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February 1998


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Table of Contents:

¨t²Î¦^«H (2 messages)
(Fwd) Gold Plated Edge Connectors (2 messages)
(Fwd) Gold Plated Edge Connectors -Reply -Forwarded (1 message)
(TN): Stressed/Fractured Joint (1 message)
: Burr (1 message)
: Query on IPC-A-61 (1 message)
: Query on IPC-A-610, Rev. B (1 message)
<No subject given> (1 message)
<No subject given> (Stepper exposure systems) (1 message)
<No subject> (31 messages)
acceptance of pwb (1 message)
Acid etching Causes and remedies for PCB industry (2 messages)
address correction (1 message)
ADMIN: Some useful commands and options (1 message)
Administrative Reply to [TN] Release: DPO - IPO "How To" Tools (1 message)
Administrative Reply: [TN] Tell me? Could Pcaster (1 message)
Again-Most weird problem: Solder between epoxy & fab or epoxy & comp (1 message)
Again-Most weird problem: Solder between epoxy & fab orepoxy &comp (1 message)
Air Ion Level Measurement (2 messages)
Alpha Metals Ionograph 500M Chemical Verification (3 messages)
Alphametals (3 messages)
Alphametals -Reply (1 message)
announcement (1 message)
ANSI-J-001 and IPC610 (1 message)
applied to the boards (1 message)
Article on PCB Warping (5 messages)
Artwork Scanner (3 messages)
ASM: Manual Assembly Houses (2 messages)
ass'y: conformal coating contractor needed (2 messages)
Assembly (1 message)
Assembly Forum ??? (1 message)
ASSY : HAND CLEANING (1 message)
Assy: (BGAs + FPGA)/(BGAs) (2 messages)
ASSY: Castellated (4 messages)
ASSY: Castellated -Reply (1 message)
ASSY: Castellated-corrected copy (1 message)
Assy: FlipChip Microvia forum at NEPCON (1 message)
ASSY: HAND CLEANING (3 messages)
Assy: Other Sources for Thermocouples (6 messages)
Assy: PBGAs (7 messages)
ASSY: SIR test on post wave soldering / touch - up operations. (1 message)
Assy: Solder Paste Height Measurement (9 messages)
ASSY: Waffle Trays (1 message)
assy:fiducials (4 messages)
ASSY:PVA equipment (1 message)
ASSY:Solder-On-Gold-Fingers (1 message)
ASY/DES: Cam Software selection (2 messages)
Atotech Black oxide (3 messages)
Automotive PFMEA for electronics assembly (4 messages)
Automotive PFMEA for electronics assembly -Reply (1 message)
Auxiliary ventilation for wave soldering equipment (1 message)
Bare board witness marks and their effect on the assembly stage (1 message)
Barrel Cracking (1 message)
BGA Interposer cards (2 messages)
BGA question (3 messages)
BGA Rework (5 messages)
Black Oxide-rinses (2 messages)
Black Oxide-rinses -Reply (2 messages)
Bond Testing Equipment (3 messages)
bright copper plating of PCB with no small (1-5um)nodule (2 messages)
CAD Software (2 messages)
CALL FOR PAPERS - 12th European Microelectronics (1 message)
cam software (1 message)
Carbamate Formation In Cyanate Ester Resin (1 message)
CCA Statewide Conference (2 messages)
CEM-1 Laminate - Edge Treatment (1 message)
Change in Technet message format (2 messages)
Change new add (1 message)
Chip On Board (2 messages)
Chip Scale International 98 - CALL FOR PAPERS - May 5-7, 1998 - Santa Clara Convention Center (5 messages)
Circuit board repair kits (1 message)
Cleanliness Test (3 messages)
Coating over No-Clean (1 message)
Component Marking Ink (2 messages)
Component Reliability Database (5 messages)
Concerns with Alpha Metals SLS65 no-clean flux (3 messages)
Confirmation of Receipt (1 message)
Conflict in Requirement (2 messages)
Conformal Coat adhesion testing? (2 messages)
Conformal coating cure for Dow Corning 2577 and 3-1765 (6 messages)
Consultant or expert in conformal coating of PCBs. (3 messages)
Controlled Impedance of a Backplane ... (1 message)
Convection Oven (2 messages)
coper oxide growth (2 messages)
copper (2 messages)
copy requests (2 messages)
Correction to FSL fax no (2 messages)
Corrosion after electroless tin finish (2 messages)
corrosivity HASL v GOLD (2 messages)
coupons (2 messages)
CPCA 1998 (1 message)
CTI Voltage (1 message)
Cure acceleration with CO2, Humidity and Heat (1 message)
Curing with CO2, humidity and heat. (1 message)
Dark brown residue (1 message)
Depression mark during soldermask exposing (4 messages)
DES: Hole sizes for non-auto-insertable parts (3 messages)
DES: Impedance software (1 message)
Design over 1GHz (3 messages)
Design: Use of Silver Filled Epoxy as Reference Plane (1 message)
Dessicant Chamber (6 messages)
Dielectric constants (10 messages)
Dow 3-1765 cure (2 messages)
Drilling of Holes (2 messages)
Drum level alarms (6 messages)
Dual Lane Processing (2 messages)
Electrical Isolation Properties of Multilayer PCB's (5 messages)
Electrical Test Definitions for IPC-ET-652 (1 message)
Electrical Test Workshop (1 message)
electrodep Cu foil vs. RA foil (6 messages)
electroless Ni/Au soft/hard (2 messages)
Entek Plus coating thickness (3 messages)
Equinox International. (1 message)
Expereinced PCB Sales Reps (1 message)
FAB - Gold consumption rates (3 messages)
FAB, Test Coupons (2 messages)
FAB: Barrel Cracking MC-3D material (2 messages)
FAB: cross section docs (1 message)
Fab: Drill Bits (3 messages)
FAB: Process controls for drilling (2 messages)
FAB: Pure Gold Process (1 message)
FAB; Subject: Very Fine Line (1 message)
FBGA design (1 message)
Fillet Height (1 message)
Fine Line Search (1 message)
fine pitch testing (1 message)
Flipchip placement equip (1 message)
Flipchip placement equip -Reply (1 message)
Florida Cirtech (2 messages)
FMEA means what? (4 messages)
FS: electrovert 500C (1 message)
FW: virus alert -Forwarded (2 messages)
FW: [TN] (Fwd) Gold Plated Edge Connectors (1 message)
FW: [TN] Alpha Metals Ionograph 500M Chemical Verification (1 message)
FW: [TN] Chip On Board (1 message)
FW: [TN] Component Marking Ink (1 message)
FW: [TN] F&K & ASM equipment feedback (1 message)
FW: [TN] Gerber Software (2 messages)
FW: [TN] Glue dispenser machine v/s stencil printing (1 message)
FW: [TN] Gold for edge-board connectors thickness (1 message)
FW: [TN] gold over entire board (1 message)
FW: [TN] Stencil Aperture Shapes -Reply (1 message)
Fwd: [CN] IPCchat session announcement (1 message)
GEB Laminate (1 message)
Gen: Axarel supplier (4 messages)
GEN: Greater Boston DC chapter meeting 2/18 (1 message)
GEN: on the passing of a friend (1 message)
GEN: Short course in UK on Electronic Manufacturing (1 message)
Gerber Software (2 messages)
GLASS ARTWORK (2 messages)
Glue dispenser machine v/s stencil printing (6 messages)
Glue on solder mask (1 message)
Gold for edge-board connectors thickness (10 messages)
gold over entire board (12 messages)
Gold plating b/4 or after hal (1 message)
Gold plating switch contacts (4 messages)
Gold surface finish (3 messages)
HASL solder specs (1 message)
Help on drying boards (3 messages)
Hi James, (1 message)
High-Frequency Dielectric Constant (4 messages)
How to treat a PWB ??? (2 messages)
I need .059 1/1 or 1/0 GE CEM3 or AL910 laminate (2 messages)
I'm looking to find a tranning course for PCB design & layout (3 messages)
IC Adapters (2 messages)
Immersion Tin (3 messages)
Impedance Software (1 message)
Information on learning curves. (1 message)
Information on Silver Terminals (4 messages)
IPC Designers Council Meeting (Atlanta Chapter) (1 message)
IPC-610 (2 messages)
IPC-CF-150E (1 message)
IPCchat session announcement (4 messages)
J-STD-001B Cleaning Call out (1 message)
jdec trays (3 messages)
Kapton Etching (4 messages)
Kevlar reinforced laminate or prepreg (4 messages)
Laminate Identification (1 message)
Laminate surface abrasion (2 messages)
Lamination Presses Input (2 messages)
Laser via in pad (2 messages)
Leaching of Gold into a solder pot? (5 messages)
Leaching of Gold into a solder pot? -Reply (1 message)
LEAD SPOT TEST (2 messages)
Looking for Equipment (2 messages)
looking for soldermask manufacturer (2 messages)
Manufacturers Rep's Wanted (3 messages)
Mating Tin / Gold; SIMMs and sockets (4 messages)
metal sludge reduction (7 messages)
MICROSCOPE REPAIRS (2 messages)
MICROSCOPE REPAIRS -Reply (1 message)
Microsection of Microvias (1 message)
Microsections (3 messages)
MicroVia info, San Diego IPC Chapter (1 message)
Min. Annular Ring (4 messages)
Modeling a IR reflow oven (3 messages)
Moisture Cure for Conformal Coatings (3 messages)
Moisture Cure for Conformal Coatings -Svar (1 message)
Moisture Sensitive Parts (3 messages)
Moisture Sensitivity (1 message)
Most weird problem: Solder between epoxy & fab or epoxy & (1 message)
Most weird problem: Solder between epoxy & fab or epoxy & comp (5 messages)
MTBF (1 message)
National PWB Resource Center (1 message)
Need inexpensive method of glueing parts on PCB (2 messages)
Nickel,Gold&solder masks (4 messages)
NON-THERMALLY RELIEVED VIAS- ring voids (4 messages)
NON-THERMALLY RELIEVED VIAS- ring voids -Reply (4 messages)
NON-THERMALLY RELIEVED VIAS- ring voids -Reply -Reply (1 message)
Omikron Immersion White Tin (2 messages)
ORGANIC COATING(PRE-FLUX) THICKNESS MEASUREMEN (3 messages)
OSP coating and soldermask (1 message)
OSP Stain (3 messages)
Paco Via Material (1 message)
pad lifting / pad rotation (2 messages)
pad lifting / pad rotation -Reply (2 messages)
panel yield on back plane (2 messages)
Panelization (4 messages)
PBGA rework with paste? (1 message)
PCB ASSEMBLER (1 message)
PCB cut-out (5 messages)
PCB desoldering (3 messages)
PCB Laminate FAQ - need support! (3 messages)
PCB Milling machines (2 messages)
PCB Prototype Facility setup (3 messages)
PCB Prototype Machine (2 messages)
PCB Supplier (2 messages)
PCB warpage (33 messages)
PCB warpage - Reply (3 messages)
PCB warpage -Reply (7 messages)
Placement system (1 message)
Plating Rectifier setup (2 messages)
Polyimide (1 message)
Polyimide and BT material (2 messages)
polyimide damage after peroxide etching (1 message)
Pre-stamped soldermask (1 message)
pre-wave masking (3 messages)
Precision Valve and Automation (1 message)
Precision Valve and Automation -Reply (1 message)
Press wanted (1 message)
Probing on fine picht SMD leads (2 messages)
Probing on fine pitch SMD leads (2 messages)
Problem with new XZ17B Coates solder resist catalyst (1 message)
Problems due to prepregs selection & it's fix (2 messages)
Production Management in PCB shops (1 message)
Pull Strengths (1 message)
Purchase of used Microscopes (3 messages)
PWB Cost (1 message)
PWB COSTING (1 message)
PWB punching tool life (2 messages)
Quality Labels ? (2 messages)
Question : "Crackling" noise in boards post SMT (4 messages)
Questions Regarding Castellations on a MCM (1 message)
Re : [TN] Circuit board repair kits (3 messages)
Re Air Ion Level Measurement (1 message)
Re J/STD/A-610 (1 message)
Release: DPO - IPO "How To" Tools (2 messages)
Reliability vs Inner Layer break Out (1 message)
Reply Error (1 message)
Re[2]: [TN] ORGANIC COATING(PRE-FLUX) THICKNESS MEASUREMEN (3 messages)
Re[2]: [TN] ORGANIC COATING(PRE-FLUX) THICKNESSMEASUREMEN (1 message)
Re[2]: [TN] Soldermask developing (5 messages)
Re[4]: [TN] Soldermask developing (1 message)
RF Plasma tool (1 message)
RF Plasma tool -Reply (1 message)
RMA vs. No Clean for BGA (1 message)
Roku-Roku Sangyo, Ltd. (1 message)
Roughness plating (2 messages)
RP machine (1 message)
San Diego Chapter of the IPC Designer Council (1 message)
San Diego Chapter of the IPC Designers Council (2 messages)
SEARCH warpage (1 message)
single-sided solder requirements (1 message)
SIR Testing for BGAs and CSPs (3 messages)
SM Lead dimension specification (3 messages)
Small holes, Thick Boards & Hole Reliability (1 message)
SMEMA Specifications (2 messages)
SNEC meeting (1 message)
solder balling (2 messages)
Solder balls spec (4 messages)
Solder Joint wetting (3 messages)
Solder Paste Inspection R & R Study (1 message)
Solder Paste Printing Process (2 messages)
Solder paste relaxation/characteristic time (1 message)
Solder paste relaxation/characteristic time -Reply (2 messages)
Solder Requirements for Chip Scale BGA's (4 messages)
solder shear strength (3 messages)
Solder-on-Gold Fingers (1 message)
Solderability od alloy 42 (2 messages)
Solderability of alloy 42 (1 message)
Solderball connection (1 message)
soldermask (1 message)
Soldermask developing (6 messages)
Soldermask foil (1 message)
SolderMask Types (4 messages)
SOURCE FOR SCREEN MESH CLOTH & EMULSION (4 messages)
Spare part for spray fluxer (1 message)
Specifications (3 messages)
Specifications for cable assemblers (1 message)
Specs on Board Warpage (1 message)
strange word (5 messages)
Subscribe (4 messages)
SUPPLIER EVALUATION AND QUALIFICATION (1 message)
Surface Finishes (6 messages)
survey report (2 messages)
suspended particle specifications (1 message)
TechNet Digest - 2 Dec 1997 to 3 Dec 1997 (1 message)
TechNet Forum....Is it just me? (8 messages)
Technet Subscription (1 message)
Tell me? Could Pcaster Make YOU $70,000 per Month on the NET? (1 message)
Temporary Soldermask (2 messages)
Temproary resist for immersion gold (1 message)
Temproary resist for immersion gold -Reply (1 message)
test (1 message)
TN : Explain me about "Nodules" (1 message)
TN Automatic evaluation of microsections (1 message)
To On or Not to On (5 messages)
To On or Not to On -Reply (3 messages)
To On or Not to On -Reply -Reply (9 messages)
To On or Not to On : Feedback (1 message)
To On or Not to On : Thank you all (1 message)
Tonites meeting is CANCELLED (2 messages)
tracking assemblies (1 message)
Training course(s)... (1 message)
Transformer Adhesive (1 message)
UL APPROVAL (BUILDUP PCB) (2 messages)
Un-subscribe (3 messages)
unsubscribe (2 messages)
Use of Compliant pin connectors on RF material backplane (1 message)
Use of Heat, Humidity, CO2 to Accelerate Conformal Coating Process (1 message)
Used Optek DPL? (1 message)
v-score depanelling tool (5 messages)
V-scored Panel Boards (3 messages)
Very Fine Line (5 messages)
Vias in SMT pads (3 messages)
Vias in SMT pads -Reply (3 messages)
Vias Surface Mount Lands (1 message)
Video Micrometer (1 message)
virus alert - NO TECHNET COMMENTS ON THIS HOAX, PLEASE (1 message)
Virus Alerts (2 messages)
Voids in PTH joints (1 message)
wavesoldering (To On or Not to On : Feedback -Reply) (1 message)
Wet Process Equipment in Asia (3 messages)
What can I use to clean my boards after rework if I am (1 message)
What can I use to clean my boards after rework if I am in NO -CLEAN Tech.?????? (2 messages)
What can I use to clean my boards after rework if I am in NO-CLEAN Tech.?????? (2 messages)
What is the advantage of brass coated Cu foil? (1 message)
What is the home address of TechNet (3 messages)
Whiskers with Sn99.3 (3 messages)
Whiskers with Sn99.3/unfused PbSn PWB plating (1 message)
Why DI - lowest cost DI quality (1 message)
Why DI? (3 messages)
Why DI? -Reply (1 message)
WIREBONDING WIRE AGE (1 message)
Work factor (3 messages)
X-Sectioning Boards with Micro Vias (3 messages)
[ASSY} Prebake (2 messages)
[ASSY} Prebake -Reply (2 messages)
[Fwd: North Texas Chapter ~ IPC Designers Council Meeting March 5th @ 6:30PM] (1 message)
[TN] gold over entire board (1 message)
[TN] Microsections (1 message)
[TN] ORGANIC COATING(PRE-FLUX) THICKNESS MEASUREMEN (1 message)
[TN] PCB warpage (1 message)
[TN] Soldermask developing (2 messages)
[TN] v-score depanelling tool (1 message)
] Design over 1GHz (2 messages)

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Subject Sorted by Subject, Chronologically

From

Date

Size

New Thread

¨t²Î¦^«H

¨t²Î¦^«H

leelam <[log in to unmask]>

Fri, 27 Feb 1998 08:36:22 +0800

22 lines

Re: ¨t²Î¦^«H

Francisco Brice $B!" (Jo / Molex de M $B#Y (Jico <[log in to unmask]>

Fri, 27 Feb 1998 10:10:08 -0600

53 lines

New Thread

(Fwd) Gold Plated Edge Connectors

(Fwd) Gold Plated Edge Connectors

John Parsons <[log in to unmask]>

Thu, 5 Feb 1998 08:48:04 +0000

48 lines

Re: (Fwd) Gold Plated Edge Connectors

Graham Naisbitt <[log in to unmask]>

Fri, 6 Feb 1998 00:05:35 -0000

92 lines

New Thread

(Fwd) Gold Plated Edge Connectors -Reply -Forwarded

(Fwd) Gold Plated Edge Connectors -Reply -Forwarded

Matthew Park <[log in to unmask]>

Thu, 5 Feb 1998 13:58:35 -0800

94 lines

New Thread

(TN): Stressed/Fractured Joint

(TN): Stressed/Fractured Joint

Poh Kong Hui <[log in to unmask]>

Fri, 20 Feb 1998 06:21:50 +0800

35 lines

New Thread

: Burr

: Burr

Poh Kong Hui <[log in to unmask]>

Wed, 4 Feb 1998 23:14:18 +0800

29 lines

New Thread

: Query on IPC-A-61

Re: : Query on IPC-A-61

JOHN OSULLIVAN <[log in to unmask]>

Mon, 9 Feb 1998 08:22:16 -0400

59 lines

New Thread

: Query on IPC-A-610, Rev. B

: Query on IPC-A-610, Rev. B

Poh Kong Hui <[log in to unmask]>

Sat, 7 Feb 1998 23:18:48 +0800

36 lines

New Thread

<No subject given>

Re: <No subject given>

Jay Soderberg <[log in to unmask]>

Tue, 3 Feb 1998 07:25:13 -0600

61 lines

New Thread

<No subject given> (Stepper exposure systems)

Re: <No subject given> (Stepper exposure systems)

Robert E. Mesick <[log in to unmask]>

Thu, 19 Feb 1998 08:57:09 +0000

67 lines

New Thread

<No subject>

<No subject>

[log in to unmask]

Mon, 2 Feb 1998 16:31:28 -0800

35 lines

<No subject>

[log in to unmask]

Mon, 2 Feb 1998 16:31:28 -0800

47 lines

<No subject>

Werner Engelmaier <[log in to unmask]>

Mon, 2 Feb 1998 16:58:52 -0800

48 lines

<No subject>

Werner Engelmaier <[log in to unmask]>

Mon, 2 Feb 1998 16:59:06 -0800

172 lines

<No subject>

Werner Engelmaier <[log in to unmask]>

Mon, 2 Feb 1998 16:59:06 -0800

184 lines

<No subject>

Werner Engelmaier <[log in to unmask]>

Mon, 2 Feb 1998 16:58:52 -0800

60 lines

<No subject>

[log in to unmask]

Mon, 2 Feb 1998 18:10:15 EST

22 lines

<No subject>

Ron Hayashi <[log in to unmask]>

Tue, 3 Feb 1998 02:20:14 -0800

31 lines

<No subject>

Ron Hayashi <[log in to unmask]>

Tue, 3 Feb 1998 02:20:14 -0800

43 lines

<No subject>

Richard MacCutcheon <[log in to unmask]>

Tue, 3 Feb 1998 02:21:42 -0800

50 lines

<No subject>

Joe Felts <[log in to unmask]>

Tue, 3 Feb 1998 02:24:38 -0800

41 lines

<No subject>

Richard MacCutcheon <[log in to unmask]>

Tue, 3 Feb 1998 02:21:42 -0800

62 lines

<No subject>

Joe Felts <[log in to unmask]>

Tue, 3 Feb 1998 02:24:38 -0800

53 lines

<No subject>

Annie Laberge <[log in to unmask]>

Tue, 3 Feb 1998 02:47:17 -0800

100 lines

<No subject>

[log in to unmask]

Tue, 3 Feb 1998 02:47:18 -0800

57 lines

<No subject>

[log in to unmask]

Tue, 3 Feb 1998 02:47:19 -0800

33 lines

<No subject>

Joseph J. Reichert <[log in to unmask]>

Tue, 3 Feb 1998 02:47:20 -0800

138 lines

<No subject>

Annie Laberge <[log in to unmask]>

Tue, 3 Feb 1998 02:47:17 -0800

112 lines

<No subject>

[log in to unmask]

Tue, 3 Feb 1998 02:47:18 -0800

69 lines

<No subject>

[log in to unmask]

Tue, 3 Feb 1998 02:47:19 -0800

45 lines

<No subject>

Joseph J. Reichert <[log in to unmask]>

Tue, 3 Feb 1998 02:47:20 -0800

150 lines

<No subject>

[log in to unmask]

Tue, 3 Feb 1998 02:47:20 -0800

82 lines

<No subject>

[log in to unmask]

Tue, 3 Feb 1998 02:47:20 -0800

94 lines

<No subject>

[log in to unmask]

Tue, 3 Feb 1998 02:52:29 -0800

38 lines

<No subject>

[log in to unmask]

Tue, 3 Feb 1998 02:52:29 -0800

50 lines

<No subject>

Al Hamilton <[log in to unmask]>

Tue, 3 Feb 1998 09:28:05 EST

29 lines

<No subject>

Stephane Richard <[log in to unmask]>

Wed, 11 Feb 1998 09:03:04 -0500

42 lines

<No subject>

Lou Franzini <[log in to unmask]>

Wed, 18 Feb 1998 16:36:15 -0500

22 lines

<No subject>

Ruben Irizarry <[log in to unmask]>

Thu, 19 Feb 1998 08:59:26 -0700

27 lines

<No subject>

Bev Christian <[log in to unmask]>

Thu, 19 Feb 1998 11:11:50 -0500

64 lines

<No subject>

mross <[log in to unmask]>

Thu, 19 Feb 1998 23:31:15 -0500

100 lines

New Thread

acceptance of pwb

acceptance of pwb

E.A. Speer <[log in to unmask]>

Thu, 5 Feb 1998 09:39:09 -0500

43 lines

New Thread

Acid etching Causes and remedies for PCB industry

Acid etching Causes and remedies for PCB industry

Indal <[log in to unmask]>

Thu, 5 Feb 1998 13:07:26 +0500

40 lines

Re: Acid etching Causes and remedies for PCB industry

[log in to unmask]

Thu, 5 Feb 1998 15:09:39 EST

32 lines

New Thread

address correction

address correction

Gary Ferrari <[log in to unmask]>

Sun, 1 Feb 1998 14:41:42 EST

32 lines

New Thread

ADMIN: Some useful commands and options

ADMIN: Some useful commands and options

Dmitriy Sklyar <[log in to unmask]>

Mon, 9 Feb 1998 14:27:10 -0600

107 lines

New Thread

Administrative Reply to [TN] Release: DPO - IPO "How To" Tools

Administrative Reply to [TN] Release: DPO - IPO "How To" Tools

Jack Crawford <[log in to unmask]>

Wed, 18 Feb 1998 16:15:15 -0600

35 lines

New Thread

Administrative Reply: [TN] Tell me? Could Pcaster

Administrative Reply: [TN] Tell me? Could Pcaster

Jack Crawford <[log in to unmask]>

Mon, 23 Feb 1998 14:08:58 -0600

36 lines

New Thread

Again-Most weird problem: Solder between epoxy & fab or epoxy & comp

Again-Most weird problem: Solder between epoxy & fab or epoxy & comp

Ken Patel <[log in to unmask]>

Mon, 9 Feb 1998 18:06:07 -0800

149 lines

New Thread

Again-Most weird problem: Solder between epoxy & fab orepoxy &comp

Re: Again-Most weird problem: Solder between epoxy & fab orepoxy &comp

Paul Klasek <[log in to unmask]>

Tue, 10 Feb 1998 13:49:22 +1100

188 lines

New Thread

Air Ion Level Measurement

Air Ion Level Measurement

Hew How Chee <[log in to unmask]>

Sat, 28 Feb 1998 11:05:52 +0800

31 lines

Re: Air Ion Level Measurement

Peter Mariani <[log in to unmask]>

Sat, 28 Feb 1998 08:16:44 -0500

69 lines

New Thread

Alpha Metals Ionograph 500M Chemical Verification

Alpha Metals Ionograph 500M Chemical Verification

Irwin, William D <[log in to unmask]>

Fri, 13 Feb 1998 09:22:10 -0600

41 lines

Re: Alpha Metals Ionograph 500M Chemical Verification

Graham Naisbitt <[log in to unmask]>

Sat, 14 Feb 1998 01:31:07 -0000

94 lines

Re: Alpha Metals Ionograph 500M Chemical Verification

Karen Tellefsen <[log in to unmask]>

Sun, 15 Feb 1998 21:55:36 -0800

61 lines

New Thread

Alphametals

Alphametals

Ed Cosper <[log in to unmask]>

Fri, 27 Feb 1998 09:33:34 -0600

25 lines

Re: Alphametals

ron rawlyk <[log in to unmask]>

Fri, 27 Feb 1998 09:52:40 -0600

42 lines

Re: Alphametals

Karen Tellefsen <[log in to unmask]>

Sat, 28 Feb 1998 07:19:37 -0800

51 lines

New Thread

Alphametals -Reply

Alphametals -Reply

Ron Hayashi <[log in to unmask]>

Fri, 27 Feb 1998 08:40:56 -0800

22 lines

New Thread

announcement

announcement

Karl Buschmann <[log in to unmask]>

Mon, 2 Feb 1998 16:47:33 -0600

38 lines

New Thread

ANSI-J-001 and IPC610

ANSI-J-001 and IPC610

[log in to unmask]

Wed, 11 Feb 1998 18:06:15 +0000

27 lines

New Thread

applied to the boards

Re: applied to the boards

John Haman Jr. <[log in to unmask]>

Tue, 3 Feb 1998 08:19:06 PST

42 lines

New Thread

Article on PCB Warping

Article on PCB Warping

ETS <[log in to unmask]>

Thu, 19 Feb 1998 15:53:29 -0800

39 lines

Re: Article on PCB Warping

Johannes Sivula <[log in to unmask]>

Fri, 20 Feb 1998 09:15:45 +0200

144 lines

Re: Article on PCB Warping

Cash, Alan <[log in to unmask]>

Fri, 20 Feb 1998 15:39:45 -0500

68 lines

Re: Article on PCB Warping

Andrew Chuong <[log in to unmask]>

Fri, 20 Feb 1998 17:52:52 +0000

49 lines

Re: Article on PCB Warping

Afri Singh <[log in to unmask]>

Sat, 21 Feb 1998 14:33:28 -0500

86 lines

New Thread

Artwork Scanner

Artwork Scanner

Eric Blazi <[log in to unmask]>

Wed, 4 Feb 1998 08:11:40 EST

29 lines

Re: Artwork Scanner

John Parsons <[log in to unmask]>

Wed, 4 Feb 1998 08:27:02 +0000

56 lines

Re: Artwork Scanner

George Toman <[log in to unmask]>

Wed, 4 Feb 1998 14:11:48 -0500

59 lines

New Thread

ASM: Manual Assembly Houses

ASM: Manual Assembly Houses

[log in to unmask]

Wed, 18 Feb 1998 05:55:14 EST

37 lines

Re: ASM: Manual Assembly Houses

Pete Schumacher <[log in to unmask]>

Wed, 18 Feb 1998 15:45:08 -0600

51 lines

New Thread

ass'y: conformal coating contractor needed

ass'y: conformal coating contractor needed

Jerry Cupples <[log in to unmask]>

Mon, 16 Feb 1998 17:33:52 -0600

72 lines

Re: ass'y: conformal coating contractor needed

Aric Parr <[log in to unmask]>

Tue, 17 Feb 1998 07:06:37 EST

100 lines

New Thread

Assembly

Assembly

Vertefeuille, Russ (AZ77) <[log in to unmask]>

Tue, 3 Feb 1998 10:30:58 -0600

29 lines

New Thread

Assembly Forum ???

Assembly Forum ???

Achim Neu <[log in to unmask]>

Sun, 1 Feb 1998 12:15:26 +0100

72 lines

New Thread

ASSY : HAND CLEANING

ASSY : HAND CLEANING

Kasprzak, Bill (esd) US <[log in to unmask]>

Tue, 24 Feb 1998 07:18:00 PST

40 lines

New Thread

Assy: (BGAs + FPGA)/(BGAs)

Assy: (BGAs + FPGA)/(BGAs)

Phil Bavaro <[log in to unmask]>

Wed, 11 Feb 1998 10:02:31 -0700

44 lines

Re: Assy: (BGAs + FPGA)/(BGAs)

Bev Christian <[log in to unmask]>

Wed, 11 Feb 1998 13:33:54 -0500

70 lines

New Thread

ASSY: Castellated

ASSY: Castellated

[log in to unmask]

Tue, 10 Feb 1998 11:22:30 -0700

21 lines

Re: ASSY: Castellated

Engineering / Design Dept. <[log in to unmask]>

Tue, 10 Feb 1998 10:43:04 -0800

43 lines

Re: ASSY: Castellated

Jerry Cupples <[log in to unmask]>

Tue, 10 Feb 1998 14:39:35 -0600

47 lines

Re: ASSY: Castellated

Jack Crawford <[log in to unmask]>

Tue, 10 Feb 1998 17:28:33 -0600

43 lines

New Thread

ASSY: Castellated -Reply

ASSY: Castellated -Reply

Christy Graham <[log in to unmask]>

Tue, 10 Feb 1998 10:47:24 -0800

31 lines

New Thread

ASSY: Castellated-corrected copy

Re: ASSY: Castellated-corrected copy

Jack Crawford <[log in to unmask]>

Tue, 10 Feb 1998 17:31:34 -0600

43 lines

New Thread

Assy: FlipChip Microvia forum at NEPCON

Assy: FlipChip Microvia forum at NEPCON

David Bergman <[log in to unmask]>

Thu, 19 Feb 1998 13:38:55 -0600

65 lines

New Thread

ASSY: HAND CLEANING

ASSY: HAND CLEANING

Jim Marsico 516-595-5879 <[log in to unmask]>

Mon, 23 Feb 1998 12:50:00 -0400

29 lines

Re: ASSY: HAND CLEANING

Aric Parr <[log in to unmask]>

Mon, 23 Feb 1998 13:12:29 EST

62 lines

Re: ASSY: HAND CLEANING

Bev Christian <[log in to unmask]>

Mon, 23 Feb 1998 15:04:50 -0500

67 lines

New Thread

Assy: Other Sources for Thermocouples

Assy: Other Sources for Thermocouples

Charles Barker <[log in to unmask]>

Tue, 10 Feb 1998 11:10:06 -0600

30 lines

Re: Assy: Other Sources for Thermocouples

Long, Jim HSD <[log in to unmask]>

Tue, 10 Feb 1998 12:46:39 -0500

55 lines

Re: Assy: Other Sources for Thermocouples

Stephen R. Gregory <[log in to unmask]>

Tue, 10 Feb 1998 16:06:20 EST

40 lines

Re: Assy: Other Sources for Thermocouples

Jerry Cupples <[log in to unmask]>

Tue, 10 Feb 1998 13:17:53 -0600

47 lines

Re: Assy: Other Sources for Thermocouples

ETS <[log in to unmask]>

Tue, 10 Feb 1998 13:32:02 -0800

84 lines

Re: Assy: Other Sources for Thermocouples

Charles Barker <[log in to unmask]>

Tue, 10 Feb 1998 16:02:37 -0600

25 lines

New Thread

Assy: PBGAs

Assy: PBGAs

Blanchet,Richard <[log in to unmask]>

Wed, 4 Feb 1998 10:46:00 -0500

42 lines

Re: Assy: PBGAs

Jeff Seeger <[log in to unmask]>

Wed, 4 Feb 1998 11:20:11 -0500

47 lines

Re: Assy: PBGAs

Greg Bartlett <[log in to unmask]>

Wed, 4 Feb 1998 13:26:52 +0000

152 lines

Re: Assy: PBGAs

Kane, Joseph <[log in to unmask]>

Wed, 4 Feb 1998 13:29:16 -0500

65 lines

Re: Assy: PBGAs

Jim Marsico 516-595-5879 <[log in to unmask]>

Wed, 4 Feb 1998 13:45:00 -0400

44 lines

Re: Assy: PBGAs

Doug Pauls <[log in to unmask]>

Thu, 5 Feb 1998 08:34:52 EST

38 lines

Re: Assy: PBGAs

Rod Martens <[log in to unmask]>

Thu, 5 Feb 1998 15:10:30 -0700

80 lines

New Thread

ASSY: SIR test on post wave soldering / touch - up operations.

ASSY: SIR test on post wave soldering / touch - up operations.

Terry Huddleston <[log in to unmask]>

Fri, 13 Feb 1998 15:53:23 -0600

35 lines

New Thread

Assy: Solder Paste Height Measurement

Assy: Solder Paste Height Measurement

Charles Barker <[log in to unmask]>

Tue, 10 Feb 1998 11:06:28 -0600

39 lines

Re: Assy: Solder Paste Height Measurement

Jerry Cupples <[log in to unmask]>

Tue, 10 Feb 1998 13:09:48 -0600

53 lines

Re: Assy: Solder Paste Height Measurement

Stephen R. Gregory <[log in to unmask]>

Tue, 10 Feb 1998 16:20:32 EST

43 lines

Re: Assy: Solder Paste Height Measurement

Ron Lohrbach <[log in to unmask]>

Tue, 10 Feb 1998 18:36:13 -0800

72 lines

Re: Assy: Solder Paste Height Measurement

Krishna Kalyan <[log in to unmask]>

Wed, 11 Feb 1998 16:33:46 PST

117 lines

Re: Assy: Solder Paste Height Measurement

Landes, Jeff <[log in to unmask]>

Thu, 12 Feb 1998 09:56:00 PST

143 lines

Re: Assy: Solder Paste Height Measurement

Jeffery L. Hempton <[log in to unmask]>

Thu, 12 Feb 1998 10:22:19 -0500

188 lines

Re: Assy: Solder Paste Height Measurement

Lustig, Steven K.. <[log in to unmask]>

Thu, 12 Feb 1998 14:37:08 -0500

179 lines

Re: Assy: Solder Paste Height Measurement

Bryan Woods <[log in to unmask]>

Fri, 13 Feb 1998 08:49:09 -0800

82 lines

New Thread

ASSY: Waffle Trays

ASSY: Waffle Trays

Lainie Loveless <[log in to unmask]>

Mon, 23 Feb 1998 08:25:01 -0500

25 lines

New Thread

assy:fiducials

assy:fiducials

Larry Davis <[log in to unmask]>

Wed, 18 Feb 1998 15:38:00 -0600

25 lines

Re: assy:fiducials

Mikael Blank <[log in to unmask]>

Thu, 19 Feb 1998 09:22:51 +0100

49 lines

Re: assy:fiducials

Achim Neu <[log in to unmask]>

Sun, 22 Feb 1998 11:28:35 +0100

70 lines

Re: assy:fiducials

Stephen R. Gregory <[log in to unmask]>

Sun, 22 Feb 1998 18:44:01 EST

57 lines

New Thread

ASSY:PVA equipment

ASSY:PVA equipment

Larry Davis <[log in to unmask]>

Tue, 10 Feb 1998 10:46:00 -0600

30 lines

New Thread

ASSY:Solder-On-Gold-Fingers

ASSY:Solder-On-Gold-Fingers

Jeffery L. Hempton <[log in to unmask]>

Tue, 3 Feb 1998 09:33:37 -0500

34 lines

New Thread

ASY/DES: Cam Software selection

ASY/DES: Cam Software selection

Mark F. Hanrahan <[log in to unmask]>

Sat, 7 Feb 1998 09:08:33 -0500

33 lines

Re: ASY/DES: Cam Software selection

[log in to unmask]

Sun, 8 Feb 1998 21:06:01 -0500

90 lines

New Thread

Atotech Black oxide

Atotech Black oxide

Scott Westheimer-CTUA143 <[log in to unmask]>

Thu, 19 Feb 1998 18:31:55 -0600

26 lines

Re: Atotech Black oxide

John Haman Jr. <[log in to unmask]>

Fri, 20 Feb 1998 08:36:53 PST

77 lines

Re: Atotech Black oxide

[log in to unmask]

Fri, 20 Feb 1998 21:44:24 EST

34 lines

New Thread

Automotive PFMEA for electronics assembly

Automotive PFMEA for electronics assembly

Ed Holton <[log in to unmask]>

Thu, 12 Feb 1998 07:20:25 -0500

41 lines

Re: Automotive PFMEA for electronics assembly

Hamilton, Richard -4454 <[log in to unmask]>

Thu, 12 Feb 1998 10:24:45 -0700

84 lines

Re: Automotive PFMEA for electronics assembly

Murphy Steve (UO/ESS) <[log in to unmask]>

Thu, 12 Feb 1998 16:41:17 -0500

75 lines

Re: Automotive PFMEA for electronics assembly

Dan Stege <[log in to unmask]>

Fri, 13 Feb 1998 11:35:09 -0600

58 lines

New Thread

Automotive PFMEA for electronics assembly -Reply

Re: Automotive PFMEA for electronics assembly -Reply

Allan Kerr <[log in to unmask]>

Thu, 12 Feb 1998 13:51:47 -0500

121 lines

New Thread

Auxiliary ventilation for wave soldering equipment

Auxiliary ventilation for wave soldering equipment

Valli Robert <[log in to unmask]>

Tue, 24 Feb 1998 13:24:00 -0500

40 lines

New Thread

Bare board witness marks and their effect on the assembly stage

Bare board witness marks and their effect on the assembly stage

Dudi Banitt <[log in to unmask]>

Wed, 25 Feb 1998 08:38:38 +0200

43 lines

New Thread

Barrel Cracking

Barrel Cracking

Steve Collins <[log in to unmask]>

Wed, 25 Feb 1998 08:37:49 -0700

40 lines

New Thread

BGA Interposer cards

BGA Interposer cards

Marcy, Jenni A <[log in to unmask]>

Mon, 9 Feb 1998 08:59:21 -0700

31 lines

BGA Interposer cards

[log in to unmask]

Wed, 11 Feb 1998 18:48:18 EST

43 lines

New Thread

BGA question

BGA question

Steve Schrader <[log in to unmask]>

Fri, 6 Feb 1998 17:26:56 -0500

27 lines

Re: BGA question

eric roulo <[log in to unmask]>

Fri, 6 Feb 1998 14:53:55 -0800

37 lines

Re: BGA question

budster <[log in to unmask]>

Fri, 6 Feb 1998 15:37:04 -0800

59 lines

New Thread

BGA Rework

BGA Rework

Tom Cooper <[log in to unmask]>

Wed, 4 Feb 1998 11:28:17 EST

36 lines

Re: BGA Rework

Shaddock, David M (CRD) <[log in to unmask]>

Fri, 6 Feb 1998 11:11:32 -0500

82 lines

BGA Rework

Stephane Richard <[log in to unmask]>

Wed, 11 Feb 1998 09:29:15 -0500

41 lines

Re: BGA Rework

MARK McAULEY <[log in to unmask]>

Wed, 11 Feb 1998 08:58:23 -0600

85 lines

Re: BGA Rework

Greg Bartlett <[log in to unmask]>

Wed, 11 Feb 1998 10:29:23 +0000

131 lines

New Thread

Black Oxide-rinses

Black Oxide-rinses

Eltek Ltd. - Process Engineering <[log in to unmask]>

Wed, 11 Feb 1998 18:40:09 +0200

39 lines

Re: Black Oxide-rinses

Eltek Ltd. - Process Engineering <[log in to unmask]>

Thu, 12 Feb 1998 08:05:45 +0200

41 lines

New Thread

Black Oxide-rinses -Reply

Black Oxide-rinses -Reply

Fred Johnson <[log in to unmask]>

Thu, 12 Feb 1998 14:36:15 +0000

81 lines

Re: Black Oxide-rinses -Reply

indal <[log in to unmask]>

Fri, 13 Feb 1998 11:45:44 +0530

113 lines

New Thread

Bond Testing Equipment

Bond Testing Equipment

Jeff Wold <[log in to unmask]>

Thu, 12 Feb 1998 13:56:33 -0600

26 lines

Re: Bond Testing Equipment

David Anderson <[log in to unmask]>

Thu, 12 Feb 1998 15:47:49 -0600

48 lines

Re: Bond Testing Equipment

Bev Christian <[log in to unmask]>

Fri, 13 Feb 1998 08:41:44 -0500

60 lines

New Thread

bright copper plating of PCB with no small (1-5um)nodule

bright copper plating of PCB with no small (1-5um)nodule

FANG J L <[log in to unmask]>

Sun, 22 Feb 1998 11:51:07 +0800

40 lines

Re: bright copper plating of PCB with no small (1-5um)nodule

fulabhai <[log in to unmask]>

Sat, 21 Feb 1998 21:41:00 -0800

72 lines

New Thread

CAD Software

CAD Software

Modular Components National, Inc. <[log in to unmask]>

Tue, 3 Feb 1998 15:36:32 -0500

30 lines

Re: CAD Software

Ralph Garvin <[log in to unmask]>

Tue, 3 Feb 1998 15:25:47 -0600

29 lines

New Thread

CALL FOR PAPERS - 12th European Microelectronics

CALL FOR PAPERS - 12th European Microelectronics

[log in to unmask]

Thu, 26 Feb 1998 10:28:41 +0000

91 lines

New Thread

cam software

cam software

[log in to unmask]

Sun, 8 Feb 1998 16:49:35 -0800

30 lines

New Thread

Carbamate Formation In Cyanate Ester Resin

Carbamate Formation In Cyanate Ester Resin

Lwallig <[log in to unmask]>

Sat, 28 Feb 1998 15:36:28 EST

29 lines

New Thread

CCA Statewide Conference

CCA Statewide Conference

Dennis Maggi <[log in to unmask]>

Mon, 2 Feb 1998 01:49:56 EST

134 lines

CCA Statewide Conference

Dennis Maggi <[log in to unmask]>

Mon, 2 Feb 1998 01:52:10 EST

35 lines

New Thread

CEM-1 Laminate - Edge Treatment

CEM-1 Laminate - Edge Treatment

JB <[log in to unmask]>

Fri, 6 Feb 1998 11:00:38 +0800

35 lines

New Thread

Change in Technet message format

Change in Technet message format

Shaun Tibbals <[log in to unmask]>

Tue, 3 Feb 1998 10:04:22 -0500

33 lines

Re: Change in Technet message format

David Tyler <[log in to unmask]>

Wed, 4 Feb 1998 12:29:55 -0500

23 lines

New Thread

Change new add

Change new add

[log in to unmask]

Fri, 27 Feb 1998 00:27:57 +0800

24 lines

New Thread

Chip On Board

Chip On Board

ssyeo <[log in to unmask]>

Fri, 6 Feb 1998 12:07:18 +0800

30 lines

Re: Chip On Board

Stephen R. Gregory <[log in to unmask]>

Thu, 5 Feb 1998 23:58:21 EST

45 lines

New Thread

Chip Scale International 98 - CALL FOR PAPERS - May 5-7, 1998 - Santa Clara Convention Center

Chip Scale International 98 - CALL FOR PAPERS - May 5-7, 1998 - Santa Clara Convention Center

John Riley <[log in to unmask]>

Mon, 2 Feb 1998 11:48:45 -0600

57 lines

Re: Chip Scale International 98 - CALL FOR PAPERS - May 5-7, 1998 - Santa Clara Convention Center

roberto <[log in to unmask]>

Tue, 3 Feb 1998 18:00:17 +0200

71 lines

Re: Chip Scale International 98 - CALL FOR PAPERS - May 5-7, 1998 - Santa Clara Convention Center

Michael Parker <[log in to unmask]>

Wed, 4 Feb 1998 08:01:30 +0000

135 lines

Re: Chip Scale International 98 - CALL FOR PAPERS - May 5-7, 1998 - Santa Clara Convention Center

Michael Freda <[log in to unmask]>

Wed, 4 Feb 1998 08:02:56 -0800

59 lines

Re: Chip Scale International 98 - CALL FOR PAPERS - May 5-7, 1998 - Santa Clara Convention Center

Joseph Fjelstad <[log in to unmask]>

Thu, 5 Feb 1998 16:25:57 -0800

160 lines

New Thread

Circuit board repair kits

Circuit board repair kits

Lee McCuistion <[log in to unmask]>

Fri, 6 Feb 1998 09:52:12 +0000

34 lines

New Thread

Cleanliness Test

Cleanliness Test

Kathy Palumbo <[log in to unmask]>

Tue, 17 Feb 1998 11:32:44 -0800

50 lines

Re: Cleanliness Test

Karen Tellefsen <[log in to unmask]>

Tue, 17 Feb 1998 16:16:58 -0500

120 lines

Re: Cleanliness Test

[log in to unmask]

Tue, 17 Feb 1998 17:02:14 EST

44 lines

New Thread

Coating over No-Clean

Re: Coating over No-Clean

[log in to unmask]

Tue, 17 Feb 1998 15:31:32 EST

31 lines

New Thread

Component Marking Ink

Component Marking Ink

Edward Valentine <[log in to unmask]>

Wed, 18 Feb 1998 23:08:54 -0800

36 lines

Re: Component Marking Ink

Scott Decker <[log in to unmask]>

Thu, 19 Feb 1998 07:56:29 -0800

71 lines

New Thread

Component Reliability Database

Component Reliability Database

Peroutka, Gregg W. <[log in to unmask]>

Thu, 26 Feb 1998 08:45:14 -0600

33 lines

Re: Component Reliability Database

Paul Terranova <[log in to unmask]>

Thu, 26 Feb 1998 10:47:16 -0500

85 lines

Re: Component Reliability Database

Gerald G. Gagnon <[log in to unmask]>

Thu, 26 Feb 1998 10:56:59 -0500

110 lines

Re: Component Reliability Database

Gregg Klawson <[log in to unmask]>

Thu, 26 Feb 1998 11:21:51 -0500

46 lines

Re: Component Reliability Database

Glenn Pelkey <[log in to unmask]>

Thu, 26 Feb 1998 08:54:03 PST

78 lines

New Thread

Concerns with Alpha Metals SLS65 no-clean flux

Concerns with Alpha Metals SLS65 no-clean flux

Chris_Smith <[log in to unmask]>

Tue, 17 Feb 1998 09:09:21 -0600

35 lines

Re: Concerns with Alpha Metals SLS65 no-clean flux

Jerry Cupples <[log in to unmask]>

Tue, 17 Feb 1998 10:02:00 -0600

67 lines

Re: Concerns with Alpha Metals SLS65 no-clean flux

Sergio Nunez <[log in to unmask]>

Mon, 16 Feb 1998 10:35:20 -0800

55 lines

New Thread

Confirmation of Receipt

Confirmation of Receipt

Undetermined origin c/o LISTSERV administrator <[log in to unmask]>

Tue, 24 Feb 1998 21:05:25 EST

29 lines

New Thread

Conflict in Requirement

Conflict in Requirement

M CURRY <[log in to unmask]>

Fri, 6 Feb 1998 17:00:17 -0600

24 lines

Re: Conflict in Requirement

Phillip E. Hinton <[log in to unmask]>

Fri, 6 Feb 1998 21:42:54 EST

30 lines

New Thread

Conformal Coat adhesion testing?

Conformal Coat adhesion testing?

Chris_Smith <[log in to unmask]>

Thu, 12 Feb 1998 13:00:25 -0600

33 lines

Re: Conformal Coat adhesion testing?

Graham Naisbitt <[log in to unmask]>

Sat, 14 Feb 1998 01:15:34 -0000

85 lines

New Thread

Conformal coating cure for Dow Corning 2577 and 3-1765

Conformal coating cure for Dow Corning 2577 and 3-1765

Chris_Smith <[log in to unmask]>

Tue, 17 Feb 1998 08:09:43 -0600

57 lines

Re: Conformal coating cure for Dow Corning 2577 and 3-1765

Aric Parr <[log in to unmask]>

Tue, 17 Feb 1998 09:49:20 EST

27 lines

Re: Conformal coating cure for Dow Corning 2577 and 3-1765

Sheila Smith <[log in to unmask]>

Tue, 17 Feb 1998 10:44:21 -0500

65 lines

Re: Conformal coating cure for Dow Corning 2577 and 3-1765

ETS <[log in to unmask]>

Tue, 17 Feb 1998 08:23:04 -0800

86 lines

Re: Conformal coating cure for Dow Corning 2577 and 3-1765

ETS <[log in to unmask]>

Tue, 17 Feb 1998 08:26:48 -0800

58 lines

Re: Conformal coating cure for Dow Corning 2577 and 3-1765

Graham Naisbitt <[log in to unmask]>

Sat, 21 Feb 1998 12:08:59 -0000

84 lines

New Thread

Consultant or expert in conformal coating of PCBs.

Consultant or expert in conformal coating of PCBs.

Brian_Maas <[log in to unmask]>

Tue, 10 Feb 1998 13:55:19 -0600

38 lines

Re: Consultant or expert in conformal coating of PCBs.

ETS <[log in to unmask]>

Tue, 10 Feb 1998 13:17:28 -0800

75 lines

Re: Consultant or expert in conformal coating of PCBs.

Edward J Popielarski <[log in to unmask]>

Wed, 11 Feb 1998 10:22:27 -0600

37 lines

New Thread

Controlled Impedance of a Backplane ...

Controlled Impedance of a Backplane ...

Doug McKean <[log in to unmask]>

Sat, 14 Feb 1998 13:55:23 -0500

69 lines

New Thread

Convection Oven

Convection Oven

Brian Husnik <[log in to unmask]>

Tue, 17 Feb 1998 16:24:27 -0600

55 lines

Re: Convection Oven

ETS <[log in to unmask]>

Thu, 19 Feb 1998 12:25:55 -0800

84 lines

New Thread

coper oxide growth

coper oxide growth

Brett Goldstein <[log in to unmask]>

Tue, 3 Feb 1998 10:26:57 +0000

30 lines

Re: coper oxide growth

[log in to unmask]

Wed, 4 Feb 1998 04:37:52 EST

25 lines

New Thread

copper

copper

[log in to unmask]

Mon, 16 Feb 1998 19:28:22 -0800

29 lines

Re: copper

Leslie O. Connally <[log in to unmask]>

Tue, 17 Feb 1998 08:15:05 -0800

60 lines

New Thread

copy requests

copy requests

Lustig, Steven K.. <[log in to unmask]>

Tue, 17 Feb 1998 18:33:13 -0500

34 lines

Re: copy requests

Jerome Sallo <[log in to unmask]>

Tue, 17 Feb 1998 19:52:44 EST

24 lines

New Thread

Correction to FSL fax no

Correction to FSL fax no

Jeremy Drake <[log in to unmask]>

Mon, 23 Feb 1998 16:31:04 +0000

56 lines

Re: Correction to FSL fax no

[log in to unmask]

Tue, 24 Feb 1998 12:10:37 EST

30 lines

New Thread

Corrosion after electroless tin finish

Corrosion after electroless tin finish

Karl Ring <[log in to unmask]>

Fri, 27 Feb 1998 09:27:46 -0500

36 lines

Re: Corrosion after electroless tin finish

Gabriela Bogdan <[log in to unmask]>

Sat, 28 Feb 1998 04:03:20 +0000

68 lines

New Thread

corrosivity HASL v GOLD

corrosivity HASL v GOLD

Evan Jones <[log in to unmask]>

Fri, 27 Feb 1998 01:18:37 -0500

42 lines

Re: corrosivity HASL v GOLD

Kathy Palumbo <[log in to unmask]>

Fri, 27 Feb 1998 08:30:28 -0800

71 lines

New Thread

coupons

coupons

Gary Ferrari <[log in to unmask]>

Sat, 31 Jan 1998 18:47:06 -0600

96 lines

Re: coupons

Ed Cosper <[log in to unmask]>

Mon, 2 Feb 1998 10:01:28 -0600

192 lines

New Thread

CPCA 1998

CPCA 1998

JB <[log in to unmask]>

Fri, 6 Feb 1998 11:00:37 +0800

33 lines

New Thread

CTI Voltage

CTI Voltage

Mike Bailey <[log in to unmask]>

Wed, 18 Feb 1998 09:57:30 -0500

30 lines

New Thread

Cure acceleration with CO2, Humidity and Heat

Cure acceleration with CO2, Humidity and Heat

ETS <[log in to unmask]>

Wed, 11 Feb 1998 14:24:53 -0800

59 lines

New Thread

Curing with CO2, humidity and heat.

Curing with CO2, humidity and heat.

ETS <[log in to unmask]>

Wed, 11 Feb 1998 09:44:16 -0800

32 lines

New Thread

Dark brown residue

Re: Dark brown residue

Doug Pauls <[log in to unmask]>

Thu, 5 Feb 1998 08:34:53 EST

31 lines

New Thread

Depression mark during soldermask exposing

Depression mark during soldermask exposing

Padmanabha Anandapuram Halappa <[log in to unmask]>

Sat, 21 Feb 1998 13:19:18 EST

24 lines

Re: Depression mark during soldermask exposing

Afri Singh <[log in to unmask]>

Sat, 21 Feb 1998 14:57:14 -0500

48 lines

Re: Depression mark during soldermask exposing

John Haman Jr. <[log in to unmask]>

Mon, 23 Feb 1998 08:38:25 PST

57 lines

Re: Depression mark during soldermask exposing

Wayne Gitlitz <[log in to unmask]>

Mon, 23 Feb 1998 08:24:39 -0800

52 lines

New Thread

DES: Hole sizes for non-auto-insertable parts

DES: Hole sizes for non-auto-insertable parts

Steve Collins <[log in to unmask]>

Mon, 23 Feb 1998 12:21:43 -0700

37 lines

Re: DES: Hole sizes for non-auto-insertable parts

Hamilton, Richard -4454 <[log in to unmask]>

Mon, 23 Feb 1998 12:41:38 -0700

73 lines

Re: DES: Hole sizes for non-auto-insertable parts

Mark Ross <[log in to unmask]>

Mon, 23 Feb 1998 21:31:45 -0500

57 lines

New Thread

DES: Impedance software

DES: Impedance software

Mitch Morey <[log in to unmask]>

Wed, 4 Feb 1998 14:35:45 -0800

73 lines

New Thread

Design over 1GHz

Design over 1GHz

Mirka Halas <[log in to unmask]>

Wed, 25 Feb 1998 12:36:05 -0500

36 lines

Re: Design over 1GHz

Joseph E. J. Duclos Jr. <[log in to unmask]>

Wed, 25 Feb 1998 19:00:53 -0500

100 lines

Re: Design over 1GHz

John Laur <[log in to unmask]>

Wed, 25 Feb 1998 12:29:24 -0600

306 lines

New Thread

Design: Use of Silver Filled Epoxy as Reference Plane

Design: Use of Silver Filled Epoxy as Reference Plane

APeder01 <[log in to unmask]>

Fri, 6 Feb 1998 14:07:14 -0500

36 lines

New Thread

Dessicant Chamber

Dessicant Chamber

Sherry Warner <[log in to unmask]>

Wed, 4 Feb 1998 10:10:07 -0500

28 lines

Re: Dessicant Chamber

Poh Kong Hui <[log in to unmask]>

Wed, 4 Feb 1998 23:31:51 +0800

63 lines

Re: Dessicant Chamber

Charles Barker <[log in to unmask]>

Wed, 4 Feb 1998 09:34:12 -0600

52 lines

Re: Dessicant Chamber

Henry Earley <[log in to unmask]>

Wed, 4 Feb 1998 09:30:16 -0800

43 lines

Re: Dessicant Chamber

Ed Holton <[log in to unmask]>

Wed, 4 Feb 1998 09:59:23 -0500

62 lines

Re: Dessicant Chamber

Steves <[log in to unmask]>

Wed, 4 Feb 1998 11:08:55 +0000

25 lines

New Thread

Dielectric constants

Dielectric constants

Gary Griffin <[log in to unmask]>

Tue, 17 Feb 1998 12:49:17 -0800

43 lines

Re: Dielectric constants

Wollam-Wright, Lynda <[log in to unmask]>

Tue, 17 Feb 1998 13:17:11 -0800

57 lines

Re: Dielectric constants

[log in to unmask] <[log in to unmask]>

Tue, 17 Feb 1998 22:21:24 -0800

41 lines

Re: Dielectric constants

Doug Jeffery <[log in to unmask]>

Wed, 18 Feb 1998 05:31:17 -0600

79 lines

Re: Dielectric constants

Colin <[log in to unmask]>

Wed, 18 Feb 1998 13:15:09 -0600

36 lines

Dielectric constants

Gary Griffin <[log in to unmask]>

Fri, 20 Feb 1998 11:18:22 -0800

52 lines

Re: Dielectric constants

Manfred Huschka <[log in to unmask]>

Fri, 20 Feb 1998 14:15:45 -0600

109 lines

Re: Dielectric constants

Dennis Beerman <[log in to unmask]>

Fri, 20 Feb 1998 15:27:07 -0500

69 lines

Re: Dielectric constants

Lyle Wallig <[log in to unmask]>

Fri, 20 Feb 1998 15:44:42 EST

55 lines

Re: Dielectric constants

Doug McKean <[log in to unmask]>

Fri, 20 Feb 1998 16:29:17 -0500

44 lines

New Thread

Dow 3-1765 cure

Dow 3-1765 cure

Benjamin A Guthrie <[log in to unmask]>

Tue, 17 Feb 1998 10:07:47 -0500

36 lines

Dow 3-1765 cure

Benjamin A Guthrie <[log in to unmask]>

Tue, 17 Feb 1998 13:11:40 -0500

29 lines

New Thread

Drilling of Holes

Drilling of Holes

Lisa Williams <[log in to unmask]>

Wed, 4 Feb 1998 11:07:01 -0600

33 lines

Re: Drilling of Holes

drilbert <[log in to unmask]>

Wed, 4 Feb 1998 19:08:39 -0800

40 lines

New Thread

Drum level alarms

Drum level alarms

Peter Blokhuis <[log in to unmask]>

Mon, 9 Feb 1998 12:21:27 EST

33 lines

Re: Drum level alarms

John Nelson <[log in to unmask]>

Mon, 9 Feb 1998 13:25:20 -0500

60 lines

Re: Drum level alarms

Joe Felts Jr. <[log in to unmask]>

Mon, 9 Feb 1998 11:27:52 -0700

69 lines

Re: Drum level alarms

Paul Klasek <[log in to unmask]>

Tue, 10 Feb 1998 08:27:21 +1100

80 lines

Re: Drum level alarms

Valquirio N. Carvalho <[log in to unmask]>

Mon, 9 Feb 1998 20:36:40 -0500

29 lines

Re: Drum level alarms

Thomas E. Waznis <[log in to unmask]>

Mon, 9 Feb 1998 19:56:44 -0800

28 lines

New Thread

Dual Lane Processing

Dual Lane Processing

ETS <[log in to unmask]>

Fri, 13 Feb 1998 14:22:07 -0800

30 lines

Re: Dual Lane Processing

[log in to unmask]

Sat, 14 Feb 1998 12:44:49 EST

30 lines

New Thread

Electrical Isolation Properties of Multilayer PCB's

Electrical Isolation Properties of Multilayer PCB's

Jeff Fries <[log in to unmask]>

Thu, 19 Feb 1998 19:49:15 -0600

136 lines

Re: Electrical Isolation Properties of Multilayer PCB's

Phillip J. Dudley <[log in to unmask]>

Thu, 19 Feb 1998 15:24:22 -0800

64 lines

Re: Electrical Isolation Properties of Multilayer PCB's

Htter Simon <[log in to unmask]>

Fri, 20 Feb 1998 08:09:10 -0000

34 lines

Re: Electrical Isolation Properties of Multilayer PCB's

Gary Griffin <[log in to unmask]>

Fri, 20 Feb 1998 08:16:33 -0800

88 lines

Re: Electrical Isolation Properties of Multilayer PCB's

Doug Jeffery <[log in to unmask]>

Sat, 21 Feb 1998 05:08:00 -0600

181 lines

New Thread

Electrical Test Definitions for IPC-ET-652

Electrical Test Definitions for IPC-ET-652

Hill, Mike E. <[log in to unmask]>

Wed, 25 Feb 1998 17:52:46 -0500

73 lines

New Thread

Electrical Test Workshop

Electrical Test Workshop

Dennis Maggi <[log in to unmask]>

Mon, 2 Feb 1998 01:47:10 EST

103 lines

New Thread

electrodep Cu foil vs. RA foil

electrodep Cu foil vs. RA foil

Josh Moody <[log in to unmask]>

Mon, 9 Feb 1998 17:00:49 -0600

37 lines

Re: electrodep Cu foil vs. RA foil

Formiller, Paul <[log in to unmask]>

Mon, 9 Feb 1998 17:22:53 -0800

190 lines

Re: electrodep Cu foil vs. RA foil

[log in to unmask]

Tue, 10 Feb 1998 06:39:51 EST

34 lines

Re: electrodep Cu foil vs. RA foil

Werner Engelmaier <[log in to unmask]>

Tue, 10 Feb 1998 08:17:17 EST

36 lines

Re: electrodep Cu foil vs. RA foil

Shaddock, David M (CRD) <[log in to unmask]>

Wed, 11 Feb 1998 13:11:12 -0500

64 lines

Re: electrodep Cu foil vs. RA foil

Meigs, Jonathan <[log in to unmask]>

Wed, 11 Feb 1998 15:38:00 -0700

93 lines

New Thread

electroless Ni/Au soft/hard

electroless Ni/Au soft/hard

Afri Singh <[log in to unmask]>

Thu, 19 Feb 1998 20:47:07 -0500

27 lines

Re: electroless Ni/Au soft/hard

Htter Simon <[log in to unmask]>

Fri, 20 Feb 1998 07:42:56 -0000

37 lines

New Thread

Entek Plus coating thickness

Entek Plus coating thickness

Matthew Park <[log in to unmask]>

Tue, 10 Feb 1998 14:55:59 -0800

49 lines

Re: Entek Plus coating thickness

Greg Bartlett <[log in to unmask]>

Wed, 11 Feb 1998 08:32:29 +0000

136 lines

Re: Entek Plus coating thickness

Michael Carano <[log in to unmask]>

Wed, 11 Feb 1998 23:12:51 -0800

69 lines

New Thread

Equinox International.

Equinox International.

[log in to unmask]

Fri, 20 Feb 1998 13:18:44 EST

25 lines

New Thread

Expereinced PCB Sales Reps

Expereinced PCB Sales Reps

Raviv <[log in to unmask]>

Wed, 25 Feb 1998 13:25:56 -0500

98 lines

New Thread

FAB - Gold consumption rates

Re: FAB - Gold consumption rates

Ed Cosper <[log in to unmask]>

Wed, 4 Feb 1998 10:35:51 -0600

28 lines

Re: FAB - Gold consumption rates

Lenny Kurup <[log in to unmask]>

Wed, 4 Feb 1998 12:08:44 -0500

66 lines

Re: FAB - Gold consumption rates

Mike Barmuta <[log in to unmask]>

Wed, 4 Feb 1998 10:56:39 -0800

58 lines

New Thread

FAB, Test Coupons

FAB, Test Coupons

James Patten <[log in to unmask]>

Tue, 10 Feb 1998 07:24:46 -0700

24 lines

FAB, Test Coupons

Richard MacCutcheon <[log in to unmask]>

Tue, 10 Feb 1998 09:22:00 -0700

58 lines

New Thread

FAB: Barrel Cracking MC-3D material

FAB: Barrel Cracking MC-3D material

Steve Collins <[log in to unmask]>

Fri, 27 Feb 1998 07:17:40 -0700

66 lines

Re: FAB: Barrel Cracking MC-3D material

Robisan1 <[log in to unmask]>

Fri, 27 Feb 1998 10:11:05 EST

66 lines

New Thread

FAB: cross section docs

FAB: cross section docs

Mark Simmons <[log in to unmask]>

Tue, 10 Feb 1998 12:29:04 -0800

29 lines

New Thread

Fab: Drill Bits

Fab: Drill Bits

sam mccorkel <[log in to unmask]>

Mon, 23 Feb 1998 13:15:08 -0500

26 lines

Re: Fab: Drill Bits

drilbert <[log in to unmask]>

Tue, 24 Feb 1998 04:14:09 -0800

39 lines

Re: Fab: Drill Bits

Richard Linn <[log in to unmask]>

Tue, 24 Feb 1998 22:50:48 +0800

54 lines

New Thread

FAB: Process controls for drilling

FAB: Process controls for drilling

sam mccorkel <[log in to unmask]>

Fri, 6 Feb 1998 09:46:52 -0500

29 lines

Re: FAB: Process controls for drilling

Ed Cosper <[log in to unmask]>

Fri, 6 Feb 1998 11:13:38 -0600

100 lines

New Thread

FAB: Pure Gold Process

Re: FAB: Pure Gold Process

Jacques A Coderre <[log in to unmask]>

Tue, 3 Feb 1998 08:55:08 -0500

79 lines

New Thread

FAB; Subject: Very Fine Line

Re: FAB; Subject: Very Fine Line

ALDERETE, MICHAEL S <[log in to unmask]>

Thu, 5 Feb 1998 11:34:58 -0800

105 lines

New Thread

FBGA design

FBGA design

Achim Neu <[log in to unmask]>

Sun, 1 Feb 1998 12:08:23 +0100

57 lines

New Thread

Fillet Height

Re: Fillet Height

[log in to unmask]

Sun, 8 Feb 1998 07:34:34 EST

27 lines

New Thread

Fine Line Search

Fine Line Search

Jana Carraway <[log in to unmask]>

Tue, 17 Feb 1998 16:15:15 PST

27 lines

New Thread

fine pitch testing

fine pitch testing

Koblinger, Jürgen <[log in to unmask]>

Thu, 26 Feb 1998 18:12:31 +0100

32 lines

New Thread

Flipchip placement equip

Flipchip placement equip

Larry Crane <[log in to unmask]>

Mon, 16 Feb 1998 12:56:21 -0400

24 lines

New Thread

Flipchip placement equip -Reply

Flipchip placement equip -Reply

David Anderson <[log in to unmask]>

Thu, 19 Feb 1998 10:07:08 -0600

78 lines

New Thread

Florida Cirtech

Florida Cirtech

[log in to unmask]

Thu, 19 Feb 1998 15:17:25 -0600

26 lines

Re: Florida Cirtech

[log in to unmask]

Thu, 19 Feb 1998 17:45:58 EST

27 lines

New Thread

FMEA means what?

FMEA means what?

Ed Cosper <[log in to unmask]>

Fri, 20 Feb 1998 14:15:33 -0600

25 lines

Re: FMEA means what?

ADAMS, Mike <[log in to unmask]>

Fri, 20 Feb 1998 15:30:38 -0500

55 lines

Re: FMEA means what?

David Girard <[log in to unmask]>

Fri, 20 Feb 1998 15:39:01 -0500

54 lines

Re: FMEA means what?

Brad Vanderhoof <[log in to unmask]>

Fri, 20 Feb 1998 12:39:06 PST

48 lines

New Thread

FS: electrovert 500C

FS: electrovert 500C

Sales Dept <[log in to unmask]>

Mon, 2 Feb 1998 12:34:14 -0500

32 lines

New Thread

FW: virus alert -Forwarded

FW: virus alert -Forwarded

Kathy Palumbo <[log in to unmask]>

Mon, 9 Feb 1998 14:16:09 -0800

160 lines

Re: FW: virus alert -Forwarded

Stella - Holowatch <[log in to unmask]>

Tue, 10 Feb 1998 18:22:04 -0500

183 lines

New Thread

FW: [TN] (Fwd) Gold Plated Edge Connectors

FW: [TN] (Fwd) Gold Plated Edge Connectors

Rhoads, Randall E <[log in to unmask]>

Wed, 11 Feb 1998 11:51:08 -0500

87 lines

New Thread

FW: [TN] Alpha Metals Ionograph 500M Chemical Verification

FW: [TN] Alpha Metals Ionograph 500M Chemical Verification

Dhawan, Ashok <[log in to unmask]>

Fri, 13 Feb 1998 09:39:01 -0700

72 lines

New Thread

FW: [TN] Chip On Board

FW: [TN] Chip On Board

Dhawan, Ashok <[log in to unmask]>

Sun, 8 Feb 1998 06:59:05 -0700

86 lines

New Thread

FW: [TN] Component Marking Ink

FW: [TN] Component Marking Ink

Dhawan, Ashok <[log in to unmask]>

Thu, 19 Feb 1998 16:31:00 -0700

104 lines

New Thread

FW: [TN] F&K & ASM equipment feedback

FW: [TN] F&K & ASM equipment feedback

Dhawan, Ashok <[log in to unmask]>

Sat, 14 Feb 1998 12:12:43 -0500

93 lines

New Thread

FW: [TN] Gerber Software

FW: [TN] Gerber Software

Dhawan, Ashok <[log in to unmask]>

Fri, 13 Feb 1998 11:22:13 -0500

55 lines

FW: [TN] Gerber Software

Dhawan, Ashok <[log in to unmask]>

Fri, 13 Feb 1998 14:32:24 -0700

78 lines

New Thread

FW: [TN] Glue dispenser machine v/s stencil printing

FW: [TN] Glue dispenser machine v/s stencil printing

Dhawan, Ashok <[log in to unmask]>

Tue, 24 Feb 1998 14:43:28 -0600

100 lines

New Thread

FW: [TN] Gold for edge-board connectors thickness

FW: [TN] Gold for edge-board connectors thickness

Rhoads, Randall E <[log in to unmask]>

Wed, 11 Feb 1998 14:27:31 -0500

82 lines

New Thread

FW: [TN] gold over entire board

FW: [TN] gold over entire board

SMITH RUSSELL MSM PO US <[log in to unmask]>

Fri, 20 Feb 1998 04:27:00 +0100

163 lines

New Thread

FW: [TN] Stencil Aperture Shapes -Reply

FW: [TN] Stencil Aperture Shapes -Reply

Dhawan, Ashok <[log in to unmask]>

Fri, 13 Feb 1998 16:22:05 -0700

225 lines

New Thread

Fwd: [CN] IPCchat session announcement

Fwd: [CN] IPCchat session announcement

Christopher Rhodes <[log in to unmask]>

Fri, 13 Feb 1998 07:57:10 -0600

112 lines

New Thread

GEB Laminate

GEB Laminate

Bernard Kessler & Associates LTD <[log in to unmask]>

Wed, 11 Feb 1998 10:36:26 -0500

33 lines

New Thread

Gen: Axarel supplier

Gen: Axarel supplier

Jim Marsico 516-595-5879 <[log in to unmask]>

Tue, 24 Feb 1998 15:51:00 -0400

25 lines

Re: Gen: Axarel supplier

Doug Pauls <[log in to unmask]>

Tue, 24 Feb 1998 16:31:38 EST

33 lines

Re: Gen: Axarel supplier

Bev Christian <[log in to unmask]>

Wed, 25 Feb 1998 07:55:04 -0500

57 lines

Re: Gen: Axarel supplier

Sherry Warner <[log in to unmask]>

Wed, 25 Feb 1998 08:26:35 -0500

56 lines

New Thread

GEN: Greater Boston DC chapter meeting 2/18

GEN: Greater Boston DC chapter meeting 2/18

Jeff Seeger <[log in to unmask]>

Fri, 13 Feb 1998 12:16:10 -0500

71 lines

New Thread

GEN: on the passing of a friend

GEN: on the passing of a friend

Jeff Seeger <[log in to unmask]>

Thu, 12 Feb 1998 16:46:29 -0500

74 lines

New Thread

GEN: Short course in UK on Electronic Manufacturing

GEN: Short course in UK on Electronic Manufacturing

David Whalley <[log in to unmask]>

Fri, 20 Feb 1998 16:52:56 +0000

55 lines

New Thread

Gerber Software

Gerber Software

Eddie Brunker <[log in to unmask]>

Fri, 13 Feb 1998 12:21:00 GMT

25 lines

Re: Gerber Software

[log in to unmask]

Fri, 13 Feb 1998 07:34:04 EST

45 lines

New Thread

GLASS ARTWORK

GLASS ARTWORK

Modular Components National, Inc. <[log in to unmask]>

Fri, 27 Feb 1998 13:17:09 -0500

35 lines

Re: GLASS ARTWORK

Bob Seyfert <[log in to unmask]>

Fri, 27 Feb 1998 17:19:36 -0500

60 lines

New Thread

Glue dispenser machine v/s stencil printing

Glue dispenser machine v/s stencil printing

Ken Patel <[log in to unmask]>

Mon, 23 Feb 1998 19:03:28 -0800

33 lines

Re: Glue dispenser machine v/s stencil printing

ss yeo <[log in to unmask]>

Fri, 20 Mar 1998 19:43:40 +0800

54 lines

Re: Glue dispenser machine v/s stencil printing

Peggi J. Blakley <[log in to unmask]>

Tue, 24 Feb 1998 05:54:16 -0800

62 lines

Re: Glue dispenser machine v/s stencil printing

Charles Barker <[log in to unmask]>

Tue, 24 Feb 1998 08:37:47 -0600

55 lines

Re: Glue dispenser machine v/s stencil printing

Karen Tellefsen <[log in to unmask]>

Tue, 24 Feb 1998 09:44:45 -0500

87 lines

Re: Glue dispenser machine v/s stencil printing

[log in to unmask]

Tue, 24 Feb 1998 09:30:25 EST

36 lines

New Thread

Glue on solder mask

Glue on solder mask

Paul Stolar <[log in to unmask]>

Tue, 24 Feb 1998 17:05:25 -0600

27 lines

New Thread

Gold for edge-board connectors thickness

Gold for edge-board connectors thickness

Carlos R. Robert <[log in to unmask]>

Fri, 6 Feb 1998 19:30:01 AST

70 lines

Re: Gold for edge-board connectors thickness

Phillip E. Hinton <[log in to unmask]>

Fri, 6 Feb 1998 21:42:55 EST

36 lines

Re: Gold for edge-board connectors thickness

Stephen R. Gregory <[log in to unmask]>

Fri, 6 Feb 1998 23:25:41 EST

40 lines

Re: Gold for edge-board connectors thickness

[log in to unmask]

Sat, 7 Feb 1998 09:03:26 EST

26 lines

Re: Gold for edge-board connectors thickness

David D Hillman <[log in to unmask]>

Sun, 8 Feb 1998 14:43:25 -0600

109 lines

Re: Gold for edge-board connectors thickness

John Haman Jr. <[log in to unmask]>

Mon, 9 Feb 1998 08:22:19 PST

44 lines

Re: Gold for edge-board connectors thickness

Jerry Cupples <[log in to unmask]>

Mon, 9 Feb 1998 17:29:36 -0600

88 lines

Re: Gold for edge-board connectors thickness

John Haman Jr. <[log in to unmask]>

Tue, 10 Feb 1998 08:24:28 PST

44 lines

Re: Gold for edge-board connectors thickness

Rod Martens <[log in to unmask]>

Tue, 10 Feb 1998 08:43:48 -0700

122 lines

Re: Gold for edge-board connectors thickness

Rhoads, Randall E <[log in to unmask]>

Mon, 16 Feb 1998 08:11:53 -0500

42 lines

New Thread

gold over entire board

gold over entire board

Matthew Park <[log in to unmask]>

Thu, 19 Feb 1998 10:51:19 -0800

47 lines

Re: gold over entire board

Gary Griffin <[log in to unmask]>

Thu, 19 Feb 1998 11:07:04 -0800

128 lines

Re: gold over entire board

Hamilton, Richard -4454 <[log in to unmask]>

Thu, 19 Feb 1998 12:27:07 -0700

73 lines

Re: gold over entire board

Stephen R. Gregory <[log in to unmask]>

Thu, 19 Feb 1998 16:37:07 EST

50 lines

Re: gold over entire board

Jack Crawford <[log in to unmask]>

Thu, 19 Feb 1998 19:07:57 -0600

102 lines

Re: gold over entire board

Darrel Therriault <[log in to unmask]>

Fri, 20 Feb 1998 07:53:09 -0800

90 lines

Re: gold over entire board

Eddie Brunker <[log in to unmask]>

Fri, 20 Feb 1998 17:10:06 GMT

96 lines

Re: gold over entire board

Boggs, David <[log in to unmask]>

Fri, 20 Feb 1998 12:19:45 -0800

158 lines

Re: gold over entire board

Stephen R. Gregory <[log in to unmask]>

Fri, 20 Feb 1998 16:24:42 EST

53 lines

Re: gold over entire board

Kathy Palumbo <[log in to unmask]>

Mon, 23 Feb 1998 09:15:32 -0800

107 lines

Re: gold over entire board

Stephen R. Gregory <[log in to unmask]>

Mon, 23 Feb 1998 13:50:18 EST

82 lines

Gold over entire board

[log in to unmask]

Mon, 23 Feb 1998 16:42:15 -0600

139 lines

New Thread

Gold plating b/4 or after hal

Re: Gold plating b/4 or after hal

John Haman Jr. <[log in to unmask]>

Tue, 3 Feb 1998 11:19:06 PST

38 lines

New Thread

Gold plating switch contacts

Gold plating switch contacts

George Elliott <[log in to unmask]>

Mon, 2 Feb 1998 14:39:10 -0000

23 lines

Re: Gold plating switch contacts

[log in to unmask]

Mon, 2 Feb 1998 11:03:26 EST

27 lines

Re: Gold plating switch contacts

Joseph Fjelstad <[log in to unmask]>

Mon, 2 Feb 1998 08:18:12 -0800

53 lines

Re: Gold plating switch contacts

Stephen R. Gregory <[log in to unmask]>

Tue, 3 Feb 1998 10:56:05 EST

32 lines

New Thread

Gold surface finish

Gold surface finish

[log in to unmask]

Wed, 25 Feb 1998 14:12:27 EST

31 lines

Re: Gold surface finish

Kathy Palumbo <[log in to unmask]>

Wed, 25 Feb 1998 11:17:47 -0800

69 lines

Re: Gold surface finish

David D Hillman <[log in to unmask]>

Thu, 26 Feb 1998 18:17:28 -0600

76 lines

New Thread

HASL solder specs

Re: HASL solder specs

David D Hillman <[log in to unmask]>

Sun, 1 Feb 1998 18:38:16 -0600

82 lines

New Thread

Help on drying boards

Help on drying boards

Gabriela Bogdan <[log in to unmask]>

Mon, 2 Feb 1998 09:05:54 +0000

43 lines

Re: Help on drying boards

David D Hillman <[log in to unmask]>

Mon, 2 Feb 1998 07:00:54 -0600

146 lines

Re: Help on drying boards

Thomas E. Waznis <[log in to unmask]>

Mon, 2 Feb 1998 05:40:23 -0800

29 lines

New Thread

Hi James,

Hi James,

Mitch Morey <[log in to unmask]>

Tue, 10 Feb 1998 08:49:19 -0800

75 lines

New Thread

High-Frequency Dielectric Constant

High-Frequency Dielectric Constant

Rhoads, Randall E <[log in to unmask]>

Wed, 4 Feb 1998 11:21:21 -0500

33 lines

Re: High-Frequency Dielectric Constant

McGlaughlin, Jeffrey A <[log in to unmask]>

Wed, 4 Feb 1998 12:57:57 -0500

62 lines

Re: High-Frequency Dielectric Constant

Manfred Huschka <[log in to unmask]>

Fri, 6 Feb 1998 01:07:19 -0600

81 lines

Re: High-Frequency Dielectric Constant

Mikhail Khusid <[log in to unmask]>

Fri, 6 Feb 1998 06:54:46 -0500

127 lines

New Thread

How to treat a PWB ???

How to treat a PWB ???

Wiessner, Christian <[log in to unmask]>

Fri, 13 Feb 1998 06:08:49 -0600

38 lines

Re: How to treat a PWB ???

David D Hillman <[log in to unmask]>

Fri, 13 Feb 1998 07:55:58 -0600

79 lines

New Thread

I need .059 1/1 or 1/0 GE CEM3 or AL910 laminate

I need .059 1/1 or 1/0 GE CEM3 or AL910 laminate

Lisa Parker <[log in to unmask]>

Fri, 6 Feb 1998 14:36:29 -0600

39 lines

Re: I need .059 1/1 or 1/0 GE CEM3 or AL910 laminate

Ed Cosper <[log in to unmask]>

Fri, 6 Feb 1998 16:30:08 -0600

75 lines

New Thread

I'm looking to find a tranning course for PCB design & layout

I'm looking to find a tranning course for PCB design & layout

Jimmy Blier <[log in to unmask]>

Wed, 11 Feb 1998 11:40:15 -0500

82 lines

I'm looking to find a tranning course for PCB design & layout

Jimmy Blier <[log in to unmask]>

Thu, 12 Feb 1998 08:30:00 -0500

83 lines

Re: I'm looking to find a tranning course for PCB design & layout

John Riley <[log in to unmask]>

Fri, 13 Feb 1998 11:42:53 -0600

107 lines

New Thread

IC Adapters

IC Adapters

Mike Wilson <[log in to unmask]>

Thu, 19 Feb 1998 08:26:31 -0800

34 lines

Re: IC Adapters

Steve Hawn <[log in to unmask]>

Thu, 19 Feb 1998 08:46:03 -0800

46 lines

New Thread

Immersion Tin

Immersion Tin

John Haman Jr. <[log in to unmask]>

Tue, 3 Feb 1998 11:17:21 PST

36 lines

Re: Immersion Tin

Mark Simmons <[log in to unmask]>

Tue, 3 Feb 1998 10:00:08 -0800

27 lines

Re: Immersion Tin

[log in to unmask]

Tue, 3 Feb 1998 23:04:00 EST

31 lines

New Thread

Impedance Software

Impedance Software

[log in to unmask]

Wed, 4 Feb 1998 12:52:02 CST

32 lines

New Thread

Information on learning curves.

Information on learning curves.

Tony Bugeja <[log in to unmask]>

Fri, 13 Feb 1998 14:17:43 -0500

32 lines

New Thread

Information on Silver Terminals

Information on Silver Terminals

Tony Bugeja <[log in to unmask]>

Tue, 10 Feb 1998 07:29:30 -0500

32 lines

Re: Information on Silver Terminals

Don Fumia <[log in to unmask]>

Tue, 10 Feb 1998 08:44:56 -0500

49 lines

Re: Information on Silver Terminals

Jerry Cupples <[log in to unmask]>

Tue, 10 Feb 1998 09:09:56 -0600

48 lines

Re: Information on Silver Terminals

Phillip J. Dudley <[log in to unmask]>

Tue, 10 Feb 1998 08:05:28 -0800

53 lines

New Thread

IPC Designers Council Meeting (Atlanta Chapter)

IPC Designers Council Meeting (Atlanta Chapter)

[log in to unmask]

Mon, 16 Feb 1998 08:29:07 EST

52 lines

New Thread

IPC-610

IPC-610

[log in to unmask]

Thu, 12 Feb 1998 17:22:30 +0000

27 lines

Re: IPC-610

Muller, Mary <[log in to unmask]>

Thu, 12 Feb 1998 14:01:53 -0800

77 lines

New Thread

IPC-CF-150E

IPC-CF-150E

CCC Malaysia (E-mail) <[log in to unmask]>

Wed, 11 Feb 1998 15:29:01 +0800

25 lines

New Thread

IPCchat session announcement

IPCchat session announcement

[log in to unmask]

Thu, 12 Feb 1998 20:34:32 -0800

49 lines

IPCchat session announcement

[log in to unmask]

Thu, 12 Feb 1998 20:34:32 -0800

61 lines

IPCchat session announcement

[log in to unmask]

Tue, 24 Feb 1998 19:33:03 -0800

46 lines

IPCchat session announcement

[log in to unmask]

Fri, 27 Feb 1998 15:27:55 -0800

46 lines

New Thread

J-STD-001B Cleaning Call out

J-STD-001B Cleaning Call out

Wesley Samples <[log in to unmask]>

Tue, 17 Feb 1998 15:41:27 -0600

41 lines

New Thread

jdec trays

jdec trays

Vertefeuille, Russ (AZ77) <[log in to unmask]>

Wed, 18 Feb 1998 11:06:19 -0600

30 lines

Re: jdec trays

Shea, Daniel <[log in to unmask]>

Wed, 18 Feb 1998 15:28:35 -0500

60 lines

Re: jdec trays

Shaddock, David M (CRD) <[log in to unmask]>

Fri, 27 Feb 1998 18:43:42 -0500

78 lines

New Thread

Kapton Etching

Kapton Etching

Bob <[log in to unmask]>

Fri, 13 Feb 1998 12:01:16 -0800

27 lines

Re: Kapton Etching

Paul Terranova <[log in to unmask]>

Fri, 13 Feb 1998 15:27:25 -0500

71 lines

Re: Kapton Etching

Sheila Smith <[log in to unmask]>

Fri, 13 Feb 1998 16:11:04 -0500

101 lines

Re: Kapton Etching

David Anderson <[log in to unmask]>

Fri, 13 Feb 1998 15:47:13 -0600

68 lines

New Thread

Kevlar reinforced laminate or prepreg

Kevlar reinforced laminate or prepreg

Sheila Smith <[log in to unmask]>

Wed, 25 Feb 1998 15:06:13 -0500

33 lines

Re: Kevlar reinforced laminate or prepreg

Leslie O. Connally <[log in to unmask]>

Wed, 25 Feb 1998 15:37:04 -0800

64 lines

Re: Kevlar reinforced laminate or prepreg

[log in to unmask]

Wed, 25 Feb 1998 17:05:16 EST

32 lines

Re: Kevlar reinforced laminate or prepreg

Jerome Sallo <[log in to unmask]>

Thu, 26 Feb 1998 11:37:08 EST

29 lines

New Thread

Laminate Identification

Laminate Identification

Dan LeVasseur <[log in to unmask]>

Tue, 10 Feb 1998 23:34:42 -0500

37 lines

New Thread

Laminate surface abrasion

Laminate surface abrasion

D'Angelo, Ken <[log in to unmask]>

Thu, 26 Feb 1998 09:58:25 -0500

44 lines

Re: Laminate surface abrasion

Paul Terranova <[log in to unmask]>

Thu, 26 Feb 1998 10:42:31 -0500

100 lines

New Thread

Lamination Presses Input

Lamination Presses Input

Richard MacCutcheon <[log in to unmask]>

Mon, 9 Feb 1998 11:24:00 -0700

37 lines

Re: Lamination Presses Input

Orna and Yehuda <[log in to unmask]>

Thu, 12 Feb 1998 00:35:25 +0200

85 lines

New Thread

Laser via in pad

Laser via in pad

David Backen <[log in to unmask]>

Sun, 1 Feb 1998 10:14:02 -0500

38 lines

laser via in pad

Thomas Jacob <[log in to unmask]>

Mon, 2 Feb 1998 18:11:01 +0100

49 lines

New Thread

Leaching of Gold into a solder pot?

Leaching of Gold into a solder pot?

Tony Bugeja <[log in to unmask]>

Tue, 10 Feb 1998 07:32:08 -0500

31 lines

Re: Leaching of Gold into a solder pot?

Jerry Cupples <[log in to unmask]>

Tue, 10 Feb 1998 09:27:31 -0600

50 lines

Re: Leaching of Gold into a solder pot?

Stephane Richard <[log in to unmask]>

Tue, 10 Feb 1998 13:39:02 -0500

71 lines

Re: Leaching of Gold into a solder pot?

[log in to unmask] <[log in to unmask]>

Tue, 10 Feb 1998 21:08:41 -0800

26 lines

Re: Leaching of Gold into a solder pot?

Paul Klasek <[log in to unmask]>

Wed, 11 Feb 1998 08:45:23 +1100

68 lines

New Thread

Leaching of Gold into a solder pot? -Reply

Leaching of Gold into a solder pot? -Reply

Jon Moore <[log in to unmask]>

Thu, 12 Feb 1998 15:11:55 -0500

65 lines

New Thread

LEAD SPOT TEST

LEAD SPOT TEST

Bev Christian <[log in to unmask]>

Wed, 11 Feb 1998 14:43:01 -0500

30 lines

Re: LEAD SPOT TEST

David D Hillman <[log in to unmask]>

Thu, 12 Feb 1998 05:53:54 -0600

71 lines

New Thread

Looking for Equipment

Looking for Equipment

John Haman Jr. <[log in to unmask]>

Fri, 20 Feb 1998 08:50:50 PST

31 lines

Re: Looking for Equipment

Phil Dam <[log in to unmask]>

Tue, 24 Feb 1998 10:25:15 EST

23 lines

New Thread

looking for soldermask manufacturer

looking for soldermask manufacturer

Tenison Stone <[log in to unmask]>

Mon, 9 Feb 1998 07:18:46 -0600

75 lines

Re: looking for soldermask manufacturer

Larry J. Fisher <[log in to unmask]>

Wed, 11 Feb 1998 00:03:49 EST

51 lines

New Thread

Manufacturers Rep's Wanted

Manufacturers Rep's Wanted

ETS <[log in to unmask]>

Mon, 2 Feb 1998 10:57:46 -0800

29 lines

Re: Manufacturers Rep's Wanted

Douglas H Bennett- Sales Engineer <[log in to unmask]>

Mon, 2 Feb 1998 17:47:51 -0800

62 lines

Re: Manufacturers Rep's Wanted

Jack Crawford <[log in to unmask]>

Mon, 2 Feb 1998 17:25:01 -0600

89 lines

New Thread

Mating Tin / Gold; SIMMs and sockets

Mating Tin / Gold; SIMMs and sockets

Lee McCuistion <[log in to unmask]>

Tue, 24 Feb 1998 10:01:02 +0000

36 lines

Re: Mating Tin / Gold; SIMMs and sockets

Karen Tellefsen <[log in to unmask]>

Tue, 24 Feb 1998 16:00:49 -0500

52 lines

Re: Mating Tin / Gold; SIMMs and sockets

Rod Martens <[log in to unmask]>

Tue, 24 Feb 1998 14:38:24 -0700

66 lines

Mating Tin / Gold; SIMMs and sockets

Stephen Ayotte <[log in to unmask]>

Wed, 25 Feb 1998 13:52:08 -0500

51 lines

New Thread

metal sludge reduction

metal sludge reduction

rameshl <[log in to unmask]>

Sat, 21 Feb 1998 14:23:50 +0500

41 lines

metal sludge reduction

rameshl <[log in to unmask]>

Mon, 23 Feb 1998 10:15:32 +0500

32 lines

Re: metal sludge reduction

[log in to unmask]

Mon, 23 Feb 1998 09:39:24 EST

33 lines

Re: metal sludge reduction

Graham Naisbitt <[log in to unmask]>

Mon, 23 Feb 1998 23:48:43 -0000

68 lines

metal sludge reduction

rameshl <[log in to unmask]>

Tue, 24 Feb 1998 09:04:25 +0500

33 lines

metal sludge reduction

rameshl <[log in to unmask]>

Tue, 24 Feb 1998 09:04:36 +0500

40 lines

Re: metal sludge reduction

Ramesh <[log in to unmask]>

Tue, 24 Feb 1998 09:28:57 +0000

83 lines

New Thread

MICROSCOPE REPAIRS

MICROSCOPE REPAIRS

David Girard <[log in to unmask]>

Thu, 12 Feb 1998 09:00:07 -0500

33 lines

Re: MICROSCOPE REPAIRS

John Haman Jr. <[log in to unmask]>

Fri, 13 Feb 1998 08:11:25 PST

61 lines

New Thread

MICROSCOPE REPAIRS -Reply

MICROSCOPE REPAIRS -Reply

Ron Hayashi <[log in to unmask]>

Thu, 12 Feb 1998 08:27:52 -0800

23 lines

New Thread

Microsection of Microvias

Microsection of Microvias

Reed, Randy <[log in to unmask]>

Thu, 26 Feb 1998 17:18:42 -0800

44 lines

New Thread

Microsections

Microsections

BOB HAYNES <[log in to unmask]>

Tue, 24 Feb 1998 14:15:00 -0600

37 lines

Re: Microsections

Paul Terranova <[log in to unmask]>

Tue, 24 Feb 1998 16:37:33 -0500

83 lines

Re: Microsections

Gabriela Bogdan <[log in to unmask]>

Wed, 25 Feb 1998 11:38:09 +0000

67 lines

New Thread

MicroVia info, San Diego IPC Chapter

Re: MicroVia info, San Diego IPC Chapter

Mitch Morey <[log in to unmask]>

Wed, 18 Feb 1998 09:47:24 -0800

44 lines

New Thread

Min. Annular Ring

Min. Annular Ring

Michael Forrester <[log in to unmask]>

Wed, 18 Feb 1998 09:11:31 -0400

30 lines

Re: Min. Annular Ring

Gary Griffin <[log in to unmask]>

Wed, 18 Feb 1998 08:30:57 -0800

99 lines

Re: Min. Annular Ring

John Haman Jr. <[log in to unmask]>

Wed, 18 Feb 1998 13:24:03 PST

89 lines

Re: Min. Annular Ring

Lyle Wallig <[log in to unmask]>

Wed, 18 Feb 1998 17:02:05 EST

30 lines

New Thread

Modeling a IR reflow oven

Modeling a IR reflow oven

W.Lawson <[log in to unmask]>

Wed, 4 Feb 1998 11:00:08 -0800

33 lines

Re: Modeling a IR reflow oven

David Whalley <[log in to unmask]>

Fri, 6 Feb 1998 09:55:51 +0000

47 lines

Re: Modeling a IR reflow oven

Werner Engelmaier <[log in to unmask]>

Sun, 8 Feb 1998 23:45:01 EST

35 lines

New Thread

Moisture Cure for Conformal Coatings

Moisture Cure for Conformal Coatings

ETS <[log in to unmask]>

Tue, 10 Feb 1998 16:26:37 -0800

43 lines

Re: Moisture Cure for Conformal Coatings

Tony Bugeja <[log in to unmask]>

Wed, 11 Feb 1998 07:48:28 -0500

73 lines

Re: Moisture Cure for Conformal Coatings

[log in to unmask]

Wed, 11 Feb 1998 07:27:51 -0700

71 lines

New Thread

Moisture Cure for Conformal Coatings -Svar

Moisture Cure for Conformal Coatings -Svar

Lars Ladefoged Holm <[log in to unmask]>

Wed, 11 Feb 1998 07:21:20 +0000

84 lines

New Thread

Moisture Sensitive Parts

Moisture Sensitive Parts

Kane, Joseph <[log in to unmask]>

Mon, 2 Feb 1998 09:51:16 -0500

33 lines

Re: Moisture Sensitive Parts

Graham Naisbitt <[log in to unmask]>

Mon, 2 Feb 1998 22:38:44 -0000

73 lines

Re: Moisture Sensitive Parts

Stephen R. Gregory <[log in to unmask]>

Tue, 3 Feb 1998 11:07:35 EST

32 lines

New Thread

Moisture Sensitivity

Moisture Sensitivity

Signorelli, Paul <[log in to unmask]>

Wed, 11 Feb 1998 10:13:08 -0600

31 lines

New Thread

Most weird problem: Solder between epoxy & fab or epoxy &

Re: Most weird problem: Solder between epoxy & fab or epoxy &

Stephen R. Gregory <[log in to unmask]>

Thu, 5 Feb 1998 23:16:43 EST

76 lines

New Thread

Most weird problem: Solder between epoxy & fab or epoxy & comp

Most weird problem: Solder between epoxy & fab or epoxy & comp

Ken Patel <[log in to unmask]>

Thu, 5 Feb 1998 18:02:04 -0800

39 lines

Re: Most weird problem: Solder between epoxy & fab or epoxy & comp

COLLINS, GRAHAM <[log in to unmask]>

Fri, 6 Feb 1998 07:53:07 -0500

94 lines

Re: Most weird problem: Solder between epoxy & fab or epoxy & comp

Ed Holton <[log in to unmask]>

Fri, 6 Feb 1998 08:00:12 -0500

109 lines

Re: Most weird problem: Solder between epoxy & fab or epoxy & comp

Darryl Small <[log in to unmask]>

Fri, 6 Feb 1998 16:36:57 -0400

149 lines

Re: Most weird problem: Solder between epoxy & fab or epoxy & comp

John Maxwell <[log in to unmask]>

Mon, 9 Feb 1998 08:50:18 -0700

46 lines

New Thread

MTBF

Re: MTBF

Werner Engelmaier <[log in to unmask]>

Tue, 3 Feb 1998 08:23:34 EST

44 lines

New Thread

National PWB Resource Center

National PWB Resource Center

Holly Lynch <[log in to unmask]>

Wed, 11 Feb 1998 08:59:20 -0500

60 lines

New Thread

Need inexpensive method of glueing parts on PCB

Need inexpensive method of glueing parts on PCB

Chris Stack <[log in to unmask]>

Tue, 24 Feb 1998 11:06:01 -0500

37 lines

Re: Need inexpensive method of glueing parts on PCB

Charles Barker <[log in to unmask]>

Wed, 25 Feb 1998 07:45:11 -0600

58 lines

New Thread

Nickel,Gold&solder masks

Nickel,Gold&solder masks

Gabriela Bogdan <[log in to unmask]>

Sat, 21 Feb 1998 11:54:45 +0000

35 lines

Re: Nickel,Gold&solder masks

Afri Singh <[log in to unmask]>

Sat, 21 Feb 1998 14:51:31 -0500

54 lines

Re: Nickel,Gold&solder masks

Lenny Kurup <[log in to unmask]>

Sun, 22 Feb 1998 22:44:27 -0500

51 lines

Re: Nickel,Gold&solder masks

[log in to unmask]

Tue, 24 Feb 1998 10:19:49 EST

39 lines

New Thread

NON-THERMALLY RELIEVED VIAS- ring voids

NON-THERMALLY RELIEVED VIAS- ring voids

Richard G Smith <[log in to unmask]>

Tue, 24 Feb 1998 17:13:29 -0600

49 lines

Re: NON-THERMALLY RELIEVED VIAS- ring voids

raymond lockshier <[log in to unmask]>

Tue, 24 Feb 1998 18:27:38 -0500

37 lines

Re: NON-THERMALLY RELIEVED VIAS- ring voids

Mike Bailey <[log in to unmask]>

Tue, 24 Feb 1998 15:41:12 -0500

30 lines

Re: NON-THERMALLY RELIEVED VIAS- ring voids

[log in to unmask]

Wed, 25 Feb 1998 08:46:03 EST

32 lines

New Thread

NON-THERMALLY RELIEVED VIAS- ring voids -Reply

NON-THERMALLY RELIEVED VIAS- ring voids -Reply

Fred Johnson <[log in to unmask]>

Tue, 24 Feb 1998 22:52:00 +0000

86 lines

Re: NON-THERMALLY RELIEVED VIAS- ring voids -Reply

John Haman Jr. <[log in to unmask]>

Wed, 25 Feb 1998 08:33:32 PST

123 lines

Re: NON-THERMALLY RELIEVED VIAS- ring voids -Reply

Matthew Park <[log in to unmask]>

Wed, 25 Feb 1998 08:05:24 -0800

65 lines

Re: NON-THERMALLY RELIEVED VIAS- ring voids -Reply

raymond lockshier <[log in to unmask]>

Wed, 25 Feb 1998 12:50:33 -0500

40 lines

New Thread

NON-THERMALLY RELIEVED VIAS- ring voids -Reply -Reply

Re: NON-THERMALLY RELIEVED VIAS- ring voids -Reply -Reply

Larry Campbell <[log in to unmask]>

Wed, 25 Feb 1998 11:34:11 -0500

86 lines

New Thread

Omikron Immersion White Tin

Omikron Immersion White Tin

Tenison Stone <[log in to unmask]>

Wed, 18 Feb 1998 15:05:04 -0600

76 lines

Re: Omikron Immersion White Tin

[log in to unmask]

Wed, 18 Feb 1998 22:13:38 EST

24 lines

New Thread

ORGANIC COATING(PRE-FLUX) THICKNESS MEASUREMEN

ORGANIC COATING(PRE-FLUX) THICKNESS MEASUREMEN

[log in to unmask]

Sat, 14 Feb 1998 09:36:11 +0900

32 lines

Re: ORGANIC COATING(PRE-FLUX) THICKNESS MEASUREMEN

H H TONG <[log in to unmask]>

Sat, 14 Feb 1998 18:43:10 +0800

69 lines

Re: ORGANIC COATING(PRE-FLUX) THICKNESS MEASUREMEN

Eltek Ltd. - Process Engineering <[log in to unmask]>

Sun, 15 Feb 1998 18:07:52 +0200

46 lines

New Thread

OSP coating and soldermask

OSP coating and soldermask

Ed Holton <[log in to unmask]>

Wed, 25 Feb 1998 09:21:20 -0400

37 lines

New Thread

OSP Stain

OSP Stain

tgyee <[log in to unmask]>

Wed, 25 Feb 1998 13:46:29 PST

41 lines

Re: OSP Stain

Tal Young-Kim <[log in to unmask]>

Fri, 27 Feb 1998 18:46:25 +0900

94 lines

Re: OSP Stain

Eltek Ltd. - Process Engineering <[log in to unmask]>

Thu, 26 Feb 1998 17:39:36 +0200

66 lines

New Thread

Paco Via Material

Paco Via Material

Ron Hayashi <[log in to unmask]>

Mon, 9 Feb 1998 09:39:15 -0800

25 lines

New Thread

pad lifting / pad rotation

pad lifting / pad rotation

Erat, Wolfgang <[log in to unmask]>

Fri, 27 Feb 1998 14:36:12 -0500

27 lines

Re: pad lifting / pad rotation

Leslie O. Connally <[log in to unmask]>

Fri, 27 Feb 1998 14:18:46 -0800

65 lines

New Thread

pad lifting / pad rotation -Reply

pad lifting / pad rotation -Reply

Fred Johnson <[log in to unmask]>

Fri, 27 Feb 1998 21:09:39 +0000

59 lines

pad lifting / pad rotation -Reply

Fred Johnson <[log in to unmask]>

Fri, 27 Feb 1998 21:17:28 +0000

302 lines

New Thread

panel yield on back plane

panel yield on back plane

Ken Patel <[log in to unmask]>

Tue, 3 Feb 1998 18:29:23 -0800

32 lines

Re: panel yield on back plane

Joseph E. J. Duclos Jr. <[log in to unmask]>

Wed, 4 Feb 1998 07:18:12 -0500

118 lines

New Thread

Panelization

Panelization

[log in to unmask]

Wed, 11 Feb 1998 18:27:00 EST

27 lines

Re: Panelization

John Parsons <[log in to unmask]>

Wed, 11 Feb 1998 15:41:01 +0000

50 lines

Re: Panelization

Stephen R. Gregory <[log in to unmask]>

Wed, 11 Feb 1998 18:56:25 EST

39 lines

Re: Panelization

Smith,Robert <[log in to unmask]>

Thu, 12 Feb 1998 06:47:00 -0500

67 lines

New Thread

PBGA rework with paste?

Re: PBGA rework with paste?

Brad Kendall <[log in to unmask]>

Wed, 11 Feb 1998 08:31:08 -0500

97 lines

New Thread

PCB ASSEMBLER

PCB ASSEMBLER

Eddy Chen <[log in to unmask]>

Sat, 28 Feb 1998 12:31:35 +0800

29 lines

New Thread

PCB cut-out

PCB cut-out

annie laberge <[log in to unmask]>

Fri, 20 Feb 1998 15:04:16 -0500

37 lines

Re: PCB cut-out

Hamilton, Richard -4454 <[log in to unmask]>

Fri, 20 Feb 1998 14:13:40 -0700

82 lines

Re: PCB cut-out

Steve Collins <[log in to unmask]>

Fri, 20 Feb 1998 15:26:23 -0700

69 lines

Re: PCB cut-out

Doug Jeffery <[log in to unmask]>

Sat, 21 Feb 1998 05:12:42 -0600

67 lines

Re: PCB cut-out

John Haman Jr. <[log in to unmask]>

Mon, 23 Feb 1998 08:32:36 PST

69 lines

New Thread

PCB desoldering

PCB desoldering

M. Betournay <[log in to unmask]>

Tue, 10 Feb 1998 10:18:24 -0500

24 lines

Re: PCB desoldering

Charles Barker <[log in to unmask]>

Tue, 10 Feb 1998 09:20:03 -0600

57 lines

Re: PCB desoldering

Stephane Richard <[log in to unmask]>

Tue, 10 Feb 1998 13:27:23 -0500

60 lines

New Thread

PCB Laminate FAQ - need support!

PCB Laminate FAQ - need support!

JB <[log in to unmask]>

Fri, 6 Feb 1998 11:00:32 +0800

41 lines

Re: PCB Laminate FAQ - need support!

John Haman Jr. <[log in to unmask]>

Fri, 6 Feb 1998 08:33:02 PST

51 lines

Re: PCB Laminate FAQ - need support!

Jerome Sallo <[log in to unmask]>

Fri, 6 Feb 1998 12:10:44 EST

27 lines

New Thread

PCB Milling machines

PCB Milling machines

Elstgeest Sander <[log in to unmask]>

Tue, 10 Feb 1998 11:11:13 +0000

30 lines

Re: PCB Milling machines

Gary Crowell Sr. <[log in to unmask]>

Tue, 10 Feb 1998 11:10:27 -0700

123 lines

New Thread

PCB Prototype Facility setup

PCB Prototype Facility setup

Alan Berni <[log in to unmask]>

Fri, 6 Feb 1998 14:03:41 -0500

47 lines

Re: PCB Prototype Facility setup

Jana Carraway <[log in to unmask]>

Fri, 6 Feb 1998 14:14:54 PST

77 lines

Re: PCB Prototype Facility setup

[log in to unmask]

Fri, 6 Feb 1998 17:36:27 EST

34 lines

New Thread

PCB Prototype Machine

PCB Prototype Machine

Alan Berni <[log in to unmask]>

Tue, 3 Feb 1998 16:44:09 -0500

37 lines

Re: PCB Prototype Machine

Mike Ralph <[log in to unmask]>

Tue, 3 Feb 1998 17:33:05 -0500

35 lines

New Thread

PCB Supplier

PCB Supplier

Mike Masters <[log in to unmask]>

Fri, 20 Feb 1998 15:42:42 -0500

37 lines

Re: PCB Supplier

Afri Singh <[log in to unmask]>

Sat, 21 Feb 1998 14:26:24 -0500

54 lines

New Thread

PCB warpage

PCB warpage

Jim Mathis <[log in to unmask]>

Mon, 16 Feb 1998 15:52:39 EST

24 lines

Re: PCB warpage

ETS <[log in to unmask]>

Mon, 16 Feb 1998 13:48:53 -0800

53 lines

Re: PCB warpage

McGlaughlin, Jeffrey A <[log in to unmask]>

Mon, 16 Feb 1998 16:51:25 -0500

48 lines

Re: PCB warpage

Shea, Daniel <[log in to unmask]>

Mon, 16 Feb 1998 16:56:19 -0500

42 lines

Re: PCB warpage

ETS <[log in to unmask]>

Mon, 16 Feb 1998 14:43:08 -0800

42 lines

Re: PCB warpage

[log in to unmask]

Mon, 16 Feb 1998 15:48:49 -0600

32 lines

Re: PCB warpage

Hamilton, Richard -4454 <[log in to unmask]>

Mon, 16 Feb 1998 16:01:27 -0700

50 lines

Re: PCB warpage

ETS <[log in to unmask]>

Mon, 16 Feb 1998 15:27:18 -0800

66 lines

Re: PCB warpage

"이진호" <[log in to unmask]>

Tue, 17 Feb 1998 14:05:33 +0900

24 lines

Re: PCB warpage

Chi-man Chan <[log in to unmask]>

Tue, 17 Feb 1998 21:13:31 +1100

37 lines

Re: PCB warpage

Dennis Beerman <[log in to unmask]>

Tue, 17 Feb 1998 07:37:26 -0500

83 lines

Re: PCB warpage

Fred Pescitelli <[log in to unmask]>

Tue, 17 Feb 1998 08:41:39 -0500

41 lines

Re: PCB warpage

Ruben Irizarry <[log in to unmask]>

Tue, 17 Feb 1998 10:04:04 -0700

58 lines

Re: PCB warpage

Dan Ratcliff 813-530-8762 <[log in to unmask]>

Tue, 17 Feb 1998 09:55:55 -0500

65 lines

Re: PCB warpage

Mark Gillan <[log in to unmask]>

Tue, 17 Feb 1998 16:24:00 +0000

96 lines

Re: PCB warpage

Nicholas Kane <[log in to unmask]>

Wed, 18 Feb 1998 05:12:59 +1100

87 lines

Re: PCB warpage

Jorge Martinez <[log in to unmask]>

Tue, 17 Feb 1998 11:08:42 -0800

67 lines

Re: PCB warpage

Jorge Martinez <[log in to unmask]>

Tue, 17 Feb 1998 11:13:18 -0800

62 lines

Re: PCB warpage

Darrel Therriault <[log in to unmask]>

Tue, 17 Feb 1998 12:12:59 -0800

69 lines

Re: PCB warpage

ETS <[log in to unmask]>

Tue, 17 Feb 1998 12:27:56 -0800

136 lines

Re: PCB warpage

Steve Collins <[log in to unmask]>

Tue, 17 Feb 1998 15:54:35 -0700

72 lines

Re: PCB warpage

Gary Griffin <[log in to unmask]>

Tue, 17 Feb 1998 14:53:11 -0800

180 lines

Re: PCB warpage

Rose, Daniel B <[log in to unmask]>

Tue, 17 Feb 1998 15:59:58 -0700

82 lines

Re: PCB warpage

David Anderson <[log in to unmask]>

Tue, 17 Feb 1998 17:28:52 -0600

23 lines

Re: PCB warpage

enza hill <[log in to unmask]>

Tue, 17 Feb 1998 18:11:15 -0600

59 lines

Re: PCB warpage

ETS <[log in to unmask]>

Tue, 17 Feb 1998 16:39:36 -0800

171 lines

PCB warpage

Eddy Chen <[log in to unmask]>

Wed, 18 Feb 1998 16:32:25 +0800

126 lines

Re: PCB warpage

Jim Mathis <[log in to unmask]>

Wed, 18 Feb 1998 17:27:19 EST

25 lines

Re: PCB warpage

Jim Mathis <[log in to unmask]>

Wed, 18 Feb 1998 17:49:36 EST

23 lines

Re: PCB warpage

Hamilton, Richard -4454 <[log in to unmask]>

Wed, 18 Feb 1998 16:00:07 -0700

47 lines

Re: PCB warpage

Dennis Beerman <[log in to unmask]>

Thu, 19 Feb 1998 09:01:11 -0500

78 lines

Re: PCB warpage

Hew How Chee <[log in to unmask]>

Sat, 21 Feb 1998 15:40:28 +0800

67 lines

Re: PCB warpage

Rob van Pol - Senior Account Engineer <[log in to unmask]>

Sat, 21 Feb 1998 12:58:50 +0100

90 lines

New Thread

PCB warpage - Reply

Re: PCB warpage - Reply

Mitch Morey <[log in to unmask]>

Thu, 19 Feb 1998 09:17:27 -0800

143 lines

Re: PCB warpage - Reply

Muller, Mary <[log in to unmask]>

Thu, 19 Feb 1998 11:00:04 -0800

186 lines

Re: PCB warpage - Reply

Jack Crawford <[log in to unmask]>

Thu, 19 Feb 1998 18:52:00 -0600

195 lines

New Thread

PCB warpage -Reply

Re: PCB warpage -Reply

Sonia Tena <[log in to unmask]>

Tue, 17 Feb 1998 09:48:34 -0800

23 lines

Re: PCB warpage -Reply

Matthew Park <[log in to unmask]>

Wed, 18 Feb 1998 15:52:54 -0800

76 lines

Re: PCB warpage -Reply

Shea, Daniel <[log in to unmask]>

Thu, 19 Feb 1998 06:52:58 -0500

122 lines

Re: PCB warpage -Reply

Lustig, Steven K.. <[log in to unmask]>

Thu, 19 Feb 1998 08:28:10 -0500

160 lines

Re: PCB warpage -Reply

Kelly Kovalovsky <[log in to unmask]>

Thu, 19 Feb 1998 09:04:18 -0500

161 lines

Re: PCB warpage -Reply

Dwight Mattix <[log in to unmask]>

Thu, 19 Feb 1998 11:28:44 -0800

112 lines

Re: PCB warpage -Reply

annie laberge <[log in to unmask]>

Fri, 20 Feb 1998 09:41:53 -0500

167 lines

New Thread

Placement system

Placement system

Valladares, Hector A (FL51) <[log in to unmask]>

Fri, 13 Feb 1998 17:27:42 -0500

32 lines

New Thread

Plating Rectifier setup

Plating Rectifier setup

Doug Jeffery <[log in to unmask]>

Thu, 19 Feb 1998 20:24:34 -0600

37 lines

Re: Plating Rectifier setup

[log in to unmask]

Fri, 20 Feb 1998 10:44:09 -0800

81 lines

New Thread

Polyimide

Polyimide

Achim Neu <[log in to unmask]>

Sun, 8 Feb 1998 11:07:13 +0100

53 lines

New Thread

Polyimide and BT material

Polyimide and BT material

Lourdes Mertens <[log in to unmask]>

Tue, 17 Feb 1998 08:39:50 -0700

31 lines

Re: Polyimide and BT material

Orna and Yehuda <[log in to unmask]>

Fri, 20 Feb 1998 00:30:36 +0200

105 lines

New Thread

polyimide damage after peroxide etching

polyimide damage after peroxide etching

George Bokisa <[log in to unmask]>

Thu, 26 Feb 1998 09:56:42 -0800

49 lines

New Thread

Pre-stamped soldermask

Pre-stamped soldermask

Achim Neu <[log in to unmask]>

Sun, 8 Feb 1998 11:04:49 +0100

52 lines

New Thread

pre-wave masking

pre-wave masking

Jim Mathis <[log in to unmask]>

Mon, 16 Feb 1998 16:01:57 EST

34 lines

Re: pre-wave masking

Bev Christian <[log in to unmask]>

Mon, 16 Feb 1998 17:28:35 -0500

72 lines

Re: pre-wave masking

Peter Swanson <[log in to unmask]>

Tue, 17 Feb 1998 09:08:47 GMT

47 lines

New Thread

Precision Valve and Automation

Precision Valve and Automation

ETS <[log in to unmask]>

Fri, 20 Feb 1998 10:52:51 -0800

25 lines

New Thread

Precision Valve and Automation -Reply

Precision Valve and Automation -Reply

JON MOORE <[log in to unmask]>

Fri, 20 Feb 1998 15:02:32 -0500

46 lines

New Thread

Press wanted

Press wanted

[log in to unmask]

Tue, 3 Feb 1998 20:25:25 EST

29 lines

New Thread

Probing on fine picht SMD leads

Probing on fine picht SMD leads

Jan Bokhove <[log in to unmask]>

Thu, 19 Feb 1998 03:47:10 -0800

43 lines

Re: Probing on fine picht SMD leads

Gary Griffin <[log in to unmask]>

Thu, 19 Feb 1998 08:31:43 -0800

125 lines

New Thread

Probing on fine pitch SMD leads

Re: Probing on fine pitch SMD leads

Jan Bokhove <[log in to unmask]>

Fri, 20 Feb 1998 07:30:07 -0800

41 lines

Re: Probing on fine pitch SMD leads

Jan Bokhove <[log in to unmask]>

Fri, 20 Feb 1998 07:30:07 -0800

53 lines

New Thread

Problem with new XZ17B Coates solder resist catalyst

Problem with new XZ17B Coates solder resist catalyst

Roger Unwin <[log in to unmask]>

Wed, 18 Feb 1998 10:21:33 +0000

31 lines

New Thread

Problems due to prepregs selection & it's fix

Problems due to prepregs selection & it's fix

Ken Patel <[log in to unmask]>

Thu, 19 Feb 1998 15:45:55 -0800

39 lines

Re: Problems due to prepregs selection & it's fix

Mitch Morey <[log in to unmask]>

Thu, 19 Feb 1998 16:15:53 -0800

89 lines

New Thread

Production Management in PCB shops

Production Management in PCB shops

Roland Jaquet <[log in to unmask]>

Thu, 5 Feb 1998 08:38:53 +0100

44 lines

New Thread

Pull Strengths

Pull Strengths

Heeran-C17277 David <[log in to unmask]>

Mon, 23 Feb 1998 14:06:20 U

35 lines

New Thread

Purchase of used Microscopes

Purchase of used Microscopes

Tony Bugeja <[log in to unmask]>

Wed, 4 Feb 1998 12:11:59 -0500

28 lines

Re: Purchase of used Microscopes

John Haman Jr. <[log in to unmask]>

Wed, 4 Feb 1998 14:37:34 PST

40 lines

Re: Purchase of used Microscopes

[log in to unmask]

Thu, 5 Feb 1998 15:01:08 EST

31 lines

New Thread

PWB Cost

PWB Cost

Hamilton, Richard -4454 <[log in to unmask]>

Fri, 6 Feb 1998 14:18:24 -0700

33 lines

New Thread

PWB COSTING

PWB COSTING

BPL-PCB, Doddaballapur <[log in to unmask]>

Fri, 6 Feb 1998 21:13:23 +0500

37 lines

New Thread

PWB punching tool life

PWB punching tool life

BPL-PCB, Doddaballapur <[log in to unmask]>

Thu, 26 Feb 1998 18:51:47 +0500

30 lines

Re: PWB punching tool life

Steve Collins <[log in to unmask]>

Thu, 26 Feb 1998 07:49:23 -0700

58 lines

New Thread

Quality Labels ?

Quality Labels ?

Ken Patel <[log in to unmask]>

Mon, 23 Feb 1998 15:08:40 -0800

33 lines

Re: Quality Labels ?

Evan Jones <[log in to unmask]>

Mon, 23 Feb 1998 19:49:54 -0500

37 lines

New Thread

Question : "Crackling" noise in boards post SMT

Question : "Crackling" noise in boards post SMT

Koushik ATD Banerjee <[log in to unmask]>

Thu, 26 Feb 1998 11:41:00 PST

34 lines

Re: Question : "Crackling" noise in boards post SMT

Lustig, Steven K.. <[log in to unmask]>

Thu, 26 Feb 1998 14:34:11 -0500

78 lines

Re: Question : "Crackling" noise in boards post SMT

Nicholas Kane <[log in to unmask]>

Fri, 27 Feb 1998 06:39:40 +1100

67 lines

Re: Question : "Crackling" noise in boards post SMT

Matthew Park <[log in to unmask]>

Thu, 26 Feb 1998 12:25:17 -0800

80 lines

New Thread

Questions Regarding Castellations on a MCM

Questions Regarding Castellations on a MCM

Michael Forrester <[log in to unmask]>

Wed, 11 Feb 1998 10:01:28 -0400

41 lines

New Thread

Re : [TN] Circuit board repair kits

Re : [TN] Circuit board repair kits

Weber Chuang <[log in to unmask]>

Mon, 9 Feb 1998 10:07:25 +0800

120 lines

Re: Re : [TN] Circuit board repair kits

DAVID C WEBER <[log in to unmask]>

Mon, 9 Feb 1998 21:12:41 -0500

56 lines

Re: Re : [TN] Circuit board repair kits

ETS <[log in to unmask]>

Tue, 10 Feb 1998 09:34:21 -0800

157 lines

New Thread

Re Air Ion Level Measurement

Re Air Ion Level Measurement

Moffitj <[log in to unmask]>

Sat, 28 Feb 1998 16:22:14 EST

48 lines

New Thread

Re J/STD/A-610

Re J/STD/A-610

[log in to unmask]

Thu, 12 Feb 1998 16:14:16 EST

77 lines

New Thread

Release: DPO - IPO "How To" Tools

Release: DPO - IPO "How To" Tools

To: Press Contacts - From: <[log in to unmask]>

Wed, 18 Feb 1998 12:46:41 -0700

59 lines

Re: Release: DPO - IPO "How To" Tools

Stephen R. Gregory <[log in to unmask]>

Wed, 18 Feb 1998 16:39:36 EST

32 lines

New Thread

Reliability vs Inner Layer break Out

Reliability vs Inner Layer break Out

Poulin, Michel <[log in to unmask]>

Thu, 5 Feb 1998 14:44:50 -0500

33 lines

New Thread

Reply Error

Reply Error

ETS <[log in to unmask]>

Thu, 19 Feb 1998 12:33:30 -0800

29 lines

New Thread

Re[2]: [TN] ORGANIC COATING(PRE-FLUX) THICKNESS MEASUREMEN

Re: Re[2]: [TN] ORGANIC COATING(PRE-FLUX) THICKNESS MEASUREMEN

H H TONG <[log in to unmask]>

Wed, 18 Feb 1998 21:08:43 +0800

98 lines

Re: Re[2]: [TN] ORGANIC COATING(PRE-FLUX) THICKNESS MEASUREMEN

George Bokisa <[log in to unmask]>

Wed, 18 Feb 1998 09:37:34 -0800

90 lines

Re: Re[2]: [TN] ORGANIC COATING(PRE-FLUX) THICKNESS MEASUREMEN

Eltek Ltd. - Process Engineering <[log in to unmask]>

Wed, 18 Feb 1998 18:03:31 +0200

36 lines

New Thread

Re[2]: [TN] ORGANIC COATING(PRE-FLUX) THICKNESSMEASUREMEN

Re: Re[2]: [TN] ORGANIC COATING(PRE-FLUX) THICKNESSMEASUREMEN

John Nelson <[log in to unmask]>

Wed, 18 Feb 1998 09:33:01 -0500

30 lines

New Thread

Re[2]: [TN] Soldermask developing

Re: Re[2]: [TN] Soldermask developing

John Haman Jr. <[log in to unmask]>

Tue, 10 Feb 1998 17:55:08 PST

53 lines

Re: Re[2]: [TN] Soldermask developing

[log in to unmask]

Wed, 11 Feb 1998 09:16:40 EST

34 lines

Re: Re[2]: [TN] Soldermask developing

Poulin, Michel <[log in to unmask]>

Wed, 11 Feb 1998 09:31:36 -0500

136 lines

Re: Re[2]: [TN] Soldermask developing

Ted Stern <[log in to unmask]>

Wed, 11 Feb 1998 10:42:11 -0800

107 lines

Re: Re[2]: [TN] Soldermask developing

Larry J. Fisher <[log in to unmask]>

Wed, 11 Feb 1998 23:28:44 EST

40 lines

New Thread

Re[4]: [TN] Soldermask developing

Re: Re[4]: [TN] Soldermask developing

Mike Barmuta <[log in to unmask]>

Mon, 16 Feb 1998 11:42:38 -0800

109 lines

New Thread

RF Plasma tool

RF Plasma tool

Ducas,Patrick <[log in to unmask]>

Thu, 19 Feb 1998 13:04:00 -0500

51 lines

New Thread

RF Plasma tool -Reply

RF Plasma tool -Reply

Matthew Park <[log in to unmask]>

Thu, 19 Feb 1998 11:10:20 -0800

30 lines

New Thread

RMA vs. No Clean for BGA

RMA vs. No Clean for BGA

MARK McAULEY <[log in to unmask]>

Tue, 10 Feb 1998 17:06:29 -0600

38 lines

New Thread

Roku-Roku Sangyo, Ltd.

Roku-Roku Sangyo, Ltd.

William E. Johnson <[log in to unmask]>

Fri, 27 Feb 1998 15:58:52 -0800

21 lines

New Thread

Roughness plating

Roughness plating

"류근정" <[log in to unmask]>

Tue, 24 Feb 1998 18:08:45 +0900

32 lines

Re: Roughness plating

J. Warhelere <[log in to unmask]>

Tue, 24 Feb 1998 18:15:15 -0500

32 lines

New Thread

RP machine

RP machine

majid aghababazadeh <[log in to unmask]>

Wed, 11 Feb 1998 15:04:24 -0800

25 lines

New Thread

San Diego Chapter of the IPC Designer Council

San Diego Chapter of the IPC Designer Council

Joseph Zdybowicz <[log in to unmask]>

Wed, 18 Feb 1998 10:58:41 -0800

391 lines

New Thread

San Diego Chapter of the IPC Designers Council

San Diego Chapter of the IPC Designers Council

Joseph Zdybowicz <[log in to unmask]>

Mon, 2 Feb 1998 09:46:06 -0800

333 lines

Re: San Diego Chapter of the IPC Designers Council

roberto <[log in to unmask]>

Tue, 3 Feb 1998 18:00:34 +0200

106 lines

New Thread

SEARCH warpage

SEARCH warpage

"이한주" <[log in to unmask]>

Mon, 23 Feb 1998 18:04:29 +0900

22 lines

New Thread

single-sided solder requirements

single-sided solder requirements

JON MOORE <[log in to unmask]>

Mon, 23 Feb 1998 11:13:45 -0500

30 lines

New Thread

SIR Testing for BGAs and CSPs

SIR Testing for BGAs and CSPs

Rose, Daniel B <[log in to unmask]>

Thu, 19 Feb 1998 11:09:39 -0700

28 lines

Re: SIR Testing for BGAs and CSPs

Graham Naisbitt <[log in to unmask]>

Thu, 19 Feb 1998 23:26:55 -0000

63 lines

Re: SIR Testing for BGAs and CSPs

tgyee <[log in to unmask]>

Fri, 20 Feb 1998 08:44:10 PST

51 lines

New Thread

SM Lead dimension specification

SM Lead dimension specification

Kicha / Krishna <[log in to unmask]>

Tue, 24 Feb 1998 06:44:12 PST

42 lines

Re: SM Lead dimension specification

Dennis Beerman <[log in to unmask]>

Tue, 24 Feb 1998 12:21:22 -0500

71 lines

Re: SM Lead dimension specification

Jack Crawford <[log in to unmask]>

Tue, 24 Feb 1998 11:30:07 -0600

79 lines

New Thread

Small holes, Thick Boards & Hole Reliability

Re: Small holes, Thick Boards & Hole Reliability

[log in to unmask] <[log in to unmask]>

Sat, 31 Jan 1998 17:02:27 -0800

41 lines

New Thread

SMEMA Specifications

SMEMA Specifications

ETS <[log in to unmask]>

Wed, 25 Feb 1998 14:49:06 -0800

33 lines

Re: SMEMA Specifications

Hamilton, Richard -4454 <[log in to unmask]>

Wed, 25 Feb 1998 15:55:49 -0700

71 lines

New Thread

SNEC meeting

SNEC meeting

Gary Ferrari <[log in to unmask]>

Fri, 6 Feb 1998 15:05:49 EST

59 lines

New Thread

solder balling

solder balling

Krishna Kalyan <[log in to unmask]>

Fri, 6 Feb 1998 10:08:00 PST

38 lines

Re: solder balling

Eddie Brunker <[log in to unmask]>

Mon, 9 Feb 1998 09:28:31 GMT

75 lines

New Thread

Solder balls spec

Solder balls spec

[log in to unmask]

Thu, 26 Feb 1998 15:50:47 EST

36 lines

Re: Solder balls spec

Muller, Mary <[log in to unmask]>

Thu, 26 Feb 1998 13:34:52 -0800

90 lines

Re: Solder balls spec

David Girard <[log in to unmask]>

Thu, 26 Feb 1998 16:49:21 -0500

75 lines

Re: Solder balls spec

Jack Crawford <[log in to unmask]>

Thu, 26 Feb 1998 16:05:13 -0600

72 lines

New Thread

Solder Joint wetting

Re: Solder Joint wetting

Kasprzak, Bill (esd) US <[log in to unmask]>

Mon, 23 Feb 1998 08:04:00 PST

45 lines

Re: Solder Joint wetting

Stephen R. Gregory <[log in to unmask]>

Mon, 23 Feb 1998 11:04:53 EST

49 lines

Re: Solder Joint wetting

Jack Crawford <[log in to unmask]>

Mon, 23 Feb 1998 12:56:01 -0600

80 lines

New Thread

Solder Paste Inspection R & R Study

Solder Paste Inspection R & R Study

[log in to unmask]

Fri, 13 Feb 1998 15:08:19 -0500

30 lines

New Thread

Solder Paste Printing Process

Solder Paste Printing Process

Kathy Palumbo <[log in to unmask]>

Thu, 12 Feb 1998 15:21:31 -0800

36 lines

Re: Solder Paste Printing Process

Brad Kendall <[log in to unmask]>

Fri, 13 Feb 1998 10:55:59 -0500

106 lines

New Thread

Solder paste relaxation/characteristic time

Solder paste relaxation/characteristic time

tana <[log in to unmask]>

Tue, 3 Feb 1998 15:36:37 +0000

35 lines

New Thread

Solder paste relaxation/characteristic time -Reply

Solder paste relaxation/characteristic time -Reply

Matthew Park <[log in to unmask]>

Tue, 3 Feb 1998 12:55:56 -0800

59 lines

Re: Solder paste relaxation/characteristic time -Reply

Stephen R. Gregory <[log in to unmask]>

Tue, 3 Feb 1998 16:59:21 EST

45 lines

New Thread

Solder Requirements for Chip Scale BGA's

Solder Requirements for Chip Scale BGA's

Kathy Palumbo <[log in to unmask]>

Thu, 12 Feb 1998 15:32:23 -0800

37 lines

Re: Solder Requirements for Chip Scale BGA's

Chan, Marcelo <[log in to unmask]>

Fri, 13 Feb 1998 08:03:10 -0500

90 lines

Re: Solder Requirements for Chip Scale BGA's

Stephen R. Gregory <[log in to unmask]>

Fri, 13 Feb 1998 18:03:21 EST

67 lines

Re: Solder Requirements for Chip Scale BGA's

Michael Weiner <[log in to unmask]>

Sun, 15 Feb 1998 08:28:35 +0200

41 lines

New Thread

solder shear strength

solder shear strength

COLLINS, GRAHAM <[log in to unmask]>

Tue, 3 Feb 1998 14:23:30 -0500

88 lines

Re: solder shear strength

JoAnn Amerson <[log in to unmask]>

Tue, 3 Feb 1998 15:32:34 +0000

39 lines

Re: solder shear strength

Paul Klasek <[log in to unmask]>

Wed, 4 Feb 1998 13:49:07 +1100

50 lines

New Thread

Solder-on-Gold Fingers

Re: Solder-on-Gold Fingers

Shaddock, David M (CRD) <[log in to unmask]>

Tue, 3 Feb 1998 09:43:34 -0500

179 lines

New Thread

Solderability od alloy 42

Solderability od alloy 42

Tom Monico <[log in to unmask]>

Wed, 18 Feb 1998 14:15:44 -0500

78 lines

Re: Solderability od alloy 42

Paul Terranova <[log in to unmask]>

Wed, 18 Feb 1998 14:35:57 -0500

65 lines

New Thread

Solderability of alloy 42

Re: Solderability of alloy 42

Edwards, Ted A (AZ75) <[log in to unmask]>

Wed, 18 Feb 1998 16:45:41 -0600

56 lines

New Thread

Solderball connection

Solderball connection

Achim Neu <[log in to unmask]>

Wed, 18 Feb 1998 07:36:59 +0100

31 lines

New Thread

soldermask

soldermask

Tenison Stone <[log in to unmask]>

Fri, 6 Feb 1998 07:46:36 -0600

75 lines

New Thread

Soldermask developing

Soldermask developing

Padmanabha Anandapuram Halappa <[log in to unmask]>

Mon, 9 Feb 1998 08:14:20 EST

27 lines

Re: Soldermask developing

Lenny Kurup <[log in to unmask]>

Mon, 9 Feb 1998 00:29:04 -0500

56 lines

Re: Soldermask developing

Larry J. Fisher <[log in to unmask]>

Mon, 9 Feb 1998 00:50:30 EST

47 lines

Re: Soldermask developing

fgolisan <[log in to unmask]>

Mon, 9 Feb 1998 08:33:22 PST

58 lines

Re: Soldermask developing

Ted Stern <[log in to unmask]>

Mon, 9 Feb 1998 12:54:44 -0800

55 lines

Re: Soldermask developing

Afri Singh <[log in to unmask]>

Mon, 9 Feb 1998 18:06:49 -0500

54 lines

New Thread

Soldermask foil

Soldermask foil

Achim Neu <[log in to unmask]>

Mon, 9 Feb 1998 20:55:30 +0100

54 lines

New Thread

SolderMask Types

Re: SolderMask Types

[log in to unmask]

Thu, 19 Feb 1998 08:54:28 -0700

31 lines

Re: SolderMask Types

John Haman Jr. <[log in to unmask]>

Thu, 19 Feb 1998 17:40:54 PST

78 lines

Re: SolderMask Types

George Toman <[log in to unmask]>

Thu, 19 Feb 1998 17:11:31 -0500

64 lines

Re: SolderMask Types

[log in to unmask]

Thu, 19 Feb 1998 14:40:21 -0700

33 lines

New Thread

SOURCE FOR SCREEN MESH CLOTH & EMULSION

SOURCE FOR SCREEN MESH CLOTH & EMULSION

BPL-PCB, Doddaballapur <[log in to unmask]>

Tue, 10 Feb 1998 17:07:16 +0500

36 lines

Re: SOURCE FOR SCREEN MESH CLOTH & EMULSION

John Nelson <[log in to unmask]>

Tue, 10 Feb 1998 10:11:24 -0500

58 lines

Re: SOURCE FOR SCREEN MESH CLOTH & EMULSION

ETS <[log in to unmask]>

Tue, 10 Feb 1998 09:34:28 -0800

63 lines

Re: SOURCE FOR SCREEN MESH CLOTH & EMULSION

Brad Vanderhoof <[log in to unmask]>

Tue, 10 Feb 1998 09:05:52 PST

30 lines

New Thread

Spare part for spray fluxer

Spare part for spray fluxer

Suchai <[log in to unmask]>

Sat, 7 Feb 1998 20:14:39 +0700

35 lines

New Thread

Specifications

Specifications

[log in to unmask]

Mon, 23 Feb 1998 07:53:36 -0600

27 lines

Re: Specifications

[log in to unmask]

Mon, 23 Feb 1998 13:09:05 EST

51 lines

Re: Specifications

Lisa Williams <[log in to unmask]>

Mon, 23 Feb 1998 16:37:14 -0600

58 lines

New Thread

Specifications for cable assemblers

Specifications for cable assemblers

Rick Racinskas <[log in to unmask]>

Wed, 11 Feb 1998 13:13:14 -0800

29 lines

New Thread

Specs on Board Warpage

Specs on Board Warpage

Phillip E. Hinton <[log in to unmask]>

Thu, 19 Feb 1998 21:17:40 EST

34 lines

New Thread

strange word

strange word

Wolfried A. A. Popelier <[log in to unmask]>

Mon, 9 Feb 1998 09:07:09 -0200

30 lines

strange word

[log in to unmask]

Mon, 9 Feb 1998 13:44:07 +0100

53 lines

Re: strange word

Doug Pauls <[log in to unmask]>

Mon, 9 Feb 1998 07:53:55 EST

32 lines

Re: strange word

Larry J. Fisher <[log in to unmask]>

Wed, 11 Feb 1998 23:14:38 EST

30 lines

Re: strange word

Gary Ferrari <[log in to unmask]>

Thu, 12 Feb 1998 05:49:46 -0600

58 lines

New Thread

Subscribe

Subscribe

Martin Valfridsson <[log in to unmask]>

Thu, 5 Feb 1998 10:48:11 +0100

32 lines

Re: Subscribe

Al Hamilton <[log in to unmask]>

Thu, 5 Feb 1998 09:25:10 EST

30 lines

Subscribe

Josh Moody <[log in to unmask]>

Mon, 9 Feb 1998 08:49:11 -0600

26 lines

Subscribe

Jimmy <[log in to unmask]>

Sat, 14 Feb 1998 17:13:26 +0800

47 lines

New Thread

SUPPLIER EVALUATION AND QUALIFICATION

SUPPLIER EVALUATION AND QUALIFICATION

[log in to unmask]

Wed, 25 Feb 1998 08:37:21 -0600

65 lines

New Thread

Surface Finishes

Surface Finishes

[log in to unmask]

Wed, 11 Feb 1998 16:56:35 -0600

35 lines

Re: Surface Finishes

Keith Larson <[log in to unmask]>

Wed, 11 Feb 1998 20:09:34 -0600

85 lines

Re: Surface Finishes

[log in to unmask]

Thu, 12 Feb 1998 00:26:22 EST

39 lines

Re: Surface Finishes

John Coffman <[log in to unmask]>

Thu, 12 Feb 1998 06:30:55 -0500

69 lines

Re: Surface Finishes

[log in to unmask] <[log in to unmask]>

Thu, 12 Feb 1998 19:49:32 -0800

29 lines

Re: Surface Finishes

[log in to unmask]

Thu, 12 Feb 1998 19:35:09 EST

49 lines

New Thread

survey report

survey report

Grace Electronic Materials Pte Ltd <[log in to unmask]>

Wed, 4 Feb 1998 12:29:32 +0800

38 lines

Re: survey report

Stephanie Kaplan <[log in to unmask]>

Wed, 25 Feb 1998 11:52:10 -0600

55 lines

New Thread

suspended particle specifications

suspended particle specifications

Sohn, John E (John) <[log in to unmask]>

Fri, 27 Feb 1998 15:58:00 -0500

30 lines

New Thread

TechNet Digest - 2 Dec 1997 to 3 Dec 1997

Re: TechNet Digest - 2 Dec 1997 to 3 Dec 1997

E.A. Speer <[log in to unmask]>

Thu, 5 Feb 1998 07:11:36 -0500

70 lines

New Thread

TechNet Forum....Is it just me?

TechNet Forum....Is it just me?

Hamilton, Richard -4454 <[log in to unmask]>

Tue, 3 Feb 1998 09:35:26 -0700

30 lines

Re: TechNet Forum....Is it just me?

ETS <[log in to unmask]>

Tue, 3 Feb 1998 12:44:48 -0800

51 lines

Re: TechNet Forum....Is it just me?

Darrel Therriault <[log in to unmask]>

Tue, 3 Feb 1998 12:58:58 -0800

57 lines

Re: TechNet Forum....Is it just me?

Rhoads, Randall E <[log in to unmask]>

Tue, 3 Feb 1998 15:53:16 -0500

48 lines

Re: TechNet Forum....Is it just me?

Jack Crawford <