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June 2008


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Table of Contents:

Aegis/Valor (1 message)
Aerospace Industry Association Offers REACH Training Workshops (1 message)
Alan Kreplick is out of the office. (1 message)
Ambient conditions for conformal coating (2 messages)
An unfortunate sign of things to come... (1 message)
Annular Rings on Via holes (5 messages)
Another overlooked source of FOD (1 message)
Antw: [TN] Ceramic LGAs (1 message)
Artwork film replacement frequency (3 messages)
Bacon Software (4 messages)
Battery contact manufacturer (2 messages)
Bias voltage test in damp heat (9 messages)
Bow PCAs (5 messages)
BP,BF,BS (1 message)
Cam software Help (ie Aegis, Valor, etc...) (2 messages)
Ceramic Cap Value (6 messages)
Ceramic LGAs (2 messages)
Changing conformal coating from silicone to urethane... (6 messages)
Chicago test resource (7 messages)
Chip on Board and Solder Mask (6 messages)
Class 3 Requirements (1 message)
controlled impedance (3 messages)
Cost Implications of Non-standard Laminate Thickness (4 messages)
Cost of Reflow (1 message)
delamination/blistering (1 message)
Don't wait, and register today for upcoming IPC Workshops (1 message)
Double side reflow query (5 messages)
double sided reflow query (1 message)
Dr. Howard Johnson newsletter (2 messages)
Edge clearance for a BGA (1 message)
edge delamination flexible circuits assemblies (8 messages)
Electroplating equipment (2 messages)
Error-proofing ZIF Connections (3 messages)
Extra cost of Copper Via Filling (6 messages)
Fiducial solder resist clearance (6 messages)
Finish plating in vias (2 messages)
Flame retardants ignite controversy - Posted without comment (12 messages)
Fw: double sided reflow query (1 message)
FW: [DC] Cadence / Mentor News? (1 message)
FW: [tinwhiskers] IPC expresses concerns on possible ROHS revisions (1 message)
Glue Mask Requirements (6 messages)
Hoping all is well with our TechNet friends in Cedar Rapids, Iowa (3 messages)
Hurry and Register today for upcoming July Fabrication Workshops - Hosted by OMG Electronic Chemicals, Inc. (1 message)
Hurry Last chance to register for upcoming DFM workshop and Certification Workshops - Manchester, N.H. (1 message)
Hurry Register today for IPC's Back to the Basics Summer School Webcast Series! (1 message)
Intermitent contact on LEDs (5 messages)
Intermittent contact on LEDs (1 message)
IPC 9701- table 4.4- failure definition (7 messages)
IPC MIDWEST - ONLINE REGISTRATION IS NOW OPEN! (1 message)
IPC Summer School Webcast Series: Back to the Basics (1 message)
IPC-6012A - allowable conductor width reduction interpretation? (3 messages)
Is there a good discrete wire support still made (6 messages)
Last Chance to Register for IPC Upcoming Design Conference (1 message)
Last Chance to Register for IPC's upcoming Design Conference June 23-25, 2008 (1 message)
Last chance to register for upcoming DFM workshop and Certification Workshops - Manchester, N.H. (1 message)
Last Chance: Register for IPC's Technical Seminars at National Electronics Week, 17-19 June 2008, London (1 message)
Leakage on Tantalum Capacitor (2 messages)
Looking for data tying rework (solder iron touch-up) with component or PCB failure (1 message)
Mehmet Emin Yaman işyeri dışında. (1 message)
Moisture sensitive componentes & manufacturing documentation (3 messages)
NTC - Tin Whiskers - how long? Size matters! (2 messages)
NTC - was SAC solder on Pb90Sn10 (1 message)
NTC - [TN] SAC solder on Pb90Sn10 (3 messages)
ntc Edradour (1 message)
NTC EU discord over EU rule (3 messages)
NTC Friday (1 message)
NTC Power amplifier growth (2 messages)
NTC RE: [TN] Flame retardants ignite controversy - Posted without comment (2 messages)
NTC Re: [TN] respirator cartridge for IPA (1 message)
NTC RE: [TN] Stainless Steel Contamination Question - Source Nailed! (2 messages)
NTC [TN] Flame retardants ignite controversy - Posted without comment (1 message)
NTC: Coefficients of thermal expansion (8 messages)
NTC: The weekend is finally here! (1 message)
packaging spec needed (1 message)
Paste 'spattering' issue. (6 messages)
PCB Laminate cost question (1 message)
Power amplifier growth (29 messages)
press fit connectors (8 messages)
Printing on Xerox 2-- (1 message)
QFN "Bumped" Pad Construction (2 messages)
REACH (8 messages)
Reflow specifications for PCB (7 messages)
Register today for IPC's 5 Week Summer School Webcast Series: Back to the Basics (1 message)
Register today for IPC's Back to the Basics Summer School Webcast Series! (1 message)
Register today for upcoming July Fabrication Workshops - Hosted by OMG Electronic Chemicals, Inc. (2 messages)
Reliability of PCB including removable auxiliaty area with test points (1 message)
Removing soldermask under SMT devices (7 messages)
Requirements for edge connector finish (2 messages)
Respirator Cartridge for IPA (16 messages)
SAC Plated Passives with SnPb Solder Paste (8 messages)
SAC solder on Pb90Sn10 (10 messages)
Singulation of Aluminum PCBs (6 messages)
SN100 for Reflow Application (7 messages)
Solder Mask Thickness (2 messages)
Solder-NiAu interface failure (2 messages)
Solithane coating dewetting (8 messages)
Space Station Malfunction (7 messages)
Space Station Malfunction NTC (3 messages)
Stainless Steel Contamination Question - Source Nailed! (8 messages)
Stainless Steel Contamination Question - Source Revealed (22 messages)
Tell the EU Commission How Much RoHS Changes Could Save You (1 message)
Temperature of lead-free for hand soldering (3 messages)
Terminology question (1 message)
Terry Chicka is out of the office from 18:00 hrs today (1 message)
Test house for J-STD-020 testing (1 message)
Tin Whiskers - how long? Size matters! (8 messages)
Tiny Bubbles (14 messages)
Vienna, Austria (1 message)
Visible Magnetic Fields (20 messages)
Visible Magnetic Fields [Scanned] (1 message)
Wave Solder Nozzle Parallelism Tool (1 message)
Way to discriminate 'date code' on PCB after assembly (1 message)
[LF] [TN] SN100 for Reflow Application (25 messages)
[NTC] An unfortunate sign of things to come... (6 messages)
[ntc] Space Station Malfunction (3 messages)

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Subject Sorted by Subject, Chronologically

From

Date

Size

New Thread

Aegis/Valor

Aegis/Valor

Gary Robinson <[log in to unmask]>

Fri, 20 Jun 2008 08:34:58 -0500

64 lines

New Thread

Aerospace Industry Association Offers REACH Training Workshops

Aerospace Industry Association Offers REACH Training Workshops

Sahar Osman-Sypher <[log in to unmask]>

Wed, 4 Jun 2008 09:57:58 -0500

59 lines

New Thread

Alan Kreplick is out of the office.

Alan Kreplick is out of the office.

Alan Kreplick <[log in to unmask]>

Mon, 16 Jun 2008 08:01:41 -0400

24 lines

New Thread

Ambient conditions for conformal coating

Ambient conditions for conformal coating

Ioan Tempea <[log in to unmask]>

Mon, 9 Jun 2008 10:53:38 -0400

40 lines

Re: Ambient conditions for conformal coating

Graham Naisbitt <[log in to unmask]>

Mon, 9 Jun 2008 16:38:49 +0100

70 lines

New Thread

An unfortunate sign of things to come...

Re: An unfortunate sign of things to come...

Stadem, Richard D. <[log in to unmask]>

Mon, 2 Jun 2008 07:32:12 -0500

207 lines

New Thread

Annular Rings on Via holes

Annular Rings on Via holes

Paul Baine <[log in to unmask]>

Wed, 11 Jun 2008 10:06:08 -0400

35 lines

Re: Annular Rings on Via holes

Dwight Mattix <[log in to unmask]>

Wed, 11 Jun 2008 09:30:42 -0700

67 lines

Re: Annular Rings on Via holes

Paul Edwards <[log in to unmask]>

Wed, 11 Jun 2008 10:09:08 -0700

137 lines

Re: Annular Rings on Via holes

Paul Reid <[log in to unmask]>

Wed, 11 Jun 2008 14:42:57 -0400

175 lines

Re: Annular Rings on Via holes

Lee parker <[log in to unmask]>

Thu, 12 Jun 2008 11:39:53 -0400

200 lines

New Thread

Another overlooked source of FOD

Another overlooked source of FOD

Stadem, Richard D. <[log in to unmask]>

Tue, 17 Jun 2008 14:14:50 -0500

30 lines

New Thread

Antw: [TN] Ceramic LGAs

Antw: [TN] Ceramic LGAs

Guenter Grossmann <[log in to unmask]>

Mon, 30 Jun 2008 09:57:42 +0200

107 lines

New Thread

Artwork film replacement frequency

Artwork film replacement frequency

Ryan Grant <[log in to unmask]>

Mon, 23 Jun 2008 10:57:54 -0600

30 lines

Re: Artwork film replacement frequency

Scott Westheimer <[log in to unmask]>

Mon, 23 Jun 2008 13:11:46 -0400

47 lines

Re: Artwork film replacement frequency

Joe Hughes <[log in to unmask]>

Mon, 23 Jun 2008 10:16:55 -0700

63 lines

New Thread

Bacon Software

Bacon Software

Dan Skweres <[log in to unmask]>

Tue, 3 Jun 2008 09:14:39 -0400

27 lines

Re: Bacon Software

Franklin D Asbell <[log in to unmask]>

Tue, 3 Jun 2008 08:28:26 -0500

69 lines

Re: Bacon Software

roland jaquet <[log in to unmask]>

Tue, 3 Jun 2008 16:01:33 +0200

74 lines

Re: Bacon Software

Ralph Richart <[log in to unmask]>

Tue, 3 Jun 2008 07:29:42 -0700

66 lines

New Thread

Battery contact manufacturer

Battery contact manufacturer

Grant Emandien <[log in to unmask]>

Mon, 30 Jun 2008 16:32:39 +0200

38 lines

Re: Battery contact manufacturer

Roberts, Jon <[log in to unmask]>

Mon, 30 Jun 2008 09:46:21 -0500

80 lines

New Thread

Bias voltage test in damp heat

Bias voltage test in damp heat

Steve Kelly <[log in to unmask]>

Wed, 25 Jun 2008 11:09:36 -0400

57 lines

Re: Bias voltage test in damp heat

Brian Ellis <[log in to unmask]>

Wed, 25 Jun 2008 18:32:23 +0300

80 lines

Re: Bias voltage test in damp heat

Douglas O. Pauls <[log in to unmask]>

Wed, 25 Jun 2008 11:37:07 -0500

126 lines

Re: Bias voltage test in damp heat

Eric CHRISTISON <[log in to unmask]>

Wed, 25 Jun 2008 17:50:08 +0100

162 lines

Re: Bias voltage test in damp heat

Inge <[log in to unmask]>

Wed, 25 Jun 2008 11:37:06 -0700

194 lines

Re: Bias voltage test in damp heat

Steve Kelly <[log in to unmask]>

Wed, 25 Jun 2008 15:21:24 -0400

224 lines

Re: Bias voltage test in damp heat

Inge <[log in to unmask]>

Wed, 25 Jun 2008 12:30:47 -0700

251 lines

Re: Bias voltage test in damp heat

Steve Kelly <[log in to unmask]>

Thu, 26 Jun 2008 09:56:02 -0400

262 lines

Re: Bias voltage test in damp heat

legg <[log in to unmask]>

Sat, 28 Jun 2008 10:59:04 -0500

56 lines

New Thread

Bow PCAs

Bow PCAs

Ted Kong <[log in to unmask]>

Mon, 30 Jun 2008 12:24:22 -0700

32 lines

Re: Bow PCAs

Ryan Grant <[log in to unmask]>

Mon, 30 Jun 2008 13:35:53 -0600

87 lines

Re: Bow PCAs

Ted Kong <[log in to unmask]>

Mon, 30 Jun 2008 13:59:25 -0700

151 lines

Re: Bow PCAs

Ryan Grant <[log in to unmask]>

Mon, 30 Jun 2008 15:07:36 -0600

182 lines

Re: Bow PCAs

Tan Geok Ang <[log in to unmask]>

Tue, 1 Jul 2008 08:24:00 +0800

192 lines

New Thread

BP,BF,BS

BP,BF,BS

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Fri, 20 Jun 2008 07:27:37 -0700

347 lines

New Thread

Cam software Help (ie Aegis, Valor, etc...)

Cam software Help (ie Aegis, Valor, etc...)

Gary Robinson <[log in to unmask]>

Tue, 3 Jun 2008 09:03:46 -0500

59 lines

Re: Cam software Help (ie Aegis, Valor, etc...)

Tan Geok Ang <[log in to unmask]>

Wed, 4 Jun 2008 17:02:10 +0800

86 lines

New Thread

Ceramic Cap Value

Ceramic Cap Value

Ken Bloomquist <[log in to unmask]>

Fri, 27 Jun 2008 14:13:32 -0700

56 lines

Re: Ceramic Cap Value

John Maxwell <[log in to unmask]>

Fri, 27 Jun 2008 14:53:38 -0700

84 lines

Re: Ceramic Cap Value

Blair Hogg <[log in to unmask]>

Sun, 29 Jun 2008 08:36:34 -0500

107 lines

Re: Ceramic Cap Value

Inge <[log in to unmask]>

Sun, 29 Jun 2008 11:14:50 -0700

124 lines

Re: Ceramic Cap Value

Bruce Tostevin <[log in to unmask]>

Mon, 30 Jun 2008 09:37:29 -0400

111 lines

Re: Ceramic Cap Value

Guy Ramsey <[log in to unmask]>

Mon, 30 Jun 2008 11:09:46 -0400

123 lines

New Thread

Ceramic LGAs

Ceramic LGAs

David Tremmel <[log in to unmask]>

Fri, 27 Jun 2008 14:42:14 -0500

61 lines

Re: Ceramic LGAs

Stadem, Richard D. <[log in to unmask]>

Mon, 30 Jun 2008 07:30:29 -0500

83 lines

New Thread

Changing conformal coating from silicone to urethane...

Changing conformal coating from silicone to urethane...

Mike Johnson <[log in to unmask]>

Fri, 6 Jun 2008 09:04:14 -0600

24 lines

Re: Changing conformal coating from silicone to urethane...

Phil Nutting <[log in to unmask]>

Fri, 6 Jun 2008 11:29:36 -0400

65 lines

Re: Changing conformal coating from silicone to urethane...

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Fri, 6 Jun 2008 08:36:50 -0700

55 lines

Re: Changing conformal coating from silicone to urethane...

Graham Naisbitt <[log in to unmask]>

Fri, 6 Jun 2008 17:06:14 +0100

68 lines

Re: Changing conformal coating from silicone to urethane...

Douglas O. Pauls <[log in to unmask]>

Mon, 9 Jun 2008 07:53:59 -0500

109 lines

Re: Changing conformal coating from silicone to urethane...

Graham Naisbitt <[log in to unmask]>

Mon, 9 Jun 2008 16:34:40 +0100

160 lines

New Thread

Chicago test resource

Chicago test resource

Croslin, Robert <[log in to unmask]>

Tue, 24 Jun 2008 08:51:28 -0400

36 lines

Re: Chicago test resource

Lee parker <[log in to unmask]>

Tue, 24 Jun 2008 11:08:18 -0400

72 lines

Re: Chicago test resource

Croslin, Robert <[log in to unmask]>

Tue, 24 Jun 2008 11:56:34 -0400

105 lines

Re: Chicago test resource

paulh <[log in to unmask]>

Tue, 24 Jun 2008 13:42:14 -0500

146 lines

Re: Chicago test resource

Croslin, Robert <[log in to unmask]>

Tue, 24 Jun 2008 14:44:09 -0400

172 lines

Re: Chicago test resource

Jack Olson <[log in to unmask]>

Wed, 25 Jun 2008 11:16:32 -0500

79 lines

Re: Chicago test resource

Croslin, Robert <[log in to unmask]>

Wed, 25 Jun 2008 13:26:22 -0400

106 lines

New Thread

Chip on Board and Solder Mask

Chip on Board and Solder Mask

Gumpert, Ben <[log in to unmask]>

Thu, 5 Jun 2008 08:40:56 -0400

32 lines

Re: Chip on Board and Solder Mask

Werner Engelmaier /* <[log in to unmask]>

Thu, 5 Jun 2008 09:17:27 EDT

50 lines

Re: Chip on Board and Solder Mask

Gumpert, Ben <[log in to unmask]>

Thu, 5 Jun 2008 15:19:17 -0400

79 lines

Re: Chip on Board and Solder Mask

Werner Engelmaier /* <[log in to unmask]>

Thu, 5 Jun 2008 15:36:11 EDT

51 lines

Re: Chip on Board and Solder Mask

Gumpert, Ben <[log in to unmask]>

Thu, 5 Jun 2008 16:27:09 -0400

84 lines

Re: Chip on Board and Solder Mask

Werner Engelmaier /* <[log in to unmask]>

Thu, 5 Jun 2008 17:22:20 EDT

52 lines

New Thread

Class 3 Requirements

Class 3 Requirements

Halas, Mirka <[log in to unmask]>

Tue, 10 Jun 2008 08:48:49 -0400

37 lines

New Thread

controlled impedance

controlled impedance

Louis Hart <[log in to unmask]>

Thu, 26 Jun 2008 19:22:18 -0400

35 lines

Re: controlled impedance

Lee parker <[log in to unmask]>

Fri, 27 Jun 2008 09:14:31 -0400

73 lines

Re: controlled impedance

Craig Sullivan <[log in to unmask]>

Mon, 30 Jun 2008 08:07:51 -0400

75 lines

New Thread

Cost Implications of Non-standard Laminate Thickness

Cost Implications of Non-standard Laminate Thickness

Gary Camac <[log in to unmask]>

Fri, 27 Jun 2008 10:40:55 -0500

45 lines

Re: Cost Implications of Non-standard Laminate Thickness

Dan Skweres <[log in to unmask]>

Fri, 27 Jun 2008 13:06:51 -0400

81 lines

Re: Cost Implications of Non-standard Laminate Thickness

Phil Nutting <[log in to unmask]>

Fri, 27 Jun 2008 13:19:44 -0400

127 lines

Re: Cost Implications of Non-standard Laminate Thickness

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Fri, 27 Jun 2008 10:26:12 -0700

163 lines

New Thread

Cost of Reflow

Cost of Reflow

Paul Reid <[log in to unmask]>

Tue, 17 Jun 2008 15:58:32 -0400

51 lines

New Thread

delamination/blistering

delamination/blistering

David Reed <[log in to unmask]>

Wed, 25 Jun 2008 03:34:51 -0700

44 lines

New Thread

Don't wait, and register today for upcoming IPC Workshops

Don't wait, and register today for upcoming IPC Workshops

Tina Nerad <[log in to unmask]>

Thu, 5 Jun 2008 10:59:52 -0500

46 lines

New Thread

Double side reflow query

Double side reflow query

prashant chopra <[log in to unmask]>

Fri, 6 Jun 2008 17:22:17 +0530

42 lines

Re: Double side reflow query

Gumpert, Ben <[log in to unmask]>

Fri, 6 Jun 2008 08:28:54 -0400

80 lines

Re: Double side reflow query

Steve Gregory <[log in to unmask]>

Fri, 6 Jun 2008 07:52:22 -0500

74 lines

Re: Double side reflow query

Joe Macko <[log in to unmask]>

Fri, 6 Jun 2008 07:03:52 -0700

114 lines

Re: Double side reflow query

Gumpert, Ben <[log in to unmask]>

Fri, 6 Jun 2008 15:41:09 -0400

136 lines

New Thread

double sided reflow query

double sided reflow query

prashant chopra <[log in to unmask]>

Fri, 6 Jun 2008 17:13:18 +0530

42 lines

New Thread

Dr. Howard Johnson newsletter

Dr. Howard Johnson newsletter

Wilson, Bob <[log in to unmask]>

Thu, 19 Jun 2008 12:11:08 -0700

36 lines

Re: Dr. Howard Johnson newsletter

Hernefjord Ingemar <[log in to unmask]>

Mon, 23 Jun 2008 10:46:08 +0200

98 lines

New Thread

Edge clearance for a BGA

Re: Edge clearance for a BGA

Joe Macko <[log in to unmask]>

Mon, 2 Jun 2008 08:51:59 -0700

93 lines

New Thread

edge delamination flexible circuits assemblies

edge delamination flexible circuits assemblies

Gabriela <[log in to unmask]>

Mon, 23 Jun 2008 20:10:37 +0300

32 lines

Re: edge delamination flexible circuits assemblies

Joyce Koo <[log in to unmask]>

Mon, 23 Jun 2008 12:47:31 -0400

66 lines

Re: edge delamination flexible circuits assemblies

James Mahoney <[log in to unmask]>

Mon, 23 Jun 2008 13:06:14 -0400

78 lines

Re: edge delamination flexible circuits assemblies

Steve Kelly <[log in to unmask]>

Mon, 23 Jun 2008 14:16:21 -0400

101 lines

Re: edge delamination flexible circuits assemblies

Stadem, Richard D. <[log in to unmask]>

Mon, 23 Jun 2008 14:20:37 -0500

131 lines

Re: edge delamination flexible circuits assemblies

James Mahoney <[log in to unmask]>

Tue, 24 Jun 2008 09:15:30 -0400

178 lines

Re: edge delamination flexible circuits assemblies

Lee parker <[log in to unmask]>

Tue, 24 Jun 2008 11:02:21 -0400

73 lines

Re: edge delamination flexible circuits assemblies

Gabriela <[log in to unmask]>

Tue, 24 Jun 2008 21:27:06 +0300

100 lines

New Thread

Electroplating equipment

Electroplating equipment

Syed Ahmad <[log in to unmask]>

Thu, 12 Jun 2008 10:56:13 -0500

39 lines

Re: Electroplating equipment

Scott Westheimer <[log in to unmask]>

Thu, 12 Jun 2008 12:01:35 -0400

53 lines

New Thread

Error-proofing ZIF Connections

Error-proofing ZIF Connections

Brian Chandler <[log in to unmask]>

Thu, 12 Jun 2008 11:19:54 -0500

28 lines

Re: Error-proofing ZIF Connections

Kathy Kuhlow <[log in to unmask]>

Thu, 12 Jun 2008 11:46:00 -0500

51 lines

Re: Error-proofing ZIF Connections

James Mahoney <[log in to unmask]>

Thu, 12 Jun 2008 12:43:17 -0400

74 lines

New Thread

Extra cost of Copper Via Filling

Extra cost of Copper Via Filling

Kirshenbaum Mordechai <[log in to unmask]>

Mon, 23 Jun 2008 23:53:49 -0500

23 lines

Re: Extra cost of Copper Via Filling

Joe Lara (Select Circuits) <[log in to unmask]>

Tue, 24 Jun 2008 01:30:06 -0400

82 lines

Re: Extra cost of Copper Via Filling

Dwight Mattix <[log in to unmask]>

Mon, 23 Jun 2008 23:04:07 -0700

133 lines

Re: Extra cost of Copper Via Filling

Thayer, Wayne <[log in to unmask]>

Tue, 24 Jun 2008 08:18:43 -0400

47 lines

Re: Extra cost of Copper Via Filling

Paul Reid <[log in to unmask]>

Tue, 24 Jun 2008 08:29:48 -0400

169 lines

Re: Extra cost of Copper Via Filling

Lee parker <[log in to unmask]>

Tue, 24 Jun 2008 11:05:25 -0400

56 lines

New Thread

Fiducial solder resist clearance

Fiducial solder resist clearance

Douglas McCall <[log in to unmask]>

Wed, 4 Jun 2008 11:13:54 +0100

41 lines

Re: Fiducial solder resist clearance

Graham Collins <[log in to unmask]>

Wed, 4 Jun 2008 07:35:25 -0300

84 lines

Re: Fiducial solder resist clearance

Lenny Carter <[log in to unmask]>

Wed, 4 Jun 2008 08:59:47 -0400

108 lines

Re: Fiducial solder resist clearance

Graham Collins <[log in to unmask]>

Wed, 4 Jun 2008 10:05:54 -0300

125 lines

Re: Fiducial solder resist clearance

Ahne Oosterhof <[log in to unmask]>

Thu, 5 Jun 2008 07:46:10 -0700

72 lines

Re: Fiducial solder resist clearance

Ted Tontis <[log in to unmask]>

Thu, 5 Jun 2008 11:09:20 -0500

102 lines

New Thread

Finish plating in vias

Finish plating in vias

Kevin Glidden <[log in to unmask]>

Mon, 2 Jun 2008 16:00:42 -0400

40 lines

Re: Finish plating in vias

Robert Lazzara <[log in to unmask]>

Mon, 2 Jun 2008 16:23:33 EDT

73 lines

New Thread

Flame retardants ignite controversy - Posted without comment

Flame retardants ignite controversy - Posted without comment

Joe Fjelstad <[log in to unmask]>

Tue, 10 Jun 2008 15:22:03 EDT

95 lines

Re: Flame retardants ignite controversy - Posted without comment

John Burke <[log in to unmask]>

Tue, 10 Jun 2008 12:52:35 -0700

141 lines

Re: Flame retardants ignite controversy - Posted without comment

Joyce Koo <[log in to unmask]>

Tue, 10 Jun 2008 20:24:14 -0400

179 lines

Re: Flame retardants ignite controversy - Posted without comment

Brian Ellis <[log in to unmask]>

Wed, 11 Jun 2008 10:22:36 +0300

206 lines

Re: Flame retardants ignite controversy - Posted without comment

Phil Nutting <[log in to unmask]>

Wed, 11 Jun 2008 09:11:12 -0400

238 lines

Re: Flame retardants ignite controversy - Posted without comment

Reuven Rokah <[log in to unmask]>

Wed, 11 Jun 2008 16:28:40 +0300

269 lines

Re: Flame retardants ignite controversy - Posted without comment

Gary Robinson <[log in to unmask]>

Wed, 11 Jun 2008 08:49:43 -0500

286 lines

Re: Flame retardants ignite controversy - Posted without comment

Joe Fjelstad <[log in to unmask]>

Wed, 11 Jun 2008 14:30:15 EDT

241 lines

Re: Flame retardants ignite controversy - Posted without comment

Stadem, Richard D. <[log in to unmask]>

Wed, 11 Jun 2008 15:09:46 -0500

252 lines

Re: Flame retardants ignite controversy - Posted without comment

Mike Fenner <[log in to unmask]>

Thu, 12 Jun 2008 14:42:19 +0100

290 lines

Re: Flame retardants ignite controversy - Posted without comment

David Tremmel <[log in to unmask]>

Thu, 12 Jun 2008 08:54:18 -0500

417 lines

Re: Flame retardants ignite controversy - Posted without comment

Wrobel, Clayton <[log in to unmask]>

Mon, 16 Jun 2008 07:39:24 -0400

273 lines

New Thread

Fw: double sided reflow query

Fw: double sided reflow query

prashant chopra <[log in to unmask]>

Fri, 6 Jun 2008 17:14:46 +0530

59 lines

New Thread

FW: [DC] Cadence / Mentor News?

FW: [DC] Cadence / Mentor News?

Barbara Burcham <[log in to unmask]>

Thu, 19 Jun 2008 08:20:50 -0500

206 lines

New Thread

FW: [tinwhiskers] IPC expresses concerns on possible ROHS revisions

FW: [tinwhiskers] IPC expresses concerns on possible ROHS revisions

John Burke <[log in to unmask]>

Thu, 26 Jun 2008 18:02:17 -0700

132 lines

New Thread

Glue Mask Requirements

Glue Mask Requirements

Natasha Baker <[log in to unmask]>

Mon, 16 Jun 2008 09:25:11 -0400

34 lines

Re: Glue Mask Requirements

Nowland, Russell Howard (Russell) <[log in to unmask]>

Mon, 16 Jun 2008 09:57:21 -0500

97 lines

Re: Glue Mask Requirements

Steve Gregory <[log in to unmask]>

Mon, 16 Jun 2008 10:05:20 -0500

80 lines

Re: Glue Mask Requirements

Stadem, Richard D. <[log in to unmask]>

Mon, 16 Jun 2008 11:46:44 -0500

123 lines

Re: Glue Mask Requirements

legg <[log in to unmask]>

Wed, 18 Jun 2008 10:42:22 -0500

35 lines

Re: Glue Mask Requirements

Ryan Grant <[log in to unmask]>

Mon, 23 Jun 2008 14:39:50 -0600

68 lines

New Thread

Hoping all is well with our TechNet friends in Cedar Rapids, Iowa

Hoping all is well with our TechNet friends in Cedar Rapids, Iowa

Joe Fjelstad <[log in to unmask]>

Thu, 12 Jun 2008 23:30:02 EDT

32 lines

Re: Hoping all is well with our TechNet friends in Cedar Rapids, Iowa

David D. Hillman <[log in to unmask]>

Fri, 13 Jun 2008 06:56:59 -0500

93 lines

Re: Hoping all is well with our TechNet friends in Cedar Rapids, Iowa

Gervascio, Thomas <[log in to unmask]>

Fri, 13 Jun 2008 10:52:29 -0400

133 lines

New Thread

Hurry and Register today for upcoming July Fabrication Workshops - Hosted by OMG Electronic Chemicals, Inc.

Hurry and Register today for upcoming July Fabrication Workshops - Hosted by OMG Electronic Chemicals, Inc.

Michelle Michelotti <[log in to unmask]>

Mon, 23 Jun 2008 09:56:13 -0500

156 lines

New Thread

Hurry Last chance to register for upcoming DFM workshop and Certification Workshops - Manchester, N.H.

Hurry Last chance to register for upcoming DFM workshop and Certification Workshops - Manchester, N.H.

Michelle Michelotti <[log in to unmask]>

Wed, 25 Jun 2008 13:41:51 -0500

42 lines

New Thread

Hurry Register today for IPC's Back to the Basics Summer School Webcast Series!

Hurry Register today for IPC's Back to the Basics Summer School Webcast Series!

Michelle Michelotti <[log in to unmask]>

Mon, 30 Jun 2008 14:24:50 -0500

66 lines

New Thread

Intermitent contact on LEDs

Intermitent contact on LEDs

Ioan Tempea <[log in to unmask]>

Tue, 3 Jun 2008 07:55:20 -0400

59 lines

Re: Intermitent contact on LEDs

Rex Waygood <[log in to unmask]>

Tue, 3 Jun 2008 13:16:20 +0100

118 lines

Re: Intermitent contact on LEDs

Werner Engelmaier /* <[log in to unmask]>

Tue, 3 Jun 2008 08:15:46 EDT

52 lines

Re: Intermitent contact on LEDs

Guy Ramsey <[log in to unmask]>

Tue, 3 Jun 2008 09:24:05 -0400

99 lines

Re: Intermitent contact on LEDs

John Burke <[log in to unmask]>

Tue, 3 Jun 2008 13:00:46 -0700

98 lines

New Thread

Intermittent contact on LEDs

Re: Intermittent contact on LEDs

Victor Hernandez <[log in to unmask]>

Tue, 3 Jun 2008 06:59:54 -0500

88 lines

New Thread

IPC 9701- table 4.4- failure definition

IPC 9701- table 4.4- failure definition

Tan Geok Ang <[log in to unmask]>

Fri, 27 Jun 2008 16:22:12 +0800

50 lines

Re: IPC 9701- table 4.4- failure definition

Werner Engelmaier /* <[log in to unmask]>

Fri, 27 Jun 2008 07:56:51 EDT

48 lines

Re: IPC 9701- table 4.4- failure definition

Tan Geok Ang <[log in to unmask]>

Fri, 27 Jun 2008 22:35:50 +0800

90 lines

Re: IPC 9701- table 4.4- failure definition

Werner Engelmaier /* <[log in to unmask]>

Fri, 27 Jun 2008 16:30:10 EDT

44 lines

Re: IPC 9701- table 4.4- failure definition

Tan Geok Ang <[log in to unmask]>

Sat, 28 Jun 2008 07:41:29 +0800

91 lines

Re: IPC 9701- table 4.4- failure definition

Werner Engelmaier /* <[log in to unmask]>

Sat, 28 Jun 2008 18:24:15 EDT

47 lines

Re: IPC 9701- table 4.4- failure definition

Tan Geok Ang <[log in to unmask]>

Sun, 29 Jun 2008 20:02:37 +0800

84 lines

New Thread

IPC MIDWEST - ONLINE REGISTRATION IS NOW OPEN!

IPC MIDWEST - ONLINE REGISTRATION IS NOW OPEN!

Media Relations <[log in to unmask]>

Thu, 12 Jun 2008 10:30:48 -0500

72 lines

New Thread

IPC Summer School Webcast Series: Back to the Basics

IPC Summer School Webcast Series: Back to the Basics

Tina Nerad <[log in to unmask]>

Thu, 26 Jun 2008 12:22:44 -0500

50 lines

New Thread

IPC-6012A - allowable conductor width reduction interpretation?

IPC-6012A - allowable conductor width reduction interpretation?

Joe Macko <[log in to unmask]>

Mon, 30 Jun 2008 09:45:13 -0700

46 lines

Re: IPC-6012A - allowable conductor width reduction interpretation?

Ryan Grant <[log in to unmask]>

Mon, 30 Jun 2008 13:43:32 -0600

86 lines

Re: IPC-6012A - allowable conductor width reduction interpretation?

Franklin D Asbell <[log in to unmask]>

Mon, 30 Jun 2008 17:01:47 -0500

122 lines

New Thread

Is there a good discrete wire support still made

Is there a good discrete wire support still made

Temkin, Gregg <[log in to unmask]>

Tue, 10 Jun 2008 07:33:12 -0700

55 lines

Re: Is there a good discrete wire support still made

Roger Stoops <[log in to unmask]>

Tue, 10 Jun 2008 10:48:13 -0400

82 lines

Re: Is there a good discrete wire support still made

Ken Bloomquist <[log in to unmask]>

Tue, 10 Jun 2008 08:20:30 -0700

82 lines

Re: Is there a good discrete wire support still made

Stadem, Richard D. <[log in to unmask]>

Tue, 10 Jun 2008 10:32:53 -0500

91 lines

Re: Is there a good discrete wire support still made

Tan Geok Ang <[log in to unmask]>

Thu, 12 Jun 2008 08:46:49 +0800

122 lines

Re: Is there a good discrete wire support still made

Kathy Kuhlow <[log in to unmask]>

Wed, 11 Jun 2008 21:03:05 -0500

143 lines

New Thread

Last Chance to Register for IPC Upcoming Design Conference

Last Chance to Register for IPC Upcoming Design Conference

Michelle Michelotti <[log in to unmask]>

Mon, 16 Jun 2008 09:11:56 -0500

91 lines

New Thread

Last Chance to Register for IPC's upcoming Design Conference June 23-25, 2008

Last Chance to Register for IPC's upcoming Design Conference June 23-25, 2008

Michelle Michelotti <[log in to unmask]>

Wed, 4 Jun 2008 09:48:49 -0500

60 lines

New Thread

Last chance to register for upcoming DFM workshop and Certification Workshops - Manchester, N.H.

Last chance to register for upcoming DFM workshop and Certification Workshops - Manchester, N.H.

Michelle Michelotti <[log in to unmask]>

Wed, 18 Jun 2008 14:11:59 -0500

40 lines

New Thread

Last Chance: Register for IPC's Technical Seminars at National Electronics Week, 17-19 June 2008, London

Last Chance: Register for IPC's Technical Seminars at National Electronics Week, 17-19 June 2008, London

Michelle Michelotti <[log in to unmask]>

Wed, 4 Jun 2008 13:24:20 -0500

73 lines

New Thread

Leakage on Tantalum Capacitor

Re: Leakage on Tantalum Capacitor

Kong Hui Poh <[log in to unmask]>

Wed, 25 Jun 2008 21:16:55 +0800

35 lines

Re: Leakage on Tantalum Capacitor

Inge <[log in to unmask]>

Wed, 25 Jun 2008 11:29:51 -0700

63 lines

New Thread

Looking for data tying rework (solder iron touch-up) with component or PCB failure

Looking for data tying rework (solder iron touch-up) with component or PCB failure

Alyn, Scott <[log in to unmask]>

Mon, 9 Jun 2008 11:56:53 -0700

34 lines

New Thread

Mehmet Emin Yaman işyeri dışında.

Mehmet Emin Yaman işyeri dışında.

Mehmet Emin Yaman <[log in to unmask]>

Mon, 23 Jun 2008 10:02:00 +0300

43 lines

New Thread

Moisture sensitive componentes & manufacturing documentation

Re: Moisture sensitive componentes & manufacturing documentation

- bogert <[log in to unmask]>

Sun, 8 Jun 2008 15:06:14 -0400

70 lines

Re: Moisture sensitive componentes & manufacturing documentation

Juan T. Marugán <[log in to unmask]>

Mon, 9 Jun 2008 07:39:08 -0500

34 lines

Re: Moisture sensitive componentes & manufacturing documentation

Gary Robinson <[log in to unmask]>

Mon, 9 Jun 2008 08:30:48 -0500

131 lines

New Thread

NTC - Tin Whiskers - how long? Size matters!

Re: NTC - Tin Whiskers - how long? Size matters!

Graham Collins <[log in to unmask]>

Fri, 13 Jun 2008 13:51:55 -0300

129 lines

Re: NTC - Tin Whiskers - how long? Size matters!

Joyce Koo <[log in to unmask]>

Fri, 13 Jun 2008 12:55:06 -0400

165 lines

New Thread

NTC - was SAC solder on Pb90Sn10

Re: NTC - was SAC solder on Pb90Sn10

Graham Collins <[log in to unmask]>

Thu, 26 Jun 2008 11:38:42 -0300

204 lines

New Thread

NTC - [TN] SAC solder on Pb90Sn10

Re: NTC - [TN] SAC solder on Pb90Sn10

David D. Hillman <[log in to unmask]>

Thu, 26 Jun 2008 07:27:59 -0500

162 lines

Re: NTC - [TN] SAC solder on Pb90Sn10

Douglas O. Pauls <[log in to unmask]>

Thu, 26 Jun 2008 07:34:49 -0500

210 lines

Re: NTC - [TN] SAC solder on Pb90Sn10

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Thu, 26 Jun 2008 06:57:26 -0700

253 lines

New Thread

ntc Edradour

Re: ntc Edradour

Stadem, Richard D. <[log in to unmask]>

Mon, 2 Jun 2008 09:58:56 -0500

83 lines

New Thread

NTC EU discord over EU rule

NTC EU discord over EU rule

John Burke <[log in to unmask]>

Fri, 13 Jun 2008 10:34:04 -0700

47 lines

Re: NTC EU discord over EU rule

R Sedlak <[log in to unmask]>

Fri, 13 Jun 2008 11:42:29 -0700

78 lines

Re: NTC EU discord over EU rule

Kong Hui Poh <[log in to unmask]>

Tue, 17 Jun 2008 22:45:54 +0800

102 lines

New Thread

NTC Friday

Re: NTC Friday

Ken Bloomquist <[log in to unmask]>

Fri, 27 Jun 2008 13:02:53 -0700

92 lines

New Thread

NTC Power amplifier growth

Re: NTC Power amplifier growth

Rex Waygood <[log in to unmask]>

Tue, 24 Jun 2008 13:35:04 +0100

166 lines

Re: NTC Power amplifier growth

Mike Sewell <[log in to unmask]>

Tue, 24 Jun 2008 07:55:54 -0500

194 lines

New Thread

NTC RE: [TN] Flame retardants ignite controversy - Posted without comment

NTC RE: [TN] Flame retardants ignite controversy - Posted without comment

Phil Nutting <[log in to unmask]>

Wed, 11 Jun 2008 10:41:34 -0400

100 lines

Re: NTC RE: [TN] Flame retardants ignite controversy - Posted without comment

John Burke <[log in to unmask]>

Wed, 11 Jun 2008 11:16:27 -0700

131 lines

New Thread

NTC Re: [TN] respirator cartridge for IPA

NTC Re: [TN] respirator cartridge for IPA

Joe Fjelstad <[log in to unmask]>

Wed, 18 Jun 2008 18:45:21 EDT

48 lines

New Thread

NTC RE: [TN] Stainless Steel Contamination Question - Source Nailed!

NTC RE: [TN] Stainless Steel Contamination Question - Source Nailed!

Bev Christian <[log in to unmask]>

Thu, 5 Jun 2008 10:25:37 -0400

83 lines

Re: NTC RE: [TN] Stainless Steel Contamination Question - Source Nailed!

Dwight Mattix <[log in to unmask]>

Thu, 5 Jun 2008 07:50:15 -0700

102 lines

New Thread

NTC [TN] Flame retardants ignite controversy - Posted without comment

Re: NTC [TN] Flame retardants ignite controversy - Posted without comment

Dharma Kemp-Bresett <[log in to unmask]>

Wed, 11 Jun 2008 13:55:11 -0400

320 lines

New Thread

NTC: Coefficients of thermal expansion

NTC: Coefficients of thermal expansion

Steve Gregory <[log in to unmask]>

Wed, 11 Jun 2008 15:02:18 -0500

64 lines

Re: NTC: Coefficients of thermal expansion

Craig Cullum <[log in to unmask]>

Wed, 11 Jun 2008 15:28:30 -0500

43 lines

Re: NTC: Coefficients of thermal expansion

Steve Gregory <[log in to unmask]>

Wed, 11 Jun 2008 15:31:52 -0500

118 lines

Re: NTC: Coefficients of thermal expansion

Dharma Kemp-Bresett <[log in to unmask]>

Wed, 11 Jun 2008 16:37:14 -0400

154 lines

Re: NTC: Coefficients of thermal expansion

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Thu, 12 Jun 2008 07:25:33 -0700

212 lines

Re: NTC: Coefficients of thermal expansion

Brian Ellis <[log in to unmask]>

Thu, 12 Jun 2008 18:30:26 +0300

230 lines

Re: NTC: Coefficients of thermal expansion

Phil Nutting <[log in to unmask]>

Thu, 12 Jun 2008 11:37:01 -0400

263 lines

Re: NTC: Coefficients of thermal expansion

Werner Engelmaier /* <[log in to unmask]>

Thu, 12 Jun 2008 15:13:31 EDT

33 lines

New Thread

NTC: The weekend is finally here!

NTC: The weekend is finally here!

Steve Gregory <[log in to unmask]>

Fri, 20 Jun 2008 07:04:48 -0500

38 lines

New Thread

packaging spec needed

packaging spec needed

John Burke <[log in to unmask]>

Thu, 26 Jun 2008 20:30:55 -0700

61 lines

New Thread

Paste 'spattering' issue.

Paste 'spattering' issue.

Peter Barton <[log in to unmask]>

Fri, 20 Jun 2008 08:05:00 +0100

80 lines

Re: Paste 'spattering' issue.

Brian Ellis <[log in to unmask]>

Fri, 20 Jun 2008 11:40:48 +0300

134 lines

Re: Paste 'spattering' issue.

Tan Geok Ang <[log in to unmask]>

Sun, 22 Jun 2008 20:03:23 +0800

130 lines

Re: Paste 'spattering' issue.

Stadem, Richard D. <[log in to unmask]>

Mon, 23 Jun 2008 08:18:55 -0500

114 lines

Re: Paste 'spattering' issue.

Guy Ramsey <[log in to unmask]>

Mon, 23 Jun 2008 11:18:04 -0400

148 lines

Re: Paste 'spattering' issue.

John Burke <[log in to unmask]>

Mon, 23 Jun 2008 09:43:49 -0700

135 lines

New Thread

PCB Laminate cost question

PCB Laminate cost question

Kathy Kuhlow <[log in to unmask]>

Fri, 6 Jun 2008 12:14:19 -0500

31 lines

New Thread

Power amplifier growth

Power amplifier growth

Dave Elder <[log in to unmask]>

Tue, 24 Jun 2008 17:00:45 +1200

68 lines

Re: Power amplifier growth

Guy Ramsey <[log in to unmask]>

Tue, 24 Jun 2008 05:03:37 -0400

66 lines

Re: Power amplifier growth

Thayer, Wayne <[log in to unmask]>

Tue, 24 Jun 2008 08:27:34 -0400

60 lines

Re: Power amplifier growth

Colin McVean <[log in to unmask]>

Tue, 24 Jun 2008 13:30:45 +0100

124 lines

Re: Power amplifier growth

Wenger, George M. <[log in to unmask]>

Tue, 24 Jun 2008 08:34:27 -0400

189 lines

Re: Power amplifier growth

Colin McVean <[log in to unmask]>

Tue, 24 Jun 2008 13:37:04 +0100

360 lines

Re: Power amplifier growth

Wenger, George M. <[log in to unmask]>

Tue, 24 Jun 2008 08:39:05 -0400

233 lines

Re: Power amplifier growth

Upton, Shawn <[log in to unmask]>

Tue, 24 Jun 2008 09:14:32 -0400

65 lines

Re: Power amplifier growth

Steve Gregory <[log in to unmask]>

Tue, 24 Jun 2008 08:32:22 -0500

70 lines

Re: Power amplifier growth

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Tue, 24 Jun 2008 08:26:55 -0700

98 lines

Re: Power amplifier growth

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Tue, 24 Jun 2008 08:32:24 -0700

74 lines

Re: Power amplifier growth

Joyce Koo <[log in to unmask]>

Tue, 24 Jun 2008 11:58:13 -0400

392 lines

Re: Power amplifier growth

Inge <[log in to unmask]>

Tue, 24 Jun 2008 11:28:46 -0700

75 lines

Re: Power amplifier growth

Dave Elder <[log in to unmask]>

Wed, 25 Jun 2008 07:55:09 +1200

125 lines

Re: Power amplifier growth

Wenger, George M. <[log in to unmask]>

Wed, 25 Jun 2008 08:10:18 -0400

118 lines

Re: Power amplifier growth

Inge <[log in to unmask]>

Wed, 25 Jun 2008 11:27:44 -0700

196 lines

Re: Power amplifier growth

Guy Ramsey <[log in to unmask]>

Wed, 25 Jun 2008 21:05:43 -0400

220 lines

Re: Power amplifier growth

Reuven Rokah <[log in to unmask]>

Thu, 26 Jun 2008 08:48:37 +0300

232 lines

Re: Power amplifier growth

Hernefjord Ingemar <[log in to unmask]>

Thu, 26 Jun 2008 09:23:41 +0200

259 lines

Re: Power amplifier growth

Steve Gregory <[log in to unmask]>

Thu, 26 Jun 2008 07:03:03 -0500

280 lines

Re: Power amplifier growth

Hernefjord Ingemar <[log in to unmask]>

Thu, 26 Jun 2008 14:38:43 +0200

309 lines

Re: Power amplifier growth

Steve Gregory <[log in to unmask]>

Thu, 26 Jun 2008 08:50:38 -0500

336 lines

Re: Power amplifier growth

Wenger, George M. <[log in to unmask]>

Thu, 26 Jun 2008 10:43:02 -0400

238 lines

Re: Power amplifier growth

Gary Robinson <[log in to unmask]>

Thu, 26 Jun 2008 12:57:39 -0500

349 lines

Re: Power amplifier growth

Creswick, Steven <[log in to unmask]>

Thu, 26 Jun 2008 14:02:05 -0400

62 lines

Re: Power amplifier growth

Gary Robinson <[log in to unmask]>

Thu, 26 Jun 2008 13:08:22 -0500

87 lines

Re: Power amplifier growth

Ted Tontis <[log in to unmask]>

Thu, 26 Jun 2008 13:16:06 -0500

95 lines

Re: Power amplifier growth

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Thu, 26 Jun 2008 11:18:46 -0700

421 lines

Re: Power amplifier growth

Charlie Pitarys <[log in to unmask]>

Thu, 26 Jun 2008 15:40:45 -0500

253 lines

New Thread

press fit connectors

press fit connectors

Linda Langley <[log in to unmask]>

Wed, 4 Jun 2008 12:34:58 -0400

44 lines

Re: press fit connectors

Kevin Glidden <[log in to unmask]>

Wed, 4 Jun 2008 13:54:30 -0400

87 lines

Re: press fit connectors

John Burke <[log in to unmask]>

Wed, 4 Jun 2008 11:16:43 -0700

115 lines

Re: press fit connectors

Kevin Glidden <[log in to unmask]>

Wed, 4 Jun 2008 14:34:23 -0400

135 lines

Re: press fit connectors

Steve Gregory <[log in to unmask]>

Wed, 4 Jun 2008 15:50:06 -0500

93 lines

Re: press fit connectors

Hernefjord Ingemar <[log in to unmask]>

Thu, 5 Jun 2008 09:56:49 +0200

119 lines

Re: press fit connectors

Steve Gregory <[log in to unmask]>

Thu, 5 Jun 2008 06:45:55 -0500

150 lines

Re: press fit connectors

Brian Chandler <[log in to unmask]>

Thu, 5 Jun 2008 06:48:22 -0500

40 lines

New Thread

Printing on Xerox 2--

Printing on Xerox 2--

Jack Crawford <[log in to unmask]>

Wed, 11 Jun 2008 10:02:08 -0500

33 lines

New Thread

QFN "Bumped" Pad Construction

QFN "Bumped" Pad Construction

bob wettermann <[log in to unmask]>

Mon, 2 Jun 2008 09:18:10 -0700

35 lines

Re: QFN "Bumped" Pad Construction

John Burke <[log in to unmask]>

Mon, 2 Jun 2008 11:29:06 -0700

76 lines

New Thread

REACH

REACH

Bill Clark <[log in to unmask]>

Fri, 27 Jun 2008 13:37:22 -0400

30 lines

Re: REACH

Bev Christian <[log in to unmask]>

Fri, 27 Jun 2008 13:56:52 -0400

80 lines

Re: REACH

Genny Gibbard <[log in to unmask]>

Fri, 27 Jun 2008 12:03:45 -0600

112 lines

Re: REACH

Bev Christian <[log in to unmask]>

Fri, 27 Jun 2008 14:32:40 -0400

150 lines

Re: REACH

John Burke <[log in to unmask]>

Fri, 27 Jun 2008 12:08:42 -0700

140 lines

Re: REACH

Genny Gibbard <[log in to unmask]>

Fri, 27 Jun 2008 13:54:33 -0600

188 lines

Re: REACH

R Sedlak <[log in to unmask]>

Fri, 27 Jun 2008 14:58:01 -0700

130 lines

Re: REACH

R Sedlak <[log in to unmask]>

Fri, 27 Jun 2008 15:00:26 -0700

183 lines

New Thread

Reflow specifications for PCB

Reflow specifications for PCB

Peter L <[log in to unmask]>

Mon, 2 Jun 2008 13:20:35 -0500

31 lines

Re: Reflow specifications for PCB

Werner Engelmaier /* <[log in to unmask]>

Mon, 2 Jun 2008 17:59:24 EDT

55 lines

Re: Reflow specifications for PCB

Paul Reid <[log in to unmask]>

Mon, 2 Jun 2008 18:58:07 -0400

143 lines

Re: Reflow specifications for PCB

Haynes, Kim <[log in to unmask]>

Mon, 2 Jun 2008 18:04:29 -0500

168 lines

Re: Reflow specifications for PCB

Paul Reid <[log in to unmask]>

Tue, 3 Jun 2008 08:03:19 -0400

259 lines

Re: Reflow specifications for PCB

Werner Engelmaier /* <[log in to unmask]>

Tue, 3 Jun 2008 08:26:59 EDT

49 lines

Re: Reflow specifications for PCB

Paul Reid <[log in to unmask]>

Tue, 3 Jun 2008 09:00:26 -0400

88 lines

New Thread

Register today for IPC's 5 Week Summer School Webcast Series: Back to the Basics

Register today for IPC's 5 Week Summer School Webcast Series: Back to the Basics

Michelle Michelotti <[log in to unmask]>

Thu, 12 Jun 2008 09:04:30 -0500

138 lines

New Thread

Register today for IPC's Back to the Basics Summer School Webcast Series!

Register today for IPC's Back to the Basics Summer School Webcast Series!

Michelle Michelotti <[log in to unmask]>

Thu, 19 Jun 2008 08:53:17 -0500

65 lines

New Thread

Register today for upcoming July Fabrication Workshops - Hosted by OMG Electronic Chemicals, Inc.

Register today for upcoming July Fabrication Workshops - Hosted by OMG Electronic Chemicals, Inc.

Michelle Michelotti <[log in to unmask]>

Mon, 2 Jun 2008 08:04:18 -0500

157 lines

Register today for upcoming July Fabrication Workshops - Hosted by OMG Electronic Chemicals, Inc.

Michelle Michelotti <[log in to unmask]>

Fri, 6 Jun 2008 09:10:43 -0500

159 lines

New Thread

Reliability of PCB including removable auxiliaty area with test points

Reliability of PCB including removable auxiliaty area with test points

Kirshenbaum Mordechai <[log in to unmask]>

Wed, 25 Jun 2008 06:25:42 -0500

31 lines

New Thread

Removing soldermask under SMT devices

Removing soldermask under SMT devices

Phil Nutting <[log in to unmask]>

Wed, 4 Jun 2008 12:33:49 -0400

44 lines

Re: Removing soldermask under SMT devices

Graham Collins <[log in to unmask]>

Wed, 4 Jun 2008 13:42:24 -0300

79 lines

Re: Removing soldermask under SMT devices

Gervascio, Thomas <[log in to unmask]>

Wed, 4 Jun 2008 13:34:06 -0400

84 lines

Re: Removing soldermask under SMT devices

Lenny Carter <[log in to unmask]>

Wed, 4 Jun 2008 14:02:52 -0400

80 lines

Re: Removing soldermask under SMT devices

John Maxwell <[log in to unmask]>

Wed, 4 Jun 2008 11:51:30 -0700

112 lines

Re: Removing soldermask under SMT devices

Phil Nutting <[log in to unmask]>

Wed, 4 Jun 2008 16:39:22 -0400

146 lines

Re: Removing soldermask under SMT devices

Ahne Oosterhof <[log in to unmask]>

Thu, 5 Jun 2008 08:10:30 -0700

81 lines

New Thread

Requirements for edge connector finish

Requirements for edge connector finish

김정철 <[log in to unmask]>

Wed, 4 Jun 2008 15:16:03 +0900

21 lines

Re: Requirements for edge connector finish

Sherif Refaat <[log in to unmask]>

Wed, 4 Jun 2008 12:36:12 -0400

54 lines

New Thread

Respirator Cartridge for IPA

Respirator Cartridge for IPA

Ken Bloomquist <[log in to unmask]>

Tue, 17 Jun 2008 06:55:45 -0700

34 lines

Re: Respirator Cartridge for IPA

Brian Ellis <[log in to unmask]>

Tue, 17 Jun 2008 17:19:04 +0300

57 lines

Re: Respirator Cartridge for IPA

Bev Christian <[log in to unmask]>

Tue, 17 Jun 2008 10:28:13 -0400

104 lines

Re: Respirator Cartridge for IPA

Matthias Mansfeld <[log in to unmask]>

Tue, 17 Jun 2008 16:31:40 +0200

97 lines

Re: Respirator Cartridge for IPA

Frederick Miller <[log in to unmask]>

Tue, 17 Jun 2008 12:21:13 -0400

68 lines

Re: Respirator Cartridge for IPA

Ken Bloomquist <[log in to unmask]>

Tue, 17 Jun 2008 09:37:21 -0700

64 lines

Re: Respirator Cartridge for IPA

Thayer, Wayne <[log in to unmask]>

Wed, 18 Jun 2008 06:16:48 -0400

132 lines

Re: Respirator Cartridge for IPA

Reuven Rokah <[log in to unmask]>

Wed, 18 Jun 2008 13:30:01 +0300

164 lines

Re: Respirator Cartridge for IPA

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Wed, 18 Jun 2008 06:40:22 -0700

162 lines

Re: Respirator Cartridge for IPA

Rex Waygood <[log in to unmask]>

Wed, 18 Jun 2008 15:00:24 +0100

96 lines

Re: respirator cartridge for IPA

[log in to unmask]

Wed, 18 Jun 2008 14:04:13 -0400

55 lines

Re: respirator cartridge for IPA

Ken Bloomquist <[log in to unmask]>

Wed, 18 Jun 2008 11:48:36 -0700

76 lines

Re: respirator cartridge for IPA

legg <[log in to unmask]>

Thu, 19 Jun 2008 08:34:09 -0500

30 lines

Re: respirator cartridge for IPA

Ken Bloomquist <[log in to unmask]>

Thu, 19 Jun 2008 07:13:09 -0700

47 lines

Re: respirator cartridge for IPA

Stadem, Richard D. <[log in to unmask]>

Thu, 19 Jun 2008 14:37:32 -0500

53 lines

Re: respirator cartridge for IPA

Ken Bloomquist <[log in to unmask]>

Thu, 19 Jun 2008 14:04:10 -0700

48 lines

New Thread

SAC Plated Passives with SnPb Solder Paste

SAC Plated Passives with SnPb Solder Paste

David Fischer <[log in to unmask]>

Fri, 20 Jun 2008 13:18:29 -0400

33 lines

Re: SAC Plated Passives with SnPb Solder Paste

Bob Willis <[log in to unmask]>

Sat, 21 Jun 2008 12:49:30 +0100

77 lines

Re: SAC Plated Passives with SnPb Solder Paste

Geert Willems <[log in to unmask]>

Sat, 21 Jun 2008 07:28:27 -0500

36 lines

Re: SAC Plated Passives with SnPb Solder Paste

Mike Fenner <[log in to unmask]>

Sat, 21 Jun 2008 17:41:43 +0100

86 lines

Re: SAC Plated Passives with SnPb Solder Paste

David Fischer <[log in to unmask]>

Sun, 22 Jun 2008 22:40:32 -0400

57 lines

Re: SAC Plated Passives with SnPb Solder Paste

Roberts, Jon <[log in to unmask]>

Mon, 23 Jun 2008 07:16:15 -0500

77 lines

Re: SAC Plated Passives with SnPb Solder Paste

Geert Willems <[log in to unmask]>

Mon, 23 Jun 2008 09:33:39 -0500

36 lines

Re: SAC Plated Passives with SnPb Solder Paste

Mike Fenner <[log in to unmask]>

Mon, 23 Jun 2008 17:13:17 +0100

108 lines

New Thread

SAC solder on Pb90Sn10

SAC solder on Pb90Sn10

Gumpert, Ben <[log in to unmask]>

Tue, 24 Jun 2008 13:42:13 -0400

28 lines

Re: SAC solder on Pb90Sn10

Stadem, Richard D. <[log in to unmask]>

Tue, 24 Jun 2008 13:40:38 -0500

61 lines

Re: SAC solder on Pb90Sn10

jonathan noquil <[log in to unmask]>

Wed, 25 Jun 2008 11:04:33 +0800

95 lines

Re: SAC solder on Pb90Sn10

Gumpert, Ben <[log in to unmask]>

Wed, 25 Jun 2008 12:00:40 -0400

135 lines

Re: SAC solder on Pb90Sn10

Werner Engelmaier /* <[log in to unmask]>

Wed, 25 Jun 2008 13:49:33 EDT

35 lines

Re: SAC solder on Pb90Sn10

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Wed, 25 Jun 2008 12:49:50 -0700

64 lines

Re: SAC solder on Pb90Sn10

jonathan noquil <[log in to unmask]>

Thu, 26 Jun 2008 11:30:24 +0800

161 lines

Re: SAC solder on Pb90Sn10

Douglas O. Pauls <[log in to unmask]>

Thu, 26 Jun 2008 07:16:56 -0500

116 lines

Re: SAC solder on Pb90Sn10

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Thu, 26 Jun 2008 07:21:49 -0700

148 lines

Re: SAC solder on Pb90Sn10

Stadem, Richard D. <[log in to unmask]>

Thu, 26 Jun 2008 09:27:47 -0500

175 lines

New Thread

Singulation of Aluminum PCBs

Singulation of Aluminum PCBs

Ioan Tempea <[log in to unmask]>

Thu, 26 Jun 2008 16:00:16 -0400

55 lines

Re: Singulation of Aluminum PCBs

Ted Tontis <[log in to unmask]>

Thu, 26 Jun 2008 15:18:10 -0500

93 lines

Re: Singulation of Aluminum PCBs

Mike Sewell <[log in to unmask]>

Thu, 26 Jun 2008 15:27:13 -0500

89 lines

Re: Singulation of Aluminum PCBs

Hernefjord Ingemar <[log in to unmask]>

Fri, 27 Jun 2008 09:45:41 +0200

82 lines

Re: Singulation of Aluminum PCBs

Tan Geok Ang <[log in to unmask]>

Fri, 27 Jun 2008 16:25:24 +0800

114 lines

Re: Singulation of Aluminum PCBs

Ioan Tempea <[log in to unmask]>

Fri, 27 Jun 2008 09:18:16 -0400

104 lines

New Thread

SN100 for Reflow Application

SN100 for Reflow Application

Kane, Amol (349) <[log in to unmask]>

Tue, 17 Jun 2008 16:05:56 -0400

61 lines

Re: SN100 for Reflow Application

John Maxwell <[log in to unmask]>

Tue, 17 Jun 2008 13:28:08 -0700

69 lines

Re: SN100 for Reflow Application

Werner Engelmaier /* <[log in to unmask]>

Tue, 17 Jun 2008 16:32:39 EDT

53 lines

Re: SN100 for Reflow Application

Kane, Amol (349) <[log in to unmask]>

Wed, 18 Jun 2008 09:27:18 -0400

72 lines

Re: SN100 for Reflow Application

Igoshev, Vladimir <[log in to unmask]>

Wed, 18 Jun 2008 13:38:58 -0400

87 lines

Re: SN100 for Reflow Application

Werner Engelmaier /* <[log in to unmask]>

Wed, 18 Jun 2008 16:53:28 EDT

44 lines

Re: SN100 for Reflow Application

Igoshev, Vladimir <[log in to unmask]>

Wed, 18 Jun 2008 16:54:43 -0400

63 lines

New Thread

Solder Mask Thickness

Solder Mask Thickness

Wood Kenneth <[log in to unmask]>

Fri, 6 Jun 2008 07:30:28 -0400

42 lines

Re: Solder Mask Thickness

Jim Mahoney <[log in to unmask]>

Thu, 12 Jun 2008 11:19:24 -0500

32 lines

New Thread

Solder-NiAu interface failure

Solder-NiAu interface failure

Geert Willems <[log in to unmask]>

Fri, 20 Jun 2008 04:05:15 -0500

84 lines

Re: Solder-NiAu interface failure

Igoshev, Vladimir <[log in to unmask]>

Fri, 20 Jun 2008 10:15:22 -0400

101 lines

New Thread

Solithane coating dewetting

Solithane coating dewetting

Tan Geok Ang <[log in to unmask]>

Thu, 26 Jun 2008 14:33:00 +0800

32 lines

Re: Solithane coating dewetting

Graham Naisbitt <[log in to unmask]>

Thu, 26 Jun 2008 12:05:11 +0100

62 lines

Re: Solithane coating dewetting

Douglas O. Pauls <[log in to unmask]>

Thu, 26 Jun 2008 07:29:58 -0500

126 lines

Re: Solithane coating dewetting

Joyce Koo <[log in to unmask]>

Thu, 26 Jun 2008 08:47:03 -0400

160 lines

Re: Solithane coating dewetting

Douglas O. Pauls <[log in to unmask]>

Thu, 26 Jun 2008 07:51:16 -0500

193 lines

Re: Solithane coating dewetting

Joyce Koo <[log in to unmask]>

Thu, 26 Jun 2008 08:54:04 -0400

228 lines

Re: Solithane coating dewetting

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Thu, 26 Jun 2008 07:09:30 -0700

168 lines

Re: Solithane coating dewetting

Tan Geok Ang <[log in to unmask]>

Fri, 27 Jun 2008 14:46:38 +0800

196 lines

New Thread

Space Station Malfunction

Re: Space Station Malfunction

Matthew Lamkin <[log in to unmask]>

Mon, 2 Jun 2008 08:42:38 +0100

78 lines

Re: Space Station Malfunction

Hernefjord Ingemar <[log in to unmask]>

Mon, 2 Jun 2008 13:17:28 +0200

112 lines

Re: Space Station Malfunction

Eric CHRISTISON <[log in to unmask]>

Mon, 2 Jun 2008 13:10:13 +0100

152 lines

Re: Space Station Malfunction

Hernefjord Ingemar <[log in to unmask]>

Mon, 2 Jun 2008 14:16:49 +0200

181 lines

Re: Space Station Malfunction

Karl Hunsinger <[log in to unmask]>

Mon, 2 Jun 2008 08:19:14 -0400

28 lines

Re: Space Station Malfunction

Stadem, Richard D. <[log in to unmask]>

Mon, 2 Jun 2008 07:37:53 -0500

132 lines

Re: Space Station Malfunction

Stadem, Richard D. <[log in to unmask]>

Mon, 2 Jun 2008 07:41:23 -0500

54 lines

New Thread

Space Station Malfunction NTC

Re: Space Station Malfunction NTC

Mike Fenner <[log in to unmask]>

Mon, 2 Jun 2008 14:40:49 +0100

200 lines

Re: Space Station Malfunction NTC

Robert Lazzara <[log in to unmask]>

Mon, 2 Jun 2008 09:59:26 EDT

36 lines

Re: Space Station Malfunction NTC

Ian Hanna <[log in to unmask]>

Mon, 2 Jun 2008 10:39:27 -0400

69 lines

New Thread

Stainless Steel Contamination Question - Source Nailed!

Stainless Steel Contamination Question - Source Nailed!

Leland Woodall <[log in to unmask]>

Thu, 5 Jun 2008 10:14:53 -0400

45 lines

Re: Stainless Steel Contamination Question - Source Nailed!

Simonik, Dave R. (David) <[log in to unmask]>

Thu, 5 Jun 2008 10:24:03 -0400

116 lines

Re: Stainless Steel Contamination Question - Source Nailed!

Leland Woodall <[log in to unmask]>

Thu, 5 Jun 2008 10:39:04 -0400

126 lines

Re: Stainless Steel Contamination Question - Source Nailed!

Ken Bloomquist <[log in to unmask]>

Thu, 5 Jun 2008 07:58:49 -0700

24 lines

Re: Stainless Steel Contamination Question - Source Nailed!

Brian Ellis <[log in to unmask]>

Thu, 5 Jun 2008 17:59:36 +0300

61 lines

Re: Stainless Steel Contamination Question - Source Nailed!

Linda Langley <[log in to unmask]>

Thu, 5 Jun 2008 11:04:41 -0400

116 lines

Re: Stainless Steel Contamination Question - Source Nailed!

Stadem, Richard D. <[log in to unmask]>

Thu, 5 Jun 2008 11:30:08 -0500

68 lines

Re: Stainless Steel Contamination Question - Source Nailed!

John Burke <[log in to unmask]>

Thu, 5 Jun 2008 10:59:38 -0700

153 lines

New Thread

Stainless Steel Contamination Question - Source Revealed

Stainless Steel Contamination Question - Source Revealed

Leland Woodall <[log in to unmask]>

Thu, 5 Jun 2008 13:23:26 -0400

131 lines

Re: Stainless Steel Contamination Question - Source Revealed

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Thu, 5 Jun 2008 10:30:27 -0700

158 lines

Re: Stainless Steel Contamination Question - Source Revealed

Stadem, Richard D. <[log in to unmask]>

Thu, 5 Jun 2008 12:51:21 -0500

154 lines

Re: Stainless Steel Contamination Question - Source Revealed

Steve Gregory <[log in to unmask]>

Thu, 5 Jun 2008 13:01:39 -0500

187 lines

Re: Stainless Steel Contamination Question - Source Revealed

John Burke <[log in to unmask]>

Thu, 5 Jun 2008 11:09:45 -0700

165 lines

Re: Stainless Steel Contamination Question - Source Revealed

John Burke <[log in to unmask]>

Thu, 5 Jun 2008 11:12:36 -0700

215 lines

Re: Stainless Steel Contamination Question - Source Revealed

Dwight Mattix <[log in to unmask]>

Thu, 5 Jun 2008 11:12:18 -0700

148 lines

Re: Stainless Steel Contamination Question - Source Revealed

Ahne Oosterhof <[log in to unmask]>

Thu, 5 Jun 2008 12:33:49 -0700

159 lines

Re: Stainless Steel Contamination Question - Source Revealed

Leland Woodall <[log in to unmask]>

Thu, 5 Jun 2008 15:49:06 -0400

179 lines

Re: Stainless Steel Contamination Question - Source Revealed

Stadem, Richard D. <[log in to unmask]>

Thu, 5 Jun 2008 14:51:14 -0500

200 lines

Re: Stainless Steel Contamination Question - Source Revealed

John Burke <[log in to unmask]>

Thu, 5 Jun 2008 14:29:50 -0700

177 lines

Re: Stainless Steel Contamination Question - Source Revealed

[log in to unmask]

Thu, 5 Jun 2008 18:38:40 EDT

49 lines

Re: Stainless Steel Contamination Question - Source Revealed

John Burke <[log in to unmask]>

Thu, 5 Jun 2008 16:16:14 -0700

88 lines

Re: Stainless Steel Contamination Question - Source Revealed

Douglas O. Pauls <[log in to unmask]>

Thu, 5 Jun 2008 18:20:23 -0500

104 lines

Re: Stainless Steel Contamination Question - Source Revealed

Brian Ellis <[log in to unmask]>

Fri, 6 Jun 2008 08:47:02 +0300

126 lines

Re: Stainless Steel Contamination Question - Source Revealed

Rex Waygood <[log in to unmask]>

Fri, 6 Jun 2008 09:54:00 +0100

189 lines

Re: Stainless Steel Contamination Question - Source Revealed

Roberts, Jon <[log in to unmask]>

Fri, 6 Jun 2008 07:22:58 -0500

101 lines

Re: Stainless Steel Contamination Question - Source Revealed

Leland Woodall <[log in to unmask]>

Fri, 6 Jun 2008 11:09:12 -0400

136 lines

Re: Stainless Steel Contamination Question - Source Revealed

Stadem, Richard D. <[log in to unmask]>

Fri, 6 Jun 2008 11:20:43 -0500

150 lines

Re: Stainless Steel Contamination Question - Source Revealed

John Burke <[log in to unmask]>

Fri, 6 Jun 2008 13:18:54 -0700

84 lines

Re: Stainless Steel Contamination Question - Source Revealed

[log in to unmask]

Fri, 6 Jun 2008 18:16:18 EDT

78 lines

Re: Stainless Steel Contamination Question - Source Revealed

Brian Ellis <[log in to unmask]>

Sat, 7 Jun 2008 10:27:24 +0300

96 lines

New Thread

Tell the EU Commission How Much RoHS Changes Could Save You

Tell the EU Commission How Much RoHS Changes Could Save You

Sahar Osman-Sypher <[log in to unmask]>

Fri, 13 Jun 2008 14:22:38 -0500

70 lines

New Thread

Temperature of lead-free for hand soldering

Temperature of lead-free for hand soldering

Luan Nguyen <[log in to unmask]>

Thu, 26 Jun 2008 15:48:16 +0700

49 lines

Re: Temperature of lead-free for hand soldering

Hernefjord Ingemar <[log in to unmask]>

Thu, 26 Jun 2008 13:28:22 +0200

85 lines

Re: Temperature of lead-free for hand soldering

P. Langeveld <[log in to unmask]>

Thu, 26 Jun 2008 17:40:13 +0200

73 lines

New Thread

Terminology question

Terminology question

Franklin D Asbell <[log in to unmask]>

Wed, 11 Jun 2008 15:02:15 -0500

40 lines

New Thread

Terry Chicka is out of the office from 18:00 hrs today

Terry Chicka is out of the office from 18:00 hrs today

Terry Chicka <[log in to unmask]>

Fri, 13 Jun 2008 04:02:52 -0400

27 lines

New Thread

Test house for J-STD-020 testing

Test house for J-STD-020 testing

Kevin Glidden <[log in to unmask]>

Thu, 19 Jun 2008 11:57:54 -0400

36 lines

New Thread

Tin Whiskers - how long? Size matters!

Tin Whiskers - how long? Size matters!

Graham Collins <[log in to unmask]>

Thu, 12 Jun 2008 16:12:32 -0300

44 lines

Re: Tin Whiskers - how long? Size matters!

Steve Gregory <[log in to unmask]>

Thu, 12 Jun 2008 14:20:32 -0500

149 lines

Re: Tin Whiskers - how long? Size matters!

Ken Bloomquist <[log in to unmask]>

Thu, 12 Jun 2008 12:45:29 -0700

186 lines

Re: Tin Whiskers - how long? Size matters!

Roberts, Jon <[log in to unmask]>

Thu, 12 Jun 2008 16:00:39 -0500

92 lines

Re: Tin Whiskers - how long? Size matters!

Ahne Oosterhof <[log in to unmask]>

Thu, 12 Jun 2008 14:42:27 -0700

74 lines

Re: Tin Whiskers - how long? Size matters!

Brian Ellis <[log in to unmask]>

Fri, 13 Jun 2008 08:52:28 +0300

53 lines

Re: Tin Whiskers - how long? Size matters!

Joe Fjelstad <[log in to unmask]>

Fri, 13 Jun 2008 12:20:43 EDT

91 lines

Re: Tin Whiskers - how long? Size matters!

Inge <[log in to unmask]>

Sat, 14 Jun 2008 23:48:59 -0700

80 lines

New Thread

Tiny Bubbles

Tiny Bubbles

Ken Bloomquist <[log in to unmask]>

Mon, 2 Jun 2008 09:26:55 -0700

37 lines

Re: Tiny Bubbles

Lenny Carter <[log in to unmask]>

Mon, 2 Jun 2008 12:35:42 -0400

76 lines

Re: Tiny Bubbles

Kathy Kuhlow <[log in to unmask]>

Mon, 2 Jun 2008 11:52:37 -0500

66 lines

Re: Tiny Bubbles

Ken Bloomquist <[log in to unmask]>

Mon, 2 Jun 2008 09:58:07 -0700

40 lines

Re: Tiny Bubbles

Brian Ellis <[log in to unmask]>

Mon, 2 Jun 2008 20:07:48 +0300

56 lines

Re: Tiny Bubbles

Steve Gregory <[log in to unmask]>

Mon, 2 Jun 2008 12:14:20 -0500

71 lines

Re: Tiny Bubbles

Gallegos, Luis A. <[log in to unmask]>

Mon, 2 Jun 2008 12:14:26 -0500

111 lines

Re: Tiny Bubbles

Gallegos, Luis A. <[log in to unmask]>

Mon, 2 Jun 2008 12:26:12 -0500

149 lines

Re: Tiny Bubbles

Ken Bloomquist <[log in to unmask]>

Mon, 2 Jun 2008 10:32:43 -0700

45 lines

Re: Tiny Bubbles

Gallegos, Luis A. <[log in to unmask]>

Mon, 2 Jun 2008 12:41:06 -0500

114 lines

Re: Tiny Bubbles

Brian Ellis <[log in to unmask]>

Tue, 3 Jun 2008 09:16:29 +0300

88 lines

Re: Tiny Bubbles

Graham Naisbitt <[log in to unmask]>

Tue, 3 Jun 2008 17:03:55 +0100

96 lines

Re: Tiny Bubbles

Douglas O. Pauls <[log in to unmask]>

Tue, 3 Jun 2008 15:47:21 -0500

144 lines

Re: Tiny Bubbles

Graham Naisbitt <[log in to unmask]>

Wed, 4 Jun 2008 14:55:33 +0100

179 lines

New Thread

Vienna, Austria

Vienna, Austria

Werner Engelmaier /* <[log in to unmask]>

Thu, 26 Jun 2008 08:46:49 EDT

39 lines

New Thread

Visible Magnetic Fields

Visible Magnetic Fields

Jack Olson <[log in to unmask]>

Tue, 3 Jun 2008 15:01:53 -0500

33 lines

Re: Visible Magnetic Fields

Stadem, Richard D. <[log in to unmask]>

Tue, 3 Jun 2008 15:37:21 -0500

57 lines

Re: Visible Magnetic Fields

Paul Reid <[log in to unmask]>

Wed, 4 Jun 2008 08:05:39 -0400

60 lines

Re: Visible Magnetic Fields

Hernefjord Ingemar <[log in to unmask]>

Wed, 4 Jun 2008 14:38:31 +0200

93 lines

Re: Visible Magnetic Fields

Phil Nutting <[log in to unmask]>

Wed, 4 Jun 2008 08:54:08 -0400

123 lines

Re: Visible Magnetic Fields

Jean-François Bissonnette <[log in to unmask]>

Wed, 4 Jun 2008 08:56:04 -0400

136 lines

Re: Visible Magnetic Fields

Jack Olson <[log in to unmask]>

Wed, 4 Jun 2008 09:01:45 -0500

78 lines

Re: Visible Magnetic Fields

Jack Olson <[log in to unmask]>

Wed, 4 Jun 2008 09:14:34 -0500

48 lines

Re: Visible Magnetic Fields

Graham Naisbitt <[log in to unmask]>

Wed, 4 Jun 2008 15:16:58 +0100

108 lines

Re: Visible Magnetic Fields

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Wed, 4 Jun 2008 09:33:29 -0700

76 lines

Re: Visible Magnetic Fields

Phil Nutting <[log in to unmask]>

Wed, 4 Jun 2008 12:58:08 -0400

108 lines

Re: Visible Magnetic Fields

Inge <[log in to unmask]>

Wed, 4 Jun 2008 12:53:24 -0700

136 lines

Re: Visible Magnetic Fields

Victor Hernandez <[log in to unmask]>

Wed, 4 Jun 2008 14:57:20 -0500

176 lines

Re: Visible Magnetic Fields

Dharma Kemp-Bresett <[log in to unmask]>

Wed, 4 Jun 2008 15:58:56 -0400

176 lines

Re: Visible Magnetic Fields

Stadem, Richard D. <[log in to unmask]>

Wed, 4 Jun 2008 15:11:08 -0500

179 lines

Re: Visible Magnetic Fields

Hernefjord Ingemar <[log in to unmask]>

Thu, 5 Jun 2008 09:44:23 +0200

203 lines

Re: Visible Magnetic Fields

Mike Fenner <[log in to unmask]>

Thu, 5 Jun 2008 14:49:00 +0100

129 lines

Re: Visible Magnetic Fields

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Thu, 5 Jun 2008 10:16:37 -0700

205 lines

Re: Visible Magnetic Fields

Kathy Kuhlow <[log in to unmask]>

Thu, 5 Jun 2008 12:45:20 -0500

206 lines

Re: Visible Magnetic Fields

Inge <[log in to unmask]>

Wed, 4 Jun 2008 13:44:47 -0700

204 lines

New Thread

Visible Magnetic Fields [Scanned]

Re: Visible Magnetic Fields [Scanned]

David Apsley <[log in to unmask]>

Wed, 4 Jun 2008 15:07:27 +0100

181 lines

New Thread

Wave Solder Nozzle Parallelism Tool

Wave Solder Nozzle Parallelism Tool

Chris Schaefer <[log in to unmask]>

Tue, 10 Jun 2008 13:44:47 -0500

49 lines

New Thread

Way to discriminate 'date code' on PCB after assembly

Way to discriminate 'date code' on PCB after assembly

김정철 <[log in to unmask]>

Fri, 20 Jun 2008 09:13:08 +0900

23 lines

New Thread

[LF] [TN] SN100 for Reflow Application

Re: [LF] [TN] SN100 for Reflow Application

Kane, Amol (349) <[log in to unmask]>

Wed, 18 Jun 2008 12:50:44 -0400

106 lines

Re: [LF] [TN] SN100 for Reflow Application

Igoshev, Vladimir <[log in to unmask]>

Wed, 18 Jun 2008 13:37:06 -0400

178 lines

Re: [LF] [TN] SN100 for Reflow Application

Ian Hanna <[log in to unmask]>

Wed, 18 Jun 2008 13:56:18 -0400

202 lines

Re: [LF] [TN] SN100 for Reflow Application

Stadem, Richard D. <[log in to unmask]>

Wed, 18 Jun 2008 13:09:41 -0500

187 lines

Re: [LF] [TN] SN100 for Reflow Application

Igoshev, Vladimir <[log in to unmask]>

Wed, 18 Jun 2008 14:21:31 -0400

226 lines

Re: [LF] [TN] SN100 for Reflow Application

Igoshev, Vladimir <[log in to unmask]>

Wed, 18 Jun 2008 17:12:15 -0400

24 lines

Re: [LF] [TN] SN100 for Reflow Application

Werner Engelmaier /* <[log in to unmask]>

Wed, 18 Jun 2008 16:55:12 EDT

37 lines

Re: [LF] [TN] SN100 for Reflow Application

Igoshev, Vladimir <[log in to unmask]>

Wed, 18 Jun 2008 16:47:08 -0400

297 lines

Re: [LF] [TN] SN100 for Reflow Application

Igoshev, Vladimir <[log in to unmask]>

Wed, 18 Jun 2008 17:00:29 -0400

69 lines

Re: [LF] [TN] SN100 for Reflow Application

Igoshev, Vladimir <[log in to unmask]>

Thu, 19 Jun 2008 09:09:55 -0400

74 lines

Re: [LF] [TN] SN100 for Reflow Application

Stadem, Richard D. <[log in to unmask]>

Thu, 19 Jun 2008 08:14:26 -0500

98 lines

Re: [LF] [TN] SN100 for Reflow Application

Kane, Amol (349) <[log in to unmask]>

Thu, 19 Jun 2008 10:04:44 -0400

84 lines

Re: [LF] [TN] SN100 for Reflow Application

Igoshev, Vladimir <[log in to unmask]>

Thu, 19 Jun 2008 10:19:00 -0400

138 lines

Re: [LF] [TN] SN100 for Reflow Application

Werner Engelmaier /* <[log in to unmask]>

Thu, 19 Jun 2008 17:13:15 EDT

61 lines

Re: [LF] [TN] SN100 for Reflow Application

Werner Engelmaier /* <[log in to unmask]>

Thu, 19 Jun 2008 17:30:04 EDT

45 lines

Re: [LF] [TN] SN100 for Reflow Application

Igoshev, Vladimir <[log in to unmask]>

Thu, 19 Jun 2008 18:42:01 -0400

38 lines

Re: [LF] [TN] SN100 for Reflow Application

Werner Engelmaier /* <[log in to unmask]>

Thu, 19 Jun 2008 18:56:11 EDT

56 lines

Re: [LF] [TN] SN100 for Reflow Application

Igoshev, Vladimir <[log in to unmask]>

Thu, 19 Jun 2008 19:03:43 -0400

44 lines

Re: [LF] [TN] SN100 for Reflow Application

Werner Engelmaier /* <[log in to unmask]>

Fri, 20 Jun 2008 04:05:16 EDT

47 lines

Re: [LF] [TN] SN100 for Reflow Application

Igoshev, Vladimir <[log in to unmask]>

Fri, 20 Jun 2008 10:03:00 -0400

86 lines

Re: [LF] [TN] SN100 for Reflow Application

Wenger, George M. <[log in to unmask]>

Fri, 20 Jun 2008 10:45:24 -0400

85 lines

Re: [LF] [TN] SN100 for Reflow Application

Kane, Amol (349) <[log in to unmask]>

Mon, 23 Jun 2008 08:27:36 -0400

135 lines

Re: [LF] [TN] SN100 for Reflow Application

Stadem, Richard D. <[log in to unmask]>

Mon, 23 Jun 2008 08:26:25 -0500

71 lines

Re: [LF] [TN] SN100 for Reflow Application

Werner Engelmaier /* <[log in to unmask]>

Mon, 23 Jun 2008 09:30:25 EDT

49 lines

Re: [LF] [TN] SN100 for Reflow Application

Igoshev, Vladimir <[log in to unmask]>

Mon, 23 Jun 2008 09:51:48 -0400

90 lines

New Thread

[NTC] An unfortunate sign of things to come...

Re: [NTC] An unfortunate sign of things to come...

Hernefjord Ingemar <[log in to unmask]>

Mon, 2 Jun 2008 09:20:57 +0200

220 lines

[NTC] An unfortunate sign of things to come...

EIMCNews <[log in to unmask]>

Mon, 2 Jun 2008 09:34:34 -0800

59 lines

Re: [NTC] An unfortunate sign of things to come...

Hernefjord Ingemar <[log in to unmask]>

Tue, 3 Jun 2008 09:42:15 +0200

89 lines

[NTC] An unfortunate sign of things to come...

R Sedlak <[log in to unmask]>

Tue, 3 Jun 2008 03:08:02 -0700

36 lines

Re: [NTC] An unfortunate sign of things to come...

Stadem, Richard D. <[log in to unmask]>

Tue, 3 Jun 2008 07:49:41 -0500

82 lines

Re: [NTC] An unfortunate sign of things to come...

Joe Fjelstad <[log in to unmask]>

Tue, 3 Jun 2008 12:57:45 EDT

45 lines

New Thread

[ntc] Space Station Malfunction

Re: [ntc] Space Station Malfunction

Guy Ramsey <[log in to unmask]>

Mon, 2 Jun 2008 08:22:26 -0400

202 lines

Re: [ntc] Space Station Malfunction

Werner Engelmaier /* <[log in to unmask]>

Mon, 2 Jun 2008 09:26:43 EDT

34 lines

Re: [ntc] Space Station Malfunction

Stadem, Richard D. <[log in to unmask]>

Mon, 2 Jun 2008 08:29:47 -0500

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