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January 2008


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Table of Contents:

% of Medical that is Pb-Free (1 message)
0.4mm, 0.5mm interposer / adaptor boards? (2 messages)
2nd request percent of industry using no-clean flux (2 messages)
Air bubble in solder resist (3 messages)
APEX/EXPO Workshops (1 message)
Baking PWB's to remove moisture (2 messages)
Bent leads on CCGA - Inspect with Panasonic CM602 (4 messages)
BGA underfill opens- the saga continues (9 messages)
Bottom side SMT adhesives (18 messages)
CAF resistant design guide?? (2 messages)
Catch up with the latest IPC has to offer! (1 message)
Check this out (3 messages)
Coating (6 messages)
Coffin-Manson (4 messages)
copper adhesion to ceramic substrate (4 messages)
CPK (1 message)
Decomposition Temperature (1 message)
Dougs articles on cleanliness (2 messages)
ECM or SIR - What Electrical test is best? (5 messages)
EU "simplification" (4 messages)
FEM to include the intermetallic layer! (3 messages)
Fiji AIM users and PPDplus (2 messages)
FW: Implementing Measures of the Korean RoHS Act Out in December 2007 (1 message)
FW: MSDS for women (1 message)
FW: MURPHY'S OTHER LAWS (6 messages)
FW: MURPHY'S OTHER LAWS NTC (7 messages)
FW: [KECE] Further implementing guidance on Korea RoHS/ELV delivered quickly (1 message)
FW: [LF] Korea RoHS Update (sort of) (2 messages)
FW: [LF] RoHS stakeholder consultation launched (1 message)
FW: [TN] EU "simplification" (1 message)
Fwd: Re: [TN] Air bubble in solder resist (6 messages)
galvanic compatibility (10 messages)
Henry Rekers is out of the office. (1 message)
hi-temp solder requirements (2 messages)
Humiseal UV40 Conformal Coating (8 messages)
Image of a B25 test Board (2 messages)
Informal poll (3 messages)
IPC 6013 (2 messages)
IPC call for nominations for awards - deadline is February 5, 2008 (1 message)
IPC International Conference on Flexible Circuits, February 12 - 14, 2008, Phoenix, Ariz, (1 message)
IPC International Conference on Flexible Circuits, February 12-14, 2008, Phoenix, Ariz. (1 message)
IPC Workshop: Design for Manufacture, Assembly and Test, Hosted by Hunter Technology - Santa Clara, Calif., February 26-27, 2008 (1 message)
ipc-6012B amendement (4 messages)
IPC-6013 final finish Class 1 or class 2 [FLEX] (2 messages)
IPC/JEDEC International Conference on Reliability, Rework and Repair of Lead-Free Electronics, March 11-12, 2008, Raleigh, N.C. (1 message)
IST for lead free assembly PCB monitoring (5 messages)
Join IPC at one of their upcoming events in California! (1 message)
Join IPC at one of their upcoming webcasts and get the latest information on these topics! (1 message)
Join IPC at their upcoming workshops in San Jose, CA! (1 message)
L0 flux classification (4 messages)
laser carbon residue (8 messages)
Lead-free HASL finishes (6 messages)
liquid imageable soldmask (8 messages)
Looking for Coating Comparison (9 messages)
Microvoids immersion silver (24 messages)
Module Quality Question (2 messages)
Molded silicone thermal sheets (5 messages)
More AuSn needle and platelet photos... (4 messages)
NTC Little bird "kooing" (12 messages)
NTC Solderability of Tin-Gold Intermetallic (1 message)
OSP w selective gold (18 messages)
Outgassing requirements and Polyimide material (1 message)
percent of industry using no-clean flux (1 message)
PolyChlorinated Bipheyl (1 message)
Polyester Dome Switch on Flex Circuit. (5 messages)
Randall L Bock/MSD/US/PBI is out of the office. (2 messages)
Raw PCB Insulation Resistance Test (1 message)
Recall: [TN] Used Equipment Sales (1 message)
Reflow profile development - correct starting temperature for evaluating TAL using non-eutectic solders (11 messages)
reflow soldering metal backed pcb (6 messages)
Solder fines (3 messages)
Solder thieves (6 messages)
Solderability of Tin-Gold Intermetallic (13 messages)
Solderability of Tin-Gold Intermetallic NTC (19 messages)
Solderability of Tin-Gold Intermetallic NTC Flash Floods Kill (2 messages)
Solderability of Tin-Gold Intermetallic, & NTC: Prius discussion... (3 messages)
Solderability of Tin-Gold Intermetallic, summing up (2 messages)
Soldering of Gold Finishes Reference (1 message)
Source for TO-5 cans for packaging custom components (2 messages)
specifying board cleanliness (21 messages)
Squeegee Studies (4 messages)
SV: [TN] Coffin-Manson (4 messages)
SV: [TN] copper adhesion to ceramic substrate (1 message)
SV: [TN] EU "simplification" (1 message)
SV: [TN] Reflow profile development - correct starting temperature for evaluating TAL using non-eutectic solders (5 messages)
SV: [TN] reflow soldering metal backed pcb (1 message)
SV: [TN] Solder fines (3 messages)
SV: [TN] Solderability of Tin-Gold Intermetallic (4 messages)
SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic (62 messages)
SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic - Hybrid Vehicles (2 messages)
SV: [TN] Warpage of components (9 messages)
TechNet Digest - 2 Jan 2008 to 3 Jan 2008 (#2008-3) (1 message)
Terry L Huddleston/ElecTec/Teledyne is out of the office. (1 message)
through hole current carrying capacity (2 messages)
Upcoming IPC events you should miss! Register today! (6 messages)
Upcoming IPC workshops in Bannockburn, Illinois! (1 message)
Upcoming IPC workshops on printed board technology! (1 message)
Used Equipment Sales (10 messages)
Warpage of components (13 messages)
Wedge bonds (4 messages)

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Subject Sorted by Subject, Chronologically

From

Date

Size

New Thread

% of Medical that is Pb-Free

% of Medical that is Pb-Free

Richard Kraszewski <[log in to unmask]>

Thu, 17 Jan 2008 12:04:50 -0500

31 lines

New Thread

0.4mm, 0.5mm interposer / adaptor boards?

Re: 0.4mm, 0.5mm interposer / adaptor boards?

Alan Young <[log in to unmask]>

Mon, 28 Jan 2008 17:09:53 -0500

34 lines

Re: 0.4mm, 0.5mm interposer / adaptor boards?

Dwight Mattix <[log in to unmask]>

Mon, 28 Jan 2008 15:00:02 -0800

49 lines

New Thread

2nd request percent of industry using no-clean flux

2nd request percent of industry using no-clean flux

Phil Nutting <[log in to unmask]>

Fri, 11 Jan 2008 14:24:43 -0500

45 lines

Re: 2nd request percent of industry using no-clean flux

Blair Hogg <[log in to unmask]>

Thu, 17 Jan 2008 10:43:15 -0600

26 lines

New Thread

Air bubble in solder resist

Air bubble in solder resist

Luan Nguyen <[log in to unmask]>

Wed, 9 Jan 2008 09:24:02 +0700

53 lines

Re: Air bubble in solder resist

Brian Ellis <[log in to unmask]>

Wed, 9 Jan 2008 08:37:58 +0200

75 lines

Re: Air bubble in solder resist

Luan Nguyen <[log in to unmask]>

Thu, 10 Jan 2008 08:32:31 +0700

109 lines

New Thread

APEX/EXPO Workshops

APEX/EXPO Workshops

Werner Engelmaier /* <[log in to unmask]>

Thu, 31 Jan 2008 14:46:35 EST

47 lines

New Thread

Baking PWB's to remove moisture

Re: Baking PWB's to remove moisture

Stadem, Richard D. <[log in to unmask]>

Wed, 2 Jan 2008 16:31:33 -0600

47 lines

Re: Baking PWB's to remove moisture

Stadem, Richard D. <[log in to unmask]>

Wed, 2 Jan 2008 16:46:45 -0600

73 lines

New Thread

Bent leads on CCGA - Inspect with Panasonic CM602

Bent leads on CCGA - Inspect with Panasonic CM602

Eric Castonguay <[log in to unmask]>

Wed, 16 Jan 2008 11:05:22 -0800

52 lines

Re: Bent leads on CCGA - Inspect with Panasonic CM602

John Burke <[log in to unmask]>

Wed, 16 Jan 2008 11:29:22 -0800

82 lines

Re: Bent leads on CCGA - Inspect with Panasonic CM602

John Burke <[log in to unmask]>

Wed, 16 Jan 2008 11:30:38 -0800

98 lines

Re: Bent leads on CCGA - Inspect with Panasonic CM602

Simonik, Dave R. (David) <[log in to unmask]>

Wed, 16 Jan 2008 14:37:44 -0500

151 lines

New Thread

BGA underfill opens- the saga continues

BGA underfill opens- the saga continues

Gervascio, Thomas <[log in to unmask]>

Thu, 31 Jan 2008 13:29:13 -0500

77 lines

Re: BGA underfill opens- the saga continues

Thayer, Wayne <[log in to unmask]>

Thu, 31 Jan 2008 13:42:03 -0500

107 lines

Re: BGA underfill opens- the saga continues

Guy Ramsey <[log in to unmask]>

Thu, 31 Jan 2008 13:55:08 -0500

102 lines

Re: BGA underfill opens- the saga continues

Werner Engelmaier /* <[log in to unmask]>

Thu, 31 Jan 2008 13:59:01 EST

56 lines

Re: BGA underfill opens- the saga continues

Bev Christian <[log in to unmask]>

Thu, 31 Jan 2008 15:22:26 -0500

141 lines

Re: BGA underfill opens- the saga continues

Igoshev, Vladimir <[log in to unmask]>

Thu, 31 Jan 2008 15:26:55 -0500

172 lines

Re: BGA underfill opens- the saga continues

Gervascio, Thomas <[log in to unmask]>

Thu, 31 Jan 2008 15:47:26 -0500

99 lines

Re: BGA underfill opens- the saga continues

John Burke <[log in to unmask]>

Thu, 31 Jan 2008 13:24:43 -0800

126 lines

Re: BGA underfill opens- the saga continues

Paul Edwards <[log in to unmask]>

Thu, 31 Jan 2008 13:51:25 -0800

156 lines

New Thread

Bottom side SMT adhesives

Bottom side SMT adhesives

Davis, Larry <[log in to unmask]>

Fri, 11 Jan 2008 09:37:33 -0800

42 lines

Re: Bottom side SMT adhesives

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Fri, 11 Jan 2008 10:56:22 -0700

70 lines

Re: Bottom side SMT adhesives

Douglas O. Pauls <[log in to unmask]>

Fri, 11 Jan 2008 13:06:45 -0600

111 lines

Re: Bottom side SMT adhesives

John Burke <[log in to unmask]>

Fri, 11 Jan 2008 11:20:21 -0800

97 lines

Re: Bottom side SMT adhesives

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Fri, 11 Jan 2008 12:24:52 -0700

143 lines

Re: Bottom side SMT adhesives

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Fri, 11 Jan 2008 13:28:42 -0700

132 lines

Re: Bottom side SMT adhesives

Davis, Larry <[log in to unmask]>

Fri, 11 Jan 2008 12:32:14 -0800

161 lines

Re: Bottom side SMT adhesives

Douglas O. Pauls <[log in to unmask]>

Fri, 11 Jan 2008 14:39:58 -0600

176 lines

Re: Bottom side SMT adhesives

Steve Gregory <[log in to unmask]>

Fri, 11 Jan 2008 14:41:09 -0600

194 lines

Re: Bottom side SMT adhesives

Karl Hunsinger <[log in to unmask]>

Fri, 11 Jan 2008 15:49:57 -0500

208 lines

Re: Bottom side SMT adhesives

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Fri, 11 Jan 2008 14:14:34 -0700

220 lines

Re: Bottom side SMT adhesives

Kelly Morris <[log in to unmask]>

Fri, 11 Jan 2008 15:26:22 -0600

32 lines

Re: Bottom side SMT adhesives

Bill Kunkle <[log in to unmask]>

Fri, 11 Jan 2008 17:04:11 -0500

61 lines

Re: Bottom side SMT adhesives

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Fri, 11 Jan 2008 15:08:23 -0700

60 lines

Re: Bottom side SMT adhesives

Tan Geok Ang <[log in to unmask]>

Tue, 15 Jan 2008 08:46:15 +0800

76 lines

Re: Bottom side SMT adhesives

Kathy Kuhlow <[log in to unmask]>

Mon, 14 Jan 2008 21:17:32 -0600

104 lines

Re: Bottom side SMT adhesives

Gary Camac <[log in to unmask]>

Tue, 15 Jan 2008 07:00:34 -0600

82 lines

Re: Bottom side SMT adhesives

Mike Fenner <[log in to unmask]>

Tue, 15 Jan 2008 15:08:53 -0000

118 lines

New Thread

CAF resistant design guide??

CAF resistant design guide??

Doug Carlson <[log in to unmask]>

Wed, 9 Jan 2008 20:35:21 -0600

37 lines

Re: CAF resistant design guide??

Rex Waygood <[log in to unmask]>

Thu, 10 Jan 2008 08:44:16 -0000

109 lines

New Thread

Catch up with the latest IPC has to offer!

Catch up with the latest IPC has to offer!

Tina Nerad <[log in to unmask]>

Tue, 29 Jan 2008 10:37:07 -0600

115 lines

New Thread

Check this out

Check this out

Henri Henderson <[log in to unmask]>

Wed, 16 Jan 2008 11:07:30 -0600

22 lines

Re: Check this out

Steve Gregory <[log in to unmask]>

Wed, 16 Jan 2008 12:33:03 -0600

52 lines

Re: Check this out

John Burke <[log in to unmask]>

Wed, 16 Jan 2008 11:00:00 -0800

79 lines

New Thread

Coating

Coating

Yannick Brisson <[log in to unmask]>

Wed, 9 Jan 2008 16:57:04 -0500

31 lines

Re: Coating

Douglas O. Pauls <[log in to unmask]>

Wed, 9 Jan 2008 15:59:41 -0600

79 lines

Re: Coating

Bev Christian <[log in to unmask]>

Wed, 9 Jan 2008 17:41:01 -0500

74 lines

Re: Coating

Thayer, Wayne <[log in to unmask]>

Wed, 9 Jan 2008 18:24:22 -0500

116 lines

Re: Coating

David Greenman <[log in to unmask]>

Thu, 10 Jan 2008 11:21:14 -0000

177 lines

Re: Coating

- bogert <[log in to unmask]>

Thu, 10 Jan 2008 18:29:07 -0500

209 lines

New Thread

Coffin-Manson

Re: Coffin-Manson

al shirazi <[log in to unmask]>

Wed, 23 Jan 2008 10:23:38 -0800

34 lines

Re: Coffin-Manson

Werner Engelmaier /* <[log in to unmask]>

Wed, 23 Jan 2008 18:28:12 EST

34 lines

Re: Coffin-Manson

Paul Reid <[log in to unmask]>

Thu, 24 Jan 2008 09:44:22 -0500

85 lines

Re: Coffin-Manson

Werner Engelmaier /* <[log in to unmask]>

Thu, 24 Jan 2008 10:26:44 EST

35 lines

New Thread

copper adhesion to ceramic substrate

copper adhesion to ceramic substrate

Fite,Jesse <[log in to unmask]>

Mon, 14 Jan 2008 14:25:31 -0500

41 lines

Re: copper adhesion to ceramic substrate

Lee parker <[log in to unmask]>

Mon, 14 Jan 2008 16:24:35 -0500

83 lines

Re: copper adhesion to ceramic substrate

Franklin Asbell <[log in to unmask]>

Mon, 14 Jan 2008 15:27:48 -0600

70 lines

Re: copper adhesion to ceramic substrate

Creswick, Steven <[log in to unmask]>

Tue, 15 Jan 2008 05:53:23 -0500

57 lines

New Thread

CPK

CPK

John Queen <[log in to unmask]>

Tue, 29 Jan 2008 14:53:18 -0000

86 lines

New Thread

Decomposition Temperature

Decomposition Temperature

Werner Engelmaier /* <[log in to unmask]>

Thu, 31 Jan 2008 12:32:29 EST

34 lines

New Thread

Dougs articles on cleanliness

Dougs articles on cleanliness

Douglas O. Pauls <[log in to unmask]>

Mon, 7 Jan 2008 13:15:20 -0600

25 lines

Re: Dougs articles on cleanliness

Drew meyer <[log in to unmask]>

Mon, 7 Jan 2008 13:23:56 -0600

27 lines

New Thread

ECM or SIR - What Electrical test is best?

ECM or SIR - What Electrical test is best?

Chris Schaefer <[log in to unmask]>

Thu, 10 Jan 2008 17:02:10 -0600

33 lines

Re: ECM or SIR - What Electrical test is best?

Christopher Nash <[log in to unmask]>

Fri, 11 Jan 2008 08:31:04 -0500

75 lines

Re: ECM or SIR - What Electrical test is best?

Richard Kraszewski <[log in to unmask]>

Fri, 11 Jan 2008 08:36:14 -0500

68 lines

Re: ECM or SIR - What Electrical test is best?

Douglas O. Pauls <[log in to unmask]>

Fri, 11 Jan 2008 07:59:29 -0600

112 lines

Re: ECM or SIR - What Electrical test is best?

Graham Naisbitt <[log in to unmask]>

Fri, 11 Jan 2008 14:08:49 +0000

152 lines

New Thread

EU "simplification"

EU "simplification"

John Burke <[log in to unmask]>

Fri, 18 Jan 2008 10:55:13 -0800

127 lines

Re: EU "simplification"

Dennis Fritz <[log in to unmask]>

Sat, 19 Jan 2008 17:39:09 EST

46 lines

Re: EU "simplification"

John Burke <[log in to unmask]>

Sat, 19 Jan 2008 17:13:30 -0800

80 lines

Re: EU "simplification"

Brian Ellis <[log in to unmask]>

Sun, 20 Jan 2008 11:03:35 +0200

188 lines

New Thread

FEM to include the intermetallic layer!

FEM to include the intermetallic layer!

al shirazi <[log in to unmask]>

Thu, 24 Jan 2008 07:48:05 -0800

60 lines

FEM to include the intermetallic layer!

al shirazi <[log in to unmask]>

Thu, 24 Jan 2008 07:50:43 -0800

108 lines

Re: FEM to include the intermetallic layer!

Werner Engelmaier /* <[log in to unmask]>

Thu, 24 Jan 2008 11:17:22 EST

49 lines

New Thread

Fiji AIM users and PPDplus

Fiji AIM users and PPDplus

Scott Lefebvre <[log in to unmask]>

Thu, 31 Jan 2008 08:34:29 -0800

33 lines

Re: Fiji AIM users and PPDplus

John Queen <[log in to unmask]>

Thu, 31 Jan 2008 17:02:17 -0000

69 lines

New Thread

FW: Implementing Measures of the Korean RoHS Act Out in December 2007

FW: Implementing Measures of the Korean RoHS Act Out in December 2007

John Burke <[log in to unmask]>

Wed, 2 Jan 2008 12:16:56 -0800

108 lines

New Thread

FW: MSDS for women

FW: MSDS for women

Rodney Miller <[log in to unmask]>

Wed, 2 Jan 2008 13:35:36 -0600

87 lines

New Thread

FW: MURPHY'S OTHER LAWS

FW: MURPHY'S OTHER LAWS

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Wed, 9 Jan 2008 13:09:57 -0700

132 lines

Re: FW: MURPHY'S OTHER LAWS

John Burke <[log in to unmask]>

Wed, 9 Jan 2008 12:48:24 -0800

168 lines

Re: FW: MURPHY'S OTHER LAWS

Douglas O. Pauls <[log in to unmask]>

Wed, 9 Jan 2008 14:54:24 -0600

213 lines

Re: FW: MURPHY'S OTHER LAWS

John Burke <[log in to unmask]>

Wed, 9 Jan 2008 14:35:27 -0800

250 lines

Re: FW: MURPHY'S OTHER LAWS

Hernefjord Ingemar <[log in to unmask]>

Thu, 10 Jan 2008 09:24:31 +0100

163 lines

Re: FW: MURPHY'S OTHER LAWS

Steve Gregory <[log in to unmask]>

Thu, 10 Jan 2008 06:35:15 -0600

198 lines

New Thread

FW: MURPHY'S OTHER LAWS NTC

Re: FW: MURPHY'S OTHER LAWS NTC

Mike Fenner <[log in to unmask]>

Thu, 10 Jan 2008 11:35:06 -0000

219 lines

Re: FW: MURPHY'S OTHER LAWS NTC

Bev Christian <[log in to unmask]>

Thu, 10 Jan 2008 06:41:50 -0500

268 lines

Re: FW: MURPHY'S OTHER LAWS NTC

Mike Fenner <[log in to unmask]>

Thu, 10 Jan 2008 14:34:21 -0000

308 lines

Re: FW: MURPHY'S OTHER LAWS NTC

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Thu, 10 Jan 2008 07:58:39 -0700

385 lines

Re: FW: MURPHY'S OTHER LAWS NTC

Bev Christian <[log in to unmask]>

Thu, 10 Jan 2008 10:06:45 -0500

423 lines

Re: FW: MURPHY'S OTHER LAWS NTC

John Burke <[log in to unmask]>

Thu, 10 Jan 2008 07:07:48 -0800

352 lines

Re: FW: MURPHY'S OTHER LAWS NTC

Mike Fenner <[log in to unmask]>

Thu, 10 Jan 2008 15:21:47 -0000

383 lines

New Thread

FW: [KECE] Further implementing guidance on Korea RoHS/ELV delivered quickly

FW: [KECE] Further implementing guidance on Korea RoHS/ELV delivered quickly

John Burke <[log in to unmask]>

Tue, 8 Jan 2008 12:52:16 -0800

82 lines

New Thread

FW: [LF] Korea RoHS Update (sort of)

FW: [LF] Korea RoHS Update (sort of)

John Burke <[log in to unmask]>

Wed, 30 Jan 2008 16:25:12 -0800

114 lines

Re: FW: [LF] Korea RoHS Update (sort of)

Randy Bock Sr. <[log in to unmask]>

Thu, 31 Jan 2008 07:35:32 -0500

176 lines

New Thread

FW: [LF] RoHS stakeholder consultation launched

FW: [LF] RoHS stakeholder consultation launched

John Burke <[log in to unmask]>

Mon, 28 Jan 2008 07:57:45 -0800

110 lines

New Thread

FW: [TN] EU "simplification"

FW: [TN] EU "simplification"

Mike Fenner <[log in to unmask]>

Mon, 21 Jan 2008 13:42:19 -0000

223 lines

New Thread

Fwd: Re: [TN] Air bubble in solder resist

Fwd: Re: [TN] Air bubble in solder resist

Luan Nguyen <[log in to unmask]>

Thu, 10 Jan 2008 09:49:56 +0700

136 lines

Re: Fwd: Re: [TN] Air bubble in solder resist

HuGause <[log in to unmask]>

Thu, 10 Jan 2008 13:14:49 +0800

43 lines

Re: Fwd: Re: [TN] Air bubble in solder resist

Brian Ellis <[log in to unmask]>

Thu, 10 Jan 2008 09:45:04 +0200

163 lines

Re: Fwd: Re: [TN] Air bubble in solder resist

Stadem, Richard D. <[log in to unmask]>

Thu, 10 Jan 2008 06:27:50 -0600

157 lines

Re: Fwd: Re: [TN] Air bubble in solder resist

Steve Gregory <[log in to unmask]>

Thu, 10 Jan 2008 06:39:37 -0600

183 lines

Re: Fwd: Re: [TN] Air bubble in solder resist

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Thu, 10 Jan 2008 07:14:47 -0700

201 lines

New Thread

galvanic compatibility

galvanic compatibility

Anat Douek <[log in to unmask]>

Wed, 30 Jan 2008 15:37:03 +0200

27 lines

Re: galvanic compatibility

Ido Mashall <[log in to unmask]>

Wed, 30 Jan 2008 17:52:20 +0200

67 lines

Re: galvanic compatibility

Hernefjord Ingemar <[log in to unmask]>

Thu, 31 Jan 2008 09:29:12 +0100

74 lines

Re: galvanic compatibility

Anat Douek <[log in to unmask]>

Thu, 31 Jan 2008 11:45:01 +0200

99 lines

Re: galvanic compatibility

Hernefjord Ingemar <[log in to unmask]>

Thu, 31 Jan 2008 12:37:11 +0100

135 lines

Re: galvanic compatibility

Anat Douek <[log in to unmask]>

Thu, 31 Jan 2008 13:55:31 +0200

161 lines

Re: galvanic compatibility

Ido Mashall <[log in to unmask]>

Thu, 31 Jan 2008 14:15:44 +0200

195 lines

Re: galvanic compatibility

Brian Ellis <[log in to unmask]>

Thu, 31 Jan 2008 14:20:34 +0200

179 lines

Re: galvanic compatibility

Hernefjord Ingemar <[log in to unmask]>

Thu, 31 Jan 2008 13:47:05 +0100

194 lines

Re: galvanic compatibility

Anat Douek <[log in to unmask]>

Thu, 31 Jan 2008 15:33:13 +0200

213 lines

New Thread

Henry Rekers is out of the office.

Henry Rekers is out of the office.

[log in to unmask]

Sun, 20 Jan 2008 04:00:21 -0800

24 lines

New Thread

hi-temp solder requirements

hi-temp solder requirements

Phil Nutting <[log in to unmask]>

Thu, 17 Jan 2008 11:17:15 -0500

53 lines

Re: hi-temp solder requirements

Dale Ritzen <[log in to unmask]>

Thu, 17 Jan 2008 10:59:16 -0600

97 lines

New Thread

Humiseal UV40 Conformal Coating

Humiseal UV40 Conformal Coating

Kane, Amol (349) <[log in to unmask]>

Wed, 23 Jan 2008 07:41:01 -0500

54 lines

Re: Humiseal UV40 Conformal Coating

Kane, Amol (349) <[log in to unmask]>

Thu, 24 Jan 2008 07:15:59 -0500

121 lines

Re: Humiseal UV40 Conformal Coating

Graham Naisbitt <[log in to unmask]>

Fri, 25 Jan 2008 17:55:04 +0000

90 lines

Re: Humiseal UV40 Conformal Coating

Steve Gregory <[log in to unmask]>

Fri, 25 Jan 2008 12:39:20 -0600

130 lines

Re: Humiseal UV40 Conformal Coating

Kane, Amol (349) <[log in to unmask]>

Fri, 25 Jan 2008 15:56:39 -0500

194 lines

Re: Humiseal UV40 Conformal Coating

Graham Naisbitt <[log in to unmask]>

Wed, 30 Jan 2008 13:04:13 +0000

185 lines

Re: Humiseal UV40 Conformal Coating

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Wed, 30 Jan 2008 07:00:41 -0700

216 lines

Re: Humiseal UV40 Conformal Coating

Graham Naisbitt <[log in to unmask]>

Wed, 30 Jan 2008 14:57:32 +0000

237 lines

New Thread

Image of a B25 test Board

Image of a B25 test Board

Richard Kraszewski <[log in to unmask]>

Wed, 9 Jan 2008 10:30:35 -0500

29 lines

Re: Image of a B25 test Board

Joe Russeau <[log in to unmask]>

Wed, 9 Jan 2008 11:02:51 -0500

72 lines

New Thread

Informal poll

Informal poll

Franklin Asbell <[log in to unmask]>

Fri, 25 Jan 2008 09:03:00 -0600

46 lines

Re: Informal poll

Gary Ferrari <[log in to unmask]>

Fri, 25 Jan 2008 10:17:38 -0500

67 lines

Re: Informal Poll

Jack Olson <[log in to unmask]>

Mon, 28 Jan 2008 09:52:07 -0600

70 lines

New Thread

IPC 6013

IPC 6013

Steve Kelly <[log in to unmask]>

Mon, 28 Jan 2008 13:16:29 -0500

39 lines

Re: IPC 6013

David D. Hillman <[log in to unmask]>

Tue, 29 Jan 2008 07:32:54 -0600

87 lines

New Thread

IPC call for nominations for awards - deadline is February 5, 2008

IPC call for nominations for awards - deadline is February 5, 2008

Kim Sterling <[log in to unmask]>

Thu, 17 Jan 2008 11:09:42 -0600

100 lines

New Thread

IPC International Conference on Flexible Circuits, February 12 - 14, 2008, Phoenix, Ariz,

IPC International Conference on Flexible Circuits, February 12 - 14, 2008, Phoenix, Ariz,

Tina Nerad <[log in to unmask]>

Mon, 14 Jan 2008 10:27:25 -0600

42 lines

New Thread

IPC International Conference on Flexible Circuits, February 12-14, 2008, Phoenix, Ariz.

IPC International Conference on Flexible Circuits, February 12-14, 2008, Phoenix, Ariz.

Tina Nerad <[log in to unmask]>

Thu, 3 Jan 2008 15:24:18 -0600

49 lines

New Thread

IPC Workshop: Design for Manufacture, Assembly and Test, Hosted by Hunter Technology - Santa Clara, Calif., February 26-27, 2008

IPC Workshop: Design for Manufacture, Assembly and Test, Hosted by Hunter Technology - Santa Clara, Calif., February 26-27, 2008

Tina Nerad <[log in to unmask]>

Tue, 22 Jan 2008 14:57:22 -0600

54 lines

New Thread

ipc-6012B amendement

ipc-6012B amendement

Dave Seymour <[log in to unmask]>

Thu, 24 Jan 2008 16:27:43 -0500

62 lines

Re: ipc-6012B amendement

Franklin Asbell <[log in to unmask]>

Thu, 24 Jan 2008 16:09:20 -0600

97 lines

Re: ipc-6012B amendement

Dave Seymour <[log in to unmask]>

Thu, 24 Jan 2008 17:29:52 -0500

97 lines

Re: ipc-6012B amendement

Franklin Asbell <[log in to unmask]>

Thu, 24 Jan 2008 16:45:31 -0600

122 lines

New Thread

IPC-6013 final finish Class 1 or class 2 [FLEX]

IPC-6013 final finish Class 1 or class 2 [FLEX]

Eric Bonatti <[log in to unmask]>

Mon, 28 Jan 2008 11:23:04 -0500

49 lines

Re: IPC-6013 final finish Class 1 or class 2 [FLEX]

Frank Kimmey <[log in to unmask]>

Mon, 28 Jan 2008 09:06:57 -0800

91 lines

New Thread

IPC/JEDEC International Conference on Reliability, Rework and Repair of Lead-Free Electronics, March 11-12, 2008, Raleigh, N.C.

IPC/JEDEC International Conference on Reliability, Rework and Repair of Lead-Free Electronics, March 11-12, 2008, Raleigh, N.C.

Tina Nerad <[log in to unmask]>

Wed, 16 Jan 2008 13:38:09 -0600

56 lines

New Thread

IST for lead free assembly PCB monitoring

IST for lead free assembly PCB monitoring

HuGause <[log in to unmask]>

Fri, 11 Jan 2008 14:49:25 +0800

38 lines

Re: IST for lead free assembly PCB monitoring

Paul Reid <[log in to unmask]>

Mon, 14 Jan 2008 09:38:19 -0500

84 lines

Re: IST for lead free assembly PCB monitoring

Dwight Mattix <[log in to unmask]>

Mon, 14 Jan 2008 07:43:22 -0800

172 lines

Re: IST for lead free assembly PCB monitoring

HuGause <[log in to unmask]>

Tue, 15 Jan 2008 10:48:19 +0800

134 lines

Re: IST for lead free assembly PCB monitoring

Paul Reid <[log in to unmask]>

Tue, 15 Jan 2008 18:07:54 -0500

157 lines

New Thread

Join IPC at one of their upcoming events in California!

Join IPC at one of their upcoming events in California!

Tina Nerad <[log in to unmask]>

Fri, 11 Jan 2008 11:06:22 -0600

92 lines

New Thread

Join IPC at one of their upcoming webcasts and get the latest information on these topics!

Join IPC at one of their upcoming webcasts and get the latest information on these topics!

Tina Nerad <[log in to unmask]>

Thu, 3 Jan 2008 11:02:39 -0600

124 lines

New Thread

Join IPC at their upcoming workshops in San Jose, CA!

Join IPC at their upcoming workshops in San Jose, CA!

Tina Nerad <[log in to unmask]>

Wed, 2 Jan 2008 08:48:24 -0600

70 lines

New Thread

L0 flux classification

L0 flux classification

Guy Ramsey <[log in to unmask]>

Fri, 18 Jan 2008 13:44:14 -0500

27 lines

Re: L0 flux classification

Richard Kraszewski <[log in to unmask]>

Fri, 18 Jan 2008 13:56:58 -0500

64 lines

Re: L0 flux classification

Christopher Nash <[log in to unmask]>

Fri, 18 Jan 2008 14:11:56 -0500

58 lines

Re: L0 flux classification

Mike Fenner <[log in to unmask]>

Mon, 21 Jan 2008 09:04:04 -0000

58 lines

New Thread

laser carbon residue

laser carbon residue

Jim Henderson <[log in to unmask]>

Thu, 24 Jan 2008 15:49:01 -0500

47 lines

Re: laser carbon residue

Stadem, Richard D. <[log in to unmask]>

Thu, 24 Jan 2008 15:03:52 -0600

78 lines

Re: laser carbon residue

R Sedlak <[log in to unmask]>

Thu, 24 Jan 2008 14:25:56 -0800

70 lines

Re: laser carbon residue

John Burke <[log in to unmask]>

Thu, 24 Jan 2008 15:13:07 -0800

106 lines

Re: laser carbon residue

R Sedlak <[log in to unmask]>

Thu, 24 Jan 2008 15:44:35 -0800

125 lines

Re: laser carbon residue

John Burke <[log in to unmask]>

Thu, 24 Jan 2008 15:58:54 -0800

166 lines

Re: laser carbon residue

Hernefjord Ingemar <[log in to unmask]>

Fri, 25 Jan 2008 10:30:46 +0100

75 lines

Re: laser carbon residue

Joyce Koo <[log in to unmask]>

Fri, 25 Jan 2008 07:39:54 -0500

108 lines

New Thread

Lead-free HASL finishes

Lead-free HASL finishes

Stadem, Richard D. <[log in to unmask]>

Thu, 10 Jan 2008 14:53:38 -0600

42 lines

Re: Lead-free HASL finishes

Stadem, Richard D. <[log in to unmask]>

Thu, 10 Jan 2008 15:20:39 -0600

105 lines

Re: Lead-free HASL finishes

Bev Christian <[log in to unmask]>

Thu, 10 Jan 2008 17:04:12 -0500

142 lines

Re: Lead-free HASL finishes

David D. Hillman <[log in to unmask]>

Fri, 11 Jan 2008 08:04:35 -0600

149 lines

Re: Lead-free HASL finishes

Franklin Asbell <[log in to unmask]>

Fri, 11 Jan 2008 08:28:11 -0600

172 lines

Re: Lead-free HASL finishes

David D. Hillman <[log in to unmask]>

Fri, 11 Jan 2008 08:47:37 -0600

231 lines

New Thread

liquid imageable soldmask

liquid imageable soldmask

Dave Seymour <[log in to unmask]>

Wed, 2 Jan 2008 16:12:40 -0500

49 lines

Re: liquid imageable soldmask

Douglas O. Pauls <[log in to unmask]>

Thu, 3 Jan 2008 07:33:49 -0600

99 lines

Re: liquid imageable soldmask

Dave Seymour <[log in to unmask]>

Thu, 3 Jan 2008 09:36:47 -0500

135 lines

Re: liquid imageable soldmask

Colin McVean <[log in to unmask]>

Thu, 3 Jan 2008 14:50:34 -0000

190 lines

Re: liquid imageable soldmask

Douglas O. Pauls <[log in to unmask]>

Thu, 3 Jan 2008 08:51:35 -0600

195 lines

Re: liquid imageable soldmask

Colin McVean <[log in to unmask]>

Thu, 3 Jan 2008 15:13:29 -0000

233 lines

Re: liquid imageable soldmask

Afri Singh <[log in to unmask]>

Fri, 11 Jan 2008 11:57:32 -0500

102 lines

Re: liquid imageable soldmask

Jack Olson <[log in to unmask]>

Fri, 11 Jan 2008 15:02:39 -0600

55 lines

New Thread

Looking for Coating Comparison

Looking for Coating Comparison

Bill Kasprzak <[log in to unmask]>

Wed, 2 Jan 2008 11:06:44 -0500

35 lines

Re: Looking for Coating Comparison

Douglas O. Pauls <[log in to unmask]>

Wed, 2 Jan 2008 10:15:56 -0600

108 lines

Re: Looking for Coating Comparison

Kathy Kuhlow <[log in to unmask]>

Wed, 2 Jan 2008 10:18:03 -0600

134 lines

Re: Looking for Coating Comparison

David Greenman <[log in to unmask]>

Wed, 2 Jan 2008 18:09:57 -0000

190 lines

Re: Looking for Coating Comparison

Graham Naisbitt <[log in to unmask]>

Thu, 3 Jan 2008 11:11:13 +0000

174 lines

Re: Looking for Coating Comparison

Douglas O. Pauls <[log in to unmask]>

Thu, 3 Jan 2008 07:28:30 -0600

210 lines

Re: Looking for Coating Comparison

Bill Kasprzak <[log in to unmask]>

Thu, 3 Jan 2008 08:49:04 -0500

217 lines

Re: Looking for Coating Comparison

Douglas O. Pauls <[log in to unmask]>

Thu, 3 Jan 2008 08:02:51 -0600

276 lines

Re: Looking for Coating Comparison

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Thu, 3 Jan 2008 08:20:46 -0700

71 lines

New Thread

Microvoids immersion silver

Microvoids immersion silver

Gabriela Bogdan <[log in to unmask]>

Mon, 28 Jan 2008 19:30:16 +0200

29 lines

Re: Microvoids immersion silver

R Sedlak <[log in to unmask]>

Mon, 28 Jan 2008 09:51:44 -0800

54 lines

Re: Microvoids immersion silver

Gabriela Bogdan <[log in to unmask]>

Mon, 28 Jan 2008 20:02:38 +0200

95 lines

Re: Microvoids immersion silver

Lee parker <[log in to unmask]>

Mon, 28 Jan 2008 13:15:57 -0500

72 lines

Re: Microvoids immersion silver

Dennis Fritz <[log in to unmask]>

Mon, 28 Jan 2008 13:17:49 EST

74 lines

Re: Microvoids immersion silver

Gabriela Bogdan <[log in to unmask]>

Mon, 28 Jan 2008 20:30:09 +0200

119 lines

Re: Microvoids immersion silver

Lee parker <[log in to unmask]>

Mon, 28 Jan 2008 15:14:14 -0500

188 lines

Re: Microvoids immersion silver

Gabriela Bogdan <[log in to unmask]>

Tue, 29 Jan 2008 05:28:35 +0200

221 lines

Re: Microvoids immersion silver

Reuven Rokah <[log in to unmask]>

Tue, 29 Jan 2008 10:53:25 +0200

296 lines

Re: Microvoids immersion silver

George Milad <[log in to unmask]>

Tue, 29 Jan 2008 11:53:13 EST

48 lines

Re: Microvoids immersion silver

Gabriela Bogdan <[log in to unmask]>

Tue, 29 Jan 2008 19:49:02 +0200

319 lines

Re: Microvoids immersion silver

John Burke <[log in to unmask]>

Tue, 29 Jan 2008 10:24:20 -0800

88 lines

Re: Microvoids immersion silver

Werner Engelmaier /* <[log in to unmask]>

Tue, 29 Jan 2008 13:35:16 EST

41 lines

Re: Microvoids immersion silver

Gabriela Bogdan <[log in to unmask]>

Tue, 29 Jan 2008 20:49:08 +0200

53 lines

Re: Microvoids immersion silver

Stadem, Richard D. <[log in to unmask]>

Tue, 29 Jan 2008 13:30:59 -0600

74 lines

Re: Microvoids immersion silver

Werner Engelmaier /* <[log in to unmask]>

Tue, 29 Jan 2008 14:57:30 EST

41 lines

Re: Microvoids immersion silver

Wenger, George M. <[log in to unmask]>

Tue, 29 Jan 2008 14:59:01 -0500

86 lines

Re: Microvoids immersion silver

Stadem, Richard D. <[log in to unmask]>

Tue, 29 Jan 2008 14:51:52 -0600

95 lines

Re: Microvoids immersion silver

Werner Engelmaier /* <[log in to unmask]>

Tue, 29 Jan 2008 15:57:44 EST

33 lines

Re: Microvoids immersion silver

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Tue, 29 Jan 2008 14:06:32 -0700

101 lines

Re: Microvoids immersion silver

Stadem, Richard D. <[log in to unmask]>

Tue, 29 Jan 2008 15:06:30 -0600

57 lines

Re: Microvoids immersion silver

Igoshev, Vladimir <[log in to unmask]>

Tue, 29 Jan 2008 16:45:34 -0500

116 lines

Re: Microvoids immersion silver

Stadem, Richard D. <[log in to unmask]>

Wed, 30 Jan 2008 06:59:05 -0600

125 lines

Re: Microvoids immersion silver

Gabriela Bogdan <[log in to unmask]>

Wed, 30 Jan 2008 17:50:17 +0200

150 lines

New Thread

Module Quality Question

Module Quality Question

Stephen Ayotte <[log in to unmask]>

Thu, 17 Jan 2008 16:24:18 -0800

24 lines

Re: Module Quality Question

Yuan-chia Joyce Koo <[log in to unmask]>

Thu, 17 Jan 2008 20:43:32 -0500

48 lines

New Thread

Molded silicone thermal sheets

Molded silicone thermal sheets

Douglas O. Pauls <[log in to unmask]>

Tue, 29 Jan 2008 16:16:27 -0600

32 lines

Re: Molded silicone thermal sheets

stephengregory5849 <[log in to unmask]>

Tue, 29 Jan 2008 16:33:17 -0600

65 lines

Re: Molded silicone thermal sheets

Gumpert, Ben <[log in to unmask]>

Wed, 30 Jan 2008 06:23:23 -0500

101 lines

Re: Molded silicone thermal sheets

Hernefjord Ingemar <[log in to unmask]>

Wed, 30 Jan 2008 13:48:47 +0100

63 lines

Re: Molded silicone thermal sheets

Kevin Glidden <[log in to unmask]>

Wed, 30 Jan 2008 08:40:17 -0500

63 lines

New Thread

More AuSn needle and platelet photos...

More AuSn needle and platelet photos...

Steve Gregory <[log in to unmask]>

Thu, 17 Jan 2008 12:15:51 -0600

29 lines

Re: More AuSn needle and platelet photos...

Joyce Koo <[log in to unmask]>

Thu, 17 Jan 2008 14:17:01 -0500

46 lines

Re: More AuSn needle and platelet photos...

Steve Gregory <[log in to unmask]>

Thu, 17 Jan 2008 13:25:13 -0600

59 lines

Re: More AuSn needle and platelet photos...

John Burke <[log in to unmask]>

Thu, 17 Jan 2008 13:56:23 -0800

93 lines

New Thread

NTC Little bird "kooing"

NTC Little bird "kooing"

Bev Christian <[log in to unmask]>

Wed, 23 Jan 2008 17:48:57 -0500

36 lines

Re: NTC Little bird "kooing"

Frank Kimmey <[log in to unmask]>

Wed, 23 Jan 2008 14:51:14 -0800

44 lines

Re: NTC Little bird "kooing"

stephengregory5849 <[log in to unmask]>

Wed, 23 Jan 2008 17:01:59 -0600

72 lines

Re: NTC Little bird "kooing"

John Burke <[log in to unmask]>

Wed, 23 Jan 2008 15:13:20 -0800

84 lines

Re: NTC Little bird "kooing"

Joyce Koo <[log in to unmask]>

Wed, 23 Jan 2008 18:09:44 -0500

109 lines

Re: NTC Little bird "kooing"

Bev Christian <[log in to unmask]>

Wed, 23 Jan 2008 18:22:34 -0500

90 lines

Re: NTC Little bird "kooing"

Hernefjord Ingemar <[log in to unmask]>

Thu, 24 Jan 2008 08:53:15 +0100

62 lines

Re: NTC Little bird "kooing"

Douglas O. Pauls <[log in to unmask]>

Thu, 24 Jan 2008 07:54:28 -0600

103 lines

Re: NTC Little bird "kooing"

Steve Gregory <[log in to unmask]>

Thu, 24 Jan 2008 09:22:41 -0600

138 lines

Re: NTC Little bird "kooing"

Gervascio, Thomas <[log in to unmask]>

Thu, 24 Jan 2008 10:26:34 -0500

161 lines

Re: NTC Little bird "kooing"

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Mon, 28 Jan 2008 08:35:56 -0700

99 lines

Re: NTC Little bird "kooing"

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Mon, 28 Jan 2008 08:44:54 -0700

135 lines

New Thread

NTC Solderability of Tin-Gold Intermetallic

NTC Solderability of Tin-Gold Intermetallic

Stadem, Richard D. <[log in to unmask]>

Fri, 18 Jan 2008 08:18:37 -0600

334 lines

New Thread

OSP w selective gold

OSP w selective gold

Genny Gibbard <[log in to unmask]>

Thu, 3 Jan 2008 16:22:04 -0600

30 lines

Re: OSP w selective gold

Ryan Grant <[log in to unmask]>

Thu, 3 Jan 2008 17:52:11 -0700

136 lines

Re: OSP w selective gold

Reuven Rokah <[log in to unmask]>

Fri, 4 Jan 2008 09:30:08 +0200

171 lines

Re: OSP w selective gold

HuGause <[log in to unmask]>

Fri, 4 Jan 2008 15:33:12 +0800

46 lines

Re: OSP w selective gold

Tan Geok Ang <[log in to unmask]>

Fri, 4 Jan 2008 16:50:06 +0800

163 lines

Re: OSP w selective gold

Drew meyer <[log in to unmask]>

Fri, 4 Jan 2008 06:36:04 -0600

69 lines

Re: OSP w selective gold

Genny Gibbard <[log in to unmask]>

Fri, 4 Jan 2008 11:29:58 -0600

137 lines

Re: OSP w selective gold

Werner Engelmaier /* <[log in to unmask]>

Fri, 4 Jan 2008 13:11:36 EST

39 lines

Re: OSP w selective gold

Lee parker <[log in to unmask]>

Fri, 4 Jan 2008 19:06:18 -0500

69 lines

Re: OSP w selective gold

Phillip Bavaro <[log in to unmask]>

Mon, 7 Jan 2008 13:03:14 -0800

93 lines

Re: OSP w selective gold

Bev Christian <[log in to unmask]>

Mon, 7 Jan 2008 16:09:51 -0500

156 lines

Re: OSP w selective gold

Genny Gibbard <[log in to unmask]>

Mon, 7 Jan 2008 15:15:40 -0600

183 lines

Re: OSP w selective gold

Stadem, Richard D. <[log in to unmask]>

Mon, 7 Jan 2008 15:18:58 -0600

123 lines

Re: OSP w selective gold

Bev Christian <[log in to unmask]>

Mon, 7 Jan 2008 16:18:20 -0500

206 lines

Re: OSP w selective gold

Werner Engelmaier /* <[log in to unmask]>

Mon, 7 Jan 2008 16:23:06 EST

40 lines

Re: OSP w selective gold

Lee parker <[log in to unmask]>

Mon, 7 Jan 2008 16:44:15 -0500

127 lines

Re: OSP w selective gold

Ryan Grant <[log in to unmask]>

Tue, 8 Jan 2008 10:39:00 -0700

100 lines

Re: OSP w selective gold

George Milad <[log in to unmask]>

Tue, 8 Jan 2008 19:08:30 EST

45 lines

New Thread

Outgassing requirements and Polyimide material

Outgassing requirements and Polyimide material

Franklin Asbell <[log in to unmask]>

Thu, 31 Jan 2008 11:22:49 -0600

48 lines

New Thread

percent of industry using no-clean flux

percent of industry using no-clean flux

Phil Nutting <[log in to unmask]>

Mon, 7 Jan 2008 12:11:44 -0500

39 lines

New Thread

PolyChlorinated Bipheyl

PolyChlorinated Bipheyl

SUBSCRIBE TechNet Anonymous <[log in to unmask]>

Fri, 4 Jan 2008 06:12:51 -0600

39 lines

New Thread

Polyester Dome Switch on Flex Circuit.

Polyester Dome Switch on Flex Circuit.

mattyk <[log in to unmask]>

Tue, 15 Jan 2008 10:43:58 -0500

35 lines

Re: Polyester Dome Switch on Flex Circuit.

Roger Stoops <[log in to unmask]>

Tue, 15 Jan 2008 12:06:49 -0500

71 lines

Re: Polyester Dome Switch on Flex Circuit.

mattyk <[log in to unmask]>

Tue, 15 Jan 2008 15:05:28 -0500

83 lines

Re: Polyester Dome Switch on Flex Circuit.

Roger Stoops <[log in to unmask]>

Tue, 15 Jan 2008 16:25:26 -0500

119 lines

Re: Polyester Dome Switch on Flex Circuit.

mattyk <[log in to unmask]>

Wed, 16 Jan 2008 08:46:53 -0500

138 lines

New Thread

Randall L Bock/MSD/US/PBI is out of the office.

Randall L Bock/MSD/US/PBI is out of the office.

Randy Bock Sr. <[log in to unmask]>

Tue, 8 Jan 2008 03:16:17 -0500

21 lines

Randall L Bock/MSD/US/PBI is out of the office.

Randy Bock Sr. <[log in to unmask]>

Fri, 25 Jan 2008 05:14:19 -0500

23 lines

New Thread

Raw PCB Insulation Resistance Test

Raw PCB Insulation Resistance Test

Kevin Glidden <[log in to unmask]>

Tue, 29 Jan 2008 09:49:47 -0500

73 lines

New Thread

Recall: [TN] Used Equipment Sales

Recall: [TN] Used Equipment Sales

Sklenar Vit (AE/MFE3-AU) <[log in to unmask]>

Fri, 1 Feb 2008 11:39:01 +0800

25 lines

New Thread

Reflow profile development - correct starting temperature for evaluating TAL using non-eutectic solders

Reflow profile development - correct starting temperature for evaluating TAL using non-eutectic solders

Joe Macko <[log in to unmask]>

Mon, 7 Jan 2008 08:37:19 -0800

58 lines

Re: Reflow profile development - correct starting temperature for evaluating TAL using non-eutectic solders

Werner Engelmaier /* <[log in to unmask]>

Mon, 7 Jan 2008 11:55:43 EST

47 lines

Re: Reflow profile development - correct starting temperature for evaluating TAL using non-eutectic solders

Stadem, Richard D. <[log in to unmask]>

Mon, 7 Jan 2008 11:13:53 -0600

85 lines

Re: Reflow profile development - correct starting temperature for evaluating TAL using non-eutectic solders

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Tue, 8 Jan 2008 09:29:31 -0700

84 lines

Re: Reflow profile development - correct starting temperature for evaluating TAL using non-eutectic solders

Werner Engelmaier /* <[log in to unmask]>

Tue, 8 Jan 2008 11:54:53 EST

32 lines

Re: Reflow profile development - correct starting temperature for evaluating TAL using non-eutectic solders

Stadem, Richard D. <[log in to unmask]>

Tue, 8 Jan 2008 11:00:19 -0600

58 lines

Re: Reflow profile development - correct starting temperature for evaluating TAL using non-eutectic solders

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Tue, 8 Jan 2008 10:41:47 -0700

65 lines

Re: Reflow profile development - correct starting temperature for evaluating TAL using non-eutectic solders

John Burke <[log in to unmask]>

Tue, 8 Jan 2008 12:56:38 -0800

96 lines

Re: Reflow profile development - correct starting temperature for evaluating TAL using non-eutectic solders

Stadem, Richard D. <[log in to unmask]>

Tue, 8 Jan 2008 15:00:34 -0600

121 lines

Re: Reflow profile development - correct starting temperature for evaluating TAL using non-eutectic solders

Joe Macko <[log in to unmask]>

Wed, 9 Jan 2008 08:05:45 -0800

118 lines

Re: Reflow profile development - correct starting temperature for evaluating TAL using non-eutectic solders

Werner Engelmaier /* <[log in to unmask]>

Wed, 9 Jan 2008 13:22:25 EST

41 lines

New Thread

reflow soldering metal backed pcb

reflow soldering metal backed pcb

P. Langeveld <[log in to unmask]>

Wed, 2 Jan 2008 16:57:43 +0100

35 lines

Re: reflow soldering metal backed pcb

Werner Engelmaier /* <[log in to unmask]>

Wed, 2 Jan 2008 11:00:47 EST

40 lines

Re: reflow soldering metal backed pcb

Thayer, Wayne <[log in to unmask]>

Wed, 2 Jan 2008 12:51:15 -0500

66 lines

Re: reflow soldering metal backed pcb

John Maxwell <[log in to unmask]>

Wed, 2 Jan 2008 10:16:25 -0800

60 lines

Re: reflow soldering metal backed pcb

Werner Engelmaier /* <[log in to unmask]>

Wed, 2 Jan 2008 13:24:09 EST

32 lines

Re: reflow soldering metal backed pcb

Kevin Glidden <[log in to unmask]>

Wed, 2 Jan 2008 14:31:09 -0500

78 lines

New Thread

Solder fines

Solder fines

Sue Powers-hartman <[log in to unmask]>

Wed, 23 Jan 2008 09:58:17 -0600

29 lines

Re: Solder fines

Stadem, Richard D. <[log in to unmask]>

Wed, 23 Jan 2008 11:28:37 -0600

98 lines

Re: Solder fines

Stadem, Richard D. <[log in to unmask]>

Wed, 23 Jan 2008 13:37:21 -0600

57 lines

New Thread

Solder thieves

Solder thieves

Ioan Tempea <[log in to unmask]>

Mon, 21 Jan 2008 14:48:27 -0500

37 lines

Re: Solder thieves

Ahne Oosterhof <[log in to unmask]>

Tue, 22 Jan 2008 08:11:23 -0800

62 lines

Re: Solder thieves

Guy Ramsey <[log in to unmask]>

Tue, 22 Jan 2008 14:09:37 -0500

63 lines

Re: Solder thieves

Sauer, Steve (Xetron) <[log in to unmask]>

Tue, 22 Jan 2008 14:21:48 -0600

79 lines

Re: Solder thieves

Roberts, Jon <[log in to unmask]>

Tue, 22 Jan 2008 15:41:14 -0600

115 lines

Re: Solder thieves

Ioan Tempea <[log in to unmask]>

Wed, 23 Jan 2008 07:24:32 -0500

97 lines

New Thread

Solderability of Tin-Gold Intermetallic

Solderability of Tin-Gold Intermetallic

Bev Christian <[log in to unmask]>

Wed, 16 Jan 2008 08:52:05 -0500

40 lines

Re: Solderability of Tin-Gold Intermetallic

Wenger, George M. <[log in to unmask]>

Wed, 16 Jan 2008 09:02:45 -0500

71 lines

Re: Solderability of Tin-Gold Intermetallic

Bev Christian <[log in to unmask]>

Wed, 16 Jan 2008 09:04:12 -0500

112 lines

Re: Solderability of Tin-Gold Intermetallic

Wenger, George M. <[log in to unmask]>

Wed, 16 Jan 2008 09:20:00 -0500

109 lines

Re: Solderability of Tin-Gold Intermetallic

Igoshev, Vladimir <[log in to unmask]>

Wed, 16 Jan 2008 09:25:06 -0500

77 lines

Re: Solderability of Tin-Gold Intermetallic

Bev Christian <[log in to unmask]>

Wed, 16 Jan 2008 09:39:21 -0500

172 lines

Re: Solderability of Tin-Gold Intermetallic

Werner Engelmaier /* <[log in to unmask]>

Wed, 16 Jan 2008 18:09:37 EST

32 lines

Re: Solderability of Tin-Gold Intermetallic

Bev Christian <[log in to unmask]>

Wed, 16 Jan 2008 18:19:46 -0500

52 lines

Re: Solderability of Tin-Gold Intermetallic

Werner Engelmaier /* <[log in to unmask]>

Wed, 16 Jan 2008 18:23:34 EST

34 lines

Re: Solderability of Tin-Gold Intermetallic

Bev Christian <[log in to unmask]>

Wed, 16 Jan 2008 18:53:43 -0500

50 lines

Re: Solderability of Tin-Gold Intermetallic

Rex Waygood <[log in to unmask]>

Thu, 17 Jan 2008 08:41:48 -0000

107 lines

Re: Solderability of Tin-Gold Intermetallic

David D. Hillman <[log in to unmask]>

Thu, 17 Jan 2008 07:32:19 -0600

159 lines

Re: Solderability of Tin-Gold Intermetallic

Stadem, Richard D. <[log in to unmask]>

Thu, 17 Jan 2008 09:36:24 -0600

237 lines

New Thread

Solderability of Tin-Gold Intermetallic NTC

Solderability of Tin-Gold Intermetallic NTC

Bev Christian <[log in to unmask]>

Fri, 18 Jan 2008 10:09:06 -0500

348 lines

Re: Solderability of Tin-Gold Intermetallic NTC

Werner Engelmaier /* <[log in to unmask]>

Fri, 18 Jan 2008 15:57:04 EST

33 lines

Re: Solderability of Tin-Gold Intermetallic NTC

Genny Gibbard <[log in to unmask]>

Fri, 18 Jan 2008 15:06:16 -0600

42 lines

Re: Solderability of Tin-Gold Intermetallic NTC

Guy Ramsey <[log in to unmask]>

Fri, 18 Jan 2008 16:07:18 -0500

59 lines

Re: Solderability of Tin-Gold Intermetallic NTC

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Fri, 18 Jan 2008 14:29:33 -0700

27 lines

Re: Solderability of Tin-Gold Intermetallic NTC

Genny Gibbard <[log in to unmask]>

Fri, 18 Jan 2008 15:41:15 -0600

53 lines

Re: Solderability of Tin-Gold Intermetallic NTC

Craig Cullum <[log in to unmask]>

Fri, 18 Jan 2008 15:48:13 -0600

40 lines

Re: Solderability of Tin-Gold Intermetallic NTC

John Burke <[log in to unmask]>

Fri, 18 Jan 2008 13:48:19 -0800

73 lines

Re: Solderability of Tin-Gold Intermetallic NTC

Craig Cullum <[log in to unmask]>

Fri, 18 Jan 2008 15:51:37 -0600

44 lines

Re: Solderability of Tin-Gold Intermetallic NTC

Bev Christian <[log in to unmask]>

Fri, 18 Jan 2008 16:50:51 -0500

116 lines

Re: Solderability of Tin-Gold Intermetallic NTC

Bev Christian <[log in to unmask]>

Fri, 18 Jan 2008 17:03:10 -0500

104 lines

Re: Solderability of Tin-Gold Intermetallic NTC

Werner Engelmaier /* <[log in to unmask]>

Fri, 18 Jan 2008 17:05:03 EST

34 lines

Re: Solderability of Tin-Gold Intermetallic NTC

Werner Engelmaier /* <[log in to unmask]>

Fri, 18 Jan 2008 17:10:59 EST

33 lines

Re: Solderability of Tin-Gold Intermetallic NTC

Douglas O. Pauls <[log in to unmask]>

Fri, 18 Jan 2008 16:19:41 -0600

146 lines

Re: Solderability of Tin-Gold Intermetallic NTC

John Burke <[log in to unmask]>

Fri, 18 Jan 2008 14:41:52 -0800

194 lines

Re: Solderability of Tin-Gold Intermetallic NTC

Yuan-chia Joyce Koo <[log in to unmask]>

Fri, 18 Jan 2008 18:49:30 -0500

185 lines

Re: Solderability of Tin-Gold Intermetallic NTC

Brian Ellis <[log in to unmask]>

Sat, 19 Jan 2008 11:35:54 +0200

223 lines

Re: Solderability of Tin-Gold Intermetallic NTC

John Burke <[log in to unmask]>

Sat, 19 Jan 2008 09:35:02 -0800

256 lines

Re: Solderability of Tin-Gold Intermetallic NTC

Stadem, Richard D. <[log in to unmask]>

Mon, 21 Jan 2008 07:10:53 -0600

130 lines

New Thread

Solderability of Tin-Gold Intermetallic NTC Flash Floods Kill

Re: Solderability of Tin-Gold Intermetallic NTC Flash Floods Kill

Ed Popielarski <[log in to unmask]>

Sun, 20 Jan 2008 07:08:30 -0800

109 lines

Re: Solderability of Tin-Gold Intermetallic NTC Flash Floods Kill

Brian Ellis <[log in to unmask]>

Sun, 20 Jan 2008 17:55:29 +0200

133 lines

New Thread

Solderability of Tin-Gold Intermetallic, & NTC: Prius discussion...

Solderability of Tin-Gold Intermetallic, & NTC: Prius discussion...

Steve Gregory <[log in to unmask]>

Thu, 17 Jan 2008 08:25:31 -0600

44 lines

Re: Solderability of Tin-Gold Intermetallic, & NTC: Prius discussion...

Brian Ellis <[log in to unmask]>

Thu, 17 Jan 2008 17:58:21 +0200

90 lines

Re: Solderability of Tin-Gold Intermetallic, & NTC: Prius discussion...

Steve Gregory <[log in to unmask]>

Thu, 17 Jan 2008 10:30:06 -0600

115 lines

New Thread

Solderability of Tin-Gold Intermetallic, summing up

Solderability of Tin-Gold Intermetallic, summing up

Hfjord <[log in to unmask]>

Sat, 19 Jan 2008 00:18:04 +0100

115 lines

Re: Solderability of Tin-Gold Intermetallic, summing up

Bev Christian <[log in to unmask]>

Fri, 18 Jan 2008 18:43:59 -0500

127 lines

New Thread

Soldering of Gold Finishes Reference

Soldering of Gold Finishes Reference

David D. Hillman <[log in to unmask]>

Tue, 22 Jan 2008 11:39:34 -0600

34 lines

New Thread

Source for TO-5 cans for packaging custom components

Source for TO-5 cans for packaging custom components

McGlaughlin, Jeffrey A <[log in to unmask]>

Mon, 21 Jan 2008 15:35:08 -0500

36 lines

Re: Source for TO-5 cans for packaging custom components

Creswick, Steven <[log in to unmask]>

Tue, 22 Jan 2008 10:07:13 -0500

89 lines

New Thread

specifying board cleanliness

specifying board cleanliness

Phil Nutting <[log in to unmask]>

Thu, 3 Jan 2008 09:44:43 -0500

42 lines

Re: specifying board cleanliness

Douglas O. Pauls <[log in to unmask]>

Thu, 3 Jan 2008 09:00:40 -0600

108 lines

Re: specifying board cleanliness

Graham Collins <[log in to unmask]>

Thu, 3 Jan 2008 11:09:58 -0400

87 lines

Re: specifying board cleanliness

[log in to unmask]

Thu, 3 Jan 2008 11:34:34 EST

40 lines

Re: specifying board cleanliness

Tom Newton <[log in to unmask]>

Thu, 3 Jan 2008 10:36:26 -0600

126 lines

Re: specifying board cleanliness

Douglas O. Pauls <[log in to unmask]>

Thu, 3 Jan 2008 10:46:32 -0600

170 lines

Re: specifying board cleanliness

Graham Naisbitt <[log in to unmask]>

Thu, 3 Jan 2008 16:52:05 +0000

167 lines

Re: specifying board cleanliness

Douglas O. Pauls <[log in to unmask]>

Thu, 3 Jan 2008 11:47:46 -0600

143 lines

Re: specifying board cleanliness

Richard Kraszewski <[log in to unmask]>

Thu, 3 Jan 2008 15:35:46 -0500

205 lines

Re: specifying board cleanliness

Phil Nutting <[log in to unmask]>

Thu, 3 Jan 2008 13:05:23 -0500

125 lines

Re: specifying board cleanliness

Douglas O. Pauls <[log in to unmask]>

Thu, 3 Jan 2008 15:29:10 -0600

231 lines

Re: specifying board cleanliness

Terry L. Munson <[log in to unmask]>

Thu, 3 Jan 2008 18:08:11 EST

71 lines

Re: specifying board cleanliness

Wrobel, Clayton <[log in to unmask]>

Fri, 4 Jan 2008 09:48:02 -0500

92 lines

Re: specifying board cleanliness

Phil Nutting <[log in to unmask]>

Fri, 4 Jan 2008 09:54:31 -0500

137 lines

Re: specifying board cleanliness

- bogert <[log in to unmask]>

Sun, 6 Jan 2008 14:04:42 -0500

112 lines

Re: specifying board cleanliness

[log in to unmask]

Sun, 6 Jan 2008 23:56:42 EST

50 lines

Re: specifying board cleanliness

Brian Ellis <[log in to unmask]>

Mon, 7 Jan 2008 09:09:10 +0200

151 lines

Re: specifying board cleanliness

Graham Collins <[log in to unmask]>

Mon, 7 Jan 2008 09:00:05 -0400

158 lines

Re: specifying board cleanliness

Yuan-chia Joyce Koo <[log in to unmask]>

Mon, 7 Jan 2008 08:21:08 -0500

193 lines

Re: specifying board cleanliness

Graham Collins <[log in to unmask]>

Mon, 7 Jan 2008 09:51:11 -0400

148 lines

Re: specifying board cleanliness

Stadem, Richard D. <[log in to unmask]>

Mon, 7 Jan 2008 09:20:04 -0600

198 lines

New Thread

Squeegee Studies

Squeegee Studies

Leland Woodall <[log in to unmask]>

Thu, 17 Jan 2008 10:18:52 -0500

36 lines

Re: Squeegee Studies

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Thu, 17 Jan 2008 10:01:32 -0700

63 lines

Re: Squeegee Studies

John Burke <[log in to unmask]>

Thu, 17 Jan 2008 09:58:46 -0800

81 lines

Re: Squeegee Studies

Kathy Kuhlow <[log in to unmask]>

Thu, 17 Jan 2008 17:32:44 -0600

115 lines

New Thread

SV: [TN] Coffin-Manson

SV: [TN] Coffin-Manson

Hfjord <[log in to unmask]>

Wed, 23 Jan 2008 21:32:07 +0100

83 lines

Re: SV: [TN] Coffin-Manson

al shirazi <[log in to unmask]>

Wed, 23 Jan 2008 14:34:39 -0800

83 lines

Re: SV: [TN] Coffin-Manson

Werner Engelmaier /* <[log in to unmask]>

Wed, 23 Jan 2008 18:31:40 EST

36 lines

SV: [TN] Coffin-Manson

Hfjord <[log in to unmask]>

Thu, 24 Jan 2008 19:36:29 +0100

118 lines

New Thread

SV: [TN] copper adhesion to ceramic substrate

SV: [TN] copper adhesion to ceramic substrate

Hfjord <[log in to unmask]>

Mon, 14 Jan 2008 21:43:17 +0100

78 lines

New Thread

SV: [TN] EU "simplification"

SV: [TN] EU "simplification"

Hfjord <[log in to unmask]>

Sun, 20 Jan 2008 14:39:24 +0100

107 lines

New Thread

SV: [TN] Reflow profile development - correct starting temperature for evaluating TAL using non-eutectic solders

SV: [TN] Reflow profile development - correct starting temperature for evaluating TAL using non-eutectic solders

Hfjord <[log in to unmask]>

Mon, 7 Jan 2008 18:56:23 +0100

117 lines

Re: SV: [TN] Reflow profile development - correct starting temperature for evaluating TAL using non-eutectic solders

Stadem, Richard D. <[log in to unmask]>

Mon, 7 Jan 2008 12:29:38 -0600

137 lines

Re: SV: [TN] Reflow profile development - correct starting temperature for evaluating TAL using non-eutectic solders

Hernefjord Ingemar <[log in to unmask]>

Tue, 8 Jan 2008 09:15:54 +0100

160 lines

Re: SV: [TN] Reflow profile development - correct starting temperature for evaluating TAL using non-eutectic solders

Werner Engelmaier /* <[log in to unmask]>

Tue, 8 Jan 2008 08:20:13 EST

46 lines

SV: [TN] Reflow profile development - correct starting temperature for evaluating TAL using non-eutectic solders

Hfjord <[log in to unmask]>

Tue, 8 Jan 2008 18:18:31 +0100

67 lines

New Thread

SV: [TN] reflow soldering metal backed pcb

SV: [TN] reflow soldering metal backed pcb

Hfjord <[log in to unmask]>

Wed, 2 Jan 2008 21:27:15 +0100

94 lines

New Thread

SV: [TN] Solder fines

SV: [TN] Solder fines

Hfjord <[log in to unmask]>

Wed, 23 Jan 2008 19:21:51 +0100

134 lines

Re: SV: [TN] Solder fines

Stadem, Richard D. <[log in to unmask]>

Wed, 23 Jan 2008 12:50:03 -0600

177 lines

SV: [TN] Solder fines

Hfjord <[log in to unmask]>

Wed, 23 Jan 2008 21:11:30 +0100

113 lines

New Thread

SV: [TN] Solderability of Tin-Gold Intermetallic

SV: [TN] Solderability of Tin-Gold Intermetallic

Hfjord <[log in to unmask]>

Wed, 16 Jan 2008 19:35:36 +0100

226 lines

Re: SV: [TN] Solderability of Tin-Gold Intermetallic

Joyce Koo <[log in to unmask]>

Wed, 16 Jan 2008 13:56:47 -0500

232 lines

Re: SV: [TN] Solderability of Tin-Gold Intermetallic

Igoshev, Vladimir <[log in to unmask]>

Wed, 16 Jan 2008 14:07:11 -0500

307 lines

Re: SV: [TN] Solderability of Tin-Gold Intermetallic

Werner Engelmaier /* <[log in to unmask]>

Wed, 16 Jan 2008 14:29:54 EST

42 lines

New Thread

SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic

SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic

Hfjord <[log in to unmask]>

Wed, 16 Jan 2008 21:54:37 +0100

83 lines

SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic

Hfjord <[log in to unmask]>

Wed, 16 Jan 2008 22:08:43 +0100

89 lines

Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic

Werner Engelmaier /* <[log in to unmask]>

Wed, 16 Jan 2008 16:09:43 EST

33 lines

Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic

Bev Christian <[log in to unmask]>

Wed, 16 Jan 2008 16:32:10 -0500

116 lines

Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic

Steve Gregory <[log in to unmask]>

Wed, 16 Jan 2008 15:35:27 -0600

112 lines

Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic

Werner Engelmaier /* <[log in to unmask]>

Wed, 16 Jan 2008 16:54:56 EST

33 lines

Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic

Werner Engelmaier /* <[log in to unmask]>

Wed, 16 Jan 2008 16:58:09 EST

38 lines

Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic

David D. Hillman <[log in to unmask]>

Wed, 16 Jan 2008 16:05:31 -0600

175 lines

Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic

Bev Christian <[log in to unmask]>

Wed, 16 Jan 2008 17:24:52 -0500

200 lines

Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic

Igoshev, Vladimir <[log in to unmask]>

Wed, 16 Jan 2008 19:12:07 -0500

178 lines

Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic

Yuan-chia Joyce Koo <[log in to unmask]>

Wed, 16 Jan 2008 19:36:38 -0500

269 lines

Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic

Bev Christian <[log in to unmask]>

Wed, 16 Jan 2008 19:28:07 -0500

270 lines

Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic

Bev Christian <[log in to unmask]>

Wed, 16 Jan 2008 19:30:08 -0500

280 lines

Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic

Igoshev, Vladimir <[log in to unmask]>

Wed, 16 Jan 2008 19:45:51 -0500

204 lines

Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic

Hernefjord Ingemar <[log in to unmask]>

Thu, 17 Jan 2008 09:19:57 +0100

137 lines

Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic

Brian Ellis <[log in to unmask]>

Thu, 17 Jan 2008 10:23:29 +0200

64 lines

Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic

Hernefjord Ingemar <[log in to unmask]>

Thu, 17 Jan 2008 09:42:20 +0100

152 lines

Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic

Hernefjord Ingemar <[log in to unmask]>

Thu, 17 Jan 2008 09:48:56 +0100

95 lines

Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic

Brian Ellis <[log in to unmask]>

Thu, 17 Jan 2008 11:43:14 +0200

129 lines

Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic

Hernefjord Ingemar <[log in to unmask]>

Thu, 17 Jan 2008 10:59:40 +0100

141 lines

Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic

Brian Ellis <[log in to unmask]>

Thu, 17 Jan 2008 13:53:44 +0200

179 lines

Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic

David D. Hillman <[log in to unmask]>

Thu, 17 Jan 2008 07:20:38 -0600

256 lines

Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic

Mike Fenner <[log in to unmask]>

Thu, 17 Jan 2008 13:20:40 -0000

189 lines

Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic

Hernefjord Ingemar <[log in to unmask]>

Thu, 17 Jan 2008 14:33:45 +0100

257 lines

Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic

Bev Christian <[log in to unmask]>

Thu, 17 Jan 2008 08:39:52 -0500

280 lines

Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic

Igoshev, Vladimir <[log in to unmask]>

Thu, 17 Jan 2008 09:56:29 -0500

324 lines

Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic

David D. Hillman <[log in to unmask]>

Thu, 17 Jan 2008 09:05:55 -0600

240 lines

Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic

Igoshev, Vladimir <[log in to unmask]>

Thu, 17 Jan 2008 10:25:46 -0500

130 lines

Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic

David D. Hillman <[log in to unmask]>

Thu, 17 Jan 2008 09:33:14 -0600

297 lines

Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic

Werner Engelmaier /* <[log in to unmask]>

Thu, 17 Jan 2008 10:36:03 EST

35 lines

Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic

Bev Christian <[log in to unmask]>

Thu, 17 Jan 2008 10:42:21 -0500

92 lines

Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic

Igoshev, Vladimir <[log in to unmask]>

Thu, 17 Jan 2008 10:48:02 -0500

154 lines

Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic

Guy Ramsey <[log in to unmask]>

Thu, 17 Jan 2008 13:50:33 -0500

205 lines

Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic

John Burke <[log in to unmask]>

Thu, 17 Jan 2008 11:09:28 -0800

240 lines

Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic

David D. Hillman <[log in to unmask]>

Thu, 17 Jan 2008 13:38:21 -0600

86 lines

Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic

Werner Engelmaier /* <[log in to unmask]>

Thu, 17 Jan 2008 14:45:09 EST

34 lines

Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic

David D. Hillman <[log in to unmask]>

Thu, 17 Jan 2008 13:59:45 -0600

82 lines

Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic

Igoshev, Vladimir <[log in to unmask]>

Thu, 17 Jan 2008 15:09:41 -0500

40 lines

Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic

Hernefjord Ingemar <[log in to unmask]>

Fri, 18 Jan 2008 10:45:29 +0100

135 lines

Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic

Wenger, George M. <[log in to unmask]>

Fri, 18 Jan 2008 07:25:13 -0500

153 lines

Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic

Werner Engelmaier /* <[log in to unmask]>

Fri, 18 Jan 2008 07:57:48 EST

39 lines

Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic

Rex Waygood <[log in to unmask]>

Fri, 18 Jan 2008 13:04:09 -0000

99 lines

Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic

Bev Christian <[log in to unmask]>

Fri, 18 Jan 2008 08:24:27 -0500

181 lines

Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic

David D. Hillman <[log in to unmask]>

Fri, 18 Jan 2008 07:34:42 -0600

234 lines

Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic

Bev Christian <[log in to unmask]>

Fri, 18 Jan 2008 08:36:33 -0500

281 lines

Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic

Bev Christian <[log in to unmask]>

Fri, 18 Jan 2008 08:44:02 -0500

302 lines

Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic

Yuan-chia Joyce Koo <[log in to unmask]>

Fri, 18 Jan 2008 09:10:23 -0500

336 lines

Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic

Roberts, Jon <[log in to unmask]>

Fri, 18 Jan 2008 08:03:33 -0600

78 lines

Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic

Wenger, George M. <[log in to unmask]>

Fri, 18 Jan 2008 10:07:20 -0500

211 lines

Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic

Wenger, George M. <[log in to unmask]>

Fri, 18 Jan 2008 10:16:30 -0500

217 lines

Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic

Bev Christian <[log in to unmask]>

Fri, 18 Jan 2008 10:17:56 -0500

393 lines

Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic

Reuven Rokah <[log in to unmask]>

Fri, 18 Jan 2008 19:31:10 +0200

84 lines

Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic

Werner Engelmaier /* <[log in to unmask]>

Fri, 18 Jan 2008 15:43:14 EST

43 lines

Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic

Werner Engelmaier /* <[log in to unmask]>

Fri, 18 Jan 2008 15:48:45 EST

36 lines

Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic

Igoshev, Vladimir <[log in to unmask]>

Fri, 18 Jan 2008 15:49:21 -0500

87 lines

Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic

Werner Engelmaier /* <[log in to unmask]>

Fri, 18 Jan 2008 15:59:49 EST

34 lines

Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic

Werner Engelmaier /* <[log in to unmask]>

Fri, 18 Jan 2008 16:02:10 EST

33 lines

Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic

Wenger, George M. <[log in to unmask]>

Fri, 18 Jan 2008 16:18:04 -0500

57 lines

Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic

Victor G. Hernandez <[log in to unmask]>

Fri, 18 Jan 2008 15:27:54 -0600

68 lines

Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic

Wenger, George M. <[log in to unmask]>

Fri, 18 Jan 2008 16:36:41 -0500

76 lines

Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic

Werner Engelmaier /* <[log in to unmask]>

Fri, 18 Jan 2008 17:06:28 EST

28 lines

Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic

Reuven Rokah <[log in to unmask]>

Sun, 20 Jan 2008 09:14:58 +0200

54 lines

New Thread

SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic - Hybrid Vehicles

Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic - Hybrid Vehicles

Creswick, Steven <[log in to unmask]>

Thu, 17 Jan 2008 07:10:18 -0500

62 lines

Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic - Hybrid Vehicles

Brian Ellis <[log in to unmask]>

Thu, 17 Jan 2008 14:49:05 +0200

87 lines

New Thread

SV: [TN] Warpage of components

SV: [TN] Warpage of components

Hfjord <[log in to unmask]>

Tue, 8 Jan 2008 16:55:37 +0100

72 lines

Re: SV: [TN] Warpage of components

Victor G. Hernandez <[log in to unmask]>

Tue, 8 Jan 2008 11:17:06 -0600

99 lines

Re: SV: [TN] Warpage of components

Herminia Guevarra <[log in to unmask]>

Tue, 8 Jan 2008 12:49:24 -0500

144 lines

SV: [TN] Warpage of components

Hfjord <[log in to unmask]>

Tue, 8 Jan 2008 22:16:21 +0100

95 lines

Re: SV: [TN] Warpage of components

Steve Gregory <[log in to unmask]>

Tue, 8 Jan 2008 16:24:01 -0600

122 lines

Re: SV: [TN] Warpage of components

Hernefjord Ingemar <[log in to unmask]>

Wed, 9 Jan 2008 09:42:19 +0100

153 lines

Re: SV: [TN] Warpage of components

Gumpert, Ben <[log in to unmask]>

Wed, 9 Jan 2008 06:59:09 -0500

182 lines

Re: SV: [TN] Warpage of components

Hernefjord Ingemar <[log in to unmask]>

Wed, 9 Jan 2008 14:00:56 +0100

227 lines

Re: SV: [TN] Warpage of components

Joe Fjelstad <[log in to unmask]>

Wed, 9 Jan 2008 14:04:13 EST

47 lines

New Thread

TechNet Digest - 2 Jan 2008 to 3 Jan 2008 (#2008-3)

Re: TechNet Digest - 2 Jan 2008 to 3 Jan 2008 (#2008-3)

Dan Groulx <[log in to unmask]>

Fri, 4 Jan 2008 01:18:34 -0500

27 lines

New Thread

Terry L Huddleston/ElecTec/Teledyne is out of the office.

Terry L Huddleston/ElecTec/Teledyne is out of the office.

Terry Huddleston <[log in to unmask]>

Tue, 29 Jan 2008 12:44:20 -0800

12 lines

New Thread

through hole current carrying capacity

through hole current carrying capacity

Barton, Ken <[log in to unmask]>

Tue, 22 Jan 2008 11:14:51 -0800

30 lines

Re: through hole current carrying capacity

Chris Ball <[log in to unmask]>

Tue, 22 Jan 2008 14:52:10 -0500

90 lines

New Thread

Upcoming IPC events you should miss! Register today!

Upcoming IPC events you should miss! Register today!

Tina Nerad <[log in to unmask]>

Fri, 18 Jan 2008 14:33:55 -0600

96 lines

Re: Upcoming IPC events you should miss! Register today!

R Sedlak <[log in to unmask]>

Fri, 18 Jan 2008 12:37:19 -0800

117 lines

Re: Upcoming IPC events you should miss! Register today!

Franklin Asbell <[log in to unmask]>

Fri, 18 Jan 2008 14:42:57 -0600

153 lines

Re: Upcoming IPC events you should miss! Register today!

Dave Dixon <[log in to unmask]>

Fri, 18 Jan 2008 15:41:20 -0600

82 lines

Re: Upcoming IPC events you should miss! Register today!

R Sedlak <[log in to unmask]>

Fri, 18 Jan 2008 15:11:46 -0800

101 lines

Re: Upcoming IPC events you should miss! Register today!

Stadem, Richard D. <[log in to unmask]>

Mon, 21 Jan 2008 07:00:51 -0600

120 lines

New Thread

Upcoming IPC workshops in Bannockburn, Illinois!

Upcoming IPC workshops in Bannockburn, Illinois!

Tina Nerad <[log in to unmask]>

Fri, 25 Jan 2008 15:02:46 -0600

57 lines

New Thread

Upcoming IPC workshops on printed board technology!

Upcoming IPC workshops on printed board technology!

Tina Nerad <[log in to unmask]>

Fri, 18 Jan 2008 09:22:24 -0600

51 lines

New Thread

Used Equipment Sales

Used Equipment Sales

Blair Hogg <[log in to unmask]>

Thu, 31 Jan 2008 07:00:56 -0600

27 lines

Re: Used Equipment Sales

Joyce Koo <[log in to unmask]>

Thu, 31 Jan 2008 08:20:13 -0500

63 lines

Re: Used Equipment Sales

Stadem, Richard D. <[log in to unmask]>

Thu, 31 Jan 2008 07:39:54 -0600

65 lines

Re: Used Equipment Sales

Davis, Larry <[log in to unmask]>

Thu, 31 Jan 2008 05:46:27 -0800

66 lines

Re: Used Equipment Sales

Steve Gregory <[log in to unmask]>

Thu, 31 Jan 2008 08:12:08 -0600

104 lines

Re: Used Equipment Sales

Jerry Dengler <[log in to unmask]>

Thu, 31 Jan 2008 09:15:26 -0500

68 lines

Re: Used Equipment Sales

Stadem, Richard D. <[log in to unmask]>

Thu, 31 Jan 2008 09:56:18 -0600

139 lines

Re: Used Equipment Sales

Blair Hogg <[log in to unmask]>

Thu, 31 Jan 2008 10:38:10 -0600

68 lines

Re: Used Equipment Sales

[log in to unmask]

Thu, 31 Jan 2008 22:22:54 EST

31 lines

Re: Used Equipment Sales

Sklenar Vit (AE/MFE3-AU) <[log in to unmask]>

Fri, 1 Feb 2008 11:37:01 +0800

44 lines

New Thread

Warpage of components

Warpage of components

Bev Christian <[log in to unmask]>

Mon, 7 Jan 2008 09:30:27 -0500

40 lines

Re: Warpage of components

Hernefjord Ingemar <[log in to unmask]>

Mon, 7 Jan 2008 15:57:14 +0100

67 lines

Re: Warpage of components

Guy Ramsey <[log in to unmask]>

Mon, 7 Jan 2008 15:28:27 -0500

71 lines

Re: Warpage of components

Bev Christian <[log in to unmask]>

Mon, 7 Jan 2008 15:29:26 -0500

115 lines

Re: Warpage of components

Werner Engelmaier /* <[log in to unmask]>

Mon, 7 Jan 2008 16:06:31 EST

34 lines

Re: Warpage of components

Stadem, Richard D. <[log in to unmask]>

Mon, 7 Jan 2008 15:09:47 -0600

143 lines

Re: Warpage of components

Hernefjord Ingemar <[log in to unmask]>

Tue, 8 Jan 2008 09:13:37 +0100

172 lines

Re: Warpage of components

Guy Ramsey <[log in to unmask]>

Tue, 8 Jan 2008 07:36:15 -0500

63 lines

Re: Warpage of components

Hernefjord Ingemar <[log in to unmask]>

Tue, 8 Jan 2008 13:49:30 +0100

85 lines

Re: Warpage of components

Werner Engelmaier /* <[log in to unmask]>

Tue, 8 Jan 2008 08:14:55 EST

37 lines

Re: Warpage of components

Yuan-chia Joyce Koo <[log in to unmask]>

Tue, 8 Jan 2008 08:28:42 -0500

210 lines

Re: Warpage of components

Werner Engelmaier /* <[log in to unmask]>

Tue, 8 Jan 2008 08:23:39 EST

35 lines

Warpage of components

Bev Christian <[log in to unmask]>

Wed, 9 Jan 2008 08:13:35 -0500

167 lines

New Thread

Wedge bonds

Wedge bonds

Guenter Grossmann <[log in to unmask]>

Wed, 30 Jan 2008 17:15:36 +0100

48 lines

Re: Wedge bonds

Thayer, Wayne <[log in to unmask]>

Wed, 30 Jan 2008 11:26:57 -0500

73 lines

Re: Wedge bonds

Creswick, Steven <[log in to unmask]>

Wed, 30 Jan 2008 11:28:36 -0500

95 lines

Re: Wedge bonds

Sauer, Steve (Xetron) <[log in to unmask]>

Wed, 30 Jan 2008 14:24:36 -0600

74 lines

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