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May 2006


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回复: Re: [TN] Thermal cycle test for plated through holes filled with epoxy ink and cap plated on the top (1 message)
回覆: Re: [TN] IPC handling-packaging specifications (1 message)
转发: 回复: RE: [TN] Thermal cycle test for plated through holes filled with epoxy ink and cap plated on the top (1 message)
转发: 回复: Re: [TN] Thermal cycle test for plated through holes filled with epoxy ink and cap plated on the top (1 message)
(瑞星提示-此邮ä (1 message)
(瑞星提示-此邮件可能是垃圾邮件)Re: [TN] Question about ENIG i (1 message)
0402 Experience and Pitfalls (12 messages)
100000 hits at Push back - thanks to all (1 message)
5th Stakeholder consultation (6 messages)
62Sn/36Pb/2Ag solder - too good to be true? (5 messages)
??: Re: [TN] IPC handling-packaging specifications (1 message)
A Swiss watch tale for a Friday. (1 message)
Acceptance criteria for immersion tin (3 messages)
Antw: Re: [TN] 62Sn/36Pb/2Ag solder - too good to be true? (6 messages)
Antw: Re: [TN] Rohs Weeeeeee board material (Out of office) (1 message)
Articles on lead free solders and RoHS (2 messages)
AS9102 First Article question (5 messages)
Baking Moisture Sensitive Components (1 message)
BGA problem (9 messages)
board edge to the connector soldering pad (1 message)
Board wash (5 messages)
Bow and twist Question (1 message)
Call For Papers 2007 (1 message)
Carbon Ink (1 message)
China and Korean RoHS documents (1 message)
China-NTC (3 messages)
China-NTC - don't read while eating or drinking (3 messages)
Chris BALL/AuburnHills/VSDS/VALEO is out of the office. (1 message)
Component Segregation (3 messages)
CONGRATULATIONS JOHN (1 message)
Connector Shear... (6 messages)
copper foil surface (1 message)
Copper plating question (6 messages)
Countdown timer for RoHS and competition (1 message)
Cracked ICs (6 messages)
Darrel Therriault is out of the office. (1 message)
DFA/M (3 messages)
Dip or Float (4 messages)
DTi material on WEEE and ROHS Directives (1 message)
electroless gold thickness' (6 messages)
Electrolytic Ag Suppliers for COB applications (5 messages)
Electrolytic Ni/Au in DES (5 messages)
emz file (5 messages)
Exemption possibilities for lead in solders on environmental grounds (1 message)
Failure Analysis Services (8 messages)
Fishbone for Water Washing (3 messages)
FW: Lead in solders replacements - environmental impact - letter to the commissioner (1 message)
FW: NEW exemption request under ENV:Directive 2002/95 EC Article 5(1)(b) (1 message)
FW: [TN] electroless gold thickness' (1 message)
FW: [TN] Ionic Tester filter media ? (1 message)
FW: [TN] Rohs WEEE board material (1 message)
FW: [TN] Swage Tooling Identification (4 messages)
FW: [TN] Swage Tooling Identification...I made me a swage tool holder! (7 messages)
Fwd: Article on counterfeiting of electronics (1 message)
FYI.... (32 messages)
FYI....ISO14001 vs HSPM (1 message)
Good evening I have some good news (1 message)
HAST experts (1 message)
Idea - Suggestion (6 messages)
Idea - Suggestion - NTC (2 messages)
In Circuit Test pad sizes (4 messages)
Intrusive Reflow (6 messages)
Ionic Tester filter media ? (9 messages)
IPC 4th International Conference on Flexible Circuits and Chip Scale Packaging (1 message)
IPC 620 (2 messages)
IPC handling-packaging specifications (3 messages)
IPC roadmap (2 messages)
IPC RoHS/Materials Declaration webcast series (1 message)
IPC specification for ImSn (1 message)
IPC Standard (10 messages)
IPC Standard - Board edge clearance (2 messages)
IPC Standard / PWB Router edge clearance (4 messages)
IPC Standard msg4 (5 messages)
IPC TRAINING DVD'S (1 message)
IPC Workshops "Ensuring RoHS Compliance through Materials Declaration Tools" in San Francisco, CA and Seattle, WA (1 message)
IPC-4103 vs. MIL-P-13949 (2 messages)
IPC/JEDEC First International Conference on Materials Declaration in Rosemont, IL on 6/6-7 (1 message)
IPC/JEDEC International Conference on Materials Declaration-June 6-7, 2006, Rosemont, IL (1 message)
IPC/JEDEC Materials Declaration Conference in Rosemont, IL on June 6-7, 2006 (1 message)
IPCWorks CFP 2006 (1 message)
Joel Alexander is out of the office. (2 messages)
Laser Ablation of Soldermask (6 messages)
Latest updates on RoHS round 5 exemptions and US postal stamps (17 messages)
Listserv service interruption Friday May 26th (2 messages)
Looking for a camera for a DEK 265 (3 messages)
Low Cost Lead Coplanarity Check Tool (3 messages)
Low Profile Surface Mount Connectors (1 message)
Manual Assembly (2 messages)
Materials Declaration (15 messages)
Matte-tin part lead/termination finish when soldered using Sn63 solder (1 message)
Maximum Contact Normal Force On ENIG Surfaace (1 message)
mc 790 (9 messages)
mc 790 is available (2 messages)
Mil-Spec resistors (3 messages)
MiniWave Solderpot Recommendations (5 messages)
Mixing Lead-free Plated Parts with Leaded Solder (4 messages)
More RoHS Press (2 messages)
N2 flow rates (8 messages)
NEW exemption request under ENV:Directive 2002/95 EC Article 5(1)(b) (3 messages)
Not yet time for the Champagne, yet... (7 messages)
NTC #2 Get the Lead Out (3 messages)
NTC - mc 790 (3 messages)
NTC - Surface Tension Data for SAC305 (1 message)
NTC BUT- Tin industry appears to have some serious supply chain exploitation issues (4 messages)
NTC Congo's tin men (1 message)
NTC Europen based Environmental agency taken to court over environmental damage - and lost the case...... (1 message)
NTC Exemptions applications and some fun (2 messages)
NTC Friday Posting... (4 messages)
NTC Get the Lead Out (21 messages)
NTC Harleys (1 message)
NTC I month later and the Hitch Hikers Guide (2 messages)
NTC It's Friday somewhere in the World - good morning... (1 message)
NTC Its Friday another memorable date number. (2 messages)
NTC Press release link on round 5 exemptions notification for inputs for RoHS (1 message)
NTC RE: TAC committee for RoHS (1 message)
NTC Thank you for all of your support for Pushback (4 messages)
NTC- Do not open until Friday (1 message)
NTC-Dewey started it... (2 messages)
NTC-PUN (21 messages)
NTC...Off topic reading (1 message)
Opaque black PCB material (3 messages)
Oxide Scratches (2 messages)
PCB shelf life (2 messages)
plating materials (1 message)
Plating process (6 messages)
Plating Tails (7 messages)
Plating Thickness (1 message)
PREHEATING (3 messages)
Pressure Sensitive Adhesive (9 messages)
Pump printing (5 messages)
Pushback blog site up and running (2 messages)
Putting your money where your mind is... (3 messages)
PWB de-paneling (5 messages)
QC 080000 Certified (4 messages)
Question about ENIG and other surface finishing (20 messages)
Question about ENIG in SnPb process . . . . (23 messages)
Randall L Bock/MSD/US/PBI is out of the office. (1 message)
Register now for How to Launch Your IPC-1752 Materials Declaration Program Workshop in Tampa, FL or Chelmsford, MA (1 message)
reliability data on lead free real life scenario (7 messages)
Rohs Weeeeeee board material (62 messages)
Silkscreen on pads (24 messages)
SMT Stressed Connector rework issue (3 messages)
Soda Strawing (1 message)
solder ball analysis (9 messages)
Solder Mask / Gold Finger Plating Spec (1 message)
Solder mask defined annular rings (1 message)
Soldermask adhesion over vias? (3 messages)
Stop Press II (1 message)
Storage (2 messages)
Support of John Burke (6 messages)
Surface Tension Data for SAC305 (7 messages)
Swage Tooling Identification (11 messages)
SWATCH article (1 message)
T0-257 (1 message)
TAC committee for RoHS (1 message)
TAC decisions and lead in solders (1 message)
TechNet Digest - 10 May 2006 to 11 May 2006 (#2006-127) (1 message)
Thermal cycle test for plated through holes filled with epoxy ink and cap plated on the top (7 messages)
Thermal cycle test for plated through holes filled with epoxy inkand cap plated on the top (1 message)
Thermal cycle test for plated through holes filled with epoxyink and cap plated on (2 messages)
Thermal stitching in SMT boards (1 message)
Thieving (6 messages)
Tin whisker position and China translation (1 message)
Tin Whisker REVENGE (4 messages)
Underfill or else... (2 messages)
Unplugged via under BGA (4 messages)
Upcoming IPC Events on RoHS and Materials Declaration (2 messages)
Urgent need to obtain temporary supply of Kester HF1189A wave solder flux (1 message)
Use of Fiducials & thermal stitching (7 messages)
Water Engine (2 messages)
Wicking in Printed Circuit Board (2 messages)
Workmanship (4 messages)
[LF] 5th Stakeholder consultation (1 message)
[LF] Back to square one (1 message)
[NTC] Isn't technet GREAT? (2 messages)
[NTC] MiniWave Solderpot Recommendations (4 messages)
[NTC]Re: [TN] Tin Whisker REVENGE (9 messages)
[spam] Re: [TN] FW: [TN] electroless gold thickness' (1 message)
[spam] Re: [TN] Rohs Weeeeeee board material (1 message)
[TN] Re: (瑞星提ç (1 message)

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New Thread

回复: Re: [TN] Thermal cycle test for plated through holes filled with epoxy ink and cap plated on the top

回复: Re: [TN] Thermal cycle test for plated through holes filled with epoxy ink and cap plated on the top

christian ge <[log in to unmask]>

Thu, 25 May 2006 10:03:24 +0800

150 lines

New Thread

回覆: Re: [TN] IPC handling-packaging specifications

回覆: Re: [TN] IPC handling-packaging specifications

Lin Leo <[log in to unmask]>

Tue, 2 May 2006 11:15:11 +0800

97 lines

New Thread

转发: 回复: RE: [TN] Thermal cycle test for plated through holes filled with epoxy ink and cap plated on the top

转发: 回复: RE: [TN] Thermal cycle test for plated through holes filled with epoxy ink and cap plated on the top

christian ge <[log in to unmask]>

Thu, 25 May 2006 10:17:38 +0800

85 lines

New Thread

转发: 回复: Re: [TN] Thermal cycle test for plated through holes filled with epoxy ink and cap plated on the top

转发: 回复: Re: [TN] Thermal cycle test for plated through holes filled with epoxy ink and cap plated on the top

christian ge <[log in to unmask]>

Thu, 25 May 2006 10:15:40 +0800

73 lines

New Thread

(瑞星提示-此邮ä

Re: (瑞星提示-此邮ä

白俊 <[log in to unmask]>

Tue, 9 May 2006 13:44:37 +0800

187 lines

New Thread

(瑞星提示-此邮件可能是垃圾邮件)Re: [TN] Question about ENIG i

Re: (瑞星提示-此邮件可能是垃圾邮件)Re: [TN] Question about ENIG i

白俊 <[log in to unmask]>

Fri, 12 May 2006 16:59:22 +0800

80 lines

New Thread

0402 Experience and Pitfalls

0402 Experience and Pitfalls

Ryan, Will <[log in to unmask]>

Wed, 10 May 2006 08:34:20 -0400

53 lines

Re: 0402 Experience and Pitfalls

Graham Collins <[log in to unmask]>

Wed, 10 May 2006 09:04:12 -0400

105 lines

Re: 0402 Experience and Pitfalls

Kerry McMullen <[log in to unmask]>

Wed, 10 May 2006 09:11:26 -0400

110 lines

Re: 0402 Experience and Pitfalls

Reuven ROKAH <[log in to unmask]>

Wed, 10 May 2006 16:13:14 +0300

107 lines

Re: 0402 Experience and Pitfalls

Tempea, Ioan <[log in to unmask]>

Wed, 10 May 2006 09:22:02 -0400

150 lines

Re: 0402 Experience and Pitfalls

Ryan, Will <[log in to unmask]>

Wed, 10 May 2006 10:20:59 -0400

65 lines

Re: 0402 Experience and Pitfalls

James Verrette <[log in to unmask]>

Fri, 12 May 2006 09:06:23 -0400

73 lines

Re: 0402 Experience and Pitfalls

Kerry McMullen <[log in to unmask]>

Fri, 12 May 2006 10:08:51 -0400

131 lines

Re: 0402 Experience and Pitfalls

Steve Gregory <[log in to unmask]>

Fri, 12 May 2006 09:24:43 -0500

159 lines

Re: 0402 Experience and Pitfalls

James Verrette <[log in to unmask]>

Tue, 16 May 2006 16:53:18 -0400

162 lines

Re: 0402 Experience and Pitfalls

mickey weiner <[log in to unmask]>

Wed, 17 May 2006 16:35:36 +0300

204 lines

Re: 0402 Experience and Pitfalls

mickey weiner <[log in to unmask]>

Thu, 18 May 2006 08:24:02 +0300

252 lines

New Thread

100000 hits at Push back - thanks to all

100000 hits at Push back - thanks to all

John Burke <[log in to unmask]>

Mon, 8 May 2006 20:53:37 -0700

75 lines

New Thread

5th Stakeholder consultation

5th Stakeholder consultation

John Burke <[log in to unmask]>

Thu, 11 May 2006 01:08:48 -0700

146 lines

Re: 5th Stakeholder consultation

John Burke <[log in to unmask]>

Thu, 11 May 2006 01:21:07 -0700

175 lines

Re: 5th Stakeholder consultation

John Burke <[log in to unmask]>

Thu, 11 May 2006 14:23:26 -0700

55 lines

Re: 5th Stakeholder consultation

John Burke <[log in to unmask]>

Fri, 12 May 2006 09:15:35 -0700

125 lines

Re: 5th Stakeholder consultation

John Burke <[log in to unmask]>

Sat, 13 May 2006 17:10:38 -0700

151 lines

5th Stakeholder consultation

John Burke <[log in to unmask]>

Mon, 15 May 2006 18:28:10 -0700

115 lines

New Thread

62Sn/36Pb/2Ag solder - too good to be true?

62Sn/36Pb/2Ag solder - too good to be true?

Jeff Brown <[log in to unmask]>

Thu, 18 May 2006 10:08:18 +1000

36 lines

Re: 62Sn/36Pb/2Ag solder - too good to be true?

Werner Engelmaier <[log in to unmask]>

Wed, 17 May 2006 20:49:42 EDT

26 lines

Re: 62Sn/36Pb/2Ag solder - too good to be true?

John Burke <[log in to unmask]>

Wed, 17 May 2006 18:02:05 -0700

59 lines

Re: 62Sn/36Pb/2Ag solder - too good to be true?

Steve Gregory <[log in to unmask]>

Thu, 18 May 2006 08:16:38 -0500

83 lines

Re: 62Sn/36Pb/2Ag solder - too good to be true?

Dehoyos, Ramon <[log in to unmask]>

Thu, 18 May 2006 10:32:56 -0400

132 lines

New Thread

??: Re: [TN] IPC handling-packaging specifications

Re: ??: Re: [TN] IPC handling-packaging specifications

Kane, Amol (349) <[log in to unmask]>

Tue, 2 May 2006 07:02:43 -0400

148 lines

New Thread

A Swiss watch tale for a Friday.

A Swiss watch tale for a Friday.

John Burke <[log in to unmask]>

Fri, 12 May 2006 17:49:12 -0700

41 lines

New Thread

Acceptance criteria for immersion tin

Acceptance criteria for immersion tin

ZLATKO BIJEDIC <[log in to unmask]>

Sat, 6 May 2006 03:20:54 -0700

22 lines

Re: Acceptance criteria for immersion tin

Franklin D Asbell <[log in to unmask]>

Sat, 6 May 2006 23:32:44 -0500

51 lines

Re: Acceptance criteria for immersion tin

ZLATKO BIJEDIC <[log in to unmask]>

Sun, 7 May 2006 08:42:11 -0700

68 lines

New Thread

Antw: Re: [TN] 62Sn/36Pb/2Ag solder - too good to be true?

Antw: Re: [TN] 62Sn/36Pb/2Ag solder - too good to be true?

Guenter Grossmann <[log in to unmask]>

Thu, 18 May 2006 16:32:59 +0200

122 lines

Re: Antw: Re: [TN] 62Sn/36Pb/2Ag solder - too good to be true?

Blair K. Hogg <[log in to unmask]>

Thu, 18 May 2006 12:10:00 -0400

153 lines

Re: Antw: Re: [TN] 62Sn/36Pb/2Ag solder - too good to be true?

Werner Engelmaier <[log in to unmask]>

Thu, 18 May 2006 13:03:07 -0400

193 lines

Re: Antw: Re: [TN] 62Sn/36Pb/2Ag solder - too good to be true?

Greg Major <[log in to unmask]>

Fri, 19 May 2006 10:08:25 +1200

286 lines

Re: Antw: Re: [TN] 62Sn/36Pb/2Ag solder - too good to be true?

Werner Engelmaier <[log in to unmask]>

Thu, 18 May 2006 20:11:47 EDT

35 lines

Re: Antw: Re: [TN] 62Sn/36Pb/2Ag solder - too good to be true?

Jeff Brown <[log in to unmask]>

Mon, 22 May 2006 13:44:05 +1000

67 lines

New Thread

Antw: Re: [TN] Rohs Weeeeeee board material (Out of office)

Antw: Re: [TN] Rohs Weeeeeee board material (Out of office)

Guenter Grossmann <[log in to unmask]>

Mon, 29 May 2006 20:48:21 +0200

23 lines

New Thread

Articles on lead free solders and RoHS

Articles on lead free solders and RoHS

John Burke <[log in to unmask]>

Mon, 29 May 2006 19:16:25 -0700

76 lines

Re: Articles on lead free solders and RoHS

John Burke <[log in to unmask]>

Mon, 29 May 2006 20:09:01 -0700

86 lines

New Thread

AS9102 First Article question

AS9102 First Article question

Franklin D Asbell <[log in to unmask]>

Wed, 24 May 2006 12:39:11 -0500

44 lines

Re: AS9102 First Article question

John Burke <[log in to unmask]>

Wed, 24 May 2006 10:46:21 -0700

77 lines

Re: AS9102 First Article question

Jeffrey Bush <[log in to unmask]>

Wed, 24 May 2006 15:07:47 -0400

93 lines

Re: AS9102 First Article question

Franklin D Asbell <[log in to unmask]>

Wed, 24 May 2006 15:07:22 -0500

117 lines

Re: AS9102 First Article question

Donald Vischulis <[log in to unmask]>

Wed, 24 May 2006 18:18:36 -0500

66 lines

New Thread

Baking Moisture Sensitive Components

Re: Baking Moisture Sensitive Components

West, Jim <[log in to unmask]>

Thu, 18 May 2006 13:25:57 -0400

30 lines

New Thread

BGA problem

BGA problem

Azman <[log in to unmask]>

Wed, 3 May 2006 08:47:14 -0500

26 lines

Re: BGA problem

Taylor, Royce <[log in to unmask]>

Wed, 3 May 2006 08:58:29 -0500

76 lines

Re: BGA problem

Tempea, Ioan <[log in to unmask]>

Wed, 3 May 2006 09:59:06 -0400

68 lines

Re: BGA problem

Gervascio, Thomas <[log in to unmask]>

Wed, 3 May 2006 10:17:51 -0400

53 lines

Re: BGA problem

Steve Gregory <[log in to unmask]>

Wed, 3 May 2006 09:20:35 -0500

57 lines

Re: BGA problem

Stadem, Richard D. <[log in to unmask]>

Wed, 3 May 2006 09:40:30 -0500

54 lines

Re: BGA problem

John Burke <[log in to unmask]>

Wed, 3 May 2006 08:59:21 -0700

73 lines

Re: BGA problem

Daniel Blass <[log in to unmask]>

Wed, 3 May 2006 14:08:16 -0500

30 lines

Re: BGA problem

Keld Maaløe <[log in to unmask]>

Thu, 4 May 2006 13:44:34 +0200

70 lines

New Thread

board edge to the connector soldering pad

board edge to the connector soldering pad

Selva Suganthi <[log in to unmask]>

Tue, 23 May 2006 13:35:46 +0530

29 lines

New Thread

Board wash

Board wash

Genny Gibbard <[log in to unmask]>

Thu, 18 May 2006 11:59:26 -0600

36 lines

Re: Board wash

Kane, Joseph E (US SSA) <[log in to unmask]>

Thu, 18 May 2006 15:10:03 -0400

66 lines

Re: Board wash

Steve Gregory <[log in to unmask]>

Thu, 18 May 2006 14:40:54 -0500

76 lines

Re: Board wash

Douglas O. Pauls <[log in to unmask]>

Thu, 18 May 2006 14:49:11 -0500

83 lines

Re: Board wash

Schaefer, Chris <[log in to unmask]>

Fri, 19 May 2006 09:59:48 -0500

96 lines

New Thread

Bow and twist Question

Bow and twist Question

Michael Forrester <[log in to unmask]>

Thu, 4 May 2006 05:19:13 -0400

32 lines

New Thread

Call For Papers 2007

Call For Papers 2007

IPC Mail <[log in to unmask]>

Tue, 16 May 2006 15:41:27 -0500

112 lines

New Thread

Carbon Ink

Carbon Ink

Baski Devre <[log in to unmask]>

Tue, 23 May 2006 19:10:43 +0300

43 lines

New Thread

China and Korean RoHS documents

China and Korean RoHS documents

John Burke <[log in to unmask]>

Mon, 1 May 2006 09:22:08 -0700

58 lines

New Thread

China-NTC

China-NTC

Whittaker, Dewey (AZ75) <[log in to unmask]>

Wed, 3 May 2006 09:06:16 -0700

32 lines

Re: China-NTC

Joe Russeau <[log in to unmask]>

Wed, 3 May 2006 11:12:15 -0500

70 lines

Re: China-NTC

Stadem, Richard D. <[log in to unmask]>

Wed, 3 May 2006 12:12:23 -0500

96 lines

New Thread

China-NTC - don't read while eating or drinking

Re: China-NTC - don't read while eating or drinking

Blair K. Hogg <[log in to unmask]>

Wed, 3 May 2006 12:16:47 -0400

61 lines

Re: China-NTC - don't read while eating or drinking

Whittaker, Dewey (AZ75) <[log in to unmask]>

Wed, 3 May 2006 13:04:59 -0700

88 lines

Re: China-NTC - don't read while eating or drinking

Chris Ball <[log in to unmask]>

Wed, 3 May 2006 16:12:32 -0400

137 lines

New Thread

Chris BALL/AuburnHills/VSDS/VALEO is out of the office.

Chris BALL/AuburnHills/VSDS/VALEO is out of the office.

Chris Ball <[log in to unmask]>

Fri, 19 May 2006 16:35:29 -0400

32 lines

New Thread

Component Segregation

Component Segregation

Kane, Amol (349) <[log in to unmask]>

Fri, 26 May 2006 07:10:33 -0400

50 lines

Re: Component Segregation

Randy Bock Sr. <[log in to unmask]>

Fri, 26 May 2006 08:06:17 -0400

102 lines

Re: Component Segregation

Olav Folland <[log in to unmask]>

Fri, 26 May 2006 09:08:37 -0700

64 lines

New Thread

CONGRATULATIONS JOHN

CONGRATULATIONS JOHN

Werner Engelmaier <[log in to unmask]>

Thu, 11 May 2006 11:37:21 EDT

27 lines

New Thread

Connector Shear...

Connector Shear...

Steve Gregory <[log in to unmask]>

Tue, 23 May 2006 09:53:42 -0500

54 lines

Re: Connector Shear...

Jason Gregory <[log in to unmask]>

Tue, 23 May 2006 10:09:36 -0500

92 lines

Re: Connector Shear...

Stadem, Richard D. <[log in to unmask]>

Tue, 23 May 2006 10:15:05 -0500

93 lines

Re: Connector Shear...

Stadem, Richard D. <[log in to unmask]>

Tue, 23 May 2006 10:23:24 -0500

121 lines

Re: Connector Shear...

Jason Gregory <[log in to unmask]>

Tue, 23 May 2006 10:42:24 -0500

154 lines

Re: Connector Shear...

Stadem, Richard D. <[log in to unmask]>

Tue, 23 May 2006 10:48:51 -0500

182 lines

New Thread

copper foil surface

copper foil surface

Joyce Koo <[log in to unmask]>

Thu, 25 May 2006 14:43:39 -0400

32 lines

New Thread

Copper plating question

Copper plating question

Steve Kelly <[log in to unmask]>

Thu, 25 May 2006 10:17:28 -0400

26 lines

Re: Copper plating question

Barmuta, Mike <[log in to unmask]>

Thu, 25 May 2006 08:11:50 -0700

113 lines

Re: Copper plating question

EIMCNews <[log in to unmask]>

Thu, 25 May 2006 08:36:36 -0700

49 lines

Re: Copper plating question

Jeffrey Bush <[log in to unmask]>

Thu, 25 May 2006 13:53:06 -0400

66 lines

Re: Copper plating question

Eddie Rocha <[log in to unmask]>

Fri, 26 May 2006 08:51:39 -0700

160 lines

Re: Copper plating question

Denis Morrissey <[log in to unmask]>

Fri, 26 May 2006 14:27:04 -0400

65 lines

New Thread

Countdown timer for RoHS and competition

Countdown timer for RoHS and competition

John Burke <[log in to unmask]>

Thu, 4 May 2006 09:55:11 -0700

50 lines

New Thread

Cracked ICs

Cracked ICs

Marsico, James <[log in to unmask]>

Wed, 10 May 2006 09:10:46 -0400

37 lines

Re: Cracked ICs

Russ Winslow <[log in to unmask]>

Wed, 10 May 2006 14:58:26 -0700

97 lines

Re: Cracked ICs

Marsico, James <[log in to unmask]>

Mon, 22 May 2006 13:17:06 -0400

121 lines

Re: Cracked ICs

Kane, Amol (349) <[log in to unmask]>

Mon, 22 May 2006 13:57:26 -0400

185 lines

Re: Cracked ICs

Wayne Thayer <[log in to unmask]>

Mon, 22 May 2006 14:21:07 -0400

177 lines

Re: Cracked ICs

Whittaker, Dewey (AZ75) <[log in to unmask]>

Mon, 22 May 2006 13:26:23 -0700

177 lines

New Thread

Darrel Therriault is out of the office.

Darrel Therriault is out of the office.

Darrel Therriault <[log in to unmask]>

Fri, 26 May 2006 04:13:49 -0700

25 lines

New Thread

DFA/M

DFA/M

Avigdor Jakubinsky <[log in to unmask]>

Sat, 13 May 2006 17:28:30 -0500

35 lines

Re: DFA/M

kwood716 <[log in to unmask]>

Sat, 13 May 2006 18:44:18 -0400

74 lines

Re: DFA/M

MYEMAIL <[log in to unmask]>

Sun, 14 May 2006 21:20:19 +0200

115 lines

New Thread

Dip or Float

Dip or Float

Susan Mansilla <[log in to unmask]>

Tue, 30 May 2006 08:15:33 EDT

34 lines

Re: Dip or Float

Stadem, Richard D. <[log in to unmask]>

Tue, 30 May 2006 10:13:42 -0500

69 lines

Re: Dip or Float

Susan Mansilla <[log in to unmask]>

Tue, 30 May 2006 12:29:38 EDT

40 lines

Re: Dip or Float

John Burke <[log in to unmask]>

Tue, 30 May 2006 10:38:36 -0700

86 lines

New Thread

DTi material on WEEE and ROHS Directives

DTi material on WEEE and ROHS Directives

John Burke <[log in to unmask]>

Wed, 24 May 2006 13:49:12 -0700

56 lines

New Thread

electroless gold thickness'

electroless gold thickness'

Cheryl Johnson <[log in to unmask]>

Wed, 24 May 2006 11:43:43 -0600

50 lines

Re: electroless gold thickness'

Lee parker <[log in to unmask]>

Wed, 24 May 2006 14:48:49 -0400

92 lines

Re: electroless gold thickness'

R Sedlak <[log in to unmask]>

Wed, 24 May 2006 15:26:05 -0700

87 lines

Re: electroless gold thickness'

Steve Kelly <[log in to unmask]>

Wed, 24 May 2006 22:19:14 -0400

79 lines

Re: electroless gold thickness'

Dehoyos, Ramon <[log in to unmask]>

Thu, 25 May 2006 11:45:11 -0400

135 lines

Re: electroless gold thickness'

R Sedlak <[log in to unmask]>

Thu, 25 May 2006 09:54:45 -0700

159 lines

New Thread

Electrolytic Ag Suppliers for COB applications

Electrolytic Ag Suppliers for COB applications

Creswick, Steven <[log in to unmask]>

Wed, 24 May 2006 14:59:59 -0400

40 lines

Re: Electrolytic Ag Suppliers for COB applications

Lee Parker <[log in to unmask]>

Wed, 24 May 2006 16:21:34 -0400

80 lines

Re: Electrolytic Ag Suppliers for COB applications

Joe Russeau <[log in to unmask]>

Wed, 24 May 2006 16:05:08 -0500

112 lines

Re: Electrolytic Ag Suppliers for COB applications

Lee parker <[log in to unmask]>

Wed, 24 May 2006 17:14:21 -0400

149 lines

Re: Electrolytic Ag Suppliers for COB applications

Joyce Koo <[log in to unmask]>

Wed, 24 May 2006 18:09:37 -0400

178 lines

New Thread

Electrolytic Ni/Au in DES

Electrolytic Ni/Au in DES

Lin Leo <[log in to unmask]>

Sat, 27 May 2006 15:25:06 +0800

30 lines

Re: Electrolytic Ni/Au in DES

ZLATKO BIJEDIC <[log in to unmask]>

Sat, 27 May 2006 07:25:03 -0700

61 lines

Re: Electrolytic Ni/Au in DES

Happy Holden <[log in to unmask]>

Sat, 27 May 2006 11:28:08 -0400

92 lines

Re: Electrolytic Ni/Au in DES

Denis Morrissey <[log in to unmask]>

Tue, 30 May 2006 08:37:48 -0400

81 lines

Re: Electrolytic Ni/Au in DES

Lin Leo <[log in to unmask]>

Thu, 1 Jun 2006 12:15:26 +0800

94 lines

New Thread

emz file

emz file

Joyce Koo <[log in to unmask]>

Fri, 12 May 2006 09:37:22 -0400

26 lines

Re: emz file

Michael Kuczynski <[log in to unmask]>

Fri, 12 May 2006 09:54:11 -0400

247 lines

Re: emz file

Steve Gregory <[log in to unmask]>

Fri, 12 May 2006 08:58:05 -0500

53 lines

Re: emz file

Joyce Koo <[log in to unmask]>

Fri, 12 May 2006 10:11:30 -0400

78 lines

Re: emz file

Donald Vischulis <[log in to unmask]>

Sat, 13 May 2006 09:53:18 -0500

102 lines

New Thread

Exemption possibilities for lead in solders on environmental grounds

Exemption possibilities for lead in solders on environmental grounds

John Burke <[log in to unmask]>

Sun, 30 Apr 2006 23:57:22 -0700

25 lines

New Thread

Failure Analysis Services

Failure Analysis Services

Croslin, Robert <[log in to unmask]>

Mon, 1 May 2006 14:54:04 -0400

53 lines

Re: Failure Analysis Services

Bloomquist, Ken <[log in to unmask]>

Mon, 1 May 2006 11:58:48 -0700

45 lines

Re: Failure Analysis Services

Steve Gregory <[log in to unmask]>

Mon, 1 May 2006 14:08:41 -0500

87 lines

Re: Failure Analysis Services

Gilbert Roberge <[log in to unmask]>

Mon, 1 May 2006 15:07:50 -0400

89 lines

Re: Failure Analysis Services

Werner Engelmaier <[log in to unmask]>

Mon, 1 May 2006 16:23:03 EDT

26 lines

Re: Failure Analysis Services

Daniel Blass <[log in to unmask]>

Wed, 3 May 2006 10:25:53 -0500

25 lines

Re: Failure Analysis Services

Croslin, Robert <[log in to unmask]>

Wed, 3 May 2006 11:58:13 -0400

55 lines

Re: Failure Analysis Services

Croslin, Robert <[log in to unmask]>

Wed, 3 May 2006 13:48:57 -0400

48 lines

New Thread

Fishbone for Water Washing

Fishbone for Water Washing

Richard Kraszewski <[log in to unmask]>

Fri, 26 May 2006 09:29:14 -0500

26 lines

Re: Fishbone for Water Washing

Douglas O. Pauls <[log in to unmask]>

Fri, 26 May 2006 10:19:55 -0500

77 lines

Re: Fishbone for Water Washing

Stadem, Richard D. <[log in to unmask]>

Fri, 26 May 2006 12:48:40 -0500

104 lines

New Thread

FW: Lead in solders replacements - environmental impact - letter to the commissioner

FW: Lead in solders replacements - environmental impact - letter to the commissioner

John Burke <[log in to unmask]>

Tue, 2 May 2006 11:27:07 -0700

167 lines

New Thread

FW: NEW exemption request under ENV:Directive 2002/95 EC Article 5(1)(b)

FW: NEW exemption request under ENV:Directive 2002/95 EC Article 5(1)(b)

John Burke <[log in to unmask]>

Wed, 24 May 2006 07:53:22 -0700

437 lines

New Thread

FW: [TN] electroless gold thickness'

FW: [TN] electroless gold thickness'

Dehoyos, Ramon <[log in to unmask]>

Thu, 25 May 2006 13:44:54 -0400

232 lines

New Thread

FW: [TN] Ionic Tester filter media ?

FW: [TN] Ionic Tester filter media ?

Dehoyos, Ramon <[log in to unmask]>

Mon, 22 May 2006 14:49:36 -0400

71 lines

New Thread

FW: [TN] Rohs WEEE board material

FW: [TN] Rohs WEEE board material

Whittaker, Dewey (AZ75) <[log in to unmask]>

Wed, 17 May 2006 13:37:20 -0700

92 lines

New Thread

FW: [TN] Swage Tooling Identification

FW: [TN] Swage Tooling Identification

Dehoyos, Ramon <[log in to unmask]>

Tue, 9 May 2006 13:44:13 -0400

195 lines

Re: FW: [TN] Swage Tooling Identification

Stadem, Richard D. <[log in to unmask]>

Tue, 9 May 2006 12:50:26 -0500

221 lines

Re: FW: [TN] Swage Tooling Identification

Steve Mikell <[log in to unmask]>

Wed, 10 May 2006 02:50:53 +0700

89 lines

Re: FW: [TN] Swage Tooling Identification

Martin Butcher <[log in to unmask]>

Tue, 9 May 2006 13:37:29 -0700

109 lines

New Thread

FW: [TN] Swage Tooling Identification...I made me a swage tool holder!

Re: FW: [TN] Swage Tooling Identification...I made me a swage tool holder!

Steve Gregory <[log in to unmask]>

Mon, 15 May 2006 12:47:03 -0500

149 lines

Re: FW: [TN] Swage Tooling Identification...I made me a swage tool holder!

Randy Bock Sr. <[log in to unmask]>

Mon, 15 May 2006 13:52:53 -0400

200 lines

Re: FW: [TN] Swage Tooling Identification...I made me a swage tool holder!

John Burke <[log in to unmask]>

Mon, 15 May 2006 10:55:18 -0700

181 lines

Re: FW: [TN] Swage Tooling Identification...I made me a swage tool holder!

Dehoyos, Ramon <[log in to unmask]>

Mon, 15 May 2006 13:56:50 -0400

178 lines

Re: FW: [TN] Swage Tooling Identification...I made me a swage tool holder!

Genny Gibbard <[log in to unmask]>

Mon, 15 May 2006 12:00:10 -0600

180 lines

Re: FW: [TN] Swage Tooling Identification...I made me a swage tool holder!

Dave Seymour <[log in to unmask]>

Mon, 15 May 2006 14:00:16 -0400

153 lines

Re: FW: [TN] Swage Tooling Identification...I made me a swage tool holder!

Ian Hanna <[log in to unmask]>

Mon, 15 May 2006 14:19:13 -0400

210 lines

New Thread

Fwd: Article on counterfeiting of electronics

Fwd: Article on counterfeiting of electronics

David Douthit <[log in to unmask]>

Mon, 22 May 2006 15:18:41 -0700

94 lines

New Thread

FYI....

FYI....

Ron Peeler <[log in to unmask]>

Wed, 3 May 2006 09:08:21 -0400

30 lines

Re: FYI....

Bloomquist, Ken <[log in to unmask]>

Wed, 3 May 2006 06:30:33 -0700

48 lines

Re: FYI....

Steve Gregory <[log in to unmask]>

Wed, 3 May 2006 08:38:13 -0500

75 lines

Re: FYI....

Tempea, Ioan <[log in to unmask]>

Wed, 3 May 2006 09:43:48 -0400

61 lines

Re: FYI....

Ron Peeler <[log in to unmask]>

Wed, 3 May 2006 09:42:07 -0400

84 lines

Re: FYI....

Ron Peeler <[log in to unmask]>

Wed, 3 May 2006 09:43:21 -0400

107 lines

Re: FYI....

Ron Peeler <[log in to unmask]>

Wed, 3 May 2006 09:45:35 -0400

94 lines

Re: FYI....

Stadem, Richard D. <[log in to unmask]>

Wed, 3 May 2006 09:15:52 -0500

55 lines

Re: FYI....

Jeffrey Bush <[log in to unmask]>

Wed, 3 May 2006 10:41:36 -0400

68 lines

Re: FYI....

Blair K. Hogg <[log in to unmask]>

Wed, 3 May 2006 10:53:12 -0400

44 lines

Re: FYI....

Dale Ritzen <[log in to unmask]>

Wed, 3 May 2006 10:11:22 -0500

74 lines

Re: FYI....

Ted Tontis <[log in to unmask]>

Wed, 3 May 2006 10:29:09 -0500

126 lines

Re: FYI....

Stadem, Richard D. <[log in to unmask]>

Wed, 3 May 2006 10:42:33 -0500

66 lines

Re: FYI....

Leo Higgins <[log in to unmask]>

Wed, 3 May 2006 09:01:47 -0700

115 lines

Re: FYI....

John Burke <[log in to unmask]>

Wed, 3 May 2006 09:13:34 -0700

164 lines

Re: FYI....

Blair K. Hogg <[log in to unmask]>

Wed, 3 May 2006 12:18:16 -0400

81 lines

Re: FYI....

Joe Fjelstad <[log in to unmask]>

Wed, 3 May 2006 14:00:40 EDT

36 lines

Re: FYI....

R Sedlak <[log in to unmask]>

Wed, 3 May 2006 13:23:51 -0700

58 lines

Re: FYI....

Leo Higgins <[log in to unmask]>

Wed, 3 May 2006 14:22:52 -0700

80 lines

Re: FYI....

Stadem, Richard D. <[log in to unmask]>

Thu, 4 May 2006 06:55:50 -0500

60 lines

Re: FYI....

Lee parker <[log in to unmask]>

Thu, 4 May 2006 08:19:45 -0400

84 lines

Re: FYI....

Whittaker, Dewey (AZ75) <[log in to unmask]>

Thu, 4 May 2006 06:37:31 -0700

108 lines

Re: FYI....

Dale Ritzen <[log in to unmask]>

Thu, 4 May 2006 08:50:57 -0500

134 lines

Re: FYI....

Dale Ritzen <[log in to unmask]>

Thu, 4 May 2006 08:53:49 -0500

149 lines

Re: FYI....

Joe Fjelstad <[log in to unmask]>

Thu, 4 May 2006 11:26:50 EDT

65 lines

Re: FYI....

John Burke <[log in to unmask]>

Thu, 4 May 2006 09:25:17 -0700

93 lines

Re: FYI....

John Burke <[log in to unmask]>

Thu, 4 May 2006 10:18:54 -0700

135 lines

Re: FYI....

Stadem, Richard D. <[log in to unmask]>

Wed, 3 May 2006 12:11:01 -0500

178 lines

Re: FYI....

Leo Higgins <[log in to unmask]>

Thu, 4 May 2006 12:33:04 -0700

134 lines

Re: FYI....

Joe Fjelstad <[log in to unmask]>

Thu, 4 May 2006 15:38:35 EDT

32 lines

Re: FYI....

Joe Fjelstad <[log in to unmask]>

Thu, 4 May 2006 15:44:16 EDT

23 lines

Re: FYI....

Stadem, Richard D. <[log in to unmask]>

Thu, 4 May 2006 14:56:04 -0500

159 lines

New Thread

FYI....ISO14001 vs HSPM

Re: FYI....ISO14001 vs HSPM

Leo Higgins <[log in to unmask]>

Wed, 3 May 2006 14:05:06 -0700

189 lines

New Thread

Good evening I have some good news

Good evening I have some good news

John Burke <[log in to unmask]>

Sat, 20 May 2006 00:10:06 -0700

78 lines

New Thread

HAST experts

HAST experts

Douglas O. Pauls <[log in to unmask]>

Wed, 31 May 2006 09:51:13 -0500

26 lines

New Thread

Idea - Suggestion

Idea - Suggestion

Terry Kozlyk <[log in to unmask]>

Thu, 11 May 2006 09:21:33 -0600

64 lines

Re: Idea - Suggestion

Dale Ritzen <[log in to unmask]>

Thu, 11 May 2006 11:11:39 -0500

94 lines

Re: Idea - Suggestion

Terry Kozlyk <[log in to unmask]>

Thu, 11 May 2006 10:33:29 -0600

127 lines

Re: Idea - Suggestion

Randy Morrison <[log in to unmask]>

Thu, 11 May 2006 09:38:51 -0700

143 lines

Re: Idea - Suggestion

Gary Ferrari <[log in to unmask]>

Thu, 11 May 2006 12:36:16 -0400

100 lines

Re: Idea - Suggestion

George Patrick <[log in to unmask]>

Thu, 11 May 2006 16:52:54 -0700

117 lines

New Thread

Idea - Suggestion - NTC

Re: Idea - Suggestion - NTC

David D. Hillman <[log in to unmask]>

Fri, 12 May 2006 08:57:20 -0500

164 lines

Re: Idea - Suggestion - NTC

Terry Kozlyk <[log in to unmask]>

Fri, 12 May 2006 08:46:42 -0600

210 lines

New Thread

In Circuit Test pad sizes

In Circuit Test pad sizes

Phil Nutting <[log in to unmask]>

Fri, 19 May 2006 11:38:37 -0400

33 lines

Re: In Circuit Test pad sizes

Whittaker, Dewey (AZ75) <[log in to unmask]>

Fri, 19 May 2006 08:55:23 -0700

61 lines

Re: In Circuit Test pad sizes

Ian Hanna <[log in to unmask]>

Fri, 19 May 2006 12:28:36 -0400

87 lines

Re: In Circuit Test pad sizes

John Burke <[log in to unmask]>

Fri, 19 May 2006 09:50:47 -0700

92 lines

New Thread

Intrusive Reflow

Intrusive Reflow

Yannick Brisson <[log in to unmask]>

Mon, 8 May 2006 09:04:05 -0400

33 lines

Re: Intrusive Reflow

David Tremmel <[log in to unmask]>

Mon, 8 May 2006 09:16:22 -0500

65 lines

Re: Intrusive Reflow

Tempea, Ioan <[log in to unmask]>

Mon, 8 May 2006 10:25:24 -0400

105 lines

Re: Intrusive Reflow

Kane, Amol (349) <[log in to unmask]>

Mon, 8 May 2006 10:27:07 -0400

117 lines

Re: Intrusive Reflow

Dehoyos, Ramon <[log in to unmask]>

Mon, 8 May 2006 11:46:45 -0400

97 lines

Re: Intrusive Reflow

Daniel Blass <[log in to unmask]>

Mon, 8 May 2006 12:16:27 -0500

28 lines

New Thread

Ionic Tester filter media ?

Ionic Tester filter media ?

Kevin Glidden <[log in to unmask]>

Mon, 22 May 2006 13:29:31 -0400

35 lines

Re: Ionic Tester filter media ?

Bloomquist, Ken <[log in to unmask]>

Mon, 22 May 2006 13:36:08 -0700

53 lines

Re: Ionic Tester filter media ?

Stadem, Richard D. <[log in to unmask]>

Mon, 22 May 2006 16:06:45 -0500

83 lines

Re: Ionic Tester filter media ?

Brian Ellis <[log in to unmask]>

Tue, 23 May 2006 11:00:30 +0300

131 lines

Re: Ionic Tester filter media ?

Stadem, Richard D. <[log in to unmask]>

Tue, 23 May 2006 09:24:30 -0500

151 lines

Re: Ionic Tester filter media ?

John Burke <[log in to unmask]>

Tue, 23 May 2006 11:26:29 -0700

171 lines

Re: Ionic Tester filter media ?

Kevin Glidden <[log in to unmask]>

Tue, 23 May 2006 14:37:45 -0400

227 lines

Re: Ionic Tester filter media ?

Dehoyos, Ramon <[log in to unmask]>

Wed, 24 May 2006 10:22:10 -0400

192 lines

Re: Ionic Tester filter media ?

Brian Ellis <[log in to unmask]>

Wed, 24 May 2006 18:07:48 +0300

227 lines

New Thread

IPC 4th International Conference on Flexible Circuits and Chip Scale Packaging

IPC 4th International Conference on Flexible Circuits and Chip Scale Packaging

Tina Nerad <[log in to unmask]>

Thu, 18 May 2006 16:47:09 -0500

30 lines

New Thread

IPC 620

IPC 620

Lum Wee Mei <[log in to unmask]>

Wed, 17 May 2006 10:18:37 +0800

37 lines

Re: IPC 620

Jack Crawford <[log in to unmask]>

Wed, 17 May 2006 14:03:35 -0500

132 lines

New Thread

IPC handling-packaging specifications

IPC handling-packaging specifications

Franklin D Asbell <[log in to unmask]>

Mon, 1 May 2006 09:16:26 -0500

43 lines

Re: IPC handling-packaging specifications

Kane, Amol (349) <[log in to unmask]>

Mon, 1 May 2006 10:54:37 -0400

84 lines

Re: IPC handling-packaging specifications

Green, Mike <[log in to unmask]>

Tue, 16 May 2006 15:07:47 -0700

107 lines

New Thread

IPC roadmap

IPC roadmap

Colin McVean <[log in to unmask]>

Mon, 8 May 2006 14:18:26 +0100

42 lines

Re: IPC roadmap

Dennis Fritz <[log in to unmask]>

Mon, 8 May 2006 09:30:27 EDT

59 lines

New Thread

IPC RoHS/Materials Declaration webcast series

IPC RoHS/Materials Declaration webcast series

Tina Nerad <[log in to unmask]>

Fri, 12 May 2006 14:02:11 -0500

40 lines

New Thread

IPC specification for ImSn

Re: IPC specification for ImSn

Werner Engelmaier <[log in to unmask]>

Mon, 1 May 2006 23:20:10 EDT

37 lines

New Thread

IPC Standard

IPC Standard

Victor G. Hernandez <[log in to unmask]>

Fri, 5 May 2006 13:45:43 -0500

26 lines

Re: IPC Standard

Dehoyos, Ramon <[log in to unmask]>

Fri, 5 May 2006 15:13:45 -0400

55 lines

Re: IPC Standard

John Parsons <[log in to unmask]>

Fri, 5 May 2006 12:27:46 -0700

40 lines

Re: IPC Standard

Franklin D Asbell <[log in to unmask]>

Sat, 6 May 2006 23:31:28 -0500

63 lines

Re: IPC Standard

Jeffrey Bush <[log in to unmask]>

Mon, 8 May 2006 08:24:43 -0400

64 lines

Re: IPC Standard

Stadem, Richard D. <[log in to unmask]>

Mon, 8 May 2006 08:50:44 -0500

87 lines

Re: IPC Standard

Jeffrey Bush <[log in to unmask]>

Mon, 8 May 2006 15:39:21 -0400

126 lines

Re: IPC Standard

Stadem, Richard D. <[log in to unmask]>

Mon, 8 May 2006 14:52:34 -0500

154 lines

Re: IPC Standard

Whittaker, Dewey (AZ75) <[log in to unmask]>

Mon, 8 May 2006 13:14:22 -0700

151 lines

Re: IPC Standard

Jeffrey Bush <[log in to unmask]>

Tue, 9 May 2006 07:57:14 -0400

193 lines

New Thread

IPC Standard - Board edge clearance

Re: IPC Standard - Board edge clearance

Victor G. Hernandez <[log in to unmask]>

Tue, 9 May 2006 07:07:10 -0500

221 lines

Re: IPC Standard - Board edge clearance

Jeffrey Bush <[log in to unmask]>

Tue, 9 May 2006 13:17:33 -0400

262 lines

New Thread

IPC Standard / PWB Router edge clearance

Re: IPC Standard / PWB Router edge clearance

Victor G. Hernandez <[log in to unmask]>

Mon, 8 May 2006 15:45:55 -0500

181 lines

Re: IPC Standard / PWB Router edge clearance

Stadem, Richard D. <[log in to unmask]>

Mon, 8 May 2006 16:36:52 -0500

210 lines

Re: IPC Standard / PWB Router edge clearance

John Burke <[log in to unmask]>

Mon, 8 May 2006 16:44:30 -0700

215 lines

Re: IPC Standard / PWB Router edge clearance

John Burke <[log in to unmask]>

Mon, 8 May 2006 20:37:05 -0700

236 lines

New Thread

IPC Standard msg4

Re: IPC Standard msg4

Victor G. Hernandez <[log in to unmask]>

Mon, 8 May 2006 13:02:22 -0500

116 lines

Re: IPC Standard msg4

Susan Mansilla <[log in to unmask]>

Mon, 8 May 2006 14:21:24 EDT

32 lines

Re: IPC Standard msg4

Victor G. Hernandez <[log in to unmask]>

Mon, 8 May 2006 13:42:21 -0500

64 lines

Re: IPC Standard msg4

McGlaughlin, Jeffrey A <[log in to unmask]>

Mon, 8 May 2006 14:49:58 -0400

102 lines

Re: IPC Standard msg4

Tempea, Ioan <[log in to unmask]>

Mon, 8 May 2006 15:14:42 -0400

102 lines

New Thread

IPC TRAINING DVD'S

IPC TRAINING DVD'S

Lance Mayes <[log in to unmask]>

Mon, 1 May 2006 08:41:33 -0600

36 lines

New Thread

IPC Workshops "Ensuring RoHS Compliance through Materials Declaration Tools" in San Francisco, CA and Seattle, WA

IPC Workshops "Ensuring RoHS Compliance through Materials Declaration Tools" in San Francisco, CA and Seattle, WA

Tina Nerad <[log in to unmask]>

Tue, 16 May 2006 14:12:56 -0500

40 lines

New Thread

IPC-4103 vs. MIL-P-13949

IPC-4103 vs. MIL-P-13949

ekalgren <[log in to unmask]>

Mon, 1 May 2006 12:06:20 -0400

43 lines

Re: IPC-4103 vs. MIL-P-13949

Roger Tingler <[log in to unmask]>

Mon, 1 May 2006 12:47:25 -0400

96 lines

New Thread

IPC/JEDEC First International Conference on Materials Declaration in Rosemont, IL on 6/6-7

IPC/JEDEC First International Conference on Materials Declaration in Rosemont, IL on 6/6-7

Tina Nerad <[log in to unmask]>

Wed, 17 May 2006 09:54:00 -0500

40 lines

New Thread

IPC/JEDEC International Conference on Materials Declaration-June 6-7, 2006, Rosemont, IL

IPC/JEDEC International Conference on Materials Declaration-June 6-7, 2006, Rosemont, IL

Tina Nerad <[log in to unmask]>

Tue, 9 May 2006 16:34:38 -0500

69 lines

New Thread

IPC/JEDEC Materials Declaration Conference in Rosemont, IL on June 6-7, 2006

IPC/JEDEC Materials Declaration Conference in Rosemont, IL on June 6-7, 2006

Tina Nerad <[log in to unmask]>

Tue, 23 May 2006 16:19:23 -0500

36 lines

New Thread

IPCWorks CFP 2006

IPCWorks CFP 2006

IPC Mail <[log in to unmask]>

Wed, 31 May 2006 10:42:07 -0500

298 lines

New Thread

Joel Alexander is out of the office.

Joel Alexander is out of the office.

Joel Alexander <[log in to unmask]>

Mon, 15 May 2006 14:53:21 -0400

24 lines

Re: Joel Alexander is out of the office.

Jason Gregory <[log in to unmask]>

Mon, 15 May 2006 14:09:20 -0500

60 lines

New Thread

Laser Ablation of Soldermask

Laser Ablation of Soldermask

Kevin Glidden <[log in to unmask]>

Mon, 8 May 2006 10:09:05 -0400

29 lines

Re: Laser Ablation of Soldermask

John Burke <[log in to unmask]>

Mon, 8 May 2006 09:59:25 -0700

59 lines

Re: Laser Ablation of Soldermask

Anslow, Phillip <[log in to unmask]>

Tue, 9 May 2006 17:09:15 +0100

100 lines

Re: Laser Ablation of Soldermask

John Burke <[log in to unmask]>

Tue, 9 May 2006 10:25:42 -0700

113 lines

Re: Laser Ablation of Soldermask

Leo Higgins <[log in to unmask]>

Wed, 10 May 2006 11:34:26 -0700

171 lines

Re: Laser Ablation of Soldermask

Kevin Glidden <[log in to unmask]>

Fri, 12 May 2006 09:57:02 -0400

57 lines

New Thread

Latest updates on RoHS round 5 exemptions and US postal stamps

Latest updates on RoHS round 5 exemptions and US postal stamps

John Burke <[log in to unmask]>

Tue, 16 May 2006 09:33:36 -0700

71 lines

Re: Latest updates on RoHS round 5 exemptions and US postal stamps

Ahne Oosterhof <[log in to unmask]>

Tue, 16 May 2006 15:17:09 -0700

97 lines

Re: Latest updates on RoHS round 5 exemptions and US postal stamps

John Burke <[log in to unmask]>

Tue, 16 May 2006 15:34:38 -0700

117 lines

Re: Latest updates on RoHS round 5 exemptions and US postal stamps

Joe Fjelstad <[log in to unmask]>

Tue, 16 May 2006 18:40:23 EDT

32 lines

Re: Latest updates on RoHS round 5 exemptions and US postal stamps

John Burke <[log in to unmask]>

Tue, 16 May 2006 15:57:21 -0700

65 lines

Re: Latest updates on RoHS round 5 exemptions and US postal stamps

Joe Fjelstad <[log in to unmask]>

Tue, 16 May 2006 19:12:41 EDT

30 lines

Re: Latest updates on RoHS round 5 exemptions and US postal stamps

John Burke <[log in to unmask]>

Tue, 16 May 2006 16:40:44 -0700

59 lines

Re: Latest updates on RoHS round 5 exemptions and US postal stamps

Leo Higgins <[log in to unmask]>

Tue, 16 May 2006 18:02:55 -0700

129 lines

Re: Latest updates on RoHS round 5 exemptions and US postal stamps

Leo Higgins <[log in to unmask]>

Tue, 16 May 2006 18:13:27 -0700

176 lines

Re: Latest updates on RoHS round 5 exemptions and US postal stamps

stephen gregory <[log in to unmask]>

Tue, 16 May 2006 18:25:20 -0700

199 lines

Re: Latest updates on RoHS round 5 exemptions and US postal stamps

John Burke <[log in to unmask]>

Tue, 16 May 2006 19:49:57 -0700

239 lines

Re: Latest updates on RoHS round 5 exemptions and US postal stamps

Anslow, Phillip <[log in to unmask]>

Wed, 17 May 2006 08:10:02 +0100

303 lines

Re: Latest updates on RoHS round 5 exemptions and US postal stamps

Whittaker, Dewey (AZ75) <[log in to unmask]>

Wed, 17 May 2006 07:46:47 -0700

242 lines

Re: Latest updates on RoHS round 5 exemptions and US postal stamps

Steve Gregory <[log in to unmask]>

Wed, 17 May 2006 10:08:35 -0500

245 lines

Re: Latest updates on RoHS round 5 exemptions and US postal stamps

Dehoyos, Ramon <[log in to unmask]>

Wed, 17 May 2006 12:11:14 -0400

238 lines

Re: Latest updates on RoHS round 5 exemptions and US postal stamps

Leo Higgins <[log in to unmask]>

Wed, 17 May 2006 09:27:02 -0700

269 lines

Re: Latest updates on RoHS round 5 exemptions and US postal stamps

John Burke <[log in to unmask]>

Wed, 17 May 2006 09:55:49 -0700

298 lines

New Thread

Listserv service interruption Friday May 26th

Listserv service interruption Friday May 26th

Keach Sasamori <[log in to unmask]>

Thu, 25 May 2006 23:47:10 -0500

32 lines

Listserv service interruption Friday May 26th

Keach Sasamori <[log in to unmask]>

Fri, 26 May 2006 16:06:34 -0500

31 lines

New Thread

Looking for a camera for a DEK 265

Looking for a camera for a DEK 265

Blair K. Hogg <[log in to unmask]>

Wed, 24 May 2006 14:53:55 -0400

42 lines

Re: Looking for a camera for a DEK 265

Jerry Dengler <[log in to unmask]>

Wed, 24 May 2006 15:02:43 -0400

68 lines

Re: Looking for a camera for a DEK 265

Gilbert Roberge <[log in to unmask]>

Wed, 24 May 2006 16:57:40 -0400

79 lines

New Thread

Low Cost Lead Coplanarity Check Tool

Low Cost Lead Coplanarity Check Tool

Cheryl Tulkoff <[log in to unmask]>

Tue, 23 May 2006 16:07:18 -0500

21 lines

Re: Low Cost Lead Coplanarity Check Tool

Randy Morrison <[log in to unmask]>

Tue, 23 May 2006 14:23:29 -0700

71 lines

Re: Low Cost Lead Coplanarity Check Tool

Drew meyer <[log in to unmask]>

Wed, 24 May 2006 09:19:24 -0500

37 lines

New Thread

Low Profile Surface Mount Connectors

Low Profile Surface Mount Connectors

[log in to unmask]

Fri, 12 May 2006 10:29:41 +0100

31 lines

New Thread

Manual Assembly

Manual Assembly

Blair K. Hogg <[log in to unmask]>

Fri, 12 May 2006 14:12:22 -0400

55 lines

Re: Manual Assembly

Daniel Blass <[log in to unmask]>

Fri, 12 May 2006 15:09:34 -0500

88 lines

New Thread

Materials Declaration

Re: Materials Declaration

Genny Gibbard <[log in to unmask]>

Mon, 1 May 2006 11:56:26 -0600

153 lines

Re: Materials Declaration

John Burke <[log in to unmask]>

Mon, 1 May 2006 11:41:22 -0700

207 lines

Re: Materials Declaration

Genny Gibbard <[log in to unmask]>

Mon, 1 May 2006 13:03:34 -0600

228 lines

Re: Materials Declaration

Kane, Amol (349) <[log in to unmask]>

Mon, 1 May 2006 15:07:50 -0400

266 lines

Re: Materials Declaration

Genny Gibbard <[log in to unmask]>

Mon, 1 May 2006 13:18:15 -0600

295 lines

Re: Materials Declaration

Stephen Pierce <[log in to unmask]>

Mon, 1 May 2006 13:23:25 -0700

252 lines

Re: Materials Declaration

Genny Gibbard <[log in to unmask]>

Tue, 2 May 2006 14:22:40 -0600

184 lines

Re: Materials Declaration

ekalgren <[log in to unmask]>

Tue, 2 May 2006 16:32:07 -0400

218 lines

Re: Materials Declaration

Ahne Oosterhof <[log in to unmask]>

Tue, 2 May 2006 14:14:03 -0700

217 lines

Re: Materials Declaration

John Burke <[log in to unmask]>

Tue, 2 May 2006 14:31:16 -0700

218 lines

Re: Materials Declaration

Whittaker, Dewey (AZ75) <[log in to unmask]>

Tue, 2 May 2006 15:06:01 -0700

250 lines

Re: Materials Declaration

Dehoyos, Ramon <[log in to unmask]>

Wed, 3 May 2006 08:42:32 -0400

282 lines

Re: Materials Declaration

ekalgren <[log in to unmask]>

Wed, 3 May 2006 09:15:47 -0400

320 lines

Re: Materials Declaration

Dave Dixon <[log in to unmask]>

Wed, 3 May 2006 08:23:32 -0500

49 lines

Re: Materials Declaration

Genny Gibbard <[log in to unmask]>

Wed, 3 May 2006 10:03:37 -0600

222 lines

New Thread

Matte-tin part lead/termination finish when soldered using Sn63 solder

Matte-tin part lead/termination finish when soldered using Sn63 solder

- Bogert <[log in to unmask]>

Wed, 24 May 2006 18:49:20 -0400

47 lines

New Thread

Maximum Contact Normal Force On ENIG Surfaace

Maximum Contact Normal Force On ENIG Surfaace

Mumtaz Bora <[log in to unmask]>

Fri, 12 May 2006 16:22:32 -0700

39 lines

New Thread

mc 790

mc 790

Joyce Koo <[log in to unmask]>

Wed, 31 May 2006 08:53:53 -0400

25 lines

Re: mc 790

Douglas O. Pauls <[log in to unmask]>

Wed, 31 May 2006 08:55:57 -0500

71 lines

Re: mc 790

Whittaker, Dewey (AZ75) <[log in to unmask]>

Wed, 31 May 2006 06:59:39 -0700

106 lines

Re: mc 790

Douglas O. Pauls <[log in to unmask]>

Wed, 31 May 2006 09:06:26 -0500

157 lines

Re: mc 790

Joyce Koo <[log in to unmask]>

Wed, 31 May 2006 10:17:16 -0400

100 lines

Re: mc 790

Kerry McMullen <[log in to unmask]>

Wed, 31 May 2006 10:58:46 -0400

203 lines

Re: mc 790

Chris Ball <[log in to unmask]>

Wed, 31 May 2006 11:11:46 -0400

251 lines

Re: mc 790

Olav Folland <[log in to unmask]>

Wed, 31 May 2006 08:44:43 -0700

271 lines

Re: mc 790

Stadem, Richard D. <[log in to unmask]>

Wed, 31 May 2006 10:50:05 -0500

315 lines

New Thread

mc 790 is available

Re: mc 790 is available

Jack Crawford <[log in to unmask]>

Wed, 31 May 2006 11:29:22 -0500

124 lines

Re: mc 790 is available

Joyce Koo <[log in to unmask]>

Wed, 31 May 2006 13:25:42 -0400

152 lines

New Thread

Mil-Spec resistors

Mil-Spec resistors

ekalgren <[log in to unmask]>

Tue, 2 May 2006 14:08:58 -0400

50 lines

Re: Mil-Spec resistors

Dave Dixon <[log in to unmask]>

Tue, 2 May 2006 13:19:52 -0500

49 lines

Re: Mil-Spec resistors

Dave Dixon <[log in to unmask]>

Tue, 2 May 2006 13:49:08 -0500

69 lines

New Thread

MiniWave Solderpot Recommendations

MiniWave Solderpot Recommendations

David D. Hillman <[log in to unmask]>

Fri, 19 May 2006 14:50:15 -0500

32 lines

Re: MiniWave Solderpot Recommendations

Kelly Morris <[log in to unmask]>

Fri, 19 May 2006 15:14:04 -0500

54 lines

Re: MiniWave Solderpot Recommendations

Whittaker, Dewey (AZ75) <[log in to unmask]>

Fri, 19 May 2006 13:46:57 -0700

67 lines

Re: MiniWave Solderpot Recommendations

Steve Gregory <[log in to unmask]>

Fri, 19 May 2006 15:54:13 -0500

105 lines

Re: MiniWave Solderpot Recommendations

Joe Fjelstad <[log in to unmask]>

Fri, 19 May 2006 17:10:57 -0400

61 lines

New Thread

Mixing Lead-free Plated Parts with Leaded Solder

Mixing Lead-free Plated Parts with Leaded Solder

Gregg A. Owens <[log in to unmask]>

Tue, 2 May 2006 10:26:27 -0700

46 lines

Re: Mixing Lead-free Plated Parts with Leaded Solder

Schaefer, Chris <[log in to unmask]>

Tue, 2 May 2006 12:28:52 -0500

99 lines

Re: Mixing Lead-free Plated Parts with Leaded Solder

Kane, Amol (349) <[log in to unmask]>

Tue, 2 May 2006 13:36:41 -0400

97 lines

Re: Mixing Lead-free Plated Parts with Leaded Solder

David D. Hillman <[log in to unmask]>

Tue, 2 May 2006 13:12:15 -0500

103 lines

New Thread

More RoHS Press

More RoHS Press

Bloomquist, Ken <[log in to unmask]>

Mon, 22 May 2006 12:21:20 -0700

39 lines

Re: More RoHS Press

John Burke <[log in to unmask]>

Mon, 22 May 2006 14:38:08 -0700

64 lines

New Thread

N2 flow rates

N2 flow rates

Graham Collins <[log in to unmask]>

Fri, 19 May 2006 09:23:50 -0400

52 lines

Re: N2 flow rates

Daniel Blass <[log in to unmask]>

Fri, 19 May 2006 09:51:45 -0500

67 lines

Re: N2 flow rates

Graham Collins <[log in to unmask]>

Fri, 19 May 2006 13:40:09 -0400

109 lines

Re: N2 flow rates

Whittaker, Dewey (AZ75) <[log in to unmask]>

Fri, 19 May 2006 11:23:25 -0700

139 lines

Re: N2 flow rates

John Burke <[log in to unmask]>

Fri, 19 May 2006 11:37:33 -0700

176 lines

Re: N2 flow rates

Vu Dinh Tang <[log in to unmask]>

Sat, 20 May 2006 10:34:42 +0700

90 lines

Re: N2 flow rates

ZLATKO BIJEDIC <[log in to unmask]>

Mon, 22 May 2006 04:20:43 -0700

73 lines

Re: N2 flow rates

Graham Collins <[log in to unmask]>

Tue, 23 May 2006 07:16:18 -0400

116 lines

New Thread

NEW exemption request under ENV:Directive 2002/95 EC Article 5(1)(b)

NEW exemption request under ENV:Directive 2002/95 EC Article 5(1)(b)

John Burke <[log in to unmask]>

Sat, 20 May 2006 18:08:20 -0700

249 lines

NEW exemption request under ENV:Directive 2002/95 EC Article 5(1)(b)

John Burke <[log in to unmask]>

Sat, 20 May 2006 18:23:36 -0700

254 lines

Re: NEW exemption request under ENV:Directive 2002/95 EC Article 5(1)(b)

John Burke <[log in to unmask]>

Wed, 24 May 2006 07:49:25 -0700

418 lines

New Thread

Not yet time for the Champagne, yet...

Not yet time for the Champagne, yet...

R Sedlak <[log in to unmask]>

Thu, 18 May 2006 14:24:30 -0700

32 lines

Re: Not yet time for the Champagne, yet...

Alcorn, Brent <[log in to unmask]>

Thu, 18 May 2006 17:31:20 -0400

78 lines

Re: Not yet time for the Champagne, yet...

John Burke <[log in to unmask]>

Thu, 18 May 2006 16:21:45 -0700

66 lines

Re: Not yet time for the Champagne, yet...

Scott Decker <[log in to unmask]>

Thu, 18 May 2006 16:33:31 -0700

105 lines

Re: Not yet time for the Champagne, yet...

Scott Decker <[log in to unmask]>

Thu, 18 May 2006 16:42:03 -0700

130 lines

Re: Not yet time for the Champagne, yet...

John Burke <[log in to unmask]>

Thu, 18 May 2006 16:42:22 -0700

129 lines

Re: Not yet time for the Champagne, yet...

John Burke <[log in to unmask]>

Thu, 18 May 2006 17:01:35 -0700

166 lines

New Thread

NTC #2 Get the Lead Out

Re: NTC #2 Get the Lead Out

Werner Engelmaier <[log in to unmask]>

Tue, 2 May 2006 20:55:40 EDT

35 lines

Re: NTC #2 Get the Lead Out

John Burke <[log in to unmask]>

Tue, 2 May 2006 18:21:24 -0700

83 lines

Re: NTC #2 Get the Lead Out

Werner Engelmaier <[log in to unmask]>

Tue, 2 May 2006 21:35:34 EDT

26 lines

New Thread

NTC - mc 790

Re: NTC - mc 790

Graham Collins <[log in to unmask]>

Wed, 31 May 2006 12:28:14 -0400

336 lines

Re: NTC - mc 790

Scott Decker <[log in to unmask]>

Wed, 31 May 2006 10:24:55 -0700

374 lines

Re: NTC - mc 790

Stadem, Richard D. <[log in to unmask]>

Wed, 31 May 2006 13:08:38 -0500

360 lines

New Thread

NTC - Surface Tension Data for SAC305

Re: NTC - Surface Tension Data for SAC305

David D. Hillman <[log in to unmask]>

Wed, 3 May 2006 07:36:51 -0500

108 lines

New Thread

NTC BUT- Tin industry appears to have some serious supply chain exploitation issues

NTC BUT- Tin industry appears to have some serious supply chain exploitation issues

John Burke <[log in to unmask]>

Tue, 2 May 2006 11:06:05 -0700

73 lines

Re: NTC BUT- Tin industry appears to have some serious supply chain exploitation issues

Scott Decker <[log in to unmask]>

Tue, 2 May 2006 11:13:16 -0700

105 lines

Re: NTC BUT- Tin industry appears to have some serious supply chain exploitation issues

Whittaker, Dewey (AZ75) <[log in to unmask]>

Tue, 2 May 2006 12:05:58 -0700

126 lines

Re: NTC BUT- Tin industry appears to have some serious supply chain exploitation issues

Scott Decker <[log in to unmask]>

Tue, 2 May 2006 12:20:51 -0700

156 lines

New Thread

NTC Congo's tin men

NTC Congo's tin men

Stephen Pierce <[log in to unmask]>

Mon, 8 May 2006 09:56:50 -0700

28 lines

New Thread

NTC Europen based Environmental agency taken to court over environmental damage - and lost the case......

NTC Europen based Environmental agency taken to court over environmental damage - and lost the case......

John Burke <[log in to unmask]>

Wed, 17 May 2006 16:46:34 -0700

56 lines

New Thread

NTC Exemptions applications and some fun

NTC Exemptions applications and some fun

John Burke <[log in to unmask]>

Wed, 24 May 2006 21:31:01 -0700

37 lines

Re: NTC Exemptions applications and some fun

Ahne Oosterhof <[log in to unmask]>

Thu, 25 May 2006 07:45:26 -0700

73 lines

New Thread

NTC Friday Posting...

NTC Friday Posting...

Steve Gregory <[log in to unmask]>

Fri, 5 May 2006 08:10:43 -0500

47 lines

Re: NTC Friday Posting...

Joe Russeau <[log in to unmask]>

Fri, 5 May 2006 08:22:00 -0500

76 lines

Re: NTC Friday Posting...

Randy Bock Sr. <[log in to unmask]>

Fri, 5 May 2006 09:33:16 -0400

97 lines

Re: NTC Friday Posting...

Kane, Joseph E (US SSA) <[log in to unmask]>

Fri, 5 May 2006 10:32:16 -0400

149 lines

New Thread

NTC Get the Lead Out

Re: NTC Get the Lead Out

Dehoyos, Ramon <[log in to unmask]>

Mon, 1 May 2006 10:45:49 -0400

202 lines

Re: NTC Get the Lead Out

Dale Ritzen <[log in to unmask]>

Mon, 1 May 2006 11:02:51 -0500

248 lines

Re: NTC Get the Lead Out

Dehoyos, Ramon <[log in to unmask]>

Mon, 1 May 2006 12:46:48 -0400

348 lines

Re: NTC Get the Lead Out

Werner Engelmaier <[log in to unmask]>

Mon, 1 May 2006 16:37:09 EDT

45 lines

Re: NTC Get the Lead Out

Dale Ritzen <[log in to unmask]>

Mon, 1 May 2006 16:00:58 -0500

122 lines

Re: NTC Get the Lead Out

John Burke <[log in to unmask]>

Mon, 1 May 2006 14:39:24 -0700

166 lines

Re: NTC Get the Lead Out

Brian Ellis <[log in to unmask]>

Tue, 2 May 2006 10:51:50 +0300

136 lines

Re: NTC Get the Lead Out

Dehoyos, Ramon <[log in to unmask]>

Tue, 2 May 2006 09:20:38 -0400

168 lines

Re: NTC Get the Lead Out

Brian Ellis <[log in to unmask]>

Tue, 2 May 2006 18:37:59 +0300

196 lines

Re: NTC Get the Lead Out

Jeffrey Bush <[log in to unmask]>

Tue, 2 May 2006 12:30:50 -0400

241 lines

Re: NTC Get the Lead Out

ekalgren <[log in to unmask]>

Tue, 2 May 2006 12:42:27 -0400

313 lines

Re: NTC Get the Lead Out

Dave Simonik <[log in to unmask]>

Tue, 2 May 2006 12:55:40 -0400

297 lines

NTC Get the Lead Out

R Sedlak <[log in to unmask]>

Tue, 2 May 2006 13:06:05 -0700

42 lines

Re: NTC Get the Lead Out

Ian Hanna <[log in to unmask]>

Tue, 2 May 2006 16:16:33 -0400

88 lines

Re: NTC Get the Lead Out

Chad Renando <[log in to unmask]>

Wed, 3 May 2006 06:23:18 +1000

110 lines

Re: NTC Get the Lead Out

Scott Decker <[log in to unmask]>

Tue, 2 May 2006 13:25:12 -0700

117 lines

Re: NTC Get the Lead Out

Scott Decker <[log in to unmask]>

Tue, 2 May 2006 13:29:52 -0700

142 lines

Re: NTC Get the Lead Out

John Maxwell <[log in to unmask]>

Tue, 2 May 2006 13:31:27 -0700

66 lines

Re: NTC Get the Lead Out

Whittaker, Dewey (AZ75) <[log in to unmask]>

Tue, 2 May 2006 13:50:29 -0700

82 lines

Re: NTC Get the Lead Out

Cheryl Johnson <[log in to unmask]>

Tue, 2 May 2006 14:57:12 -0600

118 lines

Re: NTC Get the Lead Out

Werner Engelmaier <[log in to unmask]>

Tue, 2 May 2006 19:45:00 EDT

29 lines

New Thread

NTC Harleys

NTC Harleys

Kevin Glidden <[log in to unmask]>

Fri, 19 May 2006 12:54:50 -0400

213 lines

New Thread

NTC I month later and the Hitch Hikers Guide

NTC I month later and the Hitch Hikers Guide

John Burke <[log in to unmask]>

Tue, 23 May 2006 16:45:21 -0700

66 lines

Re: NTC I month later and the Hitch Hikers Guide

Ed Popielarski <[log in to unmask]>

Wed, 24 May 2006 07:49:28 -0700

57 lines

New Thread

NTC It's Friday somewhere in the World - good morning...

NTC It's Friday somewhere in the World - good morning...

John Burke <[log in to unmask]>

Fri, 5 May 2006 00:33:02 -0700

36 lines

New Thread

NTC Its Friday another memorable date number.

NTC Its Friday another memorable date number.

Mike Fenner <[log in to unmask]>

Fri, 5 May 2006 13:08:21 +0100

44 lines

Re: NTC Its Friday another memorable date number.

Werner Engelmaier <[log in to unmask]>

Fri, 5 May 2006 15:01:03 EDT

26 lines

New Thread

NTC Press release link on round 5 exemptions notification for inputs for RoHS

NTC Press release link on round 5 exemptions notification for inputs for RoHS

John Burke <[log in to unmask]>

Sat, 13 May 2006 19:56:45 -0700

58 lines

New Thread

NTC RE: TAC committee for RoHS

NTC RE: TAC committee for RoHS

John Burke <[log in to unmask]>

Tue, 30 May 2006 22:48:51 -0700

34 lines

New Thread

NTC Thank you for all of your support for Pushback

Re: NTC Thank you for all of your support for Pushback

- Bogert <[log in to unmask]>

Mon, 1 May 2006 17:42:30 -0400

110 lines

Re: NTC Thank you for all of your support for Pushback

John Burke <[log in to unmask]>

Mon, 1 May 2006 14:53:22 -0700

141 lines

Re: NTC Thank you for all of your support for Pushback

Brian Ellis <[log in to unmask]>

Tue, 2 May 2006 11:10:13 +0300

127 lines

Re: NTC Thank you for all of your support for Pushback

Mike Fenner <[log in to unmask]>

Thu, 4 May 2006 09:05:49 +0100

141 lines

New Thread

NTC- Do not open until Friday

Re: NTC- Do not open until Friday

Joe Fjelstad <[log in to unmask]>

Tue, 30 May 2006 17:03:24 EDT

28 lines

New Thread

NTC-Dewey started it...

NTC-Dewey started it...

R Sedlak <[log in to unmask]>

Thu, 25 May 2006 13:10:23 -0700

43 lines

Re: NTC-Dewey started it...

Dave Seymour <[log in to unmask]>

Thu, 25 May 2006 16:31:25 -0400

30 lines

New Thread

NTC-PUN

NTC-PUN

Whittaker, Dewey (AZ75) <[log in to unmask]>

Thu, 25 May 2006 10:59:49 -0700

47 lines

Re: NTC-PUN

John Burke <[log in to unmask]>

Thu, 25 May 2006 11:17:55 -0700

72 lines

Re: NTC-PUN

Chuck Brummer <[log in to unmask]>

Thu, 25 May 2006 11:16:46 -0700

95 lines

Re: NTC-PUN

Stadem, Richard D. <[log in to unmask]>

Thu, 25 May 2006 13:22:11 -0500

97 lines

Re: NTC-PUN

R Sedlak <[log in to unmask]>

Thu, 25 May 2006 11:23:08 -0700

67 lines

Re: NTC-PUN

Kerry McMullen <[log in to unmask]>

Thu, 25 May 2006 14:26:10 -0400

123 lines

Re: NTC-PUN

John Burke <[log in to unmask]>

Thu, 25 May 2006 11:32:00 -0700

158 lines

Re: NTC-PUN

Scott Decker <[log in to unmask]>

Thu, 25 May 2006 11:38:39 -0700

189 lines

Re: NTC-PUN

Joe Russeau <[log in to unmask]>

Thu, 25 May 2006 14:41:08 -0400

75 lines

Re: NTC-PUN

Joe Russeau <[log in to unmask]>

Thu, 25 May 2006 14:52:42 -0400

103 lines

Re: NTC-PUN

Whittaker, Dewey (AZ75) <[log in to unmask]>

Thu, 25 May 2006 12:28:30 -0700

192 lines

Re: NTC-PUN

Phil Nutting <[log in to unmask]>

Thu, 25 May 2006 15:33:02 -0400

218 lines

Re: NTC-PUN

ALLEN, LOA <[log in to unmask]>

Thu, 25 May 2006 12:34:44 -0700

122 lines

Re: NTC-PUN

Scott Decker <[log in to unmask]>

Thu, 25 May 2006 12:52:28 -0700

246 lines

Re: NTC-PUN

mattyk <[log in to unmask]>

Thu, 25 May 2006 15:54:32 -0400

250 lines

Re: NTC-PUN

Ian Hanna <[log in to unmask]>

Thu, 25 May 2006 16:08:53 -0400

299 lines

Re: NTC-PUN

McGee, Mike (MN51) <[log in to unmask]>

Thu, 25 May 2006 15:07:04 -0500

287 lines

Re: NTC-PUN

Lance Mayes <[log in to unmask]>

Thu, 25 May 2006 17:02:01 -0600

280 lines

Re: NTC-PUN

Joe Fjelstad <[log in to unmask]>

Thu, 25 May 2006 21:53:23 EDT

23 lines

Re: NTC-PUN

Dehoyos, Ramon <[log in to unmask]>

Fri, 26 May 2006 07:39:44 -0400

165 lines

Re: NTC-PUN

Whittaker, Dewey (AZ75) <[log in to unmask]>

Tue, 30 May 2006 13:50:39 -0700

53 lines

New Thread

NTC...Off topic reading

NTC...Off topic reading

Joe Fjelstad <[log in to unmask]>

Sat, 13 May 2006 18:03:47 EDT

29 lines

New Thread

Opaque black PCB material

Opaque black PCB material

Loretta Wheatland <[log in to unmask]>

Wed, 10 May 2006 22:38:53 -0500

19 lines

Re: Opaque black PCB material

Roger Tingler <[log in to unmask]>

Thu, 11 May 2006 06:43:23 -0400

83 lines

Re: Opaque black PCB material

Jeffrey Bush <[log in to unmask]>

Thu, 11 May 2006 07:35:46 -0400

63 lines

New Thread

Oxide Scratches

Oxide Scratches

Ralph Richart <[log in to unmask]>

Tue, 23 May 2006 12:14:53 -0700

24 lines

Re: Oxide Scratches

Jeffrey Bush <[log in to unmask]>

Tue, 23 May 2006 15:46:37 -0400

62 lines

New Thread

PCB shelf life

PCB shelf life

WTSJ-Willis Tam <[log in to unmask]>

Tue, 16 May 2006 11:19:29 +0800

34 lines

Re: PCB shelf life

Dennis Fritz <[log in to unmask]>

Tue, 16 May 2006 06:42:30 EDT

38 lines

New Thread

plating materials

plating materials

Selva Suganthi <[log in to unmask]>

Mon, 15 May 2006 11:34:14 +0530

30 lines

New Thread

Plating process

Plating process

Selva Suganthi <[log in to unmask]>

Fri, 19 May 2006 15:39:35 +0530

29 lines

Re: Plating process

Dennis Fritz <[log in to unmask]>

Fri, 19 May 2006 07:12:26 EDT

40 lines

Re: Plating process

Selva Suganthi <[log in to unmask]>

Fri, 19 May 2006 16:54:02 +0530

95 lines

Re: Plating process

Dennis Fritz <[log in to unmask]>

Fri, 19 May 2006 07:32:10 EDT

51 lines

Re: Plating process

Werner Engelmaier <[log in to unmask]>

Fri, 19 May 2006 07:57:18 EDT

39 lines

Re: Plating process

Selva Suganthi <[log in to unmask]>

Mon, 22 May 2006 14:40:18 +0530

88 lines

New Thread

Plating Tails

Plating Tails

Selva Suganthi <[log in to unmask]>

Fri, 5 May 2006 11:04:14 +0530

28 lines

Re: Plating Tails

Joe Fjelstad <[log in to unmask]>

Fri, 5 May 2006 10:31:50 EDT

40 lines

Re: Plating Tails

Franklin D Asbell <[log in to unmask]>

Fri, 5 May 2006 09:46:10 -0500

71 lines

Re: Plating Tails

Whittaker, Dewey (AZ75) <[log in to unmask]>

Fri, 5 May 2006 09:47:36 -0700

94 lines

Re: Plating Tails

Franklin D Asbell <[log in to unmask]>

Fri, 5 May 2006 11:52:25 -0500

115 lines

Re: Plating Tails

Leo Higgins <[log in to unmask]>

Fri, 5 May 2006 11:11:00 -0700

105 lines

Re: Plating Tails

Terry Kozlyk <[log in to unmask]>

Fri, 5 May 2006 15:52:06 -0600

150 lines

New Thread

Plating Thickness

Plating Thickness

Wee Mei <[log in to unmask]>

Fri, 26 May 2006 08:02:03 +0800

44 lines

New Thread

PREHEATING

PREHEATING

Pradeep <[log in to unmask]>

Fri, 12 May 2006 14:32:10 +0530

35 lines

Re: PREHEATING

Kevin Glidden <[log in to unmask]>

Fri, 12 May 2006 08:42:57 -0400

100 lines

Re: PREHEATING

Werner Engelmaier <[log in to unmask]>

Fri, 12 May 2006 15:22:24 EDT

41 lines

New Thread

Pressure Sensitive Adhesive

Pressure Sensitive Adhesive

Gunawan, Arif <[log in to unmask]>

Thu, 11 May 2006 18:20:48 +0800

49 lines

Re: Pressure Sensitive Adhesive

Creswick, Steven <[log in to unmask]>

Thu, 11 May 2006 06:49:16 -0400

83 lines

Re: Pressure Sensitive Adhesive

Brian Ellis <[log in to unmask]>

Thu, 11 May 2006 14:47:50 +0300

113 lines

Re: Pressure Sensitive Adhesive

Dehoyos, Ramon <[log in to unmask]>

Thu, 11 May 2006 08:29:06 -0400

136 lines

Re: Pressure Sensitive Adhesive

ekalgren <[log in to unmask]>

Thu, 11 May 2006 08:40:11 -0400

173 lines

Re: Pressure Sensitive Adhesive

Creswick, Steven <[log in to unmask]>

Thu, 11 May 2006 09:24:25 -0400

214 lines

Re: Pressure Sensitive Adhesive

Whittaker, Dewey (AZ75) <[log in to unmask]>

Thu, 11 May 2006 06:46:21 -0700

73 lines

Re: Pressure Sensitive Adhesive

Joe Fjelstad <[log in to unmask]>

Thu, 11 May 2006 12:30:57 EDT

35 lines

Re: Pressure Sensitive Adhesive

Whittaker, Dewey (AZ75) <[log in to unmask]>

Thu, 11 May 2006 12:11:56 -0700

59 lines

New Thread

Pump printing

Pump printing

Tempea, Ioan <[log in to unmask]>

Mon, 1 May 2006 15:01:59 -0400

41 lines

Re: Pump printing

Gilbert Roberge <[log in to unmask]>

Mon, 1 May 2006 15:16:08 -0400

77 lines

Re: Pump printing

Steve Gregory <[log in to unmask]>

Mon, 1 May 2006 14:29:27 -0500

100 lines

Re: Pump printing

Beranek, Jerry <[log in to unmask]>

Mon, 1 May 2006 14:24:53 -0500

99 lines

Re: Pump printing

Joel Mearig <[log in to unmask]>

Mon, 1 May 2006 12:34:40 -0700

82 lines

New Thread

Pushback blog site up and running

Pushback blog site up and running

John Burke <[log in to unmask]>

Tue, 2 May 2006 18:34:53 -0700

68 lines

Re: Pushback blog site up and running

John Burke <[log in to unmask]>

Thu, 4 May 2006 09:00:59 -0700

75 lines

New Thread

Putting your money where your mind is...

Putting your money where your mind is...

R Sedlak <[log in to unmask]>

Tue, 16 May 2006 16:13:14 -0700

39 lines

Re: Putting your money where your mind is...

Joe Fjelstad <[log in to unmask]>

Tue, 16 May 2006 19:22:38 EDT

27 lines

Re: Putting your money where your mind is...

John Burke <[log in to unmask]>

Tue, 16 May 2006 16:54:07 -0700

90 lines

New Thread

PWB de-paneling

PWB de-paneling

Victor G. Hernandez <[log in to unmask]>

Tue, 2 May 2006 10:33:16 -0500

32 lines

Re: PWB de-paneling

Jeffrey Bush <[log in to unmask]>

Tue, 2 May 2006 12:45:35 -0400

73 lines

Re: PWB de-paneling

Lee Parker <[log in to unmask]>

Wed, 3 May 2006 15:35:11 -0400

110 lines

Re: PWB de-paneling

Sumxplore <[log in to unmask]>

Thu, 4 May 2006 22:47:28 +0800

143 lines

Re: PWB de-paneling

Dehoyos, Ramon <[log in to unmask]>

Fri, 5 May 2006 08:04:47 -0400

187 lines

New Thread

QC 080000 Certified

QC 080000 Certified

Ron Peeler <[log in to unmask]>

Mon, 1 May 2006 14:55:38 -0400

244 lines

Re: QC 080000 Certified

Ron Peeler <[log in to unmask]>

Mon, 1 May 2006 15:27:42 -0400

278 lines

Re: QC 080000 Certified

John Burke <[log in to unmask]>

Mon, 1 May 2006 13:09:56 -0700

318 lines

Re: QC 080000 Certified

Ron Peeler <[log in to unmask]>

Mon, 1 May 2006 16:59:48 -0400

323 lines

New Thread

Question about ENIG and other surface finishing

Re: Question about ENIG and other surface finishing

Sherif Refaat <[log in to unmask]>

Mon, 15 May 2006 10:01:55 -0400

243 lines

Re: Question about ENIG and other surface finishing

George Milad <[log in to unmask]>

Mon, 15 May 2006 15:14:44 EDT

47 lines

Re: Question about ENIG and other surface finishing

Stadem, Richard D. <[log in to unmask]>

Mon, 15 May 2006 15:50:09 -0500

79 lines

Re: Question about ENIG and other surface finishing

Roger Stoops <[log in to unmask]>

Tue, 16 May 2006 10:34:29 -0400

117 lines

Re: Question about ENIG and other surface finishing

Stadem, Richard D. <[log in to unmask]>

Tue, 16 May 2006 11:17:19 -0500

178 lines

Re: Question about ENIG and other surface finishing

John Parsons <[log in to unmask]>

Tue, 16 May 2006 09:46:19 -0700

204 lines

Re: Question about ENIG and other surface finishing

John Burke <[log in to unmask]>

Tue, 16 May 2006 09:56:40 -0700

230 lines

Re: Question about ENIG and other surface finishing

Werner Engelmaier <[log in to unmask]>

Tue, 16 May 2006 13:05:24 EDT

37 lines

Re: Question about ENIG and other surface finishing

Stadem, Richard D. <[log in to unmask]>

Tue, 16 May 2006 12:11:56 -0500

266 lines

Re: Question about ENIG and other surface finishing

John Parsons <[log in to unmask]>

Tue, 16 May 2006 10:36:14 -0700

298 lines

Re: Question about ENIG and other surface finishing

John Burke <[log in to unmask]>

Tue, 16 May 2006 11:00:10 -0700

328 lines

Re: Question about ENIG and other surface finishing

Kerry McMullen <[log in to unmask]>

Tue, 16 May 2006 15:05:50 -0400

313 lines

Re: Question about ENIG and other surface finishing

Leo Higgins <[log in to unmask]>

Tue, 16 May 2006 12:14:27 -0700

352 lines

Re: Question about ENIG and other surface finishing

Whittaker, Dewey (AZ75) <[log in to unmask]>

Tue, 16 May 2006 13:05:43 -0700

162 lines

Re: Question about ENIG and other surface finishing

Douglas O. Pauls <[log in to unmask]>

Tue, 16 May 2006 15:27:39 -0500

213 lines

Re: Question about ENIG and other surface finishing

Werner Engelmaier <[log in to unmask]>

Tue, 16 May 2006 17:05:28 EDT

26 lines

Re: Question about ENIG and other surface finishing

Leo Higgins <[log in to unmask]>

Tue, 16 May 2006 18:39:02 -0700

82 lines

Re: Question about ENIG and other surface finishing

Kane, Amol (349) <[log in to unmask]>

Fri, 19 May 2006 07:24:00 -0400

227 lines

Re: Question about ENIG and other surface finishing

Colin McVean <[log in to unmask]>

Fri, 19 May 2006 12:53:23 +0100

265 lines

Re: Question about ENIG and other surface finishing

David D. Hillman <[log in to unmask]>

Sat, 20 May 2006 13:20:42 -0500

138 lines

New Thread

Question about ENIG in SnPb process . . . .

Question about ENIG in SnPb process . . . .

Camille Good <[log in to unmask]>

Thu, 11 May 2006 17:27:31 -0700

32 lines

Re: Question about ENIG in SnPb process . . . .

Werner Engelmaier <[log in to unmask]>

Thu, 11 May 2006 20:51:16 EDT

26 lines

Re: Question about ENIG in SnPb process . . . .

Vladimir Igoshev <[log in to unmask]>

Thu, 11 May 2006 21:40:01 -0400

86 lines

Re: Question about ENIG in SnPb process . . . .

Gerard O'Brien <[log in to unmask]>

Fri, 12 May 2006 08:30:40 -0400

92 lines

Re: Question about ENIG in SnPb process . . . .

Stadem, Richard D. <[log in to unmask]>

Fri, 12 May 2006 07:54:16 -0500

108 lines

Re: Question about ENIG in SnPb process . . . .

Daniel Blass <[log in to unmask]>

Fri, 12 May 2006 08:29:53 -0500

30 lines

Re: Question about ENIG in SnPb process . . . .

Wenger, George M. <[log in to unmask]>

Fri, 12 May 2006 10:14:37 -0400

104 lines

Re: Question about ENIG in SnPb process . . . .

Lee parker <[log in to unmask]>

Fri, 12 May 2006 10:28:49 -0400

120 lines

Re: Question about ENIG in SnPb process . . . .

Vladimir Igoshev <[log in to unmask]>

Fri, 12 May 2006 11:21:13 -0400

196 lines

Re: Question about ENIG in SnPb process . . . .

Gerard O'Brien <[log in to unmask]>

Fri, 12 May 2006 11:23:52 -0400

164 lines

Re: Question about ENIG in SnPb process . . . .

Frank Kimmey <[log in to unmask]>

Fri, 12 May 2006 08:39:03 -0700

205 lines

Re: Question about ENIG in SnPb process . . . .

Whittaker, Dewey (AZ75) <[log in to unmask]>

Fri, 12 May 2006 09:28:57 -0700

185 lines

Re: Question about ENIG in SnPb process . . . .

Joe Fjelstad <[log in to unmask]>

Fri, 12 May 2006 12:43:36 EDT

32 lines

Re: Question about ENIG in SnPb process . . . .

John Burke <[log in to unmask]>

Fri, 12 May 2006 10:08:41 -0700

63 lines

Re: Question about ENIG in SnPb process . . . .

Werner Engelmaier <[log in to unmask]>

Fri, 12 May 2006 14:15:12 EDT

34 lines

Re: Question about ENIG in SnPb process . . . .

Stadem, Richard D. <[log in to unmask]>

Fri, 12 May 2006 15:51:37 -0500

82 lines

Re: Question about ENIG in SnPb process . . . .

Şefika ÖZKAL <[log in to unmask]>

Mon, 15 May 2006 09:19:17 +0300

137 lines

Re: Question about ENIG in SnPb process . . . .

Stadem, Richard D. <[log in to unmask]>

Mon, 15 May 2006 07:12:18 -0500

204 lines

Re: Question about ENIG in SnPb process . . . .

Alcorn, Brent <[log in to unmask]>

Mon, 15 May 2006 09:14:22 -0400

214 lines

Re: Question about ENIG in SnPb process . . . .

Stadem, Richard D. <[log in to unmask]>

Mon, 15 May 2006 08:46:46 -0500

262 lines

Re: Question about ENIG in SnPb process . . . .

Lee parker <[log in to unmask]>

Mon, 15 May 2006 09:59:39 -0400

182 lines

Re: Question about ENIG in SnPb process . . . .

Vladimir Igoshev <[log in to unmask]>

Mon, 15 May 2006 11:14:30 -0400

257 lines

Re: Question about ENIG in SnPb process . . . .

Werner Engelmaier <[log in to unmask]>

Mon, 15 May 2006 11:28:29 EDT

24 lines

New Thread

Randall L Bock/MSD/US/PBI is out of the office.

Randall L Bock/MSD/US/PBI is out of the office.

Randy Bock Sr. <[log in to unmask]>

Thu, 25 May 2006 00:32:12 -0400

24 lines

New Thread

Register now for How to Launch Your IPC-1752 Materials Declaration Program Workshop in Tampa, FL or Chelmsford, MA

Register now for How to Launch Your IPC-1752 Materials Declaration Program Workshop in Tampa, FL or Chelmsford, MA

Tina Nerad <[log in to unmask]>

Mon, 15 May 2006 15:59:27 -0500

45 lines

New Thread

reliability data on lead free real life scenario

reliability data on lead free real life scenario

John Burke <[log in to unmask]>

Wed, 10 May 2006 16:47:26 -0700

197 lines

Re: reliability data on lead free real life scenario

Chad Renando <[log in to unmask]>

Thu, 11 May 2006 10:02:53 +1000

223 lines

Re: reliability data on lead free real life scenario

John Burke <[log in to unmask]>

Wed, 10 May 2006 17:42:04 -0700

248 lines

Re: reliability data on lead free real life scenario

Dale Ritzen <[log in to unmask]>

Thu, 11 May 2006 06:50:05 -0500

279 lines

Re: reliability data on lead free real life scenario

Joyce Koo <[log in to unmask]>

Thu, 11 May 2006 08:49:17 -0400

270 lines

Re: reliability data on lead free real life scenario

Kerry McMullen <[log in to unmask]>

Thu, 11 May 2006 09:26:34 -0400

255 lines

Re: reliability data on lead free real life scenario

John Burke <[log in to unmask]>

Thu, 11 May 2006 09:16:22 -0700

280 lines

New Thread

Rohs Weeeeeee board material

Rohs Weeeeeee board material

Chris Ball <[log in to unmask]>

Wed, 17 May 2006 10:25:46 -0400

39 lines

Re: Rohs Weeeeeee board material

Brian Ellis <[log in to unmask]>

Wed, 17 May 2006 17:42:03 +0300

67 lines

Re: Rohs Weeeeeee board material

Colin McVean <[log in to unmask]>

Wed, 17 May 2006 15:44:09 +0100

76 lines

Re: Rohs Weeeeeee board material

Fox, Ian <[log in to unmask]>

Wed, 17 May 2006 16:02:06 +0100

83 lines

Re: Rohs Weeeeeee board material

Chris Ball <[log in to unmask]>

Wed, 17 May 2006 11:09:37 -0400

108 lines

Re: Rohs Weeeeeee board material

Chris Ball <[log in to unmask]>

Wed, 17 May 2006 11:19:35 -0400

136 lines

Re: Rohs Weeeeeee board material

Colin McVean <[log in to unmask]>

Wed, 17 May 2006 16:23:04 +0100

161 lines

Re: Rohs Weeeeeee board material

Tempea, Ioan <[log in to unmask]>

Wed, 17 May 2006 12:26:06 -0400

152 lines

Re: Rohs Weeeeeee board material

Whittaker, Dewey (AZ75) <[log in to unmask]>

Wed, 17 May 2006 10:44:24 -0700

171 lines

Re: Rohs Weeeeeee board material

Whittaker, Dewey (AZ75) <[log in to unmask]>

Wed, 17 May 2006 10:49:52 -0700

111 lines

Re: Rohs Weeeeeee board material

Joyce Koo <[log in to unmask]>

Wed, 17 May 2006 13:50:27 -0400

195 lines

Re: Rohs Weeeeeee board material

Chris Ball <[log in to unmask]>

Wed, 17 May 2006 14:10:13 -0400

169 lines

Re: Rohs Weeeeeee board material

John Burke <[log in to unmask]>

Wed, 17 May 2006 11:12:46 -0700

222 lines

Re: Rohs Weeeeeee board material

John Burke <[log in to unmask]>

Wed, 17 May 2006 11:20:01 -0700

245 lines

Re: Rohs Weeeeeee board material

James <[log in to unmask]>

Wed, 17 May 2006 11:26:46 -0700

226 lines

Re: Rohs Weeeeeee board material

James <[log in to unmask]>

Wed, 17 May 2006 12:57:52 -0700

232 lines

Re: Rohs Weeeeeee board material

Werner Engelmaier <[log in to unmask]>

Wed, 17 May 2006 20:24:09 EDT

37 lines

Re: Rohs Weeeeeee board material

Werner Engelmaier <[log in to unmask]>

Wed, 17 May 2006 20:32:30 EDT

31 lines

Re: Rohs Weeeeeee board material

Werner Engelmaier <[log in to unmask]>

Wed, 17 May 2006 20:38:31 EDT

28 lines

Re: Rohs Weeeeeee board material

Werner Engelmaier <[log in to unmask]>

Wed, 17 May 2006 20:45:34 EDT

27 lines

Re: Rohs Weeeeeee board material

Joe Fjelstad <[log in to unmask]>

Thu, 18 May 2006 13:07:02 -0400

225 lines

Re: Rohs Weeeeeee board material

EIMCNews <[log in to unmask]>

Thu, 18 May 2006 10:37:40 -0700

37 lines

Re: Rohs Weeeeeee board material

Eddie Rocha <[log in to unmask]>

Thu, 18 May 2006 14:46:56 -0700

56 lines

Re: Rohs Weeeeeee board material

Werner Engelmaier <[log in to unmask]>

Thu, 18 May 2006 20:02:44 EDT

29 lines

Re: Rohs Weeeeeee board material

Valerie St. Cyr <[log in to unmask]>

Fri, 19 May 2006 09:55:54 -0400

75 lines

Re: Rohs Weeeeeee board material

Phil Nutting <[log in to unmask]>

Fri, 19 May 2006 10:10:18 -0400

102 lines

Re: Rohs Weeeeeee board material

Phil Nutting <[log in to unmask]>

Fri, 19 May 2006 10:15:52 -0400

130 lines

Re: Rohs Weeeeeee board material

Ahne Oosterhof <[log in to unmask]>

Fri, 19 May 2006 07:46:18 -0700

145 lines

Re: Rohs Weeeeeee board material

Valerie St. Cyr <[log in to unmask]>

Fri, 19 May 2006 10:54:18 -0400

181 lines

Re: Rohs Weeeeeee board material

Phil Nutting <[log in to unmask]>

Fri, 19 May 2006 11:32:49 -0400

213 lines

Re: Rohs Weeeeeee board material

Werner Engelmaier <[log in to unmask]>

Fri, 19 May 2006 13:26:49 EDT

38 lines

Re: Rohs Weeeeeee board material

Valerie St. Cyr <[log in to unmask]>

Mon, 22 May 2006 12:32:41 -0400

153 lines

Re: Rohs Weeeeeee board material

Werner Engelmaier <[log in to unmask]>

Mon, 22 May 2006 13:34:02 EDT

81 lines

Re: Rohs Weeeeeee board material

Valerie St. Cyr <[log in to unmask]>

Mon, 22 May 2006 15:13:02 -0400

134 lines

Re: Rohs Weeeeeee board material

Werner Engelmaier <[log in to unmask]>

Mon, 22 May 2006 15:28:10 EDT

42 lines

Re: Rohs Weeeeeee board material

Werner Engelmaier <[log in to unmask]>

Mon, 22 May 2006 15:36:20 EDT

61 lines

Re: Rohs Weeeeeee board material

Gerald Gagnon <[log in to unmask]>

Tue, 23 May 2006 18:51:21 -0400

111 lines

Re: Rohs Weeeeeee board material

Werner Engelmaier <[log in to unmask]>

Tue, 23 May 2006 20:19:10 EDT

27 lines

Re: Rohs Weeeeeee board material

Whittaker, Dewey (AZ75) <[log in to unmask]>

Thu, 25 May 2006 14:15:38 -0700

94 lines

Re: Rohs Weeeeeee board material

Werner Engelmaier <[log in to unmask]>

Thu, 25 May 2006 20:38:04 EDT

34 lines

Re: Rohs Weeeeeee board material

Douglas O. Pauls <[log in to unmask]>

Fri, 26 May 2006 07:30:18 -0500

91 lines

Re: Rohs Weeeeeee board material

Werner Engelmaier <[log in to unmask]>

Fri, 26 May 2006 09:44:34 EDT

28 lines

Re: Rohs Weeeeeee board material

Happy Holden <[log in to unmask]>

Fri, 26 May 2006 10:27:52 -0400

89 lines

Re: Rohs Weeeeeee board material

Brian Ellis <[log in to unmask]>

Fri, 26 May 2006 18:35:15 +0300

80 lines

Re: Rohs Weeeeeee board material

Tempea, Ioan <[log in to unmask]>

Fri, 26 May 2006 11:49:49 -0400

39 lines

Re: Rohs Weeeeeee board material

Stadem, Richard D. <[log in to unmask]>

Fri, 26 May 2006 10:56:04 -0500

63 lines

Re: Rohs Weeeeeee board material

Tempea, Ioan <[log in to unmask]>

Fri, 26 May 2006 12:07:04 -0400

105 lines

Re: Rohs Weeeeeee board material

Happy Holden <[log in to unmask]>

Fri, 26 May 2006 12:32:52 -0400

88 lines

Re: Rohs Weeeeeee board material

Jeffrey Bush <[log in to unmask]>

Fri, 26 May 2006 12:49:25 -0400

133 lines

Re: Rohs Weeeeeee board material

John Burke <[log in to unmask]>

Fri, 26 May 2006 10:18:43 -0700

174 lines

Re: Rohs Weeeeeee board material

Werner Engelmaier <[log in to unmask]>

Fri, 26 May 2006 13:22:10 -0400

140 lines

Re: Rohs Weeeeeee board material

Werner Engelmaier <[log in to unmask]>

Fri, 26 May 2006 13:24:18 -0400

123 lines

Re: Rohs Weeeeeee board material

Werner Engelmaier <[log in to unmask]>

Fri, 26 May 2006 13:25:31 -0400

161 lines

Re: Rohs Weeeeeee board material

Stadem, Richard D. <[log in to unmask]>

Fri, 26 May 2006 12:52:08 -0500

181 lines

Re: Rohs Weeeeeee board material

Happy Holden <[log in to unmask]>

Fri, 26 May 2006 14:23:46 -0400

160 lines

Re: Rohs Weeeeeee board material

Werner Engelmaier <[log in to unmask]>

Fri, 26 May 2006 19:56:45 EDT

35 lines

Re: Rohs Weeeeeee board material

Tempea, Ioan <[log in to unmask]>

Mon, 29 May 2006 07:55:30 -0400

142 lines

Re: Rohs Weeeeeee board material

Happy Holden <[log in to unmask]>

Mon, 29 May 2006 14:46:51 -0400

190 lines

Re: Rohs Weeeeeee board material

Tempea, Ioan <[log in to unmask]>

Mon, 29 May 2006 14:59:31 -0400

63 lines

Re: Rohs Weeeeeee board material

Susan Mansilla <[log in to unmask]>

Mon, 29 May 2006 17:13:18 EDT

35 lines

Re: Rohs Weeeeeee board material

Happy Holden <[log in to unmask]>

Tue, 30 May 2006 06:23:11 -0400

82 lines

Re: Rohs Weeeeeee board material

Whittaker, Dewey (AZ75) <[log in to unmask]>

Tue, 30 May 2006 13:52:20 -0700

67 lines

New Thread

Silkscreen on pads

Silkscreen on pads

Black, Paul <[log in to unmask]>

Tue, 16 May 2006 08:46:09 -0400

38 lines

Re: Silkscreen on pads

Stadem, Richard D. <[log in to unmask]>

Tue, 16 May 2006 07:55:09 -0500

73 lines

Re: Silkscreen on pads

Franklin D Asbell <[log in to unmask]>

Tue, 16 May 2006 07:58:42 -0500

69 lines

Re: Silkscreen on pads

Black, Paul <[log in to unmask]>

Tue, 16 May 2006 09:16:27 -0400

129 lines

Re: Silkscreen on pads

Franklin D Asbell <[log in to unmask]>

Tue, 16 May 2006 08:21:41 -0500

135 lines

Re: Silkscreen on pads

[log in to unmask]

Tue, 16 May 2006 10:42:02 EDT

37 lines

Re: Silkscreen on pads

[log in to unmask]

Tue, 16 May 2006 10:49:56 EDT

28 lines

Re: Silkscreen on pads

Whittaker, Dewey (AZ75) <[log in to unmask]>

Tue, 16 May 2006 08:30:38 -0700

103 lines

Re: Silkscreen on pads

Franklin D Asbell <[log in to unmask]>

Tue, 16 May 2006 10:37:02 -0500

133 lines

Re: Silkscreen on pads

Randy Bock Sr. <[log in to unmask]>

Tue, 16 May 2006 11:38:54 -0400

186 lines

Re: Silkscreen on pads

Miswald, Ron <[log in to unmask]>

Tue, 16 May 2006 10:44:19 -0500

162 lines

Re: Silkscreen on pads

[log in to unmask] <[log in to unmask]>

Tue, 16 May 2006 11:45:33 -0400

150 lines

Re: Silkscreen on pads

Michael Kuczynski <[log in to unmask]>

Tue, 16 May 2006 11:50:28 -0400

158 lines

Re: Silkscreen on pads

Stadem, Richard D. <[log in to unmask]>

Tue, 16 May 2006 11:26:17 -0500

195 lines

Re: Silkscreen on pads

John Burke <[log in to unmask]>

Tue, 16 May 2006 09:42:02 -0700

165 lines

Re: Silkscreen on pads

ALLEN, LOA <[log in to unmask]>

Tue, 16 May 2006 10:10:09 -0700

211 lines

Re: Silkscreen on pads

Black, Paul <[log in to unmask]>

Tue, 16 May 2006 14:45:54 -0400

247 lines

Re: Silkscreen on pads

David Greig <[log in to unmask]>

Tue, 16 May 2006 20:08:23 +0100

233 lines

Re: Silkscreen on pads

Chuck Brummer <[log in to unmask]>

Tue, 16 May 2006 12:43:40 -0700

93 lines

Re: Silkscreen on pads

Ted Tontis <[log in to unmask]>

Tue, 16 May 2006 15:12:22 -0500

70 lines

Re: Silkscreen on pads

John Parsons <[log in to unmask]>

Tue, 16 May 2006 13:35:54 -0700

36 lines

Re: Silkscreen on pads

Stadem, Richard D. <[log in to unmask]>

Tue, 16 May 2006 15:35:17 -0500

93 lines

Re: Silkscreen on pads

Bob Wilson <[log in to unmask]>

Tue, 16 May 2006 13:38:25 -0700

71 lines

Re: Silkscreen on pads

Jeffrey Bush <[log in to unmask]>

Wed, 17 May 2006 08:10:46 -0400

109 lines

New Thread

SMT Stressed Connector rework issue

SMT Stressed Connector rework issue

Michael Forrester <[log in to unmask]>

Thu, 4 May 2006 06:00:38 -0400

61 lines

Re: SMT Stressed Connector rework issue

Werner Engelmaier <[log in to unmask]>

Thu, 4 May 2006 13:32:10 EDT

29 lines

Re: SMT Stressed Connector rework issue

Wayne Thayer <[log in to unmask]>

Thu, 4 May 2006 16:13:16 -0400

105 lines

New Thread

Soda Strawing

Soda Strawing

Ryan Grant <[log in to unmask]>

Fri, 12 May 2006 08:56:54 -0600

25 lines

New Thread

solder ball analysis

solder ball analysis

Andrew Shieh <[log in to unmask]>

Tue, 30 May 2006 10:23:52 -0400

61 lines

Re: solder ball analysis

[log in to unmask]

Tue, 30 May 2006 11:29:12 EDT

26 lines

Re: solder ball analysis

Matthew Park <[log in to unmask]>

Tue, 30 May 2006 10:19:59 -0500

109 lines

Re: solder ball analysis

Vladimir Igoshev <[log in to unmask]>

Tue, 30 May 2006 11:43:27 -0400

162 lines

Re: solder ball analysis

Andrew Shieh <[log in to unmask]>

Tue, 30 May 2006 12:11:20 -0400

85 lines

Re: solder ball analysis

Wayne Thayer <[log in to unmask]>

Tue, 30 May 2006 12:23:22 -0400

134 lines

Re: solder ball analysis

John Burke <[log in to unmask]>

Tue, 30 May 2006 09:59:56 -0700

63 lines

Re: solder ball analysis

Andrew Shieh <[log in to unmask]>

Tue, 30 May 2006 17:43:40 -0400

103 lines

Re: solder ball analysis

John Burke <[log in to unmask]>

Tue, 30 May 2006 15:01:22 -0700

128 lines

New Thread

Solder Mask / Gold Finger Plating Spec

Solder Mask / Gold Finger Plating Spec

Victor G. Hernandez <[log in to unmask]>

Fri, 5 May 2006 09:10:33 -0500

43 lines

New Thread

Solder mask defined annular rings

Solder mask defined annular rings

Tempea, Ioan <[log in to unmask]>

Wed, 17 May 2006 16:04:24 -0400

35 lines

New Thread

Soldermask adhesion over vias?

Soldermask adhesion over vias?

Kevin Glidden <[log in to unmask]>

Tue, 16 May 2006 08:30:58 -0400

39 lines

Re: Soldermask adhesion over vias?

Steve Gregory <[log in to unmask]>

Tue, 16 May 2006 07:45:09 -0500

67 lines

Re: Soldermask adhesion over vias?

Whittaker, Dewey (AZ75) <[log in to unmask]>

Tue, 16 May 2006 07:53:52 -0700

70 lines

New Thread

Stop Press II

Stop Press II

R Sedlak <[log in to unmask]>

Mon, 15 May 2006 16:29:32 -0700

32 lines

New Thread

Storage

Storage

Pradeep <[log in to unmask]>

Fri, 12 May 2006 14:36:11 +0530

28 lines

Re: Storage

Kevin Glidden <[log in to unmask]>

Fri, 12 May 2006 08:46:33 -0400

67 lines

New Thread

Support of John Burke

Support of John Burke

Drew meyer <[log in to unmask]>

Wed, 17 May 2006 12:21:50 -0500

32 lines

Re: Support of John Burke

John Burke <[log in to unmask]>

Wed, 17 May 2006 10:30:16 -0700

63 lines

Re: Support of John Burke

Dave Seymour <[log in to unmask]>

Wed, 17 May 2006 13:37:04 -0400

93 lines

Re: Support of John Burke

Stadem, Richard D. <[log in to unmask]>

Wed, 17 May 2006 12:40:22 -0500

124 lines

Re: Support of John Burke

Kevin Glidden <[log in to unmask]>

Wed, 17 May 2006 14:26:33 -0400

119 lines

Re: Support of John Burke

R Sedlak <[log in to unmask]>

Wed, 17 May 2006 12:06:17 -0700

34 lines

New Thread

Surface Tension Data for SAC305

Surface Tension Data for SAC305

David D. Hillman <[log in to unmask]>

Tue, 2 May 2006 10:32:52 -0500

31 lines

Re: Surface Tension Data for SAC305

Kerry McMullen <[log in to unmask]>

Tue, 2 May 2006 12:07:02 -0400

78 lines

Re: Surface Tension Data for SAC305

Gregg A. Owens <[log in to unmask]>

Tue, 2 May 2006 16:36:32 -0700

61 lines

Re: Surface Tension Data for SAC305

Douglas O. Pauls <[log in to unmask]>

Wed, 3 May 2006 07:04:43 -0500

107 lines

Re: Surface Tension Data for SAC305

Steve Gregory <[log in to unmask]>

Wed, 3 May 2006 07:30:00 -0500

149 lines

Re: Surface Tension Data for SAC305

Daniel Blass <[log in to unmask]>

Wed, 3 May 2006 15:47:20 -0500

36 lines

Re: Surface Tension Data for SAC305

Mike Fenner <[log in to unmask]>

Thu, 4 May 2006 08:49:19 +0100

80 lines

New Thread

Swage Tooling Identification

Swage Tooling Identification

Steve Gregory <[log in to unmask]>

Mon, 8 May 2006 14:38:45 -0500

50 lines

Re: Swage Tooling Identification

ekalgren <[log in to unmask]>

Mon, 8 May 2006 15:50:15 -0400

93 lines

Re: Swage Tooling Identification

Whittaker, Dewey (AZ75) <[log in to unmask]>

Mon, 8 May 2006 13:04:40 -0700

83 lines

Re: Swage Tooling Identification

Dehoyos, Ramon <[log in to unmask]>

Mon, 8 May 2006 16:20:01 -0400

129 lines

Re: Swage Tooling Identification

John Burke <[log in to unmask]>

Mon, 8 May 2006 13:34:53 -0700

82 lines

Re: Swage Tooling Identification

Jason Gregory <[log in to unmask]>

Mon, 8 May 2006 15:35:59 -0500

158 lines

Re: Swage Tooling Identification

Steve Mikell <[log in to unmask]>

Tue, 9 May 2006 04:27:21 +0700

82 lines

Re: Swage Tooling Identification

Ian Hanna <[log in to unmask]>

Mon, 8 May 2006 17:40:50 -0400

119 lines

Re: Swage Tooling Identification

Genny Gibbard <[log in to unmask]>

Mon, 8 May 2006 16:23:55 -0600

129 lines

Re: Swage Tooling Identification

Steve Gregory <[log in to unmask]>

Tue, 9 May 2006 07:03:06 -0500

120 lines

Re: Swage Tooling Identification

Ed Popielarski <[log in to unmask]>

Tue, 9 May 2006 08:06:52 -0700

139 lines

New Thread

SWATCH article

SWATCH article

John Burke <[log in to unmask]>

Fri, 12 May 2006 10:27:19 -0700

41 lines

New Thread

T0-257

T0-257

Dehoyos, Ramon <[log in to unmask]>

Fri, 19 May 2006 09:40:22 -0400

33 lines

New Thread

TAC committee for RoHS

TAC committee for RoHS

John Burke <[log in to unmask]>

Tue, 30 May 2006 21:57:33 -0700

127 lines

New Thread

TAC decisions and lead in solders

TAC decisions and lead in solders

John Burke <[log in to unmask]>

Thu, 25 May 2006 23:15:51 -0700

45 lines

New Thread

TechNet Digest - 10 May 2006 to 11 May 2006 (#2006-127)

Re: TechNet Digest - 10 May 2006 to 11 May 2006 (#2006-127)

Roger Stoops <[log in to unmask]>

Fri, 12 May 2006 09:06:35 -0400

59 lines

New Thread

Thermal cycle test for plated through holes filled with epoxy ink and cap plated on the top

Thermal cycle test for plated through holes filled with epoxy ink and cap plated on the top

christian ge <[log in to unmask]>

Tue, 23 May 2006 14:52:57 +0800

39 lines

Re: Thermal cycle test for plated through holes filled with epoxy ink and cap plated on the top

Werner Engelmaier <[log in to unmask]>

Tue, 23 May 2006 07:28:16 EDT

44 lines

Re: Thermal cycle test for plated through holes filled with epoxy ink and cap plated on the top

Werner Engelmaier <[log in to unmask]>

Tue, 23 May 2006 08:38:04 EDT

47 lines

Re: Thermal cycle test for plated through holes filled with epoxy ink and cap plated on the top

Werner Engelmaier <[log in to unmask]>

Tue, 23 May 2006 08:42:19 EDT

51 lines

Re: Thermal cycle test for plated through holes filled with epoxy ink and cap plated on the top

Jeffrey Bush <[log in to unmask]>

Tue, 23 May 2006 08:24:40 -0400

85 lines

Re: Thermal cycle test for plated through holes filled with epoxy ink and cap plated on the top

David D. Hillman <[log in to unmask]>

Tue, 23 May 2006 08:01:42 -0500

108 lines

Re: Thermal cycle test for plated through holes filled with epoxy ink and cap plated on the top

Whittaker, Dewey (AZ75) <[log in to unmask]>

Tue, 23 May 2006 06:47:26 -0700

79 lines

New Thread

Thermal cycle test for plated through holes filled with epoxy inkand cap plated on the top

Re: Thermal cycle test for plated through holes filled with epoxy inkand cap plated on the top

Wayne Thayer <[log in to unmask]>

Tue, 23 May 2006 08:31:08 -0400

78 lines

New Thread

Thermal cycle test for plated through holes filled with epoxyink and cap plated on

Re: Thermal cycle test for plated through holes filled with epoxyink and cap plated on

Wayne Thayer <[log in to unmask]>

Tue, 23 May 2006 09:39:07 -0400

181 lines

Re: Thermal cycle test for plated through holes filled with epoxyink and cap plated on

David D. Hillman <[log in to unmask]>

Tue, 23 May 2006 11:01:34 -0500

229 lines

New Thread

Thermal stitching in SMT boards

Thermal stitching in SMT boards

Phil Nutting <[log in to unmask]>

Fri, 12 May 2006 08:45:46 -0400

35 lines

New Thread

Thieving

Thieving

Barry Gallegos <[log in to unmask]>

Tue, 2 May 2006 15:21:55 -0600

28 lines

Re: Thieving

Barmuta, Mike <[log in to unmask]>

Tue, 2 May 2006 14:38:25 -0700

95 lines

Re: Thieving

Whittaker, Dewey (AZ75) <[log in to unmask]>

Tue, 2 May 2006 15:12:14 -0700

116 lines

Re: Thieving

Joe Fjelstad <[log in to unmask]>

Tue, 2 May 2006 18:57:02 EDT

40 lines

Re: Thieving

Jeffrey Bush <[log in to unmask]>

Wed, 3 May 2006 07:42:40 -0400

70 lines

Re: Thieving

Barry Gallegos <[log in to unmask]>

Wed, 3 May 2006 07:12:44 -0600

74 lines

New Thread

Tin whisker position and China translation

Tin whisker position and China translation

John Burke <[log in to unmask]>

Wed, 10 May 2006 01:02:11 -0700

139 lines

New Thread

Tin Whisker REVENGE

Tin Whisker REVENGE

R Sedlak <[log in to unmask]>

Thu, 18 May 2006 13:44:20 -0700

39 lines

Re: Tin Whisker REVENGE

Steve Mikell <[log in to unmask]>

Fri, 19 May 2006 04:21:59 +0700

72 lines

Re: Tin Whisker REVENGE

Phil Nutting <[log in to unmask]>

Thu, 18 May 2006 17:50:51 -0400

103 lines

Re: Tin Whisker REVENGE

John Burke <[log in to unmask]>

Thu, 18 May 2006 16:18:10 -0700

75 lines

New Thread

Underfill or else...

Underfill or else...

Tempea, Ioan <[log in to unmask]>

Tue, 16 May 2006 09:40:45 -0400

40 lines

Re: Underfill or else...

Leo Higgins <[log in to unmask]>

Tue, 16 May 2006 08:02:37 -0700

135 lines

New Thread

Unplugged via under BGA

Unplugged via under BGA

Miswald, Ron <[log in to unmask]>

Wed, 10 May 2006 09:40:45 -0500

36 lines

Re: Unplugged via under BGA

John Burke <[log in to unmask]>

Wed, 10 May 2006 09:32:12 -0700

79 lines

Re: Unplugged via under BGA

Preuschl, Thomas <[log in to unmask]>

Thu, 11 May 2006 08:09:05 +0200

118 lines

Re: Unplugged via under BGA

John Burke <[log in to unmask]>

Thu, 11 May 2006 16:28:47 -0700

141 lines

New Thread

Upcoming IPC Events on RoHS and Materials Declaration

Upcoming IPC Events on RoHS and Materials Declaration

Tina Nerad <[log in to unmask]>

Wed, 24 May 2006 09:31:06 -0500

44 lines

Re: Upcoming IPC Events on RoHS and Materials Declaration

Ian Hanna <[log in to unmask]>

Wed, 24 May 2006 10:45:38 -0400

68 lines

New Thread

Urgent need to obtain temporary supply of Kester HF1189A wave solder flux

Urgent need to obtain temporary supply of Kester HF1189A wave solder flux

- Bogert <[log in to unmask]>

Thu, 4 May 2006 17:14:55 -0400

39 lines

New Thread

Use of Fiducials & thermal stitching

Use of Fiducials & thermal stitching

Phil Nutting <[log in to unmask]>

Thu, 11 May 2006 10:18:24 -0400

42 lines

Re: Use of Fiducials & thermal stitching

Graham Collins <[log in to unmask]>

Thu, 11 May 2006 10:29:13 -0400

90 lines

Re: Use of Fiducials & thermal stitching

stephen gregory <[log in to unmask]>

Thu, 11 May 2006 07:34:20 -0700

66 lines

Re: Use of Fiducials & thermal stitching

Croslin, Robert <[log in to unmask]>

Thu, 11 May 2006 10:59:17 -0400

77 lines

Re: Use of Fiducials & thermal stitching

Tempea, Ioan <[log in to unmask]>

Thu, 11 May 2006 11:02:37 -0400

76 lines

Re: Use of Fiducials & thermal stitching

Daniel Blass <[log in to unmask]>

Thu, 11 May 2006 09:59:29 -0500

34 lines

Re: Use of Fiducials & thermal stitching

Jeffrey Bush <[log in to unmask]>

Thu, 11 May 2006 12:53:00 -0400

85 lines

New Thread

Water Engine

Water Engine

Dehoyos, Ramon <[log in to unmask]>

Thu, 4 May 2006 12:05:10 -0400

27 lines

Water Engine

Dehoyos, Ramon <[log in to unmask]>

Thu, 4 May 2006 12:11:15 -0400

29 lines

New Thread

Wicking in Printed Circuit Board

Wicking in Printed Circuit Board

Wee Mei <[log in to unmask]>

Fri, 26 May 2006 07:47:49 +0800

29 lines

Re: Wicking in Printed Circuit Board

Paul Reid <[log in to unmask]>

Tue, 30 May 2006 08:38:35 -0400

105 lines

New Thread

Workmanship

Workmanship

Bloomquist, Ken <[log in to unmask]>

Tue, 16 May 2006 14:35:34 -0700

30 lines

Re: Workmanship

Phil Nutting <[log in to unmask]>

Tue, 16 May 2006 17:41:11 -0400

59 lines

Re: Workmanship

Alan Davison <[log in to unmask]>

Tue, 16 May 2006 15:03:02 -0700

38 lines

Re: Workmanship

Bremer, Gary <[log in to unmask]>

Tue, 16 May 2006 15:22:37 -0700

70 lines

New Thread

[LF] 5th Stakeholder consultation

Re: [LF] 5th Stakeholder consultation

John Burke <[log in to unmask]>

Fri, 12 May 2006 09:23:30 -0700

98 lines

New Thread

[LF] Back to square one

Re: [LF] Back to square one

Werner Engelmaier <[log in to unmask]>

Mon, 22 May 2006 08:28:45 EDT

45 lines

New Thread

[NTC] Isn't technet GREAT?

[NTC] Isn't technet GREAT?

Genny Gibbard <[log in to unmask]>

Fri, 19 May 2006 10:50:54 -0600

29 lines

Re: [NTC] Isn't technet GREAT?

Brian Ellis <[log in to unmask]>

Sat, 20 May 2006 10:22:12 +0300

54 lines

New Thread

[NTC] MiniWave Solderpot Recommendations

Re: [NTC] MiniWave Solderpot Recommendations

Genny Gibbard <[log in to unmask]>

Fri, 19 May 2006 15:00:27 -0600

87 lines

Re: [NTC] MiniWave Solderpot Recommendations

Steve Gregory <[log in to unmask]>

Fri, 19 May 2006 16:03:54 -0500

114 lines

Re: [NTC] MiniWave Solderpot Recommendations

Whittaker, Dewey (AZ75) <[log in to unmask]>

Fri, 19 May 2006 14:27:42 -0700

116 lines

Re: [NTC] MiniWave Solderpot Recommendations

Whittaker, Dewey (AZ75) <[log in to unmask]>

Fri, 19 May 2006 14:30:05 -0700

141 lines

New Thread

[NTC]Re: [TN] Tin Whisker REVENGE

[NTC]Re: [TN] Tin Whisker REVENGE

Steve Mikell <[log in to unmask]>

Fri, 19 May 2006 15:14:19 +0700

113 lines

Re: [NTC]Re: [TN] Tin Whisker REVENGE

Werner Engelmaier <[log in to unmask]>

Fri, 19 May 2006 06:44:31 EDT

31 lines

Re: [NTC]Re: [TN] Tin Whisker REVENGE

John Burke <[log in to unmask]>

Fri, 19 May 2006 09:34:04 -0700

142 lines

Re: [NTC]Re: [TN] Tin Whisker REVENGE

Whittaker, Dewey (AZ75) <[log in to unmask]>

Fri, 19 May 2006 09:38:35 -0700

193 lines

Re: [NTC]Re: [TN] Tin Whisker REVENGE

John Burke <[log in to unmask]>

Fri, 19 May 2006 09:53:30 -0700

208 lines

Re: [NTC]Re: [TN] Tin Whisker REVENGE

Steve Gregory <[log in to unmask]>

Fri, 19 May 2006 13:02:54 -0500

179 lines

Re: [NTC]Re: [TN] Tin Whisker REVENGE

John Burke <[log in to unmask]>

Fri, 19 May 2006 11:16:23 -0700

195 lines

Re: [NTC]Re: [TN] Tin Whisker REVENGE

John Burke <[log in to unmask]>

Fri, 19 May 2006 11:17:10 -0700

189 lines

Re: [NTC]Re: [TN] Tin Whisker REVENGE

[log in to unmask]

Fri, 19 May 2006 14:18:59 EDT

30 lines

New Thread

[spam] Re: [TN] FW: [TN] electroless gold thickness'

[spam] Re: [TN] FW: [TN] electroless gold thickness'

R Sedlak <[log in to unmask]>

Thu, 25 May 2006 11:18:48 -0700

252 lines

New Thread

[spam] Re: [TN] Rohs Weeeeeee board material

Re: [spam] Re: [TN] Rohs Weeeeeee board material

Whittaker, Dewey (AZ75) <[log in to unmask]>

Tue, 30 May 2006 14:33:37 -0700

215 lines

New Thread

[TN] Re: (瑞星提ç

RE: [TN] Re: (瑞星提ç

Chezhian, Krishnan (Radhakrishnan) <[log in to unmask]>

Tue, 9 May 2006 15:46:57 +0800

209 lines

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