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February 1997


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Table of Contents:

(CVS) Cyclic Voltammetry Stripping (1 message)
(Fwd) Storage Time (1 message)
(no subject) (1 message)
(no subject) CONGRATULATIONS!! in ASSY question (1 message)
12 micon copper foil (1 message)
12 micron copper foil (1 message)
3 layer board with 4 oz copper (1 message)
<none> (1 message)
? (1 message)
A610 (2 messages)
Address change (1 message)
ADMIN (1 message)
Admin: Is the Net dead today? (1 message)
ADMIN: Job Posting (1 message)
ADMIN: Job Posting Gone?? (2 messages)
ADMIN: Job Postings on TechNet (2 messages)
ADMIN: Job Postings on TechNet -Reply (1 message)
ADMIN: Mail Storm (3 messages)
ADMIN: Message size limit (1 message)
ADMIN: Re: Open position (10 messages)
ADMIN: Request to Limit Submissions (1 message)
ADMIN: TechNet problem (1 message)
Alloy contamination (2 messages)
Aluminum wire bond to silver component (4 messages)
Amendment 1 to IPC-SM-782 Revision A (1 message)
Annular Ring (6 messages)
Antifoam and Black Hole (2 messages)
Aqueous LPI Masks And Compatibility With Electroless Ni/Au (1 message)
Argentum (1 message)
Article search (1 message)
Asmbly - Properties Data (2 messages)
ASS: ISHM paper Electromigration vs. SIR (1 message)
ASSEM:Solder Balls (2 messages)
Assemblies, MIL/IPC Comparison (1 message)
Assembly (3 messages)
ASSEMBLY - SOLDERLESS WRAP WIRING (1 message)
Assembly ESD (1 message)
assly:baking of PBGAs (1 message)
ASSM: Temperature-verified soldering irons (1 message)
ASSY (1 message)
ASSY : cleanliness specification (2 messages)
ASSY QUESTION (1 message)
Assy/Fab: Environmental stress screening (2 messages)
ASSY/TEST- Salt Fog Test (4 messages)
ASSY: BGA BALL ATTACHMENT (2 messages)
Assy: contract manufacturing (3 messages)
ASSY: ITT Connector Crimp (1 message)
ASSY: Omegameter reading for RMA vs. WS flux. (4 messages)
ASSY: Problems with 50V ceramic capacitor at Wave Solder (1 message)
ASSY: Problems with 50V ceramic capacitor at Wave Soldering (3 messages)
Assy: Question (15 messages)
Assy: Question -Reply (1 message)
Assy: Question : Pb/Ag--- THANKS !!! (1 message)
ASSY: Re: Flexible Circuit Repair (2 messages)
ASSY: Reliability, IPC Specs, IPC Task Groups (4 messages)
ASSY: SOLDER ALLOYS AND BGAs (2 messages)
ASSY: Solder Thieving for Components? (2 messages)
ASSY: Soldermask Encroachment (5 messages)
ASSY: SR Conformal Coating in Mfg Area (5 messages)
ASSY: Tack time of paste vs humidity (2 messages)
ASSY: THERMAL ADHESIVE (2 messages)
ASSY: TQFP Standard unit (2 messages)
Assy: Water Based VOC Flux (2 messages)
Assy: Wavesoldering thick boards (1 message)
Assy:Burn-In/ESS (2 messages)
ASSY:ESD seat covers (1 message)
Assy:ICT testing (1 message)
Assy:LCC height control (3 messages)
ASSY:SMD panelization (1 message)
ASY: Alloy contamination (4 messages)
backplane exposure (3 messages)
BBIT (1 message)
Benchmarking PCB Industry (1 message)
Benchmarking PCB Industry (fwd)[3~ (1 message)
BGA Conference Call for Papers (1 message)
Biferuated terminals (2 messages)
Black Hole and developer antifoam (1 message)
Blind vias & fine lines (8 messages)
Blind vias & fineline (1 message)
Boards with electroless Ni Au and Electroplated gold (1 message)
Built-up Up Multilayer (5 messages)
carbon ink inspection (1 message)
Carl Tautscher Number (2 messages)
Chip Scale package availability (1 message)
Chip scale packaging (3 messages)
Circuit Board/Poly-Circuits - Laser cutting (1 message)
Circuits Assembly - NAFTA (2 messages)
Coating over fine-pitch SMD parts (4 messages)
COB, TAB, and CSP... (2 messages)
Collimation or not? (6 messages)
component identification (2 messages)
Conf Coating Compatibility (1 message)
Conf Coating Compatibility -Reply (2 messages)
Connector Placement (1 message)
Controlled Impedance (1 message)
CONVECTION REFLOW PROFILES? (2 messages)
Copper Plating (3 messages)
Correction RE: RUSCON Russian PCB Conference (1 message)
corrosion (7 messages)
CRES303 (1 message)
Crosstalk calculations (1 message)
current in screened silver circuits (1 message)
Current Job Listings (2 messages)
Defective PWB at customer's facility (4 messages)
DES/FAB Controlled Impedance info request (1 message)
DES/FAB Moisture and Fungus Testing (3 messages)
DES/FAB: Moisture & Fungus testing (1 message)
DES: ASSY: Chip Scale package availability (1 message)
Des: BGAs (2 messages)
DES: Crosstalk calculations (4 messages)
DES: Cu fills on circuit layers (1 message)
DES: Cu fills on circuit layers -Reply (1 message)
Des: Induced Current (3 messages)
Des: Jumpers per IPC-A-610 (1 message)
Des: Via Hole and Pad size. (4 messages)
Des: Via Hole and Pad size. -Reply (1 message)
Design (bonding diagram editor for BGA pkgs.) (2 messages)
Design Standards for BGA -Forwarded (1 message)
Design-Rules Requirements for BGA PCB's (3 messages)
DESIGN: Aspect Ratio versus Material choice (4 messages)
DESIGN:Simulated twisted pair (1 message)
Discoloration in solder plating (4 messages)
drill and image files format (1 message)
Drilling (1 message)
Drilling Heads (1 message)
Dross reducer (Kleenox) (3 messages)
Dry Film For Deep Gold Process (5 messages)
Dry Film For Deep Gold Process -Reply (1 message)
electroless nickel finish (4 messages)
Employment Advertising (2 messages)
Enough Already !!! (1 message)
equipment queries (1 message)
ESD (2 messages)
ESD Replies (1 message)
European Joint Conference Call for Papers (1 message)
Fab - Line Width Measurment (1 message)
FAB / Waste Reuse (3 messages)
FAB and ASSEM (1 message)
Fab Oxide treatment (5 messages)
FAB, soldermask lamination (4 messages)
FAB, soldermask lamination -Reply (1 message)
Fab/Assy: Class3, 1/2 tented vias (3 messages)
FAB/DES: IPC-D-356 (1 message)
FAB: 3 layer board with 4 oz copper (3 messages)
FAB: Annular Ring (3 messages)
FAB: Annular Ring - Alternate Concern (2 messages)
FAB: DES: request for ball park costs & capabilities (1 message)
Fab: DFM (3 messages)
FAB: Differential Impedance (1 message)
FAB: Discoloration in solder plating (3 messages)
FAB: Entek, other OSP's (1 message)
FAB: innerlayer core locating slot integrity (1 message)
Fab: IPC-6012 Conformance Testing Frequency (1 message)
FAB: Liquid Photoresist (2 messages)
FAB: Liquid Photoresist -Reply (3 messages)
FAB: Palladium Plating (1 message)
FAB: planarity of pads for gold wire bond (PBGA) (1 message)
FAB: Prototype Supplier Recommondation (2 messages)
FAB: Relia-via finish (1 message)
Fab: Rivets (1 message)
FAB: Searching for PC Based Visualisation of Gerber files in order to Quote (3 messages)
FAB: Soldermask Encroachment (3 messages)
FAB: We need a manufacturer for large size single sided PCBs (1 message)
FAB:Blind vias & fine lines (2 messages)
FAB:Laser vias (5 messages)
FAB:Reliability test for via holes on BGA circuit (1 message)
FAB:Roller swelling (1 message)
FAB:Surface Preparation (1 message)
Fatigue Life of Solder Joints (2 messages)
Flex circuit boards (5 messages)
Flexible Circuit Repair (1 message)
flexing of backplanes when installing cards (2 messages)
FR-4 material movement (4 messages)
FR4 material (3 messages)
FW: Contracts for Turnkey Manufacturing (1 message)
FW: DESIGN: Aspect Ratio versus Material choice (1 message)
FW: Entek, other OSP's (1 message)
FW: FR-4 material movement (1 message)
FW: Notification: Inbound Mail Failure - Message could not be processed (1 message)
FW: Training (1 message)
Fwd: ASTM Individual Standard Search Form (1 message)
Gen.:Reliability of TSOP solder joints (2 messages)
GEN: (1 message)
GEN: ADHESIVE SUPPLIER (2 messages)
GEN: Cyclic Voltammetry (1 message)
GEN: Digest (5 messages)
GEN: Job + Label + Gerber Viewer (1 message)
GEN: malachite (1 message)
GEN: Replies (1 message)
GEN: SMTA VERSION OF TechNet AVAILABLE? (2 messages)
GEN: Soldermask Encroachment (1 message)
GEN: Wheres the TechNet archive? (4 messages)
Gerber viewer: GCPrevue for Win32 (1 message)
Gold as Etch Resist (1 message)
Gold/Tin Lead (1 message)
GraphiCode Shareware (1 message)
HAR ZION - CATALOG (1 message)
heat shielding (3 messages)
Help Desk Friday schedule (1 message)
High Density Interconnect (2 messages)
Hot shortness (1 message)
Impedance of parallel Traces (1 message)
Industry average pincounts/PPM data (1 message)
innerlayer core locating slot integrity (1 message)
IPC CONFERENCE (2 messages)
IPC Sjpecifications (1 message)
IPC Sjpecifications -Reply (1 message)
IPC Specifications (1 message)
IPC-D-356 (1 message)
IPC-MF-150 (1 message)
IPC-SM-840 (1 message)
IPCchat session announcement (4 messages)
J-STD vs MILSPEC (1 message)
j-std-002 parts (4 messages)
James B. Bryan (1 message)
Japan - Hong Kong Workshop in March (1 message)
JOB (1 message)
Job Opportunity (1 message)
JOB POSTINGS (5 messages)
Job Postings / Employers / My 2 Cents (1 message)
job postings ??? (1 message)
Job Postings on TechNet (1 message)
Joint Technical Societies, Nepcon West, L.A. Area (1 message)
KAMAN INSTRUMENTS KD-2300 (1 message)
Laser Direct Imaging (1 message)
Laser Direct Writing (3 messages)
LCC height control (1 message)
LEDs and SMT components mounted to polyester screened circuits (1 message)
LEDs on Flexible Poly Circuits (1 message)
liconix laser source (1 message)
Line width measurement (1 message)
Looking for 15 to 20 hp vacuum (1 message)
Looking for a cam operator (1 message)
Low cost flex circuits? (2 messages)
Low meelting point or temperature solder (2 messages)
Low temperature solder (3 messages)
mag hydroxide in waste treatment (1 message)
mag hydroxide in waste treatment -Reply (2 messages)
mag hydroxide in waste treatment -Reply 2 (1 message)
Mailstorm (3 messages)
Mechanical fasteners for multilayer PWBs (2 messages)
Message text (1 message)
MIL STD. 2000 ?? (2 messages)
MIL-I-45208A (1 message)
misregistration test (1 message)
Mixed Tech Assy -Reply (2 messages)
NAFTA (1 message)
NEED Gerber viewer with highlight capability (2 messages)
No clean paste (2 messages)
No IPC Technet Stuff (1 message)
Open position (2 messages)
ORC exposure machine (1 message)
OSP and solderability (1 message)
OSP Shelf Life (3 messages)
OSPs (1 message)
oxide and lpi problems (FAB) (4 messages)
packaging boards for shipment and storage (2 messages)
panasert question (2 messages)
PBGA Testing (1 message)
PCB DESIGN (4 messages)
PCB Panelization (3 messages)
PCBs at 150C for more than 2 hours (1 message)
PCBs at 150°C for more than 2 hours (1 message)
PCBs at 150C for more than 2 hours (1 message)
People (4 messages)
Pinholes - 610B vs. J-STD-001B (2 messages)
Plating Particulates (3 messages)
Plating rinse tank bacteria (5 messages)
Please read this. (3 messages)
Please read this. -Reply (1 message)
Propagation time formula (5 messages)
Proposed drill comp. (1 message)
Pulse plating acid copper solutions. (1 message)
Pulse plating acid copper solutions.Response (1 message)
PWB Copper Surface Treatments (1 message)
PWB manufacturing question? (1 message)
QUAL: MIL-STD Comparison (1 message)
qualification plan for (1 message)
re- laser vias (1 message)
RE: 12 micron copper foil (1 message)
Re: Assembly ESD (2 messages)
Re: PCBs at 150°C for more than 2 hours (1 message)
RE: Please read this. -Reply (1 message)
Re: Propagation time formula - Burkhardt reply (1 message)
Reed Beds for Effluent Treatment ? (1 message)
Relibility Ratings in Standards (7 messages)
removing RMA flux (1 message)
Replacement for Hasl operation (5 messages)
Reply: DES: Cu fills on circuit layers (1 message)
Request for assistance (1 message)
Request for information on BGA, COB, FlipChip. (3 messages)
Resin recession (2 messages)
Reverse Osmosis Unit for Charity (1 message)
Re[2]: FAB: Horizontal versus vertical etching (1 message)
Re[2]: FAB:Laser vias (1 message)
Re[2]: Gold as Etch Resist (1 message)
Re[2]: SOLDER BALLS (on SMT) (1 message)
Rigid Laminate stabilty (3 messages)
Router Bit (1 message)
Routing Ultem (1 message)
RQST, SMTA VERSION OF TECHNET AVAILABLE? (3 messages)
RUSCON Flyer (1 message)
Russian PCB Conference - RUSCON - (1 message)
Saponifier waste treatment (1 message)
Shearing Optimization (1 message)
Shelf Life (1 message)
SIR Guru (2 messages)
SMART Survey Results (1 message)
smd automatic mounting machines (1 message)
SMT adhesives (1 message)
SMT: Glue (1 message)
SMT: Glue, response (1 message)
SOLDER BALLS (on SMT) (3 messages)
Solder pot to allow removal of copper (2 messages)
solder recycle system (5 messages)
Soldering (1 message)
Soldering Stainless steel (2 messages)
Soldering Transformers (1 message)
Soldermask Encroachment (1 message)
Soldermask Lamination (1 message)
Soldermask question (1 message)
SPC for HAL solder coating process (1 message)
SPC OF PCB (2 messages)
Spec for inductive components (1 message)
Specialized IGI Ext Software Question (1 message)
Specifications for edge condition on laminate panels (1 message)
spindle reconditioning (1 message)
spray fluxing, VOC free (2 messages)
Stainless steel (2 messages)
Standard 4 layer construction (1 message)
standard panelization (1 message)
Stop send me an information about technet. (1 message)
Storage Time (1 message)
Subj: Flux Marking Pens and No-clean Flux (1 message)
SUBJ: Q-Corp Lead Trimmin (1 message)
SUBJ: Q-Corp Lead Trimming & ESD (3 messages)
subject: Flux Marking Pens & No-clean Process (2 messages)
subscribtion (1 message)
substitutes for HCFC 141b (1 message)
Surface Insulation Resistance testing (1 message)
Surface Preparation (2 messages)
Survey: Reflow Equip. & No-clean Paste (1 message)
Tech ? from Lucent (1 message)
test-coupon dimension (2 messages)
Thanks for the History lesson -- in ASSY question (1 message)
Tinning and soldering transformers (3 messages)
Training (6 messages)
Transmission line formulas (1 message)
Unidentified subject! (3 messages)
Used Equipment (2 messages)
Using Silver on Boards for Better Solderability (2 messages)
Vender Advertising on TechNet (2 messages)
Via Hole and Pad size. (2 messages)
Vote YES (job) (4 messages)
WATERBOURNE SOLDER MASK (3 messages)
We need a manufacturer for large size single sided PCBs (2 messages)
Wedge voids/Alternatives to Electroless (1 message)
Wedge voids/Alternatives to Electroless / REPLY (1 message)
Whereabouts of a temperature-controlled warehouse (1 message)
Whereabouts of a temperature-controlled warehouse -Reply (1 message)
Work smarter, not harder -Reply (1 message)
Z axis material (2 messages)
[iccon-misc] Internet Phone Rates (1 message)

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Subject Sorted by Subject, Chronologically

From

Date

Size

New Thread

(CVS) Cyclic Voltammetry Stripping

(CVS) Cyclic Voltammetry Stripping

[log in to unmask]

Wed, 12 Feb 1997 09:41:34 -0500 (EST)

51 lines

New Thread

(Fwd) Storage Time

(Fwd) Storage Time

RAINER <[log in to unmask]>

Sun, 23 Feb 1997 13:15:42 +0000

57 lines

New Thread

(no subject)

(no subject)

Bob Laurenti <[log in to unmask]>

Wed, 19 Feb 1997 12:59:43 -0600

62 lines

New Thread

(no subject) CONGRATULATIONS!! in ASSY question

(no subject) CONGRATULATIONS!! in ASSY question

Bob Laurenti (mediante: Antoni Cherta <[log in to unmask]>) <[log in to unmask]>

Fri, 21 Feb 1997 02:16:32 +0100

82 lines

New Thread

12 micon copper foil

12 micon copper foil

James Ying <[log in to unmask]>

Wed, 5 Feb 1997 00:31:40 +0800 (SST)

40 lines

New Thread

12 micron copper foil

RE: 12 micron copper foil

Kuwako, Fujio(MMS) <[log in to unmask]>

Wed, 5 Feb 1997 09:20:56 +0900

89 lines

New Thread

3 layer board with 4 oz copper

RE: 3 layer board with 4 oz copper

Terry Zhu <[log in to unmask]>

Thu, 27 Feb 1997 20:33:02 -0800

77 lines

New Thread

<none>

Re: <none>

Ava Fung <[log in to unmask]>

12 Feb 97 18:15:36 PST

174 lines

New Thread

?

?

[log in to unmask]

Tue, 18 Feb 97 08:25:48 EST

58 lines

New Thread

A610

A610

Jack Ray <[log in to unmask]>

Sat, 01 Feb 1997 12:34:08 -0500

42 lines

Re: A610

David Bergman <[log in to unmask]>

Sat, 1 Feb 1997 13:05:36 -0600 (CST)

74 lines

New Thread

Address change

Address change

Tom Colton <[log in to unmask]>

Mon, 10 Feb 1997 15:12:10 -0500

50 lines

New Thread

ADMIN

ADMIN

[log in to unmask]

Tue, 11 Feb 1997 12:59:55 +0000

51 lines

New Thread

Admin: Is the Net dead today?

Admin: Is the Net dead today?

[log in to unmask]

Tue, 18 Feb 1997 10:07:53 -0600

45 lines

New Thread

ADMIN: Job Posting

Re: ADMIN: Job Posting

[log in to unmask]

Thu, 13 Feb 1997 07:28:55 -0500

46 lines

New Thread

ADMIN: Job Posting Gone??

Re: ADMIN: Job Posting Gone??

James C. Patten <[log in to unmask]>

Wed, 12 Feb 97 09:18:41 PST

37 lines

ADMIN: Job Posting Gone??

George Franck <george@[11.1.1.33]>

Tue, 11 Feb 1997 14:20:07 -0500

192 lines

New Thread

ADMIN: Job Postings on TechNet

ADMIN: Job Postings on TechNet

[log in to unmask]

Wed, 12 Feb 1997 17:01:38 -0600 (CST)

148 lines

Re: ADMIN: Job Postings on TechNet

ddhillma <[log in to unmask]>

Fri, 14 Feb 97 13:43:52 cst

181 lines

New Thread

ADMIN: Job Postings on TechNet -Reply

Re: ADMIN: Job Postings on TechNet -Reply

Dan Lorinser <[log in to unmask]>

Mon, 17 Feb 1997 07:59:58 -0600

173 lines

New Thread

ADMIN: Mail Storm

ADMIN: Mail Storm

Dmitriy Sklyar <[log in to unmask]>

Mon, 24 Feb 1997 14:29:31 -0600 (CST)

77 lines

ADMIN: Mail Storm

Dmitriy Sklyar <[log in to unmask]>

Tue, 25 Feb 1997 11:07:01 -0600 (CST)

76 lines

Re: ADMIN: Mail Storm

[log in to unmask]

Wed, 26 Feb 1997 07:04:13 -0500

47 lines

New Thread

ADMIN: Message size limit

ADMIN: Message size limit

[log in to unmask]

Mon, 3 Feb 1997 11:40:35 -0600 (CST)

69 lines

New Thread

ADMIN: Re: Open position

ADMIN: Re: Open position

Dmitriy Sklyar <[log in to unmask]>

Tue, 11 Feb 1997 10:32:39 -0600 (CST)

112 lines

Re: ADMIN: Re: Open position

Bilal Khalaf <[log in to unmask]>

Tue, 11 Feb 97 11:18:00 PST

168 lines

RE: ADMIN: Re: Open position

Ed Cosper <[log in to unmask]>

Tue, 11 Feb 1997 15:44:18 -0600

169 lines

Re: ADMIN: Re: Open position

ddsulliv <[log in to unmask]>

Wed, 12 Feb 97 08:21:53 cst

193 lines

Re: ADMIN: Re: Open position

[log in to unmask]

Wed, 12 Feb 1997 10:09:47 -0500 (EST)

39 lines

Re: ADMIN: Re: Open position

[log in to unmask]

Wed, 12 Feb 1997 10:10:14 -0500 (EST)

43 lines

Re: ADMIN: Re: Open position

Darrell Bonzo <[log in to unmask]>

Wed, 12 Feb 97 9:11

77 lines

ADMIN: Re: Open position

Matt Mahlau <[log in to unmask]>

Wed, 12 Feb 1997 21:45:11 -0500

92 lines

Re[2]: ADMIN: Re: Open position

[log in to unmask]

Thu, 13 Feb 97 08:19:46 EST

221 lines

Re: ADMIN: Re: Open position

IAN MULCAHY <[log in to unmask]>

Mon, 17 Feb 1997 03:44:33 -0500

38 lines

New Thread

ADMIN: Request to Limit Submissions

ADMIN: Request to Limit Submissions

Melinda Robinson <[log in to unmask]>

Tue, 18 Feb 1997 10:48:37 -0600 (CST)

68 lines

New Thread

ADMIN: TechNet problem

ADMIN: TechNet problem

[log in to unmask]

Fri, 7 Feb 1997 11:39:41 -0600 (CST)

63 lines

New Thread

Alloy contamination

Re: Alloy contamination

Jack Crawford <[log in to unmask]>

Wed, 5 Feb 1997 13:54:39 -0500

81 lines

Re: Alloy contamination

Jack Crawford <[log in to unmask]>

Wed, 5 Feb 1997 18:18:10 -0500

136 lines

New Thread

Aluminum wire bond to silver component

Aluminum wire bond to silver component

Jay Kovacs <[log in to unmask]>

Tue, 18 Feb 1997 17:52:40 -0500

49 lines

Re: Aluminum wire bond to silver component

mrosenfi <[log in to unmask]>

Wed, 19 Feb 1997 16:55:27 -0500

76 lines

Re[2]: Aluminum wire bond to silver component

ddhillma <[log in to unmask]>

Thu, 20 Feb 97 11:44:05 cst

100 lines

Re[3]: Aluminum wire bond to silver component

mrosenfi <[log in to unmask]>

Thu, 20 Feb 1997 14:26:27 -0500

121 lines

New Thread

Amendment 1 to IPC-SM-782 Revision A

Amendment 1 to IPC-SM-782 Revision A

Lisa Williams <[log in to unmask]>

Thu, 6 Feb 1997 12:13:20 -0600 (CST)

60 lines

New Thread

Annular Ring

Annular Ring

Mirka Halas <[log in to unmask]>

Tue, 04 Feb 1997 18:00:23 -0500

58 lines

Annular Ring

Mirka Halas <[log in to unmask]>

Wed, 05 Feb 1997 09:41:50 -0500

57 lines

Annular Ring

Mirka Halas <[log in to unmask]>

Thu, 06 Feb 1997 09:59:30 -0500

57 lines

Re: Annular Ring

[log in to unmask]

Fri, 7 Feb 1997 12:23:24 -0500 (EST)

54 lines

Re: Annular Ring

Paul Gould <[log in to unmask]>

Sat, 8 Feb 1997 13:45:40 +0000

82 lines

Annular Ring

Rainer Taube <[log in to unmask]>

Sun, 09 Feb 1997 00:50:43 -0500

73 lines

New Thread

Antifoam and Black Hole

Antifoam and Black Hole

[log in to unmask]

Fri, 7 Feb 1997 16:46:05 -0500 (EST)

50 lines

Re: Antifoam and Black Hole

[log in to unmask]

Sun, 9 Feb 1997 12:01:58 -0500 (EST)

75 lines

New Thread

Aqueous LPI Masks And Compatibility With Electroless Ni/Au

Re:Aqueous LPI Masks And Compatibility With Electroless Ni/Au

[log in to unmask]

Thu, 20 Feb 1997 23:20:50 -0500 (EST)

77 lines

New Thread

Argentum

Argentum

[log in to unmask]

Wed, 19 Feb 97 7:41:37 CST

41 lines

New Thread

Article search

Article search

Locke, Doug <[log in to unmask]>

Thu, 06 Feb 97 13:09:00 PST

43 lines

New Thread

Asmbly - Properties Data

Asmbly - Properties Data

ddhillma <[log in to unmask]>

Fri, 21 Feb 97 09:53:58 cst

40 lines

Re: Asmbly - Properties Data

[log in to unmask]

Thu, 27 Feb 97 16:25:36 MDT

64 lines

New Thread

ASS: ISHM paper Electromigration vs. SIR

ASS: ISHM paper Electromigration vs. SIR

Nachbor, Suzanne (MN51) <[log in to unmask]>

Tue, 11 Feb 97 08:53:00 PST

41 lines

New Thread

ASSEM:Solder Balls

ASSEM:Solder Balls

James Edwards <[log in to unmask]>

Wed, 5 Feb 1997 14:46:22 -0500

51 lines

ASSEM:Solder balls

James Edwards <[log in to unmask]>

Wed, 5 Feb 1997 18:26:38 -0500

50 lines

New Thread

Assemblies, MIL/IPC Comparison

Re: Assemblies, MIL/IPC Comparison

John DeRusso <[log in to unmask]>

Sat, 15 Feb 1997 10:49:55 -0800

48 lines

New Thread

Assembly

Assembly

BLDG 3 OPS <"BLDG 3 OPS"@[log in to unmask]>

Wed, 12 Feb 1997 10:40:13 -0800

64 lines

Re: Assembly

[log in to unmask]

Fri, 14 Feb 1997 16:54:20 -0500

86 lines

RE: Assembly

Knowles, Ed (MSMAIL) <[log in to unmask]>

15 Feb 1997 06:29:42 -0700

168 lines

New Thread

ASSEMBLY - SOLDERLESS WRAP WIRING

ASSEMBLY - SOLDERLESS WRAP WIRING

Carty Lawson <[log in to unmask]>

Sat, 22 Feb 1997 07:46:14 -0400

50 lines

New Thread

Assembly ESD

Re: Assembly ESD

DAVY.J.G- <[log in to unmask]>

Mon, 3 Feb 1997 15:36:38 -0500

52 lines

New Thread

assly:baking of PBGAs

assly:baking of PBGAs

[log in to unmask]

28 Feb 97 15:03 GMT+0500

56 lines

New Thread

ASSM: Temperature-verified soldering irons

Re: ASSM: Temperature-verified soldering irons

DAVY.J.G- <[log in to unmask]>

Mon, 24 Feb 1997 12:30:59 -0500

93 lines

New Thread

ASSY

ASSY

Bob Mykich (PO1) <[log in to unmask]>

Fri, 14 Feb 1997 17:08:00 -0500

45 lines

New Thread

ASSY : cleanliness specification

ASSY : cleanliness specification

D. Terstegge <[log in to unmask]>

Wed, 05 Feb 1997 19:16:12 +0100

44 lines

RE: ASSY : cleanliness specification

Jack Crawford <[log in to unmask]>

Mon, 10 Feb 1997 11:44:00 -0500

88 lines

New Thread

ASSY QUESTION

RE: ASSY QUESTION

Eblin <[log in to unmask]>

Wed, 19 Feb 1997 13:01:30 -0600

40 lines

New Thread

Assy/Fab: Environmental stress screening

Re: Assy/Fab: Environmental stress screening

[log in to unmask] <[log in to unmask]>

Wed, 26 Feb 1997 22:36:33 -0800

49 lines

Re: Assy/Fab: Environmental stress screening

Bill Marsh <[log in to unmask]>

Wed, 26 Feb 1997 16:09:04 -0800 (PST)

82 lines

New Thread

ASSY/TEST- Salt Fog Test

ASSY/TEST- Salt Fog Test

Greg Bartlett <[log in to unmask]>

5 Feb 1997 09:30:28 -0500

51 lines

Re: ASSY/TEST- Salt Fog Test

[log in to unmask]

Wed, 5 Feb 1997 11:51:23 -0500 (EST)

39 lines

Re: ASSY/TEST- Salt Fog Test

Delsen Testing Laboratories <[log in to unmask]>

Wed, 05 Feb 1997 09:56:30 -0800

94 lines

Re: ASSY/TEST- Salt Fog Test

ddhillma <[log in to unmask]>

Wed, 05 Feb 97 13:18:53 cst

86 lines

New Thread

ASSY: BGA BALL ATTACHMENT

ASSY: BGA BALL ATTACHMENT

Jim Marsico 516-595-5879 <[log in to unmask]>

Wed, 05 Feb 1997 10:00:00 -0500 (EST)

60 lines

ASSY: BGA BALL ATTACHMENT

[log in to unmask]

5 Feb 1997 14:24:53 EST

39 lines

New Thread

Assy: contract manufacturing

Assy: contract manufacturing

[log in to unmask]

Wed, 5 Feb 97 16:33: 2 PST

47 lines

Assy: Contract Manufacturing

Bill Marsh <[log in to unmask]>

Wed, 5 Feb 1997 09:37:44 -0800 (PST)

41 lines

Re: Assy: contract manufacturing

[log in to unmask]

Wed, 5 Feb 1997 15:28:24 -0500 (EST)

35 lines

New Thread

ASSY: ITT Connector Crimp

ASSY: ITT Connector Crimp

[log in to unmask]

Wed, 12 Feb 1997 10:15:55 -0600

47 lines

New Thread

ASSY: Omegameter reading for RMA vs. WS flux.

ASSY: Omegameter reading for RMA vs. WS flux.

[log in to unmask]

Fri, 14 Feb 1997 15:09:12 -0600

53 lines

Re: ASSY: Omegameter reading for RMA vs. WS flux.

Leo P. Lambert <[log in to unmask]>

Sat, 15 Feb 1997 07:53:32 -0500 (EST)

103 lines

RE: ASSY: Omegameter reading for RMA vs. WS flux.

"esvax::mrgate::a1::kenyonwg"@[log in to unmask]

Sat, 15 Feb 97 20:12:21 EST

103 lines

Re: ASSY: Omegameter reading for RMA vs. WS flux.

[log in to unmask]

Mon, 17 Feb 1997 09:01:01 -0500 (EST)

114 lines

New Thread

ASSY: Problems with 50V ceramic capacitor at Wave Solder

Re: ASSY: Problems with 50V ceramic capacitor at Wave Solder

Aric Parr <[log in to unmask]>

04 Feb 97 07:40:41 -0500

109 lines

New Thread

ASSY: Problems with 50V ceramic capacitor at Wave Soldering

ASSY: Problems with 50V ceramic capacitor at Wave Soldering

Alain Mathieu <[log in to unmask]>

Mon, 03 Feb 1997 20:34:03 -0800

60 lines

RE: ASSY: Problems with 50V ceramic capacitor at Wave Soldering

Max Bernhardt <[log in to unmask]>

Tue, 4 Feb 1997 08:45:00 -0600

63 lines

RE: ASSY: Problems with 50V ceramic capacitor at Wave Soldering

Hanamann, Peter <[log in to unmask]>

Tue, 04 Feb 97 14:26:00 CST

88 lines

New Thread

Assy: Question

Assy: Question

Poh Kong Hui <[log in to unmask]>

Mon, 17 Feb 1997 22:23:01 +0800 (SST)

46 lines

RE: Assy: Question

Poh Kong Hui <[log in to unmask]>

Mon, 17 Feb 1997 23:22:10 +0800 (SST)

56 lines

Re: Assy: Question

ddsulliv <[log in to unmask]>

Mon, 17 Feb 97 09:35:12 cst

94 lines

Re: Assy: Question

Howard Feldmesser <[log in to unmask]>

Mon, 17 Feb 1997 10:47:03 -0500

51 lines

Re: Assy: Question

[log in to unmask]

Mon, 17 Feb 1997 11:42:50 -0500 (EST)

40 lines

Assy: Question

[log in to unmask]

Mon, 17 Feb 97 11:50:24 EST

36 lines

Assy: Question

Poh Kong Hui <[log in to unmask]>

Mon, 17 Feb 1997 22:23:01 +0800 (SST)

57 lines

RE: Assy: Question

"esvax::mrgate::a1::kenyonwg"@[log in to unmask]

Mon, 17 Feb 97 13:45:39 EST

39 lines

Re: Assy: Question

[log in to unmask]

Mon, 17 Feb 1997 11:48:47 -0600

106 lines

Re: Assy: Question

[log in to unmask]

Mon, 17 Feb 1997 15:04:14 -0500 (EST)

37 lines

Re: Assy: Question

ddhillma <[log in to unmask]>

Mon, 17 Feb 97 14:32:43 cst

90 lines

Re: Assy: Question

[log in to unmask] <[log in to unmask]>

Mon, 17 Feb 1997 20:51:05 -0800

62 lines

Re: Assy: Question

[log in to unmask]

Mon, 17 Feb 97 17:49:53

65 lines

Re: Assy: Question

Antoni Cherta <[log in to unmask]>

Wed, 19 Feb 1997 01:57:01 +0100

76 lines

Re: Assy: Question

Bob Laurenti <[log in to unmask]>

Wed, 19 Feb 1997 09:10:01 -0600

45 lines

New Thread

Assy: Question -Reply

Assy: Question -Reply

David Anderson <[log in to unmask]>

Mon, 17 Feb 1997 09:43:03 -0600

37 lines

New Thread

Assy: Question : Pb/Ag--- THANKS !!!

Assy: Question : Pb/Ag--- THANKS !!!

Poh Kong Hui <[log in to unmask]>

Tue, 18 Feb 1997 06:39:31 +0800 (SST)

40 lines

New Thread

ASSY: Re: Flexible Circuit Repair

ASSY: Re: Flexible Circuit Repair

Andrew P Magee <[log in to unmask]>

Wed, 05 Feb 1997 14:50:00 -0800

70 lines

ASSY: Re: Flexible Circuit Repair

Andrew P Magee <[log in to unmask]>

Thu, 06 Feb 1997 07:38:00 -0800

82 lines

New Thread

ASSY: Reliability, IPC Specs, IPC Task Groups

ASSY: Reliability, IPC Specs, IPC Task Groups

[log in to unmask]

Mon, 10 Feb 1997 12:46:32 -0500 (EST)

329 lines

Re: ASSY: Reliability, IPC Specs, IPC Task Groups

[log in to unmask]

Tue, 11 Feb 1997 10:46:44 -0500 (EST)

51 lines

Re[2]: ASSY: Reliability, IPC Specs, IPC Task Groups

mkwoka01 <[log in to unmask]>

Wed, 12 Feb 1997 09:56:05 -0500

118 lines

Re: ASSY: Reliability, IPC Specs, IPC Task Groups

[log in to unmask]

Wed, 12 Feb 1997 13:23:31 -0500 (EST)

35 lines

New Thread

ASSY: SOLDER ALLOYS AND BGAs

ASSY: SOLDER ALLOYS AND BGAs

Jim Marsico 516-595-5879 <[log in to unmask]>

Fri, 14 Feb 1997 07:19:00 -0500 (EST)

64 lines

Re: ASSY: SOLDER ALLOYS AND BGAs

ddhillma <[log in to unmask]>

Wed, 19 Feb 97 05:35:58 cst

88 lines

New Thread

ASSY: Solder Thieving for Components?

ASSY: Solder Thieving for Components?

TOM BRESNAN <[log in to unmask]>

Thu, 13 Feb 97 17:33:08 PST

54 lines

Re: ASSY: Solder Thieving for Components?

Gary Peterson <[log in to unmask]>

Mon, 17 Feb 1997 14:41:53 -0700

51 lines

New Thread

ASSY: Soldermask Encroachment

ASSY: Soldermask Encroachment

[log in to unmask]

Mon, 10 Feb 1997 09:05:18 -0500

43 lines

re: ASSY: Soldermask Encroachment

Rick Pfeiffer <[log in to unmask]>

Mon, 10 Feb 97 14:48:57 EST

76 lines

Re: ASSY: Soldermask Encroachment

David Hoover <[log in to unmask]>

Mon, 10 Feb 1997 22:28:17 -0800

63 lines

Re: ASSY: Soldermask Encroachment

[log in to unmask]

Tue, 11 Feb 1997 10:46:45 -0500 (EST)

37 lines

Re: ASSY: Soldermask Encroachment

[log in to unmask]

Tue, 11 Feb 1997 23:58:57 -0500 (EST)

57 lines

New Thread

ASSY: SR Conformal Coating in Mfg Area

ASSY: SR Conformal Coating in Mfg Area

Jack Crawford <[log in to unmask]>

Wed, 5 Feb 1997 18:13:23 -0500

60 lines

ASSY: SR Conformal Coating in Mfg Area

Jack Crawford <[log in to unmask]>

Tue, 11 Feb 1997 16:10:25 -0500

63 lines

Re: ASSY: SR Conformal Coating in Mfg Area

Jeffery L. Hempton <[log in to unmask]>

Mon, 17 Feb 1997 07:15:43 -0500

92 lines

RE: ASSY: SR Conformal Coating in Mfg Area

Art Perez <[log in to unmask]>

Tue, 18 Feb 1997 11:08:00 -0600

112 lines

RE: ASSY: SR Conformal Coating in Mfg Area

DAVY.J.G- <[log in to unmask]>

Thu, 20 Feb 1997 11:04:15 -0500

78 lines

New Thread

ASSY: Tack time of paste vs humidity

ASSY: Tack time of paste vs humidity

Steve Quinn <[log in to unmask]>

Wed, 19 Feb 1997 11:08:01 -0600 (CST)

50 lines

re: ASSY: Tack time of paste vs humidity

[log in to unmask]

21 FEB 97 14:08:03 EST

82 lines

New Thread

ASSY: THERMAL ADHESIVE

ASSY: THERMAL ADHESIVE

Jim Marsico 516-595-5879 <[log in to unmask]>

Mon, 03 Feb 1997 13:05:00 -0500 (EST)

68 lines

Re: ASSY: THERMAL ADHESIVE

[log in to unmask]

Tue, 4 Feb 1997 05:49:47 -0500

87 lines

New Thread

ASSY: TQFP Standard unit

ASSY: TQFP Standard unit

Siegfried Quemado <[log in to unmask]>

Thu, 20 Feb 97 18:09:00 PST

39 lines

ASSY: TQFP Standard unit

Siegfried Quemado <[log in to unmask]>

Thu, 27 Feb 97 15:35:00 PST

42 lines

New Thread

Assy: Water Based VOC Flux

Assy: Water Based VOC Flux

Hollandsworth, Ron <[log in to unmask]>

Wed, 19 Feb 97 11:29:19 EST

55 lines

Re: Assy: Water Based VOC Flux

ddhillma <[log in to unmask]>

Fri, 21 Feb 97 05:38:37 cst

97 lines

New Thread

Assy: Wavesoldering thick boards

Assy: Wavesoldering thick boards

[log in to unmask]

Thu, 13 Feb 97 18:52:41 PST

51 lines

New Thread

Assy:Burn-In/ESS

Assy:Burn-In/ESS

[log in to unmask]

Tue, 25 Feb 97 13:36:51 EST

75 lines

Re: Assy:Burn-In/ESS

Bill Marsh <[log in to unmask]>

Tue, 25 Feb 1997 17:04:52 -0800 (PST)

98 lines

New Thread

ASSY:ESD seat covers

ASSY:ESD seat covers

Jeffery L. Hempton <[log in to unmask]>

Tue, 04 Feb 1997 12:49:43 -0500

52 lines

New Thread

Assy:ICT testing

Assy:ICT testing

Johannes Sivula <[log in to unmask]>

Thu, 20 Feb 1997 17:11:35 +0300

65 lines

New Thread

Assy:LCC height control

Assy:LCC height control

[log in to unmask]

Wed, 5 Feb 1997 10:20:51 +0000

59 lines

Re: Assy:LCC height control

[log in to unmask]

Thu, 6 Feb 1997 07:26:44 -0500 (EST)

44 lines

Re: Assy:LCC height control

Mark W. Spitnale <[log in to unmask]>

Fri, 07 Feb 1997 11:08:04 -0500

123 lines

New Thread

ASSY:SMD panelization

ASSY:SMD panelization

Jeffery L. Hempton <[log in to unmask]>

Thu, 13 Feb 1997 16:46:33 -0500

71 lines

New Thread

ASY: Alloy contamination

ASY: Alloy contamination

[log in to unmask]

Wed, 5 Feb 1997 07:08:08 -0600

54 lines

Re: ASY: Alloy contamination

ddhillma <[log in to unmask]>

Wed, 05 Feb 97 11:56:20 cst

94 lines

RE: ASY: Alloy contamination

DAVY.J.G- <[log in to unmask]>

Wed, 5 Feb 1997 13:37:59 -0500

62 lines

Re: ASY: Alloy contamination

[log in to unmask]

Fri, 7 Feb 1997 12:23:07 -0500 (EST)

57 lines

New Thread

backplane exposure

backplane exposure

S D T <[log in to unmask]>

Thu, 06 Feb 1997 12:32:34 EST

41 lines

Re: backplane exposure

ddsulliv <[log in to unmask]>

Fri, 07 Feb 97 08:02:35 cst

101 lines

Re: backplane exposure

Bert Ohlig <[log in to unmask]>

Sat, 15 Feb 97 12:04:42 UT

61 lines

New Thread

BBIT

BBIT

Paula Ryan <[log in to unmask]>

Tue, 11 Feb 97 12:39:21 EST

39 lines

New Thread

Benchmarking PCB Industry

Benchmarking PCB Industry

CHANDRA SANJAY <[log in to unmask]>

Mon, 10 Feb 1997 17:20:07 -0600 (CST)

139 lines

New Thread

Benchmarking PCB Industry (fwd)[3~

Benchmarking PCB Industry (fwd)[3~

CHANDRA SANJAY <[log in to unmask]>

Wed, 5 Feb 1997 15:39:40 -0600 (CST)

143 lines

New Thread

BGA Conference Call for Papers

BGA Conference Call for Papers

John Riley <[log in to unmask]>

Fri, 28 Feb 1997 12:00:16 -0600 (CST)

90 lines

New Thread

Biferuated terminals

Biferuated terminals

Donald Monahan <[log in to unmask]>

Thu, 13 Feb 1997 19:19:01 -0500

41 lines

Re: Biferuated terminals

[log in to unmask]

Tue, 18 Feb 97 17:19:37 PST

64 lines

New Thread

Black Hole and developer antifoam

Black Hole and developer antifoam

[log in to unmask]

Sat, 8 Feb 1997 00:03:41 -0500 (EST)

51 lines

New Thread

Blind vias & fine lines

Blind vias & fine lines

[log in to unmask] <[log in to unmask]>

Tue, 11 Feb 1997 22:41:54 -0800

52 lines

Re: Blind vias & fine lines

Luis Rivera <[log in to unmask]>

Fri, 14 Feb 1997 13:55:02 -0600 CDT

87 lines

Re: Blind vias & fine lines

[log in to unmask]

Mon, 17 Feb 97 16:48:22 EST

72 lines

Re: Blind vias & fine lines

Motoyo Wajima <[log in to unmask]>

Tue, 18 Feb 1997 15:29:03 +0900

100 lines

Re: Blind vias & fine lines

Motoyo Wajima <[log in to unmask]>

Wed, 19 Feb 1997 13:47:10 +0900

101 lines

Re: Blind vias & fine lines

[log in to unmask]

Fri, 21 Feb 1997 20:04:16 -0600

151 lines

Re: Blind vias & fine lines

[log in to unmask]

Fri, 21 Feb 1997 20:04:16 -0600

156 lines

Re: Blind vias & fine lines

[log in to unmask]

Wed, 26 Feb 1997 10:49:12 -0500 (EST)

49 lines

New Thread

Blind vias & fineline

RE:Blind vias & fineline

[log in to unmask]

Fri, 14 Feb 1997 09:24:29 EST

55 lines

New Thread

Boards with electroless Ni Au and Electroplated gold

Boards with electroless Ni Au and Electroplated gold

indal <[log in to unmask]>

Mon, 3 Feb 1997 09:22:01 +0500

44 lines

New Thread

Built-up Up Multilayer

Built-up Up Multilayer

Bob Sheldon <[log in to unmask]>

Fri, 07 Feb 1997 03:32:54 GMT

39 lines

Re:Built-up Up Multilayer

Lindgren Mats <[log in to unmask]>

Fri, 7 Feb 1997 08:52:00 +0100

55 lines

RE: Built-up Up Multilayer

Thomas, Kevin <[log in to unmask]>

Fri, 7 Feb 1997 08:33:00 -0700

79 lines

RE: Built-up Up Multilayer

Dwight Mattix <[log in to unmask]>

Fri, 7 Feb 1997 10:48:44 -0800 (PST)

44 lines

RE: Built-up Up Multilayer

Thomas, Kevin <[log in to unmask]>

Mon, 10 Feb 1997 13:33:00 -0700

70 lines

New Thread

carbon ink inspection

carbon ink inspection

Todd Rogers <[log in to unmask]>

Thu, 20 Feb 1997 12:55:32 -0600

46 lines

New Thread

Carl Tautscher Number

Carl Tautscher Number

Kenny Bloomquist <[log in to unmask]>

Thu, 13 Feb 1997 07:19:26 -0800

45 lines

RE: Carl Tautscher Number

"esvax::mrgate::a1::kenyonwg"@[log in to unmask]

Fri, 14 Feb 97 14:55:35 EST

57 lines

New Thread

Chip Scale package availability

Re: Chip Scale package availability

Jack Crawford <[log in to unmask]>

Mon, 10 Feb 1997 09:44:06 -0500

90 lines

New Thread

Chip scale packaging

Chip scale packaging

Werner Wiemers <[log in to unmask]>

Mon, 03 Feb 1997 12:00:46 -0800

64 lines

Re: Chip scale packaging

Lindgren Mats <[log in to unmask]>

Mon, 3 Feb 1997 15:01:00 +0100

43 lines

Re: Chip scale packaging

Marshall Andrews <[log in to unmask]>

Mon, 03 Feb 1997 11:25:26 -0600

79 lines

New Thread

Circuit Board/Poly-Circuits - Laser cutting

Circuit Board/Poly-Circuits - Laser cutting

[log in to unmask]

Wed, 19 Feb 1997 09:02:17 -0800

47 lines

New Thread

Circuits Assembly - NAFTA

Circuits Assembly - NAFTA

[log in to unmask]

Fri, 14 Feb 1997 15:23:47 -0500

39 lines

Circuits Assembly - NAFTA

[log in to unmask]

Fri, 14 Feb 1997 22:00:45 -0500

36 lines

New Thread

Coating over fine-pitch SMD parts

Coating over fine-pitch SMD parts

W. Scott Gaskins <[log in to unmask]>

Thu, 20 Feb 1997 09:49:40 -0500

63 lines

Re: Coating over fine-pitch SMD parts

Jerry Cupples <[log in to unmask]>

Thu, 20 Feb 1997 16:45:32 -0600

78 lines

Re: Coating over fine-pitch SMD parts

W. Scott Gaskins <[log in to unmask]>

Thu, 20 Feb 1997 17:54:52 -0500

105 lines

Re: Coating over fine-pitch SMD parts

Brian Hyde <[log in to unmask]>

Fri, 21 Feb 1997 16:12:50 -0500

81 lines

New Thread

COB, TAB, and CSP...

COB, TAB, and CSP...

Lang, Michael <[log in to unmask]>

Fri, 07 Feb 97 08:44:00 E

59 lines

Re: COB, TAB, and CSP...

Phil Yates <[log in to unmask]>

Mon, 10 Feb 1997 12:34:25 -0600

99 lines

New Thread

Collimation or not?

Collimation or not?

[log in to unmask]

Thu, 20 Feb 1997 03:47:15 EST

57 lines

Re: Collimation or not?

[log in to unmask]

Thu, 20 Feb 97 08:06:13 PST

91 lines

Re: Collimation or not?

Bob Mesick <[log in to unmask]>

Thu, 20 Feb 1997 15:11:19 -0800 (PST)

112 lines

Re: Collimation or not?

Bob Mesick <[log in to unmask]>

Thu, 20 Feb 1997 15:46:40 -0800 (PST)

112 lines

RE: Collimation or not?

Bert Ohlig <[log in to unmask]>

Mon, 24 Feb 97 03:04:36 UT

119 lines

RE: Collimation or not?

Bert Ohlig <[log in to unmask]>

Mon, 24 Feb 97 03:04:36 UT

119 lines

New Thread

component identification

component identification

[log in to unmask]

Thu, 27 Feb 1997 15:33:45 -0500

44 lines

RE: component identification

Max Bernhardt <[log in to unmask]>

Fri, 28 Feb 1997 07:56:00 -0600

88 lines

New Thread

Conf Coating Compatibility

Conf Coating Compatibility

[log in to unmask]

Sun, 2 Feb 1997 19:08:56 -0500 (EST)

52 lines

New Thread

Conf Coating Compatibility -Reply

Conf Coating Compatibility -Reply

Bob Metcalf <[log in to unmask]>

Mon, 03 Feb 1997 22:18:37 -0800

87 lines

Conf Coating Compatibility -Reply

Curtis Lustig <[log in to unmask]>

Wed, 05 Feb 1997 09:23:30 -0800

59 lines

New Thread

Connector Placement

Re: Connector Placement

Jim Zanolli <[log in to unmask]>

Fri, 07 Feb 1997 14:14:07 -0500

42 lines

New Thread

Controlled Impedance

Controlled Impedance

Timothy Gaylor <[log in to unmask]>

Tue, 18 Feb 1997 17:28:15 -0500

47 lines

New Thread

CONVECTION REFLOW PROFILES?

CONVECTION REFLOW PROFILES?

Lolmaugh, Scott <[log in to unmask]>

03 Feb 1997 12:04:28 -0600

78 lines

Re: CONVECTION REFLOW PROFILES?

[log in to unmask]

Tue, 4 Feb 1997 05:24:02 -0500 (EST)

46 lines

New Thread

Copper Plating

Copper Plating

[log in to unmask]

Fri, 7 Feb 1997 18:09:46 -0500

44 lines

Re: Copper Plating

David Arivett <[log in to unmask]>

Sat, 8 Feb 1997 12:19:52 -0600 (CST)

91 lines

Re: Copper Plating

[log in to unmask]

Sat, 8 Feb 1997 13:36:40 -0500 (EST)

40 lines

New Thread

Correction RE: RUSCON Russian PCB Conference

Correction RE: RUSCON Russian PCB Conference

Joseph Fjelstad <[log in to unmask]>

Mon, 3 Feb 1997 02:13:54 -0800

59 lines

New Thread

corrosion

corrosion

[log in to unmask]

Mon, 24 Feb 97 16:51:21 +0100

71 lines

corrosion

[log in to unmask]

Thu, 27 Feb 97 13:50:36 +0100

90 lines

Re: corrosion

Andrew P Magee <[log in to unmask]>

Thu, 27 Feb 1997 10:24:00 -0800

186 lines

Corrosion

[log in to unmask]

Thu, 27 Feb 97 17:19:00 CST

41 lines

Re: corrosion

Don Vischulis <[log in to unmask]>

Thu, 27 Feb 1997 19:02:02 -0600

89 lines

corrosion

Andrew P Magee <[log in to unmask]>

Thu, 27 Feb 1997 17:15:00 -0800

198 lines

Re: corrosion

[log in to unmask]

Fri, 28 Feb 1997 09:16:43 -0500 (EST)

50 lines

New Thread

CRES303

CRES303

[log in to unmask]

Thu, 20 Feb 97 8:44:08 PST

51 lines

New Thread

Crosstalk calculations

Re: Crosstalk calculations

john balchunas <[log in to unmask]>

Fri, 28 Feb 1997 00:04:20 -0500 (EST)

106 lines

New Thread

current in screened silver circuits

Re: current in screened silver circuits

Andrew P Magee <[log in to unmask]>

Tue, 04 Feb 1997 09:14:00 -0800

265 lines

New Thread

Current Job Listings

Re: Current Job Listings

[log in to unmask]

Thu, 13 Feb 1997 23:14:39 -0500 (EST)

44 lines

Re: Current Job Listings

Harold Downing <[log in to unmask]>

Fri, 14 Feb 1997 13:49:49 -0600

83 lines

New Thread

Defective PWB at customer's facility

Defective PWB at customer's facility

[log in to unmask]

Wed, 26 Feb 1997 14:29:06 -0600

53 lines

re: Defective PWB at customer's facility

Vernon Pursley <[log in to unmask]>

Wed, 26 Feb 97 14:56:24 PST

97 lines

Re: Defective PWB at customer's facility

[log in to unmask]

Thu, 27 Feb 97 09:57:14 PST

73 lines

Re: Defective PWB at customer's facility

Dwight Mattix <[log in to unmask]>

Thu, 27 Feb 1997 15:31:00 -0800 (PST)

82 lines

New Thread

DES/FAB Controlled Impedance info request

DES/FAB Controlled Impedance info request

[log in to unmask]

Tue, 11 Feb 97 14:27:04 EST

59 lines

New Thread

DES/FAB Moisture and Fungus Testing

DES/FAB Moisture and Fungus Testing

David Hoover <[log in to unmask]>

Wed, 26 Feb 1997 19:32:58 -0800

84 lines

Re: DES/FAB Moisture and Fungus Testing

Doug McKean <[log in to unmask]>

Thu, 27 Feb 1997 08:54:54 -0500

69 lines

Re: DES/FAB Moisture and Fungus Testing

Pratap Singh <[log in to unmask]>

Thu, 27 Feb 1997 08:56:15 -0800

57 lines

New Thread

DES/FAB: Moisture & Fungus testing

RE: DES/FAB: Moisture & Fungus testing

Sheila Smith <[log in to unmask]>

Thu, 27 Feb 1997 08:46:57 -0500 (EST)

56 lines

New Thread

DES: ASSY: Chip Scale package availability

DES: ASSY: Chip Scale package availability

Gary Peterson <[log in to unmask]>

Fri, 7 Feb 1997 13:02:51 -0700

54 lines

New Thread

Des: BGAs

Des: BGAs

Glynn Shaw <[log in to unmask]>

Tue, 4 Feb 1997 09:29:53 -0800

58 lines

Re: Des: BGAs

Lisa Williams <[log in to unmask]>

Tue, 4 Feb 1997 16:38:46 -0600 (CST)

91 lines

New Thread

DES: Crosstalk calculations

DES: Crosstalk calculations

Mitch Morey <[log in to unmask]>

Wed, 26 Feb 1997 07:40:09 -0800

93 lines

Re: DES: Crosstalk calculations

Doug McKean <[log in to unmask]>

Wed, 26 Feb 1997 15:17:27 -0500

82 lines

Re: DES: Crosstalk calculations

David Hoover <[log in to unmask]>

Wed, 26 Feb 1997 19:31:40 -0800

255 lines

Re: DES: Crosstalk calculations

David Hoover <[log in to unmask]>

Wed, 26 Feb 1997 19:31:40 -0800

255 lines

New Thread

DES: Cu fills on circuit layers

DES: Cu fills on circuit layers

Ty Thomas <[log in to unmask]>

Wed, 05 Feb 1997 05:57:39 -0500

68 lines

New Thread

DES: Cu fills on circuit layers -Reply

DES: Cu fills on circuit layers -Reply

Dan Lorinser <[log in to unmask]>

Wed, 05 Feb 1997 06:48:15 -0600

86 lines

New Thread

Des: Induced Current

Des: Induced Current

Frederick A Martin <[log in to unmask]>

18 Feb 97 12:58:10 EST

41 lines

Re: Des: Induced Current

Doug McKean <[log in to unmask]>

Thu, 20 Feb 1997 13:58:50 -0500

68 lines

Re: Des: Induced Current

Ralph Hersey <[log in to unmask]>

Fri, 21 Feb 1997 07:16:14 -0800

159 lines

New Thread

Des: Jumpers per IPC-A-610

Des: Jumpers per IPC-A-610

Don Browne <[log in to unmask]>

17 Feb 1997 08:46:40 -0500

61 lines

New Thread

Des: Via Hole and Pad size.

Des: Via Hole and Pad size.

George Franck Jr <[log in to unmask]>

Wed, 5 Feb 1997 09:51:00 -0500

67 lines

Re: Des: Via Hole and Pad size.

[log in to unmask]

Wed, 05 Feb 97 13:55:37 EST

92 lines

Re: Des: Via Hole and Pad size.

David Hoover <[log in to unmask]>

Thu, 06 Feb 1997 06:52:55 -0800

87 lines

Re: Des: Via Hole and Pad size.

David Hoover <[log in to unmask]>

Thu, 06 Feb 1997 06:52:43 -0800

87 lines

New Thread

Des: Via Hole and Pad size. -Reply

Des: Via Hole and Pad size. -Reply

Dan Lorinser <[log in to unmask]>

Fri, 07 Feb 1997 07:28:50 -0600

54 lines

New Thread

Design (bonding diagram editor for BGA pkgs.)

Design (bonding diagram editor for BGA pkgs.)

Chris Whitley <[log in to unmask]>

Tue, 4 Feb 1997 13:33:09 -0700 (MST)

53 lines

Re: Design (bonding diagram editor for BGA pkgs.)

Joseph Fjelstad <[log in to unmask]>

Tue, 4 Feb 1997 04:27:03 -0800

98 lines

New Thread

Design Standards for BGA -Forwarded

Re: Design Standards for BGA -Forwarded

MIKE J. LOPEZ <[log in to unmask]>

Fri, 07 Feb 1997 06:54:20 -0500

96 lines

New Thread

Design-Rules Requirements for BGA PCB's

Design-Rules Requirements for BGA PCB's

[log in to unmask]

Thu, 6 Feb 97 12:03:17 PST

55 lines

Design-Rules Requirements for BGA PCB's

[log in to unmask]

Fri, 7 Feb 97 12:03:36 PST

60 lines

Design-Rules Requirements for BGA PCB's

[log in to unmask]

Fri, 7 Feb 97 12:50:40 PST

64 lines

New Thread

DESIGN: Aspect Ratio versus Material choice

DESIGN: Aspect Ratio versus Material choice

Edwards, Ted A (AZ75) <[log in to unmask]>

19 Feb 1997 14:11:00 -0600

61 lines

Re: DESIGN: Aspect Ratio versus Material choice

joef <[log in to unmask]>

Thu, 20 Feb 97 12:02:58 EST

85 lines

Re: DESIGN: Aspect Ratio versus Material choice

[log in to unmask]

Thu, 20 Feb 1997 12:45:45 -0500 (EST)

83 lines

Re: DESIGN: Aspect Ratio versus Material choice

Pratap Singh <[log in to unmask]>

Thu, 20 Feb 1997 19:52:07 -0800

76 lines

New Thread

DESIGN:Simulated twisted pair

DESIGN:Simulated twisted pair

Jack Holm <[log in to unmask]>

Sat, 22 Feb 97 9:40:34 EST

86 lines

New Thread

Discoloration in solder plating

Discoloration in solder plating

Mohd Misri-RSB019 <[log in to unmask]>

Fri, 14 Feb 1997 8:30:00 +0800

80 lines

Re: Discoloration in solder plating

[log in to unmask]

Sun, 16 Feb 1997 10:00:51 -0500 (EST)

38 lines

Re[2]: Discoloration in solder plating

Mohd Misri-RSB019 <[log in to unmask]>

Mon, 17 Feb 1997 8:34:00 +0800

60 lines

Re: Discoloration in solder plating

[log in to unmask]

Sun, 16 Feb 1997 22:09:27 -0500 (EST)

62 lines

New Thread

drill and image files format

drill and image files format

[log in to unmask]

Tue, 4 Feb 1997 22:56:29 +0100

44 lines

New Thread

Drilling

Drilling

drilbert <[log in to unmask]>

Wed, 26 Feb 1997 20:39:38 -0800

42 lines

New Thread

Drilling Heads

Drilling Heads

[log in to unmask]

Thu, 20 Feb 1997 10:09:04 +0200 (IST)

43 lines

New Thread

Dross reducer (Kleenox)

Dross reducer (Kleenox)

Long, Gregory <[log in to unmask]>

13 Feb 1997 16:21:11 -0600

53 lines

Re: Dross reducer (Kleenox)

Bob Willis <[log in to unmask]>

15 Feb 97 04:56:28 EST

52 lines

Re: Dross reducer (Kleenox)

ddhillma <[log in to unmask]>

Mon, 17 Feb 97 14:03:45 cst

72 lines

New Thread

Dry Film For Deep Gold Process

Dry Film For Deep Gold Process

Tony King <[log in to unmask]>

18 Feb 97 12:29:29 EST

76 lines

Re: Dry Film For Deep Gold Process

[log in to unmask]

Wed, 19 Feb 1997 10:32:59 -0500 (EST)

42 lines

Re: Dry Film For Deep Gold Process

[log in to unmask]

Thu, 20 Feb 1997 20:59:26 -0500 (EST)

39 lines

Re: Dry Film For Deep Gold Process

Michael Barmuta <[log in to unmask]>

Fri, 21 Feb 1997 15:39:30 -0800

94 lines

Re: Dry Film For Deep Gold Process

[log in to unmask]

Wed, 26 Feb 97 15:47:20 EST

118 lines

New Thread

Dry Film For Deep Gold Process -Reply

Dry Film For Deep Gold Process -Reply

Ken Bridges <[log in to unmask]>

Thu, 20 Feb 1997 10:36:23 -0800

107 lines

New Thread

electroless nickel finish

electroless nickel finish

[log in to unmask]

Wed, 19 Feb 1997 16:26:11 +0500

59 lines

Re: electroless nickel finish

Kyle Gulley <[log in to unmask]>

Wed, 19 Feb 97 14:30:22 PST

40 lines

Re: electroless nickel finish

John Grosso <[log in to unmask]>

20 Feb 97 12:53:43

69 lines

Re[2]: electroless nickel finish

Michael Holan <[log in to unmask]>

Sat, 22 Feb 1997 06:33:41 -0600

104 lines

New Thread

Employment Advertising

Employment Advertising

Lynch, Lyn <[log in to unmask]>

Wed, 12 Feb 97 06:42:32

47 lines

Re: Employment Advertising

Fred Paul <[log in to unmask]>

Wed, 12 Feb 1997 11:18:02 -0800

72 lines

New Thread

Enough Already !!!

Enough Already !!!

Kasprzak, Bill (esd) US <[log in to unmask]>

Wed, 19 Feb 97 07:58:00 PST

55 lines

New Thread

equipment queries

equipment queries

[log in to unmask]

Fri, 14 Feb 1997 10:13:48 -0500 (EST)

43 lines

New Thread

ESD

ESD

Benedict, Heather <[log in to unmask]>

Fri, 07 Feb 97 16:35:00 CST

38 lines

Re: ESD

[log in to unmask]

Mon, 10 Feb 1997 12:48:00 -0500 (EST)

49 lines

New Thread

ESD Replies

ESD Replies

ddhillma <[log in to unmask]>

Wed, 05 Feb 97 06:12:24 cst

43 lines

New Thread

European Joint Conference Call for Papers

European Joint Conference Call for Papers

David Bergman <[log in to unmask]>

Wed, 5 Feb 1997 18:11:25 -0600 (CST)

233 lines

New Thread

Fab - Line Width Measurment

Fab - Line Width Measurment

Doug Jeffery <[log in to unmask]>

Fri, 28 Feb 1997 05:46:52 -0600 (CST)

43 lines

New Thread

FAB / Waste Reuse

FAB / Waste Reuse

[log in to unmask]

Sat, 15 Feb 1997 17:51:52 -0500

53 lines

Re: FAB / Waste Reuse

[log in to unmask]

Mon, 17 Feb 1997 09:19:34 +0000

92 lines

Re: FAB / Waste Reuse

[log in to unmask]

Mon, 17 Feb 1997 17:27:11 -0500

58 lines

New Thread

FAB and ASSEM

FAB and ASSEM

[log in to unmask]

Fri, 28 Feb 97 15:37:39 PST

57 lines

New Thread

Fab Oxide treatment

Fab Oxide treatment

Scott B. Westheimer <[log in to unmask]>

Wed, 5 Feb 1997 04:52:03 +0800

44 lines

RE: Fab Oxide treatment

Kuwako, Fujio(MMS) <[log in to unmask]>

Wed, 5 Feb 1997 12:48:04 +0900

64 lines

Re: Fab Oxide treatment

David Bergman <[log in to unmask]>

Wed, 5 Feb 1997 07:59:00 -0600 (CST)

76 lines

Re: Fab Oxide treatment

carl01 <[log in to unmask]>

Wed, 05 Feb 1997 22:15:36 +0800

59 lines

Re: Fab Oxide treatment

[log in to unmask]

Wed, 5 Feb 1997 10:12:32 -0600

101 lines

New Thread

FAB, soldermask lamination

FAB, soldermask lamination

[log in to unmask]

Thu, 20 Feb 97 10:06:40 EST

47 lines

Re: FAB, soldermask lamination

[log in to unmask]

Thu, 20 Feb 97 14:49:29 PST

80 lines

FAB, soldermask lamination

Lawrence R Blumberg (T/L 857-1368) <[log in to unmask]>

Fri, 21 Feb 97 17:45:44 EST

107 lines

Re: FAB, soldermask lamination

[log in to unmask]

Fri, 21 Feb 1997 16:23:58 -0500 (EST)

47 lines

New Thread

FAB, soldermask lamination -Reply

FAB, soldermask lamination -Reply

Bob Metcalf <[log in to unmask]>

Thu, 20 Feb 1997 11:12:05 -0800

93 lines

New Thread

Fab/Assy: Class3, 1/2 tented vias

Fab/Assy: Class3, 1/2 tented vias

Jeff Seeger <[log in to unmask]>

Tue, 25 Feb 1997 15:02:05 -0500

73 lines

RE: Fab/Assy: Class3, 1/2 tented vias

Wander, Nicholas G <[log in to unmask]>

Wed, 26 Feb 1997 10:15:59 -0500

106 lines

RE: Fab/Assy: Class3, 1/2 tented vias

Ed Cosper <[log in to unmask]>

Wed, 26 Feb 1997 17:04:57 -0600

118 lines

New Thread

FAB/DES: IPC-D-356

FAB/DES: IPC-D-356

Pete Court <[log in to unmask]>

Thu, 13 Feb 1997 16:24:26 +0000

52 lines

New Thread

FAB: 3 layer board with 4 oz copper

FAB: 3 layer board with 4 oz copper

sam mccorkel <[log in to unmask]>

Thu, 27 Feb 1997 14:42:46 -0500

41 lines

Re: FAB: 3 layer board with 4 oz copper

joef <[log in to unmask]>

Thu, 27 Feb 97 15:20:39 EST

73 lines

re: FAB: 3 layer board with 4 oz copper

Rick Haynes <[log in to unmask]>

Fri, 28 Feb 1997 12:55:22 -0800

177 lines

New Thread

FAB: Annular Ring

FAB: Annular Ring

R_R_HOLMES <[log in to unmask]>

Thu, 06 Feb 97 09:38:29 EST

75 lines

Re: FAB: Annular Ring

[log in to unmask]

Fri, 07 Feb 97 09:01:38 MST

95 lines

Re: FAB: Annular Ring

David Hoover <[log in to unmask]>

Fri, 07 Feb 1997 18:56:52 -0800

100 lines

New Thread

FAB: Annular Ring - Alternate Concern

FAB: Annular Ring - Alternate Concern

D. Rooke <[log in to unmask]>

Sat, 8 Feb 1997 14:49:53 -0500 (EST)

73 lines

Re: FAB: Annular Ring - Alternate Concern

[log in to unmask]

Sun, 9 Feb 1997 14:25:21 -0500 (EST)

52 lines

New Thread

FAB: DES: request for ball park costs & capabilities

FAB: DES: request for ball park costs & capabilities

Craig Williams @Telegen <[log in to unmask]>

Tue, 04 Feb 1997 09:09:58 -0800

92 lines

New Thread

Fab: DFM

Fab: DFM

Scott B. Westheimer <[log in to unmask]>

Tue, 4 Feb 1997 05:36:39 +0800

44 lines

Re: Fab: DFM

Pratap Singh <[log in to unmask]>

Tue, 04 Feb 1997 08:55:01 -0800

60 lines

Re: Fab: DFM

pcfab <[log in to unmask]>

Wed, 05 Feb 97 11:25:13 PST

64 lines

New Thread

FAB: Differential Impedance

FAB: Differential Impedance

John Parsons <[log in to unmask]>

Mon, 17 Feb 1997 13:41:56 -0800

46 lines

New Thread

FAB: Discoloration in solder plating

Re[2]: FAB: Discoloration in solder plating

Mohd Misri-RSB019 <[log in to unmask]>

Wed, 19 Feb 1997 19:03:00 +0800

101 lines

Re[3]: FAB: Discoloration in solder plating

ddhillma <[log in to unmask]>

Thu, 20 Feb 97 09:17:47 cst

133 lines

Re[2]: FAB: Discoloration in solder plating

Mohd Misri-RSB019 <[log in to unmask]>

Wed, 19 Feb 1997 19:03:00 +0800

124 lines

New Thread

FAB: Entek, other OSP's

FAB: Entek, other OSP's

Vera Payne <[log in to unmask]>

Mon, 17 Feb 1997 11:12:33 -0600

48 lines

New Thread

FAB: innerlayer core locating slot integrity

FAB: innerlayer core locating slot integrity

Jonathan Whitcomb <[log in to unmask]>

Wed, 19 Feb 97 17:11:42 EST

41 lines

New Thread

Fab: IPC-6012 Conformance Testing Frequency

Fab: IPC-6012 Conformance Testing Frequency

Nancy Nelson <[log in to unmask]>

24 Feb 97 17:17 CST

51 lines

New Thread

FAB: Liquid Photoresist

FAB: Liquid Photoresist

Karl Sauter <[log in to unmask]>

Tue, 18 Feb 1997 18:03:11 -0800

64 lines

Re: FAB: Liquid Photoresist

[log in to unmask]

Thu, 20 Feb 1997 17:12:03 -0500 (EST)

68 lines

New Thread

FAB: Liquid Photoresist -Reply

FAB: Liquid Photoresist -Reply

Ken Bridges <[log in to unmask]>

Thu, 20 Feb 1997 11:18:56 -0800

114 lines

Re: FAB: Liquid Photoresist -Reply

D. Rooke <[log in to unmask]>

Wed, 26 Feb 1997 20:14:52 -0500 (EST)

124 lines

Re: FAB: Liquid Photoresist -Reply

[log in to unmask]

Thu, 27 Feb 1997 09:58:55 -0500 (EST)

49 lines

New Thread

FAB: Palladium Plating

FAB: Palladium Plating

YAP CHOW LAN <[log in to unmask]>

Fri, 28 Feb 1997 13:19:12 +0800

45 lines

New Thread

FAB: planarity of pads for gold wire bond (PBGA)

FAB: planarity of pads for gold wire bond (PBGA)

Jonathan Whitcomb (757-1326) <[log in to unmask]>

Fri, 28 Feb 97 13:51:59 EST

44 lines

New Thread

FAB: Prototype Supplier Recommondation

FAB: Prototype Supplier Recommondation

Scott Miller <[log in to unmask]>

Sat, 22 Feb 1997 00:09:54 -0800

45 lines

Re: FAB: Prototype Supplier Recommondation

[log in to unmask]

Tue, 25 Feb 97 08:50:50 PST

63 lines

New Thread

FAB: Relia-via finish

FAB: Relia-via finish

Ed Cosper <[log in to unmask]>

Fri, 7 Feb 1997 16:01:46 -0600

40 lines

New Thread

Fab: Rivets

Fab: Rivets

Scott B. Westheimer <[log in to unmask]>

Sat, 1 Mar 1997 07:43:24 +0800

52 lines

New Thread

FAB: Searching for PC Based Visualisation of Gerber files in order to Quote

FAB: Searching for PC Based Visualisation of Gerber files in order to Quote

Roland Jaquet <[log in to unmask]>

Thu, 13 Feb 1997 13:42:30 +0100

50 lines

RE: FAB: Searching for PC Based Visualisation of Gerber files in order to Quote

[log in to unmask]

Fri, 14 Feb 97 08:30: 3 est

81 lines

Re: FAB: Searching for PC Based Visualisation of Gerber files in order to Quote

Wolfgang Schenke <[log in to unmask]>

Fri, 14 Feb 97 14:45 PST

63 lines

New Thread

FAB: Soldermask Encroachment

FAB: Soldermask Encroachment

[log in to unmask]

Wed, 12 Feb 1997 13:05:15 -0500

43 lines

Re: FAB: Soldermask Encroachment

Bob Willis <[log in to unmask]>

13 Feb 97 13:33:27 EST

45 lines

Re: FAB: Soldermask Encroachment

Leo P. Lambert <[log in to unmask]>

Sat, 15 Feb 1997 07:36:33 -0500 (EST)

91 lines

New Thread

FAB: We need a manufacturer for large size single sided PCBs

FAB: We need a manufacturer for large size single sided PCBs

Roland Jaquet <[log in to unmask]>

Wed, 26 Feb 1997 17:35:42 +0100

58 lines

New Thread

FAB:Blind vias & fine lines

Re: FAB:Blind vias & fine lines

David Hoover <[log in to unmask]>

Wed, 26 Feb 1997 19:33:20 -0800

187 lines

Re: FAB:Blind vias & fine lines

[log in to unmask]

Mon, 03 Mar 1997 10:21:16 -0800

170 lines

New Thread

FAB:Laser vias

FAB:Laser vias

David Arivett <[log in to unmask]>

Sat, 15 Feb 1997 13:54:12 -0600 (CST)

47 lines

RE: FAB:Laser vias

Kuwako, Fujio(MMS) <[log in to unmask]>

Mon, 17 Feb 1997 10:36:32 +0900

103 lines

RE: FAB:Laser vias

Thomas, Kevin <[log in to unmask]>

Mon, 17 Feb 1997 08:31:00 -0700

78 lines

RE: FAB:Laser vias

Thomas, Kevin <[log in to unmask]>

Mon, 17 Feb 1997 15:24:00 -0700

81 lines

Re[2]: FAB:Laser vias

mhu <[log in to unmask]>

Wed, 19 Feb 97 09:05:53 PST

103 lines

New Thread

FAB:Reliability test for via holes on BGA circuit

FAB:Reliability test for via holes on BGA circuit

[log in to unmask]

Fri, 14 Feb 1997 16:30:04 +0000

54 lines

New Thread

FAB:Roller swelling

FAB:Roller swelling

DAVID MANDER <[log in to unmask]>

Wed, 8 Jan 1997 15:10:52, -0500

45 lines

New Thread

FAB:Surface Preparation

FAB:Surface Preparation

[log in to unmask] <[log in to unmask]>

Wed, 19 Feb 1997 20:39:39 -0800

50 lines

New Thread

Fatigue Life of Solder Joints

Fatigue Life of Solder Joints

Hasan U. Akay <[log in to unmask]>

Mon, 03 Feb 1997 16:15:57 +0000

67 lines

Re: Fatigue Life of Solder Joints

[log in to unmask]

Tue, 4 Feb 1997 03:48:30 -0500 (EST)

78 lines

New Thread

Flex circuit boards

Flex circuit boards

[log in to unmask]

6 FEB 97 14:35:24 EST

42 lines

Re: Flex circuit boards

[log in to unmask]

Fri, 07 Feb 97 08:46:31 EST

67 lines

Re: Flex circuit boards

Jack Olson <[log in to unmask]>

Fri, 07 Feb 1997 08:16:06 -0800

48 lines

Re: Flex circuit boards

Don Vischulis <[log in to unmask]>

Fri, 07 Feb 1997 14:31:04 -0600

68 lines

Re: Flex circuit boards

[log in to unmask] <[log in to unmask]>

Mon, 10 Feb 1997 23:40:34 +0800

56 lines

New Thread

Flexible Circuit Repair

Flexible Circuit Repair

Tracey Spencer <[log in to unmask]>

Tue, 4 Feb 1997 14:52:50 -0500

38 lines

New Thread

flexing of backplanes when installing cards

flexing of backplanes when installing cards

James R Harbaugh <[log in to unmask]>

Thu, 27 Feb 97 14:59:35 -30000

40 lines

Re: flexing of backplanes when installing cards

[log in to unmask]

Thu, 27 Feb 1997 16:45:43 -0500 (EST)

51 lines

New Thread

FR-4 material movement

FR-4 material movement

sam mccorkel <[log in to unmask]>

Fri, 07 Feb 1997 10:25:09 -0500

53 lines

FR-4 material movement

sam mccorkel <[log in to unmask]>

Thu, 13 Feb 1997 11:10:17 -0500

62 lines

Re: FR-4 material movement

David Hoover <[log in to unmask]>

Fri, 14 Feb 1997 23:18:05 -0800

105 lines

Re: FR-4 material movement

[log in to unmask]

Tue, 18 Feb 97 08:16:46 PST

90 lines

New Thread

FR4 material

FR4 material

John Van Nierop <[log in to unmask]>

Thu, 20 Feb 1997 15:42:11 -0500

43 lines

Re: FR4 material

[log in to unmask]

Mon, 24 Feb 1997 10:17:03 -0500 (EST)

55 lines

Re: FR4 material

David Hoover <[log in to unmask]>

Mon, 24 Feb 1997 19:41:57 -0800

143 lines

New Thread

FW: Contracts for Turnkey Manufacturing

FW: Contracts for Turnkey Manufacturing

JIM ENNIS <[log in to unmask]>

Mon, 03 Mar 97 09:47:00 PST

75 lines

New Thread

FW: DESIGN: Aspect Ratio versus Material choice

FW: DESIGN: Aspect Ratio versus Material choice

Gagnon, Gerry <[log in to unmask]>

Thu, 20 Feb 1997 09:48:48 -0500

98 lines

New Thread

FW: Entek, other OSP's

FW: Entek, other OSP's

Vera Payne <[log in to unmask]>

Wed, 19 Feb 1997 13:16:15 -0600

56 lines

New Thread

FW: FR-4 material movement

FW: FR-4 material movement

Ed Cosper <[log in to unmask]>

Fri, 7 Feb 1997 15:44:06 -0600

103 lines

New Thread

FW: Notification: Inbound Mail Failure - Message could not be processed

FW: Notification: Inbound Mail Failure - Message could not be processed

Buxton, Jeff (AZ75) <[log in to unmask]>

19 Feb 1997 10:52:50 -0600

189 lines

New Thread

FW: Training

FW: Training

MASTORIDES, John <[log in to unmask]>

Mon, 10 Feb 97 10:03 EST

76 lines

New Thread

Fwd: ASTM Individual Standard Search Form

Fwd: ASTM Individual Standard Search Form

[log in to unmask]

Sat, 15 Feb 1997 08:39:31 -0500

79 lines

New Thread

Gen.:Reliability of TSOP solder joints

Gen.:Reliability of TSOP solder joints

Guenter Grossmann <[log in to unmask]>

Wed, 19 Feb 1997 15:12:09 +0100

44 lines

Re: Gen.:Reliability of TSOP solder joints

[log in to unmask]

Thu, 20 Feb 1997 12:45:48 -0500 (EST)

45 lines

New Thread

GEN:

GEN:

MARTIN A. PETERSEN <"[log in to unmask]"@[log in to unmask]>

Mon, 17 Feb 1997 21:07:26 -0600

41 lines

New Thread

GEN: ADHESIVE SUPPLIER

GEN: ADHESIVE SUPPLIER

Jim Marsico 516-595-5879 <[log in to unmask]>

Thu, 06 Feb 1997 13:24:00 -0500 (EST)

61 lines

Re: GEN: ADHESIVE SUPPLIER

[log in to unmask]

Fri, 7 Feb 1997 08:50:45 -0500

79 lines

New Thread

GEN: Cyclic Voltammetry

GEN: Cyclic Voltammetry

[log in to unmask]

Mon, 10 Feb 1997 06:59:10 -0500

44 lines

New Thread

GEN: Digest

GEN: Digest

Paula Ryan <[log in to unmask]>

Mon, 17 Feb 97 10:47:05 EST

46 lines

Re: GEN: Digest

Dmitriy Sklyar <[log in to unmask]>

Tue, 18 Feb 1997 10:48:15 -0600 (CST)

85 lines

Re: GEN: Digest

[log in to unmask]

Fri, 21 Feb 1997 20:20:42 -0600

103 lines

RE: GEN: Digest

Ed Cosper <[log in to unmask]>

Mon, 24 Feb 1997 17:34:18 -0600

164 lines

Re: GEN: Digest

[log in to unmask]

Mon, 24 Feb 97 15:38:09 -0800

415 lines

New Thread

GEN: Job + Label + Gerber Viewer

GEN: Job + Label + Gerber Viewer

Roland Jaquet <[log in to unmask]>

Wed, 19 Feb 1997 10:11:44 +0100

58 lines

New Thread

GEN: malachite

GEN: malachite

[log in to unmask]

Mon, 17 Feb 1997 20:31:59 -0500

68 lines

New Thread

GEN: Replies

GEN: Replies

Caldera Desktop User <[log in to unmask]>

Fri, 28 Feb 1997 16:46:40 -8000 (PST)

46 lines

New Thread

GEN: SMTA VERSION OF TechNet AVAILABLE?

GEN: SMTA VERSION OF TechNet AVAILABLE?

Lolmaugh, Scott <[log in to unmask]>

12 Feb 1997 09:12:14 -0600

83 lines

Re: GEN: SMTA VERSION OF TechNet AVAILABLE?

Jack Ray <[log in to unmask]>

Thu, 13 Feb 1997 12:57:49 -0500

44 lines

New Thread

GEN: Soldermask Encroachment

GEN: Soldermask Encroachment

[log in to unmask]

Wed, 05 Feb 1997 16:53:19 -0500

42 lines

New Thread

GEN: Wheres the TechNet archive?

GEN: Wheres the TechNet archive?

72030,3271 <[log in to unmask]>

04 Feb 97 06:34:43 EST

38 lines

Re: GEN: Wheres the TechNet archive?

David Bergman <[log in to unmask]>

Tue, 4 Feb 1997 07:43:26 -0600 (CST)

315 lines

GEN: Wheres the TechNet archive?

[log in to unmask]

Tue, 04 Feb 97 08:56:39 EST

35 lines

GEN: Wheres the TechNet archive?

72030,3271 <[log in to unmask]>

04 Feb 97 06:34:43 EST

49 lines

New Thread

Gerber viewer: GCPrevue for Win32

Gerber viewer: GCPrevue for Win32

Ross LaGue <[log in to unmask]>

Sat, 15 Feb 1997 20:36:36 -0500

52 lines

New Thread

Gold as Etch Resist

Re: Gold as Etch Resist

[log in to unmask]

Sat, 1 Feb 1997 13:19:19 -0500 (EST)

53 lines

New Thread

Gold/Tin Lead

Gold/Tin Lead

Darrell Daigle <[log in to unmask]>

Thu, 27 Feb 97 15:24:00 PST

47 lines

New Thread

GraphiCode Shareware

GraphiCode Shareware

Jack Olson <[log in to unmask]>

Thu, 13 Feb 1997 08:31:44 -0800

44 lines

New Thread

HAR ZION - CATALOG

HAR ZION - CATALOG

jac a. <[log in to unmask]>

Fri, 14 Feb 1997 14:01:56 -0800

90 lines

New Thread

heat shielding

heat shielding

[log in to unmask]

Mon, 17 Feb 1997 11:44:26 -0500 (EST)

45 lines

Re: heat shielding

Victor Li <[log in to unmask]>

Thu, 20 Feb 1997 00:49:30 +0800 (HKT)

75 lines

RE: heat shielding

Yuen, Mike <[log in to unmask]>

Thu, 20 Feb 97 12:21:00 CST

70 lines

New Thread

Help Desk Friday schedule

Re: Help Desk Friday schedule

Frank Bucci <[log in to unmask]>

Wed, 19 Feb 1997 17:15:07 -0400

47 lines

New Thread

High Density Interconnect

High Density Interconnect

[log in to unmask]

Thu, 06 Feb 1997 04:50:08 EST

61 lines

Re: High Density Interconnect

Phil Yates <[log in to unmask]>

Mon, 10 Feb 1997 12:07:09 -0600

96 lines

New Thread

Hot shortness

Re: Hot shortness

ddhillma <[log in to unmask]>

Fri, 21 Feb 97 14:42:48 cst

64 lines

New Thread

Impedance of parallel Traces

Impedance of parallel Traces

John Reardon <[log in to unmask]>

Thu, 20 Feb 97 10:21:00 PST

44 lines

New Thread

Industry average pincounts/PPM data

Industry average pincounts/PPM data

Pat McDonough <[log in to unmask]>

Fri, 07 Feb 1997 12:15:55 -0800

47 lines

New Thread

innerlayer core locating slot integrity

RE: innerlayer core locating slot integrity

Ed Cosper <[log in to unmask]>

Thu, 20 Feb 1997 13:17:24 -0600

91 lines

New Thread

IPC CONFERENCE

IPC CONFERENCE

Baker,Kelly <[log in to unmask]>

Thu, 13 Feb 1997 15:01:09 -0500

37 lines

Re: IPC CONFERENCE

David Bergman <[log in to unmask]>

Thu, 13 Feb 1997 16:47:16 -0600 (CST)

70 lines

New Thread

IPC Sjpecifications

IPC Sjpecifications

Roxanne L Tovey <[log in to unmask]>

17 Feb 1997 11:39:49 -0800

56 lines

New Thread

IPC Sjpecifications -Reply

IPC Sjpecifications -Reply

Dan Lorinser <[log in to unmask]>

Wed, 19 Feb 1997 06:26:25 -0600

34 lines

New Thread

IPC Specifications

Re: IPC Specifications

Mike Buetow <[log in to unmask]>

Mon, 17 Feb 1997 14:30:09 -0600 (CST)

70 lines

New Thread

IPC-D-356

Re: IPC-D-356

[log in to unmask]

Mon, 3 Feb 1997 08:39:45 -0600

66 lines

New Thread

IPC-MF-150

IPC-MF-150

Jon Holmen <[log in to unmask]>

Wed, 12 Feb 1997 10:43:39 -0600 (CST)

62 lines

New Thread

IPC-SM-840

Re[2]: IPC-SM-840

ddhillma <[log in to unmask]>

Mon, 03 Feb 97 09:09:41 cst

106 lines

New Thread

IPCchat session announcement

IPCchat session announcement

[log in to unmask]

Tue, 4 Feb 1997 21:31:49 GMT

64 lines

IPCchat session announcement

[log in to unmask]

Mon, 10 Feb 1997 19:53:44 GMT

64 lines

IPCchat session announcement

[log in to unmask]

Wed, 26 Feb 1997 20:49:26 GMT

62 lines

IPCchat session announcement

[log in to unmask]

Fri, 28 Feb 1997 19:37:11 GMT

62 lines

New Thread

J-STD vs MILSPEC

J-STD vs MILSPEC

DeRusso, John <[log in to unmask]>

Thu, 13 Feb 1997 11:11:00 -0700

38 lines

New Thread

j-std-002 parts

j-std-002 parts

[log in to unmask]

Wed, 19 Feb 1997 01:09:18 -0500 (EST)

59 lines

RE: j-std-002 parts

DAVY.J.G- <[log in to unmask]>

Thu, 20 Feb 1997 12:16:48 -0500

89 lines

Re: j-std-002 parts

mkwoka01 <[log in to unmask]>

Thu, 20 Feb 1997 15:26:58 -0500

122 lines

Re: j-std-002 parts

ddhillma <[log in to unmask]>

Fri, 21 Feb 97 05:26:36 cst

109 lines

New Thread

James B. Bryan

James B. Bryan

William Johnson <[log in to unmask]>

Wed, 5 Feb 97 22:05:25 UT

34 lines

New Thread

Japan - Hong Kong Workshop in March

Japan - Hong Kong Workshop in March

Toshiki Sasabe 13-Feb-1997 1435 <[log in to unmask]>

Thu, 13 Feb 97 00:46:14 EST

95 lines

New Thread

JOB

JOB

Dan Lorinser <[log in to unmask]>

Tue, 11 Feb 1997 09:11:21 -0600

39 lines

New Thread

Job Opportunity

Job Opportunity

[log in to unmask]

Mon, 3 Feb 97 9:36:31 CST

54 lines

New Thread

JOB POSTINGS

re:JOB POSTINGS

MIKE J. LOPEZ <[log in to unmask]>

Thu, 13 Feb 1997 06:50:54 -0500

41 lines

re:JOB POSTINGS

Melinda Robinson <[log in to unmask]>

Thu, 13 Feb 1997 13:36:18 -0600 (CST)

78 lines

RE: Job Postings

[log in to unmask]

Fri, 14 Feb 1997 18:29:41 -0500

75 lines

Re: JOB POSTINGS

[log in to unmask]

Fri, 14 Feb 1997 22:26:40 -0500 (EST)

42 lines

Job Postings

Bernard Kessler & Associates LTD <[log in to unmask]>

Sat, 15 Feb 97 16:17 EST

67 lines

New Thread

Job Postings / Employers / My 2 Cents

Job Postings / Employers / My 2 Cents

[log in to unmask]

Mon, 17 Feb 1997 14:28:39 -0800

69 lines

New Thread

job postings ???

job postings ???

[log in to unmask]

Fri, 14 Feb 97 16:44:43 PST

39 lines

New Thread

Job Postings on TechNet

Job Postings on TechNet

Joel Yocom <[log in to unmask]>

Fri, 14 Feb 1997 14:15:19 +0000

49 lines

New Thread

Joint Technical Societies, Nepcon West, L.A. Area

Joint Technical Societies, Nepcon West, L.A. Area

Bill Gaines B160 x2199 <[log in to unmask]>

Tue, 11 Feb 97 11:22:55 PST

85 lines

New Thread

KAMAN INSTRUMENTS KD-2300

KAMAN INSTRUMENTS KD-2300

William Johnson <[log in to unmask]>

Tue, 4 Feb 97 18:54:19 UT

34 lines

New Thread

Laser Direct Imaging

Laser Direct Imaging

ROBERT L SEYFERT <[log in to unmask]>

Tue, 04 Feb 97 08:24:01 -0500

180 lines

New Thread

Laser Direct Writing

Laser Direct Writing

s d thompson <[log in to unmask]>

Mon, 03 Feb 1997 19:21:46 EST

47 lines

Laser Direct Writing

E.Janssens@MT0004 <[log in to unmask]>

Tue, 04 Feb 1997 06:05:24 EST

72 lines

Re: Laser Direct Writing

[log in to unmask]

Tue, 4 Feb 1997 11:37:19 -0500 (EST)

37 lines

New Thread

LCC height control

Re: LCC height control

[log in to unmask]

Sun, 9 Feb 1997 07:59:24 -0500 (EST)

51 lines

New Thread

LEDs and SMT components mounted to polyester screened circuits

LEDs and SMT components mounted to polyester screened circuits

[log in to unmask]

Thu, 13 Feb 1997 09:59:44 -0800

38 lines

New Thread

LEDs on Flexible Poly Circuits

LEDs on Flexible Poly Circuits

[log in to unmask]

Wed, 19 Feb 1997 09:02:20 -0800

51 lines

New Thread

liconix laser source

liconix laser source

[log in to unmask]

Mon, 17 Feb 1997 20:26:51 +0500

38 lines

New Thread

Line width measurement

Line width measurement

[log in to unmask]

Thu, 27 Feb 97 09:23:41 MST

56 lines

New Thread

Looking for 15 to 20 hp vacuum

Looking for 15 to 20 hp vacuum

[log in to unmask]

Wed, 19 Feb 1997 09:19:57 -0500 (EST)

36 lines

New Thread

Looking for a cam operator

Looking for a cam operator

Ed Cosper <[log in to unmask]>

Mon, 3 Feb 1997 09:35:48 -0600

44 lines

New Thread

Low cost flex circuits?

Low cost flex circuits?

[log in to unmask]

Tue, 11 Feb 1997 17:32:54 -0800

41 lines

Low cost flex circuits?

[log in to unmask]

Wed, 12 Feb 1997 09:14:56 -0800

43 lines

New Thread

Low meelting point or temperature solder

Low meelting point or temperature solder

Antoni Cherta <[log in to unmask]>

Wed, 5 Feb 1997 14:12:13 +0100

70 lines

Re: Low meelting point or temperature solder

[log in to unmask]

Wed, 5 Feb 1997 15:54:46 -0500 (EST)

45 lines

New Thread

Low temperature solder

Low temperature solder

Victor Li <[log in to unmask]>

Mon, 3 Feb 1997 10:38:36 +0800 (HKT)

51 lines

Re: Low temperature solder

ddhillma <[log in to unmask]>

Mon, 03 Feb 97 09:32:47 cst

83 lines

Re: Low temperature solder

[log in to unmask]

Sat, 01 Feb 97 11:03:21

103 lines

New Thread

mag hydroxide in waste treatment

mag hydroxide in waste treatment

[log in to unmask]

Fri, 7 Feb 1997 20:58:25 -0500 (EST)

39 lines

New Thread

mag hydroxide in waste treatment -Reply

mag hydroxide in waste treatment -Reply

Tat Choo <[log in to unmask]>

Wed, 12 Feb 1997 14:37:17 -0800

53 lines

Re: mag hydroxide in waste treatment -Reply

Paul Gould <[log in to unmask]>

Fri, 14 Feb 1997 22:54:59 +0000

53 lines

New Thread

mag hydroxide in waste treatment -Reply 2

Re: mag hydroxide in waste treatment -Reply 2

[log in to unmask]

Mon, 17 Feb 1997 09:19:34 +0000

95 lines

New Thread

Mailstorm

Re: Mailstorm

[log in to unmask]

Wed, 26 Feb 1997 10:40:50 -0500 (EST)

44 lines

re:mailstorm

Dmitriy Sklyar <[log in to unmask]>

Wed, 26 Feb 1997 09:36:30 -0600 (CST)

99 lines

re:mailstorm

[log in to unmask]

Wed, 26 Feb 1997 04:12:46 EST

57 lines

New Thread

Mechanical fasteners for multilayer PWBs

Mechanical fasteners for multilayer PWBs

Gagnon, Gerry <[log in to unmask]>

Mon, 3 Feb 1997 14:03:42 -0500

57 lines

RE: Mechanical fasteners for multilayer PWBs

Wander, Nicholas G RV <[log in to unmask]>

Tue, 04 Feb 97 14:18:00 CST

91 lines

New Thread

Message text

Message text

[log in to unmask]

Wed, 19 Feb 97 18:25:48 +0100

75 lines

New Thread

MIL STD. 2000 ??

RE:MIL STD. 2000 ??

[log in to unmask]

6 Feb 97 19:25 GMT+0500

55 lines

Re: MIL STD. 2000 ??

[log in to unmask]

Mon, 10 Feb 1997 12:49:43 -0500 (EST)

68 lines

New Thread

MIL-I-45208A

RE: MIL-I-45208A

Darrell Bonzo <[log in to unmask]>

Mon, 03 Mar 97 8:19

81 lines

New Thread

misregistration test

misregistration test

[log in to unmask]

Tue, 4 Feb 1997 00:48:02 +0100

66 lines

New Thread

Mixed Tech Assy -Reply

Re: Mixed Tech Assy -Reply

[log in to unmask]

5 Feb 97 20:06 GMT+0500

116 lines

RE: Mixed Tech Assy -Reply

Jack Crawford <[log in to unmask]>

Thu, 6 Feb 1997 09:20:11 -0500

86 lines

New Thread

NAFTA

NAFTA

[log in to unmask]

Thu, 13 Feb 1997 20:40:12 -0500

39 lines

New Thread

NEED Gerber viewer with highlight capability

NEED Gerber viewer with highlight capability

Greg Hanson <[log in to unmask]>

Fri, 28 Feb 97 14:42:32 PST

51 lines

RE: NEED Gerber viewer with highlight capability

Lolmaugh, Scott (AZ15) <[log in to unmask]>

03 Mar 1997 10:03:22 -0600

89 lines

New Thread

No clean paste

No clean paste

[log in to unmask]

Thu, 6 Feb 1997 09:45:54 +0000

49 lines

Re: No clean paste

ddhillma <[log in to unmask]>

Fri, 07 Feb 97 07:26:08 cst

81 lines

New Thread

No IPC Technet Stuff

Re: No IPC Technet Stuff

Bob Willis <[log in to unmask]>

11 Feb 97 02:40:25 EST

46 lines

New Thread

Open position

Open position

Bilal Khalaf <[log in to unmask]>

Mon, 10 Feb 97 10:13:00 PST

72 lines

open position

Dan Lorinser <[log in to unmask]>

Tue, 11 Feb 1997 07:02:03 -0600

43 lines

New Thread

ORC exposure machine

Re: ORC exposure machine

[log in to unmask]

Sun, 2 Feb 1997 23:13:45 -0500 (EST)

40 lines

New Thread

OSP and solderability

OSP and solderability

Johannes Sivula <[log in to unmask]>

Fri, 28 Feb 1997 17:08:43 +0300

48 lines

New Thread

OSP Shelf Life

OSP Shelf Life

[log in to unmask]

Wed, 19 Feb 97 12:53:21 EST

42 lines

Re: OSP Shelf Life

Jack Crawford <[log in to unmask]>

Thu, 20 Feb 1997 14:40:02 -0500

73 lines

Re: OSP Shelf Life

Lee Hitchens <[log in to unmask]>

Fri, 21 Feb 97 09:13:35 GMT

94 lines

New Thread

OSPs

OSPs

J_L_PARKER <[log in to unmask]>

Mon, 24 Feb 97 23:59:41 EST

46 lines

New Thread

oxide and lpi problems (FAB)

oxide and lpi problems (FAB)

Adeodato Vigano <[log in to unmask]>

Thu, 6 Feb 1997 18:45:57 -0500 ()

53 lines

Re: oxide and lpi problems (FAB)

[log in to unmask]

Fri, 7 Feb 1997 19:08:40 -0500 (EST)

49 lines

RE: oxide and lpi problems (FAB)

[log in to unmask]

Sat, 8 Feb 1997 02:02:45 -0500 (EST)

49 lines

Re: oxide and lpi problems (FAB)

[log in to unmask]

Sun, 9 Feb 1997 22:55:00 -0500 (EST)

81 lines

New Thread

packaging boards for shipment and storage

packaging boards for shipment and storage

[log in to unmask]

Thu, 20 Feb 1997 11:31:13 -0800

44 lines

Re: packaging boards for shipment and storage

DAVY.J.G- <[log in to unmask]>

Mon, 24 Feb 1997 15:47:18 -0500

96 lines

New Thread

panasert question

panasert question

Seth Tompkins <[log in to unmask]>

Mon, 10 Feb 1997 14:39:49 -0800

61 lines

Re: panasert question

[log in to unmask]

Tue, 11 Feb 1997 16:23:03 -0500

86 lines

New Thread

PBGA Testing

PBGA Testing

Carl E. Chiang <[log in to unmask]>

Tue, 25 Feb 1997 17:50:13 -0800

74 lines

New Thread

PCB DESIGN

PCB DESIGN

Dan Lorinser <[log in to unmask]>

Thu, 06 Feb 1997 07:09:57 -0600

54 lines

Re: PCB DESIGN

[log in to unmask]

Fri, 07 Feb 97 10:39:01 EST

86 lines

Re: PCB DESIGN

[log in to unmask]

Fri, 7 Feb 1997 18:01:15 -0500 (EST)

55 lines

Re: PCB DESIGN

Lisa Williams <[log in to unmask]>

Wed, 12 Feb 1997 09:32:54 -0600 (CST)

97 lines

New Thread

PCB Panelization

PCB Panelization

Mark W. Spitnale <[log in to unmask]>

Wed, 12 Feb 1997 06:59:07 -0500

69 lines

re: PCB Panelization

Vernon Pursley <[log in to unmask]>

Fri, 14 Feb 97 16:03:15 PST

116 lines

PCB Panelization

[log in to unmask]

Fri, 14 Feb 1997 08:03:36 EST

136 lines

New Thread

PCBs at 150C for more than 2 hours

PCBs at 150C for more than 2 hours

Ulrich Korndoerfer <[log in to unmask]>

Tue, 04 Feb 1997 00:03:10 +0100

56 lines

New Thread

PCBs at 150°C for more than 2 hours

Re: PCBs at 150°C for more than 2 hours

Tom Ingham <[log in to unmask]>

Tue, 4 Feb 1997 09:10:48 -0700

106 lines

New Thread

PCBs at 150C for more than 2 hours

RE: PCBs at 150C for more than 2 hours

Wander, Nicholas G RV <[log in to unmask]>

Tue, 04 Feb 97 15:02:00 CST

77 lines

New Thread

People

People

[log in to unmask]

Wed, 12 Feb 97 10:44:15 PST

45 lines

Re: People

[log in to unmask]

Thu, 13 Feb 97 10:43:42 PST

71 lines

Re: People

[log in to unmask]

Fri, 14 Feb 1997 08:43:25 -0500 (EST)

37 lines

Re: People

[log in to unmask]

Fri, 14 Feb 1997 07:47:29 -0500 (EST)

37 lines

New Thread

Pinholes - 610B vs. J-STD-001B

Pinholes - 610B vs. J-STD-001B

Thomas D. Langlois <[log in to unmask]>

Sun, 2 Feb 1997 19:33:50 -0800

40 lines

Re: Pinholes - 610B vs. J-STD-001B

Jack Crawford <[log in to unmask]>

Mon, 3 Feb 1997 10:24:25 -0500

74 lines

New Thread

Plating Particulates

Plating Particulates

[log in to unmask]

Fri, 7 Feb 1997 07:07:16 -0500

51 lines

Re: Plating Particulates

dhoppe <[log in to unmask]>

Fri, 07 Feb 97 16:28:02 PST

76 lines

Re: Plating Particulates

[log in to unmask]

Sat, 8 Feb 1997 17:37:22 -0500 (EST)

39 lines

New Thread

Plating rinse tank bacteria

Plating rinse tank bacteria

Modular Components National, Inc. <[log in to unmask]>

Thu, 6 Feb 1997 09:36:55 -0500

68 lines

Re: Plating rinse tank bacteria

Bob Mesick <[log in to unmask]>

Fri, 7 Feb 1997 13:08:32 -0800 (PST)

127 lines

Re: Plating rinse tank bacteria

Goldman, Patricia J. <[log in to unmask]>

Wed, 12 Feb 97 12:45:00 PST

153 lines

Re: Plating rinse tank bacteria

Andrew P Magee <[log in to unmask]>

Thu, 13 Feb 1997 15:55:00 -0800

178 lines

Re: Plating rinse tank bacteria

John Grosso <[log in to unmask]>

17 Feb 97 9:20:35

45 lines

New Thread

Please read this.

Please read this.

Jan Merstrand <[log in to unmask]>

Tue, 11 Feb 1997 19:19:25 +0100

64 lines

Please read this.

Keith Larson <[log in to unmask]>

Thu, 13 Feb 1997 12:53:42 -0600

77 lines

RE: Please read this.

[log in to unmask]

Mon, 17 Feb 1997 08:45:33 +0000

54 lines

New Thread

Please read this. -Reply

RE: Please read this. -Reply

Dan Lorinser <[log in to unmask]>

Mon, 17 Feb 1997 07:57:35 -0600

57 lines

New Thread

Propagation time formula

Propagation time formula

Doug Brooks <[log in to unmask]>

Thu, 06 Feb 1997 13:27:34 -0500

46 lines

Re: Propagation time formula

Andy Burkhardt <[log in to unmask]>

Fri, 7 Feb 1997 14:12:01 GMT

108 lines

Re: Propagation time formula

TOSTEVIN_BC <[log in to unmask]>

Fri, 7 Feb 1997 11:27:44 -0500

66 lines

Re: Propagation time formula

Andy Burkhardt <[log in to unmask]>

Fri, 7 Feb 1997 18:12:38 GMT

108 lines

Re: Propagation time formula

Doug McKean <[log in to unmask]>

Fri, 07 Feb 1997 17:42:12 -0500

84 lines

New Thread

Proposed drill comp.

Re: Proposed drill comp.

R_R_HOLMES <[log in to unmask]>

Mon, 03 Feb 97 09:35:51 EST

118 lines

New Thread

Pulse plating acid copper solutions.

Pulse plating acid copper solutions.

[log in to unmask] <[log in to unmask]>

Mon, 03 Feb 1997 20:55:08 -0800

45 lines

New Thread

Pulse plating acid copper solutions.Response

Re: Pulse plating acid copper solutions.Response

[log in to unmask]

Wed, 5 Feb 1997 08:58:59 -0500 (EST)

41 lines

New Thread

PWB Copper Surface Treatments

PWB Copper Surface Treatments

Michael Forrester <[log in to unmask]>

Fri, 28 Feb 1997 15:09:41 -0400

60 lines

New Thread

PWB manufacturing question?

Re: PWB manufacturing question?

[log in to unmask]

Sun, 2 Feb 1997 23:02:47 -0500 (EST)

44 lines

New Thread

QUAL: MIL-STD Comparison

QUAL: MIL-STD Comparison

[log in to unmask]

Fri, 28 Feb 1997 20:48:28 -0600

61 lines

New Thread

qualification plan for

Re: qualification plan for

Greg Bartlett <[log in to unmask]>

3 Jan 1997 13:47:07 -0500

114 lines

New Thread

re- laser vias

re- laser vias

[log in to unmask]

Tue, 18 Feb 1997 05:32:39 EST

54 lines

New Thread

RE: 12 micron copper foil

Re: RE: 12 micron copper foil

[log in to unmask]

Wed, 5 Feb 1997 12:23:25 -0500 (EST)

41 lines

New Thread

Re: Assembly ESD

re: Re: Assembly ESD

[log in to unmask]

Tue, 4 Feb 97 9:53:34 EST

79 lines

re: Re: Assembly ESD

[log in to unmask]

08 Feb 97 23:05:50

67 lines

New Thread

Re: PCBs at 150°C for more than 2 hours

Re: Re: PCBs at 150°C for more than 2 hours

Paul Gould <[log in to unmask]>

Wed, 5 Feb 1997 19:58:05 +0000

70 lines

New Thread

RE: Please read this. -Reply

re: RE: Please read this. -Reply

[log in to unmask]

Wed, 19 Feb 97 7:53:34 EST

38 lines

New Thread

Re: Propagation time formula - Burkhardt reply

Re:Re: Propagation time formula - Burkhardt reply

DAVY.J.G- <[log in to unmask]>

Fri, 7 Feb 1997 14:50:35 -0500

49 lines

New Thread

Reed Beds for Effluent Treatment ?

Reed Beds for Effluent Treatment ?

[log in to unmask]

Thu, 13 Feb 1997 12:42:03 -0500 (EST)

48 lines

New Thread

Relibility Ratings in Standards

Relibility Ratings in Standards

DAVY.J.G- <[log in to unmask]>

Mon, 3 Feb 1997 10:46:06 -0500

105 lines

Re: Relibility Ratings in Standards

[log in to unmask]

Tue, 4 Feb 1997 00:17:25 -0500 (EST)

48 lines

Re: Relibility Ratings in Standards

[log in to unmask]

Tue, 4 Feb 1997 05:01:00 -0500 (EST)

59 lines

Re: Relibility Ratings in Standards

[log in to unmask]

Tue, 4 Feb 1997 09:57:21 -0500 (EST)

144 lines

Re: Relibility Ratings in Standards

Doug McKean <[log in to unmask]>

Tue, 04 Feb 1997 10:53:13 -0500

118 lines

Re: Relibility Ratings in Standards

DAVY.J.G- <[log in to unmask]>

Tue, 4 Feb 1997 15:07:02 -0500

102 lines

Re: Relibility Ratings in Standards

[log in to unmask]

Wed, 5 Feb 1997 08:43:45 -0500 (EST)

47 lines

New Thread

removing RMA flux

RE: removing RMA flux

Jack Crawford <[log in to unmask]>

Wed, 12 Feb 1997 13:05:11 -0500

122 lines

New Thread

Replacement for Hasl operation

Replacement for Hasl operation

David Creager <[log in to unmask]>

Wed, 5 Feb 1997 09:08:00 -0600

40 lines

Replacement for Hasl operation

[log in to unmask]

Wed, 05 Feb 1997 16:01:23 EST

105 lines

Replacement for Hasl operation

[log in to unmask]

Wed, 05 Feb 1997 17:25:06 EST

36 lines

Replacement for Hasl operation

David Creager <[log in to unmask]>

Wed, 5 Feb 1997 09:08:00 -0600

57 lines

Re: Replacement for Hasl operation

[log in to unmask]

Fri, 07 Feb 97 08:15:33 EST

59 lines

New Thread

Reply: DES: Cu fills on circuit layers

Reply: DES: Cu fills on circuit layers

John Lennox <[log in to unmask]>

Wed, 05 Feb 1997 17:04:26 -0800

85 lines

New Thread

Request for assistance

Request for assistance

Fred Atton <[log in to unmask]>

Fri, 28 Feb 1997 13:12:27 -0600

85 lines

New Thread

Request for information on BGA, COB, FlipChip.

Request for information on BGA, COB, FlipChip.

EDMUND-SING <[log in to unmask]>

Thu, 20 Feb 97 08:44:19

45 lines

Request for information on BGA, COB, FlipChip.

EDMUND-SING <[log in to unmask]>

Thu, 20 Feb 97 08:44:19

45 lines

Re: Request for information on BGA, COB, FlipChip.

[log in to unmask]

Fri, 21 Feb 1997 07:08:52 -0500 (EST)

47 lines

New Thread

Resin recession

Resin recession

mickey <[log in to unmask]>

Tue, 18 Feb 1997 16:13:44 -0800

70 lines

Re: Resin Recession

D'Auteuil, Gerry <[log in to unmask]>

Mon, 24 Feb 97 15:40:00 PST

47 lines

New Thread

Reverse Osmosis Unit for Charity

Reverse Osmosis Unit for Charity

Edward J Popielarski <[log in to unmask]>

Fri, 28 Feb 1997 14:53:35 -0600 (CST)

53 lines

New Thread

Re[2]: FAB: Horizontal versus vertical etching

Re: Re[2]: FAB: Horizontal versus vertical etching

[log in to unmask]

Mon, 3 Feb 1997 09:59:21 -0500 (EST)

51 lines

New Thread

Re[2]: FAB:Laser vias

RE: Re[2]: FAB:Laser vias

Thomas, Kevin <[log in to unmask]>

Thu, 20 Feb 1997 09:06:00 -0700

162 lines

New Thread

Re[2]: Gold as Etch Resist

Re: Re[2]: Gold as Etch Resist

David Hoover <[log in to unmask]>

Sun, 02 Feb 1997 16:14:38 -0800

72 lines

New Thread

Re[2]: SOLDER BALLS (on SMT)

RE: Re[2]: SOLDER BALLS (on SMT)

"esvax::mrgate::a1::kenyonwg"@[log in to unmask]

Fri, 7 Feb 97 10:49:22 EST

82 lines

New Thread

Rigid Laminate stabilty

Re: Rigid Laminate stabilty

Paul Gould <[log in to unmask]>

Sun, 2 Feb 1997 13:39:20 +0000

79 lines

Re: Rigid Laminate stabilty

R_R_HOLMES <[log in to unmask]>

Mon, 03 Feb 97 09:46:18 EST

81 lines

Re: Rigid Laminate stabilty

Paul Gould <[log in to unmask]>

Mon, 3 Feb 1997 17:37:10 +0000

98 lines

New Thread

Router Bit

Router Bit

Robert Boilard <[log in to unmask]>

Wed, 12 Feb 1997 18:26:00 -0500

44 lines

New Thread

Routing Ultem

RE: Routing Ultem

Sheila Smith <[log in to unmask]>

Fri, 14 Feb 1997 16:24:51 -0500 (EST)

53 lines

New Thread

RQST, SMTA VERSION OF TECHNET AVAILABLE?

RQST, SMTA VERSION OF TECHNET AVAILABLE?

Lolmaugh, Scott <[log in to unmask]>

11 Feb 1997 13:41:49 -0600

59 lines

Re: RQST, SMTA VERSION OF TECHNET AVAILABLE?

David Bergman <[log in to unmask]>

Wed, 12 Feb 1997 08:59:14 -0600 (CST)

68 lines

Re: RQST, SMTA VERSION OF TECHNET AVAILABLE?

Bob Willis <[log in to unmask]>

15 Feb 97 04:50:18 EST

47 lines

New Thread

RUSCON Flyer

RUSCON Flyer

Joseph Fjelstad <[log in to unmask]>

Sun, 2 Feb 1997 20:05:44 -0800

417 lines

New Thread

Russian PCB Conference - RUSCON -

Russian PCB Conference - RUSCON -

Joseph Fjelstad <[log in to unmask]>

Sun, 2 Feb 1997 19:20:39 -0800

209 lines

New Thread

Saponifier waste treatment

Saponifier waste treatment

[log in to unmask]

Wed, 5 Feb 97 12:47:27 EST

43 lines

New Thread

Shearing Optimization

Shearing Optimization

William Fumo <[log in to unmask]>

11 Feb 97 16:57:34 EST

37 lines

New Thread

Shelf Life

Shelf Life

[log in to unmask]

Wed, 26 Feb 1997 10:46:00 -0500

54 lines

New Thread

SIR Guru

SIR Guru

Guenter Grossmann <[log in to unmask]>

Tue, 11 Feb 1997 10:08:31 +0100

73 lines

Re: SIR Guru

[log in to unmask]

Wed, 12 Feb 1997 09:29:39 -0500 (EST)

77 lines

New Thread

SMART Survey Results

SMART Survey Results

Bob Willis <[log in to unmask]>

19 Feb 97 14:38:42 EST

228 lines

New Thread

smd automatic mounting machines

smd automatic mounting machines

[log in to unmask]

Tue, 11 Feb 1997 21:25:08 +0100

41 lines

New Thread

SMT adhesives

SMT adhesives

Antoni Cherta <[log in to unmask]>

Wed, 5 Feb 1997 12:59:18 +0100

51 lines

New Thread

SMT: Glue

SMT: Glue

Paul Stolar <[log in to unmask]>

Thu, 27 Feb 97 16:40:49 CDT

40 lines

New Thread

SMT: Glue, response

Re: SMT: Glue, response

Mark W. Spitnale <[log in to unmask]>

Fri, 28 Feb 1997 10:10:35 -0500

80 lines

New Thread

SOLDER BALLS (on SMT)

RE: SOLDER BALLS (on SMT)

Phil Bavaro <[log in to unmask]>

Thu, 6 Feb 1997 19:23:01 -0800 (PST)

98 lines

Re[2]: SOLDER BALLS (on SMT)

ddhillma <[log in to unmask]>

Fri, 07 Feb 97 07:04:12 cst

153 lines

Re: SOLDER BALLS (on SMT)

Pratap Singh <[log in to unmask]>

Thu, 20 Feb 1997 20:05:08 -0800

122 lines

New Thread

Solder pot to allow removal of copper

Solder pot to allow removal of copper

DAVY.J.G- <[log in to unmask]>

Mon, 3 Feb 1997 11:30:57 -0500

68 lines

Re: Solder pot to allow removal of copper

ddhillma <[log in to unmask]>

Mon, 03 Feb 97 17:01:34 cst

108 lines

New Thread

solder recycle system

solder recycle system

indal <[log in to unmask]>

Mon, 3 Feb 1997 09:22:10 +0500

39 lines

Re: solder recycle system

[log in to unmask]

Mon, 3 Feb 1997 00:30:50 -0500 (EST)

41 lines

re: solder recycle system

James Kenny <[log in to unmask]>

Mon, 3 Feb 97 7:11:20 PST

77 lines

Re: solder recycle system

Motoyo Wajima <[log in to unmask]>

Tue, 04 Feb 1997 09:34:14 +0900

64 lines

Re: solder recycle system

Motoyo Wajima <[log in to unmask]>

Tue, 04 Feb 1997 15:25:18 +0900

65 lines

New Thread

Soldering

Soldering

Knowles, Ed (MSMAIL) <[log in to unmask]>

22 Feb 1997 06:42:45 -0700

79 lines

New Thread

Soldering Stainless steel

Re: Soldering Stainless steel

D. Rooke <[log in to unmask]>

Thu, 20 Feb 1997 21:48:34 -0500 (EST)

90 lines

Re: Soldering Stainless steel

D. Rooke <[log in to unmask]>

Sat, 22 Feb 1997 12:13:18 -0500 (EST)

90 lines

New Thread

Soldering Transformers

Soldering Transformers

Mike Middleton <[log in to unmask]>

Tue, 4 Feb 1997 20:29:41 -0700 (MST)

47 lines

New Thread

Soldermask Encroachment

Re: Soldermask Encroachment

[log in to unmask]

Tue, 18 Feb 1997 10:11:08 -0500 (EST)

47 lines

New Thread

Soldermask Lamination

Soldermask Lamination

Lawrence R Blumberg (T/L 857-1368) <[log in to unmask]>

Fri, 21 Feb 97 10:41:37 EST

88 lines

New Thread

Soldermask question

Soldermask question

Davis Benjamin L <[log in to unmask]>

Fri, 28 Feb 1997 14:25:04 -0600

55 lines

New Thread

SPC for HAL solder coating process

SPC for HAL solder coating process

Dave Willhard <[log in to unmask]>

Thu, 27 Feb 1997 16:27:21 PST

46 lines

New Thread

SPC OF PCB

SPC OF PCB

cctc <[log in to unmask]>

Fri, 21 Feb 1997 16:06:51 +0800

56 lines

RE: SPC OF PCB

Ed Cosper <[log in to unmask]>

Mon, 24 Feb 1997 15:36:19 -0600

64 lines

New Thread

Spec for inductive components

Spec for inductive components

DAVY.J.G- <[log in to unmask]>

Tue, 4 Feb 1997 11:24:46 -0500

48 lines

New Thread

Specialized IGI Ext Software Question

Specialized IGI Ext Software Question

Glynn Shaw <[log in to unmask]>

Mon, 24 Feb 1997 15:30:01 -0800

55 lines

New Thread

Specifications for edge condition on laminate panels

Specifications for edge condition on laminate panels

Stan Wilson <[log in to unmask]>

Fri, 14 Feb 1997 21:55:15 -0500

56 lines

New Thread

spindle reconditioning

spindle reconditioning

[log in to unmask]

Mon, 17 Feb 1997 20:22:04 +0500

44 lines

New Thread

spray fluxing, VOC free

spray fluxing, VOC free

P Roy <[log in to unmask]>

04 Feb 97 08:39:01 EST

51 lines

Re: spray fluxing, VOC free

Aric Parr <[log in to unmask]>

04 Feb 97 11:32:52 -0500

92 lines

New Thread

Stainless steel

Stainless steel

[log in to unmask]

Wed, 19 Feb 97 08:56:54 +0100

56 lines

Re: Stainless steel

ddhillma <[log in to unmask]>

Wed, 19 Feb 97 16:19:39 cst

89 lines

New Thread

Standard 4 layer construction

Standard 4 layer construction

Marti Tully <[log in to unmask]>

Wed, 05 Feb 1997 15:08:16 -0700

56 lines

New Thread

standard panelization

standard panelization

MIKE J. LOPEZ <[log in to unmask]>

Tue, 25 Feb 1997 07:34:24 -0500

39 lines

New Thread

Stop send me an information about technet.

Stop send me an information about technet.

dct1998 <[log in to unmask]>

Sat, 08 Feb 1997 05:08:21 +0800

47 lines

New Thread

Storage Time

Storage Time

RAINER <[log in to unmask]>

Fri, 21 Feb 1997 14:35:10 +0000

48 lines

New Thread

Subj: Flux Marking Pens and No-clean Flux

Subj: Flux Marking Pens and No-clean Flux

Hollandsworth, Ron <[log in to unmask]>

Tue, 11 Feb 97 14:07:53 EST

56 lines

New Thread

SUBJ: Q-Corp Lead Trimmin

RE: SUBJ: Q-Corp Lead Trimmin

[log in to unmask]

11 Feb 97 13:03:56

60 lines

New Thread

SUBJ: Q-Corp Lead Trimming & ESD

SUBJ: Q-Corp Lead Trimming & ESD

Hollandsworth, Ron <[log in to unmask]>

Wed, 05 Feb 97 10:13:47 EST

41 lines

RE: SUBJ: Q-Corp Lead Trimming & ESD

Jim Marsico 516-595-5879 <[log in to unmask]>

Fri, 07 Feb 1997 06:13:00 -0500 (EST)

59 lines

RE: SUBJ: Q-Corp Lead Trimming & ESD

Darrell Bonzo <[log in to unmask]>

Fri, 07 Feb 97 7:54

80 lines

New Thread

subject: Flux Marking Pens & No-clean Process

subject: Flux Marking Pens & No-clean Process

Hollandsworth, Ron <[log in to unmask]>

Tue, 11 Feb 97 09:55:52 EST

56 lines

Re: subject: Flux Marking Pens & No-clean Process

ddhillma <[log in to unmask]>

Thu, 13 Feb 97 06:30:19 cst

108 lines

New Thread

subscribtion

subscribtion

[log in to unmask]

Tue, 11 Feb 1997 14:00 +0100

36 lines

New Thread

substitutes for HCFC 141b

Re: substitutes for HCFC 141b

Antoni Cherta <[log in to unmask]>

Sun, 23 Feb 1997 14:39:18 +0100

67 lines

New Thread

Surface Insulation Resistance testing

Surface Insulation Resistance testing

Dave Willhard <[log in to unmask]>

Fri, 28 Feb 1997 16:05:14 PST

53 lines

New Thread

Surface Preparation

Surface Preparation

John Perna <[log in to unmask]>

Tue, 18 Feb 1997 18:01:07 -0800

41 lines

RE: Surface Preparation

Ed Cosper <[log in to unmask]>

Wed, 19 Feb 1997 14:11:42 -0600

83 lines

New Thread

Survey: Reflow Equip. & No-clean Paste

Survey: Reflow Equip. & No-clean Paste

Hollandsworth, Ron <[log in to unmask]>

Fri, 07 Feb 97 08:53:10 EST

49 lines

New Thread

Tech ? from Lucent

Re: Tech ? from Lucent

[log in to unmask]

Thu, 27 Feb 97 10:47:26 MST

105 lines

New Thread

test-coupon dimension

test-coupon dimension

[log in to unmask]

Tue, 4 Feb 1997 22:43:57 +0100

42 lines

Re: test-coupon dimension

[log in to unmask]

Thu, 6 Feb 1997 21:46:37 +0100

79 lines

New Thread

Thanks for the History lesson -- in ASSY question

Re:Thanks for the History lesson -- in ASSY question

Poh Kong Hui <[log in to unmask]>

Sat, 22 Feb 1997 19:35:06 +0800 (SST)

104 lines

New Thread

Tinning and soldering transformers

Tinning and soldering transformers

Mike Middleton <[log in to unmask]>

Mon, 3 Feb 1997 19:41:37 -0700 (MST)

72 lines

Re: Tinning and soldering transformers

ddhillma <[log in to unmask]>

Tue, 04 Feb 97 10:03:24 cst

111 lines

Tinning and soldering transformers

Jack Crawford <[log in to unmask]>

Tue, 4 Feb 1997 14:30:58 -0500

130 lines

New Thread

Training

Training

Jack Ray <[log in to unmask]>

Sat, 08 Feb 1997 13:14:36 -0500

48 lines

Re: Training

LAMBERT.K.A- <[log in to unmask]>

Mon, 10 Feb 1997 07:27:18 -0500

75 lines

Re: Training

Brian Hyde <[log in to unmask]>

Mon, 10 Feb 1997 11:12:32 -0500

59 lines

Training

Bill Marsh <[log in to unmask]>

Mon, 10 Feb 1997 09:30:12 -0800 (PST)

42 lines

Re: Training

MTTC <[log in to unmask]>

Tue, 11 Feb 1997 13:10:05 -0800 (PST)

49 lines

Re: Training

Bob Willis <[log in to unmask]>

14 Feb 97 02:55:01 EST

44 lines

New Thread

Transmission line formulas

Transmission line formulas

Doug Brooks <[log in to unmask]>

Thu, 06 Feb 1997 11:35:37 -0500

53 lines

New Thread

Unidentified subject!

Re: Unidentified subject!

Paul Gould <[log in to unmask]>

Sun, 2 Feb 1997 13:58:48 +0000

78 lines

Re: Unidentified subject!

[log in to unmask]

Tue, 4 Feb 1997 22:45:28 +0100

168 lines

Unidentified subject!

Tom Johnson <[log in to unmask]>

Fri, 21 Feb 1997 09:27:14 -0800

48 lines

New Thread

Used Equipment

Used Equipment

Edward J Popielarski <[log in to unmask]>

Thu, 13 Feb 1997 13:47:22 -0600 (CST)

41 lines

Re: Used Equipment

Bryan Woods <[log in to unmask]>

Fri, 14 Feb 1997 08:02:09 -0800

84 lines

New Thread

Using Silver on Boards for Better Solderability

Using Silver on Boards for Better Solderability

Doug McKean <[log in to unmask]>

Wed, 26 Feb 1997 16:07:02 -0500

62 lines

RE: Using Silver on Boards for Better Solderability

Frank Kurisu <[log in to unmask]>

Fri, 28 Feb 97 00:13:38 UT

88 lines

New Thread

Vender Advertising on TechNet

Vender Advertising on TechNet

[log in to unmask]

Thu, 6 Feb 1997 15:33:07 -0500 (EST)

58 lines

Re: Vender Advertising on TechNet

[log in to unmask]

Mon, 10 Feb 1997 12:54:14 -0500 (EST)

73 lines

New Thread

Via Hole and Pad size.

RE: Via Hole and Pad size.

Wander, Nicholas G RV <[log in to unmask]>

Wed, 05 Feb 97 17:36:00 CST

102 lines

RE: Via Hole and Pad size.

Wander, Nicholas G <[log in to unmask]>

Mon, 17 Feb 1997 11:52:49 -0700

181 lines

New Thread

Vote YES (job)

Vote YES (job)

Dan Lorinser <[log in to unmask]>

Thu, 13 Feb 1997 06:14:18 -0600

40 lines

Re: Vote YES (job)

[log in to unmask]

Thu, 13 Feb 1997 16:10:33 -0500 (EST)

38 lines

Re: Vote YES (job)

mkwoka01 <[log in to unmask]>

Fri, 14 Feb 1997 10:13:45 -0500

65 lines

Re: Vote YES (job)

[log in to unmask]

Tue, 18 Feb 1997 08:36:03 -0500 (EST)

36 lines

New Thread

WATERBOURNE SOLDER MASK

WATERBOURNE SOLDER MASK

[log in to unmask]

Fri, 7 Feb 1997 12:14:17 -0500 (EST)

43 lines

Re: WATERBOURNE SOLDER MASK

[log in to unmask]

Sun, 9 Feb 1997 10:44:33 -0500 (EST)

42 lines

Re: WATERBOURNE SOLDER MASK

[log in to unmask]

Sun, 9 Feb 1997 22:37:37 -0500 (EST)

59 lines

New Thread

We need a manufacturer for large size single sided PCBs

We need a manufacturer for large size single sided PCBs

Guenter Grossmann <[log in to unmask]>

Fri, 28 Feb 1997 09:58:50 +0100

54 lines

Re: We need a manufacturer for large size single sided PCBs

[log in to unmask]

Fri, 28 Feb 1997 07:50:30 -0500 (EST)

33 lines

New Thread

Wedge voids/Alternatives to Electroless

Wedge voids/Alternatives to Electroless

Nachbor, Suzanne (MN51) <[log in to unmask]>

Wed, 26 Feb 97 11:41:00 PST

39 lines

New Thread

Wedge voids/Alternatives to Electroless / REPLY

Re: Wedge voids/Alternatives to Electroless / REPLY

[log in to unmask]

Fri, 28 Feb 1997 09:48:25 -0500 (EST)

33 lines

New Thread

Whereabouts of a temperature-controlled warehouse

Whereabouts of a temperature-controlled warehouse

Scott Miller <[log in to unmask]>

Sun, 09 Feb 1997 14:59:17 -0800

45 lines

New Thread

Whereabouts of a temperature-controlled warehouse -Reply

Whereabouts of a temperature-controlled warehouse -Reply

Duff Weede <[log in to unmask]>

Mon, 10 Feb 1997 09:48:31 -0800

60 lines

New Thread

Work smarter, not harder -Reply

Work smarter, not harder -Reply

Bob Metcalf <[log in to unmask]>

Mon, 03 Feb 1997 22:03:02 -0800

77 lines

New Thread

Z axis material

Z axis material

Nye, Mike COLASC <[log in to unmask]>

Mon, 3 Feb 1997 21:43:00 -0500

42 lines

Re: Z axis material

[log in to unmask]

Fri, 07 Feb 97 14:20:17 PDT

60 lines

New Thread

[iccon-misc] Internet Phone Rates

[iccon-misc] Internet Phone Rates

[log in to unmask]

Wed, 12 Feb 1997 12:27:53 EST

129 lines

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