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June 1997


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Table of Contents:

Alternative solder alloy for a special process application (2 messages)
Anyone have problems with Waving case size "A" Tant or SOT-23's (1 message)
Are U Square or Round or Oval (1 message)
ASS. Reliability of solder bonds (3 messages)
ASSEM (1 message)
ASSEM--PCB Marking Methods (2 messages)
ASSEM: Re: FW: Dry Storage (1 message)
ASSEMBLY- Looking for relay mounting clip (2 messages)
assy - loctite hardware on pcb assemblies (3 messages)
Assy Supplier Qualification (3 messages)
ASSY, rework of damaged QFP leads (1 message)
ASSY, solder thieves (3 messages)
ASSY- CONFORMAL COATING (1 message)
ASSY/DSN: Minimum Spacing (1 message)
ASSY: 45 degree oriented QFP (1 message)
ASSY: AOI, Xray, automated solder joint inspection (1 message)
ASSY: Are U Square or Round or Oval (7 messages)
Assy: Au/Pd/Ni/Cu PCB Finish (8 messages)
Assy: conformal coating (1 message)
ASSY: CONFORMAL COATING BGAs (3 messages)
ASSY: Genesolv replacement (3 messages)
ASSY: ITT Canon (1 message)
ASSY: MOLE temperature probes (2 messages)
ASSY: Rework Method (2 messages)
Assy: Solder Heat Resistance (1 message)
ASSY: Solder joint strength (2 messages)
Assy: Tantulam Powder (1 message)
ASSY: TQFP JEDEC TRAYS (1 message)
Assy: vapor phase secondary fluid (1 message)
ASSY: VIA_Wetting (1 message)
ASSY: Wave solder defect rates: (was: Hot Air Knife a (1 message)
ASSY: Wave solder defect rates: (was: Hot Air Knife after solder pot?? Anyone use this?) (2 messages)
ASSY: Wave Solder sand Bags (1 message)
ASSY: Wavesoldering questions... (2 messages)
Assy: white residues (2 messages)
ASSY:Coplanarity (2 messages)
ASSY:Ionic contamination specs (5 messages)
Assy:VIA_Wetting (1 message)
Au/Pd/Ni/Cu PCB Finish (1 message)
Automated Optical Inspection (AOI) of PCB inner layers (3 messages)
BGA Pad design (2 messages)
BLIND AND BURIED VIA (3 messages)
Blue fr-4 (1 message)
Bob Ziedmans Email ID (1 message)
Bowing off Tantulam Caps (4 messages)
Buried capacitance material (2 messages)
Carbon Ink Resistors (1 message)
cc:Mail Link to SMTP Undeliverable Message (3 messages)
change e-mail address (1 message)
Chlorine damage to electronics (fwd) (3 messages)
Cleaning with Ultrasonic (1 message)
Cleanliness of assembled boards (2 messages)
Co-planar Waveguide question! (1 message)
Coax plating (1 message)
component (1 message)
CONFORMAL COATING (5 messages)
Controlled impedance documents (2 messages)
Copper and Phosphate (1 message)
Copper recycling (2 messages)
Cross Section Service (1 message)
Cu/Ni/Pd/Au finish (1 message)
Dazor (1 message)
DEC Alpha Motherboards (1 message)
DES- PTH Mathematical Mo (1 message)
DES: Heatsinking SMD OpAmp (1 message)
DES: High Cycle Fatigue Properties of Solder (1 message)
DES: I/O Terminations (1 message)
DES: Panelization (6 messages)
DES: PTH Mathematical Model (2 messages)
DES: PTH Mathematical Model -Reply (1 message)
DES: Track spacing for 100V on internal layers (1 message)
DES: Track spacing for 100V on internal layers -Reply (3 messages)
DES:I/O Terminations (2 messages)
Design, Fab & Assembly - BGA, vias and power planes (1 message)
Did Technet disappear (1 message)
Document IRD-DES 003 (1 message)
double sided reflow-soldering top side to bottom side (1 message)
double sided reflow-soldering top side to bottom side parts. (3 messages)
Double Soldering? (2 messages)
Double Soldering? -Reply (1 message)
Dry Storage (1 message)
E-Mail massages (2 messages)
Electrochemical migration (2 messages)
Electroless Deposition (1 message)
EMC Analysis S/W (1 message)
Emma 210 Driver (1 message)
Employment chatter (4 messages)
ETS300-019-1, 2, and 3 (1 message)
Excellon SMX programing (1 message)
Expert Systems (3 messages)
fab (3 messages)
FAB - chemical and physical properties of PCB board material (2 messages)
FAB and ASSY: Spec for Electroless Ni and Immersion A (1 message)
FAB and ASSY: Spec for Electroless Ni and Immersion Au (4 messages)
FAB equipment, non-contact pyrometer (1 message)
Fab/Assy: Decapsulant method (2 messages)
FAB/ASSY: PCMCIA (1 message)
Fab: Addition of Controled Impedance Conductors (1 message)
FAB: APM Radiometers (4 messages)
FAB: conveyorized 'durabond' (2 messages)
FAB: Copper foil compatability (1 message)
Fab: CRM5 Material (2 messages)
fab: drilling (3 messages)
Fab: Drilling/routing dust (1 message)
FAB: Etching Double-Treat foil. (2 messages)
FAB: Hole tolerances (1 message)
Fab: Horizontal Oxide Line (2 messages)
FAB: Instrument for PTH Cu measurement. (1 message)
FAB: Lap shear test (3 messages)
FAB: LPI (3 messages)
Fab: LPI soldermask (1 message)
FAB: Material - FR10 (4 messages)
FAB: Material ; G-10 (5 messages)
FAB: Material Certificate? (1 message)
FAB: Plating Thickness inside hole walls ; reliability of measurement (1 message)
FAB: RE: Question on Pad Leveling (8 messages)
Fab: Rinse water quality (1 message)
FAB: tin only over copper on antenna design (3 messages)
FAB: Unbalance Copper Core (1 message)
Fab: Wanted PWB Shop to Purchase (1 message)
Fab:Disposal of drilling/routing dust (1 message)
FAB:Resin Removal from Tooling holes (2 messages)
Fab:Router dust (2 messages)
Fabrication (1 message)
FEB- ceramic BGA crackin (1 message)
FEB: ceramic BGA cracking after wave solder (2 messages)
FW: ASSEM--PCB Marking Methods (1 message)
FW: ASSY:Au/Ni Coated Boards (1 message)
FW: Bowing off Tantulam Caps (1 message)
FW: Chlorine damage to electronics (fwd) (1 message)
FW: Cleanliness of assembled boards (1 message)
FW: Cross Section Service (3 messages)
FW: DES: Panelization (1 message)
FW: Dry Storage (3 messages)
FW: EMC Analysis S/W (1 message)
FW: Hot Air Knife after solder pot?? Anyone use this? (1 message)
FW: Intrusive Reflow (1 message)
FW: Nitto Tape (1 message)
FW: PEM reflow (2 messages)
Fw: PLASTIC RIVET MACHINE SUPPLIER (1 message)
FW: plugged vias (1 message)
FW: Press Pin Assembly Equipmen (1 message)
FW: Re: palladium plating (1 message)
FW: removing solder mask (1 message)
FW: Tented Vias (1 message)
Fwd: Fab: Rinse water quality (3 messages)
Fwd: RE: FAB equipment, non-contact pyrometer (1 message)
GEN - Image processing for PCB inspection (1 message)
Gen- Durometer Measurement (1 message)
Gen: R&D (2 messages)
GEN: S.M. adhesives (1 message)
GEN: SUPPLIER (2 messages)
Gen: Wanted,Tackroller (4 messages)
Gen: Wanted,Tackroller -Reply (1 message)
General: Vision Inspection of Built Up Assemblies (3 messages)
General: Vision Inspection of Built Up Assemblies -Reply (1 message)
Glaser DP3545 Photoplotter (1 message)
Globtop Decapsulation (2 messages)
Gold Finger Touch Up (4 messages)
Gold/Tin-soldering (2 messages)
HALT / HASS physical stress systems (3 messages)
Hasl thickness... (3 messages)
Hello... (1 message)
High Cycle Fatigue Properties of Solder (2 messages)
Hot Air Knife after solder pot?? Anyone use this? (4 messages)
How do you use Material Certificate? (2 messages)
Idents and HASL (1 message)
Idents before or after HASL (4 messages)
Idents before or after HASL-- Reply (1 message)
IMS Material (3 messages)
INFO: Charles Hutchins (1 message)
INFO: Charles Hutchins -Reply (1 message)
Insulation Displacement Connectors (2 messages)
Intrusive Reflow (2 messages)
Ionic contamination specs (1 message)
IONIC TESTING (2 messages)
IPC-A-610B Quality Levels (1 message)
IR Reflow Ovens & Wetting Balance (1 message)
ISO Discussion Forum (1 message)
ISO9002 (5 messages)
ISO9002 (fwd) (1 message)
John Sohn: Out of Office AutoReply: Cleanliness of assembled (1 message)
Koax plating (1 message)
LCC (1 message)
LCC Solder Joint (7 messages)
Linguistics (2 messages)
Looking for CAD software (1 message)
Looking to buy used CAD software (1 message)
LPI soldermask (1 message)
LPISM STRIPPING (2 messages)
LPSIM Stripping (2 messages)
Mailbox getting too full from TechNet?? (1 message)
me too..... (1 message)
Measuring QFP Lead Pitch (2 messages)
Message not deliverable (2 messages)
MIL-P-11268 (2 messages)
Mill Dies (2 messages)
Minimum gold plating on gold tabs (2 messages)
Minimum gold plating on gold tabs -Reply (1 message)
Modifications to PCBs with 30AWG wire... (4 messages)
N2-bags (3 messages)
Need Carbon Capability Prototype Fab Shop. (2 messages)
New Printed Wiring Board Technology (2 messages)
Nitto Tape (4 messages)
No-clean/Test Probes/Cleaning (2 messages)
Non-halogenated fore retardant additives for laminates (1 message)
OSP (1 message)
palladium plating (3 messages)
paste measurement (2 messages)
Patent Search Web Site (6 messages)
PC Cards (2 messages)
PCB Lacquer (1 message)
PCMCIA STANDARDS (2 messages)
PHOTOPLOTTER 4 SALE + PROBIMER LINE (1 message)
placement system (1 message)
PLASTIC RIVET MACHINE SUPPLIER (2 messages)
Plating over Monel (1 message)
plugged vias (4 messages)
Press Pin Assembly Equipmen (1 message)
Press Pin Assembly Equipmen -Reply (1 message)
Preventive Maintenance Software (1 message)
Previous Message By Myself (1 message)
Price Fixing and Restraints of Trade (2 messages)
Primary Image ( outer layers ) (1 message)
Profiling PCB's (2 messages)
PTH Mathematical Model (1 message)
Pumice Source (1 message)
QS-9000 standard (3 messages)
Question on Pad Leveling??? (1 message)
R: Pumice Source (1 message)
Raw Flex Manufacture (2 messages)
Raw Flex Manufacture; Please read (1 message)
removing solder mask (4 messages)
Reply: Conformal coating (1 message)
Research Associate Vacancy (1 message)
Resin Removal (3 messages)
Re[2]: LPISM Stripping (7 messages)
Re[2]: LPISM Stripping -Reply (1 message)
RF Design (5 messages)
RF Design - Plating and Routing (2 messages)
Rinse water quality (1 message)
Rinse water quality (graphs and formula) (1 message)
Roku-Roku Sangyo, Ltd. (1 message)
S/M Tack Cure Racks (2 messages)
Silkscreening (2 messages)
SMT Assy Equipment (1 message)
Solder Balls (4 messages)
Solder joint strength (1 message)
solder mask (3 messages)
Solder Mask CTI Rating (2 messages)
Solder Precoat (1 message)
SOLDERABILITY OF IMMERSION GOLD (2 messages)
Solderability Tests of Boards (5 messages)
Soldering to Nickel Plate (1 message)
Soldering to Nickel Plate -Reply (1 message)
soldermask stripping (1 message)
Solution: No Solder on Size "A" Tant Caps after WAVE also (2 messages)
Solution: No Solder on Size "A" Tant Caps after WAVE also SOT-23's (2 messages)
STD: IPC-6012 - Dewetting Definition (3 messages)
Subject: Solution: No Solder on Size "A" Tant Caps after WAVE also SOT-23's (1 message)
subscrib (1 message)
Supplier (1 message)
Supplier Edge connectors (1 message)
Supplier of polymer solders (5 messages)
Surface Mount Devices (1 message)
Tantulam Powder (1 message)
Taping machines (1 message)
Tented Via Reliability (2 messages)
Tented Via Reliability -Reply (5 messages)
Tented Vias (3 messages)
Test probes for gold fingers (1 message)
Thermal Retesting After Replacing ICs... (2 messages)
tim strip issue (3 messages)
Timeway Program (1 message)
Tin / HASL (3 messages)
Tin as an etch resist (4 messages)
Tin strip issue (2 messages)
TMA and TGA testing (3 messages)
Touch up Ink for Outer layers (1 message)
Touch-up (2 messages)
Training-Certification (1 message)
Translator for Allegro (1 message)
Translator to Allegro (1 message)
Ultrasonic Cleaning (4 messages)
UNE Specification (3 messages)
Unidentified subject! (1 message)
Unknown adhesive (1 message)
Used Equipment - From ex-PCB manufacturer (1 message)
Via Plugging (4 messages)
Via Reliability (1 message)
Vision and X-Ray inspection of assemblies (1 message)
waterbased flux (1 message)
Waterbased Flux AND N2 Bags (1 message)
Wave Solder (2 messages)
Wave Solder Approach - a SURVEY (4 messages)
Wave solder approach - A survey. (2 messages)
What is black alloy plating? (2 messages)
What is ED? (3 messages)
Where is SirGuru (4 messages)
White Residues and "J" leads (1 message)
[Fwd: Mousebites/divots] (5 messages)

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Subject Sorted by Subject, Chronologically

From

Date

Size

New Thread

Alternative solder alloy for a special process application

Alternative solder alloy for a special process application

Jim Herard

Wed, 18 Jun 1997 16:12:27 -0400

85 lines

Alternative solder alloy for a special process application

Patrick Ducas

Wed, 18 Jun 1997 11:05:25 -0400

57 lines

New Thread

Anyone have problems with Waving case size "A" Tant or SOT-23's

Anyone have problems with Waving case size "A" Tant or SOT-23's

D. A. (Tony) Stewart

Wed, 04 Jun 1997 10:05:21 -0500

116 lines

New Thread

Are U Square or Round or Oval

Re: Are U Square or Round or Oval

<>

Fri, 13 Jun 1997 13:00:55 -0400 (EDT)

57 lines

New Thread

ASS. Reliability of solder bonds

Re[2]: ASS. Reliability of solder bonds

ddhillma

Tue, 10 Jun 97 23:18:03 cst

101 lines

Re: ASS. Reliability of solder bonds

<>

Mon, 9 Jun 1997 09:53:04 -0400 (EDT)

67 lines

ASS. Reliability of solder bonds

Martin Farrell

Mon, 09 Jun 1997 10:53:57 +0000 (GMT)

49 lines

New Thread

ASSEM

ASSEM

<>

Thu, 5 Jun 97 11:02:29 -0400

50 lines

New Thread

ASSEM--PCB Marking Methods

Re: ASSEM--PCB Marking Methods

scott birnbaum

Fri, 13 Jun 97 21:31:14 PDT

78 lines

ASSEM--PCB Marking Methods

Bruce Gibson

Fri, 13 Jun 1997 15:13:16 -0600

42 lines

New Thread

ASSEM: Re: FW: Dry Storage

ASSEM: Re: FW: Dry Storage

Mike Buetow

Mon, 2 Jun 1997 11:30:12 -0500 (CDT)

62 lines

New Thread

ASSEMBLY- Looking for relay mounting clip

ASSEMBLY- Looking for relay mounting clip

<>

Thu, 12 Jun 97 08:20:59 PST8

53 lines

ASSEMBLY- Looking for relay mounting clip

<>

Tue, 10 Jun 97 11:35:08 PST8

51 lines

New Thread

assy - loctite hardware on pcb assemblies

Re: assy - loctite hardware on pcb assemblies

Sheila Smith

Mon, 2 Jun 1997 08:40:14 -0400 (EDT)

84 lines

RE: assy - loctite hardware on pcb assemblies

JIM ENNIS

Mon, 02 Jun 97 07:10:00 PDT

80 lines

Re: assy - loctite hardware on pcb assemblies

Steve Mikell

Sun, 1 Jun 1997 13:23:13 -0500 (CDT)

72 lines

New Thread

Assy Supplier Qualification

Re: Assy Supplier Qualification

<>

Wed, 18 Jun 1997 15:56:31 -0400 (EDT)

49 lines

Re: Assy Supplier Qualification

<>

Wed, 18 Jun 1997 15:52:16 -0400 (EDT)

49 lines

Assy Supplier Qualification

Frank Hinojos

Tue, 17 Jun 1997 09:46:47 -0700

43 lines

New Thread

ASSY, rework of damaged QFP leads

ASSY, rework of damaged QFP leads

Patrick Ducas

Tue, 17 Jun 1997 08:55:08 -0400

62 lines

New Thread

ASSY, solder thieves

Re: ASSY, solder thieves

<>

Mon, 2 Jun 1997 09:43:38 -0400 (EDT)

53 lines

ASSY, solder thieves

Patrick Ducas

Fri, 30 May 1997 15:17:39 -0400

68 lines

ASSY, solder thieves

<>

Sun, 01 Jun 1997 21:18:53 EDT

41 lines

New Thread

ASSY- CONFORMAL COATING

Re: ASSY- CONFORMAL COATING

Greg Bartlett

26 Jun 1997 14:10:50 -0400

141 lines

New Thread

ASSY/DSN: Minimum Spacing

ASSY/DSN: Minimum Spacing

<>

Thu, 26 Jun 1997 16:15:55 -0500

56 lines

New Thread

ASSY: 45 degree oriented QFP

ASSY: 45 degree oriented QFP

Yuen, Mike

Fri, 27 Jun 97 11:03:00 CDT

39 lines

New Thread

ASSY: AOI, Xray, automated solder joint inspection

ASSY: AOI, Xray, automated solder joint inspection

Vickie Chapman

Mon, 30 Jun 1997 11:19:32 -0700

69 lines

New Thread

ASSY: Are U Square or Round or Oval

Re: ASSY: Are U Square or Round or Oval

<>

Wed, 11 Jun 1997 17:06:29 -0400 (EDT)

40 lines

Re: ASSY: Are U Square or Round or Oval

<>

Wed, 11 Jun 1997 15:27:37 -0400 (EDT)

37 lines

Re: ASSY: Are U Square or Round or Oval

James C. Patten

Wed, 11 Jun 97 09:18:00 PDT

83 lines

Re: ASSY: Are U Square or Round or Oval

<>

Wed, 11 Jun 1997 07:05:22 -0400 (EDT)

53 lines

Re: ASSY: Are U Square or Round or Oval

<>

Wed, 11 Jun 97 07:16:53 EDT

78 lines

Re: ASSY: Are U Square or Round or Oval

ddhillma

Tue, 10 Jun 97 23:32:12 cst

100 lines

ASSY: Are U Square or Round or Oval

<>

Tue, 10 Jun 1997 14:13:05 -0500

69 lines

New Thread

Assy: Au/Pd/Ni/Cu PCB Finish

Re: Assy: Au/Pd/Ni/Cu PCB Finish

gabriela

Sun, 15 Jun 1997 17:15:38 +0000

80 lines

Re: Assy: Au/Pd/Ni/Cu PCB Finish

<>

Sun, 15 Jun 1997 09:02:01 -0400 (EDT)

47 lines

Re: Assy: Au/Pd/Ni/Cu PCB Finish

<>

Thu, 12 Jun 1997 15:22:03 -0400 (EDT)

39 lines

Re: Assy: Au/Pd/Ni/Cu PCB Finish

<>

Thu, 12 Jun 1997 15:22:06 -0400 (EDT)

42 lines

Re: Assy: Au/Pd/Ni/Cu PCB Finish

ddhillma

Thu, 12 Jun 97 09:10:33 cst

77 lines

Re[2]: Assy: Au/Pd/Ni/Cu PCB Finish

<>

Thu, 12 Jun 1997 08:52:44 -0500

288 lines

RE: Assy: Au/Pd/Ni/Cu PCB Finish

John Guy

Thu, 12 Jun 1997 08:31:33 -0500

64 lines

Assy: Au/Pd/Ni/Cu PCB Finish

Barthel, Bill

Thu, 12 Jun 97 07:45:00 CDT

38 lines

New Thread

Assy: conformal coating

Re: Assy: conformal coating

<>

Sun, 15 Jun 1997 00:48:03 -0400 (EDT)

44 lines

New Thread

ASSY: CONFORMAL COATING BGAs

ASSY: CONFORMAL COATING BGAs

Graham Naisbitt

Fri, 27 Jun 97 16:21:47 UT

57 lines

Re: ASSY: CONFORMAL COATING BGAs

Lynch, Lyn

Thu, 26 Jun 97 09:48:41

95 lines

ASSY: CONFORMAL COATING BGAs

Jim Marsico 516-595-5879

Thu, 26 Jun 1997 11:30:00 -0400 (EDT)

69 lines

New Thread

ASSY: Genesolv replacement

Re: ASSY: Genesolv replacement

Aric J Parr

Thu, 12 Jun 1997 08:50:09 -0500

79 lines

Re: ASSY: Genesolv replacement

Sheila Smith

Thu, 12 Jun 1997 08:31:49 -0400 (EDT)

78 lines

ASSY: Genesolv replacement

Blanchet,Richard

Thu, 12 Jun 1997 07:52:00 -0400 (EDT)

53 lines

New Thread

ASSY: ITT Canon

ASSY: ITT Canon

<>

Tue, 17 Jun 1997 10:01:41 -0500

47 lines

New Thread

ASSY: MOLE temperature probes

Re[2]: ASSY: MOLE temperature probes

<>

Tue, 03 Jun 97 13:57:05 PST

87 lines

RE: ASSY: MOLE temperature probes

JIM ENNIS

Thu, 29 May 97 11:44:00 PDT

88 lines

New Thread

ASSY: Rework Method

Re: ASSY: Rework Method

ddhillma

Tue, 03 Jun 97 06:19:05 cst

104 lines

ASSY: Rework Method

Peter Swanson

Mon, 02 Jun 1997 18:35:36 GMT

69 lines

New Thread

Assy: Solder Heat Resistance

Assy: Solder Heat Resistance

<>

Wed, 18 Jun 97 16:31:05 PDT

46 lines

New Thread

ASSY: Solder joint strength

Re: ASSY: Solder joint strength

Mike Buetow

Sat, 7 Jun 1997 14:13:20 -0500 (CDT)

85 lines

ASSY: Solder joint strength

Andrea Shurtz

6 Jun 97 13:32:07 EDT

45 lines

New Thread

Assy: Tantulam Powder

Assy: Tantulam Powder

Yuen, Mike

Wed, 18 Jun 97 13:32:00 CDT

39 lines

New Thread

ASSY: TQFP JEDEC TRAYS

ASSY: TQFP JEDEC TRAYS

Siegfried Quemado

Mon, 02 Jun 97 08:31:00 PDT

36 lines

New Thread

Assy: vapor phase secondary fluid

Assy: vapor phase secondary fluid

Steve Mikell

Thu, 26 Jun 1997 17:34:10 -0500 (CDT)

50 lines

New Thread

ASSY: VIA_Wetting

ASSY: VIA_Wetting

<>

Wed, 18 Jun 1997 17:39:00 +0000

80 lines

New Thread

ASSY: Wave solder defect rates: (was: Hot Air Knife a

Re[2]: ASSY: Wave solder defect rates: (was: Hot Air Knife a

Ron Hollandsworth

Wed, 18 Jun 97 09:27:17 -0500

195 lines

New Thread

ASSY: Wave solder defect rates: (was: Hot Air Knife after solder pot?? Anyone use this?)

Re: ASSY: Wave solder defect rates: (was: Hot Air Knife after solder pot?? Anyone use this?)

Fritz Byle

Tue, 17 Jun 1997 22:49:43 -0500

167 lines

ASSY: Wave solder defect rates: (was: Hot Air Knife after solder pot?? Anyone use this?)

Vickie Chapman

Tue, 17 Jun 1997 13:17:27 -0700

140 lines

New Thread

ASSY: Wave Solder sand Bags

ASSY: Wave Solder sand Bags

Jeffery L. Hempton

Fri, 06 Jun 1997 09:59:21 -0500

51 lines

New Thread

ASSY: Wavesoldering questions...

Re: ASSY: Wavesoldering questions...

Leo P. Lambert

Sun, 29 Jun 1997 22:21:23 -0400 (EDT)

105 lines

ASSY: Wavesoldering questions...

Vickie Chapman

Mon, 23 Jun 1997 08:59:51 -0700

53 lines

New Thread

Assy: white residues

Re: Assy: white residues

ddhillma

Tue, 10 Jun 97 13:12:01 cst

76 lines

Assy: white residues

Blanchet,Richard

Thu, 05 Jun 1997 12:09:00 -0400 (EDT)

50 lines

New Thread

ASSY:Coplanarity

Re: ASSY:Coplanarity

Jeff Seeger

Mon, 23 Jun 1997 19:30:02 -0400

60 lines

ASSY:Coplanarity

<>

Mon, 23 Jun 1997 11:33:00 +0000

55 lines

New Thread

ASSY:Ionic contamination specs

Re: ASSY:Ionic contamination specs

<>

Thu, 19 Jun 1997 12:49:51 -0400 (EDT)

94 lines

Re[2]: ASSY:Ionic contamination specs

ddhillma

Wed, 18 Jun 97 12:09:32 cst

93 lines

Re: ASSY:Ionic contamination specs

Raymond Klein

Fri, 13 Jun 1997 16:51:29 -0700

49 lines

Re: ASSY:Ionic contamination specs

<>

Fri, 13 Jun 1997 19:30:15 -0400 (EDT)

57 lines

ASSY:Ionic contamination specs

John Barton

Thu, 12 Jun 1997 15:02:57 +0000

74 lines

New Thread

Assy:VIA_Wetting

Assy:VIA_Wetting

<>

Thu, 19 Jun 1997 08:14:00 +0000

59 lines

New Thread

Au/Pd/Ni/Cu PCB Finish

Re: Au/Pd/Ni/Cu PCB Finish

<>

Fri, 13 Jun 1997 11:01:38 -0400 (EDT)

55 lines

New Thread

Automated Optical Inspection (AOI) of PCB inner layers

RE: Automated Optical Inspection (AOI) of PCB inner layers

Murray, George @ GSC

Fri, 13 Jun 97 15:10:00 PDT

67 lines

RE: Automated Optical Inspection (AOI) of PCB inner layers

Ed Cosper

Fri, 13 Jun 1997 14:32:06 -0500

71 lines

Automated Optical Inspection (AOI) of PCB inner layers

Rick Haynes

Fri, 13 Jun 1997 13:36:47 -0700

100 lines

New Thread

BGA Pad design

Re: BGA Pad design

Steve Quinn

Thu, 12 Jun 1997 12:36:15 -0500 (CDT)

82 lines

Re: BGA Pad design

Doug Jeffery

Wed, 11 Jun 1997 18:52:09 -0500 (CDT)

61 lines

New Thread

BLIND AND BURIED VIA

RE:BLIND AND BURIED VIA

<>

Mon, 09 Jun 1997 04:06:05 EDT

88 lines

Re: Blind and Buried Via

Robert Welch

Sat, 7 Jun 1997 10:45:20 +0000

46 lines

Blind and Buried Via

CADET, India.

Sat, 07 Jun 1997 10:56:27 +0530

77 lines

New Thread

Blue fr-4

Blue fr-4

sam mccorkel

Mon, 09 Jun 1997 11:48:46 -0400

39 lines

New Thread

Bob Ziedmans Email ID

Bob Ziedmans Email ID

CADET Automation Systems

Thu, 05 Jun 1997 09:06:12 +0530

47 lines

New Thread

Bowing off Tantulam Caps

Re: Bowing off Tantulam Caps

Doug McKean

Wed, 11 Jun 1997 09:50:51 -0400

54 lines

Re: Bowing off Tantulam Caps

ddhillma

Tue, 10 Jun 97 23:24:49 cst

101 lines

RE: Bowing off Tantulam Caps

Max Bernhardt

Tue, 10 Jun 1997 14:43:00 -0500

121 lines

Bowing off Tantulam Caps

Dhawan, Ashok CA-WINPO2

Mon, 09 Jun 97 14:42:00 GMT

67 lines

New Thread

Buried capacitance material

Re: Buried capacitance material

<>

Fri, 13 Jun 97 16:26:33 -0500

80 lines

Buried capacitance material

Ed Cosper

Fri, 13 Jun 1997 14:18:20 -0500

54 lines

New Thread

Carbon Ink Resistors

Carbon Ink Resistors

Hanamann, Peter

Thu, 12 Jun 97 16:05:00 CDT

42 lines

New Thread

cc:Mail Link to SMTP Undeliverable Message

cc:Mail Link to SMTP Undeliverable Message

<>

Mon, 09 Jun 97 17:57:03 -0800

104 lines

cc:Mail Link to SMTP Undeliverable Message

<>

Tue, 03 Jun 97 21:39:34 -0800

155 lines

cc:Mail Link to SMTP Undeliverable Message

<>

Tue, 03 Jun 97 16:38:34 -0800

153 lines

New Thread

change e-mail address

change e-mail address

Keren Gideon

Sat, 7 Jun 1997 22:39:51 +0300

43 lines

New Thread

Chlorine damage to electronics (fwd)

Re: Chlorine damage to electronics (fwd)

ddhillma

Wed, 18 Jun 97 08:42:36 cst

101 lines

Re: Chlorine damage to electronics (fwd)

<>

Tue, 17 Jun 1997 09:35:18 -0400 (EDT)

46 lines

Chlorine damage to electronics (fwd)

David Bergman

Mon, 16 Jun 1997 13:44:23 -0500 (CDT)

69 lines

New Thread

Cleaning with Ultrasonic

Cleaning with Ultrasonic

<>

Mon, 9 Jun 1997 14:16:07 -0400 (EDT)

44 lines

New Thread

Cleanliness of assembled boards

RE: Cleanliness of assembled boards

Graham Naisbitt

Wed, 25 Jun 97 23:01:08 UT

72 lines

Cleanliness of assembled boards

MATI BARUCH

Wed, 25 Jun 1997 20:40:28 GT+0300

41 lines

New Thread

Co-planar Waveguide question!

Re: Co-planar Waveguide question!

Andy Burkhardt

Mon, 2 Jun 1997 10:37:59 +0100

74 lines

New Thread

Coax plating

Coax plating

<>

Thu, 12 Jun 97 15:56:47 +0200

45 lines

New Thread

component

component

<>

Thu, 26 Jun 1997 13:39:47 -0400

48 lines

New Thread

CONFORMAL COATING

Re: CONFORMAL COATING

<>

Sun, 15 Jun 1997 01:18:04 -0400 (EDT)

44 lines

Re: Conformal Coating

Ulrich Korndoerfer

Sat, 14 Jun 1997 00:31:44 +0200

57 lines

Conformal Coating

Graham Naisbitt

Fri, 13 Jun 97 15:48:10 UT

89 lines

Re: CONFORMAL COATING

Frank Hinojos

Thu, 12 Jun 1997 08:47:38 -0700

100 lines

CONFORMAL COATING

Tamir Ben-Shoshan

Thu, 12 Jun 97 17:01:17 EST

39 lines

New Thread

Controlled impedance documents

Re: Controlled impedance documents

Mitch Morey

Fri, 6 Jun 1997 11:10:29 -0700

52 lines

Controlled impedance documents

Steves

Fri, 6 Jun 1997 12:56:20 +0000

40 lines

New Thread

Copper and Phosphate

Copper and Phosphate

Goldman, Patricia J.

Mon, 30 Jun 97 12:07:00 PDT

46 lines

New Thread

Copper recycling

Re: Copper recycling

<>

Fri, 6 Jun 1997 22:43:39 -0400

43 lines

Copper recycling

scott birnbaum

Mon, 02 Jun 97 05:48:23 PDT

44 lines

New Thread

Cross Section Service

Cross Section Service

friday

Tue, 24 Jun 1997 08:14:44 -0400

42 lines

New Thread

Cu/Ni/Pd/Au finish

Cu/Ni/Pd/Au finish

<>

Sun, 15 Jun 1997 18:26:45 -0400 (EDT)

68 lines

New Thread

Dazor

Re: Dazor

JoAnn Amerson

Wed, 4 Jun 1997 11:08:08 +0000

53 lines

New Thread

DEC Alpha Motherboards

DEC Alpha Motherboards

Robert Shinolt

Sat, 14 Jun 1997 18:41:31 -0700

41 lines

New Thread

DES- PTH Mathematical Mo

Re: DES- PTH Mathematical Mo

Greg Bartlett

18 Jun 1997 15:39:07 -0400

106 lines

New Thread

DES: Heatsinking SMD OpAmp

DES: Heatsinking SMD OpAmp

Dave Hammond

Wed, 18 Jun 1997 08:22:00 -0500

52 lines

New Thread

DES: High Cycle Fatigue Properties of Solder

DES: High Cycle Fatigue Properties of Solder

Prasad Godavarti-G12162

Wed, 18 Jun 1997 11:29:00 -0500

57 lines

New Thread

DES: I/O Terminations

RE: DES: I/O Terminations

Raymond Klein

Wed, 18 Jun 1997 19:10:58 -0700

49 lines

New Thread

DES: Panelization

Re: DES: Panelization

<>

Thu, 05 Jun 1997 14:06:00 EDT

139 lines

Re: DES: Panelization

Andrew G Kettlewell

Thu, 5 Jun 1997 12:48:45 -0600

88 lines

Re: DES: Panelization

<>

Wed, 4 Jun 1997 14:20:19 -0700

48 lines

DES: Panelization

Steve Collins

Wed, 4 Jun 1997 16:53:39 -0600

52 lines

DES: Panelization

Steve Collins

Wed, 4 Jun 1997 14:35:07 -0600

52 lines

DES: Panelization

Steve Collins

Wed, 4 Jun 1997 14:14:38 -0600

48 lines

New Thread

DES: PTH Mathematical Model

Re: DES: PTH Mathematical Model

Andrew J. Scholand

Wed, 18 Jun 1997 20:01:05 -0400 (EDT)

71 lines

DES: PTH Mathematical Model

Andrew J. Scholand

Wed, 18 Jun 1997 11:28:26 -0400 (EDT)

45 lines

New Thread

DES: PTH Mathematical Model -Reply

DES: PTH Mathematical Model -Reply

John Swinehart

Wed, 18 Jun 1997 14:38:57 -0400

67 lines

New Thread

DES: Track spacing for 100V on internal layers

DES: Track spacing for 100V on internal layers

Gary Willard-G10982

Mon, 2 Jun 1997 11:15:34 +0000

64 lines

New Thread

DES: Track spacing for 100V on internal layers -Reply

Re: DES: Track spacing for 100V on internal layers -Reply

<>

Mon, 9 Jun 1997 09:48:34 -0400 (EDT)

52 lines

Re: DES: Track spacing for 100V on internal layers -Reply

Duane B. Mahnke

Tue, 03 Jun 1997 20:07:00 -0700

162 lines

DES: Track spacing for 100V on internal layers -Reply

Dennis Ostendorf

Mon, 02 Jun 1997 10:50:55 -0500

99 lines

New Thread

DES:I/O Terminations

Re: DES:I/O Terminations

<>

Thu, 19 Jun 1997 10:45:37 -0500

101 lines

DES:I/O Terminations

Andreas Olofsson

Wed, 18 Jun 1997 18:50:24 -0500

53 lines

New Thread

Design, Fab & Assembly - BGA, vias and power planes

Design, Fab & Assembly - BGA, vias and power planes

Tully, Marti (AZ15)

26 Jun 1997 14:32:12 -0500

69 lines

New Thread

Did Technet disappear

Did Technet disappear

Steve Collins

Mon, 23 Jun 1997 07:39:12 -0600

43 lines

New Thread

Document IRD-DES 003

Document IRD-DES 003

<>

Wed, 25 Jun 97 08:50:07 PST

42 lines

New Thread

double sided reflow-soldering top side to bottom side

Re[2]: double sided reflow-soldering top side to bottom side

Aric J Parr

Fri, 6 Jun 1997 10:14:06 -0500

115 lines

New Thread

double sided reflow-soldering top side to bottom side parts.

Re: double sided reflow-soldering top side to bottom side parts.

Jeffery L. Hempton

Fri, 06 Jun 1997 09:51:12 -0500

86 lines

RE: double sided reflow-soldering top side to bottom side parts.

JIM ENNIS

Fri, 06 Jun 97 09:33:00 PDT

73 lines

double sided reflow-soldering top side to bottom side parts.

Aric J Parr

Fri, 6 Jun 1997 08:52:57 -0500

56 lines

New Thread

Double Soldering?

Re: Double Soldering?

Sheila Smith

Fri, 20 Jun 1997 13:11:10 -0400 (EDT)

77 lines

Double Soldering?

Doug McKean

Fri, 20 Jun 1997 12:01:26 -0400

44 lines

New Thread

Double Soldering? -Reply

Double Soldering? -Reply

Jeff McGlaughlin

Mon, 23 Jun 1997 11:17:06 -0400

57 lines

New Thread

Dry Storage

RE: Dry Storage

Dhawan, Ashok CA-WINPO2

Mon, 02 Jun 97 19:13:00 GMT

66 lines

New Thread

E-Mail massages

Re: E-Mail massages

Sheila Smith

Tue, 17 Jun 1997 14:19:45 -0400 (EDT)

57 lines

E-Mail massages

Gidon

Mon, 16 Jun 1997 23:32:00 +0000

43 lines

New Thread

Electrochemical migration

re: Electrochemical migration

<>

Wed, 18 Jun 97 14:02:44 PDT

67 lines

Electrochemical migration

<>

Tue, 17 Jun 1997 15:07:05 +0100

54 lines

New Thread

Electroless Deposition

Electroless Deposition

Steve Duke

Fri, 27 Jun 1997 11:00:47 -0500 (CDT)

55 lines

New Thread

EMC Analysis S/W

EMC Analysis S/W

Mark Radley

Thu, 19 Jun 1997 14:11:15

50 lines

New Thread

Emma 210 Driver

Emma 210 Driver

Dave Artman

Wed, 18 Jun 1997 17:00:22 -0500

51 lines

New Thread

Employment chatter

Re: Employment chatter

<>

Tue, 24 Jun 1997 10:13:36 +0600 (GMT+0600)

58 lines

Re: Employment chatter

<>

Mon, 23 Jun 1997 19:24:49 -0400 (EDT)

36 lines

Re: Employment chatter

Matt Mahlau

Mon, 23 Jun 1997 13:56:13 -0400

62 lines

Employment chatter

sam mccorkel

Fri, 20 Jun 1997 08:58:32 -0400

43 lines

New Thread

ETS300-019-1, 2, and 3

ETS300-019-1, 2, and 3

Frank Hinojos

Wed, 18 Jun 1997 10:39:25 -0700

44 lines

New Thread

Excellon SMX programing

Excellon SMX programing

c. norton

Thu, 19 Jun 1997 10:54:38 -0700

56 lines

New Thread

Expert Systems

RE: Expert Systems

Andrew J. Scholand

Sun, 29 Jun 1997 12:13:51 -0400

77 lines

RE: Expert Systems

Alderete, Michael

Sun, 29 Jun 1997 14:26:02 -0700

137 lines

Expert Systems

Jeremias Michael

Fri, 27 Jun 1997 15:35:27 -0700

53 lines

New Thread

fab

fab

Otto Jespersen

Fri, 20 Jun 1997 16:51:25 -0400

42 lines

Fab

Engineering / Design Dept.

Fri, 06 Jun 1997 15:14:15 -0700

44 lines

FAB

Scott Westheimer-CTUA143

Tue, 3 Jun 1997 21:28:53 -0500

40 lines

New Thread

FAB - chemical and physical properties of PCB board material

RE: FAB - chemical and physical properties of PCB board material

Andrew J. Scholand

Tue, 24 Jun 1997 04:37:26 -0400 (EDT)

77 lines

FAB - chemical and physical properties of PCB board material

Dr. Jolyon Browne

Mon, 23 Jun 1997 11:03:07 -0700

58 lines

New Thread

FAB and ASSY: Spec for Electroless Ni and Immersion A

Re[2]: FAB and ASSY: Spec for Electroless Ni and Immersion A

dmitchel

Wed, 04 Jun 97 07:43:57 PST

109 lines

New Thread

FAB and ASSY: Spec for Electroless Ni and Immersion Au

RE: FAB and ASSY: Spec for Electroless Ni and Immersion Au

Jim Herard

Thu, 5 Jun 1997 13:16:38 -0400

157 lines

Re: FAB and ASSY: Spec for Electroless Ni and Immersion Au

<>

Wed, 4 Jun 1997 19:01:54 -0400 (EDT)

46 lines

Re: FAB and ASSY: Spec for Electroless Ni and Immersion Au

Jim Herard

Wed, 4 Jun 1997 10:34:48 -0400

91 lines

FAB and ASSY: Spec for Electroless Ni and Immersion Au

Reed, Randy

Tue, 03 Jun 1997 13:44 -0800

45 lines

New Thread

FAB equipment, non-contact pyrometer

RE: FAB equipment, non-contact pyrometer

John Nelson

Wed, 25 Jun 1997 08:17:13 -0400

41 lines

New Thread

Fab/Assy: Decapsulant method

Re: Fab/Assy: Decapsulant method

Michael Barmuta

Fri, 6 Jun 1997 15:33:23 -0700

86 lines

Fab/Assy: Decapsulant method

<>

Fri, 6 Jun 97 12:46:44 PDT

50 lines

New Thread

FAB/ASSY: PCMCIA

FAB/ASSY: PCMCIA

<>

Tue, 10 Jun 1997 09:20:49 -0500

55 lines

New Thread

Fab: Addition of Controled Impedance Conductors

Fab: Addition of Controled Impedance Conductors

Avner Drory

Sun, 15 Jun 1997 22:05:06 +-300

64 lines

New Thread

FAB: APM Radiometers

Re: FAB: APM Radiometers

<>

Wed, 25 Jun 1997 00:05:55 -0400 (EDT)

51 lines

Re: FAB: APM Radiometers

Michael Barmuta

Tue, 24 Jun 1997 14:59:39 -0700

80 lines

Re: FAB: APM Radiometers

<>

Tue, 24 Jun 97 15:09:22 -0800

73 lines

FAB: APM Radiometers

Scott

Tue, 24 Jun 1997 10:24:25 -0400

45 lines

New Thread

FAB: conveyorized 'durabond'

Re: FAB: conveyorized 'durabond'

<>

Wed, 4 Jun 1997 15:05:55 -0400 (EDT)

39 lines

FAB: conveyorized 'durabond'

J.Felts

Mon, 2 Jun 1997 23:22:23 -0700

47 lines

New Thread

FAB: Copper foil compatability

FAB: Copper foil compatability

Saccomanno, Tom

Fri, 27 Jun 1997 10:51:55 -0400

38 lines

New Thread

Fab: CRM5 Material

Fab: CRM5 Material

Todd Rodgers

Tue, 3 Jun 1997 11:20:40 -0500

43 lines

FAB: CRM5 Material

Todd Rodgers

Mon, 2 Jun 1997 08:23:35 -0500

43 lines

New Thread

fab: drilling

Re: fab: drilling

Motoyo Wajima

Wed, 04 Jun 1997 08:44:51 +0900

98 lines

Re: fab: drilling

Motoyo Wajima

Wed, 04 Jun 1997 08:43:50 +0900

96 lines

Re: fab: drilling

Motoyo Wajima

Tue, 03 Jun 1997 18:21:55 +0900

98 lines

New Thread

Fab: Drilling/routing dust

Fab: Drilling/routing dust

Matt Mahlau

Mon, 2 Jun 1997 15:08:59 -0400

43 lines

New Thread

FAB: Etching Double-Treat foil.

Re: FAB: Etching Double-Treat foil.

<>

Fri, 13 Jun 97 09:33:27 EST

80 lines

FAB: Etching Double-Treat foil.

<>

Thu, 12 Jun 1997 16:00:28 -0400 (EDT)

53 lines

New Thread

FAB: Hole tolerances

FAB: Hole tolerances

Mike Buetow

Mon, 2 Jun 1997 14:47:39 -0500 (CDT)

56 lines

New Thread

Fab: Horizontal Oxide Line

Re: Fab: Horizontal Oxide Line

<>

Wed, 4 Jun 1997 02:00:31 -0400 (EDT)

40 lines

Fab: Horizontal Oxide Line

Scott B. Westheimer

Tue, 3 Jun 1997 21:07:17 +0800

57 lines

New Thread

FAB: Instrument for PTH Cu measurement.

FAB: Instrument for PTH Cu measurement.

Lars Ladefoged Holm

Wed, 25 Jun 1997 06:59:14 +0000

56 lines

New Thread

FAB: Lap shear test

Re: FAB: Lap shear test

Delsen Testing Laboratories

Mon, 30 Jun 1997 13:25:46 -0700

74 lines

Re: FAB: Lap shear test

ddhillma

Mon, 30 Jun 97 12:47:25 cst

79 lines

FAB: Lap shear test

Yud

Mon, 30 Jun 1997 00:09:50 +0300

52 lines

New Thread

FAB: LPI

Re: FAB: LPI

<>

Sat, 7 Jun 1997 14:22:01 -0400 (EDT)

51 lines

Re: FAB: LPI

Paul Gould

Thu, 5 Jun 1997 23:23:07 +0100

76 lines

FAB: LPI

Joe Lee

Thu, 5 Jun 1997 00:34:50 -0700

41 lines

New Thread

Fab: LPI soldermask

Fab: LPI soldermask

sam mccorkel

Thu, 26 Jun 1997 13:01:39 -0400

47 lines

New Thread

FAB: Material - FR10

RE: FAB: Material - FR10

<>

Wed, 11 Jun 1997 11:31:42 +0100

54 lines

Re: FAB: Material - FR10

Brock Hunter

Tue, 10 Jun 1997 14:18:39 -0400 (EDT)

61 lines

Re: FAB: Material - FR10

Frank Hinojos

Tue, 10 Jun 1997 11:05:27 -0700

71 lines

FAB: Material - FR10

John Parsons

Tue, 10 Jun 1997 10:46:22 +0000

47 lines

New Thread

FAB: Material ; G-10

Re: FAB: Material ; G-10

David Heywood

Fri, 13 Jun 1997 18:49:34 -0400

45 lines

RE: FAB: Material ; G-10

<>

Wed, 11 Jun 1997 15:46:45 -0700

113 lines

Re: FAB: Material ; G-10

<>

Wed, 11 Jun 1997 17:14:10 -0400 (EDT)

39 lines

Re: FAB: Material ; G-10

<>

Wed, 11 Jun 1997 15:31:14 -0400 (EDT)

38 lines

FAB: Material ; G-10

Gary Peterson

Wed, 11 Jun 1997 09:06:16 -0600

53 lines

New Thread

FAB: Material Certificate?

FAB: Material Certificate?

Jim Herard

Tue, 3 Jun 1997 11:52:35 -0400

108 lines

New Thread

FAB: Plating Thickness inside hole walls ; reliability of measurement

FAB: Plating Thickness inside hole walls ; reliability of measurement

Paul Gould

Mon, 9 Jun 1997 15:45:02 +0100

67 lines

New Thread

FAB: RE: Question on Pad Leveling

Re: FAB: RE: Question on Pad Leveling

EDDIE ROCHA

Fri, 13 Jun 97 11:47:51 EDT

43 lines

Re[2]: FAB: RE: Question on Pad Leveling

ddhillma

Thu, 12 Jun 97 20:45:42 cst

201 lines

Re[2]: FAB: RE: Question on Pad Leveling

Frank Hinojos

Thu, 12 Jun 1997 16:30:22 -0700

258 lines

FAB: RE: Question on Pad Leveling

<>

Thu, 12 Jun 97 16:26:55 EST

112 lines

Re: FAB: RE: Question on Pad Leveling

gabriela

Thu, 12 Jun 1997 22:00:27 +0000

152 lines

FAB: RE: Question on Pad Leveling

Patrick Ducas

Thu, 12 Jun 1997 14:10:56 -0400

100 lines

Re: FAB: RE: Question on Pad Leveling

Frank Hinojos

Thu, 12 Jun 1997 09:16:58 -0700

94 lines

FAB: RE: Question on Pad Leveling

<>

Thu, 12 Jun 97 10:47:24 EST

65 lines

New Thread

Fab: Rinse water quality

Fab: Rinse water quality

Scott B. Westheimer

Thu, 12 Jun 1997 20:32:36 +0800

46 lines

New Thread

FAB: tin only over copper on antenna design

Re: FAB: tin only over copper on antenna design

<>

Wed, 25 Jun 1997 09:22:41 -0400 (EDT)

42 lines

Re: FAB: tin only over copper on antenna design

Thomas E. Waznis

23 Jun 97 23:22:34 -0800

56 lines

FAB: tin only over copper on antenna design

Ed Cosper

Mon, 23 Jun 1997 15:53:25 -0500

60 lines

New Thread

FAB: Unbalance Copper Core

FAB: Unbalance Copper Core

<>

Thu, 19 Jun 1997 10:09:15 -0500

54 lines

New Thread

Fab: Wanted PWB Shop to Purchase

Fab: Wanted PWB Shop to Purchase

<>

Thu, 5 Jun 1997 12:00:43 -0400 (EDT)

58 lines

New Thread

Fab:Disposal of drilling/routing dust

Fab:Disposal of drilling/routing dust

Matthew Mahlau

Mon, 02 Jun 1997 14:07:08 -0400

42 lines

New Thread

FAB:Resin Removal from Tooling holes

Re: FAB:Resin Removal from Tooling holes

<>

Wed, 25 Jun 1997 23:07:31 -0400 (EDT)

55 lines

FAB:Resin Removal from Tooling holes

Doug Jeffery

Wed, 25 Jun 1997 05:19:09 -0500 (CDT)

65 lines

New Thread

Fab:Router dust

Re: Fab:Router dust

Ted Stern

Mon, 02 Jun 1997 14:16:37 -0700

113 lines

Fab:Router dust

Matthew Mahlau

Mon, 02 Jun 1997 13:58:05 -0400

42 lines

New Thread

Fabrication

Fabrication

<>

Mon, 02 Jun 97 13:58:29 EDT

48 lines

New Thread

FEB- ceramic BGA crackin

Re: FEB- ceramic BGA crackin

Greg Bartlett

13 Jun 1997 09:09:59 -0400

154 lines

New Thread

FEB: ceramic BGA cracking after wave solder

FEB: ceramic BGA cracking after wave solder

Jim Herard

Thu, 12 Jun 1997 17:47:58 -0400

80 lines

FEB: ceramic BGA cracking after wave solder

Sheila Smith

Wed, 11 Jun 1997 11:59:45 -0400 (EDT)

44 lines

New Thread

FW: ASSEM--PCB Marking Methods

FW: ASSEM--PCB Marking Methods

Dhawan, Ashok CA-WINPO2

Mon, 16 Jun 97 13:36:00 GMT

97 lines

New Thread

FW: ASSY:Au/Ni Coated Boards

Re: FW: ASSY:Au/Ni Coated Boards

Jim Herard

Mon, 2 Jun 1997 10:54:53 -0400

221 lines

New Thread

FW: Bowing off Tantulam Caps

FW: Bowing off Tantulam Caps

Dhawan, Ashok CA-WINPO2

Mon, 09 Jun 97 17:32:00 GMT

171 lines

New Thread

FW: Chlorine damage to electronics (fwd)

FW: Chlorine damage to electronics (fwd)

Paul Terranova

Tue, 17 Jun 1997 16:33:31 -0400

95 lines

New Thread

FW: Cleanliness of assembled boards

FW: Cleanliness of assembled boards

Graham Naisbitt

Thu, 26 Jun 97 17:42:55 UT

139 lines

New Thread

FW: Cross Section Service

FW: Cross Section Service

<>

Tue, 24 Jun 1997 14:19:07 -0700

95 lines

FW: Cross Section Service

<>

Tue, 24 Jun 1997 09:48:52 -0700

95 lines

FW: Cross Section Service

Paul Terranova

Tue, 24 Jun 1997 09:30:50 -0400

123 lines

New Thread

FW: DES: Panelization

FW: DES: Panelization

Dhawan, Ashok CA-WINPO2

Thu, 05 Jun 97 18:17:00 GMT

156 lines

New Thread

FW: Dry Storage

Re: FW: Dry Storage

Allen Hertz

Tue, 03 Jun 1997 09:09:41 -0500 (EST)

78 lines

FW: Dry Storage

[log in to unmask]

Mon, 2 Jun 1997 12:21:23 -0500

58 lines

FW: Dry Storage

Snider, Scott/NTSEUG

Mon, 02 Jun 97 09:05:00 PDT

42 lines

New Thread

FW: EMC Analysis S/W

FW: EMC Analysis S/W

Mark Radley

Thu, 19 Jun 1997 16:12:48

51 lines

New Thread

FW: Hot Air Knife after solder pot?? Anyone use this?

FW: Hot Air Knife after solder pot?? Anyone use this?

Dhawan, Ashok CA-WINPO2

Fri, 13 Jun 97 15:55:00 GMT

88 lines

New Thread

FW: Intrusive Reflow

FW: Intrusive Reflow

Dhawan, Ashok CA-WINPO2

Fri, 20 Jun 97 02:14:00 GMT

79 lines

New Thread

FW: Nitto Tape

FW: Nitto Tape

Dhawan, Ashok CA-WINPO2

Fri, 27 Jun 97 19:05:00 GMT

64 lines

New Thread

FW: PEM reflow

Re: FW: PEM reflow

Prasad Godavarti-G12162

Fri, 6 Jun 1997 16:24:00 -0500

102 lines

FW: PEM reflow

John Guy

Fri, 6 Jun 1997 13:28:20 -0500

72 lines

New Thread

Fw: PLASTIC RIVET MACHINE SUPPLIER

Fw: PLASTIC RIVET MACHINE SUPPLIER

Scott B. Westheimer

Fri, 27 Jun 1997 18:08:26 +0800

58 lines

New Thread

FW: plugged vias

FW: plugged vias

Gagnon, Gerry

Wed, 18 Jun 1997 09:47:43 -0400

73 lines

New Thread

FW: Press Pin Assembly Equipmen

FW: Press Pin Assembly Equipmen

Dhawan, Ashok CA-WINPO2

Thu, 19 Jun 97 15:30:00 GMT

79 lines

New Thread

FW: Re: palladium plating

FW: Re: palladium plating

<>

Wed, 11 Jun 1997 13:43:24 -0700

114 lines

New Thread

FW: removing solder mask

FW: removing solder mask

Blanchet,Richard

Thu, 19 Jun 1997 09:40:00 -0400 (EDT)

62 lines

New Thread

FW: Tented Vias

FW: Tented Vias

Paul Terranova

Wed, 25 Jun 1997 15:03:33 -0400

117 lines

New Thread

Fwd: Fab: Rinse water quality

RE: Fwd: Fab: Rinse water quality

Goldman, Patricia J.

Thu, 19 Jun 97 08:31:00 PDT

90 lines

RE: Fwd: Fab: Rinse water quality

Bob Lundquist

Wed, 18 Jun 97 15:36:00 PDT

68 lines

Fwd: Fab: Rinse water quality

<>

Wed, 18 Jun 1997 12:46:30 -0400 (EDT)

204 lines

New Thread

Fwd: RE: FAB equipment, non-contact pyrometer

Fwd: RE: FAB equipment, non-contact pyrometer

Edward J Popielarski

Wed, 25 Jun 1997 10:18:48 -0500 (CDT)

105 lines

New Thread

GEN - Image processing for PCB inspection

GEN - Image processing for PCB inspection

Dr. Jolyon Browne

Tue, 17 Jun 1997 17:47:32 -0700

58 lines

New Thread

Gen- Durometer Measurement

Re: Gen- Durometer Measurement

sbryan

Mon, 02 Jun 97 07:05:49 PST

72 lines

New Thread

Gen: R&D

Re: Gen: R&D

<>

Tue, 24 Jun 1997 10:13:24 +0600 (GMT+0600)

60 lines

Gen: R&D

Josep Sajut

Sun, 22 Jun 1997 22:53:38 -0400

44 lines

New Thread

GEN: S.M. adhesives

GEN: S.M. adhesives

Rob Palson

Mon, 9 Jun 1997 16:29:24 +0000

47 lines

New Thread

GEN: SUPPLIER

Re: GEN: SUPPLIER

<>

Mon, 9 Jun 1997 14:27:24 -0400 (EDT)

40 lines

GEN: SUPPLIER

Jim Marsico 516-595-5879

Mon, 09 Jun 1997 10:22:00 -0400 (EDT)

60 lines

New Thread

Gen: Wanted,Tackroller

Re: Gen: Wanted,Tackroller

<>

Tue, 10 Jun 1997 10:38:01 -0400 (EDT)

40 lines

Re: Gen: Wanted,Tackroller

Scott

Mon, 09 Jun 1997 21:40:53 -0400

67 lines

Re: Gen: Wanted,Tackroller

<>

Mon, 09 Jun 97 13:54:55 EST

38 lines

Gen: Wanted,Tackroller

Timothy Gaylor

Mon, 9 Jun 1997 13:25:56 -0400

46 lines

New Thread

Gen: Wanted,Tackroller -Reply

Re: Gen: Wanted,Tackroller -Reply

Bob Stumpf

Tue, 10 Jun 1997 15:52:39 -0700

103 lines

New Thread

General: Vision Inspection of Built Up Assemblies

Re: General: Vision Inspection of Built Up Assemblies

gabriela

Tue, 03 Jun 1997 20:21:26 +0000

82 lines

Re: General: Vision Inspection of Built Up Assemblies

Greg Parke

Mon, 2 Jun 1997 10:39:21 -0400

58 lines

General: Vision Inspection of Built Up Assemblies

Clarke, Robert HSD

Mon, 02 Jun 1997 08:51:14 -0400

111 lines

New Thread

General: Vision Inspection of Built Up Assemblies -Reply

Re: General: Vision Inspection of Built Up Assemblies -Reply

Andre Bisson

Wed, 04 Jun 1997 09:14:59 -0300

106 lines

New Thread

Glaser DP3545 Photoplotter

Glaser DP3545 Photoplotter

K.Varadaraj@CADET, India

Sat, 14 Jun 1997 08:55:55 +0530

48 lines

New Thread

Globtop Decapsulation

Re: Globtop Decapsulation

gabriela

Tue, 03 Jun 1997 20:05:36 +0000

74 lines

Globtop Decapsulation

John Barton

Tue, 3 Jun 1997 15:02:27 +0000

54 lines

New Thread

Gold Finger Touch Up

Re: Gold Finger Touch Up

Paul Gould

Mon, 16 Jun 1997 22:21:30 +0100

62 lines

Re: Gold Finger Touch Up

<>

Mon, 16 Jun 1997 15:45:16 -0400

45 lines

Re: Gold Finger Touch Up

Aric J Parr

Mon, 16 Jun 1997 14:08:49 -0500

72 lines

Gold Finger Touch Up

Denis Meloche

Mon, 16 Jun 1997 13:50:59 -0400

45 lines

New Thread

Gold/Tin-soldering

RE: Gold/Tin-soldering

<>

Fri, 13 Jun 1997 15:18:25 +0100

139 lines

Gold/Tin-soldering

<>

Fri, 13 Jun 97 14:41:39 +0200

52 lines

New Thread

HALT / HASS physical stress systems

Re: HALT / HASS physical stress systems

Frank Hinojos

Wed, 25 Jun 1997 14:31:01 -0700

70 lines

Re: HALT / HASS physical stress systems

Vickie Chapman

Wed, 25 Jun 1997 11:13:39 -0700

71 lines

HALT / HASS physical stress systems

<>

Wed, 25 Jun 1997 08:42:11 -0400

45 lines

New Thread

Hasl thickness...

Hasl thickness...

MARK SIMMONS

Wed, 18 Jun 1997 14:23:30 -0700

45 lines

Re: HASL thickness...

ddhillma

Wed, 18 Jun 97 08:30:35 cst

80 lines

HASL thickness...

MARK SIMMONS

Sat, 14 Jun 1997 06:44:04 -0700

49 lines

New Thread

Hello...

Hello...

Lyle Dove

Tue, 17 Jun 1997 22:26:41

54 lines

New Thread

High Cycle Fatigue Properties of Solder

Re: High Cycle Fatigue Properties of Solder

<>

Thu, 19 Jun 1997 13:09:38 -0500

42 lines

Re: High Cycle Fatigue Properties of Solder

<>

Thu, 19 Jun 1997 13:51:25 -0400 (EDT)

49 lines

New Thread

Hot Air Knife after solder pot?? Anyone use this?

Re[2]: Hot Air Knife after solder pot?? Anyone use this?

Aric J Parr

Tue, 17 Jun 1997 09:08:33 -0500

159 lines

Re: Hot Air Knife after solder pot?? Anyone use this?

Ron Hollandsworth

Mon, 16 Jun 97 13:28:57 -0500

117 lines

Hot Air Knife after solder pot?? Anyone use this?

Edward J Popielarski

Mon, 16 Jun 1997 12:23:38 -0500 (CDT)

61 lines

Hot Air Knife after solder pot?? Anyone use this?

Tony Stewart

Fri, 6 Jun 1997 14:45:49 -0500

92 lines

New Thread

How do you use Material Certificate?

RE: How do you use Material Certificate?

Darrell Bonzo

Tue, 03 Jun 97 7:45

171 lines

How do you use Material Certificate?

KoizumiT

Tue, 03 Jun 97 10:34:25 JST

49 lines

New Thread

Idents and HASL

Idents and HASL

David Arivett

Mon, 30 Jun 1997 16:20:55 -0500 (CDT)

46 lines

New Thread

Idents before or after HASL

Re: Idents before or after HASL

<>

Sun, 29 Jun 1997 01:53:15 -0400 (EDT)

55 lines

Re: Idents before or after HASL

<>

Sat, 28 Jun 1997 13:41:29 -0400 (EDT)

44 lines

RE: Idents before or after HASL

Kenny, James

Fri, 27 Jun 1997 10:08 -0800

79 lines

Idents before or after HASL

<>

Fri, 27 Jun 1997 11:45:03 GMT

45 lines

New Thread

Idents before or after HASL-- Reply

Idents before or after HASL-- Reply

Jim Herard

Fri, 27 Jun 1997 12:05:37 -0400

75 lines

New Thread

IMS Material

Re: IMS Material

Ulrich Korndoerfer

Fri, 13 Jun 1997 23:42:01 +0200

64 lines

Re: IMS Material

<>

Wed, 11 Jun 97 08:21:55 CDT

54 lines

IMS Material

Elizabeth Falk

Wed, 11 Jun 1997 08:23:16 -0400

49 lines

New Thread

INFO: Charles Hutchins

INFO: Charles Hutchins

Jack Crawford

Mon, 2 Jun 1997 12:33:51 -0500

56 lines

New Thread

INFO: Charles Hutchins -Reply

INFO: Charles Hutchins -Reply

Eric Siegel

Mon, 02 Jun 1997 15:48:19 -0400

43 lines

New Thread

Insulation Displacement Connectors

Insulation Displacement Connectors

Jim Herard

Wed, 25 Jun 1997 12:07:44 -0400

93 lines

Insulation Displacement Connectors

Howard Feldmesser

Tue, 24 Jun 1997 17:24:43 -0400

45 lines

New Thread

Intrusive Reflow

Re: Intrusive Reflow

Jeffery L. Hempton

Mon, 23 Jun 1997 07:43:34 -0500

71 lines

Intrusive Reflow

Denis Meloche

Thu, 19 Jun 1997 12:31:31 -0400

45 lines

New Thread

Ionic contamination specs

RE:Ionic contamination specs

Karl Ring

Fri, 13 Jun 1997 04:33:03 -0400

61 lines

New Thread

IONIC TESTING

Re: IONIC TESTING

<>

Thu, 19 Jun 1997 12:48:29 -0400 (EDT)

41 lines

IONIC TESTING

Graham Naisbitt

Fri, 13 Jun 97 15:52:03 UT

46 lines

New Thread

IPC-A-610B Quality Levels

IPC-A-610B Quality Levels

Ed Koyama

Thu, 26 Jun 1997 17:42:30 -0400

57 lines

New Thread

IR Reflow Ovens & Wetting Balance

IR Reflow Ovens & Wetting Balance

<>

Mon, 9 Jun 1997 08:16:46 -0500

49 lines

New Thread

ISO Discussion Forum

RE: ISO Discussion Forum

<>

Fri, 13 Jun 97 9:45:43 PDT

146 lines

New Thread

ISO9002

Re: ISO9002

<>

Thu, 19 Jun 97 09:00:06 PST

68 lines

ISO9002

sam mccorkel

Wed, 18 Jun 1997 12:35:45 -0400

46 lines

Re: ISO9002

Jeffery L. Hempton

Fri, 13 Jun 1997 11:32:26 -0500

52 lines

Re: ISO9002

<>

Fri, 13 Jun 1997 12:07:15 -0500

95 lines

ISO9002

sam mccorkel

Fri, 13 Jun 1997 08:32:56 -0400

39 lines

New Thread

ISO9002 (fwd)

Re: ISO9002 (fwd)

David Bergman

Tue, 17 Jun 1997 12:06:57 -0500 (CDT)

90 lines

New Thread

John Sohn: Out of Office AutoReply: Cleanliness of assembled

RE: John Sohn: Out of Office AutoReply: Cleanliness of assembled

Graham Naisbitt

Thu, 26 Jun 97 17:47:15 UT

51 lines

New Thread

Koax plating

Koax plating

<>

Thu, 12 Jun 97 15:19:10 +0200

43 lines

New Thread

LCC

Re:LCC

Guenter Grossmann

Wed, 11 Jun 1997 09:59:36 +0200

51 lines

New Thread

LCC Solder Joint

Re[2]: LCC Solder Joint

Frank Hinojos

Tue, 10 Jun 1997 08:56:07 -0700

80 lines

Re: LCC Solder Joint

Kasprzak, Bill (esd) US

Tue, 10 Jun 97 07:21:00 PDT

52 lines

Re: LCC solder joint

<>

Mon, 9 Jun 1997 22:39:36 -0400 (EDT)

51 lines

Re: LCC solder joint

<>

Mon, 9 Jun 1997 12:36:43 -0400 (EDT)

75 lines

RE: LCC solder joint

Steve Tetorka

Mon, 9 Jun 1997 11:53:00 -0800

84 lines

Re: LCC solder joint

Aric J Parr

Mon, 9 Jun 1997 10:57:22 -0500

71 lines

LCC solder joint

Steve Siu

Mon, 9 Jun 1997 08:37:46 -0800

51 lines

New Thread

Linguistics

Re: Linguistics

<>

Fri, 6 Jun 1997 12:11:17 -0400 (EDT)

42 lines

Linguistics

<>

Thu, 05 Jun 97 15:35:02 EDT

50 lines

New Thread

Looking for CAD software

Looking for CAD software

<>

Thu, 19 Jun 1997 12:18:23 -0700

53 lines

New Thread

Looking to buy used CAD software

Looking to buy used CAD software

Mark Ross

Wed, 18 Jun 1997 12:15:34 -0700

54 lines

New Thread

LPI soldermask

RE: LPI soldermask

John Nelson

Thu, 26 Jun 1997 14:04:15 -0400

82 lines

New Thread

LPISM STRIPPING

Re: LPISM STRIPPING

Lenny Kurup

Mon, 16 Jun 1997 11:52:08 -0400 (EDT)

72 lines

LPISM STRIPPING

Lenny Kurup

Mon, 16 Jun 1997 11:33:43 -0400 (EDT)

54 lines

New Thread

LPSIM Stripping

Re: LPSIM Stripping

Lenny Kurup

Mon, 16 Jun 1997 14:39:59 -0400 (EDT)

85 lines

LPSIM Stripping

Lynch, Lyn

Mon, 16 Jun 97 10:09:12

55 lines

New Thread

Mailbox getting too full from TechNet??

Mailbox getting too full from TechNet??

Tony Stewart

Wed, 11 Jun 1997 17:48:51 -0500

135 lines

New Thread

me too.....

me too.....

KoizumiT

Wed, 18 Jun 97 11:49:49 JST

50 lines

New Thread

Measuring QFP Lead Pitch

Re: Measuring QFP Lead Pitch

Charles Elliott

4 Jun 1997 16:14:46 U

138 lines

Measuring QFP Lead Pitch

<>

4 Jun 1997 14:13:56 -0500

59 lines

New Thread

Message not deliverable

Message not deliverable

Lynch, Lyn

Thu, 26 Jun 97 12:35:13

105 lines

Message not deliverable

<>

Wed, 04 Jun 97 16:23:56 EST

74 lines

New Thread

MIL-P-11268

MIL-P-11268

Elizabeth

Wed, 18 Jun 1997 15:52:15 -0400

45 lines

MIL-P-11268

Elizabeth

Wed, 18 Jun 1997 15:07:31 -0400

45 lines

New Thread

Mill Dies

Re: Mill Dies

John Coonrod

Wed, 04 Jun 1997 15:56:00 -0700

111 lines

Mill Dies

Nelson Calimquim

Tue, 3 Jun 1997 14:43:48 -0700

46 lines

New Thread

Minimum gold plating on gold tabs

Re: Minimum gold plating on gold tabs

<>

Fri, 6 Jun 1997 15:04:01 -0400 (EDT)

44 lines

Minimum gold plating on gold tabs

starr devere

Fri, 6 Jun 1997 10:23:52 MST

38 lines

New Thread

Minimum gold plating on gold tabs -Reply

Minimum gold plating on gold tabs -Reply

Jeff McGlaughlin

Fri, 06 Jun 1997 15:02:57 -0400

62 lines

New Thread

Modifications to PCBs with 30AWG wire...

RE: Modifications to PCBs with 30AWG wire...

Lepsche, Thomas G (NM75)

Wed, 18 Jun 1997 10:28:35 -0600

94 lines

Re: Modifications to PCBs with 30AWG wire...

<>

Wed, 18 Jun 1997 07:59:22 -0400

54 lines

Re: Modifications to PCBs with 30AWG wire...

Doug McKean

Tue, 17 Jun 1997 14:53:28 -0400

69 lines

Modifications to PCBs with 30AWG wire...

Doug McKean

Mon, 16 Jun 1997 15:38:49 -0400

47 lines

New Thread

N2-bags

Re: N2-bags

scott birnbaum

Wed, 25 Jun 97 22:17:48 PDT

44 lines

Re: N2-bags

<>

Wed, 25 Jun 1997 11:12:04 -0500

114 lines

N2-bags

<>

Wed, 25 Jun 97 16:39:04 +0200

52 lines

New Thread

Need Carbon Capability Prototype Fab Shop.

Re: Need Carbon Capability Prototype Fab Shop.

72030,3271

04 Jun 97 20:42:55 EDT

42 lines

Need Carbon Capability Prototype Fab Shop.

Beller, Les

Wed, 4 Jun 1997 11:54:08 -0600

49 lines

New Thread

New Printed Wiring Board Technology

New Printed Wiring Board Technology

Rob Dabney

Wed, 25 Jun 1997 09:46:39 -0700

91 lines

New Printed Wiring Board Technology

Rob Dabney

Wed, 25 Jun 1997 09:46:39 -0700

88 lines

New Thread

Nitto Tape

RE: Nitto Tape

<>

Thu, 26 Jun 1997 8:06:52 +0000

147 lines

RE: Nitto Tape

<>

Thu, 26 Jun 1997 8:06:52 +0000

54 lines

Re: Nitto Tape

KoizumiT

Thu, 26 Jun 97 11:46:50 JST

58 lines

Nitto Tape

Nelson Calimquim

Wed, 25 Jun 1997 16:30:01 -0700

43 lines

New Thread

No-clean/Test Probes/Cleaning

Re: No-clean/Test Probes/Cleaning

Aric J Parr

Fri, 27 Jun 1997 09:50:26 -0500

129 lines

No-clean/Test Probes/Cleaning

Ron Hollandsworth

Fri, 27 Jun 97 08:21:25 -0500

87 lines

New Thread

Non-halogenated fore retardant additives for laminates

Non-halogenated fore retardant additives for laminates

kathy barthman

Tue, 10 Jun 1997 14:40:11 -0700

52 lines

New Thread

OSP

OSP

Tamir Ben-Shoshan

Sun, 01 Jun 97 08:00:53 EST

39 lines

New Thread

palladium plating

Re: palladium plating

<>

Sun, 15 Jun 1997 08:41:26 -0400 (EDT)

46 lines

Re: palladium plating

Sheila Smith

Wed, 11 Jun 1997 13:02:26 -0400 (EDT)

59 lines

palladium plating

Crown Circuits Inc.

Wed, 11 Jun 97 09:38 PDT

44 lines

New Thread

paste measurement

Re: paste measurement

<>

Mon, 30 Jun 1997 10:44:29 -0400 (EDT)

40 lines

paste measurement

MIKE J. LOPEZ

Wed, 18 Jun 1997 13:28:48 -0400

39 lines

New Thread

Patent Search Web Site

Re[2]: Patent Search Web Site

Ron Hollandsworth

Thu, 05 Jun 97 10:10:38 -0500

145 lines

RE: Patent Search Web Site

Joseph Fjelstad

Wed, 4 Jun 1997 17:19:36 -0700

53 lines

RE: Patent Search Web Site

william spalton

Thu, 5 Jun 97 9:10:23 EDT

131 lines

RE: Patent Search Web Site

John Guy

Thu, 5 Jun 1997 07:41:44 -0500

112 lines

RE: Patent Search Web Site

William Johnson

Wed, 4 Jun 97 21:13:14 UT

76 lines

Patent Search Web Site

Joseph Fjelstad

Tue, 3 Jun 1997 23:27:00 -0700

61 lines

New Thread

PC Cards

Re: PC Cards

Jerry Cupples

Fri, 13 Jun 1997 10:27:29 -0500

105 lines

PC Cards

<>

Fri, 13 Jun 1997 11:37:15 +0100

53 lines

New Thread

PCB Lacquer

PCB Lacquer

Martin Dooner *

Wed, 18 Jun 1997 23:38:05 +0100

80 lines

New Thread

PCMCIA STANDARDS

Re: PCMCIA STANDARDS

Lisa Williams

Thu, 12 Jun 1997 12:23:22 -0500 (CDT)

80 lines

PCMCIA STANDARDS

<>

Thu, 12 Jun 1997 11:58:16 +0100

54 lines

New Thread

PHOTOPLOTTER 4 SALE + PROBIMER LINE

PHOTOPLOTTER 4 SALE + PROBIMER LINE

Roland Jaquet

Tue, 24 Jun 1997 15:51:59 +0200

75 lines

New Thread

placement system

placement system

Valladares, Hector A (FL51)

Mon, 30 Jun 1997 16:18:53 -0400

39 lines

New Thread

PLASTIC RIVET MACHINE SUPPLIER

Re: PLASTIC RIVET MACHINE SUPPLIER

Tomer_2

Mon, 30 Jun 1997 15:51:17 +0000

53 lines

PLASTIC RIVET MACHINE SUPPLIER

Danny Yam-CTUA124

Fri, 27 Jun 1997 2:09:11 -0500

43 lines

New Thread

Plating over Monel

Re: Plating over Monel

<>

Wed, 4 Jun 1997 11:18:18 -0400 (EDT)

40 lines

New Thread

plugged vias

Re: plugged vias

<>

18 Jun 97 08:33:56 EDT

113 lines

plugged vias

Jim Herard

Tue, 17 Jun 1997 16:59:56 -0400

112 lines

Re: plugged vias

Frank Hinojos

Tue, 17 Jun 1997 12:17:53 -0700

92 lines

plugged vias

David Arivett

Mon, 16 Jun 1997 14:43:23 -0500 (CDT)

62 lines

New Thread

Press Pin Assembly Equipmen

Press Pin Assembly Equipmen

Natalie Sharp

18 Jun 1997 15:56:02 U

53 lines

New Thread

Press Pin Assembly Equipmen -Reply

Press Pin Assembly Equipmen -Reply

RICH BUCCIERI

Thu, 19 Jun 1997 08:55:56 -0600

95 lines

New Thread

Preventive Maintenance Software

Preventive Maintenance Software

Steve Smith

Tue, 24 Jun 1997 15:25:37 -0700

43 lines

New Thread

Previous Message By Myself

Previous Message By Myself

Lyle Dove

Tue, 17 Jun 1997 22:31:48

51 lines

New Thread

Price Fixing and Restraints of Trade

Re: Price Fixing and Restraints of Trade

Josep Sajut

Thu, 26 Jun 1997 05:37:21 -0400

41 lines

Price Fixing and Restraints of Trade

William Johnson

Wed, 25 Jun 97 17:45:42 UT

36 lines

New Thread

Primary Image ( outer layers )

Primary Image ( outer layers )

<>

Thu, 05 Jun 97 14:29:34 -0800

52 lines

New Thread

Profiling PCB's

Profiling PCB's

Kasprzak, Bill (esd) US

Wed, 25 Jun 97 15:18:00 PDT

45 lines

profiling pcb's

Rob Williams

Wed, 25 Jun 1997 11:35:27 -0500

50 lines

New Thread

PTH Mathematical Model

Re: PTH Mathematical Model

<>

Thu, 19 Jun 1997 07:35:37 -0400 (EDT)

50 lines

New Thread

Pumice Source

Pumice Source

<>

Thu, 12 Jun 1997 16:36:35 -0400 (EDT)

37 lines

New Thread

QS-9000 standard

Re: QS-9000 standard

Murphy Steve (UO/ESS)

Fri, 13 Jun 1997 08:02:07 -0400

63 lines

Re: QS-9000 standard

<>

Thu, 12 Jun 1997 18:36:32 -0500

107 lines

QS-9000 standard

David Hall

Thu, 12 Jun 1997 12:50:17 PST

50 lines

New Thread

Question on Pad Leveling???

RE: Question on Pad Leveling???

Kearney, Donald J (RFC MS-Mail)

Thu, 12 Jun 1997 09:39:00 -0400

53 lines

New Thread

R: Pumice Source

R: Pumice Source

Alessandro ROSSI

Fri, 13 Jun 1997 22:37:24 +-200

77 lines

New Thread

Raw Flex Manufacture

Re: Raw Flex Manufacture

<>

Wed, 25 Jun 1997 08:20:11 -0500

41 lines

Raw Flex Manufacture

Sanmatech

Wed, 25 Jun 1997 19:19:15 +0800

59 lines

New Thread

Raw Flex Manufacture; Please read

Re: Raw Flex Manufacture; Please read

<>

Thu, 26 Jun 1997 10:22:28 +0600 (GMT+0600)

325 lines

New Thread

removing solder mask

RE: removing solder mask

Frank Kurisu

Fri, 20 Jun 97 00:57:19 UT

92 lines

Re: removing solder mask

<>

Thu, 19 Jun 1997 08:47:55 -0400 (EDT)

40 lines

Re: removing solder mask

<>

Wed, 18 Jun 1997 10:52:56 -0500

74 lines

removing solder mask

Paul Wareham

Wed, 18 Jun 1997 01:04:53 -0300

45 lines

New Thread

Reply: Conformal coating

Reply: Conformal coating

Blanchet,Richard

Fri, 13 Jun 1997 13:37:00 -0400 (EDT)

39 lines

New Thread

Research Associate Vacancy

Research Associate Vacancy

D.C.Whalley

Wed, 04 Jun 1997 17:04:30 -0400

67 lines

New Thread

Resin Removal

Resin Removal

<>

Thu, 19 Jun 1997 17:10:56 +0100

65 lines

Re: Resin Removal

Doug Alcoe

Thu, 12 Jun 97 23:08:40 CST

96 lines

Resin Removal

<>

Thu, 12 Jun 1997 12:23:15 +0100

60 lines

New Thread

Re[2]: LPISM Stripping

Re: Re[2]: LPISM Stripping

<>

Thu, 19 Jun 1997 09:19:02 -0400 (EDT)

42 lines

RE: Re[2]: LPISM Stripping

Terry Zhu

Tue, 17 Jun 1997 23:12:32 -0700

90 lines

Re: Re[2]: LPISM Stripping

<>

Mon, 16 Jun 1997 23:18:45 -0400 (EDT)

35 lines

Re: Re[2]: LPISM Stripping

Lenny Kurup

Mon, 16 Jun 1997 10:56:27 -0400 (EDT)

80 lines

Re: Re[2]: LPISM Stripping

<>

Sun, 15 Jun 1997 12:55:52 -0400 (EDT)

59 lines

RE: Re[2]: LPISM Stripping

Terry Zhu

Sat, 14 Jun 1997 23:16:39 -0700

94 lines

Re: Re[2]: LPISM Stripping

<>

Sun, 15 Jun 1997 00:55:39 -0400 (EDT)

51 lines

New Thread

Re[2]: LPISM Stripping -Reply

RE: Re[2]: LPISM Stripping -Reply

Bob Metcalf

Wed, 18 Jun 1997 21:48:32 -0700

121 lines

New Thread

RF Design

RE: RF Design

Jeff McGlaughlin

Wed, 25 Jun 1997 10:37:02 -0400

67 lines

RE: RF Design

Jeff McGlaughlin

Wed, 25 Jun 1997 10:37:02 -0400

66 lines

Re: RF Design

Frank Hinojos

Tue, 24 Jun 1997 16:47:06 -0700

58 lines

RF Design

Raymond Klein

Tue, 24 Jun 1997 14:47:41 -0700

51 lines

Re: RF Design

Jack Olson

Tue, 24 Jun 1997 11:58:08 -0700

59 lines

New Thread

RF Design - Plating and Routing

Re: RF Design - Plating and Routing

Tony Stewart

Tue, 24 Jun 1997 18:39:23 -0500

198 lines

RF Design - Plating and Routing

Jack Olson

Tue, 24 Jun 1997 08:32:47 -0700

60 lines

New Thread

Rinse water quality

Rinse water quality

Radhakrishna N

Sat, 28 Jun 1997 11:49:51 -0700

52 lines

New Thread

Rinse water quality (graphs and formula)

Re:Rinse water quality (graphs and formula)

Bob Mesick

Mon, 30 Jun 1997 13:02:25 -0700

77 lines

New Thread

Roku-Roku Sangyo, Ltd.

Re: Roku-Roku Sangyo, Ltd.

KoizumiT

Thu, 26 Jun 97 11:35:41 JST

47 lines

New Thread

S/M Tack Cure Racks

RE: S/M Tack Cure Racks

John Nelson

Wed, 25 Jun 1997 07:55:39 -0400

65 lines

S/M Tack Cure Racks

<>

Tue, 24 Jun 97 15:21:02 EST

37 lines

New Thread

Silkscreening

Re: Silkscreening

<>

Wed, 4 Jun 1997 12:27:16 -0400 (EDT)

41 lines

RE: SILKSCREENING

John Nelson

Mon, 2 Jun 1997 09:41:44 -0400

55 lines

New Thread

SMT Assy Equipment

SMT Assy Equipment

<>

Mon, 30 Jun 1997 15:54:11 -0500

43 lines

New Thread

Solder Balls

Re: Solder Balls

Aric J Parr

Mon, 30 Jun 1997 11:21:39 -0500

81 lines

Re: Solder Balls

ddsulliv

Mon, 30 Jun 97 10:57:59 cst

113 lines

Solder Balls

<>

Mon, 30 Jun 1997 10:23:05 -0500

56 lines

Re: Solder balls

<>

Sun, 15 Jun 1997 00:33:53 -0400 (EDT)

67 lines

New Thread

Solder joint strength

Re: Solder joint strength

<>

Sun, 8 Jun 1997 09:58:50 -0400 (EDT)

76 lines

New Thread

solder mask

Re: solder mask

<>

Sun, 15 Jun 1997 02:24:51 -0400 (EDT)

49 lines

Re: solder mask

Paul Gould

Fri, 13 Jun 1997 16:13:55 +0100

66 lines

solder mask

Suixin Zhang

Fri, 13 Jun 1997 14:11:57 +0100

49 lines

New Thread

Solder Mask CTI Rating

Solder Mask CTI Rating

<>

Thu, 12 Jun 1997 9:16:08 -0500

90 lines

Solder Mask CTI Rating

<>

Wed, 11 Jun 1997 19:37:13 -0500

89 lines

New Thread

Solder Precoat

Solder Precoat

CSS Asia Co., Ltd.

Thu, 5 Jun 1997 16:14:48 +0900

47 lines

New Thread

SOLDERABILITY OF IMMERSION GOLD

RE: SOLDERABILITY OF IMMERSION GOLD

Wally Doeling (wallyd)

Wed, 18 Jun 97 09:27:00 PDT

88 lines

SOLDERABILITY OF IMMERSION GOLD

gabriela

Wed, 18 Jun 1997 15:15:38 +0000

53 lines

New Thread

Solderability Tests of Boards

Re: Solderability Tests of Boards

ddhillma

Mon, 23 Jun 97 16:29:05 cst

107 lines

Solderability Tests of Boards

<>

Mon, 23 Jun 97 13:54:27 MST

75 lines

Solderability Tests of Boards

Jim Herard

Wed, 11 Jun 1997 11:49:45 -0400

123 lines

Re: Solderability Tests of Boards

<>

Sat, 7 Jun 1997 00:42:18 -0400 (EDT)

33 lines

Solderability Tests of Boards

<>

Fri, 06 Jun 97 13:04:37 MST

65 lines

New Thread

Soldering to Nickel Plate

Soldering to Nickel Plate

Gary Bliss

Wed, 25 Jun 1997 14:05:37 -0700

45 lines

New Thread

Soldering to Nickel Plate -Reply

Soldering to Nickel Plate -Reply

Jeff McGlaughlin

Thu, 26 Jun 1997 07:26:43 -0400

62 lines

New Thread

soldermask stripping

Re: soldermask stripping

sbryan

Mon, 02 Jun 97 06:57:43 PST

111 lines

New Thread

Solution: No Solder on Size "A" Tant Caps after WAVE also

RE: Solution: No Solder on Size "A" Tant Caps after WAVE also

Rich Everman

Wed, 4 Jun 1997 09:33:55 -0500

222 lines

Solution: No Solder on Size "A" Tant Caps after WAVE also

<>

Wed, 04 Jun 1997 10:25:51 EDT

231 lines

New Thread

Solution: No Solder on Size "A" Tant Caps after WAVE also SOT-23's

Re:Solution: No Solder on Size "A" Tant Caps after WAVE also SOT-23's

Guenter Grossmann

Thu, 5 Jun 1997 10:42:06 +0200

61 lines

Solution: No Solder on Size "A" Tant Caps after WAVE also SOT-23's

D. A. (Tony) Stewart

Wed, 04 Jun 1997 07:43:38 -0500

105 lines

New Thread

STD: IPC-6012 - Dewetting Definition

Re: STD: IPC-6012 - Dewetting Definition

<>

Wed, 18 Jun 1997 10:41:33 -0400 (EDT)

35 lines

Re: STD: IPC-6012 - Dewetting Definition

ddhillma

Wed, 18 Jun 97 09:09:52 cst

89 lines

STD: IPC-6012 - Dewetting Definition

Quality Dept. - Eltek Ltd.

Tue, 17 Jun 1997 08:54:49 +0300 (IDT)

53 lines

New Thread

Subject: Solution: No Solder on Size "A" Tant Caps after WAVE also SOT-23's

RE: Subject: Solution: No Solder on Size "A" Tant Caps after WAVE also SOT-23's

Rich Everman

Wed, 4 Jun 1997 08:45:27 -0500

212 lines

New Thread

subscrib

subscrib

=?HZ-GB-2312?B?fnszLEl5UyFWRjBlOStLPn59?=

Tue, 3 Jun 1997 14:56:24 +0800

39 lines

New Thread

Supplier

Re: Supplier

<>

Sun, 15 Jun 1997 00:18:24 -0400 (EDT)

46 lines

New Thread

Supplier Edge connectors

Supplier Edge connectors

<>

Mon, 9 Jun 97 15:42:55 PDT

47 lines

New Thread

Supplier of polymer solders

Re: Supplier of polymer solders

Peter McGrath

Thu, 19 Jun 1997 08:44:03 -0700

40 lines

Re: Supplier of polymer solders

Motoyo Wajima

Thu, 19 Jun 1997 10:09:55 +0900

81 lines

RE: Supplier of polymer solders

Patrick Ducas

Wed, 18 Jun 1997 15:55:56 -0400

131 lines

RE: Supplier of polymer solders

<>

Wed, 18 Jun 1997 11:58:53 -0700

91 lines

Supplier of polymer solders

Patrick Ducas

Wed, 18 Jun 1997 11:46:42 -0400

50 lines

New Thread

Surface Mount Devices

Re: Surface Mount Devices

<>

Sun, 1 Jun 1997 09:48:33 -0400 (EDT)

59 lines

New Thread

Tantulam Powder

Tantulam Powder

Payne, Rick

Wed, 11 Jun 97 11:22:00 CDT

39 lines

New Thread

Taping machines

Taping machines

pgiovann

Thu, 19 Jun 97 02:08:02 PST

38 lines

New Thread

Tented Via Reliability

Re: Tented Via Reliability

<>

Wed, 11 Jun 1997 08:32:36 -0400 (EDT)

42 lines

Tented Via Reliability

Frank Hinojos

Tue, 10 Jun 1997 16:18:45 -0700

43 lines

New Thread

Tented Via Reliability -Reply

Re: Tented Via Reliability -Reply

Hans Rohr

Wed, 11 Jun 1997 21:48:48 -0400

101 lines

Re: Tented Via Reliability -Reply

<>

Wed, 11 Jun 1997 17:37:05 -0400 (EDT)

54 lines

Re: Tented Via Reliability -Reply

Jim Herard

Wed, 11 Jun 1997 08:32:25 -0400

128 lines

Re: Tented Via Reliability -Reply

Frank Hinojos

Tue, 10 Jun 1997 17:40:39 -0700

84 lines

Tented Via Reliability -Reply

bob metcalf

Tue, 10 Jun 1997 17:16:39 -0700

64 lines

New Thread

Tented Vias

Re: Tented Vias

Greg Bartlett

25 Jun 1997 09:42:23 -0400

119 lines

Re: Tented Vias

George Franck

Wed, 25 Jun 1997 09:02:45 -0400

82 lines

Tented Vias

Frank Hinojos

Tue, 24 Jun 1997 14:53:34 -0700

46 lines

New Thread

Test probes for gold fingers

Test probes for gold fingers

DAVID DUROSS

Mon, 30 Jun 97 12:52:14 UT

46 lines

New Thread

Thermal Retesting After Replacing ICs...

re: Thermal Retesting After Replacing ICs...

<>

Thu, 12 Jun 97 11:55:08 PDT

91 lines

Thermal Retesting After Replacing ICs...

Doug McKean

Wed, 11 Jun 1997 12:25:39 -0400

63 lines

New Thread

tim strip issue

Re: tim strip issue

<>

Sun, 22 Jun 1997 17:14:38 -0400 (EDT)

48 lines

Re: tim strip issue

<>

Thu, 19 Jun 1997 07:18:31 -0400 (EDT)

46 lines

tim strip issue

DAVID DUROSS

Wed, 18 Jun 97 21:07:11 UT

47 lines

New Thread

Timeway Program

Timeway Program

<>

Thu, 12 Jun 1997 08:30:13 -0500

51 lines

New Thread

Tin / HASL

Tin / HASL

sam mccorkel

Wed, 11 Jun 1997 10:04:47 -0400

42 lines

RE: Tin / HASL

Ed Cosper

Tue, 10 Jun 1997 13:24:40 -0500

85 lines

Tin / HASL

sam mccorkel

Tue, 10 Jun 1997 13:29:13 -0400

42 lines

New Thread

Tin as an etch resist

Re: Tin as an etch resist

<>

Sun, 15 Jun 1997 08:32:41 -0400 (EDT)

62 lines

Re: Tin as an etch resist

Paul A Galatis

Sun, 15 Jun 1997 12:26:08 -0500

68 lines

RE: Tin as an etch resist

Terry Zhu

Sat, 14 Jun 1997 19:51:38 -0700

83 lines

Tin as an etch resist

<>

Sat, 14 Jun 1997 13:07:38 -0400 (EDT)

41 lines

New Thread

Tin strip issue

Re: Tin strip issue

Aric J Parr

Wed, 18 Jun 1997 13:08:19 -0500

75 lines

Tin strip issue

DAVID DUROSS

Wed, 18 Jun 97 15:45:53 UT

46 lines

New Thread

TMA and TGA testing

Re: TMA and TGA testing

Delsen Testing Laboratories

Fri, 06 Jun 1997 10:49:00 -0700

77 lines

RE: TMA and TGA testing

Steve Tetorka

Fri, 6 Jun 1997 8:22:00 -0800

70 lines

TMA and TGA testing

<>

Fri, 6 Jun 1997 06:27:59 -0400 (EDT)

41 lines

New Thread

Touch up Ink for Outer layers

Touch up Ink for Outer layers

<>

Fri, 27 Jun 97 16:24:20 -0800

42 lines

New Thread

Touch-up

Re: Touch-up

<>

Fri, 06 Jun 97 11:30:11 EST

57 lines

Touch-up

annie laberge

Fri, 06 Jun 1997 10:54:11 -0400

44 lines

New Thread

Training-Certification

Training-Certification

Mel Parrish MTTC

Thu, 26 Jun 1997 15:10:39

59 lines

New Thread

Translator for Allegro

Translator for Allegro

Mirka Halas

Mon, 23 Jun 1997 16:01:46 -0400

47 lines

New Thread

Translator to Allegro

Translator to Allegro

Mirka Halas

Mon, 23 Jun 1997 16:36:30 -0400

49 lines

New Thread

Ultrasonic Cleaning

RE: Ultrasonic Cleaning

Jack Crawford

Tue, 10 Jun 1997 10:27:27 -0500

127 lines

Re: Ultrasonic Cleaning

Oliver Kierse

Mon, 9 Jun 97 09:50:32 BST

90 lines

Re: Ultrasonic Cleaning

Charles Elliott

6 Jun 1997 15:27:07 U

122 lines

Ultrasonic Cleaning

<>

Fri, 6 Jun 1997 14:23:14 -0400 (EDT)

45 lines

New Thread

UNE Specification

UNE Specification

=?EUC-KR?B?sejBvr/s?=

Fri, 20 Jun 1997 11:51:22 +0900

49 lines

UNE Specification

=?EUC-KR?B?sejBvr/s?=

Fri, 20 Jun 1997 08:56:43 +0900

47 lines

UNE Specification

=?EUC-KR?B?sejBvr/s?=

Wed, 18 Jun 1997 14:31:52 +0900

53 lines

New Thread

Unidentified subject!

Unidentified subject!

Sarunya P.

Tue, 03 Jun 1997 17:57:05 +0700

52 lines

New Thread

Unknown adhesive

Unknown adhesive

mhu

Tue, 10 Jun 97 15:46:15 PST

38 lines

New Thread

Used Equipment - From ex-PCB manufacturer

Used Equipment - From ex-PCB manufacturer

Roland Jaquet

Sat, 14 Jun 1997 10:33:55 +0200

159 lines

New Thread

Via Plugging

RE: Via Plugging

Jeff McGlaughlin

Wed, 11 Jun 1997 12:05:51 -0400

50 lines

RE: via plugging

Lolmaugh, Scott (AZ15)

11 Jun 1997 09:48:42 -0500

134 lines

via plugging

Jim Herard

Wed, 11 Jun 1997 08:45:16 -0400

88 lines

via plugging

Suixin Zhang

Tue, 10 Jun 1997 16:42:46 +0100

48 lines

New Thread

Via Reliability

Re: Via Reliability

<>

Wed, 11 Jun 1997 20:42:35 -0400 (EDT)

48 lines

New Thread

Vision and X-Ray inspection of assemblies

Vision and X-Ray inspection of assemblies

gabriela

Wed, 04 Jun 1997 17:25:46 +0000

44 lines

New Thread

waterbased flux

waterbased flux

<>

Wed, 25 Jun 97 16:18:50 +0200

50 lines

New Thread

Waterbased Flux AND N2 Bags

Waterbased Flux AND N2 Bags

Graham Naisbitt

Thu, 26 Jun 97 17:14:11 UT

94 lines

New Thread

Wave Solder

Re: Wave Solder

Ron Hollandsworth

Mon, 30 Jun 97 09:27:43 -0500

86 lines

Wave Solder

Rob Williams

Fri, 27 Jun 1997 14:02:11 -0500

53 lines

New Thread

Wave Solder Approach - a SURVEY

RE: Wave Solder Approach - a SURVEY

Jack Crawford

Fri, 6 Jun 1997 11:00:26 -0500

86 lines

Re: Wave Solder Approach - a SURVEY

Jeffery L. Hempton

Fri, 06 Jun 1997 09:15:01 -0500

111 lines

Re: Wave Solder Approach - a SURVEY

P. ROY

06 Jun 97 08:03:19 EDT

51 lines

Wave Solder Approach - a SURVEY

<>

5 Jun 97 15:19:04 EDT

62 lines

New Thread

Wave solder approach - A survey.

re: Wave solder approach - A survey.

william spalton

Fri, 6 Jun 97 8:20:08 EDT

125 lines

Wave solder approach - A survey.

Larry Morse

Wed, 05 Feb 1997 17:18:19 -0800

102 lines

New Thread

What is black alloy plating?

Re: What is black alloy plating?

<>

Wed, 4 Jun 1997 10:20:29 -0400 (EDT)

39 lines

What is black alloy plating?

Kenneth Kowalski/Picker

2 Jun 97 15:37:56

43 lines

New Thread

What is ED?

Re: What is ED?

Roland Jaquet

Tue, 3 Jun 1997 09:34:30 +0200

173 lines

RE: What is ED?

Goldman, Patricia J.

Mon, 02 Jun 97 08:20:00 PDT

98 lines

Re: What is ED?

Roland Jaquet

Mon, 2 Jun 1997 13:28:19 +0200

119 lines

New Thread

Where is SirGuru

Re: Where is SirGuru

<>

Thu, 19 Jun 1997 10:45:51 -0400 (EDT)

40 lines

Re: Where is SirGuru

Hans Rohr

Wed, 18 Jun 1997 21:09:21 -0400

55 lines

Re: Where is SirGuru

ddhillma

Wed, 18 Jun 97 14:06:29 cst

75 lines

Where is SirGuru

Kenny Bloomquist

Wed, 18 Jun 1997 09:32:17 -0700

46 lines

New Thread

White Residues and "J" leads

Re: White Residues and "J" leads

Kasprzak, Bill (esd) US

Wed, 11 Jun 97 14:20:00 PDT

67 lines

New Thread

[Fwd: Mousebites/divots]

Re[2]: [Fwd: Mousebites/divots]

ddsulliv

Mon, 30 Jun 97 09:20:11 cst

155 lines

Re: [Fwd: Mousebites/divots]

<>

Sat, 28 Jun 1997 17:39:37 -0400 (EDT)

44 lines

Re: [Fwd: Mousebites/divots]

<>

Sat, 28 Jun 1997 13:01:06 -0400 (EDT)

48 lines

Re: [Fwd: Mousebites/divots]

<>

Fri, 27 Jun 1997 17:05:17 -0400 (EDT)

67 lines

[Fwd: Mousebites/divots]

anthony Peirano

Thu, 26 Jun 1997 17:34:23 -0700

88 lines

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