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July 1997


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Table of Contents:

"Delayed dalamination" (4 messages)
"Delayed Delamination" (1 message)
"Delayed" delamination (1 message)
(Fwd) DIP packaging (1 message)
(Fwd) Slide Lines or Conveyors?? (1 message)
(no subject) (1 message)
98' IPC Events (2 messages)
Adhesive Guidelines (1 message)
ADMIN: IPC's Move to More Powerful Mail List Software (1 message)
ADMIN:For your information (1 message)
ADMIN:Unwelcome advertisement. (1 message)
ALLOY 42 (2 messages)
Any one help? (2 messages)
ARTICLE - When a Ground Is Not a Ground Article (1 message)
ASS: Wave Solder 0805 bridging (2 messages)
ASSEM (2 messages)
ASSEM organic passivation (1 message)
assem:Oxydation arrest paper (2 messages)
Assembly-IC Vendor LOGOS (2 messages)
Assembly: Torsion Tester Quest (1 message)
ASSY (De-soldering tools) (4 messages)
ASSY - Water soluble solder pastes and component bake (3 messages)
ASSY- Encapsulant/underfill (3 messages)
ASSY: BGA Mounting (3 messages)
Assy: D-Pak Tape and Reel orientation (1 message)
ASSY: EE Evaluation Engineering (2 messages)
Assy: equipment needed (1 message)
ASSY: feeders (1 message)
ASSY: MIL-P-13949H (1 message)
ASSY: MIL-S-13949H (2 messages)
Assy: mini-wave (1 message)
ASSY: Nickel Beryllium (2 messages)
ASSY: Probe/Contact failures (1 message)
Assy: Rigid-Flex Thermal Processing (2 messages)
ASSY: Sn43/Pb43/Bi14 solder (2 messages)
ASSY: Solderpaste samples (2 messages)
Assy: Temporary Spot Solder Mask (1 message)
ASSY: TUBE HOLDERS (1 message)
ASSY: Wave Solder Optimizer (4 messages)
ASSY: Wavesoldering questions... (fwd) (1 message)
ASSY:PCB/heatsink lamination (3 messages)
ASSY:Wave Solder (4 messages)
Axial Bulk Feeders (1 message)
Bar Coding / Job Tracking (4 messages)
Bare PCB packaging (1 message)
BGA and Paste-Insert-Reflow (3 messages)
BGA and Pin-in-Paste (3 messages)
BGA Question (2 messages)
BGA Re-balling (5 messages)
BGA Re-balling -Reply (1 message)
BGA sphere attach. (1 message)
Biocide, no formaldehyde. (4 messages)
Boards with hard gold and electroless Ni-Au (2 messages)
Bonding Tools! (1 message)
Cadence Allegro on IBM rs6000 (AIX) (1 message)
Carbon ink vs. gold - ink vs. mesh/foil (3 messages)
Castalated vs Full Face Terminations (1 message)
Chemicals for AOI ? (2 messages)
cleaning /rework of osp packs (1 message)
Conductor design rule (1 message)
Conformal Coat: Masking (5 messages)
Contact of Dynaco? (1 message)
Continuous monitoring system (1 message)
Copper and Phosphate (1 message)
Copper thickness (3 messages)
Creep resistance of solder (2 messages)
Cu Foil Grain size (3 messages)
Decapping ICs (4 messages)
DECAPPING WITHOUT DAMAGING THE SILVER LAYER (3 messages)
DES (5 messages)
DES : Question About Power Density Capabilities of PCB's (2 messages)
Des: Design check list (3 messages)
Des: Design check list -Reply (1 message)
DES: High Cycle Fatigue Properties of Solder (1 message)
DES: Pads (2 messages)
DES: Panelisation (1 message)
DES: panelization (1 message)
DES: RF layout reqmts (1 message)
DES: tented vias (6 messages)
DES: tented vias(2) (1 message)
DES: Thermal Conductivity (2 messages)
DES: Thermal Vias (4 messages)
DES: Via Inductance (2 messages)
DES:Conductor design rule (3 messages)
DES:FR-4 Thermal Conductivity (4 messages)
DES:thru via current capability (1 message)
Design check list (1 message)
Dielectric constant of FR4 - tempera (1 message)
Dielectric constant of FR4 - temperature (1 message)
Dielectric constant of FR4 - temperature dependency (1 message)
DIP packaging (2 messages)
Drill Chart (1 message)
Drill Chart.... (1 message)
Drilling Backup Material (1 message)
Dry Film Rework (1 message)
Dummy Die (2 messages)
Electrically operated "Hot air oven" (1 message)
Electrically operated "Hot air oven" (fwd) (1 message)
Electroless Nickel and Immersion Gold (4 messages)
Electroless Nickle and Immersion Gold (2 messages)
Electrostatic dissipative (1 message)
Electrostatic dissipative f (1 message)
Embedded Components. (1 message)
ESD ground vs Electrical ground (9 messages)
Etcher Pressure Setting (3 messages)
FAB (1 message)
FAB : tented vias (2 messages)
FAB- (1 message)
Fab/Assy: Thermal Vias (3 messages)
Fab/Assy: Thermal Vias: REPLY (1 message)
FAB: charts of standard drill sizes (1 message)
FAB: Coefficients of Thermal Expansion (1 message)
FAB: Controller for Oxide (1 message)
FAB: Copper Peelers (4 messages)
FAB: Copper plating Tensile and Elongation (3 messages)
FAB: Excellon LPG2001 Photoplotter (1 message)
FAB: FR4 exotherm & rheology (2 messages)
FAB: Getek Material (2 messages)
FAB: Gold plating (1 message)
FAB: Immersion Au as solderable surface/SPECS (1 message)
FAB: Inner-Layer Scaling Factors (2 messages)
Fab: Innerlayer cleanliness/Fine lines&Spaces (4 messages)
Fab: non-symmetrical stackups (3 messages)
FAB: Padless vs. Padded (4 messages)
FAB: Re: Black oxide and wedge voiding (1 message)
FAB: Re: Pink ring and hard failures (2 messages)
FAB: Reliability of blind and buried vias. (1 message)
FAB: reverse pulse plating (1 message)
Fab: Rivets in the lamination press (2 messages)
FAB: Robber Bars and More (2 messages)
FAB: Silkscreen (1 message)
FAB: Software for Lab Analysis Management (2 messages)
Fab: soldermask capability (1 message)
Fab: soldermask capability REPLY (2 messages)
FAB: Soldermask Residue - SERA (5 messages)
FAB: Taconic Tac-Lam (1 message)
FAB: Taconic-Tac-Lam (2 messages)
FAB: Ultrasonic Vibrators (1 message)
FAB: Unsupported vs. Supported (1 message)
Fab:RE oxide controller (1 message)
Fabrication Specs (2 messages)
FLEX (8 messages)
Flex Circuit Info (2 messages)
Flux Classification (2 messages)
Flux Survey? (2 messages)
Forums (2 messages)
Frosty board edges. (1 message)
FW: "Luis Rivera" <[log in to unmask]>: FAB: Software for Lab Analysis Management (2 messages)
Fw: :Your information (2 messages)
FW: BGA and Pin-in-Paste (1 message)
FW: BGA sphere attach. (1 message)
Fw: Chemicals for AOI (1 message)
FW: Electrostatic dissipative (1 message)
FW: GTEL records (1 message)
FW: Solder Dispensing Valve and Controller (1 message)
FW: [log in to unmask]: RE: FAB: Silkscreen (1 message)
Fwd(1): Re: Mechanism of Wedge Void Formation (2 messages)
fwd: Bare PCB packaging (1 message)
Fwd: FAB: Re: Pink ring and hard failures (2 messages)
Fwd: Fab:RE oxide controller (1 message)
fwd: Re: RF Design (1 message)
FWD: Re: Tensile strength/elongation (1 message)
FWD:Re: polyimide flexible jumper (1 message)
GEN-cost analysis and model (1 message)
GEN: Cab Maestro (1 message)
GEN: Electrical Ground or Earth Ground? (2 messages)
GEN: ESD Flooring Pros/Cons (5 messages)
GEN: IPC spec for HDI (1 message)
GEN: SMOBC vs Reflower Tin/Lead (4 messages)
GEN: Technical Paper (1 message)
General: 3rd Ann. Ala. Adv. Tech. Seminar (1 message)
Glue (2 messages)
Gold - copper diffusion (1 message)
Gold / Silver Incompatibility for Adhesives (4 messages)
Gold peel after solder level (5 messages)
HASL Finish (1 message)
Help..Need Some Resources (1 message)
High Cycle Fatigue Properties of Solder (1 message)
Hole Fill (1 message)
HPGL2 conversion software (7 messages)
hull cell (3 messages)
Idents and HASL (1 message)
IEC Specs (2 messages)
IN-CLOSING: Padless vs. Padded (2 messages)
IONIC TESTING (6 messages)
IPC National Conference: Organic High Density Interconnect (1 message)
IPC PWB SURFACE FINISHES CONFERENCE (3 messages)
IPC spec for Flip Chip (2 messages)
IPC-B-24 Test Boards (2 messages)
IPC-D-275 Requirements (2 messages)
IPCchat session announcement (3 messages)
ISO certification (3 messages)
ISO-Net (1 message)
John Treiber Company (1 message)
John Treiber Company. (3 messages)
July 1 (1 message)
Koax plating (1 message)
Lackey Sanding Service (2 messages)
landless via (1 message)
line width ,space (2 messages)
Market Research Data (1 message)
MATERIALS: Prepreg info needed (1 message)
Mechanism of Wedge Void Formation (10 messages)
Message for Steve O'Hara, HP (1 message)
minimum hole size (1 message)
Mixed Technologie SMD-Soldering + COB (2 messages)
Motherboard (1 message)
Need RF Fab/Assy house (1 message)
North Texas Chapter ~ IPC Designers Council Meeting August 7th (2 messages)
OFHC copper (4 messages)
Oxidation arrest paper (1 message)
oxide controller (1 message)
Oxide Post Bake (6 messages)
Oxide skips (3 messages)
Oxydation arrest paper (8 messages)
Panelization (3 messages)
Panelization - Thks (1 message)
Part II: Mechanism of Wedge Void Formation (5 messages)
PCB Equipment manufacturer (1 message)
PCB rework cycles (2 messages)
PCB Training Course (1 message)
placement machine evaluation (1 message)
placement system (1 message)
PLANARITY (1 message)
please remove request (1 message)
polyimide flexible jumper (2 messages)
polyimide flexible jumper -Reply (1 message)
Power Symbols (3 messages)
PPM Defect Counting (9 messages)
PPM Defects Project (1 message)
Printed Info on Flexible Circuit Manufacturing (3 messages)
Pwb Design Service (1 message)
PWB OEM Incoming Inspection (2 messages)
PWB trace cut sealing (5 messages)
Re [2]: Re: Fab: Innerlayer cleanliness/Fine lines&Spaces (1 message)
Re(2): Decapping ICs (1 message)
Re2: PPM Defect Counting> more thoughts (1 message)
Re: Pink ring and hard failures (1 message)
Reflow oven temperature (7 messages)
Reliability of Solder Mask Defined Lands (1 message)
Removal of Dunlop Glue (Rubber base glue) (1 message)
Remove prepreg (3 messages)
Replay : Barcoding / Job Tracking (1 message)
Reply to "what is via tenting?" (1 message)
Reply [3] - Solder compatibility (1 message)
Reply:Wave and BGA (1 message)
REQUIRED...Ink Mixer/Stirrer (1 message)
REWORK: BGA adaptors (1 message)
REWORK: BGA adaptors -Reply (1 message)
Re[2]: Bar Coding / Job Tracking (1 message)
Re[2]: LPISM Stripping (1 message)
Re[2]: Mechanism of Wedge Void Formation (9 messages)
Re[2]: Rigid-flex technologies (1 message)
Re[2]: Solder Mask Residue (1 message)
Re[5]: Mechanism of Wedge Void Formation (2 messages)
Re[6]: Mechanism of Wedge Void Formation (1 message)
Rigid-flex technologies (3 messages)
Rigid-Flex Technology (1 message)
ROUTED EDGE QUALITY (3 messages)
Second hand machine (1 message)
Second hand/Refurbished equipment (1 message)
SHORTS AT ELEVATED TEMPERATURE IN DOUBLE SIDE BOARDS. (4 messages)
Silkscreen (5 messages)
Silkscreen -Reply (3 messages)
Smallest standard label size (1 message)
SMT Assy Equipment (1 message)
Solder Balls (3 messages)
Solder compatibility (10 messages)
Solder dispensing valve and controller (3 messages)
Solder Expert (2 messages)
Solder joint design rules (3 messages)
Solder Joint Reliability (1 message)
Solder Mask Residue (6 messages)
Solder Recovery Systems (1 message)
Solderability Tests for PCBs (7 messages)
Soldering silver on brass (5 messages)
SOLDERING TO PLATINUM (2 messages)
Sources of Universal Equipment (1 message)
Standard Lab Conditions (1 message)
Standard PCB/PWB Trace Width's (4 messages)
Standard PCB/PWB Trace Width's -Reply (1 message)
Standard PCB/PWB Trace Withd's (2 messages)
Strip tin-lead (2 messages)
supplier for screens (2 messages)
Surface prep prior to solder mask (1 message)
Targets and Film (6 messages)
TechNet Forum (2 messages)
TechNet-d Digest V97 #423 (1 message)
TechNet-d Digest V97 #428 (1 message)
Temporary spot mask (1 message)
Temporary Spot Solder Mask (5 messages)
Tensile strength/elongation (1 message)
Test and Inspection Strategy (3 messages)
Test Die for SMD Reliability Testing (3 messages)
Test die for SMD reliability. (1 message)
Test probes for gold fingers (1 message)
Test Strategy (1 message)
Thanks For All The Flex Circuit Info (1 message)
Thermal concerns in the assembly of BGA designs (1 message)
Thermal considerations in BGA design (1 message)
Through Hole Solder Joint Performance (1 message)
TMRC/AMRC Archive (1 message)
Trace & Space Width (1 message)
U.V. cure of L.P.I. soldermasks (3 messages)
Ultrasonic Vibrators (2 messages)
Unidentified subject! (11 messages)
Urgently need 3M Fluorad FC-725 conformal coat material (1 message)
Use of SMD shields for shielding pre reflow (ASSEM) (4 messages)
Using the Technet Exploder (2 messages)
Vacations (1 message)
vacuum lamination (2 messages)
Vapor Honing (5 messages)
Vendors for oxide treatment on copper laminates (1 message)
Via hole/pad size (1 message)
Via Inductance (2 messages)
Voltage Breakdown of materials (1 message)
Voltage Breakdowns of Resins (1 message)
Want Electrovert Cleaner (1 message)
Wave and BGA (5 messages)
Wave Solder Optimizer (1 message)
Wave: Airknife (1 message)
[Fwd: Alloy 42] (1 message)
[Fwd: Mousebites/divots] (3 messages)
[Fwd: Via Current ratings] (1 message)

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Subject Sorted by Subject, Chronologically

From

Date

Size

New Thread

"Delayed dalamination"

RE: "Delayed dalamination"

LES CONNALLY

Wed, 30 Jul 1997 12:37:03 -0700

156 lines

Re: "Delayed dalamination"

Orna and Yehuda

Mon, 28 Jul 1997 22:45:38 +0300

52 lines

RE: "Delayed dalamination"

Andrew J. Scholand

Sun, 27 Jul 1997 02:35:32 -0400

124 lines

Re: "Delayed dalamination"

Orna and Yehuda

Thu, 24 Jul 1997 06:05:12 +0300

65 lines

New Thread

"Delayed Delamination"

"Delayed Delamination"

Kasprzak, Bill (esd) US

Mon, 21 Jul 97 07:35:00 PDT

68 lines

New Thread

"Delayed" delamination

"Delayed" delamination

Orna and Yehuda

Fri, 18 Jul 1997 15:43:07 +0300

55 lines

New Thread

(Fwd) DIP packaging

(Fwd) DIP packaging

Lainie Loveless

Thu, 17 Jul 97 16:47:06

70 lines

New Thread

(Fwd) Slide Lines or Conveyors??

(Fwd) Slide Lines or Conveyors??

Keith Birchfield

Thu, 24 Jul 1997 11:25:16 +0000

80 lines

New Thread

(no subject)

RE: (no subject)

Alderete, Michael

Wed, 16 Jul 1997 12:09:47 -0700

107 lines

New Thread

98' IPC Events

Re: 98' IPC Events

Mike Buetow

Tue, 29 Jul 1997 13:07:24 -0500 (CDT)

63 lines

98' IPC Events

Baker,Kelly

Tue, 29 Jul 1997 13:35:04 -0400

36 lines

New Thread

Adhesive Guidelines

Adhesive Guidelines

Denis Meloche

Thu, 31 Jul 1997 11:35:13 -0400

50 lines

New Thread

ADMIN: IPC's Move to More Powerful Mail List Software

ADMIN: IPC's Move to More Powerful Mail List Software

Dmitriy Sklyar

Fri, 25 Jul 1997 16:58:07 -0500

70 lines

New Thread

ADMIN:For your information

ADMIN:For your information

Dmitriy Sklyar

Mon, 28 Jul 1997 10:48:35 -0500

54 lines

New Thread

ADMIN:Unwelcome advertisement.

ADMIN:Unwelcome advertisement.

Dmitriy Sklyar

Mon, 28 Jul 1997 09:37:56 -0500

55 lines

New Thread

ALLOY 42

RE: ALLOY 42

Max Bernhardt

Tue, 22 Jul 1997 07:20:00 -0500

79 lines

ALLOY 42

Gabriela Bogdan

Fri, 18 Jul 1997 19:35:21 +0000

50 lines

New Thread

Any one help?

Re: Any one help?

<>

Mon, 7 Jul 1997 00:02:04 -0400 (EDT)

48 lines

Any one help?

tetz schemm

Thu, 03 Jul 1997 00:10:01 PDT

67 lines

New Thread

ARTICLE - When a Ground Is Not a Ground Article

ARTICLE - When a Ground Is Not a Ground Article

<>

Wed, 30 Jul 1997 09:41:19 -0500

289 lines

New Thread

ASS: Wave Solder 0805 bridging

Re: ASS: Wave Solder 0805 bridging

Poh Kong Hui

Mon, 21 Jul 1997 23:32:41 +0800 (SST)

65 lines

ASS: Wave Solder 0805 bridging

Nachbor, Suzanne (MN51)

Fri, 18 Jul 97 11:44:00 PDT

46 lines

New Thread

ASSEM

RE: ASSEM

Valladares, Hector A (FL51)

Tue, 8 Jul 1997 12:53:37 -0400

115 lines

ASSEM

peter dahlen

Tue, 08 Jul 1997 14:41:36 +0000

72 lines

New Thread

ASSEM organic passivation

Re: ASSEM organic passivation

peter dahlen

Thu, 10 Jul 1997 09:18:16 +0000

143 lines

New Thread

assem:Oxydation arrest paper

Re: assem:Oxydation arrest paper

Duane B. Mahnke

Mon, 21 Jul 1997 19:45:00 -0700

103 lines

assem:Oxydation arrest paper

Marie-Jose Lambert (Marie-Jose Lambert Marie-Jose Lambert)

Mon, 21 Jul 1997 12:21:50 -0300

50 lines

New Thread

Assembly-IC Vendor LOGOS

Re: Assembly-IC Vendor LOGOS

Stew Benedict

Wed, 23 Jul 1997 02:21:08 -0700 (PDT)

69 lines

Assembly-IC Vendor LOGOS

<>

Tue, 22 Jul 97 08:43:30 PST8

45 lines

New Thread

Assembly: Torsion Tester Quest

Assembly: Torsion Tester Quest

<>

Tue, 01 Jul 97 07:58:15 cst

46 lines

New Thread

ASSY (De-soldering tools)

Re: ASSY (De-soldering tools)

Denis Meloche

Thu, 10 Jul 1997 11:24:18 -0400

75 lines

Re: ASSY (De-soldering tools)

Phil Bavaro

Wed, 9 Jul 1997 17:54:35 -0800

86 lines

Re: ASSY (De-soldering tools)

<>

Wed, 9 Jul 1997 16:21:14 -0500

84 lines

Re: ASSY (De-soldering tools)

Tom Hybiske

Wed, 09 Jul 97 16:13:22

43 lines

New Thread

ASSY - Water soluble solder pastes and component bake

Re: ASSY - Water soluble solder pastes and component bake

<>

Thu, 31 Jul 1997 09:42:38 -0400 (EDT)

104 lines

Re: ASSY - Water soluble solder pastes and component bake

Charles Elliott

30 Jul 1997 12:01:32 U

133 lines

ASSY - Water soluble solder pastes and component bake

Patrick Ducas

Wed, 30 Jul 1997 10:34:50 -0400

66 lines

New Thread

ASSY- Encapsulant/underfill

Re: ASSY- Encapsulant/underfill

<>

Tue, 15 Jul 1997 21:54:12 -0400 (EDT)

61 lines

Re: ASSY- Encapsulant/underfill

Brian Hyde

Tue, 15 Jul 97 10:53:10 EDT

82 lines

ASSY- Encapsulant/underfill

Charles Elliott

11 Jul 1997 11:40:43 U

54 lines

New Thread

ASSY: BGA Mounting

ASSY: BGA Mounting

Jim Herard

Tue, 22 Jul 1997 07:22:40 -0400

89 lines

Re: ASSY: BGA Mounting

Gary Woodford

Tue, 22 Jul 1997 07:23:13 +0100

54 lines

ASSY: BGA Mounting

Christy Graham

Mon, 21 Jul 1997 16:41:29 -0800

48 lines

New Thread

Assy: D-Pak Tape and Reel orientation

Assy: D-Pak Tape and Reel orientation

Mark W. Spitnale

Tue, 01 Jul 1997 14:05:54 -0500

49 lines

New Thread

ASSY: EE Evaluation Engineering

Re: ASSY: EE Evaluation Engineering

<>

Mon, 28 Jul 1997 08:00:20 -0500

65 lines

ASSY: EE Evaluation Engineering

<>

Sun, 27 Jul 1997 21:29:57 -0500

43 lines

New Thread

Assy: equipment needed

Assy: equipment needed

Blanchet,Richard

Tue, 01 Jul 1997 08:14:00 -0400 (EDT)

47 lines

New Thread

ASSY: feeders

ASSY: feeders

Blanchet,Richard

Mon, 28 Jul 1997 09:09:00 -0400 (EDT)

42 lines

New Thread

ASSY: MIL-P-13949H

ASSY: MIL-P-13949H

<>

Mon, 28 Jul 97 9:43:13 PDT

45 lines

New Thread

ASSY: MIL-S-13949H

Re: ASSY: MIL-S-13949H

David Bergman

Sun, 3 Aug 1997 21:53:38 -0500 (CDT)

80 lines

ASSY: MIL-S-13949H

<>

Mon, 28 Jul 97 14:39:34 PDT

45 lines

New Thread

Assy: mini-wave

Assy: mini-wave

Blanchet,Richard

Wed, 09 Jul 1997 11:19:00 -0400 (EDT)

43 lines

New Thread

ASSY: Nickel Beryllium

ASSY: Nickel Beryllium

Poh Kong Hui

Fri, 1 Aug 1997 23:45:32 +0800 (SST)

43 lines

ASSY: Nickel Beryllium

Poh Kong Hui

Wed, 30 Jul 1997 07:00:52 +0800 (SST)

43 lines

New Thread

ASSY: Probe/Contact failures

ASSY: Probe/Contact failures

<>

Tue, 1 Jul 1997 15:28:24 -0500

48 lines

New Thread

Assy: Rigid-Flex Thermal Processing

Re: Assy: Rigid-Flex Thermal Processing

Frank Hinojos

Wed, 16 Jul 1997 13:40:10 -0700

86 lines

Assy: Rigid-Flex Thermal Processing

Ploughman, Mark

Wed, 16 Jul 97 12:05:04

59 lines

New Thread

ASSY: Sn43/Pb43/Bi14 solder

Re: ASSY: Sn43/Pb43/Bi14 solder

<>

Thu, 10 Jul 97 10:24:43 cst

101 lines

ASSY: Sn43/Pb43/Bi14 solder

Patrick Ducas

Wed, 09 Jul 1997 09:27:04 -0400

67 lines

New Thread

ASSY: Solderpaste samples

Re: ASSY: Solderpaste samples

<>

Tue, 29 Jul 97 06:56:30 cst

73 lines

ASSY: Solderpaste samples

<>

Mon, 28 Jul 1997 15:54:50 -0500

47 lines

New Thread

Assy: Temporary Spot Solder Mask

Re: Assy: Temporary Spot Solder Mask

Jerry Cupples

Wed, 23 Jul 1997 13:11:21 -0500

63 lines

New Thread

ASSY: TUBE HOLDERS

ASSY: TUBE HOLDERS

Steve Quinn

Tue, 1 Jul 1997 09:26:28 -0500 (CDT)

46 lines

New Thread

ASSY: Wave Solder Optimizer

RE: ASSY: Wave Solder Optimizer

Vickie Chapman

Wed, 2 Jul 1997 12:42:17 -0700

127 lines

RE: ASSY: Wave Solder Optimizer

Lepsche, Thomas G (NM75)

Wed, 2 Jul 1997 11:10:46 -0600

66 lines

Re: ASSY: Wave Solder Optimizer

Rob Williams

Wed, 02 Jul 1997 08:04:01 -0500

90 lines

ASSY: Wave Solder Optimizer

Vickie Chapman

Tue, 1 Jul 1997 13:24:00 -0700

45 lines

New Thread

ASSY: Wavesoldering questions... (fwd)

ASSY: Wavesoldering questions... (fwd)

Vickie Chapman

Mon, 7 Jul 1997 08:55:39 -0700

72 lines

New Thread

ASSY:PCB/heatsink lamination

Re: ASSY:PCB/heatsink lamination

David Anderson

Tue, 22 Jul 1997 10:10:24 -0500

63 lines

RE: ASSY:PCB/heatsink lamination

ADAMS, Mike

Tue, 22 Jul 1997 11:10:55 -0400 (EDT)

115 lines

ASSY:PCB/heatsink lamination

Devitt, Ken

Tue, 22 Jul 1997 10:12:05 -0400

48 lines

New Thread

ASSY:Wave Solder

Re: ASSY:Wave Solder

<>

Tue, 15 Jul 1997 08:41:28 +0900

50 lines

Re: ASSY:Wave Solder

Poh Kong Hui

Sun, 13 Jul 1997 16:56:56 +0800 (SST)

102 lines

Re: ASSY:Wave Solder

Aric J Parr

Fri, 11 Jul 1997 08:07:51 -0500

91 lines

ASSY:Wave Solder

<>

Fri, 11 Jul 97 14:45:54

60 lines

New Thread

Axial Bulk Feeders

Axial Bulk Feeders

Challoner, Scott

Thu, 17 Jul 97 16:34:00 CDT

37 lines

New Thread

Bar Coding / Job Tracking

Re: Bar Coding / Job Tracking

Alan Berni

Wed, 9 Jul 1997 10:03:24 -0400

59 lines

Re[2]: Bar Coding / Job Tracking

bob smith

Tue, 08 Jul 97 08:46:07

104 lines

Re: Bar Coding / Job Tracking

drilbert

Mon, 07 Jul 1997 19:50:26 -0700

67 lines

Bar Coding / Job Tracking

<>

Mon, 7 Jul 1997 10:30:26 -0400 (EDT)

47 lines

New Thread

Bare PCB packaging

RE: Bare PCB packaging

Ed Cosper

Mon, 14 Jul 1997 17:04:33 -0500

101 lines

New Thread

BGA and Paste-Insert-Reflow

Re[2]: BGA and Paste-Insert-Reflow

<>

Fri, 25 Jul 97 08:43:48 -0500

98 lines

Re: BGA and Paste-Insert-Reflow

Jeffery L. Hempton

Fri, 25 Jul 1997 06:33:23 -0500

68 lines

BGA and Paste-Insert-Reflow

Steve Siu

Thu, 24 Jul 1997 17:01:57 -0800

50 lines

New Thread

BGA and Pin-in-Paste

Re: BGA and Pin-in-Paste

<>

Thu, 31 Jul 1997 09:42:40 -0400 (EDT)

49 lines

Re: BGA and Pin-in-Paste

Jack Crawford

Thu, 31 Jul 1997 08:18:52 -0500 (CDT)

82 lines

BGA and Pin-in-Paste

Steve Siu

Wed, 30 Jul 1997 12:52:57 -0800

61 lines

New Thread

BGA Question

RE: BGA Question

Alderete, Michael

Wed, 09 Jul 1997 16:37:28 -0700

118 lines

BGA Question

rob starr

Wed, 9 Jul 1997 16:00:29 -0700

52 lines

New Thread

BGA Re-balling

Re: BGA Re-balling

Greg Bartlett

8 Jul 1997 08:32:47 -0400

98 lines

Re: BGA Re-balling

Allen Hertz

Tue, 08 Jul 97 08:27:36 EST

70 lines

Re: BGA Re-balling

<>

Mon, 7 Jul 1997 22:57:26 -0400 (EDT)

40 lines

RE: BGA Re-balling

Alderete, Michael

Mon, 07 Jul 1997 17:51:18 -0700

112 lines

BGA Re-balling

Michael J. Marks

Mon, 07 Jul 1997 18:53:02 -0400

38 lines

New Thread

BGA Re-balling -Reply

BGA Re-balling -Reply

Marshall Canaday

Tue, 08 Jul 1997 08:42:21 -0400

45 lines

New Thread

BGA sphere attach.

re: BGA sphere attach.

Alderete, Michael

Tue, 08 Jul 1997 06:24:45 -0700

75 lines

New Thread

Biocide, no formaldehyde.

Re: Biocide, no formaldehyde.

<>

Fri, 18 Jul 97 13:04:55 cst

118 lines

Re: Biocide, no formaldehyde.

<>

Thu, 17 Jul 97 15:37:59 PST

69 lines

Re: Biocide, no formaldehyde.

Aric J Parr

Thu, 17 Jul 1997 14:03:45 -0500

69 lines

Biocide, no formaldehyde.

Dan Brandler

Thu, 17 Jul 1997 09:07:25 -0700

49 lines

New Thread

Boards with hard gold and electroless Ni-Au

Re: Boards with hard gold and electroless Ni-Au

Afri Singh

Tue, 29 Jul 1997 20:37:11 -0400 (EDT)

76 lines

Boards with hard gold and electroless Ni-Au

B.S.Krishna

Mon, 28 Jul 1997 17:56:53 +0500

56 lines

New Thread

Bonding Tools!

Bonding Tools!

Patrick Ducas

Wed, 16 Jul 1997 09:13:29 -0400

95 lines

New Thread

Cadence Allegro on IBM rs6000 (AIX)

Cadence Allegro on IBM rs6000 (AIX)

<>

Tue, 29 Jul 1997 14:22:50 -0700

44 lines

New Thread

Carbon ink vs. gold - ink vs. mesh/foil

Re: Carbon ink vs. gold - ink vs. mesh/foil

Michael Barmuta

Tue, 29 Jul 1997 09:30:46 -0700

104 lines

Re: Carbon ink vs. gold - ink vs. mesh/foil

72030,3271

29 Jul 97 08:58:16 EDT

34 lines

Carbon ink vs. gold - ink vs. mesh/foil

Gregg Klawson

Tue, 29 Jul 1997 07:54:36 -0400

55 lines

New Thread

Castalated vs Full Face Terminations

Castalated vs Full Face Terminations

<>

Mon, 21 Jul 1997 16:31:02 -0500

54 lines

New Thread

Chemicals for AOI ?

Re: Chemicals for AOI ?

Scott B. Westheimer

Fri, 11 Jul 1997 21:04:27 +0800

127 lines

Re: Chemicals for AOI ?

Jan Thuesen

Fri, 11 Jul 1997 13:26:57 +0200

87 lines

New Thread

cleaning /rework of osp packs

cleaning /rework of osp packs

Baruch Schifman

Wed, 30 Jul 1997 18:31:28 +0300

60 lines

New Thread

Conductor design rule

Conductor design rule

<>

Thu, 10 Jul 97 19:03:02 -0400

45 lines

New Thread

Conformal Coat: Masking

Re[2]: Conformal Coat: Masking

<>

Sat, 12 Jul 97 10:41:47 -0500

85 lines

Re: Conformal Coat: Masking

Mark Shandley

Thu, 10 Jul 1997 09:41:48 -0500

71 lines

re: Conformal Coat: Masking

<>

Wed, 9 Jul 97 15:53:50 EDT

175 lines

Re: Conformal Coat: Masking

Aric J Parr

Wed, 9 Jul 1997 15:28:20 -0500

72 lines

Conformal Coat: Masking

Lainie Loveless

Wed, 09 Jul 97 14:42:32

49 lines

New Thread

Contact of Dynaco?

Contact of Dynaco?

<>

Fri, 25 Jul 97 09:00:19 MDT

36 lines

New Thread

Continuous monitoring system

Continuous monitoring system

Lim Teong Kheng

Fri, 25 Jul 1997 21:24:12 +0800

40 lines

New Thread

Copper and Phosphate

Re: Copper and Phosphate

<>

Tue, 1 Jul 1997 09:00:07 -0400 (EDT)

65 lines

New Thread

Copper thickness

RE: Copper thickness

<>

Fri, 11 Jul 1997 7:53:17 +0000

65 lines

Re: Copper thickness

<>

Fri, 11 Jul 1997 09:59:18 +0800

39 lines

Copper thickness

Anthony Wong

Thu, 10 Jul 1997 19:54:11 -0400

42 lines

New Thread

Creep resistance of solder

Re: Creep resistance of solder

<>

Thu, 24 Jul 97 13:27:05 cst

80 lines

Creep resistance of solder

Denis Meloche

Wed, 23 Jul 1997 14:05:24 -0400

44 lines

New Thread

Cu Foil Grain size

Re: Cu Foil Grain size

David Hoover

Tue, 22 Jul 1997 18:26:07 -0700

93 lines

Re: Cu Foil Grain size

<>

Tue, 22 Jul 97 07:40:02 PST

83 lines

Cu Foil Grain size

<>

Tue, 22 Jul 1997 15:34:10 +0800

57 lines

New Thread

Decapping ICs

Re[2]: Decapping ICs

Frank Hinojos

Wed, 16 Jul 1997 10:05:44 -0700

130 lines

Re(2): Decapping ICs

Sheila Smith

Wed, 16 Jul 1997 08:36:00 -0400 (EDT)

113 lines

Re: Decapping ICs

Bogdan Gaby

Wed, 16 Jul 1997 09:31:55 -0700

93 lines

Decapping ICs

Joseph Fjelstad

Tue, 15 Jul 1997 09:47:57 -0700

57 lines

New Thread

DECAPPING WITHOUT DAMAGING THE SILVER LAYER

DECAPPING WITHOUT DAMAGING THE SILVER LAYER

Nik Tajuddin-RKU939

Thu, 24 Jul 1997 9:45:00 -0500

70 lines

Re: DECAPPING WITHOUT DAMAGING THE SILVER LAYER

Sheila Smith

Wed, 23 Jul 1997 15:28:55 -0400 (EDT)

79 lines

DECAPPING WITHOUT DAMAGING THE SILVER LAYER

Mohd Misri-RSB019

Wed, 23 Jul 1997 15:58:00 -0500

56 lines

New Thread

DES

Re: DES

<>

Fri, 25 Jul 1997 09:59:49 -0400 (EDT)

39 lines

DES

Kasprzak, Bill (esd) US

Thu, 24 Jul 97 13:52:00 PDT

62 lines

RE: DES

Jim Marsico 516-595-5879

Wed, 23 Jul 1997 14:37:00 -0400 (EDT)

64 lines

DES

Jason R Witt

Wed, 23 Jul 97 8:19:32 EDT

43 lines

DES

Jason R Witt

Wed, 23 Jul 97 7:11:05 EDT

43 lines

New Thread

DES : Question About Power Density Capabilities of PCB's

Re: DES : Question About Power Density Capabilities of PCB's

Frank Hinojos

Wed, 16 Jul 1997 12:53:41 -0700

134 lines

DES : Question About Power Density Capabilities of PCB's

Jeff Fries

Wed, 16 Jul 1997 09:57:24 -0500

89 lines

New Thread

Des: Design check list

Re: Des: Design check list

Dan Ratcliff 813-530-8762

Mon, 07 Jul 1997 09:57:05 -0400

97 lines

Re: Des: Design check list

JoAnn Amerson

Wed, 2 Jul 1997 12:53:27 +0000

57 lines

Des: Design check list

Steve Collins

Wed, 2 Jul 1997 07:41:41 -0600

47 lines

New Thread

Des: Design check list -Reply

Re: Des: Design check list -Reply

Jeff McGlaughlin

Wed, 02 Jul 1997 13:53:08 -0400

65 lines

New Thread

DES: High Cycle Fatigue Properties of Solder

Re: DES: High Cycle Fatigue Properties of Solder

D.C.Whalley

Thu, 10 Jul 1997 11:03:48 -0400

80 lines

New Thread

DES: Pads

Re: DES: Pads

Frank Hinojos

Mon, 28 Jul 1997 16:57:55 -0700

79 lines

DES: Pads

Steve Collins

Thu, 24 Jul 1997 13:35:48 -0600

53 lines

New Thread

DES: Panelisation

DES: Panelisation

Poh Kong Hui

Mon, 21 Jul 1997 23:28:02 +0800 (SST)

46 lines

New Thread

DES: panelization

DES: panelization

Larry Morse

Sat, 22 Feb 1997 09:52:52 -0800

66 lines

New Thread

DES: RF layout reqmts

DES: RF layout reqmts

Donna Perry

Tue, 22 Jul 1997 02:14:18 -0700

48 lines

New Thread

DES: tented vias

RE: DES: tented vias

Robert Welch

Thu, 17 Jul 1997 16:07:28 +0000

50 lines

RE: DES: tented vias

Jim Herard

Thu, 17 Jul 1997 11:57:30 -0400

86 lines

Re: DES: tented vias

Jeff Seeger

Thu, 17 Jul 1997 11:42:18 -0400

63 lines

RE: DES: tented vias

<>

Wed, 16 Jul 97 21:41:14 EST

54 lines

Re: Des: Tented Vias

<>

Wed, 16 Jul 1997 09:00:11 -0400 (EDT)

43 lines

Des: Tented Vias

Steve Collins

Wed, 16 Jul 1997 06:46:52 -0600

53 lines

New Thread

DES: tented vias(2)

RE: DES: tented vias(2)

<>

Thu, 17 Jul 97 14:31:33 EST

46 lines

New Thread

DES: Thermal Conductivity

Re: DES: Thermal Conductivity

Sheila Smith

Thu, 24 Jul 1997 08:22:54 -0400 (EDT)

94 lines

DES: Thermal Conductivity

<>

Wed, 23 Jul 1997 11:16:57 -0700

59 lines

New Thread

DES: Thermal Vias

Re: DES: Thermal Vias

Paul Gould

Wed, 23 Jul 1997 08:14:11 +0100

64 lines

DES: Thermal Vias

Urry, John @ SLG

Mon, 21 Jul 97 16:26:00 mdt

46 lines

Re: DES: Thermal Vias

Mitch Morey

Mon, 21 Jul 1997 14:51:58 -0700

76 lines

DES: Thermal Vias

Urry, John @ SLG

Mon, 21 Jul 97 15:09:00 mdt

46 lines

New Thread

DES: Via Inductance

Re: DES: Via Inductance

Andy Burkhardt

Fri, 1 Aug 1997 16:04:30 +0100

83 lines

DES: Via Inductance

Jack Olson

Thu, 31 Jul 1997 09:51:56 -0700

49 lines

New Thread

DES:Conductor design rule

Re: DES:Conductor design rule

Jeff Seeger

Thu, 17 Jul 1997 16:29:23 -0400

66 lines

DES:Conductor design rule

<>

Thu, 17 Jul 97 15:17:40 -0400

57 lines

DES:Conductor design rule

<>

Wed, 16 Jul 97 16:39:57 -0400

100 lines

New Thread

DES:FR-4 Thermal Conductivity

Re: DES:FR-4 Thermal Conductivity

Andrew J. Scholand

Wed, 23 Jul 1997 00:55:02 -0400

80 lines

DES:FR-4 Thermal Conductivity

Michael Alderete

Tue, 22 Jul 1997 18:19:22 -0700

135 lines

Re: DES:FR-4 Thermal Conductivity

Frank Hinojos

Tue, 22 Jul 1997 14:48:41 -0700

76 lines

DES:FR-4 Thermal Conductivity

<>

Tue, 22 Jul 1997 14:05:06 -0700

49 lines

New Thread

DES:thru via current capability

DES:thru via current capability

Donna Perry

Wed, 23 Jul 1997 21:54:57 -0700

43 lines

New Thread

Design check list

RE: Design check list

Eubanks, Phil (Phillip K)

Tue, 8 Jul 1997 11:47:29 -0500

82 lines

New Thread

Dielectric constant of FR4 - tempera

RE: Dielectric constant of FR4 - tempera

<>

Wed, 16 Jul 1997 8:27:23 +0000

76 lines

New Thread

Dielectric constant of FR4 - temperature

RE: Dielectric constant of FR4 - temperature

<>

Wed, 16 Jul 97 8:28:56 PDT

72 lines

New Thread

Dielectric constant of FR4 - temperature dependency

Dielectric constant of FR4 - temperature dependency

Walther Bach

Tue, 15 Jul 1997 14:19:08 -0400

47 lines

New Thread

DIP packaging

Re: DIP packaging

Mark Shandley

Thu, 17 Jul 1997 15:29:19 -0500

92 lines

DIP packaging

Benjamin A Guthrie

Thu, 17 Jul 1997 08:58:48 -0500

70 lines

New Thread

Drill Chart

Drill Chart

Lyle Dove (GCA Tech Support)

Tue, 29 Jul 1997 15:44:56

50 lines

New Thread

Drill Chart....

Drill Chart....

Lyle Dove (GCA Tech Support)

Tue, 29 Jul 1997 19:32:16

187 lines

New Thread

Drilling Backup Material

Re: Drilling Backup Material

drilbert

Fri, 25 Jul 1997 23:29:03 -0700

50 lines

New Thread

Dry Film Rework

Dry Film Rework

scott birnbaum

Fri, 18 Jul 97 16:41:47 PDT

48 lines

New Thread

Dummy Die

Re: Dummy Die

Denis Meloche

Thu, 17 Jul 1997 09:40:43 -0400

75 lines

Re: Dummy Die

<>

Thu, 17 Jul 1997 16:30:45 +0800

45 lines

New Thread

Electrically operated "Hot air oven"

Electrically operated "Hot air oven"

H.N.Muralidhara

Sat, 12 Jul 1997 15:03:11 +0530 (IST)

96 lines

New Thread

Electrically operated "Hot air oven" (fwd)

Electrically operated "Hot air oven" (fwd)

H.N.Muralidhara

Sat, 12 Jul 1997 15:33:33 +0530 (IST)

112 lines

New Thread

Electroless Nickel and Immersion Gold

Re: Electroless Nickel and Immersion Gold

Sam Pirayesh

Fri, 11 Jul 1997 12:51:20 -0700

123 lines

Re: Electroless Nickel and Immersion Gold

<>

Fri, 11 Jul 1997 09:16:35 -0400 (EDT)

49 lines

Re: Electroless Nickel and Immersion Gold

PERARO_DJ

Fri, 11 Jul 1997 08:23:28 -0400

132 lines

Electroless Nickel and Immersion Gold

Jim Herard

Thu, 10 Jul 1997 18:28:14 -0400

104 lines

New Thread

Electroless Nickle and Immersion Gold

RE: Electroless Nickle and Immersion Gold

Max Bernhardt

Thu, 10 Jul 1997 09:15:00 -0500

85 lines

Electroless Nickle and Immersion Gold

Sam Pirayesh

Thu, 10 Jul 1997 07:41:14 -0700

47 lines

New Thread

Electrostatic dissipative

Re: Electrostatic dissipative

<>

Thu, 31 Jul 1997 08:05:35 -0400 (EDT)

54 lines

New Thread

Electrostatic dissipative f

Electrostatic dissipative f

JOHN OSULLIVAN

31 Jul 1997 07:51:50 -0400

44 lines

New Thread

Embedded Components.

Embedded Components.

Tom Johnson

Tue, 22 Jul 1997 08:32:11 -0700

49 lines

New Thread

ESD ground vs Electrical ground

Re: ESD ground vs Electrical ground

Steve Mikell

Sat, 26 Jul 1997 11:04:29 -0500 (CDT)

76 lines

ESD ground vs Electrical ground

Lim Teong Kheng

Sat, 26 Jul 1997 12:55:39 +0800

59 lines

Re: ESD ground vs Electrical ground

Doug McKean

Fri, 25 Jul 1997 17:53:34 -0400

88 lines

Re: ESD ground vs Electrical ground

<>

Fri, 25 Jul 1997 10:50:06 -0600

78 lines

Re: ESD ground vs Electrical ground

Stuart Chessen

Fri, 25 Jul 1997 08:09:42 -0700

69 lines

Re: ESD ground vs Electrical ground

Doug McKean

Fri, 25 Jul 1997 10:24:58 -0400

89 lines

Re: ESD ground vs Electrical ground

<>

Fri, 25 Jul 1997 09:16:46 -0500

67 lines

ESD ground vs Electrical ground

Lim Teong Kheng

Fri, 25 Jul 1997 21:27:50 +0800

40 lines

ESD ground vs Electrical ground

Lim Teong Kheng

Fri, 25 Jul 1997 21:17:53 +0800

40 lines

New Thread

Etcher Pressure Setting

Re[2]: Etcher Pressure Setting

tgyee

Wed, 16 Jul 97 11:33:56 PST

71 lines

Re: Etcher Pressure Setting

<>

Tue, 15 Jul 1997 09:43:40 -0500

153 lines

Etcher Pressure Setting

tgyee

Tue, 15 Jul 97 09:54:56 PST

39 lines

New Thread

FAB

FAB

Dejan

Mon, 21 Jul 1997 09:07:57 -0700

44 lines

New Thread

FAB : tented vias

RE: FAB : tented vias

Kenny, James

Wed, 16 Jul 1997 9:44 -0800

70 lines

FAB : tented vias

Engineering / Design Dept.

Wed, 16 Jul 1997 09:33:36 -0700

41 lines

New Thread

FAB-

FAB-

Bill Chou

25 Jul 1997 13:20:27 -0800

51 lines

New Thread

Fab/Assy: Thermal Vias

Re: Fab/Assy: Thermal Vias

<>

Fri, 1 Aug 97 10:33:23 +0200

105 lines

Re: Fab/Assy: Thermal Vias

Aric J Parr

Thu, 31 Jul 1997 13:00:53 -0500

70 lines

Fab/Assy: Thermal Vias

<>

Thu, 31 Jul 97 8:24:09 PDT

48 lines

New Thread

Fab/Assy: Thermal Vias: REPLY

Fab/Assy: Thermal Vias: REPLY

Jim Herard

Thu, 31 Jul 1997 18:16:36 -0400

97 lines

New Thread

FAB: charts of standard drill sizes

FAB: charts of standard drill sizes

Jeff Seeger

Tue, 15 Jul 1997 19:30:19 -0400

50 lines

New Thread

FAB: Coefficients of Thermal Expansion

FAB: Coefficients of Thermal Expansion

Ploughman, Mark

Thu, 31 Jul 97 20:08:25

46 lines

New Thread

FAB: Controller for Oxide

FAB: Controller for Oxide

Frederick Bonaventure

Wed, 23 Jul 1997 18:39:37 -0400

56 lines

New Thread

FAB: Copper Peelers

Re: FAB: Copper Peelers

<>

Fri, 18 Jul 1997 18:38:30 -0400 (EDT)

59 lines

Re: FAB: Copper Peelers

<>

Fri, 18 Jul 1997 10:27:48 -0400 (EDT)

44 lines

Re: FAB: Copper Peelers

<>

Thu, 17 Jul 1997 18:57:20 -0400 (EDT)

45 lines

FAB: Copper Peelers

<>

Thu, 17 Jul 1997 09:01:24 -0400 (EDT)

42 lines

New Thread

FAB: Copper plating Tensile and Elongation

Re[2]: FAB: Copper plating Tensile and Elongation

PHONG NGUYEN

Tue, 29 Jul 97 18:16:44 PST

97 lines

Re: FAB: Copper plating Tensile and Elongation

Ted Stern

Tue, 29 Jul 1997 13:54:45 -0700

94 lines

FAB: Copper plating Tensile and Elongation

Edwards, Ted A (AZ75)

29 Jul 1997 09:13:46 -0500

65 lines

New Thread

FAB: Excellon LPG2001 Photoplotter

FAB: Excellon LPG2001 Photoplotter

John Parsons

Fri, 4 Jul 1997 11:33:18 +0000

50 lines

New Thread

FAB: FR4 exotherm & rheology

FAB: FR4 exotherm & rheology

J.Felts

Thu, 17 Jul 1997 11:02:43 -0700

46 lines

FAB: FR4 exotherm & rheology

J.Felts

Wed, 16 Jul 1997 00:05:12 -0700

45 lines

New Thread

FAB: Getek Material

Re: FAB: Getek Material

Frank Hinojos

Wed, 23 Jul 1997 18:37:41 -0700

71 lines

FAB: Getek Material

<>

Wed, 23 Jul 97 17:19:01 -0700

44 lines

New Thread

FAB: Gold plating

FAB: Gold plating

Joe Lee

Sat, 5 Jul 1997 20:32:17 -0700

44 lines

New Thread

FAB: Immersion Au as solderable surface/SPECS

FAB: Immersion Au as solderable surface/SPECS

Jim Herard

Mon, 28 Jul 1997 19:02:38 -0400

64 lines

New Thread

FAB: Inner-Layer Scaling Factors

Re: FAB: Inner-Layer Scaling Factors

Tomer_2

Sun, 20 Jul 1997 16:48:21 +0000

100 lines

FAB: Inner-Layer Scaling Factors

<>

Thu, 17 Jul 1997 13:39:28 -0400 (EDT)

50 lines

New Thread

Fab: Innerlayer cleanliness/Fine lines&Spaces

Re: Fab: Innerlayer cleanliness/Fine lines&Spaces

<>

Mon, 21 Jul 1997 16:14:09 -0400 (EDT)

36 lines

Re: Fab: Innerlayer cleanliness/Fine lines&Spaces

<>

Mon, 21 Jul 1997 14:11:58 -0400 (EDT)

47 lines

Re: Fab: Innerlayer cleanliness/Fine lines&Spaces

<>

Mon, 21 Jul 97 11:21:18 MST

78 lines

Fab: Innerlayer cleanliness/Fine lines&Spaces

Nachbor, Suzanne (MN51)

Mon, 21 Jul 97 12:09:00 PDT

44 lines

New Thread

Fab: non-symmetrical stackups

Re: Fab: non-symmetrical stackups

<>

Fri, 11 Jul 1997 07:46:43 -0400 (EDT)

47 lines

Re:Fab: non-symmetrical stackups

Jeffrey McGlaughlin (Jeff McGlaughlin)

Thu, 10 Jul 1997 07:56:46 -0400

65 lines

Fab: non-symmetrical stackups

Jeff Seeger

Wed, 09 Jul 1997 18:15:20 -0400

65 lines

New Thread

FAB: Padless vs. Padded

RE: FAB: Padless vs. Padded

<>

Wed, 16 Jul 97 21:56:49 EST

45 lines

Re: FAB: Padless vs. Padded

<>

Tue, 15 Jul 1997 21:52:34 -0400 (EDT)

57 lines

Re: FAB: Padless vs. Padded

Lyle Dove (GCA Tech Support)

Tue, 15 Jul 1997 15:37:15

101 lines

FAB: Padless vs. Padded

<>

Tue, 15 Jul 1997 15:32:42 -0500

56 lines

New Thread

FAB: Re: Black oxide and wedge voiding

FAB: Re: Black oxide and wedge voiding

Orna and Yehuda

Fri, 18 Jul 1997 20:02:09 +0300

53 lines

New Thread

FAB: Re: Pink ring and hard failures

Re: FAB: Re: Pink ring and hard failures

<>

Fri, 25 Jul 1997 10:42:17 -0400 (EDT)

37 lines

FAB: Re: Pink ring and hard failures

Mike Buetow

Fri, 18 Jul 1997 11:45:35 -0500 (CDT)

99 lines

New Thread

FAB: Reliability of blind and buried vias.

FAB: Reliability of blind and buried vias.

<>

Wed, 16 Jul 1997 10:38:52 +0100

61 lines

New Thread

FAB: reverse pulse plating

FAB: reverse pulse plating

<>

Thu, 3 Jul 1997 10:13:18 -0400 (EDT)

46 lines

New Thread

Fab: Rivets in the lamination press

Re: Fab: Rivets in the lamination press

<>

Fri, 25 Jul 97 17:23:14 MST

114 lines

Fab: Rivets in the lamination press

Jonathan Whitcomb (757-1326)

Fri, 25 Jul 97 12:00:18 EDT

61 lines

New Thread

FAB: Robber Bars and More

Re: FAB: Robber Bars and More

<>

Thu, 31 Jul 1997 09:24:21 -0400 (EDT)

36 lines

FAB: Robber Bars and More

Taylor Michelle Bodziak

Wed, 30 Jul 1997 19:32:00 -0400

50 lines

New Thread

FAB: Silkscreen

RE: FAB: Silkscreen

<>

Tue, 08 Jul 97 22:25:31 EST

52 lines

New Thread

FAB: Software for Lab Analysis Management

Re: FAB: Software for Lab Analysis Management

John Grosso

Wed, 2 Jul 1997 10:09:17 -0400

56 lines

FAB: Software for Lab Analysis Management

Luis Rivera

Wed, 2 Jul 1997 07:45:58 -0600 CDT

59 lines

New Thread

Fab: soldermask capability

Fab: soldermask capability

GeoFranck

Tue, 29 Jul 1997 08:54:07 -0400

53 lines

New Thread

Fab: soldermask capability REPLY

Re: Fab: soldermask capability REPLY

<>

Wed, 30 Jul 1997 17:47:54 -0400 (EDT)

34 lines

Fab: soldermask capability REPLY

Jim Herard

Wed, 30 Jul 1997 07:53:36 -0400

94 lines

New Thread

FAB: Soldermask Residue - SERA

Re: FAB: Soldermask Residue - SERA

<>

Mon, 28 Jul 1997 17:48:53 -0400 (EDT)

43 lines

Re: FAB: Soldermask Residue - SERA

<>

Thu, 24 Jul 97 14:08:07 cst

103 lines

Re: FAB: Soldermask Residue - SERA

Robert Welch

Thu, 24 Jul 1997 13:48:30 +0000

56 lines

re: FAB: Soldermask Residue - SERA

LES CONNALLY

Thu, 24 Jul 1997 10:23:46 -0700

99 lines

FAB: Soldermask Residue - SERA

<>

Wed, 23 Jul 1997 15:53:22 -0500

66 lines

New Thread

FAB: Taconic Tac-Lam

Re: FAB: Taconic Tac-Lam

Orna and Yehuda

Fri, 1 Aug 1997 12:51:24 +0300

46 lines

New Thread

FAB: Taconic-Tac-Lam

Re: FAB: Taconic-Tac-Lam

<>

Thu, 31 Jul 97 14:56:10 PST

75 lines

FAB: Taconic-Tac-Lam

Ploughman, Mark

Thu, 31 Jul 97 12:02:23

47 lines

New Thread

FAB: Ultrasonic Vibrators

FAB: Ultrasonic Vibrators

<>

Wed, 30 Jul 1997 23:35:03 GMT

45 lines

New Thread

FAB: Unsupported vs. Supported

FAB: Unsupported vs. Supported

<>

Tue, 15 Jul 1997 14:23:40 -0500

51 lines

New Thread

Fab:RE oxide controller

Fab:RE oxide controller

DAVID MANDER

Thu, 24 Jul 1997 14:49:46, -0500

43 lines

New Thread

Fabrication Specs

Re: Fabrication Specs

Mike Buetow

Thu, 31 Jul 1997 10:04:05 -0500 (CDT)

67 lines

Fabrication Specs

<>

Thu, 31 Jul 97 11:03:01 EDT

47 lines

New Thread

FLEX

FLEX

TIMOTHY C CABLES

Thu, 24 Jul 1997 15:52:31 -0400

45 lines

Re: Flex

Daniel, John

Thu, 24 Jul 1997 13:44:23 -0400

38 lines

Re: Flex

Joel Yocom

Thu, 24 Jul 1997 08:04:41 +0000

41 lines

Re: Flex

<>

Wed, 23 Jul 97 17:26:40 -0700

87 lines

Re: Flex

Peter McGrath

Thu, 24 Jul 1997 11:22:40 -0700

39 lines

Re: Flex

ROY PRATT

Wed, 23 Jul 1997 11:59:39 PST

73 lines

Re: Flex

<>

Wed, 23 Jul 1997 08:29:25 -0700

38 lines

Flex

TIMOTHY C CABLES

Wed, 23 Jul 1997 10:18:23 -0400

53 lines

New Thread

Flex Circuit Info

Re: Flex Circuit Info

KoizumiT

Tue, 22 Jul 97 21:33:13 JST

69 lines

Flex Circuit Info

Phil Culpovich

Mon, 21 Jul 1997 10:16:46 -0700

51 lines

New Thread

Flux Classification

Re: Flux Classification

Mike Buetow

Wed, 30 Jul 1997 08:19:24 -0500 (CDT)

74 lines

Flux Classification

Denis Meloche

Wed, 30 Jul 1997 09:23:36 -0400

45 lines

New Thread

Flux Survey?

Re: Flux Survey?

Peter Swanson

Wed, 23 Jul 1997 20:40:39 GMT

56 lines

Flux Survey?

Jeff Orlando

Wed, 23 Jul 1997 12:22:57 +0000

44 lines

New Thread

Forums

Re: Forums

Neil Diamond

Fri, 01 Aug 1997 10:52:42 -0500

72 lines

Forums

JOHN OSULLIVAN

1 Aug 1997 13:06:38 -0400

44 lines

New Thread

Frosty board edges.

Frosty board edges.

David Taylor

Tue, 1 Jul 1997 15:19:30 +1000

53 lines

New Thread

FW: "Luis Rivera" <[log in to unmask]>: FAB: Software for Lab Analysis Management

Re: FW: "Luis Rivera" <[log in to unmask]>: FAB: Software for Lab Analysis Management

Joel Fillion

Sun, 20 Jul 1997 16:20:18 -0700

262 lines

FW: "Luis Rivera" <[log in to unmask]>: FAB: Software for Lab Analysis Management

<>

Wed, 02 Jul 1997 09:38:04 GMT

118 lines

New Thread

Fw: :Your information

Fw: :Your information

=?BIG5?B?p/UgILJRICCrug==?=

Wed, 30 Jul 1997 14:37:53 +0800

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Fw: :Your information

=?BIG5?B?p/UgILJRICCrug==?=

Wed, 30 Jul 1997 13:44:47 +0800

41 lines

New Thread

FW: BGA and Pin-in-Paste

FW: BGA and Pin-in-Paste

Dhawan, Ashok

Fri, 1 Aug 1997 16:01:01 -0000

92 lines

New Thread

FW: BGA sphere attach.

FW: BGA sphere attach.

Alderete, Michael

Wed, 09 Jul 1997 12:27:13 -0700

149 lines

New Thread

Fw: Chemicals for AOI

Fw: Chemicals for AOI

Kuwako, Fujio(MMS)

Fri, 11 Jul 1997 15:36:08 +0900

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New Thread

FW: Electrostatic dissipative

FW: Electrostatic dissipative

Blanchet,Richard

Thu, 31 Jul 1997 08:47:00 -0400 (EDT)

85 lines

New Thread

FW: GTEL records

FW: GTEL records

Andrew J. Scholand

Thu, 24 Jul 1997 23:00:57 -0400

92 lines

New Thread

FW: Solder Dispensing Valve and Controller

FW: Solder Dispensing Valve and Controller

Dhawan, Ashok CA-WINPO2

Fri, 18 Jul 97 01:07:00 GMT

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New Thread

FW: [log in to unmask]: RE: FAB: Silkscreen

FW: [log in to unmask]: RE: FAB: Silkscreen

<>

Wed, 09 Jul 1997 07:53:04 GMT

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New Thread

Fwd(1): Re: Mechanism of Wedge Void Formation

Re: Fwd(1): Re: Mechanism of Wedge Void Formation

<>

Tue, 15 Jul 1997 09:21:03 -0400 (EDT)

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Fwd(1): Re: Mechanism of Wedge Void Formation

Josep Sajut

Tue, 15 Jul 1997 07:31:26 -0400

97 lines

New Thread

fwd: Bare PCB packaging

fwd: Bare PCB packaging

<>

14 Jul 97 09:56:39 EDT

51 lines

New Thread

Fwd: FAB: Re: Pink ring and hard failures

Re: Fwd: FAB: Re: Pink ring and hard failures

Paul Gould

Wed, 23 Jul 1997 23:22:37 +0100

66 lines

Fwd: FAB: Re: Pink ring and hard failures

<>

Tue, 22 Jul 1997 10:20:50 -0400 (EDT)

50 lines

New Thread

Fwd: Fab:RE oxide controller

Fwd: Fab:RE oxide controller

Frederick Bonaventure

Thu, 24 Jul 1997 17:58:56 -0400

101 lines

New Thread

fwd: Re: RF Design

fwd: Re: RF Design

Mike Wolverton

Wed, 2 Jul 1997 09:35:35 -0700

92 lines

New Thread

FWD: Re: Tensile strength/elongation

FWD: Re: Tensile strength/elongation

Greg Bartlett

01 Aug 97 09:32:03 +0000

153 lines

New Thread

FWD:Re: polyimide flexible jumper

FWD:Re: polyimide flexible jumper

Lyle Dove

Wed, 23 Jul 1997 11:32:59

62 lines

New Thread

GEN-cost analysis and model

GEN-cost analysis and model

Bill Chou

25 Jul 1997 10:53:36 -0800

55 lines

New Thread

GEN: Cab Maestro

GEN: Cab Maestro

<>

Fri, 18 Jul 1997 10:56:00 -0500

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New Thread

GEN: Electrical Ground or Earth Ground?

GEN: Electrical Ground or Earth Ground?

Kasprzak, Bill (esd) US

Wed, 30 Jul 97 07:42:00 PDT

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GEN: Electrical Ground or Earth Ground?

<>

Tue, 29 Jul 1997 14:03:06 -0500

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New Thread

GEN: ESD Flooring Pros/Cons

RE:GEN: ESD Flooring Pros/Cons

Raymond Klein

Fri, 25 Jul 1997 10:59:28 -0700

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Re[2]: GEN: ESD Flooring Pros/Cons

CAREY ENGLISH

Fri, 25 Jul 1997 12:40:58 -0500

137 lines

Re: GEN: ESD Flooring Pros/Cons

Vickie Chapman

Fri, 25 Jul 1997 10:27:28 -0700

122 lines

Re:GEN: ESD Flooring Pros/Cons

<>

Fri, 25 Jul 1997 11:31:41 -0600

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GEN: ESD Flooring Pros/Cons

<>

Fri, 25 Jul 1997 10:48:38 -0500

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New Thread

GEN: IPC spec for HDI

GEN: IPC spec for HDI

YAP CHOW LAN

Fri, 18 Jul 1997 18:13:34 +0800

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New Thread

GEN: SMOBC vs Reflower Tin/Lead

Re: GEN: SMOBC vs Reflower Tin/Lead

<>

Sun, 6 Jul 1997 04:55:37 -0400 (EDT)

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Re: GEN: SMOBC vs Reflower Tin/Lead

<>

Sun, 6 Jul 1997 03:15:38 -0400 (EDT)

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Re: GEN: SMOBC vs Reflower Tin/Lead

<>

Fri, 4 Jul 1997 10:04:57 -0400 (EDT)

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GEN: SMOBC vs Reflower Tin/Lead

Don Vischulis

Wed, 02 Jul 1997 17:45:20 -0500

54 lines

New Thread

GEN: Technical Paper

GEN: Technical Paper

<>

Tue, 1 Jul 1997 10:23:51 -0500

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New Thread

General: 3rd Ann. Ala. Adv. Tech. Seminar

General: 3rd Ann. Ala. Adv. Tech. Seminar

Alan Kreplick

Fri, 25 Jul 1997 07:53:22 -0400

42 lines

New Thread

Glue

Re: Glue

Larry Morse

Tue, 11 Feb 1997 10:29:55 -0800

77 lines

Glue

Paul Stolar

Thu, 10 Jul 97 17:38:06 -0600

52 lines

New Thread

Gold - copper diffusion

Gold - copper diffusion

Allan H. Reed

Mon, 21 Jul 1997 14:07:44 -0400 (EDT)

41 lines

New Thread

Gold / Silver Incompatibility for Adhesives

re: Gold / Silver Incompatibility for Adhesives

<>

Fri, 1 Aug 97 8:19:40 PDT

69 lines

Re: Gold / Silver Incompatibility for Adhesives

Denis Meloche

Fri, 01 Aug 1997 10:32:34 -0400

71 lines

Gold / Silver Incompatibility for Adhesives

Murphy Steve (UO/ESS)

Thu, 31 Jul 1997 15:52:18 -0400

41 lines

Gold / Silver Incompatibility for Adhesives

Murphy Steve (UO/ESS)

Thu, 31 Jul 1997 15:52:18 -0400

41 lines

New Thread

Gold peel after solder level

Re: Gold peel after solder level

Paul A Galatis

Sun, 27 Jul 1997 11:26:47 -0500

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Re: Gold peel after solder level

Paul Gould

Sat, 26 Jul 1997 08:58:55 +0100

70 lines

RE: Gold peel after solder level

Andy Heidelberg

Fri, 25 Jul 1997 17:11:19 -0600

134 lines

Re: Gold peel after solder level

Michael Barmuta

Fri, 25 Jul 1997 14:40:10 -0700

91 lines

Gold peel after solder level

<>

Fri, 25 Jul 97 11:50:24 EST

40 lines

New Thread

HASL Finish

HASL Finish

Maurice Dore

Thu, 10 Jul 1997 13:30:21 GMT

57 lines

New Thread

Help..Need Some Resources

Help..Need Some Resources

<>

Mon, 28 Jul 1997 16:02:59 -0500

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New Thread

High Cycle Fatigue Properties of Solder

Re: High Cycle Fatigue Properties of Solder

<>

Sat, 12 Jul 1997 08:45:43 -0400 (EDT)

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New Thread

Hole Fill

Hole Fill

<>

Tue, 29 Jul 1997 09:36:03 -0400 (EDT)

37 lines

New Thread

HPGL2 conversion software

Re: HPGL2 conversion software

Steve Collins

Thu, 31 Jul 1997 12:27:21 -0600

79 lines

Re: HPGL2 conversion software

Lolmaugh, Scott (AZ15)

31 Jul 1997 14:42:28 -0500

94 lines

Re: HPGL2 conversion software

Steve Collins

Thu, 31 Jul 1997 12:27:21 -0600

79 lines

Re: HPGL2 conversion software

Steve Collins

Thu, 31 Jul 1997 12:27:21 -0600

79 lines

Re: HPGL2 conversion software

<>

Thu, 31 Jul 97 11:19:57 -0700

70 lines

Re: HPGL2 conversion software

Neil Diamond

Thu, 31 Jul 1997 12:55:24 -0500

70 lines

HPGL2 conversion software

Erik Bodell

Thu, 31 Jul 1997 09:52:52 PST

42 lines

New Thread

hull cell

Re: hull cell

Lenny Kurup

Mon, 7 Jul 1997 11:41:06 -0400 (EDT)

85 lines

Re: hull cell

<>

Mon, 7 Jul 1997 07:41:14 -0400 (EDT)

51 lines

hull cell

Suixin Zhang

Fri, 4 Jul 1997 11:11:53 +0100

43 lines

New Thread

Idents and HASL

Re: Idents and HASL

annie laberge

Tue, 01 Jul 1997 08:36:45 -0400

79 lines

New Thread

IEC Specs

Re: IEC Specs

Lynch, Lyn

Wed, 16 Jul 97 16:09:59

80 lines

IEC Specs

Robert Welch

Wed, 16 Jul 1997 14:34:04 +0000

46 lines

New Thread

IN-CLOSING: Padless vs. Padded

Re: IN-CLOSING: Padless vs. Padded

Don Vischulis

Fri, 18 Jul 1997 18:32:02 -0500

208 lines

IN-CLOSING: Padless vs. Padded

<>

Thu, 17 Jul 1997 18:23:23 -0500

230 lines

New Thread

IONIC TESTING

IONIC TESTING

<>

Fri, 11 Jul 97 12:47:22 EST

176 lines

Re[2]: IONIC TESTING

<>

Fri, 11 Jul 97 07:59:25 EST

170 lines

Re: IONIC TESTING

Sheila Smith

Thu, 10 Jul 1997 08:29:45 -0400 (EDT)

92 lines

Re: IONIC TESTING

<>

Wed, 9 Jul 1997 22:54:09 -0400 (EDT)

67 lines

Re: IONIC TESTING

<>

Tue, 8 Jul 1997 09:45:56 -0400 (EDT)

73 lines

Re: IONIC TESTING

<>

Sun, 6 Jul 1997 02:43:59 -0400 (EDT)

52 lines

New Thread

IPC National Conference: Organic High Density Interconnect

IPC National Conference: Organic High Density Interconnect

John Riley

Fri, 18 Jul 1997 10:04:39 -0500

308 lines

New Thread

IPC PWB SURFACE FINISHES CONFERENCE

Re: IPC PWB SURFACE FINISHES CONFERENCE

<>

Tue, 29 Jul 97 11:39:25 cst

78 lines

RE: IPC PWB SURFACE FINISHES CONFERENCE

Lepsche, Thomas G (NM75)

Tue, 29 Jul 1997 09:57:29 -0600

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IPC PWB SURFACE FINISHES CONFERENCE

Michael Forrester

Tue, 29 Jul 1997 11:08:39 -0400

48 lines

New Thread

IPC spec for Flip Chip

Re: IPC spec for Flip Chip

Mike Buetow

Wed, 2 Jul 1997 12:06:24 -0500 (CDT)

79 lines

IPC spec for Flip Chip

david yeh

Sun, 2 Jul 1995 22:37:18 +0800

49 lines

New Thread

IPC-B-24 Test Boards

Re: IPC-B-24 Test Boards

Aric J Parr

Wed, 9 Jul 1997 15:32:47 -0500

64 lines

IPC-B-24 Test Boards

<>

Wed, 09 Jul 97 15:09:10 -0500

48 lines

New Thread

IPC-D-275 Requirements

Re: IPC-D-275 Requirements

Jack Olson

Fri, 18 Jul 1997 10:24:56 -0700

62 lines

IPC-D-275 Requirements

VOLPE, RAY

Fri, 18 Jul 1997 10:26:10 -0400

49 lines

New Thread

IPCchat session announcement

Re: IPCchat session announcement

Keith Larson

Thu, 31 Jul 1997 09:05:49 -0500

61 lines

IPCchat session announcement

<>

Wed, 30 Jul 1997 22:41:32 -0700

60 lines

IPCchat session announcement

<>

Sun, 27 Jul 1997 19:02:36 -0700

61 lines

New Thread

ISO certification

RE: ISO certification

Challoner, Scott

Thu, 24 Jul 97 10:51:00 CDT

62 lines

Re: ISO certification

Doug McKean

Thu, 24 Jul 1997 11:38:54 -0400

47 lines

ISO certification

<>

Thu, 24 Jul 1997 10:15:36 +0400 (EDT)

39 lines

New Thread

ISO-Net

ISO-Net

Baker,Kelly

Wed, 16 Jul 1997 08:31:05 -0400

37 lines

New Thread

John Treiber Company

John Treiber Company

Kasprzak, Bill (esd) US

Tue, 15 Jul 97 14:18:00 PDT

48 lines

New Thread

John Treiber Company.

RE: John Treiber Company.

<>

Thu, 17 Jul 1997 6:26:01 -0700

93 lines

Re: John Treiber Company.

Edward J Popielarski

Tue, 15 Jul 1997 09:53:09 -0500 (CDT)

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John Treiber Company.

<>

15 Jul 97 08:09:17 EDT

37 lines

New Thread

July 1

July 1

<>

Tue, 1 Jul 1997 08:49:11 -0400 (EDT)

33 lines

New Thread

Koax plating

Re: Koax plating

<>

Thu, 03 Jul 97 16:29:00 cst

71 lines

New Thread

Lackey Sanding Service

Re: Lackey Sanding Service

<>

Sat, 5 Jul 1997 21:46:22 -0400 (EDT)

33 lines

Lackey Sanding Service

CLIFF MADDOX

Wed, 02 Jul 97 11:18:13 PST

41 lines

New Thread

landless via

landless via

OBRIEN GERARD

Mon, 14 Jul 97 9:09:49 -0400

45 lines

New Thread

line width ,space

Re: line width ,space

<>

Sat, 26 Jul 1997 12:12:04 -0400 (EDT)

51 lines

line width ,space

Radhakrishna N

Wed, 23 Jul 1997 19:34:57 -0700

43 lines

New Thread

Market Research Data

Market Research Data

OMNI High Tech Industries Ltd. (OHTIL)

Tue, 22 Jul 1997 21:49:02 +0600

44 lines

New Thread

MATERIALS: Prepreg info needed

MATERIALS: Prepreg info needed

Duane B. Mahnke

Wed, 30 Jul 1997 20:53:00 -0700

51 lines

New Thread

Mechanism of Wedge Void Formation

Re[5]: Mechanism of Wedge Void Formation

tgyee

Mon, 21 Jul 97 10:19:18 PST

52 lines

Re[4]: Mechanism of Wedge Void Formation

<>

Fri, 18 Jul 97 13:46:02 cst

199 lines

Re[4]: Mechanism of Wedge Void Formation

<>

Thu, 17 Jul 97 22:13:08 cst

90 lines

Re[4]: Mechanism of Wedge Void Formation

pgiovann

Wed, 16 Jul 97 02:58:05 PST

46 lines

Re[3]: Mechanism of Wedge Void Formation

tgyee

Wed, 16 Jul 97 11:09:32 PST

104 lines

Re[2]: Mechanism of Wedge Void Formation

<>

Tue, 15 Jul 97 15:58:03 EST

73 lines

Re[2]: Mechanism of Wedge Void Formation

<>

Tue, 15 Jul 97 15:58:03 EST

73 lines

Re: Mechanism of Wedge Void Formation

<>

Tue, 15 Jul 1997 06:06:19 -0400 (EDT)

44 lines

Re: Mechanism of Wedge Void Formation

tgyee

Tue, 15 Jul 97 09:48:51 PST

69 lines

Mechanism of Wedge Void Formation

Josep Sajut

Mon, 14 Jul 1997 18:06:52 -0400

49 lines

New Thread

Message for Steve O'Hara, HP

Re: Message for Steve O'Hara, HP

<>

Mon, 14 Jul 1997 18:32:20 -0400 (EDT)

38 lines

New Thread

minimum hole size

minimum hole size

<>

Mon, 21 Jul 1997 14:16:05 -0700

40 lines

New Thread

Mixed Technologie SMD-Soldering + COB

RE: Mixed Technologie SMD-Soldering + COB

<>

Tue, 29 Jul 1997 08:48:28 +0100

102 lines

Mixed Technologie SMD-Soldering + COB

Jeremias Michael

Mon, 28 Jul 1997 22:49:08 -0700

58 lines

New Thread

Motherboard

Motherboard

Peter Wei

Tue, 1 Jul 1997 23:02:42 +0200

52 lines

New Thread

Need RF Fab/Assy house

Need RF Fab/Assy house

Bill Gaines B160 x2199

Wed, 9 Jul 1997 08:15:29 -0700 (PDT)

54 lines

New Thread

North Texas Chapter ~ IPC Designers Council Meeting August 7th

North Texas Chapter ~ IPC Designers Council Meeting August 7th

Keith Larson

Sun, 27 Jul 1997 18:41:57 -0500

162 lines

North Texas Chapter ~ IPC Designers Council Meeting August 7th

<>

Wed, 23 Jul 97 17:12:47 CDT

195 lines

New Thread

OFHC copper

Re: OFHC copper

<>

Fri, 01 Aug 97 07:58:16 cst

69 lines

Re: OFHC copper

<>

Thu, 31 Jul 1997 11:26:55 -0400 (EDT)

36 lines

OFHC copper

Andre Bisson

Wed, 30 Jul 1997 15:32:39 -0300

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OFHC copper

Andre Bisson

Wed, 23 Jul 1997 14:10:31 -0300

45 lines

New Thread

Oxidation arrest paper

Oxidation arrest paper

<>

Tue, 22 Jul 1997 07:43:18 -0500

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New Thread

oxide controller

Re: oxide controller

<>

Fri, 25 Jul 1997 10:37:10 -0400 (EDT)

47 lines

New Thread

Oxide Post Bake

Re: Oxide Post Bake

George Wheadon

07 Jul 97 12:09:04 EDT

41 lines

Re: Oxide Post Bake

<>

Mon, 7 Jul 1997 09:30:25 -0400 (EDT)

51 lines

Re: Oxide Post Bake

<>

Mon, 7 Jul 1997 09:18:42 -0400 (EDT)

49 lines

Re: Oxide Post Bake

tgyee

Mon, 07 Jul 97 14:06:16 PST

72 lines

Re: Oxide Post Bake

Thomas E. Waznis

06 Jul 97 21:47:53 -0800

56 lines

Oxide Post Bake

<>

Thu, 03 Jul 97 09:48:09 MST

47 lines

New Thread

Oxide skips

Re: Oxide skips

<>

Thu, 17 Jul 1997 11:06:20 -0400 (EDT)

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Re: Oxide skips

<>

Mon, 14 Jul 1997 23:34:45 -0400 (EDT)

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Oxide skips

<>

Sat, 12 Jul 1997 19:22:34 -0400 (EDT)

49 lines

New Thread

Oxydation arrest paper

Re: Oxydation arrest paper

Peter Swanson

Wed, 23 Jul 1997 09:16:24 GMT

59 lines

Re: Oxydation arrest paper

David Hoover

Tue, 22 Jul 1997 18:28:34 -0700

79 lines

Re: Oxydation arrest paper

Peter Swanson

Tue, 22 Jul 1997 09:10:36 GMT

68 lines

Re: Oxydation arrest paper

<>

Tue, 22 Jul 1997 02:03:03 -0400 (EDT)

40 lines

Re[2]: Oxydation arrest paper

<>

Mon, 21 Jul 1997 14:44:51 -0500

76 lines

Re: Oxydation arrest paper

<>

Mon, 21 Jul 1997 13:27:29 -0500

84 lines

Re: Oxydation arrest paper

<>

Mon, 21 Jul 1997 12:08:00 -0400 (EDT)

37 lines

Oxydation arrest paper

Marie-Jose Lambert (Marie-Jose Lambert)

Mon, 21 Jul 1997 09:44:26 -0300

50 lines

New Thread

Panelization

Re: Panelization

Chuck Hahr

Mon, 28 Jul 1997 11:00:54 +0000

83 lines

Re: Panelization

Jeffery L. Hempton

Mon, 28 Jul 1997 11:16:50 -0500

57 lines

Panelization

<>

Mon, 28 Jul 1997 10:16:30 +0400 (EDT)

41 lines

New Thread

Panelization - Thks

Re: Panelization - Thks

Poh Kong Hui

Tue, 29 Jul 1997 23:54:44 +0800 (SST)

39 lines

New Thread

Part II: Mechanism of Wedge Void Formation

Re[3]: Part II: Mechanism of Wedge Void Formation

<>

Thu, 17 Jul 97 11:12:01 cst

150 lines

Re: Part II: Mechanism of Wedge Void Formation

D. Rooke

Thu, 17 Jul 1997 00:18:59 -0400 (EDT)

136 lines

Re[2]: Part II: Mechanism of Wedge Void Formation

<>

Wed, 16 Jul 97 21:48:20 EST

120 lines

Re: Part II: Mechanism of Wedge Void Formation

<>

Wed, 16 Jul 97 07:59:02 cst

107 lines

Part II: Mechanism of Wedge Void Formation

Josep Sajut

Tue, 15 Jul 1997 18:02:41 -0400

70 lines

New Thread

PCB Equipment manufacturer

PCB Equipment manufacturer

OMNI High Tech Industries Ltd. (OHTIL)

Tue, 22 Jul 1997 21:50:19 +0600

89 lines

New Thread

PCB rework cycles

Re: PCB rework cycles

<>

Thu, 10 Jul 1997 16:42:18 -0400 (EDT)

46 lines

PCB rework cycles

Tom Olafsson

Mon, 7 Jul 1997 10:51:11 -0400

44 lines

New Thread

PCB Training Course

PCB Training Course

Michael Forrester

Thu, 24 Jul 1997 12:11:32 -0400

51 lines

New Thread

placement machine evaluation

placement machine evaluation

<>

Wed, 09 Jul 97 09:18:02 CST

44 lines

New Thread

placement system

Re: placement system

<>

Mon, 7 Jul 1997 05:25:55 -0400

63 lines

New Thread

PLANARITY

PLANARITY

Paul Stolar

Thu, 10 Jul 97 17:34:44 -0600

39 lines

New Thread

please remove request

please remove request

<>

Thu, 10 Jul 97 09:07:38 CST

39 lines

New Thread

polyimide flexible jumper

Re: polyimide flexible jumper

Lyle Dove

Tue, 22 Jul 1997 08:44:56

107 lines

polyimide flexible jumper

guerard

Tue, 22 Jul 1997 15:27:29 +0200

57 lines

New Thread

polyimide flexible jumper -Reply

polyimide flexible jumper -Reply

David Anderson

Tue, 22 Jul 1997 09:58:01 -0500

78 lines

New Thread

Power Symbols

Re: Power Symbols

<>

Tue, 29 Jul 1997 13:05:37 -0700

73 lines

Re: Power Symbols

JoAnn Amerson

Tue, 29 Jul 1997 15:02:34 +0000

53 lines

Power Symbols

<>

Tue, 29 Jul 1997 09:57:07 -0700

41 lines

New Thread

PPM Defect Counting

Re: PPM Defect Counting

Vickie Chapman

Thu, 10 Jul 1997 08:22:32 -0700

123 lines

Re: PPM Defect Counting

Steve Mikell

Thu, 10 Jul 1997 10:19:48 -0500 (CDT)

87 lines

Re[2]: PPM Defect Counting

David Bruni

Thu, 10 Jul 97 07:56:58 -0500

160 lines

PPM defect counting

Patrick Ducas

Thu, 10 Jul 1997 07:45:43 -0400

190 lines

Re: PPM Defect Counting

Mark W. Spitnale

Thu, 10 Jul 1997 06:22:11 -0500

89 lines

PPM defect counting

Jos Aarninkhof

Thu, 10 Jul 1997 08:22:34 +0200

127 lines

Re: PPM Defect Counting

Vickie Chapman

Wed, 9 Jul 1997 15:44:22 -0700

117 lines

Re: PPM Defect Counting

<>

Wed, 09 Jul 97 15:26:32 -0500

81 lines

PPM Defect Counting

RICK VERNON

Wed, 09 Jul 1997 12:33:41 -0500

49 lines

New Thread

PPM Defects Project

PPM Defects Project

Jack Crawford

Tue, 15 Jul 1997 09:24:21 -0500

72 lines

New Thread

Printed Info on Flexible Circuit Manufacturing

Re[2]: Printed Info on Flexible Circuit Manufacturing

Frank Hinojos

Tue, 22 Jul 1997 09:25:19 -0700

100 lines

Re: Printed Info on Flexible Circuit Manufacturing

Omni High Tech Industries Ltd. (OHTIL)

Tue, 22 Jul 1997 18:54:20 +0600

61 lines

Printed Info on Flexible Circuit Manufacturing

Phil Culpovich

Sat, 19 Jul 1997 01:53:51 -0700

49 lines

New Thread

Pwb Design Service

Pwb Design Service

<>

Wed, 9 Jul 1997 09:54:33 -0400

48 lines

New Thread

PWB OEM Incoming Inspection

RE: PWB OEM Incoming Inspection

Ed Cosper

Wed, 9 Jul 1997 11:44:41 -0500

136 lines

RE: PWB OEM Incoming Inspection

<>

Wed, 09 Jul 97 10:24:23 EST

61 lines

New Thread

PWB trace cut sealing

Re: PWB trace cut sealing

Jeffery L. Hempton

Mon, 28 Jul 1997 11:09:46 -0500

78 lines

Re: PWB trace cut sealing

Aric J Parr

Mon, 28 Jul 1997 08:06:07 -0500

80 lines

Re: PWB trace cut sealing

<>

Fri, 25 Jul 97 14:18:10 -0700

90 lines

Re: PWB trace cut sealing

<>

Fri, 25 Jul 1997 15:12:45 -0600

102 lines

PWB trace cut sealing

<>

Fri, 25 Jul 1997 10:33:26 +0000

64 lines

New Thread

Re [2]: Re: Fab: Innerlayer cleanliness/Fine lines&Spaces

Re [2]: Re: Fab: Innerlayer cleanliness/Fine lines&Spaces

Nachbor, Suzanne (MN51)

Tue, 22 Jul 97 16:12:00 PDT

50 lines

New Thread

Re(2): Decapping ICs

Re: Re(2): Decapping ICs

Gregg Klawson

Wed, 16 Jul 1997 11:07:35 -0400

69 lines

New Thread

Re2: PPM Defect Counting> more thoughts

Re2: PPM Defect Counting> more thoughts

Steve Mikell

Thu, 10 Jul 1997 13:36:51 -0500 (CDT)

61 lines

New Thread

Re: Pink ring and hard failures

RE: Re: Pink ring and hard failures

Ed Cosper

Fri, 18 Jul 1997 16:23:44 -0500

172 lines

New Thread

Reflow oven temperature

RE: Reflow oven temperature

Orna and Yehuda

Wed, 23 Jul 1997 23:17:37 +0300

63 lines

Re: Reflow oven temperature

Jerry Cupples

Wed, 23 Jul 1997 11:37:50 -0500

103 lines

RE: Reflow oven temperature

John Guy

Wed, 23 Jul 1997 08:01:53 -0500

163 lines

RE: Reflow oven temperature

Andrew J. Scholand

Wed, 23 Jul 1997 00:54:23 -0400

95 lines

Re: Reflow oven temperature

Frank Hinojos

Mon, 21 Jul 1997 11:02:52 -0700

90 lines

RE: Reflow oven temperature

John Guy

Mon, 21 Jul 1997 12:39:04 -0500

109 lines

Reflow oven temperature

<>

Mon, 21 Jul 97 16:24:07 PST

55 lines

New Thread

Reliability of Solder Mask Defined Lands

Reliability of Solder Mask Defined Lands

Stephen C Joy

Tue, 08 Jul 97 15:01:00 PDT

35 lines

New Thread

Removal of Dunlop Glue (Rubber base glue)

Removal of Dunlop Glue (Rubber base glue)

Mohd Misri-RSB019

Fri, 18 Jul 1997 8:16:00 -0500

54 lines

New Thread

Remove prepreg

Re: Remove prepreg

Jim Herard

Wed, 16 Jul 1997 17:34:44 -0400

75 lines

RE: Remove prepreg

<>

Wed, 16 Jul 1997 8:32:43 +0000

71 lines

Remove prepreg

Tomer_2

Wed, 16 Jul 1997 09:40:13 +0000

48 lines

New Thread

Replay : Barcoding / Job Tracking

Replay : Barcoding / Job Tracking

Chris Gregg

Wed, 9 Jul 1997 11:35:41 +0100

112 lines

New Thread

Reply to "what is via tenting?"

Reply to "what is via tenting?"

Dejan

Wed, 16 Jul 1997 17:00:37 -0700

42 lines

New Thread

Reply [3] - Solder compatibility

Reply [3] - Solder compatibility

<>

Tue, 15 Jul 1997 10:16:06 -0400 (EDT)

41 lines

New Thread

Reply:Wave and BGA

Reply:Wave and BGA

Jim Herard

Wed, 16 Jul 1997 17:40:43 -0400

101 lines

New Thread

REQUIRED...Ink Mixer/Stirrer

REQUIRED...Ink Mixer/Stirrer

Dileep Mohan

Sat, 12 Jul 1997 15:40:27 +0530 (IST)

54 lines

New Thread

REWORK: BGA adaptors

REWORK: BGA adaptors

Kahu Himona

Wed, 23 Jul 1997 16:01:07 +1200

74 lines

New Thread

REWORK: BGA adaptors -Reply

REWORK: BGA adaptors -Reply

Jeff McGlaughlin

Thu, 24 Jul 1997 07:37:49 -0400

73 lines

New Thread

Re[2]: Bar Coding / Job Tracking

Re: Re[2]: Bar Coding / Job Tracking

<>

Tue, 8 Jul 1997 12:42:15 -0400 (EDT)

50 lines

New Thread

Re[2]: LPISM Stripping

Re: Re[2]: LPISM Stripping

<>

Mon, 7 Jul 1997 11:03:28 -0400 (EDT)

54 lines

New Thread

Re[2]: Mechanism of Wedge Void Formation

Re: Re[2]: Mechanism of Wedge Void Formation

Goldman, Patricia J.

Fri, 18 Jul 97 11:59:00 PDT

111 lines

Re: Re[2]: Mechanism of Wedge Void Formation

<>

Fri, 18 Jul 1997 12:40:29 -0400 (EDT)

55 lines

Re: Re[2]: Mechanism of Wedge Void Formation

<>

Fri, 18 Jul 1997 11:11:33 -0400 (EDT)

46 lines

Re: Re[2]: Mechanism of Wedge Void Formation

Lenny Kurup

Fri, 18 Jul 1997 09:34:32 -0400 (EDT)

209 lines

Re: Re[2]: Mechanism of Wedge Void Formation

<>

Thu, 17 Jul 1997 18:49:13 -0400 (EDT)

58 lines

Re: Re[2]: Mechanism of Wedge Void Formation

<>

Thu, 17 Jul 1997 18:30:14 -0400 (EDT)

41 lines

Re: Re[2]: Mechanism of Wedge Void Formation

Richard A. Schumacher

Thu, 17 Jul 1997 10:56:22 -0500

43 lines

Re: Re[2]: Mechanism of Wedge Void Formation

Goldman, Patricia J.

Thu, 17 Jul 97 08:32:00 PDT

176 lines

Re: Re[2]: Mechanism of Wedge Void Formation

Lenny Kurup

Wed, 16 Jul 1997 14:17:49 -0400 (EDT)

106 lines

New Thread

Re[2]: Rigid-flex technologies

Re: Re[2]: Rigid-flex technologies

Denis Meloche

Fri, 25 Jul 1997 13:57:54 -0400

114 lines

New Thread

Re[2]: Solder Mask Residue

Re: Re[2]: Solder Mask Residue

<>

Wed, 16 Jul 1997 13:40:54 -0400 (EDT)

39 lines

New Thread

Re[5]: Mechanism of Wedge Void Formation

RE: Re[5]: Mechanism of Wedge Void Formation

Goldman, Patricia J.

Mon, 21 Jul 97 12:53:00 PDT

123 lines

Re: Re[5]: Mechanism of Wedge Void Formation

Lenny Kurup

Mon, 21 Jul 1997 12:09:05 -0400 (EDT)

82 lines

New Thread

Re[6]: Mechanism of Wedge Void Formation

Re: Re[6]: Mechanism of Wedge Void Formation

<>

Mon, 21 Jul 1997 22:12:43 -0400 (EDT)

60 lines

New Thread

Rigid-flex technologies

Re[2]: Rigid-flex technologies

<>

Fri, 25 Jul 97 10:22:22 MDT

82 lines

Re: Rigid-flex technologies

Joel Yocom

Fri, 25 Jul 1997 08:06:52 +0000

63 lines

Rigid-flex technologies

<>

Thu, 24 Jul 97 16:22:19 MDT

45 lines

New Thread

Rigid-Flex Technology

Rigid-Flex Technology

Bernard Kessler & Associates LTD

Fri, 25 Jul 1997 12:04:06 -0400 (EDT)

41 lines

New Thread

ROUTED EDGE QUALITY

RE: ROUTED EDGE QUALITY

Ed Cosper

Fri, 18 Jul 1997 15:58:53 -0500

100 lines

ROUTED EDGE QUALITY

George Lubbecke

Thu, 17 Jul 1997 17:49:41 -0700

54 lines

ROUTED EDGE QUALITY

George Lubbecke

Thu, 17 Jul 1997 12:15:53 -0700

44 lines

New Thread

Second hand machine

Second hand machine

tonghh

Sun, 13 Jul 1997 21:09:33 +0800

53 lines

New Thread

Second hand/Refurbished equipment

Second hand/Refurbished equipment

Andrew G Kettlewell

Fri, 11 Jul 1997 08:27:23 -0500

62 lines

New Thread

SHORTS AT ELEVATED TEMPERATURE IN DOUBLE SIDE BOARDS.

Re: SHORTS AT ELEVATED TEMPERATURE IN DOUBLE SIDE BOARDS.

<>

Fri, 25 Jul 1997 11:37:18 -0400 (EDT)

92 lines

Re: SHORTS AT ELEVATED TEMPERATURE IN DOUBLE SIDE BOARDS.

Barbara Burcham

Thu, 24 Jul 1997 15:42:14 -0700

74 lines

re: SHORTS AT ELEVATED TEMPERATURE IN DOUBLE SIDE BOARDS.

LES CONNALLY

Thu, 24 Jul 1997 09:29:42 -0700

92 lines

SHORTS AT ELEVATED TEMPERATURE IN DOUBLE SIDE BOARDS.

B.R.SHASHIRAJ

Thu, 24 Jul 1997 18:28:41 +0500

51 lines

New Thread

Silkscreen

Re[2]: Silkscreen

Frank Hinojos

Wed, 9 Jul 1997 15:53:01 -0700

75 lines

Re: Silkscreen

David Ricketts

Wed, 09 Jul 1997 12:00:24 -0700

64 lines

Re: Silkscreen

<>

Wed, 9 Jul 1997 11:52:54 -0400 (EDT)

45 lines

Re: Silkscreen

JoAnn Amerson

Wed, 9 Jul 1997 08:44:11 +0000

66 lines

Silkscreen

Thomas Kropski

Tue, 08 Jul 1997 15:35:39 -0700

48 lines

New Thread

Silkscreen -Reply

Re: Silkscreen -Reply

John Swinehart

Wed, 09 Jul 1997 15:26:36 -0400

99 lines

Re: Silkscreen -Reply

Andrew Buonviri

Tue, 8 Jul 1997 19:26:16 -0400

44 lines

Silkscreen -Reply

John Swinehart

Tue, 08 Jul 1997 16:17:03 -0400

50 lines

New Thread

Smallest standard label size

Smallest standard label size

<>

Mon, 21 Jul 97 12:14:42 MDT

41 lines

New Thread

SMT Assy Equipment

Re: SMT Assy Equipment

Poh Kong Hui

Tue, 1 Jul 1997 07:13:04 +0800 (SST)

65 lines

New Thread

Solder Balls

Re: Solder Balls

Denis Meloche

Tue, 01 Jul 1997 09:50:13 -0400

97 lines

Re[2]: Solder Balls

Ron Hollandsworth

Tue, 01 Jul 97 08:06:36 -0500

112 lines

Re: Solder Balls

Poh Kong Hui

Tue, 1 Jul 1997 07:03:33 +0800 (SST)

71 lines

New Thread

Solder compatibility

Re[2]: Solder compatibility

<>

Mon, 14 Jul 1997 09:31:45 -0400 (EDT)

59 lines

Re[2]: Solder compatibility

<>

Mon, 14 Jul 1997 09:31:37 -0400 (EDT)

65 lines

Re[2]: Solder Compatibility

<>

Mon, 14 Jul 1997 09:22:45 -0400 (EDT)

55 lines

Re[2]: Solder compatibility

<>

Fri, 11 Jul 97 09:12:50 cst

90 lines

Re: Solder compatibility

<>

Fri, 11 Jul 1997 08:59:25 -0400 (EDT)

46 lines

Re: Solder compatibility

<>

Fri, 11 Jul 1997 08:25:37 EDT

112 lines

Re: Solder compatibility

<>

Fri, 11 Jul 1997 07:46:45 -0400 (EDT)

49 lines

Re: Solder compatibility

<>

Fri, 11 Jul 1997 00:09:39 -0400 (EDT)

55 lines

Re: Solder compatibility

<>

Thu, 10 Jul 97 10:15:53 cst

74 lines

Solder compatibility

<>

Wed, 09 Jul 1997 11:27:49 EDT

44 lines

New Thread

Solder dispensing valve and controller

RE: Solder dispensing valve and controller

Larry Morse

Sat, 22 Feb 1997 09:48:15 -0800

114 lines

Solder Dispensing Valve and Controller

Miguel Apezteguia

Mon, 14 Jul 1997 12:50:07 -0600

72 lines

Solder Dispensing Valve and Controller

Miguel Apezteguia

Mon, 14 Jul 1997 12:50:07 -0600

72 lines

New Thread

Solder Expert

Solder Expert

<>

Mon, 14 Jul 1997 09:49:34 -0700

43 lines

Solder Expert

<>

Mon, 14 Jul 1997 09:42:32 -0700

85 lines

New Thread

Solder joint design rules

Re: Solder joint design rules

James C. Patten

Mon, 7 Jul 97 11:04:00 PDT

99 lines

Re: Solder joint design rules

<>

Mon, 7 Jul 1997 07:41:20 -0400 (EDT)

67 lines

Solder joint design rules

<>

Fri, 4 Jul 97 12:09:07 +0200

87 lines

New Thread

Solder Joint Reliability

Solder Joint Reliability

Krawczyk, Russ

Wed, 16 Jul 1997 10:43:26 -0500

57 lines

New Thread

Solder Mask Residue

Re[4]: Solder Mask Residue

tgyee

Mon, 21 Jul 97 09:35:17 PST

59 lines

Re[2]: Solder Mask Residue

tgyee

Wed, 16 Jul 97 09:12:34 PST

71 lines

Re: Solder Mask Residue

<>

Tue, 15 Jul 1997 09:52:40 -0400 (EDT)

50 lines

Re: Solder Mask Residue

<>

Tue, 15 Jul 1997 09:22:31 -0400 (EDT)

68 lines

Re: Solder Mask Residue

<>

Tue, 15 Jul 97 08:02:10 -0800

84 lines

Solder Mask Residue

Cambridge Electronics Corp. - Marketing Dept.

Tue, 15 Jul 1997 19:25:28 +0800

60 lines

New Thread

Solder Recovery Systems

Solder Recovery Systems

Maurice Dore

Thu, 31 Jul 1997 8:45:11 GMT

45 lines

New Thread

Solderability Tests for PCBs

Re: Solderability Tests for PCBs

Poh Kong Hui

Thu, 31 Jul 1997 23:00:31 +0800 (SST)

81 lines

Re: Solderability Tests for PCBs

<>

Wed, 30 Jul 1997 17:49:34 -0400 (EDT)

33 lines

Re: Solderability Tests for PCBs

<>

Wed, 30 Jul 1997 17:01:46 -0400 (EDT)

40 lines

re: Solderability Tests for PCBs

LES CONNALLY

Wed, 30 Jul 1997 15:05:39 -0700

90 lines

Re: Solderability Tests for PCBs

<>

Wed, 30 Jul 97 15:01:38 cst

83 lines

Re: Solderability Tests for PCBs

Denis Meloche

Wed, 30 Jul 1997 14:54:09 -0400

83 lines

Solderability Tests for PCBs

Mike Masters

Wed, 30 Jul 1997 11:47:26 -0400

58 lines

New Thread

Soldering silver on brass

Re[2]: Soldering silver on brass

Paul Stolar

Tue, 15 Jul 97 13:21:49 -0600

99 lines

Re: Soldering silver on brass

<>

Tue, 15 Jul 97 10:23:39 cst

70 lines

Re: Soldering silver on brass

Poh Kong Hui

Tue, 15 Jul 1997 23:05:47 +0800 (SST)

77 lines

Re: Soldering silver on brass

<>

Tue, 15 Jul 1997 10:01:35 -0400 (EDT)

39 lines

Soldering silver on brass

Paul Stolar

Tue, 15 Jul 97 08:35:58 -0600

41 lines

New Thread

SOLDERING TO PLATINUM

Re: SOLDERING TO PLATINUM

<>

Thu, 10 Jul 97 10:10:01 cst

75 lines

SOLDERING TO PLATINUM

Lolmaugh, Scott (AZ15)

09 Jul 1997 15:59:24 -0500

57 lines

New Thread

Sources of Universal Equipment

Re: Sources of Universal Equipment

<>

Mon, 28 Jul 1997 15:47:02 -0400 (EDT)

43 lines

New Thread

Standard Lab Conditions

Standard Lab Conditions

Godby, Larry (On-Call)

Mon, 16 Jun 1997 14:21:26 -0600

40 lines

New Thread

Standard PCB/PWB Trace Width's

Standard PCB/PWB Trace Width's

jon johnson

Mon, 21 Jul 1997 11:00:37 -0400

50 lines

Standard PCB/PWB Trace Width's

<>

Mon, 21 Jul 1997 09:58:23 -0500

98 lines

Re: Standard PCB/PWB Trace Width's

<>

Sat, 19 Jul 1997 11:43:25 -0400 (EDT)

40 lines

Standard PCB/PWB Trace Width's

Michael Forrester

Fri, 18 Jul 1997 17:38:37 -0400

51 lines

New Thread

Standard PCB/PWB Trace Width's -Reply

Standard PCB/PWB Trace Width's -Reply

John Swinehart

Mon, 21 Jul 1997 13:12:56 -0400

143 lines

New Thread

Standard PCB/PWB Trace Withd's

Re: Standard PCB/PWB Trace Withd's

GeoFranck

Mon, 21 Jul 1997 09:13:43 -0400

110 lines

RE: Standard PCB/PWB Trace Withd's

Raymond Klein

Fri, 18 Jul 1997 15:57:17 -0700

47 lines

New Thread

Strip tin-lead

Re: Strip tin-lead

<>

Fri, 18 Jul 1997 06:29:46 -0400 (EDT)

49 lines

Strip tin-lead

Eltek Ltd. - Process Engineering

Wed, 16 Jul 1997 18:31:22 +0300 (IDT)

55 lines

New Thread

supplier for screens

RE: supplier for screens

Ed Cosper

Tue, 1 Jul 1997 17:10:29 -0500

71 lines

supplier for screens

<>

Tue, 01 Jul 1997 14:14:04 GMT

35 lines

New Thread

Surface prep prior to solder mask

Surface prep prior to solder mask

<>

Wed, 30 Jul 1997 21:39:50 -0400 (EDT)

43 lines

New Thread

Targets and Film

Re: Targets and Film

<>

Mon, 28 Jul 97 12:01:04 -0500

92 lines

Re: Targets and Film

Dick Desrosiers

Mon, 28 Jul 97 09:21:05 EDT

42 lines

Re: Targets and Film

Paul Gould

Sat, 26 Jul 1997 21:03:21 +0100

54 lines

Re: Targets and Film

Jack Olson

Sat, 26 Jul 1997 10:48:37 -0700

69 lines

Re: Targets and Film

<>

Fri, 25 Jul 1997 16:26:09 +0400 (EDT)

77 lines

Targets and Film

Jack Olson

Fri, 25 Jul 1997 13:01:18 -0700

58 lines

New Thread

TechNet Forum

Re: TechNet Forum

JoAnn Amerson

Tue, 15 Jul 1997 15:07:46 +0000

51 lines

TechNet Forum

William Johnson

Tue, 15 Jul 97 18:04:39 UT

33 lines

New Thread

TechNet-d Digest V97 #423

Re: TechNet-d Digest V97 #423

Phil Culpovich

Fri, 18 Jul 1997 20:56:13 -0700

79 lines

New Thread

TechNet-d Digest V97 #428

Re: TechNet-d Digest V97 #428

Dan Lee

Tue, 22 Jul 1997 07:44:29 -0700

57 lines

New Thread

Temporary spot mask

Temporary spot mask

Graham Naisbitt

Fri, 25 Jul 97 16:25:08 UT

52 lines

New Thread

Temporary Spot Solder Mask

Re: Temporary Spot Solder Mask

<>

Thu, 24 Jul 1997 09:13:05 -0400 (EDT)

45 lines

RE: Temporary Spot Solder Mask

Graham Naisbitt

Wed, 23 Jul 97 22:00:55 UT

99 lines

Re: Temporary Spot Solder Mask

Peter Swanson

Wed, 23 Jul 1997 20:44:36 GMT

68 lines

RE: Temporary Spot Solder Mask

Yuen, Mike

Wed, 23 Jul 97 12:10:00 CDT

80 lines

Temporary Spot Solder Mask

Ben Lee

Wed, 23 Jul 1997 11:30:49 -0400

50 lines

New Thread

Tensile strength/elongation

Re: Tensile strength/elongation

<>

Wed, 30 Jul 1997 12:12:08 -0400 (EDT)

51 lines

New Thread

Test and Inspection Strategy

Re: Test and Inspection Strategy

Vickie Chapman

Fri, 11 Jul 1997 10:02:39 -0700

61 lines

Re: Test and Inspection Strategy

<>

Fri, 11 Jul 1997 09:16:37 -0400 (EDT)

57 lines

Test and Inspection Strategy

Vickie Chapman

Thu, 10 Jul 1997 15:57:55 -0700

128 lines

New Thread

Test Die for SMD Reliability Testing

Test Die for SMD Reliability Testing

Oliver Kierse

Fri, 11 Jul 97 10:09:32 BST

68 lines

RE: Test Die for SMD Reliability Testing

Alderete, Michael

Thu, 10 Jul 1997 15:23:54 -0700

166 lines

Test Die for SMD Reliability Testing

Maguire, James F

Thu, 10 Jul 1997 12:21:14 -0700

89 lines

New Thread

Test die for SMD reliability.

RE: Test die for SMD reliability.

<>

Fri, 11 Jul 1997 08:57:32 +0100

162 lines

New Thread

Test probes for gold fingers

RE: Test probes for gold fingers

Jeffrey C. Garland

Tue, 1 Jul 1997 08:12:25 -0700

104 lines

New Thread

Test Strategy

Test Strategy

Lepsche, Thomas G (NM75)

Thu, 10 Jul 1997 15:49:54 -0600

58 lines

New Thread

Thanks For All The Flex Circuit Info

Thanks For All The Flex Circuit Info

Phil Culpovich

Tue, 22 Jul 1997 08:06:13 -0700

50 lines

New Thread

Thermal concerns in the assembly of BGA designs

Thermal concerns in the assembly of BGA designs

Karl Bornemann

Wed, 30 Jul 1997 11:39:57 +0100

48 lines

New Thread

Thermal considerations in BGA design

Thermal considerations in BGA design

Karl Bornemann

Thu, 24 Jul 1997 10:37:40 +0100

50 lines

New Thread

Through Hole Solder Joint Performance

Through Hole Solder Joint Performance

Krawczyk, Russ

Wed, 16 Jul 1997 11:14:37 -0500

57 lines

New Thread

TMRC/AMRC Archive

TMRC/AMRC Archive

Kim Sterling

Tue, 22 Jul 1997 13:36:05 -0500

43 lines

New Thread

Trace & Space Width

Trace & Space Width

Phil Culpovich

Mon, 21 Jul 1997 10:37:47 -0700

78 lines

New Thread

U.V. cure of L.P.I. soldermasks

Re: U.V. cure of L.P.I. soldermasks

Larry Crane

Wed, 9 Jul 1997 13:03:18 -0400

86 lines

Re: U.V. cure of L.P.I. soldermasks

<>

Wed, 09 Jul 97 10:16:19 -0800

71 lines

U.V. cure of L.P.I. soldermasks

Steves

Wed, 9 Jul 1997 09:59:12 +0000

47 lines

New Thread

Ultrasonic Vibrators

Ultrasonic Vibrators

Eltek Ltd. - Process Engineering

Tue, 8 Jul 1997 07:19:46 +0300 (IDT)

57 lines

Ultrasonic Vibrators

Eltek Ltd. - Process Engineering

Mon, 7 Jul 1997 13:54:10 +0300 (IDT)

57 lines

New Thread

Unidentified subject!

Unidentified subject!

Orna and Yehuda

Fri, 1 Aug 1997 12:37:08 +0300

47 lines

Unidentified subject!

EDDY CHEN

Sat, 26 Jul 1997 15:46:34 +0800

43 lines

Re: Unidentified subject!

<>

Fri, 25 Jul 1997 10:12:29 -0400 (EDT)

57 lines

Unidentified subject!

DAVID HILL

Thu, 24 Jul 1997 15:46:42 +0100

61 lines

RE: Unidentified subject!

John Nelson

Mon, 14 Jul 1997 11:34:25 -0400

78 lines

Unidentified subject!

=?US-ASCII?Q?Angel_Luis_Ferrandez_Berrueco?=

Mon, 14 Jul 1997 12:59:00 -0700

46 lines

Unidentified subject!

<>

Mon, 14 Jul 1997 10:11:06 GMT

38 lines

Unidentified subject!

<>

Fri, 11 Jul 1997 08:59:05 GMT

40 lines

Unidentified subject!

Poh Kong Hui

Thu, 10 Jul 1997 22:42:34 +0800 (SST)

50 lines

Unidentified subject!

<>

Wed, 9 Jul 1997 15:10:25 +0100

74 lines

Unidentified subject!

Kevin Jamison

Wed, 2 Jul 1997 17:10:40 -0500

42 lines

New Thread

Urgently need 3M Fluorad FC-725 conformal coat material

Urgently need 3M Fluorad FC-725 conformal coat material

John Loveluck

Mon, 07 Jul 1997 11:42:20 -0700

60 lines

New Thread

Use of SMD shields for shielding pre reflow (ASSEM)

Re: Use of SMD shields for shielding pre reflow (ASSEM)

Denis Meloche

Fri, 11 Jul 1997 12:29:56 -0400

87 lines

Re: Use of SMD shields for shielding pre reflow (ASSEM)

Mark W. Spitnale

Mon, 14 Jul 1997 06:26:28 -0500

101 lines

RE: Use of SMD shields for shielding pre reflow (ASSEM)

John Wick 595-6667

Fri, 11 Jul 1997 10:00:00 -0400 (EDT)

62 lines

Use of SMD shields for shielding pre reflow (ASSEM)

Jesse Dijkstra

Fri, 11 Jul 1997 12:17:17 +1200

46 lines

New Thread

Using the Technet Exploder

Re: Using the Technet Exploder

Sheila Smith

Wed, 16 Jul 1997 11:08:10 -0400 (EDT)

60 lines

Using the Technet Exploder

Edwin Louis

16 Jul 1997 07:55:32 -0600

53 lines

New Thread

Vacations

Vacations

Graham Naisbitt

Tue, 22 Jul 97 20:24:48 UT

52 lines

New Thread

vacuum lamination

Re: vacuum lamination

<>

Tue, 8 Jul 1997 21:25:18 -0400 (EDT)

45 lines

vacuum lamination

<>

Tue, 8 Jul 1997 00:22:06 -0400 (EDT)

39 lines

New Thread

Vapor Honing

Re: Vapor Honing

<>

Mon, 21 Jul 1997 11:15:15 -0400 (EDT)

52 lines

Re: vapor honing

Sheila Smith

Mon, 21 Jul 1997 08:28:17 -0400 (EDT)

83 lines

Re: vapor honing

<>

Fri, 18 Jul 1997 23:25:14 -0400 (EDT)

42 lines

RE: vapor honing

John Nelson

Fri, 18 Jul 1997 16:44:34 -0400

73 lines

vapor honing

<>

Fri, 18 Jul 1997 13:38:09 GMT

41 lines

New Thread

Vendors for oxide treatment on copper laminates

Vendors for oxide treatment on copper laminates

Duane B. Mahnke

Wed, 30 Jul 1997 21:04:00 -0700

47 lines

New Thread

Via hole/pad size

Via hole/pad size

Thomas Kropski

Fri, 01 Aug 1997 09:06:54 -0700

49 lines

New Thread

Via Inductance

Re: Via Inductance

Jack Olson

Thu, 31 Jul 1997 22:25:07 -0700

45 lines

Re: Via Inductance

Doug McKean

Thu, 31 Jul 1997 13:05:07 -0400

81 lines

New Thread

Voltage Breakdown of materials

Voltage Breakdown of materials

James A Larson

Wed, 02 Jul 1997 22:04:32 +0100

47 lines

New Thread

Voltage Breakdowns of Resins

Voltage Breakdowns of Resins

James A Larson

Wed, 02 Jul 1997 17:42:25 +0100

47 lines

New Thread

Want Electrovert Cleaner

Want Electrovert Cleaner

Sanmatech

Mon, 7 Jul 1997 10:14:03 +0800

54 lines

New Thread

Wave and BGA

RE: Wave and BGA

Landes, Jeff

Wed, 16 Jul 97 11:51:00 PDT

98 lines

Re[2]: Wave and BGA

Thad McMillan

16 Jul 97 13:41 CDT

143 lines

Re: Wave and BGA

Charles Elliott

16 Jul 1997 11:35:02 U

131 lines

Re: Wave and BGA

Greg Bartlett

16 Jul 1997 10:44:56 -0400

128 lines

Wave and BGA

Andre Bisson

Wed, 16 Jul 1997 10:00:07 -0300

61 lines

New Thread

Wave Solder Optimizer

RE: Wave Solder Optimizer

Ron Hollandsworth

Mon, 07 Jul 97 09:28:50 -0500

51 lines

New Thread

Wave: Airknife

Wave: Airknife

Lainie Loveless

Wed, 16 Jul 97 17:17:25

63 lines

New Thread

[Fwd: Alloy 42]

[Fwd: Alloy 42]

Bogdan Gaby

Tue, 15 Jul 1997 14:33:34 -0700

66 lines

New Thread

[Fwd: Mousebites/divots]

Re: [Fwd: Mousebites/divots]

David Arivett

Tue, 1 Jul 1997 08:36:46 -0500 (CDT)

121 lines

Re: [Fwd: Mousebites/divots]

Roland Jaquet

Tue, 1 Jul 1997 10:36:02 +0200

127 lines

Re: [Fwd: Mousebites/divots]

Paul A Galatis

Tue, 1 Jul 1997 12:24:11 -0500

85 lines

New Thread

[Fwd: Via Current ratings]

[Fwd: Via Current ratings]

Donna Perry

Wed, 23 Jul 1997 05:38:37 -0700

60 lines

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