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June 1997


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Table of Contents:

Alternative solder alloy for a special process application (2 messages)
Anyone have problems with Waving case size "A" Tant or SOT-23's (1 message)
Are U Square or Round or Oval (1 message)
ASS. Reliability of solder bonds (3 messages)
ASSEM (1 message)
ASSEM--PCB Marking Methods (2 messages)
ASSEM: Re: FW: Dry Storage (1 message)
ASSEMBLY- Looking for relay mounting clip (2 messages)
assy - loctite hardware on pcb assemblies (3 messages)
Assy Supplier Qualification (3 messages)
ASSY, rework of damaged QFP leads (1 message)
ASSY, solder thieves (3 messages)
ASSY- CONFORMAL COATING (1 message)
ASSY/DSN: Minimum Spacing (1 message)
ASSY: 45 degree oriented QFP (1 message)
ASSY: AOI, Xray, automated solder joint inspection (1 message)
ASSY: Are U Square or Round or Oval (7 messages)
Assy: Au/Pd/Ni/Cu PCB Finish (8 messages)
Assy: conformal coating (1 message)
ASSY: CONFORMAL COATING BGAs (3 messages)
ASSY: Genesolv replacement (3 messages)
ASSY: ITT Canon (1 message)
ASSY: MOLE temperature probes (2 messages)
ASSY: Rework Method (2 messages)
Assy: Solder Heat Resistance (1 message)
ASSY: Solder joint strength (2 messages)
Assy: Tantulam Powder (1 message)
ASSY: TQFP JEDEC TRAYS (1 message)
Assy: vapor phase secondary fluid (1 message)
ASSY: VIA_Wetting (1 message)
ASSY: Wave solder defect rates: (was: Hot Air Knife a (1 message)
ASSY: Wave solder defect rates: (was: Hot Air Knife after solder pot?? Anyone use this?) (2 messages)
ASSY: Wave Solder sand Bags (1 message)
ASSY: Wavesoldering questions... (2 messages)
Assy: white residues (2 messages)
ASSY:Coplanarity (2 messages)
ASSY:Ionic contamination specs (5 messages)
Assy:VIA_Wetting (1 message)
Au/Pd/Ni/Cu PCB Finish (1 message)
Automated Optical Inspection (AOI) of PCB inner layers (3 messages)
BGA Pad design (2 messages)
Blind and Buried Via (3 messages)
Blue fr-4 (1 message)
Bob Ziedmans Email ID (1 message)
Bowing off Tantulam Caps (4 messages)
Buried capacitance material (2 messages)
Carbon Ink Resistors (1 message)
cc:Mail Link to SMTP Undeliverable Message (3 messages)
change e-mail address (1 message)
Chlorine damage to electronics (fwd) (3 messages)
Cleaning with Ultrasonic (1 message)
Cleanliness of assembled boards (2 messages)
Co-planar Waveguide question! (1 message)
Coax plating (1 message)
component (1 message)
CONFORMAL COATING (5 messages)
Controlled impedance documents (2 messages)
Copper and Phosphate (1 message)
Copper recycling (2 messages)
Cross Section Service (1 message)
Cu/Ni/Pd/Au finish (1 message)
Dazor (1 message)
DEC Alpha Motherboards (1 message)
DES- PTH Mathematical Mo (1 message)
DES: Heatsinking SMD OpAmp (1 message)
DES: High Cycle Fatigue Properties of Solder (1 message)
DES: I/O Terminations (1 message)
DES: Panelization (6 messages)
DES: PTH Mathematical Model (2 messages)
DES: PTH Mathematical Model -Reply (1 message)
DES: Track spacing for 100V on internal layers (1 message)
DES: Track spacing for 100V on internal layers -Reply (3 messages)
DES:I/O Terminations (2 messages)
Design, Fab & Assembly - BGA, vias and power planes (1 message)
Did Technet disappear (1 message)
Document IRD-DES 003 (1 message)
double sided reflow-soldering top side to bottom side (1 message)
double sided reflow-soldering top side to bottom side parts. (3 messages)
Double Soldering? (2 messages)
Double Soldering? -Reply (1 message)
Dry Storage (1 message)
E-Mail massages (2 messages)
Electrochemical migration (2 messages)
Electroless Deposition (1 message)
EMC Analysis S/W (1 message)
Emma 210 Driver (1 message)
Employment chatter (4 messages)
ETS300-019-1, 2, and 3 (1 message)
Excellon SMX programing (1 message)
Expert Systems (3 messages)
FAB (3 messages)
FAB - chemical and physical properties of PCB board material (2 messages)
FAB and ASSY: Spec for Electroless Ni and Immersion A (1 message)
FAB and ASSY: Spec for Electroless Ni and Immersion Au (4 messages)
FAB equipment, non-contact pyrometer (1 message)
Fab/Assy: Decapsulant method (2 messages)
FAB/ASSY: PCMCIA (1 message)
Fab: Addition of Controled Impedance Conductors (1 message)
FAB: APM Radiometers (4 messages)
FAB: conveyorized 'durabond' (2 messages)
FAB: Copper foil compatability (1 message)
FAB: CRM5 Material (2 messages)
fab: drilling (3 messages)
Fab: Drilling/routing dust (1 message)
FAB: Etching Double-Treat foil. (2 messages)
FAB: Hole tolerances (1 message)
Fab: Horizontal Oxide Line (2 messages)
FAB: Instrument for PTH Cu measurement. (1 message)
FAB: Lap shear test (3 messages)
FAB: LPI (3 messages)
Fab: LPI soldermask (1 message)
FAB: Material - FR10 (4 messages)
FAB: Material ; G-10 (5 messages)
FAB: Material Certificate? (1 message)
FAB: Plating Thickness inside hole walls ; reliability of measurement (1 message)
FAB: RE: Question on Pad Leveling (8 messages)
Fab: Rinse water quality (1 message)
FAB: tin only over copper on antenna design (3 messages)
FAB: Unbalance Copper Core (1 message)
Fab: Wanted PWB Shop to Purchase (1 message)
Fab:Disposal of drilling/routing dust (1 message)
FAB:Resin Removal from Tooling holes (2 messages)
Fab:Router dust (2 messages)
Fabrication (1 message)
FEB- ceramic BGA crackin (1 message)
FEB: ceramic BGA cracking after wave solder (2 messages)
FW: ASSEM--PCB Marking Methods (1 message)
FW: ASSY:Au/Ni Coated Boards (1 message)
FW: Bowing off Tantulam Caps (1 message)
FW: Chlorine damage to electronics (fwd) (1 message)
FW: Cleanliness of assembled boards (1 message)
FW: Cross Section Service (3 messages)
FW: DES: Panelization (1 message)
FW: Dry Storage (3 messages)
FW: EMC Analysis S/W (1 message)
FW: Hot Air Knife after solder pot?? Anyone use this? (1 message)
FW: Intrusive Reflow (1 message)
FW: Nitto Tape (1 message)
FW: PEM reflow (2 messages)
Fw: PLASTIC RIVET MACHINE SUPPLIER (1 message)
FW: plugged vias (1 message)
FW: Press Pin Assembly Equipmen (1 message)
FW: Re: palladium plating (1 message)
FW: removing solder mask (1 message)
FW: Tented Vias (1 message)
Fwd: Fab: Rinse water quality (3 messages)
Fwd: RE: FAB equipment, non-contact pyrometer (1 message)
GEN - Image processing for PCB inspection (1 message)
Gen- Durometer Measurement (1 message)
Gen: R&D (2 messages)
GEN: S.M. adhesives (1 message)
GEN: SUPPLIER (2 messages)
Gen: Wanted,Tackroller (4 messages)
Gen: Wanted,Tackroller -Reply (1 message)
General: Vision Inspection of Built Up Assemblies (3 messages)
General: Vision Inspection of Built Up Assemblies -Reply (1 message)
Glaser DP3545 Photoplotter (1 message)
Globtop Decapsulation (2 messages)
Gold Finger Touch Up (4 messages)
Gold/Tin-soldering (2 messages)
HALT / HASS physical stress systems (3 messages)
HASL thickness... (3 messages)
Hello... (1 message)
High Cycle Fatigue Properties of Solder (2 messages)
Hot Air Knife after solder pot?? Anyone use this? (4 messages)
How do you use Material Certificate? (2 messages)
Idents and HASL (1 message)
Idents before or after HASL (4 messages)
Idents before or after HASL-- Reply (1 message)
IMS Material (3 messages)
INFO: Charles Hutchins (1 message)
INFO: Charles Hutchins -Reply (1 message)
Insulation Displacement Connectors (2 messages)
Intrusive Reflow (2 messages)
Ionic contamination specs (1 message)
IONIC TESTING (2 messages)
IPC-A-610B Quality Levels (1 message)
IR Reflow Ovens & Wetting Balance (1 message)
ISO Discussion Forum (1 message)
ISO9002 (5 messages)
ISO9002 (fwd) (1 message)
John Sohn: Out of Office AutoReply: Cleanliness of assembled (1 message)
Koax plating (1 message)
LCC (1 message)
LCC solder joint (7 messages)
Linguistics (2 messages)
Looking for CAD software (1 message)
Looking to buy used CAD software (1 message)
LPI soldermask (1 message)
LPISM STRIPPING (2 messages)
LPSIM Stripping (2 messages)
Mailbox getting too full from TechNet?? (1 message)
me too..... (1 message)
Measuring QFP Lead Pitch (2 messages)
Message not deliverable (2 messages)
MIL-P-11268 (2 messages)
Mill Dies (2 messages)
Minimum gold plating on gold tabs (2 messages)
Minimum gold plating on gold tabs -Reply (1 message)
Modifications to PCBs with 30AWG wire... (4 messages)
N2-bags (3 messages)
Need Carbon Capability Prototype Fab Shop. (2 messages)
New Printed Wiring Board Technology (2 messages)
Nitto Tape (4 messages)
No-clean/Test Probes/Cleaning (2 messages)
Non-halogenated fore retardant additives for laminates (1 message)
OSP (1 message)
palladium plating (3 messages)
paste measurement (2 messages)
Patent Search Web Site (6 messages)
PC Cards (2 messages)
PCB Lacquer (1 message)
PCMCIA STANDARDS (2 messages)
PHOTOPLOTTER 4 SALE + PROBIMER LINE (1 message)
placement system (1 message)
PLASTIC RIVET MACHINE SUPPLIER (2 messages)
Plating over Monel (1 message)
plugged vias (4 messages)
Press Pin Assembly Equipmen (1 message)
Press Pin Assembly Equipmen -Reply (1 message)
Preventive Maintenance Software (1 message)
Previous Message By Myself (1 message)
Price Fixing and Restraints of Trade (2 messages)
Primary Image ( outer layers ) (1 message)
profiling pcb's (2 messages)
PTH Mathematical Model (1 message)
Pumice Source (1 message)
QS-9000 standard (3 messages)
Question on Pad Leveling??? (1 message)
R: Pumice Source (1 message)
Raw Flex Manufacture (2 messages)
Raw Flex Manufacture; Please read (1 message)
removing solder mask (4 messages)
Reply: Conformal coating (1 message)
Research Associate Vacancy (1 message)
Resin Removal (3 messages)
Re[2]: LPISM Stripping (7 messages)
Re[2]: LPISM Stripping -Reply (1 message)
RF Design (5 messages)
RF Design - Plating and Routing (2 messages)
Rinse water quality (1 message)
Rinse water quality (graphs and formula) (1 message)
Roku-Roku Sangyo, Ltd. (1 message)
S/M Tack Cure Racks (2 messages)
SILKSCREENING (2 messages)
SMT Assy Equipment (1 message)
Solder balls (4 messages)
Solder joint strength (1 message)
solder mask (3 messages)
Solder Mask CTI Rating (2 messages)
Solder Precoat (1 message)
SOLDERABILITY OF IMMERSION GOLD (2 messages)
Solderability Tests of Boards (5 messages)
Soldering to Nickel Plate (1 message)
Soldering to Nickel Plate -Reply (1 message)
soldermask stripping (1 message)
Solution: No Solder on Size "A" Tant Caps after WAVE also (2 messages)
Solution: No Solder on Size "A" Tant Caps after WAVE also SOT-23's (2 messages)
STD: IPC-6012 - Dewetting Definition (3 messages)
Subject: Solution: No Solder on Size "A" Tant Caps after WAVE also SOT-23's (1 message)
subscrib (1 message)
Supplier (1 message)
Supplier Edge connectors (1 message)
Supplier of polymer solders (5 messages)
Surface Mount Devices (1 message)
Tantulam Powder (1 message)
Taping machines (1 message)
Tented Via Reliability (2 messages)
Tented Via Reliability -Reply (5 messages)
Tented Vias (3 messages)
Test probes for gold fingers (1 message)
Thermal Retesting After Replacing ICs... (2 messages)
tim strip issue (3 messages)
Timeway Program (1 message)
Tin / HASL (3 messages)
Tin as an etch resist (4 messages)
Tin strip issue (2 messages)
TMA and TGA testing (3 messages)
Touch up Ink for Outer layers (1 message)
Touch-up (2 messages)
Training-Certification (1 message)
Translator for Allegro (1 message)
Translator to Allegro (1 message)
Ultrasonic Cleaning (4 messages)
UNE Specification (3 messages)
Unidentified subject! (1 message)
Unknown adhesive (1 message)
Used Equipment - From ex-PCB manufacturer (1 message)
via plugging (4 messages)
Via Reliability (1 message)
Vision and X-Ray inspection of assemblies (1 message)
waterbased flux (1 message)
Waterbased Flux AND N2 Bags (1 message)
Wave Solder (2 messages)
Wave Solder Approach - a SURVEY (4 messages)
Wave solder approach - A survey. (2 messages)
What is black alloy plating? (2 messages)
What is ED? (3 messages)
Where is SirGuru (4 messages)
White Residues and "J" leads (1 message)
[Fwd: Mousebites/divots] (5 messages)

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Subject Sorted by Subject, Chronologically

From

Date

Size

New Thread

Alternative solder alloy for a special process application

Alternative solder alloy for a special process application

Patrick Ducas <[log in to unmask]>

Wed, 18 Jun 1997 11:05:25 -0400

57 lines

Alternative solder alloy for a special process application

Jim Herard <[log in to unmask]>

Wed, 18 Jun 1997 16:12:27 -0400

85 lines

New Thread

Anyone have problems with Waving case size "A" Tant or SOT-23's

Anyone have problems with Waving case size "A" Tant or SOT-23's

D. A. (Tony) Stewart <[log in to unmask]>

Wed, 04 Jun 1997 10:05:21 -0500

116 lines

New Thread

Are U Square or Round or Oval

Re: Are U Square or Round or Oval

[log in to unmask]

Fri, 13 Jun 1997 13:00:55 -0400 (EDT)

57 lines

New Thread

ASS. Reliability of solder bonds

ASS. Reliability of solder bonds

Martin Farrell <[log in to unmask]>

Mon, 09 Jun 1997 10:53:57 +0000 (GMT)

49 lines

Re: ASS. Reliability of solder bonds

[log in to unmask]

Mon, 9 Jun 1997 09:53:04 -0400 (EDT)

67 lines

Re[2]: ASS. Reliability of solder bonds

ddhillma <[log in to unmask]>

Tue, 10 Jun 97 23:18:03 cst

101 lines

New Thread

ASSEM

ASSEM

[log in to unmask]

Thu, 5 Jun 97 11:02:29 -0400

50 lines

New Thread

ASSEM--PCB Marking Methods

ASSEM--PCB Marking Methods

Bruce Gibson <[log in to unmask]>

Fri, 13 Jun 1997 15:13:16 -0600

42 lines

Re: ASSEM--PCB Marking Methods

scott birnbaum <[log in to unmask]>

Fri, 13 Jun 97 21:31:14 PDT

78 lines

New Thread

ASSEM: Re: FW: Dry Storage

ASSEM: Re: FW: Dry Storage

Mike Buetow <[log in to unmask]>

Mon, 2 Jun 1997 11:30:12 -0500 (CDT)

62 lines

New Thread

ASSEMBLY- Looking for relay mounting clip

ASSEMBLY- Looking for relay mounting clip

[log in to unmask]

Tue, 10 Jun 97 11:35:08 PST8

51 lines

ASSEMBLY- Looking for relay mounting clip

[log in to unmask]

Thu, 12 Jun 97 08:20:59 PST8

53 lines

New Thread

assy - loctite hardware on pcb assemblies

Re: assy - loctite hardware on pcb assemblies

Steve Mikell <[log in to unmask]>

Sun, 1 Jun 1997 13:23:13 -0500 (CDT)

72 lines

RE: assy - loctite hardware on pcb assemblies

JIM ENNIS <[log in to unmask]>

Mon, 02 Jun 97 07:10:00 PDT

80 lines

Re: assy - loctite hardware on pcb assemblies

Sheila Smith <[log in to unmask]>

Mon, 2 Jun 1997 08:40:14 -0400 (EDT)

84 lines

New Thread

Assy Supplier Qualification

Assy Supplier Qualification

Frank Hinojos <[log in to unmask]>

Tue, 17 Jun 1997 09:46:47 -0700

43 lines

Re: Assy Supplier Qualification

[log in to unmask]

Wed, 18 Jun 1997 15:52:16 -0400 (EDT)

49 lines

Re: Assy Supplier Qualification

[log in to unmask]

Wed, 18 Jun 1997 15:56:31 -0400 (EDT)

49 lines

New Thread

ASSY, rework of damaged QFP leads

ASSY, rework of damaged QFP leads

Patrick Ducas <[log in to unmask]>

Tue, 17 Jun 1997 08:55:08 -0400

62 lines

New Thread

ASSY, solder thieves

ASSY, solder thieves

[log in to unmask]

Sun, 01 Jun 1997 21:18:53 EDT

41 lines

ASSY, solder thieves

Patrick Ducas <[log in to unmask]>

Fri, 30 May 1997 15:17:39 -0400

68 lines

Re: ASSY, solder thieves

[log in to unmask]

Mon, 2 Jun 1997 09:43:38 -0400 (EDT)

53 lines

New Thread

ASSY- CONFORMAL COATING

Re: ASSY- CONFORMAL COATING

Greg Bartlett <[log in to unmask]>

26 Jun 1997 14:10:50 -0400

141 lines

New Thread

ASSY/DSN: Minimum Spacing

ASSY/DSN: Minimum Spacing

[log in to unmask]

Thu, 26 Jun 1997 16:15:55 -0500

56 lines

New Thread

ASSY: 45 degree oriented QFP

ASSY: 45 degree oriented QFP

Yuen, Mike <[log in to unmask]>

Fri, 27 Jun 97 11:03:00 CDT

39 lines

New Thread

ASSY: AOI, Xray, automated solder joint inspection

ASSY: AOI, Xray, automated solder joint inspection

Vickie Chapman <[log in to unmask]>

Mon, 30 Jun 1997 11:19:32 -0700

69 lines

New Thread

ASSY: Are U Square or Round or Oval

ASSY: Are U Square or Round or Oval

[log in to unmask]

Tue, 10 Jun 1997 14:13:05 -0500

69 lines

Re: ASSY: Are U Square or Round or Oval

ddhillma <[log in to unmask]>

Tue, 10 Jun 97 23:32:12 cst

100 lines

Re: ASSY: Are U Square or Round or Oval

[log in to unmask]

Wed, 11 Jun 97 07:16:53 EDT

78 lines

Re: ASSY: Are U Square or Round or Oval

[log in to unmask]

Wed, 11 Jun 1997 07:05:22 -0400 (EDT)

53 lines

Re: ASSY: Are U Square or Round or Oval

James C. Patten <[log in to unmask]>

Wed, 11 Jun 97 09:18:00 PDT

83 lines

Re: ASSY: Are U Square or Round or Oval

[log in to unmask]

Wed, 11 Jun 1997 15:27:37 -0400 (EDT)

37 lines

Re: ASSY: Are U Square or Round or Oval

[log in to unmask]

Wed, 11 Jun 1997 17:06:29 -0400 (EDT)

40 lines

New Thread

Assy: Au/Pd/Ni/Cu PCB Finish

Assy: Au/Pd/Ni/Cu PCB Finish

Barthel, Bill <[log in to unmask]>

Thu, 12 Jun 97 07:45:00 CDT

38 lines

RE: Assy: Au/Pd/Ni/Cu PCB Finish

John Guy <[log in to unmask]>

Thu, 12 Jun 1997 08:31:33 -0500

64 lines

Re[2]: Assy: Au/Pd/Ni/Cu PCB Finish

[log in to unmask]

Thu, 12 Jun 1997 08:52:44 -0500

288 lines

Re: Assy: Au/Pd/Ni/Cu PCB Finish

ddhillma <[log in to unmask]>

Thu, 12 Jun 97 09:10:33 cst

77 lines

Re: Assy: Au/Pd/Ni/Cu PCB Finish

[log in to unmask]

Thu, 12 Jun 1997 15:22:06 -0400 (EDT)

42 lines

Re: Assy: Au/Pd/Ni/Cu PCB Finish

[log in to unmask]

Thu, 12 Jun 1997 15:22:03 -0400 (EDT)

39 lines

Re: Assy: Au/Pd/Ni/Cu PCB Finish

[log in to unmask]

Sun, 15 Jun 1997 09:02:01 -0400 (EDT)

47 lines

Re: Assy: Au/Pd/Ni/Cu PCB Finish

gabriela <[log in to unmask]>

Sun, 15 Jun 1997 17:15:38 +0000

80 lines

New Thread

Assy: conformal coating

Re: Assy: conformal coating

[log in to unmask]

Sun, 15 Jun 1997 00:48:03 -0400 (EDT)

44 lines

New Thread

ASSY: CONFORMAL COATING BGAs

ASSY: CONFORMAL COATING BGAs

Jim Marsico 516-595-5879 <[log in to unmask]>

Thu, 26 Jun 1997 11:30:00 -0400 (EDT)

69 lines

Re: ASSY: CONFORMAL COATING BGAs

Lynch, Lyn <[log in to unmask]>

Thu, 26 Jun 97 09:48:41

95 lines

ASSY: CONFORMAL COATING BGAs

Graham Naisbitt <[log in to unmask]>

Fri, 27 Jun 97 16:21:47 UT

57 lines

New Thread

ASSY: Genesolv replacement

ASSY: Genesolv replacement

Blanchet,Richard <[log in to unmask]>

Thu, 12 Jun 1997 07:52:00 -0400 (EDT)

53 lines

Re: ASSY: Genesolv replacement

Sheila Smith <[log in to unmask]>

Thu, 12 Jun 1997 08:31:49 -0400 (EDT)

78 lines

Re: ASSY: Genesolv replacement

Aric J Parr <[log in to unmask]>

Thu, 12 Jun 1997 08:50:09 -0500

79 lines

New Thread

ASSY: ITT Canon

ASSY: ITT Canon

[log in to unmask]

Tue, 17 Jun 1997 10:01:41 -0500

47 lines

New Thread

ASSY: MOLE temperature probes

RE: ASSY: MOLE temperature probes

JIM ENNIS <[log in to unmask]>

Thu, 29 May 97 11:44:00 PDT

88 lines

Re[2]: ASSY: MOLE temperature probes

[log in to unmask]

Tue, 03 Jun 97 13:57:05 PST

87 lines

New Thread

ASSY: Rework Method

ASSY: Rework Method

Peter Swanson <[log in to unmask]>

Mon, 02 Jun 1997 18:35:36 GMT

69 lines

Re: ASSY: Rework Method

ddhillma <[log in to unmask]>

Tue, 03 Jun 97 06:19:05 cst

104 lines

New Thread

Assy: Solder Heat Resistance

Assy: Solder Heat Resistance

[log in to unmask]

Wed, 18 Jun 97 16:31:05 PDT

46 lines

New Thread

ASSY: Solder joint strength

ASSY: Solder joint strength

Andrea Shurtz <[log in to unmask]>

6 Jun 97 13:32:07 EDT

45 lines

Re: ASSY: Solder joint strength

Mike Buetow <[log in to unmask]>

Sat, 7 Jun 1997 14:13:20 -0500 (CDT)

85 lines

New Thread

Assy: Tantulam Powder

Assy: Tantulam Powder

Yuen, Mike <[log in to unmask]>

Wed, 18 Jun 97 13:32:00 CDT

39 lines

New Thread

ASSY: TQFP JEDEC TRAYS

ASSY: TQFP JEDEC TRAYS

Siegfried Quemado <[log in to unmask]>

Mon, 02 Jun 97 08:31:00 PDT

36 lines

New Thread

Assy: vapor phase secondary fluid

Assy: vapor phase secondary fluid

Steve Mikell <[log in to unmask]>

Thu, 26 Jun 1997 17:34:10 -0500 (CDT)

50 lines

New Thread

ASSY: VIA_Wetting

ASSY: VIA_Wetting

???@???

Wed, 18 Jun 1997 17:39:00 +0000

80 lines

New Thread

ASSY: Wave solder defect rates: (was: Hot Air Knife a

Re[2]: ASSY: Wave solder defect rates: (was: Hot Air Knife a

Ron Hollandsworth <[log in to unmask]>

Wed, 18 Jun 97 09:27:17 -0500

195 lines

New Thread

ASSY: Wave solder defect rates: (was: Hot Air Knife after solder pot?? Anyone use this?)

ASSY: Wave solder defect rates: (was: Hot Air Knife after solder pot?? Anyone use this?)

Vickie Chapman <[log in to unmask]>

Tue, 17 Jun 1997 13:17:27 -0700

140 lines

Re: ASSY: Wave solder defect rates: (was: Hot Air Knife after solder pot?? Anyone use this?)

Fritz Byle <[log in to unmask]>

Tue, 17 Jun 1997 22:49:43 -0500

167 lines

New Thread

ASSY: Wave Solder sand Bags

ASSY: Wave Solder sand Bags

Jeffery L. Hempton <[log in to unmask]>

Fri, 06 Jun 1997 09:59:21 -0500

51 lines

New Thread

ASSY: Wavesoldering questions...

ASSY: Wavesoldering questions...

Vickie Chapman <[log in to unmask]>

Mon, 23 Jun 1997 08:59:51 -0700

53 lines

Re: ASSY: Wavesoldering questions...

Leo P. Lambert <[log in to unmask]>

Sun, 29 Jun 1997 22:21:23 -0400 (EDT)

105 lines

New Thread

Assy: white residues

Assy: white residues

Blanchet,Richard <[log in to unmask]>

Thu, 05 Jun 1997 12:09:00 -0400 (EDT)

50 lines

Re: Assy: white residues

ddhillma <[log in to unmask]>

Tue, 10 Jun 97 13:12:01 cst

76 lines

New Thread

ASSY:Coplanarity

ASSY:Coplanarity

???@???

Mon, 23 Jun 1997 11:33:00 +0000

55 lines

Re: ASSY:Coplanarity

Jeff Seeger <[log in to unmask]>

Mon, 23 Jun 1997 19:30:02 -0400

60 lines

New Thread

ASSY:Ionic contamination specs

ASSY:Ionic contamination specs

John Barton <[log in to unmask]>

Thu, 12 Jun 1997 15:02:57 +0000

74 lines

Re: ASSY:Ionic contamination specs

[log in to unmask]

Fri, 13 Jun 1997 19:30:15 -0400 (EDT)

57 lines

Re: ASSY:Ionic contamination specs

Raymond Klein <[log in to unmask]>

Fri, 13 Jun 1997 16:51:29 -0700

49 lines

Re[2]: ASSY:Ionic contamination specs

ddhillma <[log in to unmask]>

Wed, 18 Jun 97 12:09:32 cst

93 lines

Re: ASSY:Ionic contamination specs

[log in to unmask]

Thu, 19 Jun 1997 12:49:51 -0400 (EDT)

94 lines

New Thread

Assy:VIA_Wetting

Assy:VIA_Wetting

???@???

Thu, 19 Jun 1997 08:14:00 +0000

59 lines

New Thread

Au/Pd/Ni/Cu PCB Finish

Re: Au/Pd/Ni/Cu PCB Finish

[log in to unmask]

Fri, 13 Jun 1997 11:01:38 -0400 (EDT)

55 lines

New Thread

Automated Optical Inspection (AOI) of PCB inner layers

Automated Optical Inspection (AOI) of PCB inner layers

Rick Haynes <[log in to unmask]>

Fri, 13 Jun 1997 13:36:47 -0700

100 lines

RE: Automated Optical Inspection (AOI) of PCB inner layers

Ed Cosper <[log in to unmask]>

Fri, 13 Jun 1997 14:32:06 -0500

71 lines

RE: Automated Optical Inspection (AOI) of PCB inner layers

Murray, George @ GSC <[log in to unmask]>

Fri, 13 Jun 97 15:10:00 PDT

67 lines

New Thread

BGA Pad design

Re: BGA Pad design

Doug Jeffery <[log in to unmask]>

Wed, 11 Jun 1997 18:52:09 -0500 (CDT)

61 lines

Re: BGA Pad design

Steve Quinn <[log in to unmask]>

Thu, 12 Jun 1997 12:36:15 -0500 (CDT)

82 lines

New Thread

Blind and Buried Via

Blind and Buried Via

CADET, India. <[log in to unmask]>

Sat, 07 Jun 1997 10:56:27 +0530

77 lines

Re: Blind and Buried Via

Robert Welch <[log in to unmask]>

Sat, 7 Jun 1997 10:45:20 +0000

46 lines

RE:BLIND AND BURIED VIA

[log in to unmask]

Mon, 09 Jun 1997 04:06:05 EDT

88 lines

New Thread

Blue fr-4

Blue fr-4

sam mccorkel <[log in to unmask]>

Mon, 09 Jun 1997 11:48:46 -0400

39 lines

New Thread

Bob Ziedmans Email ID

Bob Ziedmans Email ID

CADET Automation Systems <[log in to unmask]>

Thu, 05 Jun 1997 09:06:12 +0530

47 lines

New Thread

Bowing off Tantulam Caps

Bowing off Tantulam Caps

Dhawan, Ashok CA-WINPO2 <[log in to unmask]>

Mon, 09 Jun 97 14:42:00 GMT

67 lines

RE: Bowing off Tantulam Caps

Max Bernhardt <[log in to unmask]>

Tue, 10 Jun 1997 14:43:00 -0500

121 lines

Re: Bowing off Tantulam Caps

ddhillma <[log in to unmask]>

Tue, 10 Jun 97 23:24:49 cst

101 lines

Re: Bowing off Tantulam Caps

Doug McKean <[log in to unmask]>

Wed, 11 Jun 1997 09:50:51 -0400

54 lines

New Thread

Buried capacitance material

Buried capacitance material

Ed Cosper <[log in to unmask]>

Fri, 13 Jun 1997 14:18:20 -0500

54 lines

Re: Buried capacitance material

[log in to unmask]

Fri, 13 Jun 97 16:26:33 -0500

80 lines

New Thread

Carbon Ink Resistors

Carbon Ink Resistors

Hanamann, Peter <[log in to unmask]>

Thu, 12 Jun 97 16:05:00 CDT

42 lines

New Thread

cc:Mail Link to SMTP Undeliverable Message

cc:Mail Link to SMTP Undeliverable Message

[log in to unmask]

Tue, 03 Jun 97 16:38:34 -0800

153 lines

cc:Mail Link to SMTP Undeliverable Message

[log in to unmask]

Tue, 03 Jun 97 21:39:34 -0800

155 lines

cc:Mail Link to SMTP Undeliverable Message

[log in to unmask]

Mon, 09 Jun 97 17:57:03 -0800

104 lines

New Thread

change e-mail address

change e-mail address

Keren Gideon <[log in to unmask]>

Sat, 7 Jun 1997 22:39:51 +0300

43 lines

New Thread

Chlorine damage to electronics (fwd)

Chlorine damage to electronics (fwd)

David Bergman <[log in to unmask]>

Mon, 16 Jun 1997 13:44:23 -0500 (CDT)

69 lines

Re: Chlorine damage to electronics (fwd)

[log in to unmask]

Tue, 17 Jun 1997 09:35:18 -0400 (EDT)

46 lines

Re: Chlorine damage to electronics (fwd)

ddhillma <[log in to unmask]>

Wed, 18 Jun 97 08:42:36 cst

101 lines

New Thread

Cleaning with Ultrasonic

Cleaning with Ultrasonic

[log in to unmask]

Mon, 9 Jun 1997 14:16:07 -0400 (EDT)

44 lines

New Thread

Cleanliness of assembled boards

Cleanliness of assembled boards

MATI BARUCH <[log in to unmask]>

Wed, 25 Jun 1997 20:40:28 GT+0300

41 lines

RE: Cleanliness of assembled boards

Graham Naisbitt <[log in to unmask]>

Wed, 25 Jun 97 23:01:08 UT

72 lines

New Thread

Co-planar Waveguide question!

Re: Co-planar Waveguide question!

Andy Burkhardt <[log in to unmask]>

Mon, 2 Jun 1997 10:37:59 +0100

74 lines

New Thread

Coax plating

Coax plating

[log in to unmask]

Thu, 12 Jun 97 15:56:47 +0200

45 lines

New Thread

component

component

[log in to unmask]

Thu, 26 Jun 1997 13:39:47 -0400

48 lines

New Thread

CONFORMAL COATING

CONFORMAL COATING

Tamir Ben-Shoshan <[log in to unmask]>

Thu, 12 Jun 97 17:01:17 EST

39 lines

Re: CONFORMAL COATING

Frank Hinojos <[log in to unmask]>

Thu, 12 Jun 1997 08:47:38 -0700

100 lines

Conformal Coating

Graham Naisbitt <[log in to unmask]>

Fri, 13 Jun 97 15:48:10 UT

89 lines

Re: Conformal Coating

Ulrich Korndoerfer <[log in to unmask]>

Sat, 14 Jun 1997 00:31:44 +0200

57 lines

Re: CONFORMAL COATING

[log in to unmask]

Sun, 15 Jun 1997 01:18:04 -0400 (EDT)

44 lines

New Thread

Controlled impedance documents

Controlled impedance documents

Steves <[log in to unmask]>

Fri, 6 Jun 1997 12:56:20 +0000

40 lines

Re: Controlled impedance documents

Mitch Morey <[log in to unmask]>

Fri, 6 Jun 1997 11:10:29 -0700

52 lines

New Thread

Copper and Phosphate

Copper and Phosphate

Goldman, Patricia J. <[log in to unmask]>

Mon, 30 Jun 97 12:07:00 PDT

46 lines

New Thread

Copper recycling

Copper recycling

scott birnbaum <[log in to unmask]>

Mon, 02 Jun 97 05:48:23 PDT

44 lines

Re: Copper recycling

[log in to unmask]

Fri, 6 Jun 1997 22:43:39 -0400

43 lines

New Thread

Cross Section Service

Cross Section Service

friday <[log in to unmask]>

Tue, 24 Jun 1997 08:14:44 -0400

42 lines

New Thread

Cu/Ni/Pd/Au finish

Cu/Ni/Pd/Au finish

[log in to unmask]

Sun, 15 Jun 1997 18:26:45 -0400 (EDT)

68 lines

New Thread

Dazor

Re: Dazor

JoAnn Amerson <[log in to unmask]>

Wed, 4 Jun 1997 11:08:08 +0000

53 lines

New Thread

DEC Alpha Motherboards

DEC Alpha Motherboards

Robert Shinolt <[log in to unmask]>

Sat, 14 Jun 1997 18:41:31 -0700

41 lines

New Thread

DES- PTH Mathematical Mo

Re: DES- PTH Mathematical Mo

Greg Bartlett <[log in to unmask]>

18 Jun 1997 15:39:07 -0400

106 lines

New Thread

DES: Heatsinking SMD OpAmp

DES: Heatsinking SMD OpAmp

Dave Hammond <[log in to unmask]>

Wed, 18 Jun 1997 08:22:00 -0500

52 lines

New Thread

DES: High Cycle Fatigue Properties of Solder

DES: High Cycle Fatigue Properties of Solder

Prasad Godavarti-G12162 <[log in to unmask]>

Wed, 18 Jun 1997 11:29:00 -0500

57 lines

New Thread

DES: I/O Terminations

RE: DES: I/O Terminations

Raymond Klein <[log in to unmask]>

Wed, 18 Jun 1997 19:10:58 -0700

49 lines

New Thread

DES: Panelization

DES: Panelization

Steve Collins <[log in to unmask]>

Wed, 4 Jun 1997 14:14:38 -0600

48 lines

DES: Panelization

Steve Collins <[log in to unmask]>

Wed, 4 Jun 1997 14:35:07 -0600

52 lines

DES: Panelization

Steve Collins <[log in to unmask]>

Wed, 4 Jun 1997 16:53:39 -0600

52 lines

Re: DES: Panelization

[log in to unmask]

Wed, 4 Jun 1997 14:20:19 -0700

48 lines

Re: DES: Panelization

Andrew G Kettlewell <[log in to unmask]>

Thu, 5 Jun 1997 12:48:45 -0600

88 lines

Re: DES: Panelization

[log in to unmask]

Thu, 05 Jun 1997 14:06:00 EDT

139 lines

New Thread

DES: PTH Mathematical Model

DES: PTH Mathematical Model

Andrew J. Scholand <[log in to unmask]>

Wed, 18 Jun 1997 11:28:26 -0400 (EDT)

45 lines

Re: DES: PTH Mathematical Model

Andrew J. Scholand <[log in to unmask]>

Wed, 18 Jun 1997 20:01:05 -0400 (EDT)

71 lines

New Thread

DES: PTH Mathematical Model -Reply

DES: PTH Mathematical Model -Reply

John Swinehart <[log in to unmask]>

Wed, 18 Jun 1997 14:38:57 -0400

67 lines

New Thread

DES: Track spacing for 100V on internal layers

DES: Track spacing for 100V on internal layers

Gary Willard-G10982 <[log in to unmask]>

Mon, 2 Jun 1997 11:15:34 +0000

64 lines

New Thread

DES: Track spacing for 100V on internal layers -Reply

DES: Track spacing for 100V on internal layers -Reply

Dennis Ostendorf <[log in to unmask]>

Mon, 02 Jun 1997 10:50:55 -0500

99 lines

Re: DES: Track spacing for 100V on internal layers -Reply

Duane B. Mahnke <[log in to unmask]>

Tue, 03 Jun 1997 20:07:00 -0700

162 lines

Re: DES: Track spacing for 100V on internal layers -Reply

[log in to unmask]

Mon, 9 Jun 1997 09:48:34 -0400 (EDT)

52 lines

New Thread

DES:I/O Terminations

DES:I/O Terminations

Andreas Olofsson <[log in to unmask]>

Wed, 18 Jun 1997 18:50:24 -0500

53 lines

Re: DES:I/O Terminations

[log in to unmask]

Thu, 19 Jun 1997 10:45:37 -0500

101 lines

New Thread

Design, Fab & Assembly - BGA, vias and power planes

Design, Fab & Assembly - BGA, vias and power planes

Tully, Marti (AZ15) <[log in to unmask]>

26 Jun 1997 14:32:12 -0500

69 lines

New Thread

Did Technet disappear

Did Technet disappear

Steve Collins <[log in to unmask]>

Mon, 23 Jun 1997 07:39:12 -0600

43 lines

New Thread

Document IRD-DES 003

Document IRD-DES 003

[log in to unmask]

Wed, 25 Jun 97 08:50:07 PST

42 lines

New Thread

double sided reflow-soldering top side to bottom side

Re[2]: double sided reflow-soldering top side to bottom side

Aric J Parr <[log in to unmask]>

Fri, 6 Jun 1997 10:14:06 -0500

115 lines

New Thread

double sided reflow-soldering top side to bottom side parts.

double sided reflow-soldering top side to bottom side parts.

Aric J Parr <[log in to unmask]>

Fri, 6 Jun 1997 08:52:57 -0500

56 lines

RE: double sided reflow-soldering top side to bottom side parts.

JIM ENNIS <[log in to unmask]>

Fri, 06 Jun 97 09:33:00 PDT

73 lines

Re: double sided reflow-soldering top side to bottom side parts.

Jeffery L. Hempton <[log in to unmask]>

Fri, 06 Jun 1997 09:51:12 -0500

86 lines

New Thread

Double Soldering?

Double Soldering?

Doug McKean <[log in to unmask]>

Fri, 20 Jun 1997 12:01:26 -0400

44 lines

Re: Double Soldering?

Sheila Smith <[log in to unmask]>

Fri, 20 Jun 1997 13:11:10 -0400 (EDT)

77 lines

New Thread

Double Soldering? -Reply

Double Soldering? -Reply

Jeff McGlaughlin <[log in to unmask]>

Mon, 23 Jun 1997 11:17:06 -0400

57 lines

New Thread

Dry Storage

RE: Dry Storage

Dhawan, Ashok CA-WINPO2 <[log in to unmask]>

Mon, 02 Jun 97 19:13:00 GMT

66 lines

New Thread

E-Mail massages

E-Mail massages

Gidon <[log in to unmask]>

Mon, 16 Jun 1997 23:32:00 +0000

43 lines

Re: E-Mail massages

Sheila Smith <[log in to unmask]>

Tue, 17 Jun 1997 14:19:45 -0400 (EDT)

57 lines

New Thread

Electrochemical migration

Electrochemical migration

[log in to unmask]

Tue, 17 Jun 1997 15:07:05 +0100

54 lines

re: Electrochemical migration

[log in to unmask]

Wed, 18 Jun 97 14:02:44 PDT

67 lines

New Thread

Electroless Deposition

Electroless Deposition

Steve Duke <[log in to unmask]>

Fri, 27 Jun 1997 11:00:47 -0500 (CDT)

55 lines

New Thread

EMC Analysis S/W

EMC Analysis S/W

Mark Radley <[log in to unmask]>

Thu, 19 Jun 1997 14:11:15

50 lines

New Thread

Emma 210 Driver

Emma 210 Driver

Dave Artman <[log in to unmask]>

Wed, 18 Jun 1997 17:00:22 -0500

51 lines

New Thread

Employment chatter

Employment chatter

sam mccorkel <[log in to unmask]>

Fri, 20 Jun 1997 08:58:32 -0400

43 lines

Re: Employment chatter

Matt Mahlau <[log in to unmask]>

Mon, 23 Jun 1997 13:56:13 -0400

62 lines

Re: Employment chatter

[log in to unmask]

Mon, 23 Jun 1997 19:24:49 -0400 (EDT)

36 lines

Re: Employment chatter

[log in to unmask]

Tue, 24 Jun 1997 10:13:36 +0600 (GMT+0600)

58 lines

New Thread

ETS300-019-1, 2, and 3

ETS300-019-1, 2, and 3

Frank Hinojos <[log in to unmask]>

Wed, 18 Jun 1997 10:39:25 -0700

44 lines

New Thread

Excellon SMX programing

Excellon SMX programing

c. norton <[log in to unmask]>

Thu, 19 Jun 1997 10:54:38 -0700

56 lines

New Thread

Expert Systems

Expert Systems

Jeremias Michael <[log in to unmask]>

Fri, 27 Jun 1997 15:35:27 -0700

53 lines

RE: Expert Systems

Alderete, Michael <[log in to unmask]>

Sun, 29 Jun 1997 14:26:02 -0700

137 lines

RE: Expert Systems

Andrew J. Scholand <[log in to unmask]>

Sun, 29 Jun 1997 12:13:51 -0400

77 lines

New Thread

FAB

FAB

Scott Westheimer-CTUA143 <[log in to unmask]>

Tue, 3 Jun 1997 21:28:53 -0500

40 lines

Fab

Engineering / Design Dept. <[log in to unmask]>

Fri, 06 Jun 1997 15:14:15 -0700

44 lines

fab

Otto Jespersen <[log in to unmask]>

Fri, 20 Jun 1997 16:51:25 -0400

42 lines

New Thread

FAB - chemical and physical properties of PCB board material

FAB - chemical and physical properties of PCB board material

Dr. Jolyon Browne <[log in to unmask]>

Mon, 23 Jun 1997 11:03:07 -0700

58 lines

RE: FAB - chemical and physical properties of PCB board material

Andrew J. Scholand <[log in to unmask]>

Tue, 24 Jun 1997 04:37:26 -0400 (EDT)

77 lines

New Thread

FAB and ASSY: Spec for Electroless Ni and Immersion A

Re[2]: FAB and ASSY: Spec for Electroless Ni and Immersion A

dmitchel <[log in to unmask]>

Wed, 04 Jun 97 07:43:57 PST

109 lines

New Thread

FAB and ASSY: Spec for Electroless Ni and Immersion Au

FAB and ASSY: Spec for Electroless Ni and Immersion Au

Reed, Randy <[log in to unmask]>

Tue, 03 Jun 1997 13:44 -0800

45 lines

Re: FAB and ASSY: Spec for Electroless Ni and Immersion Au

Jim Herard <[log in to unmask]>

Wed, 4 Jun 1997 10:34:48 -0400

91 lines

Re: FAB and ASSY: Spec for Electroless Ni and Immersion Au

[log in to unmask]

Wed, 4 Jun 1997 19:01:54 -0400 (EDT)

46 lines

RE: FAB and ASSY: Spec for Electroless Ni and Immersion Au

Jim Herard <[log in to unmask]>

Thu, 5 Jun 1997 13:16:38 -0400

157 lines

New Thread

FAB equipment, non-contact pyrometer

RE: FAB equipment, non-contact pyrometer

John Nelson <[log in to unmask]>

Wed, 25 Jun 1997 08:17:13 -0400

41 lines

New Thread

Fab/Assy: Decapsulant method

Fab/Assy: Decapsulant method

[log in to unmask]

Fri, 6 Jun 97 12:46:44 PDT

50 lines

Re: Fab/Assy: Decapsulant method

Michael Barmuta <[log in to unmask]>

Fri, 6 Jun 1997 15:33:23 -0700

86 lines

New Thread

FAB/ASSY: PCMCIA

FAB/ASSY: PCMCIA

[log in to unmask]

Tue, 10 Jun 1997 09:20:49 -0500

55 lines

New Thread

Fab: Addition of Controled Impedance Conductors

Fab: Addition of Controled Impedance Conductors

Avner Drory <[log in to unmask]>

Sun, 15 Jun 1997 22:05:06 +-300

64 lines

New Thread

FAB: APM Radiometers

FAB: APM Radiometers

Scott <[log in to unmask]>

Tue, 24 Jun 1997 10:24:25 -0400

45 lines

Re: FAB: APM Radiometers

[log in to unmask]

Tue, 24 Jun 97 15:09:22 -0800

73 lines

Re: FAB: APM Radiometers

Michael Barmuta <[log in to unmask]>

Tue, 24 Jun 1997 14:59:39 -0700

80 lines

Re: FAB: APM Radiometers

[log in to unmask]

Wed, 25 Jun 1997 00:05:55 -0400 (EDT)

51 lines

New Thread

FAB: conveyorized 'durabond'

FAB: conveyorized 'durabond'

J.Felts <[log in to unmask]>

Mon, 2 Jun 1997 23:22:23 -0700

47 lines

Re: FAB: conveyorized 'durabond'

[log in to unmask]

Wed, 4 Jun 1997 15:05:55 -0400 (EDT)

39 lines

New Thread

FAB: Copper foil compatability

FAB: Copper foil compatability

Saccomanno, Tom <[log in to unmask]>

Fri, 27 Jun 1997 10:51:55 -0400

38 lines

New Thread

FAB: CRM5 Material

FAB: CRM5 Material

Todd Rodgers <[log in to unmask]>

Mon, 2 Jun 1997 08:23:35 -0500

43 lines

Fab: CRM5 Material

Todd Rodgers <[log in to unmask]>

Tue, 3 Jun 1997 11:20:40 -0500

43 lines

New Thread

fab: drilling

Re: fab: drilling

Motoyo Wajima <[log in to unmask]>

Tue, 03 Jun 1997 18:21:55 +0900

98 lines

Re: fab: drilling

Motoyo Wajima <[log in to unmask]>

Wed, 04 Jun 1997 08:43:50 +0900

96 lines

Re: fab: drilling

Motoyo Wajima <[log in to unmask]>

Wed, 04 Jun 1997 08:44:51 +0900

98 lines

New Thread

Fab: Drilling/routing dust

Fab: Drilling/routing dust

Matt Mahlau <[log in to unmask]>

Mon, 2 Jun 1997 15:08:59 -0400

43 lines

New Thread

FAB: Etching Double-Treat foil.

FAB: Etching Double-Treat foil.

[log in to unmask]

Thu, 12 Jun 1997 16:00:28 -0400 (EDT)

53 lines

Re: FAB: Etching Double-Treat foil.

[log in to unmask]

Fri, 13 Jun 97 09:33:27 EST

80 lines

New Thread

FAB: Hole tolerances

FAB: Hole tolerances

Mike Buetow <[log in to unmask]>

Mon, 2 Jun 1997 14:47:39 -0500 (CDT)

56 lines

New Thread

Fab: Horizontal Oxide Line

Fab: Horizontal Oxide Line

Scott B. Westheimer <[log in to unmask]>

Tue, 3 Jun 1997 21:07:17 +0800

57 lines

Re: Fab: Horizontal Oxide Line

[log in to unmask]

Wed, 4 Jun 1997 02:00:31 -0400 (EDT)

40 lines

New Thread

FAB: Instrument for PTH Cu measurement.

FAB: Instrument for PTH Cu measurement.

Lars Ladefoged Holm <[log in to unmask]>

Wed, 25 Jun 1997 06:59:14 +0000

56 lines

New Thread

FAB: Lap shear test

FAB: Lap shear test

Yud <[log in to unmask]>

Mon, 30 Jun 1997 00:09:50 +0300

52 lines

Re: FAB: Lap shear test

ddhillma <[log in to unmask]>

Mon, 30 Jun 97 12:47:25 cst

79 lines

Re: FAB: Lap shear test

Delsen Testing Laboratories <[log in to unmask]>

Mon, 30 Jun 1997 13:25:46 -0700

74 lines

New Thread

FAB: LPI

FAB: LPI

Joe Lee <[log in to unmask]>

Thu, 5 Jun 1997 00:34:50 -0700

41 lines

Re: FAB: LPI

Paul Gould <[log in to unmask]>

Thu, 5 Jun 1997 23:23:07 +0100

76 lines

Re: FAB: LPI

[log in to unmask]

Sat, 7 Jun 1997 14:22:01 -0400 (EDT)

51 lines

New Thread

Fab: LPI soldermask

Fab: LPI soldermask

sam mccorkel <[log in to unmask]>

Thu, 26 Jun 1997 13:01:39 -0400

47 lines

New Thread

FAB: Material - FR10

FAB: Material - FR10

John Parsons <[log in to unmask]>

Tue, 10 Jun 1997 10:46:22 +0000

47 lines

Re: FAB: Material - FR10

Frank Hinojos <[log in to unmask]>

Tue, 10 Jun 1997 11:05:27 -0700

71 lines

Re: FAB: Material - FR10

Brock Hunter <[log in to unmask]>

Tue, 10 Jun 1997 14:18:39 -0400 (EDT)

61 lines

RE: FAB: Material - FR10

[log in to unmask]

Wed, 11 Jun 1997 11:31:42 +0100

54 lines

New Thread

FAB: Material ; G-10

FAB: Material ; G-10

Gary Peterson <[log in to unmask]>

Wed, 11 Jun 1997 09:06:16 -0600

53 lines

Re: FAB: Material ; G-10

[log in to unmask]

Wed, 11 Jun 1997 15:31:14 -0400 (EDT)

38 lines

Re: FAB: Material ; G-10

[log in to unmask]

Wed, 11 Jun 1997 17:14:10 -0400 (EDT)

39 lines

RE: FAB: Material ; G-10

[log in to unmask]

Wed, 11 Jun 1997 15:46:45 -0700

113 lines

Re: FAB: Material ; G-10

David Heywood <[log in to unmask]>

Fri, 13 Jun 1997 18:49:34 -0400

45 lines

New Thread

FAB: Material Certificate?

FAB: Material Certificate?

Jim Herard <[log in to unmask]>

Tue, 3 Jun 1997 11:52:35 -0400

108 lines

New Thread

FAB: Plating Thickness inside hole walls ; reliability of measurement

FAB: Plating Thickness inside hole walls ; reliability of measurement

Paul Gould <[log in to unmask]>

Mon, 9 Jun 1997 15:45:02 +0100

67 lines

New Thread

FAB: RE: Question on Pad Leveling

FAB: RE: Question on Pad Leveling

[log in to unmask]

Thu, 12 Jun 97 10:47:24 EST

65 lines

Re: FAB: RE: Question on Pad Leveling

Frank Hinojos <[log in to unmask]>

Thu, 12 Jun 1997 09:16:58 -0700

94 lines

FAB: RE: Question on Pad Leveling

Patrick Ducas <[log in to unmask]>

Thu, 12 Jun 1997 14:10:56 -0400

100 lines

Re: FAB: RE: Question on Pad Leveling

gabriela <[log in to unmask]>

Thu, 12 Jun 1997 22:00:27 +0000

152 lines

FAB: RE: Question on Pad Leveling

[log in to unmask]

Thu, 12 Jun 97 16:26:55 EST

112 lines

Re[2]: FAB: RE: Question on Pad Leveling

Frank Hinojos <[log in to unmask]>

Thu, 12 Jun 1997 16:30:22 -0700

258 lines

Re[2]: FAB: RE: Question on Pad Leveling

ddhillma <[log in to unmask]>

Thu, 12 Jun 97 20:45:42 cst

201 lines

Re: FAB: RE: Question on Pad Leveling

EDDIE ROCHA <EddieR@[192.9.200.50]>

Fri, 13 Jun 97 11:47:51 EDT

43 lines

New Thread

Fab: Rinse water quality

Fab: Rinse water quality

Scott B. Westheimer <[log in to unmask]>

Thu, 12 Jun 1997 20:32:36 +0800

46 lines

New Thread

FAB: tin only over copper on antenna design

FAB: tin only over copper on antenna design

Ed Cosper <[log in to unmask]>

Mon, 23 Jun 1997 15:53:25 -0500

60 lines

Re: FAB: tin only over copper on antenna design

Thomas E. Waznis <[log in to unmask]>

23 Jun 97 23:22:34 -0800

56 lines

Re: FAB: tin only over copper on antenna design

[log in to unmask]

Wed, 25 Jun 1997 09:22:41 -0400 (EDT)

42 lines

New Thread

FAB: Unbalance Copper Core

FAB: Unbalance Copper Core

[log in to unmask]

Thu, 19 Jun 1997 10:09:15 -0500

54 lines

New Thread

Fab: Wanted PWB Shop to Purchase

Fab: Wanted PWB Shop to Purchase

[log in to unmask]

Thu, 5 Jun 1997 12:00:43 -0400 (EDT)

58 lines

New Thread

Fab:Disposal of drilling/routing dust

Fab:Disposal of drilling/routing dust

Matthew Mahlau <[log in to unmask]>

Mon, 02 Jun 1997 14:07:08 -0400

42 lines

New Thread

FAB:Resin Removal from Tooling holes

FAB:Resin Removal from Tooling holes

Doug Jeffery <[log in to unmask]>

Wed, 25 Jun 1997 05:19:09 -0500 (CDT)

65 lines

Re: FAB:Resin Removal from Tooling holes

[log in to unmask]

Wed, 25 Jun 1997 23:07:31 -0400 (EDT)

55 lines

New Thread

Fab:Router dust

Fab:Router dust

Matthew Mahlau <[log in to unmask]>

Mon, 02 Jun 1997 13:58:05 -0400

42 lines

Re: Fab:Router dust

Ted Stern <[log in to unmask]>

Mon, 02 Jun 1997 14:16:37 -0700

113 lines

New Thread

Fabrication

Fabrication

[log in to unmask]

Mon, 02 Jun 97 13:58:29 EDT

48 lines

New Thread

FEB- ceramic BGA crackin

Re: FEB- ceramic BGA crackin

Greg Bartlett <[log in to unmask]>

13 Jun 1997 09:09:59 -0400

154 lines

New Thread

FEB: ceramic BGA cracking after wave solder

FEB: ceramic BGA cracking after wave solder

Sheila Smith <[log in to unmask]>

Wed, 11 Jun 1997 11:59:45 -0400 (EDT)

44 lines

FEB: ceramic BGA cracking after wave solder

Jim Herard <[log in to unmask]>

Thu, 12 Jun 1997 17:47:58 -0400

80 lines

New Thread

FW: ASSEM--PCB Marking Methods

FW: ASSEM--PCB Marking Methods

Dhawan, Ashok CA-WINPO2 <[log in to unmask]>

Mon, 16 Jun 97 13:36:00 GMT

97 lines

New Thread

FW: ASSY:Au/Ni Coated Boards

Re: FW: ASSY:Au/Ni Coated Boards

Jim Herard <[log in to unmask]>

Mon, 2 Jun 1997 10:54:53 -0400

221 lines

New Thread

FW: Bowing off Tantulam Caps

FW: Bowing off Tantulam Caps

Dhawan, Ashok CA-WINPO2 <[log in to unmask]>

Mon, 09 Jun 97 17:32:00 GMT

171 lines

New Thread

FW: Chlorine damage to electronics (fwd)

FW: Chlorine damage to electronics (fwd)

Paul Terranova <[log in to unmask]>

Tue, 17 Jun 1997 16:33:31 -0400

95 lines

New Thread

FW: Cleanliness of assembled boards

FW: Cleanliness of assembled boards

Graham Naisbitt <[log in to unmask]>

Thu, 26 Jun 97 17:42:55 UT

139 lines

New Thread

FW: Cross Section Service

FW: Cross Section Service

Paul Terranova <[log in to unmask]>

Tue, 24 Jun 1997 09:30:50 -0400

123 lines

FW: Cross Section Service

[log in to unmask]

Tue, 24 Jun 1997 09:48:52 -0700

95 lines

FW: Cross Section Service

[log in to unmask]

Tue, 24 Jun 1997 14:19:07 -0700

95 lines

New Thread

FW: DES: Panelization

FW: DES: Panelization

Dhawan, Ashok CA-WINPO2 <[log in to unmask]>

Thu, 05 Jun 97 18:17:00 GMT

156 lines

New Thread

FW: Dry Storage

FW: Dry Storage

Snider, Scott/NTSEUG <[log in to unmask]>

Mon, 02 Jun 97 09:05:00 PDT

42 lines

FW: Dry Storage

[log in to unmask] <[log in to unmask]>

Mon, 2 Jun 1997 12:21:23 -0500

58 lines

Re: FW: Dry Storage

Allen Hertz <[log in to unmask]>

Tue, 03 Jun 1997 09:09:41 -0500 (EST)

78 lines

New Thread

FW: EMC Analysis S/W

FW: EMC Analysis S/W

Mark Radley <[log in to unmask]>

Thu, 19 Jun 1997 16:12:48

51 lines

New Thread

FW: Hot Air Knife after solder pot?? Anyone use this?

FW: Hot Air Knife after solder pot?? Anyone use this?

Dhawan, Ashok CA-WINPO2 <[log in to unmask]>

Fri, 13 Jun 97 15:55:00 GMT

88 lines

New Thread

FW: Intrusive Reflow

FW: Intrusive Reflow

Dhawan, Ashok CA-WINPO2 <[log in to unmask]>

Fri, 20 Jun 97 02:14:00 GMT

79 lines

New Thread

FW: Nitto Tape

FW: Nitto Tape

Dhawan, Ashok CA-WINPO2 <[log in to unmask]>

Fri, 27 Jun 97 19:05:00 GMT

64 lines

New Thread

FW: PEM reflow

FW: PEM reflow

John Guy <[log in to unmask]>

Fri, 6 Jun 1997 13:28:20 -0500

72 lines

Re: FW: PEM reflow

Prasad Godavarti-G12162 <[log in to unmask]>

Fri, 6 Jun 1997 16:24:00 -0500

102 lines

New Thread

Fw: PLASTIC RIVET MACHINE SUPPLIER

Fw: PLASTIC RIVET MACHINE SUPPLIER

Scott B. Westheimer <[log in to unmask]>

Fri, 27 Jun 1997 18:08:26 +0800

58 lines

New Thread

FW: plugged vias

FW: plugged vias

Gagnon, Gerry <[log in to unmask]>

Wed, 18 Jun 1997 09:47:43 -0400

73 lines

New Thread

FW: Press Pin Assembly Equipmen

FW: Press Pin Assembly Equipmen

Dhawan, Ashok CA-WINPO2 <[log in to unmask]>

Thu, 19 Jun 97 15:30:00 GMT

79 lines

New Thread

FW: Re: palladium plating

FW: Re: palladium plating

[log in to unmask]

Wed, 11 Jun 1997 13:43:24 -0700

114 lines

New Thread

FW: removing solder mask

FW: removing solder mask

Blanchet,Richard <[log in to unmask]>

Thu, 19 Jun 1997 09:40:00 -0400 (EDT)

62 lines

New Thread

FW: Tented Vias

FW: Tented Vias

Paul Terranova <[log in to unmask]>

Wed, 25 Jun 1997 15:03:33 -0400

117 lines

New Thread

Fwd: Fab: Rinse water quality

Fwd: Fab: Rinse water quality

[log in to unmask]

Wed, 18 Jun 1997 12:46:30 -0400 (EDT)

204 lines

RE: Fwd: Fab: Rinse water quality

Bob Lundquist <[log in to unmask]>

Wed, 18 Jun 97 15:36:00 PDT

68 lines

RE: Fwd: Fab: Rinse water quality

Goldman, Patricia J. <[log in to unmask]>

Thu, 19 Jun 97 08:31:00 PDT

90 lines

New Thread

Fwd: RE: FAB equipment, non-contact pyrometer

Fwd: RE: FAB equipment, non-contact pyrometer

Edward J Popielarski <[log in to unmask]>

Wed, 25 Jun 1997 10:18:48 -0500 (CDT)

105 lines

New Thread

GEN - Image processing for PCB inspection

GEN - Image processing for PCB inspection

Dr. Jolyon Browne <[log in to unmask]>

Tue, 17 Jun 1997 17:47:32 -0700

58 lines

New Thread

Gen- Durometer Measurement

Re: Gen- Durometer Measurement

sbryan <[log in to unmask]>

Mon, 02 Jun 97 07:05:49 PST

72 lines

New Thread

Gen: R&D

Gen: R&D

Josep Sajut <[log in to unmask]>

Sun, 22 Jun 1997 22:53:38 -0400

44 lines

Re: Gen: R&D

[log in to unmask]

Tue, 24 Jun 1997 10:13:24 +0600 (GMT+0600)

60 lines

New Thread

GEN: S.M. adhesives

GEN: S.M. adhesives

Rob Palson <[log in to unmask]>

Mon, 9 Jun 1997 16:29:24 +0000

47 lines

New Thread

GEN: SUPPLIER

GEN: SUPPLIER

Jim Marsico 516-595-5879 <[log in to unmask]>

Mon, 09 Jun 1997 10:22:00 -0400 (EDT)

60 lines

Re: GEN: SUPPLIER

[log in to unmask]

Mon, 9 Jun 1997 14:27:24 -0400 (EDT)

40 lines

New Thread

Gen: Wanted,Tackroller

Gen: Wanted,Tackroller

Timothy Gaylor <[log in to unmask]>

Mon, 9 Jun 1997 13:25:56 -0400

46 lines

Re: Gen: Wanted,Tackroller

[log in to unmask]

Mon, 09 Jun 97 13:54:55 EST

38 lines

Re: Gen: Wanted,Tackroller

Scott <[log in to unmask]>

Mon, 09 Jun 1997 21:40:53 -0400

67 lines

Re: Gen: Wanted,Tackroller

[log in to unmask]

Tue, 10 Jun 1997 10:38:01 -0400 (EDT)

40 lines

New Thread

Gen: Wanted,Tackroller -Reply

Re: Gen: Wanted,Tackroller -Reply

Bob Stumpf <[log in to unmask]>

Tue, 10 Jun 1997 15:52:39 -0700

103 lines

New Thread

General: Vision Inspection of Built Up Assemblies

General: Vision Inspection of Built Up Assemblies

Clarke, Robert HSD <[log in to unmask]>

Mon, 02 Jun 1997 08:51:14 -0400

111 lines

Re: General: Vision Inspection of Built Up Assemblies

Greg Parke <[log in to unmask]>

Mon, 2 Jun 1997 10:39:21 -0400

58 lines

Re: General: Vision Inspection of Built Up Assemblies

gabriela <[log in to unmask]>

Tue, 03 Jun 1997 20:21:26 +0000

82 lines

New Thread

General: Vision Inspection of Built Up Assemblies -Reply

Re: General: Vision Inspection of Built Up Assemblies -Reply

Andre Bisson <[log in to unmask]>

Wed, 04 Jun 1997 09:14:59 -0300

106 lines

New Thread

Glaser DP3545 Photoplotter

Glaser DP3545 Photoplotter

K.Varadaraj@CADET, India <[log in to unmask]>

Sat, 14 Jun 1997 08:55:55 +0530

48 lines

New Thread

Globtop Decapsulation

Globtop Decapsulation

John Barton <[log in to unmask]>

Tue, 3 Jun 1997 15:02:27 +0000

54 lines

Re: Globtop Decapsulation

gabriela <[log in to unmask]>

Tue, 03 Jun 1997 20:05:36 +0000

74 lines

New Thread

Gold Finger Touch Up

Gold Finger Touch Up

Denis Meloche <[log in to unmask]>

Mon, 16 Jun 1997 13:50:59 -0400

45 lines

Re: Gold Finger Touch Up

Aric J Parr <[log in to unmask]>

Mon, 16 Jun 1997 14:08:49 -0500

72 lines

Re: Gold Finger Touch Up

[log in to unmask]

Mon, 16 Jun 1997 15:45:16 -0400

45 lines

Re: Gold Finger Touch Up

Paul Gould <[log in to unmask]>

Mon, 16 Jun 1997 22:21:30 +0100

62 lines

New Thread

Gold/Tin-soldering

Gold/Tin-soldering

[log in to unmask]

Fri, 13 Jun 97 14:41:39 +0200

52 lines

RE: Gold/Tin-soldering

[log in to unmask]

Fri, 13 Jun 1997 15:18:25 +0100

139 lines

New Thread

HALT / HASS physical stress systems

HALT / HASS physical stress systems

[log in to unmask]

Wed, 25 Jun 1997 08:42:11 -0400

45 lines

Re: HALT / HASS physical stress systems

Vickie Chapman <[log in to unmask]>

Wed, 25 Jun 1997 11:13:39 -0700

71 lines

Re: HALT / HASS physical stress systems

Frank Hinojos <[log in to unmask]>

Wed, 25 Jun 1997 14:31:01 -0700

70 lines

New Thread

HASL thickness...

HASL thickness...

MARK SIMMONS <[log in to unmask]>

Sat, 14 Jun 1997 06:44:04 -0700

49 lines

Re: HASL thickness...

ddhillma <[log in to unmask]>

Wed, 18 Jun 97 08:30:35 cst

80 lines

Hasl thickness...

MARK SIMMONS <[log in to unmask]>

Wed, 18 Jun 1997 14:23:30 -0700

45 lines

New Thread

Hello...

Hello...

Lyle Dove <[log in to unmask]>

Tue, 17 Jun 1997 22:26:41

54 lines

New Thread

High Cycle Fatigue Properties of Solder

Re: High Cycle Fatigue Properties of Solder

[log in to unmask]

Thu, 19 Jun 1997 13:51:25 -0400 (EDT)

49 lines

Re: High Cycle Fatigue Properties of Solder

[log in to unmask]

Thu, 19 Jun 1997 13:09:38 -0500

42 lines

New Thread

Hot Air Knife after solder pot?? Anyone use this?

Hot Air Knife after solder pot?? Anyone use this?

Tony Stewart <[log in to unmask]>

Fri, 6 Jun 1997 14:45:49 -0500

92 lines

Hot Air Knife after solder pot?? Anyone use this?

Edward J Popielarski <[log in to unmask]>

Mon, 16 Jun 1997 12:23:38 -0500 (CDT)

61 lines

Re: Hot Air Knife after solder pot?? Anyone use this?

Ron Hollandsworth <[log in to unmask]>

Mon, 16 Jun 97 13:28:57 -0500

117 lines

Re[2]: Hot Air Knife after solder pot?? Anyone use this?

Aric J Parr <[log in to unmask]>

Tue, 17 Jun 1997 09:08:33 -0500

159 lines

New Thread

How do you use Material Certificate?

How do you use Material Certificate?

KoizumiT <[log in to unmask]>

Tue, 03 Jun 97 10:34:25 JST

49 lines

RE: How do you use Material Certificate?

Darrell Bonzo <[log in to unmask]>

Tue, 03 Jun 97 7:45

171 lines

New Thread

Idents and HASL

Idents and HASL

David Arivett <[log in to unmask]>

Mon, 30 Jun 1997 16:20:55 -0500 (CDT)

46 lines

New Thread

Idents before or after HASL

Idents before or after HASL

[log in to unmask]

Fri, 27 Jun 1997 11:45:03 GMT

45 lines

RE: Idents before or after HASL

Kenny, James <[log in to unmask]>

Fri, 27 Jun 1997 10:08 -0800

79 lines

Re: Idents before or after HASL

[log in to unmask]

Sat, 28 Jun 1997 13:41:29 -0400 (EDT)

44 lines

Re: Idents before or after HASL

[log in to unmask]

Sun, 29 Jun 1997 01:53:15 -0400 (EDT)

55 lines

New Thread

Idents before or after HASL-- Reply

Idents before or after HASL-- Reply

Jim Herard <[log in to unmask]>

Fri, 27 Jun 1997 12:05:37 -0400

75 lines

New Thread

IMS Material

IMS Material

Elizabeth Falk <[log in to unmask]>

Wed, 11 Jun 1997 08:23:16 -0400

49 lines

Re: IMS Material

???@???

Wed, 11 Jun 97 08:21:55 CDT

54 lines

Re: IMS Material

Ulrich Korndoerfer <[log in to unmask]>

Fri, 13 Jun 1997 23:42:01 +0200

64 lines

New Thread

INFO: Charles Hutchins

INFO: Charles Hutchins

Jack Crawford <[log in to unmask]>

Mon, 2 Jun 1997 12:33:51 -0500

56 lines

New Thread

INFO: Charles Hutchins -Reply

INFO: Charles Hutchins -Reply

Eric Siegel <[log in to unmask]>

Mon, 02 Jun 1997 15:48:19 -0400

43 lines

New Thread

Insulation Displacement Connectors

Insulation Displacement Connectors

Howard Feldmesser <[log in to unmask]>

Tue, 24 Jun 1997 17:24:43 -0400

45 lines

Insulation Displacement Connectors

Jim Herard <[log in to unmask]>

Wed, 25 Jun 1997 12:07:44 -0400

93 lines

New Thread

Intrusive Reflow

Intrusive Reflow

Denis Meloche <[log in to unmask]>

Thu, 19 Jun 1997 12:31:31 -0400

45 lines

Re: Intrusive Reflow

Jeffery L. Hempton <[log in to unmask]>

Mon, 23 Jun 1997 07:43:34 -0500

71 lines

New Thread

Ionic contamination specs

RE:Ionic contamination specs

Karl Ring <[log in to unmask]>

Fri, 13 Jun 1997 04:33:03 -0400

61 lines

New Thread

IONIC TESTING

IONIC TESTING

Graham Naisbitt <[log in to unmask]>

Fri, 13 Jun 97 15:52:03 UT

46 lines

Re: IONIC TESTING

[log in to unmask]

Thu, 19 Jun 1997 12:48:29 -0400 (EDT)

41 lines

New Thread

IPC-A-610B Quality Levels

IPC-A-610B Quality Levels

Ed Koyama <[log in to unmask]>

Thu, 26 Jun 1997 17:42:30 -0400

57 lines

New Thread

IR Reflow Ovens & Wetting Balance

IR Reflow Ovens & Wetting Balance

[log in to unmask]

Mon, 9 Jun 1997 08:16:46 -0500

49 lines

New Thread

ISO Discussion Forum

RE: ISO Discussion Forum

[log in to unmask]

Fri, 13 Jun 97 9:45:43 PDT

146 lines

New Thread

ISO9002

ISO9002

sam mccorkel <[log in to unmask]>

Fri, 13 Jun 1997 08:32:56 -0400

39 lines

Re: ISO9002

[log in to unmask]

Fri, 13 Jun 1997 12:07:15 -0500

95 lines

Re: ISO9002

Jeffery L. Hempton <[log in to unmask]>

Fri, 13 Jun 1997 11:32:26 -0500

52 lines

ISO9002

sam mccorkel <[log in to unmask]>

Wed, 18 Jun 1997 12:35:45 -0400

46 lines

Re: ISO9002

[log in to unmask]

Thu, 19 Jun 97 09:00:06 PST

68 lines

New Thread

ISO9002 (fwd)

Re: ISO9002 (fwd)

David Bergman <[log in to unmask]>

Tue, 17 Jun 1997 12:06:57 -0500 (CDT)

90 lines

New Thread

John Sohn: Out of Office AutoReply: Cleanliness of assembled

RE: John Sohn: Out of Office AutoReply: Cleanliness of assembled

Graham Naisbitt <[log in to unmask]>

Thu, 26 Jun 97 17:47:15 UT

51 lines

New Thread

Koax plating

Koax plating

[log in to unmask]

Thu, 12 Jun 97 15:19:10 +0200

43 lines

New Thread

LCC

Re:LCC

Guenter Grossmann <[log in to unmask]>

Wed, 11 Jun 1997 09:59:36 +0200

51 lines

New Thread

LCC solder joint

LCC solder joint

Steve Siu <[log in to unmask]>

Mon, 9 Jun 1997 08:37:46 -0800

51 lines

Re: LCC solder joint

Aric J Parr <[log in to unmask]>

Mon, 9 Jun 1997 10:57:22 -0500

71 lines

RE: LCC solder joint

Steve Tetorka <[log in to unmask]>

Mon, 9 Jun 1997 11:53:00 -0800

84 lines

Re: LCC solder joint

[log in to unmask]

Mon, 9 Jun 1997 12:36:43 -0400 (EDT)

75 lines

Re: LCC solder joint

[log in to unmask]

Mon, 9 Jun 1997 22:39:36 -0400 (EDT)

51 lines

Re: LCC Solder Joint

Kasprzak, Bill (esd) US <[log in to unmask]>

Tue, 10 Jun 97 07:21:00 PDT

52 lines

Re[2]: LCC Solder Joint

Frank Hinojos <[log in to unmask]>

Tue, 10 Jun 1997 08:56:07 -0700

80 lines

New Thread

Linguistics

Linguistics

[log in to unmask]

Thu, 05 Jun 97 15:35:02 EDT

50 lines

Re: Linguistics

[log in to unmask]

Fri, 6 Jun 1997 12:11:17 -0400 (EDT)

42 lines

New Thread

Looking for CAD software

Looking for CAD software

[log in to unmask]

Thu, 19 Jun 1997 12:18:23 -0700

53 lines

New Thread

Looking to buy used CAD software

Looking to buy used CAD software

Mark Ross <[log in to unmask]>

Wed, 18 Jun 1997 12:15:34 -0700

54 lines

New Thread

LPI soldermask

RE: LPI soldermask

John Nelson <[log in to unmask]>

Thu, 26 Jun 1997 14:04:15 -0400

82 lines

New Thread

LPISM STRIPPING

LPISM STRIPPING

Lenny Kurup <[log in to unmask]>

Mon, 16 Jun 1997 11:33:43 -0400 (EDT)

54 lines

Re: LPISM STRIPPING

Lenny Kurup <[log in to unmask]>

Mon, 16 Jun 1997 11:52:08 -0400 (EDT)

72 lines

New Thread

LPSIM Stripping

LPSIM Stripping

Lynch, Lyn <[log in to unmask]>

Mon, 16 Jun 97 10:09:12

55 lines

Re: LPSIM Stripping

Lenny Kurup <[log in to unmask]>

Mon, 16 Jun 1997 14:39:59 -0400 (EDT)

85 lines

New Thread

Mailbox getting too full from TechNet??

Mailbox getting too full from TechNet??

Tony Stewart <[log in to unmask]>

Wed, 11 Jun 1997 17:48:51 -0500

135 lines

New Thread

me too.....

me too.....

KoizumiT <[log in to unmask]>

Wed, 18 Jun 97 11:49:49 JST

50 lines

New Thread

Measuring QFP Lead Pitch

Measuring QFP Lead Pitch

[log in to unmask]

4 Jun 1997 14:13:56 -0500

59 lines

Re: Measuring QFP Lead Pitch

Charles Elliott <[log in to unmask]>

4 Jun 1997 16:14:46 U

138 lines

New Thread

Message not deliverable

Message not deliverable

[log in to unmask]

Wed, 04 Jun 97 16:23:56 EST

74 lines

Message not deliverable

Lynch, Lyn <[log in to unmask]>

Thu, 26 Jun 97 12:35:13

105 lines

New Thread

MIL-P-11268

MIL-P-11268

Elizabeth <[log in to unmask]>

Wed, 18 Jun 1997 15:07:31 -0400

45 lines

MIL-P-11268

Elizabeth <[log in to unmask]>

Wed, 18 Jun 1997 15:52:15 -0400

45 lines

New Thread

Mill Dies

Mill Dies

Nelson Calimquim <[log in to unmask]>

Tue, 3 Jun 1997 14:43:48 -0700

46 lines

Re: Mill Dies

John Coonrod <[log in to unmask]>

Wed, 04 Jun 1997 15:56:00 -0700

111 lines

New Thread

Minimum gold plating on gold tabs

Minimum gold plating on gold tabs

starr devere <[log in to unmask]>

Fri, 6 Jun 1997 10:23:52 MST

38 lines

Re: Minimum gold plating on gold tabs

[log in to unmask]

Fri, 6 Jun 1997 15:04:01 -0400 (EDT)

44 lines

New Thread

Minimum gold plating on gold tabs -Reply

Minimum gold plating on gold tabs -Reply

Jeff McGlaughlin <[log in to unmask]>

Fri, 06 Jun 1997 15:02:57 -0400

62 lines

New Thread

Modifications to PCBs with 30AWG wire...

Modifications to PCBs with 30AWG wire...

Doug McKean <[log in to unmask]>

Mon, 16 Jun 1997 15:38:49 -0400

47 lines

Re: Modifications to PCBs with 30AWG wire...

Doug McKean <[log in to unmask]>

Tue, 17 Jun 1997 14:53:28 -0400

69 lines

Re: Modifications to PCBs with 30AWG wire...

[log in to unmask]

Wed, 18 Jun 1997 07:59:22 -0400

54 lines

RE: Modifications to PCBs with 30AWG wire...

Lepsche, Thomas G (NM75) <[log in to unmask]>

Wed, 18 Jun 1997 10:28:35 -0600

94 lines

New Thread

N2-bags

N2-bags

[log in to unmask]

Wed, 25 Jun 97 16:39:04 +0200

52 lines

Re: N2-bags

[log in to unmask]

Wed, 25 Jun 1997 11:12:04 -0500

114 lines

Re: N2-bags

scott birnbaum <[log in to unmask]>

Wed, 25 Jun 97 22:17:48 PDT

44 lines

New Thread

Need Carbon Capability Prototype Fab Shop.

Need Carbon Capability Prototype Fab Shop.

Beller, Les <[log in to unmask]>

Wed, 4 Jun 1997 11:54:08 -0600

49 lines

Re: Need Carbon Capability Prototype Fab Shop.

72030,3271 <[log in to unmask]>

04 Jun 97 20:42:55 EDT

42 lines

New Thread

New Printed Wiring Board Technology

New Printed Wiring Board Technology

Rob Dabney <[log in to unmask]>

Wed, 25 Jun 1997 09:46:39 -0700

88 lines

New Printed Wiring Board Technology

Rob Dabney <[log in to unmask]>

Wed, 25 Jun 1997 09:46:39 -0700

91 lines

New Thread

Nitto Tape

Nitto Tape

Nelson Calimquim <[log in to unmask]>

Wed, 25 Jun 1997 16:30:01 -0700

43 lines

Re: Nitto Tape

KoizumiT <[log in to unmask]>

Thu, 26 Jun 97 11:46:50 JST

58 lines

RE: Nitto Tape

[log in to unmask]

Thu, 26 Jun 1997 8:06:52 +0000

54 lines

RE: Nitto Tape

[log in to unmask]

Thu, 26 Jun 1997 8:06:52 +0000

147 lines

New Thread

No-clean/Test Probes/Cleaning

No-clean/Test Probes/Cleaning

Ron Hollandsworth <[log in to unmask]>

Fri, 27 Jun 97 08:21:25 -0500

87 lines

Re: No-clean/Test Probes/Cleaning

Aric J Parr <[log in to unmask]>

Fri, 27 Jun 1997 09:50:26 -0500

129 lines

New Thread

Non-halogenated fore retardant additives for laminates

Non-halogenated fore retardant additives for laminates

kathy barthman <[log in to unmask]>

Tue, 10 Jun 1997 14:40:11 -0700

52 lines

New Thread

OSP

OSP

Tamir Ben-Shoshan <[log in to unmask]>

Sun, 01 Jun 97 08:00:53 EST

39 lines

New Thread

palladium plating

palladium plating

Crown Circuits Inc. <[log in to unmask]>

Wed, 11 Jun 97 09:38 PDT

44 lines

Re: palladium plating

Sheila Smith <[log in to unmask]>

Wed, 11 Jun 1997 13:02:26 -0400 (EDT)

59 lines

Re: palladium plating

[log in to unmask]

Sun, 15 Jun 1997 08:41:26 -0400 (EDT)

46 lines

New Thread

paste measurement

paste measurement

MIKE J. LOPEZ <[log in to unmask]>

Wed, 18 Jun 1997 13:28:48 -0400

39 lines

Re: paste measurement

[log in to unmask]

Mon, 30 Jun 1997 10:44:29 -0400 (EDT)

40 lines

New Thread

Patent Search Web Site

Patent Search Web Site

Joseph Fjelstad <[log in to unmask]>

Tue, 3 Jun 1997 23:27:00 -0700

61 lines

RE: Patent Search Web Site

William Johnson <[log in to unmask]>

Wed, 4 Jun 97 21:13:14 UT

76 lines

RE: Patent Search Web Site

John Guy <[log in to unmask]>

Thu, 5 Jun 1997 07:41:44 -0500

112 lines

RE: Patent Search Web Site

william spalton <[log in to unmask]>

Thu, 5 Jun 97 9:10:23 EDT

131 lines

RE: Patent Search Web Site

Joseph Fjelstad <[log in to unmask]>

Wed, 4 Jun 1997 17:19:36 -0700

53 lines

Re[2]: Patent Search Web Site

Ron Hollandsworth <[log in to unmask]>

Thu, 05 Jun 97 10:10:38 -0500

145 lines

New Thread

PC Cards

PC Cards

[log in to unmask]

Fri, 13 Jun 1997 11:37:15 +0100

53 lines

Re: PC Cards

Jerry Cupples <[log in to unmask]>

Fri, 13 Jun 1997 10:27:29 -0500

105 lines

New Thread

PCB Lacquer

PCB Lacquer

Martin Dooner * <[log in to unmask]>

Wed, 18 Jun 1997 23:38:05 +0100

80 lines

New Thread

PCMCIA STANDARDS

PCMCIA STANDARDS

[log in to unmask]

Thu, 12 Jun 1997 11:58:16 +0100

54 lines

Re: PCMCIA STANDARDS

Lisa Williams <[log in to unmask]>

Thu, 12 Jun 1997 12:23:22 -0500 (CDT)

80 lines

New Thread

PHOTOPLOTTER 4 SALE + PROBIMER LINE

PHOTOPLOTTER 4 SALE + PROBIMER LINE

Roland Jaquet <[log in to unmask]>

Tue, 24 Jun 1997 15:51:59 +0200

75 lines

New Thread

placement system

placement system

Valladares, Hector A (FL51) <[log in to unmask]>

Mon, 30 Jun 1997 16:18:53 -0400

39 lines

New Thread

PLASTIC RIVET MACHINE SUPPLIER

PLASTIC RIVET MACHINE SUPPLIER

Danny Yam-CTUA124 <[log in to unmask]>

Fri, 27 Jun 1997 2:09:11 -0500

43 lines

Re: PLASTIC RIVET MACHINE SUPPLIER

Tomer_2 <[log in to unmask]>

Mon, 30 Jun 1997 15:51:17 +0000

53 lines

New Thread

Plating over Monel

Re: Plating over Monel

[log in to unmask]

Wed, 4 Jun 1997 11:18:18 -0400 (EDT)

40 lines

New Thread

plugged vias

plugged vias

David Arivett <[log in to unmask]>

Mon, 16 Jun 1997 14:43:23 -0500 (CDT)

62 lines

Re: plugged vias

Frank Hinojos <[log in to unmask]>

Tue, 17 Jun 1997 12:17:53 -0700

92 lines

plugged vias

Jim Herard <[log in to unmask]>

Tue, 17 Jun 1997 16:59:56 -0400

112 lines

Re: plugged vias

[log in to unmask]

18 Jun 97 08:33:56 EDT

113 lines

New Thread

Press Pin Assembly Equipmen

Press Pin Assembly Equipmen

Natalie Sharp <[log in to unmask]>

18 Jun 1997 15:56:02 U

53 lines

New Thread

Press Pin Assembly Equipmen -Reply

Press Pin Assembly Equipmen -Reply

RICH BUCCIERI <[log in to unmask]>

Thu, 19 Jun 1997 08:55:56 -0600

95 lines

New Thread

Preventive Maintenance Software

Preventive Maintenance Software

Steve Smith <[log in to unmask]>

Tue, 24 Jun 1997 15:25:37 -0700

43 lines

New Thread

Previous Message By Myself

Previous Message By Myself

Lyle Dove <[log in to unmask]>

Tue, 17 Jun 1997 22:31:48

51 lines

New Thread

Price Fixing and Restraints of Trade

Price Fixing and Restraints of Trade

William Johnson <[log in to unmask]>

Wed, 25 Jun 97 17:45:42 UT

36 lines

Re: Price Fixing and Restraints of Trade

Josep Sajut <[log in to unmask]>

Thu, 26 Jun 1997 05:37:21 -0400

41 lines

New Thread

Primary Image ( outer layers )

Primary Image ( outer layers )

[log in to unmask]

Thu, 05 Jun 97 14:29:34 -0800

52 lines

New Thread

profiling pcb's

profiling pcb's

Rob Williams <[log in to unmask]>

Wed, 25 Jun 1997 11:35:27 -0500

50 lines

Profiling PCB's

Kasprzak, Bill (esd) US <[log in to unmask]>

Wed, 25 Jun 97 15:18:00 PDT

45 lines

New Thread

PTH Mathematical Model

Re: PTH Mathematical Model

[log in to unmask]

Thu, 19 Jun 1997 07:35:37 -0400 (EDT)

50 lines

New Thread

Pumice Source

Pumice Source

[log in to unmask]

Thu, 12 Jun 1997 16:36:35 -0400 (EDT)

37 lines

New Thread

QS-9000 standard

QS-9000 standard

David Hall <[log in to unmask]>

Thu, 12 Jun 1997 12:50:17 PST

50 lines

Re: QS-9000 standard

[log in to unmask]

Thu, 12 Jun 1997 18:36:32 -0500

107 lines

Re: QS-9000 standard

Murphy Steve (UO/ESS) <[log in to unmask]>

Fri, 13 Jun 1997 08:02:07 -0400

63 lines

New Thread

Question on Pad Leveling???

RE: Question on Pad Leveling???

Kearney, Donald J (RFC MS-Mail) <[log in to unmask]>

Thu, 12 Jun 1997 09:39:00 -0400

53 lines

New Thread

R: Pumice Source

R: Pumice Source

Alessandro ROSSI <[log in to unmask]>

Fri, 13 Jun 1997 22:37:24 +-200

77 lines

New Thread

Raw Flex Manufacture

Raw Flex Manufacture

Sanmatech <[log in to unmask]>

Wed, 25 Jun 1997 19:19:15 +0800

59 lines

Re: Raw Flex Manufacture

[log in to unmask]

Wed, 25 Jun 1997 08:20:11 -0500

41 lines

New Thread

Raw Flex Manufacture; Please read

Re: Raw Flex Manufacture; Please read

[log in to unmask]

Thu, 26 Jun 1997 10:22:28 +0600 (GMT+0600)

325 lines

New Thread

removing solder mask

removing solder mask

Paul Wareham <[log in to unmask]>

Wed, 18 Jun 1997 01:04:53 -0300

45 lines

Re: removing solder mask

[log in to unmask]

Wed, 18 Jun 1997 10:52:56 -0500

74 lines

Re: removing solder mask

[log in to unmask]

Thu, 19 Jun 1997 08:47:55 -0400 (EDT)

40 lines

RE: removing solder mask

Frank Kurisu <[log in to unmask]>

Fri, 20 Jun 97 00:57:19 UT

92 lines

New Thread

Reply: Conformal coating

Reply: Conformal coating

Blanchet,Richard <[log in to unmask]>

Fri, 13 Jun 1997 13:37:00 -0400 (EDT)

39 lines

New Thread

Research Associate Vacancy

Research Associate Vacancy

D.C.Whalley <[log in to unmask]>

Wed, 04 Jun 1997 17:04:30 -0400

67 lines

New Thread

Resin Removal

Resin Removal

[log in to unmask]

Thu, 12 Jun 1997 12:23:15 +0100

60 lines

Re: Resin Removal

Doug Alcoe <[log in to unmask]>

Thu, 12 Jun 97 23:08:40 CST

96 lines

Resin Removal

[log in to unmask]

Thu, 19 Jun 1997 17:10:56 +0100

65 lines

New Thread

Re[2]: LPISM Stripping

Re: Re[2]: LPISM Stripping

[log in to unmask]

Sun, 15 Jun 1997 00:55:39 -0400 (EDT)

51 lines

RE: Re[2]: LPISM Stripping

Terry Zhu <[log in to unmask]>

Sat, 14 Jun 1997 23:16:39 -0700

94 lines

Re: Re[2]: LPISM Stripping

[log in to unmask]

Sun, 15 Jun 1997 12:55:52 -0400 (EDT)

59 lines

Re: Re[2]: LPISM Stripping

Lenny Kurup <[log in to unmask]>

Mon, 16 Jun 1997 10:56:27 -0400 (EDT)

80 lines

Re: Re[2]: LPISM Stripping

[log in to unmask]

Mon, 16 Jun 1997 23:18:45 -0400 (EDT)

35 lines

RE: Re[2]: LPISM Stripping

Terry Zhu <[log in to unmask]>

Tue, 17 Jun 1997 23:12:32 -0700

90 lines

Re: Re[2]: LPISM Stripping

[log in to unmask]

Thu, 19 Jun 1997 09:19:02 -0400 (EDT)

42 lines

New Thread

Re[2]: LPISM Stripping -Reply

RE: Re[2]: LPISM Stripping -Reply

Bob Metcalf <[log in to unmask]>

Wed, 18 Jun 1997 21:48:32 -0700

121 lines

New Thread

RF Design

Re: RF Design

Jack Olson <[log in to unmask]>

Tue, 24 Jun 1997 11:58:08 -0700

59 lines

RF Design

Raymond Klein <[log in to unmask]>

Tue, 24 Jun 1997 14:47:41 -0700

51 lines

Re: RF Design

Frank Hinojos <[log in to unmask]>

Tue, 24 Jun 1997 16:47:06 -0700

58 lines

RE: RF Design

Jeff McGlaughlin <[log in to unmask]>

Wed, 25 Jun 1997 10:37:02 -0400

66 lines

RE: RF Design

Jeff McGlaughlin <[log in to unmask]>

Wed, 25 Jun 1997 10:37:02 -0400

67 lines

New Thread

RF Design - Plating and Routing

RF Design - Plating and Routing

Jack Olson <[log in to unmask]>

Tue, 24 Jun 1997 08:32:47 -0700

60 lines

Re: RF Design - Plating and Routing

Tony Stewart <[log in to unmask]>

Tue, 24 Jun 1997 18:39:23 -0500

198 lines

New Thread

Rinse water quality

Rinse water quality

Radhakrishna N <[log in to unmask]>

Sat, 28 Jun 1997 11:49:51 -0700

52 lines

New Thread

Rinse water quality (graphs and formula)

Re:Rinse water quality (graphs and formula)

Bob Mesick <[log in to unmask]>

Mon, 30 Jun 1997 13:02:25 -0700

77 lines

New Thread

Roku-Roku Sangyo, Ltd.

Re: Roku-Roku Sangyo, Ltd.

KoizumiT <[log in to unmask]>

Thu, 26 Jun 97 11:35:41 JST

47 lines

New Thread

S/M Tack Cure Racks

S/M Tack Cure Racks

[log in to unmask]

Tue, 24 Jun 97 15:21:02 EST

37 lines

RE: S/M Tack Cure Racks

John Nelson <[log in to unmask]>

Wed, 25 Jun 1997 07:55:39 -0400

65 lines

New Thread

SILKSCREENING

RE: SILKSCREENING

John Nelson <[log in to unmask]>

Mon, 2 Jun 1997 09:41:44 -0400

55 lines

Re: Silkscreening

[log in to unmask]

Wed, 4 Jun 1997 12:27:16 -0400 (EDT)

41 lines

New Thread

SMT Assy Equipment

SMT Assy Equipment

[log in to unmask]

Mon, 30 Jun 1997 15:54:11 -0500

43 lines

New Thread

Solder balls

Re: Solder balls

[log in to unmask]

Sun, 15 Jun 1997 00:33:53 -0400 (EDT)

67 lines

Solder Balls

[log in to unmask]

Mon, 30 Jun 1997 10:23:05 -0500

56 lines

Re: Solder Balls

ddsulliv <[log in to unmask]>

Mon, 30 Jun 97 10:57:59 cst

113 lines

Re: Solder Balls

Aric J Parr <[log in to unmask]>

Mon, 30 Jun 1997 11:21:39 -0500

81 lines

New Thread

Solder joint strength

Re: Solder joint strength

[log in to unmask]

Sun, 8 Jun 1997 09:58:50 -0400 (EDT)

76 lines

New Thread

solder mask

solder mask

Suixin Zhang <[log in to unmask]>

Fri, 13 Jun 1997 14:11:57 +0100

49 lines

Re: solder mask

Paul Gould <[log in to unmask]>

Fri, 13 Jun 1997 16:13:55 +0100

66 lines

Re: solder mask

[log in to unmask]

Sun, 15 Jun 1997 02:24:51 -0400 (EDT)

49 lines

New Thread

Solder Mask CTI Rating

Solder Mask CTI Rating

[log in to unmask]

Wed, 11 Jun 1997 19:37:13 -0500

89 lines

Solder Mask CTI Rating

[log in to unmask]

Thu, 12 Jun 1997 9:16:08 -0500

90 lines

New Thread

Solder Precoat

Solder Precoat

CSS Asia Co., Ltd. <[log in to unmask]>

Thu, 5 Jun 1997 16:14:48 +0900

47 lines

New Thread

SOLDERABILITY OF IMMERSION GOLD

SOLDERABILITY OF IMMERSION GOLD

gabriela <[log in to unmask]>

Wed, 18 Jun 1997 15:15:38 +0000

53 lines

RE: SOLDERABILITY OF IMMERSION GOLD

Wally Doeling (wallyd) <[log in to unmask]>

Wed, 18 Jun 97 09:27:00 PDT

88 lines

New Thread

Solderability Tests of Boards

Solderability Tests of Boards

[log in to unmask]

Fri, 06 Jun 97 13:04:37 MST

65 lines

Re: Solderability Tests of Boards

[log in to unmask]

Sat, 7 Jun 1997 00:42:18 -0400 (EDT)

33 lines

Solderability Tests of Boards

Jim Herard <[log in to unmask]>

Wed, 11 Jun 1997 11:49:45 -0400

123 lines

Solderability Tests of Boards

[log in to unmask]

Mon, 23 Jun 97 13:54:27 MST

75 lines

Re: Solderability Tests of Boards

ddhillma <[log in to unmask]>

Mon, 23 Jun 97 16:29:05 cst

107 lines

New Thread

Soldering to Nickel Plate

Soldering to Nickel Plate

Gary Bliss <[log in to unmask]>

Wed, 25 Jun 1997 14:05:37 -0700

45 lines

New Thread

Soldering to Nickel Plate -Reply

Soldering to Nickel Plate -Reply

Jeff McGlaughlin <[log in to unmask]>

Thu, 26 Jun 1997 07:26:43 -0400

62 lines

New Thread

soldermask stripping

Re: soldermask stripping

sbryan <[log in to unmask]>

Mon, 02 Jun 97 06:57:43 PST

111 lines

New Thread

Solution: No Solder on Size "A" Tant Caps after WAVE also

Solution: No Solder on Size "A" Tant Caps after WAVE also

[log in to unmask]

Wed, 04 Jun 1997 10:25:51 EDT

231 lines

RE: Solution: No Solder on Size "A" Tant Caps after WAVE also

Rich Everman <[log in to unmask]>

Wed, 4 Jun 1997 09:33:55 -0500

222 lines

New Thread

Solution: No Solder on Size "A" Tant Caps after WAVE also SOT-23's

Solution: No Solder on Size "A" Tant Caps after WAVE also SOT-23's

D. A. (Tony) Stewart <[log in to unmask]>

Wed, 04 Jun 1997 07:43:38 -0500

105 lines

Re:Solution: No Solder on Size "A" Tant Caps after WAVE also SOT-23's

Guenter Grossmann <[log in to unmask]>

Thu, 5 Jun 1997 10:42:06 +0200

61 lines

New Thread

STD: IPC-6012 - Dewetting Definition

STD: IPC-6012 - Dewetting Definition

Quality Dept. - Eltek Ltd. <[log in to unmask]>

Tue, 17 Jun 1997 08:54:49 +0300 (IDT)

53 lines

Re: STD: IPC-6012 - Dewetting Definition

ddhillma <[log in to unmask]>

Wed, 18 Jun 97 09:09:52 cst

89 lines

Re: STD: IPC-6012 - Dewetting Definition

[log in to unmask]

Wed, 18 Jun 1997 10:41:33 -0400 (EDT)

35 lines

New Thread

Subject: Solution: No Solder on Size "A" Tant Caps after WAVE also SOT-23's

RE: Subject: Solution: No Solder on Size "A" Tant Caps after WAVE also SOT-23's

Rich Everman <[log in to unmask]>

Wed, 4 Jun 1997 08:45:27 -0500

212 lines

New Thread

subscrib

subscrib

~{3,IyS!VF0e9+K>~} <[log in to unmask]>

Tue, 3 Jun 1997 14:56:24 +0800

39 lines

New Thread

Supplier

Re: Supplier

[log in to unmask]

Sun, 15 Jun 1997 00:18:24 -0400 (EDT)

46 lines

New Thread

Supplier Edge connectors

Supplier Edge connectors

[log in to unmask]

Mon, 9 Jun 97 15:42:55 PDT

47 lines

New Thread

Supplier of polymer solders

Supplier of polymer solders

Patrick Ducas <[log in to unmask]>

Wed, 18 Jun 1997 11:46:42 -0400

50 lines

RE: Supplier of polymer solders

[log in to unmask]

Wed, 18 Jun 1997 11:58:53 -0700

91 lines

RE: Supplier of polymer solders

Patrick Ducas <[log in to unmask]>

Wed, 18 Jun 1997 15:55:56 -0400

131 lines

Re: Supplier of polymer solders

Motoyo Wajima <[log in to unmask]>

Thu, 19 Jun 1997 10:09:55 +0900

81 lines

Re: Supplier of polymer solders

Peter McGrath <[log in to unmask]>

Thu, 19 Jun 1997 08:44:03 -0700

40 lines

New Thread

Surface Mount Devices

Re: Surface Mount Devices

[log in to unmask]

Sun, 1 Jun 1997 09:48:33 -0400 (EDT)

59 lines

New Thread

Tantulam Powder

Tantulam Powder

Payne, Rick <[log in to unmask]>

Wed, 11 Jun 97 11:22:00 CDT

39 lines

New Thread

Taping machines

Taping machines

pgiovann <[log in to unmask]>

Thu, 19 Jun 97 02:08:02 PST

38 lines

New Thread

Tented Via Reliability

Tented Via Reliability

Frank Hinojos <[log in to unmask]>

Tue, 10 Jun 1997 16:18:45 -0700

43 lines

Re: Tented Via Reliability

[log in to unmask]

Wed, 11 Jun 1997 08:32:36 -0400 (EDT)

42 lines

New Thread

Tented Via Reliability -Reply

Tented Via Reliability -Reply

bob metcalf <[log in to unmask]>

Tue, 10 Jun 1997 17:16:39 -0700

64 lines

Re: Tented Via Reliability -Reply

Frank Hinojos <[log in to unmask]>

Tue, 10 Jun 1997 17:40:39 -0700

84 lines

Re: Tented Via Reliability -Reply

Jim Herard <[log in to unmask]>

Wed, 11 Jun 1997 08:32:25 -0400

128 lines

Re: Tented Via Reliability -Reply

[log in to unmask]

Wed, 11 Jun 1997 17:37:05 -0400 (EDT)

54 lines

Re: Tented Via Reliability -Reply

Hans Rohr <[log in to unmask]>

Wed, 11 Jun 1997 21:48:48 -0400

101 lines

New Thread

Tented Vias

Tented Vias

Frank Hinojos <[log in to unmask]>

Tue, 24 Jun 1997 14:53:34 -0700

46 lines

Re: Tented Vias

George Franck <[log in to unmask]>

Wed, 25 Jun 1997 09:02:45 -0400

82 lines

Re: Tented Vias

Greg Bartlett <[log in to unmask]>

25 Jun 1997 09:42:23 -0400

119 lines

New Thread

Test probes for gold fingers

Test probes for gold fingers

DAVID DUROSS <[log in to unmask]>

Mon, 30 Jun 97 12:52:14 UT

46 lines

New Thread

Thermal Retesting After Replacing ICs...

Thermal Retesting After Replacing ICs...

Doug McKean <[log in to unmask]>

Wed, 11 Jun 1997 12:25:39 -0400

63 lines

re: Thermal Retesting After Replacing ICs...

[log in to unmask]

Thu, 12 Jun 97 11:55:08 PDT

91 lines

New Thread

tim strip issue

tim strip issue

DAVID DUROSS <[log in to unmask]>

Wed, 18 Jun 97 21:07:11 UT

47 lines

Re: tim strip issue

[log in to unmask]

Thu, 19 Jun 1997 07:18:31 -0400 (EDT)

46 lines

Re: tim strip issue

[log in to unmask]

Sun, 22 Jun 1997 17:14:38 -0400 (EDT)

48 lines

New Thread

Timeway Program

Timeway Program

[log in to unmask]

Thu, 12 Jun 1997 08:30:13 -0500

51 lines

New Thread

Tin / HASL

Tin / HASL

sam mccorkel <[log in to unmask]>

Tue, 10 Jun 1997 13:29:13 -0400

42 lines

RE: Tin / HASL

Ed Cosper <[log in to unmask]>

Tue, 10 Jun 1997 13:24:40 -0500

85 lines

Tin / HASL

sam mccorkel <[log in to unmask]>

Wed, 11 Jun 1997 10:04:47 -0400

42 lines

New Thread

Tin as an etch resist

Tin as an etch resist

[log in to unmask]

Sat, 14 Jun 1997 13:07:38 -0400 (EDT)

41 lines

RE: Tin as an etch resist

Terry Zhu <[log in to unmask]>

Sat, 14 Jun 1997 19:51:38 -0700

83 lines

Re: Tin as an etch resist

Paul A Galatis <[log in to unmask]>

Sun, 15 Jun 1997 12:26:08 -0500

68 lines

Re: Tin as an etch resist

[log in to unmask]

Sun, 15 Jun 1997 08:32:41 -0400 (EDT)

62 lines

New Thread

Tin strip issue

Tin strip issue

DAVID DUROSS <[log in to unmask]>

Wed, 18 Jun 97 15:45:53 UT

46 lines

Re: Tin strip issue

Aric J Parr <[log in to unmask]>

Wed, 18 Jun 1997 13:08:19 -0500

75 lines

New Thread

TMA and TGA testing

TMA and TGA testing

[log in to unmask]

Fri, 6 Jun 1997 06:27:59 -0400 (EDT)

41 lines

RE: TMA and TGA testing

Steve Tetorka <[log in to unmask]>

Fri, 6 Jun 1997 8:22:00 -0800

70 lines

Re: TMA and TGA testing

Delsen Testing Laboratories <[log in to unmask]>

Fri, 06 Jun 1997 10:49:00 -0700

77 lines

New Thread

Touch up Ink for Outer layers

Touch up Ink for Outer layers

[log in to unmask]

Fri, 27 Jun 97 16:24:20 -0800

42 lines

New Thread

Touch-up

Touch-up

annie laberge <[log in to unmask]>

Fri, 06 Jun 1997 10:54:11 -0400

44 lines

Re: Touch-up

[log in to unmask]

Fri, 06 Jun 97 11:30:11 EST

57 lines

New Thread

Training-Certification

Training-Certification

Mel Parrish MTTC <[log in to unmask]>

Thu, 26 Jun 1997 15:10:39

59 lines

New Thread

Translator for Allegro

Translator for Allegro

Mirka Halas <[log in to unmask]>

Mon, 23 Jun 1997 16:01:46 -0400

47 lines

New Thread

Translator to Allegro

Translator to Allegro

Mirka Halas <[log in to unmask]>

Mon, 23 Jun 1997 16:36:30 -0400

49 lines

New Thread

Ultrasonic Cleaning

Ultrasonic Cleaning

[log in to unmask]

Fri, 6 Jun 1997 14:23:14 -0400 (EDT)

45 lines

Re: Ultrasonic Cleaning

Charles Elliott <[log in to unmask]>

6 Jun 1997 15:27:07 U

122 lines

Re: Ultrasonic Cleaning

Oliver Kierse <[log in to unmask]>

Mon, 9 Jun 97 09:50:32 BST

90 lines

RE: Ultrasonic Cleaning

Jack Crawford <[log in to unmask]>

Tue, 10 Jun 1997 10:27:27 -0500

127 lines

New Thread

UNE Specification

UNE Specification

김종우 <[log in to unmask]>

Wed, 18 Jun 1997 14:31:52 +0900

53 lines

UNE Specification

김종우 <[log in to unmask]>

Fri, 20 Jun 1997 08:56:43 +0900

47 lines

UNE Specification

김종우 <[log in to unmask]>

Fri, 20 Jun 1997 11:51:22 +0900

49 lines

New Thread

Unidentified subject!

Unidentified subject!

Sarunya P. <[log in to unmask]>

Tue, 03 Jun 1997 17:57:05 +0700

52 lines

New Thread

Unknown adhesive

Unknown adhesive

mhu <[log in to unmask]>

Tue, 10 Jun 97 15:46:15 PST

38 lines

New Thread

Used Equipment - From ex-PCB manufacturer

Used Equipment - From ex-PCB manufacturer

Roland Jaquet <[log in to unmask]>

Sat, 14 Jun 1997 10:33:55 +0200

159 lines

New Thread

via plugging

via plugging

Suixin Zhang <[log in to unmask]>

Tue, 10 Jun 1997 16:42:46 +0100

48 lines

via plugging

Jim Herard <[log in to unmask]>

Wed, 11 Jun 1997 08:45:16 -0400

88 lines

RE: via plugging

Lolmaugh, Scott (AZ15) <[log in to unmask]>

11 Jun 1997 09:48:42 -0500

134 lines

RE: Via Plugging

Jeff McGlaughlin <[log in to unmask]>

Wed, 11 Jun 1997 12:05:51 -0400

50 lines

New Thread

Via Reliability

Re: Via Reliability

[log in to unmask]

Wed, 11 Jun 1997 20:42:35 -0400 (EDT)

48 lines

New Thread

Vision and X-Ray inspection of assemblies

Vision and X-Ray inspection of assemblies

gabriela <[log in to unmask]>

Wed, 04 Jun 1997 17:25:46 +0000

44 lines

New Thread

waterbased flux

waterbased flux

[log in to unmask]

Wed, 25 Jun 97 16:18:50 +0200

50 lines

New Thread

Waterbased Flux AND N2 Bags

Waterbased Flux AND N2 Bags

Graham Naisbitt <[log in to unmask]>

Thu, 26 Jun 97 17:14:11 UT

94 lines

New Thread

Wave Solder

Wave Solder

Rob Williams <[log in to unmask]>

Fri, 27 Jun 1997 14:02:11 -0500

53 lines

Re: Wave Solder

Ron Hollandsworth <[log in to unmask]>

Mon, 30 Jun 97 09:27:43 -0500

86 lines

New Thread

Wave Solder Approach - a SURVEY

Wave Solder Approach - a SURVEY

[log in to unmask]

5 Jun 97 15:19:04 EDT

62 lines

Re: Wave Solder Approach - a SURVEY

P. ROY <[log in to unmask]>

06 Jun 97 08:03:19 EDT

51 lines

Re: Wave Solder Approach - a SURVEY

Jeffery L. Hempton <[log in to unmask]>

Fri, 06 Jun 1997 09:15:01 -0500

111 lines

RE: Wave Solder Approach - a SURVEY

Jack Crawford <[log in to unmask]>

Fri, 6 Jun 1997 11:00:26 -0500

86 lines

New Thread

Wave solder approach - A survey.

Wave solder approach - A survey.

Larry Morse <[log in to unmask]>

Wed, 05 Feb 1997 17:18:19 -0800

102 lines

re: Wave solder approach - A survey.

william spalton <[log in to unmask]>

Fri, 6 Jun 97 8:20:08 EDT

125 lines

New Thread

What is black alloy plating?

What is black alloy plating?

Kenneth Kowalski/Picker <[log in to unmask]>

2 Jun 97 15:37:56

43 lines

Re: What is black alloy plating?

[log in to unmask]

Wed, 4 Jun 1997 10:20:29 -0400 (EDT)

39 lines

New Thread

What is ED?

Re: What is ED?

Roland Jaquet <[log in to unmask]>

Mon, 2 Jun 1997 13:28:19 +0200

119 lines

RE: What is ED?

Goldman, Patricia J. <[log in to unmask]>

Mon, 02 Jun 97 08:20:00 PDT

98 lines

Re: What is ED?

Roland Jaquet <[log in to unmask]>

Tue, 3 Jun 1997 09:34:30 +0200

173 lines

New Thread

Where is SirGuru

Where is SirGuru

Kenny Bloomquist <[log in to unmask]>

Wed, 18 Jun 1997 09:32:17 -0700

46 lines

Re: Where is SirGuru

ddhillma <[log in to unmask]>

Wed, 18 Jun 97 14:06:29 cst

75 lines

Re: Where is SirGuru

Hans Rohr <[log in to unmask]>

Wed, 18 Jun 1997 21:09:21 -0400

55 lines

Re: Where is SirGuru

[log in to unmask]

Thu, 19 Jun 1997 10:45:51 -0400 (EDT)

40 lines

New Thread

White Residues and "J" leads

Re: White Residues and "J" leads

Kasprzak, Bill (esd) US <[log in to unmask]>

Wed, 11 Jun 97 14:20:00 PDT

67 lines

New Thread

[Fwd: Mousebites/divots]

[Fwd: Mousebites/divots]

anthony Peirano <[log in to unmask]>

Thu, 26 Jun 1997 17:34:23 -0700

88 lines

Re: [Fwd: Mousebites/divots]

[log in to unmask]

Fri, 27 Jun 1997 17:05:17 -0400 (EDT)

67 lines

Re: [Fwd: Mousebites/divots]

[log in to unmask]

Sat, 28 Jun 1997 13:01:06 -0400 (EDT)

48 lines

Re: [Fwd: Mousebites/divots]

[log in to unmask]

Sat, 28 Jun 1997 17:39:37 -0400 (EDT)

44 lines

Re[2]: [Fwd: Mousebites/divots]

ddsulliv <[log in to unmask]>

Mon, 30 Jun 97 09:20:11 cst

155 lines

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