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November 1997


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Table of Contents:

回覆 : [TN] Des: Mentor area fill problem (1 message)
"rolled solder" (4 messages)
(ADMIN) TechNet Server Unavailable for 39 Hours (1 message)
(TN): ASSY: Good Joint (3 messages)
(TN): ASSY: Reliability study for copper vs alooy 42 lead frame (1 message)
110v air gap (6 messages)
2 mil thick prepreg (1 message)
4th Annual IPC National Conference: Flexible Circuits '98 (1 message)
: ASSY: Good Joint (1 message)
: Reliability study for copper vs Alloy 42 lead (1 message)
<No subject> (12 messages)
A better wetting compound for cross-sections? (4 messages)
Acetone interactions with buttercoat, etc. (2 messages)
adhesion of chip bonder to solder mask (2 messages)
ADMIN: BGA issue clarification (1 message)
ADMIN: BGA Mailing List (1 message)
ADMIN: Fact Sheets (1 message)
ADMIN: Information on a BGA Mailing List (1 message)
ADMIN: Information on a BGA Mailing List -Reply (1 message)
ADMIN: Mail lists will be down (1 message)
Alternative Substance for Trichloroethylene (4 messages)
Alternative Substance for Trichloroethylene -Reply (1 message)
Amistar 1800 and Unicam (1 message)
AOI CAD reference (1 message)
ASM: Ethlyene Glycol (6 messages)
ASM: Water Soluble Mask (5 messages)
Assembly (6 messages)
Assembly (Solderability) (5 messages)
Assembly (wire bonding course) (1 message)
ASSY, solder residues on gold fingers (6 messages)
ASSY: Cleaners (6 messages)
ASSY: Conformal coating (2 messages)
ASSY: Conformal coating -Reply (1 message)
Assy: Disolving pads (2 messages)
ASSY: Duroid or Teflon boards (2 messages)
ASSY: gravity conveyor (1 message)
Assy: Hi Temp Soldering to pads on Ceramic substrate (4 messages)
ASSY: High Temp Solder (1 message)
Assy: Labels for ICs (1 message)
ASSY: Long-term Storage of Components (1 message)
Assy: Pre-heating of PCBs (2 messages)
ASSY: Rack Covers (3 messages)
ASSY: SMT/Temp. Cycling Test Failures revisited (7 messages)
Assy: Soldering to crystal cans (4 messages)
ASSY: Soldermask vs conformal coat (6 messages)
Assy: Wire bonding course. The Welding Institute. (1 message)
Assy:cracker boards (1 message)
Autoclave (1 message)
Axial part age (2 messages)
Bare Board Cleanliness (2 messages)
BGA mail list (1 message)
BGA Mailing List (22 messages)
BGA Pad to via spacing (1 message)
BGA soldering profile (4 messages)
BGA XRAY INSPECTION LABS (1 message)
Blow holes (2 messages)
Blow holes -Reply (1 message)
Breaking of tabs (4 messages)
Breaking of Tabs.. (1 message)
C.I. Symposium Cups (1 message)
CAD Librarian (1 message)
Cap shorting at low voltage high impedance circuit (10 messages)
Carbon Ink Printing for remote Control PWBs (1 message)
carelesness (1 message)
CCGA Process (1 message)
Chip Capacitor Termination Finish (2 messages)
Chip On Glass (1 message)
Chip Resistor Networks (1 message)
Chip Softpassivation Polyimide (2 messages)
Circuit Repair Corporation (3 messages)
Circuit Repair Corporation -Reply (1 message)
Circuit width and spacing (4 messages)
Cleanliness of boards (2 messages)
Cleanliness under Flip-Chips (1 message)
Closed-Loop Water Recycling Systems (4 messages)
Coaters for LPI (4 messages)
Component Shelf Life (2 messages)
Conformal Coating (2 messages)
CONFORMAL COATING REPAIR (1 message)
contamination on sm capacitors (4 messages)
Copper concentration in Rack Strip (1 message)
Corner cracks in electrolytic copper plating. (1 message)
Cutting internal layer traces (1 message)
dark gold fingers (7 messages)
DC Etch prediction (2 messages)
Delamination Issues (2 messages)
DES: Guard rings (3 messages)
DES: Gullwing Leads Manufacturer (5 messages)
Des: Mentor area fill problem (2 messages)
Design: Shield Layer Relief and Shielding Effectiveness (1 message)
Die Attach Adhesive Bleed (1 message)
Differential Impedance Calculations (6 messages)
Differential Impendance (2 messages)
Do we really need ionic contamination measurement e (1 message)
Do we really need ionic contamination measurement equipm ent? (1 message)
Do we really need ionic contamination measurement equipment? (8 messages)
Do we really need ionic contamination measurement equipment? -Reply (1 message)
Double Sided Assembly (6 messages)
Double sided assembly methods (2 messages)
Double Sided Reflow (2 messages)
Electroless Gold (1 message)
Electronic Field Failures Caused by Temperature (3 messages)
Encapsulation material TEDISTAC (2 messages)
Engelhard (2 messages)
Enlist to BGA list (1 message)
Enlist us to The BGA lists,Thanks you (1 message)
Entek Plus 106 and Kester no clean flux 951 (3 messages)
Environmentally Friendly PWB's (2 messages)
Er of FR-4 (1 message)
ESD Safe Plexiglass (2 messages)
ESD SAFE WINDOWS? (2 messages)
ESD SAFE WINDOWS? -Reply (1 message)
Etchant for Au/Sn solder (3 messages)
FAB - CAM Systems Administration (4 messages)
Fab /Assm: Big Boards! (1 message)
FAB Ionic Cleanliness Testing Equip (3 messages)
FAB Materials: What are these? (2 messages)
FAB staining on FR4 (3 messages)
Fab vendor qualification (2 messages)
Fab-Selective Gold (1 message)
FAB. Dielectric constant c (1 message)
FAB. Dielectric constant certification (1 message)
FAB/ ASSY: Big Boards! (4 messages)
FAB/ ASSY: Big Boards! -Reply (2 messages)
FAB/ASSY: Tooling Hole Sizes (3 messages)
FAB/DES/ASM - Buried Capaciatance (2 messages)
FAB: Bellcore spec (1 message)
FAB: Custom Flex Lamination Equipment (1 message)
FAB: Electrical Testers (3 messages)
FAB: Facilities question (4 messages)
FAB: Immersion Gold Services (4 messages)
FAB: Immersion Gold Services -Reply (2 messages)
FAB: Measuring Solder Thickness After HASL (2 messages)
Fab: Packaging (3 messages)
FAB: polyimide laminate (2 messages)
FAB: Procedure to remo (1 message)
FAB: Procedure to remove tin-scale in a resiststripper (3 messages)
FAB: Tin / Lead finish (3 messages)
Fab: Where is Steven Eldefonso? (2 messages)
FABRICATION (4 messages)
Fanuc (5 messages)
filling of test vias which are encroached on topside (1 message)
fine pitch pads / design width (1 message)
fine pitch pads / designwidth (1 message)
Flexible PCBs (1 message)
Flux Fumes (1 message)
foam fluxer (3 messages)
Frequency of Solder Analysis (1 message)
frequency of solder pot content analysis (8 messages)
FW: ASSY:Wave solder (1 message)
FW: ENVIRONMENTAL CONTROL (2 messages)
FW: lead trimming (1 message)
FW: RESEND -Teflon replacement (1 message)
FW: sub: zero profile sockets (2 messages)
FW: [TN] Cleanliness of boards (1 message)
FW: [TN] Double sided assembly methods (1 message)
FW: [TN] frequency of solder pot content analysis (1 message)
FW: [TN] frequency of solder pot content analysis -Reply (1 message)
FW: [TN] Silver chromate paper and copper mirror source (1 message)
FW: [TN] Subscribe (2 messages)
FW: [TN] Temperature Profiler Questions (1 message)
FW: [TN] [AS] What parameters do other companies use when evaluat ing the e ffectiveness of Assembly houses builds (1 message)
FW: [TN] [AS] What parameters do other companies use when evaluating the effectiveness of Assembly houses builds (1 message)
FWD>RE>[TN] (TN): ASSY: (1 message)
G-10 (4 messages)
GEN (3 messages)
GEN: Liability (3 messages)
GEN: Used Equipment Reseller (2 messages)
Gold deposition: Electrolytic v/s Immersion - An (1 message)
Gold deposition: Electrolytic v/s Immersion - Any problem (2 messages)
Gold Thickness Measurement Error (2 messages)
Gold Tips Staining (2 messages)
goldman (1 message)
Gullwing Leads Manufacturer (2 messages)
Hardware (2 messages)
Help - Intrusive Reflow (2 messages)
High Temperature Soldering/Applications (1 message)
HOW DO I SET MY LIST TO DIGEST (2 messages)
Immersion Gold (1 message)
info on MCM Design and Fabrication (2 messages)
Intrusive Reflow (1 message)
ion exchange (1 message)
IPC Printed Circuits Expo '98 (1 message)
IPC-6013 Flex PWB (2 messages)
IPC-A-610 & Piezoelectric ceramic (1 message)
IPCchat session announcement (5 messages)
ITO conductive film (3 messages)
J-Lead Mods (6 messages)
J-leads (1 message)
Job posting (1 message)
length of reflow oven (7 messages)
Liability (3 messages)
Liability of products (3 messages)
Materials (1 message)
Maximum component height for IP-II (1 message)
Measuring Solder Thickness after HAL (1 message)
Mechanical standoff (6 messages)
Meeting Announcement, SoCal98, Anaheim, 12May98 (1 message)
Metals finishing (3 messages)
Mouse Bites (7 messages)
Mouse Bites -Reply (1 message)
Neurocam (1 message)
Off topic: Need a phone number (1 message)
Other Forums (1 message)
PAC glass (1 message)
Paste Inspection (1 message)
PC-Board mech. Specification (2 messages)
PCB'S (3 messages)
PCMCIA INFO (1 message)
Peelable mask (1 message)
Personal Req (1 message)
Personnel Requirements (5 messages)
PIN-THROUGH PASTE PROCESS (2 messages)
Plating integrity in small vias (16 messages)
Plating vibrators (7 messages)
Please take me off the list (1 message)
Printed wiring board Data standards (1 message)
PTFE bonding (1 message)
PTFE bonding -Reply (1 message)
PTFE Multilayer (4 messages)
Pull Strength (2 messages)
Pulse Rectification (8 messages)
Re [TN] Blow holes (1 message)
Re [TN] SOLID SOLDER DEPOSIT TECH. (2 messages)
Reference planes in microstrip (1 message)
Reference planes in microstrip? (1 message)
Reflow problem (1 message)
Reliability information request (2 messages)
Reliability of BGA (6 messages)
Research paper (1 message)
Resin Starvation (4 messages)
Resist removal from tooling holes (1 message)
Responses Needed Please!!Nitrogen use w/ BGA reflow (3 messages)
Re[2]: [TN] Liability of products (1 message)
Re[3]: [TN] DES: Guard rings (1 message)
rogers 4003 material (4 messages)
Rogers RO-4003 Material (2 messages)
Rogers TMM (4 messages)
Roku-Roku Sangyo, Ltd. (1 message)
RV: (3 messages)
RV: another hoax; PLEASE NOBODY ELSE REPLY (1 message)
sales products (1 message)
Sealing Vias (9 messages)
Sealing Vias -Reply (5 messages)
Shelf life requirements (3 messages)
SHORTS CIRCUIT DURING WAVE (2 messages)
Signal Integrity Analysis (5 messages)
Silver chromate paper and copper mirror source (1 message)
Silver Dendrites (4 messages)
SIR Test Cabling (3 messages)
SMT and Chip assembly on Flexible PCB's (1 message)
SMT Component Height Restrictions (2 messages)
Solder balls on SMT assy (1 message)
Solder paste inspection (2 messages)
Solder paste inspection and incoming QC (1 message)
Solder paste inspection and incoming QC -Reply (1 message)
Solderability (1 message)
SOLID SOLDER DEPOSIT TECH. (1 message)
SOT23 problems (11 messages)
SOT23 problems - leadframe alloy (1 message)
SOT23 problems -Reply (2 messages)
Source for MIL-I-46058 Y Pattern Coupons (2 messages)
Source for RF Tuning Pads, Tabs, Confetti (1 message)
Source for Silver Paste for PCB Repairing (1 message)
SpeedBoard (2 messages)
Stencil Control Procedure (1 message)
subscribe (4 messages)
Surface Tension in Electroplating solution. (1 message)
SV: [TN] Mouse Bites -Reply (1 message)
TechNet Digest - 12 Nov 1997 to 13 Nov 1997 (1 message)
Teflon replacement (4 messages)
Tempe (1 message)
Temperature Profiler Questions (4 messages)
TH part solderability concerns (1 message)
Thermal Cycle Tester (1 message)
Thiourea free alkaline etchant (1 message)
tin/lead plating (2 messages)
tin/lead plating -Reply (1 message)
Tip Soldering (1 message)
TN] BGA Mailing List (1 message)
tombstoning (6 messages)
tooling pins (2 messages)
totally reflow (1 message)
Trace Width calculations (2 messages)
TSOP, TQFP reliability (5 messages)
Underfill voiding in flip chips (1 message)
unsubscribe (1 message)
Unsubscrivbe help needed... (2 messages)
Use half empty solder paste jar next day? (1 message)
Via in Pad (2 messages)
Via in Pad for BGA (3 messages)
Voids in Eutectic BGA joints (3 messages)
Voltage requirement of Bare Board Testing (3 messages)
Wavesolder (1 message)
What parameters do other companies use when (1 message)
Whitehouse Machine Tools (1 message)
WIRE WRAPS (2 messages)
your mail (1 message)
[AS] What parameters do other companies use when evaluating the e ffectiveness of Assembly houses builds (2 messages)
[TECHNET] Corner cracks in electrolytic copper plating. (1 message)
[TECHNET] Gold Connector Thickness (1 message)
[TECHNET] unsubscribe (1 message)
[TE] Conformal Coating (1 message)
[TN] ASM: Water Soluble Mask (2 messages)
[TN] ASM: Water Soluble Mask -Reply (1 message)
[TN] Assembly (wire bonding course) (1 message)
[TN] ASSY: Rack Covers (1 message)
[TN] DES: Guard rings (2 messages)
[TN] foam fluxer (1 message)
[TN] Liability of products (1 message)
[TN] Plating integrity in small vias (1 message)
[TN] Sealing Vias (1 message)

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Subject Sorted by Subject, Chronologically

From

Date

Size

New Thread

回覆 : [TN] Des: Mentor area fill problem

回覆 : [TN] Des: Mentor area fill problem

Weber Chuang

Tue, 4 Nov 1997 19:02:43 +0800

143 lines

New Thread

"rolled solder"

Re: "rolled solder"

Doug Jeffery

Thu, 13 Nov 1997 04:33:44 -0600

86 lines

Re: "rolled solder"

Don Vischulis

Wed, 12 Nov 1997 22:04:39 -0600

58 lines

Re: "rolled solder"

Andy Cameron

Wed, 12 Nov 1997 23:03:36 -0500

23 lines

"rolled solder"

Chetan Mehta

Wed, 12 Nov 1997 17:19:33 -0600

57 lines

New Thread

(ADMIN) TechNet Server Unavailable for 39 Hours

(ADMIN) TechNet Server Unavailable for 39 Hours

Melinda Robinson

Fri, 14 Nov 1997 16:37:17 -0600

30 lines

New Thread

(TN): ASSY: Good Joint

Re: (TN): ASSY: Good Joint

Max Bernhardt

Tue, 11 Nov 1997 09:06:00 -0600

23 lines

Re: (TN): ASSY: Good Joint

Bev Christian

Mon, 10 Nov 1997 22:59:17 -0500

65 lines

(TN): ASSY: Good Joint

Poh Kong Hui

Tue, 11 Nov 1997 06:58:59 +0800

33 lines

New Thread

(TN): ASSY: Reliability study for copper vs alooy 42 lead frame

(TN): ASSY: Reliability study for copper vs alooy 42 lead frame

Poh Kong Hui

Wed, 12 Nov 1997 07:02:02 +0800

37 lines

New Thread

110v air gap

Re: 110v air gap

Mark Ross

Tue, 25 Nov 1997 19:00:02 -0500

54 lines

Re: 110v air gap

Doug McKean

Tue, 25 Nov 1997 13:38:08 -0500

91 lines

Re: 110v air gap

Ralph Hersey

Tue, 25 Nov 1997 10:31:45 -0800

63 lines

Re: 110v air gap

Don Walker

Tue, 25 Nov 1997 11:12:33 -0600

51 lines

Re: 110v air gap

Rodney

Tue, 25 Nov 1997 11:02:27 EST

31 lines

110v air gap

<>

Tue, 25 Nov 1997 11:37:20 -0500

24 lines

New Thread

2 mil thick prepreg

2 mil thick prepreg

CSS Asia Co., Ltd.

Tue, 11 Nov 1997 16:30:49 +0900

37 lines

New Thread

4th Annual IPC National Conference: Flexible Circuits '98

4th Annual IPC National Conference: Flexible Circuits '98

John Riley

Tue, 11 Nov 1997 15:25:23 -0600

34 lines

New Thread

: ASSY: Good Joint

Re: : ASSY: Good Joint

<>

Tue, 11 Nov 1997 09:47:54 -0500

45 lines

New Thread

: Reliability study for copper vs Alloy 42 lead

Re: : Reliability study for copper vs Alloy 42 lead

<>

Wed, 12 Nov 1997 00:06:13 -0500

39 lines

New Thread

<No subject>

<No subject>

Mike Wilson

Fri, 28 Nov 1997 16:51:24 -0800

91 lines

<No subject>

Keith Larson

Thu, 27 Nov 1997 04:46:08 -0600

89 lines

<No subject>

Ecad technologies pvt ltd

Thu, 27 Nov 1997 00:27:12 +0530

36 lines

<No subject>

<>

Wed, 26 Nov 1997 00:24:19 -0500

30 lines

<No subject>

<>

Tue, 25 Nov 1997 12:23:30 -0500

30 lines

<No subject>

Bev Christian

Mon, 24 Nov 1997 17:01:37 -0500

35 lines

<No subject>

<>

11/10/97 8:13 PM

24 lines

<No subject>

<>

11/11/97 7:33 AM

11 lines

<No subject>

Lepsche, Thomas G (NM75)

Tue, 11 Nov 1997 07:16:15 -0700

27 lines

<No subject>

Chan, Marcelo

Mon, 10 Nov 1997 08:44:27 -0500

31 lines

<No subject>

Doug Jeffery

Tue, 4 Nov 1997 17:21:33 -0600

64 lines

<No subject>

Ian Giddings

Tue, 4 Nov 1997 06:38:54 -0500

33 lines

New Thread

A better wetting compound for cross-sections?

Re: A better wetting compound for cross-sections?

<>

Tue, 4 Nov 1997 07:38:00 -0500

31 lines

A better wetting compound for cross-sections?

Richard MacCutcheon

Mon, 3 Nov 1997 08:31:00 -0700

90 lines

Re: A better wetting compound for cross-sections?

Bev Christian

Mon, 3 Nov 1997 09:12:32 -0600

69 lines

A better wetting compound for cross-sections?

Rogers, Lance M.

Mon, 3 Nov 1997 08:44:05 -0500

41 lines

New Thread

Acetone interactions with buttercoat, etc.

Re: Acetone interactions with buttercoat, etc.

Aric J Parr

Tue, 18 Nov 1997 14:00:24 -0500

21 lines

Acetone interactions with buttercoat, etc.

David D Sullivan

Tue, 18 Nov 1997 12:16:55 -0600

59 lines

New Thread

adhesion of chip bonder to solder mask

Re: adhesion of chip bonder to solder mask

<>

Wed, 26 Nov 1997 08:32:19 +0000

58 lines

adhesion of chip bonder to solder mask

annie laberge

Mon, 24 Nov 1997 16:55:56 -0500

42 lines

New Thread

ADMIN: BGA issue clarification

ADMIN: BGA issue clarification

Dmitriy Sklyar

Fri, 7 Nov 1997 11:56:11 -0600

44 lines

New Thread

ADMIN: BGA Mailing List

Re: ADMIN: BGA Mailing List

Peter Swanson

Fri, 7 Nov 1997 19:47:43 GMT

32 lines

New Thread

ADMIN: Fact Sheets

ADMIN: Fact Sheets

Jim Herard

Fri, 14 Nov 1997 19:12:04 -0500

42 lines

New Thread

ADMIN: Information on a BGA Mailing List

ADMIN: Information on a BGA Mailing List

Jack Crawford

Thu, 6 Nov 1997 15:28:40 -0600

33 lines

New Thread

ADMIN: Information on a BGA Mailing List -Reply

ADMIN: Information on a BGA Mailing List -Reply

Ron Hayashi

Thu, 6 Nov 1997 13:29:41 -0800

22 lines

New Thread

ADMIN: Mail lists will be down

ADMIN: Mail lists will be down

Dmitriy Sklyar

Thu, 20 Nov 1997 14:51:26 -0600

43 lines

New Thread

Alternative Substance for Trichloroethylene

Re: Alternative Substance for Trichloroethylene

<>

Wed, 12 Nov 1997 09:48:35 +0900

75 lines

Re: Alternative Substance for Trichloroethylene

<>

Tue, 11 Nov 1997 11:47:13 -0500

32 lines

Re: Alternative Substance for Trichloroethylene

roberto tulman

Mon, 10 Nov 1997 22:12:16 +0200

54 lines

Alternative Substance for Trichloroethylene

Y.H. Woo

Sat, 8 Nov 1997 16:24:18 +0900

25 lines

New Thread

Alternative Substance for Trichloroethylene -Reply

Re: Alternative Substance for Trichloroethylene -Reply

Fred Johnson

Wed, 12 Nov 1997 11:28:36 +0000

75 lines

New Thread

Amistar 1800 and Unicam

Amistar 1800 and Unicam

SDalton

Tue, 25 Nov 1997 14:35:19 -0600

29 lines

New Thread

AOI CAD reference

AOI CAD reference

Sid Tryzbiak

Wed, 26 Nov 1997 15:48:54 -0500

70 lines

New Thread

ASM: Ethlyene Glycol

Re: ASM: Ethlyene Glycol

Mike Barmuta

Fri, 7 Nov 1997 08:42:33 -0800

11 lines

Re: ASM: Ethlyene Glycol

Doug Pauls

Fri, 7 Nov 1997 08:09:46 -0500

83 lines

Re: ASM: Ethlyene Glycol

David D Hillman

Fri, 7 Nov 1997 00:25:47 -0600

83 lines

Re: ASM: Ethlyene Glycol

<>

Thu, 6 Nov 1997 17:21:31 -0500

32 lines

Re: ASM: Ethlyene Glycol

Doug McKean

Thu, 6 Nov 1997 16:50:28 -0500

74 lines

ASM: Ethlyene Glycol

George Franck

Thu, 6 Nov 1997 15:36:43 -0500

46 lines

New Thread

ASM: Water Soluble Mask

Re: ASM: Water Soluble Mask

Pratap Singh

Tue, 11 Nov 1997 19:29:11 -0800

29 lines

Re: ASM: Water Soluble Mask

Pratap Singh

Tue, 11 Nov 1997 19:19:20 -0800

27 lines

Re: ASM: Water Soluble Mask

Vertefeuille, Russ (AZ77)

Tue, 11 Nov 1997 09:39:40 -0600

26 lines

Re: ASM: Water Soluble Mask

Paul Stolar

Mon, 10 Nov 1997 15:51:22 -0600

20 lines

ASM: Water Soluble Mask

<>

Mon, 10 Nov 1997 16:13:07 EST

34 lines

New Thread

Assembly

Assembly

<>

Mon, 24 Nov 1997 14:31:28 +0000

48 lines

Re: Assembly

David Anderson

Mon, 17 Nov 1997 18:35:45 -0600

57 lines

Re: Assembly

Warren Szkolnicki

Mon, 17 Nov 1997 17:20:47 -0600

69 lines

Assembly

Robert Schetty

Mon, 17 Nov 1997 22:45:44 UT

27 lines

Re: Assembly

Jim Marsico 516-595-5879

Mon, 17 Nov 1997 07:39:00 -0400

24 lines

Assembly

<>

Sat, 15 Nov 1997 06:44:39 -0500

105 lines

New Thread

Assembly (Solderability)

Re: Assembly (Solderability)

Achim Neu

Wed, 26 Nov 1997 23:19:41 +0100

36 lines

Re: Assembly (Solderability)

David D Hillman

Wed, 26 Nov 1997 07:50:05 -0600

80 lines

Re: Assembly (Solderability)

Ed Holton

Fri, 21 Nov 1997 13:45:47 -0500

24 lines

Re: Assembly (Solderability)

Jack Crawford

Fri, 21 Nov 1997 12:33:24 -0600

59 lines

Assembly (Solderability)

Darrell Bonzo

Fri, 21 Nov 1997 08:04:44 -0700

40 lines

New Thread

Assembly (wire bonding course)

Re: Assembly (wire bonding course)

<>

Tue, 18 Nov 1997 09:07:31 +0000

27 lines

New Thread

ASSY, solder residues on gold fingers

Re: ASSY, solder residues on gold fingers

Luke B. Mendoza

Thu, 6 Nov 1997 11:31:35 +0800

66 lines

Re: ASSY, solder residues on gold fingers

COLLINS, GRAHAM

Wed, 5 Nov 1997 07:23:20 -0500

176 lines

Re: ASSY, solder residues on gold fingers

<>

Wed, 5 Nov 1997 08:24:09 -0500

30 lines

Re: ASSY, solder residues on gold fingers

David D Hillman

Tue, 4 Nov 1997 21:41:57 -0600

78 lines

Re: ASSY, solder residues on gold fingers

<>

Tue, 4 Nov 1997 13:52:01 -0800

96 lines

ASSY, solder residues on gold fingers

Patrick Ducas

Tue, 4 Nov 1997 16:07:28 -0500

49 lines

New Thread

ASSY: Cleaners

Re: ASSY: Cleaners

Max Bernhardt

Fri, 21 Nov 1997 08:26:00 -0600

25 lines

Re: ASSY: Cleaners

Graham Naisbitt

Thu, 20 Nov 1997 10:11:00 UT

145 lines

Re: ASSY: Cleaners

Evan Jones

Thu, 20 Nov 1997 00:57:24 -0500

61 lines

ASSY: Cleaners

Evan Jones

Thu, 20 Nov 1997 00:27:20 -0500

61 lines

Re: ASSY: Cleaners

Bev Christian

Wed, 19 Nov 1997 16:18:41 -0500

103 lines

ASSY: Cleaners

Sheila Smith

Wed, 19 Nov 1997 13:36:46 -0500

29 lines

New Thread

ASSY: Conformal coating

Re: ASSY: Conformal coating

Buschor, Thomas

Tue, 4 Nov 1997 16:50:18 -0500

77 lines

ASSY: Conformal coating

Sheila Smith

Tue, 4 Nov 1997 15:55:20 -0500

30 lines

New Thread

ASSY: Conformal coating -Reply

ASSY: Conformal coating -Reply

Ron Hayashi

Tue, 4 Nov 1997 13:40:53 -0800

25 lines

New Thread

Assy: Disolving pads

Re: Assy: Disolving pads

Graham Naisbitt

Tue, 4 Nov 1997 23:05:01 UT

62 lines

Assy: Disolving pads

Blanchet,Richard

Tue, 4 Nov 1997 13:04:00 -0500

27 lines

New Thread

ASSY: Duroid or Teflon boards

ASSY: Duroid or Teflon boards

<>

Fri, 14 Nov 1997 09:00:04 +0100

44 lines

ASSY: Duroid or Teflon boards

Sheila Smith

Thu, 13 Nov 1997 14:22:35 -0500

29 lines

New Thread

ASSY: gravity conveyor

ASSY: gravity conveyor

Jerry Cupples

Wed, 12 Nov 1997 16:13:10 -0600

48 lines

New Thread

Assy: Hi Temp Soldering to pads on Ceramic substrate

Re: Assy: Hi Temp Soldering to pads on Ceramic substrate

Phillip E. Hinton

Thu, 6 Nov 1997 12:52:57 -0500

60 lines

Re: Assy: Hi Temp Soldering to pads on Ceramic substrate

David D Hillman

Thu, 6 Nov 1997 06:40:37 -0600

117 lines

Re: Assy: Hi Temp Soldering to pads on Ceramic substrate

Bev Christian

Wed, 5 Nov 1997 19:20:53 -0500

96 lines

Assy: Hi Temp Soldering to pads on Ceramic substrate

Charles Barker

Wed, 5 Nov 1997 15:35:48 -0600

55 lines

New Thread

ASSY: High Temp Solder

ASSY: High Temp Solder

Lainie Loveless

Fri, 21 Nov 1997 19:32:56 -0600

31 lines

New Thread

Assy: Labels for ICs

Assy: Labels for ICs

Blanchet,Richard

Thu, 6 Nov 1997 12:18:00 -0500

34 lines

New Thread

ASSY: Long-term Storage of Components

ASSY: Long-term Storage of Components

Lainie Loveless

Fri, 21 Nov 1997 19:33:16 -0600

32 lines

New Thread

Assy: Pre-heating of PCBs

Re: Assy: Pre-heating of PCBs

Bev Christian

Thu, 27 Nov 1997 20:56:13 -0500

74 lines

Assy: Pre-heating of PCBs

Blanchet,Richard

Thu, 27 Nov 1997 14:03:00 -0500

35 lines

New Thread

ASSY: Rack Covers

Re: ASSY: Rack Covers

Richard Hamilton -TEST

Tue, 25 Nov 1997 10:37:04 -0700

68 lines

Re: ASSY: Rack Covers

Richard Hamilton -TEST

Tue, 25 Nov 1997 10:54:54 -0700

67 lines

ASSY: Rack Covers

<>

Mon, 24 Nov 1997 21:33:09 -0600

32 lines

New Thread

ASSY: SMT/Temp. Cycling Test Failures revisited

Re: ASSY: SMT/Temp. Cycling Test Failures revisited

Graham Naisbitt

Tue, 4 Nov 1997 22:14:23 UT

112 lines

Re: ASSY: SMT/Temp. Cycling Test Failures revisited

Jim Marsico 516-595-5879

Tue, 4 Nov 1997 07:49:00 -0400

25 lines

Re: ASSY: SMT/Temp. Cycling Test Failures revisited

Graham Naisbitt

Mon, 3 Nov 1997 23:57:42 UT

123 lines

Re: ASSY: SMT/Temp. Cycling Test Failures revisited

Kane, Joseph

Mon, 3 Nov 1997 17:07:57 -0500

86 lines

Re: ASSY: SMT/Temp. Cycling Test Failures revisited

Gregg Klawson

Mon, 3 Nov 1997 16:09:56 -0500

55 lines

Re: ASSY: SMT/Temp. Cycling Test Failures revisited

Aric J Parr

Mon, 3 Nov 1997 15:49:34 -0500

29 lines

ASSY: SMT/Temp. Cycling Test Failures revisited

BROMLEY, Bill

Mon, 3 Nov 1997 15:13:29 -0500

119 lines

New Thread

Assy: Soldering to crystal cans

Re: Assy: Soldering to crystal cans

Max Bernhardt

Tue, 11 Nov 1997 12:02:00 -0600

20 lines

Re: Assy: Soldering to crystal cans

Scott Decker

Tue, 11 Nov 1997 10:54:56 -0800

76 lines

Re: Assy: Soldering to crystal cans

Yvon Hache

Tue, 11 Nov 1997 13:11:54 -0800

42 lines

Assy: Soldering to crystal cans

Raymond Klein

Mon, 10 Nov 1997 14:23:44 -0800

29 lines

New Thread

ASSY: Soldermask vs conformal coat

Re: ASSY: Soldermask vs conformal coat

Larry Crane

Tue, 25 Nov 1997 07:41:22 -0400

34 lines

Re: ASSY: Soldermask vs conformal coat

Graham Naisbitt

Tue, 25 Nov 1997 00:18:27 UT

78 lines

Re: ASSY: Soldermask vs conformal coat

Larry J. Fisher

Mon, 24 Nov 1997 11:16:19 -0500

36 lines

Re: ASSY: Soldermask vs conformal coat

Tully, Marti (AZ15)

Fri, 21 Nov 1997 15:56:35 -0600

29 lines

Re: ASSY: Soldermask vs conformal coat

Lepsche, Thomas G (NM75)

Fri, 21 Nov 1997 14:42:00 -0700

59 lines

ASSY: Soldermask vs conformal coat

Sheila Smith

Fri, 21 Nov 1997 16:10:38 -0500

29 lines

New Thread

Assy: Wire bonding course. The Welding Institute.

Assy: Wire bonding course. The Welding Institute.

<>

Wed, 19 Nov 1997 08:52:38 +0000

53 lines

New Thread

Assy:cracker boards

Assy:cracker boards

Raymond Klein

Thu, 6 Nov 1997 10:01:52 -0800

34 lines

New Thread

Autoclave

Autoclave

Universal Circuits - Buffalo

Thu, 13 Nov 1997 17:22:19 -0600

30 lines

New Thread

Axial part age

Re: Axial part age

Mark Ross

Wed, 5 Nov 1997 19:57:53 -0500

303 lines

Axial part age

Joe Wackerman

Wed, 5 Nov 1997 15:43:08 -0800

45 lines

New Thread

Bare Board Cleanliness

Re: Bare Board Cleanliness

Steve Collins

Fri, 7 Nov 1997 13:05:11 -0700

60 lines

Bare Board Cleanliness

Paul Robertson

Fri, 7 Nov 1997 14:04:19 +0000

35 lines

New Thread

BGA mail list

Re: BGA mail list

Nachbor, Suzanne (MN51)

Fri, 7 Nov 1997 10:34:48 -0600

25 lines

New Thread

BGA Mailing List

Re: BGA Mailing List

Michael Jeremias

Wed, 12 Nov 1997 10:05:21 -0800

87 lines

Re: BGA mailing list

<>

Tue, 11 Nov 1997 07:08:09 -0500

20 lines

Re: BGA Mailing List

<Gareth Jones>

Mon, 10 Nov 1997 13:02:42 +0000

27 lines

BGA Mailing list

Scott Westheimer

Mon, 10 Nov 1997 17:53:21 +0800

54 lines

BGA mailing list

<>

Mon, 10 Nov 1997 14:44:22 +0900

21 lines

BGA mailing list

<>

Sun, 9 Nov 1997 19:43:10 -0500

19 lines

Re: BGA Mailing List

jon johnson

Sat, 8 Nov 1997 16:41:36 -0500

29 lines

Re: BGA Mailing List

Adan Verduzco

Sat, 8 Nov 1997 13:10:14 -0700

109 lines

Re: BGA Mailing List

Carl Chiang

Sat, 8 Nov 1997 23:05:02 +0800

24 lines

Re: BGA Mailing List

Gabriela Bogdan

Sat, 8 Nov 1997 12:02:11 +0000

45 lines

BGA Mailing List

Robert Schetty

Fri, 7 Nov 1997 17:56:10 UT

20 lines

Re: BGA Mailing List

Yuen, Mike

Fri, 7 Nov 1997 09:53:00 CST

19 lines

BGA Mailing List

Legend Zhang

Fri, 7 Nov 1997 09:03:47 -0600

26 lines

Re: BGA Mailing List

Brian Husnik

Fri, 7 Nov 1997 08:53:55 -0600

33 lines

Re: BGA Mailing List

Doug Jeffery

Fri, 7 Nov 1997 04:43:51 -0600

45 lines

BGA Mailing List

Varadaraj.K

Fri, 7 Nov 1997 12:07:53 +0500

29 lines

Re: BGA Mailing List

Fanny TANG (ESD)

Fri, 7 Nov 1997 09:23:33 +0800

22 lines

Re: BGA Mailing List

Fulton Feng

Thu, 6 Nov 1997 18:24:22 -0500

75 lines

Re: BGA Mailing List

Douglas H Bennett- Sales Engineer

Thu, 6 Nov 1997 17:39:19 -0800

43 lines

Re: BGA Mailing List

Lisa Anderson

Thu, 6 Nov 1997 15:48:40 -0500

24 lines

Re: BGA Mailing List

<>

Thu, 6 Nov 1997 15:15:33 -0500

16 lines

BGA Mailing List

<>

Thu, 6 Nov 1997 14:45:36 -0500

22 lines

New Thread

BGA Pad to via spacing

BGA Pad to via spacing

COLLINS, GRAHAM

Wed, 12 Nov 1997 06:50:43 -0500

77 lines

New Thread

BGA soldering profile

Re: BGA soldering profile

John Guy

Mon, 10 Nov 1997 15:49:50 -0500

85 lines

Re: BGA soldering profile

<>

Mon, 10 Nov 1997 08:36:10 -0500

33 lines

Re: BGA soldering profile

Jim Marsico 516-595-5879

Fri, 7 Nov 1997 11:17:00 -0400

43 lines

BGA soldering profile

Legend Zhang

Fri, 7 Nov 1997 09:15:11 -0600

41 lines

New Thread

BGA XRAY INSPECTION LABS

BGA XRAY INSPECTION LABS

Jason Goddard

Tue, 25 Nov 1997 12:36:51 +1100

37 lines

New Thread

Blow holes

Re: Blow holes

John Guy

Thu, 20 Nov 1997 13:43:31 -0500

78 lines

Blow holes

sam mccorkel

Thu, 20 Nov 1997 12:26:52 -0500

29 lines

New Thread

Blow holes -Reply

Blow holes -Reply

Ron Hayashi

Thu, 20 Nov 1997 10:58:53 -0800

23 lines

New Thread

Breaking of tabs

Re: Breaking of tabs

Joseph Duclos

Thu, 6 Nov 1997 18:05:01 -0500

40 lines

Re: Breaking of tabs

<>

Wed, 5 Nov 1997 23:36:46 -0600

56 lines

Re: Breaking of tabs

Charles Barker

Thu, 6 Nov 1997 11:34:51 -0600

64 lines

Breaking of tabs

Dhawan, Ashok

Thu, 6 Nov 1997 14:52:39 -0000

30 lines

New Thread

Breaking of Tabs..

Breaking of Tabs..

MARK SIMMONS

Thu, 6 Nov 1997 10:07:56 -0800

41 lines

New Thread

C.I. Symposium Cups

Re: C.I. Symposium Cups

<>

Tue, 4 Nov 1997 13:30:33 EST

37 lines

New Thread

CAD Librarian

CAD Librarian

Richard G Smith

Mon, 10 Nov 1997 15:57:24 -0600

27 lines

New Thread

Cap shorting at low voltage high impedance circuit

Re: Cap shorting at low voltage high impedance circuit

Gabriela Bogdan

Sat, 22 Nov 1997 12:13:25 +0000

140 lines

Re: Cap shorting at low voltage high impedance circuit

Ed Holton

Fri, 21 Nov 1997 09:07:25 -0500

101 lines

Re: Cap shorting at low voltage high impedance circuit

Martin Bourke

Fri, 21 Nov 1997 02:07:56 GMT

89 lines

Cap shorting at low voltage high impedance circuit

Ken Patel

Thu, 20 Nov 1997 14:03:38 -0800

73 lines

Re: Cap shorting at low voltage high impedance circuit

Paul Terranova

Thu, 20 Nov 1997 13:12:18 -0500

117 lines

Re: Cap shorting at low voltage high impedance circuit

Doug Pauls

Thu, 20 Nov 1997 09:42:59 -0500

52 lines

Cap shorting at low voltage high impedance circuit

Evan Jones

Thu, 20 Nov 1997 00:49:39 -0500

61 lines

Re: Cap shorting at low voltage high impedance circuit

Evan Jones

Thu, 20 Nov 1997 00:44:21 -0500

61 lines

Re: Cap shorting at low voltage high impedance circuit

<>

Wed, 19 Nov 1997 20:15:11 -0600

36 lines

Cap shorting at low voltage high impedance circuit

Ken Patel

Wed, 19 Nov 1997 17:41:16 -0800

51 lines

New Thread

Carbon Ink Printing for remote Control PWBs

Carbon Ink Printing for remote Control PWBs

BPL Ltd.

Sat, 8 Nov 1997 12:30:42 +0530

38 lines

New Thread

carelesness

carelesness

phil stortz

Tue, 4 Nov 1997 20:23:54 +0100

24 lines

New Thread

CCGA Process

CCGA Process

Sonia Singh

Wed, 5 Nov 1997 16:51:01 +0000

33 lines

New Thread

Chip Capacitor Termination Finish

Re: Chip Capacitor Termination Finish

Phillip E. Hinton

Tue, 11 Nov 1997 16:22:47 -0500

30 lines

Chip Capacitor Termination Finish

VanDreel, Kirk

Tue, 11 Nov 1997 13:11:00 CST

46 lines

New Thread

Chip On Glass

Chip On Glass

Fanny TANG (ESD)

Fri, 7 Nov 1997 09:31:44 +0800

28 lines

New Thread

Chip Resistor Networks

Chip Resistor Networks

Signorelli, Paul

Wed, 5 Nov 1997 08:33:57 -0600

25 lines

New Thread

Chip Softpassivation Polyimide

Chip Softpassivation Polyimide

<>

Tue, 25 Nov 1997 16:15:02 MST

47 lines

Chip Softpassivation Polyimide

Achim Neu

Tue, 25 Nov 1997 23:34:17 +0100

34 lines

New Thread

Circuit Repair Corporation

Re: Circuit Repair Corporation

Charles Barker

Tue, 18 Nov 1997 13:37:43 -0600

50 lines

Re: Circuit Repair Corporation

Jack Crawford

Tue, 18 Nov 1997 10:27:16 -0600

55 lines

Circuit Repair Corporation

Lei, Kuan

Tue, 18 Nov 1997 09:49:55 -0600

36 lines

New Thread

Circuit Repair Corporation -Reply

Circuit Repair Corporation -Reply

Ron Hayashi

Tue, 18 Nov 1997 08:25:16 -0800

25 lines

New Thread

Circuit width and spacing

Re: Circuit width and spacing

George H. Patrick, III

Tue, 11 Nov 1997 08:54:21 -0800

52 lines

Re: Circuit width and spacing

Ralph Hersey

Tue, 11 Nov 1997 08:11:20 -0800

79 lines

Re: Circuit width and spacing

Rodney

Tue, 11 Nov 1997 09:43:36 EST

32 lines

Circuit width and spacing

Jeffrey Carano

Tue, 11 Nov 1997 10:12:38 -0500

27 lines

New Thread

Cleanliness of boards

Re: Cleanliness of boards

Doug Pauls

Thu, 6 Nov 1997 12:29:46 -0500

48 lines

Cleanliness of boards

Dhawan, Ashok

Thu, 6 Nov 1997 14:48:47 -0000

32 lines

New Thread

Cleanliness under Flip-Chips

Re: Cleanliness under Flip-Chips

Graham Naisbitt

Fri, 7 Nov 1997 00:03:17 UT

126 lines

New Thread

Closed-Loop Water Recycling Systems

Re: Closed-Loop Water Recycling Systems

Marie Holmgard

Thu, 6 Nov 1997 11:26:33 +1200

91 lines

Re: Closed-Loop Water Recycling Systems

Kenny Bloomquist

Wed, 5 Nov 1997 14:04:30 -0800

40 lines

Re: Closed-Loop Water Recycling Systems

Charles Barker

Wed, 5 Nov 1997 15:46:56 -0600

54 lines

Closed-Loop Water Recycling Systems

Thomas C Han

Wed, 5 Nov 1997 13:35:50 -0800

28 lines

New Thread

Coaters for LPI

Re: Coaters for LPI

Afri Singh

Thu, 20 Nov 1997 09:29:55 -0500

59 lines

Re: Coaters for LPI

Larry J. Fisher

Fri, 14 Nov 1997 10:20:58 -0500

46 lines

Re: Coaters for LPI

<>

Tue, 11 Nov 1997 20:17:54 -0500

26 lines

Coaters for LPI

Universal Circuits - Buffalo

Tue, 11 Nov 1997 17:51:15 -0600

31 lines

New Thread

Component Shelf Life

Re: Component Shelf Life

David D Hillman

Tue, 4 Nov 1997 06:37:17 -0600

103 lines

Re: Component Shelf Life

Bev Christian

Sat, 1 Nov 1997 10:33:47 -0500

78 lines

New Thread

Conformal Coating

Re: Conformal Coating

Jim Marsico 516-595-5879

Tue, 4 Nov 1997 07:57:00 -0400

27 lines

Conformal Coating

tjsjo

Mon, 3 Nov 1997 17:34:30 -0800

29 lines

New Thread

CONFORMAL COATING REPAIR

Re: CONFORMAL COATING REPAIR

Graham Naisbitt

Sun, 2 Nov 1997 00:52:15 UT

87 lines

New Thread

contamination on sm capacitors

Re: contamination on sm capacitors

john maxwell

Wed, 5 Nov 1997 12:24:40 -0700

38 lines

Re: contamination on sm capacitors

Doug Pauls

Tue, 4 Nov 1997 09:16:13 -0500

44 lines

Re: contamination on sm capacitors

Gregg Klawson

Tue, 4 Nov 1997 08:19:52 -0500

44 lines

contamination on sm capacitors

Jim Hedderick

Tue, 4 Nov 1997 09:49:30 +0000

30 lines

New Thread

Copper concentration in Rack Strip

Copper concentration in Rack Strip

Chris Ford

Wed, 12 Nov 1997 10:11:46 -0500

34 lines

New Thread

Corner cracks in electrolytic copper plating.

Re: Corner cracks in electrolytic copper plating.

<>

Sun, 16 Nov 1997 18:37:40 -0500

21 lines

New Thread

Cutting internal layer traces

Cutting internal layer traces

Thomas Phelps

Tue, 4 Nov 1997 16:24:00 -0500

39 lines

New Thread

dark gold fingers

Re: dark gold fingers

[log in to unmask]

Tue, 25 Nov 1997 21:22:05 -0800

39 lines

Re: dark gold fingers

Lenny Kurup

Tue, 25 Nov 1997 15:35:16 -0500

56 lines

Re: dark gold fingers

Robert Welch

Tue, 25 Nov 1997 13:30:16 +0000

36 lines

Re: dark gold fingers

Goldman, Patricia J.

Tue, 25 Nov 1997 08:41:00 PST

18 lines

Re: dark gold fingers

Jan Bokhove

Tue, 25 Nov 1997 09:00:24 +0100

55 lines

Re: dark gold fingers

<>

Mon, 24 Nov 1997 14:38:38 -0800

33 lines

dark gold fingers

annie laberge

Mon, 24 Nov 1997 16:45:29 -0500

35 lines

New Thread

DC Etch prediction

Re: DC Etch prediction

Doug Jeffery

Fri, 7 Nov 1997 04:41:19 -0600

71 lines

DC Etch prediction

Stone, Steve

Thu, 6 Nov 1997 09:24:00 PST

32 lines

New Thread

Delamination Issues

Delamination Issues

Evan Jones

Thu, 20 Nov 1997 00:27:45 -0500

61 lines

Delamination Issues

<>

Wed, 19 Nov 1997 16:25:41 CST

34 lines

New Thread

DES: Guard rings

Re: DES: Guard rings

Jeff Seeger

Mon, 3 Nov 1997 16:27:32 -0500

63 lines

Re: DES: Guard rings

Neil Diamond

Mon, 3 Nov 1997 15:07:52 -0600

63 lines

DES: Guard rings

Max Harris

Mon, 3 Nov 1997 15:39:21 -0500

36 lines

New Thread

DES: Gullwing Leads Manufacturer

Re: DES: Gullwing Leads Manufacturer

D.C.Whalley

Thu, 20 Nov 1997 08:49:32 -0500

30 lines

Re: DES: Gullwing Leads Manufacturer

Evan Jones

Thu, 20 Nov 1997 00:53:51 -0500

61 lines

DES: Gullwing Leads Manufacturer

Evan Jones

Thu, 20 Nov 1997 00:26:40 -0500

61 lines

Re: DES: Gullwing Leads Manufacturer

Ulrich Korndoerfer

Thu, 20 Nov 1997 00:08:09 +0100

60 lines

DES: Gullwing Leads Manufacturer

Steve Collins

Wed, 19 Nov 1997 07:30:27 -0700

35 lines

New Thread

Des: Mentor area fill problem

Re: Des: Mentor area fill problem

Yvon Hache

Tue, 4 Nov 1997 07:27:12 -0800

35 lines

Des: Mentor area fill problem

Ty Thomas

Mon, 3 Nov 1997 10:13:32 -0500

42 lines

New Thread

Design: Shield Layer Relief and Shielding Effectiveness

Re: Design: Shield Layer Relief and Shielding Effectiveness

Doug McKean

Sat, 1 Nov 1997 15:59:27 -0500

89 lines

New Thread

Die Attach Adhesive Bleed

Die Attach Adhesive Bleed

Matthew Byrne

Tue, 11 Nov 1997 20:51:34 EST

37 lines

New Thread

Differential Impedance Calculations

Re: Differential Impedance Calculations

Gwen Merchant

Wed, 19 Nov 1997 11:49:15 +0000

72 lines

Re: Differential Impedance Calculations

Engineering / Design Dept.

Wed, 12 Nov 1997 10:49:11 -0800

90 lines

Re: Differential Impedance Calculations

Neil Diamond

Wed, 12 Nov 1997 11:42:56 -0600

63 lines

Re: Differential Impedance Calculations

Scott Decker

Wed, 12 Nov 1997 08:09:58 -0800

75 lines

Re: Differential Impedance Calculations

<>

Tue, 11 Nov 1997 18:13:30 -0500

20 lines

Differential Impedance Calculations

Brock Hunter

Tue, 11 Nov 1997 17:19:10 -0500

40 lines

New Thread

Differential Impendance

Re: Differential Impendance

D. Rooke

Tue, 4 Nov 1997 00:38:07 -0500

53 lines

Differential Impendance

teik

Mon, 3 Nov 1997 14:57:44 EST

24 lines

New Thread

Do we really need ionic contamination measurement e

Re: Do we really need ionic contamination measurement e

Jim Herard

Thu, 13 Nov 1997 19:26:59 -0500

76 lines

New Thread

Do we really need ionic contamination measurement equipm ent?

Re: Do we really need ionic contamination measurement equipm ent?

COLLINS, GRAHAM

Fri, 14 Nov 1997 06:51:24 -0500

102 lines

New Thread

Do we really need ionic contamination measurement equipment?

Re: Do we really need ionic contamination measurement equipment?

Graham Naisbitt

Thu, 27 Nov 1997 11:35:56 UT

108 lines

Re: Do we really need ionic contamination measurement equipment?

Nicholas Kane

Mon, 17 Nov 1997 21:54:52 +1100

110 lines

Re: Do we really need ionic contamination measurement equipment?

Doug Pauls

Mon, 17 Nov 1997 08:05:55 -0500

85 lines

Re: Do we really need ionic contamination measurement equipment?

Lenny Kurup

Fri, 14 Nov 1997 13:46:24 -0500

67 lines

Re: Do we really need ionic contamination measurement equipment?

Graham Naisbitt

Sat, 15 Nov 1997 09:53:13 UT

79 lines

Re: Do we really need ionic contamination measurement equipment?

Larry J. Fisher

Fri, 14 Nov 1997 10:38:11 -0500

55 lines

Re: Do we really need ionic contamination measurement equipment?

<>

Fri, 14 Nov 1997 02:54:39 -0500

29 lines

Do we really need ionic contamination measurement equipment?

Ken Patel

Thu, 13 Nov 1997 14:25:32 -0800

38 lines

New Thread

Do we really need ionic contamination measurement equipment? -Reply

Do we really need ionic contamination measurement equipment? -Reply

SOKKHON OU

Fri, 14 Nov 1997 09:20:46 -0600

25 lines

New Thread

Double Sided Assembly

Re: Double Sided Assembly

<>

Thu, 27 Nov 1997 07:52:08 -0500

56 lines

Double Sided Assembly

Eddie Brunker

Thu, 27 Nov 1997 10:13:42 GMT

58 lines

Re: Double Sided Assembly

COLLINS, GRAHAM

Wed, 26 Nov 1997 15:14:07 -0500

226 lines

Re: Double Sided Assembly

Ed Holton

Wed, 26 Nov 1997 13:09:41 -0500

153 lines

Re: Double Sided Assembly

David D Hillman

Wed, 26 Nov 1997 12:38:31 -0600

106 lines

Double Sided Assembly

Eddie Brunker

Wed, 26 Nov 1997 14:35:03 GMT

65 lines

New Thread

Double sided assembly methods

Re: Double sided assembly methods

David D Hillman

Wed, 26 Nov 1997 07:35:17 -0600

84 lines

Double sided assembly methods

Lee McCuistion

Tue, 25 Nov 1997 13:28:11 +0000

42 lines

New Thread

Double Sided Reflow

Re: Double Sided Reflow

<>

Fri, 28 Nov 1997 08:32:06 -0500

31 lines

Re: Double Sided Reflow

Moss Dore

Thu, 27 Nov 1997 13:20:08 +0000

35 lines

New Thread

Electroless Gold

Electroless Gold

<>

Wed, 12 Nov 1997 12:14:59 +0800

30 lines

New Thread

Electronic Field Failures Caused by Temperature

Re: Electronic Field Failures Caused by Temperature

Pratap Singh

Sat, 8 Nov 1997 11:37:49 -0800

35 lines

Re: Electronic Field Failures Caused by Temperature

D.C.Whalley

Fri, 7 Nov 1997 07:50:36 -0500

41 lines

Electronic Field Failures Caused by Temperature

Matt Aubrey

Thu, 6 Nov 1997 18:28:10 -0500

30 lines

New Thread

Encapsulation material TEDISTAC

Encapsulation material TEDISTAC

Michael Jeremias

Thu, 20 Nov 1997 12:15:22 -0800

56 lines

Encapsulation material TEDISTAC

Michael Jeremias

Tue, 18 Nov 1997 20:04:29 -0800

36 lines

New Thread

Engelhard

Engelhard

Matthew Mahlau

Thu, 6 Nov 1997 11:20:39 -0500

182 lines

Engelhard

tonghh

Thu, 6 Nov 1997 22:57:23 +0800

27 lines

New Thread

Enlist to BGA list

Enlist to BGA list

BPL Ltd.

Sat, 8 Nov 1997 19:00:48 +0530

36 lines

New Thread

Enlist us to The BGA lists,Thanks you

Enlist us to The BGA lists,Thanks you

Eddy Chen

Sat, 8 Nov 1997 00:25:14 +0800

29 lines

New Thread

Entek Plus 106 and Kester no clean flux 951

Entek Plus 106 and Kester no clean flux 951

Evan Jones

Mon, 1 Dec 1997 00:19:57 -0500

62 lines

Re: Entek Plus 106 and Kester no clean flux 951

J. Paul Mecca

Fri, 28 Nov 1997 19:55:15 -0500

51 lines

Entek Plus 106 and Kester no clean flux 951

Matthew Park

Fri, 28 Nov 1997 13:04:10 -0800

28 lines

New Thread

Environmentally Friendly PWB's

Re: Environmentally Friendly PWB's

D.C.Whalley

Wed, 12 Nov 1997 12:43:56 -0500

40 lines

Environmentally Friendly PWB's

Kenneth Rodgers

Fri, 7 Nov 1997 11:00:46 -0600

33 lines

New Thread

Er of FR-4

Re: Er of FR-4

<>

Thu, 6 Nov 1997 12:00:14 +0000

4987 lines

New Thread

ESD Safe Plexiglass

ESD Safe Plexiglass

Evan Jones

Thu, 20 Nov 1997 01:08:31 -0500

61 lines

ESD Safe Plexiglass

Signorelli, Paul

Wed, 19 Nov 1997 10:41:56 -0600

23 lines

New Thread

ESD SAFE WINDOWS?

Re: ESD SAFE WINDOWS?

Saracino, Glenn (AZ75)

Tue, 18 Nov 1997 16:53:41 -0600

72 lines

ESD SAFE WINDOWS?

David Girard

Tue, 18 Nov 1997 17:04:50 -0500

36 lines

New Thread

ESD SAFE WINDOWS? -Reply

Re: ESD SAFE WINDOWS? -Reply

Fanny TANG (ESD)

Mon, 24 Nov 1997 12:35:01 +0800

27 lines

New Thread

Etchant for Au/Sn solder

Re: Etchant for Au/Sn solder

Lenny Kurup

Wed, 26 Nov 1997 11:10:43 -0500

50 lines

Etchant for Au/Sn solder

<>

Wed, 26 Nov 1997 16:15:14 +0100

31 lines

Etchant for Au/Sn solder

Phillip E. Hinton

Wed, 26 Nov 1997 09:27:50 -0500

27 lines

New Thread

FAB - CAM Systems Administration

Re: FAB - CAM Systems Administration

Jack Crawford

Fri, 14 Nov 1997 11:10:27 -0600

58 lines

Re: FAB - CAM Systems Administration

Jack Crawford

Fri, 14 Nov 1997 10:41:39 -0600

47 lines

Re: FAB - CAM Systems Administration

Richard Hamilton -TEST

Thu, 13 Nov 1997 14:49:27 -0700

59 lines

FAB - CAM Systems Administration

Jeffrey Worth

Thu, 13 Nov 1997 16:27:14 -0500

27 lines

New Thread

Fab /Assm: Big Boards!

Fab /Assm: Big Boards!

<>

Fri, 14 Nov 1997 20:42:16 -0600

23 lines

New Thread

FAB Ionic Cleanliness Testing Equip

Re: FAB Ionic Cleanliness Testing Equip

Larry J. Fisher

Mon, 24 Nov 1997 11:08:49 -0500

38 lines

Re: FAB Ionic Cleanliness Testing Equip

Al Hamilton

Mon, 24 Nov 1997 10:21:34 -0500

23 lines

FAB Ionic Cleanliness Testing Equip

<>

Fri, 21 Nov 1997 12:44:33 -0500

35 lines

New Thread

FAB Materials: What are these?

Re: FAB Materials: What are these?

Steven Sauer

Mon, 24 Nov 1997 09:19:29 -0500

36 lines

FAB Materials: What are these?

<>

Mon, 24 Nov 1997 08:58:54 -0500

35 lines

New Thread

FAB staining on FR4

Re: FAB staining on FR4

Lenny Kurup

Thu, 20 Nov 1997 17:21:56 -0500

83 lines

Re: FAB staining on FR4

Robert Welch

Thu, 20 Nov 1997 17:17:03 +0000

53 lines

Re: FAB staining on FR4

[log in to unmask]

Thu, 20 Nov 1997 20:56:11 -0800

51 lines

New Thread

Fab vendor qualification

Re: Fab vendor qualification

Steve Collins

Wed, 5 Nov 1997 07:14:58 -0700

59 lines

Fab vendor qualification

Ken Patel

Tue, 4 Nov 1997 10:46:27 -0800

32 lines

New Thread

Fab-Selective Gold

Re: Fab-Selective Gold

John Gordon

Thu, 6 Nov 1997 11:04:34 -0800

31 lines

New Thread

FAB. Dielectric constant c

Re: FAB. Dielectric constant c

<>

Wed, 5 Nov 1997 15:24:37 +0000

23 lines

New Thread

FAB. Dielectric constant certification

FAB. Dielectric constant certification

=?ISO-8859-1?Q?Jos=E9_Muelas?=

Wed, 5 Nov 1997 00:59:14 +0100

34 lines

New Thread

FAB/ ASSY: Big Boards!

Re: FAB/ ASSY: Big Boards!

<>

Thu, 6 Nov 1997 10:15:56 EST

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Re: FAB/ ASSY: Big Boards!

Keith Larson

Wed, 5 Nov 1997 18:47:15 -0600

82 lines

Re: FAB/ ASSY: Big Boards!

<>

Wed, 5 Nov 1997 08:25:49 -0800

24 lines

FAB/ ASSY: Big Boards!

MR JOHN L THOMA

Wed, 5 Nov 1997 10:57:54 -0500

24 lines

New Thread

FAB/ ASSY: Big Boards! -Reply

Re: FAB/ ASSY: Big Boards! -Reply

<>

Mon, 10 Nov 1997 10:05:01 -0500

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FAB/ ASSY: Big Boards! -Reply

KARLA DUGGAN

Wed, 5 Nov 1997 10:18:42 -0600

48 lines

New Thread

FAB/ASSY: Tooling Hole Sizes

Re: FAB/ASSY: Tooling Hole Sizes

Steve Collins

Thu, 6 Nov 1997 15:15:45 -0700

65 lines

Re: FAB/ASSY: Tooling Hole Sizes

John Laur

Thu, 6 Nov 1997 15:03:46 -0600

35 lines

FAB/ASSY: Tooling Hole Sizes

<>

Thu, 6 Nov 1997 12:49:36 -0700

29 lines

New Thread

FAB/DES/ASM - Buried Capaciatance

Re: FAB/DES/ASM - Buried Capaciatance

Carey Pico

Fri, 7 Nov 1997 08:43:44 -0800

70 lines

FAB/DES/ASM - Buried Capaciatance

Roland Jaquet

Fri, 7 Nov 1997 11:07:16 +0100

60 lines

New Thread

FAB: Bellcore spec

Re: FAB: Bellcore spec

Orna and Yehuda

Mon, 3 Nov 1997 23:09:17 +0200

77 lines

New Thread

FAB: Custom Flex Lamination Equipment

FAB: Custom Flex Lamination Equipment

Andy Magee

Tue, 18 Nov 1997 07:16:33 -0500

31 lines

New Thread

FAB: Electrical Testers

Re: FAB: Electrical Testers

Jeff Seeger

Tue, 18 Nov 1997 16:28:28 -0500

60 lines

Re: FAB: Electrical Testers

Neil Diamond

Tue, 18 Nov 1997 14:58:43 -0600

61 lines

Re: FAB: Electrical Testers

Ron Videen

Tue, 18 Nov 1997 13:48:37 -0600

89 lines

New Thread

FAB: Facilities question

Re: FAB: Facilities question

FULABHAI

Thu, 6 Nov 1997 14:13:21 EST

38 lines

Re: FAB: Facilities question

Warren Szkolnicki

Thu, 6 Nov 1997 08:35:01 -0600

90 lines

Re: FAB: Facilities question

Aric J Parr

Thu, 6 Nov 1997 09:38:21 -0500

32 lines

FAB: Facilities question

Sheila Smith

Thu, 6 Nov 1997 08:50:00 -0500

34 lines

New Thread

FAB: Immersion Gold Services

Re: FAB: Immersion Gold Services

Ted Stern

Tue, 25 Nov 1997 10:13:06 -0800

43 lines

Re: FAB: Immersion Gold Services

Larry J. Fisher

Mon, 24 Nov 1997 20:05:43 -0500

27 lines

Re: FAB: Immersion Gold Services

Jana Carraway

Mon, 24 Nov 1997 09:10:38 PST

68 lines

FAB: Immersion Gold Services

John Parsons

Fri, 21 Nov 1997 16:08:42 +0000

30 lines

New Thread

FAB: Immersion Gold Services -Reply

Re: FAB: Immersion Gold Services -Reply

Kelly Kovalovsky

Mon, 24 Nov 1997 12:58:23 -0500

52 lines

FAB: Immersion Gold Services -Reply

Ron Hayashi

Mon, 24 Nov 1997 08:20:01 -0800

23 lines

New Thread

FAB: Measuring Solder Thickness After HASL

Re: FAB: Measuring Solder Thickness After HASL

Fulton Feng

Thu, 13 Nov 1997 12:56:18 -0500

57 lines

FAB: Measuring Solder Thickness After HASL

Hans Rohr

Wed, 12 Nov 1997 20:57:53 -0500

28 lines

New Thread

Fab: Packaging

Re: Fab: Packaging

Paul Gould

Tue, 4 Nov 1997 20:45:54 +0000

47 lines

Re: Fab: Packaging

Charles Barker

Tue, 4 Nov 1997 13:17:02 -0600

74 lines

Fab: Packaging

sam mccorkel

Tue, 4 Nov 1997 13:57:04 -0500

33 lines

New Thread

FAB: polyimide laminate

Re: FAB: polyimide laminate

David Bergman

Wed, 26 Nov 1997 09:25:19 -0600

59 lines

FAB: polyimide laminate

Sheila Smith

Thu, 6 Nov 1997 09:58:11 -0500

29 lines

New Thread

FAB: Procedure to remo

Re: FAB: Procedure to remo

Leon Snowdon

Tue, 25 Nov 1997 12:15:14 +0000

38 lines

New Thread

FAB: Procedure to remove tin-scale in a resiststripper

Re: FAB: Procedure to remove tin-scale in a resiststripper

David D Sullivan

Tue, 25 Nov 1997 09:38:56 -0600

290 lines

Re: FAB: Procedure to remove tin-scale in a resiststripper

Ted Stern

Tue, 25 Nov 1997 10:42:08 -0800

56 lines

FAB: Procedure to remove tin-scale in a resiststripper

Jan Thuesen

Tue, 25 Nov 1997 11:44:45 +0100

64 lines

New Thread

FAB: Tin / Lead finish

Re: FAB: Tin / Lead finish

-Bob Daniels, Jr - ECC Corp.

Tue, 4 Nov 1997 22:00:49 -0500

30 lines

Re: FAB: Tin / Lead finish

Paul Gould

Tue, 4 Nov 1997 20:49:39 +0000

52 lines

FAB: Tin / Lead finish

sam mccorkel

Tue, 4 Nov 1997 13:56:01 -0500

34 lines

New Thread

Fab: Where is Steven Eldefonso?

Re: Fab: Where is Steven Eldefonso?

PAUL OLSON

Tue, 18 Nov 1997 13:03:12 -0600

64 lines

Fab: Where is Steven Eldefonso?

Glynn Shaw

Mon, 17 Nov 1997 15:43:45 -0800

32 lines

New Thread

FABRICATION

FABRICATION

Evan Jones

Thu, 20 Nov 1997 01:04:12 -0500

61 lines

Re: FABRICATION

Evan Jones

Thu, 20 Nov 1997 00:28:11 -0500

61 lines

Re: FABRICATION

<>

Wed, 19 Nov 1997 19:22:59 -0500

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FABRICATION

Keith Larson

Wed, 19 Nov 1997 12:13:59 -0600

67 lines

New Thread

Fanuc

Re: Fanuc

-Bob Daniels, Jr - ECC Corp.

Sat, 15 Nov 1997 15:57:26 -0500

21 lines

Re: Fanuc

Sheila and Donna

Tue, 11 Nov 1997 18:18:03 -0800

52 lines

Re: Fanuc

<>

Tue, 11 Nov 1997 16:44:09 +0000

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Re: Fanuc

George Franck

Tue, 11 Nov 1997 10:14:21 -0500

60 lines

Fanuc

William E. Johnson

Mon, 10 Nov 1997 14:31:29 -0800

22 lines

New Thread

filling of test vias which are encroached on topside

filling of test vias which are encroached on topside

Ken Patel

Tue, 18 Nov 1997 10:38:40 -0800

37 lines

New Thread

fine pitch pads / design width

fine pitch pads / design width

john balchunas

Wed, 26 Nov 1997 10:24:47 -0500

297 lines

New Thread

fine pitch pads / designwidth

fine pitch pads / designwidth

Wolfgang Erat

Tue, 25 Nov 1997 12:36:48 -0500

30 lines

New Thread

Flexible PCBs

Flexible PCBs

Varadaraj.K

Fri, 28 Nov 1997 08:59:03 +0530

33 lines

New Thread

Flux Fumes

Flux Fumes

Linda Bookman

Mon, 17 Nov 1997 15:56:42 -0800

32 lines

New Thread

foam fluxer

Re: foam fluxer

Evan Jones

Thu, 20 Nov 1997 01:11:16 -0500

61 lines

Re: foam fluxer

Edward J. Valentine

Wed, 19 Nov 1997 13:09:20 -0800

49 lines

foam fluxer

Leslie Greenlee

Mon, 17 Nov 1997 09:18:25 -0500

26 lines

New Thread

Frequency of Solder Analysis

Re: Frequency of Solder Analysis

Ron Hollandsworth

Mon, 17 Nov 1997 15:28:41 -0500

35 lines

New Thread

frequency of solder pot content analysis

Re: frequency of solder pot content analysis

<>

Mon, 17 Nov 1997 15:32:47 PST8

25 lines

Re: frequency of solder pot content analysis

<>

Mon, 17 Nov 1997 11:50:32 -0800

24 lines

Re: frequency of solder pot content analysis

Alan Kreplick

Mon, 17 Nov 1997 14:36:20 -0500

39 lines

Re: frequency of solder pot content analysis

Engineering / Design Dept.

Mon, 17 Nov 1997 11:28:20 -0800

52 lines

Re: frequency of solder pot content analysis

COLLINS, GRAHAM

Mon, 17 Nov 1997 14:22:21 -0500

76 lines

Re: frequency of solder pot content analysis

Jerry Cupples

Mon, 17 Nov 1997 13:30:48 -0600

54 lines

Re: frequency of solder pot content analysis

Aric J Parr

Mon, 17 Nov 1997 14:28:37 -0500

40 lines

frequency of solder pot content analysis

Ken Patel

Mon, 17 Nov 1997 11:04:08 -0800

32 lines

New Thread

FW: ASSY:Wave solder

FW: ASSY:Wave solder

Larry Davis

Tue, 11 Nov 1997 13:23:00 -0600

30 lines

New Thread

FW: ENVIRONMENTAL CONTROL

Re: FW: ENVIRONMENTAL CONTROL

Bev Christian

Sat, 1 Nov 1997 11:09:13 -0500

76 lines

FW: ENVIRONMENTAL CONTROL

Dhawan, Ashok

Sat, 1 Nov 1997 15:45:56 -0000

44 lines

New Thread

FW: lead trimming

FW: lead trimming

Dhawan, Ashok

Sat, 1 Nov 1997 15:42:08 -0000

48 lines

New Thread

FW: RESEND -Teflon replacement

FW: RESEND -Teflon replacement

Lepsche, Thomas G (NM75)

Thu, 6 Nov 1997 08:53:42 -0700

45 lines

New Thread

FW: sub: zero profile sockets

Re: FW: sub: zero profile sockets

Mike Wilson

Mon, 3 Nov 1997 04:58:04 -0800

71 lines

FW: sub: zero profile sockets

Dhawan, Ashok

Sat, 1 Nov 1997 15:40:46 -0000

37 lines

New Thread

FW: [TN] Cleanliness of boards

FW: [TN] Cleanliness of boards

Dhawan, Ashok

Thu, 6 Nov 1997 19:08:12 -0000

99 lines

New Thread

FW: [TN] Double sided assembly methods

FW: [TN] Double sided assembly methods

Tezak Tim

Wed, 26 Nov 1997 14:37:00 -0500

30 lines

New Thread

FW: [TN] frequency of solder pot content analysis

FW: [TN] frequency of solder pot content analysis

Blanchet,Richard

Mon, 17 Nov 1997 14:03:00 -0500

16 lines

New Thread

FW: [TN] frequency of solder pot content analysis -Reply

FW: [TN] frequency of solder pot content analysis -Reply

Ron Hayashi

Mon, 17 Nov 1997 11:27:38 -0800

27 lines

New Thread

FW: [TN] Silver chromate paper and copper mirror source

FW: [TN] Silver chromate paper and copper mirror source

Davis, Mary

Thu, 20 Nov 1997 14:21:32 -0800

77 lines

New Thread

FW: [TN] Subscribe

Re: FW: [TN] Subscribe

Jim Marsico 516-595-5879

Thu, 6 Nov 1997 14:02:00 -0400

22 lines

FW: [TN] Subscribe

Dhawan, Ashok

Thu, 6 Nov 1997 18:26:27 -0000

63 lines

New Thread

FW: [TN] Temperature Profiler Questions

FW: [TN] Temperature Profiler Questions

Blanchet,Richard

Mon, 3 Nov 1997 08:53:00 -0500

34 lines

New Thread

FW: [TN] [AS] What parameters do other companies use when evaluat ing the e ffectiveness of Assembly houses builds

FW: [TN] [AS] What parameters do other companies use when evaluat ing the e ffectiveness of Assembly houses builds

Dhawan, Ashok

Thu, 6 Nov 1997 19:39:10 -0000

72 lines

New Thread

FW: [TN] [AS] What parameters do other companies use when evaluating the effectiveness of Assembly houses builds

Re: FW: [TN] [AS] What parameters do other companies use when evaluating the effectiveness of Assembly houses builds

Graham Naisbitt

Fri, 7 Nov 1997 00:10:28 UT

111 lines

New Thread

FWD>RE>[TN] (TN): ASSY:

Re: FWD>RE>[TN] (TN): ASSY:

Whit Greenwood

Tue, 11 Nov 1997 08:21:48 U

19 lines

New Thread

G-10

Re: G-10

Steven Sauer

Tue, 25 Nov 1997 06:16:03 -0500

24 lines

Re: G-10

Jerome Sallo

Mon, 24 Nov 1997 17:22:40 -0500

26 lines

Re: G-10

Sheila Smith

Mon, 24 Nov 1997 14:55:31 -0500

45 lines

G-10

Ed Cosper

Mon, 24 Nov 1997 13:50:57 -0600

25 lines

New Thread

GEN

Re: GEN

Charles Desroches

Wed, 26 Nov 1997 16:45:01 -0500

74 lines

Re: GEN

Gary Crowell Sr.

Wed, 26 Nov 1997 14:20:34 -0700

56 lines

Re: GEN

Mitch Morey

Wed, 26 Nov 1997 11:57:14 -0800

31 lines

New Thread

GEN: Liability

Re: GEN: Liability

Afri Singh

Fri, 21 Nov 1997 10:08:39 -0500

56 lines

Re: GEN: Liability

William E. Johnson

Thu, 20 Nov 1997 14:18:59 -0800

23 lines

GEN: Liability

Tri-C Dave Roesler

Thu, 20 Nov 1997 15:41:27 -0600

38 lines

New Thread

GEN: Used Equipment Reseller

Re: GEN: Used Equipment Reseller

<>

Mon, 24 Nov 1997 17:41:09 -0500

25 lines

GEN: Used Equipment Reseller

Tri-C Dave Roesler

Fri, 21 Nov 1997 11:08:23 -0600

28 lines

New Thread

Gold deposition: Electrolytic v/s Immersion - An

Re: Gold deposition: Electrolytic v/s Immersion - An

<>

Mon, 24 Nov 1997 15:54:02 -0800

23 lines

New Thread

Gold deposition: Electrolytic v/s Immersion - Any problem

Re: Gold deposition: Electrolytic v/s Immersion - Any problem

Lenny Kurup

Tue, 25 Nov 1997 15:19:02 -0500

66 lines

Gold deposition: Electrolytic v/s Immersion - Any problem

Ken Patel

Mon, 24 Nov 1997 15:26:03 -0800

35 lines

New Thread

Gold Thickness Measurement Error

Re: Gold Thickness Measurement Error

Gerald G. Gagnon

Thu, 6 Nov 1997 09:20:50 -0500

100 lines

Gold Thickness Measurement Error

Hans Rohr

Wed, 5 Nov 1997 20:36:44 -0500

49 lines

New Thread

Gold Tips Staining

Re: Gold Tips Staining

Thomas M. Eshelman

Fri, 21 Nov 1997 17:17:02 -0500

62 lines

Gold Tips Staining

tgyee

Fri, 21 Nov 1997 09:30:42 PST

31 lines

New Thread

goldman

Re: goldman

<>

Wed, 5 Nov 1997 21:01:59 -0500

20 lines

New Thread

Gullwing Leads Manufacturer

Re: Gullwing Leads Manufacturer

Evan Jones

Thu, 20 Nov 1997 00:44:36 -0500

61 lines

Re: Gullwing Leads Manufacturer

<>

Wed, 19 Nov 1997 22:09:25 -0500

38 lines

New Thread

Hardware

Re: Hardware

Ralph Hersey

Thu, 20 Nov 1997 16:38:21 -0800

62 lines

Hardware

John M LaFontaine

Thu, 20 Nov 1997 10:40:18 -0600

30 lines

New Thread

Help - Intrusive Reflow

Re: Help - Intrusive Reflow

Lainie Loveless

Wed, 5 Nov 1997 10:12:02 -0600

73 lines

Help - Intrusive Reflow

Luke B. Mendoza

Wed, 5 Nov 1997 10:04:13 +0800

32 lines

New Thread

High Temperature Soldering/Applications

High Temperature Soldering/Applications

Ed Holton

Fri, 21 Nov 1997 14:24:57 -0500

47 lines

New Thread

HOW DO I SET MY LIST TO DIGEST

Re: HOW DO I SET MY LIST TO DIGEST

Dmitriy Sklyar

Mon, 24 Nov 1997 12:33:53 -0600

67 lines

HOW DO I SET MY LIST TO DIGEST

<>

Mon, 24 Nov 1997 12:44:14 -0500

25 lines

New Thread

Immersion Gold

Immersion Gold

Baker,Kelly

Tue, 25 Nov 1997 06:28:54 -0500

26 lines

New Thread

info on MCM Design and Fabrication

Re: info on MCM Design and Fabrication

<>

Thu, 13 Nov 1997 00:58:04 -0600

28 lines

info on MCM Design and Fabrication

Papanna Manjunatha

Wed, 12 Nov 1997 15:31:59 IST

38 lines

New Thread

Intrusive Reflow

Intrusive Reflow

Peter Willaert

Thu, 20 Nov 1997 12:58:49 +0100

50 lines

New Thread

ion exchange

ion exchange

<>

Thu, 27 Nov 1997 08:22:57 -0500

26 lines

New Thread

IPC Printed Circuits Expo '98

IPC Printed Circuits Expo '98

Lisa Williams

Tue, 4 Nov 1997 09:37:04 -0600

471 lines

New Thread

IPC-6013 Flex PWB

Re: IPC-6013 Flex PWB

Mike Buetow

Tue, 4 Nov 1997 09:58:35 -0600

48 lines

IPC-6013 Flex PWB

George Franck

Tue, 4 Nov 1997 09:18:51 -0500

32 lines

New Thread

IPC-A-610 & Piezoelectric ceramic

IPC-A-610 & Piezoelectric ceramic

<>

Tue, 18 Nov 1997 12:48:12 -0700

30 lines

New Thread

IPCchat session announcement

IPCchat session announcement

<>

Sat, 22 Nov 1997 01:14:56 -0800

46 lines

IPCchat session announcement

Lee Yong-Sam

Fri, 21 Nov 1997 01:57:10 -0800

46 lines

IPCchat session announcement

<>

Thu, 20 Nov 1997 10:22:59 -0800

49 lines

IPCchat session announcement

<>

Mon, 3 Nov 1997 18:03:32 -0800

49 lines

IPCchat session announcement

<>

Mon, 3 Nov 1997 16:49:35 -0800

48 lines

New Thread

ITO conductive film

ITO conductive film

Thomas Jacob

Wed, 26 Nov 1997 09:07:12 +0100

39 lines

Re: ITO conductive film

Joseph Fjelstad

Tue, 25 Nov 1997 09:04:46 -0800

48 lines

ITO conductive film

James Wallace Harmening Jr.

Tue, 25 Nov 1997 10:32:48 -0600

23 lines

New Thread

J-Lead Mods

Re: J-Lead Mods

Evan Jones

Thu, 20 Nov 1997 00:35:33 -0500

61 lines

Re: J-Lead Mods

James P Carlson

Wed, 19 Nov 1997 07:44:22 -0600

30 lines

Re: J-Lead Mods

<>

Tue, 18 Nov 1997 18:39:11 -0500

57 lines

Re: J-Lead Mods

Max Bernhardt

Mon, 17 Nov 1997 13:16:00 -0600

23 lines

Re: J-Lead Mods

Bob Vanech

Mon, 17 Nov 1997 13:31:58 -0500

40 lines

J-Lead Mods

Kane, Joseph

Mon, 17 Nov 1997 10:51:44 -0500

45 lines

New Thread

J-leads

Re: J-leads

Guenter Grossmann

Tue, 18 Nov 1997 10:21:14 +0200

56 lines

New Thread

Job posting

Job posting

Richard G Smith

Mon, 10 Nov 1997 07:52:22 -0600

26 lines

New Thread

length of reflow oven

Re: length of reflow oven

D.C.Whalley

Mon, 17 Nov 1997 13:45:20 -0500

46 lines

Re: length of reflow oven

<>

Fri, 14 Nov 1997 12:39:26 -0500

100 lines

Re: length of reflow oven

Ken Patel

Wed, 12 Nov 1997 16:46:30 -0800

69 lines

Re: length of reflow oven

Jerry Cupples

Wed, 12 Nov 1997 13:50:10 -0600

57 lines

Re: length of reflow oven

<>

Wed, 12 Nov 1997 14:53:03 -0500

83 lines

Re: length of reflow oven

Charles Barker

Wed, 12 Nov 1997 13:17:09 -0600

46 lines

length of reflow oven

D. Terstegge

Wed, 12 Nov 1997 19:41:45 +0100

30 lines

New Thread

Liability

Re: Liability

William E. Johnson

Mon, 24 Nov 1997 09:35:28 -0800

14 lines

Re: Liability

<>

Sat, 22 Nov 1997 20:11:37 -0500

35 lines

Re: Liability

Jack Olson

Fri, 21 Nov 1997 12:10:39 -0800

62 lines

New Thread

Liability of products

Liability of products

Raymond Klein

Fri, 21 Nov 1997 14:27:21 -0800

33 lines

Liability of Products

William E. Johnson

Fri, 21 Nov 1997 13:54:11 -0800

45 lines

Re: Liability of products

Ed Cosper

Fri, 21 Nov 1997 09:42:30 -0600

67 lines

New Thread

Materials

Materials

Lisa Anderson

Thu, 6 Nov 1997 10:24:58 -0500

41 lines

New Thread

Maximum component height for IP-II

Maximum component height for IP-II

Lisa Anderson

Tue, 4 Nov 1997 16:38:43 -0500

24 lines

New Thread

Measuring Solder Thickness after HAL

Measuring Solder Thickness after HAL

MARK SIMMONS

Thu, 13 Nov 1997 07:32:50 -0800

50 lines

New Thread

Mechanical standoff

Re: Mechanical standoff

Tucker, Steve (KS)

Wed, 5 Nov 1997 07:00:55 -0700

71 lines

Re: Mechanical standoff

Tom Hybiske

Tue, 4 Nov 1997 11:01:57 -0600

33 lines

Re: Mechanical standoff

John Laur

Tue, 4 Nov 1997 10:11:11 -0600

36 lines

Re: Mechanical standoff

Dan Stege

Tue, 4 Nov 1997 10:02:28 -0600

41 lines

Re: Mechanical standoff

Charles Barker

Tue, 4 Nov 1997 10:11:03 -0600

60 lines

Mechanical standoff

COLLINS, GRAHAM

Mon, 3 Nov 1997 14:03:40 -0500

88 lines

New Thread

Meeting Announcement, SoCal98, Anaheim, 12May98

Meeting Announcement, SoCal98, Anaheim, 12May98

Bill Gaines B160 x2199

Mon, 24 Nov 1997 07:18:58 -0800

45 lines

New Thread

Metals finishing

Re: Metals finishing

<>

Tue, 11 Nov 1997 17:11:43 -0500

26 lines

Re: Metals finishing

Roger Mouton

Tue, 11 Nov 1997 09:32:24 -0500

21 lines

Metals finishing

tonghh

Tue, 11 Nov 1997 20:46:56 +0800

26 lines

New Thread

Mouse Bites

Re: Mouse Bites

<>

Fri, 21 Nov 1997 23:58:21 -0500

47 lines

Re: Mouse Bites

Pratap Singh

Fri, 21 Nov 1997 21:29:00 -0800

31 lines

Re: Mouse Bites

Al Hamilton

Thu, 20 Nov 1997 16:09:47 -0500

23 lines

Re: Mouse Bites

John Nelson

Thu, 20 Nov 1997 16:12:26 -0500

61 lines

Re: Mouse Bites

<>

Thu, 20 Nov 1997 16:01:32 -0500

32 lines

Re: Mouse Bites

<>

Thu, 20 Nov 1997 15:56:29 -0500

20 lines

Mouse Bites

sam mccorkel

Thu, 20 Nov 1997 12:23:39 -0500

28 lines

New Thread

Mouse Bites -Reply

Re: Mouse Bites -Reply

Fred Johnson

Sun, 23 Nov 1997 00:23:38 +0000

67 lines

New Thread

Neurocam

Neurocam

<>

Sun, 9 Nov 1997 23:05:44 +0100

34 lines

New Thread

Off topic: Need a phone number

Off topic: Need a phone number

JoAnn Amerson

Thu, 20 Nov 1997 11:49:19 +0000

37 lines

New Thread

Other Forums

Re: Other Forums

Dan Brandler

Thu, 20 Nov 1997 10:14:50 -0800

28 lines

New Thread

PAC glass

PAC glass

Sid Tryzbiak

Fri, 7 Nov 1997 10:16:58 -0500

61 lines

New Thread

Paste Inspection

Paste Inspection

Natalie Sharp

Fri, 7 Nov 1997 13:04:20 -0400

41 lines

New Thread

PC-Board mech. Specification

Re: PC-Board mech. Specification

John Laur

Tue, 4 Nov 1997 07:43:58 -0600

41 lines

PC-Board mech. Specification

Rolf Buchholz

Tue, 4 Nov 1997 02:41:16 -0500

28 lines

New Thread

PCB'S

Re: PCB'S

David Arivett

Fri, 28 Nov 1997 08:33:07 -0600

62 lines

Re: PCB'S

Bev Christian

Fri, 28 Nov 1997 08:17:21 -0500

55 lines

PCB'S

<>

Fri, 28 Nov 1997 04:12:21 -0500

25 lines

New Thread

PCMCIA INFO

Re: PCMCIA INFO

Robert Downing

Sun, 9 Nov 1997 11:44:18 PST

92 lines

New Thread

Peelable mask

Peelable mask

Yuen, Mike

Thu, 13 Nov 1997 08:15:00 CST

27 lines

New Thread

Personal Req

Re: Personal Req

Terry Zhu

Fri, 21 Nov 1997 16:47:14 -0800

27 lines

New Thread

Personnel Requirements

Re: Personnel Requirements

Evan Jones

Thu, 20 Nov 1997 00:56:57 -0500

61 lines

Personnel Requirements

Evan Jones

Thu, 20 Nov 1997 00:22:39 -0500

61 lines

Re: Personnel Requirements

Terry Zhu

Wed, 19 Nov 1997 20:14:55 -0800

71 lines

Re: Personnel Requirements

Jack Crawford

Wed, 19 Nov 1997 14:31:07 -0600

60 lines

Personnel Requirements

Dick Desrosiers

Wed, 19 Nov 1997 14:53:12 EST

39 lines

New Thread

PIN-THROUGH PASTE PROCESS

Re: PIN-THROUGH PASTE PROCESS

Jack Crawford

Thu, 6 Nov 1997 11:50:26 -0600

59 lines

PIN-THROUGH PASTE PROCESS

RAYMOND YONG

Thu, 6 Nov 1997 17:51:16 +0700

34 lines

New Thread

Plating integrity in small vias

Re: Plating integrity in small vias

[log in to unmask]

Wed, 26 Nov 1997 22:21:18 -0800

38 lines

Re: Plating integrity in small vias

Peter Blokhuis

Wed, 26 Nov 1997 16:18:30 -0500

23 lines

Re: Plating integrity in small vias

Bogdan Gaby

Wed, 26 Nov 1997 16:42:04 -0800

53 lines

Re: Plating integrity in small vias

<>

Wed, 26 Nov 1997 00:24:24 -0500

32 lines

Re: Plating integrity in small vias

<>

Wed, 26 Nov 1997 00:24:21 -0500

33 lines

Re: Plating integrity in small vias

Leslie O. Connally

Tue, 25 Nov 1997 17:13:33 -0800

134 lines

Re: Plating integrity in small vias

[log in to unmask]

Tue, 25 Nov 1997 21:15:34 -0800

28 lines

Re: Plating integrity in small vias

<>

Tue, 25 Nov 1997 12:23:34 -0500

34 lines

Re: Plating integrity in small vias

<>

Tue, 25 Nov 1997 12:23:36 -0500

33 lines

Re: Plating integrity in small vias

Gabriela Bogdan

Tue, 25 Nov 1997 08:20:50 +0000

90 lines

Re: Plating integrity in small vias

Gregg Klawson

Mon, 24 Nov 1997 21:32:48 -0500

35 lines

Re: Plating integrity in small vias

<>

Mon, 24 Nov 1997 21:20:03 -0500

45 lines

Re: Plating integrity in small vias

Paul Gould

Mon, 24 Nov 1997 20:12:20 +0000

43 lines

Re: Plating integrity in small vias

peter dahlen

Mon, 24 Nov 1997 15:54:33 +0000

64 lines

Re: Plating integrity in small vias

Joseph Duclos

Mon, 24 Nov 1997 09:41:48 -0500

70 lines

Plating integrity in small vias

Bogdan Gaby

Mon, 24 Nov 1997 16:11:02 -0800

36 lines

New Thread

Plating vibrators

Re: Plating vibrators

Fritz Steiner

Tue, 25 Nov 1997 08:03:34 +0100

32 lines

Re: Plating vibrators

Russell S Gregory

Fri, 21 Nov 1997 17:11:42 -0500

21 lines

Re: Plating vibrators

Lenny Kurup

Fri, 21 Nov 1997 15:00:35 -0500

40 lines

Re: Plating vibrators

Leslie O. Connally

Fri, 21 Nov 1997 14:47:11 -0800

145 lines

Re: Plating vibrators

<>

Fri, 21 Nov 1997 21:05:45 -0500

36 lines

Re: Plating vibrators

Goldman, Patricia J.

Fri, 21 Nov 1997 14:52:00 PST

19 lines

Plating vibrators

sam mccorkel

Fri, 21 Nov 1997 11:16:27 -0500

22 lines

New Thread

Please take me off the list

Please take me off the list

KARLA DUGGAN

Tue, 25 Nov 1997 11:33:05 -0600

23 lines

New Thread

Printed wiring board Data standards

Printed wiring board Data standards

Corey A Peterson

Fri, 28 Nov 1997 10:10:03 -0600

39 lines

New Thread

PTFE bonding

PTFE bonding

peter dahlen

Wed, 26 Nov 1997 14:47:21 +0000

57 lines

New Thread

PTFE bonding -Reply

PTFE bonding -Reply

Fred Johnson

Wed, 26 Nov 1997 17:20:11 +0000

98 lines

New Thread

PTFE Multilayer

Re: PTFE Multilayer

Arturo J. Aguayo

Tue, 25 Nov 1997 13:53:28 -0700

111 lines

Re: PTFE Multilayer

Alan Cochrane

Mon, 24 Nov 1997 14:55:20 -0800

33 lines

PTFE Multilayer

<>

Mon, 24 Nov 1997 16:58:09 +0100

41 lines

PTFE Multilayer

peter dahlen

Mon, 24 Nov 1997 15:39:14 +0000

70 lines

New Thread

Pull Strength

Re: Pull Strength

<>

Wed, 26 Nov 1997 21:02:23 -0500

39 lines

Pull Strength

Gavin Chau

Wed, 26 Nov 1997 17:27:41 +0800

32 lines

New Thread

Pulse Rectification

Re: Pulse Rectification

Don Vischulis

Fri, 7 Nov 1997 20:07:06 -0600

46 lines

Re: Pulse Rectification

<>

Wed, 5 Nov 1997 20:06:09 -0500

26 lines

Re: Pulse Rectification

David Anderson

Wed, 5 Nov 1997 18:42:40 -0600

46 lines

Re: Pulse Rectification

[log in to unmask]

Wed, 5 Nov 1997 21:31:39 -0800

32 lines

Re: Pulse Rectification

Robert Welch

Wed, 5 Nov 1997 16:27:48 +0000

31 lines

Re: Pulse Rectification

NCPPaul @aol.com

Wed, 5 Nov 1997 10:26:50 -0500

26 lines

Re: Pulse Rectification

Afri Singh

Tue, 4 Nov 1997 19:06:02 -0500

42 lines

Pulse Rectification

George Bokisa

Tue, 4 Nov 1997 15:06:21 -0800

23 lines

New Thread

Re [TN] Blow holes

Re [TN] Blow holes

Guenter Grossmann

Fri, 21 Nov 1997 09:40:06 +0200

39 lines

New Thread

Re [TN] SOLID SOLDER DEPOSIT TECH.

Re: Re [TN] SOLID SOLDER DEPOSIT TECH.

Fulton Feng

Mon, 10 Nov 1997 19:54:18 -0500

90 lines

Re [TN] SOLID SOLDER DEPOSIT TECH.

Guenter Grossmann

Mon, 10 Nov 1997 15:07:47 +0200

43 lines

New Thread

Reference planes in microstrip

Re: Reference planes in microstrip

Raymond Klein

Wed, 26 Nov 1997 16:16:41 -0800

30 lines

New Thread

Reference planes in microstrip?

Reference planes in microstrip?

Andreas Olofsson

Wed, 26 Nov 1997 17:49:18 -0600

35 lines

New Thread

Reflow problem

Reflow problem

JOHN OSULLIVAN

Fri, 7 Nov 1997 08:01:09 -0400

47 lines

New Thread

Reliability information request

Re: Reliability information request

<>

Wed, 12 Nov 1997 00:06:08 -0500

41 lines

Reliability information request

Landes, Jeff

Tue, 11 Nov 1997 15:13:00 PST

33 lines

New Thread

Reliability of BGA

Re: Reliability of BGA

Guenter Grossmann

Thu, 20 Nov 1997 09:58:00 +0200

49 lines

Re: Reliability of BGA

Michael Jeremias

Thu, 13 Nov 1997 14:14:03 -0800

54 lines

Re: Reliability of BGA

Michael Jeremias

Thu, 13 Nov 1997 13:57:56 -0800

52 lines

Re: Reliability of BGA

Guenter Grossmann

Thu, 13 Nov 1997 10:08:55 +0200

40 lines

Re: Reliability of BGA

<>

Wed, 12 Nov 1997 21:32:15 -0500

43 lines

Reliability of BGA

D. Terstegge

Wed, 12 Nov 1997 20:01:20 +0100

30 lines

New Thread

Research paper

Research paper

Valladares, Hector A (FL51)

Wed, 12 Nov 1997 14:51:04 -0500

26 lines

New Thread

Resin Starvation

Re: Resin Starvation

<>

Mon, 10 Nov 1997 08:52:51 -0500

42 lines

Re: Resin Starvation

Phillip E. Hinton

Sun, 9 Nov 1997 21:02:12 -0500

35 lines

Resin Starvation

QUALITY

Sun, 9 Nov 1997 10:46:56 +0200

30 lines

Resin Starvation

QUALITY

Tue, 4 Nov 1997 15:25:57 +0200

29 lines

New Thread

Resist removal from tooling holes

Re: Resist removal from tooling holes

<>

Mon, 3 Nov 1997 16:09:57 PST8

21 lines

New Thread

Responses Needed Please!!Nitrogen use w/ BGA reflow

Re: Responses Needed Please!!Nitrogen use w/ BGA reflow

John Guy

Tue, 4 Nov 1997 07:37:42 -0500

126 lines

Re: Responses Needed Please!!Nitrogen use w/ BGA reflow

Graham Naisbitt

Tue, 4 Nov 1997 00:04:11 UT

73 lines

Responses Needed Please!!Nitrogen use w/ BGA reflow

Douglas H. Bennett

Mon, 3 Nov 1997 08:39:56 -0800

36 lines

New Thread

Re[2]: [TN] Liability of products

Re: Re[2]: [TN] Liability of products

Jerome Sallo

Fri, 21 Nov 1997 18:17:43 -0500

29 lines

New Thread

Re[3]: [TN] DES: Guard rings

Re: Re[3]: [TN] DES: Guard rings

Jeff Seeger

Tue, 4 Nov 1997 13:59:39 -0500

83 lines

New Thread

rogers 4003 material

Re: rogers 4003 material

Evan Jones

Thu, 20 Nov 1997 01:03:06 -0500

61 lines

Re: rogers 4003 material

Steves

Wed, 19 Nov 1997 10:40:15 +0000

28 lines

Re: rogers 4003 material

Leon Snowdon

Wed, 19 Nov 1997 11:09:56 +0000

33 lines

rogers 4003 material

Tenison Stone

Tue, 18 Nov 1997 13:51:59 -0500

25 lines

New Thread

Rogers RO-4003 Material

Rogers RO-4003 Material

Evan Jones

Thu, 20 Nov 1997 01:07:23 -0500

61 lines

Rogers RO-4003 Material

Fred Paul

Wed, 19 Nov 1997 07:51:25 -0800

39 lines

New Thread

Rogers TMM

Re: Rogers TMM

john balchunas

Fri, 21 Nov 1997 07:33:47 -0500

30 lines

Re: Rogers TMM

Arturo J. Aguayo

Thu, 20 Nov 1997 14:30:58 -0700

62 lines

Re: Rogers TMM

Sheila Smith

Thu, 20 Nov 1997 10:22:21 -0500

56 lines

Rogers TMM

<>

Thu, 20 Nov 1997 12:33:10 +0100

31 lines

New Thread

Roku-Roku Sangyo, Ltd.

Roku-Roku Sangyo, Ltd.

William E. Johnson

Fri, 21 Nov 1997 14:22:12 -0800

21 lines

New Thread

RV:

Re: RV:

CIDEIN S.L.

Mon, 17 Nov 1997 12:51:13 +0100

70 lines

Re: RV:

Per Viklund

Fri, 14 Nov 1997 12:51:25 +0100

47 lines

RV:

Circuitos Impresos Profesionales S.A.

Fri, 14 Nov 1997 12:19:09 +0100

49 lines

New Thread

RV: another hoax; PLEASE NOBODY ELSE REPLY

Re: RV: another hoax; PLEASE NOBODY ELSE REPLY

Jack Crawford

Fri, 14 Nov 1997 11:26:29 -0600

142 lines

New Thread

sales products

sales products

fxr

Sun, 9 Nov 1997 21:11:27 +0800

117 lines

New Thread

Sealing Vias

Re: Sealing Vias

Graham Naisbitt

Thu, 13 Nov 1997 17:13:30 UT

97 lines

Re: Sealing Vias

<>

Wed, 12 Nov 1997 09:04:08 EST

60 lines

Re: Sealing Vias

Erika Pacheco

Tue, 11 Nov 1997 23:18:06 -0500

54 lines

Re: Sealing Vias

<>

Tue, 11 Nov 1997 22:26:15 -0500

30 lines

Re: Sealing Vias

Dejan

Tue, 11 Nov 1997 16:04:10 -0700

29 lines

Re: Sealing Vias

<>

Tue, 11 Nov 1997 19:14:23 -0500

38 lines

Re: Sealing Vias

Chan, Marcelo

Tue, 11 Nov 1997 18:22:55 -0500

74 lines

Re: Sealing Vias

Tovey, Roxanne L

Tue, 11 Nov 1997 15:08:58 -0800

66 lines

Sealing Vias

<>

Tue, 11 Nov 1997 17:41:20 EST

35 lines

New Thread

Sealing Vias -Reply

Re: Sealing Vias -Reply

Larry Campbell

Wed, 12 Nov 1997 08:28:47 -0500

70 lines

Re: Sealing Vias -Reply

Larry Campbell

Wed, 12 Nov 1997 08:18:56 -0500

100 lines

Sealing Vias -Reply

Larry Campbell

Wed, 12 Nov 1997 08:18:13 -0500

73 lines

Re: Sealing Vias -Reply

Ron Hayashi

Tue, 11 Nov 1997 15:23:49 -0800

22 lines

Sealing Vias -Reply

Ron Hayashi

Tue, 11 Nov 1997 15:22:56 -0800

25 lines

New Thread

Shelf life requirements

Shelf life requirements

Baker,Kelly

Wed, 19 Nov 1997 07:16:09 -0500

26 lines

Re: Shelf life requirements

Aaron AB Bundy

Tue, 18 Nov 1997 14:56:43 -0700

21 lines

Shelf life requirements

Baker,Kelly

Tue, 18 Nov 1997 16:05:36 -0500

28 lines

New Thread

SHORTS CIRCUIT DURING WAVE

Re: SHORTS CIRCUIT DURING WAVE

john maxwell

Wed, 5 Nov 1997 12:24:42 -0700

47 lines

SHORTS CIRCUIT DURING WAVE

Tamir Ben-Shoshan

Wed, 5 Nov 1997 16:36:36 +0200

29 lines

New Thread

Signal Integrity Analysis

Re: Signal Integrity Analysis

Ken Patel

Mon, 3 Nov 1997 14:42:52 -0800

54 lines

Re: Signal Integrity Analysis

Jerry Cupples

Mon, 3 Nov 1997 16:05:33 -0600

64 lines

Re: Signal Integrity Analysis

Gary Crowell Sr.

Mon, 3 Nov 1997 14:27:18 -0700

43 lines

Re: Signal Integrity Analysis

Doug McKean

Mon, 3 Nov 1997 14:23:12 -0500

85 lines

Signal Integrity Analysis

Ken Patel

Mon, 3 Nov 1997 11:00:55 -0800

32 lines

New Thread

Silver chromate paper and copper mirror source

Silver chromate paper and copper mirror source

Marianne Romansky

Thu, 20 Nov 1997 16:31:47 EST

32 lines

New Thread

Silver Dendrites

Re: Silver Dendrites

Ulrich Korndoerfer

Sun, 9 Nov 1997 01:50:55 +0100

61 lines

Re: Silver Dendrites

Ralph Hersey

Sat, 8 Nov 1997 16:31:26 -0800

94 lines

Re: Silver Dendrites

CSS Asia Co., Ltd.

Sat, 8 Nov 1997 18:05:57 +0900

76 lines

Silver Dendrites

Steve

Fri, 7 Nov 1997 09:48:17 -0800

56 lines

New Thread

SIR Test Cabling

Re: SIR Test Cabling

Karen Tellefsen

Thu, 20 Nov 1997 21:00:05 -0800

58 lines

Re: SIR Test Cabling

Mike Barmuta

Thu, 20 Nov 1997 10:16:57 -0800

10 lines

SIR Test Cabling

Graham Naisbitt

Thu, 20 Nov 1997 15:51:58 UT

36 lines

New Thread

SMT and Chip assembly on Flexible PCB's

SMT and Chip assembly on Flexible PCB's

Manor Itzhak

Mon, 24 Nov 1997 10:42:18 +0200

35 lines

New Thread

SMT Component Height Restrictions

SMT Component Height Restrictions

Evan Jones

Thu, 20 Nov 1997 00:27:21 -0500

61 lines

SMT Component Height Restrictions

Lisa Anderson

Wed, 19 Nov 1997 14:04:14 -0500

28 lines

New Thread

Solder balls on SMT assy

Solder balls on SMT assy

Larry Morse

Sun, 9 Mar 1997 19:09:05 -0800

52 lines

New Thread

Solder paste inspection

Re: Solder paste inspection

Greg Parke

Mon, 17 Nov 1997 16:36:45 -0500

44 lines

Solder paste inspection

Gary Gartley

Mon, 17 Nov 1997 15:43:06 -0500

42 lines

New Thread

Solder paste inspection and incoming QC

Solder paste inspection and incoming QC

John Y. Xie

Mon, 17 Nov 1997 18:07:58 -0800

34 lines

New Thread

Solder paste inspection and incoming QC -Reply

Solder paste inspection and incoming QC -Reply

SOKKHON OU

Tue, 25 Nov 1997 12:29:46 -0600

24 lines

New Thread

Solderability

Solderability

Don Vischulis

Thu, 27 Nov 1997 08:09:33 -0600

52 lines

New Thread

SOLID SOLDER DEPOSIT TECH.

SOLID SOLDER DEPOSIT TECH.

Tamir Ben-Shoshan

Mon, 10 Nov 1997 13:37:41 +0200

28 lines

New Thread

SOT23 problems

Re: SOT23 problems

Bev Christian

Mon, 17 Nov 1997 16:59:09 -0500

67 lines

Re: SOT23 problems

<>

Wed, 12 Nov 1997 21:28:47 -0500

39 lines

Re: SOT23 problems

<>

Wed, 12 Nov 1997 20:10:58 -0500

50 lines

Re: SOT23 problems

JoAnn Amerson

Wed, 12 Nov 1997 16:03:25 +0000

38 lines

Re: SOT23 problems

<>

Wed, 12 Nov 1997 15:48:26 -0500

78 lines

Re: SOT23 problems

George H. Patrick, III

Wed, 12 Nov 1997 12:31:51 -0800

55 lines

Re: SOT23 problems

<>

Wed, 12 Nov 1997 14:51:53 -0500

87 lines

Re: SOT23 problems

Charles Barker

Wed, 12 Nov 1997 13:26:46 -0600

88 lines

Re: SOT23 problems

D. Terstegge

Wed, 12 Nov 1997 20:13:57 +0100

47 lines

Re: SOT23 problems

George H. Patrick, III

Wed, 12 Nov 1997 10:34:35 -0800

65 lines

SOT23 problems

KARLA DUGGAN

Wed, 12 Nov 1997 10:00:36 -0600

38 lines

New Thread

SOT23 problems - leadframe alloy

Re: SOT23 problems - leadframe alloy

Oliver Kierse

Mon, 17 Nov 1997 10:02:20 GMT

32 lines

New Thread

SOT23 problems -Reply

Re: SOT23 problems -Reply

Charles Barker

Thu, 13 Nov 1997 08:58:33 -0600

106 lines

Re: SOT23 problems -Reply

KARLA DUGGAN

Wed, 12 Nov 1997 14:28:05 -0600

62 lines

New Thread

Source for MIL-I-46058 Y Pattern Coupons

Re: Source for MIL-I-46058 Y Pattern Coupons

Graham Naisbitt

Wed, 26 Nov 1997 23:38:26 UT

63 lines

Source for MIL-I-46058 Y Pattern Coupons

Davis, Mary

Wed, 26 Nov 1997 13:42:48 -0800

26 lines

New Thread

Source for RF Tuning Pads, Tabs, Confetti

Source for RF Tuning Pads, Tabs, Confetti

Warren Szkolnicki

Mon, 24 Nov 1997 15:59:32 -0600

45 lines

New Thread

Source for Silver Paste for PCB Repairing

Source for Silver Paste for PCB Repairing

BPL Ltd.

Sat, 29 Nov 1997 11:09:18 +0530

40 lines

New Thread

SpeedBoard

Re: SpeedBoard

PAUL OLSON

Tue, 25 Nov 1997 22:51:15 -0600

72 lines

SpeedBoard

<>

Mon, 24 Nov 1997 10:35:36 -0800

33 lines

New Thread

Stencil Control Procedure

Stencil Control Procedure

<>

Tue, 4 Nov 1997 09:18:18 PST

36 lines

New Thread

subscribe

subscribe

<>

Tue, 18 Nov 1997 15:43:33 -0500

25 lines

subscribe

Joe Hughes

Mon, 10 Nov 1997 12:46:07 -0800

19 lines

Subscribe

<>

Wed, 5 Nov 1997 17:46:02 -0800

31 lines

subscribe

<>

Mon, 1 Jan 1996 22:01:00 +-800

19 lines

New Thread

Surface Tension in Electroplating solution.

Surface Tension in Electroplating solution.

Charles Desroches

Thu, 27 Nov 1997 14:45:57 -0500

46 lines

New Thread

SV: [TN] Mouse Bites -Reply

SV: [TN] Mouse Bites -Reply

Jan Thuesen

Tue, 25 Nov 1997 12:11:04 +0100

190 lines

New Thread

TechNet Digest - 12 Nov 1997 to 13 Nov 1997

Re: TechNet Digest - 12 Nov 1997 to 13 Nov 1997

<>

Fri, 14 Nov 1997 19:37:09 -0500

24 lines

New Thread

Teflon replacement

Re: Teflon replacement

Sheila Smith

Wed, 5 Nov 1997 13:37:38 -0500

84 lines

Re: Teflon replacement

Jerome Sallo

Wed, 5 Nov 1997 13:17:36 -0500

27 lines

Re: Teflon replacement

Bev Christian

Wed, 5 Nov 1997 13:06:59 -0500

63 lines

Teflon replacement

Lepsche, Thomas G (NM75)

Wed, 5 Nov 1997 10:11:02 -0700

30 lines

New Thread

Tempe

Tempe

Bob Vanech

Tue, 4 Nov 1997 11:11:00 -0500

31 lines

New Thread

Temperature Profiler Questions

Re: Temperature Profiler Questions

Charles Barker

Wed, 5 Nov 1997 09:48:12 -0600

67 lines

Re: Temperature Profiler Questions

Erik C. Olson

Wed, 5 Nov 1997 09:00:02 -0600

98 lines

Temperature Profiler Questions

Dennis Patrick Ishler

Sat, 1 Nov 1997 20:39:59 -0700

62 lines

Temperature Profiler Questions

Dennis Patrick Ishler

Sat, 1 Nov 1997 20:40:15 -0700

50 lines

New Thread

TH part solderability concerns

TH part solderability concerns

Benjamin A Guthrie

Fri, 24 Oct 1997 10:12:58 -0500

26 lines

New Thread

Thermal Cycle Tester

Thermal Cycle Tester

Heribert Streup

Wed, 26 Nov 1997 01:23:56 -0500

29 lines

New Thread

Thiourea free alkaline etchant

Thiourea free alkaline etchant

Steves

Mon, 3 Nov 1997 12:48:51 +0000

26 lines

New Thread

tin/lead plating

Re: tin/lead plating

Phillip E. Hinton

Thu, 6 Nov 1997 01:47:23 -0500

26 lines

tin/lead plating

Aric J Parr

Wed, 5 Nov 1997 14:50:15 -0500

33 lines

New Thread

tin/lead plating -Reply

tin/lead plating -Reply

Fred Johnson

Wed, 5 Nov 1997 20:53:18 +0000

60 lines

New Thread

Tip Soldering

Tip Soldering

Sosa, Lourdes

Sat, 1 Nov 1997 12:57:44 -0500

34 lines

New Thread

TN] BGA Mailing List

TN] BGA Mailing List

Roberto Torres

Sun, 9 Nov 1997 10:09:56 -0800

22 lines

New Thread

tombstoning

Re: tombstoning

Yuen, Mike

Tue, 25 Nov 1997 15:42:00 CST

28 lines

Re: tombstoning

Fulton Feng

Tue, 25 Nov 1997 12:25:12 -0500

63 lines

Re: tombstoning

John Guy

Tue, 25 Nov 1997 08:13:20 -0500

75 lines

Re: tombstoning

John Maxwell

Mon, 24 Nov 1997 20:48:09 -0600

28 lines

Re: tombstoning

<>

Mon, 24 Nov 1997 21:20:06 -0500

33 lines

tombstoning

Tenison Stone

Mon, 24 Nov 1997 14:40:38 -0500

30 lines

New Thread

tooling pins

Re: tooling pins

Doug Jeffery

Sat, 22 Nov 1997 18:47:03 -0600

47 lines

tooling pins

drilbert

Wed, 19 Nov 1997 20:41:50 -0800

26 lines

New Thread

totally reflow

totally reflow

Jim Mathis

Sat, 8 Nov 1997 08:37:19 -0500

26 lines

New Thread

Trace Width calculations

Re: Trace Width calculations

Ralph Hersey

Wed, 12 Nov 1997 10:10:32 -0800

65 lines

Trace Width calculations

Clint Cote

Wed, 12 Nov 1997 10:22:59 -0500

34 lines

New Thread

TSOP, TQFP reliability

Re: TSOP, TQFP reliability

Achim Neu

Sat, 29 Nov 1997 13:52:00 +0100

110 lines

Re: TSOP, TQFP reliability

Joseph Fjelstad

Fri, 28 Nov 1997 13:23:43 -0800

70 lines

Re: TSOP, TQFP reliability

<>

Fri, 28 Nov 1997 08:32:05 -0500

36 lines

Re: TSOP, TQFP reliability

Bev Christian

Thu, 27 Nov 1997 21:13:57 -0500

81 lines

TSOP, TQFP reliability

SVEBA

Thu, 27 Nov 1997 15:38:59 +0100

31 lines

New Thread

Underfill voiding in flip chips

Underfill voiding in flip chips

Nitin Juneja

Mon, 17 Nov 1997 16:52:14 EST

34 lines

New Thread

unsubscribe

unsubscribe

John Portoghese

Wed, 26 Nov 1997 07:09:00 PST

19 lines

New Thread

Unsubscrivbe help needed...

Re: Unsubscrivbe help needed...

Jana Carraway

Tue, 18 Nov 1997 10:45:47 PST

64 lines

Unsubscrivbe help needed...

Lang, Michael

Tue, 18 Nov 1997 12:58:41 -0500

26 lines

New Thread

Use half empty solder paste jar next day?

Use half empty solder paste jar next day?

Ken Patel

Wed, 26 Nov 1997 16:57:12 -0800

38 lines

New Thread

Via in Pad

Re: Via in Pad

Steve Hawn

Tue, 25 Nov 1997 08:55:34 -0800

43 lines

Via in Pad

Eddie Brunker

Tue, 25 Nov 1997 10:14:34 GMT

44 lines

New Thread

Via in Pad for BGA

Re: Via in Pad for BGA

David Hoover

Mon, 24 Nov 1997 18:41:28 -0800

38 lines

Re: Via in Pad for BGA

Alan Cochrane

Mon, 24 Nov 1997 17:40:01 -0800

34 lines

Via in Pad for BGA

Charles Elliott

Mon, 24 Nov 1997 08:24:44 -0500

36 lines

New Thread

Voids in Eutectic BGA joints

Re: Voids in Eutectic BGA joints

Bev Christian

Mon, 17 Nov 1997 16:42:50 -0500

63 lines

Re: Voids in Eutectic BGA joints

<>

Wed, 12 Nov 1997 00:15:25 -0500

33 lines

Voids in Eutectic BGA joints

<>

Tue, 11 Nov 1997 21:56:09 +0000

30 lines

New Thread

Voltage requirement of Bare Board Testing

Re: Voltage requirement of Bare Board Testing

<>

Tue, 18 Nov 1997 18:19:18 -0500

28 lines

Re: Voltage requirement of Bare Board Testing

Donald M. Hague

Tue, 18 Nov 1997 14:19:19 -0500

30 lines

Voltage requirement of Bare Board Testing

Janardhan Rao

Tue, 18 Nov 1997 13:03:24 +0530

36 lines

New Thread

Wavesolder

Re: Wavesolder

Ron Hollandsworth

Wed, 12 Nov 1997 11:21:22 -0500

61 lines

New Thread

What parameters do other companies use when

Re: What parameters do other companies use when

Doug Pauls

Fri, 7 Nov 1997 08:09:51 -0500

54 lines

New Thread

Whitehouse Machine Tools

Whitehouse Machine Tools

William E. Johnson

Sat, 15 Nov 1997 11:51:52 -0800

21 lines

New Thread

WIRE WRAPS

Re: WIRE WRAPS

Jerry Cupples

Wed, 12 Nov 1997 10:04:38 -0600

103 lines

WIRE WRAPS

Ellen Berkman

Wed, 12 Nov 1997 11:48:43 -0800

46 lines

New Thread

your mail

Re: your mail

Scott Decker

Wed, 26 Nov 1997 11:26:25 -0800

74 lines

New Thread

[AS] What parameters do other companies use when evaluating the e ffectiveness of Assembly houses builds

Re: [AS] What parameters do other companies use when evaluating the e ffectiveness of Assembly houses builds

Graham Naisbitt

Wed, 5 Nov 1997 21:31:24 UT

75 lines

[AS] What parameters do other companies use when evaluating the e ffectiveness of Assembly houses builds

Max Bernhardt

Tue, 4 Nov 1997 16:23:00 -0600

38 lines

New Thread

[TECHNET] Corner cracks in electrolytic copper plating.

Re: [TECHNET] Corner cracks in electrolytic copper plating.

Gomez, Rudy

Fri, 14 Nov 1997 18:06:34 -0800

21 lines

New Thread

[TECHNET] Gold Connector Thickness

Re: [TECHNET] Gold Connector Thickness

Pratap Singh

Wed, 5 Nov 1997 20:19:05 -0800

38 lines

New Thread

[TECHNET] unsubscribe

[TECHNET] unsubscribe

David P Ho

Sat, 1 Nov 1997 14:04:07 -0800

49 lines

New Thread

[TE] Conformal Coating

Re: [TE] Conformal Coating

Graham Naisbitt

Tue, 4 Nov 1997 22:40:10 UT

50 lines

New Thread

[TN] ASM: Water Soluble Mask

Re[2]: [TN] ASM: Water Soluble Mask

Paul Stolar

Wed, 12 Nov 1997 08:24:23 -0600

23 lines

Re[2]: [TN] ASM: Water Soluble Mask

Aric J Parr

Tue, 11 Nov 1997 09:25:35 -0500

20 lines

New Thread

[TN] ASM: Water Soluble Mask -Reply

Re[2]: [TN] ASM: Water Soluble Mask -Reply

Ron Hayashi

Wed, 12 Nov 1997 08:16:24 -0800

23 lines

New Thread

[TN] Assembly (wire bonding course)

Re[2]: [TN] Assembly (wire bonding course)

Matthew Byrne

Tue, 18 Nov 1997 10:06:23 EST

19 lines

New Thread

[TN] ASSY: Rack Covers

Re[2]: [TN] ASSY: Rack Covers

<>

Wed, 26 Nov 1997 03:11:47 -0600

36 lines

New Thread

[TN] DES: Guard rings

Re[3]: [TN] DES: Guard rings

Max Harris

Tue, 4 Nov 1997 08:28:30 -0500

29 lines

Re[2]: [TN] DES: Guard rings

Max Harris

Tue, 4 Nov 1997 08:23:23 -0500

41 lines

New Thread

[TN] foam fluxer

Re[2]: [TN] foam fluxer

<>

Thu, 20 Nov 1997 16:44:05 PST8

71 lines

New Thread

[TN] Liability of products

Re[2]: [TN] Liability of products

<>

Fri, 21 Nov 1997 11:24:03 -0800

53 lines

New Thread

[TN] Plating integrity in small vias

Re[2]: [TN] Plating integrity in small vias

<>

Mon, 24 Nov 1997 11:38:35 -0500

23 lines

New Thread

[TN] Sealing Vias

Re[2]: [TN] Sealing Vias

Matthew Byrne

Mon, 17 Nov 1997 11:39:56 EST

24 lines

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