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June 2008


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Table of Contents:

Aegis/Valor (1 message)
Aerospace Industry Association Offers REACH Training Workshops (1 message)
Alan Kreplick is out of the office. (1 message)
Ambient conditions for conformal coating (2 messages)
An unfortunate sign of things to come... (1 message)
Annular Rings on Via holes (5 messages)
Another overlooked source of FOD (1 message)
Antw: [TN] Ceramic LGAs (1 message)
Artwork film replacement frequency (3 messages)
Bacon Software (4 messages)
Battery contact manufacturer (2 messages)
Bias voltage test in damp heat (9 messages)
Bow PCAs (5 messages)
BP,BF,BS (1 message)
Cam software Help (ie Aegis, Valor, etc...) (2 messages)
Ceramic Cap Value (6 messages)
Ceramic LGAs (2 messages)
Changing conformal coating from silicone to urethane... (6 messages)
Chicago test resource (7 messages)
Chip on Board and Solder Mask (6 messages)
Class 3 Requirements (1 message)
controlled impedance (3 messages)
Cost Implications of Non-standard Laminate Thickness (4 messages)
Cost of Reflow (1 message)
delamination/blistering (1 message)
Don't wait, and register today for upcoming IPC Workshops (1 message)
Double side reflow query (5 messages)
double sided reflow query (1 message)
Dr. Howard Johnson newsletter (2 messages)
Edge clearance for a BGA (1 message)
edge delamination flexible circuits assemblies (8 messages)
Electroplating equipment (2 messages)
Error-proofing ZIF Connections (3 messages)
Extra cost of Copper Via Filling (6 messages)
Fiducial solder resist clearance (6 messages)
Finish plating in vias (2 messages)
Flame retardants ignite controversy - Posted without comment (12 messages)
Fw: double sided reflow query (1 message)
FW: [DC] Cadence / Mentor News? (1 message)
FW: [tinwhiskers] IPC expresses concerns on possible ROHS revisions (1 message)
Glue Mask Requirements (6 messages)
Hoping all is well with our TechNet friends in Cedar Rapids, Iowa (3 messages)
Hurry and Register today for upcoming July Fabrication Workshops - Hosted by OMG Electronic Chemicals, Inc. (1 message)
Hurry Last chance to register for upcoming DFM workshop and Certification Workshops - Manchester, N.H. (1 message)
Hurry Register today for IPC's Back to the Basics Summer School Webcast Series! (1 message)
Intermitent contact on LEDs (5 messages)
Intermittent contact on LEDs (1 message)
IPC 9701- table 4.4- failure definition (7 messages)
IPC MIDWEST - ONLINE REGISTRATION IS NOW OPEN! (1 message)
IPC Summer School Webcast Series: Back to the Basics (1 message)
IPC-6012A - allowable conductor width reduction interpretation? (3 messages)
Is there a good discrete wire support still made (6 messages)
Last Chance to Register for IPC Upcoming Design Conference (1 message)
Last Chance to Register for IPC's upcoming Design Conference June 23-25, 2008 (1 message)
Last chance to register for upcoming DFM workshop and Certification Workshops - Manchester, N.H. (1 message)
Last Chance: Register for IPC's Technical Seminars at National Electronics Week, 17-19 June 2008, London (1 message)
Leakage on Tantalum Capacitor (2 messages)
Looking for data tying rework (solder iron touch-up) with component or PCB failure (1 message)
Mehmet Emin Yaman işyeri dışında. (1 message)
Moisture sensitive componentes & manufacturing documentation (3 messages)
NTC - Tin Whiskers - how long? Size matters! (2 messages)
NTC - was SAC solder on Pb90Sn10 (1 message)
NTC - [TN] SAC solder on Pb90Sn10 (3 messages)
ntc Edradour (1 message)
NTC EU discord over EU rule (3 messages)
NTC Friday (1 message)
NTC Power amplifier growth (2 messages)
NTC RE: [TN] Flame retardants ignite controversy - Posted without comment (2 messages)
NTC Re: [TN] respirator cartridge for IPA (1 message)
NTC RE: [TN] Stainless Steel Contamination Question - Source Nailed! (2 messages)
NTC [TN] Flame retardants ignite controversy - Posted without comment (1 message)
NTC: Coefficients of thermal expansion (8 messages)
NTC: The weekend is finally here! (1 message)
packaging spec needed (1 message)
Paste 'spattering' issue. (6 messages)
PCB Laminate cost question (1 message)
Power amplifier growth (29 messages)
press fit connectors (8 messages)
Printing on Xerox 2-- (1 message)
QFN "Bumped" Pad Construction (2 messages)
REACH (8 messages)
Reflow specifications for PCB (7 messages)
Register today for IPC's 5 Week Summer School Webcast Series: Back to the Basics (1 message)
Register today for IPC's Back to the Basics Summer School Webcast Series! (1 message)
Register today for upcoming July Fabrication Workshops - Hosted by OMG Electronic Chemicals, Inc. (2 messages)
Reliability of PCB including removable auxiliaty area with test points (1 message)
Removing soldermask under SMT devices (7 messages)
Requirements for edge connector finish (2 messages)
respirator cartridge for IPA (16 messages)
SAC Plated Passives with SnPb Solder Paste (8 messages)
SAC solder on Pb90Sn10 (10 messages)
Singulation of Aluminum PCBs (6 messages)
SN100 for Reflow Application (7 messages)
Solder Mask Thickness (2 messages)
Solder-NiAu interface failure (2 messages)
Solithane coating dewetting (8 messages)
Space Station Malfunction (7 messages)
Space Station Malfunction NTC (3 messages)
Stainless Steel Contamination Question - Source Nailed! (8 messages)
Stainless Steel Contamination Question - Source Revealed (22 messages)
Tell the EU Commission How Much RoHS Changes Could Save You (1 message)
Temperature of lead-free for hand soldering (3 messages)
Terminology question (1 message)
Terry Chicka is out of the office from 18:00 hrs today (1 message)
Test house for J-STD-020 testing (1 message)
Tin Whiskers - how long? Size matters! (8 messages)
Tiny Bubbles (14 messages)
Vienna, Austria (1 message)
Visible Magnetic Fields (20 messages)
Visible Magnetic Fields [Scanned] (1 message)
Wave Solder Nozzle Parallelism Tool (1 message)
Way to discriminate 'date code' on PCB after assembly (1 message)
[LF] [TN] SN100 for Reflow Application (25 messages)
[NTC] An unfortunate sign of things to come... (6 messages)
[ntc] Space Station Malfunction (3 messages)

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Subject Sorted by Subject, Chronologically

From

Date

Size

New Thread

Aegis/Valor

Aegis/Valor

Gary Robinson

Fri, 20 Jun 2008 08:34:58 -0500

64 lines

New Thread

Aerospace Industry Association Offers REACH Training Workshops

Aerospace Industry Association Offers REACH Training Workshops

Sahar Osman-Sypher

Wed, 4 Jun 2008 09:57:58 -0500

59 lines

New Thread

Alan Kreplick is out of the office.

Alan Kreplick is out of the office.

Alan Kreplick

Mon, 16 Jun 2008 08:01:41 -0400

24 lines

New Thread

Ambient conditions for conformal coating

Re: Ambient conditions for conformal coating

Graham Naisbitt

Mon, 9 Jun 2008 16:38:49 +0100

70 lines

Ambient conditions for conformal coating

Ioan Tempea

Mon, 9 Jun 2008 10:53:38 -0400

40 lines

New Thread

An unfortunate sign of things to come...

Re: An unfortunate sign of things to come...

Stadem, Richard D.

Mon, 2 Jun 2008 07:32:12 -0500

207 lines

New Thread

Annular Rings on Via holes

Re: Annular Rings on Via holes

Lee parker

Thu, 12 Jun 2008 11:39:53 -0400

200 lines

Re: Annular Rings on Via holes

Paul Reid

Wed, 11 Jun 2008 14:42:57 -0400

175 lines

Re: Annular Rings on Via holes

Paul Edwards

Wed, 11 Jun 2008 10:09:08 -0700

137 lines

Re: Annular Rings on Via holes

Dwight Mattix

Wed, 11 Jun 2008 09:30:42 -0700

67 lines

Annular Rings on Via holes

Paul Baine

Wed, 11 Jun 2008 10:06:08 -0400

35 lines

New Thread

Another overlooked source of FOD

Another overlooked source of FOD

Stadem, Richard D.

Tue, 17 Jun 2008 14:14:50 -0500

30 lines

New Thread

Antw: [TN] Ceramic LGAs

Antw: [TN] Ceramic LGAs

Guenter Grossmann

Mon, 30 Jun 2008 09:57:42 +0200

107 lines

New Thread

Artwork film replacement frequency

Re: Artwork film replacement frequency

Joe Hughes

Mon, 23 Jun 2008 10:16:55 -0700

63 lines

Re: Artwork film replacement frequency

Scott Westheimer

Mon, 23 Jun 2008 13:11:46 -0400

47 lines

Artwork film replacement frequency

Ryan Grant

Mon, 23 Jun 2008 10:57:54 -0600

30 lines

New Thread

Bacon Software

Re: Bacon Software

Ralph Richart

Tue, 3 Jun 2008 07:29:42 -0700

66 lines

Re: Bacon Software

roland jaquet

Tue, 3 Jun 2008 16:01:33 +0200

74 lines

Re: Bacon Software

Franklin D Asbell

Tue, 3 Jun 2008 08:28:26 -0500

69 lines

Bacon Software

Dan Skweres

Tue, 3 Jun 2008 09:14:39 -0400

27 lines

New Thread

Battery contact manufacturer

Re: Battery contact manufacturer

Roberts, Jon

Mon, 30 Jun 2008 09:46:21 -0500

80 lines

Battery contact manufacturer

Grant Emandien

Mon, 30 Jun 2008 16:32:39 +0200

38 lines

New Thread

Bias voltage test in damp heat

Re: Bias voltage test in damp heat

legg

Sat, 28 Jun 2008 10:59:04 -0500

56 lines

Re: Bias voltage test in damp heat

Steve Kelly

Thu, 26 Jun 2008 09:56:02 -0400

262 lines

Re: Bias voltage test in damp heat

Inge

Wed, 25 Jun 2008 12:30:47 -0700

251 lines

Re: Bias voltage test in damp heat

Steve Kelly

Wed, 25 Jun 2008 15:21:24 -0400

224 lines

Re: Bias voltage test in damp heat

Inge

Wed, 25 Jun 2008 11:37:06 -0700

194 lines

Re: Bias voltage test in damp heat

Eric CHRISTISON

Wed, 25 Jun 2008 17:50:08 +0100

162 lines

Re: Bias voltage test in damp heat

Douglas O. Pauls

Wed, 25 Jun 2008 11:37:07 -0500

126 lines

Re: Bias voltage test in damp heat

Brian Ellis

Wed, 25 Jun 2008 18:32:23 +0300

80 lines

Bias voltage test in damp heat

Steve Kelly

Wed, 25 Jun 2008 11:09:36 -0400

57 lines

New Thread

Bow PCAs

Re: Bow PCAs

Tan Geok Ang

Tue, 1 Jul 2008 08:24:00 +0800

192 lines

Re: Bow PCAs

Ryan Grant

Mon, 30 Jun 2008 15:07:36 -0600

182 lines

Re: Bow PCAs

Ted Kong

Mon, 30 Jun 2008 13:59:25 -0700

151 lines

Re: Bow PCAs

Ryan Grant

Mon, 30 Jun 2008 13:35:53 -0600

87 lines

Bow PCAs

Ted Kong

Mon, 30 Jun 2008 12:24:22 -0700

32 lines

New Thread

BP,BF,BS

BP,BF,BS

Whittaker, Dewey (EHCOE)

Fri, 20 Jun 2008 07:27:37 -0700

347 lines

New Thread

Cam software Help (ie Aegis, Valor, etc...)

Re: Cam software Help (ie Aegis, Valor, etc...)

Tan Geok Ang

Wed, 4 Jun 2008 17:02:10 +0800

86 lines

Cam software Help (ie Aegis, Valor, etc...)

Gary Robinson

Tue, 3 Jun 2008 09:03:46 -0500

59 lines

New Thread

Ceramic Cap Value

Re: Ceramic Cap Value

Guy Ramsey

Mon, 30 Jun 2008 11:09:46 -0400

123 lines

Re: Ceramic Cap Value

Bruce Tostevin

Mon, 30 Jun 2008 09:37:29 -0400

111 lines

Re: Ceramic Cap Value

Inge

Sun, 29 Jun 2008 11:14:50 -0700

124 lines

Re: Ceramic Cap Value

Blair Hogg

Sun, 29 Jun 2008 08:36:34 -0500

107 lines

Re: Ceramic Cap Value

John Maxwell

Fri, 27 Jun 2008 14:53:38 -0700

84 lines

Ceramic Cap Value

Ken Bloomquist

Fri, 27 Jun 2008 14:13:32 -0700

56 lines

New Thread

Ceramic LGAs

Re: Ceramic LGAs

Stadem, Richard D.

Mon, 30 Jun 2008 07:30:29 -0500

83 lines

Ceramic LGAs

David Tremmel

Fri, 27 Jun 2008 14:42:14 -0500

61 lines

New Thread

Changing conformal coating from silicone to urethane...

Re: Changing conformal coating from silicone to urethane...

Graham Naisbitt

Mon, 9 Jun 2008 16:34:40 +0100

160 lines

Re: Changing conformal coating from silicone to urethane...

Douglas O. Pauls

Mon, 9 Jun 2008 07:53:59 -0500

109 lines

Re: Changing conformal coating from silicone to urethane...

Graham Naisbitt

Fri, 6 Jun 2008 17:06:14 +0100

68 lines

Re: Changing conformal coating from silicone to urethane...

Whittaker, Dewey (EHCOE)

Fri, 6 Jun 2008 08:36:50 -0700

55 lines

Re: Changing conformal coating from silicone to urethane...

Phil Nutting

Fri, 6 Jun 2008 11:29:36 -0400

65 lines

Changing conformal coating from silicone to urethane...

Mike Johnson

Fri, 6 Jun 2008 09:04:14 -0600

24 lines

New Thread

Chicago test resource

Re: Chicago test resource

Croslin, Robert

Wed, 25 Jun 2008 13:26:22 -0400

106 lines

Re: Chicago test resource

Jack Olson

Wed, 25 Jun 2008 11:16:32 -0500

79 lines

Re: Chicago test resource

Croslin, Robert

Tue, 24 Jun 2008 14:44:09 -0400

172 lines

Re: Chicago test resource

paulh

Tue, 24 Jun 2008 13:42:14 -0500

146 lines

Re: Chicago test resource

Croslin, Robert

Tue, 24 Jun 2008 11:56:34 -0400

105 lines

Re: Chicago test resource

Lee parker

Tue, 24 Jun 2008 11:08:18 -0400

72 lines

Chicago test resource

Croslin, Robert

Tue, 24 Jun 2008 08:51:28 -0400

36 lines

New Thread

Chip on Board and Solder Mask

Re: Chip on Board and Solder Mask

Werner Engelmaier /*

Thu, 5 Jun 2008 17:22:20 EDT

52 lines

Re: Chip on Board and Solder Mask

Gumpert, Ben

Thu, 5 Jun 2008 16:27:09 -0400

84 lines

Re: Chip on Board and Solder Mask

Werner Engelmaier /*

Thu, 5 Jun 2008 15:36:11 EDT

51 lines

Re: Chip on Board and Solder Mask

Gumpert, Ben

Thu, 5 Jun 2008 15:19:17 -0400

79 lines

Re: Chip on Board and Solder Mask

Werner Engelmaier /*

Thu, 5 Jun 2008 09:17:27 EDT

50 lines

Chip on Board and Solder Mask

Gumpert, Ben

Thu, 5 Jun 2008 08:40:56 -0400

32 lines

New Thread

Class 3 Requirements

Class 3 Requirements

Halas, Mirka

Tue, 10 Jun 2008 08:48:49 -0400

37 lines

New Thread

controlled impedance

Re: controlled impedance

Craig Sullivan

Mon, 30 Jun 2008 08:07:51 -0400

75 lines

Re: controlled impedance

Lee parker

Fri, 27 Jun 2008 09:14:31 -0400

73 lines

controlled impedance

Louis Hart

Thu, 26 Jun 2008 19:22:18 -0400

35 lines

New Thread

Cost Implications of Non-standard Laminate Thickness

Re: Cost Implications of Non-standard Laminate Thickness

Whittaker, Dewey (EHCOE)

Fri, 27 Jun 2008 10:26:12 -0700

163 lines

Re: Cost Implications of Non-standard Laminate Thickness

Phil Nutting

Fri, 27 Jun 2008 13:19:44 -0400

127 lines

Re: Cost Implications of Non-standard Laminate Thickness

Dan Skweres

Fri, 27 Jun 2008 13:06:51 -0400

81 lines

Cost Implications of Non-standard Laminate Thickness

Gary Camac

Fri, 27 Jun 2008 10:40:55 -0500

45 lines

New Thread

Cost of Reflow

Cost of Reflow

Paul Reid

Tue, 17 Jun 2008 15:58:32 -0400

51 lines

New Thread

delamination/blistering

delamination/blistering

David Reed

Wed, 25 Jun 2008 03:34:51 -0700

44 lines

New Thread

Don't wait, and register today for upcoming IPC Workshops

Don't wait, and register today for upcoming IPC Workshops

Tina Nerad

Thu, 5 Jun 2008 10:59:52 -0500

46 lines

New Thread

Double side reflow query

Re: Double side reflow query

Gumpert, Ben

Fri, 6 Jun 2008 15:41:09 -0400

136 lines

Re: Double side reflow query

Joe Macko

Fri, 6 Jun 2008 07:03:52 -0700

114 lines

Re: Double side reflow query

Steve Gregory

Fri, 6 Jun 2008 07:52:22 -0500

74 lines

Re: Double side reflow query

Gumpert, Ben

Fri, 6 Jun 2008 08:28:54 -0400

80 lines

Double side reflow query

prashant chopra

Fri, 6 Jun 2008 17:22:17 +0530

42 lines

New Thread

double sided reflow query

double sided reflow query

prashant chopra

Fri, 6 Jun 2008 17:13:18 +0530

42 lines

New Thread

Dr. Howard Johnson newsletter

Re: Dr. Howard Johnson newsletter

Hernefjord Ingemar

Mon, 23 Jun 2008 10:46:08 +0200

98 lines

Dr. Howard Johnson newsletter

Wilson, Bob

Thu, 19 Jun 2008 12:11:08 -0700

36 lines

New Thread

Edge clearance for a BGA

Re: Edge clearance for a BGA

Joe Macko

Mon, 2 Jun 2008 08:51:59 -0700

93 lines

New Thread

edge delamination flexible circuits assemblies

Re: edge delamination flexible circuits assemblies

Gabriela

Tue, 24 Jun 2008 21:27:06 +0300

100 lines

Re: edge delamination flexible circuits assemblies

Lee parker

Tue, 24 Jun 2008 11:02:21 -0400

73 lines

Re: edge delamination flexible circuits assemblies

James Mahoney

Tue, 24 Jun 2008 09:15:30 -0400

178 lines

Re: edge delamination flexible circuits assemblies

Stadem, Richard D.

Mon, 23 Jun 2008 14:20:37 -0500

131 lines

Re: edge delamination flexible circuits assemblies

Steve Kelly

Mon, 23 Jun 2008 14:16:21 -0400

101 lines

Re: edge delamination flexible circuits assemblies

James Mahoney

Mon, 23 Jun 2008 13:06:14 -0400

78 lines

Re: edge delamination flexible circuits assemblies

Joyce Koo

Mon, 23 Jun 2008 12:47:31 -0400

66 lines

edge delamination flexible circuits assemblies

Gabriela

Mon, 23 Jun 2008 20:10:37 +0300

32 lines

New Thread

Electroplating equipment

Re: Electroplating equipment

Scott Westheimer

Thu, 12 Jun 2008 12:01:35 -0400

53 lines

Electroplating equipment

Syed Ahmad

Thu, 12 Jun 2008 10:56:13 -0500

39 lines

New Thread

Error-proofing ZIF Connections

Re: Error-proofing ZIF Connections

James Mahoney

Thu, 12 Jun 2008 12:43:17 -0400

74 lines

Re: Error-proofing ZIF Connections

Kathy Kuhlow

Thu, 12 Jun 2008 11:46:00 -0500

51 lines

Error-proofing ZIF Connections

Brian Chandler

Thu, 12 Jun 2008 11:19:54 -0500

28 lines

New Thread

Extra cost of Copper Via Filling

Re: Extra cost of Copper Via Filling

Lee parker

Tue, 24 Jun 2008 11:05:25 -0400

56 lines

Re: Extra cost of Copper Via Filling

Paul Reid

Tue, 24 Jun 2008 08:29:48 -0400

169 lines

Re: Extra cost of Copper Via Filling

Thayer, Wayne

Tue, 24 Jun 2008 08:18:43 -0400

47 lines

Re: Extra cost of Copper Via Filling

Dwight Mattix

Mon, 23 Jun 2008 23:04:07 -0700

133 lines

Re: Extra cost of Copper Via Filling

Joe Lara (Select Circuits)

Tue, 24 Jun 2008 01:30:06 -0400

82 lines

Extra cost of Copper Via Filling

Kirshenbaum Mordechai

Mon, 23 Jun 2008 23:53:49 -0500

23 lines

New Thread

Fiducial solder resist clearance

Re: Fiducial solder resist clearance

Ted Tontis

Thu, 5 Jun 2008 11:09:20 -0500

102 lines

Re: Fiducial solder resist clearance

Ahne Oosterhof

Thu, 5 Jun 2008 07:46:10 -0700

72 lines

Re: Fiducial solder resist clearance

Graham Collins

Wed, 4 Jun 2008 10:05:54 -0300

125 lines

Re: Fiducial solder resist clearance

Lenny Carter

Wed, 4 Jun 2008 08:59:47 -0400

108 lines

Re: Fiducial solder resist clearance

Graham Collins

Wed, 4 Jun 2008 07:35:25 -0300

84 lines

Fiducial solder resist clearance

Douglas McCall

Wed, 4 Jun 2008 11:13:54 +0100

41 lines

New Thread

Finish plating in vias

Re: Finish plating in vias

Robert Lazzara

Mon, 2 Jun 2008 16:23:33 EDT

73 lines

Finish plating in vias

Kevin Glidden

Mon, 2 Jun 2008 16:00:42 -0400

40 lines

New Thread

Flame retardants ignite controversy - Posted without comment

Re: Flame retardants ignite controversy - Posted without comment

Wrobel, Clayton

Mon, 16 Jun 2008 07:39:24 -0400

273 lines

Re: Flame retardants ignite controversy - Posted without comment

David Tremmel

Thu, 12 Jun 2008 08:54:18 -0500

417 lines

Re: Flame retardants ignite controversy - Posted without comment

Mike Fenner

Thu, 12 Jun 2008 14:42:19 +0100

290 lines

Re: Flame retardants ignite controversy - Posted without comment

Stadem, Richard D.

Wed, 11 Jun 2008 15:09:46 -0500

252 lines

Re: Flame retardants ignite controversy - Posted without comment

Joe Fjelstad

Wed, 11 Jun 2008 14:30:15 EDT

241 lines

Re: Flame retardants ignite controversy - Posted without comment

Gary Robinson

Wed, 11 Jun 2008 08:49:43 -0500

286 lines

Re: Flame retardants ignite controversy - Posted without comment

Reuven Rokah

Wed, 11 Jun 2008 16:28:40 +0300

269 lines

Re: Flame retardants ignite controversy - Posted without comment

Phil Nutting

Wed, 11 Jun 2008 09:11:12 -0400

238 lines

Re: Flame retardants ignite controversy - Posted without comment

Brian Ellis

Wed, 11 Jun 2008 10:22:36 +0300

206 lines

Re: Flame retardants ignite controversy - Posted without comment

Joyce Koo

Tue, 10 Jun 2008 20:24:14 -0400

179 lines

Re: Flame retardants ignite controversy - Posted without comment

John Burke

Tue, 10 Jun 2008 12:52:35 -0700

141 lines

Flame retardants ignite controversy - Posted without comment

Joe Fjelstad

Tue, 10 Jun 2008 15:22:03 EDT

95 lines

New Thread

Fw: double sided reflow query

Fw: double sided reflow query

prashant chopra

Fri, 6 Jun 2008 17:14:46 +0530

59 lines

New Thread

FW: [DC] Cadence / Mentor News?

FW: [DC] Cadence / Mentor News?

Barbara Burcham

Thu, 19 Jun 2008 08:20:50 -0500

206 lines

New Thread

FW: [tinwhiskers] IPC expresses concerns on possible ROHS revisions

FW: [tinwhiskers] IPC expresses concerns on possible ROHS revisions

John Burke

Thu, 26 Jun 2008 18:02:17 -0700

132 lines

New Thread

Glue Mask Requirements

Re: Glue Mask Requirements

Ryan Grant

Mon, 23 Jun 2008 14:39:50 -0600

68 lines

Re: Glue Mask Requirements

legg

Wed, 18 Jun 2008 10:42:22 -0500

35 lines

Re: Glue Mask Requirements

Stadem, Richard D.

Mon, 16 Jun 2008 11:46:44 -0500

123 lines

Re: Glue Mask Requirements

Steve Gregory

Mon, 16 Jun 2008 10:05:20 -0500

80 lines

Re: Glue Mask Requirements

Nowland, Russell Howard (Russell)

Mon, 16 Jun 2008 09:57:21 -0500

97 lines

Glue Mask Requirements

Natasha Baker

Mon, 16 Jun 2008 09:25:11 -0400

34 lines

New Thread

Hoping all is well with our TechNet friends in Cedar Rapids, Iowa

Re: Hoping all is well with our TechNet friends in Cedar Rapids, Iowa

Gervascio, Thomas

Fri, 13 Jun 2008 10:52:29 -0400

133 lines

Re: Hoping all is well with our TechNet friends in Cedar Rapids, Iowa

David D. Hillman

Fri, 13 Jun 2008 06:56:59 -0500

93 lines

Hoping all is well with our TechNet friends in Cedar Rapids, Iowa

Joe Fjelstad

Thu, 12 Jun 2008 23:30:02 EDT

32 lines

New Thread

Hurry and Register today for upcoming July Fabrication Workshops - Hosted by OMG Electronic Chemicals, Inc.

Hurry and Register today for upcoming July Fabrication Workshops - Hosted by OMG Electronic Chemicals, Inc.

Michelle Michelotti

Mon, 23 Jun 2008 09:56:13 -0500

156 lines

New Thread

Hurry Last chance to register for upcoming DFM workshop and Certification Workshops - Manchester, N.H.

Hurry Last chance to register for upcoming DFM workshop and Certification Workshops - Manchester, N.H.

Michelle Michelotti

Wed, 25 Jun 2008 13:41:51 -0500

42 lines

New Thread

Hurry Register today for IPC's Back to the Basics Summer School Webcast Series!

Hurry Register today for IPC's Back to the Basics Summer School Webcast Series!

Michelle Michelotti

Mon, 30 Jun 2008 14:24:50 -0500

66 lines

New Thread

Intermitent contact on LEDs

Re: Intermitent contact on LEDs

John Burke

Tue, 3 Jun 2008 13:00:46 -0700

98 lines

Re: Intermitent contact on LEDs

Guy Ramsey

Tue, 3 Jun 2008 09:24:05 -0400

99 lines

Re: Intermitent contact on LEDs

Werner Engelmaier /*

Tue, 3 Jun 2008 08:15:46 EDT

52 lines

Re: Intermitent contact on LEDs

Rex Waygood

Tue, 3 Jun 2008 13:16:20 +0100

118 lines

Intermitent contact on LEDs

Ioan Tempea

Tue, 3 Jun 2008 07:55:20 -0400

59 lines

New Thread

Intermittent contact on LEDs

Re: Intermittent contact on LEDs

Victor Hernandez

Tue, 3 Jun 2008 06:59:54 -0500

88 lines

New Thread

IPC 9701- table 4.4- failure definition

Re: IPC 9701- table 4.4- failure definition

Tan Geok Ang

Sun, 29 Jun 2008 20:02:37 +0800

84 lines

Re: IPC 9701- table 4.4- failure definition

Werner Engelmaier /*

Sat, 28 Jun 2008 18:24:15 EDT

47 lines

Re: IPC 9701- table 4.4- failure definition

Tan Geok Ang

Sat, 28 Jun 2008 07:41:29 +0800

91 lines

Re: IPC 9701- table 4.4- failure definition

Werner Engelmaier /*

Fri, 27 Jun 2008 16:30:10 EDT

44 lines

Re: IPC 9701- table 4.4- failure definition

Tan Geok Ang

Fri, 27 Jun 2008 22:35:50 +0800

90 lines

Re: IPC 9701- table 4.4- failure definition

Werner Engelmaier /*

Fri, 27 Jun 2008 07:56:51 EDT

48 lines

IPC 9701- table 4.4- failure definition

Tan Geok Ang

Fri, 27 Jun 2008 16:22:12 +0800

50 lines

New Thread

IPC MIDWEST - ONLINE REGISTRATION IS NOW OPEN!

IPC MIDWEST - ONLINE REGISTRATION IS NOW OPEN!

Media Relations

Thu, 12 Jun 2008 10:30:48 -0500

72 lines

New Thread

IPC Summer School Webcast Series: Back to the Basics

IPC Summer School Webcast Series: Back to the Basics

Tina Nerad

Thu, 26 Jun 2008 12:22:44 -0500

50 lines

New Thread

IPC-6012A - allowable conductor width reduction interpretation?

Re: IPC-6012A - allowable conductor width reduction interpretation?

Franklin D Asbell

Mon, 30 Jun 2008 17:01:47 -0500

122 lines

Re: IPC-6012A - allowable conductor width reduction interpretation?

Ryan Grant

Mon, 30 Jun 2008 13:43:32 -0600

86 lines

IPC-6012A - allowable conductor width reduction interpretation?

Joe Macko

Mon, 30 Jun 2008 09:45:13 -0700

46 lines

New Thread

Is there a good discrete wire support still made

Re: Is there a good discrete wire support still made

Kathy Kuhlow

Wed, 11 Jun 2008 21:03:05 -0500

143 lines

Re: Is there a good discrete wire support still made

Tan Geok Ang

Thu, 12 Jun 2008 08:46:49 +0800

122 lines

Re: Is there a good discrete wire support still made

Stadem, Richard D.

Tue, 10 Jun 2008 10:32:53 -0500

91 lines

Re: Is there a good discrete wire support still made

Ken Bloomquist

Tue, 10 Jun 2008 08:20:30 -0700

82 lines

Re: Is there a good discrete wire support still made

Roger Stoops

Tue, 10 Jun 2008 10:48:13 -0400

82 lines

Is there a good discrete wire support still made

Temkin, Gregg

Tue, 10 Jun 2008 07:33:12 -0700

55 lines

New Thread

Last Chance to Register for IPC Upcoming Design Conference

Last Chance to Register for IPC Upcoming Design Conference

Michelle Michelotti

Mon, 16 Jun 2008 09:11:56 -0500

91 lines

New Thread

Last Chance to Register for IPC's upcoming Design Conference June 23-25, 2008

Last Chance to Register for IPC's upcoming Design Conference June 23-25, 2008

Michelle Michelotti

Wed, 4 Jun 2008 09:48:49 -0500

60 lines

New Thread

Last chance to register for upcoming DFM workshop and Certification Workshops - Manchester, N.H.

Last chance to register for upcoming DFM workshop and Certification Workshops - Manchester, N.H.

Michelle Michelotti

Wed, 18 Jun 2008 14:11:59 -0500

40 lines

New Thread

Last Chance: Register for IPC's Technical Seminars at National Electronics Week, 17-19 June 2008, London

Last Chance: Register for IPC's Technical Seminars at National Electronics Week, 17-19 June 2008, London

Michelle Michelotti

Wed, 4 Jun 2008 13:24:20 -0500

73 lines

New Thread

Leakage on Tantalum Capacitor

Re: Leakage on Tantalum Capacitor

Inge

Wed, 25 Jun 2008 11:29:51 -0700

63 lines

Re: Leakage on Tantalum Capacitor

Kong Hui Poh

Wed, 25 Jun 2008 21:16:55 +0800

35 lines

New Thread

Looking for data tying rework (solder iron touch-up) with component or PCB failure

Looking for data tying rework (solder iron touch-up) with component or PCB failure

Alyn, Scott

Mon, 9 Jun 2008 11:56:53 -0700

34 lines

New Thread

Mehmet Emin Yaman işyeri dışında.

Mehmet Emin Yaman işyeri dışında.

Mehmet Emin Yaman

Mon, 23 Jun 2008 10:02:00 +0300

43 lines

New Thread

Moisture sensitive componentes & manufacturing documentation

Re: Moisture sensitive componentes & manufacturing documentation

Gary Robinson

Mon, 9 Jun 2008 08:30:48 -0500

131 lines

Re: Moisture sensitive componentes & manufacturing documentation

Juan T. Marug=?WINDOWS-1252?Q?=E1n?=

Mon, 9 Jun 2008 07:39:08 -0500

34 lines

Re: Moisture sensitive componentes & manufacturing documentation

- bogert

Sun, 8 Jun 2008 15:06:14 -0400

70 lines

New Thread

NTC - Tin Whiskers - how long? Size matters!

Re: NTC - Tin Whiskers - how long? Size matters!

Joyce Koo

Fri, 13 Jun 2008 12:55:06 -0400

165 lines

Re: NTC - Tin Whiskers - how long? Size matters!

Graham Collins

Fri, 13 Jun 2008 13:51:55 -0300

129 lines

New Thread

NTC - was SAC solder on Pb90Sn10

Re: NTC - was SAC solder on Pb90Sn10

Graham Collins

Thu, 26 Jun 2008 11:38:42 -0300

204 lines

New Thread

NTC - [TN] SAC solder on Pb90Sn10

Re: NTC - [TN] SAC solder on Pb90Sn10

Whittaker, Dewey (EHCOE)

Thu, 26 Jun 2008 06:57:26 -0700

253 lines

Re: NTC - [TN] SAC solder on Pb90Sn10

Douglas O. Pauls

Thu, 26 Jun 2008 07:34:49 -0500

210 lines

Re: NTC - [TN] SAC solder on Pb90Sn10

David D. Hillman

Thu, 26 Jun 2008 07:27:59 -0500

162 lines

New Thread

ntc Edradour

Re: ntc Edradour

Stadem, Richard D.

Mon, 2 Jun 2008 09:58:56 -0500

83 lines

New Thread

NTC EU discord over EU rule

Re: NTC EU discord over EU rule

Kong Hui Poh

Tue, 17 Jun 2008 22:45:54 +0800

102 lines

Re: NTC EU discord over EU rule

R Sedlak

Fri, 13 Jun 2008 11:42:29 -0700

78 lines

NTC EU discord over EU rule

John Burke

Fri, 13 Jun 2008 10:34:04 -0700

47 lines

New Thread

NTC Friday

Re: NTC Friday

Ken Bloomquist

Fri, 27 Jun 2008 13:02:53 -0700

92 lines

New Thread

NTC Power amplifier growth

Re: NTC Power amplifier growth

Mike Sewell

Tue, 24 Jun 2008 07:55:54 -0500

194 lines

Re: NTC Power amplifier growth

Rex Waygood

Tue, 24 Jun 2008 13:35:04 +0100

166 lines

New Thread

NTC RE: [TN] Flame retardants ignite controversy - Posted without comment

Re: NTC RE: [TN] Flame retardants ignite controversy - Posted without comment

John Burke

Wed, 11 Jun 2008 11:16:27 -0700

131 lines

NTC RE: [TN] Flame retardants ignite controversy - Posted without comment

Phil Nutting

Wed, 11 Jun 2008 10:41:34 -0400

100 lines

New Thread

NTC Re: [TN] respirator cartridge for IPA

NTC Re: [TN] respirator cartridge for IPA

Joe Fjelstad

Wed, 18 Jun 2008 18:45:21 EDT

48 lines

New Thread

NTC RE: [TN] Stainless Steel Contamination Question - Source Nailed!

Re: NTC RE: [TN] Stainless Steel Contamination Question - Source Nailed!

Dwight Mattix

Thu, 5 Jun 2008 07:50:15 -0700

102 lines

NTC RE: [TN] Stainless Steel Contamination Question - Source Nailed!

Bev Christian

Thu, 5 Jun 2008 10:25:37 -0400

83 lines

New Thread

NTC [TN] Flame retardants ignite controversy - Posted without comment

Re: NTC [TN] Flame retardants ignite controversy - Posted without comment

Dharma Kemp-Bresett

Wed, 11 Jun 2008 13:55:11 -0400

320 lines

New Thread

NTC: Coefficients of thermal expansion

Re: NTC: Coefficients of thermal expansion

Werner Engelmaier /*

Thu, 12 Jun 2008 15:13:31 EDT

33 lines

Re: NTC: Coefficients of thermal expansion

Phil Nutting

Thu, 12 Jun 2008 11:37:01 -0400

263 lines

Re: NTC: Coefficients of thermal expansion

Brian Ellis

Thu, 12 Jun 2008 18:30:26 +0300

230 lines

Re: NTC: Coefficients of thermal expansion

Whittaker, Dewey (EHCOE)

Thu, 12 Jun 2008 07:25:33 -0700

212 lines

Re: NTC: Coefficients of thermal expansion

Dharma Kemp-Bresett

Wed, 11 Jun 2008 16:37:14 -0400

154 lines

Re: NTC: Coefficients of thermal expansion

Steve Gregory

Wed, 11 Jun 2008 15:31:52 -0500

118 lines

Re: NTC: Coefficients of thermal expansion

Craig Cullum

Wed, 11 Jun 2008 15:28:30 -0500

43 lines

NTC: Coefficients of thermal expansion

Steve Gregory

Wed, 11 Jun 2008 15:02:18 -0500

64 lines

New Thread

NTC: The weekend is finally here!

NTC: The weekend is finally here!

Steve Gregory

Fri, 20 Jun 2008 07:04:48 -0500

38 lines

New Thread

packaging spec needed

packaging spec needed

John Burke

Thu, 26 Jun 2008 20:30:55 -0700

61 lines

New Thread

Paste 'spattering' issue.

Re: Paste 'spattering' issue.

John Burke

Mon, 23 Jun 2008 09:43:49 -0700

135 lines

Re: Paste 'spattering' issue.

Guy Ramsey

Mon, 23 Jun 2008 11:18:04 -0400

148 lines

Re: Paste 'spattering' issue.

Stadem, Richard D.

Mon, 23 Jun 2008 08:18:55 -0500

114 lines

Re: Paste 'spattering' issue.

Tan Geok Ang

Sun, 22 Jun 2008 20:03:23 +0800

130 lines

Re: Paste 'spattering' issue.

Brian Ellis

Fri, 20 Jun 2008 11:40:48 +0300

134 lines

Paste 'spattering' issue.

Peter Barton

Fri, 20 Jun 2008 08:05:00 +0100

80 lines

New Thread

PCB Laminate cost question

PCB Laminate cost question

Kathy Kuhlow

Fri, 6 Jun 2008 12:14:19 -0500

31 lines

New Thread

Power amplifier growth

Re: Power amplifier growth

Charlie Pitarys

Thu, 26 Jun 2008 15:40:45 -0500

253 lines

Re: Power amplifier growth

Whittaker, Dewey (EHCOE)

Thu, 26 Jun 2008 11:18:46 -0700

421 lines

Re: Power amplifier growth

Ted Tontis

Thu, 26 Jun 2008 13:16:06 -0500

95 lines

Re: Power amplifier growth

Gary Robinson

Thu, 26 Jun 2008 13:08:22 -0500

87 lines

Re: Power amplifier growth

Creswick, Steven

Thu, 26 Jun 2008 14:02:05 -0400

62 lines

Re: Power amplifier growth

Gary Robinson

Thu, 26 Jun 2008 12:57:39 -0500

349 lines

Re: Power amplifier growth

Wenger, George M.

Thu, 26 Jun 2008 10:43:02 -0400

238 lines

Re: Power amplifier growth

Steve Gregory

Thu, 26 Jun 2008 08:50:38 -0500

336 lines

Re: Power amplifier growth

Hernefjord Ingemar

Thu, 26 Jun 2008 14:38:43 +0200

309 lines

Re: Power amplifier growth

Steve Gregory

Thu, 26 Jun 2008 07:03:03 -0500

280 lines

Re: Power amplifier growth

Hernefjord Ingemar

Thu, 26 Jun 2008 09:23:41 +0200

259 lines

Re: Power amplifier growth

Reuven Rokah

Thu, 26 Jun 2008 08:48:37 +0300

232 lines

Re: Power amplifier growth

Guy Ramsey

Wed, 25 Jun 2008 21:05:43 -0400

220 lines

Re: Power amplifier growth

Inge

Wed, 25 Jun 2008 11:27:44 -0700

196 lines

Re: Power amplifier growth

Wenger, George M.

Wed, 25 Jun 2008 08:10:18 -0400

118 lines

Re: Power amplifier growth

Dave Elder

Wed, 25 Jun 2008 07:55:09 +1200

125 lines

Re: Power amplifier growth

Inge

Tue, 24 Jun 2008 11:28:46 -0700

75 lines

Re: Power amplifier growth

Joyce Koo

Tue, 24 Jun 2008 11:58:13 -0400

392 lines

Re: Power amplifier growth

Whittaker, Dewey (EHCOE)

Tue, 24 Jun 2008 08:32:24 -0700

74 lines

Re: Power amplifier growth

Whittaker, Dewey (EHCOE)

Tue, 24 Jun 2008 08:26:55 -0700

98 lines

Re: Power amplifier growth

Steve Gregory

Tue, 24 Jun 2008 08:32:22 -0500

70 lines

Re: Power amplifier growth

Upton, Shawn

Tue, 24 Jun 2008 09:14:32 -0400

65 lines

Re: Power amplifier growth

Wenger, George M.

Tue, 24 Jun 2008 08:39:05 -0400

233 lines

Re: Power amplifier growth

Colin McVean

Tue, 24 Jun 2008 13:37:04 +0100

360 lines

Re: Power amplifier growth

Wenger, George M.

Tue, 24 Jun 2008 08:34:27 -0400

189 lines

Re: Power amplifier growth

Colin McVean

Tue, 24 Jun 2008 13:30:45 +0100

124 lines

Re: Power amplifier growth

Thayer, Wayne

Tue, 24 Jun 2008 08:27:34 -0400

60 lines

Re: Power amplifier growth

Guy Ramsey

Tue, 24 Jun 2008 05:03:37 -0400

66 lines

Power amplifier growth

Dave Elder

Tue, 24 Jun 2008 17:00:45 +1200

68 lines

New Thread

press fit connectors

Re: press fit connectors

Brian Chandler

Thu, 5 Jun 2008 06:48:22 -0500

40 lines

Re: press fit connectors

Steve Gregory

Thu, 5 Jun 2008 06:45:55 -0500

150 lines

Re: press fit connectors

Hernefjord Ingemar

Thu, 5 Jun 2008 09:56:49 +0200

119 lines

Re: press fit connectors

Steve Gregory

Wed, 4 Jun 2008 15:50:06 -0500

93 lines

Re: press fit connectors

Kevin Glidden

Wed, 4 Jun 2008 14:34:23 -0400

135 lines

Re: press fit connectors

John Burke

Wed, 4 Jun 2008 11:16:43 -0700

115 lines

Re: press fit connectors

Kevin Glidden

Wed, 4 Jun 2008 13:54:30 -0400

87 lines

press fit connectors

Linda Langley

Wed, 4 Jun 2008 12:34:58 -0400

44 lines

New Thread

Printing on Xerox 2--

Printing on Xerox 2--

Jack Crawford

Wed, 11 Jun 2008 10:02:08 -0500

33 lines

New Thread

QFN "Bumped" Pad Construction

Re: QFN "Bumped" Pad Construction

John Burke

Mon, 2 Jun 2008 11:29:06 -0700

76 lines

QFN "Bumped" Pad Construction

bob wettermann

Mon, 2 Jun 2008 09:18:10 -0700

35 lines

New Thread

REACH

Re: REACH

R Sedlak

Fri, 27 Jun 2008 15:00:26 -0700

183 lines

Re: REACH

R Sedlak

Fri, 27 Jun 2008 14:58:01 -0700

130 lines

Re: REACH

Genny Gibbard

Fri, 27 Jun 2008 13:54:33 -0600

188 lines

Re: REACH

John Burke

Fri, 27 Jun 2008 12:08:42 -0700

140 lines

Re: REACH

Bev Christian

Fri, 27 Jun 2008 14:32:40 -0400

150 lines

Re: REACH

Genny Gibbard

Fri, 27 Jun 2008 12:03:45 -0600

112 lines

Re: REACH

Bev Christian

Fri, 27 Jun 2008 13:56:52 -0400

80 lines

REACH

Bill Clark

Fri, 27 Jun 2008 13:37:22 -0400

30 lines

New Thread

Reflow specifications for PCB

Re: Reflow specifications for PCB

Paul Reid

Tue, 3 Jun 2008 09:00:26 -0400

88 lines

Re: Reflow specifications for PCB

Werner Engelmaier /*

Tue, 3 Jun 2008 08:26:59 EDT

49 lines

Re: Reflow specifications for PCB

Paul Reid

Tue, 3 Jun 2008 08:03:19 -0400

259 lines

Re: Reflow specifications for PCB

Haynes, Kim

Mon, 2 Jun 2008 18:04:29 -0500

168 lines

Re: Reflow specifications for PCB

Paul Reid

Mon, 2 Jun 2008 18:58:07 -0400

143 lines

Re: Reflow specifications for PCB

Werner Engelmaier /*

Mon, 2 Jun 2008 17:59:24 EDT

55 lines

Reflow specifications for PCB

Peter L

Mon, 2 Jun 2008 13:20:35 -0500

31 lines

New Thread

Register today for IPC's 5 Week Summer School Webcast Series: Back to the Basics

Register today for IPC's 5 Week Summer School Webcast Series: Back to the Basics

Michelle Michelotti

Thu, 12 Jun 2008 09:04:30 -0500

138 lines

New Thread

Register today for IPC's Back to the Basics Summer School Webcast Series!

Register today for IPC's Back to the Basics Summer School Webcast Series!

Michelle Michelotti

Thu, 19 Jun 2008 08:53:17 -0500

65 lines

New Thread

Register today for upcoming July Fabrication Workshops - Hosted by OMG Electronic Chemicals, Inc.

Register today for upcoming July Fabrication Workshops - Hosted by OMG Electronic Chemicals, Inc.

Michelle Michelotti

Fri, 6 Jun 2008 09:10:43 -0500

159 lines

Register today for upcoming July Fabrication Workshops - Hosted by OMG Electronic Chemicals, Inc.

Michelle Michelotti

Mon, 2 Jun 2008 08:04:18 -0500

157 lines

New Thread

Reliability of PCB including removable auxiliaty area with test points

Reliability of PCB including removable auxiliaty area with test points

Kirshenbaum Mordechai

Wed, 25 Jun 2008 06:25:42 -0500

31 lines

New Thread

Removing soldermask under SMT devices

Re: Removing soldermask under SMT devices

Ahne Oosterhof

Thu, 5 Jun 2008 08:10:30 -0700

81 lines

Re: Removing soldermask under SMT devices

Phil Nutting

Wed, 4 Jun 2008 16:39:22 -0400

146 lines

Re: Removing soldermask under SMT devices

John Maxwell

Wed, 4 Jun 2008 11:51:30 -0700

112 lines

Re: Removing soldermask under SMT devices

Lenny Carter

Wed, 4 Jun 2008 14:02:52 -0400

80 lines

Re: Removing soldermask under SMT devices

Gervascio, Thomas

Wed, 4 Jun 2008 13:34:06 -0400

84 lines

Re: Removing soldermask under SMT devices

Graham Collins

Wed, 4 Jun 2008 13:42:24 -0300

79 lines

Removing soldermask under SMT devices

Phil Nutting

Wed, 4 Jun 2008 12:33:49 -0400

44 lines

New Thread

Requirements for edge connector finish

Re: Requirements for edge connector finish

Sherif Refaat

Wed, 4 Jun 2008 12:36:12 -0400

54 lines

Requirements for edge connector finish

=?ks_c_5601-1987?B?sejBpMO2?=

Wed, 4 Jun 2008 15:16:03 +0900

21 lines

New Thread

respirator cartridge for IPA

Re: respirator cartridge for IPA

Ken Bloomquist

Thu, 19 Jun 2008 14:04:10 -0700

48 lines

Re: respirator cartridge for IPA

Stadem, Richard D.

Thu, 19 Jun 2008 14:37:32 -0500

53 lines

Re: respirator cartridge for IPA

Ken Bloomquist

Thu, 19 Jun 2008 07:13:09 -0700

47 lines

Re: respirator cartridge for IPA

legg

Thu, 19 Jun 2008 08:34:09 -0500

30 lines

Re: respirator cartridge for IPA

Ken Bloomquist

Wed, 18 Jun 2008 11:48:36 -0700

76 lines

Re: respirator cartridge for IPA

<>

Wed, 18 Jun 2008 14:04:13 -0400

55 lines

Re: Respirator Cartridge for IPA

Rex Waygood

Wed, 18 Jun 2008 15:00:24 +0100

96 lines

Re: Respirator Cartridge for IPA

Whittaker, Dewey (EHCOE)

Wed, 18 Jun 2008 06:40:22 -0700

162 lines

Re: Respirator Cartridge for IPA

Reuven Rokah

Wed, 18 Jun 2008 13:30:01 +0300

164 lines

Re: Respirator Cartridge for IPA

Thayer, Wayne

Wed, 18 Jun 2008 06:16:48 -0400

132 lines

Re: Respirator Cartridge for IPA

Ken Bloomquist

Tue, 17 Jun 2008 09:37:21 -0700

64 lines

Re: Respirator Cartridge for IPA

Frederick Miller

Tue, 17 Jun 2008 12:21:13 -0400

68 lines

Re: Respirator Cartridge for IPA

Matthias Mansfeld

Tue, 17 Jun 2008 16:31:40 +0200

97 lines

Re: Respirator Cartridge for IPA

Bev Christian

Tue, 17 Jun 2008 10:28:13 -0400

104 lines

Re: Respirator Cartridge for IPA

Brian Ellis

Tue, 17 Jun 2008 17:19:04 +0300

57 lines

Respirator Cartridge for IPA

Ken Bloomquist

Tue, 17 Jun 2008 06:55:45 -0700

34 lines

New Thread

SAC Plated Passives with SnPb Solder Paste

Re: SAC Plated Passives with SnPb Solder Paste

Mike Fenner

Mon, 23 Jun 2008 17:13:17 +0100

108 lines

Re: SAC Plated Passives with SnPb Solder Paste

Geert Willems

Mon, 23 Jun 2008 09:33:39 -0500

36 lines

Re: SAC Plated Passives with SnPb Solder Paste

Roberts, Jon

Mon, 23 Jun 2008 07:16:15 -0500

77 lines

Re: SAC Plated Passives with SnPb Solder Paste

David Fischer

Sun, 22 Jun 2008 22:40:32 -0400

57 lines

Re: SAC Plated Passives with SnPb Solder Paste

Mike Fenner

Sat, 21 Jun 2008 17:41:43 +0100

86 lines

Re: SAC Plated Passives with SnPb Solder Paste

Geert Willems

Sat, 21 Jun 2008 07:28:27 -0500

36 lines

Re: SAC Plated Passives with SnPb Solder Paste

Bob Willis

Sat, 21 Jun 2008 12:49:30 +0100

77 lines

SAC Plated Passives with SnPb Solder Paste

David Fischer

Fri, 20 Jun 2008 13:18:29 -0400

33 lines

New Thread

SAC solder on Pb90Sn10

Re: SAC solder on Pb90Sn10

Stadem, Richard D.

Thu, 26 Jun 2008 09:27:47 -0500

175 lines

Re: SAC solder on Pb90Sn10

Whittaker, Dewey (EHCOE)

Thu, 26 Jun 2008 07:21:49 -0700

148 lines

Re: SAC solder on Pb90Sn10

Douglas O. Pauls

Thu, 26 Jun 2008 07:16:56 -0500

116 lines

Re: SAC solder on Pb90Sn10

jonathan noquil

Thu, 26 Jun 2008 11:30:24 +0800

161 lines

Re: SAC solder on Pb90Sn10

Whittaker, Dewey (EHCOE)

Wed, 25 Jun 2008 12:49:50 -0700

64 lines

Re: SAC solder on Pb90Sn10

Werner Engelmaier /*

Wed, 25 Jun 2008 13:49:33 EDT

35 lines

Re: SAC solder on Pb90Sn10

Gumpert, Ben

Wed, 25 Jun 2008 12:00:40 -0400

135 lines

Re: SAC solder on Pb90Sn10

jonathan noquil

Wed, 25 Jun 2008 11:04:33 +0800

95 lines

Re: SAC solder on Pb90Sn10

Stadem, Richard D.

Tue, 24 Jun 2008 13:40:38 -0500

61 lines

SAC solder on Pb90Sn10

Gumpert, Ben

Tue, 24 Jun 2008 13:42:13 -0400

28 lines

New Thread

Singulation of Aluminum PCBs

Re: Singulation of Aluminum PCBs

Ioan Tempea

Fri, 27 Jun 2008 09:18:16 -0400

104 lines

Re: Singulation of Aluminum PCBs

Tan Geok Ang

Fri, 27 Jun 2008 16:25:24 +0800

114 lines

Re: Singulation of Aluminum PCBs

Hernefjord Ingemar

Fri, 27 Jun 2008 09:45:41 +0200

82 lines

Re: Singulation of Aluminum PCBs

Mike Sewell

Thu, 26 Jun 2008 15:27:13 -0500

89 lines

Re: Singulation of Aluminum PCBs

Ted Tontis

Thu, 26 Jun 2008 15:18:10 -0500

93 lines

Singulation of Aluminum PCBs

Ioan Tempea

Thu, 26 Jun 2008 16:00:16 -0400

55 lines

New Thread

SN100 for Reflow Application

Re: SN100 for Reflow Application

Igoshev, Vladimir

Wed, 18 Jun 2008 16:54:43 -0400

63 lines

Re: SN100 for Reflow Application

Werner Engelmaier /*

Wed, 18 Jun 2008 16:53:28 EDT

44 lines

Re: SN100 for Reflow Application

Igoshev, Vladimir

Wed, 18 Jun 2008 13:38:58 -0400

87 lines

Re: SN100 for Reflow Application

Kane, Amol (349)

Wed, 18 Jun 2008 09:27:18 -0400

72 lines

Re: SN100 for Reflow Application

Werner Engelmaier /*

Tue, 17 Jun 2008 16:32:39 EDT

53 lines

Re: SN100 for Reflow Application

John Maxwell

Tue, 17 Jun 2008 13:28:08 -0700

69 lines

SN100 for Reflow Application

Kane, Amol (349)

Tue, 17 Jun 2008 16:05:56 -0400

61 lines

New Thread

Solder Mask Thickness

Re: Solder Mask Thickness

Jim Mahoney

Thu, 12 Jun 2008 11:19:24 -0500

32 lines

Solder Mask Thickness

Wood Kenneth

Fri, 6 Jun 2008 07:30:28 -0400

42 lines

New Thread

Solder-NiAu interface failure

Re: Solder-NiAu interface failure

Igoshev, Vladimir

Fri, 20 Jun 2008 10:15:22 -0400

101 lines

Solder-NiAu interface failure

Geert Willems

Fri, 20 Jun 2008 04:05:15 -0500

84 lines

New Thread

Solithane coating dewetting

Re: Solithane coating dewetting

Tan Geok Ang

Fri, 27 Jun 2008 14:46:38 +0800

196 lines

Re: Solithane coating dewetting

Whittaker, Dewey (EHCOE)

Thu, 26 Jun 2008 07:09:30 -0700

168 lines

Re: Solithane coating dewetting

Joyce Koo

Thu, 26 Jun 2008 08:54:04 -0400

228 lines

Re: Solithane coating dewetting

Douglas O. Pauls

Thu, 26 Jun 2008 07:51:16 -0500

193 lines

Re: Solithane coating dewetting

Joyce Koo

Thu, 26 Jun 2008 08:47:03 -0400

160 lines

Re: Solithane coating dewetting

Douglas O. Pauls

Thu, 26 Jun 2008 07:29:58 -0500

126 lines

Re: Solithane coating dewetting

Graham Naisbitt

Thu, 26 Jun 2008 12:05:11 +0100

62 lines

Solithane coating dewetting

Tan Geok Ang

Thu, 26 Jun 2008 14:33:00 +0800

32 lines

New Thread

Space Station Malfunction

Re: Space Station Malfunction

Stadem, Richard D.

Mon, 2 Jun 2008 07:41:23 -0500

54 lines

Re: Space Station Malfunction

Stadem, Richard D.

Mon, 2 Jun 2008 07:37:53 -0500

132 lines

Re: Space Station Malfunction

Karl Hunsinger

Mon, 2 Jun 2008 08:19:14 -0400

28 lines

Re: Space Station Malfunction

Hernefjord Ingemar

Mon, 2 Jun 2008 14:16:49 +0200

181 lines

Re: Space Station Malfunction

Eric CHRISTISON

Mon, 2 Jun 2008 13:10:13 +0100

152 lines

Re: Space Station Malfunction

Hernefjord Ingemar

Mon, 2 Jun 2008 13:17:28 +0200

112 lines

Re: Space Station Malfunction

Matthew Lamkin

Mon, 2 Jun 2008 08:42:38 +0100

78 lines

New Thread

Space Station Malfunction NTC

Re: Space Station Malfunction NTC

Ian Hanna

Mon, 2 Jun 2008 10:39:27 -0400

69 lines

Re: Space Station Malfunction NTC

Robert Lazzara

Mon, 2 Jun 2008 09:59:26 EDT

36 lines

Re: Space Station Malfunction NTC

Mike Fenner

Mon, 2 Jun 2008 14:40:49 +0100

200 lines

New Thread

Stainless Steel Contamination Question - Source Nailed!

Re: Stainless Steel Contamination Question - Source Nailed!

John Burke

Thu, 5 Jun 2008 10:59:38 -0700

153 lines

Re: Stainless Steel Contamination Question - Source Nailed!

Stadem, Richard D.

Thu, 5 Jun 2008 11:30:08 -0500

68 lines

Re: Stainless Steel Contamination Question - Source Nailed!

Linda Langley

Thu, 5 Jun 2008 11:04:41 -0400

116 lines

Re: Stainless Steel Contamination Question - Source Nailed!

Brian Ellis

Thu, 5 Jun 2008 17:59:36 +0300

61 lines

Re: Stainless Steel Contamination Question - Source Nailed!

Ken Bloomquist

Thu, 5 Jun 2008 07:58:49 -0700

24 lines

Re: Stainless Steel Contamination Question - Source Nailed!

Leland Woodall

Thu, 5 Jun 2008 10:39:04 -0400

126 lines

Re: Stainless Steel Contamination Question - Source Nailed!

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Thu, 5 Jun 2008 10:24:03 -0400

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Stainless Steel Contamination Question - Source Nailed!

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Sat, 7 Jun 2008 10:27:24 +0300

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<>

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<>

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=?iso-8859-1?Q?Jean-Fran=E7ois_Bissonnette?=

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=?ks_c_5601-1987?B?sejBpMO2?=

Fri, 20 Jun 2008 09:13:08 +0900

23 lines

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Mon, 23 Jun 2008 09:51:48 -0400

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Thu, 19 Jun 2008 19:03:43 -0400

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Re: [NTC] An unfortunate sign of things to come...

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Tue, 3 Jun 2008 12:57:45 EDT

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