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July 1997


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Table of Contents:

"Delayed dalamination" (4 messages)
"Delayed Delamination" (1 message)
"Delayed" delamination (1 message)
(Fwd) DIP packaging (1 message)
(Fwd) Slide Lines or Conveyors?? (1 message)
(no subject) (1 message)
98' IPC Events (2 messages)
Adhesive Guidelines (1 message)
ADMIN: IPC's Move to More Powerful Mail List Software (1 message)
ADMIN:For your information (1 message)
ADMIN:Unwelcome advertisement. (1 message)
ALLOY 42 (2 messages)
Any one help? (2 messages)
ARTICLE - When a Ground Is Not a Ground Article (1 message)
ASS: Wave Solder 0805 bridging (2 messages)
ASSEM (2 messages)
ASSEM organic passivation (1 message)
assem:Oxydation arrest paper (2 messages)
Assembly-IC Vendor LOGOS (2 messages)
Assembly: Torsion Tester Quest (1 message)
ASSY (De-soldering tools) (4 messages)
ASSY - Water soluble solder pastes and component bake (3 messages)
ASSY- Encapsulant/underfill (3 messages)
ASSY: BGA Mounting (3 messages)
Assy: D-Pak Tape and Reel orientation (1 message)
ASSY: EE Evaluation Engineering (2 messages)
Assy: equipment needed (1 message)
ASSY: feeders (1 message)
ASSY: MIL-P-13949H (1 message)
ASSY: MIL-S-13949H (2 messages)
Assy: mini-wave (1 message)
ASSY: Nickel Beryllium (2 messages)
ASSY: Probe/Contact failures (1 message)
Assy: Rigid-Flex Thermal Processing (2 messages)
ASSY: Sn43/Pb43/Bi14 solder (2 messages)
ASSY: Solderpaste samples (2 messages)
Assy: Temporary Spot Solder Mask (1 message)
ASSY: TUBE HOLDERS (1 message)
ASSY: Wave Solder Optimizer (4 messages)
ASSY: Wavesoldering questions... (fwd) (1 message)
ASSY:PCB/heatsink lamination (3 messages)
ASSY:Wave Solder (4 messages)
Axial Bulk Feeders (1 message)
Bar Coding / Job Tracking (4 messages)
Bare PCB packaging (1 message)
BGA and Paste-Insert-Reflow (3 messages)
BGA and Pin-in-Paste (3 messages)
BGA Question (2 messages)
BGA Re-balling (5 messages)
BGA Re-balling -Reply (1 message)
BGA sphere attach. (1 message)
Biocide, no formaldehyde. (4 messages)
Boards with hard gold and electroless Ni-Au (2 messages)
Bonding Tools! (1 message)
Cadence Allegro on IBM rs6000 (AIX) (1 message)
Carbon ink vs. gold - ink vs. mesh/foil (3 messages)
Castalated vs Full Face Terminations (1 message)
Chemicals for AOI ? (2 messages)
cleaning /rework of osp packs (1 message)
Conductor design rule (1 message)
Conformal Coat: Masking (5 messages)
Contact of Dynaco? (1 message)
Continuous monitoring system (1 message)
Copper and Phosphate (1 message)
Copper thickness (3 messages)
Creep resistance of solder (2 messages)
Cu Foil Grain size (3 messages)
Decapping ICs (4 messages)
DECAPPING WITHOUT DAMAGING THE SILVER LAYER (3 messages)
DES (5 messages)
DES : Question About Power Density Capabilities of PCB's (2 messages)
Des: Design check list (3 messages)
Des: Design check list -Reply (1 message)
DES: High Cycle Fatigue Properties of Solder (1 message)
DES: Pads (2 messages)
DES: Panelisation (1 message)
DES: panelization (1 message)
DES: RF layout reqmts (1 message)
Des: Tented Vias (6 messages)
DES: tented vias(2) (1 message)
DES: Thermal Conductivity (2 messages)
DES: Thermal Vias (4 messages)
DES: Via Inductance (2 messages)
DES:Conductor design rule (3 messages)
DES:FR-4 Thermal Conductivity (4 messages)
DES:thru via current capability (1 message)
Design check list (1 message)
Dielectric constant of FR4 - tempera (1 message)
Dielectric constant of FR4 - temperature (1 message)
Dielectric constant of FR4 - temperature dependency (1 message)
DIP packaging (2 messages)
Drill Chart (1 message)
Drill Chart.... (1 message)
Drilling Backup Material (1 message)
Dry Film Rework (1 message)
Dummy Die (2 messages)
Electrically operated "Hot air oven" (1 message)
Electrically operated "Hot air oven" (fwd) (1 message)
Electroless Nickel and Immersion Gold (4 messages)
Electroless Nickle and Immersion Gold (2 messages)
Electrostatic dissipative (1 message)
Electrostatic dissipative f (1 message)
Embedded Components. (1 message)
ESD ground vs Electrical ground (9 messages)
Etcher Pressure Setting (3 messages)
FAB (1 message)
FAB : tented vias (2 messages)
FAB- (1 message)
Fab/Assy: Thermal Vias (3 messages)
Fab/Assy: Thermal Vias: REPLY (1 message)
FAB: charts of standard drill sizes (1 message)
FAB: Coefficients of Thermal Expansion (1 message)
FAB: Controller for Oxide (1 message)
FAB: Copper Peelers (4 messages)
FAB: Copper plating Tensile and Elongation (3 messages)
FAB: Excellon LPG2001 Photoplotter (1 message)
FAB: FR4 exotherm & rheology (2 messages)
FAB: Getek Material (2 messages)
FAB: Gold plating (1 message)
FAB: Immersion Au as solderable surface/SPECS (1 message)
FAB: Inner-Layer Scaling Factors (2 messages)
Fab: Innerlayer cleanliness/Fine lines&Spaces (4 messages)
Fab: non-symmetrical stackups (3 messages)
FAB: Padless vs. Padded (4 messages)
FAB: Re: Black oxide and wedge voiding (1 message)
FAB: Re: Pink ring and hard failures (2 messages)
FAB: Reliability of blind and buried vias. (1 message)
FAB: reverse pulse plating (1 message)
Fab: Rivets in the lamination press (2 messages)
FAB: Robber Bars and More (2 messages)
FAB: Silkscreen (1 message)
FAB: Software for Lab Analysis Management (2 messages)
Fab: soldermask capability (1 message)
Fab: soldermask capability REPLY (2 messages)
FAB: Soldermask Residue - SERA (5 messages)
FAB: Taconic Tac-Lam (1 message)
FAB: Taconic-Tac-Lam (2 messages)
FAB: Ultrasonic Vibrators (1 message)
FAB: Unsupported vs. Supported (1 message)
Fab:RE oxide controller (1 message)
Fabrication Specs (2 messages)
Flex (8 messages)
Flex Circuit Info (2 messages)
Flux Classification (2 messages)
Flux Survey? (2 messages)
Forums (2 messages)
Frosty board edges. (1 message)
FW: "Luis Rivera" <[log in to unmask]>: FAB: Software for Lab Analysis Management (2 messages)
Fw: :Your information (2 messages)
FW: BGA and Pin-in-Paste (1 message)
FW: BGA sphere attach. (1 message)
Fw: Chemicals for AOI (1 message)
FW: Electrostatic dissipative (1 message)
FW: GTEL records (1 message)
FW: Solder Dispensing Valve and Controller (1 message)
FW: [log in to unmask]: RE: FAB: Silkscreen (1 message)
Fwd(1): Re: Mechanism of Wedge Void Formation (2 messages)
fwd: Bare PCB packaging (1 message)
Fwd: FAB: Re: Pink ring and hard failures (2 messages)
Fwd: Fab:RE oxide controller (1 message)
fwd: Re: RF Design (1 message)
FWD: Re: Tensile strength/elongation (1 message)
FWD:Re: polyimide flexible jumper (1 message)
GEN-cost analysis and model (1 message)
GEN: Cab Maestro (1 message)
GEN: Electrical Ground or Earth Ground? (2 messages)
GEN: ESD Flooring Pros/Cons (5 messages)
GEN: IPC spec for HDI (1 message)
GEN: SMOBC vs Reflower Tin/Lead (4 messages)
GEN: Technical Paper (1 message)
General: 3rd Ann. Ala. Adv. Tech. Seminar (1 message)
Glue (2 messages)
Gold - copper diffusion (1 message)
Gold / Silver Incompatibility for Adhesives (4 messages)
Gold peel after solder level (5 messages)
HASL Finish (1 message)
Help..Need Some Resources (1 message)
High Cycle Fatigue Properties of Solder (1 message)
Hole Fill (1 message)
HPGL2 conversion software (7 messages)
hull cell (3 messages)
Idents and HASL (1 message)
IEC Specs (2 messages)
IN-CLOSING: Padless vs. Padded (2 messages)
IONIC TESTING (6 messages)
IPC National Conference: Organic High Density Interconnect (1 message)
IPC PWB SURFACE FINISHES CONFERENCE (3 messages)
IPC spec for Flip Chip (2 messages)
IPC-B-24 Test Boards (2 messages)
IPC-D-275 Requirements (2 messages)
IPCchat session announcement (3 messages)
ISO certification (3 messages)
ISO-Net (1 message)
John Treiber Company (1 message)
John Treiber Company. (3 messages)
July 1 (1 message)
Koax plating (1 message)
Lackey Sanding Service (2 messages)
landless via (1 message)
line width ,space (2 messages)
Market Research Data (1 message)
MATERIALS: Prepreg info needed (1 message)
Mechanism of Wedge Void Formation (10 messages)
Message for Steve O'Hara, HP (1 message)
minimum hole size (1 message)
Mixed Technologie SMD-Soldering + COB (2 messages)
Motherboard (1 message)
Need RF Fab/Assy house (1 message)
North Texas Chapter ~ IPC Designers Council Meeting August 7th (2 messages)
OFHC copper (4 messages)
Oxidation arrest paper (1 message)
oxide controller (1 message)
Oxide Post Bake (6 messages)
Oxide skips (3 messages)
Oxydation arrest paper (8 messages)
Panelization (3 messages)
Panelization - Thks (1 message)
Part II: Mechanism of Wedge Void Formation (5 messages)
PCB Equipment manufacturer (1 message)
PCB rework cycles (2 messages)
PCB Training Course (1 message)
placement machine evaluation (1 message)
placement system (1 message)
PLANARITY (1 message)
please remove request (1 message)
polyimide flexible jumper (2 messages)
polyimide flexible jumper -Reply (1 message)
Power Symbols (3 messages)
PPM Defect Counting (9 messages)
PPM Defects Project (1 message)
Printed Info on Flexible Circuit Manufacturing (3 messages)
Pwb Design Service (1 message)
PWB OEM Incoming Inspection (2 messages)
PWB trace cut sealing (5 messages)
Re [2]: Re: Fab: Innerlayer cleanliness/Fine lines&Spaces (1 message)
Re(2): Decapping ICs (1 message)
Re2: PPM Defect Counting> more thoughts (1 message)
Re: Pink ring and hard failures (1 message)
Reflow oven temperature (7 messages)
Reliability of Solder Mask Defined Lands (1 message)
Removal of Dunlop Glue (Rubber base glue) (1 message)
Remove prepreg (3 messages)
Replay : Barcoding / Job Tracking (1 message)
Reply to "what is via tenting?" (1 message)
Reply [3] - Solder compatibility (1 message)
Reply:Wave and BGA (1 message)
REQUIRED...Ink Mixer/Stirrer (1 message)
REWORK: BGA adaptors (1 message)
REWORK: BGA adaptors -Reply (1 message)
Re[2]: Bar Coding / Job Tracking (1 message)
Re[2]: LPISM Stripping (1 message)
Re[2]: Mechanism of Wedge Void Formation (9 messages)
Re[2]: Rigid-flex technologies (1 message)
Re[2]: Solder Mask Residue (1 message)
Re[5]: Mechanism of Wedge Void Formation (2 messages)
Re[6]: Mechanism of Wedge Void Formation (1 message)
Rigid-flex technologies (3 messages)
Rigid-Flex Technology (1 message)
ROUTED EDGE QUALITY (3 messages)
Second hand machine (1 message)
Second hand/Refurbished equipment (1 message)
SHORTS AT ELEVATED TEMPERATURE IN DOUBLE SIDE BOARDS. (4 messages)
Silkscreen (5 messages)
Silkscreen -Reply (3 messages)
Smallest standard label size (1 message)
SMT Assy Equipment (1 message)
Solder Balls (3 messages)
Solder compatibility (10 messages)
Solder Dispensing Valve and Controller (3 messages)
Solder Expert (2 messages)
Solder joint design rules (3 messages)
Solder Joint Reliability (1 message)
Solder Mask Residue (6 messages)
Solder Recovery Systems (1 message)
Solderability Tests for PCBs (7 messages)
Soldering silver on brass (5 messages)
SOLDERING TO PLATINUM (2 messages)
Sources of Universal Equipment (1 message)
Standard Lab Conditions (1 message)
Standard PCB/PWB Trace Width's (4 messages)
Standard PCB/PWB Trace Width's -Reply (1 message)
Standard PCB/PWB Trace Withd's (2 messages)
Strip tin-lead (2 messages)
supplier for screens (2 messages)
Surface prep prior to solder mask (1 message)
Targets and Film (6 messages)
TechNet Forum (2 messages)
TechNet-d Digest V97 #423 (1 message)
TechNet-d Digest V97 #428 (1 message)
Temporary spot mask (1 message)
Temporary Spot Solder Mask (5 messages)
Tensile strength/elongation (1 message)
Test and Inspection Strategy (3 messages)
Test Die for SMD Reliability Testing (3 messages)
Test die for SMD reliability. (1 message)
Test probes for gold fingers (1 message)
Test Strategy (1 message)
Thanks For All The Flex Circuit Info (1 message)
Thermal concerns in the assembly of BGA designs (1 message)
Thermal considerations in BGA design (1 message)
Through Hole Solder Joint Performance (1 message)
TMRC/AMRC Archive (1 message)
Trace & Space Width (1 message)
U.V. cure of L.P.I. soldermasks (3 messages)
Ultrasonic Vibrators (2 messages)
Unidentified subject! (11 messages)
Urgently need 3M Fluorad FC-725 conformal coat material (1 message)
Use of SMD shields for shielding pre reflow (ASSEM) (4 messages)
Using the Technet Exploder (2 messages)
Vacations (1 message)
vacuum lamination (2 messages)
vapor honing (5 messages)
Vendors for oxide treatment on copper laminates (1 message)
Via hole/pad size (1 message)
Via Inductance (2 messages)
Voltage Breakdown of materials (1 message)
Voltage Breakdowns of Resins (1 message)
Want Electrovert Cleaner (1 message)
Wave and BGA (5 messages)
Wave Solder Optimizer (1 message)
Wave: Airknife (1 message)
[Fwd: Alloy 42] (1 message)
[Fwd: Mousebites/divots] (3 messages)
[Fwd: Via Current ratings] (1 message)

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Subject Sorted by Subject, Chronologically

From

Date

Size

New Thread

"Delayed dalamination"

Re: "Delayed dalamination"

Orna and Yehuda <[log in to unmask]>

Thu, 24 Jul 1997 06:05:12 +0300

65 lines

RE: "Delayed dalamination"

Andrew J. Scholand <[log in to unmask]>

Sun, 27 Jul 1997 02:35:32 -0400

124 lines

Re: "Delayed dalamination"

Orna and Yehuda <[log in to unmask]>

Mon, 28 Jul 1997 22:45:38 +0300

52 lines

RE: "Delayed dalamination"

LES CONNALLY <[log in to unmask]>

Wed, 30 Jul 1997 12:37:03 -0700

156 lines

New Thread

"Delayed Delamination"

"Delayed Delamination"

Kasprzak, Bill (esd) US <[log in to unmask]>

Mon, 21 Jul 97 07:35:00 PDT

68 lines

New Thread

"Delayed" delamination

"Delayed" delamination

Orna and Yehuda <[log in to unmask]>

Fri, 18 Jul 1997 15:43:07 +0300

55 lines

New Thread

(Fwd) DIP packaging

(Fwd) DIP packaging

Lainie Loveless <[log in to unmask]>

Thu, 17 Jul 97 16:47:06

70 lines

New Thread

(Fwd) Slide Lines or Conveyors??

(Fwd) Slide Lines or Conveyors??

Keith Birchfield <[log in to unmask]>

Thu, 24 Jul 1997 11:25:16 +0000

80 lines

New Thread

(no subject)

RE: (no subject)

Alderete, Michael <[log in to unmask]>

Wed, 16 Jul 1997 12:09:47 -0700

107 lines

New Thread

98' IPC Events

98' IPC Events

Baker,Kelly <[log in to unmask]>

Tue, 29 Jul 1997 13:35:04 -0400

36 lines

Re: 98' IPC Events

Mike Buetow <[log in to unmask]>

Tue, 29 Jul 1997 13:07:24 -0500 (CDT)

63 lines

New Thread

Adhesive Guidelines

Adhesive Guidelines

Denis Meloche <[log in to unmask]>

Thu, 31 Jul 1997 11:35:13 -0400

50 lines

New Thread

ADMIN: IPC's Move to More Powerful Mail List Software

ADMIN: IPC's Move to More Powerful Mail List Software

Dmitriy Sklyar <[log in to unmask]>

Fri, 25 Jul 1997 16:58:07 -0500

70 lines

New Thread

ADMIN:For your information

ADMIN:For your information

Dmitriy Sklyar <[log in to unmask]>

Mon, 28 Jul 1997 10:48:35 -0500

54 lines

New Thread

ADMIN:Unwelcome advertisement.

ADMIN:Unwelcome advertisement.

Dmitriy Sklyar <[log in to unmask]>

Mon, 28 Jul 1997 09:37:56 -0500

55 lines

New Thread

ALLOY 42

ALLOY 42

Gabriela Bogdan <[log in to unmask]>

Fri, 18 Jul 1997 19:35:21 +0000

50 lines

RE: ALLOY 42

Max Bernhardt <[log in to unmask]>

Tue, 22 Jul 1997 07:20:00 -0500

79 lines

New Thread

Any one help?

Any one help?

tetz schemm <[log in to unmask]>

Thu, 03 Jul 1997 00:10:01 PDT

67 lines

Re: Any one help?

[log in to unmask]

Mon, 7 Jul 1997 00:02:04 -0400 (EDT)

48 lines

New Thread

ARTICLE - When a Ground Is Not a Ground Article

ARTICLE - When a Ground Is Not a Ground Article

[log in to unmask]

Wed, 30 Jul 1997 09:41:19 -0500

289 lines

New Thread

ASS: Wave Solder 0805 bridging

ASS: Wave Solder 0805 bridging

Nachbor, Suzanne (MN51) <[log in to unmask]>

Fri, 18 Jul 97 11:44:00 PDT

46 lines

Re: ASS: Wave Solder 0805 bridging

Poh Kong Hui <[log in to unmask]>

Mon, 21 Jul 1997 23:32:41 +0800 (SST)

65 lines

New Thread

ASSEM

ASSEM

peter dahlen <[log in to unmask]>

Tue, 08 Jul 1997 14:41:36 +0000

72 lines

RE: ASSEM

Valladares, Hector A (FL51) <[log in to unmask]>

Tue, 8 Jul 1997 12:53:37 -0400

115 lines

New Thread

ASSEM organic passivation

Re: ASSEM organic passivation

peter dahlen <[log in to unmask]>

Thu, 10 Jul 1997 09:18:16 +0000

143 lines

New Thread

assem:Oxydation arrest paper

assem:Oxydation arrest paper

Marie-Jose Lambert (Marie-Jose Lambert Marie-Jose Lambert) <[log in to unmask]>

Mon, 21 Jul 1997 12:21:50 -0300

50 lines

Re: assem:Oxydation arrest paper

Duane B. Mahnke <[log in to unmask]>

Mon, 21 Jul 1997 19:45:00 -0700

103 lines

New Thread

Assembly-IC Vendor LOGOS

Assembly-IC Vendor LOGOS

[log in to unmask]

Tue, 22 Jul 97 08:43:30 PST8

45 lines

Re: Assembly-IC Vendor LOGOS

Stew Benedict <[log in to unmask]>

Wed, 23 Jul 1997 02:21:08 -0700 (PDT)

69 lines

New Thread

Assembly: Torsion Tester Quest

Assembly: Torsion Tester Quest

[log in to unmask]

Tue, 01 Jul 97 07:58:15 cst

46 lines

New Thread

ASSY (De-soldering tools)

Re: ASSY (De-soldering tools)

Tom Hybiske <[log in to unmask]>

Wed, 09 Jul 97 16:13:22

43 lines

Re: ASSY (De-soldering tools)

[log in to unmask]

Wed, 9 Jul 1997 16:21:14 -0500

84 lines

Re: ASSY (De-soldering tools)

Phil Bavaro <[log in to unmask]>

Wed, 9 Jul 1997 17:54:35 -0800

86 lines

Re: ASSY (De-soldering tools)

Denis Meloche <[log in to unmask]>

Thu, 10 Jul 1997 11:24:18 -0400

75 lines

New Thread

ASSY - Water soluble solder pastes and component bake

ASSY - Water soluble solder pastes and component bake

Patrick Ducas <[log in to unmask]>

Wed, 30 Jul 1997 10:34:50 -0400

66 lines

Re: ASSY - Water soluble solder pastes and component bake

Charles Elliott <[log in to unmask]>

30 Jul 1997 12:01:32 U

133 lines

Re: ASSY - Water soluble solder pastes and component bake

[log in to unmask]

Thu, 31 Jul 1997 09:42:38 -0400 (EDT)

104 lines

New Thread

ASSY- Encapsulant/underfill

ASSY- Encapsulant/underfill

Charles Elliott <[log in to unmask]>

11 Jul 1997 11:40:43 U

54 lines

Re: ASSY- Encapsulant/underfill

Brian Hyde <[log in to unmask]>

Tue, 15 Jul 97 10:53:10 EDT

82 lines

Re: ASSY- Encapsulant/underfill

[log in to unmask]

Tue, 15 Jul 1997 21:54:12 -0400 (EDT)

61 lines

New Thread

ASSY: BGA Mounting

ASSY: BGA Mounting

Christy Graham <[log in to unmask]>

Mon, 21 Jul 1997 16:41:29 -0800

48 lines

Re: ASSY: BGA Mounting

Gary Woodford <[log in to unmask]>

Tue, 22 Jul 1997 07:23:13 +0100

54 lines

ASSY: BGA Mounting

Jim Herard <[log in to unmask]>

Tue, 22 Jul 1997 07:22:40 -0400

89 lines

New Thread

Assy: D-Pak Tape and Reel orientation

Assy: D-Pak Tape and Reel orientation

Mark W. Spitnale <[log in to unmask]>

Tue, 01 Jul 1997 14:05:54 -0500

49 lines

New Thread

ASSY: EE Evaluation Engineering

ASSY: EE Evaluation Engineering

[log in to unmask]

Sun, 27 Jul 1997 21:29:57 -0500

43 lines

Re: ASSY: EE Evaluation Engineering

[log in to unmask]

Mon, 28 Jul 1997 08:00:20 -0500

65 lines

New Thread

Assy: equipment needed

Assy: equipment needed

Blanchet,Richard <[log in to unmask]>

Tue, 01 Jul 1997 08:14:00 -0400 (EDT)

47 lines

New Thread

ASSY: feeders

ASSY: feeders

Blanchet,Richard <[log in to unmask]>

Mon, 28 Jul 1997 09:09:00 -0400 (EDT)

42 lines

New Thread

ASSY: MIL-P-13949H

ASSY: MIL-P-13949H

[log in to unmask]

Mon, 28 Jul 97 9:43:13 PDT

45 lines

New Thread

ASSY: MIL-S-13949H

ASSY: MIL-S-13949H

[log in to unmask]

Mon, 28 Jul 97 14:39:34 PDT

45 lines

Re: ASSY: MIL-S-13949H

David Bergman <[log in to unmask]>

Sun, 3 Aug 1997 21:53:38 -0500 (CDT)

80 lines

New Thread

Assy: mini-wave

Assy: mini-wave

Blanchet,Richard <[log in to unmask]>

Wed, 09 Jul 1997 11:19:00 -0400 (EDT)

43 lines

New Thread

ASSY: Nickel Beryllium

ASSY: Nickel Beryllium

Poh Kong Hui <[log in to unmask]>

Wed, 30 Jul 1997 07:00:52 +0800 (SST)

43 lines

ASSY: Nickel Beryllium

Poh Kong Hui <[log in to unmask]>

Fri, 1 Aug 1997 23:45:32 +0800 (SST)

43 lines

New Thread

ASSY: Probe/Contact failures

ASSY: Probe/Contact failures

[log in to unmask]

Tue, 1 Jul 1997 15:28:24 -0500

48 lines

New Thread

Assy: Rigid-Flex Thermal Processing

Assy: Rigid-Flex Thermal Processing

Ploughman, Mark <[log in to unmask]>

Wed, 16 Jul 97 12:05:04

59 lines

Re: Assy: Rigid-Flex Thermal Processing

Frank Hinojos <[log in to unmask]>

Wed, 16 Jul 1997 13:40:10 -0700

86 lines

New Thread

ASSY: Sn43/Pb43/Bi14 solder

ASSY: Sn43/Pb43/Bi14 solder

Patrick Ducas <[log in to unmask]>

Wed, 09 Jul 1997 09:27:04 -0400

67 lines

Re: ASSY: Sn43/Pb43/Bi14 solder

[log in to unmask]

Thu, 10 Jul 97 10:24:43 cst

101 lines

New Thread

ASSY: Solderpaste samples

ASSY: Solderpaste samples

[log in to unmask]

Mon, 28 Jul 1997 15:54:50 -0500

47 lines

Re: ASSY: Solderpaste samples

[log in to unmask]

Tue, 29 Jul 97 06:56:30 cst

73 lines

New Thread

Assy: Temporary Spot Solder Mask

Re: Assy: Temporary Spot Solder Mask

Jerry Cupples <[log in to unmask]>

Wed, 23 Jul 1997 13:11:21 -0500

63 lines

New Thread

ASSY: TUBE HOLDERS

ASSY: TUBE HOLDERS

Steve Quinn <[log in to unmask]>

Tue, 1 Jul 1997 09:26:28 -0500 (CDT)

46 lines

New Thread

ASSY: Wave Solder Optimizer

ASSY: Wave Solder Optimizer

Vickie Chapman <[log in to unmask]>

Tue, 1 Jul 1997 13:24:00 -0700

45 lines

Re: ASSY: Wave Solder Optimizer

Rob Williams <[log in to unmask]>

Wed, 02 Jul 1997 08:04:01 -0500

90 lines

RE: ASSY: Wave Solder Optimizer

Lepsche, Thomas G (NM75) <[log in to unmask]>

Wed, 2 Jul 1997 11:10:46 -0600

66 lines

RE: ASSY: Wave Solder Optimizer

Vickie Chapman <[log in to unmask]>

Wed, 2 Jul 1997 12:42:17 -0700

127 lines

New Thread

ASSY: Wavesoldering questions... (fwd)

ASSY: Wavesoldering questions... (fwd)

Vickie Chapman <[log in to unmask]>

Mon, 7 Jul 1997 08:55:39 -0700

72 lines

New Thread

ASSY:PCB/heatsink lamination

ASSY:PCB/heatsink lamination

Devitt, Ken <[log in to unmask]>

Tue, 22 Jul 1997 10:12:05 -0400

48 lines

RE: ASSY:PCB/heatsink lamination

ADAMS, Mike <"LI/LIAUROR2/ADAMSM%Lucas Aerospace"@[log in to unmask]>

Tue, 22 Jul 1997 11:10:55 -0400 (EDT)

115 lines

Re: ASSY:PCB/heatsink lamination

David Anderson <[log in to unmask]>

Tue, 22 Jul 1997 10:10:24 -0500

63 lines

New Thread

ASSY:Wave Solder

ASSY:Wave Solder

[log in to unmask]

Fri, 11 Jul 97 14:45:54

60 lines

Re: ASSY:Wave Solder

Aric J Parr <[log in to unmask]>

Fri, 11 Jul 1997 08:07:51 -0500

91 lines

Re: ASSY:Wave Solder

Poh Kong Hui <[log in to unmask]>

Sun, 13 Jul 1997 16:56:56 +0800 (SST)

102 lines

Re: ASSY:Wave Solder

[log in to unmask]

Tue, 15 Jul 1997 08:41:28 +0900

50 lines

New Thread

Axial Bulk Feeders

Axial Bulk Feeders

Challoner, Scott <[log in to unmask]>

Thu, 17 Jul 97 16:34:00 CDT

37 lines

New Thread

Bar Coding / Job Tracking

Bar Coding / Job Tracking

[log in to unmask]

Mon, 7 Jul 1997 10:30:26 -0400 (EDT)

47 lines

Re: Bar Coding / Job Tracking

drilbert <[log in to unmask]>

Mon, 07 Jul 1997 19:50:26 -0700

67 lines

Re[2]: Bar Coding / Job Tracking

bob smith <[log in to unmask]>

Tue, 08 Jul 97 08:46:07

104 lines

Re: Bar Coding / Job Tracking

Alan Berni <[log in to unmask]>

Wed, 9 Jul 1997 10:03:24 -0400

59 lines

New Thread

Bare PCB packaging

RE: Bare PCB packaging

Ed Cosper <[log in to unmask]>

Mon, 14 Jul 1997 17:04:33 -0500

101 lines

New Thread

BGA and Paste-Insert-Reflow

BGA and Paste-Insert-Reflow

Steve Siu <[log in to unmask]>

Thu, 24 Jul 1997 17:01:57 -0800

50 lines

Re: BGA and Paste-Insert-Reflow

Jeffery L. Hempton <[log in to unmask]>

Fri, 25 Jul 1997 06:33:23 -0500

68 lines

Re[2]: BGA and Paste-Insert-Reflow

[log in to unmask]

Fri, 25 Jul 97 08:43:48 -0500

98 lines

New Thread

BGA and Pin-in-Paste

BGA and Pin-in-Paste

Steve Siu <[log in to unmask]>

Wed, 30 Jul 1997 12:52:57 -0800

61 lines

Re: BGA and Pin-in-Paste

Jack Crawford <[log in to unmask]>

Thu, 31 Jul 1997 08:18:52 -0500 (CDT)

82 lines

Re: BGA and Pin-in-Paste

[log in to unmask]

Thu, 31 Jul 1997 09:42:40 -0400 (EDT)

49 lines

New Thread

BGA Question

BGA Question

rob starr <[log in to unmask]>

Wed, 9 Jul 1997 16:00:29 -0700

52 lines

RE: BGA Question

Alderete, Michael <[log in to unmask]>

Wed, 09 Jul 1997 16:37:28 -0700

118 lines

New Thread

BGA Re-balling

BGA Re-balling

Michael J. Marks <[log in to unmask]>

Mon, 07 Jul 1997 18:53:02 -0400

38 lines

RE: BGA Re-balling

Alderete, Michael <[log in to unmask]>

Mon, 07 Jul 1997 17:51:18 -0700

112 lines

Re: BGA Re-balling

[log in to unmask]

Mon, 7 Jul 1997 22:57:26 -0400 (EDT)

40 lines

Re: BGA Re-balling

Allen Hertz <[log in to unmask]>

Tue, 08 Jul 97 08:27:36 EST

70 lines

Re: BGA Re-balling

Greg Bartlett <[log in to unmask]>

8 Jul 1997 08:32:47 -0400

98 lines

New Thread

BGA Re-balling -Reply

BGA Re-balling -Reply

Marshall Canaday <[log in to unmask]>

Tue, 08 Jul 1997 08:42:21 -0400

45 lines

New Thread

BGA sphere attach.

re: BGA sphere attach.

Alderete, Michael <[log in to unmask]>

Tue, 08 Jul 1997 06:24:45 -0700

75 lines

New Thread

Biocide, no formaldehyde.

Biocide, no formaldehyde.

Dan Brandler <[log in to unmask]>

Thu, 17 Jul 1997 09:07:25 -0700

49 lines

Re: Biocide, no formaldehyde.

Aric J Parr <[log in to unmask]>

Thu, 17 Jul 1997 14:03:45 -0500

69 lines

Re: Biocide, no formaldehyde.

[log in to unmask]

Thu, 17 Jul 97 15:37:59 PST

69 lines

Re: Biocide, no formaldehyde.

[log in to unmask]

Fri, 18 Jul 97 13:04:55 cst

118 lines

New Thread

Boards with hard gold and electroless Ni-Au

Boards with hard gold and electroless Ni-Au

B.S.Krishna <[log in to unmask]>

Mon, 28 Jul 1997 17:56:53 +0500

56 lines

Re: Boards with hard gold and electroless Ni-Au

Afri Singh <[log in to unmask]>

Tue, 29 Jul 1997 20:37:11 -0400 (EDT)

76 lines

New Thread

Bonding Tools!

Bonding Tools!

Patrick Ducas <[log in to unmask]>

Wed, 16 Jul 1997 09:13:29 -0400

95 lines

New Thread

Cadence Allegro on IBM rs6000 (AIX)

Cadence Allegro on IBM rs6000 (AIX)

[log in to unmask]

Tue, 29 Jul 1997 14:22:50 -0700

44 lines

New Thread

Carbon ink vs. gold - ink vs. mesh/foil

Carbon ink vs. gold - ink vs. mesh/foil

Gregg Klawson <[log in to unmask]>

Tue, 29 Jul 1997 07:54:36 -0400

55 lines

Re: Carbon ink vs. gold - ink vs. mesh/foil

72030,3271 <[log in to unmask]>

29 Jul 97 08:58:16 EDT

34 lines

Re: Carbon ink vs. gold - ink vs. mesh/foil

Michael Barmuta <[log in to unmask]>

Tue, 29 Jul 1997 09:30:46 -0700

104 lines

New Thread

Castalated vs Full Face Terminations

Castalated vs Full Face Terminations

[log in to unmask]

Mon, 21 Jul 1997 16:31:02 -0500

54 lines

New Thread

Chemicals for AOI ?

Re: Chemicals for AOI ?

Jan Thuesen <[log in to unmask]>

Fri, 11 Jul 1997 13:26:57 +0200

87 lines

Re: Chemicals for AOI ?

Scott B. Westheimer <[log in to unmask]>

Fri, 11 Jul 1997 21:04:27 +0800

127 lines

New Thread

cleaning /rework of osp packs

cleaning /rework of osp packs

Baruch Schifman <[log in to unmask]>

Wed, 30 Jul 1997 18:31:28 +0300

60 lines

New Thread

Conductor design rule

Conductor design rule

[log in to unmask]

Thu, 10 Jul 97 19:03:02 -0400

45 lines

New Thread

Conformal Coat: Masking

Conformal Coat: Masking

Lainie Loveless <[log in to unmask]>

Wed, 09 Jul 97 14:42:32

49 lines

Re: Conformal Coat: Masking

Aric J Parr <[log in to unmask]>

Wed, 9 Jul 1997 15:28:20 -0500

72 lines

re: Conformal Coat: Masking

[log in to unmask]

Wed, 9 Jul 97 15:53:50 EDT

175 lines

Re: Conformal Coat: Masking

Mark Shandley <[log in to unmask]>

Thu, 10 Jul 1997 09:41:48 -0500

71 lines

Re[2]: Conformal Coat: Masking

[log in to unmask]

Sat, 12 Jul 97 10:41:47 -0500

85 lines

New Thread

Contact of Dynaco?

Contact of Dynaco?

[log in to unmask]

Fri, 25 Jul 97 09:00:19 MDT

36 lines

New Thread

Continuous monitoring system

Continuous monitoring system

Lim Teong Kheng <[log in to unmask]>

Fri, 25 Jul 1997 21:24:12 +0800

40 lines

New Thread

Copper and Phosphate

Re: Copper and Phosphate

[log in to unmask]

Tue, 1 Jul 1997 09:00:07 -0400 (EDT)

65 lines

New Thread

Copper thickness

Copper thickness

Anthony Wong <[log in to unmask]>

Thu, 10 Jul 1997 19:54:11 -0400

42 lines

Re: Copper thickness

[log in to unmask]

Fri, 11 Jul 1997 09:59:18 +0800

39 lines

RE: Copper thickness

[log in to unmask]

Fri, 11 Jul 1997 7:53:17 +0000

65 lines

New Thread

Creep resistance of solder

Creep resistance of solder

Denis Meloche <[log in to unmask]>

Wed, 23 Jul 1997 14:05:24 -0400

44 lines

Re: Creep resistance of solder

[log in to unmask]

Thu, 24 Jul 97 13:27:05 cst

80 lines

New Thread

Cu Foil Grain size

Cu Foil Grain size

[log in to unmask]

Tue, 22 Jul 1997 15:34:10 +0800

57 lines

Re: Cu Foil Grain size

[log in to unmask]

Tue, 22 Jul 97 07:40:02 PST

83 lines

Re: Cu Foil Grain size

David Hoover <[log in to unmask]>

Tue, 22 Jul 1997 18:26:07 -0700

93 lines

New Thread

Decapping ICs

Decapping ICs

Joseph Fjelstad <[log in to unmask]>

Tue, 15 Jul 1997 09:47:57 -0700

57 lines

Re: Decapping ICs

Bogdan Gaby <[log in to unmask]>

Wed, 16 Jul 1997 09:31:55 -0700

93 lines

Re(2): Decapping ICs

Sheila Smith <[log in to unmask]>

Wed, 16 Jul 1997 08:36:00 -0400 (EDT)

113 lines

Re[2]: Decapping ICs

Frank Hinojos <[log in to unmask]>

Wed, 16 Jul 1997 10:05:44 -0700

130 lines

New Thread

DECAPPING WITHOUT DAMAGING THE SILVER LAYER

DECAPPING WITHOUT DAMAGING THE SILVER LAYER

Mohd Misri-RSB019 <[log in to unmask]>

Wed, 23 Jul 1997 15:58:00 -0500

56 lines

Re: DECAPPING WITHOUT DAMAGING THE SILVER LAYER

Sheila Smith <[log in to unmask]>

Wed, 23 Jul 1997 15:28:55 -0400 (EDT)

79 lines

DECAPPING WITHOUT DAMAGING THE SILVER LAYER

Nik Tajuddin-RKU939 <[log in to unmask]>

Thu, 24 Jul 1997 9:45:00 -0500

70 lines

New Thread

DES

DES

Jason R Witt <[log in to unmask]>

Wed, 23 Jul 97 7:11:05 EDT

43 lines

DES

Jason R Witt <[log in to unmask]>

Wed, 23 Jul 97 8:19:32 EDT

43 lines

RE: DES

Jim Marsico 516-595-5879 <[log in to unmask]>

Wed, 23 Jul 1997 14:37:00 -0400 (EDT)

64 lines

DES

Kasprzak, Bill (esd) US <[log in to unmask]>

Thu, 24 Jul 97 13:52:00 PDT

62 lines

Re: DES

[log in to unmask]

Fri, 25 Jul 1997 09:59:49 -0400 (EDT)

39 lines

New Thread

DES : Question About Power Density Capabilities of PCB's

DES : Question About Power Density Capabilities of PCB's

Jeff Fries <[log in to unmask]>

Wed, 16 Jul 1997 09:57:24 -0500

89 lines

Re: DES : Question About Power Density Capabilities of PCB's

Frank Hinojos <[log in to unmask]>

Wed, 16 Jul 1997 12:53:41 -0700

134 lines

New Thread

Des: Design check list

Des: Design check list

Steve Collins <[log in to unmask]>

Wed, 2 Jul 1997 07:41:41 -0600

47 lines

Re: Des: Design check list

JoAnn Amerson <[log in to unmask]>

Wed, 2 Jul 1997 12:53:27 +0000

57 lines

Re: Des: Design check list

Dan Ratcliff 813-530-8762 <[log in to unmask]>

Mon, 07 Jul 1997 09:57:05 -0400

97 lines

New Thread

Des: Design check list -Reply

Re: Des: Design check list -Reply

Jeff McGlaughlin <[log in to unmask]>

Wed, 02 Jul 1997 13:53:08 -0400

65 lines

New Thread

DES: High Cycle Fatigue Properties of Solder

Re: DES: High Cycle Fatigue Properties of Solder

D.C.Whalley <[log in to unmask]>

Thu, 10 Jul 1997 11:03:48 -0400

80 lines

New Thread

DES: Pads

DES: Pads

Steve Collins <[log in to unmask]>

Thu, 24 Jul 1997 13:35:48 -0600

53 lines

Re: DES: Pads

Frank Hinojos <[log in to unmask]>

Mon, 28 Jul 1997 16:57:55 -0700

79 lines

New Thread

DES: Panelisation

DES: Panelisation

Poh Kong Hui <[log in to unmask]>

Mon, 21 Jul 1997 23:28:02 +0800 (SST)

46 lines

New Thread

DES: panelization

DES: panelization

Larry Morse <[log in to unmask]>

Sat, 22 Feb 1997 09:52:52 -0800

66 lines

New Thread

DES: RF layout reqmts

DES: RF layout reqmts

Donna Perry <[log in to unmask]>

Tue, 22 Jul 1997 02:14:18 -0700

48 lines

New Thread

Des: Tented Vias

Des: Tented Vias

Steve Collins <[log in to unmask]>

Wed, 16 Jul 1997 06:46:52 -0600

53 lines

Re: Des: Tented Vias

[log in to unmask]

Wed, 16 Jul 1997 09:00:11 -0400 (EDT)

43 lines

RE: DES: tented vias

[log in to unmask]

Wed, 16 Jul 97 21:41:14 EST

54 lines

Re: DES: tented vias

Jeff Seeger <[log in to unmask]>

Thu, 17 Jul 1997 11:42:18 -0400

63 lines

RE: DES: tented vias

Jim Herard <[log in to unmask]>

Thu, 17 Jul 1997 11:57:30 -0400

86 lines

RE: DES: tented vias

Robert Welch <[log in to unmask]>

Thu, 17 Jul 1997 16:07:28 +0000

50 lines

New Thread

DES: tented vias(2)

RE: DES: tented vias(2)

[log in to unmask]

Thu, 17 Jul 97 14:31:33 EST

46 lines

New Thread

DES: Thermal Conductivity

DES: Thermal Conductivity

[log in to unmask]

Wed, 23 Jul 1997 11:16:57 -0700

59 lines

Re: DES: Thermal Conductivity

Sheila Smith <[log in to unmask]>

Thu, 24 Jul 1997 08:22:54 -0400 (EDT)

94 lines

New Thread

DES: Thermal Vias

DES: Thermal Vias

Urry, John @ SLG <[log in to unmask]>

Mon, 21 Jul 97 15:09:00 mdt

46 lines

Re: DES: Thermal Vias

Mitch Morey <[log in to unmask]>

Mon, 21 Jul 1997 14:51:58 -0700

76 lines

DES: Thermal Vias

Urry, John @ SLG <[log in to unmask]>

Mon, 21 Jul 97 16:26:00 mdt

46 lines

Re: DES: Thermal Vias

Paul Gould <[log in to unmask]>

Wed, 23 Jul 1997 08:14:11 +0100

64 lines

New Thread

DES: Via Inductance

DES: Via Inductance

Jack Olson <[log in to unmask]>

Thu, 31 Jul 1997 09:51:56 -0700

49 lines

Re: DES: Via Inductance

Andy Burkhardt <[log in to unmask]>

Fri, 1 Aug 1997 16:04:30 +0100

83 lines

New Thread

DES:Conductor design rule

DES:Conductor design rule

[log in to unmask]

Wed, 16 Jul 97 16:39:57 -0400

100 lines

DES:Conductor design rule

[log in to unmask]

Thu, 17 Jul 97 15:17:40 -0400

57 lines

Re: DES:Conductor design rule

Jeff Seeger <[log in to unmask]>

Thu, 17 Jul 1997 16:29:23 -0400

66 lines

New Thread

DES:FR-4 Thermal Conductivity

DES:FR-4 Thermal Conductivity

[log in to unmask]

Tue, 22 Jul 1997 14:05:06 -0700

49 lines

Re: DES:FR-4 Thermal Conductivity

Frank Hinojos <[log in to unmask]>

Tue, 22 Jul 1997 14:48:41 -0700

76 lines

DES:FR-4 Thermal Conductivity

Michael Alderete <[log in to unmask]>

Tue, 22 Jul 1997 18:19:22 -0700

135 lines

Re: DES:FR-4 Thermal Conductivity

Andrew J. Scholand <[log in to unmask]>

Wed, 23 Jul 1997 00:55:02 -0400

80 lines

New Thread

DES:thru via current capability

DES:thru via current capability

Donna Perry <[log in to unmask]>

Wed, 23 Jul 1997 21:54:57 -0700

43 lines

New Thread

Design check list

RE: Design check list

Eubanks, Phil (Phillip K) <[log in to unmask]>

Tue, 8 Jul 1997 11:47:29 -0500

82 lines

New Thread

Dielectric constant of FR4 - tempera

RE: Dielectric constant of FR4 - tempera

[log in to unmask]

Wed, 16 Jul 1997 8:27:23 +0000

76 lines

New Thread

Dielectric constant of FR4 - temperature

RE: Dielectric constant of FR4 - temperature

[log in to unmask]

Wed, 16 Jul 97 8:28:56 PDT

72 lines

New Thread

Dielectric constant of FR4 - temperature dependency

Dielectric constant of FR4 - temperature dependency

Walther Bach <[log in to unmask]>

Tue, 15 Jul 1997 14:19:08 -0400

47 lines

New Thread

DIP packaging

DIP packaging

Benjamin A Guthrie <[log in to unmask]>

Thu, 17 Jul 1997 08:58:48 -0500

70 lines

Re: DIP packaging

Mark Shandley <[log in to unmask]>

Thu, 17 Jul 1997 15:29:19 -0500

92 lines

New Thread

Drill Chart

Drill Chart

Lyle Dove (GCA Tech Support) <[log in to unmask]>

Tue, 29 Jul 1997 15:44:56

50 lines

New Thread

Drill Chart....

Drill Chart....

Lyle Dove (GCA Tech Support) <[log in to unmask]>

Tue, 29 Jul 1997 19:32:16

187 lines

New Thread

Drilling Backup Material

Re: Drilling Backup Material

drilbert <[log in to unmask]>

Fri, 25 Jul 1997 23:29:03 -0700

50 lines

New Thread

Dry Film Rework

Dry Film Rework

scott birnbaum <[log in to unmask]>

Fri, 18 Jul 97 16:41:47 PDT

48 lines

New Thread

Dummy Die

Re: Dummy Die

[log in to unmask]

Thu, 17 Jul 1997 16:30:45 +0800

45 lines

Re: Dummy Die

Denis Meloche <[log in to unmask]>

Thu, 17 Jul 1997 09:40:43 -0400

75 lines

New Thread

Electrically operated "Hot air oven"

Electrically operated "Hot air oven"

H.N.Muralidhara <[log in to unmask]>

Sat, 12 Jul 1997 15:03:11 +0530 (IST)

96 lines

New Thread

Electrically operated "Hot air oven" (fwd)

Electrically operated "Hot air oven" (fwd)

H.N.Muralidhara <[log in to unmask]>

Sat, 12 Jul 1997 15:33:33 +0530 (IST)

112 lines

New Thread

Electroless Nickel and Immersion Gold

Electroless Nickel and Immersion Gold

Jim Herard <[log in to unmask]>

Thu, 10 Jul 1997 18:28:14 -0400

104 lines

Re: Electroless Nickel and Immersion Gold

PERARO_DJ <[log in to unmask]>

Fri, 11 Jul 1997 08:23:28 -0400

132 lines

Re: Electroless Nickel and Immersion Gold

[log in to unmask]

Fri, 11 Jul 1997 09:16:35 -0400 (EDT)

49 lines

Re: Electroless Nickel and Immersion Gold

Sam Pirayesh <[log in to unmask]>

Fri, 11 Jul 1997 12:51:20 -0700

123 lines

New Thread

Electroless Nickle and Immersion Gold

Electroless Nickle and Immersion Gold

Sam Pirayesh <[log in to unmask]>

Thu, 10 Jul 1997 07:41:14 -0700

47 lines

RE: Electroless Nickle and Immersion Gold

Max Bernhardt <[log in to unmask]>

Thu, 10 Jul 1997 09:15:00 -0500

85 lines

New Thread

Electrostatic dissipative

Re: Electrostatic dissipative

[log in to unmask]

Thu, 31 Jul 1997 08:05:35 -0400 (EDT)

54 lines

New Thread

Electrostatic dissipative f

Electrostatic dissipative f

JOHN OSULLIVAN <[log in to unmask]>

31 Jul 1997 07:51:50 -0400

44 lines

New Thread

Embedded Components.

Embedded Components.

Tom Johnson <[log in to unmask]>

Tue, 22 Jul 1997 08:32:11 -0700

49 lines

New Thread

ESD ground vs Electrical ground

ESD ground vs Electrical ground

Lim Teong Kheng <[log in to unmask]>

Fri, 25 Jul 1997 21:17:53 +0800

40 lines

ESD ground vs Electrical ground

Lim Teong Kheng <[log in to unmask]>

Fri, 25 Jul 1997 21:27:50 +0800

40 lines

Re: ESD ground vs Electrical ground

[log in to unmask]

Fri, 25 Jul 1997 09:16:46 -0500

67 lines

Re: ESD ground vs Electrical ground

Doug McKean <[log in to unmask]>

Fri, 25 Jul 1997 10:24:58 -0400

89 lines

Re: ESD ground vs Electrical ground

Stuart Chessen <[log in to unmask]>

Fri, 25 Jul 1997 08:09:42 -0700

69 lines

Re: ESD ground vs Electrical ground

[log in to unmask]

Fri, 25 Jul 1997 10:50:06 -0600

78 lines

Re: ESD ground vs Electrical ground

Doug McKean <[log in to unmask]>

Fri, 25 Jul 1997 17:53:34 -0400

88 lines

ESD ground vs Electrical ground

Lim Teong Kheng <[log in to unmask]>

Sat, 26 Jul 1997 12:55:39 +0800

59 lines

Re: ESD ground vs Electrical ground

Steve Mikell <[log in to unmask]>

Sat, 26 Jul 1997 11:04:29 -0500 (CDT)

76 lines

New Thread

Etcher Pressure Setting

Etcher Pressure Setting

tgyee <[log in to unmask]>

Tue, 15 Jul 97 09:54:56 PST

39 lines

Re: Etcher Pressure Setting

[log in to unmask]

Tue, 15 Jul 1997 09:43:40 -0500

153 lines

Re[2]: Etcher Pressure Setting

tgyee <[log in to unmask]>

Wed, 16 Jul 97 11:33:56 PST

71 lines

New Thread

FAB

FAB

Dejan <[log in to unmask]>

Mon, 21 Jul 1997 09:07:57 -0700

44 lines

New Thread

FAB : tented vias

FAB : tented vias

Engineering / Design Dept. <[log in to unmask]>

Wed, 16 Jul 1997 09:33:36 -0700

41 lines

RE: FAB : tented vias

Kenny, James <[log in to unmask]>

Wed, 16 Jul 1997 9:44 -0800

70 lines

New Thread

FAB-

FAB-

Bill Chou <[log in to unmask]>

25 Jul 1997 13:20:27 -0800

51 lines

New Thread

Fab/Assy: Thermal Vias

Fab/Assy: Thermal Vias

[log in to unmask]

Thu, 31 Jul 97 8:24:09 PDT

48 lines

Re: Fab/Assy: Thermal Vias

Aric J Parr <[log in to unmask]>

Thu, 31 Jul 1997 13:00:53 -0500

70 lines

Re: Fab/Assy: Thermal Vias

[log in to unmask]

Fri, 1 Aug 97 10:33:23 +0200

105 lines

New Thread

Fab/Assy: Thermal Vias: REPLY

Fab/Assy: Thermal Vias: REPLY

Jim Herard <[log in to unmask]>

Thu, 31 Jul 1997 18:16:36 -0400

97 lines

New Thread

FAB: charts of standard drill sizes

FAB: charts of standard drill sizes

Jeff Seeger <[log in to unmask]>

Tue, 15 Jul 1997 19:30:19 -0400

50 lines

New Thread

FAB: Coefficients of Thermal Expansion

FAB: Coefficients of Thermal Expansion

Ploughman, Mark <[log in to unmask]>

Thu, 31 Jul 97 20:08:25

46 lines

New Thread

FAB: Controller for Oxide

FAB: Controller for Oxide

Frederick Bonaventure <[log in to unmask]>

Wed, 23 Jul 1997 18:39:37 -0400

56 lines

New Thread

FAB: Copper Peelers

FAB: Copper Peelers

[log in to unmask]

Thu, 17 Jul 1997 09:01:24 -0400 (EDT)

42 lines

Re: FAB: Copper Peelers

[log in to unmask]

Thu, 17 Jul 1997 18:57:20 -0400 (EDT)

45 lines

Re: FAB: Copper Peelers

[log in to unmask]

Fri, 18 Jul 1997 10:27:48 -0400 (EDT)

44 lines

Re: FAB: Copper Peelers

[log in to unmask]

Fri, 18 Jul 1997 18:38:30 -0400 (EDT)

59 lines

New Thread

FAB: Copper plating Tensile and Elongation

FAB: Copper plating Tensile and Elongation

Edwards, Ted A (AZ75) <[log in to unmask]>

29 Jul 1997 09:13:46 -0500

65 lines

Re: FAB: Copper plating Tensile and Elongation

Ted Stern <[log in to unmask]>

Tue, 29 Jul 1997 13:54:45 -0700

94 lines

Re[2]: FAB: Copper plating Tensile and Elongation

PHONG NGUYEN <[log in to unmask]>

Tue, 29 Jul 97 18:16:44 PST

97 lines

New Thread

FAB: Excellon LPG2001 Photoplotter

FAB: Excellon LPG2001 Photoplotter

John Parsons <[log in to unmask]>

Fri, 4 Jul 1997 11:33:18 +0000

50 lines

New Thread

FAB: FR4 exotherm & rheology

FAB: FR4 exotherm & rheology

J.Felts <[log in to unmask]>

Wed, 16 Jul 1997 00:05:12 -0700

45 lines

FAB: FR4 exotherm & rheology

J.Felts <[log in to unmask]>

Thu, 17 Jul 1997 11:02:43 -0700

46 lines

New Thread

FAB: Getek Material

FAB: Getek Material

[log in to unmask]

Wed, 23 Jul 97 17:19:01 -0700

44 lines

Re: FAB: Getek Material

Frank Hinojos <[log in to unmask]>

Wed, 23 Jul 1997 18:37:41 -0700

71 lines

New Thread

FAB: Gold plating

FAB: Gold plating

Joe Lee <[log in to unmask]>

Sat, 5 Jul 1997 20:32:17 -0700

44 lines

New Thread

FAB: Immersion Au as solderable surface/SPECS

FAB: Immersion Au as solderable surface/SPECS

Jim Herard <[log in to unmask]>

Mon, 28 Jul 1997 19:02:38 -0400

64 lines

New Thread

FAB: Inner-Layer Scaling Factors

FAB: Inner-Layer Scaling Factors

[log in to unmask]

Thu, 17 Jul 1997 13:39:28 -0400 (EDT)

50 lines

Re: FAB: Inner-Layer Scaling Factors

Tomer_2 <[log in to unmask]>

Sun, 20 Jul 1997 16:48:21 +0000

100 lines

New Thread

Fab: Innerlayer cleanliness/Fine lines&Spaces

Fab: Innerlayer cleanliness/Fine lines&Spaces

Nachbor, Suzanne (MN51) <[log in to unmask]>

Mon, 21 Jul 97 12:09:00 PDT

44 lines

Re: Fab: Innerlayer cleanliness/Fine lines&Spaces

[log in to unmask]

Mon, 21 Jul 97 11:21:18 MST

78 lines

Re: Fab: Innerlayer cleanliness/Fine lines&Spaces

[log in to unmask]

Mon, 21 Jul 1997 14:11:58 -0400 (EDT)

47 lines

Re: Fab: Innerlayer cleanliness/Fine lines&Spaces

[log in to unmask]

Mon, 21 Jul 1997 16:14:09 -0400 (EDT)

36 lines

New Thread

Fab: non-symmetrical stackups

Fab: non-symmetrical stackups

Jeff Seeger <[log in to unmask]>

Wed, 09 Jul 1997 18:15:20 -0400

65 lines

Re:Fab: non-symmetrical stackups

Jeffrey McGlaughlin (Jeff McGlaughlin) <[log in to unmask]>

Thu, 10 Jul 1997 07:56:46 -0400

65 lines

Re: Fab: non-symmetrical stackups

[log in to unmask]

Fri, 11 Jul 1997 07:46:43 -0400 (EDT)

47 lines

New Thread

FAB: Padless vs. Padded

FAB: Padless vs. Padded

[log in to unmask]

Tue, 15 Jul 1997 15:32:42 -0500

56 lines

Re: FAB: Padless vs. Padded

Lyle Dove (GCA Tech Support) <[log in to unmask]>

Tue, 15 Jul 1997 15:37:15

101 lines

Re: FAB: Padless vs. Padded

[log in to unmask]

Tue, 15 Jul 1997 21:52:34 -0400 (EDT)

57 lines

RE: FAB: Padless vs. Padded

[log in to unmask]

Wed, 16 Jul 97 21:56:49 EST

45 lines

New Thread

FAB: Re: Black oxide and wedge voiding

FAB: Re: Black oxide and wedge voiding

Orna and Yehuda <[log in to unmask]>

Fri, 18 Jul 1997 20:02:09 +0300

53 lines

New Thread

FAB: Re: Pink ring and hard failures

FAB: Re: Pink ring and hard failures

Mike Buetow <[log in to unmask]>

Fri, 18 Jul 1997 11:45:35 -0500 (CDT)

99 lines

Re: FAB: Re: Pink ring and hard failures

[log in to unmask]

Fri, 25 Jul 1997 10:42:17 -0400 (EDT)

37 lines

New Thread

FAB: Reliability of blind and buried vias.

FAB: Reliability of blind and buried vias.

[log in to unmask]

Wed, 16 Jul 1997 10:38:52 +0100

61 lines

New Thread

FAB: reverse pulse plating

FAB: reverse pulse plating

[log in to unmask]

Thu, 3 Jul 1997 10:13:18 -0400 (EDT)

46 lines

New Thread

Fab: Rivets in the lamination press

Fab: Rivets in the lamination press

Jonathan Whitcomb (757-1326) <[log in to unmask]>

Fri, 25 Jul 97 12:00:18 EDT

61 lines

Re: Fab: Rivets in the lamination press

[log in to unmask]

Fri, 25 Jul 97 17:23:14 MST

114 lines

New Thread

FAB: Robber Bars and More

FAB: Robber Bars and More

Taylor Michelle Bodziak <[log in to unmask]>

Wed, 30 Jul 1997 19:32:00 -0400

50 lines

Re: FAB: Robber Bars and More

[log in to unmask]

Thu, 31 Jul 1997 09:24:21 -0400 (EDT)

36 lines

New Thread

FAB: Silkscreen

RE: FAB: Silkscreen

[log in to unmask]

Tue, 08 Jul 97 22:25:31 EST

52 lines

New Thread

FAB: Software for Lab Analysis Management

FAB: Software for Lab Analysis Management

Luis Rivera <[log in to unmask]>

Wed, 2 Jul 1997 07:45:58 -0600 CDT

59 lines

Re: FAB: Software for Lab Analysis Management

John Grosso <[log in to unmask]>

Wed, 2 Jul 1997 10:09:17 -0400

56 lines

New Thread

Fab: soldermask capability

Fab: soldermask capability

GeoFranck <[log in to unmask]>

Tue, 29 Jul 1997 08:54:07 -0400

53 lines

New Thread

Fab: soldermask capability REPLY

Fab: soldermask capability REPLY

Jim Herard <[log in to unmask]>

Wed, 30 Jul 1997 07:53:36 -0400

94 lines

Re: Fab: soldermask capability REPLY

[log in to unmask]

Wed, 30 Jul 1997 17:47:54 -0400 (EDT)

34 lines

New Thread

FAB: Soldermask Residue - SERA

FAB: Soldermask Residue - SERA

[log in to unmask]

Wed, 23 Jul 1997 15:53:22 -0500

66 lines

re: FAB: Soldermask Residue - SERA

LES CONNALLY <[log in to unmask]>

Thu, 24 Jul 1997 10:23:46 -0700

99 lines

Re: FAB: Soldermask Residue - SERA

Robert Welch <[log in to unmask]>

Thu, 24 Jul 1997 13:48:30 +0000

56 lines

Re: FAB: Soldermask Residue - SERA

[log in to unmask]

Thu, 24 Jul 97 14:08:07 cst

103 lines

Re: FAB: Soldermask Residue - SERA

[log in to unmask]

Mon, 28 Jul 1997 17:48:53 -0400 (EDT)

43 lines

New Thread

FAB: Taconic Tac-Lam

Re: FAB: Taconic Tac-Lam

Orna and Yehuda <[log in to unmask]>

Fri, 1 Aug 1997 12:51:24 +0300

46 lines

New Thread

FAB: Taconic-Tac-Lam

FAB: Taconic-Tac-Lam

Ploughman, Mark <[log in to unmask]>

Thu, 31 Jul 97 12:02:23

47 lines

Re: FAB: Taconic-Tac-Lam

[log in to unmask]

Thu, 31 Jul 97 14:56:10 PST

75 lines

New Thread

FAB: Ultrasonic Vibrators

FAB: Ultrasonic Vibrators

[log in to unmask]

Wed, 30 Jul 1997 23:35:03 GMT

45 lines

New Thread

FAB: Unsupported vs. Supported

FAB: Unsupported vs. Supported

[log in to unmask]

Tue, 15 Jul 1997 14:23:40 -0500

51 lines

New Thread

Fab:RE oxide controller

Fab:RE oxide controller

DAVID MANDER <[log in to unmask]>

Thu, 24 Jul 1997 14:49:46, -0500

43 lines

New Thread

Fabrication Specs

Fabrication Specs

[log in to unmask]

Thu, 31 Jul 97 11:03:01 EDT

47 lines

Re: Fabrication Specs

Mike Buetow <[log in to unmask]>

Thu, 31 Jul 1997 10:04:05 -0500 (CDT)

67 lines

New Thread

Flex

Flex

TIMOTHY C CABLES <[log in to unmask]>

Wed, 23 Jul 1997 10:18:23 -0400

53 lines

Re: Flex

[log in to unmask]

Wed, 23 Jul 1997 08:29:25 -0700

38 lines

Re: Flex

ROY PRATT <[log in to unmask]>

Wed, 23 Jul 1997 11:59:39 PST

73 lines

Re: Flex

Peter McGrath <[log in to unmask]>

Thu, 24 Jul 1997 11:22:40 -0700

39 lines

Re: Flex

[log in to unmask]

Wed, 23 Jul 97 17:26:40 -0700

87 lines

Re: Flex

Joel Yocom <[log in to unmask]>

Thu, 24 Jul 1997 08:04:41 +0000

41 lines

Re: Flex

Daniel, John <[log in to unmask]>

Thu, 24 Jul 1997 13:44:23 -0400

38 lines

FLEX

TIMOTHY C CABLES <[log in to unmask]>

Thu, 24 Jul 1997 15:52:31 -0400

45 lines

New Thread

Flex Circuit Info

Flex Circuit Info

Phil Culpovich <[log in to unmask]>

Mon, 21 Jul 1997 10:16:46 -0700

51 lines

Re: Flex Circuit Info

KoizumiT <[log in to unmask]>

Tue, 22 Jul 97 21:33:13 JST

69 lines

New Thread

Flux Classification

Flux Classification

Denis Meloche <[log in to unmask]>

Wed, 30 Jul 1997 09:23:36 -0400

45 lines

Re: Flux Classification

Mike Buetow <[log in to unmask]>

Wed, 30 Jul 1997 08:19:24 -0500 (CDT)

74 lines

New Thread

Flux Survey?

Flux Survey?

Jeff Orlando <[log in to unmask]>

Wed, 23 Jul 1997 12:22:57 +0000

44 lines

Re: Flux Survey?

Peter Swanson <[log in to unmask]>

Wed, 23 Jul 1997 20:40:39 GMT

56 lines

New Thread

Forums

Forums

JOHN OSULLIVAN <[log in to unmask]>

1 Aug 1997 13:06:38 -0400

44 lines

Re: Forums

Neil Diamond <[log in to unmask]>

Fri, 01 Aug 1997 10:52:42 -0500

72 lines

New Thread

Frosty board edges.

Frosty board edges.

David Taylor <[log in to unmask]>

Tue, 1 Jul 1997 15:19:30 +1000

53 lines

New Thread

FW: "Luis Rivera" <[log in to unmask]>: FAB: Software for Lab Analysis Management

FW: "Luis Rivera" <[log in to unmask]>: FAB: Software for Lab Analysis Management

[log in to unmask]

Wed, 02 Jul 1997 09:38:04 GMT

118 lines

Re: FW: "Luis Rivera" <[log in to unmask]>: FAB: Software for Lab Analysis Management

Joel Fillion <[log in to unmask]>

Sun, 20 Jul 1997 16:20:18 -0700

262 lines

New Thread

Fw: :Your information

Fw: :Your information

李 淑 姿 <[log in to unmask]>

Wed, 30 Jul 1997 13:44:47 +0800

41 lines

Fw: :Your information

李 淑 姿 <[log in to unmask]>

Wed, 30 Jul 1997 14:37:53 +0800

57 lines

New Thread

FW: BGA and Pin-in-Paste

FW: BGA and Pin-in-Paste

Dhawan, Ashok <[log in to unmask]>

Fri, 1 Aug 1997 16:01:01 -0000

92 lines

New Thread

FW: BGA sphere attach.

FW: BGA sphere attach.

Alderete, Michael <[log in to unmask]>

Wed, 09 Jul 1997 12:27:13 -0700

149 lines

New Thread

Fw: Chemicals for AOI

Fw: Chemicals for AOI

Kuwako, Fujio(MMS) <[log in to unmask]>

Fri, 11 Jul 1997 15:36:08 +0900

43 lines

New Thread

FW: Electrostatic dissipative

FW: Electrostatic dissipative

Blanchet,Richard <[log in to unmask]>

Thu, 31 Jul 1997 08:47:00 -0400 (EDT)

85 lines

New Thread

FW: GTEL records

FW: GTEL records

Andrew J. Scholand <[log in to unmask]>

Thu, 24 Jul 1997 23:00:57 -0400

92 lines

New Thread

FW: Solder Dispensing Valve and Controller

FW: Solder Dispensing Valve and Controller

Dhawan, Ashok CA-WINPO2 <[log in to unmask]>

Fri, 18 Jul 97 01:07:00 GMT

88 lines

New Thread

FW: [log in to unmask]: RE: FAB: Silkscreen

FW: [log in to unmask]: RE: FAB: Silkscreen

[log in to unmask]

Wed, 09 Jul 1997 07:53:04 GMT

117 lines

New Thread

Fwd(1): Re: Mechanism of Wedge Void Formation

Fwd(1): Re: Mechanism of Wedge Void Formation

Josep Sajut <[log in to unmask]>

Tue, 15 Jul 1997 07:31:26 -0400

97 lines

Re: Fwd(1): Re: Mechanism of Wedge Void Formation

[log in to unmask]

Tue, 15 Jul 1997 09:21:03 -0400 (EDT)

60 lines

New Thread

fwd: Bare PCB packaging

fwd: Bare PCB packaging

[log in to unmask]

14 Jul 97 09:56:39 EDT

51 lines

New Thread

Fwd: FAB: Re: Pink ring and hard failures

Fwd: FAB: Re: Pink ring and hard failures

[log in to unmask]

Tue, 22 Jul 1997 10:20:50 -0400 (EDT)

50 lines

Re: Fwd: FAB: Re: Pink ring and hard failures

Paul Gould <[log in to unmask]>

Wed, 23 Jul 1997 23:22:37 +0100

66 lines

New Thread

Fwd: Fab:RE oxide controller

Fwd: Fab:RE oxide controller

Frederick Bonaventure <[log in to unmask]>

Thu, 24 Jul 1997 17:58:56 -0400

101 lines

New Thread

fwd: Re: RF Design

fwd: Re: RF Design

Mike Wolverton <[log in to unmask]>

Wed, 2 Jul 1997 09:35:35 -0700

92 lines

New Thread

FWD: Re: Tensile strength/elongation

FWD: Re: Tensile strength/elongation

Greg Bartlett <[log in to unmask]>

01 Aug 97 09:32:03 +0000

153 lines

New Thread

FWD:Re: polyimide flexible jumper

FWD:Re: polyimide flexible jumper

Lyle Dove <[log in to unmask]>

Wed, 23 Jul 1997 11:32:59

62 lines

New Thread

GEN-cost analysis and model

GEN-cost analysis and model

Bill Chou <[log in to unmask]>

25 Jul 1997 10:53:36 -0800

55 lines

New Thread

GEN: Cab Maestro

GEN: Cab Maestro

[log in to unmask]

Fri, 18 Jul 1997 10:56:00 -0500

46 lines

New Thread

GEN: Electrical Ground or Earth Ground?

GEN: Electrical Ground or Earth Ground?

[log in to unmask]

Tue, 29 Jul 1997 14:03:06 -0500

46 lines

GEN: Electrical Ground or Earth Ground?

Kasprzak, Bill (esd) US <[log in to unmask]>

Wed, 30 Jul 97 07:42:00 PDT

45 lines

New Thread

GEN: ESD Flooring Pros/Cons

GEN: ESD Flooring Pros/Cons

[log in to unmask]

Fri, 25 Jul 1997 10:48:38 -0500

63 lines

Re:GEN: ESD Flooring Pros/Cons

[log in to unmask]

Fri, 25 Jul 1997 11:31:41 -0600

65 lines

Re: GEN: ESD Flooring Pros/Cons

Vickie Chapman <[log in to unmask]>

Fri, 25 Jul 1997 10:27:28 -0700

122 lines

Re[2]: GEN: ESD Flooring Pros/Cons

CAREY ENGLISH <[log in to unmask]>

Fri, 25 Jul 1997 12:40:58 -0500

137 lines

RE:GEN: ESD Flooring Pros/Cons

Raymond Klein <[log in to unmask]>

Fri, 25 Jul 1997 10:59:28 -0700

46 lines

New Thread

GEN: IPC spec for HDI

GEN: IPC spec for HDI

YAP CHOW LAN <[log in to unmask]>

Fri, 18 Jul 1997 18:13:34 +0800

40 lines

New Thread

GEN: SMOBC vs Reflower Tin/Lead

GEN: SMOBC vs Reflower Tin/Lead

Don Vischulis <[log in to unmask]>

Wed, 02 Jul 1997 17:45:20 -0500

54 lines

Re: GEN: SMOBC vs Reflower Tin/Lead

[log in to unmask]

Fri, 4 Jul 1997 10:04:57 -0400 (EDT)

40 lines

Re: GEN: SMOBC vs Reflower Tin/Lead

[log in to unmask]

Sun, 6 Jul 1997 03:15:38 -0400 (EDT)

69 lines

Re: GEN: SMOBC vs Reflower Tin/Lead

[log in to unmask]

Sun, 6 Jul 1997 04:55:37 -0400 (EDT)

89 lines

New Thread

GEN: Technical Paper

GEN: Technical Paper

[log in to unmask]

Tue, 1 Jul 1997 10:23:51 -0500

50 lines

New Thread

General: 3rd Ann. Ala. Adv. Tech. Seminar

General: 3rd Ann. Ala. Adv. Tech. Seminar

Alan Kreplick <[log in to unmask]>

Fri, 25 Jul 1997 07:53:22 -0400

42 lines

New Thread

Glue

Glue

Paul Stolar <[log in to unmask]>

Thu, 10 Jul 97 17:38:06 -0600

52 lines

Re: Glue

Larry Morse <[log in to unmask]>

Tue, 11 Feb 1997 10:29:55 -0800

77 lines

New Thread

Gold - copper diffusion

Gold - copper diffusion

Allan H. Reed <[log in to unmask]>

Mon, 21 Jul 1997 14:07:44 -0400 (EDT)

41 lines

New Thread

Gold / Silver Incompatibility for Adhesives

Gold / Silver Incompatibility for Adhesives

Murphy Steve (UO/ESS) <[log in to unmask]>

Thu, 31 Jul 1997 15:52:18 -0400

41 lines

Gold / Silver Incompatibility for Adhesives

Murphy Steve (UO/ESS) <[log in to unmask]>

Thu, 31 Jul 1997 15:52:18 -0400

41 lines

Re: Gold / Silver Incompatibility for Adhesives

Denis Meloche <[log in to unmask]>

Fri, 01 Aug 1997 10:32:34 -0400

71 lines

re: Gold / Silver Incompatibility for Adhesives

[log in to unmask]

Fri, 1 Aug 97 8:19:40 PDT

69 lines

New Thread

Gold peel after solder level

Gold peel after solder level

[log in to unmask]

Fri, 25 Jul 97 11:50:24 EST

40 lines

Re: Gold peel after solder level

Michael Barmuta <[log in to unmask]>

Fri, 25 Jul 1997 14:40:10 -0700

91 lines

RE: Gold peel after solder level

Andy Heidelberg <[log in to unmask]>

Fri, 25 Jul 1997 17:11:19 -0600

134 lines

Re: Gold peel after solder level

Paul Gould <[log in to unmask]>

Sat, 26 Jul 1997 08:58:55 +0100

70 lines

Re: Gold peel after solder level

Paul A Galatis <[log in to unmask]>

Sun, 27 Jul 1997 11:26:47 -0500

42 lines

New Thread

HASL Finish

HASL Finish

Maurice Dore <[log in to unmask]>

Thu, 10 Jul 1997 13:30:21 GMT

57 lines

New Thread

Help..Need Some Resources

Help..Need Some Resources

[log in to unmask]

Mon, 28 Jul 1997 16:02:59 -0500

50 lines

New Thread

High Cycle Fatigue Properties of Solder

Re: High Cycle Fatigue Properties of Solder

[log in to unmask]

Sat, 12 Jul 1997 08:45:43 -0400 (EDT)

46 lines

New Thread

Hole Fill

Hole Fill

[log in to unmask]

Tue, 29 Jul 1997 09:36:03 -0400 (EDT)

37 lines

New Thread

HPGL2 conversion software

HPGL2 conversion software

Erik Bodell <[log in to unmask]>

Thu, 31 Jul 1997 09:52:52 PST

42 lines

Re: HPGL2 conversion software

Neil Diamond <[log in to unmask]>

Thu, 31 Jul 1997 12:55:24 -0500

70 lines

Re: HPGL2 conversion software

[log in to unmask]

Thu, 31 Jul 97 11:19:57 -0700

70 lines

Re: HPGL2 conversion software

Steve Collins <[log in to unmask]>

Thu, 31 Jul 1997 12:27:21 -0600

79 lines

Re: HPGL2 conversion software

Steve Collins <[log in to unmask]>

Thu, 31 Jul 1997 12:27:21 -0600

79 lines

Re: HPGL2 conversion software

Lolmaugh, Scott (AZ15) <[log in to unmask]>

31 Jul 1997 14:42:28 -0500

94 lines

Re: HPGL2 conversion software

Steve Collins <[log in to unmask]>

Thu, 31 Jul 1997 12:27:21 -0600

79 lines

New Thread

hull cell

hull cell

Suixin Zhang <[log in to unmask]>

Fri, 4 Jul 1997 11:11:53 +0100

43 lines

Re: hull cell

[log in to unmask]

Mon, 7 Jul 1997 07:41:14 -0400 (EDT)

51 lines

Re: hull cell

Lenny Kurup <[log in to unmask]>

Mon, 7 Jul 1997 11:41:06 -0400 (EDT)

85 lines

New Thread

Idents and HASL

Re: Idents and HASL

annie laberge <[log in to unmask]>

Tue, 01 Jul 1997 08:36:45 -0400

79 lines

New Thread

IEC Specs

IEC Specs

Robert Welch <[log in to unmask]>

Wed, 16 Jul 1997 14:34:04 +0000

46 lines

Re: IEC Specs

Lynch, Lyn <[log in to unmask]>

Wed, 16 Jul 97 16:09:59

80 lines

New Thread

IN-CLOSING: Padless vs. Padded

IN-CLOSING: Padless vs. Padded

[log in to unmask]

Thu, 17 Jul 1997 18:23:23 -0500

230 lines

Re: IN-CLOSING: Padless vs. Padded

Don Vischulis <[log in to unmask]>

Fri, 18 Jul 1997 18:32:02 -0500

208 lines

New Thread

IONIC TESTING

Re: IONIC TESTING

[log in to unmask]

Sun, 6 Jul 1997 02:43:59 -0400 (EDT)

52 lines

Re: IONIC TESTING

[log in to unmask]

Tue, 8 Jul 1997 09:45:56 -0400 (EDT)

73 lines

Re: IONIC TESTING

[log in to unmask]

Wed, 9 Jul 1997 22:54:09 -0400 (EDT)

67 lines

Re: IONIC TESTING

Sheila Smith <[log in to unmask]>

Thu, 10 Jul 1997 08:29:45 -0400 (EDT)

92 lines

Re[2]: IONIC TESTING

[log in to unmask]

Fri, 11 Jul 97 07:59:25 EST

170 lines

IONIC TESTING

[log in to unmask]

Fri, 11 Jul 97 12:47:22 EST

176 lines

New Thread

IPC National Conference: Organic High Density Interconnect

IPC National Conference: Organic High Density Interconnect

John Riley <[log in to unmask]>

Fri, 18 Jul 1997 10:04:39 -0500

308 lines

New Thread

IPC PWB SURFACE FINISHES CONFERENCE

IPC PWB SURFACE FINISHES CONFERENCE

Michael Forrester <[log in to unmask]>

Tue, 29 Jul 1997 11:08:39 -0400

48 lines

RE: IPC PWB SURFACE FINISHES CONFERENCE

Lepsche, Thomas G (NM75) <[log in to unmask]>

Tue, 29 Jul 1997 09:57:29 -0600

81 lines

Re: IPC PWB SURFACE FINISHES CONFERENCE

[log in to unmask]

Tue, 29 Jul 97 11:39:25 cst

78 lines

New Thread

IPC spec for Flip Chip

IPC spec for Flip Chip

david yeh <[log in to unmask]>

Sun, 2 Jul 1995 22:37:18 +0800

49 lines

Re: IPC spec for Flip Chip

Mike Buetow <[log in to unmask]>

Wed, 2 Jul 1997 12:06:24 -0500 (CDT)

79 lines

New Thread

IPC-B-24 Test Boards

IPC-B-24 Test Boards

[log in to unmask]

Wed, 09 Jul 97 15:09:10 -0500

48 lines

Re: IPC-B-24 Test Boards

Aric J Parr <[log in to unmask]>

Wed, 9 Jul 1997 15:32:47 -0500

64 lines

New Thread

IPC-D-275 Requirements

IPC-D-275 Requirements

VOLPE, RAY <[log in to unmask]>

Fri, 18 Jul 1997 10:26:10 -0400

49 lines

Re: IPC-D-275 Requirements

Jack Olson <[log in to unmask]>

Fri, 18 Jul 1997 10:24:56 -0700

62 lines

New Thread

IPCchat session announcement

IPCchat session announcement

[log in to unmask]

Sun, 27 Jul 1997 19:02:36 -0700

61 lines

IPCchat session announcement

[log in to unmask]

Wed, 30 Jul 1997 22:41:32 -0700

60 lines

Re: IPCchat session announcement

Keith Larson <[log in to unmask]>

Thu, 31 Jul 1997 09:05:49 -0500

61 lines

New Thread

ISO certification

ISO certification

[log in to unmask]

Thu, 24 Jul 1997 10:15:36 +0400 (EDT)

39 lines

Re: ISO certification

Doug McKean <[log in to unmask]>

Thu, 24 Jul 1997 11:38:54 -0400

47 lines

RE: ISO certification

Challoner, Scott <[log in to unmask]>

Thu, 24 Jul 97 10:51:00 CDT

62 lines

New Thread

ISO-Net

ISO-Net

Baker,Kelly <[log in to unmask]>

Wed, 16 Jul 1997 08:31:05 -0400

37 lines

New Thread

John Treiber Company

John Treiber Company

Kasprzak, Bill (esd) US <[log in to unmask]>

Tue, 15 Jul 97 14:18:00 PDT

48 lines

New Thread

John Treiber Company.

John Treiber Company.

[log in to unmask]

15 Jul 97 08:09:17 EDT

37 lines

Re: John Treiber Company.

Edward J Popielarski <[log in to unmask]>

Tue, 15 Jul 1997 09:53:09 -0500 (CDT)

74 lines

RE: John Treiber Company.

[log in to unmask]

Thu, 17 Jul 1997 6:26:01 -0700

93 lines

New Thread

July 1

July 1

[log in to unmask]

Tue, 1 Jul 1997 08:49:11 -0400 (EDT)

33 lines

New Thread

Koax plating

Re: Koax plating

[log in to unmask]

Thu, 03 Jul 97 16:29:00 cst

71 lines

New Thread

Lackey Sanding Service

Lackey Sanding Service

CLIFF MADDOX <[log in to unmask]>

Wed, 02 Jul 97 11:18:13 PST

41 lines

Re: Lackey Sanding Service

[log in to unmask]

Sat, 5 Jul 1997 21:46:22 -0400 (EDT)

33 lines

New Thread

landless via

landless via

OBRIEN GERARD <[log in to unmask]>

Mon, 14 Jul 97 9:09:49 -0400

45 lines

New Thread

line width ,space

line width ,space

Radhakrishna N <[log in to unmask]>

Wed, 23 Jul 1997 19:34:57 -0700

43 lines

Re: line width ,space

[log in to unmask]

Sat, 26 Jul 1997 12:12:04 -0400 (EDT)

51 lines

New Thread

Market Research Data

Market Research Data

OMNI High Tech Industries Ltd. (OHTIL) <[log in to unmask]>

Tue, 22 Jul 1997 21:49:02 +0600

44 lines

New Thread

MATERIALS: Prepreg info needed

MATERIALS: Prepreg info needed

Duane B. Mahnke <[log in to unmask]>

Wed, 30 Jul 1997 20:53:00 -0700

51 lines

New Thread

Mechanism of Wedge Void Formation

Mechanism of Wedge Void Formation

Josep Sajut <[log in to unmask]>

Mon, 14 Jul 1997 18:06:52 -0400

49 lines

Re: Mechanism of Wedge Void Formation

tgyee <[log in to unmask]>

Tue, 15 Jul 97 09:48:51 PST

69 lines

Re: Mechanism of Wedge Void Formation

[log in to unmask]

Tue, 15 Jul 1997 06:06:19 -0400 (EDT)

44 lines

Re[2]: Mechanism of Wedge Void Formation

[log in to unmask]

Tue, 15 Jul 97 15:58:03 EST

73 lines

Re[2]: Mechanism of Wedge Void Formation

[log in to unmask]

Tue, 15 Jul 97 15:58:03 EST

73 lines

Re[3]: Mechanism of Wedge Void Formation

tgyee <[log in to unmask]>

Wed, 16 Jul 97 11:09:32 PST

104 lines

Re[4]: Mechanism of Wedge Void Formation

pgiovann <[log in to unmask]>

Wed, 16 Jul 97 02:58:05 PST

46 lines

Re[4]: Mechanism of Wedge Void Formation

[log in to unmask]

Thu, 17 Jul 97 22:13:08 cst

90 lines

Re[4]: Mechanism of Wedge Void Formation

[log in to unmask]

Fri, 18 Jul 97 13:46:02 cst

199 lines

Re[5]: Mechanism of Wedge Void Formation

tgyee <[log in to unmask]>

Mon, 21 Jul 97 10:19:18 PST

52 lines

New Thread

Message for Steve O'Hara, HP

Re: Message for Steve O'Hara, HP

[log in to unmask]

Mon, 14 Jul 1997 18:32:20 -0400 (EDT)

38 lines

New Thread

minimum hole size

minimum hole size

[log in to unmask]

Mon, 21 Jul 1997 14:16:05 -0700

40 lines

New Thread

Mixed Technologie SMD-Soldering + COB

Mixed Technologie SMD-Soldering + COB

Jeremias Michael <[log in to unmask]>

Mon, 28 Jul 1997 22:49:08 -0700

58 lines

RE: Mixed Technologie SMD-Soldering + COB

[log in to unmask]

Tue, 29 Jul 1997 08:48:28 +0100

102 lines

New Thread

Motherboard

Motherboard

Peter Wei <[log in to unmask]>

Tue, 1 Jul 1997 23:02:42 +0200

52 lines

New Thread

Need RF Fab/Assy house

Need RF Fab/Assy house

Bill Gaines B160 x2199 <[log in to unmask]>

Wed, 9 Jul 1997 08:15:29 -0700 (PDT)

54 lines

New Thread

North Texas Chapter ~ IPC Designers Council Meeting August 7th

North Texas Chapter ~ IPC Designers Council Meeting August 7th

[log in to unmask]

Wed, 23 Jul 97 17:12:47 CDT

195 lines

North Texas Chapter ~ IPC Designers Council Meeting August 7th

Keith Larson <[log in to unmask]>

Sun, 27 Jul 1997 18:41:57 -0500

162 lines

New Thread

OFHC copper

OFHC copper

Andre Bisson <[log in to unmask]>

Wed, 23 Jul 1997 14:10:31 -0300

45 lines

OFHC copper

Andre Bisson <[log in to unmask]>

Wed, 30 Jul 1997 15:32:39 -0300

43 lines

Re: OFHC copper

[log in to unmask]

Thu, 31 Jul 1997 11:26:55 -0400 (EDT)

36 lines

Re: OFHC copper

[log in to unmask]

Fri, 01 Aug 97 07:58:16 cst

69 lines

New Thread

Oxidation arrest paper

Oxidation arrest paper

[log in to unmask]

Tue, 22 Jul 1997 07:43:18 -0500

47 lines

New Thread

oxide controller

Re: oxide controller

[log in to unmask]

Fri, 25 Jul 1997 10:37:10 -0400 (EDT)

47 lines

New Thread

Oxide Post Bake

Oxide Post Bake

[log in to unmask]

Thu, 03 Jul 97 09:48:09 MST

47 lines

Re: Oxide Post Bake

Thomas E. Waznis <[log in to unmask]>

06 Jul 97 21:47:53 -0800

56 lines

Re: Oxide Post Bake

tgyee <[log in to unmask]>

Mon, 07 Jul 97 14:06:16 PST

72 lines

Re: Oxide Post Bake

[log in to unmask]

Mon, 7 Jul 1997 09:18:42 -0400 (EDT)

49 lines

Re: Oxide Post Bake

[log in to unmask]

Mon, 7 Jul 1997 09:30:25 -0400 (EDT)

51 lines

Re: Oxide Post Bake

George Wheadon <[log in to unmask]>

07 Jul 97 12:09:04 EDT

41 lines

New Thread

Oxide skips

Oxide skips

[log in to unmask]

Sat, 12 Jul 1997 19:22:34 -0400 (EDT)

49 lines

Re: Oxide skips

[log in to unmask]

Mon, 14 Jul 1997 23:34:45 -0400 (EDT)

58 lines

Re: Oxide skips

[log in to unmask]

Thu, 17 Jul 1997 11:06:20 -0400 (EDT)

40 lines

New Thread

Oxydation arrest paper

Oxydation arrest paper

Marie-Jose Lambert (Marie-Jose Lambert) <[log in to unmask]>

Mon, 21 Jul 1997 09:44:26 -0300

50 lines

Re: Oxydation arrest paper

[log in to unmask]

Mon, 21 Jul 1997 12:08:00 -0400 (EDT)

37 lines

Re: Oxydation arrest paper

[log in to unmask]

Mon, 21 Jul 1997 13:27:29 -0500

84 lines

Re[2]: Oxydation arrest paper

[log in to unmask]

Mon, 21 Jul 1997 14:44:51 -0500

76 lines

Re: Oxydation arrest paper

[log in to unmask]

Tue, 22 Jul 1997 02:03:03 -0400 (EDT)

40 lines

Re: Oxydation arrest paper

Peter Swanson <[log in to unmask]>

Tue, 22 Jul 1997 09:10:36 GMT

68 lines

Re: Oxydation arrest paper

David Hoover <[log in to unmask]>

Tue, 22 Jul 1997 18:28:34 -0700

79 lines

Re: Oxydation arrest paper

Peter Swanson <[log in to unmask]>

Wed, 23 Jul 1997 09:16:24 GMT

59 lines

New Thread

Panelization

Panelization

[log in to unmask]

Mon, 28 Jul 1997 10:16:30 +0400 (EDT)

41 lines

Re: Panelization

Jeffery L. Hempton <[log in to unmask]>

Mon, 28 Jul 1997 11:16:50 -0500

57 lines

Re: Panelization

Chuck Hahr <[log in to unmask]>

Mon, 28 Jul 1997 11:00:54 +0000

83 lines

New Thread

Panelization - Thks

Re: Panelization - Thks

Poh Kong Hui <[log in to unmask]>

Tue, 29 Jul 1997 23:54:44 +0800 (SST)

39 lines

New Thread

Part II: Mechanism of Wedge Void Formation

Part II: Mechanism of Wedge Void Formation

Josep Sajut <[log in to unmask]>

Tue, 15 Jul 1997 18:02:41 -0400

70 lines

Re: Part II: Mechanism of Wedge Void Formation

[log in to unmask]

Wed, 16 Jul 97 07:59:02 cst

107 lines

Re[2]: Part II: Mechanism of Wedge Void Formation

[log in to unmask]

Wed, 16 Jul 97 21:48:20 EST

120 lines

Re: Part II: Mechanism of Wedge Void Formation

D. Rooke <[log in to unmask]>

Thu, 17 Jul 1997 00:18:59 -0400 (EDT)

136 lines

Re[3]: Part II: Mechanism of Wedge Void Formation

[log in to unmask]

Thu, 17 Jul 97 11:12:01 cst

150 lines

New Thread

PCB Equipment manufacturer

PCB Equipment manufacturer

OMNI High Tech Industries Ltd. (OHTIL) <[log in to unmask]>

Tue, 22 Jul 1997 21:50:19 +0600

89 lines

New Thread

PCB rework cycles

PCB rework cycles

Tom Olafsson <[log in to unmask]>

Mon, 7 Jul 1997 10:51:11 -0400

44 lines

Re: PCB rework cycles

[log in to unmask]

Thu, 10 Jul 1997 16:42:18 -0400 (EDT)

46 lines

New Thread

PCB Training Course

PCB Training Course

Michael Forrester <[log in to unmask]>

Thu, 24 Jul 1997 12:11:32 -0400

51 lines

New Thread

placement machine evaluation

placement machine evaluation

[log in to unmask]

Wed, 09 Jul 97 09:18:02 CST

44 lines

New Thread

placement system

Re: placement system

[log in to unmask]

Mon, 7 Jul 1997 05:25:55 -0400

63 lines

New Thread

PLANARITY

PLANARITY

Paul Stolar <[log in to unmask]>

Thu, 10 Jul 97 17:34:44 -0600

39 lines

New Thread

please remove request

please remove request

[log in to unmask]

Thu, 10 Jul 97 09:07:38 CST

39 lines

New Thread

polyimide flexible jumper

polyimide flexible jumper

guerard <[log in to unmask]>

Tue, 22 Jul 1997 15:27:29 +0200

57 lines

Re: polyimide flexible jumper

Lyle Dove <[log in to unmask]>

Tue, 22 Jul 1997 08:44:56

107 lines

New Thread

polyimide flexible jumper -Reply

polyimide flexible jumper -Reply

David Anderson <[log in to unmask]>

Tue, 22 Jul 1997 09:58:01 -0500

78 lines

New Thread

Power Symbols

Power Symbols

[log in to unmask]

Tue, 29 Jul 1997 09:57:07 -0700

41 lines

Re: Power Symbols

JoAnn Amerson <[log in to unmask]>

Tue, 29 Jul 1997 15:02:34 +0000

53 lines

Re: Power Symbols

[log in to unmask]

Tue, 29 Jul 1997 13:05:37 -0700

73 lines

New Thread

PPM Defect Counting

PPM Defect Counting

RICK VERNON <[log in to unmask]>

Wed, 09 Jul 1997 12:33:41 -0500

49 lines

Re: PPM Defect Counting

[log in to unmask]

Wed, 09 Jul 97 15:26:32 -0500

81 lines

Re: PPM Defect Counting

Vickie Chapman <[log in to unmask]>

Wed, 9 Jul 1997 15:44:22 -0700

117 lines

PPM defect counting

Jos Aarninkhof <[log in to unmask]>

Thu, 10 Jul 1997 08:22:34 +0200

127 lines

Re: PPM Defect Counting

Mark W. Spitnale <[log in to unmask]>

Thu, 10 Jul 1997 06:22:11 -0500

89 lines

PPM defect counting

Patrick Ducas <[log in to unmask]>

Thu, 10 Jul 1997 07:45:43 -0400

190 lines

Re[2]: PPM Defect Counting

David Bruni <[log in to unmask]>

Thu, 10 Jul 97 07:56:58 -0500

160 lines

Re: PPM Defect Counting

Steve Mikell <[log in to unmask]>

Thu, 10 Jul 1997 10:19:48 -0500 (CDT)

87 lines

Re: PPM Defect Counting

Vickie Chapman <[log in to unmask]>

Thu, 10 Jul 1997 08:22:32 -0700

123 lines

New Thread

PPM Defects Project

PPM Defects Project

Jack Crawford <[log in to unmask]>

Tue, 15 Jul 1997 09:24:21 -0500

72 lines

New Thread

Printed Info on Flexible Circuit Manufacturing

Printed Info on Flexible Circuit Manufacturing

Phil Culpovich <[log in to unmask]>

Sat, 19 Jul 1997 01:53:51 -0700

49 lines

Re: Printed Info on Flexible Circuit Manufacturing

Omni High Tech Industries Ltd. (OHTIL) <[log in to unmask]>

Tue, 22 Jul 1997 18:54:20 +0600

61 lines

Re[2]: Printed Info on Flexible Circuit Manufacturing

Frank Hinojos <[log in to unmask]>

Tue, 22 Jul 1997 09:25:19 -0700

100 lines

New Thread

Pwb Design Service

Pwb Design Service

[log in to unmask]

Wed, 9 Jul 1997 09:54:33 -0400

48 lines

New Thread

PWB OEM Incoming Inspection

RE: PWB OEM Incoming Inspection

[log in to unmask]

Wed, 09 Jul 97 10:24:23 EST

61 lines

RE: PWB OEM Incoming Inspection

Ed Cosper <[log in to unmask]>

Wed, 9 Jul 1997 11:44:41 -0500

136 lines

New Thread

PWB trace cut sealing

PWB trace cut sealing

[log in to unmask]

Fri, 25 Jul 1997 10:33:26 +0000

64 lines

Re: PWB trace cut sealing

[log in to unmask]

Fri, 25 Jul 1997 15:12:45 -0600

102 lines

Re: PWB trace cut sealing

[log in to unmask]

Fri, 25 Jul 97 14:18:10 -0700

90 lines

Re: PWB trace cut sealing

Aric J Parr <[log in to unmask]>

Mon, 28 Jul 1997 08:06:07 -0500

80 lines

Re: PWB trace cut sealing

Jeffery L. Hempton <[log in to unmask]>

Mon, 28 Jul 1997 11:09:46 -0500

78 lines

New Thread

Re [2]: Re: Fab: Innerlayer cleanliness/Fine lines&Spaces

Re [2]: Re: Fab: Innerlayer cleanliness/Fine lines&Spaces

Nachbor, Suzanne (MN51) <[log in to unmask]>

Tue, 22 Jul 97 16:12:00 PDT

50 lines

New Thread

Re(2): Decapping ICs

Re: Re(2): Decapping ICs

Gregg Klawson <[log in to unmask]>

Wed, 16 Jul 1997 11:07:35 -0400

69 lines

New Thread

Re2: PPM Defect Counting> more thoughts

Re2: PPM Defect Counting> more thoughts

Steve Mikell <[log in to unmask]>

Thu, 10 Jul 1997 13:36:51 -0500 (CDT)

61 lines

New Thread

Re: Pink ring and hard failures

RE: Re: Pink ring and hard failures

Ed Cosper <[log in to unmask]>

Fri, 18 Jul 1997 16:23:44 -0500

172 lines

New Thread

Reflow oven temperature

Reflow oven temperature

[log in to unmask]

Mon, 21 Jul 97 16:24:07 PST

55 lines

RE: Reflow oven temperature

John Guy <[log in to unmask]>

Mon, 21 Jul 1997 12:39:04 -0500

109 lines

Re: Reflow oven temperature

Frank Hinojos <[log in to unmask]>

Mon, 21 Jul 1997 11:02:52 -0700

90 lines

RE: Reflow oven temperature

Andrew J. Scholand <[log in to unmask]>

Wed, 23 Jul 1997 00:54:23 -0400

95 lines

RE: Reflow oven temperature

John Guy <[log in to unmask]>

Wed, 23 Jul 1997 08:01:53 -0500

163 lines

Re: Reflow oven temperature

Jerry Cupples <[log in to unmask]>

Wed, 23 Jul 1997 11:37:50 -0500

103 lines

RE: Reflow oven temperature

Orna and Yehuda <[log in to unmask]>

Wed, 23 Jul 1997 23:17:37 +0300

63 lines

New Thread

Reliability of Solder Mask Defined Lands

Reliability of Solder Mask Defined Lands

Stephen C Joy <[log in to unmask]>

Tue, 08 Jul 97 15:01:00 PDT

35 lines

New Thread

Removal of Dunlop Glue (Rubber base glue)

Removal of Dunlop Glue (Rubber base glue)

Mohd Misri-RSB019 <[log in to unmask]>

Fri, 18 Jul 1997 8:16:00 -0500

54 lines

New Thread

Remove prepreg

Remove prepreg

Tomer_2 <[log in to unmask]>

Wed, 16 Jul 1997 09:40:13 +0000

48 lines

RE: Remove prepreg

[log in to unmask]

Wed, 16 Jul 1997 8:32:43 +0000

71 lines

Re: Remove prepreg

Jim Herard <[log in to unmask]>

Wed, 16 Jul 1997 17:34:44 -0400

75 lines

New Thread

Replay : Barcoding / Job Tracking

Replay : Barcoding / Job Tracking

Chris Gregg <[log in to unmask]>

Wed, 9 Jul 1997 11:35:41 +0100

112 lines

New Thread

Reply to "what is via tenting?"

Reply to "what is via tenting?"

Dejan <[log in to unmask]>

Wed, 16 Jul 1997 17:00:37 -0700

42 lines

New Thread

Reply [3] - Solder compatibility

Reply [3] - Solder compatibility

[log in to unmask]

Tue, 15 Jul 1997 10:16:06 -0400 (EDT)

41 lines

New Thread

Reply:Wave and BGA

Reply:Wave and BGA

Jim Herard <[log in to unmask]>

Wed, 16 Jul 1997 17:40:43 -0400

101 lines

New Thread

REQUIRED...Ink Mixer/Stirrer

REQUIRED...Ink Mixer/Stirrer

Dileep Mohan <[log in to unmask]>

Sat, 12 Jul 1997 15:40:27 +0530 (IST)

54 lines

New Thread

REWORK: BGA adaptors

REWORK: BGA adaptors

Kahu Himona <[log in to unmask]>

Wed, 23 Jul 1997 16:01:07 +1200

74 lines

New Thread

REWORK: BGA adaptors -Reply

REWORK: BGA adaptors -Reply

Jeff McGlaughlin <[log in to unmask]>

Thu, 24 Jul 1997 07:37:49 -0400

73 lines

New Thread

Re[2]: Bar Coding / Job Tracking

Re: Re[2]: Bar Coding / Job Tracking

[log in to unmask]

Tue, 8 Jul 1997 12:42:15 -0400 (EDT)

50 lines

New Thread

Re[2]: LPISM Stripping

Re: Re[2]: LPISM Stripping

[log in to unmask]

Mon, 7 Jul 1997 11:03:28 -0400 (EDT)

54 lines

New Thread

Re[2]: Mechanism of Wedge Void Formation

Re: Re[2]: Mechanism of Wedge Void Formation

Lenny Kurup <[log in to unmask]>

Wed, 16 Jul 1997 14:17:49 -0400 (EDT)

106 lines

Re: Re[2]: Mechanism of Wedge Void Formation

Goldman, Patricia J. <[log in to unmask]>

Thu, 17 Jul 97 08:32:00 PDT

176 lines

Re: Re[2]: Mechanism of Wedge Void Formation

Richard A. Schumacher <[log in to unmask]>

Thu, 17 Jul 1997 10:56:22 -0500

43 lines

Re: Re[2]: Mechanism of Wedge Void Formation

[log in to unmask]

Thu, 17 Jul 1997 18:30:14 -0400 (EDT)

41 lines

Re: Re[2]: Mechanism of Wedge Void Formation

[log in to unmask]

Thu, 17 Jul 1997 18:49:13 -0400 (EDT)

58 lines

Re: Re[2]: Mechanism of Wedge Void Formation

Lenny Kurup <[log in to unmask]>

Fri, 18 Jul 1997 09:34:32 -0400 (EDT)

209 lines

Re: Re[2]: Mechanism of Wedge Void Formation

[log in to unmask]

Fri, 18 Jul 1997 11:11:33 -0400 (EDT)

46 lines

Re: Re[2]: Mechanism of Wedge Void Formation

[log in to unmask]

Fri, 18 Jul 1997 12:40:29 -0400 (EDT)

55 lines

Re: Re[2]: Mechanism of Wedge Void Formation

Goldman, Patricia J. <[log in to unmask]>

Fri, 18 Jul 97 11:59:00 PDT

111 lines

New Thread

Re[2]: Rigid-flex technologies

Re: Re[2]: Rigid-flex technologies

Denis Meloche <[log in to unmask]>

Fri, 25 Jul 1997 13:57:54 -0400

114 lines

New Thread

Re[2]: Solder Mask Residue

Re: Re[2]: Solder Mask Residue

[log in to unmask]

Wed, 16 Jul 1997 13:40:54 -0400 (EDT)

39 lines

New Thread

Re[5]: Mechanism of Wedge Void Formation

Re: Re[5]: Mechanism of Wedge Void Formation

Lenny Kurup <[log in to unmask]>

Mon, 21 Jul 1997 12:09:05 -0400 (EDT)

82 lines

RE: Re[5]: Mechanism of Wedge Void Formation

Goldman, Patricia J. <[log in to unmask]>

Mon, 21 Jul 97 12:53:00 PDT

123 lines

New Thread

Re[6]: Mechanism of Wedge Void Formation

Re: Re[6]: Mechanism of Wedge Void Formation

[log in to unmask]

Mon, 21 Jul 1997 22:12:43 -0400 (EDT)

60 lines

New Thread

Rigid-flex technologies

Rigid-flex technologies

[log in to unmask]

Thu, 24 Jul 97 16:22:19 MDT

45 lines

Re: Rigid-flex technologies

Joel Yocom <[log in to unmask]>

Fri, 25 Jul 1997 08:06:52 +0000

63 lines

Re[2]: Rigid-flex technologies

[log in to unmask]

Fri, 25 Jul 97 10:22:22 MDT

82 lines

New Thread

Rigid-Flex Technology

Rigid-Flex Technology

Bernard Kessler & Associates LTD <[log in to unmask]>

Fri, 25 Jul 1997 12:04:06 -0400 (EDT)

41 lines

New Thread

ROUTED EDGE QUALITY

ROUTED EDGE QUALITY

George Lubbecke <[log in to unmask]>

Thu, 17 Jul 1997 12:15:53 -0700

44 lines

ROUTED EDGE QUALITY

George Lubbecke <[log in to unmask]>

Thu, 17 Jul 1997 17:49:41 -0700

54 lines

RE: ROUTED EDGE QUALITY

Ed Cosper <[log in to unmask]>

Fri, 18 Jul 1997 15:58:53 -0500

100 lines

New Thread

Second hand machine

Second hand machine

tonghh <[log in to unmask]>

Sun, 13 Jul 1997 21:09:33 +0800

53 lines

New Thread

Second hand/Refurbished equipment

Second hand/Refurbished equipment

Andrew G Kettlewell <[log in to unmask]>

Fri, 11 Jul 1997 08:27:23 -0500

62 lines

New Thread

SHORTS AT ELEVATED TEMPERATURE IN DOUBLE SIDE BOARDS.

SHORTS AT ELEVATED TEMPERATURE IN DOUBLE SIDE BOARDS.

B.R.SHASHIRAJ <[log in to unmask]>

Thu, 24 Jul 1997 18:28:41 +0500

51 lines

re: SHORTS AT ELEVATED TEMPERATURE IN DOUBLE SIDE BOARDS.

LES CONNALLY <[log in to unmask]>

Thu, 24 Jul 1997 09:29:42 -0700

92 lines

Re: SHORTS AT ELEVATED TEMPERATURE IN DOUBLE SIDE BOARDS.

Barbara Burcham <[log in to unmask]>

Thu, 24 Jul 1997 15:42:14 -0700

74 lines

Re: SHORTS AT ELEVATED TEMPERATURE IN DOUBLE SIDE BOARDS.

[log in to unmask]

Fri, 25 Jul 1997 11:37:18 -0400 (EDT)

92 lines

New Thread

Silkscreen

Silkscreen

Thomas Kropski <[log in to unmask]>

Tue, 08 Jul 1997 15:35:39 -0700

48 lines

Re: Silkscreen

JoAnn Amerson <[log in to unmask]>

Wed, 9 Jul 1997 08:44:11 +0000

66 lines

Re: Silkscreen

[log in to unmask]

Wed, 9 Jul 1997 11:52:54 -0400 (EDT)

45 lines

Re: Silkscreen

David Ricketts <[log in to unmask]>

Wed, 09 Jul 1997 12:00:24 -0700

64 lines

Re[2]: Silkscreen

Frank Hinojos <[log in to unmask]>

Wed, 9 Jul 1997 15:53:01 -0700

75 lines

New Thread

Silkscreen -Reply

Silkscreen -Reply

John Swinehart <[log in to unmask]>

Tue, 08 Jul 1997 16:17:03 -0400

50 lines

Re: Silkscreen -Reply

Andrew Buonviri <[log in to unmask]>

Tue, 8 Jul 1997 19:26:16 -0400

44 lines

Re: Silkscreen -Reply

John Swinehart <[log in to unmask]>

Wed, 09 Jul 1997 15:26:36 -0400

99 lines

New Thread

Smallest standard label size

Smallest standard label size

[log in to unmask]

Mon, 21 Jul 97 12:14:42 MDT

41 lines

New Thread

SMT Assy Equipment

Re: SMT Assy Equipment

Poh Kong Hui <[log in to unmask]>

Tue, 1 Jul 1997 07:13:04 +0800 (SST)

65 lines

New Thread

Solder Balls

Re: Solder Balls

Poh Kong Hui <[log in to unmask]>

Tue, 1 Jul 1997 07:03:33 +0800 (SST)

71 lines

Re[2]: Solder Balls

Ron Hollandsworth <[log in to unmask]>

Tue, 01 Jul 97 08:06:36 -0500

112 lines

Re: Solder Balls

Denis Meloche <[log in to unmask]>

Tue, 01 Jul 1997 09:50:13 -0400

97 lines

New Thread

Solder compatibility

Solder compatibility

[log in to unmask]

Wed, 09 Jul 1997 11:27:49 EDT

44 lines

Re: Solder compatibility

[log in to unmask]

Thu, 10 Jul 97 10:15:53 cst

74 lines

Re: Solder compatibility

[log in to unmask]

Fri, 11 Jul 1997 00:09:39 -0400 (EDT)

55 lines

Re: Solder compatibility

[log in to unmask]

Fri, 11 Jul 1997 07:46:45 -0400 (EDT)

49 lines

Re: Solder compatibility

[log in to unmask]

Fri, 11 Jul 1997 08:25:37 EDT

112 lines

Re: Solder compatibility

[log in to unmask]

Fri, 11 Jul 1997 08:59:25 -0400 (EDT)

46 lines

Re[2]: Solder compatibility

[log in to unmask]

Fri, 11 Jul 97 09:12:50 cst

90 lines

Re[2]: Solder Compatibility

[log in to unmask]

Mon, 14 Jul 1997 09:22:45 -0400 (EDT)

55 lines

Re[2]: Solder compatibility

[log in to unmask]

Mon, 14 Jul 1997 09:31:37 -0400 (EDT)

65 lines

Re[2]: Solder compatibility

[log in to unmask]

Mon, 14 Jul 1997 09:31:45 -0400 (EDT)

59 lines

New Thread

Solder Dispensing Valve and Controller

Solder Dispensing Valve and Controller

Miguel Apezteguia <[log in to unmask]>

Mon, 14 Jul 1997 12:50:07 -0600

72 lines

Solder Dispensing Valve and Controller

Miguel Apezteguia <[log in to unmask]>

Mon, 14 Jul 1997 12:50:07 -0600

72 lines

RE: Solder dispensing valve and controller

Larry Morse <[log in to unmask]>

Sat, 22 Feb 1997 09:48:15 -0800

114 lines

New Thread

Solder Expert

Solder Expert

[log in to unmask]

Mon, 14 Jul 1997 09:42:32 -0700

85 lines

Solder Expert

[log in to unmask]

Mon, 14 Jul 1997 09:49:34 -0700

43 lines

New Thread

Solder joint design rules

Solder joint design rules

[log in to unmask]

Fri, 4 Jul 97 12:09:07 +0200

87 lines

Re: Solder joint design rules

[log in to unmask]

Mon, 7 Jul 1997 07:41:20 -0400 (EDT)

67 lines

Re: Solder joint design rules

James C. Patten <[log in to unmask]>

Mon, 7 Jul 97 11:04:00 PDT

99 lines

New Thread

Solder Joint Reliability

Solder Joint Reliability

Krawczyk, Russ <[log in to unmask]>

Wed, 16 Jul 1997 10:43:26 -0500

57 lines

New Thread

Solder Mask Residue

Solder Mask Residue

Cambridge Electronics Corp. - Marketing Dept. <[log in to unmask]>

Tue, 15 Jul 1997 19:25:28 +0800

60 lines

Re: Solder Mask Residue

[log in to unmask]

Tue, 15 Jul 97 08:02:10 -0800

84 lines

Re: Solder Mask Residue

[log in to unmask]

Tue, 15 Jul 1997 09:22:31 -0400 (EDT)

68 lines

Re: Solder Mask Residue

[log in to unmask]

Tue, 15 Jul 1997 09:52:40 -0400 (EDT)

50 lines

Re[2]: Solder Mask Residue

tgyee <[log in to unmask]>

Wed, 16 Jul 97 09:12:34 PST

71 lines

Re[4]: Solder Mask Residue

tgyee <[log in to unmask]>

Mon, 21 Jul 97 09:35:17 PST

59 lines

New Thread

Solder Recovery Systems

Solder Recovery Systems

Maurice Dore <[log in to unmask]>

Thu, 31 Jul 1997 8:45:11 GMT

45 lines

New Thread

Solderability Tests for PCBs

Solderability Tests for PCBs

Mike Masters <[log in to unmask]>

Wed, 30 Jul 1997 11:47:26 -0400

58 lines

Re: Solderability Tests for PCBs

Denis Meloche <[log in to unmask]>

Wed, 30 Jul 1997 14:54:09 -0400

83 lines

Re: Solderability Tests for PCBs

[log in to unmask]

Wed, 30 Jul 97 15:01:38 cst

83 lines

re: Solderability Tests for PCBs

LES CONNALLY <[log in to unmask]>

Wed, 30 Jul 1997 15:05:39 -0700

90 lines

Re: Solderability Tests for PCBs

[log in to unmask]

Wed, 30 Jul 1997 17:01:46 -0400 (EDT)

40 lines

Re: Solderability Tests for PCBs

[log in to unmask]

Wed, 30 Jul 1997 17:49:34 -0400 (EDT)

33 lines

Re: Solderability Tests for PCBs

Poh Kong Hui <[log in to unmask]>

Thu, 31 Jul 1997 23:00:31 +0800 (SST)

81 lines

New Thread

Soldering silver on brass

Soldering silver on brass

Paul Stolar <[log in to unmask]>

Tue, 15 Jul 97 08:35:58 -0600

41 lines

Re: Soldering silver on brass

[log in to unmask]

Tue, 15 Jul 1997 10:01:35 -0400 (EDT)

39 lines

Re: Soldering silver on brass

Poh Kong Hui <[log in to unmask]>

Tue, 15 Jul 1997 23:05:47 +0800 (SST)

77 lines

Re: Soldering silver on brass

[log in to unmask]

Tue, 15 Jul 97 10:23:39 cst

70 lines

Re[2]: Soldering silver on brass

Paul Stolar <[log in to unmask]>

Tue, 15 Jul 97 13:21:49 -0600

99 lines

New Thread

SOLDERING TO PLATINUM

SOLDERING TO PLATINUM

Lolmaugh, Scott (AZ15) <[log in to unmask]>

09 Jul 1997 15:59:24 -0500

57 lines

Re: SOLDERING TO PLATINUM

[log in to unmask]

Thu, 10 Jul 97 10:10:01 cst

75 lines

New Thread

Sources of Universal Equipment

Re: Sources of Universal Equipment

[log in to unmask]

Mon, 28 Jul 1997 15:47:02 -0400 (EDT)

43 lines

New Thread

Standard Lab Conditions

Standard Lab Conditions

Godby, Larry (On-Call) <[log in to unmask]>

Mon, 16 Jun 1997 14:21:26 -0600

40 lines

New Thread

Standard PCB/PWB Trace Width's

Standard PCB/PWB Trace Width's

Michael Forrester <[log in to unmask]>

Fri, 18 Jul 1997 17:38:37 -0400

51 lines

Re: Standard PCB/PWB Trace Width's

[log in to unmask]

Sat, 19 Jul 1997 11:43:25 -0400 (EDT)

40 lines

Standard PCB/PWB Trace Width's

[log in to unmask]

Mon, 21 Jul 1997 09:58:23 -0500

98 lines

Standard PCB/PWB Trace Width's

jon johnson <[log in to unmask]>

Mon, 21 Jul 1997 11:00:37 -0400

50 lines

New Thread

Standard PCB/PWB Trace Width's -Reply

Standard PCB/PWB Trace Width's -Reply

John Swinehart <[log in to unmask]>

Mon, 21 Jul 1997 13:12:56 -0400

143 lines

New Thread

Standard PCB/PWB Trace Withd's

RE: Standard PCB/PWB Trace Withd's

Raymond Klein <[log in to unmask]>

Fri, 18 Jul 1997 15:57:17 -0700

47 lines

Re: Standard PCB/PWB Trace Withd's

GeoFranck <[log in to unmask]>

Mon, 21 Jul 1997 09:13:43 -0400

110 lines

New Thread

Strip tin-lead

Strip tin-lead

Eltek Ltd. - Process Engineering <[log in to unmask]>

Wed, 16 Jul 1997 18:31:22 +0300 (IDT)

55 lines

Re: Strip tin-lead

[log in to unmask]

Fri, 18 Jul 1997 06:29:46 -0400 (EDT)

49 lines

New Thread

supplier for screens

supplier for screens

[log in to unmask]

Tue, 01 Jul 1997 14:14:04 GMT

35 lines

RE: supplier for screens

Ed Cosper <[log in to unmask]>

Tue, 1 Jul 1997 17:10:29 -0500

71 lines

New Thread

Surface prep prior to solder mask

Surface prep prior to solder mask

[log in to unmask]

Wed, 30 Jul 1997 21:39:50 -0400 (EDT)

43 lines

New Thread

Targets and Film

Targets and Film

Jack Olson <[log in to unmask]>

Fri, 25 Jul 1997 13:01:18 -0700

58 lines

Re: Targets and Film

[log in to unmask]

Fri, 25 Jul 1997 16:26:09 +0400 (EDT)

77 lines

Re: Targets and Film

Jack Olson <[log in to unmask]>

Sat, 26 Jul 1997 10:48:37 -0700

69 lines

Re: Targets and Film

Paul Gould <[log in to unmask]>

Sat, 26 Jul 1997 21:03:21 +0100

54 lines

Re: Targets and Film

Dick Desrosiers <[log in to unmask]>

Mon, 28 Jul 97 09:21:05 EDT

42 lines

Re: Targets and Film

[log in to unmask]

Mon, 28 Jul 97 12:01:04 -0500

92 lines

New Thread

TechNet Forum

TechNet Forum

William Johnson <[log in to unmask]>

Tue, 15 Jul 97 18:04:39 UT

33 lines

Re: TechNet Forum

JoAnn Amerson <[log in to unmask]>

Tue, 15 Jul 1997 15:07:46 +0000

51 lines

New Thread

TechNet-d Digest V97 #423

Re: TechNet-d Digest V97 #423

Phil Culpovich <[log in to unmask]>

Fri, 18 Jul 1997 20:56:13 -0700

79 lines

New Thread

TechNet-d Digest V97 #428

Re: TechNet-d Digest V97 #428

Dan Lee <[log in to unmask]>

Tue, 22 Jul 1997 07:44:29 -0700

57 lines

New Thread

Temporary spot mask

Temporary spot mask

Graham Naisbitt <[log in to unmask]>

Fri, 25 Jul 97 16:25:08 UT

52 lines

New Thread

Temporary Spot Solder Mask

Temporary Spot Solder Mask

Ben Lee <[log in to unmask]>

Wed, 23 Jul 1997 11:30:49 -0400

50 lines

RE: Temporary Spot Solder Mask

Yuen, Mike <[log in to unmask]>

Wed, 23 Jul 97 12:10:00 CDT

80 lines

Re: Temporary Spot Solder Mask

Peter Swanson <[log in to unmask]>

Wed, 23 Jul 1997 20:44:36 GMT

68 lines

RE: Temporary Spot Solder Mask

Graham Naisbitt <[log in to unmask]>

Wed, 23 Jul 97 22:00:55 UT

99 lines

Re: Temporary Spot Solder Mask

[log in to unmask]

Thu, 24 Jul 1997 09:13:05 -0400 (EDT)

45 lines

New Thread

Tensile strength/elongation

Re: Tensile strength/elongation

[log in to unmask]

Wed, 30 Jul 1997 12:12:08 -0400 (EDT)

51 lines

New Thread

Test and Inspection Strategy

Test and Inspection Strategy

Vickie Chapman <[log in to unmask]>

Thu, 10 Jul 1997 15:57:55 -0700

128 lines

Re: Test and Inspection Strategy

[log in to unmask]

Fri, 11 Jul 1997 09:16:37 -0400 (EDT)

57 lines

Re: Test and Inspection Strategy

Vickie Chapman <[log in to unmask]>

Fri, 11 Jul 1997 10:02:39 -0700

61 lines

New Thread

Test Die for SMD Reliability Testing

Test Die for SMD Reliability Testing

Maguire, James F <[log in to unmask]>

Thu, 10 Jul 1997 12:21:14 -0700

89 lines

RE: Test Die for SMD Reliability Testing

Alderete, Michael <[log in to unmask]>

Thu, 10 Jul 1997 15:23:54 -0700

166 lines

Test Die for SMD Reliability Testing

Oliver Kierse <[log in to unmask]>

Fri, 11 Jul 97 10:09:32 BST

68 lines

New Thread

Test die for SMD reliability.

RE: Test die for SMD reliability.

[log in to unmask]

Fri, 11 Jul 1997 08:57:32 +0100

162 lines

New Thread

Test probes for gold fingers

RE: Test probes for gold fingers

Jeffrey C. Garland <[log in to unmask]>

Tue, 1 Jul 1997 08:12:25 -0700

104 lines

New Thread

Test Strategy

Test Strategy

Lepsche, Thomas G (NM75) <[log in to unmask]>

Thu, 10 Jul 1997 15:49:54 -0600

58 lines

New Thread

Thanks For All The Flex Circuit Info

Thanks For All The Flex Circuit Info

Phil Culpovich <[log in to unmask]>

Tue, 22 Jul 1997 08:06:13 -0700

50 lines

New Thread

Thermal concerns in the assembly of BGA designs

Thermal concerns in the assembly of BGA designs

Karl Bornemann <[log in to unmask]>

Wed, 30 Jul 1997 11:39:57 +0100

48 lines

New Thread

Thermal considerations in BGA design

Thermal considerations in BGA design

Karl Bornemann <[log in to unmask]>

Thu, 24 Jul 1997 10:37:40 +0100

50 lines

New Thread

Through Hole Solder Joint Performance

Through Hole Solder Joint Performance

Krawczyk, Russ <[log in to unmask]>

Wed, 16 Jul 1997 11:14:37 -0500

57 lines

New Thread

TMRC/AMRC Archive

TMRC/AMRC Archive

Kim Sterling <[log in to unmask]>

Tue, 22 Jul 1997 13:36:05 -0500

43 lines

New Thread

Trace & Space Width

Trace & Space Width

Phil Culpovich <[log in to unmask]>

Mon, 21 Jul 1997 10:37:47 -0700

78 lines

New Thread

U.V. cure of L.P.I. soldermasks

U.V. cure of L.P.I. soldermasks

Steves <[log in to unmask]>

Wed, 9 Jul 1997 09:59:12 +0000

47 lines

Re: U.V. cure of L.P.I. soldermasks

[log in to unmask]

Wed, 09 Jul 97 10:16:19 -0800

71 lines

Re: U.V. cure of L.P.I. soldermasks

Larry Crane <[log in to unmask]>

Wed, 9 Jul 1997 13:03:18 -0400

86 lines

New Thread

Ultrasonic Vibrators

Ultrasonic Vibrators

Eltek Ltd. - Process Engineering <[log in to unmask]>

Mon, 7 Jul 1997 13:54:10 +0300 (IDT)

57 lines

Ultrasonic Vibrators

Eltek Ltd. - Process Engineering <[log in to unmask]>

Tue, 8 Jul 1997 07:19:46 +0300 (IDT)

57 lines

New Thread

Unidentified subject!

Unidentified subject!

Kevin Jamison <[log in to unmask]>

Wed, 2 Jul 1997 17:10:40 -0500

42 lines

Unidentified subject!

[log in to unmask]

Wed, 9 Jul 1997 15:10:25 +0100

74 lines

Unidentified subject!

Poh Kong Hui <[log in to unmask]>

Thu, 10 Jul 1997 22:42:34 +0800 (SST)

50 lines

Unidentified subject!

[log in to unmask]

Fri, 11 Jul 1997 08:59:05 GMT

40 lines

Unidentified subject!

[log in to unmask]

Mon, 14 Jul 1997 10:11:06 GMT

38 lines

Unidentified subject!

Angel Luis Ferrandez Berrueco <[log in to unmask]>

Mon, 14 Jul 1997 12:59:00 -0700

46 lines

RE: Unidentified subject!

John Nelson <[log in to unmask]>

Mon, 14 Jul 1997 11:34:25 -0400

78 lines

Unidentified subject!

DAVID HILL <[log in to unmask]>

Thu, 24 Jul 1997 15:46:42 +0100

61 lines

Re: Unidentified subject!

[log in to unmask]

Fri, 25 Jul 1997 10:12:29 -0400 (EDT)

57 lines

Unidentified subject!

EDDY CHEN <[log in to unmask]>

Sat, 26 Jul 1997 15:46:34 +0800

43 lines

Unidentified subject!

Orna and Yehuda <[log in to unmask]>

Fri, 1 Aug 1997 12:37:08 +0300

47 lines

New Thread

Urgently need 3M Fluorad FC-725 conformal coat material

Urgently need 3M Fluorad FC-725 conformal coat material

John Loveluck <[log in to unmask]>

Mon, 07 Jul 1997 11:42:20 -0700

60 lines

New Thread

Use of SMD shields for shielding pre reflow (ASSEM)

Use of SMD shields for shielding pre reflow (ASSEM)

Jesse Dijkstra <[log in to unmask]>

Fri, 11 Jul 1997 12:17:17 +1200

46 lines

RE: Use of SMD shields for shielding pre reflow (ASSEM)

John Wick 595-6667 <[log in to unmask]>

Fri, 11 Jul 1997 10:00:00 -0400 (EDT)

62 lines

Re: Use of SMD shields for shielding pre reflow (ASSEM)

Mark W. Spitnale <[log in to unmask]>

Mon, 14 Jul 1997 06:26:28 -0500

101 lines

Re: Use of SMD shields for shielding pre reflow (ASSEM)

Denis Meloche <[log in to unmask]>

Fri, 11 Jul 1997 12:29:56 -0400

87 lines

New Thread

Using the Technet Exploder

Using the Technet Exploder

Edwin Louis <[log in to unmask]>

16 Jul 1997 07:55:32 -0600

53 lines

Re: Using the Technet Exploder

Sheila Smith <[log in to unmask]>

Wed, 16 Jul 1997 11:08:10 -0400 (EDT)

60 lines

New Thread

Vacations

Vacations

Graham Naisbitt <[log in to unmask]>

Tue, 22 Jul 97 20:24:48 UT

52 lines

New Thread

vacuum lamination

vacuum lamination

[log in to unmask]

Tue, 8 Jul 1997 00:22:06 -0400 (EDT)

39 lines

Re: vacuum lamination

[log in to unmask]

Tue, 8 Jul 1997 21:25:18 -0400 (EDT)

45 lines

New Thread

vapor honing

vapor honing

[log in to unmask]

Fri, 18 Jul 1997 13:38:09 GMT

41 lines

RE: vapor honing

John Nelson <[log in to unmask]>

Fri, 18 Jul 1997 16:44:34 -0400

73 lines

Re: vapor honing

[log in to unmask]

Fri, 18 Jul 1997 23:25:14 -0400 (EDT)

42 lines

Re: vapor honing

Sheila Smith <[log in to unmask]>

Mon, 21 Jul 1997 08:28:17 -0400 (EDT)

83 lines

Re: Vapor Honing

[log in to unmask]

Mon, 21 Jul 1997 11:15:15 -0400 (EDT)

52 lines

New Thread

Vendors for oxide treatment on copper laminates

Vendors for oxide treatment on copper laminates

Duane B. Mahnke <[log in to unmask]>

Wed, 30 Jul 1997 21:04:00 -0700

47 lines

New Thread

Via hole/pad size

Via hole/pad size

Thomas Kropski <[log in to unmask]>

Fri, 01 Aug 1997 09:06:54 -0700

49 lines

New Thread

Via Inductance

Re: Via Inductance

Doug McKean <[log in to unmask]>

Thu, 31 Jul 1997 13:05:07 -0400

81 lines

Re: Via Inductance

Jack Olson <[log in to unmask]>

Thu, 31 Jul 1997 22:25:07 -0700

45 lines

New Thread

Voltage Breakdown of materials

Voltage Breakdown of materials

James A Larson <[log in to unmask]>

Wed, 02 Jul 1997 22:04:32 +0100

47 lines

New Thread

Voltage Breakdowns of Resins

Voltage Breakdowns of Resins

James A Larson <[log in to unmask]>

Wed, 02 Jul 1997 17:42:25 +0100

47 lines

New Thread

Want Electrovert Cleaner

Want Electrovert Cleaner

Sanmatech <[log in to unmask]>

Mon, 7 Jul 1997 10:14:03 +0800

54 lines

New Thread

Wave and BGA

Wave and BGA

Andre Bisson <[log in to unmask]>

Wed, 16 Jul 1997 10:00:07 -0300

61 lines

Re: Wave and BGA

Greg Bartlett <[log in to unmask]>

16 Jul 1997 10:44:56 -0400

128 lines

Re: Wave and BGA

Charles Elliott <[log in to unmask]>

16 Jul 1997 11:35:02 U

131 lines

Re[2]: Wave and BGA

Thad McMillan <[log in to unmask]>

16 Jul 97 13:41 CDT

143 lines

RE: Wave and BGA

Landes, Jeff <[log in to unmask]>

Wed, 16 Jul 97 11:51:00 PDT

98 lines

New Thread

Wave Solder Optimizer

RE: Wave Solder Optimizer

Ron Hollandsworth <[log in to unmask]>

Mon, 07 Jul 97 09:28:50 -0500

51 lines

New Thread

Wave: Airknife

Wave: Airknife

Lainie Loveless <[log in to unmask]>

Wed, 16 Jul 97 17:17:25

63 lines

New Thread

[Fwd: Alloy 42]

[Fwd: Alloy 42]

Bogdan Gaby <[log in to unmask]>

Tue, 15 Jul 1997 14:33:34 -0700

66 lines

New Thread

[Fwd: Mousebites/divots]

Re: [Fwd: Mousebites/divots]

Paul A Galatis <[log in to unmask]>

Tue, 1 Jul 1997 12:24:11 -0500

85 lines

Re: [Fwd: Mousebites/divots]

Roland Jaquet <[log in to unmask]>

Tue, 1 Jul 1997 10:36:02 +0200

127 lines

Re: [Fwd: Mousebites/divots]

David Arivett <[log in to unmask]>

Tue, 1 Jul 1997 08:36:46 -0500 (CDT)

121 lines

New Thread

[Fwd: Via Current ratings]

[Fwd: Via Current ratings]

Donna Perry <[log in to unmask]>

Wed, 23 Jul 1997 05:38:37 -0700

60 lines

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