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May 2009

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Subject	From	Date
Re: Soldermask for High CTI >600 PLC 0 Laminate	李义	Fri, 15 May 2009 17:53:59 +0800
Re: Beginning of the week quiz!	<>	Mon, 18 May 2009 07:18:45 -0700
Re: Congratulations to Werner	<>	Wed, 20 May 2009 17:15:09 EDT
Re: Connectors	<>	Wed, 13 May 2009 17:47:14 EDT
End of the week quiz!	<>	Sun, 17 May 2009 09:16:21 -0700
Re: End of the week quiz!	<>	Mon, 18 May 2009 07:24:04 -0700
Re: Golden finger (Golden Pad) clear and protect method	<>	Fri, 22 May 2009 18:03:36 EDT
Re: FLEX question	Ahne Oosterhof	Fri, 15 May 2009 11:43:34 -0700
End of the week quiz!	al shirazi	Fri, 15 May 2009 13:54:37 -0700
Fw: End of the week quiz!	al shirazi	Fri, 15 May 2009 13:59:44 -0700
Re: Fw: End of the week quiz!	al shirazi	Sat, 16 May 2009 12:58:12 -0700
0201 capacitor failure after reflow	Anat Douek	Thu, 14 May 2009 23:18:35 +0200
Re: 0201 capacitor failure after reflow	Anat Douek	Fri, 15 May 2009 16:47:59 +0200
Re: 0201 capacitor failure after reflow	Anat Douek	Sun, 17 May 2009 08:10:15 +0200
Re: Immersion Silver	Anat Douek	Sun, 31 May 2009 14:51:17 +0200
FW: [TN] 0201 capacitor failure after reflow	Anat Douek	Sun, 17 May 2009 11:25:04 +0200
Re: humidity test failure	Anil kher	Thu, 28 May 2009 00:55:00 +0530
Re: Congratulations to Werner	Barry Gallegos	Wed, 20 May 2009 10:53:38 -0600
Re: Memorial Day	Bernard Kessler	Mon, 25 May 2009 16:32:15 -0700
Re: Email Change	Bev Christian	Mon, 4 May 2009 07:58:23 -0400
Re: End of the week quiz!	Bev Christian	Fri, 15 May 2009 17:31:33 -0400
Re: lighting ballast encapsulant removal	Bev Christian	Fri, 29 May 2009 16:19:02 -0400
Looking for a cartoon reference	Bev Christian	Sun, 24 May 2009 10:15:03 -0400
Re: Looking for a cartoon reference	Bev Christian	Sun, 24 May 2009 12:11:39 -0400
Re: Looking for a cartoon reference	Bev Christian	Tue, 26 May 2009 08:14:46 -0400
Memorial Day	Bev Christian	Mon, 25 May 2009 16:56:21 -0400
Nickel - again	Bev Christian	Wed, 6 May 2009 19:41:03 -0400
Re: Nickel - again	Bev Christian	Wed, 6 May 2009 19:53:15 -0400
Re: Nickel - again	Bev Christian	Wed, 6 May 2009 20:33:21 -0400
Re: Nickel - again	Bev Christian	Thu, 7 May 2009 06:08:55 -0400
Re: Nickel - again	Bev Christian	Thu, 7 May 2009 17:41:03 -0400
NTC RE: [TN] PB Surface Contamination	Bev Christian	Thu, 7 May 2009 14:25:13 -0400
Re: Request For Screenprinter Commentary	Bev Christian	Sat, 23 May 2009 11:04:36 -0400
Re: Rohs SMT parts and shelf life	Bev Christian	Sat, 9 May 2009 11:30:57 -0400
Underfill Pass/fail criteria	Bev Christian	Tue, 19 May 2009 13:51:53 -0400
Re: Underfill Pass/fail criteria	Bev Christian	Tue, 19 May 2009 14:38:26 -0400
Re: Underfill Pass/fail criteria	Bev Christian	Tue, 19 May 2009 14:54:33 -0400
Re: Underfill Pass/fail criteria	Bev Christian	Tue, 19 May 2009 16:56:08 -0400
Re: Underfill Pass/fail criteria	Bev Christian	Wed, 20 May 2009 08:45:54 -0400
Re: WAX	Bev Christian	Fri, 29 May 2009 11:56:25 -0400
Re: WAX	Bev Christian	Fri, 29 May 2009 12:11:57 -0400
Re: NTC: Beginning of the week quiz!	Bill Clark	Mon, 18 May 2009 10:27:17 -0400
Re: Congratulations to Werner	Blair Hogg	Fri, 22 May 2009 07:40:26 -0500
Strange Tolerances on BGA Pitch-How to Accomodate the Stencil File?	bob wettermann	Tue, 19 May 2009 05:44:23 -0700
Re: Golden finger (Golden Pad) clear and protect method	Bob Willis	Fri, 22 May 2009 09:14:47 +0100
Re: Request For Screenprinter Commentary	Bob Willis	Sat, 23 May 2009 18:37:41 +0100
Re: Request For Screenprinter Commentary	Bob Willis	Tue, 26 May 2009 15:15:03 +0100
Re: Underfill Pass/fail criteria	Bob Willis	Wed, 20 May 2009 11:44:11 +0100
Absence	Brian Ellis	Sun, 31 May 2009 08:15:00 +0300
Re: Absence	Brian Ellis	Sun, 31 May 2009 13:41:54 +0300
Re: Absence	Brian Ellis	Sun, 31 May 2009 20:04:47 +0300
Re: PB Surface Contamination	Brian Ellis	Thu, 7 May 2009 17:51:23 +0300
Re: Taguchi	Brian Ellis	Sun, 31 May 2009 08:13:58 +0300
Re: coupon router	Bush, Jeffrey D. (US SSA)	Mon, 18 May 2009 17:49:17 -0400
Re: Parylene Adhesion Tape Test	Bush, Jeffrey D. (US SSA)	Tue, 12 May 2009 17:01:12 -0400
Re: PCB baking	Bush, Jeffrey D. (US SSA)	Mon, 4 May 2009 11:21:28 -0400
Re: PWB fab drawing - how thick is the copper?	Bush, Jeffrey D. (US SSA)	Mon, 18 May 2009 14:01:20 -0400
答复: [TN] Looking for opinions on separ ation/delamination between copper land a nd dielectric material.	Charming Chan	Fri, 29 May 2009 20:42:31 +0800
Looking for opinions on separation/delamination between copper land and dielectric material.	Charming Chan	Fri, 29 May 2009 16:45:48 +0800
Re: humidity test failure	Chris Mahanna	Wed, 27 May 2009 12:34:44 -0400
Re: NTC: Beginning of the week quiz!	Chris Mahanna	Mon, 18 May 2009 23:10:20 -0400
Re: Open joints on CompactFlash connector	Chris Mahanna	Thu, 21 May 2009 17:22:39 -0400
Re: PCB holder for microscope inspection	Chris Mahanna	Tue, 26 May 2009 11:43:08 -0400
Re: Underfill Pass/fail criteria	Chris Mahanna	Tue, 19 May 2009 15:21:01 -0400
Re: FLEX question	Chuck Brummer	Fri, 15 May 2009 10:16:40 -0700
Re: NTC - Friday Trivia Question	Craig Cullum	Fri, 15 May 2009 10:31:40 -0500
Re: Nitrogen use for selective soldering equipment	Craig Sullivan	Fri, 1 May 2009 08:03:16 -0400
Re: Request For Screenprinter Commentary	Craig Sullivan	Sun, 24 May 2009 12:47:45 GMT
Re: Immersion Silver	Croslin, Robert	Wed, 27 May 2009 10:23:08 -0400
Re: Panelization Software	Croslin, Robert	Fri, 29 May 2009 15:37:41 -0400
IPC-4101 question	Dave Connitt	Wed, 20 May 2009 10:15:02 -0400
IPC-4101 specification question	Dave Connitt	Wed, 20 May 2009 06:46:50 -0400
Re: Solder Mask	Dave Dixon	Mon, 11 May 2009 11:21:08 -0500
Via Tenting Under BGAs .. Again (apologies!)	Dave Schaefer	Mon, 11 May 2009 15:51:51 -0500
Re: ESD Heel Strap / Shoe Checker - low resistance	David Bergman	Wed, 20 May 2009 14:18:24 -0500
FW: [TN] Dear friend, - malware caused posting	David Bergman	Wed, 13 May 2009 12:18:46 -0500
Re: humidity test failure	David D. Hillman	Wed, 27 May 2009 07:15:14 -0500
Looking for an Optical Picture of a Popcorned SMT Component	David D. Hillman	Fri, 1 May 2009 07:02:15 -0500
Re: Looking for an Optical Picture of a Popcorned SMT Component	David D. Hillman	Fri, 1 May 2009 10:09:13 -0500
NTC - Friday Trivia Question	David D. Hillman	Fri, 15 May 2009 07:45:32 -0500
Re: NTC - Friday Trivia Question	David D. Hillman	Fri, 15 May 2009 08:11:29 -0500
Re: NTC - Friday Trivia Question	David D. Hillman	Fri, 15 May 2009 13:41:46 -0500
Re: NTC - Friday Trivia Question	David D. Hillman	Fri, 15 May 2009 16:11:08 -0500
Re: NTC - Friday Trivia Question	David D. Hillman	Fri, 15 May 2009 16:27:48 -0500
Re: NTC - Nylon connectors - moisture sensitivity	David D. Hillman	Wed, 13 May 2009 16:31:36 -0500
Re: NTC [TN] humidity test failure	David D. Hillman	Thu, 28 May 2009 07:55:02 -0500
Re: Nylon connectors - moisture sensitivity	David D. Hillman	Wed, 13 May 2009 13:58:00 -0500
Re: Underfill Pass/fail criteria	David D. Hillman	Tue, 19 May 2009 16:54:41 -0500
Re: WAX	David D. Hillman	Fri, 29 May 2009 11:38:00 -0500
Re: Bare PCB Packaging Requirements	Dean Stadem	Fri, 15 May 2009 07:26:29 -0500
Re: DIP Leadframes	Dean Stadem	Thu, 21 May 2009 20:15:55 -0500
Re: NTC - Friday Trivia Question	Dean Stadem	Fri, 15 May 2009 08:24:33 -0500
Re: Solder Mask	Dennis Fritz	Mon, 11 May 2009 09:06:01 -0400
PCB holder for microscope inspection	Dominic Boudreau	Fri, 22 May 2009 13:16:52 -0400
Re: Connector with loose pins	Douglas Erb	Fri, 15 May 2009 14:38:58 -0700
Re: NTC - Friday Trivia Question	Douglas Erb	Fri, 15 May 2009 15:02:23 -0700
Re: NTC - Friday Trivia Question	Douglas Erb	Fri, 15 May 2009 15:11:37 -0700
Re: NTC - Nylon connectors - moisture sensitivity	Douglas Erb	Wed, 13 May 2009 13:47:17 -0700
Re: Nylon connectors - moisture sensitivity	Douglas Erb	Wed, 13 May 2009 11:50:21 -0700
Re: Nylon connectors - moisture sensitivity	Douglas Erb	Wed, 13 May 2009 12:08:18 -0700
Re: Nylon connectors - moisture sensitivity	Douglas Erb	Wed, 13 May 2009 13:07:50 -0700
Re: Nylon connectors - moisture sensitivity	Douglas Erb	Wed, 13 May 2009 13:22:22 -0700
Re: Nylon connectors - moisture sensitivity	Douglas Erb	Wed, 13 May 2009 13:54:02 -0700
Re: Congratulations to Werner	Douglas Pauls	Wed, 20 May 2009 11:51:47 -0500
Re: humidity test failure	Douglas Pauls	Thu, 28 May 2009 07:43:55 -0500
Re: lighting ballast encapsulant removal	Douglas Pauls	Fri, 29 May 2009 13:34:37 -0500
Re: Looking for opinions on separation/delamination between copper land and dielectric material.	Douglas Pauls	Fri, 29 May 2009 10:23:46 -0500
Re: NTC - Friday Trivia Question	Douglas Pauls	Fri, 15 May 2009 11:35:57 -0500
Re: NTC - Friday Trivia Question	Douglas Pauls	Fri, 15 May 2009 13:57:33 -0500
Re: Parylene Adhesion Tape Test	Douglas Pauls	Mon, 11 May 2009 06:33:40 -0500
Re: PWB fab drawing - how thick is the copper?	Douglas Pauls	Thu, 14 May 2009 13:05:58 -0500
Re: What does HIGH GRADE FR-4 mean?	Douglas Pauls	Tue, 5 May 2009 12:42:27 -0500
Re: What does HIGH GRADE FR-4 mean?	Douglas Pauls	Wed, 6 May 2009 08:51:01 -0500
Re: coupon router	Drew meyer	Fri, 15 May 2009 13:50:42 -0500
Re: Material 96% Alumina	Drew meyer	Tue, 12 May 2009 10:02:15 -0500
Re: NTC - Friday Trivia Question	Drew meyer	Fri, 15 May 2009 08:26:26 -0500
Re: NTC - Friday Trivia Question	Drew meyer	Fri, 15 May 2009 15:20:26 -0500
Re: Nylon connectors - moisture sensitivity	Drew meyer	Wed, 13 May 2009 15:15:40 -0500
Re: PWB fab drawing - how thick is the copper?	Drew meyer	Thu, 14 May 2009 12:09:33 -0500
Re: Looking for opinions on separation/delamination between copper land and dielectric material.	Dwight Mattix	Fri, 29 May 2009 07:40:32 -0700
Re: Technetters/LF-People in Spain, Portugal & Southern France	Dwight Mattix	Fri, 29 May 2009 10:01:57 -0700
答复: [TN] 答复: [TN] Rohs SMT parts and she lf lif e	ee	Wed, 20 May 2009 18:53:10 +0800
答复: [TN] 0201 capacitor failure after refl ow	ee	Fri, 16 May 2003 21:50:47 +0800
答复: [TN] Congratulations to Werner	ee	Thu, 21 May 2009 20:49:22 +0800
答复: [TN] PCB holder for microscope ins pection	ee	Sat, 23 May 2009 22:28:05 +0800
答复: [TN] Rohs SMT parts and shelf life	ee	Mon, 18 May 2009 22:22:02 +0800
Re: Strange Tolerances on BGA Pitch-How to Accomodate the Stencil File?	Eric CHRISTISON	Wed, 20 May 2009 09:08:14 +0100
Re: humidity test failure	Gary Camac	Thu, 28 May 2009 13:50:48 -0500
Re: Strange Tolerances on BGA Pitch-How to Accomodate the Stencil File?	Gary Ferrari	Wed, 20 May 2009 17:48:46 -0400
Re: Strange Tolerances on BGA Pitch-How to Accomodate the Stencil File?	Gary Ferrari	Thu, 21 May 2009 09:03:30 -0400
Re: ESD Heel Strap / Shoe Checker - low resistance	Gene Felder	Wed, 20 May 2009 12:49:35 -0700
Re: ESD Heel Strap / Shoe Checker - low resistance	Gene Felder	Wed, 20 May 2009 14:51:59 -0700
Re: ESD Heel Strap / Shoe Checker - low resistance	Gene Felder	Wed, 20 May 2009 15:07:21 -0700
Re: ESD Heel Strap / Shoe Checker - low resistance	Gene Felder	Thu, 21 May 2009 08:16:15 -0700
Re: ESD Heel Strap / Shoe Checker - low resistance	Genny Gibbard	Wed, 20 May 2009 13:26:20 -0600
Nylon connectors - moisture sensitivity	Genny Gibbard	Wed, 13 May 2009 12:43:04 -0600
Re: Nylon connectors - moisture sensitivity	Genny Gibbard	Wed, 13 May 2009 14:23:23 -0600
Dear friend,	Gerald Gagnon	Wed, 13 May 2009 12:19:42 -0400
Re: Congratulations to Werner	Gervascio, Thomas L	Wed, 20 May 2009 12:58:49 -0400
NTC - RE: [TN] What does HIGH GRADE FR-4 mean?	Graham Collins	Wed, 6 May 2009 13:46:27 -0300
PWB fab drawing - how thick is the copper?	Graham Collins	Thu, 14 May 2009 09:56:23 -0300
Re: PWB fab drawing - how thick is the copper?	Graham Collins	Thu, 14 May 2009 10:17:12 -0300
Re: Underfill Pass/fail criteria	Graham Collins	Tue, 19 May 2009 15:31:29 -0300
Re: Underfill Pass/fail criteria	Graham Collins	Tue, 19 May 2009 16:17:47 -0300
Re: Underfill Pass/fail criteria	Graham Collins	Wed, 20 May 2009 08:06:09 -0300
Re: Absence	Graham Naisbitt	Sun, 31 May 2009 20:12:46 +0100
Re: Conformal coating process	Graham Naisbitt	Fri, 29 May 2009 11:03:59 +0100
Re: humidity test failure	Graham Naisbitt	Thu, 28 May 2009 13:40:24 +0100
Re: Humiseal 2A64 CC Experiences	Graham Naisbitt	Fri, 29 May 2009 15:10:42 +0100
Re: Humiseal 2A64 CC Experiences	Graham Naisbitt	Fri, 29 May 2009 16:34:22 +0100
Re: NTC - Friday Trivia Question	Graham Naisbitt	Fri, 15 May 2009 17:05:20 +0100
Re: Parylene Adhesion Tape Test	Graham Naisbitt	Mon, 11 May 2009 13:36:50 +0100
Re: Parylene Adhesion Tape Test	Graham Naisbitt	Mon, 11 May 2009 17:35:18 +0100
Re: What does HIGH GRADE FR-4 mean?	Graham Naisbitt	Wed, 6 May 2009 17:35:33 +0100
Re: Congratulations to Werner	Grant Emandien	Wed, 20 May 2009 22:10:32 +0200
Re: Congratulations to Werner	Grant Emandien	Wed, 20 May 2009 22:22:16 +0200
Re: Congratulations to Werner	Grant Emandien	Wed, 20 May 2009 22:36:28 +0200
Re: End of the week quiz!	Gumpert, Ben	Mon, 18 May 2009 10:35:55 -0400
Nickel barrier layer thickness.	Guy Ramsey	Tue, 12 May 2009 11:24:58 -0400
Re: Request For Screenprinter Commentary	Guy Ramsey	Sat, 23 May 2009 10:41:17 -0400
Material 96% Alumina	Harris Dy	Thu, 7 May 2009 12:21:04 -0700
Panelization Software	Harris Dy	Fri, 29 May 2009 12:23:44 -0700
Plating Hardness of Ni 450Hv or more	Harris Dy	Mon, 4 May 2009 14:07:46 -0700
Soldermask for High CTI >600 PLC 0 Laminate	Harris Dy	Thu, 14 May 2009 11:40:39 -0700
What does HIGH GRADE FR-4 mean?	Harris Dy	Tue, 5 May 2009 10:22:50 -0700
ESD Heel Strap / Shoe Checker - low resistance	Helena Pasquito (Cobham DES SSA)	Wed, 20 May 2009 14:53:14 -0400
Re: Congratulations to Werner	Herminia Guevarra	Thu, 21 May 2009 07:33:46 -0400
Re: Bare PCB Packaging Requirements	Hernefjord Ingemar	Fri, 15 May 2009 09:17:56 +0200
Design considerations for MCM packages	Hernefjord Ingemar	Fri, 8 May 2009 13:56:04 +0200
Re: Design considerations for MCM packages	Hernefjord Ingemar	Fri, 8 May 2009 15:02:10 +0200
Re: Design considerations for MCM packages	Hernefjord Ingemar	Fri, 8 May 2009 15:07:56 +0200
Re: Design considerations for MCM packages	Hernefjord Ingemar	Fri, 8 May 2009 15:06:32 +0200
Re: humidity test failure	Hernefjord Ingemar	Wed, 27 May 2009 09:41:33 +0200
Re: humidity test failure	Hernefjord Ingemar	Wed, 27 May 2009 15:45:54 +0200
Re: Material 96% Alumina	Hernefjord Ingemar	Tue, 12 May 2009 09:11:49 +0200
Re: Material 96% Alumina	Hernefjord Ingemar	Wed, 13 May 2009 08:48:36 +0200
Re: Memorial Day	Hernefjord Ingemar	Tue, 26 May 2009 09:00:49 +0200
Re: Nickel - again	Hernefjord Ingemar	Thu, 7 May 2009 08:50:01 +0200
Re: Nickel - again	Hernefjord Ingemar	Thu, 7 May 2009 12:18:56 +0200
Re: PCB baking	Hernefjord Ingemar	Tue, 5 May 2009 10:04:38 +0200
Re: PCB baking	Hernefjord Ingemar	Tue, 5 May 2009 10:07:00 +0200
Re: Plating Hardness of Ni 450Hv or more	Hernefjord Ingemar	Tue, 5 May 2009 09:08:47 +0200
答复: [TN] Inspector evaluation boards	ii	Sat, 9 May 2009 22:04:19 +0800
答复: [TN] PB Surface Contamination	ii	Thu, 7 May 2009 22:08:43 +0800
Re: 0201 capacitor failure after reflow	Inge	Thu, 14 May 2009 22:31:07 +0200
<No subject>	Inge	Thu, 14 May 2009 22:36:14 +0200
Re: Absence	Inge	Sun, 31 May 2009 17:49:08 +0200
Re: Bare PCB Packaging Requirements	Inge	Thu, 14 May 2009 20:49:01 +0200
Re: Bare PCB Packaging Requirements	Inge	Thu, 14 May 2009 21:26:36 +0200
Re: Bare PCB Packaging Requirements	Inge	Fri, 15 May 2009 16:38:16 +0200
Re: Bare PCB Packaging Requirements	Inge	Fri, 15 May 2009 20:30:55 +0200
Re: Bare PCB Packaging Requirements, what TYKO says	Inge	Thu, 14 May 2009 22:12:47 +0200
Re: Beginning of the week quiz!	Inge	Mon, 18 May 2009 17:59:57 +0200
Re: Conformal coating process	Inge	Thu, 28 May 2009 22:36:36 +0200
Re: Conformal coating process	Inge	Fri, 29 May 2009 17:13:24 +0200
Re: Congratulations to Werner	Inge	Wed, 20 May 2009 19:43:14 +0200
Re: Congratulations to Werner	Inge	Wed, 20 May 2009 22:08:50 +0200
Re: Congratulations to Werner	Inge	Wed, 20 May 2009 22:29:05 +0200
Re: Congratulations to Werner	Inge	Wed, 20 May 2009 22:49:34 +0200
Connectors	Inge	Wed, 13 May 2009 23:12:20 +0200
Re: Dear friend,	Inge	Wed, 13 May 2009 19:11:23 +0200
Re: Design considerations for MCM packages	Inge	Fri, 8 May 2009 17:08:09 +0200
Re: Design considerations for MCM packages	Inge	Fri, 8 May 2009 18:42:21 +0200
Re: Fw: End of the week quiz!	Inge	Fri, 15 May 2009 23:25:07 +0200
Re: Fw: End of the week quiz!	Inge	Sat, 16 May 2009 00:20:15 +0200
Re: Fw: End of the week quiz!	Inge	Sat, 16 May 2009 17:08:54 +0200
Re: Fw: End of the week quiz!	Inge	Sat, 16 May 2009 17:52:05 +0200
Re: humidity test failure	Inge	Wed, 27 May 2009 17:05:10 +0200
Re: humidity test failure	Inge	Wed, 27 May 2009 19:02:25 +0200
Re: humidity test failure	Inge	Wed, 27 May 2009 19:45:59 +0200
Re: humidity test failure	Inge	Wed, 27 May 2009 20:46:41 +0200
Re: humidity test failure	Inge	Thu, 28 May 2009 19:51:12 +0200
Re: Looking for opinions on separation/delamination between copper land and dielectric material.	Inge	Fri, 29 May 2009 16:20:27 +0200
Re: Looking for opinions on separation/delamination between copper land and dielectric material.	Inge	Fri, 29 May 2009 17:39:49 +0200
Re: Looking for opinions on separation/delamination between copper land and dielectric material.	Inge	Fri, 29 May 2009 17:50:08 +0200
Re: Material 96% Alumina	Inge	Thu, 7 May 2009 21:38:13 +0200
Re: Material 96% Alumina	Inge	Thu, 7 May 2009 21:48:22 +0200
Re: Material 96% Alumina	Inge	Tue, 12 May 2009 16:43:36 +0200
Re: Memorial Day	Inge	Tue, 26 May 2009 18:13:36 +0200
Non Technical Re: [TN] Design considerations for MCM packages	Inge	Fri, 8 May 2009 19:00:19 +0200
Re: NTC - Friday Trivia Question	Inge	Fri, 15 May 2009 20:45:09 +0200
Re: NTC - Friday Trivia Question	Inge	Fri, 15 May 2009 22:36:40 +0200
Re: NTC - Friday Trivia Question	Inge	Fri, 15 May 2009 23:35:52 +0200
Re: NTC - Friday Trivia Question	Inge	Fri, 15 May 2009 23:46:39 +0200
Re: NTC - Friday Trivia Question	Inge	Sat, 16 May 2009 00:12:05 +0200
Re: NTC - RE: [TN] What does HIGH GRADE FR-4 mean?	Inge	Wed, 6 May 2009 20:35:26 +0200
NTC, no jokes serious q	Inge	Thu, 14 May 2009 18:55:44 +0200
Re: NTC, no jokes serious q	Inge	Thu, 14 May 2009 20:00:33 +0200
NTC: Beginning of the week quiz!	Inge	Sun, 17 May 2009 20:19:47 +0200
Re: Nylon connectors - moisture sensitivity	Inge	Wed, 13 May 2009 21:22:07 +0200
Re: Nylon connectors - moisture sensitivity	Inge	Wed, 13 May 2009 22:39:35 +0200
Package requirement Method 1014	Inge	Wed, 20 May 2009 21:56:11 +0200
Re: PB Surface Contamination	Inge	Thu, 7 May 2009 18:48:12 +0200
Re: PB Surface Contamination	Inge	Thu, 7 May 2009 19:27:55 +0200
Re: PB Surface Contamination	Inge	Thu, 7 May 2009 19:48:28 +0200
Re: PB Surface Contamination	Inge	Thu, 7 May 2009 19:57:16 +0200
Re: PB Surface Contamination	Inge	Thu, 7 May 2009 21:28:33 +0200
Re: PCB holder for microscope inspection	Inge	Fri, 22 May 2009 23:09:53 +0200
Re: PWB fab drawing - how thick is the copper?	Inge	Thu, 14 May 2009 18:07:34 +0200
Re: PWB fab drawing - how thick is the copper?	Inge	Thu, 14 May 2009 19:04:36 +0200
Re: PWB fab drawing - how thick is the copper?	Inge	Thu, 14 May 2009 19:17:17 +0200
Seam welding	Inge	Thu, 14 May 2009 20:39:05 +0200
Re: Seam welding	Inge	Thu, 14 May 2009 21:36:58 +0200
Re: Technetters/LF-People in Spain, Portugal & Southern France	Inge	Fri, 29 May 2009 17:56:09 +0200
WAX	Inge	Fri, 29 May 2009 16:33:48 +0200
Re: WAX	Inge	Fri, 29 May 2009 18:07:38 +0200
Re: WAX	Inge	Fri, 29 May 2009 18:18:58 +0200
Re: WAX	Inge	Fri, 29 May 2009 18:20:31 +0200
Re: WAX	Inge	Fri, 29 May 2009 19:50:45 +0200
Re: WAX	Inge	Fri, 29 May 2009 23:07:20 +0200
Re: What does HIGH GRADE FR-4 mean?	Inge	Wed, 6 May 2009 08:23:51 +0200
Re: FW: [TN] 0201 capacitor failure after reflow	Inge	Sun, 17 May 2009 17:07:28 +0200
Inspector evaluation boards	Ioan Tempea	Thu, 7 May 2009 16:19:53 -0400
Re: Looking for an Optical Picture of a Popcorned SMT Component	Ioan Tempea	Fri, 1 May 2009 10:45:27 -0400
Open joints on CompactFlash connector	Ioan Tempea	Thu, 21 May 2009 08:10:12 -0400
PCB baking	Ioan Tempea	Mon, 4 May 2009 09:25:18 -0400
Re: Underfill Pass/fail criteria	Ioan Tempea	Tue, 19 May 2009 14:39:45 -0400
Re: FLEX question	James Mahoney	Fri, 15 May 2009 08:29:30 -0400
Re: FLEX question	James Mahoney	Fri, 15 May 2009 13:27:49 -0400
Re: IPC-4101 specification question	James Mahoney	Wed, 20 May 2009 08:17:39 -0400
Re: Military Specification Y-pattern	James Mahoney	Mon, 18 May 2009 10:14:09 -0400
Re: Solder Mask	Joe Fjelstad	Fri, 8 May 2009 16:10:39 EDT
Re: Solder Mask	Joe Fjelstad	Mon, 11 May 2009 11:40:42 EDT
Re: What does HIGH GRADE FR-4 mean?	Joe Fjelstad	Wed, 6 May 2009 12:58:08 EDT
Re: PCB baking	Joe Macko	Mon, 4 May 2009 07:04:53 -0700
Re: ESD Heel Strap / Shoe Checker - low resistance	John Anselmo	Wed, 20 May 2009 13:31:08 -0600
Re: Congratulations to Werner	John Burke	Wed, 20 May 2009 10:53:17 -0700
Re: End of the week quiz!	John Burke	Fri, 15 May 2009 14:24:11 -0700
Re: Fw: End of the week quiz!	John Burke	Fri, 15 May 2009 15:01:57 -0700
Re: Fw: End of the week quiz!	John Burke	Sat, 16 May 2009 10:49:49 -0700
Re: humidity test failure	John Burke	Thu, 28 May 2009 08:38:19 -0700
Re: Material 96% Alumina	John Burke	Thu, 7 May 2009 21:13:26 -0700
Re: Material 96% Alumina	John Burke	Tue, 12 May 2009 06:35:15 -0700
Re: Nickel - again	John Burke	Wed, 6 May 2009 16:49:10 -0700
Re: NTC - Friday Trivia Question	John Burke	Fri, 15 May 2009 08:21:07 -0700
Re: NTC - Friday Trivia Question	John Burke	Fri, 15 May 2009 11:33:37 -0700
Re: NTC - RE: [TN] What does HIGH GRADE FR-4 mean?	John Burke	Wed, 6 May 2009 09:58:24 -0700
Re: PB Surface Contamination	John Burke	Thu, 7 May 2009 10:53:57 -0700
Re: PB Surface Contamination	John Burke	Thu, 7 May 2009 11:58:52 -0700
Re: PB Surface Contamination	John Burke	Thu, 7 May 2009 13:19:40 -0700
Re: PB Surface Contamination	John Burke	Thu, 7 May 2009 14:50:55 -0700
Re: Solder Jetting	John Burke	Mon, 25 May 2009 18:43:42 -0700
Re: Solder Mask	John Burke	Fri, 8 May 2009 14:45:13 -0700
Re: WAX	John Burke	Fri, 29 May 2009 13:52:30 -0700
Re: WAX	John Burke	Fri, 29 May 2009 14:52:01 -0700
Re: WAX	John Burke	Fri, 29 May 2009 15:39:02 -0700
FLEX question	John Foster	Thu, 14 May 2009 17:52:15 -0700
Re: FLEX question	John Foster	Thu, 14 May 2009 19:07:50 -0700
Re: FLEX question	John Foster	Thu, 14 May 2009 19:14:06 -0700
Re: FLEX question	John Foster	Fri, 15 May 2009 08:22:28 -0700
Re: FLEX question	John Foster	Fri, 15 May 2009 10:20:53 -0700
Rohs SMT parts and shelf life	John Goulet	Sat, 9 May 2009 15:03:43 +0000
Re: Rohs SMT parts and shelf life	John Goulet	Mon, 18 May 2009 00:18:18 +0000
Re: Panelization Software	John Koleszar	Fri, 29 May 2009 15:37:07 -0400
Bare PCB Packaging Requirements	John Parsons	Thu, 14 May 2009 11:36:58 -0700
Re: Bare PCB Packaging Requirements	John Parsons	Thu, 14 May 2009 12:56:03 -0700
Invitation to connect on LinkedIn	John Queen	Sat, 23 May 2009 06:43:08 -0700
OSP Test Point issue	John Queen	Fri, 15 May 2009 12:36:12 +0000
Taguchi	John Queen	Sun, 24 May 2009 13:55:28 +0100
Re: Bare PCB Packaging Requirements	Joyce Koo	Fri, 15 May 2009 15:50:20 -0400
Re: Congratulations to Werner	Joyce Koo	Wed, 20 May 2009 12:44:59 -0400
Re: Design considerations for MCM packages	Joyce Koo	Fri, 8 May 2009 10:22:28 -0400
Re: Design considerations for MCM packages	Joyce Koo	Fri, 8 May 2009 20:30:16 -0400
Re: Design considerations for MCM packages	Joyce Koo	Sat, 9 May 2009 15:43:47 -0400
Re: Immersion Silver	Joyce Koo	Sun, 31 May 2009 09:09:43 -0400
Re: NTC - Friday Trivia Question	Joyce Koo	Fri, 15 May 2009 15:50:08 -0400
Re: Nylon connectors - moisture sensitivity	Joyce Koo	Wed, 13 May 2009 18:15:50 -0400
Re: PB Surface Contamination	Joyce Koo	Thu, 7 May 2009 19:04:39 -0400
Re: WAX	Joyce Koo	Fri, 29 May 2009 13:01:07 -0400
Re: WAX	Joyce Koo	Fri, 29 May 2009 18:27:46 -0400
Re: What does HIGH GRADE FR-4 mean?	Joyce Koo	Tue, 5 May 2009 17:43:05 -0400
Re: Congratulations to Werner	Kane, Amol (349)	Wed, 20 May 2009 14:24:29 -0400
Humiseal 2A64 CC Experiences	Kane, Amol (349)	Fri, 29 May 2009 08:34:55 -0400
Re: Humiseal 2A64 CC Experiences	Kane, Amol (349)	Fri, 29 May 2009 10:34:56 -0400
Re: Humiseal 2A64 CC Experiences	Kane, Amol (349)	Fri, 29 May 2009 16:21:09 -0400
Re: IPC/EIA-J-STD 002 Steam Ageing	Kane, Amol (349)	Fri, 1 May 2009 09:59:40 -0400
Re: Open joints on CompactFlash connector	Kane, Amol (349)	Thu, 21 May 2009 09:04:21 -0400
Re: Solder Ball Problem	Kane, Amol (349)	Fri, 1 May 2009 10:07:20 -0400
Test	Kane, Amol (349)	Wed, 13 May 2009 07:57:46 -0400
Re: Conformal coating process	Kane, Joseph E (US SSA)	Thu, 28 May 2009 16:25:06 -0400
Re: ESD Heel Strap / Shoe Checker - low resistance	Kane, Joseph E (US SSA)	Wed, 20 May 2009 16:30:18 -0400
Re: ESD Heel Strap / Shoe Checker - low resistance	Kane, Joseph E (US SSA)	Thu, 21 May 2009 10:34:53 -0400
PB Surface Contamination	Kane, Joseph E (US SSA)	Thu, 7 May 2009 09:12:49 -0400
Re: Bare PCB Packaging Requirements	Karen Tellefsen	Thu, 14 May 2009 16:13:02 -0400
Re: Bare PCB Packaging Requirements	Karen Tellefsen	Thu, 14 May 2009 17:52:53 -0400
Re: Congratulations to Werner	Karen Tellefsen	Wed, 20 May 2009 12:41:13 -0400
Re: coupon router	Karen Tellefsen	Fri, 15 May 2009 14:27:56 -0400
Re: NTC - Friday Trivia Question	Karen Tellefsen	Fri, 15 May 2009 14:24:36 -0400
Re: NTC - Friday Trivia Question	Karen Tellefsen	Fri, 15 May 2009 17:24:06 -0400
Re: Parylene Adhesion Tape Test	Karen Tellefsen	Mon, 11 May 2009 09:33:45 -0400
Re: Parylene Adhesion Tape Test	Karen Tellefsen	Mon, 11 May 2009 11:30:40 -0400
Re: PB Surface Contamination	Karen Tellefsen	Thu, 7 May 2009 09:28:30 -0400
Re: PB Surface Contamination	Karen Tellefsen	Thu, 7 May 2009 12:40:32 -0400
Re: PB Surface Contamination	Karen Tellefsen	Thu, 7 May 2009 13:02:07 -0400
Re: PB Surface Contamination	Karen Tellefsen	Thu, 7 May 2009 13:30:29 -0400
Re: What does HIGH GRADE FR-4 mean?	Karen Tellefsen	Tue, 5 May 2009 14:32:20 -0400
Technet Etiquette and Policy Reminder	Keach Sasamori	Wed, 13 May 2009 12:13:29 -0500
Re: Congratulations to Werner	Ken Bloomquist	Wed, 20 May 2009 09:24:59 -0800
Re: Inspector evaluation boards	Ken Bloomquist	Mon, 11 May 2009 06:49:42 -0800
Re: Parylene Adhesion Tape Test	Ken Bloomquist	Mon, 11 May 2009 07:18:16 -0800
Re: What does HIGH GRADE FR-4 mean?	Ken Bloomquist	Tue, 5 May 2009 09:43:59 -0800
test	Kenneth Wood	Mon, 4 May 2009 08:11:00 -0400
crimp to wire solder terminal	Kevin Glidden	Tue, 19 May 2009 13:14:42 -0400
Re: humidity test failure	Kevin Glidden	Wed, 27 May 2009 08:23:50 -0400
Re: humidity test failure	Kevin Glidden	Wed, 27 May 2009 11:25:19 -0400
Re: Immersion Silver	Kevin Glidden	Wed, 27 May 2009 07:54:18 -0400
Re: What does HIGH GRADE FR-4 mean?	Kevin Glidden	Tue, 5 May 2009 14:41:41 -0400
Congratulations to Werner	Kim Sterling	Wed, 20 May 2009 11:32:29 -0500
Email Change	kwood716	Mon, 4 May 2009 07:45:12 -0400
Re: Parylene Adhesion Tape Test	Lamar Young	Tue, 12 May 2009 10:33:34 -0400
Re: Nitrogen use for selective soldering equipment	Larry Dzaugis	Fri, 1 May 2009 11:51:16 -0500
Re: Congratulations to Werner	Lee parker	Wed, 20 May 2009 15:44:53 -0400
Re: Immersion Silver	Lee parker	Wed, 27 May 2009 07:46:26 -0400
Re: Looking for opinions on separation/delamination between copper land and dielectric material.	Lee parker	Fri, 29 May 2009 11:25:54 -0400
Re: Nickel - again	Lee parker	Wed, 6 May 2009 20:16:35 -0400
Re: PB Surface Contamination	Lee parker	Thu, 7 May 2009 17:29:38 -0400
Re: NTC - Nylon connectors - moisture sensitivity	Lee Whiteman	Wed, 13 May 2009 16:23:11 -0400
Re: NTC - Nylon connectors - moisture sensitivity	Lee Whiteman	Wed, 13 May 2009 16:33:12 -0400
Re: Nylon connectors - moisture sensitivity	Lee Whiteman	Wed, 13 May 2009 14:55:48 -0400
Re: Nylon connectors - moisture sensitivity	Lee Whiteman	Wed, 13 May 2009 14:58:19 -0400
Re: Nylon connectors - moisture sensitivity	Lee Whiteman	Wed, 13 May 2009 14:59:13 -0400
Re: Design considerations for MCM packages	legg	Fri, 8 May 2009 07:46:13 -0500
Re: Is fusing current current?	legg	Fri, 8 May 2009 07:53:16 -0500
Re: Congratulations to Werner	Leif Erik Laerum	Wed, 20 May 2009 16:58:08 -0500
Connector with loose pins	Leif Erik Laerum	Fri, 15 May 2009 16:16:49 -0500
Re: Connector with loose pins	Leif Erik Laerum	Fri, 15 May 2009 16:42:01 -0500
Re: Connector with loose pins	Leif Erik Laerum	Fri, 15 May 2009 17:15:42 -0500
Re: Open joints on CompactFlash connector	Leif Erik Laerum	Thu, 21 May 2009 09:41:47 -0500
Re: Congratulations to Werner	Leland Woodall	Thu, 21 May 2009 09:47:33 -0400
Re: Dear friend,	Leland Woodall	Wed, 13 May 2009 13:18:07 -0400
Request For Screenprinter Commentary	Leland Woodall	Fri, 22 May 2009 12:42:09 -0400
lighting ballast encapsulant removal	Lenny Carter	Fri, 29 May 2009 13:59:24 -0400
Re: lighting ballast encapsulant removal	Lenny Carter	Fri, 29 May 2009 16:34:41 -0400
Re: Inspector evaluation boards	Linda Langley	Fri, 8 May 2009 11:48:34 -0400
coupon router	Louis Hart	Fri, 15 May 2009 14:17:47 -0400
Re: NTC NTC - Nylon connectors - moisture sensitivity	Louis Hart	Wed, 13 May 2009 17:38:26 -0400
Re: Congratulations to Werner	Lum Wee Mei	Thu, 21 May 2009 08:44:31 +0800
Parylene Adhesion Tape Test	Mary Lou Sachenik	Sat, 9 May 2009 07:47:55 -0400
Re: Straddle mount connector at SMT	Matt Kehoe	Wed, 20 May 2009 05:44:49 -0500
Re: lighting ballast encapsulant removal	Matthias Mansfeld	Fri, 29 May 2009 22:47:44 +0200
Re: NTC, no jokes serious q	Matthias Mansfeld	Thu, 14 May 2009 19:43:43 +0200
Re: Immersion Silver	Maurice Dore	Wed, 27 May 2009 08:36:18 +0100
Re: IPC-4101 specification question	McGlaughlin, Jeffrey A	Wed, 20 May 2009 08:15:42 -0400
Re: PWB fab drawing - how thick is the copper?	McGlaughlin, Jeffrey A	Thu, 14 May 2009 09:16:25 -0400
Re: Via Tenting Under BGAs .. Again (apologies!)	McGlaughlin, Jeffrey A	Tue, 12 May 2009 06:51:24 -0400
Re: Memorial Day	Meyers, Paula	Tue, 26 May 2009 11:13:16 -0400
Re: Memorial Day	Meyers, Paula	Tue, 26 May 2009 12:01:39 -0400
Re: OT RE: [TN] Memorial Day	Meyers, Paula	Wed, 27 May 2009 11:32:30 -0400
Re: Congratulations to Werner	Michael Kirschner	Wed, 20 May 2009 16:57:30 -0500
Re: Absence	Mike Fenner	Sun, 31 May 2009 10:52:13 +0100
Re: Conformal coating process	Mike Fenner	Fri, 29 May 2009 08:54:15 +0100
Re: Conformal coating process	Mike Fenner	Sat, 30 May 2009 21:35:36 +0100
Re: Fw: End of the week quiz!	Mike Fenner	Sat, 16 May 2009 15:06:56 +0100
Re: humidity test failure	Mike Fenner	Wed, 27 May 2009 15:40:22 +0100
Re: humidity test failure	Mike Fenner	Thu, 28 May 2009 08:46:15 +0100
Re: Material 96% Alumina	Mike Fenner	Fri, 8 May 2009 08:25:43 +0100
Re: Nickel - again	Mike Fenner	Thu, 7 May 2009 10:35:04 +0100
Re: NTC, no jokes serious q	Mike Fenner	Fri, 15 May 2009 17:48:58 +0100
Conformal coating process	Mike Johnson	Thu, 28 May 2009 14:37:45 -0500
Re: ESD Heel Strap / Shoe Checker - low resistance	Mike Sewell	Wed, 20 May 2009 14:46:58 -0500
Re: ESD Heel Strap / Shoe Checker - low resistance (TYPO)	Mike Sewell	Wed, 20 May 2009 14:50:00 -0500
Re: Request For Screenprinter Commentary	mikebuetow	Sat, 23 May 2009 14:55:20 +0000
Re: Request For Screenprinter Commentary	mikebuetow	Sat, 23 May 2009 15:18:04 +0000
HDI in Class 3	Mirka Halas	Wed, 27 May 2009 13:26:01 -0500
Re: PCB baking	Mumtaz Bora	Mon, 4 May 2009 09:14:48 -0700
Re: PCB baking	N Burtt	Tue, 5 May 2009 06:35:13 -0500
Re: Congratulations to Werner	Nowland, Russell Howard (Russell)	Wed, 20 May 2009 13:04:57 -0500
Re: PCB baking	Paul O Connor	Mon, 11 May 2009 13:55:55 -0500
Re: PCB baking	Paul O Connor	Mon, 11 May 2009 21:09:52 +0100
Soldermask for High CTI >600 PLC 0 Laminate	Paul O Connor	Fri, 15 May 2009 03:38:10 -0500
Re: Congratulations to Werner	Paul Reid	Wed, 20 May 2009 14:58:53 -0400
Re: humidity test failure	Paul Reid	Thu, 28 May 2009 06:50:33 -0400
Re: Looking for opinions on separation/delamination between copper land and dielectric material.	Paul Reid	Fri, 29 May 2009 08:40:21 -0400
Re: Memorial Day	Paul Reid	Tue, 26 May 2009 06:32:21 -0400
Re: Memorial Day	Paul Reid	Tue, 26 May 2009 11:40:05 -0400
Re: Memorial Day	Paul Reid	Tue, 26 May 2009 12:03:50 -0400
Re: PCB baking	Paul Reid	Mon, 4 May 2009 14:59:52 -0400
Re: Solder Mask	Paul Reid	Fri, 8 May 2009 17:23:16 -0400
Re: Solder Mask	Paul Reid	Mon, 11 May 2009 09:45:02 -0400
Re: Dear friend,	Peter Swanson	Wed, 13 May 2009 17:29:02 +0100
Looking for Metric thread banana plugs	Phil Nutting	Fri, 8 May 2009 07:43:50 -0400
Metric thread banana plugs	Phil Nutting	Wed, 6 May 2009 17:32:45 -0400
Re: WAX	R Sedlak	Fri, 29 May 2009 09:01:38 -0700
Re: Congratulations to Werner	Randall L Bock	Wed, 20 May 2009 12:39:09 -0400
Re: Looking for opinions on separation/delamination between copper land and dielectric material.	Randall L Bock	Fri, 29 May 2009 11:22:54 -0400
Re: OT RE: [TN] Memorial Day	Randall L Bock	Wed, 27 May 2009 11:49:15 -0400
Re: Congratulations to Werner	Reuven Rokah	Wed, 20 May 2009 22:16:07 +0300
Re: End of the week quiz!	Rex Waygood	Mon, 18 May 2009 10:47:59 +0100
Re: End of the week quiz!	Rex Waygood	Mon, 18 May 2009 16:09:14 +0100
Re: ESD Heel Strap / Shoe Checker - low resistance	Rex Waygood	Wed, 20 May 2009 22:39:48 +0100
Re: ESD Heel Strap / Shoe Checker - low resistance	Rex Waygood	Wed, 20 May 2009 22:53:28 +0100
Re: ESD Heel Strap / Shoe Checker - low resistance	Rex Waygood	Thu, 21 May 2009 17:22:36 +0100
Military Specification Y-pattern	Richard Kraszewski	Fri, 15 May 2009 09:25:25 -0500
Re: Parylene Adhesion Tape Test	Richard Kraszewski	Tue, 12 May 2009 09:04:26 -0500
Re: Nylon connectors - moisture sensitivity	Rick Bell	Wed, 13 May 2009 15:59:32 -0500
Re: Open joints on CompactFlash connector	Rick Bell	Thu, 21 May 2009 15:11:22 -0500
SMD 0603 dual-wound Filter	Rob Mullane	Wed, 13 May 2009 22:21:36 +0100
Re: Bare PCB Packaging Requirements	Rob Strecker	Thu, 14 May 2009 13:42:31 -0600
Re: PCB baking	Rob Strecker	Mon, 4 May 2009 08:54:26 -0600
Re: PCB baking	Rob Strecker	Mon, 11 May 2009 09:50:43 -0600
Re: PCB baking	Rob Strecker	Mon, 11 May 2009 10:39:38 -0600
Re: PCB baking	Rob Strecker	Mon, 11 May 2009 11:18:34 -0600
Re: Bare PCB Packaging Requirements	Robert Kondner	Thu, 14 May 2009 15:03:17 -0400
Re: Bare PCB Packaging Requirements	Robert Kondner	Thu, 14 May 2009 16:57:56 -0400
Re: Bare PCB Packaging Requirements	Robert Kondner	Thu, 14 May 2009 17:20:44 -0400
Re: Bare PCB Packaging Requirements	Robert Kondner	Thu, 14 May 2009 18:03:50 -0400
Re: Bare PCB Packaging Requirements	Robert Kondner	Fri, 15 May 2009 09:53:12 -0400
Re: Bare PCB Packaging Requirements	Robert Kondner	Fri, 15 May 2009 12:41:45 -0400
Re: Bare PCB Packaging Requirements	Robert Kondner	Fri, 15 May 2009 16:35:33 -0400
Re: Conformal coating process	Robert Kondner	Thu, 28 May 2009 16:36:03 -0400
Re: Memorial Day	Robert Kondner	Tue, 26 May 2009 12:06:57 -0400
Re: Open joints on CompactFlash connector	Robert Kondner	Thu, 21 May 2009 08:51:10 -0400
OT RE: [TN] Memorial Day	Robert Kondner	Tue, 26 May 2009 12:12:49 -0400
Re: OT RE: [TN] Memorial Day	Robert Kondner	Wed, 27 May 2009 12:49:01 -0400
Re: Panelization Software	Robert Kondner	Fri, 29 May 2009 15:25:55 -0400
Re: Panelization Software	Robert Kondner	Fri, 29 May 2009 15:42:26 -0400
Re: Request For Screenprinter Commentary	Robert Kondner	Sat, 23 May 2009 16:29:02 -0400
Re: Congratulations to Werner	Roberts, Jon	Wed, 20 May 2009 12:11:15 -0500
Re: Looking for a cartoon reference	Roberts, Jon	Tue, 26 May 2009 07:05:27 -0500
Re: Congratulations to Werner	roland jaquet	Fri, 22 May 2009 12:56:23 +0200
Re: PWB fab drawing - how thick is the copper?	Scott B. Westheimer	Thu, 14 May 2009 10:20:06 -0400
Re: Bare PCB Packaging Requirements	Stadem, Richard D.	Thu, 14 May 2009 14:11:31 -0500
Re: Bare PCB Packaging Requirements	Stadem, Richard D.	Thu, 14 May 2009 15:22:25 -0500
Re: Congratulations to Werner	Stadem, Richard D.	Wed, 20 May 2009 13:00:25 -0500
Re: Connector with loose pins	Stadem, Richard D.	Mon, 18 May 2009 07:50:55 -0500
Re: Dear friend,	Stadem, Richard D.	Wed, 13 May 2009 11:28:27 -0500
Re: Design considerations for MCM packages	Stadem, Richard D.	Fri, 8 May 2009 07:42:51 -0500
Re: Design considerations for MCM packages	Stadem, Richard D.	Fri, 8 May 2009 08:24:36 -0500
Re: Design considerations for MCM packages	Stadem, Richard D.	Fri, 8 May 2009 12:36:45 -0500
Re: ESD Heel Strap / Shoe Checker - low resistance	Stadem, Richard D.	Wed, 20 May 2009 14:58:57 -0500
Re: Golden finger (Golden Pad) clear and protect method	Stadem, Richard D.	Fri, 22 May 2009 08:33:27 -0500
Re: humidity test failure	Stadem, Richard D.	Wed, 27 May 2009 08:06:41 -0500
Re: humidity test failure	Stadem, Richard D.	Wed, 27 May 2009 16:17:39 -0500
Re: Inspector evaluation boards	Stadem, Richard D.	Thu, 7 May 2009 16:05:12 -0500
Re: Material 96% Alumina	Stadem, Richard D.	Tue, 12 May 2009 10:46:05 -0500
Re: Material 96% Alumina	Stadem, Richard D.	Tue, 12 May 2009 10:47:46 -0500
Re: Material 96% Alumina	Stadem, Richard D.	Tue, 12 May 2009 10:54:33 -0500
Re: Memorial Day	Stadem, Richard D.	Tue, 26 May 2009 10:54:10 -0500
Re: NTC, no jokes serious q	Stadem, Richard D.	Thu, 14 May 2009 12:41:38 -0500
Re: PB Surface Contamination	Stadem, Richard D.	Thu, 7 May 2009 13:22:30 -0500
Re: PCB baking	Stadem, Richard D.	Mon, 4 May 2009 10:07:54 -0500
Re: PCB baking	Stadem, Richard D.	Mon, 4 May 2009 10:26:52 -0500
Re: Plating Hardness of Ni 450Hv or more	Stadem, Richard D.	Mon, 4 May 2009 16:25:10 -0500
Re: PWB fab drawing - how thick is the copper?	Stadem, Richard D.	Thu, 14 May 2009 12:35:17 -0500
Re: Seam welding	Stadem, Richard D.	Thu, 14 May 2009 14:14:46 -0500
Re: Strange Tolerances on BGA Pitch-How to Accomodate the Stencil File?	Stadem, Richard D.	Tue, 19 May 2009 08:47:50 -0500
Re: Strange Tolerances on BGA Pitch-How to Accomodate the Stencil File?	Stadem, Richard D.	Wed, 20 May 2009 10:20:17 -0500
Re: Strange Tolerances on BGA Pitch-How to Accomodate the Stencil File?	Stadem, Richard D.	Thu, 21 May 2009 07:47:19 -0500
Re: Strange Tolerances on BGA Pitch-How to Accomodate the Stencil File?	Stadem, Richard D.	Thu, 21 May 2009 08:18:40 -0500
Re: Underfill Pass/fail criteria	Stadem, Richard D.	Tue, 19 May 2009 15:00:37 -0500
Re: Underfill Pass/fail criteria	Stadem, Richard D.	Tue, 19 May 2009 15:18:02 -0500
Re: Underfill Pass/fail criteria	Stadem, Richard D.	Tue, 19 May 2009 16:50:46 -0500
Re: What does HIGH GRADE FR-4 mean?	Stadem, Richard D.	Tue, 5 May 2009 12:37:01 -0500
Re: What does HIGH GRADE FR-4 mean?	Stadem, Richard D.	Tue, 5 May 2009 12:49:03 -0500
Re: What does HIGH GRADE FR-4 mean?	Stadem, Richard D.	Tue, 5 May 2009 13:59:03 -0500
Re: Looking for a cartoon reference	stephengregory5849	Sun, 24 May 2009 10:41:15 -0500
Re: Memorial Day	stephengregory5849	Mon, 25 May 2009 17:52:30 -0500
Re: Dear friend,	Steve Gregory	Wed, 13 May 2009 12:51:15 -0500
Re: humidity test failure	Steve Gregory	Wed, 27 May 2009 06:59:42 -0500
Re: humidity test failure	Steve Gregory	Wed, 27 May 2009 09:22:03 -0500
Is fusing current current?	Steve Gregory	Fri, 1 May 2009 06:56:45 -0500
Re: Looking for an Optical Picture of a Popcorned SMT Component	Steve Gregory	Fri, 1 May 2009 09:41:40 -0500
Re: Looking for opinions on separation/delamination between copper land and dielectric material.	Steve Gregory	Fri, 29 May 2009 09:57:08 -0500
Re: NTC - Friday Trivia Question	Steve Gregory	Fri, 15 May 2009 08:03:14 -0500
Re: test	Steve Gregory	Mon, 4 May 2009 07:23:37 -0500
Re: What does HIGH GRADE FR-4 mean?	Steve Gregory	Tue, 5 May 2009 13:41:27 -0500
Re: What does HIGH GRADE FR-4 mean?	Steve Gregory	Tue, 5 May 2009 13:59:15 -0500
Re: FLEX question	Steve Kelly	Fri, 15 May 2009 09:17:12 -0400
Re: FLEX question	Steve Kelly	Fri, 15 May 2009 14:09:26 -0400
Immersion Silver	Steve Kelly	Tue, 26 May 2009 17:00:20 -0400
Re: Immersion Silver	Steve Kelly	Wed, 27 May 2009 14:34:46 -0400
Re: Design considerations for MCM packages	Steven Creswick	Fri, 8 May 2009 08:37:09 -0400
Re: Design considerations for MCM packages	Steven Creswick	Fri, 8 May 2009 08:42:02 -0400
Re: DIP Leadframes	Steven Creswick	Thu, 21 May 2009 20:00:25 -0400
Re: lighting ballast encapsulant removal	Steven Creswick	Fri, 29 May 2009 14:22:48 -0400
Re: Material 96% Alumina	Steven Creswick	Thu, 7 May 2009 15:29:57 -0400
Re: Material 96% Alumina	Steven Creswick	Thu, 7 May 2009 20:20:26 -0400
Re: Package requirement Method 1014	Steven Creswick	Wed, 20 May 2009 20:23:32 -0400
Re: NTC, no jokes serious q	Stewart, Dougal	Thu, 14 May 2009 18:24:33 +0100
Re: Congratulations to Werner	Tan Geok Ang	Thu, 21 May 2009 08:41:08 +0800
Re: lighting ballast encapsulant removal	Terry L. Munson	Fri, 29 May 2009 16:11:22 EDT
Re: PB Surface Contamination	Terry L. Munson	Thu, 7 May 2009 12:01:56 EDT
DIP Leadframes	Thayer, Wayne	Thu, 21 May 2009 19:32:36 -0400
humidity test failure	Thayer, Wayne	Tue, 26 May 2009 22:01:10 -0400
Re: humidity test failure	Thayer, Wayne	Wed, 27 May 2009 09:50:11 -0400
Re: humidity test failure	Thayer, Wayne	Wed, 27 May 2009 09:56:54 -0400
Re: humidity test failure	Thayer, Wayne	Wed, 27 May 2009 16:10:38 -0400
Re: Open joints on CompactFlash connector	Thayer, Wayne	Thu, 21 May 2009 12:45:49 -0400
Re: SMD 0603 dual-wound Filter	Thayer, Wayne	Thu, 14 May 2009 12:55:59 -0400
Solder Jetting	Thayer, Wayne	Sun, 24 May 2009 09:15:36 -0400
Re: PWB fab drawing - how thick is the copper?	Thomas E Kemp	Thu, 14 May 2009 09:24:38 -0500
Upcoming IPC workshops and webcasts on printed circuit board technology	Tina Nerad	Tue, 26 May 2009 14:12:19 -0500
Re: FLEX question	Tony Steinke	Fri, 15 May 2009 12:08:29 -0400
Re: Congratulations to Werner	Victor Hernandez	Wed, 20 May 2009 11:38:25 -0500
Re: Golden finger (Golden Pad) clear and protect method	Victor Hernandez	Fri, 22 May 2009 08:17:49 -0500
Halogen Free raw boards/PWB/PCB	Victor Hernandez	Thu, 21 May 2009 10:27:03 -0500
Re: humidity test failure	Victor Hernandez	Wed, 27 May 2009 08:50:10 -0500
Re: Inspector evaluation boards	Victor Hernandez	Thu, 7 May 2009 15:25:49 -0500
Re: Open joints on CompactFlash connector	Victor Hernandez	Thu, 21 May 2009 07:41:52 -0500
Re: OT RE: [TN] Memorial Day	Victor Hernandez	Wed, 27 May 2009 10:42:52 -0500
Solder Mask	Victor Hernandez	Fri, 8 May 2009 14:36:49 -0500
Re: Solder Mask	Victor Hernandez	Mon, 11 May 2009 07:31:08 -0500
Re: Solder Mask	Victor Hernandez	Mon, 11 May 2009 07:31:08 -0500
Re: WAX	Victor Hernandez	Fri, 29 May 2009 10:24:36 -0500
Re: Congratulations to Werner	Vladimir Igoshev	Wed, 20 May 2009 19:38:46 -0400
Re: Design considerations for MCM packages	Vladimir Igoshev	Sat, 9 May 2009 01:20:38 +0000
Re: humidity test failure	Vladimir Igoshev	Wed, 27 May 2009 12:35:13 +0000
Re: humidity test failure	Vladimir Igoshev	Wed, 27 May 2009 15:39:24 +0000
Re: Open joints on CompactFlash connector	Vladimir Igoshev	Thu, 21 May 2009 12:46:02 +0000
Re: Plating Hardness of Ni 450Hv or more	Vladimir Igoshev	Mon, 4 May 2009 21:41:26 +0000
Re: Underfill Pass/fail criteria	Vladimir Igoshev	Tue, 19 May 2009 18:51:44 +0000
Golden finger (Golden Pad) clear and protect method	Wang, Rocky	Fri, 22 May 2009 11:40:42 +0800
Re: Absence	Wenger, George M.	Sun, 31 May 2009 15:23:30 -0400
Re: humidity test failure	Wenger, George M.	Wed, 27 May 2009 08:30:43 -0400
Re: humidity test failure	Wenger, George M.	Wed, 27 May 2009 11:02:18 -0400
Re: humidity test failure	Wenger, George M.	Wed, 27 May 2009 14:55:32 -0400
Re: Immersion Silver	Wenger, George M.	Wed, 27 May 2009 11:34:26 -0400
Re: PB Surface Contamination	Wenger, George M.	Thu, 7 May 2009 09:34:14 -0400
Re: 答复: [TN] Rohs SMT parts and shelf lif e	Werner Engelmaier /*	Mon, 18 May 2009 11:21:28 -0400
Re: 0201 capacitor failure after reflow	Werner Engelmaier /*	Thu, 14 May 2009 17:40:50 -0400
Re: 0201 capacitor failure after reflow	Werner Engelmaier /*	Fri, 15 May 2009 16:11:17 -0400
Re: 0201 capacitor failure after reflow	Werner Engelmaier /*	Fri, 15 May 2009 16:52:02 -0400
Re: 0201 capacitor failure after reflow	Werner Engelmaier /*	Fri, 15 May 2009 17:10:33 -0400
Re: 0201 capacitor failure after reflow	Werner Engelmaier /*	Sun, 17 May 2009 13:58:51 -0400
Re: Absence	Werner Engelmaier /*	Sun, 31 May 2009 14:36:16 -0400
Re: Congratulations to Werner	Werner Engelmaier /*	Wed, 20 May 2009 15:04:22 -0400
Re: Congratulations to Werner	Werner Engelmaier /*	Wed, 20 May 2009 16:00:15 -0400
Re: Connector with loose pins	Werner Engelmaier /*	Fri, 15 May 2009 17:22:14 -0400
Re: Connector with loose pins	Werner Engelmaier /*	Fri, 15 May 2009 17:45:31 -0400
Re: End of the week quiz!	Werner Engelmaier /*	Fri, 15 May 2009 17:06:52 -0400
Re: Fw: End of the week quiz!	Werner Engelmaier /*	Fri, 15 May 2009 17:27:25 -0400
Re: End of the week quiz!	Werner Engelmaier /*	Fri, 15 May 2009 17:28:15 -0400
Re: Fw: End of the week quiz!	Werner Engelmaier /*	Fri, 15 May 2009 17:30:48 -0400
Re: Fw: End of the week quiz!	Werner Engelmaier /*	Sat, 16 May 2009 11:22:16 -0400
Re: FLEX question	Werner Engelmaier /*	Thu, 14 May 2009 21:29:12 -0400
Re: FLEX question	Werner Engelmaier /*	Thu, 14 May 2009 22:12:14 EDT
Re: humidity test failure	Werner Engelmaier /*	Tue, 26 May 2009 22:40:43 -0400
Re: humidity test failure	Werner Engelmaier /*	Wed, 27 May 2009 13:08:34 -0400
Re: humidity test failure	Werner Engelmaier /*	Wed, 27 May 2009 13:59:47 -0400
Re: humidity test failure	Werner Engelmaier /*	Wed, 27 May 2009 19:46:04 -0400
Re: humidity test failure	Werner Engelmaier /*	Wed, 27 May 2009 19:49:38 -0400
Re: humidity test failure	Werner Engelmaier /*	Thu, 28 May 2009 07:47:14 -0400
Re: Looking for opinions on separation/delamination between copper land and dielectric material.	Werner Engelmaier /*	Fri, 29 May 2009 08:43:25 -0400
Re: Looking for opinions on separation/delamination between copper land and dielectric material.	Werner Engelmaier /*	Fri, 29 May 2009 10:56:20 -0400
Re: NTC, no jokes serious q	Werner Engelmaier /*	Thu, 14 May 2009 17:17:29 -0400
Re: Nylon connectors - moisture sensitivity	Werner Engelmaier /*	Wed, 13 May 2009 16:24:50 -0400
Re: PCB baking	Werner Engelmaier /*	Mon, 4 May 2009 09:56:39 -0400
Re: PCB baking	Werner Engelmaier /*	Mon, 4 May 2009 11:03:22 -0400
Re: PCB baking	Werner Engelmaier /*	Mon, 11 May 2009 13:10:38 -0400
Re: PCB baking	Werner Engelmaier /*	Mon, 11 May 2009 13:42:44 -0400
Re: PCB baking	Werner Engelmaier /*	Mon, 11 May 2009 14:40:10 -0400
Re: PCB baking	Werner Engelmaier /*	Mon, 11 May 2009 15:22:37 -0400
Re: PCB baking	Werner Engelmaier /*	Mon, 11 May 2009 17:21:10 -0400
Re: Rohs SMT parts and shelf life	Werner Engelmaier /*	Sat, 9 May 2009 15:07:07 -0400
Re: Rohs SMT parts and shelf life	Werner Engelmaier /*	Sun, 10 May 2009 21:12:41 -0400
Re: Rohs SMT parts and shelf life	Werner Engelmaier /*	Mon, 18 May 2009 07:42:57 -0400
Technetters/LF-People in Spain, Portugal & Southern France	Werner Engelmaier /*	Fri, 29 May 2009 11:43:01 -0400
Re: Underfill Pass/fail criteria	Werner Engelmaier /*	Tue, 19 May 2009 14:17:36 -0400
Re: Underfill Pass/fail criteria	Werner Engelmaier /*	Tue, 19 May 2009 15:00:44 -0400
Re: Underfill Pass/fail criteria	Werner Engelmaier /*	Tue, 19 May 2009 15:02:10 -0400
Re: Underfill Pass/fail criteria	Werner Engelmaier /*	Tue, 19 May 2009 15:07:46 -0400
Re: Underfill Pass/fail criteria	Werner Engelmaier /*	Tue, 19 May 2009 15:28:59 -0400
Re: Underfill Pass/fail criteria	Werner Engelmaier /*	Wed, 20 May 2009 09:08:20 -0400
Re: 0201 capacitor failure after reflow	Whittaker, Dewey (EHCOE)	Fri, 15 May 2009 13:41:27 -0700
Re: 0201 capacitor failure after reflow	Whittaker, Dewey (EHCOE)	Fri, 15 May 2009 14:02:50 -0700
<No subject>	Whittaker, Dewey (EHCOE)	Thu, 14 May 2009 13:24:45 -0700
Re: Bare PCB Packaging Requirements	Whittaker, Dewey (EHCOE)	Thu, 14 May 2009 12:56:32 -0700
Re: Conformal coating process	Whittaker, Dewey (EHCOE)	Fri, 29 May 2009 07:50:17 -0700
Re: Congratulations to Werner	Whittaker, Dewey (EHCOE)	Wed, 20 May 2009 09:57:17 -0700
Re: Fw: End of the week quiz!	Whittaker, Dewey (EHCOE)	Fri, 15 May 2009 14:49:48 -0700
Re: ESD Heel Strap / Shoe Checker - low resistance	Whittaker, Dewey (EHCOE)	Thu, 21 May 2009 06:49:32 -0700
Re: humidity test failure	Whittaker, Dewey (EHCOE)	Thu, 28 May 2009 09:24:45 -0700
Re: Immersion Silver	Whittaker, Dewey (EHCOE)	Tue, 26 May 2009 14:44:16 -0700
Re: Material 96% Alumina	Whittaker, Dewey (EHCOE)	Mon, 11 May 2009 09:49:32 -0700
Re: Material 96% Alumina	Whittaker, Dewey (EHCOE)	Tue, 12 May 2009 07:12:40 -0700
Re: Memorial Day	Whittaker, Dewey (EHCOE)	Tue, 26 May 2009 07:56:52 -0700
Re: Memorial Day	Whittaker, Dewey (EHCOE)	Tue, 26 May 2009 08:09:04 -0700
Re: NTC - Friday Trivia Question	Whittaker, Dewey (EHCOE)	Fri, 15 May 2009 07:11:41 -0700
Re: NTC - Friday Trivia Question	Whittaker, Dewey (EHCOE)	Fri, 15 May 2009 13:53:08 -0700
Re: NTC - Friday Trivia Question	Whittaker, Dewey (EHCOE)	Fri, 15 May 2009 14:51:51 -0700
Re: NTC - RE: [TN] What does HIGH GRADE FR-4 mean?	Whittaker, Dewey (EHCOE)	Wed, 6 May 2009 10:41:06 -0700
Re: NTC [TN] humidity test failure	Whittaker, Dewey (EHCOE)	Thu, 28 May 2009 09:47:59 -0700
Re: Open joints on CompactFlash connector	Whittaker, Dewey (EHCOE)	Thu, 21 May 2009 14:49:06 -0700
Re: Parylene Adhesion Tape Test	Whittaker, Dewey (EHCOE)	Mon, 11 May 2009 07:53:35 -0700
Re: Parylene Adhesion Tape Test	Whittaker, Dewey (EHCOE)	Mon, 11 May 2009 08:43:29 -0700
Re: PB Surface Contamination	Whittaker, Dewey (EHCOE)	Thu, 7 May 2009 07:03:10 -0700
Re: PB Surface Contamination	Whittaker, Dewey (EHCOE)	Thu, 7 May 2009 10:18:38 -0700
Re: PB Surface Contamination	Whittaker, Dewey (EHCOE)	Thu, 7 May 2009 10:38:40 -0700
Re: PB Surface Contamination	Whittaker, Dewey (EHCOE)	Thu, 7 May 2009 10:57:46 -0700
Re: PB Surface Contamination	Whittaker, Dewey (EHCOE)	Thu, 7 May 2009 13:41:05 -0700
Re: PB Surface Contamination	Whittaker, Dewey (EHCOE)	Thu, 7 May 2009 13:42:18 -0700
Re: PB Surface Contamination	Whittaker, Dewey (EHCOE)	Thu, 7 May 2009 13:49:48 -0700
Re: PCB baking	Whittaker, Dewey (EHCOE)	Mon, 11 May 2009 09:32:28 -0700
Re: PCB baking	Whittaker, Dewey (EHCOE)	Mon, 11 May 2009 10:30:35 -0700
Re: PWB fab drawing - how thick is the copper?	Whittaker, Dewey (EHCOE)	Thu, 14 May 2009 06:59:58 -0700
Re: PWB fab drawing - how thick is the copper?	Whittaker, Dewey (EHCOE)	Thu, 14 May 2009 07:49:45 -0700
Re: PWB fab drawing - how thick is the copper?	Whittaker, Dewey (EHCOE)	Thu, 14 May 2009 09:50:37 -0700
Re: Underfill Pass/fail criteria	Whittaker, Dewey (EHCOE)	Tue, 19 May 2009 12:16:00 -0700
Re: WAX	Whittaker, Dewey (EHCOE)	Fri, 29 May 2009 09:31:20 -0700
Re: What does HIGH GRADE FR-4 mean?	Whittaker, Dewey (EHCOE)	Tue, 5 May 2009 11:53:48 -0700
Re: What does HIGH GRADE FR-4 mean?	Whittaker, Dewey (EHCOE)	Wed, 6 May 2009 06:48:58 -0700
Re: What does HIGH GRADE FR-4 mean?	Whittaker, Dewey (EHCOE)	Wed, 6 May 2009 09:44:07 -0700
Re: Panelization Software	Wolfe, Robert	Fri, 29 May 2009 15:33:41 -0400

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