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February 2012


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Table of Contents:

答复: discussion between you and JIAN about 0.1 mm coutyard (1 message)
Air Bubbles in Syringes of Solder Paste... (15 messages)
Aluminum 3003-H14 (2 messages)
Antwort: RE [TN] Antwort: [TN] R: [TN] Microballs (1 message)
Antwort: [TN] R: [TN] Microballs (1 message)
APEX (3 messages)
APEX 2012 Technetters (2 messages)
Are Rosin and Resin Fluxes TRULY equivalent? (2 messages)
ASTM 4130 steel (4 messages)
AW: Gerber files viewer (1 message)
baking after strip of plating resist (1 message)
Cleaning ESD Floor Mats (2 messages)
Conf Coating in Cold and Clammy (16 messages)
Congratulations, Mr.Hillman! (7 messages)
Correlation Factors for ROSE Testing (20 messages)
Correlation Factors for ROSE Testing & Cpk (6 messages)
Counterfeit Suspension Memo... (4 messages)
Cu - dissolution and IMC growth rate (5 messages)
Cu dissolution and IMC thickness questions (1 message)
ENIG thickness (10 messages)
EXTERNAL: Re: [TN] Is this a gull wing lead? (1 message)
Field Return Product w/corrosion product (7 messages)
Gerber files viewer (8 messages)
halides in water soluble fluxes (12 messages)
High temperature inside Printer Machine (3 messages)
How can I remove solder mask? (6 messages)
IPC-4562 - Copper Foil Ductility (1 message)
IPC-STD-030 underfill standard (2 messages)
IR Reflow Oven capability (6 messages)
Is 99% USP IPA what most folks use? (5 messages)
Is this a gull wing lead? (2 messages)
Late Friday Question (3 messages)
Lead Free Fillet Lift (2 messages)
Lead to Hole Ratio for Wave and Selective Soldering (7 messages)
looking for suggestions for no-clean flux-core PB-free wire solder (13 messages)
Max downward pressure applied to BGA with heat sink (3 messages)
Measure of "How long after printing can parts be placed." (2 messages)
Microballs (6 messages)
NTC Friday Element Quiz - the Answer (16 messages)
NTC Friday Element Quiz - the Question (33 messages)
NTC: APEX 2012 Technetters (26 messages)
Old Harddisk for Mydata PnP (3 messages)
Post Thermal Cycle induced solder stress-fractures (1 message)
Query -- Fiducial (3 messages)
R: [TN] Cu - dissolution and IMC growth rate (6 messages)
R: [TN] Microballs (5 messages)
R: [TN] R: [TN] Microballs (2 messages)
R: [TN] Restoration of Humidity Indicator Cards (1 message)
RE [TN] Antwort: [TN] R: [TN] Microballs (1 message)
RES: Gerber files viewer (1 message)
RES: High temperature inside Printer Machine (2 messages)
Restoration of Humidity Indicator Cards (2 messages)
Sanding board edges after reflow (8 messages)
Setting special nozzle on fuji flexa (1 message)
Siliporite molecular sieve (5 messages)
Silver immersion with gold fingers (4 messages)
Solder etchant, Sn-99.3-Cu-0.7, Post Thermal Cycle induced fractures (3 messages)
Soldermask adhesion test (5 messages)
Surface Finish for Backplane Board (4 messages)
TechNet Archives (6 messages)
Tin Pest (6 messages)
Tin/Zinc whiskers (3 messages)
Typical ROSE Test Duration (5 messages)
Zinc plating processes (3 messages)
[OT] Conductivity of Oxides and Passivation Coatings (6 messages)

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答复: discussion between you and JIAN about 0.1 mm coutyard

答复: discussion between you and JIAN about 0.1 mm coutyard

Leesha PENG Lixia <[log in to unmask]>

Mon, 27 Feb 2012 02:07:21 +0000

27 lines

New Thread

Air Bubbles in Syringes of Solder Paste...

Air Bubbles in Syringes of Solder Paste...

Steve Gregory <[log in to unmask]>

Wed, 22 Feb 2012 19:51:58 -0500

59 lines

Re: Air Bubbles in Syringes of Solder Paste...

Steve Gregory <[log in to unmask]>

Wed, 22 Feb 2012 19:58:55 -0500

68 lines

Re: Air Bubbles in Syringes of Solder Paste...

Joyce Koo <[log in to unmask]>

Thu, 23 Feb 2012 01:50:13 +0000

81 lines

Re: Air Bubbles in Syringes of Solder Paste...

Steve Gregory <[log in to unmask]>

Wed, 22 Feb 2012 21:06:51 -0500

125 lines

Re: Air Bubbles in Syringes of Solder Paste...

Bev Christian <[log in to unmask]>

Wed, 22 Feb 2012 21:29:43 -0500

79 lines

Re: Air Bubbles in Syringes of Solder Paste...

Larry Dzaugis <[log in to unmask]>

Wed, 22 Feb 2012 21:00:25 -0600

22 lines

Re: Air Bubbles in Syringes of Solder Paste...

Brian Ellis <[log in to unmask]>

Thu, 23 Feb 2012 09:52:07 +0200

123 lines

Re: Air Bubbles in Syringes of Solder Paste...

Steven Creswick <[log in to unmask]>

Thu, 23 Feb 2012 04:57:23 -0500

60 lines

Re: Air Bubbles in Syringes of Solder Paste...

David D. Hillman <[log in to unmask]>

Thu, 23 Feb 2012 07:14:11 -0600

121 lines

Re: Air Bubbles in Syringes of Solder Paste...

Mike Fenner <[log in to unmask]>

Thu, 23 Feb 2012 23:45:07 +0000

107 lines

Re: Air Bubbles in Syringes of Solder Paste...

Bev Christian <[log in to unmask]>

Thu, 23 Feb 2012 18:58:31 -0500

105 lines

Re: Air Bubbles in Syringes of Solder Paste...

Mike Fenner <[log in to unmask]>

Fri, 24 Feb 2012 17:07:50 +0000

128 lines

Re: Air Bubbles in Syringes of Solder Paste...

Stadem, Richard D. <[log in to unmask]>

Fri, 24 Feb 2012 12:06:17 -0600

166 lines

Re: Air Bubbles in Syringes of Solder Paste...

Larry Dzaugis <[log in to unmask]>

Fri, 24 Feb 2012 14:03:28 -0600

36 lines

Re: Air Bubbles in Syringes of Solder Paste...

Goodyear, Patrick <[log in to unmask]>

Mon, 27 Feb 2012 17:52:08 +0000

185 lines

New Thread

Aluminum 3003-H14

Aluminum 3003-H14

Harp, Ken <[log in to unmask]>

Thu, 16 Feb 2012 21:44:09 +0000

25 lines

Re: Aluminum 3003-H14

Inge Hernefjord <[log in to unmask]>

Fri, 17 Feb 2012 00:19:31 +0100

43 lines

New Thread

Antwort: RE [TN] Antwort: [TN] R: [TN] Microballs

Antwort: RE [TN] Antwort: [TN] R: [TN] Microballs

Frank Kriesch <[log in to unmask]>

Thu, 23 Feb 2012 15:23:08 +0100

258 lines

New Thread

Antwort: [TN] R: [TN] Microballs

Antwort: [TN] R: [TN] Microballs

Frank Kriesch <[log in to unmask]>

Wed, 22 Feb 2012 11:21:06 +0100

175 lines

New Thread

APEX

APEX

Louis Hart <[log in to unmask]>

Wed, 22 Feb 2012 23:40:29 +0000

30 lines

Apex

Ed <[log in to unmask]>

Thu, 23 Feb 2012 19:28:04 -0800

49 lines

Re: Apex

Garcia, Rigo (GSFC-300.0)[MANTECH SRS TECHNOLOGIES] <[log in to unmask]>

Fri, 24 Feb 2012 07:47:34 -0600

79 lines

New Thread

APEX 2012 Technetters

Re: APEX 2012 Technetters

Joyce Koo <[log in to unmask]>

Thu, 23 Feb 2012 21:05:55 +0000

59 lines

Re: APEX 2012 Technetters

Ian Hanna <[log in to unmask]>

Thu, 23 Feb 2012 16:08:15 -0500

86 lines

New Thread

Are Rosin and Resin Fluxes TRULY equivalent?

Are Rosin and Resin Fluxes TRULY equivalent?

Garcia, Rigo (GSFC-300.0)[MANTECH SRS TECHNOLOGIES] <[log in to unmask]>

Fri, 17 Feb 2012 15:32:15 -0600

39 lines

Re: Are Rosin and Resin Fluxes TRULY equivalent?

Mike Fenner <[log in to unmask]>

Sat, 18 Feb 2012 20:44:45 +0000

92 lines

New Thread

ASTM 4130 steel

ASTM 4130 steel

Victor Hernandez <[log in to unmask]>

Fri, 3 Feb 2012 09:17:20 -0600

36 lines

Re: ASTM 4130 steel

Giamis, Andy <[log in to unmask]>

Fri, 3 Feb 2012 09:28:01 -0600

71 lines

Re: ASTM 4130 steel

R Sedlak <[log in to unmask]>

Fri, 3 Feb 2012 13:38:51 -0800

61 lines

Re: ASTM 4130 steel

Fox, Ian <[log in to unmask]>

Mon, 6 Feb 2012 08:54:38 +0000

93 lines

New Thread

AW: Gerber files viewer

AW: Gerber files viewer

Torsten Hagge <[log in to unmask]>

Tue, 28 Feb 2012 15:15:28 +0000

79 lines

New Thread

baking after strip of plating resist

baking after strip of plating resist

Louis Hart <[log in to unmask]>

Tue, 14 Feb 2012 17:12:18 +0000

34 lines

New Thread

Cleaning ESD Floor Mats

Cleaning ESD Floor Mats

Blair Hogg <[log in to unmask]>

Thu, 23 Feb 2012 13:53:29 -0600

35 lines

Re: Cleaning ESD Floor Mats

Goodyear, Patrick <[log in to unmask]>

Thu, 23 Feb 2012 22:32:40 +0000

56 lines

New Thread

Conf Coating in Cold and Clammy

Conf Coating in Cold and Clammy

Douglas Pauls <[log in to unmask]>

Fri, 10 Feb 2012 15:42:04 -0600

56 lines

Re: Conf Coating in Cold and Clammy

Joyce Koo <[log in to unmask]>

Fri, 10 Feb 2012 23:53:50 +0000

96 lines

Re: Conf Coating in Cold and Clammy

Steven Creswick <[log in to unmask]>

Sat, 11 Feb 2012 12:06:14 -0500

105 lines

Re: Conf Coating in Cold and Clammy

Chris Mahanna <[log in to unmask]>

Mon, 13 Feb 2012 16:24:14 -0500

97 lines

Re: Conf Coating in Cold and Clammy

Joyce Koo <[log in to unmask]>

Mon, 13 Feb 2012 21:42:51 +0000

126 lines

Re: Conf Coating in Cold and Clammy

David D. Hillman <[log in to unmask]>

Mon, 13 Feb 2012 16:53:43 -0600

163 lines

Re: Conf Coating in Cold and Clammy

Robert Kondner <[log in to unmask]>

Mon, 13 Feb 2012 18:14:42 -0500

180 lines

Re: Conf Coating in Cold and Clammy

Phil Bavaro <[log in to unmask]>

Mon, 13 Feb 2012 15:44:59 -0800

217 lines

Re: Conf Coating in Cold and Clammy

Robert Kondner <[log in to unmask]>

Mon, 13 Feb 2012 18:54:13 -0500

220 lines

Re: Conf Coating in Cold and Clammy

David D. Hillman <[log in to unmask]>

Tue, 14 Feb 2012 07:02:21 -0600

222 lines

Re: Conf Coating in Cold and Clammy

Douglas Pauls <[log in to unmask]>

Tue, 14 Feb 2012 15:50:11 -0600

124 lines

Re: Conf Coating in Cold and Clammy

Garcia, Rigo (GSFC-300.0)[MANTECH SRS TECHNOLOGIES] <[log in to unmask]>

Tue, 14 Feb 2012 15:53:10 -0600

151 lines

Re: Conf Coating in Cold and Clammy

Douglas Pauls <[log in to unmask]>

Tue, 14 Feb 2012 16:04:14 -0600

172 lines

Re: Conf Coating in Cold and Clammy

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Wed, 15 Feb 2012 14:42:42 +0000

238 lines

Re: Conf Coating in Cold and Clammy

Steven Creswick <[log in to unmask]>

Wed, 15 Feb 2012 12:14:20 -0500

253 lines

Re: Conf Coating in Cold and Clammy

Chris Mahanna <[log in to unmask]>

Wed, 15 Feb 2012 12:59:54 -0500

214 lines

New Thread

Congratulations, Mr.Hillman!

Congratulations, Mr.Hillman!

Jack Olson <[log in to unmask]>

Fri, 3 Feb 2012 11:37:38 -0600

21 lines

Re: Congratulations, Mr.Hillman!

Karen Tellefsen <[log in to unmask]>

Fri, 3 Feb 2012 13:10:21 -0500

89 lines

Re: Congratulations, Mr.Hillman!

Mike Buetow <[log in to unmask]>

Fri, 3 Feb 2012 13:14:56 -0500

35 lines

Re: Congratulations, Mr.Hillman!

Joyce Koo <[log in to unmask]>

Fri, 3 Feb 2012 18:19:12 +0000

122 lines

Re: Congratulations, Mr.Hillman!

Victor Hernandez <[log in to unmask]>

Fri, 3 Feb 2012 12:20:04 -0600

42 lines

Re: Congratulations, Mr.Hillman!

David D. Hillman <[log in to unmask]>

Fri, 3 Feb 2012 13:55:50 -0600

64 lines

Re: Congratulations, Mr.Hillman!

Inge Hernefjord <[log in to unmask]>

Fri, 3 Feb 2012 20:59:56 +0100

38 lines

New Thread

Correlation Factors for ROSE Testing

Correlation Factors for ROSE Testing

Richard Kraszewski <[log in to unmask]>

Thu, 16 Feb 2012 13:59:50 -0600

36 lines

Re: Correlation Factors for ROSE Testing

Glidden, Kevin <[log in to unmask]>

Thu, 16 Feb 2012 15:06:15 -0500

60 lines

Re: Correlation Factors for ROSE Testing

Louis Hart <[log in to unmask]>

Thu, 16 Feb 2012 20:06:28 +0000

53 lines

Re: Correlation Factors for ROSE Testing

Douglas Pauls <[log in to unmask]>

Thu, 16 Feb 2012 14:38:15 -0600

65 lines

Re: Correlation Factors for ROSE Testing

Victor Hernandez <[log in to unmask]>

Thu, 16 Feb 2012 14:55:24 -0600

88 lines

Re: Correlation Factors for ROSE Testing

Garcia, Rigo (GSFC-300.0)[MANTECH SRS TECHNOLOGIES] <[log in to unmask]>

Thu, 16 Feb 2012 14:57:27 -0600

109 lines

Re: Correlation Factors for ROSE Testing

Lamar Young <[log in to unmask]>

Thu, 16 Feb 2012 15:59:21 -0500

62 lines

Re: Correlation Factors for ROSE Testing

Lamar Young <[log in to unmask]>

Thu, 16 Feb 2012 16:08:42 -0500

74 lines

Re: Correlation Factors for ROSE Testing

Graham Naisbitt <[log in to unmask]>

Thu, 16 Feb 2012 22:00:42 +0000

78 lines

Re: Correlation Factors for ROSE Testing

Brian Ellis <[log in to unmask]>

Fri, 17 Feb 2012 00:47:31 +0200

73 lines

Re: Correlation Factors for ROSE Testing

Bev Christian <[log in to unmask]>

Thu, 16 Feb 2012 20:10:07 -0500

89 lines

Re: Correlation Factors for ROSE Testing

PIRES Fabrice <[log in to unmask]>

Fri, 17 Feb 2012 09:03:48 +0100

64 lines

Re: Correlation Factors for ROSE Testing

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Fri, 17 Feb 2012 13:41:05 +0000

72 lines

Re: Correlation Factors for ROSE Testing

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Fri, 17 Feb 2012 14:16:50 +0000

95 lines

Re: Correlation Factors for ROSE Testing

Douglas Pauls <[log in to unmask]>

Fri, 17 Feb 2012 08:23:05 -0600

115 lines

Re: Correlation Factors for ROSE Testing

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Fri, 17 Feb 2012 15:26:03 +0000

126 lines

Re: Correlation Factors for ROSE Testing

Richard Kraszewski <[log in to unmask]>

Fri, 17 Feb 2012 13:53:00 -0600

96 lines

Re: Correlation Factors for ROSE Testing

Graham Naisbitt <[log in to unmask]>

Fri, 17 Feb 2012 20:14:12 +0000

105 lines

Re: Correlation Factors for ROSE Testing

Joyce Koo <[log in to unmask]>

Fri, 17 Feb 2012 20:21:23 +0000

135 lines

Re: Correlation Factors for ROSE Testing

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Fri, 17 Feb 2012 20:32:36 +0000

151 lines

New Thread

Correlation Factors for ROSE Testing & Cpk

Re: Correlation Factors for ROSE Testing & Cpk

Richard Kraszewski <[log in to unmask]>

Fri, 17 Feb 2012 14:22:18 -0600

74 lines

Re: Correlation Factors for ROSE Testing & Cpk

Joyce Koo <[log in to unmask]>

Fri, 17 Feb 2012 20:31:02 +0000

106 lines

Re: Correlation Factors for ROSE Testing & Cpk

Garcia, Rigo (GSFC-300.0)[MANTECH SRS TECHNOLOGIES] <[log in to unmask]>

Fri, 17 Feb 2012 14:54:39 -0600

123 lines

Re: Correlation Factors for ROSE Testing & Cpk

Brian Ellis <[log in to unmask]>

Sat, 18 Feb 2012 12:55:30 +0200

168 lines

Re: Correlation Factors for ROSE Testing & Cpk

Richard Kraszewski <[log in to unmask]>

Sat, 18 Feb 2012 14:25:58 -0600

129 lines

Re: Correlation Factors for ROSE Testing & Cpk

Amol Kane (Asteelflash,US) <[log in to unmask]>

Tue, 21 Feb 2012 06:34:08 -0800

103 lines

New Thread

Counterfeit Suspension Memo...

Counterfeit Suspension Memo...

Steve Gregory <[log in to unmask]>

Fri, 10 Feb 2012 10:01:32 -0500

33 lines

Re: Counterfeit Suspension Memo...

Steven Creswick <[log in to unmask]>

Fri, 10 Feb 2012 10:35:47 -0500

60 lines

Re: Counterfeit Suspension Memo...

Rick Bell <[log in to unmask]>

Fri, 10 Feb 2012 09:49:51 -0600

101 lines

Re: Counterfeit Suspension Memo...

Gerald Bogert <[log in to unmask]>

Fri, 10 Feb 2012 11:49:21 -0500

133 lines

New Thread

Cu - dissolution and IMC growth rate

Cu - dissolution and IMC growth rate

Stewart McCracken <[log in to unmask]>

Thu, 2 Feb 2012 10:11:55 +0000

75 lines

Re: Cu - dissolution and IMC growth rate

Rex Waygood <[log in to unmask]>

Thu, 2 Feb 2012 15:48:43 +0000

136 lines

Re: Cu - dissolution and IMC growth rate

Guy Ramsey <[log in to unmask]>

Thu, 2 Feb 2012 14:48:37 -0500

162 lines

Re: Cu - dissolution and IMC growth rate

Mike Fenner <[log in to unmask]>

Thu, 2 Feb 2012 21:19:12 +0000

114 lines

Re: Cu - dissolution and IMC growth rate

David D. Hillman <[log in to unmask]>

Thu, 2 Feb 2012 16:02:19 -0600

148 lines

New Thread

Cu dissolution and IMC thickness questions

Cu dissolution and IMC thickness questions

Stewart McCracken <[log in to unmask]>

Wed, 8 Feb 2012 09:55:43 +0000

43 lines

New Thread

ENIG thickness

ENIG thickness

Victor Hernandez <[log in to unmask]>

Thu, 2 Feb 2012 09:37:46 -0600

37 lines

Re: ENIG thickness

John Burke <[log in to unmask]>

Thu, 2 Feb 2012 08:00:39 -0800

32 lines

Re: ENIG thickness

Wenger, George M. <[log in to unmask]>

Thu, 2 Feb 2012 10:21:28 -0600

49 lines

Re: ENIG thickness

Guy Ramsey <[log in to unmask]>

Thu, 2 Feb 2012 11:25:18 -0500

45 lines

Re: ENIG thickness

David D. Hillman <[log in to unmask]>

Thu, 2 Feb 2012 10:36:04 -0600

87 lines

Re: ENIG thickness

Rex Waygood <[log in to unmask]>

Thu, 2 Feb 2012 16:40:58 +0000

62 lines

Re: ENIG thickness

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Thu, 2 Feb 2012 16:42:23 +0000

108 lines

Re: ENIG thickness

Guy Ramsey <[log in to unmask]>

Thu, 2 Feb 2012 11:52:39 -0500

70 lines

Re: ENIG thickness

David D. Hillman <[log in to unmask]>

Thu, 2 Feb 2012 13:40:48 -0600

218 lines

Re: ENIG thickness

Mike Fenner <[log in to unmask]>

Thu, 2 Feb 2012 21:09:10 +0000

79 lines

New Thread

EXTERNAL: Re: [TN] Is this a gull wing lead?

Re: EXTERNAL: Re: [TN] Is this a gull wing lead?

Gumpert, Ben <[log in to unmask]>

Thu, 23 Feb 2012 21:22:37 +0000

53 lines

New Thread

Field Return Product w/corrosion product

Field Return Product w/corrosion product

Victor Hernandez <[log in to unmask]>

Wed, 29 Feb 2012 08:53:17 -0600

34 lines

Re: Field Return Product w/corrosion product

Phil Bavaro <[log in to unmask]>

Wed, 29 Feb 2012 08:19:11 -0800

62 lines

Re: Field Return Product w/corrosion product

Steven Creswick <[log in to unmask]>

Wed, 29 Feb 2012 12:06:20 -0500

74 lines

Re: Field Return Product w/corrosion product

Inge Hernefjord <[log in to unmask]>

Wed, 29 Feb 2012 18:32:27 +0100

71 lines

Re: Field Return Product w/corrosion product

Brian Ellis <[log in to unmask]>

Wed, 29 Feb 2012 20:01:30 +0200

46 lines

Re: Field Return Product w/corrosion product

Joyce Koo <[log in to unmask]>

Wed, 29 Feb 2012 18:14:38 +0000

88 lines

Re: Field Return Product w/corrosion product

Steve Gregory <[log in to unmask]>

Wed, 29 Feb 2012 14:41:42 -0500

60 lines

New Thread

Gerber files viewer

Gerber files viewer

Jim West <[log in to unmask]>

Mon, 27 Feb 2012 08:14:44 -0500

42 lines

Re: Gerber files viewer

James Head <[log in to unmask]>

Mon, 27 Feb 2012 13:28:16 +0000

99 lines

Re: Gerber files viewer

Montanher, Mickael Canassa <[log in to unmask]>

Mon, 27 Feb 2012 14:29:27 +0100

64 lines

Re: Gerber files viewer

Gumpert, Ben <[log in to unmask]>

Mon, 27 Feb 2012 13:33:55 +0000

49 lines

Re: Gerber files viewer

Karen Tellefsen <[log in to unmask]>

Mon, 27 Feb 2012 08:44:16 -0500

107 lines

Re: Gerber files viewer

Steve Gregory <[log in to unmask]>

Mon, 27 Feb 2012 10:42:18 -0500

63 lines

Re: Gerber files viewer

Blair Hogg <[log in to unmask]>

Tue, 28 Feb 2012 07:16:19 -0600

28 lines

Re: Gerber files viewer

Brian Chandler <[log in to unmask]>

Tue, 28 Feb 2012 09:02:17 -0600

14 lines

New Thread

halides in water soluble fluxes

halides in water soluble fluxes

Phil Nutting <[log in to unmask]>

Tue, 28 Feb 2012 14:12:36 -0500

50 lines

Re: halides in water soluble fluxes

Inge Hernefjord <[log in to unmask]>

Tue, 28 Feb 2012 23:11:46 +0100

87 lines

Re: halides in water soluble fluxes

Inge Hernefjord <[log in to unmask]>

Tue, 28 Feb 2012 23:14:51 +0100

94 lines

Re: halides in water soluble fluxes

Mike Fenner <[log in to unmask]>

Tue, 28 Feb 2012 22:23:24 +0000

87 lines

Re: halides in water soluble fluxes

Brian Ellis <[log in to unmask]>

Wed, 29 Feb 2012 09:48:43 +0200

96 lines

Re: halides in water soluble fluxes

Brian Ellis <[log in to unmask]>

Wed, 29 Feb 2012 12:32:53 +0200

161 lines

Re: halides in water soluble fluxes

Joyce Koo <[log in to unmask]>

Wed, 29 Feb 2012 11:07:29 +0000

144 lines

Re: halides in water soluble fluxes

Brian Ellis <[log in to unmask]>

Wed, 29 Feb 2012 13:57:05 +0200

133 lines

Re: halides in water soluble fluxes

Amol Kane (Asteelflash,US) <[log in to unmask]>

Wed, 29 Feb 2012 05:22:45 -0800

89 lines

Re: halides in water soluble fluxes

Joyce Koo <[log in to unmask]>

Wed, 29 Feb 2012 13:27:09 +0000

195 lines

Re: halides in water soluble fluxes

Brian Ellis <[log in to unmask]>

Wed, 29 Feb 2012 15:47:26 +0200

230 lines

Re: halides in water soluble fluxes

Phil Nutting <[log in to unmask]>

Wed, 29 Feb 2012 09:52:44 -0500

103 lines

New Thread

High temperature inside Printer Machine

High temperature inside Printer Machine

Juliano Pacheco <[log in to unmask]>

Thu, 16 Feb 2012 15:12:55 -0200

25 lines

Re: High temperature inside Printer Machine

Joyce Koo <[log in to unmask]>

Thu, 16 Feb 2012 17:16:33 +0000

56 lines

Re: High temperature inside Printer Machine

Inge Hernefjord <[log in to unmask]>

Fri, 17 Feb 2012 10:17:03 +0100

49 lines

New Thread

How can I remove solder mask?

How can I remove solder mask?

Carl VanWormer <[log in to unmask]>

Thu, 9 Feb 2012 10:00:00 -0800

36 lines

Re: How can I remove solder mask?

Steve Gregory <[log in to unmask]>

Thu, 9 Feb 2012 18:29:43 -0500

80 lines

Re: How can I remove solder mask?

Paul Edwards <[log in to unmask]>

Fri, 10 Feb 2012 16:44:01 -0800

60 lines

Re: How can I remove solder mask?

Inge Hernefjord <[log in to unmask]>

Sat, 11 Feb 2012 07:48:40 +0100

67 lines

Re: How can I remove solder mask?

Blakley, Peggi J CIV NSWC CRANE, GXSQ <[log in to unmask]>

Mon, 13 Feb 2012 08:01:24 -0500

51 lines

Re: How can I remove solder mask?

Carl VanWormer <[log in to unmask]>

Mon, 13 Feb 2012 07:16:20 -0800

96 lines

New Thread

IPC-4562 - Copper Foil Ductility

IPC-4562 - Copper Foil Ductility

Harp, Ken <[log in to unmask]>

Thu, 2 Feb 2012 23:27:41 +0000

40 lines

New Thread

IPC-STD-030 underfill standard

IPC-STD-030 underfill standard

Joyce Koo <[log in to unmask]>

Mon, 27 Feb 2012 17:27:45 +0000

38 lines

Re: IPC-STD-030 underfill standard

Joyce Koo <[log in to unmask]>

Wed, 29 Feb 2012 15:57:38 +0000

121 lines

New Thread

IR Reflow Oven capability

IR Reflow Oven capability

Watson, Howard A <[log in to unmask]>

Wed, 15 Feb 2012 15:44:24 +0000

43 lines

Re: IR Reflow Oven capability

David D. Hillman <[log in to unmask]>

Wed, 15 Feb 2012 10:47:15 -0600

89 lines

Re: IR Reflow Oven capability

Guy Ramsey <[log in to unmask]>

Wed, 15 Feb 2012 13:04:46 -0500

86 lines

Re: IR Reflow Oven capability

Watson, Howard A <[log in to unmask]>

Wed, 15 Feb 2012 20:09:24 +0000

102 lines

Re: IR Reflow Oven capability

Mike Fenner <[log in to unmask]>

Thu, 16 Feb 2012 11:35:14 +0000

128 lines

Re: IR Reflow Oven capability

Nigel Burtt <[log in to unmask]>

Thu, 16 Feb 2012 10:07:13 -0600

26 lines

New Thread

Is 99% USP IPA what most folks use?

Is 99% USP IPA what most folks use?

Robert Kondner <[log in to unmask]>

Sat, 4 Feb 2012 19:24:33 -0500

59 lines

Re: Is 99% USP IPA what most folks use?

Phil Bavaro <[log in to unmask]>

Sat, 4 Feb 2012 17:40:21 -0800

90 lines

Re: Is 99% USP IPA what most folks use?

Inge Hernefjord <[log in to unmask]>

Sun, 5 Feb 2012 08:33:38 +0100

101 lines

Re: Is 99% USP IPA what most folks use?

Brian Ellis <[log in to unmask]>

Sun, 5 Feb 2012 09:55:27 +0200

87 lines

Re: Is 99% USP IPA what most folks use?

Robert Kondner <[log in to unmask]>

Sun, 5 Feb 2012 14:54:13 -0500

127 lines

New Thread

Is this a gull wing lead?

Is this a gull wing lead?

Gumpert, Ben <[log in to unmask]>

Wed, 22 Feb 2012 19:42:07 +0000

28 lines

Re: Is this a gull wing lead?

Larry Dzaugis <[log in to unmask]>

Wed, 22 Feb 2012 15:31:29 -0600

51 lines

New Thread

Late Friday Question

Late Friday Question

Steven Kelly <[log in to unmask]>

Fri, 17 Feb 2012 22:13:14 +0000

18 lines

Re: Late Friday Question

Joyce Koo <[log in to unmask]>

Fri, 17 Feb 2012 22:53:26 +0000

46 lines

Re: Late Friday Question

Inge Hernefjord <[log in to unmask]>

Fri, 17 Feb 2012 23:45:57 +0100

32 lines

New Thread

Lead Free Fillet Lift

Lead Free Fillet Lift

Jeff Popp <[log in to unmask]>

Fri, 17 Feb 2012 18:52:35 +0000

30 lines

Re: Lead Free Fillet Lift

David D. Hillman <[log in to unmask]>

Fri, 17 Feb 2012 18:42:37 -0600

75 lines

New Thread

Lead to Hole Ratio for Wave and Selective Soldering

Lead to Hole Ratio for Wave and Selective Soldering

Carl Ray <[log in to unmask]>

Wed, 15 Feb 2012 16:48:41 -0500

25 lines

Re: Lead to Hole Ratio for Wave and Selective Soldering

Reuven Rokah <[log in to unmask]>

Thu, 16 Feb 2012 09:01:05 +0200

58 lines

Re: Lead to Hole Ratio for Wave and Selective Soldering

Mark Larson <[log in to unmask]>

Tue, 21 Feb 2012 10:02:36 -0600

23 lines

Re: Lead to Hole Ratio for Wave and Selective Soldering

Jack Olson <[log in to unmask]>

Wed, 22 Feb 2012 08:33:34 -0600

36 lines

Re: Lead to Hole Ratio for Wave and Selective Soldering

Mark Larson <[log in to unmask]>

Wed, 22 Feb 2012 09:05:34 -0600

18 lines

Re: Lead to Hole Ratio for Wave and Selective Soldering

Mark Larson <[log in to unmask]>

Wed, 22 Feb 2012 09:11:14 -0600

17 lines

Re: Lead to Hole Ratio for Wave and Selective Soldering

Larry Dzaugis <[log in to unmask]>

Wed, 22 Feb 2012 16:01:47 -0600

26 lines

New Thread

looking for suggestions for no-clean flux-core PB-free wire solder

looking for suggestions for no-clean flux-core PB-free wire solder

Carl VanWormer <[log in to unmask]>

Sun, 26 Feb 2012 10:34:27 -0800

49 lines

Re: looking for suggestions for no-clean flux-core PB-free wire solder

Reuven Rokah <[log in to unmask]>

Sun, 26 Feb 2012 21:11:33 +0200

83 lines

Re: looking for suggestions for no-clean flux-core PB-free wire solder

Nigel Burtt <[log in to unmask]>

Mon, 27 Feb 2012 02:53:25 -0600

25 lines

Re: looking for suggestions for no-clean flux-core PB-free wire solder

Nigel Burtt <[log in to unmask]>

Mon, 27 Feb 2012 02:55:17 -0600

14 lines

Re: looking for suggestions for no-clean flux-core PB-free wire solder

Robert Kondner <[log in to unmask]>

Mon, 27 Feb 2012 07:46:02 -0500

38 lines

Re: looking for suggestions for no-clean flux-core PB-free wire solder

Phil Nutting <[log in to unmask]>

Mon, 27 Feb 2012 08:51:16 -0500

78 lines

Re: looking for suggestions for no-clean flux-core PB-free wire solder

Karen Tellefsen <[log in to unmask]>

Mon, 27 Feb 2012 08:53:51 -0500

100 lines

Re: looking for suggestions for no-clean flux-core PB-free wire solder

Nigel Burtt <[log in to unmask]>

Mon, 27 Feb 2012 09:57:50 -0600

22 lines

Re: looking for suggestions for no-clean flux-core PB-free wire solder

Julie Silk <[log in to unmask]>

Mon, 27 Feb 2012 10:21:09 -0600

20 lines

Re: looking for suggestions for no-clean flux-core PB-free wire solder

Karen Tellefsen <[log in to unmask]>

Mon, 27 Feb 2012 11:30:35 -0500

89 lines

Re: looking for suggestions for no-clean flux-core PB-free wire solder

Fox, Ian <[log in to unmask]>

Mon, 27 Feb 2012 16:31:41 +0000

47 lines

Re: looking for suggestions for no-clean flux-core PB-free wire solder

Carl VanWormer <[log in to unmask]>

Mon, 27 Feb 2012 08:35:39 -0800

83 lines

Re: looking for suggestions for no-clean flux-core PB-free wire solder

Robert Kondner <[log in to unmask]>

Mon, 27 Feb 2012 11:53:17 -0500

49 lines

New Thread

Max downward pressure applied to BGA with heat sink

Max downward pressure applied to BGA with heat sink

Scott Lefebvre <[log in to unmask]>

Fri, 17 Feb 2012 10:09:17 -0800

38 lines

Re: Max downward pressure applied to BGA with heat sink

Joyce Koo <[log in to unmask]>

Fri, 17 Feb 2012 18:14:40 +0000

71 lines

Re: Max downward pressure applied to BGA with heat sink

Scott Lefebvre <[log in to unmask]>

Fri, 17 Feb 2012 10:44:54 -0800

87 lines

New Thread

Measure of "How long after printing can parts be placed."

Measure of "How long after printing can parts be placed."

Robert Kondner <[log in to unmask]>

Wed, 22 Feb 2012 08:11:01 -0700

34 lines

Re: Measure of "How long after printing can parts be placed."

Mike Fenner <[log in to unmask]>

Wed, 22 Feb 2012 22:10:13 +0000

83 lines

New Thread

Microballs

Microballs

[log in to unmask]

Wed, 22 Feb 2012 07:33:12 +0100

40 lines

Re: Microballs

Reuven Rokah <[log in to unmask]>

Wed, 22 Feb 2012 08:52:33 +0200

81 lines

Re: Microballs

[log in to unmask]

Wed, 22 Feb 2012 09:04:30 +0100

119 lines

Re: Microballs

Phil Bavaro <[log in to unmask]>

Wed, 22 Feb 2012 08:25:13 -0800

152 lines

Re: Microballs

Inge Hernefjord <[log in to unmask]>

Wed, 22 Feb 2012 20:15:51 +0100

85 lines

Re: Microballs

Inge Hernefjord <[log in to unmask]>

Wed, 22 Feb 2012 20:26:24 +0100

95 lines

New Thread

NTC Friday Element Quiz - the Answer

NTC Friday Element Quiz - the Answer

David D. Hillman <[log in to unmask]>

Fri, 3 Feb 2012 15:46:14 -0600

262 lines

Re: NTC Friday Element Quiz - the Answer

Douglas Pauls <[log in to unmask]>

Fri, 3 Feb 2012 15:54:57 -0600

299 lines

Re: NTC Friday Element Quiz - the Answer

Fox, Ian <[log in to unmask]>

Mon, 6 Feb 2012 08:41:32 +0000

296 lines

NTC Friday Element Quiz - the Answer

David D. Hillman <[log in to unmask]>

Fri, 10 Feb 2012 15:54:00 -0600

266 lines

NTC Friday Element Quiz - the Answer

David D. Hillman <[log in to unmask]>

Fri, 17 Feb 2012 17:54:09 -0600

268 lines

Re: NTC Friday Element Quiz - the Answer

Brian Ellis <[log in to unmask]>

Sat, 18 Feb 2012 14:19:16 +0200

303 lines

Re: NTC Friday Element Quiz - the Answer

Bev Christian <[log in to unmask]>

Sat, 18 Feb 2012 09:06:46 -0500

336 lines

Re: NTC Friday Element Quiz - the Answer

Guy Ramsey <[log in to unmask]>

Mon, 20 Feb 2012 08:36:16 -0500

289 lines

NTC Friday Element Quiz - the Answer

David D. Hillman <[log in to unmask]>

Fri, 24 Feb 2012 13:43:52 -0600

282 lines

Re: NTC Friday Element Quiz - the Answer

Graham Collins <[log in to unmask]>

Fri, 24 Feb 2012 15:49:26 -0400

312 lines

Re: NTC Friday Element Quiz - the Answer

Douglas Pauls <[log in to unmask]>

Fri, 24 Feb 2012 14:04:10 -0600

315 lines

Re: NTC Friday Element Quiz - the Answer

Gregg Owens <[log in to unmask]>

Fri, 24 Feb 2012 20:07:27 +0000

342 lines

Re: NTC Friday Element Quiz - the Answer

Stadem, Richard D. <[log in to unmask]>

Fri, 24 Feb 2012 14:08:45 -0600

357 lines

Re: NTC Friday Element Quiz - the Answer

David D. Hillman <[log in to unmask]>

Fri, 24 Feb 2012 14:37:47 -0600

365 lines

Re: NTC Friday Element Quiz - the Answer

Aleks Lozinsky <[log in to unmask]>

Fri, 24 Feb 2012 22:01:35 +0000

236 lines

Re: NTC Friday Element Quiz - the Answer

Brian Ellis <[log in to unmask]>

Sat, 25 Feb 2012 10:39:03 +0200

315 lines

New Thread

NTC Friday Element Quiz - the Question

NTC Friday Element Quiz - the Question

David D. Hillman <[log in to unmask]>

Fri, 3 Feb 2012 06:53:02 -0600

254 lines

Re: NTC Friday Element Quiz - the Question

Fox, Ian <[log in to unmask]>

Fri, 3 Feb 2012 13:06:15 +0000

298 lines

Re: NTC Friday Element Quiz - the Question

James Head <[log in to unmask]>

Fri, 3 Feb 2012 13:14:25 +0000

68 lines

Re: NTC Friday Element Quiz - the Question

Douglas Pauls <[log in to unmask]>

Fri, 3 Feb 2012 07:45:13 -0600

335 lines

Re: NTC Friday Element Quiz - the Question

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Fri, 3 Feb 2012 14:35:01 +0000

377 lines

Re: NTC Friday Element Quiz - the Question

Dwight Mattix <[log in to unmask]>

Fri, 3 Feb 2012 06:42:21 -0800

281 lines

Re: NTC Friday Element Quiz - the Question

Chuck Brummer <[log in to unmask]>

Fri, 3 Feb 2012 07:52:21 -0800

298 lines

Re: NTC Friday Element Quiz - the Question

Blair Hogg <[log in to unmask]>

Fri, 3 Feb 2012 14:26:16 -0600

285 lines

Re: NTC Friday Element Quiz - the Question

Dennis Fritz <[log in to unmask]>

Fri, 3 Feb 2012 15:32:12 -0500

341 lines

NTC Friday Element Quiz - the Question

David D. Hillman <[log in to unmask]>

Thu, 9 Feb 2012 21:10:45 -0600

250 lines

Re: NTC Friday Element Quiz - the Question

Steve Mikell <[log in to unmask]>

Fri, 10 Feb 2012 01:05:37 -0500

23 lines

Re: NTC Friday Element Quiz - the Question

Anslow, Phillip (UK) <[log in to unmask]>

Fri, 10 Feb 2012 11:53:42 +0000

299 lines

Re: NTC Friday Element Quiz - the Question

Chuck Brummer <[log in to unmask]>

Fri, 10 Feb 2012 08:41:00 -0800

292 lines

Re: NTC Friday Element Quiz - the Question

Chuck Brummer <[log in to unmask]>

Fri, 10 Feb 2012 08:45:04 -0800

339 lines

NTC Friday Element Quiz - the Question

David D. Hillman <[log in to unmask]>

Fri, 17 Feb 2012 06:31:43 -0600

253 lines

Re: NTC Friday Element Quiz - the Question

James Head <[log in to unmask]>

Fri, 17 Feb 2012 12:38:55 +0000

314 lines

Re: NTC Friday Element Quiz - the Question

Brian Ellis <[log in to unmask]>

Fri, 17 Feb 2012 14:45:42 +0200

265 lines

Re: NTC Friday Element Quiz - the Question

Robert Kondner <[log in to unmask]>

Fri, 17 Feb 2012 07:50:45 -0500

273 lines

Re: NTC Friday Element Quiz - the Question

G Sidney Cox <[log in to unmask]>

Fri, 17 Feb 2012 08:10:24 -0500

299 lines

Re: NTC Friday Element Quiz - the Question

Raffaella Rognoni <[log in to unmask]>

Fri, 17 Feb 2012 14:04:27 +0100

178 lines

Re: NTC Friday Element Quiz - the Question

Giamis, Andy <[log in to unmask]>

Fri, 17 Feb 2012 07:34:52 -0600

297 lines

Re: NTC Friday Element Quiz - the Question

Pietro Novati <[log in to unmask]>

Fri, 17 Feb 2012 14:34:14 +0100

179 lines

Re: NTC Friday Element Quiz - the Question

Joyce Koo <[log in to unmask]>

Fri, 17 Feb 2012 14:04:25 +0000

295 lines

Re: NTC Friday Element Quiz - the Question

Nigel Burtt <[log in to unmask]>

Fri, 17 Feb 2012 08:23:36 -0600

16 lines

Re: NTC Friday Element Quiz - the Question

Rivera, Raye <[log in to unmask]>

Fri, 17 Feb 2012 08:46:14 -0800

288 lines

NTC Friday Element Quiz - the Question

David D. Hillman <[log in to unmask]>

Fri, 24 Feb 2012 07:07:47 -0600

256 lines

Re: NTC Friday Element Quiz - the Question

Brian Ellis <[log in to unmask]>

Fri, 24 Feb 2012 15:17:02 +0200

268 lines

Re: NTC Friday Element Quiz - the Question

Aleks Lozinsky <[log in to unmask]>

Fri, 24 Feb 2012 13:26:49 +0000

166 lines

Re: NTC Friday Element Quiz - the Question

Paul Reid <[log in to unmask]>

Fri, 24 Feb 2012 08:27:34 -0500

317 lines

Re: NTC Friday Element Quiz - the Question

Brian Ellis <[log in to unmask]>

Fri, 24 Feb 2012 15:27:05 +0200

268 lines

Re: NTC Friday Element Quiz - the Question

Fox, Ian <[log in to unmask]>

Fri, 24 Feb 2012 13:33:33 +0000

330 lines

Re: NTC Friday Element Quiz - the Question

Brian Ellis <[log in to unmask]>

Fri, 24 Feb 2012 15:47:41 +0200

323 lines

Re: NTC Friday Element Quiz - the Question

Stadem, Richard D. <[log in to unmask]>

Fri, 24 Feb 2012 08:13:47 -0600

347 lines

New Thread

NTC: APEX 2012 Technetters

NTC: APEX 2012 Technetters

Phil Bavaro <[log in to unmask]>

Wed, 22 Feb 2012 10:59:25 -0800

40 lines

Re: NTC: APEX 2012 Technetters

Douglas Pauls <[log in to unmask]>

Wed, 22 Feb 2012 13:11:09 -0600

61 lines

Re: NTC: APEX 2012 Technetters

Karen Tellefsen <[log in to unmask]>

Wed, 22 Feb 2012 14:21:59 -0500

105 lines

Re: NTC: APEX 2012 Technetters

Brown, Dock <[log in to unmask]>

Wed, 22 Feb 2012 12:53:13 -0800

46 lines

Re: NTC: APEX 2012 Technetters

Larry Dzaugis <[log in to unmask]>

Wed, 22 Feb 2012 15:23:28 -0600

19 lines

Re: NTC: APEX 2012 Technetters

Phil Bavaro <[log in to unmask]>

Wed, 22 Feb 2012 13:38:05 -0800

74 lines

Re: NTC: APEX 2012 Technetters

Gregg Owens <[log in to unmask]>

Wed, 22 Feb 2012 21:46:51 +0000

67 lines

Re: NTC: APEX 2012 Technetters

Ahne Oosterhof <[log in to unmask]>

Wed, 22 Feb 2012 15:01:08 -0800

107 lines

Re: NTC: APEX 2012 Technetters

Leland Woodall <[log in to unmask]>

Thu, 23 Feb 2012 01:12:49 +0000

70 lines

Re: NTC: APEX 2012 Technetters

John Burke <[log in to unmask]>

Thu, 23 Feb 2012 03:15:56 +0100

60 lines

Re: NTC: APEX 2012 Technetters

Bev Christian <[log in to unmask]>

Wed, 22 Feb 2012 21:33:42 -0500

129 lines

Re: NTC: APEX 2012 Technetters

Garcia, Rigo (GSFC-300.0)[MANTECH SRS TECHNOLOGIES] <[log in to unmask]>

Thu, 23 Feb 2012 07:34:04 -0600

48 lines

Re: NTC: APEX 2012 Technetters

Pete <[log in to unmask]>

Thu, 23 Feb 2012 08:43:19 -0600

19 lines

Re: NTC: APEX 2012 Technetters

Douglas Pauls <[log in to unmask]>

Thu, 23 Feb 2012 10:01:08 -0600

113 lines

Re: NTC: APEX 2012 Technetters

Goodyear, Patrick <[log in to unmask]>

Thu, 23 Feb 2012 16:05:03 +0000

25 lines

Re: NTC: APEX 2012 Technetters

Chuck Brummer <[log in to unmask]>

Thu, 23 Feb 2012 08:43:46 -0800

178 lines

Re: NTC: APEX 2012 Technetters

Karen Tellefsen <[log in to unmask]>

Thu, 23 Feb 2012 12:38:34 -0500

247 lines

Re: NTC: APEX 2012 Technetters

Ahne Oosterhof <[log in to unmask]>

Thu, 23 Feb 2012 09:40:11 -0800

138 lines

NTC: APEX 2012 Technetters

Kim Sterling <[log in to unmask]>

Thu, 23 Feb 2012 20:58:09 +0000

27 lines

Re: NTC: APEX 2012 Technetters

Bev Christian <[log in to unmask]>

Thu, 23 Feb 2012 18:25:09 -0500

240 lines

Re: NTC: APEX 2012 Technetters

Gregg Owens <[log in to unmask]>

Thu, 23 Feb 2012 23:37:21 +0000

274 lines

Re: NTC: APEX 2012 Technetters

Leland Woodall <[log in to unmask]>

Sat, 25 Feb 2012 02:30:38 +0000

149 lines

Re: NTC: APEX 2012 Technetters

Gregg Owens <[log in to unmask]>

Sat, 25 Feb 2012 07:15:00 +0000

165 lines

Re: NTC: APEX 2012 Technetters

Phil Bavaro <[log in to unmask]>

Sun, 26 Feb 2012 14:53:44 -0800

253 lines

Re: NTC: APEX 2012 Technetters

Brown, Dock <[log in to unmask]>

Mon, 27 Feb 2012 06:52:02 -0800

170 lines

Re: NTC: APEX 2012 TechNetters

Garcia, Rigo (GSFC-300.0)[MANTECH SRS TECHNOLOGIES] <[log in to unmask]>

Mon, 27 Feb 2012 09:01:25 -0600

184 lines

New Thread

Old Harddisk for Mydata PnP

Re: Old Harddisk for Mydata PnP

Poh KH <[log in to unmask]>

Wed, 15 Feb 2012 21:46:23 +0800

29 lines

Re: Old Harddisk for Mydata PnP

Carl VanWormer <[log in to unmask]>

Wed, 15 Feb 2012 06:28:22 -0800

46 lines

Re: Old Harddisk for Mydata PnP

Blair Hogg <[log in to unmask]>

Thu, 16 Feb 2012 11:55:30 -0600

48 lines

New Thread

Post Thermal Cycle induced solder stress-fractures

Post Thermal Cycle induced solder stress-fractures

Victor Hernandez <[log in to unmask]>

Fri, 17 Feb 2012 10:19:41 -0600

27 lines

New Thread

Query -- Fiducial

Query -- Fiducial

prashant chopra <[log in to unmask]>

Mon, 20 Feb 2012 15:04:38 +0530

34 lines

Re: Query -- Fiducial

Rex Waygood <[log in to unmask]>

Mon, 20 Feb 2012 09:37:35 +0000

75 lines

Re: Query -- Fiducial

James Head <[log in to unmask]>

Mon, 20 Feb 2012 09:53:55 +0000

45 lines

New Thread

R: [TN] Cu - dissolution and IMC growth rate

R: [TN] Cu - dissolution and IMC growth rate

SALA GABRIELE <[log in to unmask]>

Thu, 2 Feb 2012 17:20:22 +0100

90 lines

Re: R: [TN] Cu - dissolution and IMC growth rate

Joyce Koo <[log in to unmask]>

Thu, 2 Feb 2012 16:42:49 +0000

108 lines

R: [TN] Cu - dissolution and IMC growth rate

SALA GABRIELE <[log in to unmask]>

Thu, 2 Feb 2012 23:58:35 +0100

216 lines

Re: R: [TN] Cu - dissolution and IMC growth rate

Inge Hernefjord <[log in to unmask]>

Fri, 3 Feb 2012 21:48:34 +0100

256 lines

Re: R: [TN] Cu - dissolution and IMC growth rate

Douglas Pauls <[log in to unmask]>

Fri, 3 Feb 2012 15:56:10 -0600

290 lines

Re: R: [TN] Cu - dissolution and IMC growth rate

Inge Hernefjord <[log in to unmask]>

Fri, 3 Feb 2012 23:38:19 +0100

323 lines

New Thread

R: [TN] Microballs

R: [TN] Microballs

SALA GABRIELE <[log in to unmask]>

Wed, 22 Feb 2012 09:06:44 +0100

133 lines

Re: R: [TN] Microballs

Victor Hernandez <[log in to unmask]>

Wed, 22 Feb 2012 05:43:24 -0600

148 lines

Re: R: [TN] Microballs

[log in to unmask]

Thu, 23 Feb 2012 16:02:59 +0100

197 lines

R: [TN] Microballs

[log in to unmask]

Fri, 24 Feb 2012 12:53:07 +0100

27 lines

Re: R: [TN] Microballs

Inge <[log in to unmask]>

Fri, 24 Feb 2012 13:07:51 +0100

46 lines

New Thread

R: [TN] R: [TN] Microballs

R: [TN] R: [TN] Microballs

SALA GABRIELE <[log in to unmask]>

Wed, 22 Feb 2012 11:21:33 +0100

162 lines

Re: R: [TN] R: [TN] Microballs

Victor Hernandez <[log in to unmask]>

Wed, 22 Feb 2012 05:46:14 -0600

176 lines

New Thread

R: [TN] Restoration of Humidity Indicator Cards

R: [TN] Restoration of Humidity Indicator Cards

SALA GABRIELE <[log in to unmask]>

Tue, 14 Feb 2012 22:46:06 +0100

61 lines

New Thread

RE [TN] Antwort: [TN] R: [TN] Microballs

RE [TN] Antwort: [TN] R: [TN] Microballs

[log in to unmask]

Thu, 23 Feb 2012 07:15:11 +0100

219 lines

New Thread

RES: Gerber files viewer

RES: Gerber files viewer

Juliano Pacheco <[log in to unmask]>

Mon, 27 Feb 2012 10:33:41 -0300

79 lines

New Thread

RES: High temperature inside Printer Machine

RES: High temperature inside Printer Machine

Juliano Pacheco <[log in to unmask]>

Thu, 16 Feb 2012 15:27:57 -0200

82 lines

Re: RES: High temperature inside Printer Machine

Phil Bavaro <[log in to unmask]>

Thu, 16 Feb 2012 09:40:42 -0800

102 lines

New Thread

Restoration of Humidity Indicator Cards

Restoration of Humidity Indicator Cards

Blair Hogg <[log in to unmask]>

Tue, 14 Feb 2012 15:12:17 -0600

23 lines

Re: Restoration of Humidity Indicator Cards

Chuck Brummer <[log in to unmask]>

Tue, 14 Feb 2012 13:39:43 -0800

65 lines

New Thread

Sanding board edges after reflow

Sanding board edges after reflow

Bob Landman <[log in to unmask]>

Sat, 18 Feb 2012 14:23:04 -0500

53 lines

Re: Sanding board edges after reflow

Amol Kane (Asteelflash,US) <[log in to unmask]>

Mon, 20 Feb 2012 08:40:02 -0800

86 lines

Re: Sanding board edges after reflow

Bob Landman <[log in to unmask]>

Mon, 20 Feb 2012 13:46:49 -0500

111 lines

Re: Sanding board edges after reflow

Graham Collins <[log in to unmask]>

Mon, 20 Feb 2012 14:51:38 -0400

135 lines

Re: Sanding board edges after reflow

Phil Bavaro <[log in to unmask]>

Mon, 20 Feb 2012 10:52:53 -0800

144 lines

Re: Sanding board edges after reflow

Tontis, Theodore <[log in to unmask]>

Mon, 20 Feb 2012 15:04:41 -0500

165 lines

Re: Sanding board edges after reflow

Bob Landman <[log in to unmask]>

Mon, 20 Feb 2012 17:57:43 -0500

142 lines

Re: Sanding board edges after reflow

John Burke <[log in to unmask]>

Mon, 20 Feb 2012 15:14:06 -0800

162 lines

New Thread

Setting special nozzle on fuji flexa

Setting special nozzle on fuji flexa

Juliano Pacheco <[log in to unmask]>

Wed, 15 Feb 2012 11:50:28 -0200

23 lines

New Thread

Siliporite molecular sieve

Siliporite molecular sieve

Cedric ORAIN <[log in to unmask]>

Fri, 24 Feb 2012 11:20:30 +0100

31 lines

Re: Siliporite molecular sieve

Bev Christian <[log in to unmask]>

Fri, 24 Feb 2012 06:36:44 -0500

81 lines

Re: Siliporite molecular sieve

Cedric ORAIN <[log in to unmask]>

Fri, 24 Feb 2012 14:14:22 +0100

112 lines

Re: Siliporite molecular sieve

Stadem, Richard D. <[log in to unmask]>

Fri, 24 Feb 2012 08:09:24 -0600

96 lines

Re: Siliporite molecular sieve

Cedric ORAIN <[log in to unmask]>

Fri, 24 Feb 2012 17:48:18 +0100

111 lines

New Thread

Silver immersion with gold fingers

Silver immersion with gold fingers

John Burke <[log in to unmask]>

Fri, 10 Feb 2012 07:48:48 -0800

23 lines

Re: Silver immersion with gold fingers

Thomas E Kemp <[log in to unmask]>

Fri, 10 Feb 2012 10:01:01 -0600

57 lines

Re: Silver immersion with gold fingers

Inge Hernefjord <[log in to unmask]>

Thu, 16 Feb 2012 19:37:23 +0100

47 lines

Re: Silver immersion with gold fingers

Joyce Koo <[log in to unmask]>

Thu, 16 Feb 2012 20:02:13 +0000

87 lines

New Thread

Solder etchant, Sn-99.3-Cu-0.7, Post Thermal Cycle induced fractures

Re: Solder etchant, Sn-99.3-Cu-0.7, Post Thermal Cycle induced fractures

Victor Hernandez <[log in to unmask]>

Fri, 17 Feb 2012 10:11:33 -0600

27 lines

Re: Solder etchant, Sn-99.3-Cu-0.7, Post Thermal Cycle induced fractures

Inge Hernefjord <[log in to unmask]>

Fri, 17 Feb 2012 20:21:13 +0100

65 lines

Re: Solder etchant, Sn-99.3-Cu-0.7, Post Thermal Cycle induced fractures

Jac Kroeker <[log in to unmask]>

Fri, 17 Feb 2012 13:57:22 -0800

86 lines

New Thread

Soldermask adhesion test

Soldermask adhesion test

Amol Kane (Asteelflash,US) <[log in to unmask]>

Tue, 7 Feb 2012 06:59:25 -0800

50 lines

Re: Soldermask adhesion test

Inge Hernefjord <[log in to unmask]>

Tue, 7 Feb 2012 17:15:59 +0100

69 lines

Re: Soldermask adhesion test

Guy Ramsey <[log in to unmask]>

Tue, 7 Feb 2012 13:27:51 -0500

92 lines

Re: Soldermask adhesion test

Amol Kane (Asteelflash,US) <[log in to unmask]>

Tue, 7 Feb 2012 10:34:44 -0800

114 lines

Re: Soldermask adhesion test

Douglas Pauls <[log in to unmask]>

Tue, 7 Feb 2012 12:59:59 -0600

134 lines

New Thread

Surface Finish for Backplane Board

Surface Finish for Backplane Board

prashant chopra <[log in to unmask]>

Fri, 10 Feb 2012 10:55:09 +0530

27 lines

Re: Surface Finish for Backplane Board

Reuven Rokah <[log in to unmask]>

Fri, 10 Feb 2012 09:55:37 +0200

63 lines

Re: Surface Finish for Backplane Board

Joyce Koo <[log in to unmask]>

Fri, 10 Feb 2012 08:05:30 +0000

55 lines

Re: Surface Finish for Backplane Board

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Fri, 10 Feb 2012 13:42:00 +0000

44 lines

New Thread

TechNet Archives

TechNet Archives

Jack Olson <[log in to unmask]>

Wed, 1 Feb 2012 12:08:14 -0600

41 lines

Re: TechNet Archives

David Bergman <[log in to unmask]>

Thu, 2 Feb 2012 16:40:40 +0000

80 lines

Re: TechNet Archives

Steven Creswick <[log in to unmask]>

Thu, 2 Feb 2012 12:54:43 -0500

74 lines

Re: TechNet Archives

Keach Sasamori <[log in to unmask]>

Thu, 2 Feb 2012 18:10:50 +0000

74 lines

Re: TechNet Archives

Jack Olson <[log in to unmask]>

Fri, 3 Feb 2012 09:26:12 -0600

103 lines

Re: TechNet Archives

Keach Sasamori <[log in to unmask]>

Fri, 3 Feb 2012 16:10:42 +0000

144 lines

New Thread

Tin Pest

Tin Pest

Chris Hunt <[log in to unmask]>

Thu, 9 Feb 2012 13:22:09 +0000

45 lines

Re: Tin Pest

Mike Fenner <[log in to unmask]>

Thu, 9 Feb 2012 20:37:03 +0000

68 lines

Re: Tin Pest

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Thu, 9 Feb 2012 21:45:13 +0000

89 lines

Re: Tin Pest

Douglas Pauls <[log in to unmask]>

Thu, 9 Feb 2012 16:11:03 -0600

107 lines

Re: Tin Pest

Bob METCALF <[log in to unmask]>

Thu, 9 Feb 2012 19:38:52 -0800

123 lines

Re: Tin Pest

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Fri, 10 Feb 2012 13:27:13 +0000

119 lines

New Thread

Tin/Zinc whiskers

Tin/Zinc whiskers

Victor Hernandez <[log in to unmask]>

Fri, 17 Feb 2012 09:06:52 -0600

28 lines

Re: Tin/Zinc whiskers

Dennis Fritz <[log in to unmask]>

Fri, 17 Feb 2012 10:20:00 -0500

61 lines

Re: Tin/Zinc whiskers

Inge Hernefjord <[log in to unmask]>

Fri, 17 Feb 2012 16:41:58 +0100

67 lines

New Thread

Typical ROSE Test Duration

Re: Typical ROSE Test Duration

Brian Ellis <[log in to unmask]>

Wed, 1 Feb 2012 12:45:44 +0200

280 lines

Re: Typical ROSE Test Duration

Douglas Pauls <[log in to unmask]>

Wed, 1 Feb 2012 07:51:54 -0600

333 lines

Re: Typical ROSE Test Duration

Brian Ellis <[log in to unmask]>

Wed, 1 Feb 2012 16:19:04 +0200

304 lines

Re: Typical ROSE Test Duration

Brian Ellis <[log in to unmask]>

Wed, 1 Feb 2012 16:26:22 +0200

334 lines

Re: Typical ROSE Test Duration

Brian Ellis <[log in to unmask]>

Thu, 2 Feb 2012 23:55:28 +0200

402 lines

New Thread

Zinc plating processes

Zinc plating processes

Victor Hernandez <[log in to unmask]>

Sat, 18 Feb 2012 13:01:17 -0600

30 lines

Re: Zinc plating processes

Inge Hernefjord <[log in to unmask]>

Sat, 18 Feb 2012 21:56:29 +0100

100 lines

Re: Zinc plating processes

David D. Hillman <[log in to unmask]>

Mon, 20 Feb 2012 07:40:18 -0600

74 lines

New Thread

[OT] Conductivity of Oxides and Passivation Coatings

[OT] Conductivity of Oxides and Passivation Coatings

Blair Hogg <[log in to unmask]>

Fri, 10 Feb 2012 13:51:06 -0600

37 lines

Re: [OT] Conductivity of Oxides and Passivation Coatings

Victor Hernandez <[log in to unmask]>

Fri, 10 Feb 2012 13:54:45 -0600

47 lines

Re: [OT] Conductivity of Oxides and Passivation Coatings

Steven Creswick <[log in to unmask]>

Fri, 10 Feb 2012 15:50:20 -0500

74 lines

Re: [OT] Conductivity of Oxides and Passivation Coatings

Karen Tellefsen <[log in to unmask]>

Fri, 10 Feb 2012 15:59:11 -0500

117 lines

Re: [OT] Conductivity of Oxides and Passivation Coatings

Gary Crowell <[log in to unmask]>

Fri, 10 Feb 2012 15:39:27 -0700

62 lines

Re: [OT] Conductivity of Oxides and Passivation Coatings

Blair Hogg <[log in to unmask]>

Tue, 14 Feb 2012 07:39:52 -0600

55 lines

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