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March 1997


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Table of Contents:

(FAB) Request for Film Processor Manufacturers (1 message)
(Fwd) Re: FAB(Shifting Layers) (2 messages)
50 mil pitch/30mil drill component, with 6 mil routing. (3 messages)
80 pin QFP (2 messages)
Accuracy of SnPb comp. meas. (2 messages)
Acid copper bath (4 messages)
Acoustic imaging of boards (1 message)
Adhesive Squeeze Out (2 messages)
Admin: New Opportunity (1 message)
Advertisement on the Technet (4 messages)
alloy 42 (1 message)
Alpha-Prep (1 message)
Alpha-Prep-responce (1 message)
Alternative to HASL (3 messages)
Alternatives to HASL (3 messages)
analysis method for copper in effluent (5 messages)
Any recommendations for test fixture drilling machine (1 message)
ASM Gilbert Connectors (1 message)
ass- gold/Ni solder skips (4 messages)
assem (6 messages)
Assembly (2 messages)
Assembly Test Defect Analysis (3 messages)
Assembly: Solder plating height for TAB bonding (1 message)
Assembly:Looking for optical Comparator (3 messages)
ASST: Grainy wave solder joints (3 messages)
ASSY (1 message)
ASSY wirebonding (1 message)
ASSY- Bake for component re (1 message)
ASSY/TEST: Electrical Test; Solder contact problem (1 message)
ASSY: Au-plated Kovar (1 message)
Assy: BGA query (1 message)
Assy: Blowhole (7 messages)
Assy: Blowhole -- > Thanks (1 message)
Assy: Blowhole(reply) (1 message)
ASSY: brainstorm ways to acheive better wetting to Pd-Ag terminations? (2 messages)
Assy: Component in tape counters. (1 message)
ASSY: CONFORMAL COATING ADHESION (5 messages)
ASSY: CONFORMAL COATING ADHESION -Reply (2 messages)
ASSY: Double sided soldering (2 messages)
ASSY: Fractured Solder Joints (2 messages)
ASSY: Gold in the solder connection #2 (3 messages)
ASSY: Gold in the solder connection. (2 messages)
Assy: green stuff (2 messages)
ASSY: HASL height for fine pitch bonding (1 message)
Assy: Lifted lead (QFP) (5 messages)
ASSY: LOOKING FOR COMPONENT SERVICE SUPPLIER (2 messages)
ASSY: Magnetic pick-up tools (1 message)
ASSY: manufacturers (1 message)
Assy: Pad lifting (2 messages)
ASSY: Pin Fracture (1 message)
Assy: QFP Reflow (6 messages)
Assy: resistor networks (2 messages)
ASSY: Saponification shorts (1 message)
Assy: Small PC Card (1 message)
Assy: Small PC-Card (3 messages)
Assy: Vapor Phase Reflow Oven (6 messages)
ASSY:ALTERNATIVES TO HASL (3 messages)
ASSY:baking of PBGAs (3 messages)
Assy:Dwell time (1 message)
ASSY:Grainy wave solder joints (3 messages)
ASSY:search for conformal coat mat'l (1 message)
Attaching methods for thermocouples (5 messages)
Automatic Packaging needed (1 message)
backplane bending (2 messages)
BACKSIDE WAVE SOLDER OF IC'S (1 message)
BAKING & STORAGE CONDITION OF PBGA (1 message)
Balls after reflow (1 message)
Bare Board electrical test equipment (1 message)
Bare PWB for Pc computers (4 messages)
Black-oxide layer turned red after pressing (7 messages)
BOARD WARPAGE (2 messages)
Brass inserts (1 message)
BUM Technology (3 messages)
Cartoon Box (1 message)
cc:Mail UUCPLINK 2.0 Undeliverable Message (1 message)
Ceramic panels that darken with electric current. (1 message)
Change to J-STD-001 (1 message)
Cleaning of BGA (6 messages)
Commercial components in Military apps. (5 messages)
Commercial Workmanship Standards (4 messages)
conductive carbon ink (1 message)
Conformal coating of printed circuit boards (1 message)
Contracts for Turnkey Manufacturing (1 message)
Copper Peel Strength on microvia - dielectrics (1 message)
copper plating (2 messages)
Copper Plating to Fe/Ni Alloys (2 messages)
Crescent 30 Photoplotter Problems... (2 messages)
Crystal Insulator Pads (1 message)
Crystal Insulator Pads -Reply (1 message)
Crystal Insulator Pads -Reply -Reply (1 message)
Current Carring Capacity (3 messages)
D.E.S.E. (3 messages)
Data Protection (1 message)
DES (2 messages)
DES FAB (1 message)
DES/ASSY: Placement files (1 message)
DES/FAB Moisture and Fungus Testing (1 message)
DES: Breakaway hole design (1 message)
DES: Cu fills on circuit layers (2 messages)
Des: GigaHertz Loss (1 message)
Des: Impedance Calc - special (1 message)
DES: inexpensive plotter (4 messages)
DES: Internal Connections On PWBs (2 messages)
Des: IPC-D-356 Netlist From Allegro (1 message)
DES: Viewlogic ISIS software (1 message)
Design-IPC-D-356/RS274X format (1 message)
Design-Microstrip (3 messages)
Design: Hybrid Design Training (2 messages)
DesignRules Wire and Ribbon Bonding (1 message)
Desmear follow-up (3 messages)
differential impedance testing (2 messages)
Dimensional stability (3 messages)
Dk & Df (2 messages)
DXF to Gerber?. (2 messages)
Easter Weekend (1 message)
EL (Electroluminescent) Flexible strips fabrication (1 message)
elctroless nickel gold -an update (1 message)
elctroless nickel gold -and dull Copper pads after stripping of Tin (1 message)
ELECTROLESS NiAu - BACKGROUND PLATING (1 message)
elimination of etch resists through differential etching (fwd) (1 message)
EMI/RFI/H-field Data Protection (2 messages)
ESD PROBLEM ON ATI CNC ROUTING MACHINE (4 messages)
Etchback vs Smear Removal (1 message)
etching of microsections (1 message)
Eutectic Solder Mechanical Properties (1 message)
Excessive caking of debris (DRILL) (4 messages)
Experience users of Unline 2000 (test fixure drilling system) (1 message)
Expo ATP Meeting - Title, Description (fwd) (1 message)
exposed copper OSP (1 message)
fab (2 messages)
fab - cleanning of innerlayers (1 message)
FAB(Shifting Layers) (5 messages)
Fab/Assy: Class3, 1/2 tented vias (1 message)
FAB: ALTERNATIVE TO HASL (3 messages)
FAB: BGA and uBGA phototool reqrmnts (1 message)
Fab: C.B-200 Question (1 message)
FAB: Conformal coating (3 messages)
Fab: Multilayer Lamination - Image Transfer/Telegraphing (1 message)
FAB: Nan Ya (2 messages)
FAB: Palladium Plating (6 messages)
FAB: Resin Recession (1 message)
FAB: Silver-Fill (2 messages)
FAB:Preclean parameters (2 messages)
FAB:Prepreg shelf life - a functional test (1 message)
FAB:SPC for PWB ET (1 message)
FIDUCIALS (7 messages)
fine pitch SMT solder mask (1 message)
Flex circuit heat sealing equipment (2 messages)
FR-4 (2 messages)
FR4 standard sizes (1 message)
FW: Assy: Lifted lead (QFP) (1 message)
FW: Conformal coating (1 message)
Fw: Copper Peel Strength on microvia - dielectrics (1 message)
FW: DesignRules Wire and Ribbon Bonding (1 message)
FW: elimination of etch resists through differential etching (2 messages)
FW: Eutectic Solder Mechanical Properties (2 messages)
FW: FIDUCIALS (1 message)
FW: Galvanic Corrosion (1 message)
FW: Gold/Tin Lead (1 message)
FW: Interconnection Resistance, Multilayer Printed Wiring. (3 messages)
FW: IPC ARTWORK (1 message)
FW: IPC-2221 AND IPC-2222 , MIL-PRF-55110F (1 message)
FW: Obsolete Transistors (1 message)
FW: OSP pads not fully covered with solder (1 message)
Fw: Re: Defective PWB at customer's facility (1 message)
FW: The meaning of ISO (4 messages)
Fwd: Mechanical Properties: Intermetallic Thickness! (1 message)
fwd: Re: Gold Embrittlement (1 message)
FWD>GEN- SPC software desig (1 message)
Galvanic Corrosion (7 messages)
Gen Arlon contact (1 message)
Gen- Cu protective coating (1 message)
GEN-Hollis Cleaners (2 messages)
Gen: Arlon contact (2 messages)
GEN: Carbamates (1 message)
GEN: IPC Designers Council Chesapeake Chapter Meeting (3 messages)
GEN: IPC Designers Council Chesapeake Chapter Minutes (1 message)
GEN: Scanning Mylar (4 messages)
GEN: SPC software designed for PCB production (1 message)
Gerber format (4 messages)
GERBER TO DXF?? (8 messages)
gerber viewer (3 messages)
Glass transition temperature (2 messages)
Gold Embrittlement (2 messages)
gold in solder joints (1 message)
Gold Thickness on Pads (3 messages)
Gold/Tin (1 message)
Gold/Tin - How to Remove Sn and Replate Au (4 messages)
handling silver halide wastes (3 messages)
HASL (1 message)
HASL Replacements (2 messages)
help on failure analysis of modules (1 message)
Help on PCBA qualify inspection (2 messages)
How to obtain IPC spec compliance (1 message)
Immersion gold for keypad contacts (4 messages)
Immersion gold vs. Hot air solder level from component assembly point of view (1 message)
Immersion Tin process (5 messages)
impedance calculation software (4 messages)
Impedance of parallel Traces (1 message)
Impedance testing source (3 messages)
Inner layer silver screen material. (2 messages)
Introduction to ISO (1 message)
Ionic Contamination on PWA (5 messages)
IPC / Industry MELF Components (1 message)
IPC ARTWORK (5 messages)
IPC Designers Council Chesapeake Chapter (1 message)
IPC maillist maintainer on vacation :-) (1 message)
IPC-2221 AND IPC-2222 , (1 message)
IPC-2221 AND IPC-2222 , MIL-PRF-55110F (2 messages)
IPC-RB-276 is OBSOLETE! -Reply -Reply (1 message)
IPCchat session announcement (3 messages)
IR Oven Calibration (3 messages)
ISO Cleanroom Standard (3 messages)
ITO Coated Film (1 message)
JEDEC Component Trays (1 message)
Lab for Impedance Testing (1 message)
LAMINATION RIVETING (3 messages)
Land Pattern Standard for Xtal Osc? (2 messages)
Lead forming of ASICS - (DES???) (1 message)
LOOKING FOR SUPPLIER OF LARGE FORMAT PCB - PTH - UL APPROVED (2 messages)
mailstorm (1 message)
Marine Environment (3 messages)
marking standards (6 messages)
maximum weight for DSR (1 message)
Meaning of "ISO" (1 message)
Mechanical Properties: Intermetallic Thickness! (5 messages)
microphone (1 message)
Microsection Etchants (1 message)
Microsectioning (7 messages)
Microvia technology (1 message)
MIL-I-45208A (1 message)
Multilayer PCB (1 message)
Mylar removal on inners. (2 messages)
NEED Gerber viewer with (1 message)
NEED Gerber viewer with highlight capability (4 messages)
need info on SSD process of PCMCIA (5 messages)
Ni-Au Electroless (2 messages)
Ni-Au Electroless -Reply (4 messages)
Nitrogen Storage (2 messages)
No Clean Bare Board Controls (8 messages)
No Clean Bare Board Controls -Reply (1 message)
No-Clean Solder Block Change Info Wanted (2 messages)
Obsolete Transistors (3 messages)
Odd symbols in messages (1 message)
OSP Coatings -- Solderability (1 message)
OSP pads not fully covered with solder (2 messages)
OSP versus HASL (3 messages)
Panel utilisation (1 message)
Paste Flux for FCOB (1 message)
Pattern plating considerations (2 messages)
PCB (9 messages)
PCB Design software (2 messages)
PCB Designers (1 message)
PCB for high frequency (2 messages)
PCB REPAIR (3 messages)
PCB: Solder Joint issue (3 messages)
Peelable Coating Mask (1 message)
peelable mask (3 messages)
Photo Via (3 messages)
Photo-Defined Blind Vias - Technology Workshop - San Jos (2 messages)
Photo-Defined Blind Vias - Technology Workshop - San Jose - Thurs afterno... (1 message)
Photo-Defined Blind Vias - Technology Workshop - San Jose - Thurs afternoon March 13th - Red Lion Hotel (1 message)
Placement files (3 messages)
Plastic on LCCC pads (1 message)
Preclean parameters (1 message)
Prepreg shelf life. (3 messages)
Printed Wire Assembly Solder Rework Reliability (1 message)
Processing PTFE laminates. (2 messages)
Protracer Driver (1 message)
Pulse plating of copper and tin/lead (3 messages)
PWB traveler generation software (2 messages)
PWB's 1 pass ratio (1 message)
PWB,PCB,PWBA,ETC. (1 message)
PWB: Coating and White ID stringers (1 message)
QUAL: MIL-STD Comparison (2 messages)
Questionarie on Double Sided SMA (1 message)
Re,Re:cleaning of BGA's (2 messages)
RE: Response to : Black-oxide layer turned red after pressing (1 message)
Receipt of 3/27/97 4:46PM message (1 message)
Recycle (1 message)
Regarding SPC in PCB shops (2 messages)
Removing solder from leads (1 message)
REQUESTED SPC INFO ( 5 PAGES) (3 messages)
Resend: Questionarie on Double Sided SMA (1 message)
Resin Recession (4 messages)
Response to SPC Question. (3 messages)
Response to SPC Question. -Reply (1 message)
Rework and Repair Station (6 messages)
Re[2]: Microsectioning (1 message)
ROLAND - - LARGE BOARDS (1 message)
Searching for Info on Bellcore Complaince Testing (1 message)
Selective PCB plating (5 messages)
Self limiting Immersion Gold Process (1 message)
sequential build up (1 message)
Shipping Automation (1 message)
Shrink Wrap for pcbs (2 messages)
Silver Halide Wastes (1 message)
SMT Assembly and Flex Circuits (6 messages)
SMT Assembly and Flex Circuits -Reply (1 message)
SMT pre-owned equipments (2 messages)
SMT REEL SPLICER (3 messages)
Solder Joint issue (1 message)
Solder Mask Coverage and exposed SN/PB and Copper (2 messages)
Solder Mask on fine pitch SMT component (7 messages)
Solder Mask on fine pitch SMT component -Reply (1 message)
Solder mask question (1 message)
Solder preforms. (3 messages)
Solderability Shelf Life of Untreated Copper SMT Pads (1 message)
Soldermask question (4 messages)
Soldermask question -Reply (1 message)
Solutions for Loading Databas using Mentor "Board Station" (1 message)
Solutions for Loading Databas using Mentor "Board Station" (fwd) (1 message)
SOT-23 lands for wave soldering (2 messages)
SPC chart for % defective (4 messages)
SPC for PCB fabrication (2 messages)
SPC for PCBs (1 message)
SPC software designed for PCB production (2 messages)
Specs (1 message)
Spots on Cu surfaces aft (1 message)
Spots on Cu surfaces after OSP coating (1 message)
Strategy for Baking Plastic Parts... (1 message)
Surface Mount Reliability (1 message)
Surface Mount test points (3 messages)
Surface tension of molten Pb/Sn (2 messages)
TCE (3 messages)
Test coupans for controlled impedance boards. (3 messages)
Testing Methodolgies (1 message)
Testing strategies (1 message)
Testing strategies -Reply (1 message)
The meaning of ISO (2 messages)
TSOPs (1 message)
UL (2 messages)
ultra fine pithch vs. fine pitch (1 message)
Unidentified subject! (8 messages)
Use of Microvia Technology (2 messages)
Use of Microvia Technology/ Reply (1 message)
Using Silver on Boards for Better Solderability (1 message)
UTP - Unshielded Twisted Pair (3 messages)
Vapor phase oven/Centech info. (1 message)
WAVE SOLDER PALLETS (1 message)
Wire bonding (3 messages)
Wire Termination Spec. (1 message)
Working to NHB5300.4(3A-1) (3 messages)
Workmanship Standards (1 message)
Workmanship Standards (fwd) (1 message)
[Fwd: Re: Placement files] (1 message)
[Fwd: Re[2]: Pulse plating of copper and tin/lead] (1 message)

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Subject Sorted by Subject, Chronologically

From

Date

Size

New Thread

(FAB) Request for Film Processor Manufacturers

(FAB) Request for Film Processor Manufacturers

[log in to unmask]

Tue, 18 Mar 97 9:53:45 EST

45 lines

New Thread

(Fwd) Re: FAB(Shifting Layers)

(Fwd) Re: FAB(Shifting Layers)

Bob McGarry <[log in to unmask]>

Fri, 21 Mar 1997 08:46:52 +0000

98 lines

Re: (Fwd) Re: FAB(Shifting Layers)

SCOTT BALLER <[log in to unmask]>

Fri, 21 Mar 97 06:44:59 PST

132 lines

New Thread

50 mil pitch/30mil drill component, with 6 mil routing.

50 mil pitch/30mil drill component, with 6 mil routing.

K.Varadaraj@CADET, India. <[log in to unmask]>

Sat, 15 Mar 1997 13:21:16 +0500 (GMT+0500)

56 lines

Re: 50 mil pitch/30mil drill component, with 6 mil routing.

Rainer Taube <[log in to unmask]>

Sat, 15 Mar 1997 19:31:00 -0500

62 lines

RE: 50 mil pitch/30mil drill component, with 6 mil routing.

Wander, Nicholas G <[log in to unmask]>

Mon, 17 Mar 1997 07:48:33 -0700

78 lines

New Thread

80 pin QFP

80 pin QFP

James Beard <[log in to unmask]>

Thu, 13 Mar 1997 09:53:45 -0800

39 lines

80 pin QFP

Robert Donovan <[log in to unmask]>

Thu, 13 Mar 1997 12:20:07 -0600

53 lines

New Thread

Accuracy of SnPb comp. meas.

Accuracy of SnPb comp. meas.

Dave Willhard <[log in to unmask]>

Fri, 14 Mar 1997 16:14:16 PST

57 lines

Re: Accuracy of SnPb comp. meas.

[log in to unmask]

Fri, 14 Mar 97 17:13:08 MST

108 lines

New Thread

Acid copper bath

Acid copper bath

tonghh <[log in to unmask]>

Mon, 17 Mar 1997 22:49:23 +0800

45 lines

Re: Acid copper bath

[log in to unmask]

Mon, 17 Mar 1997 14:49:27 -0500 (EST)

40 lines

RE: Acid copper bath

George Carroll (PO3) <[log in to unmask]>

Mon, 17 Mar 1997 16:12:00 -0500

79 lines

Re[2]: Acid copper bath

ddsulliv <[log in to unmask]>

Tue, 18 Mar 97 08:02:34 cst

112 lines

New Thread

Acoustic imaging of boards

Acoustic imaging of boards

robert larmouth <[log in to unmask]>

Fri, 07 Mar 97 09:22:17 PST

41 lines

New Thread

Adhesive Squeeze Out

Adhesive Squeeze Out

Robert Boilard <[log in to unmask]>

Wed, 05 Mar 1997 17:52:19 -0500

50 lines

Re: Adhesive Squeeze Out

[log in to unmask]

Mon, 10 Mar 97 10:47:05 PST

81 lines

New Thread

Admin: New Opportunity

Admin: New Opportunity

Andrew P Magee <[log in to unmask]>

Thu, 13 Mar 1997 18:26:00 -0800

68 lines

New Thread

Advertisement on the Technet

Advertisement on the Technet

Renee Devlin <[log in to unmask]>

Thu, 6 Mar 1997 10:55:39 -0600

53 lines

Re: Advertisement on the Technet

[log in to unmask]

Thu, 6 Mar 1997 18:23:55 -0600

102 lines

Re: Advertisement on the Technet

Cadet automation systems <[log in to unmask]>

Fri, 7 Mar 1997 08:42:16 +0500 (GMT+0500)

78 lines

Re: Advertisement on the Technet

[log in to unmask]

Fri, 7 Mar 1997 09:16:25 -0500 (EST)

33 lines

New Thread

alloy 42

Re: alloy 42

[log in to unmask]

Fri, 28 Mar 1997 08:57:22 -0500 (EST)

84 lines

New Thread

Alpha-Prep

Alpha-Prep

Matt Mahlau <[log in to unmask]>

Mon, 3 Mar 1997 13:24:30 -0500

50 lines

New Thread

Alpha-Prep-responce

Re: Alpha-Prep-responce

[log in to unmask]

Mon, 3 Mar 1997 22:32:41 -0500 (EST)

39 lines

New Thread

Alternative to HASL

Alternative to HASL

Darrell Daigle <[log in to unmask]>

Wed, 19 Mar 97 11:13:00 PST

40 lines

Re: Alternative to HASL

[log in to unmask]

Mon, 24 Mar 1997 16:44:15 +0100

48 lines

Re: Alternative to HASL

[log in to unmask]

Mon, 24 Mar 1997 12:32:40 -0500 (EST)

45 lines

New Thread

Alternatives to HASL

Re: Alternatives to HASL

[log in to unmask]

Wed, 19 Mar 1997 17:08:46 -0500 (EST)

54 lines

Re: Alternatives to HASL

[log in to unmask]

Thu, 20 Mar 1997 00:50:26 -0500 (EST)

37 lines

Re: Alternatives to HASL

[log in to unmask]

Thu, 20 Mar 1997 10:10:46 -0500 (EST)

62 lines

New Thread

analysis method for copper in effluent

analysis method for copper in effluent

[log in to unmask]

Sun, 23 Mar 1997 13:06:47 +0500

80 lines

analysis method for copper in effluent

Anthony Balraj <[log in to unmask]>

Wed, 26 Mar 1997 09:44:56 +0500

92 lines

analysis method for copper in effluent

Anthony Balraj <[log in to unmask]>

Wed, 26 Mar 1997 09:45:03 +0500

80 lines

RE: analysis method for copper in effluent

David Creager <[log in to unmask]>

Wed, 26 Mar 1997 16:07:00 -0600

156 lines

Re: analysis method for copper in effluent

Ted Stern <[log in to unmask]>

Thu, 27 Mar 1997 09:42:54 -0800

108 lines

New Thread

Any recommendations for test fixture drilling machine

Any recommendations for test fixture drilling machine

Mike deCesare <[log in to unmask]>

Thu, 27 Mar 1997 09:15:43 PST

38 lines

New Thread

ASM Gilbert Connectors

ASM Gilbert Connectors

George Franck <george@[11.1.1.33]>

Fri, 14 Mar 1997 11:54:59 -0500

59 lines

New Thread

ass- gold/Ni solder skips

ass- gold/Ni solder skips

Maurice Dore <[log in to unmask]>

Thu, 27 Mar 1997 14:52:46 GMT

49 lines

Re: ass- gold/Ni solder skips

ddhillma <[log in to unmask]>

Thu, 27 Mar 97 16:33:54 cst

83 lines

Re: ass- gold/Ni solder skips

Leo P. Lambert <[log in to unmask]>

Thu, 27 Mar 1997 21:44:36 -0500 (EST)

90 lines

Re: ass- gold/Ni solder skips

Leo P. Lambert <[log in to unmask]>

Mon, 31 Mar 1997 21:45:25 -0500 (EST)

102 lines

New Thread

assem

assem

Mient van der Molen <[log in to unmask]>

Thu, 06 Mar 1997 19:29:08 -0800

39 lines

Re: assem

Mike Buetow <[log in to unmask]>

Thu, 6 Mar 1997 12:38:13 -0600 (CST)

88 lines

RE: assem

Maguire, James F <[log in to unmask]>

Thu, 6 Mar 1997 14:53:03 -0800

121 lines

Re: assem

Ron Hollandsworth <[log in to unmask]>

Fri, 07 Mar 97 08:21:47 -0500

61 lines

Re: assem

Ron Hollandsworth <[log in to unmask]>

Fri, 07 Mar 97 08:31:07 -0500

81 lines

ASSEM

Mihai Beffa <[log in to unmask]>

Sat, 29 Mar 1997 09:20:55 -0800

40 lines

New Thread

Assembly

RE:Assembly

Ron Hollandsworth <[log in to unmask]>

Fri, 07 Mar 97 08:37:15 -0500

47 lines

RE:Assembly

Elaine Gamboa <[log in to unmask]>

Fri, 7 Mar 1997 13:09:40 -0600

48 lines

New Thread

Assembly Test Defect Analysis

RE: Assembly Test Defect Analysis

Fairbanks, John <[log in to unmask]>

Tue, 18 Mar 97 11:54:00 PST

43 lines

RE: Assembly Test Defect Analysis

"esvax::mrgate::a1::kenyonwg"@[log in to unmask]

Tue, 18 Mar 97 16:17:25 EST

39 lines

Re: Assembly Test Defect Analysis

[log in to unmask]

Tue, 18 Mar 1997 22:45:28 -0500 (EST)

33 lines

New Thread

Assembly: Solder plating height for TAB bonding

Assembly: Solder plating height for TAB bonding

Donal O'Keeffe <[log in to unmask]>

Wed, 26 Mar 1997 10:11:13 GMT

49 lines

New Thread

Assembly:Looking for optical Comparator

Assembly:Looking for optical Comparator

[log in to unmask]

Thu, 6 Mar 1997 16:24:43 -0800

54 lines

Assembly:Looking for optical Comparator

[log in to unmask]

Fri, 7 Mar 1997 16:58:33 -0600

93 lines

RE: Assembly:Looking for optical Comparator

Chilcote, Jim (AZ75) <[log in to unmask]>

07 Mar 1997 17:16:14 -0600

76 lines

New Thread

ASST: Grainy wave solder joints

ASST: Grainy wave solder joints

Larry Morse <[log in to unmask]>

Tue, 18 Mar 1997 15:17:36 -0800

97 lines

Re: ASST: Grainy wave solder joints

[log in to unmask]

Wed, 19 Mar 97 08:35:44 PST8

97 lines

Re: ASST: Grainy wave solder joints

"esvax::mrgate::a1::kenyonwg"@[log in to unmask]

Wed, 19 Mar 97 10:35:47 EST

54 lines

New Thread

ASSY

ASSY

Bob Mykich (PO1) <[log in to unmask]>

Wed, 19 Mar 1997 14:51:00 -0500

45 lines

New Thread

ASSY wirebonding

RE: ASSY wirebonding

Rolf Beuttenmuller <[log in to unmask]>

Fri, 14 Mar 1997 08:15:24 -0500

50 lines

New Thread

ASSY- Bake for component re

ASSY- Bake for component re

Charles Elliott <[log in to unmask]>

10 Mar 1997 09:36:59 -0500

56 lines

New Thread

ASSY/TEST: Electrical Test; Solder contact problem

ASSY/TEST: Electrical Test; Solder contact problem

Mohd Misri-RSB019 <[log in to unmask]>

Thu, 6 Mar 1997 11:31:00 +0800

60 lines

New Thread

ASSY: Au-plated Kovar

ASSY: Au-plated Kovar

Sheila Smith <[log in to unmask]>

Wed, 19 Mar 1997 14:07:59 -0500 (EST)

47 lines

New Thread

Assy: BGA query

Assy: BGA query

Poh Kong Hui <[log in to unmask]>

Wed, 5 Mar 1997 23:21:19 +0800 (SST)

46 lines

New Thread

Assy: Blowhole

Assy: Blowhole

Poh Kong Hui <[log in to unmask]>

Wed, 5 Mar 1997 19:31:13 +0800 (SST)

54 lines

Re: Assy: Blowhole

[log in to unmask]

Wed, 5 Mar 1997 08:55:57 -0500 (EST)

42 lines

Re: Assy: Blowhole

Johannes Sivula <[log in to unmask]>

Wed, 5 Mar 1997 16:25:56 +0300

71 lines

Re: Assy: Blowhole

Ted Stern <[log in to unmask]>

Wed, 05 Mar 1997 09:16:20 -0800

104 lines

Re: Assy: Blowhole

[log in to unmask]

Wed, 05 Mar 97 10:17:41 PST

75 lines

Re: Assy: Blowhole

[log in to unmask]

Wed, 05 Mar 97 10:17:46 CST

72 lines

Re: Assy: Blowhole

Jack Crawford <[log in to unmask]>

Wed, 5 Mar 1997 11:38:11 -0500

103 lines

New Thread

Assy: Blowhole -- > Thanks

Re: Assy: Blowhole -- > Thanks

Poh Kong Hui <[log in to unmask]>

Wed, 12 Mar 1997 22:44:05 +0800 (SST)

40 lines

New Thread

Assy: Blowhole(reply)

Re: Assy: Blowhole(reply)

LANmark Circuits,Inc. <[log in to unmask]>

Wed, 5 Mar 1997 06:21:32 -0800

80 lines

New Thread

ASSY: brainstorm ways to acheive better wetting to Pd-Ag terminations?

ASSY: brainstorm ways to acheive better wetting to Pd-Ag terminations?

starr devere <[log in to unmask]>

Mon, 17 Mar 1997 08:42:55 MST

59 lines

Re: ASSY: brainstorm ways to acheive better wetting to Pd-Ag terminations?

[log in to unmask]

Wed, 19 Mar 1997 09:05:54 -0500 (EST)

44 lines

New Thread

Assy: Component in tape counters.

Assy: Component in tape counters.

[log in to unmask]

Fri, 7 Mar 1997 14:03:34 -0600

58 lines

New Thread

ASSY: CONFORMAL COATING ADHESION

ASSY: CONFORMAL COATING ADHESION

Blanchet,Richard <[log in to unmask]>

Tue, 18 Mar 1997 10:55:00 -0500 (EST)

55 lines

Re: ASSY: CONFORMAL COATING ADHESION

[log in to unmask]

Tue, 18 Mar 1997 23:59:44 -0500 (EST)

67 lines

Re: ASSY: CONFORMAL COATING ADHESION

Art Perez <[log in to unmask]>

Wed, 19 Mar 1997 07:22:00 -0600

117 lines

Re: ASSY: CONFORMAL COATING ADHESION

[log in to unmask]

Thu, 20 Mar 1997 20:51:20 -0500 (EST)

39 lines

Re: ASSY: CONFORMAL COATING ADHESION

[log in to unmask]

Thu, 20 Mar 1997 20:54:13 -0500 (EST)

34 lines

New Thread

ASSY: CONFORMAL COATING ADHESION -Reply

ASSY: CONFORMAL COATING ADHESION -Reply

Bob Metcalf <[log in to unmask]>

Tue, 18 Mar 1997 14:56:56 -0800

92 lines

Re: ASSY: CONFORMAL COATING ADHESION -Reply

[log in to unmask]

Thu, 20 Mar 1997 20:48:33 -0500 (EST)

39 lines

New Thread

ASSY: Double sided soldering

ASSY: Double sided soldering

DEAN MAY <[log in to unmask]>

Wed, 19 Mar 1997 09:51:25 -0500

58 lines

ASSY: Double sided soldering

[log in to unmask]

Wed, 19 Mar 97 12:13:05 MST

68 lines

New Thread

ASSY: Fractured Solder Joints

ASSY: Fractured Solder Joints

[log in to unmask]

Thu, 27 Mar 1997 15:00:27 -0600

86 lines

Re: ASSY: Fractured Solder Joints

[log in to unmask]

Fri, 28 Mar 1997 10:14:15 -0500 (EST)

46 lines

New Thread

ASSY: Gold in the solder connection #2

ASSY: Gold in the solder connection #2

SVEBA <[log in to unmask]>

Tue, 18 Mar 1997 14:07:31 +0100

69 lines

Re: ASSY: Gold in the solder connection #2

[log in to unmask]

Wed, 19 Mar 1997 09:04:41 -0500 (EST)

53 lines

Re: ASSY: Gold in the solder connection #2

Jim Herard <[log in to unmask]>

Thu, 20 Mar 1997 11:38:17 -0500

91 lines

New Thread

ASSY: Gold in the solder connection.

ASSY: Gold in the solder connection.

SVEBA <[log in to unmask]>

Tue, 18 Mar 1997 12:39:32 +0100

67 lines

Re: ASSY: Gold in the solder connection.

Pratap Singh <[log in to unmask]>

Tue, 18 Mar 1997 09:00:14 -0800

78 lines

New Thread

Assy: green stuff

Assy: green stuff

Blanchet,Richard <[log in to unmask]>

Tue, 25 Mar 1997 17:46:00 -0500 (EST)

45 lines

Re: Assy: green stuff

[log in to unmask]

Tue, 25 Mar 1997 18:01:12 -0600

88 lines

New Thread

ASSY: HASL height for fine pitch bonding

ASSY: HASL height for fine pitch bonding

Donal O'Keeffe <[log in to unmask]>

Fri, 28 Mar 1997 09:12:03 GMT

45 lines

New Thread

Assy: Lifted lead (QFP)

Assy: Lifted lead (QFP)

Poh Kong Hui <[log in to unmask]>

Tue, 25 Mar 1997 07:16:29 +0800 (SST)

50 lines

Re: Assy: Lifted lead (QFP)

Poh Kong Hui <[log in to unmask]>

Tue, 25 Mar 1997 20:05:47 +0800 (SST)

65 lines

Re: Assy: Lifted lead (QFP)

Ron Hollandsworth <[log in to unmask]>

Tue, 25 Mar 97 07:45:07 -0500

76 lines

Re: Assy: Lifted lead (QFP)

Jerry Cupples <[log in to unmask]>

Tue, 25 Mar 1997 09:28:06 -0600

77 lines

Re[2]: Assy: Lifted lead (QFP)

Allen Hertz <[log in to unmask]>

Tue, 25 Mar 1997 13:37:20 -0500 (EST)

104 lines

New Thread

ASSY: LOOKING FOR COMPONENT SERVICE SUPPLIER

ASSY: LOOKING FOR COMPONENT SERVICE SUPPLIER

starr devere <[log in to unmask]>

Wed, 19 Mar 1997 08:25:10 MST

46 lines

Re: ASSY: LOOKING FOR COMPONENT SERVICE SUPPLIER

[log in to unmask]

Wed, 19 Mar 1997 12:35:20 -0600

77 lines

New Thread

ASSY: Magnetic pick-up tools

ASSY: Magnetic pick-up tools

D. Terstegge <[log in to unmask]>

Sat, 08 Mar 1997 10:32:19 +0100

42 lines

New Thread

ASSY: manufacturers

ASSY: manufacturers

Blanchet,Richard <[log in to unmask]>

Tue, 18 Mar 1997 16:52:00 -0500 (EST)

57 lines

New Thread

Assy: Pad lifting

Assy: Pad lifting

Marcy, Jenni A <[log in to unmask]>

Wed, 19 Mar 1997 10:51:05 -0700

47 lines

Re: Assy: Pad lifting

Eduardo E Wong <[log in to unmask]>

Sun, 23 Mar 1997 23:20:22 EST

88 lines

New Thread

ASSY: Pin Fracture

ASSY: Pin Fracture

[log in to unmask]

Tue, 25 Mar 97 14:28:45 PST

49 lines

New Thread

Assy: QFP Reflow

Assy: QFP Reflow

Ron Hollandsworth <[log in to unmask]>

Thu, 20 Mar 97 08:24:54 -0500

60 lines

Re: Assy: QFP Reflow

Steve Quinn <[log in to unmask]>

Thu, 20 Mar 1997 09:39:11 -0600 (CST)

84 lines

Re: Assy: QFP Reflow

Thad McMillan <[log in to unmask]>

20 Mar 97 10:21 CST

91 lines

RE: Assy: QFP Reflow

John Guy <[log in to unmask]>

Thu, 20 Mar 1997 12:08:09 -0500

115 lines

Re: Assy: QFP Reflow

Steve Quinn <[log in to unmask]>

Thu, 20 Mar 1997 12:12:09 -0600 (CST)

84 lines

Re: Assy: QFP Reflow

Poh Kong Hui <[log in to unmask]>

Fri, 21 Mar 1997 21:50:55 +0800 (SST)

95 lines

New Thread

Assy: resistor networks

Assy: resistor networks

[log in to unmask]

Thu, 20 Mar 97 11:10:49 PST

50 lines

Re: Assy: resistor networks

[log in to unmask]

Thu, 20 Mar 1997 18:36:32 -0500 (EST)

53 lines

New Thread

ASSY: Saponification shorts

ASSY: Saponification shorts

Don Browne <[log in to unmask]>

12 Mar 1997 14:13:43 -0500

82 lines

New Thread

Assy: Small PC Card

Re: Assy: Small PC Card

MR JIM R ZANOLLI <[log in to unmask]>

Sat, 15 Mar 1997 07:04:57, -0500

36 lines

New Thread

Assy: Small PC-Card

Assy: Small PC-Card

Yuen, Mike <[log in to unmask]>

Tue, 11 Mar 97 16:25:00 CST

60 lines

Re: Assy: Small PC-Card

[log in to unmask]

Fri, 14 Mar 1997 09:38:21 -0600

48 lines

Re[3]: Assy: Small PC-Card

[log in to unmask]

Fri, 14 Mar 1997 10:45:06 -0600

84 lines

New Thread

Assy: Vapor Phase Reflow Oven

Assy: Vapor Phase Reflow Oven

Poh Kong Hui <[log in to unmask]>

Thu, 27 Mar 1997 21:47:22 +0800 (SST)

49 lines

Re: Assy: Vapor Phase Reflow Oven

Leo P. Lambert <[log in to unmask]>

Thu, 27 Mar 1997 21:36:29 -0500 (EST)

76 lines

Re: Assy: Vapor Phase Reflow Oven

Leo P. Lambert <[log in to unmask]>

Thu, 27 Mar 1997 21:45:19 -0500 (EST)

76 lines

Re: Assy: Vapor Phase Reflow Oven

Edward J. Valentine <[log in to unmask]>

Fri, 28 Mar 1997 10:45:46 -0800

66 lines

Re: Assy: Vapor Phase Reflow Oven

Leo P. Lambert <[log in to unmask]>

Mon, 31 Mar 1997 21:44:48 -0500 (EST)

76 lines

Re: Assy: Vapor Phase Reflow Oven

Leo P. Lambert <[log in to unmask]>

Mon, 31 Mar 1997 21:46:02 -0500 (EST)

76 lines

New Thread

ASSY:ALTERNATIVES TO HASL

ASSY:ALTERNATIVES TO HASL

[log in to unmask]

Thu, 27 Mar 1997 13:47:39 -0500

39 lines

Re: ASSY:ALTERNATIVES TO HASL

ddhillma <[log in to unmask]>

Thu, 27 Mar 97 16:13:18 cst

67 lines

Re: ASSY:ALTERNATIVES TO HASL

Allen Hertz <[log in to unmask]>

Fri, 28 Mar 1997 08:56:55 -0500 (EST)

128 lines

New Thread

ASSY:baking of PBGAs

Re:ASSY:baking of PBGAs

DAVY.J.G- <[log in to unmask]>

Tue, 4 Mar 1997 12:53:07 -0500

66 lines

ASSY:baking of PBGAs

Gary Peterson <[log in to unmask]>

Tue, 4 Mar 1997 14:48:52 -0700

73 lines

Re: ASSY:baking of PBGAs

Mike Buetow <[log in to unmask]>

Wed, 5 Mar 1997 09:40:54 -0600 (CST)

83 lines

New Thread

Assy:Dwell time

Assy:Dwell time

Johannes Sivula <[log in to unmask]>

Wed, 26 Mar 1997 17:13:43 +0300

45 lines

New Thread

ASSY:Grainy wave solder joints

ASSY:Grainy wave solder joints

BROMLEY, Bill <[log in to unmask]>

Tue, 18 Mar 97 16:05 EST

53 lines

Re: ASSY:Grainy wave solder joints

Poh Kong Hui <[log in to unmask]>

Wed, 19 Mar 1997 23:54:53 +0800 (SST)

87 lines

Re: ASSY:Grainy wave solder joints

ddhillma <[log in to unmask]>

Wed, 19 Mar 97 18:38:18 cst

107 lines

New Thread

ASSY:search for conformal coat mat'l

ASSY:search for conformal coat mat'l

Jeffery L. Hempton <[log in to unmask]>

Wed, 26 Mar 1997 08:53:42 -0500

57 lines

New Thread

Attaching methods for thermocouples

Attaching methods for thermocouples

Dave Crowhurst <[log in to unmask]>

Fri, 7 Mar 1997 16:43:55 -0700

84 lines

Re: Attaching methods for thermocouples

[log in to unmask]

Sat, 8 Mar 1997 09:33:01 -0500 (EST)

49 lines

Re: Attaching methods for thermocouples

Fritz Byle <[log in to unmask]>

Sun, 9 Mar 1997 18:12:09 -0600 (CST)

107 lines

RE: Attaching methods for thermocouples

Jim Marsico 516-595-5879 <[log in to unmask]>

Mon, 10 Mar 1997 08:39:00 -0500 (EST)

59 lines

Re: Attaching methods for thermocouples

[log in to unmask]

Mon, 10 Mar 1997 10:12:47 -0600

92 lines

New Thread

Automatic Packaging needed

Automatic Packaging needed

Sid tryzbiak <[log in to unmask]>

Sun, 2 Mar 1997 12:34:04 -0500

56 lines

New Thread

backplane bending

backplane bending

James R Harbaugh <[log in to unmask]>

Tue, 11 Mar 97 14:05:06 -30000

39 lines

backplane bending

Jim Herard <[log in to unmask]>

Tue, 11 Mar 1997 17:40:55 -0500

93 lines

New Thread

BACKSIDE WAVE SOLDER OF IC'S

BACKSIDE WAVE SOLDER OF IC'S

Kirk Olund - DMD QACE <[log in to unmask]>

Mon, 31 Mar 1997 16:21:25 -0500

49 lines

New Thread

BAKING & STORAGE CONDITION OF PBGA

BAKING & STORAGE CONDITION OF PBGA

[log in to unmask]

5 Mar 97 19:40 GMT+0500

51 lines

New Thread

Balls after reflow

Balls after reflow

Antoni Cherta <[log in to unmask]>

Tue, 18 Mar 1997 17:47:34 +0100

59 lines

New Thread

Bare Board electrical test equipment

Bare Board electrical test equipment

Ed Cosper <[log in to unmask]>

Tue, 4 Mar 1997 17:04:17 -0600

42 lines

New Thread

Bare PWB for Pc computers

Bare PWB for Pc computers

Pond Barretto <[log in to unmask]>

Fri, 14 Mar 1997 07:05:48 -0800

45 lines

Re: Bare PWB for Pc computers

Anil K. Singh <[log in to unmask]>

Fri, 14 Mar 1997 18:46:57 +0000 (GMT)

61 lines

Re: Bare PWB for Pc computers

Anil K. Singh <[log in to unmask]>

Fri, 14 Mar 1997 18:39:55 +0000 (GMT)

67 lines

Re: Bare PWB for Pc computers

Anil K. Singh <[log in to unmask]>

Fri, 14 Mar 1997 19:02:23 +0000 (GMT)

65 lines

New Thread

Black-oxide layer turned red after pressing

Black-oxide layer turned red after pressing

Darik Leung <[log in to unmask]>

Sat, 08 Mar 1997 21:55:07 -0800

53 lines

Re: Black-oxide layer turned red after pressing

[log in to unmask]

Sat, 08 Mar 97 17:21:55 EST

69 lines

RE: Black-oxide layer turned red after pressing

Ed Cosper <[log in to unmask]>

Mon, 10 Mar 1997 10:06:48 -0600

121 lines

RE: Black-oxide layer turned red after pressing

Ed Cosper <[log in to unmask]>

Thu, 13 Mar 1997 09:19:30 -0600

82 lines

Re[2]: Black-oxide layer turned red after pressing

[log in to unmask]

Thu, 13 Mar 97 22:03:21 EST

89 lines

Re: Black-oxide layer turned red after pressing

[log in to unmask]

Fri, 14 Mar 1997 11:23:19 -0500 (EST)

45 lines

Re[2]: Black-oxide layer turned red after pressing

joef <[log in to unmask]>

Thu, 20 Mar 97 13:28:57 EST

99 lines

New Thread

BOARD WARPAGE

BOARD WARPAGE

MIKE J. LOPEZ <[log in to unmask]>

Tue, 04 Mar 1997 10:55:06 -0500

35 lines

RE: BOARD WARPAGE

Ed Cosper <[log in to unmask]>

Tue, 4 Mar 1997 11:05:53 -0600

89 lines

New Thread

Brass inserts

Brass inserts

[log in to unmask]

Mon, 10 Mar 1997 12:38:29 -0700

48 lines

New Thread

BUM Technology

BUM Technology

ALFACHIMICI S.r.l. <[log in to unmask]>

Tue, 18 Mar 97 14:15:19 +0100

42 lines

Re: BUM Technology

[log in to unmask]

Fri, 21 Mar 1997 12:39:07 -0500 (EST)

43 lines

Re: BUM Technology

[log in to unmask]

Fri, 21 Mar 1997 14:03:42 -0500 (EST)

34 lines

New Thread

Cartoon Box

Cartoon Box

Fanny TANG (ESD) <[log in to unmask]>

Wed, 26 Mar 1997 09:22:37 +0800

42 lines

New Thread

cc:Mail UUCPLINK 2.0 Undeliverable Message

cc:Mail UUCPLINK 2.0 Undeliverable Message

[log in to unmask]

Mon, 10 Mar 97 07:22:34

88 lines

New Thread

Ceramic panels that darken with electric current.

Ceramic panels that darken with electric current.

[log in to unmask]

Thu, 27 Mar 1997 11:22:22 -0500 (EST)

41 lines

New Thread

Change to J-STD-001

Change to J-STD-001

[log in to unmask]

Fri, 7 Mar 1997 16:00:29 +0000

55 lines

New Thread

Cleaning of BGA

Re: Cleaning of BGA

Guenter Grossmann <[log in to unmask]>

Fri, 7 Mar 1997 14:12:32 +0100

52 lines

Re: Cleaning of BGA

Karl Sauter <[log in to unmask]>

Fri, 7 Mar 1997 07:58:21 -0800

76 lines

RE: Cleaning of BGA

Maguire, James F <[log in to unmask]>

Fri, 7 Mar 1997 10:22:54 -0800

90 lines

Re: Cleaning of BGA

[log in to unmask]

Fri, 7 Mar 1997 13:58:31 -0500 (EST)

44 lines

Re[2]: Cleaning of BGA

Allen Hertz <[log in to unmask]>

Fri, 07 Mar 1997 14:50:52 -0500 (EST)

114 lines

Re: Cleaning of BGA

[log in to unmask]

Mon, 10 Mar 1997 13:50:49 -0500 (EST)

37 lines

New Thread

Commercial components in Military apps.

Commercial components in Military apps.

Greg Byram <[log in to unmask]>

Wed, 12 Mar 1997 09:41:57 -0500

41 lines

Re: Commercial components in Military apps.

[log in to unmask]

Thu, 13 Mar 97 10:48:34 PST

65 lines

RE: Commercial components in Military apps.

Max Bernhardt <[log in to unmask]>

Fri, 14 Mar 1997 07:48:00 -0600

106 lines

RE: Commercial components in Military apps.

Urry, John @ SLG <[log in to unmask]>

Fri, 14 Mar 97 12:02:00 mst

66 lines

Re[2]: Commercial components in Military apps.

[log in to unmask]

Fri, 14 Mar 97 15:08:48 EST

124 lines

New Thread

Commercial Workmanship Standards

Commercial Workmanship Standards

Bill Marsh <[log in to unmask]>

Tue, 25 Mar 1997 12:48:05 -0800 (PST)

48 lines

Re: Commercial Workmanship Standards

Warren Szkolnicki <[log in to unmask]>

Tue, 25 Mar 1997 16:52:47 -0800

87 lines

Re: Commercial Workmanship Standards

Carty Lawson <[log in to unmask]>

Tue, 25 Mar 1997 18:26:58 -0400

104 lines

Re: Commercial Workmanship Standards

[log in to unmask]

Thu, 27 Mar 1997 21:43:56 -0500 (EST)

44 lines

New Thread

conductive carbon ink

conductive carbon ink

[log in to unmask]

Wed, 26 Mar 1997 18:07:25 -0800

43 lines

New Thread

Conformal coating of printed circuit boards

Conformal coating of printed circuit boards

George Zenke <[log in to unmask]>

Sat, 29 Mar 97 01:51:25 UT

40 lines

New Thread

Contracts for Turnkey Manufacturing

Contracts for Turnkey Manufacturing

David Driscoll <[log in to unmask]>

Sun, 02 Mar 1997 10:42:47 +0000

58 lines

New Thread

Copper Peel Strength on microvia - dielectrics

Copper Peel Strength on microvia - dielectrics

Steve <[log in to unmask]>

Mon, 24 Mar 1997 20:01:47 -0500

46 lines

New Thread

copper plating

copper plating

Suixin Zhang <[log in to unmask]>

Tue, 25 Mar 1997 16:29:57 +0100

50 lines

Re: copper plating

dhoppe <[log in to unmask]>

Tue, 25 Mar 97 10:38:17 PST

71 lines

New Thread

Copper Plating to Fe/Ni Alloys

Copper Plating to Fe/Ni Alloys

Tony Johnson <[log in to unmask]>

Wed, 19 Mar 1997 08:23:26 -0800

53 lines

Re: Copper Plating to Fe/Ni Alloys

Thomas E. Waznis <[log in to unmask]>

19 Mar 97 20:48:55 -0800

69 lines

New Thread

Crescent 30 Photoplotter Problems...

Crescent 30 Photoplotter Problems...

Nelson Calimquim <[log in to unmask]>

Sat, 22 Mar 1997 09:30:40 -0800

53 lines

RE: Crescent 30 Photoplotter Problems...

Murray, George @ GSC <[log in to unmask]>

Thu, 27 Mar 97 13:49:00 PST

71 lines

New Thread

Crystal Insulator Pads

Crystal Insulator Pads

IAN MULCAHY <[log in to unmask]>

Thu, 6 Mar 1997 05:52:15 -0500

49 lines

New Thread

Crystal Insulator Pads -Reply

Crystal Insulator Pads -Reply

ELLSWORTH BERKOWITZ <[log in to unmask]>

Mon, 10 Mar 1997 17:19:28 -0500

82 lines

New Thread

Crystal Insulator Pads -Reply -Reply

Re: Crystal Insulator Pads -Reply -Reply

ELLSWORTH BERKOWITZ <[log in to unmask]>

Tue, 11 Mar 1997 14:22:12 -0500

90 lines

New Thread

Current Carring Capacity

Current Carring Capacity

Pat McGuine <[log in to unmask]>

Thu, 27 Mar 1997 07:52:38 -0600

47 lines

Re: Current Carring Capacity

[log in to unmask]

Thu, 27 Mar 97 08:49:32 CST

73 lines

Re: Current Carring Capacity

TOM BRESNAN <[log in to unmask]>

Thu, 27 Mar 97 07:46:35 PST

63 lines

New Thread

D.E.S.E.

D.E.S.E.

Harvey Plott <[log in to unmask]>

Tue, 4 Mar 1997 17:47:17 -0800

43 lines

Re: D.E.S.E.

Bill Marsh <[log in to unmask]>

Wed, 5 Mar 1997 08:01:37 -0800 (PST)

72 lines

Re: D.E.S.E.

Sheila Smith <[log in to unmask]>

Wed, 5 Mar 1997 14:27:50 -0500 (EST)

69 lines

New Thread

Data Protection

Data Protection

Hugh J. Rundle <[log in to unmask]>

Mon, 10 Mar 1997 19:45:49 -0500

45 lines

New Thread

DES

DES

Nasser Y. El-Awar <[log in to unmask]>

Mon, 24 Mar 1997 15:18:03 -0500

66 lines

DES

Mihai Beffa <[log in to unmask]>

Sat, 29 Mar 1997 09:20:46 -0800

40 lines

New Thread

DES FAB

DES FAB

S_R_OVERBERG <[log in to unmask]>

Thu, 06 Mar 97 10:24:03 EST

49 lines

New Thread

DES/ASSY: Placement files

Re: DES/ASSY: Placement files

Jeff Seeger <[log in to unmask]>

Tue, 11 Mar 1997 18:02:22 -0500

91 lines

New Thread

DES/FAB Moisture and Fungus Testing

Re: DES/FAB Moisture and Fungus Testing

[log in to unmask]

Sun, 2 Mar 1997 21:41:46 -0500 (EST)

41 lines

New Thread

DES: Breakaway hole design

DES: Breakaway hole design

[log in to unmask]

Wed, 26 Mar 1997 17:03:14 +0100

88 lines

New Thread

DES: Cu fills on circuit layers

Re: DES: Cu fills on circuit layers

chuan <[log in to unmask]>

Sat, 15 Mar 1997 18:42:05 +0800

95 lines

Re: DES: Cu fills on circuit layers

Scott B. Westheimer <[log in to unmask]>

Sun, 16 Mar 1997 07:10:36 +0800

151 lines

New Thread

Des: GigaHertz Loss

Des: GigaHertz Loss

George Franck <george@[11.1.1.33]>

Fri, 28 Mar 1997 09:23:37 -0500

65 lines

New Thread

Des: Impedance Calc - special

Des: Impedance Calc - special

Charles H. Emory <[log in to unmask]>

Thu, 27 Mar 1997 16:28:37 -0500 (EST)

75 lines

New Thread

DES: inexpensive plotter

DES: inexpensive plotter

Jerry Cupples <[log in to unmask]>

Thu, 6 Mar 1997 14:47:24 -0600

77 lines

Re: DES: inexpensive plotter

Cadet automation systems <[log in to unmask]>

Fri, 7 Mar 1997 08:39:24 +0500 (GMT+0500)

117 lines

Re: DES: inexpensive plotter

Jeff Seeger <[log in to unmask]>

Fri, 07 Mar 1997 11:50:30 -0500

76 lines

DES: inexpensive plotter

[log in to unmask]

Mon, 10 Mar 1997 10:16:42 -0600

143 lines

New Thread

DES: Internal Connections On PWBs

DES: Internal Connections On PWBs

Harlan Vince <[log in to unmask]>

Fri, 14 Mar 97 10:11:05 -0500

58 lines

Re: DES: Internal Connections On PWBs

[log in to unmask]

Mon, 17 Mar 97 13:17:26 PST

89 lines

New Thread

Des: IPC-D-356 Netlist From Allegro

Des: IPC-D-356 Netlist From Allegro

Pete Court <[log in to unmask]>

Wed, 05 Mar 1997 14:13:53 +0000

54 lines

New Thread

DES: Viewlogic ISIS software

DES: Viewlogic ISIS software

Gary Peterson <[log in to unmask]>

Tue, 4 Mar 1997 08:10:49 -0700

48 lines

New Thread

Design-IPC-D-356/RS274X format

Design-IPC-D-356/RS274X format

Wilcox Tom <[log in to unmask]>

Thu, 13 Mar 97 10:34:00 MST

40 lines

New Thread

Design-Microstrip

Design-Microstrip

Ron Yanuszewski <[log in to unmask]>

Sat, 29 Mar 1997 12:35:45 -0400

43 lines

Re: Design-Microstrip

Doug McKean <[log in to unmask]>

Sat, 29 Mar 1997 13:48:58 -0500

60 lines

Re: Design-Microstrip

Howard Feldmesser <[log in to unmask]>

Sat, 29 Mar 1997 15:43:02 -0500

61 lines

New Thread

Design: Hybrid Design Training

Design: Hybrid Design Training

Ron Oneal <[log in to unmask]>

Thu, 13 Mar 1997 16:48:11 -0500

43 lines

re: Design: Hybrid Design Training

[log in to unmask]

Thu, 13 Mar 97 15:30:45 PST

41 lines

New Thread

DesignRules Wire and Ribbon Bonding

DesignRules Wire and Ribbon Bonding

[log in to unmask]

Fri, 14 Mar 97 17:57:39 PST

48 lines

New Thread

Desmear follow-up

Desmear follow-up

Eltek Ltd. - Process Engineering <[log in to unmask]>

Thu, 6 Mar 1997 18:17:46 +0200 (IST)

45 lines

DESMEAR FOLLOW-UP

[log in to unmask]

Fri, 07 Mar 1997 07:32:44 EST

59 lines

Re: DESMEAR FOLLOW-UP

ddsulliv <[log in to unmask]>

Fri, 07 Mar 97 07:13:44 cst

136 lines

New Thread

differential impedance testing

differential impedance testing

Steve Sekanina <[log in to unmask]>

Wed, 26 Mar 1997 16:57:56 +0000

42 lines

RE: differential impedance testing

Nelson Calimquim <[log in to unmask]>

Thu, 27 Mar 1997 13:06:38 -0800

71 lines

New Thread

Dimensional stability

Dimensional stability

[log in to unmask]

Mon, 10 Mar 1997 16:09:34 +0000

52 lines

Re: dimensional stability

Sheila Smith <[log in to unmask]>

Mon, 10 Mar 1997 15:39:55 -0500 (EST)

52 lines

Re: dimensional stability

Bill Marsh <[log in to unmask]>

Mon, 10 Mar 1997 14:51:41 -0800 (PST)

70 lines

New Thread

Dk & Df

Dk & Df

[log in to unmask]

Sat, 8 Mar 1997 18:52:52 +0800 (SST)

44 lines

RE: Dk & Df

Terry Zhu <[log in to unmask]>

Sat, 8 Mar 1997 15:32:49 -0800

86 lines

New Thread

DXF to Gerber?.

DXF to Gerber?.

Cadet automation systems <[log in to unmask]>

Wed, 12 Mar 1997 09:01:26 +0500 (GMT+0500)

43 lines

Re: DXF to Gerber?.

[log in to unmask]

Wed, 12 Mar 1997 05:57:27 -0500

69 lines

New Thread

Easter Weekend

Easter Weekend

Ed Cosper <[log in to unmask]>

Fri, 28 Mar 1997 11:05:09 -0600

41 lines

New Thread

EL (Electroluminescent) Flexible strips fabrication

EL (Electroluminescent) Flexible strips fabrication

Rahim Bhutto <[log in to unmask]>

Fri, 7 Mar 1997 17:07:11 +-500

50 lines

New Thread

elctroless nickel gold -an update

elctroless nickel gold -an update

[log in to unmask]

Wed, 12 Mar 1997 10:05:55 +0500

118 lines

New Thread

elctroless nickel gold -and dull Copper pads after stripping of Tin

Re: elctroless nickel gold -and dull Copper pads after stripping of Tin

[log in to unmask]

Wed, 12 Mar 1997 22:19:10 -0500 (EST)

49 lines

New Thread

ELECTROLESS NiAu - BACKGROUND PLATING

ELECTROLESS NiAu - BACKGROUND PLATING

John Grosso <[log in to unmask]>

4 Mar 97 12:30:50

101 lines

New Thread

elimination of etch resists through differential etching (fwd)

elimination of etch resists through differential etching (fwd)

Christopher Rhodes <[log in to unmask]>

Wed, 19 Mar 1997 12:39:58 -0600 (CST)

89 lines

New Thread

EMI/RFI/H-field Data Protection

EMI/RFI/H-field Data Protection

Hugh J. Rundle <[log in to unmask]>

Tue, 11 Mar 1997 13:48:11 -0500

50 lines

Re: EMI/RFI/H-field Data Protection

Doug McKean <[log in to unmask]>

Tue, 11 Mar 1997 16:42:37 -0500

123 lines

New Thread

ESD PROBLEM ON ATI CNC ROUTING MACHINE

ESD PROBLEM ON ATI CNC ROUTING MACHINE

Circo Craft Co inc. <[log in to unmask]>

Tue, 04 Mar 1997 13:31:20 -0800

53 lines

Re: ESD PROBLEM ON ATI CNC ROUTING MACHINE

Doug McKean <[log in to unmask]>

Tue, 04 Mar 1997 14:23:26 -0500

80 lines

Re: ESD PROBLEM ON ATI CNC ROUTING MACHINE

R_R_HOLMES <[log in to unmask]>

Tue, 04 Mar 97 16:08:25 EST

77 lines

RE: ESD PROBLEM ON ATI CNC ROUTING MACHINE

Smith,Robert <[log in to unmask]>

Wed, 5 Mar 1997 07:57:57 -0500

84 lines

New Thread

Etchback vs Smear Removal

Etchback vs Smear Removal

Thomas Kropski <[log in to unmask]>

Wed, 26 Mar 1997 09:45:15 -0800

46 lines

New Thread

etching of microsections

RE: etching of microsections

Paul Terranova, MCG MRO Engineering Lab, 297-3109 <[log in to unmask]>

Tue, 25 Mar 97 09:04:43 EST

84 lines

New Thread

Eutectic Solder Mechanical Properties

Re:Eutectic Solder Mechanical Properties

Guenter Grossmann <[log in to unmask]>

Mon, 24 Mar 1997 13:44:42 +0100

83 lines

New Thread

Excessive caking of debris (DRILL)

Excessive caking of debris (DRILL)

Shredder <[log in to unmask]>

Fri, 21 Mar 1997 17:09:57 -0800

107 lines

EXCESSIVE CAKING OF DEBRIS (DRILL)

[log in to unmask]

Sun, 23 Mar 1997 07:39:09 EST

64 lines

Re: Excessive caking of debris (DRILL)

SCOTT BALLER <[log in to unmask]>

Mon, 24 Mar 97 06:02:02 PST

128 lines

Re: Excessive caking of debris (DRILL)

justin kelly <[log in to unmask]>

Tue, 25 Mar 1997 09:12:26 +0000

71 lines

New Thread

Experience users of Unline 2000 (test fixure drilling system)

Experience users of Unline 2000 (test fixure drilling system)

Mike deCesare <[log in to unmask]>

Wed, 26 Mar 1997 14:57:49 PST

38 lines

New Thread

Expo ATP Meeting - Title, Description (fwd)

Expo ATP Meeting - Title, Description (fwd)

David Bergman <[log in to unmask]>

Fri, 7 Mar 1997 12:12:52 -0600 (CST)

90 lines

New Thread

exposed copper OSP

Re: exposed copper OSP

George Franck <george@[11.1.1.33]>

Tue, 11 Mar 1997 15:31:53 -0500

98 lines

New Thread

fab

fab

peer fisker <[log in to unmask]>

Mon, 03 Mar 1997 15:19:15 +0000

56 lines

FAB

Mihai Beffa <[log in to unmask]>

Sat, 29 Mar 1997 09:20:49 -0800

40 lines

New Thread

fab - cleanning of innerlayers

RE: fab - cleanning of innerlayers

Ed Cosper <[log in to unmask]>

Mon, 3 Mar 1997 09:19:37 -0600

97 lines

New Thread

FAB(Shifting Layers)

FAB(Shifting Layers)

[log in to unmask]

Thu, 20 Mar 97 11:10:45 EST

61 lines

Re: FAB(Shifting Layers)

jbrunett <[log in to unmask]>

Thu, 20 Mar 97 16:06:49 PST

99 lines

Re: FAB(Shifting Layers)

Paul Gould <[log in to unmask]>

Thu, 20 Mar 1997 22:50:22 +0000

73 lines

RE: FAB(Shifting Layers)

Ed Cosper <[log in to unmask]>

Fri, 21 Mar 1997 08:45:26 -0600

117 lines

Re[2]: FAB(Shifting Layers)

TOM BRESNAN <[log in to unmask]>

Fri, 21 Mar 97 07:55:39 PST

93 lines

New Thread

Fab/Assy: Class3, 1/2 tented vias

Re: Fab/Assy: Class3, 1/2 tented vias

[log in to unmask]

Sun, 2 Mar 1997 21:37:22 -0500 (EST)

55 lines

New Thread

FAB: ALTERNATIVE TO HASL

FAB: ALTERNATIVE TO HASL

sam mccorkel <[log in to unmask]>

Tue, 11 Mar 1997 09:08:53 -0500

39 lines

Re: FAB: ALTERNATIVE TO HASL

Tom Cooper <[log in to unmask]>

Tue, 11 Mar 97 10:40:33 EST

56 lines

Re: FAB: ALTERNATIVE TO HASL

[log in to unmask]

Tue, 11 Mar 97 11:08:42 PST

57 lines

New Thread

FAB: BGA and uBGA phototool reqrmnts

FAB: BGA and uBGA phototool reqrmnts

Murray, George @ GSC <[log in to unmask]>

Mon, 17 Mar 97 15:50:00 PST

47 lines

New Thread

Fab: C.B-200 Question

Fab: C.B-200 Question

Nancy Nelson <[log in to unmask]>

25 Mar 97 14:30 CST

51 lines

New Thread

FAB: Conformal coating

FAB: Conformal coating

Sheila Smith <[log in to unmask]>

Fri, 7 Mar 1997 08:16:17 -0500 (EST)

49 lines

Re: FAB: Conformal coating

Pratap Singh <[log in to unmask]>

Fri, 07 Mar 1997 09:05:55 -0800

72 lines

Re: FAB: Conformal coating

Howard Feldmesser <[log in to unmask]>

Fri, 7 Mar 1997 13:13:53 -0500

77 lines

New Thread

Fab: Multilayer Lamination - Image Transfer/Telegraphing

Fab: Multilayer Lamination - Image Transfer/Telegraphing

[log in to unmask]

Mon, 10 Mar 1997 18:58:55 -0500 (EST)

49 lines

New Thread

FAB: Nan Ya

FAB: Nan Ya

Siegfried Quemado <[log in to unmask]>

Mon, 03 Mar 97 16:04:00 PST

39 lines

Re: FAB: Nan Ya

David Bergman <[log in to unmask]>

Mon, 3 Mar 1997 17:05:25 -0600 (CST)

72 lines

New Thread

FAB: Palladium Plating

FAB: Palladium Plating

YAP CHOW LAN <[log in to unmask]>

Fri, 7 Mar 1997 18:00:23 +0800

47 lines

RE: FAB: Palladium Plating

George Carroll (PO3) <[log in to unmask]>

Fri, 7 Mar 1997 09:33:00 -0500

82 lines

Re: FAB: Palladium Plating

Pratap Singh <[log in to unmask]>

Fri, 07 Mar 1997 09:22:13 -0800

72 lines

RE: FAB: Palladium Plating

Darrell Daigle <[log in to unmask]>

Fri, 07 Mar 97 10:32:00 PST

37 lines

RE: FAB: Palladium Plating

Jack Crawford <[log in to unmask]>

Fri, 7 Mar 1997 11:01:57 -0500

110 lines

RE: FAB: Palladium Plating

Steve Masear-RVG230 <[log in to unmask]>

Fri, 7 Mar 1997 11:41:00 -0600

96 lines

New Thread

FAB: Resin Recession

FAB: Resin Recession

Yud <[log in to unmask]>

Tue, 04 Mar 1997 01:21:47 +0200

57 lines

New Thread

FAB: Silver-Fill

FAB: Silver-Fill

Karl Sauter <[log in to unmask]>

Fri, 21 Mar 1997 10:30:40 -0800

47 lines

FAB: Silver-Fill

Jim Herard <[log in to unmask]>

Fri, 21 Mar 1997 16:24:17 -0500

85 lines

New Thread

FAB:Preclean parameters

FAB:Preclean parameters

Robert Peterson <[log in to unmask]>

Mon, 10 Mar 97 19:47:24 UT

47 lines

Re: FAB:Preclean parameters

[log in to unmask]

Sun, 16 Mar 1997 11:44:39 -0500 (EST)

66 lines

New Thread

FAB:Prepreg shelf life - a functional test

Re: FAB:Prepreg shelf life - a functional test

D. Rooke <[log in to unmask]>

Wed, 5 Mar 1997 22:44:19 -0500 (EST)

64 lines

New Thread

FAB:SPC for PWB ET

FAB:SPC for PWB ET

Jeffrey C. Garland <[log in to unmask]>

Tue, 18 Mar 1997 11:13:38 -0800

52 lines

New Thread

FIDUCIALS

FIDUCIALS

Darrell Daigle <[log in to unmask]>

Tue, 11 Mar 97 16:28:00 PST

41 lines

re: FIDUCIALS

Gary S Thomas <[log in to unmask]>

Wed, 12 Mar 97 6:45:13 EST

43 lines

Re: FIDUCIALS

gwilling <[log in to unmask]>

Wed, 12 Mar 97 08:51:35 PST

66 lines

FIDUCIALS

[log in to unmask]

Wed, 12 Mar 1997 21:39:39 EST

36 lines

FIDUCIALS

Darrell Daigle <[log in to unmask]>

Tue, 11 Mar 97 16:28:00 PST

58 lines

Re: FIDUCIALS

Mark W. Spitnale <[log in to unmask]>

Thu, 13 Mar 1997 06:07:15 -0500

97 lines

RE: Fiducials

Neil Maloney <[log in to unmask]>

Thu, 13 Mar 1997 08:55:26 -0600 (CST)

55 lines

New Thread

fine pitch SMT solder mask

fine pitch SMT solder mask

H_B_MICKS <[log in to unmask]>

Thu, 13 Mar 97 10:26:04 EST

78 lines

New Thread

Flex circuit heat sealing equipment

Flex circuit heat sealing equipment

[log in to unmask]

Fri, 14 Mar 1997 06:51:01 -0800

41 lines

Re: Flex circuit heat sealing equipment

[log in to unmask]

Fri, 14 Mar 97 10:57:56 EST

62 lines

New Thread

FR-4

FR-4

Michael Weal - RD <[log in to unmask]>

Mon, 24 Mar 1997 17:29:03 -0800

41 lines

Re: FR-4

Bill Marsh <[log in to unmask]>

Tue, 25 Mar 1997 07:43:35 -0800 (PST)

61 lines

New Thread

FR4 standard sizes

FR4 standard sizes

Mihai Beffa <[log in to unmask]>

Sat, 29 Mar 1997 23:40:18 -0800

47 lines

New Thread

FW: Assy: Lifted lead (QFP)

FW: Assy: Lifted lead (QFP)

Blanchet,Richard <[log in to unmask]>

Tue, 25 Mar 1997 07:45:00 -0500 (EST)

95 lines

New Thread

FW: Conformal coating

FW: Conformal coating

Maguire, James F <[log in to unmask]>

Fri, 7 Mar 1997 10:29:46 -0800

105 lines

New Thread

Fw: Copper Peel Strength on microvia - dielectrics

Fw: Copper Peel Strength on microvia - dielectrics

Steve <[log in to unmask]>

Sat, 29 Mar 1997 12:44:41 -0500

56 lines

New Thread

FW: DesignRules Wire and Ribbon Bonding

FW: DesignRules Wire and Ribbon Bonding

[log in to unmask]

Tue, 18 Mar 97 18:28:23 PST

53 lines

New Thread

FW: elimination of etch resists through differential etching

FW: elimination of etch resists through differential etching

Holly Lynch <[log in to unmask]>

Wed, 19 Mar 1997 15:16:01 -0500

83 lines

Re: FW: elimination of etch resists through differential etching

Joseph Fjelstad <[log in to unmask]>

Tue, 18 Mar 1997 23:15:33 -0800

125 lines

New Thread

FW: Eutectic Solder Mechanical Properties

FW: Eutectic Solder Mechanical Properties

Hans Ohman <[log in to unmask]>

Fri, 21 Mar 97 09:56:00 DST

56 lines

Re: FW: Eutectic Solder Mechanical Properties

[log in to unmask]

Fri, 21 Mar 1997 15:17:22 -0500 (EST)

79 lines

New Thread

FW: FIDUCIALS

FW: FIDUCIALS

Darrell Daigle <[log in to unmask]>

Wed, 12 Mar 97 10:04:00 PST

60 lines

New Thread

FW: Galvanic Corrosion

FW: Galvanic Corrosion

Darrell Daigle <[log in to unmask]>

Wed, 26 Mar 97 10:46:00 PST

49 lines

New Thread

FW: Gold/Tin Lead

FW: Gold/Tin Lead

Darrell Daigle <[log in to unmask]>

Tue, 04 Mar 97 11:18:00 PST

54 lines

New Thread

FW: Interconnection Resistance, Multilayer Printed Wiring.

FW: Interconnection Resistance, Multilayer Printed Wiring.

frp <[log in to unmask]>

Mon, 24 Mar 1997 19:03:28 +0100

53 lines

Re: FW: Interconnection Resistance, Multilayer Printed Wiring.

[log in to unmask]

Mon, 24 Mar 1997 16:29:37 -0500 (EST)

48 lines

Re: FW: Interconnection Resistance, Multilayer Printed Wiring.

Gwen Merchant <[log in to unmask]>

Tue, 25 Mar 1997 11:42:03 +0000

91 lines

New Thread

FW: IPC ARTWORK

FW: IPC ARTWORK

Baker,Kelly <[log in to unmask]>

Thu, 13 Mar 1997 11:18:36 -0500

99 lines

New Thread

FW: IPC-2221 AND IPC-2222 , MIL-PRF-55110F

FW: IPC-2221 AND IPC-2222 , MIL-PRF-55110F

Baker,Kelly <[log in to unmask]>

Mon, 24 Mar 1997 16:25:19 -0500

72 lines

New Thread

FW: Obsolete Transistors

FW: Obsolete Transistors

D'Auteuil, Gerry <[log in to unmask]>

Fri, 21 Mar 97 08:14:00 PST

72 lines

New Thread

FW: OSP pads not fully covered with solder

FW: OSP pads not fully covered with solder

Gagnon, Gerry <[log in to unmask]>

Wed, 12 Mar 1997 09:37:35 -0500

148 lines

New Thread

Fw: Re: Defective PWB at customer's facility

Fw: Re: Defective PWB at customer's facility

Excalibur Ltd. <[log in to unmask]>

Sun, 2 Mar 1997 12:03:21 +0200 (IST)

46 lines

New Thread

FW: The meaning of ISO

FW: The meaning of ISO

[log in to unmask]

Wed, 26 Mar 1997 16:29:40 -0800

116 lines

Re: FW: The meaning of ISO

Mike Masters <[log in to unmask]>

Thu, 27 Mar 1997 07:44:19 -0500

164 lines

Re: FW: The meaning of ISO

James C. Patten <[log in to unmask]>

Thu, 27 Mar 97 09:49:31 PST

44 lines

Re: FW: The meaning of ISO

Jack <[log in to unmask]>

Thu, 27 Mar 1997 19:21:23 -0500

89 lines

New Thread

Fwd: Mechanical Properties: Intermetallic Thickness!

Fwd: Mechanical Properties: Intermetallic Thickness!

Chris Hunt <[log in to unmask]>

Mon, 24 Mar 97 09:32:29 GMT

73 lines

New Thread

fwd: Re: Gold Embrittlement

fwd: Re: Gold Embrittlement

Mike Wolverton <[log in to unmask]>

Fri, 21 Mar 1997 15:42:08 -0800

161 lines

New Thread

FWD>GEN- SPC software desig

FWD>GEN- SPC software desig

Rex Breunsbach <[log in to unmask]>

18 Mar 1997 09:56:09 -0800

88 lines

New Thread

Galvanic Corrosion

Galvanic Corrosion

Darrell Daigle <[log in to unmask]>

Tue, 25 Mar 97 16:04:00 PST

41 lines

Galvanic Corrosion

Darrell Daigle <[log in to unmask]>

Thu, 27 Mar 97 10:18:00 PST

43 lines

Re: Galvanic Corrosion

Ted Stern <[log in to unmask]>

Thu, 27 Mar 1997 10:18:27 -0800

62 lines

Re: Galvanic Corrosion

ddhillma <[log in to unmask]>

Thu, 27 Mar 97 16:25:32 cst

82 lines

Re: Galvanic Corrosion

Leo P. Lambert <[log in to unmask]>

Thu, 27 Mar 1997 22:00:35 -0500 (EST)

78 lines

Re: Galvanic Corrosion

Edward J Popielarski <[log in to unmask]>

Fri, 28 Mar 1997 14:08:21 -0600 (CST)

103 lines

Re: Galvanic Corrosion

Leo P. Lambert <[log in to unmask]>

Mon, 31 Mar 1997 21:44:14 -0500 (EST)

78 lines

New Thread

Gen Arlon contact

RE: Gen Arlon contact

Mike Matson <[log in to unmask]>

Mon, 10 Mar 1997 09:15:00 -0600

47 lines

New Thread

Gen- Cu protective coating

Gen- Cu protective coating

Maurice Dore <[log in to unmask]>

Mon, 10 Mar 1997 13:19:44 GMT

51 lines

New Thread

GEN-Hollis Cleaners

GEN-Hollis Cleaners

Maurice Dore <[log in to unmask]>

Tue, 25 Mar 1997 15:13:07 GMT

50 lines

RE: GEN-Hollis Cleaners

Vertefeuille, Russ (AZ77) <[log in to unmask]>

25 Mar 1997 17:25:53 -0600

96 lines

New Thread

Gen: Arlon contact

Gen: Arlon contact

George Franck <george@[11.1.1.33]>

Mon, 10 Mar 1997 09:24:12 -0500

54 lines

Re: Gen: Arlon contact

ALAN COCHRANE <[log in to unmask]>

Mon, 10 Mar 97 09:31:03 PST

81 lines

New Thread

GEN: Carbamates

GEN: Carbamates

James A Larson <[log in to unmask]>

Fri, 28 Mar 1997 15:56:23 +0000

49 lines

New Thread

GEN: IPC Designers Council Chesapeake Chapter Meeting

GEN: IPC Designers Council Chesapeake Chapter Meeting

[log in to unmask]

Wed, 05 Mar 97 12:08:06 EST

62 lines

GEN: IPC Designers Council Chesapeake Chapter Meeting

[log in to unmask]

Wed, 05 Mar 97 17:29:34 EST

70 lines

GEN: IPC Designers Council Chesapeake Chapter Meeting

[log in to unmask]

Wed, 05 Mar 97 17:29:34 EST

70 lines

New Thread

GEN: IPC Designers Council Chesapeake Chapter Minutes

GEN: IPC Designers Council Chesapeake Chapter Minutes

[log in to unmask]

Wed, 05 Mar 97 17:22:48 EST

60 lines

New Thread

GEN: Scanning Mylar

GEN: Scanning Mylar

Ubl, Scott <[log in to unmask]>

Thu, 06 Mar 97 17:43:00 CST

49 lines

Re: GEN: Scanning Mylar

John Parsons <[log in to unmask]>

Thu, 6 Mar 1997 16:50:00 +0000

73 lines

RE: GEN: Scanning Mylar

Murray, George @ GSC <[log in to unmask]>

Fri, 07 Mar 97 11:37:00 PST

81 lines

Re: GEN: Scanning Mylar

[log in to unmask]

Fri, 7 Mar 1997 14:31:31 -0500 (EST)

41 lines

New Thread

GEN: SPC software designed for PCB production

GEN: SPC software designed for PCB production

Lars Ladefoged Holm <[log in to unmask]>

Tue, 18 Mar 1997 15:02:32 +0000

73 lines

New Thread

Gerber format

Gerber format

Andrew Buonviri <[log in to unmask]>

Tue, 25 Mar 1997 08:11:54 -0400

44 lines

Re: Gerber format

Don Walker <[log in to unmask]>

Tue, 25 Mar 1997 09:16:24 -0600

75 lines

Gerber format

Kevin L Seaman <[log in to unmask]>

Tue, 25 Mar 1997 08:44:29 -0800 (PST)

55 lines

RE: Gerber format

Murray, George @ GSC <[log in to unmask]>

Wed, 26 Mar 97 01:55:00 PST

58 lines

New Thread

GERBER TO DXF??

GERBER TO DXF??

Gary S Thomas <[log in to unmask]>

Tue, 11 Mar 97 8:48:05 EST

41 lines

Re: GERBER TO DXF??

Brock Hunter <[log in to unmask]>

Tue, 11 Mar 1997 10:28:27 -0500 (EST)

63 lines

Re: GERBER TO DXF??

Mike Wilson <[log in to unmask]>

Tue, 11 Mar 1997 10:59:33 -0800

65 lines

Re: GERBER TO DXF??

Doug Jeffery <[log in to unmask]>

Wed, 12 Mar 1997 04:07:47 -0600 (CST)

68 lines

Re: GERBER TO DXF??

Jeff Foster <[log in to unmask]>

Thu, 13 Mar 1997 11:26:16 -0600

59 lines

Re: GERBER TO DXF??

K.Varadaraj@CADET, India <[log in to unmask]>

Fri, 14 Mar 1997 08:39:46 +0500 (GMT+0500)

81 lines

Re: GERBER TO DXF??

Johannes Sivula <[log in to unmask]>

Fri, 14 Mar 1997 09:51:28 +0300

116 lines

RE: GERBER TO DXF??

Nelson Calimquim <[log in to unmask]>

Mon, 17 Mar 1997 09:45:45 -0800

174 lines

New Thread

gerber viewer

gerber viewer

Dan Lorinser <[log in to unmask]>

Wed, 05 Mar 1997 12:52:55 -0600

37 lines

Re: gerber viewer

Cadet automation systems <[log in to unmask]>

Thu, 6 Mar 1997 09:12:56 +0500 (GMT+0500)

72 lines

Re: gerber viewer

Cadet automation systems <[log in to unmask]>

Thu, 6 Mar 1997 13:29:28 +0500 (GMT+0500)

87 lines

New Thread

Glass transition temperature

Glass transition temperature

[log in to unmask]

Thu, 13 Mar 97 11:20:23 PST

41 lines

Re: Glass transition temperature

Sheila Smith <[log in to unmask]>

Thu, 13 Mar 1997 09:04:57 -0500 (EST)

71 lines

New Thread

Gold Embrittlement

Gold Embrittlement

Tom Guerriere <[log in to unmask]>

Wed, 19 Mar 1997 15:19:04 -0500

60 lines

Re: Gold Embrittlement

ddhillma <[log in to unmask]>

Thu, 20 Mar 97 17:50:37 cst

102 lines

New Thread

gold in solder joints

Re:gold in solder joints

[log in to unmask]

Thu, 20 Mar 1997 12:58:53 -0500 (EST)

105 lines

New Thread

Gold Thickness on Pads

Gold Thickness on Pads

Michael Forrester <[log in to unmask]>

Thu, 13 Mar 1997 11:14:42 -0400

53 lines

Gold Thickness on Pads

[log in to unmask]

Thu, 13 Mar 97 13:28:05 EST

45 lines

Gold Thickness on Pads

Michael Forrester <[log in to unmask]>

Thu, 13 Mar 1997 11:14:42 -0400

64 lines

New Thread

Gold/Tin

Gold/Tin

DAVY.J.G- <[log in to unmask]>

Tue, 4 Mar 1997 12:10:15 -0500

58 lines

New Thread

Gold/Tin - How to Remove Sn and Replate Au

Gold/Tin - How to Remove Sn and Replate Au

Lang, Michael <[log in to unmask]>

Tue, 04 Mar 97 15:58:00 E

56 lines

RE: Gold/Tin - How to Remove Sn and Replate Au

Yuen, Mike <[log in to unmask]>

Tue, 04 Mar 97 16:27:00 CST

65 lines

Re: Gold/Tin - How to Remove Sn and Replate Au

[log in to unmask]

Tue, 4 Mar 1997 21:33:22 -0500 (EST)

49 lines

Re: Gold/Tin - How to Remove Sn and Replate Au

[log in to unmask]

Wed, 05 Mar 97 07:42:39 EST

80 lines

New Thread

handling silver halide wastes

RE: handling silver halide wastes

Dick Desrosiers <[log in to unmask]>

Sat, 01 Mar 1997 16:09:16 -0500

119 lines

RE: handling silver halide wastes

[log in to unmask]

Mon, 3 Mar 1997 9:36:50 +0200 (CET)

161 lines

RE: Handling silver halide wastes

[log in to unmask]

Mon, 3 Mar 1997 9:40:51 +0200 (CET)

66 lines

New Thread

HASL

HASL

Darrell Daigle <[log in to unmask]>

Wed, 19 Mar 97 11:06:00 PST

40 lines

New Thread

HASL Replacements

HASL Replacements

Mike Smith <[log in to unmask]>

Tue, 18 Mar 1997 18:04:03 -0500

59 lines

Re: HASL Replacements

[log in to unmask]

Thu, 27 Mar 1997 20:50:23 -0500 (EST)

46 lines

New Thread

help on failure analysis of modules

RE: help on failure analysis of modules

Paul Terranova, MCG MRO Engineering Lab, 297-3109 <[log in to unmask]>

Tue, 18 Mar 97 14:59:35 EST

55 lines

New Thread

Help on PCBA qualify inspection

Help on PCBA qualify inspection

[log in to unmask]

Mon, 24 Mar 97 12:46:31 MDT

48 lines

Re: Help on PCBA qualify inspection

[log in to unmask]

Tue, 25 Mar 1997 14:20:51 -0500 (EST)

50 lines

New Thread

How to obtain IPC spec compliance

How to obtain IPC spec compliance

Sam Patel <[log in to unmask]>

Sun, 16 Mar 1997 13:02:35 -0600

44 lines

New Thread

Immersion gold for keypad contacts

Immersion gold for keypad contacts

[log in to unmask]

Fri, 21 Mar 1997 10:44:22 -0800

51 lines

Re: Immersion gold for keypad contacts

[log in to unmask]

Fri, 21 Mar 1997 14:59:36 -0500 (EST)

45 lines

Re: Immersion gold for keypad contacts

Jim Herard <[log in to unmask]>

Fri, 21 Mar 1997 16:19:16 -0500

96 lines

Re: Immersion gold for keypad contacts

Dwight Mattix <[log in to unmask]>

Fri, 21 Mar 1997 14:08:04 -0800 (PST)

76 lines

New Thread

Immersion gold vs. Hot air solder level from component assembly point of view

Immersion gold vs. Hot air solder level from component assembly point of view

Francis Sun <[log in to unmask]>

Tue, 25 Mar 1997 14:10:42 -0800

45 lines

New Thread

Immersion Tin process

Immersion Tin process

[log in to unmask]

Fri, 28 Mar 1997 11:52:44 -0500 (EST)

36 lines

Re: Immersion Tin process

[log in to unmask]

Fri, 28 Mar 1997 14:22:27 -0500 (EST)

37 lines

Re: Immersion Tin process

Leshman Israel <[log in to unmask]>

Sat, 29 Mar 1997 21:35:40 +0200

53 lines

Re: Immersion Tin process

[log in to unmask]

Sun, 30 Mar 1997 10:24:17 -0500 (EST)

38 lines

Re: Immersion Tin process

[log in to unmask]

Mon, 31 Mar 97 08:22:39 PST

58 lines

New Thread

impedance calculation software

impedance calculation software

[log in to unmask]

Mon, 10 Mar 1997 00:43:35 -0500 (EST)

47 lines

Re: impedance calculation software

Andy Wolf <[log in to unmask]>

Mon, 10 Mar 1997 10:32:05 -0500

53 lines

Re: impedance calculation software

John Parsons <[log in to unmask]>

Mon, 10 Mar 1997 08:11:32 +0000

55 lines

RE: impedance calculation software

Ed Cosper <[log in to unmask]>

Mon, 10 Mar 1997 10:31:30 -0600

79 lines

New Thread

Impedance of parallel Traces

Re: Impedance of parallel Traces

Andy Burkhardt <[log in to unmask]>

Fri, 21 Mar 1997 14:47:54 GMT

99 lines

New Thread

Impedance testing source

Impedance testing source

Ed Cosper <[log in to unmask]>

Fri, 21 Mar 1997 11:32:23 -0600

47 lines

Re: Impedance testing source

Fred Paul <[log in to unmask]>

Fri, 21 Mar 1997 11:52:23 -0800

84 lines

Re: Impedance testing source

Fred Paul <[log in to unmask]>

Fri, 21 Mar 1997 15:02:51 -0800

73 lines

New Thread

Inner layer silver screen material.

Inner layer silver screen material.

Steve Sekanina <[log in to unmask]>

Tue, 25 Mar 1997 10:13:53 +0000

41 lines

Re: Inner layer silver screen material.

[log in to unmask]

Sat, 29 Mar 1997 14:28:32 -0500 (EST)

36 lines

New Thread

Introduction to ISO

Introduction to ISO

Zvi Biran <[log in to unmask]>

Thu, 27 Mar 1997 12:55:47 -0800

44 lines

New Thread

Ionic Contamination on PWA

Ionic Contamination on PWA

Wasan Singhatong <[log in to unmask]>

Wed, 19 Mar 1997 11:38:26 +0700 (GMT+0700)

40 lines

Re: Ionic Contamination on PWA

Mike Buetow <[log in to unmask]>

Wed, 19 Mar 1997 09:00:10 -0600 (CST)

73 lines

RE: Ionic Contamination on PWA

"esvax::mrgate::a1::kenyonwg"@[log in to unmask]

Wed, 19 Mar 97 10:18:55 EST

38 lines

Re: Ionic Contamination on PWA

[log in to unmask]

Wed, 19 Mar 1997 18:10:55 -0500 (EST)

55 lines

Re: Ionic Contamination on PWA

David Bergman <[log in to unmask]>

Thu, 20 Mar 1997 14:12:57 -0600 (CST)

168 lines

New Thread

IPC / Industry MELF Components

RE: IPC / Industry MELF Components

Albert R. Aquino <[log in to unmask]>

Tue, 11 Mar 1997 10:43:39 -0500

45 lines

New Thread

IPC ARTWORK

IPC ARTWORK

Robert Boilard <[log in to unmask]>

Wed, 12 Mar 1997 18:41:28 -0500

49 lines

Re: IPC ARTWORK

Matt Mahlau <[log in to unmask]>

Thu, 13 Mar 1997 08:19:26 -0500

60 lines

IPC ARTWORK

Robert Donovan <[log in to unmask]>

Thu, 13 Mar 1997 08:12:43 -0600

64 lines

Re: IPC ARTWORK

Fritz Byle <[log in to unmask]>

Fri, 14 Mar 1997 06:48:25 -0600 (CST)

59 lines

RE: IPC ARTWORK

Goldman, Patricia J. <[log in to unmask]>

Mon, 17 Mar 97 11:36:00 PST

130 lines

New Thread

IPC Designers Council Chesapeake Chapter

Re: IPC Designers Council Chesapeake Chapter

[log in to unmask]

Wed, 05 Mar 97 17:33:09 EST

72 lines

New Thread

IPC maillist maintainer on vacation :-)

IPC maillist maintainer on vacation :-)

Dmitriy Sklyar <[log in to unmask]>

Mon, 17 Mar 1997 12:48:36 -0600 (CST)

42 lines

New Thread

IPC-2221 AND IPC-2222 ,

Re: IPC-2221 AND IPC-2222 ,

LISA GREENLEAF <[log in to unmask]>

27 Mar 1997 10:15:54 -0400

99 lines

New Thread

IPC-2221 AND IPC-2222 , MIL-PRF-55110F

IPC-2221 AND IPC-2222 , MIL-PRF-55110F

Baker,Kelly <[log in to unmask]>

Mon, 24 Mar 1997 14:23:57 -0500

48 lines

Re: IPC-2221 AND IPC-2222 , MIL-PRF-55110F

Lisa Williams <[log in to unmask]>

Tue, 25 Mar 1997 12:51:02 -0600 (CST)

78 lines

New Thread

IPC-RB-276 is OBSOLETE! -Reply -Reply

Re: IPC-RB-276 is OBSOLETE! -Reply -Reply

[log in to unmask]

Mon, 31 Mar 1997 22:45:10 -0500

106 lines

New Thread

IPCchat session announcement

IPCchat session announcement

[log in to unmask]

Tue, 4 Mar 1997 18:53:01 GMT

64 lines

IPCchat session announcement

[log in to unmask]

Tue, 11 Mar 1997 06:18:04 GMT

67 lines

IPCchat session announcement

[log in to unmask]

Thu, 27 Mar 1997 01:52:18 GMT

61 lines

New Thread

IR Oven Calibration

IR Oven Calibration

[log in to unmask]

Mon, 24 Mar 1997 12:22:05 -0500 (EST)

68 lines

Re: IR Oven Calibration

[log in to unmask]

Mon, 24 Mar 1997 16:05:18 -0500 (EST)

47 lines

Re: IR Oven Calibration

[log in to unmask]

Mon, 24 Mar 1997 17:20:40 -0500 (EST)

52 lines

New Thread

ISO Cleanroom Standard

ISO Cleanroom Standard

[log in to unmask]

Thu, 6 Mar 1997 13:27:07 -0500 (EST)

44 lines

Re: ISO Cleanroom Standard

[log in to unmask]

Thu, 06 Mar 97 16:58:33 PST

105 lines

Re: ISO Cleanroom Standard

[log in to unmask]

Fri, 14 Mar 97 09:46:11 PST

77 lines

New Thread

ITO Coated Film

ITO Coated Film

Freeland, Alan <[log in to unmask]>

Tue, 18 Mar 1997 17:14:33 -0600

61 lines

New Thread

JEDEC Component Trays

JEDEC Component Trays

[log in to unmask]

Fri, 28 Mar 97 16:17:06 EDT

43 lines

New Thread

Lab for Impedance Testing

Lab for Impedance Testing

Paul Terranova, MCG MRO Engineering Lab, 297-3109 <[log in to unmask]>

Fri, 21 Mar 97 16:47:20 EST

59 lines

New Thread

LAMINATION RIVETING

LAMINATION RIVETING

Scott B. Westheimer <[log in to unmask]>

Wed, 26 Mar 1997 05:24:16 +0800

54 lines

Re: LAMINATION RIVETING

[log in to unmask]

Tue, 25 Mar 97 15:42:10 PST

83 lines

RE: LAMINATION RIVETING

Ed Cosper <[log in to unmask]>

Wed, 26 Mar 1997 11:29:05 -0600

113 lines

New Thread

Land Pattern Standard for Xtal Osc?

Land Pattern Standard for Xtal Osc?

Ron Richardson ForeWest NPI PM <[log in to unmask]>

Thu, 27 Mar 1997 08:26:40 -0800

55 lines

Re: Land Pattern Standard for Xtal Osc?

Lisa Williams <[log in to unmask]>

Thu, 27 Mar 1997 13:15:09 -0600 (CST)

96 lines

New Thread

Lead forming of ASICS - (DES???)

Lead forming of ASICS - (DES???)

Cunningham, Dave <[log in to unmask]>

Wed, 26 Mar 1997 09:40:48 -0700

38 lines

New Thread

LOOKING FOR SUPPLIER OF LARGE FORMAT PCB - PTH - UL APPROVED

LOOKING FOR SUPPLIER OF LARGE FORMAT PCB - PTH - UL APPROVED

Roland Jaquet <[log in to unmask]>

Wed, 5 Mar 1997 15:36:46 +0100

62 lines

Re: LOOKING FOR SUPPLIER OF LARGE FORMAT PCB - PTH - UL APPROVED

[log in to unmask] <[log in to unmask]>

Thu, 06 Mar 1997 22:47:44 +0800

75 lines

New Thread

mailstorm

Re: mailstorm

[log in to unmask]

Sun, 2 Mar 1997 10:32:32 -0500 (EST)

54 lines

New Thread

Marine Environment

Marine Environment

William Johnson <[log in to unmask]>

Thu, 27 Mar 97 19:27:18 UT

35 lines

Re: Marine Environment

Mike Buetow <[log in to unmask]>

Thu, 27 Mar 1997 13:58:59 -0600 (CST)

66 lines

Re: Marine Environment

[log in to unmask]

Thu, 27 Mar 97 16:32:24 EST

56 lines

New Thread

marking standards

marking standards

Lynette M Hawkins <[log in to unmask]>

Mon, 24 Mar 1997 14:24:29 -0800

48 lines

Re: marking standards

[log in to unmask]

Tue, 25 Mar 1997 09:38:09 -0500 (EST)

43 lines

marking standards

Lynette M Hawkins <[log in to unmask]>

Tue, 25 Mar 1997 08:30:09 -0800

44 lines

Re: marking standards

Jack Crawford <[log in to unmask]>

Tue, 25 Mar 1997 12:01:04 -0500

62 lines

RE: marking standards

John Guy <[log in to unmask]>

Tue, 25 Mar 1997 15:48:11 -0500

78 lines

Re: marking standards

[log in to unmask]

Tue, 25 Mar 1997 17:21:09 -0600

91 lines

New Thread

maximum weight for DSR

maximum weight for DSR

Tamir Ben-Shoshan <[log in to unmask]>

Sun, 30 Mar 97 08:44:27 EST

38 lines

New Thread

Meaning of "ISO"

Meaning of "ISO"

Dave Willhard <[log in to unmask]>

Thu, 27 Mar 1997 07:46:11 PST

50 lines

New Thread

Mechanical Properties: Intermetallic Thickness!

Mechanical Properties: Intermetallic Thickness!

Yuen, Mike <[log in to unmask]>

Fri, 21 Mar 97 11:31:00 CST

44 lines

Re: Mechanical Properties: Intermetallic Thickness!

[log in to unmask]

Fri, 21 Mar 1997 13:41:46 -0500 (EST)

38 lines

Re: Mechanical Properties: Intermetallic Thickness!

nbiunno <[log in to unmask]>

Fri, 21 Mar 97 10:43:37 PST

66 lines

Re: Mechanical Properties: Intermetallic Thickness!

[log in to unmask]

Fri, 21 Mar 1997 15:28:44 -0500 (EST)

53 lines

Re: Mechanical Properties: Intermetallic Thickness!

ddhillma <[log in to unmask]>

Fri, 21 Mar 97 17:40:04 cst

74 lines

New Thread

microphone

microphone

[log in to unmask]

Fri, 07 Mar 1997 18:48:39 -0800

40 lines

New Thread

Microsection Etchants

Microsection Etchants

Reed, Randy <[log in to unmask]>

Mon, 31 Mar 1997 10:33 -0800

78 lines

New Thread

Microsectioning

Microsectioning

Timothy Gaylor <[log in to unmask]>

Mon, 24 Mar 1997 19:40:23 -0500

48 lines

Re: Microsectioning

[log in to unmask]

Tue, 25 Mar 1997 07:58:49 -0500 (EST)

48 lines

Re: Microsectioning

George Franck <george@[11.1.1.33]>

Tue, 25 Mar 1997 08:56:15 -0500

54 lines

Re: Microsectioning

[log in to unmask]

Thu, 27 Mar 97 14:50:05 PST

77 lines

Re[2]: Microsectioning

[log in to unmask]

Thu, 27 Mar 97 09:49:09 EST

68 lines

Re: Microsectioning

[log in to unmask]

Thu, 27 Mar 1997 15:46:06 -0500 (EST)

51 lines

Re: Microsectioning

George Franck <george@[11.1.1.33]>

Fri, 28 Mar 1997 08:12:23 -0500

107 lines

New Thread

Microvia technology

Microvia technology

David Driscoll <[log in to unmask]>

Wed, 05 Mar 1997 16:43:51 -0800

44 lines

New Thread

MIL-I-45208A

MIL-I-45208A

Excalibur Ltd. <[log in to unmask]>

Sun, 2 Mar 1997 11:58:04 +0200 (IST)

45 lines

New Thread

Multilayer PCB

Multilayer PCB

[log in to unmask]

17 Mar 97 16:33:47

51 lines

New Thread

Mylar removal on inners.

Mylar removal on inners.

[log in to unmask]

Thu, 06 Mar 1997 09:06:49 EST

61 lines

Re: Mylar removal on inners.

[log in to unmask]

Fri, 7 Mar 1997 23:10:48 -0500 (EST)

43 lines

New Thread

NEED Gerber viewer with

Re: NEED Gerber viewer with

Rex Breunsbach <[log in to unmask]>

3 Mar 1997 12:18:18 -0800

93 lines

New Thread

NEED Gerber viewer with highlight capability

Re: NEED Gerber viewer with highlight capability

Poh Kong Hui <[log in to unmask]>

Sat, 1 Mar 1997 23:08:10 +0800 (SST)

73 lines

Re: NEED Gerber viewer with highlight capability

[log in to unmask]

Mon, 3 Mar 1997 08:22:56 -0600

53 lines

Re: NEED Gerber viewer with highlight capability

[log in to unmask]

Mon, 3 Mar 1997 08:54:28 -0600

53 lines

Re[2]: NEED Gerber viewer with highlight capability

[log in to unmask]

Mon, 3 Mar 1997 11:06:20 -0600

111 lines

New Thread

need info on SSD process of PCMCIA

need info on SSD process of PCMCIA

Neil Maloney <[log in to unmask]>

Tue, 11 Mar 1997 08:04:06 -0600 (CST)

61 lines

need info on SSD process of PCMCIA

Gary Peterson <[log in to unmask]>

Tue, 11 Mar 1997 08:56:43 -0700

70 lines

Re: need info on SSD process of PCMCIA

[log in to unmask]

Wed, 12 Mar 1997 12:50:40 -0500 (EST)

34 lines

Re: need info on SSD process of PCMCIA

Poh Kong Hui <[log in to unmask]>

Mon, 17 Mar 1997 21:23:17 +0800 (SST)

94 lines

Re: need info on SSD process of PCMCIA

"esvax::mrgate::a1::kenyonwg"@[log in to unmask]

Mon, 17 Mar 97 13:38:22 EST

57 lines

New Thread

Ni-Au Electroless

Ni-Au Electroless

Eltek Ltd. - Process Engineering <[log in to unmask]>

Wed, 12 Mar 1997 08:44:18 +0200 (IST)

52 lines

Re: Ni-Au Electroless

[log in to unmask]

Wed, 12 Mar 1997 22:16:14 -0500 (EST)

55 lines

New Thread

Ni-Au Electroless -Reply

Ni-Au Electroless -Reply

David Anderson <[log in to unmask]>

Thu, 13 Mar 1997 08:09:59 -0600

47 lines

RE: Ni-Au Electroless -Reply

John Nelson <[log in to unmask]>

Wed, 12 Mar 1997 10:23:49 -0500

62 lines

Re: Ni-Au Electroless -Reply

[log in to unmask]

Fri, 14 Mar 1997 00:33:24 -0500 (EST)

51 lines

Re: Ni-Au Electroless -Reply

[log in to unmask]

Fri, 14 Mar 1997 13:47:48 -0500 (EST)

39 lines

New Thread

Nitrogen Storage

Nitrogen Storage

Thomas M. Garvin <[log in to unmask]>

Mon, 24 Mar 97 10:21:40 CST

37 lines

Re: Nitrogen Storage

Poh Kong Hui <[log in to unmask]>

Tue, 25 Mar 1997 20:53:01 +0800 (SST)

70 lines

New Thread

No Clean Bare Board Controls

No Clean Bare Board Controls

Davis, Mary <[log in to unmask]>

Mon, 3 Mar 1997 12:04:16 -0800

56 lines

RE: No Clean Bare Board Controls

Ed Cosper <[log in to unmask]>

Mon, 3 Mar 1997 17:44:07 -0600

88 lines

Re: No Clean Bare Board Controls

Fritz Byle <[log in to unmask]>

Mon, 3 Mar 1997 18:39:21 -0600 (CST)

79 lines

RE: No Clean Bare Board Controls

Ed Cosper <[log in to unmask]>

Tue, 4 Mar 1997 10:25:44 -0600

184 lines

RE: No Clean Bare Board Controls

Davis, Mary <[log in to unmask]>

Tue, 4 Mar 1997 09:20:55 -0800

49 lines

Re: No Clean Bare Board Controls

[log in to unmask]

Tue, 4 Mar 1997 16:40:42 -0500 (EST)

78 lines

Re: No Clean Bare Board Controls

Michael Barmuta <[log in to unmask]>

Tue, 4 Mar 1997 16:27:08 -0800

104 lines

Re: No Clean Bare Board Controls

[log in to unmask]

Wed, 05 Mar 97 13:39:04 CST

90 lines

New Thread

No Clean Bare Board Controls -Reply

Re: No Clean Bare Board Controls -Reply

Bob Metcalf <[log in to unmask]>

Wed, 05 Mar 1997 10:42:54 -0800

106 lines

New Thread

No-Clean Solder Block Change Info Wanted

No-Clean Solder Block Change Info Wanted

Lang, Michael <[log in to unmask]>

Tue, 25 Mar 97 16:00:00 E

47 lines

Re: No-Clean Solder Block Change Info Wanted

Jack Crawford <[log in to unmask]>

Wed, 26 Mar 1997 08:38:07 -0500

100 lines

New Thread

Obsolete Transistors

Obsolete Transistors

Reissa Reedy <[log in to unmask]>

Thu, 20 Mar 1997 08:39:28 -0800

44 lines

Re: Obsolete Transistors

Brian Hyde <[log in to unmask]>

Thu, 20 Mar 1997 11:35:58 -0500

62 lines

RE: Obsolete Transistors

D'Auteuil, Gerry <[log in to unmask]>

Thu, 20 Mar 97 15:34:00 PST

70 lines

New Thread

Odd symbols in messages

Odd symbols in messages

Dave Willhard <[log in to unmask]>

Fri, 28 Mar 1997 10:44:42 PST

46 lines

New Thread

OSP Coatings -- Solderability

OSP Coatings -- Solderability

Jim Herard <[log in to unmask]>

Tue, 11 Mar 1997 11:34:35 -0500

112 lines

New Thread

OSP pads not fully covered with solder

RE: OSP pads not fully covered with solder

Wander, Nicholas G <[log in to unmask]>

Tue, 11 Mar 1997 18:36:58 -0000

82 lines

RE: OSP pads not fully covered with solder

[log in to unmask]

Tue, 11 Mar 97 14:56:56 -0800

110 lines

New Thread

OSP versus HASL

OSP versus HASL

Johannes Sivula <[log in to unmask]>

Tue, 4 Mar 1997 15:10:30 +0300

56 lines

Re: OSP versus HASL

[log in to unmask]

Tue, 4 Mar 1997 10:15:25 -0500 (EST)

46 lines

Re[2]: OSP versus HASL

[log in to unmask]

Tue, 04 Mar 97 12:09:35 MDT

73 lines

New Thread

Panel utilisation

Panel utilisation

tonghh <[log in to unmask]>

Thu, 20 Mar 1997 21:31:40 +0800

44 lines

New Thread

Paste Flux for FCOB

Paste Flux for FCOB

Adzahar Bin Samat <[log in to unmask]>

Sat, 29 Mar 1997 10:02:35 +0800

51 lines

New Thread

Pattern plating considerations

Pattern plating considerations

Eltek Ltd. - Process Engineering <[log in to unmask]>

Wed, 19 Mar 1997 08:10:55 +0200 (IST)

63 lines

Re: Pattern plating considerations

dhoppe <[log in to unmask]>

Mon, 24 Mar 97 15:29:27 PST

91 lines

New Thread

PCB

PCB

Matthew Leary <[log in to unmask]>

Fri, 07 Mar 1997 17:30:12 -0500

41 lines

Re: PCB

Mike Buetow <[log in to unmask]>

Fri, 7 Mar 1997 16:54:28 -0600 (CST)

70 lines

Re: PCB

Excalibur Ltd. <[log in to unmask]>

Sun, 9 Mar 1997 09:32:02 +0200 (IST)

44 lines

RE: PCB

Wander, Nicholas G <[log in to unmask]>

Mon, 10 Mar 1997 11:19:13 -0500

61 lines

RE: PCB

Michael Weal - RD <[log in to unmask]>

Mon, 10 Mar 1997 09:32:40 -0800

95 lines

Re: PCB

DOUG MILLS DIR RESIDENT CME GROUP (714)438-2985 <[log in to unmask]>

Mon, 10 Mar 1997 10:56:54 PT

52 lines

Re[2]: PCB

[log in to unmask]

Mon, 10 Mar 97 15:03:08 CST

94 lines

PCB

Mack, Roger CA-WINPO2 <[log in to unmask]>

Mon, 10 Mar 97 23:00:00 GMT

66 lines

RE: PCB

Kenny Bloomquist <[log in to unmask]>

Tue, 11 Mar 1997 05:32:57 -0800

107 lines

New Thread

PCB Design software

PCB Design software

EAI Engineering <[log in to unmask]>

Mon, 31 Mar 1997 14:39:50 +0800

59 lines

PCB Design Software

EAI Engineering <[log in to unmask]>

Mon, 31 Mar 1997 18:03:34 +0800

59 lines

New Thread

PCB Designers

PCB Designers

Cadet automation systems <[log in to unmask]>

Thu, 6 Mar 1997 19:52:46 +0500 (GMT+0500)

98 lines

New Thread

PCB for high frequency

PCB for high frequency

Jingcheng Zhang <[log in to unmask]>

Thu, 27 Mar 1997 23:13:48 -0800

44 lines

Re: PCB for high frequency

TOM BRESNAN <[log in to unmask]>

Fri, 28 Mar 97 10:57:03 PST

69 lines

New Thread

PCB REPAIR

PCB REPAIR

gabriela <[log in to unmask]>

Tue, 26 Mar 1996 23:07:31 +0000

48 lines

Re: PCB REPAIR

Harry Palmer <[log in to unmask]>

Thu, 27 Mar 1997 21:10:58 -0600

82 lines

RE: PCB REPAIR

Ed Cosper <[log in to unmask]>

Fri, 28 Mar 1997 09:32:07 -0600

89 lines

New Thread

PCB: Solder Joint issue

PCB: Solder Joint issue

[log in to unmask]

Thu, 20 Mar 1997 6:46:29 -0600

91 lines

Re: PCB: Solder Joint issue

ddhillma <[log in to unmask]>

Thu, 20 Mar 97 07:34:21 cst

122 lines

RE: PCB: Solder Joint issue

Maguire, James F <[log in to unmask]>

Thu, 20 Mar 1997 08:34:10 -0800

159 lines

New Thread

Peelable Coating Mask

Peelable Coating Mask

Tamir Ben-Shoshan <[log in to unmask]>

Sun, 30 Mar 97 10:12:40 EST

38 lines

New Thread

peelable mask

peelable mask

[log in to unmask]

Mon, 31 Mar 1997 16:00:04 GMT

42 lines

Re: peelable mask

Karen Tellefsen <[log in to unmask]>

Mon, 31 Mar 1997 17:26:32 -0500 (EST)

68 lines

Re: peelable mask

[log in to unmask]

Tue, 31 Mar 97 15:15:49 EST

61 lines

New Thread

Photo Via

Photo Via

Scott B. Westheimer <[log in to unmask]>

Wed, 19 Mar 1997 21:06:07 +0800

51 lines

Re: Photo Via

[log in to unmask]

Thu, 20 Mar 97 11:03:29 MST

77 lines

Re: Photo Via

[log in to unmask]

Fri, 21 Mar 1997 13:10:01 -0500 (EST)

46 lines

New Thread

Photo-Defined Blind Vias - Technology Workshop - San Jos

Re: Photo-Defined Blind Vias - Technology Workshop - San Jos

[log in to unmask]

Wed, 05 Mar 97 07:08:48 EST

129 lines

Re: Photo-Defined Blind Vias - Technology Workshop - San Jos

Brian McDermott <[log in to unmask]>

Wed, 5 Mar 1997 10:05:02 -0500

185 lines

New Thread

Photo-Defined Blind Vias - Technology Workshop - San Jose - Thurs afterno...

Re: Photo-Defined Blind Vias - Technology Workshop - San Jose - Thurs afterno...

[log in to unmask]

Thu, 6 Mar 1997 13:12:20 -0500 (EST)

35 lines

New Thread

Photo-Defined Blind Vias - Technology Workshop - San Jose - Thurs afternoon March 13th - Red Lion Hotel

Photo-Defined Blind Vias - Technology Workshop - San Jose - Thurs afternoon March 13th - Red Lion Hotel

Brian McDermott <[log in to unmask]>

Tue, 4 Mar 1997 18:48:23 -0500

72 lines

New Thread

Placement files

Placement files

Michael Weal - RD <[log in to unmask]>

Tue, 11 Mar 1997 10:18:51 -0800

55 lines

Re: Placement files

Andrew Buonviri <[log in to unmask]>

Tue, 11 Mar 1997 16:08:04 -0400

44 lines

Re: Placement files

Mark W. Spitnale <[log in to unmask]>

Thu, 13 Mar 1997 06:01:44 -0500

120 lines

New Thread

Plastic on LCCC pads

Plastic on LCCC pads

[log in to unmask]

Wed, 26 Mar 97 07:45:07 +0100

59 lines

New Thread

Preclean parameters

RE: Preclean parameters

Terry Zhu <[log in to unmask]>

Tue, 11 Mar 1997 20:04:23 -0800

99 lines

New Thread

Prepreg shelf life.

Prepreg shelf life.

Steve Sekanina <[log in to unmask]>

Wed, 5 Mar 1997 09:47:07 +0000

47 lines

RE: Prepreg shelf life.

Ed Cosper <[log in to unmask]>

Wed, 5 Mar 1997 10:54:09 -0600

93 lines

Re: Prepreg shelf life.

LISA GREENLEAF <[log in to unmask]>

6 Mar 1997 10:23:30 -0400

80 lines

New Thread

Printed Wire Assembly Solder Rework Reliability

Printed Wire Assembly Solder Rework Reliability

d.guigues <[log in to unmask]>

Fri, 21 Mar 1997 09:05:26 -0800

61 lines

New Thread

Processing PTFE laminates.

Processing PTFE laminates.

Eltek Ltd. - Process Engineering <[log in to unmask]>

Mon, 31 Mar 1997 07:10:47 +0300 (IDT)

51 lines

Re: Processing PTFE laminates.

Yud <[log in to unmask]>

Mon, 31 Mar 1997 22:34:49 +0300

87 lines

New Thread

Protracer Driver

Protracer Driver

Fred Pescitelli <[log in to unmask]>

Wed, 10 Jun 1998 16:28:06 -0700

53 lines

New Thread

Pulse plating of copper and tin/lead

Pulse plating of copper and tin/lead

Rick Haynes <[log in to unmask]>

Tue, 18 Mar 1997 08:48:30 -0800

109 lines

Re: Pulse plating of copper and tin/lead

Paul Gould <[log in to unmask]>

Wed, 19 Mar 1997 23:23:19 +0000

60 lines

Re[2]: Pulse plating of copper and tin/lead

TOM BRESNAN <[log in to unmask]>

Wed, 19 Mar 97 16:33:38 PST

80 lines

New Thread

PWB traveler generation software

PWB traveler generation software

Sid Tryzbiak <[log in to unmask]>

Wed, 19 Mar 1997 10:04:42 -0500

54 lines

Re: PWB traveler generation software

[log in to unmask]

Sun, 23 Mar 1997 14:03:54 -0500 (EST)

39 lines

New Thread

PWB's 1 pass ratio

PWB's 1 pass ratio

[log in to unmask]

13 Mar 97 21:11:42

51 lines

New Thread

PWB,PCB,PWBA,ETC.

PWB,PCB,PWBA,ETC.

Fred Pescitelli <[log in to unmask]>

Wed, 12 Mar 1997 11:16:10 -0500

50 lines

New Thread

PWB: Coating and White ID stringers

PWB: Coating and White ID stringers

[log in to unmask]

Mon, 10 Mar 1997 17:24:07 -0500

45 lines

New Thread

QUAL: MIL-STD Comparison

Re: QUAL: MIL-STD Comparison

Prasad Godavarti-G12162 <[log in to unmask]>

Mon, 3 Mar 1997 8:34:00 -0600

78 lines

RE: QUAL: MIL-STD Comparison

Jan Satterfield <[log in to unmask]>

Mon, 03 Mar 97 14:50

97 lines

New Thread

Questionarie on Double Sided SMA

Questionarie on Double Sided SMA

Victor Li <[log in to unmask]>

Mon, 10 Mar 1997 09:46:46 +0800 (HKT)

118 lines

New Thread

Re,Re:cleaning of BGA's

Re,Re:cleaning of BGA's

Guenter Grossmann <[log in to unmask]>

Fri, 14 Mar 1997 17:25:24 +0100

48 lines

Re,Re:cleaning of BGA's

Bob Willis <[log in to unmask]>

Sat, 15 Mar 1997 08:43:46 -0500

47 lines

New Thread

RE: Response to : Black-oxide layer turned red after pressing

Re: RE: Response to : Black-oxide layer turned red after pressing

Anthony (Tony) King <[log in to unmask]>

14 Mar 97 07:55:08 EST

128 lines

New Thread

Receipt of 3/27/97 4:46PM message

Receipt of 3/27/97 4:46PM message

[log in to unmask]

Thu, 27 Mar 97 17:33:20 MST

33 lines

New Thread

Recycle

Recycle

[log in to unmask]

Mon, 10 Mar 1997 09:04:13 +0000

52 lines

New Thread

Regarding SPC in PCB shops

Regarding SPC in PCB shops

Dave Willhard <[log in to unmask]>

Tue, 18 Mar 1997 13:06:49 PST

55 lines

RE: Regarding SPC in PCB shops

Ed Cosper <[log in to unmask]>

Tue, 18 Mar 1997 15:46:16 -0600

98 lines

New Thread

Removing solder from leads

Removing solder from leads

[log in to unmask]

Wed, 5 Mar 1997 10:57:45 -0500 (EST)

48 lines

New Thread

REQUESTED SPC INFO ( 5 PAGES)

REQUESTED SPC INFO ( 5 PAGES)

Ed Cosper <[log in to unmask]>

Fri, 14 Mar 1997 18:32:48 -0600

378 lines

Re: REQUESTED SPC INFO ( 5 PAGES)

[log in to unmask]

Sun, 16 Mar 1997 11:44:34 -0500 (EST)

44 lines

Re: REQUESTED SPC INFO ( 5 PAGES)

Jim Herard <[log in to unmask]>

Mon, 17 Mar 1997 13:53:05 -0500

94 lines

New Thread

Resend: Questionarie on Double Sided SMA

Resend: Questionarie on Double Sided SMA

Victor Li <[log in to unmask]>

Thu, 20 Mar 1997 17:33:28 +0800 (HKT)

119 lines

New Thread

Resin Recession

RE: Resin Recession

D'Auteuil, Gerry <[log in to unmask]>

Mon, 03 Mar 97 13:32:00 PST

55 lines

Re: Resin Recession

George Franck <george@[11.1.1.33]>

Mon, 3 Mar 1997 15:41:51 -0500

105 lines

RE: Resin Recession

Ed Cosper <[log in to unmask]>

Mon, 3 Mar 1997 14:46:13 -0600

105 lines

Re: Resin Recession

[log in to unmask]

Mon, 3 Mar 1997 21:09:11 -0500 (EST)

41 lines

New Thread

Response to SPC Question.

RE: Response to SPC Question.

Ed Cosper <[log in to unmask]>

Mon, 17 Mar 1997 14:50:33 -0600

97 lines

RE: Response to SPC Question.

Ed Cosper <[log in to unmask]>

Tue, 18 Mar 1997 08:55:46 -0600

113 lines

RE: Response to SPC Question.

Campbell, Todd @ GSC <[log in to unmask]>

Tue, 18 Mar 97 10:35:00 PST

149 lines

New Thread

Response to SPC Question. -Reply

RE: Response to SPC Question. -Reply

David Anderson <[log in to unmask]>

Tue, 18 Mar 1997 21:49:45 -0600

84 lines

New Thread

Rework and Repair Station

Rework and Repair Station

Wanda Solanoo <[log in to unmask]>

Mon, 3 Mar 1997 15:55:24 -0600

41 lines

Re: Rework and Repair Station

Excalibur Ltd. <[log in to unmask]>

Tue, 4 Mar 1997 12:15:30 +0200 (IST)

39 lines

Re: Rework and Repair Station

[log in to unmask]

Tue, 04 Mar 97 07:40:24 EST

58 lines

Re: Rework and Repair Station

[log in to unmask]

Tue, 4 Mar 1997 09:12:54 -0500 (EST)

40 lines

RE:Rework and Repair Station

[log in to unmask]

Tue, 4 Mar 1997 09:30:07 -0500

104 lines

Re: Rework and Repair Station

[log in to unmask]

Wed, 5 Mar 1997 11:20:48 -0500 (EST)

41 lines

New Thread

Re[2]: Microsectioning

Re: Re[2]: Microsectioning

David Anderson <[log in to unmask]>

Thu, 27 Mar 1997 20:38:17 -0600

53 lines

New Thread

ROLAND - - LARGE BOARDS

ROLAND - - LARGE BOARDS

Baker,Kelly <[log in to unmask]>

Sun, 2 Mar 1997 10:02:34 -0500

41 lines

New Thread

Searching for Info on Bellcore Complaince Testing

Searching for Info on Bellcore Complaince Testing

Scott Miller <[log in to unmask]>

Sat, 08 Mar 1997 18:50:21 -0500

49 lines

New Thread

Selective PCB plating

Selective PCB plating

David Driscoll <[log in to unmask]>

Mon, 10 Mar 1997 06:43:59 -0800

45 lines

Re: Selective PCB plating

Harlan Vince <[log in to unmask]>

Mon, 10 Mar 97 11:34:05 -0500

79 lines

Re: Selective PCB plating

Allen Hertz <[log in to unmask]>

Mon, 10 Mar 1997 15:28:43 -0500 (EST)

75 lines

Re: Selective PCB plating

[log in to unmask]

Tue, 11 Mar 97 10:50:44 EST

38 lines

Re: Selective PCB plating

Harlan Vince <[log in to unmask]>

Mon, 10 Mar 97 11:34:05 -0500

91 lines

New Thread

Self limiting Immersion Gold Process

Self limiting Immersion Gold Process

Michael Forrester <[log in to unmask]>

Wed, 19 Mar 1997 13:31:25 -0400

65 lines

New Thread

sequential build up

sequential build up

Ed Cosper <[log in to unmask]>

Tue, 25 Mar 1997 13:24:44 -0600

49 lines

New Thread

Shipping Automation

Shipping Automation

Sid Tryzbiak <[log in to unmask]>

Mon, 3 Mar 1997 08:57:16 -0500

54 lines

New Thread

Shrink Wrap for pcbs

Shrink Wrap for pcbs

Paul Greene <[log in to unmask]>

Mon, 31 Mar 1997 10:49:36 GMT

45 lines

Re: Shrink Wrap for pcbs

Chris Messner <[log in to unmask]>

Mon, 31 Mar 1997 15:04:01 -0500

75 lines

New Thread

Silver Halide Wastes

Silver Halide Wastes

Dick Desrosiers <[log in to unmask]>

Sun, 02 Feb 1997 09:16:24 -0500

62 lines

New Thread

SMT Assembly and Flex Circuits

SMT Assembly and Flex Circuits

Prasad Godavarti-G12162 <[log in to unmask]>

Mon, 10 Mar 1997 11:35:00 -0600

40 lines

Re: SMT Assembly and Flex Circuits

[log in to unmask] <[log in to unmask]>

Tue, 11 Mar 1997 22:50:13 +0800

64 lines

RE: SMT Assembly and Flex Circuits

Nelson Calimquim <[log in to unmask]>

Tue, 11 Mar 1997 09:59:49 -0800

62 lines

RE: SMT Assembly and Flex Circuits

Nelson Calimquim <[log in to unmask]>

Tue, 18 Mar 1997 09:40:13 -0800

118 lines

Re: SMT Assembly and Flex Circuits

[log in to unmask]

Tue, 18 Mar 1997 20:02:05 -0500 (EST)

37 lines

Re: SMT Assembly and Flex Circuits

[log in to unmask]

Wed, 19 Mar 1997 08:18:47 -0500 (EST)

39 lines

New Thread

SMT Assembly and Flex Circuits -Reply

Re: SMT Assembly and Flex Circuits -Reply

David Anderson <[log in to unmask]>

Tue, 18 Mar 1997 19:27:58 -0600

64 lines

New Thread

SMT pre-owned equipments

SMT pre-owned equipments

M. Betournay <[log in to unmask]>

Mon, 17 Mar 1997 08:16:08 -0500

41 lines

Re: SMT pre-owned equipments

Antoni Cherta <[log in to unmask]>

Tue, 18 Mar 1997 17:47:32 +0100

96 lines

New Thread

SMT REEL SPLICER

SMT REEL SPLICER

Carl Ray <[log in to unmask]>

Wed, 26 Mar 1997 08:46:58 -0600

52 lines

Re: SMT REEL SPLICER

[log in to unmask]

Wed, 26 Mar 1997 10:03:38 -0600

77 lines

Re: SMT REEL SPLICER

Jerry Cupples <[log in to unmask]>

Wed, 26 Mar 1997 10:26:59 -0600

76 lines

New Thread

Solder Joint issue

RE: Solder Joint issue

Maguire, James F <[log in to unmask]>

Thu, 20 Mar 1997 08:43:27 -0800

125 lines

New Thread

Solder Mask Coverage and exposed SN/PB and Copper

Solder Mask Coverage and exposed SN/PB and Copper

Mike Masters <[log in to unmask]>

Tue, 25 Mar 1997 07:55:56 -0500

68 lines

RE: Solder Mask Coverage and exposed SN/PB and Copper

Ed Cosper <[log in to unmask]>

Tue, 25 Mar 1997 09:44:14 -0600

111 lines

New Thread

Solder Mask on fine pitch SMT component

Solder Mask on fine pitch SMT component

Andy <[log in to unmask]>

Thu, 13 Mar 1997 09:38:07 +0800

48 lines

RE: Solder Mask on fine pitch SMT component

Wander, Nicholas G <[log in to unmask]>

Thu, 13 Mar 1997 09:51:37 -0500

64 lines

Re: Solder Mask on fine pitch SMT component

[log in to unmask]

Thu, 13 Mar 97 07:26:38 PST

69 lines

RE: Solder Mask on fine pitch SMT component

K.Varadaraj@CADET, India <[log in to unmask]>

Fri, 14 Mar 1997 08:34:36 +0500 (GMT+0500)

98 lines

RE: Solder Mask on fine pitch SMT component

Wander, Nicholas G <[log in to unmask]>

Fri, 14 Mar 1997 09:15:04 -0700

102 lines

Re: Solder Mask on fine pitch SMT component

[log in to unmask]

Wed, 19 Mar 1997 00:12:36 -0500 (EST)

54 lines

RE: Solder Mask on fine pitch SMT component

Bert Ohlig <[log in to unmask]>

Thu, 20 Mar 97 13:50:55 UT

84 lines

New Thread

Solder Mask on fine pitch SMT component -Reply

Solder Mask on fine pitch SMT component -Reply

Bob Metcalf <[log in to unmask]>

Wed, 12 Mar 1997 19:06:33 -0800

68 lines

New Thread

Solder mask question

Solder mask question

Stephen C Joy <[log in to unmask]>

Tue, 25 Mar 97 14:16:00 PST

74 lines

New Thread

Solder preforms.

Solder preforms.

[log in to unmask]

18 Mar 97 23:47 GMT+0500

50 lines

Re: Solder preforms.

Poh Kong Hui <[log in to unmask]>

Wed, 19 Mar 1997 07:15:38 +0800 (SST)

69 lines

Re: Solder preforms.

[log in to unmask]

Wed, 19 Mar 1997 14:19:06 -0500 (EST)

40 lines

New Thread

Solderability Shelf Life of Untreated Copper SMT Pads

Solderability Shelf Life of Untreated Copper SMT Pads

[log in to unmask] (Lorne Johnson) <[log in to unmask]>

Mon, 24 Mar 1997 15:54:51 -0800

41 lines

New Thread

Soldermask question

Re: Soldermask question

[log in to unmask]

Sat, 1 Mar 1997 08:51:35 -0500 (EST)

37 lines

Re: Soldermask question

[log in to unmask]

Sun, 2 Mar 1997 20:01:33 -0500 (EST)

57 lines

Re: Soldermask question

[log in to unmask]

Mon, 3 Mar 1997 09:44:41 -0500 (EST)

42 lines

Re: Soldermask question

sbryan <[log in to unmask]>

Mon, 03 Mar 97 07:16:15 PST

84 lines

New Thread

Soldermask question -Reply

Soldermask question -Reply

Bob Metcalf <[log in to unmask]>

Mon, 03 Mar 1997 14:24:00 -0800

73 lines

New Thread

Solutions for Loading Databas using Mentor "Board Station"

Solutions for Loading Databas using Mentor "Board Station"

Cadet automation systems <[log in to unmask]>

Sat, 8 Mar 1997 17:26:23 +0500 (GMT+0500)

53 lines

New Thread

Solutions for Loading Databas using Mentor "Board Station" (fwd)

Solutions for Loading Databas using Mentor "Board Station" (fwd)

Cadet automation systems <[log in to unmask]>

Mon, 10 Mar 1997 10:10:47 +0500 (GMT+0500)

62 lines

New Thread

SOT-23 lands for wave soldering

SOT-23 lands for wave soldering

James Glasson <[log in to unmask]>

Fri, 7 Mar 1997 10:17:58 EST

65 lines

RE: SOT-23 lands for wave soldering

JIM ENNIS <[log in to unmask]>

Fri, 07 Mar 97 13:44:00 PST

85 lines

New Thread

SPC chart for % defective

SPC chart for % defective

Dave Willhard <[log in to unmask]>

Thu, 27 Mar 1997 15:41:34 PST

52 lines

RE: SPC chart for % defective

John Nelson <[log in to unmask]>

Thu, 27 Mar 1997 07:53:06 -0500

55 lines

RE: SPC chart for % defective

Ed Cosper <[log in to unmask]>

Fri, 28 Mar 1997 09:25:44 -0600

105 lines

RE: SPC chart for % defective

Tully, Marti (AZ15) <[log in to unmask]>

31 Mar 1997 17:16:03 -0600

112 lines

New Thread

SPC for PCB fabrication

SPC for PCB fabrication

Dave Willhard <[log in to unmask]>

Mon, 3 Mar 1997 11:58:13 PST

65 lines

RE: SPC for PCB fabrication

Ed Cosper <[log in to unmask]>

Mon, 3 Mar 1997 15:00:05 -0600

125 lines

New Thread

SPC for PCBs

SPC for PCBs

Ed Cosper <[log in to unmask]>

Tue, 4 Mar 1997 11:32:53 -0600

68 lines

New Thread

SPC software designed for PCB production

Re: SPC software designed for PCB production

Sid Tryzbiak <[log in to unmask]>

Wed, 19 Mar 1997 10:29:26 -0500

131 lines

Re[2]: SPC software designed for PCB production

joef <[log in to unmask]>

Thu, 20 Mar 97 15:36:34 EST

147 lines

New Thread

Specs

Specs

Nasser Y. El-Awar <[log in to unmask]>

Tue, 25 Mar 1997 14:05:46 -0500

46 lines

New Thread

Spots on Cu surfaces aft

Re: Spots on Cu surfaces aft

Greg Bartlett <[log in to unmask]>

6 Mar 1997 14:58:45 -0500

119 lines

New Thread

Spots on Cu surfaces after OSP coating

Spots on Cu surfaces after OSP coating

Dave Willhard <[log in to unmask]>

Thu, 6 Mar 1997 11:58:10 PST

54 lines

New Thread

Strategy for Baking Plastic Parts...

Strategy for Baking Plastic Parts...

Lang, Michael <[log in to unmask]>

Wed, 05 Mar 97 08:49:00 E

73 lines

New Thread

Surface Mount Reliability

Surface Mount Reliability

Bruning, Kenneth D <[log in to unmask]>

Thu, 27 Mar 1997 13:40:09 -0500

47 lines

New Thread

Surface Mount test points

Surface Mount test points

Ron Richardson ForeWest NPI PM <[log in to unmask]>

Thu, 27 Mar 1997 08:42:05 -0800

51 lines

re: Surface Mount Test Points

Budster <[log in to unmask]>

Thu, 27 Mar 1997 12:50:40 -0800

66 lines

Re: Surface Mount test points

[log in to unmask]

Mon, 31 Mar 1997 11:51:27 -0600

74 lines

New Thread

Surface tension of molten Pb/Sn

Surface tension of molten Pb/Sn

Tamir Ben-Shoshan <[log in to unmask]>

Sun, 30 Mar 97 13:50:00 EST

35 lines

Re: Surface tension of molten Pb/Sn

ddhillma <[log in to unmask]>

Mon, 31 Mar 97 07:01:54 cst

65 lines

New Thread

TCE

Re: TCE

Fred Paul <[log in to unmask]>

Mon, 24 Mar 1997 08:45:16 -0800

75 lines

RE: TCE

Tom Johnson <[log in to unmask]>

Mon, 24 Mar 1997 10:28:42 -0800

98 lines

Re: TCE

Jerry Cupples <[log in to unmask]>

Mon, 24 Mar 1997 16:24:58 -0600

80 lines

New Thread

Test coupans for controlled impedance boards.

Test coupans for controlled impedance boards.

[log in to unmask]

19 Mar 97 23:35 GMT+0500

52 lines

Re: Test coupans for controlled impedance boards.

John Parsons <[log in to unmask]>

Thu, 20 Mar 1997 10:07:21 +0000

44 lines

Re: Test coupans for controlled impedance boards.

Andy Burkhardt <[log in to unmask]>

Fri, 21 Mar 1997 14:48:07 GMT

63 lines

New Thread

Testing Methodolgies

Testing Methodolgies

[log in to unmask]

Thu, 27 Mar 1997 06:58:15 -0800

51 lines

New Thread

Testing strategies

Testing strategies

David Driscoll <[log in to unmask]>

Tue, 11 Mar 1997 11:42:51 -0800

53 lines

New Thread

Testing strategies -Reply

Testing strategies -Reply

Dan Lorinser <[log in to unmask]>

Wed, 12 Mar 1997 06:36:52 -0600

69 lines

New Thread

The meaning of ISO

The meaning of ISO

Ed Cosper <[log in to unmask]>

Wed, 26 Mar 1997 17:36:29 -0600

70 lines

RE: The meaning of ISO

[log in to unmask]

Thu, 27 Mar 1997 11:01:11 +0000

55 lines

New Thread

TSOPs

Re: TSOPs

[log in to unmask]

Mon, 17 Mar 1997 10:08:01 -0500 (EST)

46 lines

New Thread

UL

UL

Matthew Leary <[log in to unmask]>

Fri, 07 Mar 1997 17:29:03 -0500

42 lines

Re: UL

Doug Jeffery <[log in to unmask]>

Sat, 8 Mar 1997 06:50:51 -0600 (CST)

75 lines

New Thread

ultra fine pithch vs. fine pitch

ultra fine pithch vs. fine pitch

[log in to unmask]

Thu, 13 Mar 97 08:26:54 CDT

35 lines

New Thread

Unidentified subject!

Unidentified subject!

Michael Forrester <[log in to unmask]>

Tue, 11 Mar 1997 09:14:30 -0400

61 lines

Unidentified subject!

Larry Morse <[log in to unmask]>

Wed, 12 Mar 1997 09:17:16 -0800

68 lines

Unidentified subject!

Sid Tryzbiak <[log in to unmask]>

Fri, 21 Mar 1997 13:09:47 -0500

55 lines

Re: Unidentified subject!

Michael Barmuta <[log in to unmask]>

Fri, 21 Mar 1997 13:43:56 -0800

92 lines

Re: Unidentified subject!

Karen Tellefsen <[log in to unmask]>

Sat, 22 Mar 1997 10:06:10 -0800

67 lines

Unidentified subject!

[log in to unmask]

Tue, 25 Mar 1997 09:57:05 -0600

60 lines

Unidentified subject!

Larry Morse <[log in to unmask]>

Tue, 25 Mar 1997 16:47:53 -0800

71 lines

re: Unidentified subject!

[log in to unmask]

Wed, 26 Mar 97 17:56:30 PST

39 lines

New Thread

Use of Microvia Technology

Use of Microvia Technology

David Driscoll <[log in to unmask]>

Wed, 05 Mar 1997 10:28:31 -0800

44 lines

RE: Use of Microvia Technology

D'Auteuil, Gerry <[log in to unmask]>

Thu, 06 Mar 97 08:08:00 PST

72 lines

New Thread

Use of Microvia Technology/ Reply

Re: Use of Microvia Technology/ Reply

[log in to unmask]

Wed, 5 Mar 1997 17:50:55 -0500 (EST)

39 lines

New Thread

Using Silver on Boards for Better Solderability

Re: Using Silver on Boards for Better Solderability

[log in to unmask]

Mon, 17 Mar 1997 10:08:02 -0500 (EST)

58 lines

New Thread

UTP - Unshielded Twisted Pair

UTP - Unshielded Twisted Pair

Doug McKean <[log in to unmask]>

Thu, 27 Mar 1997 12:22:38 -0500

47 lines

Re: UTP - Unshielded Twisted Pair

John Nieznanski <[log in to unmask]>

Thu, 27 Mar 1997 15:31:00 -0500

63 lines

Re: UTP - Unshielded Twisted Pair

Doug McKean <[log in to unmask]>

Thu, 27 Mar 1997 16:34:55 -0500

74 lines

New Thread

Vapor phase oven/Centech info.

Vapor phase oven/Centech info.

Maguire, James F <[log in to unmask]>

Fri, 28 Mar 1997 14:25:26 -0800

56 lines

New Thread

WAVE SOLDER PALLETS

WAVE SOLDER PALLETS

malcolm pinder <[log in to unmask]>

Mon, 17 Mar 1997 14:38:11 -0800

38 lines

New Thread

Wire bonding

Wire bonding

[log in to unmask]

Thu, 20 Mar 97 11:48:26 EST

39 lines

Re: Wire bonding

David Anderson <[log in to unmask]>

Thu, 20 Mar 1997 10:56:19 -0600

50 lines

Wire bonding

Jim Herard <[log in to unmask]>

Thu, 20 Mar 1997 16:45:03 -0500

71 lines

New Thread

Wire Termination Spec.

Wire Termination Spec.

Kenny Bloomquist <[log in to unmask]>

Tue, 11 Mar 1997 05:45:25 -0800

45 lines

New Thread

Working to NHB5300.4(3A-1)

Working to NHB5300.4(3A-1)

Kasprzak, Bill (esd) US <[log in to unmask]>

Tue, 25 Mar 97 15:22:00 PST

50 lines

Re: Working to NHB5300.4(3A-1)

marc decantillon <[log in to unmask]>

Wed, 26 Mar 97 15:35:24 CST

68 lines

Re: Working to NHB5300.4(3A-1)

Bill Gaines B160 x2199 <[log in to unmask]>

Thu, 27 Mar 97 10:23:42 PST

51 lines

New Thread

Workmanship Standards

Workmanship Standards

[log in to unmask]

Tue, 25 Mar 1997 10:34:14 -0600

57 lines

New Thread

Workmanship Standards (fwd)

Re: Workmanship Standards (fwd)

Jon Holmen <[log in to unmask]>

Tue, 25 Mar 1997 11:19:56 -0600 (CST)

107 lines

New Thread

[Fwd: Re: Placement files]

[Fwd: Re: Placement files]

Robert Boilard <[log in to unmask]>

Wed, 12 Mar 1997 19:22:58 -0500

92 lines

New Thread

[Fwd: Re[2]: Pulse plating of copper and tin/lead]

[Fwd: Re[2]: Pulse plating of copper and tin/lead]

[log in to unmask]

Thu, 20 Mar 1997 23:18:39 -0800

141 lines

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