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January 2008

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Subject	From	Date
% of Medical that is Pb-Free	Richard Kraszewski	Thu, 17 Jan 2008 12:04:50 -0500
Re: 0.4mm, 0.5mm interposer / adaptor boards?	Alan Young	Mon, 28 Jan 2008 17:09:53 -0500
Re: 0.4mm, 0.5mm interposer / adaptor boards?	Dwight Mattix	Mon, 28 Jan 2008 15:00:02 -0800
2nd request percent of industry using no-clean flux	Phil Nutting	Fri, 11 Jan 2008 14:24:43 -0500
Re: 2nd request percent of industry using no-clean flux	Blair Hogg	Thu, 17 Jan 2008 10:43:15 -0600
Air bubble in solder resist	Luan Nguyen	Wed, 9 Jan 2008 09:24:02 +0700
Re: Air bubble in solder resist	Brian Ellis	Wed, 9 Jan 2008 08:37:58 +0200
Re: Air bubble in solder resist	Luan Nguyen	Thu, 10 Jan 2008 08:32:31 +0700
APEX/EXPO Workshops	Werner Engelmaier /*	Thu, 31 Jan 2008 14:46:35 EST
Re: Baking PWB's to remove moisture	Stadem, Richard D.	Wed, 2 Jan 2008 16:31:33 -0600
Re: Baking PWB's to remove moisture	Stadem, Richard D.	Wed, 2 Jan 2008 16:46:45 -0600
Bent leads on CCGA - Inspect with Panasonic CM602	Eric Castonguay	Wed, 16 Jan 2008 11:05:22 -0800
Re: Bent leads on CCGA - Inspect with Panasonic CM602	John Burke	Wed, 16 Jan 2008 11:29:22 -0800
Re: Bent leads on CCGA - Inspect with Panasonic CM602	John Burke	Wed, 16 Jan 2008 11:30:38 -0800
Re: Bent leads on CCGA - Inspect with Panasonic CM602	Simonik, Dave R. (David)	Wed, 16 Jan 2008 14:37:44 -0500
BGA underfill opens- the saga continues	Gervascio, Thomas	Thu, 31 Jan 2008 13:29:13 -0500
Re: BGA underfill opens- the saga continues	Thayer, Wayne	Thu, 31 Jan 2008 13:42:03 -0500
Re: BGA underfill opens- the saga continues	Guy Ramsey	Thu, 31 Jan 2008 13:55:08 -0500
Re: BGA underfill opens- the saga continues	Werner Engelmaier /*	Thu, 31 Jan 2008 13:59:01 EST
Re: BGA underfill opens- the saga continues	Bev Christian	Thu, 31 Jan 2008 15:22:26 -0500
Re: BGA underfill opens- the saga continues	Igoshev, Vladimir	Thu, 31 Jan 2008 15:26:55 -0500
Re: BGA underfill opens- the saga continues	Gervascio, Thomas	Thu, 31 Jan 2008 15:47:26 -0500
Re: BGA underfill opens- the saga continues	John Burke	Thu, 31 Jan 2008 13:24:43 -0800
Re: BGA underfill opens- the saga continues	Paul Edwards	Thu, 31 Jan 2008 13:51:25 -0800
Bottom side SMT adhesives	Davis, Larry	Fri, 11 Jan 2008 09:37:33 -0800
Re: Bottom side SMT adhesives	Whittaker, Dewey (EHCOE)	Fri, 11 Jan 2008 10:56:22 -0700
Re: Bottom side SMT adhesives	Douglas O. Pauls	Fri, 11 Jan 2008 13:06:45 -0600
Re: Bottom side SMT adhesives	John Burke	Fri, 11 Jan 2008 11:20:21 -0800
Re: Bottom side SMT adhesives	Whittaker, Dewey (EHCOE)	Fri, 11 Jan 2008 12:24:52 -0700
Re: Bottom side SMT adhesives	Whittaker, Dewey (EHCOE)	Fri, 11 Jan 2008 13:28:42 -0700
Re: Bottom side SMT adhesives	Davis, Larry	Fri, 11 Jan 2008 12:32:14 -0800
Re: Bottom side SMT adhesives	Douglas O. Pauls	Fri, 11 Jan 2008 14:39:58 -0600
Re: Bottom side SMT adhesives	Steve Gregory	Fri, 11 Jan 2008 14:41:09 -0600
Re: Bottom side SMT adhesives	Karl Hunsinger	Fri, 11 Jan 2008 15:49:57 -0500
Re: Bottom side SMT adhesives	Whittaker, Dewey (EHCOE)	Fri, 11 Jan 2008 14:14:34 -0700
Re: Bottom side SMT adhesives	Kelly Morris	Fri, 11 Jan 2008 15:26:22 -0600
Re: Bottom side SMT adhesives	Bill Kunkle	Fri, 11 Jan 2008 17:04:11 -0500
Re: Bottom side SMT adhesives	Whittaker, Dewey (EHCOE)	Fri, 11 Jan 2008 15:08:23 -0700
Re: Bottom side SMT adhesives	Tan Geok Ang	Tue, 15 Jan 2008 08:46:15 +0800
Re: Bottom side SMT adhesives	Kathy Kuhlow	Mon, 14 Jan 2008 21:17:32 -0600
Re: Bottom side SMT adhesives	Gary Camac	Tue, 15 Jan 2008 07:00:34 -0600
Re: Bottom side SMT adhesives	Mike Fenner	Tue, 15 Jan 2008 15:08:53 -0000
CAF resistant design guide??	Doug Carlson	Wed, 9 Jan 2008 20:35:21 -0600
Re: CAF resistant design guide??	Rex Waygood	Thu, 10 Jan 2008 08:44:16 -0000
Catch up with the latest IPC has to offer!	Tina Nerad	Tue, 29 Jan 2008 10:37:07 -0600
Check this out	Henri Henderson	Wed, 16 Jan 2008 11:07:30 -0600
Re: Check this out	Steve Gregory	Wed, 16 Jan 2008 12:33:03 -0600
Re: Check this out	John Burke	Wed, 16 Jan 2008 11:00:00 -0800
Coating	Yannick Brisson	Wed, 9 Jan 2008 16:57:04 -0500
Re: Coating	Douglas O. Pauls	Wed, 9 Jan 2008 15:59:41 -0600
Re: Coating	Bev Christian	Wed, 9 Jan 2008 17:41:01 -0500
Re: Coating	Thayer, Wayne	Wed, 9 Jan 2008 18:24:22 -0500
Re: Coating	David Greenman	Thu, 10 Jan 2008 11:21:14 -0000
Re: Coating	- bogert	Thu, 10 Jan 2008 18:29:07 -0500
Re: Coffin-Manson	al shirazi	Wed, 23 Jan 2008 10:23:38 -0800
Re: Coffin-Manson	Werner Engelmaier /*	Wed, 23 Jan 2008 18:28:12 EST
Re: Coffin-Manson	Paul Reid	Thu, 24 Jan 2008 09:44:22 -0500
Re: Coffin-Manson	Werner Engelmaier /*	Thu, 24 Jan 2008 10:26:44 EST
copper adhesion to ceramic substrate	Fite,Jesse	Mon, 14 Jan 2008 14:25:31 -0500
Re: copper adhesion to ceramic substrate	Lee parker	Mon, 14 Jan 2008 16:24:35 -0500
Re: copper adhesion to ceramic substrate	Franklin Asbell	Mon, 14 Jan 2008 15:27:48 -0600
Re: copper adhesion to ceramic substrate	Creswick, Steven	Tue, 15 Jan 2008 05:53:23 -0500
CPK	John Queen	Tue, 29 Jan 2008 14:53:18 -0000
Decomposition Temperature	Werner Engelmaier /*	Thu, 31 Jan 2008 12:32:29 EST
Dougs articles on cleanliness	Douglas O. Pauls	Mon, 7 Jan 2008 13:15:20 -0600
Re: Dougs articles on cleanliness	Drew meyer	Mon, 7 Jan 2008 13:23:56 -0600
ECM or SIR - What Electrical test is best?	Chris Schaefer	Thu, 10 Jan 2008 17:02:10 -0600
Re: ECM or SIR - What Electrical test is best?	Christopher Nash	Fri, 11 Jan 2008 08:31:04 -0500
Re: ECM or SIR - What Electrical test is best?	Richard Kraszewski	Fri, 11 Jan 2008 08:36:14 -0500
Re: ECM or SIR - What Electrical test is best?	Douglas O. Pauls	Fri, 11 Jan 2008 07:59:29 -0600
Re: ECM or SIR - What Electrical test is best?	Graham Naisbitt	Fri, 11 Jan 2008 14:08:49 +0000
EU "simplification"	John Burke	Fri, 18 Jan 2008 10:55:13 -0800
Re: EU "simplification"	Dennis Fritz	Sat, 19 Jan 2008 17:39:09 EST
Re: EU "simplification"	John Burke	Sat, 19 Jan 2008 17:13:30 -0800
Re: EU "simplification"	Brian Ellis	Sun, 20 Jan 2008 11:03:35 +0200
FEM to include the intermetallic layer!	al shirazi	Thu, 24 Jan 2008 07:48:05 -0800
FEM to include the intermetallic layer!	al shirazi	Thu, 24 Jan 2008 07:50:43 -0800
Re: FEM to include the intermetallic layer!	Werner Engelmaier /*	Thu, 24 Jan 2008 11:17:22 EST
Fiji AIM users and PPDplus	Scott Lefebvre	Thu, 31 Jan 2008 08:34:29 -0800
Re: Fiji AIM users and PPDplus	John Queen	Thu, 31 Jan 2008 17:02:17 -0000
galvanic compatibility	Anat Douek	Wed, 30 Jan 2008 15:37:03 +0200
Re: galvanic compatibility	Ido Mashall	Wed, 30 Jan 2008 17:52:20 +0200
Re: galvanic compatibility	Hernefjord Ingemar	Thu, 31 Jan 2008 09:29:12 +0100
Re: galvanic compatibility	Anat Douek	Thu, 31 Jan 2008 11:45:01 +0200
Re: galvanic compatibility	Hernefjord Ingemar	Thu, 31 Jan 2008 12:37:11 +0100
Re: galvanic compatibility	Anat Douek	Thu, 31 Jan 2008 13:55:31 +0200
Re: galvanic compatibility	Ido Mashall	Thu, 31 Jan 2008 14:15:44 +0200
Re: galvanic compatibility	Brian Ellis	Thu, 31 Jan 2008 14:20:34 +0200
Re: galvanic compatibility	Hernefjord Ingemar	Thu, 31 Jan 2008 13:47:05 +0100
Re: galvanic compatibility	Anat Douek	Thu, 31 Jan 2008 15:33:13 +0200
Henry Rekers is out of the office.	<>	Sun, 20 Jan 2008 04:00:21 -0800
hi-temp solder requirements	Phil Nutting	Thu, 17 Jan 2008 11:17:15 -0500
Re: hi-temp solder requirements	Dale Ritzen	Thu, 17 Jan 2008 10:59:16 -0600
Humiseal UV40 Conformal Coating	Kane, Amol (349)	Wed, 23 Jan 2008 07:41:01 -0500
Re: Humiseal UV40 Conformal Coating	Kane, Amol (349)	Thu, 24 Jan 2008 07:15:59 -0500
Re: Humiseal UV40 Conformal Coating	Graham Naisbitt	Fri, 25 Jan 2008 17:55:04 +0000
Re: Humiseal UV40 Conformal Coating	Steve Gregory	Fri, 25 Jan 2008 12:39:20 -0600
Re: Humiseal UV40 Conformal Coating	Kane, Amol (349)	Fri, 25 Jan 2008 15:56:39 -0500
Re: Humiseal UV40 Conformal Coating	Graham Naisbitt	Wed, 30 Jan 2008 13:04:13 +0000
Re: Humiseal UV40 Conformal Coating	Whittaker, Dewey (EHCOE)	Wed, 30 Jan 2008 07:00:41 -0700
Re: Humiseal UV40 Conformal Coating	Graham Naisbitt	Wed, 30 Jan 2008 14:57:32 +0000
Image of a B25 test Board	Richard Kraszewski	Wed, 9 Jan 2008 10:30:35 -0500
Re: Image of a B25 test Board	Joe Russeau	Wed, 9 Jan 2008 11:02:51 -0500
FW: Implementing Measures of the Korean RoHS Act Out in December 2007	John Burke	Wed, 2 Jan 2008 12:16:56 -0800
Informal poll	Franklin Asbell	Fri, 25 Jan 2008 09:03:00 -0600
Re: Informal poll	Gary Ferrari	Fri, 25 Jan 2008 10:17:38 -0500
Re: Informal Poll	Jack Olson	Mon, 28 Jan 2008 09:52:07 -0600
IPC 6013	Steve Kelly	Mon, 28 Jan 2008 13:16:29 -0500
Re: IPC 6013	David D. Hillman	Tue, 29 Jan 2008 07:32:54 -0600
IPC call for nominations for awards - deadline is February 5, 2008	Kim Sterling	Thu, 17 Jan 2008 11:09:42 -0600
IPC International Conference on Flexible Circuits, February 12 - 14, 2008, Phoenix, Ariz,	Tina Nerad	Mon, 14 Jan 2008 10:27:25 -0600
IPC International Conference on Flexible Circuits, February 12-14, 2008, Phoenix, Ariz.	Tina Nerad	Thu, 3 Jan 2008 15:24:18 -0600
IPC Workshop: Design for Manufacture, Assembly and Test, Hosted by Hunter Technology - Santa Clara, Calif., February 26-27, 2008	Tina Nerad	Tue, 22 Jan 2008 14:57:22 -0600
ipc-6012B amendement	Dave Seymour	Thu, 24 Jan 2008 16:27:43 -0500
Re: ipc-6012B amendement	Franklin Asbell	Thu, 24 Jan 2008 16:09:20 -0600
Re: ipc-6012B amendement	Dave Seymour	Thu, 24 Jan 2008 17:29:52 -0500
Re: ipc-6012B amendement	Franklin Asbell	Thu, 24 Jan 2008 16:45:31 -0600
IPC-6013 final finish Class 1 or class 2 [FLEX]	Eric Bonatti	Mon, 28 Jan 2008 11:23:04 -0500
Re: IPC-6013 final finish Class 1 or class 2 [FLEX]	Frank Kimmey	Mon, 28 Jan 2008 09:06:57 -0800
IPC/JEDEC International Conference on Reliability, Rework and Repair of Lead-Free Electronics, March 11-12, 2008, Raleigh, N.C.	Tina Nerad	Wed, 16 Jan 2008 13:38:09 -0600
IST for lead free assembly PCB monitoring	HuGause	Fri, 11 Jan 2008 14:49:25 +0800
Re: IST for lead free assembly PCB monitoring	Paul Reid	Mon, 14 Jan 2008 09:38:19 -0500
Re: IST for lead free assembly PCB monitoring	Dwight Mattix	Mon, 14 Jan 2008 07:43:22 -0800
Re: IST for lead free assembly PCB monitoring	HuGause	Tue, 15 Jan 2008 10:48:19 +0800
Re: IST for lead free assembly PCB monitoring	Paul Reid	Tue, 15 Jan 2008 18:07:54 -0500
Join IPC at one of their upcoming events in California!	Tina Nerad	Fri, 11 Jan 2008 11:06:22 -0600
Join IPC at one of their upcoming webcasts and get the latest information on these topics!	Tina Nerad	Thu, 3 Jan 2008 11:02:39 -0600
Join IPC at their upcoming workshops in San Jose, CA!	Tina Nerad	Wed, 2 Jan 2008 08:48:24 -0600
L0 flux classification	Guy Ramsey	Fri, 18 Jan 2008 13:44:14 -0500
Re: L0 flux classification	Richard Kraszewski	Fri, 18 Jan 2008 13:56:58 -0500
Re: L0 flux classification	Christopher Nash	Fri, 18 Jan 2008 14:11:56 -0500
Re: L0 flux classification	Mike Fenner	Mon, 21 Jan 2008 09:04:04 -0000
laser carbon residue	Jim Henderson	Thu, 24 Jan 2008 15:49:01 -0500
Re: laser carbon residue	Stadem, Richard D.	Thu, 24 Jan 2008 15:03:52 -0600
Re: laser carbon residue	R Sedlak	Thu, 24 Jan 2008 14:25:56 -0800
Re: laser carbon residue	John Burke	Thu, 24 Jan 2008 15:13:07 -0800
Re: laser carbon residue	R Sedlak	Thu, 24 Jan 2008 15:44:35 -0800
Re: laser carbon residue	John Burke	Thu, 24 Jan 2008 15:58:54 -0800
Re: laser carbon residue	Hernefjord Ingemar	Fri, 25 Jan 2008 10:30:46 +0100
Re: laser carbon residue	Joyce Koo	Fri, 25 Jan 2008 07:39:54 -0500
Lead-free HASL finishes	Stadem, Richard D.	Thu, 10 Jan 2008 14:53:38 -0600
Re: Lead-free HASL finishes	Stadem, Richard D.	Thu, 10 Jan 2008 15:20:39 -0600
Re: Lead-free HASL finishes	Bev Christian	Thu, 10 Jan 2008 17:04:12 -0500
Re: Lead-free HASL finishes	David D. Hillman	Fri, 11 Jan 2008 08:04:35 -0600
Re: Lead-free HASL finishes	Franklin Asbell	Fri, 11 Jan 2008 08:28:11 -0600
Re: Lead-free HASL finishes	David D. Hillman	Fri, 11 Jan 2008 08:47:37 -0600
liquid imageable soldmask	Dave Seymour	Wed, 2 Jan 2008 16:12:40 -0500
Re: liquid imageable soldmask	Douglas O. Pauls	Thu, 3 Jan 2008 07:33:49 -0600
Re: liquid imageable soldmask	Dave Seymour	Thu, 3 Jan 2008 09:36:47 -0500
Re: liquid imageable soldmask	Colin McVean	Thu, 3 Jan 2008 14:50:34 -0000
Re: liquid imageable soldmask	Douglas O. Pauls	Thu, 3 Jan 2008 08:51:35 -0600
Re: liquid imageable soldmask	Colin McVean	Thu, 3 Jan 2008 15:13:29 -0000
Re: liquid imageable soldmask	Afri Singh	Fri, 11 Jan 2008 11:57:32 -0500
Re: liquid imageable soldmask	Jack Olson	Fri, 11 Jan 2008 15:02:39 -0600
Looking for Coating Comparison	Bill Kasprzak	Wed, 2 Jan 2008 11:06:44 -0500
Re: Looking for Coating Comparison	Douglas O. Pauls	Wed, 2 Jan 2008 10:15:56 -0600
Re: Looking for Coating Comparison	Kathy Kuhlow	Wed, 2 Jan 2008 10:18:03 -0600
Re: Looking for Coating Comparison	David Greenman	Wed, 2 Jan 2008 18:09:57 -0000
Re: Looking for Coating Comparison	Graham Naisbitt	Thu, 3 Jan 2008 11:11:13 +0000
Re: Looking for Coating Comparison	Douglas O. Pauls	Thu, 3 Jan 2008 07:28:30 -0600
Re: Looking for Coating Comparison	Bill Kasprzak	Thu, 3 Jan 2008 08:49:04 -0500
Re: Looking for Coating Comparison	Douglas O. Pauls	Thu, 3 Jan 2008 08:02:51 -0600
Re: Looking for Coating Comparison	Whittaker, Dewey (EHCOE)	Thu, 3 Jan 2008 08:20:46 -0700
Microvoids immersion silver	Gabriela Bogdan	Mon, 28 Jan 2008 19:30:16 +0200
Re: Microvoids immersion silver	R Sedlak	Mon, 28 Jan 2008 09:51:44 -0800
Re: Microvoids immersion silver	Gabriela Bogdan	Mon, 28 Jan 2008 20:02:38 +0200
Re: Microvoids immersion silver	Lee parker	Mon, 28 Jan 2008 13:15:57 -0500
Re: Microvoids immersion silver	Dennis Fritz	Mon, 28 Jan 2008 13:17:49 EST
Re: Microvoids immersion silver	Gabriela Bogdan	Mon, 28 Jan 2008 20:30:09 +0200
Re: Microvoids immersion silver	Lee parker	Mon, 28 Jan 2008 15:14:14 -0500
Re: Microvoids immersion silver	Gabriela Bogdan	Tue, 29 Jan 2008 05:28:35 +0200
Re: Microvoids immersion silver	Reuven Rokah	Tue, 29 Jan 2008 10:53:25 +0200
Re: Microvoids immersion silver	George Milad	Tue, 29 Jan 2008 11:53:13 EST
Re: Microvoids immersion silver	Gabriela Bogdan	Tue, 29 Jan 2008 19:49:02 +0200
Re: Microvoids immersion silver	John Burke	Tue, 29 Jan 2008 10:24:20 -0800
Re: Microvoids immersion silver	Werner Engelmaier /*	Tue, 29 Jan 2008 13:35:16 EST
Re: Microvoids immersion silver	Gabriela Bogdan	Tue, 29 Jan 2008 20:49:08 +0200
Re: Microvoids immersion silver	Stadem, Richard D.	Tue, 29 Jan 2008 13:30:59 -0600
Re: Microvoids immersion silver	Werner Engelmaier /*	Tue, 29 Jan 2008 14:57:30 EST
Re: Microvoids immersion silver	Wenger, George M.	Tue, 29 Jan 2008 14:59:01 -0500
Re: Microvoids immersion silver	Stadem, Richard D.	Tue, 29 Jan 2008 14:51:52 -0600
Re: Microvoids immersion silver	Werner Engelmaier /*	Tue, 29 Jan 2008 15:57:44 EST
Re: Microvoids immersion silver	Whittaker, Dewey (EHCOE)	Tue, 29 Jan 2008 14:06:32 -0700
Re: Microvoids immersion silver	Stadem, Richard D.	Tue, 29 Jan 2008 15:06:30 -0600
Re: Microvoids immersion silver	Igoshev, Vladimir	Tue, 29 Jan 2008 16:45:34 -0500
Re: Microvoids immersion silver	Stadem, Richard D.	Wed, 30 Jan 2008 06:59:05 -0600
Re: Microvoids immersion silver	Gabriela Bogdan	Wed, 30 Jan 2008 17:50:17 +0200
Module Quality Question	Stephen Ayotte	Thu, 17 Jan 2008 16:24:18 -0800
Re: Module Quality Question	Yuan-chia Joyce Koo	Thu, 17 Jan 2008 20:43:32 -0500
Molded silicone thermal sheets	Douglas O. Pauls	Tue, 29 Jan 2008 16:16:27 -0600
Re: Molded silicone thermal sheets	stephengregory5849	Tue, 29 Jan 2008 16:33:17 -0600
Re: Molded silicone thermal sheets	Gumpert, Ben	Wed, 30 Jan 2008 06:23:23 -0500
Re: Molded silicone thermal sheets	Hernefjord Ingemar	Wed, 30 Jan 2008 13:48:47 +0100
Re: Molded silicone thermal sheets	Kevin Glidden	Wed, 30 Jan 2008 08:40:17 -0500
More AuSn needle and platelet photos...	Steve Gregory	Thu, 17 Jan 2008 12:15:51 -0600
Re: More AuSn needle and platelet photos...	Joyce Koo	Thu, 17 Jan 2008 14:17:01 -0500
Re: More AuSn needle and platelet photos...	Steve Gregory	Thu, 17 Jan 2008 13:25:13 -0600
Re: More AuSn needle and platelet photos...	John Burke	Thu, 17 Jan 2008 13:56:23 -0800
FW: MSDS for women	Rodney Miller	Wed, 2 Jan 2008 13:35:36 -0600
FW: MURPHY'S OTHER LAWS	Whittaker, Dewey (EHCOE)	Wed, 9 Jan 2008 13:09:57 -0700
Re: FW: MURPHY'S OTHER LAWS	John Burke	Wed, 9 Jan 2008 12:48:24 -0800
Re: FW: MURPHY'S OTHER LAWS	Douglas O. Pauls	Wed, 9 Jan 2008 14:54:24 -0600
Re: FW: MURPHY'S OTHER LAWS	John Burke	Wed, 9 Jan 2008 14:35:27 -0800
Re: FW: MURPHY'S OTHER LAWS	Hernefjord Ingemar	Thu, 10 Jan 2008 09:24:31 +0100
Re: FW: MURPHY'S OTHER LAWS	Steve Gregory	Thu, 10 Jan 2008 06:35:15 -0600
Re: FW: MURPHY'S OTHER LAWS NTC	Mike Fenner	Thu, 10 Jan 2008 11:35:06 -0000
Re: FW: MURPHY'S OTHER LAWS NTC	Bev Christian	Thu, 10 Jan 2008 06:41:50 -0500
Re: FW: MURPHY'S OTHER LAWS NTC	Mike Fenner	Thu, 10 Jan 2008 14:34:21 -0000
Re: FW: MURPHY'S OTHER LAWS NTC	Whittaker, Dewey (EHCOE)	Thu, 10 Jan 2008 07:58:39 -0700
Re: FW: MURPHY'S OTHER LAWS NTC	Bev Christian	Thu, 10 Jan 2008 10:06:45 -0500
Re: FW: MURPHY'S OTHER LAWS NTC	John Burke	Thu, 10 Jan 2008 07:07:48 -0800
Re: FW: MURPHY'S OTHER LAWS NTC	Mike Fenner	Thu, 10 Jan 2008 15:21:47 -0000
NTC Little bird "kooing"	Bev Christian	Wed, 23 Jan 2008 17:48:57 -0500
Re: NTC Little bird "kooing"	Frank Kimmey	Wed, 23 Jan 2008 14:51:14 -0800
Re: NTC Little bird "kooing"	stephengregory5849	Wed, 23 Jan 2008 17:01:59 -0600
Re: NTC Little bird "kooing"	John Burke	Wed, 23 Jan 2008 15:13:20 -0800
Re: NTC Little bird "kooing"	Joyce Koo	Wed, 23 Jan 2008 18:09:44 -0500
Re: NTC Little bird "kooing"	Bev Christian	Wed, 23 Jan 2008 18:22:34 -0500
Re: NTC Little bird "kooing"	Hernefjord Ingemar	Thu, 24 Jan 2008 08:53:15 +0100
Re: NTC Little bird "kooing"	Douglas O. Pauls	Thu, 24 Jan 2008 07:54:28 -0600
Re: NTC Little bird "kooing"	Steve Gregory	Thu, 24 Jan 2008 09:22:41 -0600
Re: NTC Little bird "kooing"	Gervascio, Thomas	Thu, 24 Jan 2008 10:26:34 -0500
Re: NTC Little bird "kooing"	Whittaker, Dewey (EHCOE)	Mon, 28 Jan 2008 08:35:56 -0700
Re: NTC Little bird "kooing"	Whittaker, Dewey (EHCOE)	Mon, 28 Jan 2008 08:44:54 -0700
NTC Solderability of Tin-Gold Intermetallic	Stadem, Richard D.	Fri, 18 Jan 2008 08:18:37 -0600
OSP w selective gold	Genny Gibbard	Thu, 3 Jan 2008 16:22:04 -0600
Re: OSP w selective gold	Ryan Grant	Thu, 3 Jan 2008 17:52:11 -0700
Re: OSP w selective gold	Reuven Rokah	Fri, 4 Jan 2008 09:30:08 +0200
Re: OSP w selective gold	HuGause	Fri, 4 Jan 2008 15:33:12 +0800
Re: OSP w selective gold	Tan Geok Ang	Fri, 4 Jan 2008 16:50:06 +0800
Re: OSP w selective gold	Drew meyer	Fri, 4 Jan 2008 06:36:04 -0600
Re: OSP w selective gold	Genny Gibbard	Fri, 4 Jan 2008 11:29:58 -0600
Re: OSP w selective gold	Werner Engelmaier /*	Fri, 4 Jan 2008 13:11:36 EST
Re: OSP w selective gold	Lee parker	Fri, 4 Jan 2008 19:06:18 -0500
Re: OSP w selective gold	Phillip Bavaro	Mon, 7 Jan 2008 13:03:14 -0800
Re: OSP w selective gold	Bev Christian	Mon, 7 Jan 2008 16:09:51 -0500
Re: OSP w selective gold	Genny Gibbard	Mon, 7 Jan 2008 15:15:40 -0600
Re: OSP w selective gold	Stadem, Richard D.	Mon, 7 Jan 2008 15:18:58 -0600
Re: OSP w selective gold	Bev Christian	Mon, 7 Jan 2008 16:18:20 -0500
Re: OSP w selective gold	Werner Engelmaier /*	Mon, 7 Jan 2008 16:23:06 EST
Re: OSP w selective gold	Lee parker	Mon, 7 Jan 2008 16:44:15 -0500
Re: OSP w selective gold	Ryan Grant	Tue, 8 Jan 2008 10:39:00 -0700
Re: OSP w selective gold	George Milad	Tue, 8 Jan 2008 19:08:30 EST
Outgassing requirements and Polyimide material	Franklin Asbell	Thu, 31 Jan 2008 11:22:49 -0600
percent of industry using no-clean flux	Phil Nutting	Mon, 7 Jan 2008 12:11:44 -0500
PolyChlorinated Bipheyl	SUBSCRIBE TechNet Anonymous	Fri, 4 Jan 2008 06:12:51 -0600
Polyester Dome Switch on Flex Circuit.	mattyk	Tue, 15 Jan 2008 10:43:58 -0500
Re: Polyester Dome Switch on Flex Circuit.	Roger Stoops	Tue, 15 Jan 2008 12:06:49 -0500
Re: Polyester Dome Switch on Flex Circuit.	mattyk	Tue, 15 Jan 2008 15:05:28 -0500
Re: Polyester Dome Switch on Flex Circuit.	Roger Stoops	Tue, 15 Jan 2008 16:25:26 -0500
Re: Polyester Dome Switch on Flex Circuit.	mattyk	Wed, 16 Jan 2008 08:46:53 -0500
Randall L Bock/MSD/US/PBI is out of the office.	Randy Bock Sr.	Tue, 8 Jan 2008 03:16:17 -0500
Randall L Bock/MSD/US/PBI is out of the office.	Randy Bock Sr.	Fri, 25 Jan 2008 05:14:19 -0500
Raw PCB Insulation Resistance Test	Kevin Glidden	Tue, 29 Jan 2008 09:49:47 -0500
Recall: [TN] Used Equipment Sales	Sklenar Vit (AE/MFE3-AU)	Fri, 1 Feb 2008 11:39:01 +0800
Reflow profile development - correct starting temperature for evaluating TAL using non-eutectic solders	Joe Macko	Mon, 7 Jan 2008 08:37:19 -0800
Re: Reflow profile development - correct starting temperature for evaluating TAL using non-eutectic solders	Werner Engelmaier /*	Mon, 7 Jan 2008 11:55:43 EST
Re: Reflow profile development - correct starting temperature for evaluating TAL using non-eutectic solders	Stadem, Richard D.	Mon, 7 Jan 2008 11:13:53 -0600
Re: Reflow profile development - correct starting temperature for evaluating TAL using non-eutectic solders	Whittaker, Dewey (EHCOE)	Tue, 8 Jan 2008 09:29:31 -0700
Re: Reflow profile development - correct starting temperature for evaluating TAL using non-eutectic solders	Werner Engelmaier /*	Tue, 8 Jan 2008 11:54:53 EST
Re: Reflow profile development - correct starting temperature for evaluating TAL using non-eutectic solders	Stadem, Richard D.	Tue, 8 Jan 2008 11:00:19 -0600
Re: Reflow profile development - correct starting temperature for evaluating TAL using non-eutectic solders	Whittaker, Dewey (EHCOE)	Tue, 8 Jan 2008 10:41:47 -0700
Re: Reflow profile development - correct starting temperature for evaluating TAL using non-eutectic solders	John Burke	Tue, 8 Jan 2008 12:56:38 -0800
Re: Reflow profile development - correct starting temperature for evaluating TAL using non-eutectic solders	Stadem, Richard D.	Tue, 8 Jan 2008 15:00:34 -0600
Re: Reflow profile development - correct starting temperature for evaluating TAL using non-eutectic solders	Joe Macko	Wed, 9 Jan 2008 08:05:45 -0800
Re: Reflow profile development - correct starting temperature for evaluating TAL using non-eutectic solders	Werner Engelmaier /*	Wed, 9 Jan 2008 13:22:25 EST
reflow soldering metal backed pcb	P. Langeveld	Wed, 2 Jan 2008 16:57:43 +0100
Re: reflow soldering metal backed pcb	Werner Engelmaier /*	Wed, 2 Jan 2008 11:00:47 EST
Re: reflow soldering metal backed pcb	Thayer, Wayne	Wed, 2 Jan 2008 12:51:15 -0500
Re: reflow soldering metal backed pcb	John Maxwell	Wed, 2 Jan 2008 10:16:25 -0800
Re: reflow soldering metal backed pcb	Werner Engelmaier /*	Wed, 2 Jan 2008 13:24:09 EST
Re: reflow soldering metal backed pcb	Kevin Glidden	Wed, 2 Jan 2008 14:31:09 -0500
Solder fines	Sue Powers-hartman	Wed, 23 Jan 2008 09:58:17 -0600
Re: Solder fines	Stadem, Richard D.	Wed, 23 Jan 2008 11:28:37 -0600
Re: Solder fines	Stadem, Richard D.	Wed, 23 Jan 2008 13:37:21 -0600
Solder thieves	Ioan Tempea	Mon, 21 Jan 2008 14:48:27 -0500
Re: Solder thieves	Ahne Oosterhof	Tue, 22 Jan 2008 08:11:23 -0800
Re: Solder thieves	Guy Ramsey	Tue, 22 Jan 2008 14:09:37 -0500
Re: Solder thieves	Sauer, Steve (Xetron)	Tue, 22 Jan 2008 14:21:48 -0600
Re: Solder thieves	Roberts, Jon	Tue, 22 Jan 2008 15:41:14 -0600
Re: Solder thieves	Ioan Tempea	Wed, 23 Jan 2008 07:24:32 -0500
Solderability of Tin-Gold Intermetallic	Bev Christian	Wed, 16 Jan 2008 08:52:05 -0500
Re: Solderability of Tin-Gold Intermetallic	Wenger, George M.	Wed, 16 Jan 2008 09:02:45 -0500
Re: Solderability of Tin-Gold Intermetallic	Bev Christian	Wed, 16 Jan 2008 09:04:12 -0500
Re: Solderability of Tin-Gold Intermetallic	Wenger, George M.	Wed, 16 Jan 2008 09:20:00 -0500
Re: Solderability of Tin-Gold Intermetallic	Igoshev, Vladimir	Wed, 16 Jan 2008 09:25:06 -0500
Re: Solderability of Tin-Gold Intermetallic	Bev Christian	Wed, 16 Jan 2008 09:39:21 -0500
Re: Solderability of Tin-Gold Intermetallic	Werner Engelmaier /*	Wed, 16 Jan 2008 18:09:37 EST
Re: Solderability of Tin-Gold Intermetallic	Bev Christian	Wed, 16 Jan 2008 18:19:46 -0500
Re: Solderability of Tin-Gold Intermetallic	Werner Engelmaier /*	Wed, 16 Jan 2008 18:23:34 EST
Re: Solderability of Tin-Gold Intermetallic	Bev Christian	Wed, 16 Jan 2008 18:53:43 -0500
Re: Solderability of Tin-Gold Intermetallic	Rex Waygood	Thu, 17 Jan 2008 08:41:48 -0000
Re: Solderability of Tin-Gold Intermetallic	David D. Hillman	Thu, 17 Jan 2008 07:32:19 -0600
Re: Solderability of Tin-Gold Intermetallic	Stadem, Richard D.	Thu, 17 Jan 2008 09:36:24 -0600
Solderability of Tin-Gold Intermetallic NTC	Bev Christian	Fri, 18 Jan 2008 10:09:06 -0500
Re: Solderability of Tin-Gold Intermetallic NTC	Werner Engelmaier /*	Fri, 18 Jan 2008 15:57:04 EST
Re: Solderability of Tin-Gold Intermetallic NTC	Genny Gibbard	Fri, 18 Jan 2008 15:06:16 -0600
Re: Solderability of Tin-Gold Intermetallic NTC	Guy Ramsey	Fri, 18 Jan 2008 16:07:18 -0500
Re: Solderability of Tin-Gold Intermetallic NTC	Whittaker, Dewey (EHCOE)	Fri, 18 Jan 2008 14:29:33 -0700
Re: Solderability of Tin-Gold Intermetallic NTC	Genny Gibbard	Fri, 18 Jan 2008 15:41:15 -0600
Re: Solderability of Tin-Gold Intermetallic NTC	Craig Cullum	Fri, 18 Jan 2008 15:48:13 -0600
Re: Solderability of Tin-Gold Intermetallic NTC	John Burke	Fri, 18 Jan 2008 13:48:19 -0800
Re: Solderability of Tin-Gold Intermetallic NTC	Craig Cullum	Fri, 18 Jan 2008 15:51:37 -0600
Re: Solderability of Tin-Gold Intermetallic NTC	Bev Christian	Fri, 18 Jan 2008 16:50:51 -0500
Re: Solderability of Tin-Gold Intermetallic NTC	Bev Christian	Fri, 18 Jan 2008 17:03:10 -0500
Re: Solderability of Tin-Gold Intermetallic NTC	Werner Engelmaier /*	Fri, 18 Jan 2008 17:05:03 EST
Re: Solderability of Tin-Gold Intermetallic NTC	Werner Engelmaier /*	Fri, 18 Jan 2008 17:10:59 EST
Re: Solderability of Tin-Gold Intermetallic NTC	Douglas O. Pauls	Fri, 18 Jan 2008 16:19:41 -0600
Re: Solderability of Tin-Gold Intermetallic NTC	John Burke	Fri, 18 Jan 2008 14:41:52 -0800
Re: Solderability of Tin-Gold Intermetallic NTC	Yuan-chia Joyce Koo	Fri, 18 Jan 2008 18:49:30 -0500
Re: Solderability of Tin-Gold Intermetallic NTC	Brian Ellis	Sat, 19 Jan 2008 11:35:54 +0200
Re: Solderability of Tin-Gold Intermetallic NTC	John Burke	Sat, 19 Jan 2008 09:35:02 -0800
Re: Solderability of Tin-Gold Intermetallic NTC	Stadem, Richard D.	Mon, 21 Jan 2008 07:10:53 -0600
Re: Solderability of Tin-Gold Intermetallic NTC Flash Floods Kill	Ed Popielarski	Sun, 20 Jan 2008 07:08:30 -0800
Re: Solderability of Tin-Gold Intermetallic NTC Flash Floods Kill	Brian Ellis	Sun, 20 Jan 2008 17:55:29 +0200
Solderability of Tin-Gold Intermetallic, & NTC: Prius discussion...	Steve Gregory	Thu, 17 Jan 2008 08:25:31 -0600
Re: Solderability of Tin-Gold Intermetallic, & NTC: Prius discussion...	Brian Ellis	Thu, 17 Jan 2008 17:58:21 +0200
Re: Solderability of Tin-Gold Intermetallic, & NTC: Prius discussion...	Steve Gregory	Thu, 17 Jan 2008 10:30:06 -0600
Solderability of Tin-Gold Intermetallic, summing up	Hfjord	Sat, 19 Jan 2008 00:18:04 +0100
Re: Solderability of Tin-Gold Intermetallic, summing up	Bev Christian	Fri, 18 Jan 2008 18:43:59 -0500
Soldering of Gold Finishes Reference	David D. Hillman	Tue, 22 Jan 2008 11:39:34 -0600
Source for TO-5 cans for packaging custom components	McGlaughlin, Jeffrey A	Mon, 21 Jan 2008 15:35:08 -0500
Re: Source for TO-5 cans for packaging custom components	Creswick, Steven	Tue, 22 Jan 2008 10:07:13 -0500
specifying board cleanliness	Phil Nutting	Thu, 3 Jan 2008 09:44:43 -0500
Re: specifying board cleanliness	Douglas O. Pauls	Thu, 3 Jan 2008 09:00:40 -0600
Re: specifying board cleanliness	Graham Collins	Thu, 3 Jan 2008 11:09:58 -0400
Re: specifying board cleanliness	<>	Thu, 3 Jan 2008 11:34:34 EST
Re: specifying board cleanliness	Tom Newton	Thu, 3 Jan 2008 10:36:26 -0600
Re: specifying board cleanliness	Douglas O. Pauls	Thu, 3 Jan 2008 10:46:32 -0600
Re: specifying board cleanliness	Graham Naisbitt	Thu, 3 Jan 2008 16:52:05 +0000
Re: specifying board cleanliness	Douglas O. Pauls	Thu, 3 Jan 2008 11:47:46 -0600
Re: specifying board cleanliness	Richard Kraszewski	Thu, 3 Jan 2008 15:35:46 -0500
Re: specifying board cleanliness	Phil Nutting	Thu, 3 Jan 2008 13:05:23 -0500
Re: specifying board cleanliness	Douglas O. Pauls	Thu, 3 Jan 2008 15:29:10 -0600
Re: specifying board cleanliness	Terry L. Munson	Thu, 3 Jan 2008 18:08:11 EST
Re: specifying board cleanliness	Wrobel, Clayton	Fri, 4 Jan 2008 09:48:02 -0500
Re: specifying board cleanliness	Phil Nutting	Fri, 4 Jan 2008 09:54:31 -0500
Re: specifying board cleanliness	- bogert	Sun, 6 Jan 2008 14:04:42 -0500
Re: specifying board cleanliness	<>	Sun, 6 Jan 2008 23:56:42 EST
Re: specifying board cleanliness	Brian Ellis	Mon, 7 Jan 2008 09:09:10 +0200
Re: specifying board cleanliness	Graham Collins	Mon, 7 Jan 2008 09:00:05 -0400
Re: specifying board cleanliness	Yuan-chia Joyce Koo	Mon, 7 Jan 2008 08:21:08 -0500
Re: specifying board cleanliness	Graham Collins	Mon, 7 Jan 2008 09:51:11 -0400
Re: specifying board cleanliness	Stadem, Richard D.	Mon, 7 Jan 2008 09:20:04 -0600
Squeegee Studies	Leland Woodall	Thu, 17 Jan 2008 10:18:52 -0500
Re: Squeegee Studies	Whittaker, Dewey (EHCOE)	Thu, 17 Jan 2008 10:01:32 -0700
Re: Squeegee Studies	John Burke	Thu, 17 Jan 2008 09:58:46 -0800
Re: Squeegee Studies	Kathy Kuhlow	Thu, 17 Jan 2008 17:32:44 -0600
SV: [TN] Coffin-Manson	Hfjord	Wed, 23 Jan 2008 21:32:07 +0100
Re: SV: [TN] Coffin-Manson	al shirazi	Wed, 23 Jan 2008 14:34:39 -0800
Re: SV: [TN] Coffin-Manson	Werner Engelmaier /*	Wed, 23 Jan 2008 18:31:40 EST
SV: [TN] Coffin-Manson	Hfjord	Thu, 24 Jan 2008 19:36:29 +0100
SV: [TN] copper adhesion to ceramic substrate	Hfjord	Mon, 14 Jan 2008 21:43:17 +0100
SV: [TN] EU "simplification"	Hfjord	Sun, 20 Jan 2008 14:39:24 +0100
SV: [TN] Reflow profile development - correct starting temperature for evaluating TAL using non-eutectic solders	Hfjord	Mon, 7 Jan 2008 18:56:23 +0100
Re: SV: [TN] Reflow profile development - correct starting temperature for evaluating TAL using non-eutectic solders	Stadem, Richard D.	Mon, 7 Jan 2008 12:29:38 -0600
Re: SV: [TN] Reflow profile development - correct starting temperature for evaluating TAL using non-eutectic solders	Hernefjord Ingemar	Tue, 8 Jan 2008 09:15:54 +0100
Re: SV: [TN] Reflow profile development - correct starting temperature for evaluating TAL using non-eutectic solders	Werner Engelmaier /*	Tue, 8 Jan 2008 08:20:13 EST
SV: [TN] Reflow profile development - correct starting temperature for evaluating TAL using non-eutectic solders	Hfjord	Tue, 8 Jan 2008 18:18:31 +0100
SV: [TN] reflow soldering metal backed pcb	Hfjord	Wed, 2 Jan 2008 21:27:15 +0100
SV: [TN] Solder fines	Hfjord	Wed, 23 Jan 2008 19:21:51 +0100
Re: SV: [TN] Solder fines	Stadem, Richard D.	Wed, 23 Jan 2008 12:50:03 -0600
SV: [TN] Solder fines	Hfjord	Wed, 23 Jan 2008 21:11:30 +0100
SV: [TN] Solderability of Tin-Gold Intermetallic	Hfjord	Wed, 16 Jan 2008 19:35:36 +0100
Re: SV: [TN] Solderability of Tin-Gold Intermetallic	Joyce Koo	Wed, 16 Jan 2008 13:56:47 -0500
Re: SV: [TN] Solderability of Tin-Gold Intermetallic	Igoshev, Vladimir	Wed, 16 Jan 2008 14:07:11 -0500
Re: SV: [TN] Solderability of Tin-Gold Intermetallic	Werner Engelmaier /*	Wed, 16 Jan 2008 14:29:54 EST
SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic	Hfjord	Wed, 16 Jan 2008 21:54:37 +0100
SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic	Hfjord	Wed, 16 Jan 2008 22:08:43 +0100
Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic	Werner Engelmaier /*	Wed, 16 Jan 2008 16:09:43 EST
Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic	Bev Christian	Wed, 16 Jan 2008 16:32:10 -0500
Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic	Steve Gregory	Wed, 16 Jan 2008 15:35:27 -0600
Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic	Werner Engelmaier /*	Wed, 16 Jan 2008 16:54:56 EST
Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic	Werner Engelmaier /*	Wed, 16 Jan 2008 16:58:09 EST
Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic	David D. Hillman	Wed, 16 Jan 2008 16:05:31 -0600
Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic	Bev Christian	Wed, 16 Jan 2008 17:24:52 -0500
Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic	Igoshev, Vladimir	Wed, 16 Jan 2008 19:12:07 -0500
Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic	Yuan-chia Joyce Koo	Wed, 16 Jan 2008 19:36:38 -0500
Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic	Bev Christian	Wed, 16 Jan 2008 19:28:07 -0500
Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic	Bev Christian	Wed, 16 Jan 2008 19:30:08 -0500
Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic	Igoshev, Vladimir	Wed, 16 Jan 2008 19:45:51 -0500
Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic	Hernefjord Ingemar	Thu, 17 Jan 2008 09:19:57 +0100
Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic	Brian Ellis	Thu, 17 Jan 2008 10:23:29 +0200
Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic	Hernefjord Ingemar	Thu, 17 Jan 2008 09:42:20 +0100
Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic	Hernefjord Ingemar	Thu, 17 Jan 2008 09:48:56 +0100
Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic	Brian Ellis	Thu, 17 Jan 2008 11:43:14 +0200
Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic	Hernefjord Ingemar	Thu, 17 Jan 2008 10:59:40 +0100
Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic	Brian Ellis	Thu, 17 Jan 2008 13:53:44 +0200
Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic	David D. Hillman	Thu, 17 Jan 2008 07:20:38 -0600
Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic	Mike Fenner	Thu, 17 Jan 2008 13:20:40 -0000
Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic	Hernefjord Ingemar	Thu, 17 Jan 2008 14:33:45 +0100
Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic	Bev Christian	Thu, 17 Jan 2008 08:39:52 -0500
Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic	Igoshev, Vladimir	Thu, 17 Jan 2008 09:56:29 -0500
Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic	David D. Hillman	Thu, 17 Jan 2008 09:05:55 -0600
Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic	Igoshev, Vladimir	Thu, 17 Jan 2008 10:25:46 -0500
Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic	David D. Hillman	Thu, 17 Jan 2008 09:33:14 -0600
Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic	Werner Engelmaier /*	Thu, 17 Jan 2008 10:36:03 EST
Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic	Bev Christian	Thu, 17 Jan 2008 10:42:21 -0500
Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic	Igoshev, Vladimir	Thu, 17 Jan 2008 10:48:02 -0500
Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic	Guy Ramsey	Thu, 17 Jan 2008 13:50:33 -0500
Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic	John Burke	Thu, 17 Jan 2008 11:09:28 -0800
Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic	David D. Hillman	Thu, 17 Jan 2008 13:38:21 -0600
Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic	Werner Engelmaier /*	Thu, 17 Jan 2008 14:45:09 EST
Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic	David D. Hillman	Thu, 17 Jan 2008 13:59:45 -0600
Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic	Igoshev, Vladimir	Thu, 17 Jan 2008 15:09:41 -0500
Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic	Hernefjord Ingemar	Fri, 18 Jan 2008 10:45:29 +0100
Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic	Wenger, George M.	Fri, 18 Jan 2008 07:25:13 -0500
Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic	Werner Engelmaier /*	Fri, 18 Jan 2008 07:57:48 EST
Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic	Rex Waygood	Fri, 18 Jan 2008 13:04:09 -0000
Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic	Bev Christian	Fri, 18 Jan 2008 08:24:27 -0500
Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic	David D. Hillman	Fri, 18 Jan 2008 07:34:42 -0600
Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic	Bev Christian	Fri, 18 Jan 2008 08:36:33 -0500
Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic	Bev Christian	Fri, 18 Jan 2008 08:44:02 -0500
Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic	Yuan-chia Joyce Koo	Fri, 18 Jan 2008 09:10:23 -0500
Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic	Roberts, Jon	Fri, 18 Jan 2008 08:03:33 -0600
Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic	Wenger, George M.	Fri, 18 Jan 2008 10:07:20 -0500
Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic	Wenger, George M.	Fri, 18 Jan 2008 10:16:30 -0500
Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic	Bev Christian	Fri, 18 Jan 2008 10:17:56 -0500
Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic	Reuven Rokah	Fri, 18 Jan 2008 19:31:10 +0200
Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic	Werner Engelmaier /*	Fri, 18 Jan 2008 15:43:14 EST
Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic	Werner Engelmaier /*	Fri, 18 Jan 2008 15:48:45 EST
Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic	Igoshev, Vladimir	Fri, 18 Jan 2008 15:49:21 -0500
Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic	Werner Engelmaier /*	Fri, 18 Jan 2008 15:59:49 EST
Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic	Werner Engelmaier /*	Fri, 18 Jan 2008 16:02:10 EST
Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic	Wenger, George M.	Fri, 18 Jan 2008 16:18:04 -0500
Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic	Victor G. Hernandez	Fri, 18 Jan 2008 15:27:54 -0600
Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic	Wenger, George M.	Fri, 18 Jan 2008 16:36:41 -0500
Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic	Werner Engelmaier /*	Fri, 18 Jan 2008 17:06:28 EST
Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic	Reuven Rokah	Sun, 20 Jan 2008 09:14:58 +0200
Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic - Hybrid Vehicles	Creswick, Steven	Thu, 17 Jan 2008 07:10:18 -0500
Re: SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic - Hybrid Vehicles	Brian Ellis	Thu, 17 Jan 2008 14:49:05 +0200
SV: [TN] Warpage of components	Hfjord	Tue, 8 Jan 2008 16:55:37 +0100
Re: SV: [TN] Warpage of components	Victor G. Hernandez	Tue, 8 Jan 2008 11:17:06 -0600
Re: SV: [TN] Warpage of components	Herminia Guevarra	Tue, 8 Jan 2008 12:49:24 -0500
SV: [TN] Warpage of components	Hfjord	Tue, 8 Jan 2008 22:16:21 +0100
Re: SV: [TN] Warpage of components	Steve Gregory	Tue, 8 Jan 2008 16:24:01 -0600
Re: SV: [TN] Warpage of components	Hernefjord Ingemar	Wed, 9 Jan 2008 09:42:19 +0100
Re: SV: [TN] Warpage of components	Gumpert, Ben	Wed, 9 Jan 2008 06:59:09 -0500
Re: SV: [TN] Warpage of components	Hernefjord Ingemar	Wed, 9 Jan 2008 14:00:56 +0100
Re: SV: [TN] Warpage of components	Joe Fjelstad	Wed, 9 Jan 2008 14:04:13 EST
Re: TechNet Digest - 2 Jan 2008 to 3 Jan 2008 (#2008-3)	Dan Groulx	Fri, 4 Jan 2008 01:18:34 -0500
Terry L Huddleston/ElecTec/Teledyne is out of the office.	Terry Huddleston	Tue, 29 Jan 2008 12:44:20 -0800
through hole current carrying capacity	Barton, Ken	Tue, 22 Jan 2008 11:14:51 -0800
Re: through hole current carrying capacity	Chris Ball	Tue, 22 Jan 2008 14:52:10 -0500
Upcoming IPC events you should miss! Register today!	Tina Nerad	Fri, 18 Jan 2008 14:33:55 -0600
Re: Upcoming IPC events you should miss! Register today!	R Sedlak	Fri, 18 Jan 2008 12:37:19 -0800
Re: Upcoming IPC events you should miss! Register today!	Franklin Asbell	Fri, 18 Jan 2008 14:42:57 -0600
Re: Upcoming IPC events you should miss! Register today!	Dave Dixon	Fri, 18 Jan 2008 15:41:20 -0600
Re: Upcoming IPC events you should miss! Register today!	R Sedlak	Fri, 18 Jan 2008 15:11:46 -0800
Re: Upcoming IPC events you should miss! Register today!	Stadem, Richard D.	Mon, 21 Jan 2008 07:00:51 -0600
Upcoming IPC workshops in Bannockburn, Illinois!	Tina Nerad	Fri, 25 Jan 2008 15:02:46 -0600
Upcoming IPC workshops on printed board technology!	Tina Nerad	Fri, 18 Jan 2008 09:22:24 -0600
Used Equipment Sales	Blair Hogg	Thu, 31 Jan 2008 07:00:56 -0600
Re: Used Equipment Sales	Joyce Koo	Thu, 31 Jan 2008 08:20:13 -0500
Re: Used Equipment Sales	Stadem, Richard D.	Thu, 31 Jan 2008 07:39:54 -0600
Re: Used Equipment Sales	Davis, Larry	Thu, 31 Jan 2008 05:46:27 -0800
Re: Used Equipment Sales	Steve Gregory	Thu, 31 Jan 2008 08:12:08 -0600
Re: Used Equipment Sales	Jerry Dengler	Thu, 31 Jan 2008 09:15:26 -0500
Re: Used Equipment Sales	Stadem, Richard D.	Thu, 31 Jan 2008 09:56:18 -0600
Re: Used Equipment Sales	Blair Hogg	Thu, 31 Jan 2008 10:38:10 -0600
Re: Used Equipment Sales	<>	Thu, 31 Jan 2008 22:22:54 EST
Re: Used Equipment Sales	Sklenar Vit (AE/MFE3-AU)	Fri, 1 Feb 2008 11:37:01 +0800
Warpage of components	Bev Christian	Mon, 7 Jan 2008 09:30:27 -0500
Re: Warpage of components	Hernefjord Ingemar	Mon, 7 Jan 2008 15:57:14 +0100
Re: Warpage of components	Guy Ramsey	Mon, 7 Jan 2008 15:28:27 -0500
Re: Warpage of components	Bev Christian	Mon, 7 Jan 2008 15:29:26 -0500
Re: Warpage of components	Werner Engelmaier /*	Mon, 7 Jan 2008 16:06:31 EST
Re: Warpage of components	Stadem, Richard D.	Mon, 7 Jan 2008 15:09:47 -0600
Re: Warpage of components	Hernefjord Ingemar	Tue, 8 Jan 2008 09:13:37 +0100
Re: Warpage of components	Guy Ramsey	Tue, 8 Jan 2008 07:36:15 -0500
Re: Warpage of components	Hernefjord Ingemar	Tue, 8 Jan 2008 13:49:30 +0100
Re: Warpage of components	Werner Engelmaier /*	Tue, 8 Jan 2008 08:14:55 EST
Re: Warpage of components	Yuan-chia Joyce Koo	Tue, 8 Jan 2008 08:28:42 -0500
Re: Warpage of components	Werner Engelmaier /*	Tue, 8 Jan 2008 08:23:39 EST
Warpage of components	Bev Christian	Wed, 9 Jan 2008 08:13:35 -0500
Wedge bonds	Guenter Grossmann	Wed, 30 Jan 2008 17:15:36 +0100
Re: Wedge bonds	Thayer, Wayne	Wed, 30 Jan 2008 11:26:57 -0500
Re: Wedge bonds	Creswick, Steven	Wed, 30 Jan 2008 11:28:36 -0500
Re: Wedge bonds	Sauer, Steve (Xetron)	Wed, 30 Jan 2008 14:24:36 -0600
FW: [KECE] Further implementing guidance on Korea RoHS/ELV delivered quickly	John Burke	Tue, 8 Jan 2008 12:52:16 -0800
FW: [LF] Korea RoHS Update (sort of)	John Burke	Wed, 30 Jan 2008 16:25:12 -0800
Re: FW: [LF] Korea RoHS Update (sort of)	Randy Bock Sr.	Thu, 31 Jan 2008 07:35:32 -0500
FW: [LF] RoHS stakeholder consultation launched	John Burke	Mon, 28 Jan 2008 07:57:45 -0800
Fwd: Re: [TN] Air bubble in solder resist	Luan Nguyen	Thu, 10 Jan 2008 09:49:56 +0700
Re: Fwd: Re: [TN] Air bubble in solder resist	HuGause	Thu, 10 Jan 2008 13:14:49 +0800
Re: Fwd: Re: [TN] Air bubble in solder resist	Brian Ellis	Thu, 10 Jan 2008 09:45:04 +0200
Re: Fwd: Re: [TN] Air bubble in solder resist	Stadem, Richard D.	Thu, 10 Jan 2008 06:27:50 -0600
Re: Fwd: Re: [TN] Air bubble in solder resist	Steve Gregory	Thu, 10 Jan 2008 06:39:37 -0600
Re: Fwd: Re: [TN] Air bubble in solder resist	Whittaker, Dewey (EHCOE)	Thu, 10 Jan 2008 07:14:47 -0700
FW: [TN] EU "simplification"	Mike Fenner	Mon, 21 Jan 2008 13:42:19 -0000

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