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October 1997


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Table of Contents:

(TN): Cracked Chip Capacitor (4 messages)
***Stress Test Barrel********** (3 messages)
: ASSY: Visual Inspection. (1 message)
: FAB: FR4 material (1 message)
<No subject> (55 messages)
About BT(bismaleimide triazine) Resin ~! (1 message)
Acceptance of Panelized Boards (2 messages)
Adhesive Screen Printer Settings (1 message)
Adhesive Screen Printer Settings -Reply (3 messages)
ADMIN: New mail lists identifiers (1 message)
ADMIN: Posting messages (3 messages)
ADMIN: Posting messages. (2 messages)
ADMIN: Unwelcome posting. (1 message)
Alloy42 (7 messages)
Alpha OM700 Omegameter (2 messages)
ALTERNATIVE FINISH (7 messages)
Aluminium Entry (1 message)
Anisotropic (z-axis) conductive adhesives (2 messages)
AOI (4 messages)
Asking for subscription (1 message)
Aspect Ratio (3 messages)
assem: shape code library (1 message)
assembly (5 messages)
Assembly (Sn-Pb Solder Joint Contamination) (2 messages)
Assembly - Solder Joint Failures (1 message)
Assembly - Solderability (1 message)
Assembly Aptitude Tests (2 messages)
Assembly Inspection Equipment (1 message)
ASSY - Questionnaire - High frequency and solder paste and flux residues (2 messages)
ASSY -OSP-Preserving Solderability (4 messages)
ASSY, solder on goldfingers (1 message)
ASSY: (1 message)
Assy: Baking prior to Wave & Reflow (2 messages)
Assy: BGA stuff (3 messages)
Assy: BGA, dummies, pad finishes, stencils, profile (1 message)
Assy: BGA, dummies, pad finishes, stencils, profiles, SM opening size, Bd ma (1 message)
Assy: BGA, dummies, pad finishes, stencils, profiles, SM opening size, Bd material (1 message)
assy: Biral Lubricants found (1 message)
Assy: Cold Solder Joint (2 messages)
ASSY: Cracking of Caps Tech-note (1 message)
Assy: flux residues (1 message)
Assy: Gold plated pads (3 messages)
ASSY: Guidelines/No-Clean soldering (1 message)
ASSY: IPC Board Finish Conference Supplement to Proceedings (1 message)
ASSY: Isotropically Conductive Adhesives (2 messages)
ASSY: J-STD-030 Qualification and Performance of Flip Chip Underfill Materials (3 messages)
Assy: Placement Machine Measurement (1 message)
ASSY: SMD processing of Teflon PCB's (1 message)
Assy: SN10 Solder source (2 messages)
ASSY: Solder compatibility (2 messages)
Assy: Solder Failures (2 messages)
Assy: Soldering on gold plated pads (3 messages)
ASSY: SOLDERING TO GOLD (2 messages)
ASSY: Temperature Cycling Test Failures (5 messages)
ASSY: Using PWBs for structural applications (1 message)
Assy: Water Soluble Flux (6 messages)
ASSY:PCB Assy that is Potted (1 message)
ASSY:PCB Assy that is Potted -Reply (1 message)
assy:stencil cleaner (3 messages)
Assy:Use of xray equipment needed! (5 messages)
Automated Inspection Equipment (4 messages)
Axial Part Age (2 messages)
Bed-o-nails testing (4 messages)
Benchmarking (6 messages)
Benchmarking - BURIED CAPACITANCE - LASER TECH (1 message)
Benchmarking - BURIED CAPACITANCE - LASER TECHNOLOGY (2 messages)
BGA Joint Reliability Under "Static" Stress (2 messages)
Brittle Solder Joints (1 message)
Brittle Solder Joints N (6 messages)
building virtual PCBs (2 messages)
Buried Resistor Testing (3 messages)
Burn-in / Stress screening (1 message)
CAD system: UltiBoard (1 message)
Call for Data on Airborne Lead Concentrations from Soldering Operations (2 messages)
Call for Data on Airborne Lead Concentrations fromSolderingOperations (1 message)
CAM operator salaries (2 messages)
CANADIAN PROPOSAL TO REDUCE LEAD CONTENT IN CHILDREN'S/CONSUMER PRODUCTS (1 message)
career opportunity (1 message)
CIC smutting (1 message)
COB footprint (1 message)
Company Named AAT (4 messages)
Component Failure Analysis (5 messages)
Component Pricing Trends (2 messages)
Component Shelf Life (1 message)
Conduction cooled PCB (1 message)
CONFORMAL COATING REPAIR (3 messages)
Conformal coating study (1 message)
Confused! (1 message)
Corner cracks in electrolytic copper plating. (2 messages)
Cost of Gold Plating (2 messages)
cover blind vias (1 message)
Cracked Chip Capacitor (1 message)
Cracked Conductors (3 messages)
Cracked solder on NiAu (1 message)
Cracking of 1206 compo (2 messages)
Crazing, Information Request (1 message)
Cupric Chloride (3 messages)
Cupric Chloride Etchant (8 messages)
Dear Dhswan: (1 message)
Definition of controlled impedance ? (4 messages)
DES Autoload Equipment (1 message)
DES, FAB, ASSY: Standards (3 messages)
DES: COB Design Guide (1 message)
DES: PCB Mounting (2 messages)
Design: Shield Layer Relief and Shielding Effectiveness (1 message)
DESIGN: tin-antimony solders (1 message)
Developing question (8 messages)
dielectric data E-glass fiber (2 messages)
Drill mach. (1 message)
Drill Tips. (1 message)
Englemaier?? (1 message)
Enquiry on FR4 material (1 message)
ENVIRONMENTAL CONTROL (1 message)
Environmental Stress Screening (1 message)
ESD Handling of RNR & RNC Resistors (2 messages)
ESD Standards (3 messages)
Exposed copper pads/Immersion NiAu (5 messages)
fab, cleanrooms rating (3 messages)
FAB: Artwotk maintenance (1 message)
FAB: Bellcore spec (2 messages)
FAB: BOARD SOLDERABILITY (4 messages)
FAB: Datecode Marking (2 messages)
FAB: Electrical Testers (1 message)
FAB: Gold Finger Extensions (2 messages)
FAB: HASL Temp. (3 messages)
FAB: HASL Temp.(Reply) (1 message)
FAB: Ionic Contamination Measurements (1 message)
FAB: Kodak vs Agfa (2 messages)
Fab: Packaging (3 messages)
FAB: Silver-filled epoxy with tin or solder (3 messages)
FAB: Stage Micrometer Calibration Service (3 messages)
FAB: surface prep for bonding (2 messages)
FAB: Tin / Lead finish (1 message)
Fab: Voids in resin filled via (1 message)
FABMASTER (1 message)
Fiberoptic device handling (4 messages)
Fischer Precision Spindles (1 message)
Fixing Warped Assemblies (2 messages)
Flex Circuit Assy/Fab (1 message)
flexible polyester circuits (1 message)
Fluoride and Halide in flux tests. (1 message)
fracture resistance (1 message)
Free!!! 125 sex channels when u join (2 messages)
Fw: Fw: [TECHNET] ASSY:PCB Assy that is Potted (1 message)
FW: Torque (2 messages)
FW: [TECHNET] assem: shape code library (1 message)
FW: [TECHNET] Assembly Inspection Equipment (1 message)
FW: [TECHNET] ASSY: Conformal Coating Coverage (2 messages)
FW: [TECHNET] Assy: Soldering on gold plated pads (3 messages)
FW: [TECHNET] Brittle Solder Joints N (2 messages)
FW: [TECHNET] CANADIAN PROPOSAL TO REDUCE LEAD CONTENT IN CHILDREN'S/CONSUMER PRODUCTS (1 message)
FW: [TECHNET] Design of Experiments soft (2 messages)
FW: [TECHNET] FAB: software to view gerber (1 message)
FW: [TECHNET] Need help on solder paste stencils (2 messages)
FW: [TECHNET] SCreenprinting (1 message)
FW: [TECHNET] SMT soldering (1 message)
FW: [TECHNET] Solder Stencil Guidelines Wanted... (1 message)
FW: [TECHNET] TEchnet (1 message)
FW: [TECHNET] Testing of Solder (1 message)
FW: [TECHNET] X-Ray Inspection Equipment (1 message)
FW: [TECHNET] [Technet] Assy: Placement Machine Measurement (1 message)
Gas Mystery (1 message)
GEN Know errors in IPC-sm-840C (1 message)
GEN: MIL-PRF-31032 Certification/Qualification (2 messages)
General Question (2 messages)
Gold and BGA devices (1 message)
Gold for BGA (1 message)
Gold Immersion Plating (4 messages)
Gold Potassium Cyanide (GPC) supply (1 message)
Gold Slivers (6 messages)
Gov't Sales (1 message)
Grey Scale Machine Vision (1 message)
Halide free cable for SIR testing (1 message)
hard gold/immersion gold finish (2 messages)
Hardest photoimageable solder mask (1 message)
Heatsink lamination (9 messages)
Help (1 message)
Hole wall pullaway (2 messages)
Hot Air soldering pencil. (1 message)
Immersion / Electroless (3 messages)
Immersion / Electroless,Reply (1 message)
Immersion AU, NPTH Deposits (2 messages)
Inboard Ni/Au contacts (1 message)
insulation resistance testing (2 messages)
Invitation & Call for Panelists for free DfE Making Holes Conductive Seminar on Nov 13 in Phoenix (1 message)
Ionic Contam. Testers (1 message)
IPC 1710 (2 messages)
IPC spec for Electrical Test on BGA substrate (1 message)
IPCchat session announcement (1 message)
Kaizen FCR (2 messages)
Laminate designations (3 messages)
Land to Lead Ratio (4 messages)
Laser benchmarking (2 messages)
Layman's guide for J-STD-001B (8 messages)
LED Sorting (1 message)
Legend ink (3 messages)
Lengthening stencil opennings under fine pitch parts. (1 message)
Lifted Lands in Assemblies (2 messages)
Lifted Lands per IPC-6012 (3 messages)
Line staffing (1 message)
Looking for ANSI symbol documention (1 message)
Low Temp Bake for Plastic Parts (1 message)
Making hole quality sections (2 messages)
Material handling (2 messages)
Measurement Specification (1 message)
Mechanically attached Heat Sinks (1 message)
MIL Specification (2 messages)
MIL-STD Cleanliness spec. (3 messages)
MillipaQ 80s (1 message)
minimum distance a hole can be drilled from the edge (4 messages)
minimum distance a hole can be drilled from the edge -Reply (1 message)
Need help on solder paste stencils (1 message)
Nitrogen use w/ BGA reflow (1 message)
Nitrogen use w/ BGA reflow (jocularity) (1 message)
obsolete transistor (3 messages)
OSP y OSP (1 message)
Palladium (10 messages)
Palladium -Reply (1 message)
Part Numbering Systems (7 messages)
PC card (populated) burn-in (1 message)
PCB Designers (1 message)
PCB goldfingers (1 message)
PCMCIA INFO (5 messages)
Phosporised Copper anodes (2 messages)
pill package (1 message)
Pill Style Metal Can Package, Honeywell (1 message)
Planar Magnetics (1 message)
Plastic Parts Questions... (2 messages)
Plastic Parts: Low Temperature Bake! (2 messages)
PNP Info (1 message)
Pollution Prevention/Green Manufacturing Conference in Atlanta (1 message)
positive dry film resist (3 messages)
Post separation & Resin smear (1 message)
Post separation & Resin smear -Reply (1 message)
Press Fit and Ni/Au Surface Finish (5 messages)
Preventive maintenance software (2 messages)
Proceeding IPC Works 97 (2 messages)
PTFE laminates. (4 messages)
Pull and cross-section test (1 message)
Punch (2 messages)
Re : Part Numbering Systems (1 message)
RE : [TECHNET] [Technet]: FAB: FR4 material (2 messages)
Receipt of 10/8/97 2:39PM message (1 message)
Reliability Testing New SIR developments (1 message)
REPLY- BOARD SOLDERABILITY (1 message)
Request For Info (1 message)
Resin Blocking on Sequential Lamination (2 messages)
Resin Blocking on Sequential Lamination -Reply (1 message)
RESIST DEFINED LANDS (3 messages)
Resist removal from tooling holes (3 messages)
Results of BGA issues questions to TechNet. (1 message)
RMA flux on PEMs (1 message)
Roku-Roku (1 message)
Roku-Roku Model GR435N high speed milling machine (1 message)
Rotary Dip Solderability Fixture (3 messages)
Screening & Inspection Services needed (1 message)
SCreenprinting (1 message)
signoff technet (2 messages)
SIR developments (3 messages)
SIR Testing (3 messages)
SIR Testing New developments (6 messages)
small via on thick fab (5 messages)
SMT Connectors plating (1 message)
SMT soldering (4 messages)
SMT Tolerance (1 message)
SMUTTING (9 messages)
Software Programming Negotiations (1 message)
solder balls (1 message)
Solder Joint Failures (1 message)
solder joint thickness (2 messages)
SOLDER MASK T-UP (2 messages)
Solder paste inspection equipment (2 messages)
SOLDER PASTE ON FIDUCI (1 message)
SOLDER PASTE ON FIDUCIALS (4 messages)
Solder resist blisters (4 messages)
Solder Stencil Guidelines Wanted... (2 messages)
solder-ball free LPISM? (2 messages)
Solderability requirements per ANSI/J-STD-002 (2 messages)
solderballs (2 messages)
Source for temperature-indicating labels (3 messages)
Sparkgaps (2 messages)
SPC for primary image process (2 messages)
Spraying Matte LPI (1 message)
Static charge on PCB lamin (1 message)
Static charge on PCB laminate (1 message)
steam age (3 messages)
Stencil printing problems (1 message)
subscribe (4 messages)
Suppliers of Teflon Material (4 messages)
SV: [TECHNET] Inboard Ni/Au contacts (1 message)
Switch To Immersion Gold (1 message)
Tape and Reel (1 message)
TEchnet (1 message)
Temperature and humidity parameters (1 message)
Test Fixture Generation (1 message)
Test Laboratory (3 messages)
test method (2 messages)
Time Way Software (2 messages)
Tombstoning (2 messages)
ULTIboard (1 message)
UNSUBSCRIBE (2 messages)
Using crystals in refow (1 message)
Via Hole ratio's (5 messages)
Viod Inspect (4 messages)
Volume resistivity (1 message)
waste treatment (8 messages)
Water Quality (1 message)
WAVE SOLDER DROSS & MARBLES (3 messages)
Wave Solder Profile Questions (1 message)
Wave soldering SMD actives (5 messages)
Wire Bonder Comments (1 message)
X-Ray Inspection Equipment (3 messages)
X-section Mounting Media (8 messages)
XRF (1 message)
YTECHNET? IMMERSION AU, NPTH DEPOSITS (1 message)
YTN? RESIST REMOVAL FROM TOOLING HOLES (1 message)
[Fwd: Re: PC card (populated) burn-in] (1 message)
[TECHNET] Assembly (2 messages)
[TECHNET] Assy: BGA, dummies, pad finishes, stencils, profiles, SM o (1 message)
[TECHNET] ASSY: Solder compatibility (5 messages)
[TECHNET] Assy: Solder Failures (1 message)
[TECHNET] Cupric Chloride Etchant (4 messages)
[TECHNET] Exposed copper pads/Immersion NiAu (1 message)
[TECHNET] Gold and BGA devices (4 messages)
[TECHNET] Inboard Ni/Au contacts (1 message)
[TECHNET] Lifted Lands per IPC-6012 (2 messages)
[TECHNET] PTFE laminates. (3 messages)
[TECHNET] PTFE laminates. -Reply (1 message)
[TECHNET] RE:FAB Date Codes (1 message)
[TECHNET] Resist Defined Lands (1 message)
[TECHNET] SIR developments (1 message)
[TECHNET] Solder resist blisters (1 message)
[TECHNET] Sparkgaps (1 message)
[Technet]: FAB: FR4 material (3 messages)
[Technet]: FAB: Specificition (2 messages)
[TERNATE] Cracking of 1206 components (1 message)
[TN] FAB: Kodak vs Agfa (1 message)
[TN] Free!!! 125 sex channels when u join (1 message)
[T] Brittle Solder Joints (2 messages)
[T] Corner cracks in electrolytic copper plating. (1 message)
[T] Cracking of 1206 components (4 messages)
[T] Englemaier?? (1 message)
[T] Gold Immersion Plating (1 message)
[T] Gold Immersion Plating -Reply (1 message)
[T] PC card (populated) burn-in (1 message)
[T] Post separation & Resin smear (1 message)
[T] Pull and cross-section test (1 message)
[T] Request For Info (1 message)
[T] RESIST DEFINED LANDS (2 messages)
[T] RESIST DEFINED LANDS, amongst other things ... (1 message)
[T] Solder compatibility (1 message)
[T] Solder Failures (1 message)
[T] Soldering on gold plated pads (1 message)
[T]*Stress Test Barrel********** (2 messages)
[T]BGA stuff (2 messages)

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Subject Sorted by Subject, Chronologically

From

Date

Size

New Thread

(TN): Cracked Chip Capacitor

(TN): Cracked Chip Capacitor

Poh Kong Hui <[log in to unmask]>

Fri, 24 Oct 1997 22:52:39 +0800

30 lines

Re: (TN): Cracked Chip Capacitor

Pratap Singh <[log in to unmask]>

Sun, 26 Oct 1997 15:21:52 -0800

32 lines

Re: (TN): Cracked Chip Capacitor

Jim Mathis <[log in to unmask]>

Mon, 27 Oct 1997 10:46:39 -0500

20 lines

Re: (TN): Cracked Chip Capacitor

[log in to unmask]

Mon, 27 Oct 1997 20:39:56 -0500

42 lines

New Thread

***Stress Test Barrel**********

***Stress Test Barrel**********

[log in to unmask]

Wed, 1 Oct 1997 15:13:30 MST

44 lines

Re: ***Stress Test Barrel**********

Phillip E. Hinton <[log in to unmask]>

Wed, 1 Oct 1997 22:06:01 -0400

27 lines

Re: ***Stress Test Barrel**********

mhu <[log in to unmask]>

Wed, 15 Oct 1997 18:07:01 PST

21 lines

New Thread

: ASSY: Visual Inspection.

: ASSY: Visual Inspection.

Poh Kong Hui <[log in to unmask]>

Thu, 30 Oct 1997 22:55:00 +0800

30 lines

New Thread

: FAB: FR4 material

Re: : FAB: FR4 material

Karl Sauter <[log in to unmask]>

Fri, 10 Oct 1997 08:59:24 -0700

19 lines

New Thread

<No subject>

<No subject>

Tuesday, September 30, 1997 8:16PM

36 lines

<No subject>

9/29/97 10:43 PM

41 lines

<No subject>

10/1/97 10:12 AM

38 lines

<No subject>

10/1/97 6:43 PM

33 lines

<No subject>

Martin Bourke <[log in to unmask]>

Fri, 3 Oct 1997 02:07:37 +0100

54 lines

<No subject>

10/3/97 1:42 AM

37 lines

<No subject>

Thursday, October 02, 1997 9:07PM

81 lines

<No subject>

Charles Desroches <[log in to unmask]>

Fri, 3 Oct 1997 12:50:01 -0400

21 lines

<No subject>

10/3/97 2:25 PM

37 lines

<No subject>

10/7/97 6:48 AM

37 lines

<No subject>

Tuesday, October 07, 1997 9:01 AM

90 lines

<No subject>

Tuesday, October 07, 1997 1:06 PM

112 lines

<No subject>

10/7/97 10:56 PM

31 lines

<No subject>

Tuesday, October 07, 1997 1:06 PM

126 lines

<No subject>

10/8/97 8:36 AM

38 lines

<No subject>

24 September, 1997 13:10

89 lines

<No subject>

10/8/97 2:54 PM

41 lines

<No subject>

10/8/97 2:54 PM

54 lines

<No subject>

10/8/97 08:36

38 lines

<No subject>

10/13/97

18 lines

<No subject>

Monday, October 13, 1997 6:13 AM

106 lines

<No subject>

10/14/97 1:10 PM

46 lines

<No subject>

10/14/97 1:10 PM

87 lines

<No subject>

10/15/97 8:06 AM

60 lines

<No subject>

15 October, 1997 10:14

41 lines

<No subject>

10/15/97 2:42 PM

44 lines

<No subject>

10/15/97 5:19 PM

44 lines

<No subject>

10/1/97 3:08 PM

53 lines

<No subject>

Denis Meloche <[log in to unmask]>

Thu, 16 Oct 1997 09:04:26 -0500

27 lines

<No subject>

10/16/97 12:26 PM

84 lines

<No subject>

Thursday, October 16, 1997 2:52PM

45 lines

<No subject>

Thursday, October 16, 1997 1:54PM

52 lines

<No subject>

B.N.Maruthi <[log in to unmask]>

Fri, 17 Oct 1997 21:53:07 +0530

25 lines

<No subject>

Thursday, October 16, 1997 9:33PM

19 lines

<No subject>

10/20/97 9:52 AM

48 lines

<No subject>

10/21/97 10:31 AM

36 lines

<No subject>

10/21/97 11:49 AM

35 lines

<No subject>

10/22/97 10:16 AM

55 lines

<No subject>

Wednesday, October 22, 1997 11:31AM

37 lines

<No subject>

10/22/97

18 lines

<No subject>

10/23/97 1:15 PM

72 lines

<No subject>

10/23/97 1:15 PM

83 lines

<No subject>

Thursday, October 23, 1997 8:57AM

98 lines

<No subject>

10/23/97 9:41 AM

55 lines

<No subject>

10/23/97 9:41 AM

64 lines

<No subject>

Tuesday, October 21, 1997 3:15PM

50 lines

<No subject>

Bev Christian <[log in to unmask]>

Fri, 24 Oct 1997 08:30:09 -0400

46 lines

<No subject>

10/23/97 4:19 PM

44 lines

<No subject>

10/27/97 6:44 AM

34 lines

<No subject>

10/27/97 2:30 PM

52 lines

<No subject>

Tuesday, October 28, 1997 2:15PM

24 lines

<No subject>

10/29/97 4:22 PM

35 lines

<No subject>

Thursday, October 30, 1997 11:28 AM

34 lines

<No subject>

Roger Roseum <[log in to unmask]>

Thu, 30 Oct 1997 15:40:09 -0500

35 lines

<No subject>

Tuesday, October 28, 1997 2:15PM

35 lines

New Thread

About BT(bismaleimide triazine) Resin ~!

About BT(bismaleimide triazine) Resin ~!

[log in to unmask]

Fri, 24 Oct 1997 10:37:00 +0900

32 lines

New Thread

Acceptance of Panelized Boards

Acceptance of Panelized Boards

Lainie Loveless <[log in to unmask]>

Wed, 22 Oct 1997 15:06:55 -0500

33 lines

Re: Acceptance of Panelized Boards

Bev Christian <[log in to unmask]>

Wed, 22 Oct 1997 16:55:01 -0400

74 lines

New Thread

Adhesive Screen Printer Settings

Adhesive Screen Printer Settings

Erik Olson <[log in to unmask]>

Fri, 10 Oct 1997 07:43:20 -0500

34 lines

New Thread

Adhesive Screen Printer Settings -Reply

Adhesive Screen Printer Settings -Reply

MIKE J. LOPEZ <[log in to unmask]>

Wed, 15 Oct 1997 08:06:36 -0400

50 lines

Re: Adhesive Screen Printer Settings -Reply

Paul Stolar <[log in to unmask]>

Wed, 15 Oct 1997 08:31:20 -0600

24 lines

Re: Adhesive Screen Printer Settings -Reply

MIKE J. LOPEZ <[log in to unmask]>

Thu, 16 Oct 1997 07:21:14 -0400

26 lines

New Thread

ADMIN: New mail lists identifiers

ADMIN: New mail lists identifiers

Dmitriy Sklyar <[log in to unmask]>

Wed, 22 Oct 1997 10:20:00 -0500

47 lines

New Thread

ADMIN: Posting messages

Re: ADMIN: Posting messages

Peter Willaert <[log in to unmask]>

Fri, 24 Oct 1997 18:28:57 +0200

30 lines

Re: ADMIN: Posting messages

Richard Hamilton -TEST <[log in to unmask]>

Fri, 24 Oct 1997 09:48:51 -0700

63 lines

Re: ADMIN: Posting messages

Steves <[log in to unmask]>

Fri, 24 Oct 1997 13:12:20 +0000

24 lines

New Thread

ADMIN: Posting messages.

ADMIN: Posting messages.

Dmitriy Sklyar <[log in to unmask]>

Fri, 24 Oct 1997 10:49:50 -0500

47 lines

Re: ADMIN: Posting messages.

Bev Christian <[log in to unmask]>

Fri, 24 Oct 1997 12:12:40 -0400

78 lines

New Thread

ADMIN: Unwelcome posting.

ADMIN: Unwelcome posting.

Dmitriy Sklyar <[log in to unmask]>

Mon, 27 Oct 1997 10:32:52 -0600

68 lines

New Thread

Alloy42

Alloy42

tonghh <[log in to unmask]>

Thu, 30 Oct 1997 20:22:15 +0800

30 lines

Re: Alloy42

Robert Schetty <[log in to unmask]>

Thu, 30 Oct 1997 14:18:13 UT

55 lines

Re: Alloy42

[log in to unmask]

Thu, 30 Oct 1997 11:24:48 -0500

35 lines

Re: Alloy42

[log in to unmask]

Thu, 30 Oct 1997 11:43:29 -0500

29 lines

Re: Alloy42

Dan Brandler <[log in to unmask]>

Thu, 30 Oct 1997 11:41:04 -0800

49 lines

Re: Alloy42

tonghh <[log in to unmask]>

Fri, 31 Oct 1997 22:21:13 +0800

56 lines

Re: Alloy42

tonghh <[log in to unmask]>

Fri, 31 Oct 1997 22:33:02 +0800

90 lines

New Thread

Alpha OM700 Omegameter

Alpha OM700 Omegameter

Valli Robert <[log in to unmask]>

Fri, 10 Oct 1997 08:02:00 -0400

31 lines

Re: Alpha OM700 Omegameter

[log in to unmask]

Sat, 11 Oct 1997 09:24:59 +0100

69 lines

New Thread

ALTERNATIVE FINISH

ALTERNATIVE FINISH

Eddie Brunker <[log in to unmask]>

Fri, 24 Oct 1997 18:41:03 +0100

71 lines

Re: ALTERNATIVE FINISH

[log in to unmask]

Sat, 25 Oct 1997 12:08:42 -0400

35 lines

Re: ALTERNATIVE FINISH

Bev Christian <[log in to unmask]>

Sat, 25 Oct 1997 19:11:58 -0400

111 lines

Re: ALTERNATIVE FINISH

Bev Christian <[log in to unmask]>

Sat, 25 Oct 1997 19:25:22 -0400

98 lines

Re: ALTERNATIVE FINISH

[log in to unmask]

Sun, 26 Oct 1997 09:25:51 -0500

30 lines

Re: ALTERNATIVE FINISH

-Bob Daniels, Jr - ECC Corp. <[log in to unmask]>

Sun, 26 Oct 1997 10:12:44 -0500

45 lines

Re: ALTERNATIVE FINISH

[log in to unmask]

Sun, 26 Oct 1997 18:58:13 -0500

84 lines

New Thread

Aluminium Entry

Aluminium Entry

H.N.Muralidhara <[log in to unmask]>

Tue, 28 Oct 1997 09:11:00 +0530

54 lines

New Thread

Anisotropic (z-axis) conductive adhesives

Anisotropic (z-axis) conductive adhesives

belanw <[log in to unmask]>

Wed, 15 Oct 1997 10:00:45 -0400

33 lines

Re: Anisotropic (z-axis) conductive adhesives

D.C.Whalley <[log in to unmask]>

Wed, 15 Oct 1997 16:49:03 -0400

61 lines

New Thread

AOI

AOI

sam mccorkel <[log in to unmask]>

Thu, 2 Oct 1997 08:40:25 -0400

31 lines

Re: AOI

Roland Jaquet <[log in to unmask]>

Wed, 8 Oct 1997 09:50:41 +0100

60 lines

AOI

sam mccorkel <[log in to unmask]>

Wed, 8 Oct 1997 10:18:26 -0400

38 lines

Re: AOI

OMNI High Tech Industries Ltd. (OHTIL) <[log in to unmask]>

Thu, 9 Oct 1997 18:53:19 +0600

43 lines

New Thread

Asking for subscription

Asking for subscription

Johnny Ng <[log in to unmask]>

Mon, 27 Oct 1997 15:36:15 -0800

28 lines

New Thread

Aspect Ratio

Aspect Ratio

Bilal Khalaf <[log in to unmask]>

Wed, 1 Oct 1997 09:39:00 PDT

32 lines

Re: Aspect Ratio

Alan Cochrane <[log in to unmask]>

Thu, 2 Oct 1997 16:19:36 -0700

35 lines

Re: Aspect Ratio

Bill Jenkins <[log in to unmask]>

Thu, 2 Oct 1997 18:29:36 -0700

55 lines

New Thread

assem: shape code library

assem: shape code library

Marie-Josee Lambert <[log in to unmask]>

Wed, 1 Oct 1997 11:52:38 -0400

46 lines

New Thread

assembly

assembly

Vertefeuille, Russ (AZ77) <[log in to unmask]>

Thu, 2 Oct 1997 14:34:16 -0500

31 lines

Assembly

Robert Schetty <[log in to unmask]>

Mon, 20 Oct 1997 15:56:31 UT

27 lines

Re: Assembly

Charles Barker <[log in to unmask]>

Mon, 20 Oct 1997 11:31:26 -0500

26 lines

Re: Assembly

Terry Zhu <[log in to unmask]>

Mon, 20 Oct 1997 14:11:17 -0400

27 lines

Re: Assembly

Robert Schetty <[log in to unmask]>

Tue, 21 Oct 1997 18:46:06 UT

53 lines

New Thread

Assembly (Sn-Pb Solder Joint Contamination)

Re: Assembly (Sn-Pb Solder Joint Contamination)

Robert Schetty <[log in to unmask]>

Mon, 27 Oct 1997 16:08:36 UT

40 lines

Re: Assembly (Sn-Pb Solder Joint Contamination)

Robert Schetty <[log in to unmask]>

Thu, 30 Oct 1997 17:19:09 UT

90 lines

New Thread

Assembly - Solder Joint Failures

Assembly - Solder Joint Failures

TED JONES <[log in to unmask]>

Wed, 29 Oct 1997 13:27:16 -0500

36 lines

New Thread

Assembly - Solderability

Assembly - Solderability

David D Hillman <[log in to unmask]>

Sun, 12 Oct 1997 19:10:44 -0500

36 lines

New Thread

Assembly Aptitude Tests

Assembly Aptitude Tests

Brian Husnik <[log in to unmask]>

Wed, 1 Oct 1997 14:51:03 -0600

40 lines

Re: Assembly Aptitude Tests

Doug Pauls <[log in to unmask]>

Thu, 2 Oct 1997 12:31:04 -0400

26 lines

New Thread

Assembly Inspection Equipment

Assembly Inspection Equipment

Brian Husnik <[log in to unmask]>

Thu, 9 Oct 1997 16:20:57 -0600

56 lines

New Thread

ASSY - Questionnaire - High frequency and solder paste and flux residues

ASSY - Questionnaire - High frequency and solder paste and flux residues

Karen Tellefsen <[log in to unmask]>

Thu, 9 Oct 1997 16:41:25 -0400

68 lines

Re: ASSY - Questionnaire - High frequency and solder paste and flux residues

Graham Naisbitt <[log in to unmask]>

Thu, 9 Oct 1997 22:20:48 UT

113 lines

New Thread

ASSY -OSP-Preserving Solderability

ASSY -OSP-Preserving Solderability

[log in to unmask]

Wed, 15 Oct 1997 17:19:31 -0400

36 lines

Re: ASSY -OSP-Preserving Solderability

Charles Barker <[log in to unmask]>

Wed, 15 Oct 1997 16:59:23 -0500

64 lines

Re: ASSY -OSP-Preserving Solderability

[log in to unmask]

Wed, 15 Oct 1997 15:05:01 PST

15 lines

Re: ASSY -OSP-Preserving Solderability

[log in to unmask]

Wed, 15 Oct 1997 15:11:04 -0700

39 lines

New Thread

ASSY, solder on goldfingers

ASSY, solder on goldfingers

Patrick Ducas <[log in to unmask]>

Tue, 7 Oct 1997 11:52:56 -0400

46 lines

New Thread

ASSY:

ASSY:

[log in to unmask]

Wed, 1 Oct 1997 12:16:58 -0400

28 lines

New Thread

Assy: Baking prior to Wave & Reflow

Assy: Baking prior to Wave & Reflow

Lainie Loveless <[log in to unmask]>

Thu, 23 Oct 1997 11:10:33 -0500

33 lines

Re: Assy: Baking prior to Wave & Reflow

Bev Christian <[log in to unmask]>

Thu, 23 Oct 1997 13:37:37 -0400

65 lines

New Thread

Assy: BGA stuff

Assy: BGA stuff

Charles Barker <[log in to unmask]>

Tue, 14 Oct 1997 15:41:05 -0500

98 lines

Re: Assy: BGA stuff

Greg Bartlett <[log in to unmask]>

Wed, 15 Oct 1997 10:18:48 +0000

113 lines

Re: Assy: BGA stuff

Maguire, James F <[log in to unmask]>

Wed, 15 Oct 1997 11:57:19 -0700

174 lines

New Thread

Assy: BGA, dummies, pad finishes, stencils, profile

Assy: BGA, dummies, pad finishes, stencils, profile

Jim Marsico 516-595-5879 <[log in to unmask]>

Mon, 13 Oct 1997 07:53:00 -0400

18 lines

New Thread

Assy: BGA, dummies, pad finishes, stencils, profiles, SM opening size, Bd ma

Assy: BGA, dummies, pad finishes, stencils, profiles, SM opening size, Bd ma

Marshall Canaday <[log in to unmask]>

Fri, 10 Oct 1997 16:36:36 -0400

28 lines

New Thread

Assy: BGA, dummies, pad finishes, stencils, profiles, SM opening size, Bd material

Assy: BGA, dummies, pad finishes, stencils, profiles, SM opening size, Bd material

Charles Barker <[log in to unmask]>

Fri, 10 Oct 1997 11:34:33 -0500

78 lines

New Thread

assy: Biral Lubricants found

assy: Biral Lubricants found

Jerry Cupples <[log in to unmask]>

Mon, 20 Oct 1997 11:23:31 -0500

47 lines

New Thread

Assy: Cold Solder Joint

Assy: Cold Solder Joint

Dan Babcock <[log in to unmask]>

Wed, 8 Oct 1997 14:48:58 MDT

30 lines

Re: Assy: Cold Solder Joint

David D Hillman <[log in to unmask]>

Sun, 12 Oct 1997 18:47:45 -0500

39 lines

New Thread

ASSY: Cracking of Caps Tech-note

ASSY: Cracking of Caps Tech-note

Gary D. Peterson <[log in to unmask]>

Fri, 3 Oct 1997 09:44:31 -0600

122 lines

New Thread

Assy: flux residues

Assy: flux residues

Blanchet,Richard <[log in to unmask]>

Tue, 21 Oct 1997 17:50:00 -0400

31 lines

New Thread

Assy: Gold plated pads

Assy: Gold plated pads

Blanchet,Richard <[log in to unmask]>

Thu, 16 Oct 1997 14:52:00 -0400

37 lines

Re: Assy: Gold plated pads

Larry Tawyea <[log in to unmask]>

Thu, 16 Oct 1997 15:00:12 -0500

61 lines

Re: Assy: Gold plated pads

Goldman, Patricia J. <[log in to unmask]>

Thu, 16 Oct 1997 16:31:00 PDT

17 lines

New Thread

ASSY: Guidelines/No-Clean soldering

ASSY: Guidelines/No-Clean soldering

[log in to unmask]

Thu, 2 Oct 1997 14:19:28 -0400

36 lines

New Thread

ASSY: IPC Board Finish Conference Supplement to Proceedings

ASSY: IPC Board Finish Conference Supplement to Proceedings

Jack Crawford <[log in to unmask]>

Thu, 23 Oct 1997 11:32:21 -0500

30 lines

New Thread

ASSY: Isotropically Conductive Adhesives

ASSY: Isotropically Conductive Adhesives

Jack Crawford <[log in to unmask]>

Tue, 21 Oct 1997 11:03:42 -0500

31 lines

Re: ASSY: Isotropically Conductive Adhesives

John Guy <[log in to unmask]>

Tue, 21 Oct 1997 13:35:05 -0500

68 lines

New Thread

ASSY: J-STD-030 Qualification and Performance of Flip Chip Underfill Materials

ASSY: J-STD-030 Qualification and Performance of Flip Chip Underfill Materials

Jack Crawford <[log in to unmask]>

Fri, 24 Oct 1997 12:35:33 -0500

40 lines

ASSY: J-STD-030 Qualification and Performance of Flip Chip Underfill Materials

Jack Crawford <[log in to unmask]>

Fri, 24 Oct 1997 15:06:17 -0500

41 lines

Re: ASSY: J-STD-030 Qualification and Performance of Flip Chip Underfill Materials

[log in to unmask]

Mon, 27 Oct 1997 08:32:10 +0000

21 lines

New Thread

Assy: Placement Machine Measurement

Re: Assy: Placement Machine Measurement

Poh Kong Hui <[log in to unmask]>

Sun, 26 Oct 1997 22:58:58 +0800

27 lines

New Thread

ASSY: SMD processing of Teflon PCB's

ASSY: SMD processing of Teflon PCB's

Jos Aarninkhof <[log in to unmask]>

Tue, 28 Oct 1997 08:25:32 +0100

37 lines

New Thread

Assy: SN10 Solder source

Assy: SN10 Solder source

Jim Marsico 516-595-5879 <[log in to unmask]>

Fri, 10 Oct 1997 15:00:00 -0400

40 lines

Re: Assy: SN10 Solder source

David D Hillman <[log in to unmask]>

Sun, 12 Oct 1997 18:57:07 -0500

29 lines

New Thread

ASSY: Solder compatibility

ASSY: Solder compatibility

Sheila Smith <[log in to unmask]>

Tue, 21 Oct 1997 11:05:36 -0400

29 lines

Re: ASSY: Solder compatibility

Phillip E. Hinton <[log in to unmask]>

Tue, 21 Oct 1997 13:53:30 -0400

33 lines

New Thread

Assy: Solder Failures

Assy: Solder Failures

[log in to unmask]

Tue, 21 Oct 1997 08:52:53 PDT

43 lines

Re: Assy: Solder Failures

Gregg Klawson <[log in to unmask]>

Tue, 21 Oct 1997 12:23:01 -0400

74 lines

New Thread

Assy: Soldering on gold plated pads

Assy: Soldering on gold plated pads

Blanchet,Richard <[log in to unmask]>

Wed, 15 Oct 1997 10:38:00 -0400

38 lines

Re: Assy: Soldering on gold plated pads

Charles Barker <[log in to unmask]>

Wed, 15 Oct 1997 10:14:28 -0500

34 lines

Re: Assy: Soldering on gold plated pads

Ken Patel <[log in to unmask]>

Wed, 15 Oct 1997 18:08:22 -0700

69 lines

New Thread

ASSY: SOLDERING TO GOLD

ASSY: SOLDERING TO GOLD

John Wick 595-6667 <[log in to unmask]>

Thu, 9 Oct 1997 13:52:00 -0400

36 lines

Re: ASSY: SOLDERING TO GOLD

David D Hillman <[log in to unmask]>

Sun, 12 Oct 1997 18:53:40 -0500

80 lines

New Thread

ASSY: Temperature Cycling Test Failures

ASSY: Temperature Cycling Test Failures

BROMLEY, Bill <[log in to unmask]>

Fri, 17 Oct 1997 11:19:37 -0400

100 lines

Re: ASSY: Temperature Cycling Test Failures

Hemstad, Jon (MN51) <[log in to unmask]>

Fri, 17 Oct 1997 10:46:32 -0500

68 lines

Re: ASSY: Temperature Cycling Test Failures

Sheila Smith <[log in to unmask]>

Fri, 17 Oct 1997 13:38:05 -0400

69 lines

Re: ASSY: Temperature Cycling Test Failures

Graham Naisbitt <[log in to unmask]>

Sat, 18 Oct 1997 22:44:31 UT

92 lines

Re: ASSY: Temperature Cycling Test Failures

Doug Pauls <[log in to unmask]>

Mon, 20 Oct 1997 10:36:42 -0400

30 lines

New Thread

ASSY: Using PWBs for structural applications

ASSY: Using PWBs for structural applications

Sheila Smith <[log in to unmask]>

Tue, 28 Oct 1997 11:20:31 -0500

32 lines

New Thread

Assy: Water Soluble Flux

Assy: Water Soluble Flux

Jan Satterfield <[log in to unmask]>

Fri, 10 Oct 1997 14:56:03 -0600

35 lines

Re: Assy: Water Soluble Flux

Graham Naisbitt <[log in to unmask]>

Fri, 10 Oct 1997 23:27:14 UT

116 lines

Re: Assy: Water Soluble Flux

[log in to unmask]

Sat, 11 Oct 1997 09:56:26 -0400

29 lines

Re: Assy: Water Soluble Flux

David D Hillman <[log in to unmask]>

Sun, 12 Oct 1997 19:03:05 -0500

74 lines

Re: Assy: Water Soluble Flux

Doug Pauls <[log in to unmask]>

Mon, 13 Oct 1997 09:57:07 -0400

113 lines

Re: Assy: Water Soluble Flux

Maguire, James F <[log in to unmask]>

Sun, 12 Oct 1997 17:16:26 -0700

66 lines

New Thread

ASSY:PCB Assy that is Potted

ASSY:PCB Assy that is Potted

David Hoover <[log in to unmask]>

Wed, 15 Oct 1997 18:24:57 -0700

100 lines

New Thread

ASSY:PCB Assy that is Potted -Reply

ASSY:PCB Assy that is Potted -Reply

Larry Campbell <[log in to unmask]>

Thu, 16 Oct 1997 08:00:45 -0400

71 lines

New Thread

assy:stencil cleaner

assy:stencil cleaner

Marie-Josee Lambert <[log in to unmask]>

Thu, 16 Oct 1997 09:34:23 -0400

43 lines

Re: assy:stencil cleaner

Bev Christian <[log in to unmask]>

Thu, 16 Oct 1997 12:26:20 -0400

77 lines

Re: assy:stencil cleaner

LAMBERT.K.A- <[log in to unmask]>

Thu, 16 Oct 1997 14:05:13 -0400

26 lines

New Thread

Assy:Use of xray equipment needed!

Assy:Use of xray equipment needed!

Chris Byrne <[log in to unmask]>

Tue, 28 Oct 1997 12:21:22 -0600

27 lines

Re: Assy:Use of xray equipment needed!

Charles Barker <[log in to unmask]>

Tue, 28 Oct 1997 12:41:31 -0600

62 lines

Re: Assy:Use of xray equipment needed!

Darrell Drake <[log in to unmask]>

Tue, 28 Oct 1997 12:49:35 -0600

131 lines

Re: Assy:Use of xray equipment needed!

drilbert <[log in to unmask]>

Tue, 28 Oct 1997 22:42:35 -0800

45 lines

Re: Assy:Use of xray equipment needed!

Jim Marsico 516-595-5879 <[log in to unmask]>

Wed, 29 Oct 1997 14:20:00 -0400

38 lines

New Thread

Automated Inspection Equipment

Automated Inspection Equipment

Jos Aarninkhof <[log in to unmask]>

Mon, 20 Oct 1997 09:52:04 +0100

41 lines

Re: Automated Inspection Equipment

[log in to unmask]

Mon, 20 Oct 1997 21:20:47 -0500

30 lines

Re: Automated Inspection Equipment

Vickie Chapman <[log in to unmask]>

Mon, 20 Oct 1997 08:19:31 -0700

124 lines

Re: Automated Inspection Equipment

Charles Barker <[log in to unmask]>

Mon, 20 Oct 1997 10:55:52 -0500

77 lines

New Thread

Axial Part Age

Axial Part Age

Joe Wackerman <[log in to unmask]>

Thu, 23 Oct 1997 17:12:53 -0700

40 lines

Re: Axial Part Age

David D Hillman <[log in to unmask]>

Fri, 24 Oct 1997 06:33:09 -0500

97 lines

New Thread

Bed-o-nails testing

Bed-o-nails testing

Don Walker <[log in to unmask]>

Fri, 31 Oct 1997 07:48:55 -0600

43 lines

Re: Bed-o-nails testing

Jeff Garland <[log in to unmask]>

Fri, 31 Oct 1997 09:00:15 -0500

80 lines

Bed-o-nails testing

Wilber E. Heath <[log in to unmask]>

Fri, 31 Oct 1997 10:19:22 -0600

26 lines

Re: Bed-o-nails testing

Don Walker <[log in to unmask]>

Fri, 31 Oct 1997 11:39:20 -0600

63 lines

New Thread

Benchmarking

Benchmarking

tonghh <[log in to unmask]>

Thu, 16 Oct 1997 21:33:27 +0800

25 lines

Benchmarking

Rob van Pol - Senior Account Engineer <[log in to unmask]>

Thu, 16 Oct 1997 17:57:27 +0200

43 lines

Re: Benchmarking

John Guy <[log in to unmask]>

Thu, 16 Oct 1997 14:15:29 -0500

57 lines

Re: Benchmarking

Ron Hollandsworth <[log in to unmask]>

Fri, 17 Oct 1997 07:29:38 -0500

30 lines

Re: Benchmarking

Landes, Jeff <[log in to unmask]>

Fri, 17 Oct 1997 16:28:00 PDT

22 lines

Re: Benchmarking

tonghh <[log in to unmask]>

Sun, 19 Oct 1997 16:32:54 +0800

80 lines

New Thread

Benchmarking - BURIED CAPACITANCE - LASER TECH

Re: Benchmarking - BURIED CAPACITANCE - LASER TECH

MCHAN <[log in to unmask]>

Wed, 22 Oct 1997 09:50:46 -0400

24 lines

New Thread

Benchmarking - BURIED CAPACITANCE - LASER TECHNOLOGY

Benchmarking - BURIED CAPACITANCE - LASER TECHNOLOGY

Roland Jaquet <[log in to unmask]>

Wed, 22 Oct 1997 10:16:42 +0100

49 lines

Re: Benchmarking - BURIED CAPACITANCE - LASER TECHNOLOGY

Tomer_2 <[log in to unmask]>

Wed, 22 Oct 1997 13:08:12 +0000

64 lines

New Thread

BGA Joint Reliability Under "Static" Stress

Re: BGA Joint Reliability Under "Static" Stress

[log in to unmask]

Fri, 24 Oct 1997 20:52:21 -0400

71 lines

Re: BGA Joint Reliability Under "Static" Stress

Andrew J. Scholand <[log in to unmask]>

Mon, 27 Oct 1997 11:04:47 -0500

128 lines

New Thread

Brittle Solder Joints

Brittle Solder Joints

Christina Piasky (piasky) <[log in to unmask]>

Wed, 15 Oct 1997 11:16:10 -0700

39 lines

New Thread

Brittle Solder Joints N

Re: Brittle Solder Joints N

Dan Babcock <[log in to unmask]>

Wed, 15 Oct 1997 16:56:43 MDT

53 lines

Re: Brittle Solder Joints N

TAMURA KAKEN SINGAPORE PTE LTD. <[log in to unmask]>

Thu, 16 Oct 1997 09:49:02 +0800

88 lines

Re: Brittle Solder Joints N

Fulton Feng <[log in to unmask]>

Fri, 17 Oct 1997 20:13:07 -0400

86 lines

Re: Brittle Solder Joints N

Doug Pauls <[log in to unmask]>

Mon, 20 Oct 1997 10:36:17 -0400

1197 lines

Re: Brittle Solder Joints N

Fulton Feng <[log in to unmask]>

Mon, 20 Oct 1997 19:27:32 -0400

39 lines

Re: Brittle Solder Joints N

Doug Pauls <[log in to unmask]>

Wed, 22 Oct 1997 05:45:13 -0400

21 lines

New Thread

building virtual PCBs

building virtual PCBs

Jan Vercammen <[log in to unmask]>

Wed, 1 Oct 1997 12:17:26 +0200

223 lines

Re: building virtual PCBs

D.C.Whalley <[log in to unmask]>

Wed, 1 Oct 1997 12:20:16 -0400

31 lines

New Thread

Buried Resistor Testing

Buried Resistor Testing

Kalpesh Patel <[log in to unmask]>

Mon, 6 Oct 1997 17:41:44 EST

51 lines

Re: Buried Resistor Testing

Dan Brandler <[log in to unmask]>

Tue, 7 Oct 1997 12:22:26 -0700

49 lines

Re: Buried Resistor Testing

Dan Brandler <[log in to unmask]>

Wed, 8 Oct 1997 08:13:43 -0700

37 lines

New Thread

Burn-in / Stress screening

Burn-in / Stress screening

Kew - Steve <[log in to unmask]>

Thu, 16 Oct 1997 09:22:39 +0100

34 lines

New Thread

CAD system: UltiBoard

CAD system: UltiBoard

Charles Barker <[log in to unmask]>

Thu, 30 Oct 1997 09:21:51 -0600

31 lines

New Thread

Call for Data on Airborne Lead Concentrations from Soldering Operations

Call for Data on Airborne Lead Concentrations from Soldering Operations

Christopher Rhodes <[log in to unmask]>

Tue, 14 Oct 1997 09:32:44 -0500

35 lines

Re: Call for Data on Airborne Lead Concentrations from Soldering Operations

Bev Christian <[log in to unmask]>

Wed, 15 Oct 1997 11:18:38 -0400

100 lines

New Thread

Call for Data on Airborne Lead Concentrations fromSolderingOperations

Re: Call for Data on Airborne Lead Concentrations fromSolderingOperations

Doug McKean <[log in to unmask]>

Wed, 15 Oct 1997 12:01:47 -0400

135 lines

New Thread

CAM operator salaries

CAM operator salaries

Tri-C Dave Roesler <[log in to unmask]>

Thu, 30 Oct 1997 16:54:31 -0600

28 lines

Re: CAM operator salaries

Budster <[log in to unmask]>

Thu, 30 Oct 1997 15:41:59 -0800

35 lines

New Thread

CANADIAN PROPOSAL TO REDUCE LEAD CONTENT IN CHILDREN'S/CONSUMER PRODUCTS

CANADIAN PROPOSAL TO REDUCE LEAD CONTENT IN CHILDREN'S/CONSUMER PRODUCTS

Christopher Rhodes <[log in to unmask]>

Wed, 1 Oct 1997 09:51:53 -0500

45 lines

New Thread

career opportunity

career opportunity

Wingate Dunross <[log in to unmask]>

Wed, 29 Oct 1997 09:44:42 -0800

31 lines

New Thread

CIC smutting

CIC smutting

Robert Childers <[log in to unmask]>

Mon, 6 Oct 1997 10:24:24 -0700

38 lines

New Thread

COB footprint

COB footprint

Yvon Hache <[log in to unmask]>

Fri, 31 Oct 1997 09:40:31 -0800

39 lines

New Thread

Company Named AAT

Company Named AAT

Erik Olson <[log in to unmask]>

Fri, 3 Oct 1997 14:25:32 -0500

31 lines

Re: Company Named AAT

Charles Barker <[log in to unmask]>

Fri, 3 Oct 1997 14:40:53 -0500

48 lines

Re: Company Named AAT

MARK McAULEY <[log in to unmask]>

Fri, 3 Oct 1997 15:07:50 -0500

28 lines

Re: Company Named AAT

Edward J. Valentine <[log in to unmask]>

Fri, 3 Oct 1997 17:40:44 -0700

47 lines

New Thread

Component Failure Analysis

Component Failure Analysis

Darrell Bonzo <[log in to unmask]>

Thu, 23 Oct 1997 11:56:59 -0700

38 lines

Re: Component Failure Analysis

Gomez, Rudy (MS Mail) <[log in to unmask]>

Thu, 23 Oct 1997 13:27:41 -0700

72 lines

Re: Component Failure Analysis

Bev Christian <[log in to unmask]>

Thu, 23 Oct 1997 17:28:26 -0400

85 lines

Re: Component Failure Analysis

Gregg Klawson <[log in to unmask]>

Thu, 23 Oct 1997 19:48:27 -0400

46 lines

Re: Component Failure Analysis

David Tyler <[log in to unmask]>

Fri, 24 Oct 1997 07:39:59 -0400

31 lines

New Thread

Component Pricing Trends

Component Pricing Trends

Hamilton, Richard -4454 <[log in to unmask]>

Wed, 22 Oct 1997 11:45:00 -0700

36 lines

Re: Component Pricing Trends

Mark Ross <[log in to unmask]>

Wed, 22 Oct 1997 16:17:17 -0400

77 lines

New Thread

Component Shelf Life

Component Shelf Life

[log in to unmask]

Fri, 31 Oct 1997 04:06:36 -0600

50 lines

New Thread

Conduction cooled PCB

Conduction cooled PCB

Gilmer Klintworth <[log in to unmask]>

Tue, 7 Oct 1997 11:10:35 +0200

42 lines

New Thread

CONFORMAL COATING REPAIR

CONFORMAL COATING REPAIR

[log in to unmask]

Tue, 28 Oct 1997 09:12:14 EST

35 lines

Re: CONFORMAL COATING REPAIR

Hemstad, Jon (MN51) <[log in to unmask]>

Tue, 28 Oct 1997 10:36:22 -0600

70 lines

Re: CONFORMAL COATING REPAIR

Jim Marsico 516-595-5879 <[log in to unmask]>

Wed, 29 Oct 1997 14:01:00 -0400

44 lines

New Thread

Conformal coating study

Conformal coating study

Sheila Smith <[log in to unmask]>

Thu, 9 Oct 1997 11:47:55 -0400

35 lines

New Thread

Confused!

Re: Confused!

Engelmaier <[log in to unmask]>

Thu, 9 Oct 1997 22:10:26 EDT

66 lines

New Thread

Corner cracks in electrolytic copper plating.

Corner cracks in electrolytic copper plating.

Paul Sevriens <[log in to unmask]>

Mon, 13 Oct 1997 14:13:22 +0100

53 lines

Re: Corner cracks in electrolytic copper plating.

David Hoover <[log in to unmask]>

Mon, 13 Oct 1997 20:50:05 -0700

34 lines

New Thread

Cost of Gold Plating

Cost of Gold Plating

Scott Miller <[log in to unmask]>

Sun, 26 Oct 1997 01:46:26 -0700

29 lines

Re: Cost of Gold Plating

Sheila Smith <[log in to unmask]>

Mon, 27 Oct 1997 08:54:34 -0500

53 lines

New Thread

cover blind vias

cover blind vias

Fritz Steiner <[log in to unmask]>

Tue, 14 Oct 1997 12:25:09 +0100

36 lines

New Thread

Cracked Chip Capacitor

Re: Cracked Chip Capacitor

[log in to unmask]

Tue, 28 Oct 1997 12:39:21 -0500

39 lines

New Thread

Cracked Conductors

Cracked Conductors

George Kotecki <[log in to unmask]>

Wed, 29 Oct 1997 15:05:56 -0600

41 lines

Re: Cracked Conductors

[log in to unmask]

Thu, 30 Oct 1997 11:24:49 -0500

43 lines

Re: Cracked Conductors

Paul Gould <[log in to unmask]>

Thu, 30 Oct 1997 22:24:08 +0000

66 lines

New Thread

Cracked solder on NiAu

Re: Cracked solder on NiAu

Phillip E. Hinton <[log in to unmask]>

Thu, 16 Oct 1997 14:22:54 -0400

68 lines

New Thread

Cracking of 1206 compo

Cracking of 1206 compo

[log in to unmask]

Wed, 1 Oct 1997 07:29:15 -0500

36 lines

Re: Cracking of 1206 compo

Don Fumia <[log in to unmask]>

Wed, 1 Oct 1997 08:56:01 -0500

62 lines

New Thread

Crazing, Information Request

Crazing, Information Request

Ralph Hersey <[log in to unmask]>

Sun, 26 Oct 1997 21:54:50 -0800

100 lines

New Thread

Cupric Chloride

Cupric Chloride

[log in to unmask]

Fri, 17 Oct 1997 13:02:49 -0400

31 lines

Re: Cupric Chloride

Christopher Rhodes <[log in to unmask]>

Fri, 17 Oct 1997 12:12:14 -0500

47 lines

Re: Cupric Chloride

Phil Culpovich <[log in to unmask]>

Tue, 21 Oct 1997 18:51:26 -0700

48 lines

New Thread

Cupric Chloride Etchant

Cupric Chloride Etchant

Jack Evans <[log in to unmask]>

Tue, 21 Oct 1997 10:12:23 -0700

28 lines

Re: Cupric Chloride Etchant

[log in to unmask]

Tue, 21 Oct 1997 12:12:55 PST8

18 lines

Re: Cupric Chloride Etchant

John Nelson <[log in to unmask]>

Tue, 21 Oct 1997 15:37:37 -0400

42 lines

Re: Cupric Chloride Etchant

Marty Grove <[log in to unmask]>

Tue, 21 Oct 1997 16:28:07 -0400

79 lines

Re: Cupric Chloride Etchant

George Franck <[log in to unmask]>

Tue, 21 Oct 1997 18:06:40 -0400

71 lines

Re: Cupric Chloride Etchant

Paul Gould <[log in to unmask]>

Tue, 21 Oct 1997 22:52:59 +0100

51 lines

Cupric Chloride Etchant

Jack Evans <[log in to unmask]>

Tue, 21 Oct 1997 10:12:23 -0700

23 lines

Re: Cupric Chloride Etchant

John Nelson <[log in to unmask]>

Wed, 22 Oct 1997 07:50:10 -0400

39 lines

New Thread

Dear Dhswan:

Dear Dhswan:

Patrick McCall <[log in to unmask]>

Mon, 6 Oct 1997 09:29:24 -0400

128 lines

New Thread

Definition of controlled impedance ?

Definition of controlled impedance ?

<David Albin> <[log in to unmask]>

Thu, 30 Oct 1997 16:28:03 +0000

27 lines

Re: Definition of controlled impedance ?

Doug McKean <[log in to unmask]>

Thu, 30 Oct 1997 15:10:57 -0500

95 lines

Re: Definition of controlled impedance ?

Joseph Duclos <[log in to unmask]>

Thu, 30 Oct 1997 18:58:33 -0500

33 lines

Re: Definition of controlled impedance ?

Doug McKean <[log in to unmask]>

Fri, 31 Oct 1997 11:51:39 -0500

44 lines

New Thread

DES Autoload Equipment

DES Autoload Equipment

Tony King <[log in to unmask]>

Wed, 8 Oct 1997 08:24:38 -0800

33 lines

New Thread

DES, FAB, ASSY: Standards

DES, FAB, ASSY: Standards

Randy Johnson (Loveland) <[log in to unmask]>

Sun, 5 Oct 1997 12:37:00 -0500

61 lines

Re: DES, FAB, ASSY: Standards

Ralph Hersey <[log in to unmask]>

Mon, 6 Oct 1997 19:37:04 -0700

119 lines

Re: DES, FAB, ASSY: Standards

Phillip E. Hinton <[log in to unmask]>

Thu, 9 Oct 1997 13:28:02 -0400

45 lines

New Thread

DES: COB Design Guide

DES: COB Design Guide

Pucket, Larry Lee <[log in to unmask]>

Thu, 2 Oct 1997 07:33:48 -0600

42 lines

New Thread

DES: PCB Mounting

DES: PCB Mounting

Steve Collins <[log in to unmask]>

Thu, 23 Oct 1997 16:05:10 -0600

32 lines

Re: DES: PCB Mounting

John Laur <[log in to unmask]>

Fri, 24 Oct 1997 08:04:10 -0500

50 lines

New Thread

Design: Shield Layer Relief and Shielding Effectiveness

Design: Shield Layer Relief and Shielding Effectiveness

APeder01 <[log in to unmask]>

Fri, 31 Oct 1997 13:55:55 -0500

39 lines

New Thread

DESIGN: tin-antimony solders

DESIGN: tin-antimony solders

Sheila Smith <[log in to unmask]>

Wed, 1 Oct 1997 09:48:37 -0400

29 lines

New Thread

Developing question

Developing question

[log in to unmask]

Sat, 4 Oct 1997 11:19:45 -0400

39 lines

Re: Developing question

Andy Cameron <[log in to unmask]>

Sat, 4 Oct 1997 11:38:00 -0400

22 lines

Re: Developing question

[log in to unmask]

Sun, 5 Oct 1997 01:17:29 -0400

58 lines

Re: Developing question

DAVID MANDER <[log in to unmask]>

Mon, 6 Oct 1997 08:52:00 -0500

35 lines

Re: Developing question

Lourdes Mertens <[log in to unmask]>

Mon, 6 Oct 1997 06:02:53 -0700

89 lines

Re: Developing question

Ted Stern <[log in to unmask]>

Sat, 4 Oct 1997 11:22:56 -0700

119 lines

Re: Developing question

Lenny Kurup <[log in to unmask]>

Mon, 6 Oct 1997 14:15:30 -0400

76 lines

Re: Developing question

Terry Zhu <[log in to unmask]>

Mon, 6 Oct 1997 15:40:21 -0400

30 lines

New Thread

dielectric data E-glass fiber

dielectric data E-glass fiber

Jan Vercammen <[log in to unmask]>

Thu, 23 Oct 1997 15:31:57 +0200

38 lines

Re: dielectric data E-glass fiber

Greg Finlay <[log in to unmask]>

Thu, 23 Oct 1997 10:23:56 -0400

73 lines

New Thread

Drill mach.

Drill mach.

Dean Kershner <[log in to unmask]>

Sun, 12 Oct 1997 07:45:07 -0500

26 lines

New Thread

Drill Tips.

Drill Tips.

majid <[log in to unmask]>

Wed, 15 Oct 1997 10:58:48 -0700

32 lines

New Thread

Englemaier??

Englemaier??

Chris Gardini-ECG005 <[log in to unmask]>

Mon, 13 Oct 1997 13:17:47 -0500

27 lines

New Thread

Enquiry on FR4 material

Enquiry on FR4 material

yitlai <[log in to unmask]>

Sat, 18 Oct 1997 22:22:53 +0800

34 lines

New Thread

ENVIRONMENTAL CONTROL

ENVIRONMENTAL CONTROL

Dhawan, Ashok <[log in to unmask]>

Thu, 9 Oct 1997 18:35:29 -0000

31 lines

New Thread

Environmental Stress Screening

Environmental Stress Screening

John Lohan * <[log in to unmask]>

Wed, 8 Oct 1997 22:01:00 +0100

68 lines

New Thread

ESD Handling of RNR & RNC Resistors

ESD Handling of RNR & RNC Resistors

Kasprzak, Bill (esd) US <[log in to unmask]>

Wed, 8 Oct 1997 15:05:00 PDT

43 lines

Re: ESD Handling of RNR & RNC Resistors

Sonny Hays <[log in to unmask]>

Wed, 8 Oct 1997 14:50:15 -0700

75 lines

New Thread

ESD Standards

ESD Standards

Brian Husnik <[log in to unmask]>

Fri, 17 Oct 1997 16:00:30 -0600

44 lines

Re: ESD Standards

Dwight Mattix <[log in to unmask]>

Fri, 17 Oct 1997 15:17:33 -0700

70 lines

Re: ESD Standards

Doug Pauls <[log in to unmask]>

Mon, 20 Oct 1997 10:36:33 -0400

30 lines

New Thread

Exposed copper pads/Immersion NiAu

Exposed copper pads/Immersion NiAu

Ron Hayashi <[log in to unmask]>

Wed, 15 Oct 1997 13:02:57 -0700

33 lines

Re: Exposed copper pads/Immersion NiAu

Indal <[log in to unmask]>

Thu, 16 Oct 1997 13:35:38 -0700

72 lines

Re: Exposed copper pads/Immersion NiAu

Martin Farrell <[log in to unmask]>

Thu, 16 Oct 1997 10:01:40 +0000

38 lines

Re: Exposed copper pads/Immersion NiAu

Martin Farrell <[log in to unmask]>

Thu, 16 Oct 1997 11:27:43 +0000

40 lines

Exposed copper pads/Immersion NiAu

Jacques A Coderre <[log in to unmask]>

Thu, 16 Oct 1997 10:00:05 -0400

84 lines

New Thread

fab, cleanrooms rating

Re: fab, cleanrooms rating

John Nelson <[log in to unmask]>

Thu, 9 Oct 1997 11:54:13 -0400

33 lines

Re: fab, cleanrooms rating

Ed Cosper <[log in to unmask]>

Thu, 9 Oct 1997 11:04:03 -0500

60 lines

Re: fab, cleanrooms rating

Jan Thuesen <[log in to unmask]>

Fri, 10 Oct 1997 12:41:33 +0100

92 lines

New Thread

FAB: Artwotk maintenance

Re: FAB: Artwotk maintenance

blewis <[log in to unmask]>

Wed, 1 Oct 1997 09:32:49 PST

30 lines

New Thread

FAB: Bellcore spec

FAB: Bellcore spec

Orna and Yehuda <[log in to unmask]>

Fri, 31 Oct 1997 21:10:43 +0200

43 lines

Re: FAB: Bellcore spec

Bev Christian <[log in to unmask]>

Thu, 30 Oct 1997 14:37:37 -0500

78 lines

New Thread

FAB: BOARD SOLDERABILITY

FAB: BOARD SOLDERABILITY

Jim Marsico 516-595-5879 <[log in to unmask]>

Wed, 29 Oct 1997 16:22:00 -0400

27 lines

Re: FAB: BOARD SOLDERABILITY

Ken Patel <[log in to unmask]>

Wed, 29 Oct 1997 15:54:01 -0800

55 lines

FAB: Board Solderability

MARK SIMMONS <[log in to unmask]>

Wed, 29 Oct 1997 16:56:34 -0800

45 lines

Re: FAB: Board Solderability

[log in to unmask]

Thu, 30 Oct 1997 10:13:46 -0500

22 lines

New Thread

FAB: Datecode Marking

FAB: Datecode Marking

[log in to unmask]

Tue, 21 Oct 1997 13:31:22 -0400

38 lines

Re: FAB: Datecode Marking

Doug Jeffery <[log in to unmask]>

Wed, 22 Oct 1997 04:19:04 -0500

66 lines

New Thread

FAB: Electrical Testers

FAB: Electrical Testers

sam mccorkel <[log in to unmask]>

Fri, 24 Oct 1997 11:49:35 -0400

38 lines

New Thread

FAB: Gold Finger Extensions

FAB: Gold Finger Extensions

John Parsons <[log in to unmask]>

Thu, 9 Oct 1997 10:12:06 +0000

39 lines

Re: FAB: Gold Finger Extensions

Jeff Garland <[log in to unmask]>

Thu, 9 Oct 1997 18:34:22 -0400

63 lines

New Thread

FAB: HASL Temp.

FAB: HASL Temp.

Ed Cosper <[log in to unmask]>

Wed, 8 Oct 1997 10:09:35 -0500

25 lines

Re: FAB: HASL Temp.

Anil K Singh <[log in to unmask]>

Thu, 9 Oct 1997 06:52:18 +0530

48 lines

Re: FAB: HASL Temp.

Fritz Steiner <[log in to unmask]>

Thu, 9 Oct 1997 07:09:09 +0100

48 lines

New Thread

FAB: HASL Temp.(Reply)

Re: FAB: HASL Temp.(Reply)

Dr. Nimal Liyanage <[log in to unmask]>

Wed, 8 Oct 1997 17:21:30 -0400

21 lines

New Thread

FAB: Ionic Contamination Measurements

FAB: Ionic Contamination Measurements

John Parsons <[log in to unmask]>

Thu, 9 Oct 1997 16:06:11 +0000

33 lines

New Thread

FAB: Kodak vs Agfa

FAB: Kodak vs Agfa

John Parsons <[log in to unmask]>

Tue, 28 Oct 1997 14:02:22 +0000

29 lines

Re: FAB: Kodak vs Agfa

Tom Monico <[log in to unmask]>

Tue, 28 Oct 1997 18:41:48 -0500

28 lines

New Thread

Fab: Packaging

Fab: Packaging

sam mccorkel <[log in to unmask]>

Fri, 31 Oct 1997 12:15:59 -0500

31 lines

Re: Fab: Packaging

David Girard <[log in to unmask]>

Fri, 31 Oct 1997 13:11:02 -0500

69 lines

Re: Fab: Packaging

Don Vischulis <[log in to unmask]>

Fri, 31 Oct 1997 22:45:35 -0600

79 lines

New Thread

FAB: Silver-filled epoxy with tin or solder

Re: FAB: Silver-filled epoxy with tin or solder

[log in to unmask]

Wed, 15 Oct 1997 08:20:19 PDT

71 lines

Re: FAB: Silver-filled epoxy with tin or solder

D.C.Whalley <[log in to unmask]>

Tue, 21 Oct 1997 16:33:48 -0400

54 lines

Re: FAB: Silver-filled epoxy with tin or solder

[log in to unmask]

Wed, 22 Oct 1997 11:20:50 +0100

99 lines

New Thread

FAB: Stage Micrometer Calibration Service

FAB: Stage Micrometer Calibration Service

Reed, Randy <[log in to unmask]>

Thu, 23 Oct 1997 16:19:00 -0700

36 lines

Re: FAB: Stage Micrometer Calibration Service

[log in to unmask]

Fri, 24 Oct 1997 09:54:38 -0400

24 lines

Re: FAB: Stage Micrometer Calibration Service

[log in to unmask]

Fri, 24 Oct 1997 10:18:45 -0400

25 lines

New Thread

FAB: surface prep for bonding

FAB: surface prep for bonding

Sheila Smith <[log in to unmask]>

Mon, 13 Oct 1997 15:15:48 -0400

25 lines

Re: FAB: surface prep for bonding

D.C.Whalley <[log in to unmask]>

Tue, 14 Oct 1997 10:31:13 -0400

36 lines

New Thread

FAB: Tin / Lead finish

FAB: Tin / Lead finish

sam mccorkel <[log in to unmask]>

Wed, 29 Oct 1997 09:04:14 -0500

31 lines

New Thread

Fab: Voids in resin filled via

Fab: Voids in resin filled via

Moss Dore <[log in to unmask]>

Thu, 30 Oct 1997 09:41:31 +0000

28 lines

New Thread

FABMASTER

FABMASTER

Chris Shirley <[log in to unmask]>

Thu, 30 Oct 1997 18:55:58 EST

28 lines

New Thread

Fiberoptic device handling

Fiberoptic device handling

Steve Mikell <[log in to unmask]>

Wed, 8 Oct 1997 08:36:14 -0500

30 lines

Re: Fiberoptic device handling

Doug McKean <[log in to unmask]>

Wed, 8 Oct 1997 10:09:42 -0400

85 lines

Re: Fiberoptic device handling

TOSTEVIN_BC <[log in to unmask]>

Wed, 8 Oct 1997 10:19:28 -0400

19 lines

Re: Fiberoptic device handling

Stuart Chessen <[log in to unmask]>

Fri, 10 Oct 1997 12:38:39 -0700

59 lines

New Thread

Fischer Precision Spindles

Fischer Precision Spindles

William Johnson <[log in to unmask]>

Fri, 10 Oct 1997 19:30:22 UT

21 lines

New Thread

Fixing Warped Assemblies

Fixing Warped Assemblies

[log in to unmask]

Thu, 9 Oct 1997 03:28:07 -0500

93 lines

Re: Fixing Warped Assemblies

Andrew J. Scholand <[log in to unmask]>

Wed, 8 Oct 1997 23:22:49 -0400

110 lines

New Thread

Flex Circuit Assy/Fab

Flex Circuit Assy/Fab

[log in to unmask]

Tue, 14 Oct 1997 04:15:19 -0500

55 lines

New Thread

flexible polyester circuits

flexible polyester circuits

Markus Roeck <[log in to unmask]>

Wed, 29 Oct 1997 06:59:08 PST

31 lines

New Thread

Fluoride and Halide in flux tests.

Fluoride and Halide in flux tests.

[log in to unmask]

Wed, 29 Oct 1997 14:39:32 +0000

60 lines

New Thread

fracture resistance

fracture resistance

MARK SIMMONS <[log in to unmask]>

Thu, 16 Oct 1997 14:46:55 -0700

26 lines

New Thread

Free!!! 125 sex channels when u join

Free!!! 125 sex channels when u join

[log in to unmask]

Mon, 27 Oct 1997 09:02:51 EST

39 lines

Re: Free!!! 125 sex channels when u join

[log in to unmask]

Mon, 27 Oct 1997 08:27:15 -0500

24 lines

New Thread

Fw: Fw: [TECHNET] ASSY:PCB Assy that is Potted

Fw: Fw: [TECHNET] ASSY:PCB Assy that is Potted

David Hoover <[log in to unmask]>

Tue, 21 Oct 1997 21:04:13 -0700

105 lines

New Thread

FW: Torque

FW: Torque

Jim Schlosser (MSMail) <[log in to unmask]>

Thu, 30 Oct 1997 07:29:00 -0800

14 lines

FW: Torque

Jim Herard <[log in to unmask]>

Thu, 30 Oct 1997 18:10:07 -0500

40 lines

New Thread

FW: [TECHNET] assem: shape code library

FW: [TECHNET] assem: shape code library

Dhawan, Ashok <[log in to unmask]>

Sun, 5 Oct 1997 14:17:26 -0000

89 lines

New Thread

FW: [TECHNET] Assembly Inspection Equipment

FW: [TECHNET] Assembly Inspection Equipment

Dhawan, Ashok <[log in to unmask]>

Fri, 10 Oct 1997 13:27:46 -0000

85 lines

New Thread

FW: [TECHNET] ASSY: Conformal Coating Coverage

FW: [TECHNET] ASSY: Conformal Coating Coverage

Blanchet,Richard <[log in to unmask]>

Wed, 8 Oct 1997 17:42:00 -0400

24 lines

Re: FW: [TECHNET] ASSY: Conformal Coating Coverage

Martin Farrell <[log in to unmask]>

Thu, 9 Oct 1997 14:06:33 +0000

31 lines

New Thread

FW: [TECHNET] Assy: Soldering on gold plated pads

FW: [TECHNET] Assy: Soldering on gold plated pads

Blanchet,Richard <[log in to unmask]>

Wed, 15 Oct 1997 12:01:00 -0400

30 lines

Re: FW: [TECHNET] Assy: Soldering on gold plated pads

Ken Patel <[log in to unmask]>

Wed, 15 Oct 1997 10:43:27 -0700

122 lines

Re: FW: [TECHNET] Assy: Soldering on gold plated pads

Fulton Feng <[log in to unmask]>

Wed, 15 Oct 1997 16:59:13 -0400

102 lines

New Thread

FW: [TECHNET] Brittle Solder Joints N

FW: [TECHNET] Brittle Solder Joints N

Dhawan, Ashok <[log in to unmask]>

Mon, 20 Oct 1997 14:19:46 -0000

133 lines

Re: FW: [TECHNET] Brittle Solder Joints N

Doug Pauls <[log in to unmask]>

Mon, 20 Oct 1997 14:17:06 -0400

1197 lines

New Thread

FW: [TECHNET] CANADIAN PROPOSAL TO REDUCE LEAD CONTENT IN CHILDREN'S/CONSUMER PRODUCTS

FW: [TECHNET] CANADIAN PROPOSAL TO REDUCE LEAD CONTENT IN CHILDREN'S/CONSUMER PRODUCTS

Dhawan, Ashok <[log in to unmask]>

Sun, 5 Oct 1997 14:30:13 -0000

101 lines

New Thread

FW: [TECHNET] Design of Experiments soft

FW: [TECHNET] Design of Experiments soft

Dhawan, Ashok <[log in to unmask]>

Tue, 14 Oct 1997 23:46:44 -0000

82 lines

Re: FW: [TECHNET] Design of Experiments soft

Erik C. Olson <[log in to unmask]>

Tue, 14 Oct 1997 18:55:03 -0500

120 lines

New Thread

FW: [TECHNET] FAB: software to view gerber

FW: [TECHNET] FAB: software to view gerber

Dhawan, Ashok <[log in to unmask]>

Wed, 15 Oct 1997 13:35:17 -0000

43 lines

New Thread

FW: [TECHNET] Need help on solder paste stencils

FW: [TECHNET] Need help on solder paste stencils

Dhawan, Ashok <[log in to unmask]>

Sat, 18 Oct 1997 00:01:21 -0000

71 lines

Re: FW: [TECHNET] Need help on solder paste stencils

Ken Patel <[log in to unmask]>

Mon, 20 Oct 1997 16:26:07 -0700

99 lines

New Thread

FW: [TECHNET] SCreenprinting

FW: [TECHNET] SCreenprinting

Dhawan, Ashok <[log in to unmask]>

Sun, 5 Oct 1997 13:41:59 -0000

143 lines

New Thread

FW: [TECHNET] SMT soldering

FW: [TECHNET] SMT soldering

Dhawan, Ashok <[log in to unmask]>

Tue, 7 Oct 1997 00:00:07 -0000

69 lines

New Thread

FW: [TECHNET] Solder Stencil Guidelines Wanted...

FW: [TECHNET] Solder Stencil Guidelines Wanted...

Dhawan, Ashok <[log in to unmask]>

Fri, 17 Oct 1997 12:45:13 -0000

56 lines

New Thread

FW: [TECHNET] TEchnet

FW: [TECHNET] TEchnet

Dhawan, Ashok <[log in to unmask]>

Fri, 3 Oct 1997 21:02:27 -0000

139 lines

New Thread

FW: [TECHNET] Testing of Solder

FW: [TECHNET] Testing of Solder

Dhawan, Ashok <[log in to unmask]>

Tue, 14 Oct 1997 22:56:10 -0000

78 lines

New Thread

FW: [TECHNET] X-Ray Inspection Equipment

FW: [TECHNET] X-Ray Inspection Equipment

Dhawan, Ashok <[log in to unmask]>

Tue, 14 Oct 1997 22:41:25 -0000

119 lines

New Thread

FW: [TECHNET] [Technet] Assy: Placement Machine Measurement

FW: [TECHNET] [Technet] Assy: Placement Machine Measurement

Dhawan, Ashok <[log in to unmask]>

Sun, 5 Oct 1997 14:44:28 -0000

54 lines

New Thread

Gas Mystery

Gas Mystery

[log in to unmask]

Fri, 17 Oct 1997 15:25:55 +0200

54 lines

New Thread

GEN Know errors in IPC-sm-840C

GEN Know errors in IPC-sm-840C

Lars Ladefoged Holm <[log in to unmask]>

Fri, 17 Oct 1997 07:24:33 +0000

55 lines

New Thread

GEN: MIL-PRF-31032 Certification/Qualification

GEN: MIL-PRF-31032 Certification/Qualification

Lars Ladefoged Holm <[log in to unmask]>

Tue, 21 Oct 1997 07:55:25 +0000

47 lines

Re: GEN: MIL-PRF-31032 Certification/Qualification

[log in to unmask]

Tue, 21 Oct 1997 08:14:53 PDT

71 lines

New Thread

General Question

General Question

Steve Collins <[log in to unmask]>

Fri, 24 Oct 1997 11:17:34 -0600

28 lines

Re: General Question

Jan Ciminello <[log in to unmask]>

Fri, 24 Oct 1997 11:19:38 PST

25 lines

New Thread

Gold and BGA devices

Gold and BGA devices

Eddie Brunker <[log in to unmask]>

Mon, 20 Oct 1997 14:55:46 +0100

24 lines

New Thread

Gold for BGA

Gold for BGA

Eddie Brunker <[log in to unmask]>

Thu, 23 Oct 1997 17:02:20 +0100

50 lines

New Thread

Gold Immersion Plating

Gold Immersion Plating

Niewiemski, Dwayne <[log in to unmask]>

Wed, 1 Oct 1997 08:00:07 -0400

42 lines

Re: Gold Immersion Plating

David D Hillman <[log in to unmask]>

Wed, 1 Oct 1997 12:31:54 -0500

77 lines

Re: Gold Immersion Plating

Alan Cochrane <[log in to unmask]>

Thu, 2 Oct 1997 08:27:16 -0700

33 lines

Re: Gold Immersion Plating

Frank Kurisu <[log in to unmask]>

Sat, 4 Oct 1997 01:56:14 UT

79 lines

New Thread

Gold Potassium Cyanide (GPC) supply

Gold Potassium Cyanide (GPC) supply

H.N.Muralidhara <[log in to unmask]>

Tue, 28 Oct 1997 09:15:27 +0530

53 lines

New Thread

Gold Slivers

Gold Slivers

Art Shuler <[log in to unmask]>

Tue, 7 Oct 1997 12:59:59 -0400

37 lines

Re: Gold Slivers

Jeff Garland <[log in to unmask]>

Tue, 7 Oct 1997 13:06:11 -0400

64 lines

Re: Gold Slivers

Paul Gould <[log in to unmask]>

Tue, 7 Oct 1997 21:06:37 +0100

43 lines

Re: Gold Slivers

David Hoover <[log in to unmask]>

Tue, 7 Oct 1997 21:44:45 -0700

40 lines

Re: Gold Slivers

Ed Cosper <[log in to unmask]>

Wed, 8 Oct 1997 08:28:22 -0500

59 lines

Re: Gold Slivers

David D Sullivan <[log in to unmask]>

Thu, 9 Oct 1997 09:11:32 -0500

75 lines

New Thread

Gov't Sales

Gov't Sales

[log in to unmask]

Sun, 26 Oct 1997 18:34:46 -0500

20 lines

New Thread

Grey Scale Machine Vision

Grey Scale Machine Vision

Nicholas Kane <[log in to unmask]>

Thu, 30 Oct 1997 16:54:46 +1100

30 lines

New Thread

Halide free cable for SIR testing

Halide free cable for SIR testing

Graham Naisbitt <[log in to unmask]>

Tue, 7 Oct 1997 12:37:58 UT

35 lines

New Thread

hard gold/immersion gold finish

hard gold/immersion gold finish

Bab-Hui Lee-CTUA065 <[log in to unmask]>

Wed, 1 Oct 1997 20:03:13 -0500

25 lines

Re: hard gold/immersion gold finish

jmalhi <[log in to unmask]>

Thu, 2 Oct 1997 10:08:14 PST

15 lines

New Thread

Hardest photoimageable solder mask

Hardest photoimageable solder mask

Stephen C Joy <[log in to unmask]>

Thu, 16 Oct 1997 13:31:00 PDT

25 lines

New Thread

Heatsink lamination

Heatsink lamination

Sheppard, Marty - LYPME <[log in to unmask]>

Thu, 16 Oct 1997 14:54:04 -0400

43 lines

Re: Heatsink lamination

Rodney <[log in to unmask]>

Thu, 16 Oct 1997 14:31:20 EST

30 lines

Heatsink lamination

Richard MacCutcheon <[log in to unmask]>

Thu, 16 Oct 1997 14:08:00 -0600

90 lines

Re: Heatsink lamination

Howard Feldmesser <[log in to unmask]>

Thu, 16 Oct 1997 16:24:19 -0400

68 lines

Re: Heatsink lamination

Dupriest, Don (MS Mail) <[log in to unmask]>

Thu, 16 Oct 1997 17:41:00 -0500

33 lines

Re: Heatsink lamination

Steves <[log in to unmask]>

Fri, 17 Oct 1997 10:44:07 +0000

30 lines

Re: Heatsink lamination

ADAMS, Mike <[log in to unmask]>

Fri, 17 Oct 1997 11:30:59 -0400

120 lines

Re: Heatsink lamination

Howard Feldmesser <[log in to unmask]>

Fri, 17 Oct 1997 12:33:35 -0400

139 lines

Re: Heatsink lamination

Thomas E. Waznis <[log in to unmask]>

Sat, 18 Oct 1997 18:46:38 -0800

47 lines

New Thread

Help

Help

tetz schemm <[log in to unmask]>

Wed, 22 Oct 1997 15:42:55 +0100

71 lines

New Thread

Hole wall pullaway

Hole wall pullaway

[log in to unmask]

Fri, 3 Oct 1997 08:19:34 -0400

29 lines

Re: Hole wall pullaway

roberto tulman <[log in to unmask]>

Sat, 4 Oct 1997 14:06:50 +0200

64 lines

New Thread

Hot Air soldering pencil.

Re: Hot Air soldering pencil.

Poh Kong Hui <[log in to unmask]>

Mon, 20 Oct 1997 23:05:51 +0800

30 lines

New Thread

Immersion / Electroless

Immersion / Electroless

tgyee <[log in to unmask]>

Tue, 28 Oct 1997 10:19:57 PST

20 lines

Re: Immersion / Electroless

[log in to unmask]

Tue, 28 Oct 1997 09:22:21 -0500

36 lines

Re: Immersion / Electroless

[log in to unmask]

Tue, 28 Oct 1997 11:21:53 -0500

40 lines

New Thread

Immersion / Electroless,Reply

Re: Immersion / Electroless,Reply

George Milad <[log in to unmask]>

Tue, 28 Oct 1997 09:38:35 -0500

38 lines

New Thread

Immersion AU, NPTH Deposits

Immersion AU, NPTH Deposits

Dave Willhard <[log in to unmask]>

Tue, 7 Oct 1997 09:01:22 -0700

36 lines

Re: Immersion AU, NPTH Deposits

David Hoover <[log in to unmask]>

Tue, 7 Oct 1997 21:51:11 -0700

34 lines

New Thread

Inboard Ni/Au contacts

Inboard Ni/Au contacts

Rob van Pol - Senior Account Engineer <[log in to unmask]>

Wed, 22 Oct 1997 11:35:17 +0200

49 lines

New Thread

insulation resistance testing

insulation resistance testing

Todd Rogers <[log in to unmask]>

Mon, 13 Oct 1997 23:43:22 -0500

30 lines

Re: insulation resistance testing

[log in to unmask]

Tue, 14 Oct 1997 14:44:48 EDT

44 lines

New Thread

Invitation & Call for Panelists for free DfE Making Holes Conductive Seminar on Nov 13 in Phoenix

Invitation & Call for Panelists for free DfE Making Holes Conductive Seminar on Nov 13 in Phoenix

Christopher Rhodes <[log in to unmask]>

Tue, 14 Oct 1997 10:59:07 -0500

43 lines

New Thread

Ionic Contam. Testers

Ionic Contam. Testers

Kenny Bloomquist <[log in to unmask]>

Mon, 13 Oct 1997 09:33:57 -0700

35 lines

New Thread

IPC 1710

IPC 1710

Rob van Pol - Senior Account Engineer <[log in to unmask]>

Thu, 2 Oct 1997 18:06:06 +0200

36 lines

IPC 1710

Rob van Pol - Senior Account Engineer <[log in to unmask]>

Thu, 9 Oct 1997 10:56:13 +0200

36 lines

New Thread

IPC spec for Electrical Test on BGA substrate

IPC spec for Electrical Test on BGA substrate

YAP CHOW LAN <[log in to unmask]>

Wed, 15 Oct 1997 17:25:08 +0800

42 lines

New Thread

IPCchat session announcement

IPCchat session announcement

[log in to unmask]

Mon, 27 Oct 1997 08:23:51 -0800

50 lines

New Thread

Kaizen FCR

Kaizen FCR

Lang, Michael <[log in to unmask]>

Fri, 10 Oct 1997 18:00:00 E

27 lines

Re: Kaizen FCR

[log in to unmask]

Mon, 13 Oct 1997 08:05:47 -0400

20 lines

New Thread

Laminate designations

Laminate designations

Elizabeth <[log in to unmask]>

Thu, 9 Oct 1997 12:54:27 -0400

28 lines

Re: Laminate designations

Steves <[log in to unmask]>

Thu, 9 Oct 1997 14:43:13 +0000

27 lines

Re: Laminate designations

Gary Ferrari <[log in to unmask]>

Fri, 10 Oct 1997 12:03:07 -0400

40 lines

New Thread

Land to Lead Ratio

Land to Lead Ratio

[log in to unmask]

Thu, 9 Oct 1997 21:57:26 -0500

52 lines

Re: Land to Lead Ratio

Jim Mathis <[log in to unmask]>

Thu, 9 Oct 1997 17:35:21 -0400

23 lines

Re: Land to Lead Ratio

Lainie Loveless <[log in to unmask]>

Fri, 10 Oct 1997 11:08:59 -0500

47 lines

Re: Land to Lead Ratio

Yvon Hache <[log in to unmask]>

Wed, 15 Oct 1997 21:53:10 -0700

43 lines

New Thread

Laser benchmarking

Laser benchmarking

<Gareth Jones> <[log in to unmask]>

Mon, 20 Oct 1997 13:19:46 +0100

33 lines

Re: Laser benchmarking

[log in to unmask]

Tue, 21 Oct 1997 09:08:39 +0100

23 lines

New Thread

Layman's guide for J-STD-001B

Layman's guide for J-STD-001B

Davis, Mary <[log in to unmask]>

Tue, 14 Oct 1997 12:06:24 -0700

29 lines

Re: Layman's guide for J-STD-001B

Doug Pauls <[log in to unmask]>

Tue, 14 Oct 1997 17:45:20 -0400

28 lines

Re: Layman's guide for J-STD-001B

Joe Wackerman <[log in to unmask]>

Tue, 14 Oct 1997 16:04:31 -0700

60 lines

Re: Layman's guide for J-STD-001B

Tom Moore <[log in to unmask]>

Wed, 15 Oct 1997 16:33:15 -0700

53 lines

Re: Layman's guide for J-STD-001B

Doug Pauls <[log in to unmask]>

Thu, 16 Oct 1997 11:23:17 -0400

1442 lines

Re: Layman's guide for J-STD-001B

Graham Naisbitt <[log in to unmask]>

Wed, 15 Oct 1997 21:17:55 UT

65 lines

Re: Layman's guide for J-STD-001B

[log in to unmask]

Fri, 17 Oct 1997 10:43:01 PDT

36 lines

Layman's guide for J-STD-001B

Charles Barker <[log in to unmask]>

Fri, 17 Oct 1997 15:18:33 -0500

38 lines

New Thread

LED Sorting

LED Sorting

Dave Dixon <[log in to unmask]>

Tue, 14 Oct 1997 10:38:48 -0700

28 lines

New Thread

Legend ink

Legend ink

Tomer_2 <[log in to unmask]>

Sun, 12 Oct 1997 12:43:06 +0000

40 lines

Re: Legend ink

Maguire, James F <[log in to unmask]>

Sun, 12 Oct 1997 16:41:02 -0700

71 lines

Re: Legend ink

Afri Singh <[log in to unmask]>

Fri, 17 Oct 1997 12:24:15 -0400

89 lines

New Thread

Lengthening stencil opennings under fine pitch parts.

Lengthening stencil opennings under fine pitch parts.

Charles Barker <[log in to unmask]>

Thu, 16 Oct 1997 14:56:03 -0500

42 lines

New Thread

Lifted Lands in Assemblies

Re: Lifted Lands in Assemblies

Mike Buetow <[log in to unmask]>

Wed, 22 Oct 1997 11:31:37 -0500

27 lines

Re: Lifted Lands in Assemblies

Gerarden, Jeff <[log in to unmask]>

Wed, 22 Oct 1997 13:30:00 CDT

14 lines

New Thread

Lifted Lands per IPC-6012

Lifted Lands per IPC-6012

APeder01 <[log in to unmask]>

Tue, 21 Oct 1997 16:15:50 -0400

38 lines

Re: Lifted Lands per IPC-6012

Lisa Williams <[log in to unmask]>

Wed, 22 Oct 1997 09:45:17 -0500

60 lines

Re: Lifted Lands per IPC-6012

Phillip E. Hinton <[log in to unmask]>

Wed, 22 Oct 1997 11:00:53 -0400

31 lines

New Thread

Line staffing

Line staffing

Greg Parke <[log in to unmask]>

Thu, 9 Oct 1997 16:52:45 -0400

29 lines

New Thread

Looking for ANSI symbol documention

Looking for ANSI symbol documention

Neil Diamond <[log in to unmask]>

Thu, 9 Oct 1997 12:30:25 -0500

51 lines

New Thread

Low Temp Bake for Plastic Parts

Low Temp Bake for Plastic Parts

Lang, Michael <[log in to unmask]>

Thu, 2 Oct 1997 09:08:00 E

55 lines

New Thread

Making hole quality sections

Making hole quality sections

drilbert <[log in to unmask]>

Mon, 27 Oct 1997 07:34:57 -0800

39 lines

Re: Making hole quality sections

[log in to unmask]

Mon, 27 Oct 1997 13:36:31 -0500

32 lines

New Thread

Material handling

Material handling

KARLA DUGGAN <[log in to unmask]>

Fri, 10 Oct 1997 07:55:17 -0600

38 lines

Re: Material handling

Lainie Loveless <[log in to unmask]>

Fri, 10 Oct 1997 14:45:13 -0500

39 lines

New Thread

Measurement Specification

Measurement Specification

Darrell Bonzo <[log in to unmask]>

Mon, 13 Oct 1997 10:46:08 -0700

43 lines

New Thread

Mechanically attached Heat Sinks

Mechanically attached Heat Sinks

Ken Patel <[log in to unmask]>

Mon, 20 Oct 1997 13:42:09 -0700

33 lines

New Thread

MIL Specification

MIL Specification

M.Tezuka <[log in to unmask]>

Thu, 9 Oct 1997 15:47:26 +0900

32 lines

Re: MIL Specification

[log in to unmask]

Mon, 13 Oct 1997 10:42:48 PDT

69 lines

New Thread

MIL-STD Cleanliness spec.

MIL-STD Cleanliness spec.

ROBERT MEINERT <[log in to unmask]>

Fri, 3 Oct 1997 11:02:30 -0500

31 lines

Re: MIL-STD Cleanliness spec.

Maguire, James F <[log in to unmask]>

Fri, 3 Oct 1997 09:44:13 -0700

78 lines

Re: MIL-STD Cleanliness spec.

Graham Naisbitt <[log in to unmask]>

Sun, 5 Oct 1997 22:15:34 UT

77 lines

New Thread

MillipaQ 80s

MillipaQ 80s

Andrew Buonviri <[log in to unmask]>

Wed, 29 Oct 1997 07:59:40 -0400

30 lines

New Thread

minimum distance a hole can be drilled from the edge

minimum distance a hole can be drilled from the edge

Ken Patel <[log in to unmask]>

Fri, 31 Oct 1997 12:37:54 -0800

31 lines

Re: minimum distance a hole can be drilled from the edge

John Nelson <[log in to unmask]>

Fri, 31 Oct 1997 16:16:24 -0500

39 lines

Re: minimum distance a hole can be drilled from the edge

Ken Patel <[log in to unmask]>

Fri, 31 Oct 1997 16:15:49 -0800

63 lines

Re: minimum distance a hole can be drilled from the edge

Don Vischulis <[log in to unmask]>

Fri, 31 Oct 1997 23:02:54 -0600

62 lines

New Thread

minimum distance a hole can be drilled from the edge -Reply

Re: minimum distance a hole can be drilled from the edge -Reply

Larry Campbell <[log in to unmask]>

Fri, 31 Oct 1997 16:39:02 -0500

70 lines

New Thread

Need help on solder paste stencils

Need help on solder paste stencils

Jerry Henrikson <[log in to unmask]>

Fri, 17 Oct 1997 19:01:04 -0400

42 lines

New Thread

Nitrogen use w/ BGA reflow

Nitrogen use w/ BGA reflow

Douglas H. Bennett <[log in to unmask]>

Fri, 31 Oct 1997 14:54:40 -0800

32 lines

New Thread

Nitrogen use w/ BGA reflow (jocularity)

Re: Nitrogen use w/ BGA reflow (jocularity)

Jerry Cupples <[log in to unmask]>

Fri, 31 Oct 1997 16:56:50 -0600

51 lines

New Thread

obsolete transistor

obsolete transistor

Bill Gaines B160 x2199 <[log in to unmask]>

Wed, 1 Oct 1997 13:04:42 -0700

31 lines

Re: obsolete transistor

Sonny Hays <[log in to unmask]>

Wed, 1 Oct 1997 16:45:17 -0700

59 lines

Re: obsolete transistor

Keith Larson <[log in to unmask]>

Wed, 1 Oct 1997 17:11:16 -0500

64 lines

New Thread

OSP y OSP

OSP y OSP

[log in to unmask]

Wed, 22 Oct 1997 03:38:34 -0500

69 lines

New Thread

Palladium

Palladium

Sid Tryzbiak <[log in to unmask]>

Mon, 6 Oct 1997 14:16:10 -0400

79 lines

Re: Palladium

Charles Barker <[log in to unmask]>

Mon, 6 Oct 1997 13:33:50 -0500

49 lines

Re: Palladium

Russell S Gregory <[log in to unmask]>

Mon, 6 Oct 1997 16:25:33 -0400

27 lines

Re: Palladium

[log in to unmask]

Wed, 8 Oct 1997 00:59:16 -0400

46 lines

Palladium

Peter McGrath <[log in to unmask]>

Wed, 8 Oct 1997 13:49:37 -0500

33 lines

Re: Palladium

[log in to unmask]

Wed, 8 Oct 1997 21:00:54 -0400

22 lines

Re: Palladium

[log in to unmask]

Thu, 9 Oct 1997 15:26:15 +0900

91 lines

Re: Palladium

Phillip E. Hinton <[log in to unmask]>

Thu, 9 Oct 1997 13:26:25 -0400

30 lines

Re: Palladium

[log in to unmask]

Fri, 10 Oct 1997 08:32:03 PST

22 lines

Re: Palladium

David D Hillman <[log in to unmask]>

Fri, 10 Oct 1997 14:34:32 -0500

56 lines

New Thread

Palladium -Reply

Palladium -Reply

Ron Hayashi <[log in to unmask]>

Mon, 6 Oct 1997 11:58:42 -0700

27 lines

New Thread

Part Numbering Systems

Part Numbering Systems

[log in to unmask]

Tue, 7 Oct 1997 11:30:16 -0600

39 lines

Re: Part Numbering Systems

Doug McKean <[log in to unmask]>

Tue, 7 Oct 1997 14:27:35 -0400

130 lines

Re: Part Numbering Systems

Nicholas Kane <[log in to unmask]>

Wed, 8 Oct 1997 07:14:32 +1000

163 lines

Re: part numbering systems

Bill Gaines B160 x2199 <[log in to unmask]>

Wed, 8 Oct 1997 07:55:04 -0700

61 lines

Re: Part Numbering Systems

JoAnn Amerson <[log in to unmask]>

Tue, 7 Oct 1997 11:52:17 +0000

43 lines

Re: Part Numbering Systems

Ralph Hersey <[log in to unmask]>

Thu, 9 Oct 1997 10:15:29 -0700

142 lines

Re: Part Numbering Systems

Steve Stimac <[log in to unmask]>

Mon, 20 Oct 1997 07:46:04 -0700

51 lines

New Thread

PC card (populated) burn-in

Re: PC card (populated) burn-in

PCIF <[log in to unmask]>

Tue, 14 Oct 1997 11:43:20 +0100

61 lines

New Thread

PCB Designers

PCB Designers

Steve Collins <[log in to unmask]>

Fri, 3 Oct 1997 14:40:16 -0600

36 lines

New Thread

PCB goldfingers

PCB goldfingers

Patrick Ducas <[log in to unmask]>

Thu, 9 Oct 1997 15:55:15 -0400

42 lines

New Thread

PCMCIA INFO

PCMCIA INFO

Wes Malewicz <[log in to unmask]>

Thu, 23 Oct 1997 15:32:58 EDT

28 lines

Re: PCMCIA INFO

Lisa Williams <[log in to unmask]>

Thu, 23 Oct 1997 14:51:24 -0500

49 lines

Re: PCMCIA INFO

Mike Wilson <[log in to unmask]>

Thu, 23 Oct 1997 14:05:19 -0700

61 lines

Re: PCMCIA INFO

Dieter Beisiegel <[log in to unmask]>

Fri, 24 Oct 1997 09:05:39 +-200

105 lines

Re: PCMCIA INFO

Thomas G. Martin <[log in to unmask]>

Fri, 24 Oct 1997 09:05:06 -0400

29 lines

New Thread

Phosporised Copper anodes

Phosporised Copper anodes

K.R.JAGDISH <[log in to unmask]>

Fri, 24 Oct 1997 17:30:52 -0700

47 lines

Re: Phosporised Copper anodes

CSS Asia Co., Ltd. <[log in to unmask]>

Wed, 29 Oct 1997 18:22:01 +0900

78 lines

New Thread

pill package

pill package

Roger Roseum <[log in to unmask]>

Fri, 3 Oct 1997 13:54:19 -0400

1055 lines

New Thread

Pill Style Metal Can Package, Honeywell

Pill Style Metal Can Package, Honeywell

Roger Roseum <[log in to unmask]>

Wed, 1 Oct 1997 11:16:25 -0400

37 lines

New Thread

Planar Magnetics

Planar Magnetics

[log in to unmask]

Tue, 28 Oct 1997 14:02:14 -0500

23 lines

New Thread

Plastic Parts Questions...

Plastic Parts Questions...

Lang, Michael <[log in to unmask]>

Wed, 1 Oct 1997 09:36:00 E

46 lines

Re: Plastic Parts Questions...

Marie-Josee Lambert <[log in to unmask]>

Wed, 1 Oct 1997 11:08:14 -0400

80 lines

New Thread

Plastic Parts: Low Temperature Bake!

Plastic Parts: Low Temperature Bake!

Lang, Michael <[log in to unmask]>

Mon, 13 Oct 1997 16:52:00 E

37 lines

Re: Plastic Parts: Low Temperature Bake!

Marie-Josee Lambert <[log in to unmask]>

Tue, 14 Oct 1997 09:10:49 -0400

68 lines

New Thread

PNP Info

PNP Info

Tucker, Steve (KS) <[log in to unmask]>

Fri, 10 Oct 1997 06:37:06 -0700

73 lines

New Thread

Pollution Prevention/Green Manufacturing Conference in Atlanta

Pollution Prevention/Green Manufacturing Conference in Atlanta

KATHY HART <[log in to unmask]>

Mon, 20 Oct 1997 11:08:07 -0400

66 lines

New Thread

positive dry film resist

positive dry film resist

Bill Jenkins <[log in to unmask]>

Thu, 2 Oct 1997 11:48:18 -0700

28 lines

Re: positive dry film resist

Afri Singh <[log in to unmask]>

Thu, 2 Oct 1997 18:57:23 -0400

48 lines

Re: positive dry film resist

[log in to unmask]

Fri, 3 Oct 1997 11:08:04 -0400

25 lines

New Thread

Post separation & Resin smear

Post separation & Resin smear

Ken Patel <[log in to unmask]>

Tue, 14 Oct 1997 17:14:59 -0700

43 lines

New Thread

Post separation & Resin smear -Reply

Post separation & Resin smear -Reply

Fred Johnson <[log in to unmask]>

Wed, 15 Oct 1997 15:57:54 +0100

124 lines

New Thread

Press Fit and Ni/Au Surface Finish

Press Fit and Ni/Au Surface Finish

Gus Morvillo <[log in to unmask]>

Mon, 6 Oct 1997 10:18:59 -0400

25 lines

Re: Press Fit and Ni/Au Surface Finish

Paul Gould <[log in to unmask]>

Mon, 6 Oct 1997 18:16:19 +0100

45 lines

Re: Press Fit and Ni/Au Surface Finish

Wally Doeling (wallyd) <[log in to unmask]>

Mon, 6 Oct 1997 12:44:45 -0700

86 lines

Re: Press Fit and Ni/Au Surface Finish

Fulton Feng <[log in to unmask]>

Mon, 6 Oct 1997 18:44:23 -0400

121 lines

Re: Press Fit and Ni/Au Surface Finish

drilbert <[log in to unmask]>

Mon, 6 Oct 1997 19:14:09 -0700

107 lines

New Thread

Preventive maintenance software

Preventive maintenance software

Lourdes Mertens <[log in to unmask]>

Thu, 9 Oct 1997 13:02:44 -0700

28 lines

Re: Preventive maintenance software

Nasser Y. El-Awar <[log in to unmask]>

Fri, 10 Oct 1997 11:37:17 -0400

49 lines

New Thread

Proceeding IPC Works 97

Proceeding IPC Works 97

Phillip E. Hinton <[log in to unmask]>

Thu, 23 Oct 1997 13:18:21 -0400

30 lines

Re: Proceeding IPC Works 97

Lisa Williams <[log in to unmask]>

Thu, 23 Oct 1997 13:11:18 -0500

57 lines

New Thread

PTFE laminates.

PTFE laminates.

Ed Cosper <[log in to unmask]>

Tue, 21 Oct 1997 13:41:57 -0500

27 lines

Re: PTFE laminates.

[log in to unmask]

Tue, 21 Oct 1997 12:21:59 PST8

16 lines

Re: PTFE laminates.

Terry Zhu <[log in to unmask]>

Tue, 21 Oct 1997 15:48:31 -0400

22 lines

Re: PTFE laminates.

[log in to unmask] <[log in to unmask]>

Tue, 21 Oct 1997 21:20:17 -0700

28 lines

New Thread

Pull and cross-section test

Pull and cross-section test

Fulton Feng <[log in to unmask]>

Fri, 17 Oct 1997 12:11:45 -0400

29 lines

New Thread

Punch

Punch

Michael Thiel <[log in to unmask]>

Fri, 24 Oct 1997 11:52:02 -0500

25 lines

Re: Punch

Mark R Ford <[log in to unmask]>

Mon, 27 Oct 1997 19:36:53 EST

54 lines

New Thread

Re : Part Numbering Systems

Re : Part Numbering Systems

Peter Willaert <[log in to unmask]>

Wed, 8 Oct 1997 15:59:19 +0200

119 lines

New Thread

RE : [TECHNET] [Technet]: FAB: FR4 material

RE : [TECHNET] [Technet]: FAB: FR4 material

Eddy Chen <[log in to unmask]>

Wed, 8 Oct 1997 01:27:07 +0800

196 lines

Re: RE : [TECHNET] [Technet]: FAB: FR4 material

Engelmaier <[log in to unmask]>

Thu, 9 Oct 1997 22:10:20 EDT

33 lines

New Thread

Receipt of 10/8/97 2:39PM message

Receipt of 10/8/97 2:39PM message

[log in to unmask]

Wed, 8 Oct 1997 16:46:19 MST

20 lines

New Thread

Reliability Testing New SIR developments

Reliability Testing New SIR developments

Graham Naisbitt <[log in to unmask]>

Wed, 8 Oct 1997 21:31:04 UT

104 lines

New Thread

REPLY- BOARD SOLDERABILITY

REPLY- BOARD SOLDERABILITY

[log in to unmask]

Wed, 29 Oct 1997 21:25:42 -0600

53 lines

New Thread

Request For Info

Request For Info

DRYPAK <[log in to unmask]>

Wed, 22 Oct 1997 10:33:22 EDT

35 lines

New Thread

Resin Blocking on Sequential Lamination

Resin Blocking on Sequential Lamination

Stone, Steve <[log in to unmask]>

Wed, 1 Oct 1997 12:15:00 PDT

29 lines

Re: Resin Blocking on Sequential Lamination

Rick Haynes <[log in to unmask]>

Wed, 1 Oct 1997 17:33:51 -0700

146 lines

New Thread

Resin Blocking on Sequential Lamination -Reply

Resin Blocking on Sequential Lamination -Reply

Ron Hayashi <[log in to unmask]>

Wed, 1 Oct 1997 15:25:07 -0700

25 lines

New Thread

RESIST DEFINED LANDS

RESIST DEFINED LANDS

Eddie Brunker <[log in to unmask]>

Mon, 20 Oct 1997 12:14:59 +0100

61 lines

RESIST DEFINED LANDS

Eddie Brunker <[log in to unmask]>

Tue, 21 Oct 1997 10:34:17 +0100

42 lines

Resist Defined Lands

Eddie Brunker <[log in to unmask]>

Wed, 22 Oct 1997 10:27:42 +0100

33 lines

New Thread

Resist removal from tooling holes

Resist removal from tooling holes

Steves <[log in to unmask]>

Tue, 28 Oct 1997 10:25:20 +0000

30 lines

Resist removal from tooling holes

Richard MacCutcheon <[log in to unmask]>

Tue, 28 Oct 1997 08:41:00 -0700

50 lines

Re: Resist removal from tooling holes

-Bob Daniels, Jr - ECC Corp. <[log in to unmask]>

Fri, 31 Oct 1997 21:48:40 -0500

27 lines

New Thread

Results of BGA issues questions to TechNet.

Results of BGA issues questions to TechNet.

Charles Barker <[log in to unmask]>

Fri, 17 Oct 1997 10:13:15 -0500

151 lines

New Thread

RMA flux on PEMs

RMA flux on PEMs

Jason R. Witt <[log in to unmask]>

Thu, 30 Oct 1997 02:21:47 EST

32 lines

New Thread

Roku-Roku

Roku-Roku

William Johnson <[log in to unmask]>

Thu, 16 Oct 1997 02:23:03 UT

20 lines

New Thread

Roku-Roku Model GR435N high speed milling machine

Roku-Roku Model GR435N high speed milling machine

William Johnson <[log in to unmask]>

Fri, 10 Oct 1997 19:41:53 UT

21 lines

New Thread

Rotary Dip Solderability Fixture

Rotary Dip Solderability Fixture

Jim Herard <[log in to unmask]>

Thu, 30 Oct 1997 18:16:33 -0500

30 lines

Re: Rotary Dip Solderability Fixture

[log in to unmask]

Thu, 30 Oct 1997 18:28:15 -0500

24 lines

Re: Rotary Dip Solderability Fixture

David D Hillman <[log in to unmask]>

Fri, 31 Oct 1997 06:08:12 -0600

73 lines

New Thread

Screening & Inspection Services needed

Screening & Inspection Services needed

Scott Miller <[log in to unmask]>

Sun, 26 Oct 1997 01:49:05 -0700

25 lines

New Thread

SCreenprinting

Re: SCreenprinting

Mel Moschler <[log in to unmask]>

Fri, 3 Oct 1997 08:40:37 CDT

79 lines

New Thread

signoff technet

signoff technet

[log in to unmask]

Wed, 8 Oct 1997 07:49:54 PST8

16 lines

signoff technet

Van Nguyen <[log in to unmask]>

Wed, 8 Oct 1997 07:20:07 -0700

22 lines

New Thread

SIR developments

Re: SIR developments

Graham Naisbitt <[log in to unmask]>

Thu, 9 Oct 1997 22:31:31 UT

79 lines

Re: SIR developments

Universal Circuits, Inc. <[log in to unmask]>

Fri, 10 Oct 1997 08:43:18 -0500

25 lines

Re: SIR developments

Graham Naisbitt <[log in to unmask]>

Mon, 13 Oct 1997 17:48:30 UT

62 lines

New Thread

SIR Testing

Re: SIR Testing

Maguire, James F <[log in to unmask]>

Fri, 3 Oct 1997 09:17:07 -0700

92 lines

Re: SIR Testing

Graham Naisbitt <[log in to unmask]>

Fri, 3 Oct 1997 21:07:37 UT

126 lines

Re: SIR Testing

Maguire, James F <[log in to unmask]>

Sat, 4 Oct 1997 23:15:02 -0700

178 lines

New Thread

SIR Testing New developments

SIR Testing New developments

Graham Naisbitt <[log in to unmask]>

Tue, 7 Oct 1997 16:25:22 UT

1174 lines

SIR Testing New Developments

Graham Naisbitt <[log in to unmask]>

Tue, 7 Oct 1997 17:41:15 UT

1962 lines

Re: SIR Testing New Developments

Kenny Bloomquist <[log in to unmask]>

Tue, 7 Oct 1997 11:52:12 -0700

689 lines

Re: SIR Testing New Developments

Jeffery L. Hempton <[log in to unmask]>

Tue, 7 Oct 1997 14:25:15 -0500

719 lines

Re: SIR Testing New developments

William T. Taylor <[log in to unmask]>

Tue, 7 Oct 1997 16:06:52 -0400

63 lines

Re: SIR Testing New Developments

David Tyler <[log in to unmask]>

Wed, 8 Oct 1997 09:14:40 -0400

28 lines

New Thread

small via on thick fab

small via on thick fab

Ken Patel <[log in to unmask]>

Thu, 23 Oct 1997 14:49:33 -0700

40 lines

Re: small via on thick fab

Joseph Duclos <[log in to unmask]>

Thu, 23 Oct 1997 18:02:12 -0400

41 lines

Re: small via on thick fab

[log in to unmask]

Fri, 24 Oct 1997 12:08:02 -0400

37 lines

Re: small via on thick fab

[log in to unmask] <[log in to unmask]>

Fri, 24 Oct 1997 20:41:29 -0700

42 lines

Re: small via on thick fab

[log in to unmask]

Sat, 25 Oct 1997 17:31:41 -0400

44 lines

New Thread

SMT Connectors plating

Re: SMT Connectors plating

Jesse Covner Tekcon <[log in to unmask]>

Wed, 22 Oct 1997 10:42:16 -0700

45 lines

New Thread

SMT soldering

SMT soldering

Jim Mathis <[log in to unmask]>

Mon, 6 Oct 1997 17:20:19 -0400

32 lines

Re: SMT soldering

Sonny Hays <[log in to unmask]>

Mon, 6 Oct 1997 18:17:39 -0700

94 lines

Re: SMT soldering

Martin Bourke <[log in to unmask]>

Tue, 7 Oct 1997 01:27:04 +0100

68 lines

Re: SMT soldering

Graham Naisbitt <[log in to unmask]>

Tue, 7 Oct 1997 07:22:23 UT

66 lines

New Thread

SMT Tolerance

SMT Tolerance

ryan <[log in to unmask]>

Sat, 4 Oct 1997 06:37:40 -0400

38 lines

New Thread

SMUTTING

SMUTTING

Dennis Rice <[log in to unmask]>

Thu, 9 Oct 1997 12:14:47 -0500

27 lines

Re: SMUTTING

Charles Desroches <[log in to unmask]>

Thu, 9 Oct 1997 13:41:23 -0400

63 lines

Re: SMUTTING

[log in to unmask]

Thu, 9 Oct 1997 15:45:21 -0400

31 lines

Re: SMUTTING

Paul Gould <[log in to unmask]>

Thu, 9 Oct 1997 22:23:28 +0100

32 lines

Re: SMUTTING

Leslie O. Connally <[log in to unmask]>

Thu, 9 Oct 1997 16:30:59 -0700

178 lines

Re: SMUTTING

Russell S Gregory <[log in to unmask]>

Thu, 9 Oct 1997 18:13:19 -0400

23 lines

Re: SMUTTING

Ted Stern <[log in to unmask]>

Fri, 10 Oct 1997 08:35:30 -0700

49 lines

Re: SMUTTING

Eugene Watkins <[log in to unmask]>

Fri, 10 Oct 1997 09:10:59 -0700

56 lines

Re: SMUTTING

[log in to unmask]

Fri, 10 Oct 1997 15:34:33 -0700

46 lines

New Thread

Software Programming Negotiations

Software Programming Negotiations

[log in to unmask]

Tue, 14 Oct 1997 15:46:28 MST

43 lines

New Thread

solder balls

Re: solder balls

John Guy <[log in to unmask]>

Wed, 8 Oct 1997 09:58:46 -0500

63 lines

New Thread

Solder Joint Failures

Re: Solder Joint Failures

[log in to unmask]

Thu, 30 Oct 1997 11:24:53 -0500

37 lines

New Thread

solder joint thickness

solder joint thickness

Aric J Parr <[log in to unmask]>

Tue, 28 Oct 1997 08:01:09 -0500

29 lines

Re: solder joint thickness

[log in to unmask]

Tue, 28 Oct 1997 13:16:39 -0500

36 lines

New Thread

SOLDER MASK T-UP

SOLDER MASK T-UP

annie laberge <[log in to unmask]>

Fri, 17 Oct 1997 10:09:14 -0400

32 lines

Re: SOLDER MASK T-UP

[log in to unmask]

Sat, 18 Oct 1997 10:10:32 -0400

21 lines

New Thread

Solder paste inspection equipment

Solder paste inspection equipment

MCHAN <[log in to unmask]>

Tue, 28 Oct 1997 16:52:43 -0500

36 lines

Re: Solder paste inspection equipment

Jim Marsico 516-595-5879 <[log in to unmask]>

Wed, 29 Oct 1997 14:23:00 -0400

37 lines

New Thread

SOLDER PASTE ON FIDUCI

SOLDER PASTE ON FIDUCI

[log in to unmask]

Thu, 16 Oct 1997 08:32:29 -0500

78 lines

New Thread

SOLDER PASTE ON FIDUCIALS

SOLDER PASTE ON FIDUCIALS

Robert Butterworth <[log in to unmask]>

Thu, 16 Oct 1997 08:46:55 -0600

47 lines

Re: SOLDER PASTE ON FIDUCIALS

Charles Barker <[log in to unmask]>

Thu, 16 Oct 1997 08:39:56 -0500

84 lines

Re: SOLDER PASTE ON FIDUCIALS

Lainie Loveless <[log in to unmask]>

Thu, 16 Oct 1997 09:54:45 -0500

37 lines

Re: SOLDER PASTE ON FIDUCIALS

Scott Decker <[log in to unmask]>

Thu, 16 Oct 1997 07:51:33 -0700

80 lines

New Thread

Solder resist blisters

Re: Solder resist blisters

chiman chan <[log in to unmask]>

Wed, 1 Oct 1997 04:24:24 -0700

86 lines

Re: Solder resist blisters

Ed Cosper <[log in to unmask]>

Wed, 1 Oct 1997 11:31:54 -0500

126 lines

Re: Solder resist blisters

Afri Singh <[log in to unmask]>

Wed, 1 Oct 1997 12:50:44 -0400

64 lines

Re: Solder resist blisters

David P Ho <[log in to unmask]>

Wed, 1 Oct 1997 23:41:53 -0700

20 lines

New Thread

Solder Stencil Guidelines Wanted...

Solder Stencil Guidelines Wanted...

Lang, Michael <[log in to unmask]>

Thu, 16 Oct 1997 09:10:00 E

27 lines

Re: Solder Stencil Guidelines Wanted...

John Guy <[log in to unmask]>

Thu, 16 Oct 1997 14:10:36 -0500

52 lines

New Thread

solder-ball free LPISM?

Re: solder-ball free LPISM?

[log in to unmask]

Wed, 1 Oct 1997 07:33:32 -0400

32 lines

Re: solder-ball free LPISM?

Afri Singh <[log in to unmask]>

Wed, 1 Oct 1997 12:11:11 -0400

115 lines

New Thread

Solderability requirements per ANSI/J-STD-002

Solderability requirements per ANSI/J-STD-002

Long, Jim HSD <[log in to unmask]>

Tue, 28 Oct 1997 11:51:10 -0500

35 lines

Re: Solderability requirements per ANSI/J-STD-002

David D Hillman <[log in to unmask]>

Tue, 28 Oct 1997 13:46:58 -0600

86 lines

New Thread

solderballs

solderballs

Jim Mathis <[log in to unmask]>

Tue, 7 Oct 1997 15:44:47 -0400

24 lines

Re: solderballs

Lainie Loveless <[log in to unmask]>

Tue, 7 Oct 1997 16:09:33 -0500

27 lines

New Thread

Source for temperature-indicating labels

Source for temperature-indicating labels

Vickie Chapman <[log in to unmask]>

Wed, 1 Oct 1997 10:12:30 -0700

29 lines

Re: Source for temperature-indicating labels

Aric J Parr <[log in to unmask]>

Wed, 1 Oct 1997 13:22:23 -0500

22 lines

Re: Source for temperature-indicating labels

Thomas M. Eshelman <[log in to unmask]>

Thu, 2 Oct 1997 09:15:37 -0400

94 lines

New Thread

Sparkgaps

Sparkgaps

Kimmey, Frank <[log in to unmask]>

Thu, 9 Oct 1997 06:52:51 -0700

40 lines

SparkGaps

Kimmey, Frank <[log in to unmask]>

Wed, 22 Oct 1997 06:25:18 -0700

42 lines

New Thread

SPC for primary image process

SPC for primary image process

Terry Zhu <[log in to unmask]>

Mon, 27 Oct 1997 22:19:05 -0800

30 lines

Re: SPC for primary image process

Ed Cosper <[log in to unmask]>

Tue, 28 Oct 1997 08:45:21 -0600

93 lines

New Thread

Spraying Matte LPI

Spraying Matte LPI

Robert Downing <[log in to unmask]>

Fri, 3 Oct 1997 15:22:45 PDT

30 lines

New Thread

Static charge on PCB lamin

Re: Static charge on PCB lamin

Signorelli, Paul <[log in to unmask]>

Tue, 14 Oct 1997 12:11:19 -0600

31 lines

New Thread

Static charge on PCB laminate

Static charge on PCB laminate

Vickie Chapman <[log in to unmask]>

Tue, 7 Oct 1997 08:01:55 -0700

33 lines

New Thread

steam age

steam age

David Arivett <[log in to unmask]>

Fri, 24 Oct 1997 13:31:54 -0500

28 lines

Re: steam age

David D Hillman <[log in to unmask]>

Fri, 24 Oct 1997 14:41:33 -0500

95 lines

Re: steam age

[log in to unmask]

Sat, 25 Oct 1997 12:10:55 -0400

60 lines

New Thread

Stencil printing problems

Re: Stencil printing problems

Charles Barker <[log in to unmask]>

Fri, 3 Oct 1997 08:50:15 -0500

119 lines

New Thread

subscribe

subscribe

Max Bernhardt <[log in to unmask]>

Wed, 8 Oct 1997 08:27:00 -0500

21 lines

Subscribe

Ken T Hernan <[log in to unmask]>

Thu, 9 Oct 1997 13:11:00 PDT

21 lines

Subscribe

Jamey Sibrel <[log in to unmask]>

Wed, 15 Oct 1997 12:58:26 -0500

25 lines

subscribe

Kenny,Gabe <[log in to unmask]>

Fri, 17 Oct 1997 14:28:00 -0400

49 lines

New Thread

Suppliers of Teflon Material

Suppliers of Teflon Material

Scott Miller <[log in to unmask]>

Sat, 11 Oct 1997 17:29:04 -0700

23 lines

Re: Suppliers of Teflon Material

Arturo J. Aguayo <[log in to unmask]>

Sun, 12 Oct 1997 09:55:57 -0700

51 lines

Re: Suppliers of Teflon Material

Manfred Huschka <[log in to unmask]>

Mon, 13 Oct 1997 09:46:48 -0500

53 lines

Re: Suppliers of Teflon Material

Art Shuler <[log in to unmask]>

Tue, 14 Oct 1997 14:13:40 -0400

50 lines

New Thread

SV: [TECHNET] Inboard Ni/Au contacts

SV: [TECHNET] Inboard Ni/Au contacts

Jan Thuesen <[log in to unmask]>

Wed, 29 Oct 1997 14:02:41 +0100

143 lines

New Thread

Switch To Immersion Gold

Re: Switch To Immersion Gold

Ron Hollandsworth <[log in to unmask]>

Wed, 1 Oct 1997 08:26:49 -0500

42 lines

New Thread

Tape and Reel

Tape and Reel

Paul Stolar <[log in to unmask]>

Fri, 31 Oct 1997 13:03:29 -0600

32 lines

New Thread

TEchnet

Re: TEchnet

Valli Robert <[log in to unmask]>

Fri, 3 Oct 1997 12:00:00 -0400

23 lines

New Thread

Temperature and humidity parameters

Temperature and humidity parameters

Greg Parke <[log in to unmask]>

Thu, 9 Oct 1997 16:47:28 -0400

28 lines

New Thread

Test Fixture Generation

Test Fixture Generation

[log in to unmask]

Thu, 16 Oct 1997 09:29:02 -0500

36 lines

New Thread

Test Laboratory

Test Laboratory

Kuwako, Fujio(MMS) <[log in to unmask]>

Wed, 15 Oct 1997 10:01:07 +0900

27 lines

Re: Test Laboratory

Jan Vercammen <[log in to unmask]>

Wed, 15 Oct 1997 12:48:09 +0200

45 lines

Re: Test Laboratory

Delsen Testing Laboratories <[log in to unmask]>

Wed, 15 Oct 1997 06:59:07 -0700

60 lines

New Thread

test method

test method

Benny Nilsson <[log in to unmask]>

Wed, 8 Oct 1997 15:15:16 +0100

31 lines

Re:test method

Guenter Grossmann <[log in to unmask]>

Thu, 9 Oct 1997 10:09:30 +0200

52 lines

New Thread

Time Way Software

Time Way Software

Chris Ford <[log in to unmask]>

Wed, 15 Oct 1997 11:02:44 -0400

29 lines

Re: Time Way Software

Charles Desroches <[log in to unmask]>

Fri, 17 Oct 1997 15:03:18 -0400

102 lines

New Thread

Tombstoning

Tombstoning

Gabriela Bogdan <[log in to unmask]>

Tue, 21 Oct 1997 21:46:50 +0000

36 lines

Re: Tombstoning

COLLINS, GRAHAM <[log in to unmask]>

Tue, 21 Oct 1997 14:55:55 -0400

82 lines

New Thread

ULTIboard

ULTIboard

RAINER <[log in to unmask]>

Thu, 30 Oct 1997 13:24:19 +0000

50 lines

New Thread

UNSUBSCRIBE

UNSUBSCRIBE

MIKE J. LOPEZ <[log in to unmask]>

Wed, 15 Oct 1997 07:14:54 -0400

19 lines

unsubscribe

Sonny Hays <[log in to unmask]>

Tue, 21 Oct 1997 19:01:50 -0700

22 lines

New Thread

Using crystals in refow

Using crystals in refow

Sonia Singh <[log in to unmask]>

Fri, 31 Oct 1997 12:17:01 +0000

30 lines

New Thread

Via Hole ratio's

Via Hole ratio's

VOLPE, RAY <[log in to unmask]>

Wed, 22 Oct 1997 17:33:24 -0400

27 lines

Re: Via Hole ratio's

[log in to unmask]

Wed, 22 Oct 1997 19:04:44 -0400

20 lines

Re: Via Hole ratio's

Fritz Steiner <[log in to unmask]>

Thu, 23 Oct 1997 10:02:53 +0100

46 lines

Re: Via Hole ratio's

[log in to unmask]

Thu, 23 Oct 1997 09:47:41 -0400

33 lines

Re: Via Hole ratio's

[log in to unmask]

Thu, 23 Oct 1997 11:29:11 -0400

23 lines

New Thread

Viod Inspect

Viod Inspect

Zachery Boettcher <[log in to unmask]>

Fri, 3 Oct 1997 10:21:39 +0100

29 lines

Re: Viod Inspect

tgyee <[log in to unmask]>

Fri, 3 Oct 1997 16:57:01 PST

18 lines

Re: Viod Inspect

Andy Cameron <[log in to unmask]>

Fri, 3 Oct 1997 15:11:40 -0400

22 lines

Re: Viod Inspect

Paul Gould <[log in to unmask]>

Sat, 4 Oct 1997 19:01:51 +0100

41 lines

New Thread

Volume resistivity

Re: Volume resistivity

Doug Pauls <[log in to unmask]>

Thu, 16 Oct 1997 09:59:21 -0400

29 lines

New Thread

waste treatment

waste treatment

Marie Holmgard <[log in to unmask]>

Tue, 28 Oct 1997 11:18:10 +1200

45 lines

Re: waste treatment

[log in to unmask]

Tue, 28 Oct 1997 11:24:14 -0500

64 lines

Re: waste treatment

[log in to unmask]

Tue, 28 Oct 1997 11:54:40 -0500

79 lines

Re: waste treatment

fgolisan <[log in to unmask]>

Tue, 28 Oct 1997 11:40:29 PST

39 lines

Re: waste treatment

Nicholas Kane <[log in to unmask]>

Wed, 29 Oct 1997 21:08:36 +1100

103 lines

Re: waste treatment

Paul Gould <[log in to unmask]>

Wed, 29 Oct 1997 18:52:45 +0000

78 lines

Re: waste treatment

Michael Busfield <[log in to unmask]>

Thu, 30 Oct 1997 13:44:52 -0000

131 lines

Re: waste treatment

CSS Asia Co., Ltd. <[log in to unmask]>

Fri, 31 Oct 1997 17:35:35 +0900

83 lines

New Thread

Water Quality

Water Quality

Ted F Myers <[log in to unmask]>

Mon, 20 Oct 1997 17:16:28 +0100

28 lines

New Thread

WAVE SOLDER DROSS & MARBLES

WAVE SOLDER DROSS & MARBLES

Art G. Pauly <[log in to unmask]>

Wed, 29 Oct 1997 12:13:13 +0000

36 lines

Re: WAVE SOLDER DROSS & MARBLES

Lepsche, Thomas G (NM75) <[log in to unmask]>

Wed, 29 Oct 1997 11:09:59 -0700

71 lines

Re: WAVE SOLDER DROSS & MARBLES

Poh Kong Hui <[log in to unmask]>

Thu, 30 Oct 1997 22:08:26 +0800

73 lines

New Thread

Wave Solder Profile Questions

Wave Solder Profile Questions

VanDreel, Kirk <[log in to unmask]>

Thu, 23 Oct 1997 12:07:00 CDT

43 lines

New Thread

Wave soldering SMD actives

Wave soldering SMD actives

Bryan Woods <[log in to unmask]>

Thu, 23 Oct 1997 09:41:19 -0700

47 lines

Re: Wave soldering SMD actives

[log in to unmask]

Thu, 23 Oct 1997 10:54:46 -0700

56 lines

Re: Wave soldering SMD actives

Erik C. Olson <[log in to unmask]>

Thu, 23 Oct 1997 14:08:44 -0500

80 lines

Re: Wave soldering SMD actives

Bev Christian <[log in to unmask]>

Thu, 23 Oct 1997 16:25:16 -0400

89 lines

Re: Wave soldering SMD actives

Graham Naisbitt <[log in to unmask]>

Mon, 27 Oct 1997 09:03:59 UT

149 lines

New Thread

Wire Bonder Comments

Wire Bonder Comments

Steven C. Pelayo <[log in to unmask]>

Mon, 6 Oct 1997 14:06:59 -0400

32 lines

New Thread

X-Ray Inspection Equipment

X-Ray Inspection Equipment

Phillip Ingram <[log in to unmask]>

Tue, 14 Oct 1997 16:58:39 EDT

36 lines

Re: X-Ray Inspection Equipment

Charles Barker <[log in to unmask]>

Tue, 14 Oct 1997 16:51:35 -0500

37 lines

Re: X-Ray Inspection Equipment

Erik C. Olson <[log in to unmask]>

Tue, 14 Oct 1997 16:59:54 -0500

70 lines

New Thread

X-section Mounting Media

X-section Mounting Media

Richard MacCutcheon <[log in to unmask]>

Tue, 14 Oct 1997 13:49:00 -0600

40 lines

Re: X-section Mounting Media

[log in to unmask]

Tue, 14 Oct 1997 13:40:17 MST

39 lines

Re: X-section Mounting Media

Don Burns <[log in to unmask]>

Tue, 14 Oct 1997 16:34:22 -0400

22 lines

Re: X-section Mounting Media

Garry Morand <[log in to unmask]>

Tue, 14 Oct 1997 17:23:08 -0400

42 lines

Re: X-section Mounting Media

Adrian Mulcahy <[log in to unmask]>

Wed, 15 Oct 1997 03:19:51 -0500

83 lines

Re: X-section Mounting Media

[log in to unmask]

Wed, 15 Oct 1997 10:47:02 -0400

43 lines

Re: X-section Mounting Media

Michael Barmuta <[log in to unmask]>

Wed, 15 Oct 1997 10:53:36 -0700

132 lines

Re: X-section Mounting Media

Paul Gould <[log in to unmask]>

Wed, 15 Oct 1997 19:09:48 +0100

33 lines

New Thread

XRF

Re: XRF

Kenny, James <[log in to unmask]>

Wed, 1 Oct 1997 07:42:24 -0700

67 lines

New Thread

YTECHNET? IMMERSION AU, NPTH DEPOSITS

YTECHNET? IMMERSION AU, NPTH DEPOSITS

[log in to unmask]

Tue, 7 Oct 1997 12:50:01 EDT

42 lines

New Thread

YTN? RESIST REMOVAL FROM TOOLING HOLES

YTN? RESIST REMOVAL FROM TOOLING HOLES

[log in to unmask]

Tue, 28 Oct 1997 11:20:49 EST

32 lines

New Thread

[Fwd: Re: PC card (populated) burn-in]

[Fwd: Re: PC card (populated) burn-in]

Kew - Steve <[log in to unmask]>

Wed, 15 Oct 1997 10:28:00 +0100

40 lines

New Thread

[TECHNET] Assembly

Re: [TECHNET] Assembly

David D Hillman <[log in to unmask]>

Thu, 23 Oct 1997 17:15:14 -0500

72 lines

Re: [TECHNET] Assembly

Maguire, James F <[log in to unmask]>

Mon, 27 Oct 1997 12:27:57 -0800

99 lines

New Thread

[TECHNET] Assy: BGA, dummies, pad finishes, stencils, profiles, SM o

[TECHNET] Assy: BGA, dummies, pad finishes, stencils, profiles, SM o

"Jim Marsico"@[log in to unmask]

Mon, 13 Oct 1997 07:37:00 EDT

78 lines

New Thread

[TECHNET] ASSY: Solder compatibility

Re: [TECHNET] ASSY: Solder compatibility

David D Hillman <[log in to unmask]>

Thu, 23 Oct 1997 10:59:54 -0500

68 lines

Re: [TECHNET] ASSY: Solder compatibility

Bev Christian <[log in to unmask]>

Thu, 23 Oct 1997 13:28:47 -0400

97 lines

Re: [TECHNET] ASSY: Solder compatibility

David D Hillman <[log in to unmask]>

Thu, 23 Oct 1997 15:50:30 -0500

143 lines

Re: [TECHNET] ASSY: Solder compatibility

Sheila Smith <[log in to unmask]>

Fri, 24 Oct 1997 08:30:15 -0400

117 lines

Re: [TECHNET] ASSY: Solder compatibility

Maguire, James F <[log in to unmask]>

Mon, 27 Oct 1997 12:32:21 -0800

79 lines

New Thread

[TECHNET] Assy: Solder Failures

Re: [TECHNET] Assy: Solder Failures

David D Hillman <[log in to unmask]>

Thu, 23 Oct 1997 11:56:39 -0500

98 lines

New Thread

[TECHNET] Cupric Chloride Etchant

Re: [TECHNET] Cupric Chloride Etchant

Leslie O. Connally <[log in to unmask]>

Thu, 23 Oct 1997 08:57:32 -0700

206 lines

Re: [TECHNET] Cupric Chloride Etchant

Goldman, Patricia J. <[log in to unmask]>

Thu, 23 Oct 1997 12:05:00 PDT

18 lines

Re: [TECHNET] Cupric Chloride Etchant

NCPPaul @[log in to unmask] <[log in to unmask]>

Fri, 24 Oct 1997 07:29:10 -0400

35 lines

Re: [TECHNET] Cupric Chloride Etchant

Leslie O. Connally <[log in to unmask]>

Fri, 24 Oct 1997 09:04:57 -0700

331 lines

New Thread

[TECHNET] Exposed copper pads/Immersion NiAu

Re: [TECHNET] Exposed copper pads/Immersion NiAu

[log in to unmask]

Tue, 28 Oct 1997 12:53:49 -0500

71 lines

New Thread

[TECHNET] Gold and BGA devices