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November 1997


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Table of Contents:

回覆 : [TN] Des: Mentor area fill problem (1 message)
"rolled solder" (4 messages)
(ADMIN) TechNet Server Unavailable for 39 Hours (1 message)
(TN): ASSY: Good Joint (3 messages)
(TN): ASSY: Reliability study for copper vs alooy 42 lead frame (1 message)
110v air gap (6 messages)
2 mil thick prepreg (1 message)
4th Annual IPC National Conference: Flexible Circuits '98 (1 message)
: ASSY: Good Joint (1 message)
: Reliability study for copper vs Alloy 42 lead (1 message)
<No subject> (58 messages)
A better wetting compound for cross-sections? (4 messages)
Acetone interactions with buttercoat, etc. (2 messages)
adhesion of chip bonder to solder mask (2 messages)
ADMIN: BGA issue clarification (1 message)
ADMIN: BGA Mailing List (1 message)
ADMIN: Fact Sheets (1 message)
ADMIN: Information on a BGA Mailing List (1 message)
ADMIN: Information on a BGA Mailing List -Reply (1 message)
ADMIN: Mail lists will be down (1 message)
Alternative Substance for Trichloroethylene (4 messages)
Alternative Substance for Trichloroethylene -Reply (1 message)
Amistar 1800 and Unicam (1 message)
AOI CAD reference (1 message)
ASM: Ethlyene Glycol (6 messages)
ASM: Water Soluble Mask (5 messages)
Assembly (6 messages)
Assembly (Solderability) (5 messages)
Assembly (wire bonding course) (1 message)
ASSY, solder residues on gold fingers (6 messages)
ASSY: Cleaners (6 messages)
ASSY: Conformal coating (2 messages)
ASSY: Conformal coating -Reply (1 message)
Assy: Disolving pads (2 messages)
ASSY: Duroid or Teflon boards (2 messages)
ASSY: gravity conveyor (1 message)
Assy: Hi Temp Soldering to pads on Ceramic substrate (4 messages)
ASSY: High Temp Solder (1 message)
Assy: Labels for ICs (1 message)
ASSY: Long-term Storage of Components (1 message)
Assy: Pre-heating of PCBs (2 messages)
ASSY: Rack Covers (3 messages)
ASSY: SMT/Temp. Cycling Test Failures revisited (7 messages)
Assy: Soldering to crystal cans (4 messages)
ASSY: Soldermask vs conformal coat (6 messages)
Assy: Wire bonding course. The Welding Institute. (1 message)
Assy:cracker boards (1 message)
Autoclave (1 message)
Axial part age (2 messages)
Bare Board Cleanliness (2 messages)
BGA mail list (1 message)
BGA Mailing List (22 messages)
BGA Pad to via spacing (1 message)
BGA soldering profile (4 messages)
BGA XRAY INSPECTION LABS (1 message)
Blow holes (2 messages)
Blow holes -Reply (1 message)
Breaking of tabs (4 messages)
Breaking of Tabs.. (1 message)
C.I. Symposium Cups (1 message)
CAD Librarian (1 message)
Cap shorting at low voltage high impedance circuit (10 messages)
Carbon Ink Printing for remote Control PWBs (1 message)
carelesness (1 message)
CCGA Process (1 message)
Chip Capacitor Termination Finish (2 messages)
Chip On Glass (1 message)
Chip Resistor Networks (1 message)
Chip Softpassivation Polyimide (2 messages)
Circuit Repair Corporation (3 messages)
Circuit Repair Corporation -Reply (1 message)
Circuit width and spacing (4 messages)
Cleanliness of boards (2 messages)
Cleanliness under Flip-Chips (1 message)
Closed-Loop Water Recycling Systems (4 messages)
Coaters for LPI (4 messages)
Component Shelf Life (2 messages)
Conformal Coating (2 messages)
CONFORMAL COATING REPAIR (1 message)
contamination on sm capacitors (4 messages)
Copper concentration in Rack Strip (1 message)
Corner cracks in electrolytic copper plating. (1 message)
Cutting internal layer traces (1 message)
dark gold fingers (7 messages)
DC Etch prediction (2 messages)
Delamination Issues (2 messages)
DES: Guard rings (3 messages)
DES: Gullwing Leads Manufacturer (5 messages)
Des: Mentor area fill problem (2 messages)
Design: Shield Layer Relief and Shielding Effectiveness (1 message)
Die Attach Adhesive Bleed (1 message)
Differential Impedance Calculations (6 messages)
Differential Impendance (2 messages)
Do we really need ionic contamination measurement e (1 message)
Do we really need ionic contamination measurement equipm ent? (1 message)
Do we really need ionic contamination measurement equipment? (8 messages)
Do we really need ionic contamination measurement equipment? -Reply (1 message)
Double Sided Assembly (6 messages)
Double sided assembly methods (2 messages)
Double Sided Reflow (2 messages)
Electroless Gold (1 message)
Electronic Field Failures Caused by Temperature (3 messages)
Encapsulation material TEDISTAC (2 messages)
Engelhard (2 messages)
Enlist to BGA list (1 message)
Enlist us to The BGA lists,Thanks you (1 message)
Entek Plus 106 and Kester no clean flux 951 (3 messages)
Environmentally Friendly PWB's (2 messages)
Er of FR-4 (1 message)
ESD Safe Plexiglass (2 messages)
ESD SAFE WINDOWS? (2 messages)
ESD SAFE WINDOWS? -Reply (1 message)
Etchant for Au/Sn solder (3 messages)
FAB - CAM Systems Administration (4 messages)
Fab /Assm: Big Boards! (1 message)
FAB Ionic Cleanliness Testing Equip (3 messages)
FAB Materials: What are these? (2 messages)
FAB staining on FR4 (3 messages)
Fab vendor qualification (2 messages)
Fab-Selective Gold (1 message)
FAB. Dielectric constant c (1 message)
FAB. Dielectric constant certification (1 message)
FAB/ ASSY: Big Boards! (4 messages)
FAB/ ASSY: Big Boards! -Reply (2 messages)
FAB/ASSY: Tooling Hole Sizes (3 messages)
FAB/DES/ASM - Buried Capaciatance (2 messages)
FAB: Bellcore spec (1 message)
FAB: Custom Flex Lamination Equipment (1 message)
FAB: Electrical Testers (3 messages)
FAB: Facilities question (4 messages)
FAB: Immersion Gold Services (4 messages)
FAB: Immersion Gold Services -Reply (2 messages)
FAB: Measuring Solder Thickness After HASL (2 messages)
Fab: Packaging (3 messages)
FAB: polyimide laminate (2 messages)
FAB: Procedure to remo (1 message)
FAB: Procedure to remove tin-scale in a resiststripper (3 messages)
FAB: Tin / Lead finish (3 messages)
Fab: Where is Steven Eldefonso? (2 messages)
FABRICATION (4 messages)
Fanuc (5 messages)
filling of test vias which are encroached on topside (1 message)
fine pitch pads / design width (1 message)
fine pitch pads / designwidth (1 message)
Flexible PCBs (1 message)
Flux Fumes (1 message)
foam fluxer (3 messages)
Frequency of Solder Analysis (1 message)
frequency of solder pot content analysis (8 messages)
FW: ASSY:Wave solder (1 message)
FW: ENVIRONMENTAL CONTROL (2 messages)
FW: lead trimming (1 message)
FW: RESEND -Teflon replacement (1 message)
FW: sub: zero profile sockets (2 messages)
FW: [TN] Cleanliness of boards (1 message)
FW: [TN] Double sided assembly methods (1 message)
FW: [TN] frequency of solder pot content analysis (1 message)
FW: [TN] frequency of solder pot content analysis -Reply (1 message)
FW: [TN] Silver chromate paper and copper mirror source (1 message)
FW: [TN] Subscribe (2 messages)
FW: [TN] Temperature Profiler Questions (1 message)
FW: [TN] [AS] What parameters do other companies use when evaluat ing the e ffectiveness of Assembly houses builds (1 message)
FW: [TN] [AS] What parameters do other companies use when evaluating the effectiveness of Assembly houses builds (1 message)
FWD>RE>[TN] (TN): ASSY: (1 message)
G-10 (4 messages)
GEN (3 messages)
GEN: Liability (3 messages)
GEN: Used Equipment Reseller (2 messages)
Gold deposition: Electrolytic v/s Immersion - An (1 message)
Gold deposition: Electrolytic v/s Immersion - Any problem (2 messages)
Gold Thickness Measurement Error (2 messages)
Gold Tips Staining (2 messages)
goldman (1 message)
Gullwing Leads Manufacturer (2 messages)
Hardware (2 messages)
Help - Intrusive Reflow (2 messages)
High Temperature Soldering/Applications (1 message)
HOW DO I SET MY LIST TO DIGEST (2 messages)
Immersion Gold (1 message)
info on MCM Design and Fabrication (2 messages)
Intrusive Reflow (1 message)
ion exchange (1 message)
IPC Printed Circuits Expo '98 (1 message)
IPC-6013 Flex PWB (2 messages)
IPC-A-610 & Piezoelectric ceramic (1 message)
IPCchat session announcement (5 messages)
ITO conductive film (3 messages)
J-Lead Mods (6 messages)
J-leads (1 message)
Job posting (1 message)
length of reflow oven (7 messages)
Liability (3 messages)
Liability of products (3 messages)
Materials (1 message)
Maximum component height for IP-II (1 message)
Measuring Solder Thickness after HAL (1 message)
Mechanical standoff (6 messages)
Meeting Announcement, SoCal98, Anaheim, 12May98 (1 message)
Metals finishing (3 messages)
Mouse Bites (7 messages)
Mouse Bites -Reply (1 message)
Neurocam (1 message)
Off topic: Need a phone number (1 message)
Other Forums (1 message)
PAC glass (1 message)
Paste Inspection (1 message)
PC-Board mech. Specification (2 messages)
PCB'S (3 messages)
PCMCIA INFO (1 message)
Peelable mask (1 message)
Personal Req (1 message)
Personnel Requirements (5 messages)
PIN-THROUGH PASTE PROCESS (2 messages)
Plating integrity in small vias (16 messages)
Plating vibrators (7 messages)
Please take me off the list (1 message)
Printed wiring board Data standards (1 message)
PTFE bonding (1 message)
PTFE bonding -Reply (1 message)
PTFE Multilayer (4 messages)
Pull Strength (2 messages)
Pulse Rectification (8 messages)
Re [TN] Blow holes (1 message)
Re [TN] SOLID SOLDER DEPOSIT TECH. (2 messages)
Reference planes in microstrip (1 message)
Reference planes in microstrip? (1 message)
Reflow problem (1 message)
Reliability information request (2 messages)
Reliability of BGA (6 messages)
Research paper (1 message)
Resin Starvation (4 messages)
Resist removal from tooling holes (1 message)
Responses Needed Please!!Nitrogen use w/ BGA reflow (3 messages)
Re[2]: [TN] Liability of products (1 message)
Re[3]: [TN] DES: Guard rings (1 message)
rogers 4003 material (4 messages)
Rogers RO-4003 Material (2 messages)
Rogers TMM (4 messages)
Roku-Roku Sangyo, Ltd. (1 message)
RV: (3 messages)
RV: another hoax; PLEASE NOBODY ELSE REPLY (1 message)
sales products (1 message)
Sealing Vias (9 messages)
Sealing Vias -Reply (5 messages)
Shelf life requirements (3 messages)
SHORTS CIRCUIT DURING WAVE (2 messages)
Signal Integrity Analysis (5 messages)
Silver chromate paper and copper mirror source (1 message)
Silver Dendrites (4 messages)
SIR Test Cabling (3 messages)
SMT and Chip assembly on Flexible PCB's (1 message)
SMT Component Height Restrictions (2 messages)
Solder balls on SMT assy (1 message)
Solder paste inspection (2 messages)
Solder paste inspection and incoming QC (1 message)
Solder paste inspection and incoming QC -Reply (1 message)
Solderability (1 message)
SOLID SOLDER DEPOSIT TECH. (1 message)
SOT23 problems (11 messages)
SOT23 problems - leadframe alloy (1 message)
SOT23 problems -Reply (2 messages)
Source for MIL-I-46058 Y Pattern Coupons (2 messages)
Source for RF Tuning Pads, Tabs, Confetti (1 message)
Source for Silver Paste for PCB Repairing (1 message)
SpeedBoard (2 messages)
Stencil Control Procedure (1 message)
subscribe (4 messages)
Surface Tension in Electroplating solution. (1 message)
SV: [TN] Mouse Bites -Reply (1 message)
TechNet Digest - 12 Nov 1997 to 13 Nov 1997 (1 message)
Teflon replacement (4 messages)
Tempe (1 message)
Temperature Profiler Questions (4 messages)
TH part solderability concerns (1 message)
Thermal Cycle Tester (1 message)
Thiourea free alkaline etchant (1 message)
tin/lead plating (2 messages)
tin/lead plating -Reply (1 message)
Tip Soldering (1 message)
TN] BGA Mailing List (1 message)
tombstoning (6 messages)
tooling pins (2 messages)
totally reflow (1 message)
Trace Width calculations (2 messages)
TSOP, TQFP reliability (5 messages)
Underfill voiding in flip chips (1 message)
unsubscribe (1 message)
Unsubscrivbe help needed... (2 messages)
Use half empty solder paste jar next day? (1 message)
Via in Pad (2 messages)
Via in Pad for BGA (3 messages)
Voids in Eutectic BGA joints (3 messages)
Voltage requirement of Bare Board Testing (3 messages)
Wavesolder (1 message)
What parameters do other companies use when (1 message)
Whitehouse Machine Tools (1 message)
WIRE WRAPS (2 messages)
your mail (1 message)
[AS] What parameters do other companies use when evaluating the e ffectiveness of Assembly houses builds (2 messages)
[TECHNET] Corner cracks in electrolytic copper plating. (1 message)
[TECHNET] Gold Connector Thickness (1 message)
[TECHNET] unsubscribe (1 message)
[TE] Conformal Coating (1 message)
[TN] ASM: Ethlyene Glycol (1 message)
[TN] ASM: Water Soluble Mask (2 messages)
[TN] ASM: Water Soluble Mask -Reply (1 message)
[TN] Assembly (wire bonding course) (1 message)
[TN] ASSY: Rack Covers (1 message)
[TN] Axial Part Age (1 message)
[TN] DES: Guard rings (2 messages)
[TN] foam fluxer (1 message)
[TN] GEN: Liability (3 messages)
[TN] Liability (1 message)
[TN] Liability of products (1 message)
[TN] Plating integrity in small vias (1 message)
[TN] Sealing Vias (1 message)
[TN] SIR Test Cabling (1 message)

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Subject Sorted by Subject, Chronologically

From

Date

Size

New Thread

回覆 : [TN] Des: Mentor area fill problem

回覆 : [TN] Des: Mentor area fill problem

Weber Chuang <[log in to unmask]>

Tue, 4 Nov 1997 19:02:43 +0800

143 lines

New Thread

"rolled solder"

"rolled solder"

Chetan Mehta <[log in to unmask]>

Wed, 12 Nov 1997 17:19:33 -0600

57 lines

Re: "rolled solder"

Andy Cameron <[log in to unmask]>

Wed, 12 Nov 1997 23:03:36 -0500

23 lines

Re: "rolled solder"

Don Vischulis <[log in to unmask]>

Wed, 12 Nov 1997 22:04:39 -0600

58 lines

Re: "rolled solder"

Doug Jeffery <[log in to unmask]>

Thu, 13 Nov 1997 04:33:44 -0600

86 lines

New Thread

(ADMIN) TechNet Server Unavailable for 39 Hours

(ADMIN) TechNet Server Unavailable for 39 Hours

Melinda Robinson <[log in to unmask]>

Fri, 14 Nov 1997 16:37:17 -0600

30 lines

New Thread

(TN): ASSY: Good Joint

(TN): ASSY: Good Joint

Poh Kong Hui <[log in to unmask]>

Tue, 11 Nov 1997 06:58:59 +0800

33 lines

Re: (TN): ASSY: Good Joint

Bev Christian <[log in to unmask]>

Mon, 10 Nov 1997 22:59:17 -0500

65 lines

Re: (TN): ASSY: Good Joint

Max Bernhardt <[log in to unmask]>

Tue, 11 Nov 1997 09:06:00 -0600

23 lines

New Thread

(TN): ASSY: Reliability study for copper vs alooy 42 lead frame

(TN): ASSY: Reliability study for copper vs alooy 42 lead frame

Poh Kong Hui <[log in to unmask]>

Wed, 12 Nov 1997 07:02:02 +0800

37 lines

New Thread

110v air gap

110v air gap

[log in to unmask]

Tue, 25 Nov 1997 11:37:20 -0500

24 lines

Re: 110v air gap

Rodney <[log in to unmask]>

Tue, 25 Nov 1997 11:02:27 EST

31 lines

Re: 110v air gap

Don Walker <[log in to unmask]>

Tue, 25 Nov 1997 11:12:33 -0600

51 lines

Re: 110v air gap

Ralph Hersey <[log in to unmask]>

Tue, 25 Nov 1997 10:31:45 -0800

63 lines

Re: 110v air gap

Doug McKean <[log in to unmask]>

Tue, 25 Nov 1997 13:38:08 -0500

91 lines

Re: 110v air gap

Mark Ross <[log in to unmask]>

Tue, 25 Nov 1997 19:00:02 -0500

54 lines

New Thread

2 mil thick prepreg

2 mil thick prepreg

CSS Asia Co., Ltd. <[log in to unmask]>

Tue, 11 Nov 1997 16:30:49 +0900

37 lines

New Thread

4th Annual IPC National Conference: Flexible Circuits '98

4th Annual IPC National Conference: Flexible Circuits '98

John Riley <[log in to unmask]>

Tue, 11 Nov 1997 15:25:23 -0600

34 lines

New Thread

: ASSY: Good Joint

Re: : ASSY: Good Joint

[log in to unmask]

Tue, 11 Nov 1997 09:47:54 -0500

45 lines

New Thread

: Reliability study for copper vs Alloy 42 lead

Re: : Reliability study for copper vs Alloy 42 lead

[log in to unmask]

Wed, 12 Nov 1997 00:06:13 -0500

39 lines

New Thread

<No subject>

<No subject>

1 November, 1997 20:40

60 lines

<No subject>

11/3/97 3:13 PM

53 lines

<No subject>

10/28/97 11:57 AM

55 lines

<No subject>

Ian Giddings <[log in to unmask]>

Tue, 4 Nov 1997 06:38:54 -0500

33 lines

<No subject>

11/3/97 3:07 PM

69 lines

<No subject>

11/3/97 4:27 PM

54 lines

<No subject>

11/4/97 4:07 PM =

87 lines

<No subject>

Doug Jeffery <[log in to unmask]>

Tue, 4 Nov 1997 17:21:33 -0600

64 lines

<No subject>

05 November 1997 00:20

41 lines

<No subject>

11/5/97 7:57 AM

34 lines

<No subject>

Fri, 24 Oct 1997 09:30:46 -0700

55 lines

<No subject>

11/5/97 11:30 AM

34 lines

<No subject>

11/6/97 8:50 AM

42 lines

<No subject>

11/6/97 2:52 PM

38 lines

<No subject>

11/6/97 2:45 PM

30 lines

<No subject>

11/6/97 2:45 PM

46 lines

<No subject>

Thursday, November 06, 1997 3:48PM

17 lines

<No subject>

11/6/97 2:45 PM

61 lines

<No subject>

Chan, Marcelo <[log in to unmask]>

Mon, 10 Nov 1997 08:44:27 -0500

31 lines

<No subject>

11/10/97 4:13 PM

45 lines

<No subject>

Lepsche, Thomas G (NM75) <[log in to unmask]>

Tue, 11 Nov 1997 07:16:15 -0700

27 lines

<No subject>

11/10/97 3:51 PM

13 lines

<No subject>

11/10/97 4:13 PM

59 lines

<No subject>

Monday, November 10, 1997 4:02PM

13 lines

<No subject>

11/10/97 4:13 PM

61 lines

<No subject>

Monday, November 10, 1997 4:58PM

43 lines

<No subject>

???@???

11/11/97 7:33 AM

11 lines

<No subject>

???@???

11/10/97 8:13 PM

24 lines

<No subject>

Tuesday, November 11, 1997 3:11PM

47 lines

<No subject>

11/11/97 7:19 PM

33 lines

<No subject>

11/12/97 3:31 PM

47 lines

<No subject>

11/13/97 12:57 AM

33 lines

<No subject>

Monday, November 17, 1997 11:04AM

40 lines

<No subject>

11/17/97 11:04 AM

40 lines

<No subject>

11/17/97 10:28 AM

59 lines

<No subject>

Monday, November 17, 1997 12:31PM

55 lines

<No subject>

11/17/97 11:05 AM

40 lines

<No subject>

11/18/97 09:37 AM

35 lines

<No subject>

11/18/97 12:16 PM

67 lines

<No subject>

11/18/97 2:26 PM

16 lines

<No subject>

Wednesday, November 19, 1997 2:18PM

113 lines

<No subject>

11/21/97 9:42 AM

52 lines

<No subject>

Friday, November 21, 1997 11:16AM

30 lines

<No subject>

Friday, November 21, 1997 3:27PM

36 lines

<No subject>

11/24/97 3:54 PM

100 lines

<No subject>

11/24/97 12:45 PM

43 lines

<No subject>

11/24/97 2:26 PM

43 lines

<No subject>

Bev Christian <[log in to unmask]>

Mon, 24 Nov 1997 17:01:37 -0500

35 lines

<No subject>

Tuesday, November 25, 1997 9:00AM

69 lines

<No subject>

[log in to unmask]

Tue, 25 Nov 1997 12:23:30 -0500

30 lines

<No subject>

Tuesday, November 25, 1997 12:25PM

70 lines

<No subject>

Monday, November 24, 1997 5:24 AM

101 lines

<No subject>

[log in to unmask]

Wed, 26 Nov 1997 00:24:19 -0500

30 lines

<No subject>

Ecad technologies pvt ltd <[log in to unmask]>

Thu, 27 Nov 1997 00:27:12 +0530

36 lines

<No subject>

Tuesday, November 25, 1997 8:28AM

50 lines

<No subject>

11/25/97 10:37 AM

75 lines

<No subject>

Keith Larson <[log in to unmask]>

Thu, 27 Nov 1997 04:46:08 -0600

89 lines

<No subject>

Mike Wilson <[log in to unmask]>

Fri, 28 Nov 1997 16:51:24 -0800

91 lines

New Thread

A better wetting compound for cross-sections?

A better wetting compound for cross-sections?

Rogers, Lance M. <[log in to unmask]>

Mon, 3 Nov 1997 08:44:05 -0500

41 lines

Re: A better wetting compound for cross-sections?

Bev Christian <[log in to unmask]>

Mon, 3 Nov 1997 09:12:32 -0600

69 lines

A better wetting compound for cross-sections?

Richard MacCutcheon <[log in to unmask]>

Mon, 3 Nov 1997 08:31:00 -0700

90 lines

Re: A better wetting compound for cross-sections?

[log in to unmask]

Tue, 4 Nov 1997 07:38:00 -0500

31 lines

New Thread

Acetone interactions with buttercoat, etc.

Acetone interactions with buttercoat, etc.

David D Sullivan <[log in to unmask]>

Tue, 18 Nov 1997 12:16:55 -0600

59 lines

Re: Acetone interactions with buttercoat, etc.

Aric J Parr <[log in to unmask]>

Tue, 18 Nov 1997 14:00:24 -0500

21 lines

New Thread

adhesion of chip bonder to solder mask

adhesion of chip bonder to solder mask

annie laberge <[log in to unmask]>

Mon, 24 Nov 1997 16:55:56 -0500

42 lines

Re: adhesion of chip bonder to solder mask

[log in to unmask]

Wed, 26 Nov 1997 08:32:19 +0000

58 lines

New Thread

ADMIN: BGA issue clarification

ADMIN: BGA issue clarification

Dmitriy Sklyar <[log in to unmask]>

Fri, 7 Nov 1997 11:56:11 -0600

44 lines

New Thread

ADMIN: BGA Mailing List

Re: ADMIN: BGA Mailing List

Peter Swanson <[log in to unmask]>

Fri, 7 Nov 1997 19:47:43 GMT

32 lines

New Thread

ADMIN: Fact Sheets

ADMIN: Fact Sheets

Jim Herard <[log in to unmask]>

Fri, 14 Nov 1997 19:12:04 -0500

42 lines

New Thread

ADMIN: Information on a BGA Mailing List

ADMIN: Information on a BGA Mailing List

Jack Crawford <[log in to unmask]>

Thu, 6 Nov 1997 15:28:40 -0600

33 lines

New Thread

ADMIN: Information on a BGA Mailing List -Reply

ADMIN: Information on a BGA Mailing List -Reply

Ron Hayashi <[log in to unmask]>

Thu, 6 Nov 1997 13:29:41 -0800

22 lines

New Thread

ADMIN: Mail lists will be down

ADMIN: Mail lists will be down

Dmitriy Sklyar <[log in to unmask]>

Thu, 20 Nov 1997 14:51:26 -0600

43 lines

New Thread

Alternative Substance for Trichloroethylene

Alternative Substance for Trichloroethylene

Y.H. Woo <[log in to unmask]>

Sat, 8 Nov 1997 16:24:18 +0900

25 lines

Re: Alternative Substance for Trichloroethylene

roberto tulman <[log in to unmask]>

Mon, 10 Nov 1997 22:12:16 +0200

54 lines

Re: Alternative Substance for Trichloroethylene

[log in to unmask]

Tue, 11 Nov 1997 11:47:13 -0500

32 lines

Re: Alternative Substance for Trichloroethylene

[log in to unmask]

Wed, 12 Nov 1997 09:48:35 +0900

75 lines

New Thread

Alternative Substance for Trichloroethylene -Reply

Re: Alternative Substance for Trichloroethylene -Reply

Fred Johnson <[log in to unmask]>

Wed, 12 Nov 1997 11:28:36 +0000

75 lines

New Thread

Amistar 1800 and Unicam

Amistar 1800 and Unicam

SDalton <[log in to unmask]>

Tue, 25 Nov 1997 14:35:19 -0600

29 lines

New Thread

AOI CAD reference

AOI CAD reference

Sid Tryzbiak <[log in to unmask]>

Wed, 26 Nov 1997 15:48:54 -0500

70 lines

New Thread

ASM: Ethlyene Glycol

ASM: Ethlyene Glycol

George Franck <[log in to unmask]>

Thu, 6 Nov 1997 15:36:43 -0500

46 lines

Re: ASM: Ethlyene Glycol

Doug McKean <[log in to unmask]>

Thu, 6 Nov 1997 16:50:28 -0500

74 lines

Re: ASM: Ethlyene Glycol

[log in to unmask]

Thu, 6 Nov 1997 17:21:31 -0500

32 lines

Re: ASM: Ethlyene Glycol

David D Hillman <[log in to unmask]>

Fri, 7 Nov 1997 00:25:47 -0600

83 lines

Re: ASM: Ethlyene Glycol

Doug Pauls <[log in to unmask]>

Fri, 7 Nov 1997 08:09:46 -0500

83 lines

Re: ASM: Ethlyene Glycol

Mike Barmuta <[log in to unmask]>

Fri, 7 Nov 1997 08:42:33 -0800

11 lines

New Thread

ASM: Water Soluble Mask

ASM: Water Soluble Mask

[log in to unmask]

Mon, 10 Nov 1997 16:13:07 EST

34 lines

Re: ASM: Water Soluble Mask

Paul Stolar <[log in to unmask]>

Mon, 10 Nov 1997 15:51:22 -0600

20 lines

Re: ASM: Water Soluble Mask

Vertefeuille, Russ (AZ77) <[log in to unmask]>

Tue, 11 Nov 1997 09:39:40 -0600

26 lines

Re: ASM: Water Soluble Mask

Pratap Singh <[log in to unmask]>

Tue, 11 Nov 1997 19:19:20 -0800

27 lines

Re: ASM: Water Soluble Mask

Pratap Singh <[log in to unmask]>

Tue, 11 Nov 1997 19:29:11 -0800

29 lines

New Thread

Assembly

Assembly

[log in to unmask]

Sat, 15 Nov 1997 06:44:39 -0500

105 lines

Re: Assembly

Jim Marsico 516-595-5879 <[log in to unmask]>

Mon, 17 Nov 1997 07:39:00 -0400

24 lines

Assembly

Robert Schetty <[log in to unmask]>

Mon, 17 Nov 1997 22:45:44 UT

27 lines

Re: Assembly

Warren Szkolnicki <[log in to unmask]>

Mon, 17 Nov 1997 17:20:47 -0600

69 lines

Re: Assembly

David Anderson <[log in to unmask]>

Mon, 17 Nov 1997 18:35:45 -0600

57 lines

Assembly

[log in to unmask]

Mon, 24 Nov 1997 14:31:28 +0000

48 lines

New Thread

Assembly (Solderability)

Assembly (Solderability)

Darrell Bonzo <[log in to unmask]>

Fri, 21 Nov 1997 08:04:44 -0700

40 lines

Re: Assembly (Solderability)

Jack Crawford <[log in to unmask]>

Fri, 21 Nov 1997 12:33:24 -0600

59 lines

Re: Assembly (Solderability)

Ed Holton <[log in to unmask]>

Fri, 21 Nov 1997 13:45:47 -0500

24 lines

Re: Assembly (Solderability)

David D Hillman <[log in to unmask]>

Wed, 26 Nov 1997 07:50:05 -0600

80 lines

Re: Assembly (Solderability)

Achim Neu <[log in to unmask]>

Wed, 26 Nov 1997 23:19:41 +0100

36 lines

New Thread

Assembly (wire bonding course)

Re: Assembly (wire bonding course)

[log in to unmask]

Tue, 18 Nov 1997 09:07:31 +0000

27 lines

New Thread

ASSY, solder residues on gold fingers

ASSY, solder residues on gold fingers

Patrick Ducas <[log in to unmask]>

Tue, 4 Nov 1997 16:07:28 -0500

49 lines

Re: ASSY, solder residues on gold fingers

[log in to unmask]

Tue, 4 Nov 1997 13:52:01 -0800

96 lines

Re: ASSY, solder residues on gold fingers

David D Hillman <[log in to unmask]>

Tue, 4 Nov 1997 21:41:57 -0600

78 lines

Re: ASSY, solder residues on gold fingers

[log in to unmask]

Wed, 5 Nov 1997 08:24:09 -0500

30 lines

Re: ASSY, solder residues on gold fingers

COLLINS, GRAHAM <[log in to unmask]>

Wed, 5 Nov 1997 07:23:20 -0500

176 lines

Re: ASSY, solder residues on gold fingers

Luke B. Mendoza <[log in to unmask]>

Thu, 6 Nov 1997 11:31:35 +0800

66 lines

New Thread

ASSY: Cleaners

ASSY: Cleaners

Sheila Smith <[log in to unmask]>

Wed, 19 Nov 1997 13:36:46 -0500

29 lines

Re: ASSY: Cleaners

Bev Christian <[log in to unmask]>

Wed, 19 Nov 1997 16:18:41 -0500

103 lines

ASSY: Cleaners

Evan Jones <[log in to unmask]>

Thu, 20 Nov 1997 00:27:20 -0500

61 lines

Re: ASSY: Cleaners

Evan Jones <[log in to unmask]>

Thu, 20 Nov 1997 00:57:24 -0500

61 lines

Re: ASSY: Cleaners

Graham Naisbitt <[log in to unmask]>

Thu, 20 Nov 1997 10:11:00 UT

145 lines

Re: ASSY: Cleaners

Max Bernhardt <[log in to unmask]>

Fri, 21 Nov 1997 08:26:00 -0600

25 lines

New Thread

ASSY: Conformal coating

ASSY: Conformal coating

Sheila Smith <[log in to unmask]>

Tue, 4 Nov 1997 15:55:20 -0500

30 lines

Re: ASSY: Conformal coating

Buschor, Thomas <[log in to unmask]>

Tue, 4 Nov 1997 16:50:18 -0500

77 lines

New Thread

ASSY: Conformal coating -Reply

ASSY: Conformal coating -Reply

Ron Hayashi <[log in to unmask]>

Tue, 4 Nov 1997 13:40:53 -0800

25 lines

New Thread

Assy: Disolving pads

Assy: Disolving pads

Blanchet,Richard <[log in to unmask]>

Tue, 4 Nov 1997 13:04:00 -0500

27 lines

Re: Assy: Disolving pads

Graham Naisbitt <[log in to unmask]>

Tue, 4 Nov 1997 23:05:01 UT

62 lines

New Thread

ASSY: Duroid or Teflon boards

ASSY: Duroid or Teflon boards

Sheila Smith <[log in to unmask]>

Thu, 13 Nov 1997 14:22:35 -0500

29 lines

ASSY: Duroid or Teflon boards

[log in to unmask]

Fri, 14 Nov 1997 09:00:04 +0100

44 lines

New Thread

ASSY: gravity conveyor

ASSY: gravity conveyor

Jerry Cupples <[log in to unmask]>

Wed, 12 Nov 1997 16:13:10 -0600

48 lines

New Thread

Assy: Hi Temp Soldering to pads on Ceramic substrate

Assy: Hi Temp Soldering to pads on Ceramic substrate

Charles Barker <[log in to unmask]>

Wed, 5 Nov 1997 15:35:48 -0600

55 lines

Re: Assy: Hi Temp Soldering to pads on Ceramic substrate

Bev Christian <[log in to unmask]>

Wed, 5 Nov 1997 19:20:53 -0500

96 lines

Re: Assy: Hi Temp Soldering to pads on Ceramic substrate

David D Hillman <[log in to unmask]>

Thu, 6 Nov 1997 06:40:37 -0600

117 lines

Re: Assy: Hi Temp Soldering to pads on Ceramic substrate

Phillip E. Hinton <[log in to unmask]>

Thu, 6 Nov 1997 12:52:57 -0500

60 lines

New Thread

ASSY: High Temp Solder

ASSY: High Temp Solder

Lainie Loveless <[log in to unmask]>

Fri, 21 Nov 1997 19:32:56 -0600

31 lines

New Thread

Assy: Labels for ICs

Assy: Labels for ICs

Blanchet,Richard <[log in to unmask]>

Thu, 6 Nov 1997 12:18:00 -0500

34 lines

New Thread

ASSY: Long-term Storage of Components

ASSY: Long-term Storage of Components

Lainie Loveless <[log in to unmask]>

Fri, 21 Nov 1997 19:33:16 -0600

32 lines

New Thread

Assy: Pre-heating of PCBs

Assy: Pre-heating of PCBs

Blanchet,Richard <[log in to unmask]>

Thu, 27 Nov 1997 14:03:00 -0500

35 lines

Re: Assy: Pre-heating of PCBs

Bev Christian <[log in to unmask]>

Thu, 27 Nov 1997 20:56:13 -0500

74 lines

New Thread

ASSY: Rack Covers

ASSY: Rack Covers

[log in to unmask]

Mon, 24 Nov 1997 21:33:09 -0600

32 lines

Re: ASSY: Rack Covers

Richard Hamilton -TEST <[log in to unmask]>

Tue, 25 Nov 1997 10:54:54 -0700

67 lines

Re: ASSY: Rack Covers

Richard Hamilton -TEST <[log in to unmask]>

Tue, 25 Nov 1997 10:37:04 -0700

68 lines

New Thread

ASSY: SMT/Temp. Cycling Test Failures revisited

ASSY: SMT/Temp. Cycling Test Failures revisited

BROMLEY, Bill <[log in to unmask]>

Mon, 3 Nov 1997 15:13:29 -0500

119 lines

Re: ASSY: SMT/Temp. Cycling Test Failures revisited

Aric J Parr <[log in to unmask]>

Mon, 3 Nov 1997 15:49:34 -0500

29 lines

Re: ASSY: SMT/Temp. Cycling Test Failures revisited

Gregg Klawson <[log in to unmask]>

Mon, 3 Nov 1997 16:09:56 -0500

55 lines

Re: ASSY: SMT/Temp. Cycling Test Failures revisited

Kane, Joseph <[log in to unmask]>

Mon, 3 Nov 1997 17:07:57 -0500

86 lines

Re: ASSY: SMT/Temp. Cycling Test Failures revisited

Graham Naisbitt <[log in to unmask]>

Mon, 3 Nov 1997 23:57:42 UT

123 lines

Re: ASSY: SMT/Temp. Cycling Test Failures revisited

Jim Marsico 516-595-5879 <[log in to unmask]>

Tue, 4 Nov 1997 07:49:00 -0400

25 lines

Re: ASSY: SMT/Temp. Cycling Test Failures revisited

Graham Naisbitt <[log in to unmask]>

Tue, 4 Nov 1997 22:14:23 UT

112 lines

New Thread

Assy: Soldering to crystal cans

Assy: Soldering to crystal cans

Raymond Klein <[log in to unmask]>

Mon, 10 Nov 1997 14:23:44 -0800

29 lines

Re: Assy: Soldering to crystal cans

Yvon Hache <[log in to unmask]>

Tue, 11 Nov 1997 13:11:54 -0800

42 lines

Re: Assy: Soldering to crystal cans

Scott Decker <[log in to unmask]>

Tue, 11 Nov 1997 10:54:56 -0800

76 lines

Re: Assy: Soldering to crystal cans

Max Bernhardt <[log in to unmask]>

Tue, 11 Nov 1997 12:02:00 -0600

20 lines

New Thread

ASSY: Soldermask vs conformal coat

ASSY: Soldermask vs conformal coat

Sheila Smith <[log in to unmask]>

Fri, 21 Nov 1997 16:10:38 -0500

29 lines

Re: ASSY: Soldermask vs conformal coat

Lepsche, Thomas G (NM75) <[log in to unmask]>

Fri, 21 Nov 1997 14:42:00 -0700

59 lines

Re: ASSY: Soldermask vs conformal coat

Tully, Marti (AZ15) <[log in to unmask]>

Fri, 21 Nov 1997 15:56:35 -0600

29 lines

Re: ASSY: Soldermask vs conformal coat

Larry J. Fisher <[log in to unmask]>

Mon, 24 Nov 1997 11:16:19 -0500

36 lines

Re: ASSY: Soldermask vs conformal coat

Graham Naisbitt <[log in to unmask]>

Tue, 25 Nov 1997 00:18:27 UT

78 lines

Re: ASSY: Soldermask vs conformal coat

Larry Crane <[log in to unmask]>

Tue, 25 Nov 1997 07:41:22 -0400

34 lines

New Thread

Assy: Wire bonding course. The Welding Institute.

Assy: Wire bonding course. The Welding Institute.

[log in to unmask]

Wed, 19 Nov 1997 08:52:38 +0000

53 lines

New Thread

Assy:cracker boards

Assy:cracker boards

Raymond Klein <[log in to unmask]>

Thu, 6 Nov 1997 10:01:52 -0800

34 lines

New Thread

Autoclave

Autoclave

Universal Circuits - Buffalo <[log in to unmask]>

Thu, 13 Nov 1997 17:22:19 -0600

30 lines

New Thread

Axial part age

Axial part age

Joe Wackerman <[log in to unmask]>

Wed, 5 Nov 1997 15:43:08 -0800

45 lines

Re: Axial part age

Mark Ross <[log in to unmask]>

Wed, 5 Nov 1997 19:57:53 -0500

303 lines

New Thread

Bare Board Cleanliness

Bare Board Cleanliness

Paul Robertson <[log in to unmask]>

Fri, 7 Nov 1997 14:04:19 +0000

35 lines

Re: Bare Board Cleanliness

Steve Collins <[log in to unmask]>

Fri, 7 Nov 1997 13:05:11 -0700

60 lines

New Thread

BGA mail list

Re: BGA mail list

Nachbor, Suzanne (MN51) <[log in to unmask]>

Fri, 7 Nov 1997 10:34:48 -0600

25 lines

New Thread

BGA Mailing List

BGA Mailing List

[log in to unmask]

Thu, 6 Nov 1997 14:45:36 -0500

22 lines

Re: BGA Mailing List

[log in to unmask]

Thu, 6 Nov 1997 15:15:33 -0500

16 lines

Re: BGA Mailing List

Lisa Anderson <[log in to unmask]>

Thu, 6 Nov 1997 15:48:40 -0500

24 lines

Re: BGA Mailing List

Douglas H Bennett- Sales Engineer <[log in to unmask]>

Thu, 6 Nov 1997 17:39:19 -0800

43 lines

Re: BGA Mailing List

Fulton Feng <[log in to unmask]>

Thu, 6 Nov 1997 18:24:22 -0500

75 lines

Re: BGA Mailing List

Fanny TANG (ESD) <[log in to unmask]>

Fri, 7 Nov 1997 09:23:33 +0800

22 lines

BGA Mailing List

Varadaraj.K <[log in to unmask]>

Fri, 7 Nov 1997 12:07:53 +0500

29 lines

Re: BGA Mailing List

Doug Jeffery <[log in to unmask]>

Fri, 7 Nov 1997 04:43:51 -0600

45 lines

Re: BGA Mailing List

Brian Husnik <[log in to unmask]>

Fri, 7 Nov 1997 08:53:55 -0600

33 lines

BGA Mailing List

Legend Zhang <[log in to unmask]>

Fri, 7 Nov 1997 09:03:47 -0600

26 lines

Re: BGA Mailing List

Yuen, Mike <[log in to unmask]>

Fri, 7 Nov 1997 09:53:00 CST

19 lines

BGA Mailing List

Robert Schetty <[log in to unmask]>

Fri, 7 Nov 1997 17:56:10 UT

20 lines

Re: BGA Mailing List

Gabriela Bogdan <[log in to unmask]>

Sat, 8 Nov 1997 12:02:11 +0000

45 lines

Re: BGA Mailing List

Carl Chiang <[log in to unmask]>

Sat, 8 Nov 1997 23:05:02 +0800

24 lines

Re: BGA Mailing List

Adan Verduzco <[log in to unmask]>

Sat, 8 Nov 1997 13:10:14 -0700

109 lines

Re: BGA Mailing List

jon johnson <[log in to unmask]>

Sat, 8 Nov 1997 16:41:36 -0500

29 lines

BGA mailing list

[log in to unmask]

Sun, 9 Nov 1997 19:43:10 -0500

19 lines

BGA mailing list

[log in to unmask]

Mon, 10 Nov 1997 14:44:22 +0900

21 lines

BGA Mailing list

Scott Westheimer <[log in to unmask]>

Mon, 10 Nov 1997 17:53:21 +0800

54 lines

Re: BGA Mailing List

<Gareth Jones> <[log in to unmask]>

Mon, 10 Nov 1997 13:02:42 +0000

27 lines

Re: BGA mailing list

[log in to unmask]

Tue, 11 Nov 1997 07:08:09 -0500

20 lines

Re: BGA Mailing List

Michael Jeremias <[log in to unmask]>

Wed, 12 Nov 1997 10:05:21 -0800

87 lines

New Thread

BGA Pad to via spacing

BGA Pad to via spacing

COLLINS, GRAHAM <[log in to unmask]>

Wed, 12 Nov 1997 06:50:43 -0500

77 lines

New Thread

BGA soldering profile

BGA soldering profile

Legend Zhang <[log in to unmask]>

Fri, 7 Nov 1997 09:15:11 -0600

41 lines

Re: BGA soldering profile

Jim Marsico 516-595-5879 <[log in to unmask]>

Fri, 7 Nov 1997 11:17:00 -0400

43 lines

Re: BGA soldering profile

[log in to unmask]

Mon, 10 Nov 1997 08:36:10 -0500

33 lines

Re: BGA soldering profile

John Guy <[log in to unmask]>

Mon, 10 Nov 1997 15:49:50 -0500

85 lines

New Thread

BGA XRAY INSPECTION LABS

BGA XRAY INSPECTION LABS

Jason Goddard <[log in to unmask]>

Tue, 25 Nov 1997 12:36:51 +1100

37 lines

New Thread

Blow holes

Blow holes

sam mccorkel <[log in to unmask]>

Thu, 20 Nov 1997 12:26:52 -0500

29 lines

Re: Blow holes

John Guy <[log in to unmask]>

Thu, 20 Nov 1997 13:43:31 -0500

78 lines

New Thread

Blow holes -Reply

Blow holes -Reply

Ron Hayashi <[log in to unmask]>

Thu, 20 Nov 1997 10:58:53 -0800

23 lines

New Thread

Breaking of tabs

Breaking of tabs

Dhawan, Ashok <[log in to unmask]>

Thu, 6 Nov 1997 14:52:39 -0000

30 lines

Re: Breaking of tabs

Charles Barker <[log in to unmask]>

Thu, 6 Nov 1997 11:34:51 -0600

64 lines

Re: Breaking of tabs

[log in to unmask]

Wed, 5 Nov 1997 23:36:46 -0600

56 lines

Re: Breaking of tabs

Joseph Duclos <[log in to unmask]>

Thu, 6 Nov 1997 18:05:01 -0500

40 lines

New Thread

Breaking of Tabs..

Breaking of Tabs..

MARK SIMMONS <[log in to unmask]>

Thu, 6 Nov 1997 10:07:56 -0800

41 lines

New Thread

C.I. Symposium Cups

Re: C.I. Symposium Cups

[log in to unmask]

Tue, 4 Nov 1997 13:30:33 EST

37 lines

New Thread

CAD Librarian

CAD Librarian

Richard G Smith <[log in to unmask]>

Mon, 10 Nov 1997 15:57:24 -0600

27 lines

New Thread

Cap shorting at low voltage high impedance circuit

Cap shorting at low voltage high impedance circuit

Ken Patel <[log in to unmask]>

Wed, 19 Nov 1997 17:41:16 -0800

51 lines

Re: Cap shorting at low voltage high impedance circuit

[log in to unmask]

Wed, 19 Nov 1997 20:15:11 -0600

36 lines

Re: Cap shorting at low voltage high impedance circuit

Evan Jones <[log in to unmask]>

Thu, 20 Nov 1997 00:44:21 -0500

61 lines

Cap shorting at low voltage high impedance circuit

Evan Jones <[log in to unmask]>

Thu, 20 Nov 1997 00:49:39 -0500

61 lines

Re: Cap shorting at low voltage high impedance circuit

Doug Pauls <[log in to unmask]>

Thu, 20 Nov 1997 09:42:59 -0500

52 lines

Re: Cap shorting at low voltage high impedance circuit

Paul Terranova <[log in to unmask]>

Thu, 20 Nov 1997 13:12:18 -0500

117 lines

Cap shorting at low voltage high impedance circuit

Ken Patel <[log in to unmask]>

Thu, 20 Nov 1997 14:03:38 -0800

73 lines

Re: Cap shorting at low voltage high impedance circuit

Martin Bourke <[log in to unmask]>

Fri, 21 Nov 1997 02:07:56 GMT

89 lines

Re: Cap shorting at low voltage high impedance circuit

Ed Holton <[log in to unmask]>

Fri, 21 Nov 1997 09:07:25 -0500

101 lines

Re: Cap shorting at low voltage high impedance circuit

Gabriela Bogdan <[log in to unmask]>

Sat, 22 Nov 1997 12:13:25 +0000

140 lines

New Thread

Carbon Ink Printing for remote Control PWBs

Carbon Ink Printing for remote Control PWBs

BPL Ltd. <[log in to unmask]>

Sat, 8 Nov 1997 12:30:42 +0530

38 lines

New Thread

carelesness

carelesness

phil stortz <[log in to unmask]>

Tue, 4 Nov 1997 20:23:54 +0100

24 lines

New Thread

CCGA Process

CCGA Process

Sonia Singh <[log in to unmask]>

Wed, 5 Nov 1997 16:51:01 +0000

33 lines

New Thread

Chip Capacitor Termination Finish

Chip Capacitor Termination Finish

VanDreel, Kirk <[log in to unmask]>

Tue, 11 Nov 1997 13:11:00 CST

46 lines

Re: Chip Capacitor Termination Finish

Phillip E. Hinton <[log in to unmask]>

Tue, 11 Nov 1997 16:22:47 -0500

30 lines

New Thread

Chip On Glass

Chip On Glass

Fanny TANG (ESD) <[log in to unmask]>

Fri, 7 Nov 1997 09:31:44 +0800

28 lines

New Thread

Chip Resistor Networks

Chip Resistor Networks

Signorelli, Paul <[log in to unmask]>

Wed, 5 Nov 1997 08:33:57 -0600

25 lines

New Thread

Chip Softpassivation Polyimide

Chip Softpassivation Polyimide

Achim Neu <[log in to unmask]>

Tue, 25 Nov 1997 23:34:17 +0100

34 lines

Chip Softpassivation Polyimide

[log in to unmask]

Tue, 25 Nov 1997 16:15:02 MST

47 lines

New Thread

Circuit Repair Corporation

Circuit Repair Corporation

Lei, Kuan <[log in to unmask]>

Tue, 18 Nov 1997 09:49:55 -0600

36 lines

Re: Circuit Repair Corporation

Jack Crawford <[log in to unmask]>

Tue, 18 Nov 1997 10:27:16 -0600

55 lines

Re: Circuit Repair Corporation

Charles Barker <[log in to unmask]>

Tue, 18 Nov 1997 13:37:43 -0600

50 lines

New Thread

Circuit Repair Corporation -Reply

Circuit Repair Corporation -Reply

Ron Hayashi <[log in to unmask]>

Tue, 18 Nov 1997 08:25:16 -0800

25 lines

New Thread

Circuit width and spacing

Circuit width and spacing

Jeffrey Carano <[log in to unmask]>

Tue, 11 Nov 1997 10:12:38 -0500

27 lines

Re: Circuit width and spacing

Rodney <[log in to unmask]>

Tue, 11 Nov 1997 09:43:36 EST

32 lines

Re: Circuit width and spacing

Ralph Hersey <[log in to unmask]>

Tue, 11 Nov 1997 08:11:20 -0800

79 lines

Re: Circuit width and spacing

George H. Patrick, III <[log in to unmask]>

Tue, 11 Nov 1997 08:54:21 -0800

52 lines

New Thread

Cleanliness of boards

Cleanliness of boards

Dhawan, Ashok <[log in to unmask]>

Thu, 6 Nov 1997 14:48:47 -0000

32 lines

Re: Cleanliness of boards

Doug Pauls <[log in to unmask]>

Thu, 6 Nov 1997 12:29:46 -0500

48 lines

New Thread

Cleanliness under Flip-Chips

Re: Cleanliness under Flip-Chips

Graham Naisbitt <[log in to unmask]>

Fri, 7 Nov 1997 00:03:17 UT

126 lines

New Thread

Closed-Loop Water Recycling Systems

Closed-Loop Water Recycling Systems

Thomas C Han <[log in to unmask]>

Wed, 5 Nov 1997 13:35:50 -0800

28 lines

Re: Closed-Loop Water Recycling Systems

Charles Barker <[log in to unmask]>

Wed, 5 Nov 1997 15:46:56 -0600

54 lines

Re: Closed-Loop Water Recycling Systems

Kenny Bloomquist <[log in to unmask]>

Wed, 5 Nov 1997 14:04:30 -0800

40 lines

Re: Closed-Loop Water Recycling Systems

Marie Holmgard <[log in to unmask]>

Thu, 6 Nov 1997 11:26:33 +1200

91 lines

New Thread

Coaters for LPI

Coaters for LPI

Universal Circuits - Buffalo <[log in to unmask]>

Tue, 11 Nov 1997 17:51:15 -0600

31 lines

Re: Coaters for LPI

[log in to unmask]

Tue, 11 Nov 1997 20:17:54 -0500

26 lines

Re: Coaters for LPI

Larry J. Fisher <[log in to unmask]>

Fri, 14 Nov 1997 10:20:58 -0500

46 lines

Re: Coaters for LPI

Afri Singh <[log in to unmask]>

Thu, 20 Nov 1997 09:29:55 -0500

59 lines

New Thread

Component Shelf Life

Re: Component Shelf Life

Bev Christian <[log in to unmask]>

Sat, 1 Nov 1997 10:33:47 -0500

78 lines

Re: Component Shelf Life

David D Hillman <[log in to unmask]>

Tue, 4 Nov 1997 06:37:17 -0600

103 lines

New Thread

Conformal Coating

Conformal Coating

tjsjo <[log in to unmask]>

Mon, 3 Nov 1997 17:34:30 -0800

29 lines

Re: Conformal Coating

Jim Marsico 516-595-5879 <[log in to unmask]>

Tue, 4 Nov 1997 07:57:00 -0400

27 lines

New Thread

CONFORMAL COATING REPAIR

Re: CONFORMAL COATING REPAIR

Graham Naisbitt <[log in to unmask]>

Sun, 2 Nov 1997 00:52:15 UT

87 lines

New Thread

contamination on sm capacitors

contamination on sm capacitors

Jim Hedderick <[log in to unmask]>

Tue, 4 Nov 1997 09:49:30 +0000

30 lines

Re: contamination on sm capacitors

Gregg Klawson <[log in to unmask]>

Tue, 4 Nov 1997 08:19:52 -0500

44 lines

Re: contamination on sm capacitors

Doug Pauls <[log in to unmask]>

Tue, 4 Nov 1997 09:16:13 -0500

44 lines

Re: contamination on sm capacitors

john maxwell <[log in to unmask]>

Wed, 5 Nov 1997 12:24:40 -0700

38 lines

New Thread

Copper concentration in Rack Strip

Copper concentration in Rack Strip

Chris Ford <[log in to unmask]>

Wed, 12 Nov 1997 10:11:46 -0500

34 lines

New Thread

Corner cracks in electrolytic copper plating.

Re: Corner cracks in electrolytic copper plating.

[log in to unmask]

Sun, 16 Nov 1997 18:37:40 -0500

21 lines

New Thread

Cutting internal layer traces

Cutting internal layer traces

Thomas Phelps <[log in to unmask]>

Tue, 4 Nov 1997 16:24:00 -0500

39 lines

New Thread

dark gold fingers

dark gold fingers

annie laberge <[log in to unmask]>

Mon, 24 Nov 1997 16:45:29 -0500

35 lines

Re: dark gold fingers

[log in to unmask]

Mon, 24 Nov 1997 14:38:38 -0800

33 lines

Re: dark gold fingers

Jan Bokhove <[log in to unmask]>

Tue, 25 Nov 1997 09:00:24 +0100

55 lines

Re: dark gold fingers

Goldman, Patricia J. <[log in to unmask]>

Tue, 25 Nov 1997 08:41:00 PST

18 lines

Re: dark gold fingers

Robert Welch <[log in to unmask]>

Tue, 25 Nov 1997 13:30:16 +0000

36 lines

Re: dark gold fingers

Lenny Kurup <[log in to unmask]>

Tue, 25 Nov 1997 15:35:16 -0500

56 lines

Re: dark gold fingers

[log in to unmask] <[log in to unmask]>

Tue, 25 Nov 1997 21:22:05 -0800

39 lines

New Thread

DC Etch prediction

DC Etch prediction

Stone, Steve <[log in to unmask]>

Thu, 6 Nov 1997 09:24:00 PST

32 lines

Re: DC Etch prediction

Doug Jeffery <[log in to unmask]>

Fri, 7 Nov 1997 04:41:19 -0600

71 lines

New Thread

Delamination Issues

Delamination Issues

[log in to unmask]

Wed, 19 Nov 1997 16:25:41 CST

34 lines

Delamination Issues

Evan Jones <[log in to unmask]>

Thu, 20 Nov 1997 00:27:45 -0500

61 lines

New Thread

DES: Guard rings

DES: Guard rings

Max Harris <[log in to unmask]>

Mon, 3 Nov 1997 15:39:21 -0500

36 lines

Re: DES: Guard rings

Neil Diamond <[log in to unmask]>

Mon, 3 Nov 1997 15:07:52 -0600

63 lines

Re: DES: Guard rings

Jeff Seeger <jseeger*remove_to_reply*@[log in to unmask]>

Mon, 3 Nov 1997 16:27:32 -0500

63 lines

New Thread

DES: Gullwing Leads Manufacturer

DES: Gullwing Leads Manufacturer

Steve Collins <[log in to unmask]>

Wed, 19 Nov 1997 07:30:27 -0700

35 lines

Re: DES: Gullwing Leads Manufacturer

Ulrich Korndoerfer <[log in to unmask]>

Thu, 20 Nov 1997 00:08:09 +0100

60 lines

DES: Gullwing Leads Manufacturer

Evan Jones <[log in to unmask]>

Thu, 20 Nov 1997 00:26:40 -0500

61 lines

Re: DES: Gullwing Leads Manufacturer

Evan Jones <[log in to unmask]>

Thu, 20 Nov 1997 00:53:51 -0500

61 lines

Re: DES: Gullwing Leads Manufacturer

D.C.Whalley <[log in to unmask]>

Thu, 20 Nov 1997 08:49:32 -0500

30 lines

New Thread

Des: Mentor area fill problem

Des: Mentor area fill problem

Ty Thomas <[log in to unmask]>

Mon, 3 Nov 1997 10:13:32 -0500

42 lines

Re: Des: Mentor area fill problem

Yvon Hache <[log in to unmask]>

Tue, 4 Nov 1997 07:27:12 -0800

35 lines

New Thread

Design: Shield Layer Relief and Shielding Effectiveness

Re: Design: Shield Layer Relief and Shielding Effectiveness

Doug McKean <[log in to unmask]>

Sat, 1 Nov 1997 15:59:27 -0500

89 lines

New Thread

Die Attach Adhesive Bleed

Die Attach Adhesive Bleed

Matthew Byrne <[log in to unmask]>

Tue, 11 Nov 1997 20:51:34 EST

37 lines

New Thread

Differential Impedance Calculations

Differential Impedance Calculations

Brock Hunter <[log in to unmask]>

Tue, 11 Nov 1997 17:19:10 -0500

40 lines

Re: Differential Impedance Calculations

[log in to unmask]

Tue, 11 Nov 1997 18:13:30 -0500

20 lines

Re: Differential Impedance Calculations

Scott Decker <[log in to unmask]>

Wed, 12 Nov 1997 08:09:58 -0800

75 lines

Re: Differential Impedance Calculations

Neil Diamond <[log in to unmask]>

Wed, 12 Nov 1997 11:42:56 -0600

63 lines

Re: Differential Impedance Calculations

Engineering / Design Dept. <[log in to unmask]>

Wed, 12 Nov 1997 10:49:11 -0800

90 lines

Re: Differential Impedance Calculations

Gwen Merchant <[log in to unmask]>

Wed, 19 Nov 1997 11:49:15 +0000

72 lines

New Thread

Differential Impendance

Differential Impendance

teik <[log in to unmask]>

Mon, 3 Nov 1997 14:57:44 EST

24 lines

Re: Differential Impendance

D. Rooke <[log in to unmask]>

Tue, 4 Nov 1997 00:38:07 -0500

53 lines

New Thread

Do we really need ionic contamination measurement e

Re: Do we really need ionic contamination measurement e

Jim Herard <[log in to unmask]>

Thu, 13 Nov 1997 19:26:59 -0500

76 lines

New Thread

Do we really need ionic contamination measurement equipm ent?

Re: Do we really need ionic contamination measurement equipm ent?

COLLINS, GRAHAM <[log in to unmask]>

Fri, 14 Nov 1997 06:51:24 -0500

102 lines

New Thread

Do we really need ionic contamination measurement equipment?

Do we really need ionic contamination measurement equipment?

Ken Patel <[log in to unmask]>

Thu, 13 Nov 1997 14:25:32 -0800

38 lines

Re: Do we really need ionic contamination measurement equipment?

[log in to unmask]

Fri, 14 Nov 1997 02:54:39 -0500

29 lines

Re: Do we really need ionic contamination measurement equipment?

Larry J. Fisher <[log in to unmask]>

Fri, 14 Nov 1997 10:38:11 -0500

55 lines

Re: Do we really need ionic contamination measurement equipment?

Graham Naisbitt <[log in to unmask]>

Sat, 15 Nov 1997 09:53:13 UT

79 lines

Re: Do we really need ionic contamination measurement equipment?

Lenny Kurup <[log in to unmask]>

Fri, 14 Nov 1997 13:46:24 -0500

67 lines

Re: Do we really need ionic contamination measurement equipment?

Doug Pauls <[log in to unmask]>

Mon, 17 Nov 1997 08:05:55 -0500

85 lines

Re: Do we really need ionic contamination measurement equipment?

Nicholas Kane <[log in to unmask]>

Mon, 17 Nov 1997 21:54:52 +1100

110 lines

Re: Do we really need ionic contamination measurement equipment?

Graham Naisbitt <[log in to unmask]>

Thu, 27 Nov 1997 11:35:56 UT

108 lines

New Thread

Do we really need ionic contamination measurement equipment? -Reply

Do we really need ionic contamination measurement equipment? -Reply

SOKKHON OU <[log in to unmask]>

Fri, 14 Nov 1997 09:20:46 -0600

25 lines

New Thread

Double Sided Assembly

Double Sided Assembly

Eddie Brunker <[log in to unmask]>

Wed, 26 Nov 1997 14:35:03 GMT

65 lines

Re: Double Sided Assembly

David D Hillman <[log in to unmask]>

Wed, 26 Nov 1997 12:38:31 -0600

106 lines

Re: Double Sided Assembly

Ed Holton <[log in to unmask]>

Wed, 26 Nov 1997 13:09:41 -0500

153 lines

Re: Double Sided Assembly

COLLINS, GRAHAM <[log in to unmask]>

Wed, 26 Nov 1997 15:14:07 -0500

226 lines

Double Sided Assembly

Eddie Brunker <[log in to unmask]>

Thu, 27 Nov 1997 10:13:42 GMT

58 lines

Re: Double Sided Assembly

[log in to unmask]

Thu, 27 Nov 1997 07:52:08 -0500

56 lines

New Thread

Double sided assembly methods

Double sided assembly methods

Lee McCuistion <[log in to unmask]>

Tue, 25 Nov 1997 13:28:11 +0000

42 lines

Re: Double sided assembly methods

David D Hillman <[log in to unmask]>

Wed, 26 Nov 1997 07:35:17 -0600

84 lines

New Thread

Double Sided Reflow

Re: Double Sided Reflow

Moss Dore <[log in to unmask]>

Thu, 27 Nov 1997 13:20:08 +0000

35 lines

Re: Double Sided Reflow

[log in to unmask]

Fri, 28 Nov 1997 08:32:06 -0500

31 lines

New Thread

Electroless Gold

Electroless Gold

[log in to unmask]

Wed, 12 Nov 1997 12:14:59 +0800

30 lines

New Thread

Electronic Field Failures Caused by Temperature

Electronic Field Failures Caused by Temperature

Matt Aubrey <[log in to unmask]>

Thu, 6 Nov 1997 18:28:10 -0500

30 lines

Re: Electronic Field Failures Caused by Temperature

D.C.Whalley <[log in to unmask]>

Fri, 7 Nov 1997 07:50:36 -0500

41 lines

Re: Electronic Field Failures Caused by Temperature

Pratap Singh <[log in to unmask]>

Sat, 8 Nov 1997 11:37:49 -0800

35 lines

New Thread

Encapsulation material TEDISTAC

Encapsulation material TEDISTAC

Michael Jeremias <[log in to unmask]>

Tue, 18 Nov 1997 20:04:29 -0800

36 lines

Encapsulation material TEDISTAC

Michael Jeremias <[log in to unmask]>

Thu, 20 Nov 1997 12:15:22 -0800

56 lines

New Thread

Engelhard

Engelhard

tonghh <[log in to unmask]>

Thu, 6 Nov 1997 22:57:23 +0800

27 lines

Engelhard

Matthew Mahlau <[log in to unmask]>

Thu, 6 Nov 1997 11:20:39 -0500

182 lines

New Thread

Enlist to BGA list

Enlist to BGA list

BPL Ltd. <[log in to unmask]>

Sat, 8 Nov 1997 19:00:48 +0530

36 lines

New Thread

Enlist us to The BGA lists,Thanks you

Enlist us to The BGA lists,Thanks you

Eddy Chen <[log in to unmask]>

Sat, 8 Nov 1997 00:25:14 +0800

29 lines

New Thread

Entek Plus 106 and Kester no clean flux 951

Entek Plus 106 and Kester no clean flux 951

Matthew Park <[log in to unmask]>

Fri, 28 Nov 1997 13:04:10 -0800

28 lines

Re: Entek Plus 106 and Kester no clean flux 951

J. Paul Mecca <[log in to unmask]>

Fri, 28 Nov 1997 19:55:15 -0500

51 lines

Entek Plus 106 and Kester no clean flux 951

Evan Jones <[log in to unmask]>

Mon, 1 Dec 1997 00:19:57 -0500

62 lines

New Thread

Environmentally Friendly PWB's

Environmentally Friendly PWB's

Kenneth Rodgers <[log in to unmask]>

Fri, 7 Nov 1997 11:00:46 -0600

33 lines

Re: Environmentally Friendly PWB's

D.C.Whalley <[log in to unmask]>

Wed, 12 Nov 1997 12:43:56 -0500

40 lines

New Thread

Er of FR-4

Re: Er of FR-4

[log in to unmask]

Thu, 6 Nov 1997 12:00:14 +0000

4987 lines

New Thread

ESD Safe Plexiglass

ESD Safe Plexiglass

Signorelli, Paul <[log in to unmask]>

Wed, 19 Nov 1997 10:41:56 -0600

23 lines

ESD Safe Plexiglass

Evan Jones <[log in to unmask]>

Thu, 20 Nov 1997 01:08:31 -0500

61 lines

New Thread

ESD SAFE WINDOWS?

ESD SAFE WINDOWS?

David Girard <[log in to unmask]>

Tue, 18 Nov 1997 17:04:50 -0500

36 lines

Re: ESD SAFE WINDOWS?

Saracino, Glenn (AZ75) <[log in to unmask]>

Tue, 18 Nov 1997 16:53:41 -0600

72 lines

New Thread

ESD SAFE WINDOWS? -Reply

Re: ESD SAFE WINDOWS? -Reply

Fanny TANG (ESD) <[log in to unmask]>

Mon, 24 Nov 1997 12:35:01 +0800

27 lines

New Thread

Etchant for Au/Sn solder

Etchant for Au/Sn solder

Phillip E. Hinton <[log in to unmask]>

Wed, 26 Nov 1997 09:27:50 -0500

27 lines

Etchant for Au/Sn solder

[log in to unmask]

Wed, 26 Nov 1997 16:15:14 +0100

31 lines

Re: Etchant for Au/Sn solder

Lenny Kurup <[log in to unmask]>

Wed, 26 Nov 1997 11:10:43 -0500

50 lines

New Thread

FAB - CAM Systems Administration

FAB - CAM Systems Administration

Jeffrey Worth <[log in to unmask]>

Thu, 13 Nov 1997 16:27:14 -0500

27 lines

Re: FAB - CAM Systems Administration

Richard Hamilton -TEST <[log in to unmask]>

Thu, 13 Nov 1997 14:49:27 -0700

59 lines

Re: FAB - CAM Systems Administration

Jack Crawford <[log in to unmask]>

Fri, 14 Nov 1997 10:41:39 -0600

47 lines

Re: FAB - CAM Systems Administration

Jack Crawford <[log in to unmask]>

Fri, 14 Nov 1997 11:10:27 -0600

58 lines

New Thread

Fab /Assm: Big Boards!

Fab /Assm: Big Boards!

[log in to unmask]

Fri, 14 Nov 1997 20:42:16 -0600

23 lines

New Thread

FAB Ionic Cleanliness Testing Equip

FAB Ionic Cleanliness Testing Equip

[log in to unmask]

Fri, 21 Nov 1997 12:44:33 -0500

35 lines

Re: FAB Ionic Cleanliness Testing Equip

Al Hamilton <[log in to unmask]>

Mon, 24 Nov 1997 10:21:34 -0500

23 lines

Re: FAB Ionic Cleanliness Testing Equip

Larry J. Fisher <[log in to unmask]>

Mon, 24 Nov 1997 11:08:49 -0500

38 lines

New Thread

FAB Materials: What are these?

FAB Materials: What are these?

[log in to unmask]

Mon, 24 Nov 1997 08:58:54 -0500

35 lines

Re: FAB Materials: What are these?

Steven Sauer <[log in to unmask]>

Mon, 24 Nov 1997 09:19:29 -0500

36 lines

New Thread

FAB staining on FR4

Re: FAB staining on FR4

[log in to unmask] <[log in to unmask]>

Thu, 20 Nov 1997 20:56:11 -0800

51 lines

Re: FAB staining on FR4

Robert Welch <[log in to unmask]>

Thu, 20 Nov 1997 17:17:03 +0000

53 lines

Re: FAB staining on FR4

Lenny Kurup <[log in to unmask]>

Thu, 20 Nov 1997 17:21:56 -0500

83 lines

New Thread

Fab vendor qualification

Fab vendor qualification

Ken Patel <[log in to unmask]>

Tue, 4 Nov 1997 10:46:27 -0800

32 lines

Re: Fab vendor qualification

Steve Collins <[log in to unmask]>

Wed, 5 Nov 1997 07:14:58 -0700

59 lines

New Thread

Fab-Selective Gold

Re: Fab-Selective Gold

John Gordon <[log in to unmask]>

Thu, 6 Nov 1997 11:04:34 -0800

31 lines

New Thread

FAB. Dielectric constant c

Re: FAB. Dielectric constant c

[log in to unmask]

Wed, 5 Nov 1997 15:24:37 +0000

23 lines

New Thread

FAB. Dielectric constant certification

FAB. Dielectric constant certification

José Muelas <[log in to unmask]>

Wed, 5 Nov 1997 00:59:14 +0100

34 lines

New Thread

FAB/ ASSY: Big Boards!

FAB/ ASSY: Big Boards!

MR JOHN L THOMA <[log in to unmask]>

Wed, 5 Nov 1997 10:57:54 -0500

24 lines

Re: FAB/ ASSY: Big Boards!

[log in to unmask]

Wed, 5 Nov 1997 08:25:49 -0800

24 lines

Re: FAB/ ASSY: Big Boards!

Keith Larson <[log in to unmask]>

Wed, 5 Nov 1997 18:47:15 -0600

82 lines

Re: FAB/ ASSY: Big Boards!

[log in to unmask]

Thu, 6 Nov 1997 10:15:56 EST

24 lines

New Thread

FAB/ ASSY: Big Boards! -Reply

FAB/ ASSY: Big Boards! -Reply

KARLA DUGGAN <[log in to unmask]>

Wed, 5 Nov 1997 10:18:42 -0600

48 lines

Re: FAB/ ASSY: Big Boards! -Reply

[log in to unmask]

Mon, 10 Nov 1997 10:05:01 -0500

23 lines

New Thread

FAB/ASSY: Tooling Hole Sizes

FAB/ASSY: Tooling Hole Sizes

[log in to unmask]

Thu, 6 Nov 1997 12:49:36 -0700

29 lines

Re: FAB/ASSY: Tooling Hole Sizes

John Laur <[log in to unmask]>

Thu, 6 Nov 1997 15:03:46 -0600

35 lines

Re: FAB/ASSY: Tooling Hole Sizes

Steve Collins <[log in to unmask]>

Thu, 6 Nov 1997 15:15:45 -0700

65 lines

New Thread

FAB/DES/ASM - Buried Capaciatance

FAB/DES/ASM - Buried Capaciatance

Roland Jaquet <[log in to unmask]>

Fri, 7 Nov 1997 11:07:16 +0100

60 lines

Re: FAB/DES/ASM - Buried Capaciatance

Carey Pico <[log in to unmask]>

Fri, 7 Nov 1997 08:43:44 -0800

70 lines

New Thread

FAB: Bellcore spec

Re: FAB: Bellcore spec

Orna and Yehuda <[log in to unmask]>

Mon, 3 Nov 1997 23:09:17 +0200

77 lines

New Thread

FAB: Custom Flex Lamination Equipment

FAB: Custom Flex Lamination Equipment

Andy Magee <[log in to unmask]>

Tue, 18 Nov 1997 07:16:33 -0500

31 lines

New Thread

FAB: Electrical Testers

Re: FAB: Electrical Testers

Ron Videen <[log in to unmask]>

Tue, 18 Nov 1997 13:48:37 -0600

89 lines

Re: FAB: Electrical Testers

Neil Diamond <[log in to unmask]>

Tue, 18 Nov 1997 14:58:43 -0600

61 lines

Re: FAB: Electrical Testers

Jeff Seeger <[log in to unmask]>

Tue, 18 Nov 1997 16:28:28 -0500

60 lines

New Thread

FAB: Facilities question

FAB: Facilities question

Sheila Smith <[log in to unmask]>

Thu, 6 Nov 1997 08:50:00 -0500

34 lines

Re: FAB: Facilities question

Aric J Parr <[log in to unmask]>

Thu, 6 Nov 1997 09:38:21 -0500

32 lines

Re: FAB: Facilities question

Warren Szkolnicki <[log in to unmask]>

Thu, 6 Nov 1997 08:35:01 -0600

90 lines

Re: FAB: Facilities question

FULABHAI <[log in to unmask]>

Thu, 6 Nov 1997 14:13:21 EST

38 lines

New Thread

FAB: Immersion Gold Services

FAB: Immersion Gold Services

John Parsons <[log in to unmask]>

Fri, 21 Nov 1997 16:08:42 +0000

30 lines

Re: FAB: Immersion Gold Services

Jana Carraway <[log in to unmask]>

Mon, 24 Nov 1997 09:10:38 PST

68 lines

Re: FAB: Immersion Gold Services

Larry J. Fisher <[log in to unmask]>

Mon, 24 Nov 1997 20:05:43 -0500

27 lines

Re: FAB: Immersion Gold Services

Ted Stern <[log in to unmask]>

Tue, 25 Nov 1997 10:13:06 -0800

43 lines

New Thread

FAB: Immersion Gold Services -Reply

FAB: Immersion Gold Services -Reply

Ron Hayashi <[log in to unmask]>

Mon, 24 Nov 1997 08:20:01 -0800

23 lines

Re: FAB: Immersion Gold Services -Reply

Kelly Kovalovsky <[log in to unmask]>

Mon, 24 Nov 1997 12:58:23 -0500

52 lines

New Thread

FAB: Measuring Solder Thickness After HASL

FAB: Measuring Solder Thickness After HASL

Hans Rohr <[log in to unmask]>

Wed, 12 Nov 1997 20:57:53 -0500

28 lines

Re: FAB: Measuring Solder Thickness After HASL

Fulton Feng <[log in to unmask]>

Thu, 13 Nov 1997 12:56:18 -0500

57 lines

New Thread

Fab: Packaging

Fab: Packaging

sam mccorkel <[log in to unmask]>

Tue, 4 Nov 1997 13:57:04 -0500

33 lines

Re: Fab: Packaging

Charles Barker <[log in to unmask]>

Tue, 4 Nov 1997 13:17:02 -0600

74 lines

Re: Fab: Packaging

Paul Gould <[log in to unmask]>

Tue, 4 Nov 1997 20:45:54 +0000

47 lines

New Thread

FAB: polyimide laminate

FAB: polyimide laminate

Sheila Smith <[log in to unmask]>

Thu, 6 Nov 1997 09:58:11 -0500

29 lines

Re: FAB: polyimide laminate

David Bergman <[log in to unmask]>

Wed, 26 Nov 1997 09:25:19 -0600

59 lines

New Thread

FAB: Procedure to remo

Re: FAB: Procedure to remo

Leon Snowdon <[log in to unmask]>

Tue, 25 Nov 1997 12:15:14 +0000

38 lines

New Thread

FAB: Procedure to remove tin-scale in a resiststripper

FAB: Procedure to remove tin-scale in a resiststripper

Jan Thuesen <[log in to unmask]>

Tue, 25 Nov 1997 11:44:45 +0100

64 lines

Re: FAB: Procedure to remove tin-scale in a resiststripper

Ted Stern <[log in to unmask]>

Tue, 25 Nov 1997 10:42:08 -0800

56 lines

Re: FAB: Procedure to remove tin-scale in a resiststripper

David D Sullivan <[log in to unmask]>

Tue, 25 Nov 1997 09:38:56 -0600

290 lines

New Thread

FAB: Tin / Lead finish

FAB: Tin / Lead finish

sam mccorkel <[log in to unmask]>

Tue, 4 Nov 1997 13:56:01 -0500

34 lines

Re: FAB: Tin / Lead finish

Paul Gould <[log in to unmask]>

Tue, 4 Nov 1997 20:49:39 +0000

52 lines

Re: FAB: Tin / Lead finish

-Bob Daniels, Jr - ECC Corp. <[log in to unmask]>

Tue, 4 Nov 1997 22:00:49 -0500

30 lines

New Thread

Fab: Where is Steven Eldefonso?

Fab: Where is Steven Eldefonso?

Glynn Shaw <[log in to unmask]>

Mon, 17 Nov 1997 15:43:45 -0800

32 lines

Re: Fab: Where is Steven Eldefonso?

PAUL OLSON <[log in to unmask]>

Tue, 18 Nov 1997 13:03:12 -0600

64 lines

New Thread

FABRICATION

FABRICATION

Keith Larson <[log in to unmask]>

Wed, 19 Nov 1997 12:13:59 -0600

67 lines

Re: FABRICATION

[log in to unmask]

Wed, 19 Nov 1997 19:22:59 -0500

23 lines

Re: FABRICATION

Evan Jones <[log in to unmask]>

Thu, 20 Nov 1997 00:28:11 -0500

61 lines

FABRICATION

Evan Jones <[log in to unmask]>

Thu, 20 Nov 1997 01:04:12 -0500

61 lines

New Thread

Fanuc

Fanuc

William E. Johnson <[log in to unmask]>

Mon, 10 Nov 1997 14:31:29 -0800

22 lines

Re: Fanuc

George Franck <[log in to unmask]>

Tue, 11 Nov 1997 10:14:21 -0500

60 lines

Re: Fanuc

[log in to unmask]

Tue, 11 Nov 1997 16:44:09 +0000

27 lines

Re: Fanuc

Sheila and Donna <[log in to unmask]>

Tue, 11 Nov 1997 18:18:03 -0800

52 lines

Re: Fanuc

-Bob Daniels, Jr - ECC Corp. <[log in to unmask]>

Sat, 15 Nov 1997 15:57:26 -0500

21 lines

New Thread

filling of test vias which are encroached on topside

filling of test vias which are encroached on topside

Ken Patel <[log in to unmask]>

Tue, 18 Nov 1997 10:38:40 -0800

37 lines

New Thread

fine pitch pads / design width

fine pitch pads / design width

john balchunas <[log in to unmask]>

Wed, 26 Nov 1997 10:24:47 -0500

297 lines

New Thread

fine pitch pads / designwidth

fine pitch pads / designwidth

Wolfgang Erat <[log in to unmask]>

Tue, 25 Nov 1997 12:36:48 -0500

30 lines

New Thread

Flexible PCBs

Flexible PCBs

Varadaraj.K <[log in to unmask]>

Fri, 28 Nov 1997 08:59:03 +0530

33 lines

New Thread

Flux Fumes

Flux Fumes

Linda Bookman <[log in to unmask]>

Mon, 17 Nov 1997 15:56:42 -0800

32 lines

New Thread

foam fluxer

foam fluxer

Leslie Greenlee <[log in to unmask]>

Mon, 17 Nov 1997 09:18:25 -0500

26 lines

Re: foam fluxer

Edward J. Valentine <[log in to unmask]>

Wed, 19 Nov 1997 13:09:20 -0800

49 lines

Re: foam fluxer

Evan Jones <[log in to unmask]>

Thu, 20 Nov 1997 01:11:16 -0500

61 lines

New Thread

Frequency of Solder Analysis

Re: Frequency of Solder Analysis

Ron Hollandsworth <[log in to unmask]>

Mon, 17 Nov 1997 15:28:41 -0500

35 lines

New Thread

frequency of solder pot content analysis

frequency of solder pot content analysis

Ken Patel <[log in to unmask]>

Mon, 17 Nov 1997 11:04:08 -0800

32 lines

Re: frequency of solder pot content analysis

Aric J Parr <[log in to unmask]>

Mon, 17 Nov 1997 14:28:37 -0500

40 lines

Re: frequency of solder pot content analysis

Jerry Cupples <[log in to unmask]>

Mon, 17 Nov 1997 13:30:48 -0600

54 lines

Re: frequency of solder pot content analysis

COLLINS, GRAHAM <[log in to unmask]>

Mon, 17 Nov 1997 14:22:21 -0500

76 lines

Re: frequency of solder pot content analysis

Engineering / Design Dept. <[log in to unmask]>

Mon, 17 Nov 1997 11:28:20 -0800

52 lines

Re: frequency of solder pot content analysis

Alan Kreplick <[log in to unmask]>

Mon, 17 Nov 1997 14:36:20 -0500

39 lines

Re: frequency of solder pot content analysis

[log in to unmask]

Mon, 17 Nov 1997 11:50:32 -0800

24 lines

Re: frequency of solder pot content analysis

[log in to unmask]

Mon, 17 Nov 1997 15:32:47 PST8

25 lines

New Thread

FW: ASSY:Wave solder

FW: ASSY:Wave solder

Larry Davis <[log in to unmask]>

Tue, 11 Nov 1997 13:23:00 -0600

30 lines

New Thread

FW: ENVIRONMENTAL CONTROL

FW: ENVIRONMENTAL CONTROL

Dhawan, Ashok <[log in to unmask]>

Sat, 1 Nov 1997 15:45:56 -0000

44 lines

Re: FW: ENVIRONMENTAL CONTROL

Bev Christian <[log in to unmask]>

Sat, 1 Nov 1997 11:09:13 -0500

76 lines

New Thread

FW: lead trimming

FW: lead trimming

Dhawan, Ashok <[log in to unmask]>

Sat, 1 Nov 1997 15:42:08 -0000

48 lines

New Thread

FW: RESEND -Teflon replacement

FW: RESEND -Teflon replacement

Lepsche, Thomas G (NM75) <[log in to unmask]>

Thu, 6 Nov 1997 08:53:42 -0700

45 lines

New Thread

FW: sub: zero profile sockets

FW: sub: zero profile sockets

Dhawan, Ashok <[log in to unmask]>

Sat, 1 Nov 1997 15:40:46 -0000

37 lines

Re: FW: sub: zero profile sockets

Mike Wilson <[log in to unmask]>

Mon, 3 Nov 1997 04:58:04 -0800

71 lines

New Thread

FW: [TN] Cleanliness of boards

FW: [TN] Cleanliness of boards

Dhawan, Ashok <[log in to unmask]>

Thu, 6 Nov 1997 19:08:12 -0000

99 lines

New Thread

FW: [TN] Double sided assembly methods

FW: [TN] Double sided assembly methods

Tezak Tim <[log in to unmask]>

Wed, 26 Nov 1997 14:37:00 -0500

30 lines

New Thread

FW: [TN] frequency of solder pot content analysis

FW: [TN] frequency of solder pot content analysis

Blanchet,Richard <[log in to unmask]>

Mon, 17 Nov 1997 14:03:00 -0500

16 lines

New Thread

FW: [TN] frequency of solder pot content analysis -Reply

FW: [TN] frequency of solder pot content analysis -Reply

Ron Hayashi <[log in to unmask]>

Mon, 17 Nov 1997 11:27:38 -0800

27 lines

New Thread

FW: [TN] Silver chromate paper and copper mirror source

FW: [TN] Silver chromate paper and copper mirror source

Davis, Mary <[log in to unmask]>

Thu, 20 Nov 1997 14:21:32 -0800

77 lines

New Thread

FW: [TN] Subscribe

FW: [TN] Subscribe

Dhawan, Ashok <[log in to unmask]>

Thu, 6 Nov 1997 18:26:27 -0000

63 lines

Re: FW: [TN] Subscribe

Jim Marsico 516-595-5879 <[log in to unmask]>

Thu, 6 Nov 1997 14:02:00 -0400

22 lines

New Thread

FW: [TN] Temperature Profiler Questions

FW: [TN] Temperature Profiler Questions

Blanchet,Richard <[log in to unmask]>

Mon, 3 Nov 1997 08:53:00 -0500

34 lines

New Thread

FW: [TN] [AS] What parameters do other companies use when evaluat ing the e ffectiveness of Assembly houses builds

FW: [TN] [AS] What parameters do other companies use when evaluat ing the e ffectiveness of Assembly houses builds

Dhawan, Ashok <[log in to unmask]>

Thu, 6 Nov 1997 19:39:10 -0000

72 lines

New Thread

FW: [TN] [AS] What parameters do other companies use when evaluating the effectiveness of Assembly houses builds

Re: FW: [TN] [AS] What parameters do other companies use when evaluating the effectiveness of Assembly houses builds

Graham Naisbitt <[log in to unmask]>

Fri, 7 Nov 1997 00:10:28 UT

111 lines

New Thread

FWD>RE>[TN] (TN): ASSY:

Re: FWD>RE>[TN] (TN): ASSY:

Whit Greenwood <[log in to unmask]>

Tue, 11 Nov 1997 08:21:48 U

19 lines

New Thread

G-10

G-10

Ed Cosper <[log in to unmask]>

Mon, 24 Nov 1997 13:50:57 -0600

25 lines

Re: G-10

Sheila Smith <[log in to unmask]>

Mon, 24 Nov 1997 14:55:31 -0500

45 lines

Re: G-10

Jerome Sallo <[log in to unmask]>

Mon, 24 Nov 1997 17:22:40 -0500

26 lines

Re: G-10

Steven Sauer <[log in to unmask]>

Tue, 25 Nov 1997 06:16:03 -0500

24 lines

New Thread

GEN

Re: GEN

Mitch Morey <[log in to unmask]>

Wed, 26 Nov 1997 11:57:14 -0800

31 lines

Re: GEN

Gary Crowell Sr. <[log in to unmask]>

Wed, 26 Nov 1997 14:20:34 -0700

56 lines

Re: GEN

Charles Desroches <[log in to unmask]>

Wed, 26 Nov 1997 16:45:01 -0500

74 lines

New Thread

GEN: Liability

GEN: Liability

Tri-C Dave Roesler <[log in to unmask]>

Thu, 20 Nov 1997 15:41:27 -0600

38 lines

Re: GEN: Liability

William E. Johnson <[log in to unmask]>

Thu, 20 Nov 1997 14:18:59 -0800

23 lines

Re: GEN: Liability

Afri Singh <[log in to unmask]>

Fri, 21 Nov 1997 10:08:39 -0500

56 lines

New Thread

GEN: Used Equipment Reseller

GEN: Used Equipment Reseller

Tri-C Dave Roesler <[log in to unmask]>

Fri, 21 Nov 1997 11:08:23 -0600

28 lines

Re: GEN: Used Equipment Reseller

[log in to unmask]

Mon, 24 Nov 1997 17:41:09 -0500

25 lines

New Thread

Gold deposition: Electrolytic v/s Immersion - An

Re: Gold deposition: Electrolytic v/s Immersion - An

[log in to unmask]

Mon, 24 Nov 1997 15:54:02 -0800

23 lines

New Thread

Gold deposition: Electrolytic v/s Immersion - Any problem

Gold deposition: Electrolytic v/s Immersion - Any problem

Ken Patel <[log in to unmask]>

Mon, 24 Nov 1997 15:26:03 -0800

35 lines

Re: Gold deposition: Electrolytic v/s Immersion - Any problem

Lenny Kurup <[log in to unmask]>

Tue, 25 Nov 1997 15:19:02 -0500

66 lines

New Thread

Gold Thickness Measurement Error

Gold Thickness Measurement Error

Hans Rohr <[log in to unmask]>

Wed, 5 Nov 1997 20:36:44 -0500

49 lines

Re: Gold Thickness Measurement Error

Gerald G. Gagnon <[log in to unmask]>

Thu, 6 Nov 1997 09:20:50 -0500

100 lines

New Thread

Gold Tips Staining

Gold Tips Staining

tgyee <[log in to unmask]>

Fri, 21 Nov 1997 09:30:42 PST

31 lines

Re: Gold Tips Staining

Thomas M. Eshelman <[log in to unmask]>

Fri, 21 Nov 1997 17:17:02 -0500

62 lines

New Thread

goldman

Re: goldman

[log in to unmask]

Wed, 5 Nov 1997 21:01:59 -0500

20 lines

New Thread

Gullwing Leads Manufacturer

Re: Gullwing Leads Manufacturer

[log in to unmask]

Wed, 19 Nov 1997 22:09:25 -0500

38 lines

Re: Gullwing Leads Manufacturer

Evan Jones <[log in to unmask]>

Thu, 20 Nov 1997 00:44:36 -0500

61 lines

New Thread

Hardware

Hardware

John M LaFontaine <[log in to unmask]>

Thu, 20 Nov 1997 10:40:18 -0600

30 lines

Re: Hardware

Ralph Hersey <[log in to unmask]>

Thu, 20 Nov 1997 16:38:21 -0800

62 lines

New Thread

Help - Intrusive Reflow

Help - Intrusive Reflow

Luke B. Mendoza <[log in to unmask]>

Wed, 5 Nov 1997 10:04:13 +0800

32 lines

Re: Help - Intrusive Reflow

Lainie Loveless <[log in to unmask]>

Wed, 5 Nov 1997 10:12:02 -0600

73 lines

New Thread

High Temperature Soldering/Applications

High Temperature Soldering/Applications

Ed Holton <[log in to unmask]>

Fri, 21 Nov 1997 14:24:57 -0500

47 lines

New Thread

HOW DO I SET MY LIST TO DIGEST

HOW DO I SET MY LIST TO DIGEST

[log in to unmask]

Mon, 24 Nov 1997 12:44:14 -0500

25 lines

Re: HOW DO I SET MY LIST TO DIGEST

Dmitriy Sklyar <[log in to unmask]>

Mon, 24 Nov 1997 12:33:53 -0600

67 lines

New Thread

Immersion Gold

Immersion Gold

Baker,Kelly <[log in to unmask]>

Tue, 25 Nov 1997 06:28:54 -0500

26 lines

New Thread

info on MCM Design and Fabrication

info on MCM Design and Fabrication

Papanna Manjunatha <[log in to unmask]>

Wed, 12 Nov 1997 15:31:59 IST

38 lines

Re: info on MCM Design and Fabrication

[log in to unmask]

Thu, 13 Nov 1997 00:58:04 -0600

28 lines

New Thread

Intrusive Reflow

Intrusive Reflow

Peter Willaert <[log in to unmask]>

Thu, 20 Nov 1997 12:58:49 +0100

50 lines

New Thread

ion exchange

ion exchange

[log in to unmask]

Thu, 27 Nov 1997 08:22:57 -0500

26 lines

New Thread

IPC Printed Circuits Expo '98

IPC Printed Circuits Expo '98

Lisa Williams <[log in to unmask]>

Tue, 4 Nov 1997 09:37:04 -0600

471 lines

New Thread

IPC-6013 Flex PWB

IPC-6013 Flex PWB

George Franck <[log in to unmask]>

Tue, 4 Nov 1997 09:18:51 -0500

32 lines

Re: IPC-6013 Flex PWB

Mike Buetow <[log in to unmask]>

Tue, 4 Nov 1997 09:58:35 -0600

48 lines

New Thread

IPC-A-610 & Piezoelectric ceramic

IPC-A-610 & Piezoelectric ceramic

[log in to unmask]

Tue, 18 Nov 1997 12:48:12 -0700

30 lines

New Thread

IPCchat session announcement

IPCchat session announcement

[log in to unmask]

Mon, 3 Nov 1997 16:49:35 -0800

48 lines

IPCchat session announcement

[log in to unmask]

Mon, 3 Nov 1997 18:03:32 -0800

49 lines

IPCchat session announcement

[log in to unmask]

Thu, 20 Nov 1997 10:22:59 -0800

49 lines

IPCchat session announcement

Lee Yong-Sam <[log in to unmask]>

Fri, 21 Nov 1997 01:57:10 -0800

46 lines

IPCchat session announcement

[log in to unmask]

Sat, 22 Nov 1997 01:14:56 -0800

46 lines

New Thread

ITO conductive film

ITO conductive film

James Wallace Harmening Jr. <[log in to unmask]>

Tue, 25 Nov 1997 10:32:48 -0600

23 lines

Re: ITO conductive film

Joseph Fjelstad <[log in to unmask]>

Tue, 25 Nov 1997 09:04:46 -0800

48 lines

ITO conductive film

Thomas Jacob <[log in to unmask]>

Wed, 26 Nov 1997 09:07:12 +0100

39 lines

New Thread

J-Lead Mods

J-Lead Mods

Kane, Joseph <[log in to unmask]>

Mon, 17 Nov 1997 10:51:44 -0500

45 lines

Re: J-Lead Mods

Bob Vanech <[log in to unmask]>

Mon, 17 Nov 1997 13:31:58 -0500

40 lines

Re: J-Lead Mods

Max Bernhardt <[log in to unmask]>

Mon, 17 Nov 1997 13:16:00 -0600

23 lines

Re: J-Lead Mods

[log in to unmask]

Tue, 18 Nov 1997 18:39:11 -0500

57 lines

Re: J-Lead Mods

James P Carlson <[log in to unmask]>

Wed, 19 Nov 1997 07:44:22 -0600

30 lines

Re: J-Lead Mods

Evan Jones <[log in to unmask]>

Thu, 20 Nov 1997 00:35:33 -0500

61 lines

New Thread

J-leads

Re: J-leads

Guenter Grossmann <[log in to unmask]>

Tue, 18 Nov 1997 10:21:14 +0200

56 lines

New Thread

Job posting

Job posting

Richard G Smith <[log in to unmask]>

Mon, 10 Nov 1997 07:52:22 -0600

26 lines

New Thread

length of reflow oven

length of reflow oven

D. Terstegge <[log in to unmask]>

Wed, 12 Nov 1997 19:41:45 +0100

30 lines

Re: length of reflow oven

Charles Barker <[log in to unmask]>

Wed, 12 Nov 1997 13:17:09 -0600

46 lines

Re: length of reflow oven

[log in to unmask]

Wed, 12 Nov 1997 14:53:03 -0500

83 lines

Re: length of reflow oven

Jerry Cupples <[log in to unmask]>

Wed, 12 Nov 1997 13:50:10 -0600

57 lines

Re: length of reflow oven

Ken Patel <[log in to unmask]>

Wed, 12 Nov 1997 16:46:30 -0800

69 lines

Re: length of reflow oven

[log in to unmask]

Fri, 14 Nov 1997 12:39:26 -0500

100 lines

Re: length of reflow oven

D.C.Whalley <[log in to unmask]>

Mon, 17 Nov 1997 13:45:20 -0500

46 lines

New Thread

Liability

Re: Liability

Jack Olson <[log in to unmask]>

Fri, 21 Nov 1997 12:10:39 -0800

62 lines

Re: Liability

[log in to unmask]

Sat, 22 Nov 1997 20:11:37 -0500

35 lines

Re: Liability

William E. Johnson <[log in to unmask]>

Mon, 24 Nov 1997 09:35:28 -0800

14 lines

New Thread

Liability of products

Re: Liability of products

Ed Cosper <[log in to unmask]>

Fri, 21 Nov 1997 09:42:30 -0600

67 lines

Liability of Products

William E. Johnson <[log in to unmask]>

Fri, 21 Nov 1997 13:54:11 -0800

45 lines

Liability of products

Raymond Klein <[log in to unmask]>

Fri, 21 Nov 1997 14:27:21 -0800

33 lines

New Thread

Materials

Materials

Lisa Anderson <[log in to unmask]>

Thu, 6 Nov 1997 10:24:58 -0500

41 lines

New Thread

Maximum component height for IP-II

Maximum component height for IP-II

Lisa Anderson <[log in to unmask]>

Tue, 4 Nov 1997 16:38:43 -0500

24 lines

New Thread

Measuring Solder Thickness after HAL

Measuring Solder Thickness after HAL

MARK SIMMONS <[log in to unmask]>

Thu, 13 Nov 1997 07:32:50 -0800

50 lines

New Thread

Mechanical standoff

Mechanical standoff

COLLINS, GRAHAM <[log in to unmask]>

Mon, 3 Nov 1997 14:03:40 -0500

88 lines

Re: Mechanical standoff

Charles Barker <[log in to unmask]>

Tue, 4 Nov 1997 10:11:03 -0600

60 lines

Re: Mechanical standoff

Dan Stege <[log in to unmask]>

Tue, 4 Nov 1997 10:02:28 -0600

41 lines

Re: Mechanical standoff

John Laur <[log in to unmask]>

Tue, 4 Nov 1997 10:11:11 -0600

36 lines

Re: Mechanical standoff

Tom Hybiske <[log in to unmask]>

Tue, 4 Nov 1997 11:01:57 -0600

33 lines

Re: Mechanical standoff

Tucker, Steve (KS) <[log in to unmask]>

Wed, 5 Nov 1997 07:00:55 -0700

71 lines

New Thread

Meeting Announcement, SoCal98, Anaheim, 12May98

Meeting Announcement, SoCal98, Anaheim, 12May98

Bill Gaines B160 x2199 <[log in to unmask]>

Mon, 24 Nov 1997 07:18:58 -0800

45 lines

New Thread

Metals finishing

Metals finishing

tonghh <[log in to unmask]>

Tue, 11 Nov 1997 20:46:56 +0800

26 lines

Re: Metals finishing

Roger Mouton <[log in to unmask]>

Tue, 11 Nov 1997 09:32:24 -0500

21 lines

Re: Metals finishing

[log in to unmask]

Tue, 11 Nov 1997 17:11:43 -0500

26 lines

New Thread

Mouse Bites

Mouse Bites

sam mccorkel <[log in to unmask]>

Thu, 20 Nov 1997 12:23:39 -0500

28 lines

Re: Mouse Bites

[log in to unmask]

Thu, 20 Nov 1997 15:56:29 -0500

20 lines

Re: Mouse Bites

[log in to unmask]

Thu, 20 Nov 1997 16:01:32 -0500

32 lines

Re: Mouse Bites

John Nelson <[log in to unmask]>

Thu, 20 Nov 1997 16:12:26 -0500

61 lines

Re: Mouse Bites

Al Hamilton <[log in to unmask]>

Thu, 20 Nov 1997 16:09:47 -0500

23 lines

Re: Mouse Bites

Pratap Singh <[log in to unmask]>

Fri, 21 Nov 1997 21:29:00 -0800

31 lines

Re: Mouse Bites

[log in to unmask]

Fri, 21 Nov 1997 23:58:21 -0500

47 lines

New Thread

Mouse Bites -Reply

Re: Mouse Bites -Reply

Fred Johnson <[log in to unmask]>

Sun, 23 Nov 1997 00:23:38 +0000

67 lines

New Thread

Neurocam

Neurocam

[log in to unmask]

Sun, 9 Nov 1997 23:05:44 +0100

34 lines

New Thread

Off topic: Need a phone number

Off topic: Need a phone number

JoAnn Amerson <[log in to unmask]>

Thu, 20 Nov 1997 11:49:19 +0000

37 lines

New Thread

Other Forums

Re: Other Forums

Dan Brandler <[log in to unmask]>

Thu, 20 Nov 1997 10:14:50 -0800

28 lines

New Thread

PAC glass

PAC glass

Sid Tryzbiak <[log in to unmask]>

Fri, 7 Nov 1997 10:16:58 -0500

61 lines

New Thread

Paste Inspection

Paste Inspection

Natalie Sharp <[log in to unmask]>

Fri, 7 Nov 1997 13:04:20 -0400

41 lines

New Thread

PC-Board mech. Specification

PC-Board mech. Specification

Rolf Buchholz <[log in to unmask]>

Tue, 4 Nov 1997 02:41:16 -0500

28 lines

Re: PC-Board mech. Specification

John Laur <[log in to unmask]>

Tue, 4 Nov 1997 07:43:58 -0600

41 lines

New Thread

PCB'S

PCB'S

[log in to unmask]

Fri, 28 Nov 1997 04:12:21 -0500

25 lines

Re: PCB'S

Bev Christian <[log in to unmask]>

Fri, 28 Nov 1997 08:17:21 -0500

55 lines

Re: PCB'S

David Arivett <[log in to unmask]>

Fri, 28 Nov 1997 08:33:07 -0600

62 lines

New Thread

PCMCIA INFO

Re: PCMCIA INFO

Robert Downing <[log in to unmask]>

Sun, 9 Nov 1997 11:44:18 PST

92 lines

New Thread

Peelable mask

Peelable mask

Yuen, Mike <[log in to unmask]>

Thu, 13 Nov 1997 08:15:00 CST

27 lines

New Thread

Personal Req

Re: Personal Req

Terry Zhu <[log in to unmask]>

Fri, 21 Nov 1997 16:47:14 -0800

27 lines

New Thread

Personnel Requirements

Personnel Requirements

Dick Desrosiers <[log in to unmask]>

Wed, 19 Nov 1997 14:53:12 EST

39 lines

Re: Personnel Requirements

Jack Crawford <[log in to unmask]>

Wed, 19 Nov 1997 14:31:07 -0600

60 lines

Re: Personnel Requirements

Terry Zhu <[log in to unmask]>

Wed, 19 Nov 1997 20:14:55 -0800

71 lines

Personnel Requirements

Evan Jones <[log in to unmask]>

Thu, 20 Nov 1997 00:22:39 -0500

61 lines

Re: Personnel Requirements

Evan Jones <[log in to unmask]>

Thu, 20 Nov 1997 00:56:57 -0500

61 lines

New Thread

PIN-THROUGH PASTE PROCESS

PIN-THROUGH PASTE PROCESS

RAYMOND YONG <[log in to unmask]>

Thu, 6 Nov 1997 17:51:16 +0700

34 lines

Re: PIN-THROUGH PASTE PROCESS

Jack Crawford <[log in to unmask]>

Thu, 6 Nov 1997 11:50:26 -0600

59 lines

New Thread

Plating integrity in small vias

Plating integrity in small vias

Bogdan Gaby <[log in to unmask]>

Mon, 24 Nov 1997 16:11:02 -0800

36 lines

Re: Plating integrity in small vias

Joseph Duclos <[log in to unmask]>

Mon, 24 Nov 1997 09:41:48 -0500

70 lines

Re: Plating integrity in small vias

peter dahlen <[log in to unmask]>

Mon, 24 Nov 1997 15:54:33 +0000

64 lines

Re: Plating integrity in small vias

Paul Gould <[log in to unmask]>

Mon, 24 Nov 1997 20:12:20 +0000

43 lines

Re: Plating integrity in small vias

[log in to unmask]

Mon, 24 Nov 1997 21:20:03 -0500

45 lines

Re: Plating integrity in small vias

Gregg Klawson <[log in to unmask]>

Mon, 24 Nov 1997 21:32:48 -0500

35 lines

Re: Plating integrity in small vias

Gabriela Bogdan <[log in to unmask]>

Tue, 25 Nov 1997 08:20:50 +0000

90 lines

Re: Plating integrity in small vias

[log in to unmask]

Tue, 25 Nov 1997 12:23:36 -0500

33 lines

Re: Plating integrity in small vias

[log in to unmask]

Tue, 25 Nov 1997 12:23:34 -0500

34 lines

Re: Plating integrity in small vias

[log in to unmask] <[log in to unmask]>

Tue, 25 Nov 1997 21:15:34 -0800

28 lines

Re: Plating integrity in small vias

Leslie O. Connally <[log in to unmask]>

Tue, 25 Nov 1997 17:13:33 -0800

134 lines

Re: Plating integrity in small vias

[log in to unmask]

Wed, 26 Nov 1997 00:24:21 -0500

33 lines

Re: Plating integrity in small vias

[log in to unmask]

Wed, 26 Nov 1997 00:24:24 -0500

32 lines

Re: Plating integrity in small vias

Bogdan Gaby <[log in to unmask]>

Wed, 26 Nov 1997 16:42:04 -0800

53 lines

Re: Plating integrity in small vias

Peter Blokhuis <[log in to unmask]>

Wed, 26 Nov 1997 16:18:30 -0500

23 lines

Re: Plating integrity in small vias

[log in to unmask] <[log in to unmask]>

Wed, 26 Nov 1997 22:21:18 -0800

38 lines

New Thread

Plating vibrators

Plating vibrators

sam mccorkel <[log in to unmask]>

Fri, 21 Nov 1997 11:16:27 -0500

22 lines

Re: Plating vibrators

Goldman, Patricia J. <[log in to unmask]>

Fri, 21 Nov 1997 14:52:00 PST

19 lines

Re: Plating vibrators

[log in to unmask]

Fri, 21 Nov 1997 21:05:45 -0500

36 lines

Re: Plating vibrators

Leslie O. Connally <[log in to unmask]>

Fri, 21 Nov 1997 14:47:11 -0800

145 lines

Re: Plating vibrators

Lenny Kurup <[log in to unmask]>

Fri, 21 Nov 1997 15:00:35 -0500

40 lines

Re: Plating vibrators

Russell S Gregory <[log in to unmask]>

Fri, 21 Nov 1997 17:11:42 -0500

21 lines

Re: Plating vibrators

Fritz Steiner <[log in to unmask]>

Tue, 25 Nov 1997 08:03:34 +0100

32 lines

New Thread

Please take me off the list

Please take me off the list

KARLA DUGGAN <[log in to unmask]>

Tue, 25 Nov 1997 11:33:05 -0600

23 lines

New Thread

Printed wiring board Data standards

Printed wiring board Data standards

Corey A Peterson <[log in to unmask]>

Fri, 28 Nov 1997 10:10:03 -0600

39 lines

New Thread

PTFE bonding

PTFE bonding

peter dahlen <[log in to unmask]>

Wed, 26 Nov 1997 14:47:21 +0000

57 lines

New Thread

PTFE bonding -Reply

PTFE bonding -Reply

Fred Johnson <[log in to unmask]>

Wed, 26 Nov 1997 17:20:11 +0000

98 lines

New Thread

PTFE Multilayer

PTFE Multilayer

peter dahlen <[log in to unmask]>

Mon, 24 Nov 1997 15:39:14 +0000

70 lines

PTFE Multilayer

[log in to unmask]

Mon, 24 Nov 1997 16:58:09 +0100

41 lines

Re: PTFE Multilayer

Alan Cochrane <[log in to unmask]>

Mon, 24 Nov 1997 14:55:20 -0800

33 lines

Re: PTFE Multilayer

Arturo J. Aguayo <[log in to unmask]>

Tue, 25 Nov 1997 13:53:28 -0700

111 lines

New Thread

Pull Strength

Pull Strength

Gavin Chau <[log in to unmask]>

Wed, 26 Nov 1997 17:27:41 +0800

32 lines

Re: Pull Strength

[log in to unmask]

Wed, 26 Nov 1997 21:02:23 -0500

39 lines

New Thread

Pulse Rectification

Pulse Rectification

George Bokisa <[log in to unmask]>

Tue, 4 Nov 1997 15:06:21 -0800

23 lines

Re: Pulse Rectification

Afri Singh <[log in to unmask]>

Tue, 4 Nov 1997 19:06:02 -0500

42 lines

Re: Pulse Rectification

NCPPaul @[log in to unmask] <[log in to unmask]>

Wed, 5 Nov 1997 10:26:50 -0500

26 lines

Re: Pulse Rectification

Robert Welch <[log in to unmask]>

Wed, 5 Nov 1997 16:27:48 +0000

31 lines

Re: Pulse Rectification

[log in to unmask] <[log in to unmask]>

Wed, 5 Nov 1997 21:31:39 -0800

32 lines

Re: Pulse Rectification

David Anderson <[log in to unmask]>

Wed, 5 Nov 1997 18:42:40 -0600

46 lines

Re: Pulse Rectification

[log in to unmask]

Wed, 5 Nov 1997 20:06:09 -0500

26 lines

Re: Pulse Rectification

Don Vischulis <[log in to unmask]>

Fri, 7 Nov 1997 20:07:06 -0600

46 lines

New Thread

Re [TN] Blow holes

Re [TN] Blow holes

Guenter Grossmann <[log in to unmask]>

Fri, 21 Nov 1997 09:40:06 +0200

39 lines

New Thread

Re [TN] SOLID SOLDER DEPOSIT TECH.

Re [TN] SOLID SOLDER DEPOSIT TECH.

Guenter Grossmann <[log in to unmask]>

Mon, 10 Nov 1997 15:07:47 +0200

43 lines

Re: Re [TN] SOLID SOLDER DEPOSIT TECH.

Fulton Feng <[log in to unmask]>

Mon, 10 Nov 1997 19:54:18 -0500

90 lines

New Thread

Reference planes in microstrip

Re: Reference planes in microstrip

Raymond Klein <[log in to unmask]>

Wed, 26 Nov 1997 16:16:41 -0800

30 lines

New Thread

Reference planes in microstrip?

Reference planes in microstrip?

Andreas Olofsson <[log in to unmask]>

Wed, 26 Nov 1997 17:49:18 -0600

35 lines

New Thread

Reflow problem

Reflow problem

JOHN OSULLIVAN <[log in to unmask]>

Fri, 7 Nov 1997 08:01:09 -0400

47 lines

New Thread

Reliability information request

Reliability information request

Landes, Jeff <[log in to unmask]>

Tue, 11 Nov 1997 15:13:00 PST

33 lines

Re: Reliability information request

[log in to unmask]

Wed, 12 Nov 1997 00:06:08 -0500

41 lines

New Thread

Reliability of BGA

Reliability of BGA

D. Terstegge <[log in to unmask]>

Wed, 12 Nov 1997 20:01:20 +0100

30 lines

Re: Reliability of BGA

[log in to unmask]

Wed, 12 Nov 1997 21:32:15 -0500

43 lines

Re: Reliability of BGA

Guenter Grossmann <[log in to unmask]>

Thu, 13 Nov 1997 10:08:55 +0200

40 lines

Re: Reliability of BGA

Michael Jeremias <[log in to unmask]>

Thu, 13 Nov 1997 13:57:56 -0800

52 lines

Re: Reliability of BGA

Michael Jeremias <[log in to unmask]>

Thu, 13 Nov 1997 14:14:03 -0800

54 lines

Re: Reliability of BGA

Guenter Grossmann <[log in to unmask]>

Thu, 20 Nov 1997 09:58:00 +0200

49 lines

New Thread

Research paper

Research paper

Valladares, Hector A (FL51) <[log in to unmask]>

Wed, 12 Nov 1997 14:51:04 -0500

26 lines

New Thread

Resin Starvation

Resin Starvation

QUALITY <[log in to unmask]>

Tue, 4 Nov 1997 15:25:57 +0200

29 lines

Resin Starvation

QUALITY <[log in to unmask]>

Sun, 9 Nov 1997 10:46:56 +0200

30 lines

Re: Resin Starvation

Phillip E. Hinton <[log in to unmask]>

Sun, 9 Nov 1997 21:02:12 -0500

35 lines

Re: Resin Starvation

[log in to unmask]

Mon, 10 Nov 1997 08:52:51 -0500

42 lines

New Thread

Resist removal from tooling holes

Re: Resist removal from tooling holes

[log in to unmask]

Mon, 3 Nov 1997 16:09:57 PST8

21 lines

New Thread

Responses Needed Please!!Nitrogen use w/ BGA reflow

Responses Needed Please!!Nitrogen use w/ BGA reflow

Douglas H. Bennett <[log in to unmask]>

Mon, 3 Nov 1997 08:39:56 -0800

36 lines

Re: Responses Needed Please!!Nitrogen use w/ BGA reflow

Graham Naisbitt <[log in to unmask]>

Tue, 4 Nov 1997 00:04:11 UT

73 lines

Re: Responses Needed Please!!Nitrogen use w/ BGA reflow

John Guy <[log in to unmask]>

Tue, 4 Nov 1997 07:37:42 -0500

126 lines

New Thread

Re[2]: [TN] Liability of products

Re: Re[2]: [TN] Liability of products

Jerome Sallo <[log in to unmask]>

Fri, 21 Nov 1997 18:17:43 -0500

29 lines

New Thread

Re[3]: [TN] DES: Guard rings

Re: Re[3]: [TN] DES: Guard rings

Jeff Seeger <[log in to unmask]>

Tue, 4 Nov 1997 13:59:39 -0500

83 lines

New Thread

rogers 4003 material

rogers 4003 material

Tenison Stone <[log in to unmask]>

Tue, 18 Nov 1997 13:51:59 -0500

25 lines

Re: rogers 4003 material

Leon Snowdon <[log in to unmask]>

Wed, 19 Nov 1997 11:09:56 +0000

33 lines

Re: rogers 4003 material

Steves <[log in to unmask]>

Wed, 19 Nov 1997 10:40:15 +0000

28 lines

Re: rogers 4003 material

Evan Jones <[log in to unmask]>

Thu, 20 Nov 1997 01:03:06 -0500

61 lines

New Thread

Rogers RO-4003 Material

Rogers RO-4003 Material

Fred Paul <[log in to unmask]>

Wed, 19 Nov 1997 07:51:25 -0800

39 lines

Rogers RO-4003 Material

Evan Jones <[log in to unmask]>

Thu, 20 Nov 1997 01:07:23 -0500

61 lines

New Thread

Rogers TMM

Rogers TMM

[log in to unmask]

Thu, 20 Nov 1997 12:33:10 +0100

31 lines

Re: Rogers TMM

Sheila Smith <[log in to unmask]>

Thu, 20 Nov 1997 10:22:21 -0500

56 lines

Re: Rogers TMM

Arturo J. Aguayo <[log in to unmask]>

Thu, 20 Nov 1997 14:30:58 -0700

62 lines

Re: Rogers TMM

john balchunas <[log in to unmask]>

Fri, 21 Nov 1997 07:33:47 -0500

30 lines

New Thread

Roku-Roku Sangyo, Ltd.

Roku-Roku Sangyo, Ltd.

William E. Johnson <[log in to unmask]>

Fri, 21 Nov 1997 14:22:12 -0800

21 lines

New Thread

RV:

RV:

Circuitos Impresos Profesionales S.A. <[log in to unmask]>

Fri, 14 Nov 1997 12:19:09 +0100

49 lines

Re: RV:

Per Viklund <[log in to unmask]>

Fri, 14 Nov 1997 12:51:25 +0100

47 lines

Re: RV:

CIDEIN S.L. <[log in to unmask]>

Mon, 17 Nov 1997 12:51:13 +0100

70 lines

New Thread

RV: another hoax; PLEASE NOBODY ELSE REPLY

Re: RV: another hoax; PLEASE NOBODY ELSE REPLY

Jack Crawford <[log in to unmask]>

Fri, 14 Nov 1997 11:26:29 -0600

142 lines

New Thread

sales products

sales products

fxr <[log in to unmask]>

Sun, 9 Nov 1997 21:11:27 +0800

117 lines

New Thread

Sealing Vias

Sealing Vias

[log in to unmask]

Tue, 11 Nov 1997 17:41:20 EST

35 lines

Re: Sealing Vias

Tovey, Roxanne L <[log in to unmask]>

Tue, 11 Nov 1997 15:08:58 -0800

66 lines

Re: Sealing Vias

Chan, Marcelo <[log in to unmask]>

Tue, 11 Nov 1997 18:22:55 -0500

74 lines

Re: Sealing Vias

[log in to unmask]

Tue, 11 Nov 1997 19:14:23 -0500

38 lines

Re: Sealing Vias

Dejan <dejen@[199.182.97.5]>

Tue, 11 Nov 1997 16:04:10 -0700

29 lines

Re: Sealing Vias

[log in to unmask]

Tue, 11 Nov 1997 22:26:15 -0500

30 lines

Re: Sealing Vias

Erika Pacheco <[log in to unmask]>

Tue, 11 Nov 1997 23:18:06 -0500

54 lines

Re: Sealing Vias

[log in to unmask]

Wed, 12 Nov 1997 09:04:08 EST

60 lines

Re: Sealing Vias

Graham Naisbitt <[log in to unmask]>

Thu, 13 Nov 1997 17:13:30 UT

97 lines

New Thread

Sealing Vias -Reply

Sealing Vias -Reply

Ron Hayashi <[log in to unmask]>

Tue, 11 Nov 1997 15:22:56 -0800

25 lines

Re: Sealing Vias -Reply

Ron Hayashi <[log in to unmask]>

Tue, 11 Nov 1997 15:23:49 -0800

22 lines

Sealing Vias -Reply

Larry Campbell <[log in to unmask]>

Wed, 12 Nov 1997 08:18:13 -0500

73 lines

Re: Sealing Vias -Reply

Larry Campbell <[log in to unmask]>

Wed, 12 Nov 1997 08:18:56 -0500

100 lines

Re: Sealing Vias -Reply

Larry Campbell <[log in to unmask]>

Wed, 12 Nov 1997 08:28:47 -0500

70 lines

New Thread

Shelf life requirements

Shelf life requirements

Baker,Kelly <[log in to unmask]>

Tue, 18 Nov 1997 16:05:36 -0500

28 lines

Re: Shelf life requirements

Aaron AB Bundy <[log in to unmask]>

Tue, 18 Nov 1997 14:56:43 -0700

21 lines

Shelf life requirements

Baker,Kelly <[log in to unmask]>

Wed, 19 Nov 1997 07:16:09 -0500

26 lines

New Thread

SHORTS CIRCUIT DURING WAVE

SHORTS CIRCUIT DURING WAVE

Tamir Ben-Shoshan <[log in to unmask]>

Wed, 5 Nov 1997 16:36:36 +0200

29 lines

Re: SHORTS CIRCUIT DURING WAVE

john maxwell <[log in to unmask]>

Wed, 5 Nov 1997 12:24:42 -0700

47 lines

New Thread

Signal Integrity Analysis

Signal Integrity Analysis

Ken Patel <[log in to unmask]>

Mon, 3 Nov 1997 11:00:55 -0800

32 lines

Re: Signal Integrity Analysis

Doug McKean <[log in to unmask]>

Mon, 3 Nov 1997 14:23:12 -0500

85 lines

Re: Signal Integrity Analysis

Gary Crowell Sr. <[log in to unmask]>

Mon, 3 Nov 1997 14:27:18 -0700

43 lines

Re: Signal Integrity Analysis

Jerry Cupples <[log in to unmask]>

Mon, 3 Nov 1997 16:05:33 -0600

64 lines

Re: Signal Integrity Analysis

Ken Patel <[log in to unmask]>

Mon, 3 Nov 1997 14:42:52 -0800

54 lines

New Thread

Silver chromate paper and copper mirror source

Silver chromate paper and copper mirror source

Marianne Romansky <[log in to unmask]>

Thu, 20 Nov 1997 16:31:47 EST

32 lines

New Thread

Silver Dendrites

Silver Dendrites

Steve <[log in to unmask]>

Fri, 7 Nov 1997 09:48:17 -0800

56 lines

Re: Silver Dendrites

CSS Asia Co., Ltd. <[log in to unmask]>

Sat, 8 Nov 1997 18:05:57 +0900

76 lines

Re: Silver Dendrites

Ralph Hersey <[log in to unmask]>

Sat, 8 Nov 1997 16:31:26 -0800

94 lines

Re: Silver Dendrites

Ulrich Korndoerfer <[log in to unmask]>

Sun, 9 Nov 1997 01:50:55 +0100

61 lines

New Thread

SIR Test Cabling

SIR Test Cabling

Graham Naisbitt <[log in to unmask]>

Thu, 20 Nov 1997 15:51:58 UT

36 lines

Re: SIR Test Cabling

Mike Barmuta <[log in to unmask]>

Thu, 20 Nov 1997 10:16:57 -0800

10 lines

Re: SIR Test Cabling

Karen Tellefsen <[log in to unmask]>

Thu, 20 Nov 1997 21:00:05 -0800

58 lines

New Thread

SMT and Chip assembly on Flexible PCB's

SMT and Chip assembly on Flexible PCB's

Manor Itzhak <[log in to unmask]>

Mon, 24 Nov 1997 10:42:18 +0200

35 lines

New Thread

SMT Component Height Restrictions

SMT Component Height Restrictions

Lisa Anderson <[log in to unmask]>

Wed, 19 Nov 1997 14:04:14 -0500

28 lines

SMT Component Height Restrictions

Evan Jones <[log in to unmask]>

Thu, 20 Nov 1997 00:27:21 -0500

61 lines

New Thread

Solder balls on SMT assy

Solder balls on SMT assy

Larry Morse <[log in to unmask]>

Sun, 9 Mar 1997 19:09:05 -0800

52 lines

New Thread

Solder paste inspection

Solder paste inspection

Gary Gartley <[log in to unmask]>

Mon, 17 Nov 1997 15:43:06 -0500

42 lines

Re: Solder paste inspection

Greg Parke <[log in to unmask]>

Mon, 17 Nov 1997 16:36:45 -0500

44 lines

New Thread

Solder paste inspection and incoming QC

Solder paste inspection and incoming QC

John Y. Xie <[log in to unmask]>

Mon, 17 Nov 1997 18:07:58 -0800

34 lines

New Thread

Solder paste inspection and incoming QC -Reply

Solder paste inspection and incoming QC -Reply

SOKKHON OU <[log in to unmask]>

Tue, 25 Nov 1997 12:29:46 -0600

24 lines

New Thread

Solderability

Solderability

Don Vischulis <[log in to unmask]>

Thu, 27 Nov 1997 08:09:33 -0600

52 lines

New Thread

SOLID SOLDER DEPOSIT TECH.

SOLID SOLDER DEPOSIT TECH.

Tamir Ben-Shoshan <[log in to unmask]>

Mon, 10 Nov 1997 13:37:41 +0200

28 lines

New Thread

SOT23 problems

SOT23 problems

KARLA DUGGAN <[log in to unmask]>

Wed, 12 Nov 1997 10:00:36 -0600

38 lines

Re: SOT23 problems

George H. Patrick, III <[log in to unmask]>

Wed, 12 Nov 1997 10:34:35 -0800

65 lines

Re: SOT23 problems

D. Terstegge <[log in to unmask]>

Wed, 12 Nov 1997 20:13:57 +0100

47 lines

Re: SOT23 problems

Charles Barker <[log in to unmask]>

Wed, 12 Nov 1997 13:26:46 -0600

88 lines

Re: SOT23 problems

[log in to unmask]

Wed, 12 Nov 1997 14:51:53 -0500

87 lines

Re: SOT23 problems

George H. Patrick, III <[log in to unmask]>

Wed, 12 Nov 1997 12:31:51 -0800

55 lines

Re: SOT23 problems

[log in to unmask]

Wed, 12 Nov 1997 15:48:26 -0500

78 lines

Re: SOT23 problems

JoAnn Amerson <[log in to unmask]>

Wed, 12 Nov 1997 16:03:25 +0000

38 lines

Re: SOT23 problems

[log in to unmask]

Wed, 12 Nov 1997 20:10:58 -0500

50 lines

Re: SOT23 problems

[log in to unmask]

Wed, 12 Nov 1997 21:28:47 -0500

39 lines

Re: SOT23 problems

Bev Christian <[log in to unmask]>

Mon, 17 Nov 1997 16:59:09 -0500

67 lines

New Thread

SOT23 problems - leadframe alloy

Re: SOT23 problems - leadframe alloy

Oliver Kierse <[log in to unmask]>

Mon, 17 Nov 1997 10:02:20 GMT

32 lines

New Thread

SOT23 problems -Reply

Re: SOT23 problems -Reply

KARLA DUGGAN <[log in to unmask]>

Wed, 12 Nov 1997 14:28:05 -0600

62 lines

Re: SOT23 problems -Reply

Charles Barker <[log in to unmask]>

Thu, 13 Nov 1997 08:58:33 -0600

106 lines

New Thread

Source for MIL-I-46058 Y Pattern Coupons

Source for MIL-I-46058 Y Pattern Coupons

Davis, Mary <[log in to unmask]>

Wed, 26 Nov 1997 13:42:48 -0800

26 lines

Re: Source for MIL-I-46058 Y Pattern Coupons

Graham Naisbitt <[log in to unmask]>

Wed, 26 Nov 1997 23:38:26 UT

63 lines

New Thread

Source for RF Tuning Pads, Tabs, Confetti

Source for RF Tuning Pads, Tabs, Confetti

Warren Szkolnicki <[log in to unmask]>

Mon, 24 Nov 1997 15:59:32 -0600

45 lines

New Thread

Source for Silver Paste for PCB Repairing

Source for Silver Paste for PCB Repairing

BPL Ltd. <[log in to unmask]>

Sat, 29 Nov 1997 11:09:18 +0530

40 lines

New Thread

SpeedBoard

SpeedBoard

[log in to unmask]

Mon, 24 Nov 1997 10:35:36 -0800

33 lines

Re: SpeedBoard

PAUL OLSON <[log in to unmask]>

Tue, 25 Nov 1997 22:51:15 -0600

72 lines

New Thread

Stencil Control Procedure

Stencil Control Procedure

[log in to unmask]

Tue, 4 Nov 1997 09:18:18 PST

36 lines

New Thread

subscribe

subscribe

[log in to unmask]

Mon, 1 Jan 1996 22:01:00 +-800

19 lines

Subscribe

[log in to unmask]

Wed, 5 Nov 1997 17:46:02 -0800

31 lines

subscribe

Joe Hughes <[log in to unmask]>

Mon, 10 Nov 1997 12:46:07 -0800

19 lines

subscribe

[log in to unmask]

Tue, 18 Nov 1997 15:43:33 -0500

25 lines

New Thread

Surface Tension in Electroplating solution.

Surface Tension in Electroplating solution.

Charles Desroches <[log in to unmask]>

Thu, 27 Nov 1997 14:45:57 -0500

46 lines

New Thread

SV: [TN] Mouse Bites -Reply

SV: [TN] Mouse Bites -Reply

Jan Thuesen <[log in to unmask]>

Tue, 25 Nov 1997 12:11:04 +0100

190 lines

New Thread

TechNet Digest - 12 Nov 1997 to 13 Nov 1997

Re: TechNet Digest - 12 Nov 1997 to 13 Nov 1997

[log in to unmask]

Fri, 14 Nov 1997 19:37:09 -0500

24 lines

New Thread

Teflon replacement

Teflon replacement

Lepsche, Thomas G (NM75) <[log in to unmask]>

Wed, 5 Nov 1997 10:11:02 -0700

30 lines

Re: Teflon replacement

Bev Christian <[log in to unmask]>

Wed, 5 Nov 1997 13:06:59 -0500

63 lines

Re: Teflon replacement

Jerome Sallo <[log in to unmask]>

Wed, 5 Nov 1997 13:17:36 -0500

27 lines

Re: Teflon replacement

Sheila Smith <[log in to unmask]>

Wed, 5 Nov 1997 13:37:38 -0500

84 lines

New Thread

Tempe

Tempe

Bob Vanech <[log in to unmask]>

Tue, 4 Nov 1997 11:11:00 -0500

31 lines

New Thread

Temperature Profiler Questions

Temperature Profiler Questions

Dennis Patrick Ishler <[log in to unmask]>

Sat, 1 Nov 1997 20:40:15 -0700

50 lines

Temperature Profiler Questions

Dennis Patrick Ishler <[log in to unmask]>

Sat, 1 Nov 1997 20:39:59 -0700

62 lines

Re: Temperature Profiler Questions

Erik C. Olson <[log in to unmask]>

Wed, 5 Nov 1997 09:00:02 -0600

98 lines

Re: Temperature Profiler Questions

Charles Barker <[log in to unmask]>

Wed, 5 Nov 1997 09:48:12 -0600

67 lines

New Thread

TH part solderability concerns

TH part solderability concerns

Benjamin A Guthrie <[log in to unmask]>

Fri, 24 Oct 1997 10:12:58 -0500

26 lines

New Thread

Thermal Cycle Tester

Thermal Cycle Tester

Heribert Streup <[log in to unmask]>

Wed, 26 Nov 1997 01:23:56 -0500

29 lines

New Thread

Thiourea free alkaline etchant

Thiourea free alkaline etchant

Steves <[log in to unmask]>

Mon, 3 Nov 1997 12:48:51 +0000

26 lines

New Thread

tin/lead plating

tin/lead plating

Aric J Parr <[log in to unmask]>

Wed, 5 Nov 1997 14:50:15 -0500

33 lines

Re: tin/lead plating

Phillip E. Hinton <[log in to unmask]>

Thu, 6 Nov 1997 01:47:23 -0500

26 lines

New Thread

tin/lead plating -Reply

tin/lead plating -Reply

Fred Johnson <[log in to unmask]>

Wed, 5 Nov 1997 20:53:18 +0000

60 lines

New Thread

Tip Soldering

Tip Soldering

Sosa, Lourdes <[log in to unmask]>

Sat, 1 Nov 1997 12:57:44 -0500

34 lines

New Thread

TN] BGA Mailing List

TN] BGA Mailing List

Roberto Torres <[log in to unmask]>

Sun, 9 Nov 1997 10:09:56 -0800

22 lines

New Thread

tombstoning

tombstoning

Tenison Stone <[log in to unmask]>

Mon, 24 Nov 1997 14:40:38 -0500

30 lines

Re: tombstoning

[log in to unmask]

Mon, 24 Nov 1997 21:20:06 -0500

33 lines

Re: tombstoning

John Maxwell <[log in to unmask]>

Mon, 24 Nov 1997 20:48:09 -0600

28 lines

Re: tombstoning

John Guy <[log in to unmask]>

Tue, 25 Nov 1997 08:13:20 -0500

75 lines

Re: tombstoning

Fulton Feng <[log in to unmask]>

Tue, 25 Nov 1997 12:25:12 -0500

63 lines

Re: tombstoning

Yuen, Mike <[log in to unmask]>

Tue, 25 Nov 1997 15:42:00 CST

28 lines

New Thread

tooling pins

tooling pins

drilbert <[log in to unmask]>

Wed, 19 Nov 1997 20:41:50 -0800

26 lines

Re: tooling pins

Doug Jeffery <[log in to unmask]>

Sat, 22 Nov 1997 18:47:03 -0600

47 lines

New Thread

totally reflow

totally reflow

Jim Mathis <[log in to unmask]>

Sat, 8 Nov 1997 08:37:19 -0500

26 lines

New Thread

Trace Width calculations

Trace Width calculations

Clint Cote <[log in to unmask]>

Wed, 12 Nov 1997 10:22:59 -0500

34 lines

Re: Trace Width calculations

Ralph Hersey <[log in to unmask]>

Wed, 12 Nov 1997 10:10:32 -0800

65 lines

New Thread

TSOP, TQFP reliability

TSOP, TQFP reliability

SVEBA <[log in to unmask]>

Thu, 27 Nov 1997 15:38:59 +0100

31 lines

Re: TSOP, TQFP reliability

Bev Christian <[log in to unmask]>

Thu, 27 Nov 1997 21:13:57 -0500

81 lines

Re: TSOP, TQFP reliability

[log in to unmask]

Fri, 28 Nov 1997 08:32:05 -0500

36 lines

Re: TSOP, TQFP reliability

Joseph Fjelstad <[log in to unmask]>

Fri, 28 Nov 1997 13:23:43 -0800

70 lines

Re: TSOP, TQFP reliability

Achim Neu <[log in to unmask]>

Sat, 29 Nov 1997 13:52:00 +0100

110 lines

New Thread

Underfill voiding in flip chips

Underfill voiding in flip chips

Nitin Juneja <[log in to unmask]>

Mon, 17 Nov 1997 16:52:14 EST

34 lines

New Thread

unsubscribe

unsubscribe

John Portoghese <[log in to unmask]>

Wed, 26 Nov 1997 07:09:00 PST

19 lines

New Thread

Unsubscrivbe help needed...

Unsubscrivbe help needed...

Lang, Michael <[log in to unmask]>

Tue, 18 Nov 1997 12:58:41 -0500

26 lines

Re: Unsubscrivbe help needed...

Jana Carraway <[log in to unmask]>

Tue, 18 Nov 1997 10:45:47 PST

64 lines

New Thread

Use half empty solder paste jar next day?

Use half empty solder paste jar next day?

Ken Patel <[log in to unmask]>

Wed, 26 Nov 1997 16:57:12 -0800

38 lines

New Thread

Via in Pad

Via in Pad

Eddie Brunker <[log in to unmask]>

Tue, 25 Nov 1997 10:14:34 GMT

44 lines

Re: Via in Pad

Steve Hawn <[log in to unmask]>

Tue, 25 Nov 1997 08:55:34 -0800

43 lines

New Thread

Via in Pad for BGA

Via in Pad for BGA

Charles Elliott <[log in to unmask]>

Mon, 24 Nov 1997 08:24:44 -0500

36 lines

Re: Via in Pad for BGA

Alan Cochrane <[log in to unmask]>

Mon, 24 Nov 1997 17:40:01 -0800

34 lines

Re: Via in Pad for BGA

David Hoover <[log in to unmask]>

Mon, 24 Nov 1997 18:41:28 -0800

38 lines

New Thread

Voids in Eutectic BGA joints

Voids in Eutectic BGA joints

[log in to unmask]

Tue, 11 Nov 1997 21:56:09 +0000

30 lines

Re: Voids in Eutectic BGA joints

[log in to unmask]

Wed, 12 Nov 1997 00:15:25 -0500

33 lines

Re: Voids in Eutectic BGA joints

Bev Christian <[log in to unmask]>

Mon, 17 Nov 1997 16:42:50 -0500

63 lines

New Thread

Voltage requirement of Bare Board Testing

Voltage requirement of Bare Board Testing

Janardhan Rao <[log in to unmask]>

Tue, 18 Nov 1997 13:03:24 +0530

36 lines

Re: Voltage requirement of Bare Board Testing

Donald M. Hague <[log in to unmask]>

Tue, 18 Nov 1997 14:19:19 -0500

30 lines

Re: Voltage requirement of Bare Board Testing

[log in to unmask]

Tue, 18 Nov 1997 18:19:18 -0500

28 lines

New Thread

Wavesolder

Re: Wavesolder

Ron Hollandsworth <[log in to unmask]>

Wed, 12 Nov 1997 11:21:22 -0500

61 lines

New Thread

What parameters do other companies use when

Re: What parameters do other companies use when

Doug Pauls <[log in to unmask]>

Fri, 7 Nov 1997 08:09:51 -0500

54 lines

New Thread

Whitehouse Machine Tools

Whitehouse Machine Tools

William E. Johnson <[log in to unmask]>

Sat, 15 Nov 1997 11:51:52 -0800

21 lines

New Thread

WIRE WRAPS

WIRE WRAPS

Ellen Berkman <[log in to unmask]>

Wed, 12 Nov 1997 11:48:43 -0800

46 lines

Re: WIRE WRAPS

Jerry Cupples <[log in to unmask]>

Wed, 12 Nov 1997 10:04:38 -0600

103 lines

New Thread

your mail

Re: your mail

Scott Decker <[log in to unmask]>

Wed, 26 Nov 1997 11:26:25 -0800

74 lines

New Thread

[AS] What parameters do other companies use when evaluating the e ffectiveness of Assembly houses builds