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February 2023
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From
Date
Re: Thermal cycling of epoxy attached components
Bush, Jeffrey D. (US)
Thu, 2 Feb 2023 15:04:57 +0000
Re: Most Current NASA Outgassing List of Tested Polymetric Materials
Bush, Jeffrey D. (US)
Thu, 2 Feb 2023 15:12:23 +0000
Reflow Encapsulant ????
Richard Kraszewski
Fri, 3 Feb 2023 20:58:02 +0000
Re: Reflow Encapsulant ????
Tan Geok Ang
Mon, 6 Feb 2023 06:01:43 +0000
Cool - Caps ????
Richard Kraszewski
Tue, 7 Feb 2023 21:04:57 +0000
Re: Cool - Caps ????
Tempea, Ioan
Tue, 7 Feb 2023 21:19:22 +0000
Edge Bond
<>
Mon, 13 Feb 2023 15:29:43 +0000
R: Edge Bond
Francesco Di Maio
Mon, 13 Feb 2023 17:08:01 +0000
Re: Edge Bond
Bush, Jeffrey D. (US)
Mon, 13 Feb 2023 17:45:09 +0000
Re: Edge Bond
Peter Swanson
Mon, 13 Feb 2023 19:42:59 +0000
Solder in the lead bend
Gumpert, Ben
Tue, 14 Feb 2023 15:16:36 +0000
Re: Solder in the lead bend
Bush, Jeffrey D. (US)
Tue, 14 Feb 2023 15:57:36 +0000
Re: Solder in the lead bend
[log in to unmask]
Tue, 14 Feb 2023 16:00:54 +0000
Re: Solder in the lead bend
[log in to unmask]
Tue, 14 Feb 2023 16:09:59 +0000
Re: Solder in the lead bend
Bush, Jeffrey D. (US)
Tue, 14 Feb 2023 16:16:48 +0000
Re: Solder in the lead bend
Guy Ramsey
Wed, 15 Feb 2023 08:06:47 -0500
Re: Solder in the lead bend
Gumpert, Ben
Thu, 16 Feb 2023 13:49:27 +0000
IPC HDI Standards
Hernandez, Victor G
Fri, 24 Feb 2023 14:08:40 +0000
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