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August 2008

TGAsia@IPC.ORG

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Subject	From	Date
答复: Re: [TGA] Soldering Nickel on PCB	Chris Katzko	Mon, 1 Sep 2008 10:51:10 +0800
Re: Soldering Nickel on PCB	victor	Mon, 1 Sep 2008 09:02:09 +0800
Re: Soldering Nickel on PCB	<>	Sun, 31 Aug 2008 12:28:34 +0800
Soldering Nickel on PCB	victor	Sat, 30 Aug 2008 10:41:11 +0800
焊盤缺損	Shaohua Wu	Fri, 29 Aug 2008 16:22:43 +0800
Re: AQL for PCBA soldering check	charles.lee	Thu, 28 Aug 2008 16:38:12 +0800
Re: AQL for PCBA soldering check	Tim Deng	Thu, 28 Aug 2008 15:28:20 +0800
Re: 答复: Re: [TGA] Solder ball issue	Duan, Shi Hao - Andy BSCE QA PEK	Thu, 28 Aug 2008 15:26:34 +0800
Re: AQL for PCBA soldering check	Duan, Shi Hao - Andy BSCE QA PEK	Thu, 28 Aug 2008 15:13:48 +0800
Re: PCB silksreen issue	JiaXing LIU	Thu, 28 Aug 2008 13:00:08 +0800
AQL for PCBA soldering check	Tim Deng	Thu, 28 Aug 2008 11:49:06 +0800
答复: [TGA] 答复: Re: [TGA] Solder ball issue	Jacob Wang	Thu, 28 Aug 2008 11:21:29 +0800
答复: Re: [TGA] Solder ball issue	Chris Katzko	Thu, 28 Aug 2008 10:30:35 +0800
Re: Solder ball issue	Lu Yao	Thu, 28 Aug 2008 09:22:40 +0800
Re: Solder ball issue	justin	Wed, 27 Aug 2008 18:00:32 +0800
Re: Solder ball issue	NG ENG GUAN	Wed, 27 Aug 2008 17:14:10 +0800
Solder ball issue	Eva Chen	Wed, 27 Aug 2008 16:24:08 +0800
答复: Re: [TGA] PCB silksreen issue	TL Zhang	Wed, 27 Aug 2008 15:00:39 +0800
Re: (瑞星提示-此邮件可能是垃圾邮件)[TGA] PCB V Cut spec/guideline	zhidong.chen	Wed, 27 Aug 2008 14:45:09 +0800
Re: Found the solder on the metal plane	Wei Wang	Wed, 27 Aug 2008 14:26:27 +0800
Re: PCB silksreen issue	Roger Liu	Wed, 27 Aug 2008 14:23:49 +0800
Re: PCB silksreen issue	NG ENG GUAN	Wed, 27 Aug 2008 14:18:58 +0800
Re: Found the solder on the metal plane	justin	Wed, 27 Aug 2008 14:09:13 +0800
Re: Found the solder on the metal plane	James Liu	Tue, 26 Aug 2008 22:59:27 -0700
Re: PCB silksreen issue	Jake Tu	Wed, 27 Aug 2008 13:51:56 +0800
Re: Found the solder on the metal plane	justin	Wed, 27 Aug 2008 13:39:42 +0800
Re: PCB silksreen issue	Arthur Xie	Wed, 27 Aug 2008 13:06:37 +0800
Re: PCB silksreen issue	NG ENG GUAN	Wed, 27 Aug 2008 12:54:10 +0800
Re: PCB silksreen issue	NG ENG GUAN	Wed, 27 Aug 2008 12:53:14 +0800
Re: PCB silksreen issue	Li, Nora	Wed, 27 Aug 2008 12:02:13 +0800
Re: PCB V Cut spec/guideline	jiangang	Wed, 27 Aug 2008 11:30:20 +0800
Re: PCB silksreen issue	Roger Liu	Wed, 27 Aug 2008 11:30:20 +0800
Re: PCB silksreen issue	Cony Su	Wed, 27 Aug 2008 11:24:52 +0800
Re: PCB silksreen issue	Roger Liu	Wed, 27 Aug 2008 11:17:58 +0800
Leaded paste with LF parts	Qualitek	Wed, 27 Aug 2008 09:33:19 +0800
答复: [TGA] PCB V Cut spec/guideline	Chris Katzko	Wed, 27 Aug 2008 09:18:56 +0800
PCB V Cut spec/guideline	William Yeoh	Wed, 27 Aug 2008 08:56:27 +0800
Re: PCB silksreen issue	Jason Zhao	Tue, 26 Aug 2008 07:16:58 -0700
Re: PCB silksreen issue	Cony Su	Tue, 26 Aug 2008 16:00:57 +0800
Re: PCB silksreen issue	Cony Su	Tue, 26 Aug 2008 08:50:39 +0800
关于一年后仪器表计起雾问题,请教各位	zhidong.chen	Tue, 26 Aug 2008 08:41:28 +0800
Re: FW: Particualte Matter sticked on the coating surface and antenna surface	James Liu	Mon, 25 Aug 2008 02:43:38 -0700
Re: PCB silksreen issue	MTD-AD4/AD5 Wei Jian Kang	Mon, 25 Aug 2008 17:19:24 +0800
Re: PCB silksreen issue	Ken Chow	Mon, 25 Aug 2008 16:59:24 +0800
Re: PCB silksreen issue	张俊杰	Mon, 25 Aug 2008 16:51:06 +0800
PCB silksreen issue	Cony Su	Mon, 25 Aug 2008 16:50:32 +0800
FW: Particualte Matter sticked on the coating surface and antenna surface	Zhou, Jun	Mon, 25 Aug 2008 15:26:48 +0800
Re: [SPAM] [TGA] IPC EMS管理委员会中国顾问委员会――邀请函	Susan Yuan	Mon, 25 Aug 2008 10:39:18 +0800
接头接线柱具体指哪一部位?	li.jie	Sat, 23 Aug 2008 17:16:42 +0800
IPC EMS管理委员会中国顾问委员会――邀请函	Sonia Xia	Fri, 22 Aug 2008 00:21:37 -0500
Re: IPC EMS管理委员会中国顾问委员会―― 邀请函	Benjamin Chen	Fri, 22 Aug 2008 13:08:38 +0800
答复: [TGA] IPC EMS管理委员会中国顾问委员会― ―邀请函	Zhao Charlie	Fri, 22 Aug 2008 13:02:51 +0800
IPC EMS管理委员会中国顾问委员会――邀请函	Sonia Xia	Thu, 21 Aug 2008 23:53:18 -0500
Re: 答复: Re: [TGA] 答复: Re: [TG A] PCB Tg 用错	Jake Tu	Wed, 20 Aug 2008 17:10:02 +0800
Re: 答复: Re: [TGA] 答复: Re: [TGA] PCB Tg 用错	yuank0	Wed, 20 Aug 2008 16:29:54 +0800
5-45CN 会议通知	Sonia Xia	Wed, 20 Aug 2008 03:17:13 -0500
Tin-whisker measurement	Brandon,Tang	Wed, 20 Aug 2008 13:55:46 +0800
答复: Re: [TGA] 答复: Re: [TGA] PCB Tg 用错	TL Zhang	Wed, 20 Aug 2008 13:44:11 +0800
Re: 答复: Re: [TGA] PCB Tg 用错	yuan, tom (Shenzhen)	Wed, 20 Aug 2008 01:07:40 -0400
Re: 答复: Re: [TGA] PCB Tg 用错	Wu, Junmei	Wed, 20 Aug 2008 12:59:25 +0800
Re: 答复: Re: [TGA] PCB Tg 用错	yuank0	Wed, 20 Aug 2008 12:45:54 +0800
Re: special note	Jinmei Ding	Wed, 20 Aug 2008 12:04:15 +0800
special note	Leesha Peng	Tue, 19 Aug 2008 22:26:47 -0500
Re: PCB Tg 用错	yuank0	Wed, 20 Aug 2008 11:20:05 +0800
Re: PCB Tg 用错	李建锋	Wed, 20 Aug 2008 10:46:05 +0800
Re: PCB Tg 用错	yuank0	Wed, 20 Aug 2008 09:05:04 +0800
Re: PCB Tg 用错	Jason Zhao	Tue, 19 Aug 2008 07:21:17 -0700
Re: 答复: Re: [TGA] "Crack" on film chip capacitor	Hermus Leung	Tue, 19 Aug 2008 17:31:24 +0800
答复: Re: [TGA] "Crack" on film chip capacitor	Chris Katzko	Tue, 19 Aug 2008 15:47:39 +0800
Re: "Crack" on film chip capacitor	James Liu	Tue, 19 Aug 2008 00:26:08 -0700
PCB Tg 用错	yuank0	Tue, 19 Aug 2008 15:17:14 +0800
Re: "Crack" on film chip capacitor	NG ENG GUAN	Tue, 19 Aug 2008 14:25:27 +0800
Re: "Crack" on film chip capacitor	Scott Li	Tue, 19 Aug 2008 13:56:16 +0800
答复: [TGA] "Crack" on film chip capacitor	Chris Katzko	Tue, 19 Aug 2008 13:06:28 +0800
Re: "Crack" on film chip capacitor	James Liu	Mon, 18 Aug 2008 20:44:04 -0700
"Crack" on film chip capacitor	Scott Li	Tue, 19 Aug 2008 11:01:18 +0800
Re: 钢网的制作	hantengyang	Sun, 17 Aug 2008 15:23:18 +0800
Re: Quick Introduction	<>	Sat, 16 Aug 2008 12:49:56 +0800
Quick Introduction	Ryan Smith	Fri, 15 Aug 2008 10:38:21 -0600
Re: Solder ability test	asoe lu	Thu, 14 Aug 2008 21:03:42 -0700
Re: feedback	agale_2008	Thu, 14 Aug 2008 11:17:51 +0800
答复: [TGA] 截面观察	周利文	Wed, 13 Aug 2008 18:47:02 +0800
钢网的制作	sungaixian_007	Wed, 13 Aug 2008 18:12:02 +0800
Re: 截面观察	FP Deng	Wed, 13 Aug 2008 17:15:12 +0800
答复: [TGA] 截面观察	周利文	Wed, 13 Aug 2008 16:43:15 +0800
答复: [TGA] 答复: [TGA] 截面观察	Jia Zhongzhong	Wed, 13 Aug 2008 16:42:55 +0800
答复: [TGA] 截面观察	Jia Zhongzhong	Wed, 13 Aug 2008 16:36:10 +0800
截面观察	周利文	Wed, 13 Aug 2008 16:35:18 +0800
Re: feedback	Alice Wong	Tue, 12 Aug 2008 09:01:31 +0800
about the TGAsia	xie,mindy	Mon, 11 Aug 2008 16:15:12 +0800
feedback	zhanghui	Mon, 11 Aug 2008 13:58:41 +0800
Re: ESD 测试仪	James Liu	Sun, 10 Aug 2008 17:05:15 -0700
Re: 组装中螺丝的RPM	andy.xu	Sat, 9 Aug 2008 14:36:32 +0800
ESD 测试仪	Sun Jian	Fri, 8 Aug 2008 15:52:28 +0800
Fluxer evaluation	Jake Tu	Fri, 8 Aug 2008 15:51:37 +0800
组装中螺丝的RPM	HouToby	Fri, 8 Aug 2008 12:45:20 +0800
Re: Solder ability test	William Yeoh	Thu, 7 Aug 2008 15:53:55 +0800
Re: IC Failure at FCT Station	James Liu	Wed, 6 Aug 2008 22:12:20 -0700
Re: IC Failure at FCT Station	Wu, Junmei	Thu, 7 Aug 2008 12:45:29 +0800
Re: IC Failure at FCT Station	NG ENG GUAN	Thu, 7 Aug 2008 12:23:36 +0800
Re: IC Failure at FCT Station	justin	Thu, 7 Aug 2008 12:06:58 +0800
Re: Dip Soldering	James Liu	Tue, 5 Aug 2008 17:13:41 -0700
Re: Dip Soldering	justin	Tue, 5 Aug 2008 17:24:43 +0800
Re: 请教8D中的4W1H问题	Danny Qian	Tue, 5 Aug 2008 11:43:21 +0800
What's the qualification criteria of CPK tester	Jiyang Zhang	Tue, 5 Aug 2008 08:51:52 +0800
答复: [TGA] 回复: Re: [TGA] 63/37与60/40铅焊料的差异	Apria yuan(袁赛花)	Mon, 4 Aug 2008 19:30:48 +0800
Re: 回复: Re: [TGA] 63/37与60/40铅焊料的差异	Zero He	Mon, 4 Aug 2008 18:40:18 +0800
Re: 答复: [TGA] 回复: R e: [TGA] 63/37 与60/40铅焊料的差异	guojj	Mon, 4 Aug 2008 18:30:58 +0800
Re: 回复: Re: [TGA] 63/37与60/40铅焊料的差异	Jake Tu	Mon, 4 Aug 2008 17:07:18 +0800
Re: 回复: Re: [TGA] 63/37与60/40铅焊料的差异	Charnchai	Mon, 4 Aug 2008 16:02:09 +0700
Re: 答复: [TGA] 回复: Re: [TGA] 63/37 与60/40铅焊料的差异	NG ENG GUAN	Mon, 4 Aug 2008 16:59:26 +0800
Re: 回复: Re: [TGA] 63/37与60/40铅焊料的差异	NG ENG GUAN	Mon, 4 Aug 2008 16:56:01 +0800
Re: 回复: Re: [TGA] 63/37与60/40铅焊料的差异	NG ENG GUAN	Mon, 4 Aug 2008 16:53:09 +0800
答复: [TGA] 回复: Re: [TGA] 63/37与60/40铅焊料的差异	Brandon,Tang	Mon, 4 Aug 2008 16:46:43 +0800
Re: 回复: Re: [TGA] 63/37与60/40铅焊料的差异	Peter Zhou	Mon, 4 Aug 2008 16:41:05 +0800
回复: Re: [TGA] 63/37与60/40铅焊料的差异	li.jie	Mon, 4 Aug 2008 16:31:48 +0800
Re: 63/37与60/40铅焊料的差异	mark.yang	Mon, 4 Aug 2008 16:22:57 +0800
SIR的测试	wasionhw	Mon, 4 Aug 2008 16:18:08 +0800
SMD产品在280度30秒的烘烤中存在发黄的现象	Ziyi Li	Mon, 4 Aug 2008 16:01:31 +0800
Re: 63/37与60/40铅焊料的差异	Yong Qin Tang	Mon, 4 Aug 2008 15:48:38 +0800
Re: 63/37与60/40铅焊料的差异	Yong Qin Tang	Mon, 4 Aug 2008 15:46:58 +0800
Re: 63/37与60/40铅焊料的差异	James Liu	Mon, 4 Aug 2008 00:45:10 -0700
63/37与60/40铅焊料的差异	wasionhw	Mon, 4 Aug 2008 13:47:00 +0800
Re: 请教：元器件引脚切脚长度	wasionhw	Mon, 4 Aug 2008 08:44:57 +0800
Re: (瑞星提示-此邮件可能是垃圾邮件)[可疑邮件] [TGA]请教：元器件引脚切脚长度	zhidong.chen	Mon, 4 Aug 2008 08:40:09 +0800
Re: 请教：元器件引脚切脚长度	James Liu	Sun, 3 Aug 2008 17:11:15 -0700
IPC-7912	松山湖微电子	Sat, 2 Aug 2008 11:02:10 +0800
Re: ESD Test Methods	justin	Fri, 1 Aug 2008 19:59:42 +0800
Re: 回流焊接设备特性评估技术小组获得组号确认	Steven	Fri, 1 Aug 2008 19:59:40 +0800
Re: test	Franco	Fri, 1 Aug 2008 18:20:09 +0800
SMT Part Package Spec	Yuppie Wang	Fri, 1 Aug 2008 18:01:39 +0800
请教：元器件引脚切脚长度	谢宏涛	Fri, 1 Aug 2008 16:47:36 +0800
TGAsia	松山湖微电子	Fri, 1 Aug 2008 15:43:25 +0800

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