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June 2016


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Table of Contents:

ACF bonding (7 messages)
Anyone at home? (7 messages)
AW: [TN] FR4 in COLD environments (1 message)
AW: [TN] Thermal Cycle Testing (2 messages)
Brian Ellis (3 messages)
BTU reflow oven retractable center support... (4 messages)
Conductive Epoxy Endpoint Requirements (5 messages)
DDR4 DIMM Socket (1 message)
Element Quiz Answer (10 messages)
Element Quiz Question (4 messages)
ENIG Board Finish with Tin Plated hardware (4 messages)
ENIG Nickel plating cracks (2 messages)
Fans and ESD (12 messages)
FR4 in COLD environments (13 messages)
FW: DDR4 DIMM Socket contact gold plating scheme (1 message)
FW: Mail delivery failed (1 message)
High Current or Heavy Copper PCB Design (3 messages)
ICT tester (3 messages)
Industry Resources for IPC Test Boards (10 messages)
laminate package wetting issues on ENIG surface (10 messages)
NTC Clumpy and Klompios (3 messages)
NTC Element Quiz (10 messages)
NTC Element Quiz Information (4 messages)
Part numbering, MRPs & reality (6 messages)
R: [TN] Solder fines (2 messages)
recommend CAm software (3 messages)
recommend CAm software for PCB manufacturing (2 messages)
Solder fines (4 messages)
Temperature/Humidity recorders (5 messages)
Thermal Cycle Testing (11 messages)
Vacation--holiday (1 message)
who is Technet administrator? (4 messages)
wire harness fixtures (8 messages)
[ALU] [TN] Anyone at home? (1 message)
[External] Re: [TN] FR4 in COLD environments (1 message)
[Possible Spam] Re: [TN] Part numbering, MRPs & reality (1 message)

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Subject Sorted by Subject, Chronologically

From

Date

Size

New Thread

ACF bonding

Re: ACF bonding

Ioan Tempea

Thu, 30 Jun 2016 15:47:14 +0000

123 lines

Re: ACF bonding

Yuan-chia Joyce Koo

Thu, 30 Jun 2016 11:38:08 -0400

117 lines

Re: ACF bonding

John Burke

Thu, 30 Jun 2016 07:46:44 -0700

96 lines

Re: ACF bonding

Ioan Tempea

Thu, 30 Jun 2016 11:32:22 +0000

63 lines

Re: ACF bonding

Yuan-chia Joyce Koo

Thu, 30 Jun 2016 07:24:37 -0400

71 lines

Re: ACF bonding

John Burke

Wed, 29 Jun 2016 13:05:39 -0700

71 lines

ACF bonding

Ioan Tempea

Wed, 29 Jun 2016 20:03:23 +0000

51 lines

New Thread

Anyone at home?

Re: Anyone at home?

Steven Creswick

Wed, 29 Jun 2016 12:15:16 -0400

157 lines

Re: Anyone at home?

Stadem, Richard D.

Wed, 29 Jun 2016 16:11:32 +0000

78 lines

Re: Anyone at home?

Bob Wettermann

Wed, 29 Jun 2016 10:57:09 -0500

90 lines

Re: Anyone at home?

Stadem, Richard D.

Wed, 29 Jun 2016 15:52:37 +0000

47 lines

Re: Anyone at home?

George Wenger

Wed, 29 Jun 2016 14:50:04 +0000

51 lines

Re: Anyone at home?

Victor Hernandez

Wed, 29 Jun 2016 14:03:51 +0000

37 lines

Anyone at home?

Brian Ellis

Wed, 29 Jun 2016 16:42:38 +0300

20 lines

New Thread

AW: [TN] FR4 in COLD environments

AW: [TN] FR4 in COLD environments

=?utf-8?B?R3Jvc3NtYW5uLCBHw7xudGVy?=

Thu, 2 Jun 2016 09:21:44 +0000

40 lines

New Thread

AW: [TN] Thermal Cycle Testing

Re: AW: [TN] Thermal Cycle Testing

John Burke

Mon, 27 Jun 2016 14:59:10 -0700

140 lines

AW: [TN] Thermal Cycle Testing

=?iso-8859-1?Q?Grossmann=2C_G=FCnter?=

Mon, 27 Jun 2016 07:54:51 +0000

107 lines

New Thread

Brian Ellis

Re: Brian Ellis

Yuan-chia Joyce Koo

Thu, 23 Jun 2016 14:50:17 -0400

53 lines

Re: Brian Ellis

Steve Gregory

Thu, 23 Jun 2016 10:35:38 -0600

60 lines

Brian Ellis

Graham Naisbitt

Thu, 23 Jun 2016 17:04:32 +0100

34 lines

New Thread

BTU reflow oven retractable center support...

Re: BTU reflow oven retractable center support...

John Burke

Wed, 15 Jun 2016 13:01:54 +0800

118 lines

Re: BTU reflow oven retractable center support...

Steve Gregory

Tue, 14 Jun 2016 18:48:04 -0600

89 lines

Re: BTU reflow oven retractable center support...

Brian Stumm

Tue, 14 Jun 2016 17:29:57 -0700

62 lines

BTU reflow oven retractable center support...

Steve Gregory

Tue, 14 Jun 2016 15:57:10 -0600

40 lines

New Thread

Conductive Epoxy Endpoint Requirements

Re: Conductive Epoxy Endpoint Requirements

Yuan-chia Joyce Koo

Mon, 13 Jun 2016 19:48:16 -0400

102 lines

Re: Conductive Epoxy Endpoint Requirements

Nowland, Russell (Nokia - US)

Mon, 13 Jun 2016 22:02:43 +0000

54 lines

Re: Conductive Epoxy Endpoint Requirements

Ioan Tempea

Mon, 13 Jun 2016 20:05:28 +0000

57 lines

Re: Conductive Epoxy Endpoint Requirements

David Hillman

Mon, 13 Jun 2016 13:44:11 -0500

43 lines

Conductive Epoxy Endpoint Requirements

Russell Nowland

Mon, 13 Jun 2016 13:30:12 -0500

24 lines

New Thread

DDR4 DIMM Socket

DDR4 DIMM Socket

Victor Hernandez

Fri, 10 Jun 2016 18:16:14 +0000

30 lines

New Thread

Element Quiz Answer

Re: Element Quiz Answer

Stadem, Richard D.

Mon, 13 Jun 2016 16:34:17 +0000

269 lines

Re: Element Quiz Answer

David Hillman

Mon, 13 Jun 2016 10:59:26 -0500

379 lines

Re: Element Quiz Answer

Ken Barton

Mon, 13 Jun 2016 15:51:15 +0000

242 lines

Re: Element Quiz Answer

Stadem, Richard D.

Mon, 13 Jun 2016 15:43:18 +0000

231 lines

Re: Element Quiz Answer

Douglas Pauls

Mon, 13 Jun 2016 09:18:57 -0500

257 lines

Re: Element Quiz Answer

Stadem, Richard D.

Mon, 13 Jun 2016 13:26:20 +0000

185 lines

Re: Element Quiz Answer

David Hillman

Mon, 13 Jun 2016 08:00:32 -0500

260 lines

Re: Element Quiz Answer

Douglas Pauls

Fri, 10 Jun 2016 13:56:35 -0500

226 lines

Re: Element Quiz Answer

Graham Collins

Fri, 10 Jun 2016 18:20:47 +0000

225 lines

Element Quiz Answer

David Hillman

Fri, 10 Jun 2016 13:07:12 -0500

191 lines

New Thread

Element Quiz Question

Re: Element Quiz Question

Matthias Mansfeld

Fri, 10 Jun 2016 17:23:21 +0200

45 lines

Re: Element Quiz Question

Stadem, Richard D.

Fri, 10 Jun 2016 13:45:50 +0000

136 lines

Re: Element Quiz Question

Douglas Pauls

Fri, 10 Jun 2016 08:38:23 -0500

218 lines

Element Quiz Question

David Hillman

Fri, 10 Jun 2016 08:25:26 -0500

196 lines

New Thread

ENIG Board Finish with Tin Plated hardware

Re: ENIG Board Finish with Tin Plated hardware

Peter G. Houwen

Fri, 10 Jun 2016 09:51:21 -0500

14 lines

Re: ENIG Board Finish with Tin Plated hardware

Kuczynski, Michael

Wed, 8 Jun 2016 17:18:22 +0000

39 lines

Re: ENIG Board Finish with Tin Plated hardware

Stadem, Richard D.

Wed, 8 Jun 2016 14:48:35 +0000

159 lines

Re: ENIG Board Finish with Tin Plated hardware

David Hillman

Wed, 8 Jun 2016 09:26:57 -0500

171 lines

New Thread

ENIG Nickel plating cracks

Re: ENIG Nickel plating cracks

Yuan-chia Joyce Koo

Mon, 27 Jun 2016 11:00:25 -0400

52 lines

ENIG Nickel plating cracks

Mumtaz Bora

Mon, 27 Jun 2016 14:03:00 +0000

38 lines

New Thread

Fans and ESD

Re: Fans and ESD

lduso - Diamond-MT.com

Wed, 1 Jun 2016 13:04:19 -0400

180 lines

Re: Fans and ESD

Douglas Pauls

Wed, 1 Jun 2016 11:45:53 -0500

164 lines

Re: Fans and ESD

Guy Ramsey

Wed, 1 Jun 2016 12:45:43 -0400

142 lines

Re: Fans and ESD

lduso - Diamond-MT.com

Wed, 1 Jun 2016 12:37:34 -0400

134 lines

Re: Fans and ESD

Douglas Pauls

Wed, 1 Jun 2016 11:32:30 -0500

113 lines

Re: Fans and ESD

lduso - Diamond-MT.com

Wed, 1 Jun 2016 11:50:44 -0400

86 lines

Re: Fans and ESD

Steve Gregory

Wed, 1 Jun 2016 09:43:17 -0600

63 lines

Re: Fans and ESD

Bush, Brien

Wed, 1 Jun 2016 15:37:31 +0000

54 lines

Re: Fans and ESD

Mike Fenner

Wed, 1 Jun 2016 16:33:22 +0100

53 lines

Re: Fans and ESD

lduso - Diamond-MT.com

Wed, 1 Jun 2016 11:17:27 -0400

54 lines

Re: Fans and ESD

Bhanu Sood

Wed, 1 Jun 2016 10:30:06 -0400

51 lines

Fans and ESD

Douglas Pauls

Wed, 1 Jun 2016 09:14:26 -0500

31 lines

New Thread

FR4 in COLD environments

Re: FR4 in COLD environments

Jack Olson

Mon, 6 Jun 2016 10:55:06 -0500

81 lines

Re: FR4 in COLD environments

John Burke

Wed, 1 Jun 2016 22:39:00 -0700

59 lines

Re: FR4 in COLD environments

Yuan-chia Joyce Koo

Wed, 1 Jun 2016 20:15:18 -0400

89 lines

Re: FR4 in COLD environments

Jenkins, Jeffrey A @ CSG - LINKABIT

Wed, 1 Jun 2016 23:54:23 +0000

46 lines

Re: FR4 in COLD environments

Bhanu Sood

Wed, 1 Jun 2016 17:06:25 -0400

45 lines

Re: FR4 in COLD environments

Joyce Koo

Wed, 1 Jun 2016 16:11:29 -0400

136 lines

Re: FR4 in COLD environments

Decker, Scott UTAS

Wed, 1 Jun 2016 18:27:42 +0000

97 lines

Re: FR4 in COLD environments

Douglas Pauls

Wed, 1 Jun 2016 13:16:15 -0500

51 lines

Re: FR4 in COLD environments

Stadem, Richard D.

Wed, 1 Jun 2016 18:12:47 +0000

67 lines

Re: FR4 in COLD environments

Douglas Pauls

Wed, 1 Jun 2016 13:09:48 -0500

75 lines

Re: FR4 in COLD environments

Stadem, Richard D.

Wed, 1 Jun 2016 18:06:12 +0000

46 lines

Re: FR4 in COLD environments

Stadem, Richard D.

Wed, 1 Jun 2016 17:49:12 +0000

36 lines

FR4 in COLD environments

Jack Olson

Wed, 1 Jun 2016 12:35:59 -0500

24 lines

New Thread

FW: DDR4 DIMM Socket contact gold plating scheme

FW: DDR4 DIMM Socket contact gold plating scheme

Victor Hernandez

Wed, 15 Jun 2016 12:44:04 +0000

43 lines

New Thread

FW: Mail delivery failed

FW: Mail delivery failed

Peter Barton

Thu, 9 Jun 2016 15:20:54 +0000

86 lines

New Thread

High Current or Heavy Copper PCB Design

Re: High Current or Heavy Copper PCB Design

Victor Hernandez

Mon, 20 Jun 2016 11:05:13 +0000

44 lines

Re: High Current or Heavy Copper PCB Design

Steve Gregory

Sun, 19 Jun 2016 09:24:15 -0600

70 lines

High Current or Heavy Copper PCB Design

Lum Wee Mei

Sun, 19 Jun 2016 05:42:28 +0000

28 lines

New Thread

ICT tester

Re: ICT tester

Robert Kondner

Fri, 10 Jun 2016 14:08:11 -0400

52 lines

Re: ICT tester

Larry Dzaugis

Fri, 10 Jun 2016 11:15:48 -0500

36 lines

ICT tester

Dominic Boudreau

Fri, 10 Jun 2016 15:50:49 +0000

34 lines

New Thread

Industry Resources for IPC Test Boards

Re: Industry Resources for IPC Test Boards

Douglas Pauls

Fri, 10 Jun 2016 10:09:10 -0500

183 lines

Re: Industry Resources for IPC Test Boards

Ken Barton

Fri, 10 Jun 2016 15:07:20 +0000

118 lines

Re: Industry Resources for IPC Test Boards

Stadem, Richard D.

Fri, 10 Jun 2016 15:04:53 +0000

106 lines

Re: Industry Resources for IPC Test Boards

Richard Kraszewski

Fri, 10 Jun 2016 15:01:45 +0000

97 lines

Re: Industry Resources for IPC Test Boards

Ken Barton

Fri, 10 Jun 2016 14:46:42 +0000

87 lines

Re: Industry Resources for IPC Test Boards

Stadem, Richard D.

Fri, 10 Jun 2016 14:44:48 +0000

75 lines

Re: Industry Resources for IPC Test Boards

Douglas Pauls

Fri, 10 Jun 2016 09:22:40 -0500

89 lines

Re: Industry Resources for IPC Test Boards

Yuan-chia Joyce Koo

Fri, 10 Jun 2016 10:16:24 -0400

78 lines

Re: Industry Resources for IPC Test Boards

Douglas Pauls

Fri, 10 Jun 2016 08:06:28 -0500

54 lines

Industry Resources for IPC Test Boards

Richard Kraszewski

Fri, 10 Jun 2016 12:57:35 +0000

26 lines

New Thread

laminate package wetting issues on ENIG surface

Re: laminate package wetting issues on ENIG surface

Mattix, Dwight

Wed, 22 Jun 2016 13:38:18 +0000

176 lines

Re: laminate package wetting issues on ENIG surface

Mumtaz Bora

Wed, 22 Jun 2016 13:20:42 +0000

76 lines

Re: laminate package wetting issues on ENIG surface

Mumtaz Bora

Wed, 22 Jun 2016 13:19:00 +0000

166 lines

Re: laminate package wetting issues on ENIG surface

David Hillman

Wed, 22 Jun 2016 07:40:55 -0500

62 lines

Re: laminate package wetting issues on ENIG surface

Stadem, Richard D.

Wed, 22 Jun 2016 12:31:33 +0000

146 lines

Re: laminate package wetting issues on ENIG surface

Mumtaz Bora

Wed, 22 Jun 2016 00:44:06 +0000

94 lines

Re: laminate package wetting issues on ENIG surface

George Wenger

Wed, 22 Jun 2016 00:30:54 +0000

88 lines

Re: laminate package wetting issues on ENIG surface

Mumtaz Bora

Wed, 22 Jun 2016 00:08:05 +0000

72 lines

Re: laminate package wetting issues on ENIG surface

Yuan-chia Joyce Koo

Tue, 21 Jun 2016 19:55:40 -0400

55 lines

laminate package wetting issues on ENIG surface

Mumtaz Bora

Tue, 21 Jun 2016 23:42:26 +0000

41 lines

New Thread

NTC Clumpy and Klompios

Re: NTC Clumpy and Klompios

McGlaughlin, Jeffrey A

Fri, 24 Jun 2016 15:23:31 +0000

60 lines

Re: NTC Clumpy and Klompios

Drew meyer

Fri, 24 Jun 2016 12:56:40 +0000

49 lines

NTC Clumpy and Klompios

Douglas Pauls

Fri, 24 Jun 2016 07:47:04 -0500

38 lines

New Thread

NTC Element Quiz

Re: NTC Element Quiz

Stadem, Richard D.

Mon, 20 Jun 2016 12:47:41 +0000

88 lines

Re: NTC Element Quiz

Douglas Pauls

Sun, 19 Jun 2016 13:23:50 -0500

110 lines

Re: NTC Element Quiz

Ravinder Ajmani

Fri, 17 Jun 2016 16:25:06 +0000

64 lines

Re: NTC Element Quiz

David Hillman

Fri, 17 Jun 2016 11:06:28 -0500

50 lines

Re: NTC Element Quiz

Yuan-chia Joyce Koo

Fri, 17 Jun 2016 10:30:43 -0400

43 lines

Re: NTC Element Quiz

Douglas Pauls

Fri, 17 Jun 2016 08:54:47 -0500

53 lines

Re: NTC Element Quiz

Greg Munie

Fri, 17 Jun 2016 13:27:25 +0000

51 lines

Re: NTC Element Quiz

John Burke

Fri, 17 Jun 2016 21:10:09 +0800

47 lines

Re: NTC Element Quiz

lduso - Diamond-MT.com

Fri, 17 Jun 2016 09:06:41 -0400

49 lines

NTC Element Quiz

David Hillman

Fri, 17 Jun 2016 08:00:18 -0500

27 lines

New Thread

NTC Element Quiz Information

Re: NTC Element Quiz Information

Nutting, Phil

Thu, 9 Jun 2016 14:01:10 +0000

119 lines

Re: NTC Element Quiz Information

Stadem, Richard D.

Thu, 9 Jun 2016 14:00:35 +0000

128 lines

Re: NTC Element Quiz Information

Ahne Oosterhof

Thu, 9 Jun 2016 06:41:02 -0700

137 lines

NTC Element Quiz Information

David Hillman

Thu, 9 Jun 2016 08:20:30 -0500

159 lines

New Thread

Part numbering, MRPs & reality

Re: Part numbering, MRPs & reality

Robert Kondner

Wed, 1 Jun 2016 16:52:37 -0400

266 lines

Re: Part numbering, MRPs & reality

Joyce Koo

Wed, 1 Jun 2016 16:08:07 -0400

122 lines

Re: Part numbering, MRPs & reality

Decker, Scott UTAS

Wed, 1 Jun 2016 17:57:35 +0000

111 lines

Re: Part numbering, MRPs & reality

Steve Golemme

Wed, 1 Jun 2016 10:21:59 -0700

117 lines

Re: Part numbering, MRPs & reality

Gerald Bogert (Contractor)

Wed, 1 Jun 2016 13:07:07 -0400

83 lines

Part numbering, MRPs & reality

Ken Barton

Wed, 1 Jun 2016 16:02:12 +0000

48 lines

New Thread

R: [TN] Solder fines

R: [TN] Solder fines

SALA GABRIELE

Fri, 17 Jun 2016 14:25:48 +0200

109 lines

R: [TN] Solder fines

SALA GABRIELE

Fri, 17 Jun 2016 14:23:58 +0200

95 lines

New Thread

recommend CAm software

Re: recommend CAm software

Larry Joy

Mon, 20 Jun 2016 07:46:15 -0400

61 lines

Re: recommend CAm software

Jonathan Griffiths

Mon, 20 Jun 2016 07:08:57 +0000

55 lines

recommend CAm software

Anil Kher

Mon, 20 Jun 2016 11:42:41 +0530

43 lines

New Thread

recommend CAm software for PCB manufacturing

Re: recommend CAm software for PCB manufacturing

Ioan Tempea

Mon, 20 Jun 2016 12:52:36 +0000

108 lines

recommend CAm software for PCB manufacturing

Anil Kher

Mon, 20 Jun 2016 18:10:46 +0530

61 lines

New Thread

Solder fines

Re: Solder fines

Victor Hernandez

Fri, 17 Jun 2016 12:17:23 +0000

64 lines

Re: Solder fines

Greg Munie

Thu, 16 Jun 2016 19:49:14 +0000

46 lines

Re: Solder fines

Stadem, Richard D.

Thu, 16 Jun 2016 18:35:03 +0000

42 lines

Solder fines

Victor Hernandez

Thu, 16 Jun 2016 18:18:34 +0000

25 lines

New Thread

Temperature/Humidity recorders

Re: Temperature/Humidity recorders

Stadem, Richard D.

Mon, 6 Jun 2016 14:03:26 +0000

85 lines

Re: Temperature/Humidity recorders

Douglas Pauls

Mon, 6 Jun 2016 08:03:24 -0500

52 lines

Re: Temperature/Humidity recorders

Stadem, Richard D.

Mon, 6 Jun 2016 12:58:11 +0000

50 lines

Re: Temperature/Humidity recorders

lduso - Diamond-MT.com

Thu, 2 Jun 2016 16:43:25 -0400

51 lines

Temperature/Humidity recorders

Peter Wong

Thu, 2 Jun 2016 20:40:24 +0000

34 lines

New Thread

Thermal Cycle Testing

Re: Thermal Cycle Testing

Stadem, Richard D.

Mon, 27 Jun 2016 13:16:41 +0000

120 lines

Re: Thermal Cycle Testing

Tan Geok Ang

Fri, 24 Jun 2016 02:25:29 +0000

143 lines

Re: Thermal Cycle Testing

Yuan-chia Joyce Koo

Thu, 23 Jun 2016 15:04:45 -0400

128 lines

Re: Thermal Cycle Testing

Stadem, Richard D.

Thu, 23 Jun 2016 18:40:17 +0000

102 lines

Re: Thermal Cycle Testing

Mike Fenner

Thu, 23 Jun 2016 21:39:19 +0300

103 lines

Re: Thermal Cycle Testing

John Burke

Thu, 23 Jun 2016 11:29:50 -0700

100 lines

Re: Thermal Cycle Testing

Bev Christian

Thu, 23 Jun 2016 14:22:44 -0400

73 lines

Re: Thermal Cycle Testing

David Hillman

Thu, 23 Jun 2016 11:30:58 -0500

71 lines

Re: Thermal Cycle Testing

Bhanu Sood

Thu, 23 Jun 2016 09:23:26 -0700

71 lines

Re: Thermal Cycle Testing

Giamis, Andy

Thu, 23 Jun 2016 16:18:13 +0000

71 lines

Thermal Cycle Testing

John Burke

Thu, 23 Jun 2016 09:13:17 -0700

51 lines

New Thread

Vacation--holiday

Vacation--holiday

SUBSCRIBE TechNet Larry Joy

Wed, 29 Jun 2016 08:43:14 -0500

21 lines

New Thread

who is Technet administrator?

Re: who is Technet administrator?

Nutting, Phil

Thu, 9 Jun 2016 19:08:58 +0000

77 lines

Re: who is Technet administrator?

Ahne Oosterhof

Thu, 9 Jun 2016 10:37:35 -0700

95 lines

Re: who is Technet administrator?

Steve Gregory

Thu, 9 Jun 2016 10:34:11 -0600

73 lines

who is Technet administrator?

Nutting, Phil

Thu, 9 Jun 2016 14:28:32 +0000

41 lines

New Thread

wire harness fixtures

Re: wire harness fixtures

Theodore J. Tontis

Wed, 29 Jun 2016 20:41:58 +0000

244 lines

Re: wire harness fixtures

Stadem, Richard D.

Wed, 29 Jun 2016 18:53:34 +0000

166 lines

Re: wire harness fixtures

Ed Popielarski

Wed, 29 Jun 2016 18:41:20 +0000

259 lines

Re: wire harness fixtures

Graham Collins

Wed, 29 Jun 2016 18:31:55 +0000

219 lines

Re: wire harness fixtures

John Burke

Wed, 29 Jun 2016 11:18:49 -0700

178 lines

Re: wire harness fixtures

Ed Popielarski

Wed, 29 Jun 2016 18:13:49 +0000

151 lines

Re: wire harness fixtures

Decker, Scott UTAS

Wed, 29 Jun 2016 16:25:33 +0000

48 lines

wire harness fixtures

Graham Collins

Wed, 29 Jun 2016 16:14:34 +0000

121 lines

New Thread

[ALU] [TN] Anyone at home?

Re: [ALU] [TN] Anyone at home?

Nowland, Russell (Nokia - US)

Wed, 29 Jun 2016 13:51:17 +0000

32 lines

New Thread

[External] Re: [TN] FR4 in COLD environments

Re: [External] Re: [TN] FR4 in COLD environments

Decker, Scott UTAS

Wed, 1 Jun 2016 20:34:10 +0000

129 lines

New Thread

[Possible Spam] Re: [TN] Part numbering, MRPs & reality

Re: [Possible Spam] Re: [TN] Part numbering, MRPs & reality

Ken Barton

Wed, 1 Jun 2016 20:28:50 +0000

168 lines

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