LISTSERV mailing list manager LISTSERV 16.0

Help for TECHNET Archives


TECHNET Archives

TECHNET Archives


June 2002


View:

Show Author | Hide Author
Show Table of Contents | Hide Table of Contents

 

Table of Contents:

(none) (1 message)
: Blowhole (process indicator) (2 messages)
: Martin-Marietta Workmanship Standard (7 messages)
: White residue using Kester flux & wire (2 messages)
About IPC's std.. IPC 7721 and 7720 (5 messages)
about the dye penetrant materials in solder joints FA (6 messages)
Access to balls on a BGA from the opposite side of the B oard (6 messages)
Access to balls on a BGA from the opposite side of the Board (1 message)
Advice on Inspection Equipment Needeed (3 messages)
Antw: [TN] fractured solder joints (1 message)
Antw: [TN] Soldering Nickel (1 message)
Anybody got a AirVac PCBRM 12 they want to sell? (1 message)
Assistance on IPC610 (3 messages)
ASSY: Component Polarity NTC (1 message)
Au revoir (1 message)
Ball Placement Tooling (1 message)
bent component leads (3 messages)
BGA packaging? (3 messages)
BGA Visual Inspection - Name Correction (1 message)
buried resistance/embedded components (1 message)
Cell phone antenna enhances...NTC (1 message)
Cleaning of Military PWAs That Have Been Soldered with N o-Clean Flux (1 message)
Cleaning of Military PWAs That Have Been Soldered with No-Clean Flux (1 message)
Cleaning of Military PWAs That Have Been Soldered withN o-CleanFlux (1 message)
Cleaning of Military PWAs That Have Been Soldered withNo -CleanFlux (4 messages)
Cleaning of Military PWAs That Have Been Soldered withNo-CleanFlux (5 messages)
Conformal coating - Dip Vs Spray (3 messages)
Contract Manufacturing Seminar (1 message)
Cosmetic Requirements (1 message)
cracks in solder joints (6 messages)
Definition of Suported/ unsupported hole (10 messages)
Definition of Supported/ unsupported hole (11 messages)
DEK Enviromental Control Unit (ECU) (2 messages)
DEK Environmental Control Unit (ECU) (3 messages)
Direct copper bonding (3 messages)
DPMO benchmarking (1 message)
Drilling FR6 material (1 message)
Econonic Boom (1 message)
Electrolude DCA COnformal Coating Rework (2 messages)
Electronics Assembly disposal (9 messages)
Electrovert Omniflo-10 users.. (2 messages)
ELni/au (6 messages)
ESD and equipment isolation (1 message)
ESD heel straps (13 messages)
Evanohm (3 messages)
Extraneous Metal On MLCCs (5 messages)
Failure at IMC (1 message)
Flex circuit registration (5 messages)
Flip Chip and Tape automated bonding feasibility and Implementation Program (1 message)
flux on component side of PCB (4 messages)
fluxing the top side of printed circuit board (2 messages)
Foreign Inclusions (Interpretation) (2 messages)
fractured solder joints (10 messages)
FW: Flip Chip and Tape automated bonding feasibility and Implementation Program (1 message)
FW: [DC] BGA Coating Question (1 message)
FW: [TN] Advice on Inspection Equipment Needeed (1 message)
Glue or Not to Glue? (2 messages)
High operating temperature (9 messages)
High Rel Circuit Board Fab (3 messages)
How to de-populate a PWB? (8 messages)
How to de-populate a PWB? (warning - another commercial plug) (3 messages)
How to de-populate a PWB? part 2 (1 message)
Hows ya balls? (2 messages)
Immersion Tin (15 messages)
Immersion Tin and SERA (1 message)
Intermetallic Joint Failure (10 messages)
IPC spec on silkscreen alignment (1 message)
IPC spec on silkscreen alignment. (1 message)
IPC standards on Flux residue that is non-conductive and non-corrosive? (2 messages)
IPC Torque Specifications (4 messages)
IPC's std.. IPC 7721 (2 messages)
IPC-1720 AQP (Assemblers Qualification Profile) (4 messages)
Isolation Resistance vs. Insulation Resistance (5 messages)
Jim Herard/Endicott/IBM is out of the office. (1 message)
Labor estimation (3 messages)
Lead Emission Calcs for EPA TRI Reporting? (2 messages)
lead free assembly (3 messages)
liquid residue between lands (2 messages)
Looking for Soldering Theory Proofs (3 messages)
looking for users of Lloyd Doyle Phasor Inspection System (1 message)
Mark Orlowski/PEMSTAR Inc is out of the office. (1 message)
Masking Caps (5 messages)
Metal core PCB's (1 message)
Metcal SP200 soldering Iron (7 messages)
Moisture sensitive device (4 messages)
Moisture Sensitive Devices (7 messages)
My Friday TechNet post (1 message)
Need user assist with IPC website issues (2 messages)
Nickle-Palladium lead finish (3 messages)
No UV block (2 messages)
Not gold fingers on prototype conductive elastomer switc h (1 message)
Not gold fingers on prototype conductive elastomer switch (1 message)
NTC (1 message)
NTC: Looking for a service bureau (or equivalent) that c anhandleSCI CARDS files? (1 message)
NTC: Looking for a service bureau (or equivalent) that can handle SCI CARDS files? (2 messages)
NTC: Looking for a service bureau (or equivalent) that canhandleSCI CARDS files? (1 message)
Optocoupler's (5 messages)
OT Cell phone antenna enhances...NTC (2 messages)
OT- Anybody else getting strange emails? (11 messages)
OT- wasn't an experiment.. (The other side) (2 messages)
Oxidation problem in Silver plated components leads (11 messages)
PCB Finish (2 messages)
PCB lay-out problem... (17 messages)
Peel Strength (1 message)
PWB measling and moisture (2 messages)
Re column grid arrays (3 messages)
recommended land pattern (2 messages)
Reflow on Wave. (10 messages)
Reflowing tin. (1 message)
Registration of soldermask (6 messages)
Reverse engineering a PCB... (5 messages)
Rigid Flex (1 message)
Rigid-Flex Bake Requirements?? (5 messages)
Rigid-Flex vendors... (6 messages)
Rod Smith/Endicott/IBM is out of the office. (4 messages)
Seeking PWA Test Information (2 messages)
Seho Solder System 8000 (2 messages)
Shelf life of Immersion Silver Fabs (6 messages)
Sign off Technet (1 message)
SNEC Meeting (5 messages)
SNEC Mtg - corrected date (1 message)
Solder beads on soldermask relieved traces (2 messages)
Soldering Nickel (5 messages)
soldermask ring v. full coat for BGA design (1 message)
Sorry for the weird messages (1 message)
Subj: [TN] Wire bondable gold (1 message)
subscribe TechNet David Bailey (1 message)
Suggestions for Dye penetrants used for BGA solder joint crack te sting (2 messages)
SURFACE FINISHES (1 message)
TDR Testing (3 messages)
Testing Fuse Wire (1 message)
Tetra treatment (6 messages)
thanks (1 message)
Throughhole insertion (5 messages)
tin whiskers - matte tin (4 messages)
TN: Smooth bright solder Joint (5 messages)
US Competitivness--No Tech Content (9 messages)
very small technical comment - Metcal (2 messages)
Virus (1 message)
Voltage Breakdown of Thick Laminates (2 messages)
Washing Semi gloss boards. (7 messages)
Wavesoldering Ceramic Caps (8 messages)
Wessel Drills (2 messages)
Wire bondable gold (8 messages)
Wrappage Percentage for printed boards with BGA and micr o BGA (2 messages)
Wrappage Percentage for printed boards with BGA and micro BGA (1 message)

LISTSERV Archives

LISTSERV Archives

TECHNET Home

TECHNET Home

Subject Sorted by Subject, Chronologically

From

Date

Size

New Thread

(none)

(none)

Peter Barton <[log in to unmask]>

Tue, 11 Jun 2002 13:36:00 +0100

22 lines

New Thread

: Blowhole (process indicator)

: Blowhole (process indicator)

Poh Kong Hui <[log in to unmask]>

Mon, 17 Jun 2002 21:00:57 +0800

36 lines

Re: : Blowhole (process indicator)

Andre Leclair <[log in to unmask]>

Mon, 17 Jun 2002 09:06:55 -0500

28 lines

New Thread

: Martin-Marietta Workmanship Standard

: Martin-Marietta Workmanship Standard

Poh Kong Hui <[log in to unmask]>

Wed, 5 Jun 2002 22:14:56 +0800

27 lines

Re: : Martin-Marietta Workmanship Standard

Randy Bock Sr. <[log in to unmask]>

Wed, 5 Jun 2002 14:21:16 -0400

55 lines

Re: : Martin-Marietta Workmanship Standard

Mel Parrish <[log in to unmask]>

Wed, 5 Jun 2002 15:36:30 -0500

103 lines

Re: : Martin-Marietta Workmanship Standard

David Fish <[log in to unmask]>

Wed, 5 Jun 2002 22:33:14 -0700

65 lines

Re: : Martin-Marietta Workmanship Standard

Poh Kong Hui <[log in to unmask]>

Thu, 6 Jun 2002 23:40:16 +0800

134 lines

Re: : Martin-Marietta Workmanship Standard

Mel Parrish <[log in to unmask]>

Thu, 6 Jun 2002 11:18:31 -0500

174 lines

Re: : Martin-Marietta Workmanship Standard

Ong Seet Leng <[log in to unmask]>

Fri, 7 Jun 2002 08:52:36 +0800

302 lines

New Thread

: White residue using Kester flux & wire

: White residue using Kester flux & wire

Poh Kong Hui <[log in to unmask]>

Sat, 22 Jun 2002 23:16:37 +0800

38 lines

Re: : White residue using Kester flux & wire

Barmuta, Mike <[log in to unmask]>

Mon, 24 Jun 2002 10:58:54 -0700

96 lines

New Thread

About IPC's std.. IPC 7721 and 7720

About IPC's std.. IPC 7721 and 7720

Karnwal, Pankaj <[log in to unmask]>

Mon, 10 Jun 2002 10:48:12 +0200

47 lines

Re: About IPC's std.. IPC 7721 and 7720

MA Ranganath/SMPLB/SEC/SANMAR <[log in to unmask]>

Mon, 10 Jun 2002 16:58:50 +0530

146 lines

Re: About IPC's std.. IPC 7721 and 7720

Barry Gallegos <[log in to unmask]>

Mon, 10 Jun 2002 08:27:26 -0600

187 lines

Re: About IPC's std.. IPC 7721 and 7720

David Fish <[log in to unmask]>

Tue, 11 Jun 2002 10:20:30 -0700

85 lines

Re: About IPC's std.. IPC 7721 and 7720

Mel Parrish <[log in to unmask]>

Tue, 11 Jun 2002 14:18:30 -0500

123 lines

New Thread

about the dye penetrant materials in solder joints FA

about the dye penetrant materials in solder joints FA

sangliu <[log in to unmask]>

Fri, 14 Jun 2002 14:45:10 +0800

55 lines

Re: about the dye penetrant materials in solder joints FA

Steve Owen <[log in to unmask]>

Wed, 12 Jun 2002 08:20:13 +0100

103 lines

Re: about the dye penetrant materials in solder joints FA

Tegehall Per-Erik <[log in to unmask]>

Wed, 12 Jun 2002 13:07:16 +0200

113 lines

Re: about the dye penetrant materials in solder joints FA

Randy Bock Sr. <[log in to unmask]>

Wed, 12 Jun 2002 07:49:28 -0400

97 lines

Re: about the dye penetrant materials in solder joints FA

Steve Gregory <[log in to unmask]>

Wed, 12 Jun 2002 08:58:20 EDT

56 lines

Re: about the dye penetrant materials in solder joints FA

Randy Bock Sr. <[log in to unmask]>

Wed, 12 Jun 2002 10:27:14 -0400

108 lines

New Thread

Access to balls on a BGA from the opposite side of the B oard

Re: Access to balls on a BGA from the opposite side of the B oard

Misner, Bruce <[log in to unmask]>

Wed, 12 Jun 2002 07:56:12 -0600

59 lines

Re: Access to balls on a BGA from the opposite side of the B oard

WEEKES, MICHAEL HS-SNS <[log in to unmask]>

Wed, 12 Jun 2002 11:14:26 -0400

57 lines

Re: Access to balls on a BGA from the opposite side of the B oard

Misner, Bruce <[log in to unmask]>

Wed, 12 Jun 2002 09:49:27 -0600

60 lines

Re: Access to balls on a BGA from the opposite side of the B oard

Guy Ramsey <[log in to unmask]>

Wed, 12 Jun 2002 14:24:32 -0400

68 lines

Re: Access to balls on a BGA from the opposite side of the B oard

pratap singh <[log in to unmask]>

Wed, 12 Jun 2002 16:29:57 -0500

37 lines

Re: Access to balls on a BGA from the opposite side of the B oard

Crepeau, Phil <[log in to unmask]>

Wed, 12 Jun 2002 16:14:15 -0700

65 lines

New Thread

Access to balls on a BGA from the opposite side of the Board

Access to balls on a BGA from the opposite side of the Board

Barbara Burcham <[log in to unmask]>

Tue, 11 Jun 2002 16:12:54 -0500

28 lines

New Thread

Advice on Inspection Equipment Needeed

Advice on Inspection Equipment Needeed

Eric Christison <[log in to unmask]>

Fri, 7 Jun 2002 11:02:43 +0100

45 lines

Re: Advice on Inspection Equipment Needeed

Barry Gallegos <[log in to unmask]>

Fri, 7 Jun 2002 07:22:53 -0600

80 lines

Re: Advice on Inspection Equipment Needeed

Jason W. Gregory <[log in to unmask]>

Fri, 7 Jun 2002 09:49:36 -0500

33 lines

New Thread

Antw: [TN] fractured solder joints

Antw: [TN] fractured solder joints

Guenter Grossmann <[log in to unmask]>

Wed, 26 Jun 2002 09:03:46 +0200

62 lines

New Thread

Antw: [TN] Soldering Nickel

Antw: [TN] Soldering Nickel

Guenter Grossmann <[log in to unmask]>

Wed, 5 Jun 2002 09:16:39 +0200

56 lines

New Thread

Anybody got a AirVac PCBRM 12 they want to sell?

Anybody got a AirVac PCBRM 12 they want to sell?

Steve Gregory <[log in to unmask]>

Thu, 6 Jun 2002 19:55:06 EDT

29 lines

New Thread

Assistance on IPC610

Assistance on IPC610

[log in to unmask]

Fri, 21 Jun 2002 06:42:01 -0700

41 lines

Re: Assistance on IPC610

Mel Parrish <[log in to unmask]>

Fri, 21 Jun 2002 12:37:59 -0500

88 lines

Re: Assistance on IPC610

Werner Engelmaier <[log in to unmask]>

Sat, 22 Jun 2002 20:29:50 EDT

32 lines

New Thread

ASSY: Component Polarity NTC

Re: ASSY: Component Polarity NTC

Roger Stoops <[log in to unmask]>

Mon, 3 Jun 2002 11:19:54 -0400

101 lines

New Thread

Au revoir

Au revoir

b_ellis <[log in to unmask]>

Tue, 25 Jun 2002 09:48:19 +0300

31 lines

New Thread

Ball Placement Tooling

Ball Placement Tooling

Dennis J. Fall <[log in to unmask]>

Mon, 10 Jun 2002 09:24:23 -0500

45 lines

New Thread

bent component leads

bent component leads

Larry Koens <[log in to unmask]>

Tue, 11 Jun 2002 15:26:13 -0500

35 lines

Re: bent component leads

[log in to unmask]

Tue, 11 Jun 2002 13:54:11 -0700

81 lines

Re: bent component leads

Gary Camac <[log in to unmask]>

Tue, 11 Jun 2002 17:04:50 -0500

71 lines

New Thread

BGA packaging?

BGA packaging?

David White <[log in to unmask]>

Fri, 7 Jun 2002 13:56:51 -0400

46 lines

Re: BGA packaging?

Debbie Goodwin <[log in to unmask]>

Fri, 7 Jun 2002 12:01:18 -0700

141 lines

Re: BGA packaging?

Guy Ramsey <[log in to unmask]>

Mon, 10 Jun 2002 07:37:02 -0400

96 lines

New Thread

BGA Visual Inspection - Name Correction

Re: BGA Visual Inspection - Name Correction

Sklenar Vit (RBAU-EB/MGE4) <[log in to unmask]>

Mon, 3 Jun 2002 11:36:47 +1000

43 lines

New Thread

buried resistance/embedded components

buried resistance/embedded components

Dougal Stewart <[log in to unmask]>

Thu, 6 Jun 2002 13:46:03 +0100

87 lines

New Thread

Cell phone antenna enhances...NTC

Re: Cell phone antenna enhances...NTC

Brian Ellis <[log in to unmask]>

Sat, 1 Jun 2002 11:06:44 +0300

207 lines

New Thread

Cleaning of Military PWAs That Have Been Soldered with N o-Clean Flux

Re: Cleaning of Military PWAs That Have Been Soldered with N o-Clean Flux

Ingemar Hernefjord (EMW) <[log in to unmask]>

Mon, 24 Jun 2002 09:01:44 +0200

48 lines

New Thread

Cleaning of Military PWAs That Have Been Soldered with No-Clean Flux

Cleaning of Military PWAs That Have Been Soldered with No-Clean Flux

Bogert <[log in to unmask]>

Thu, 20 Jun 2002 19:17:41 -0400

109 lines

New Thread

Cleaning of Military PWAs That Have Been Soldered withN o-CleanFlux

Re: Cleaning of Military PWAs That Have Been Soldered withN o-CleanFlux

Ingemar Hernefjord (EMW) <[log in to unmask]>

Tue, 25 Jun 2002 15:15:30 +0200

142 lines

New Thread

Cleaning of Military PWAs That Have Been Soldered withNo -CleanFlux

Re: Cleaning of Military PWAs That Have Been Soldered withNo -CleanFlux

Debbie Kenney <[log in to unmask]>

Mon, 24 Jun 2002 11:15:32 -0700

122 lines

Re: Cleaning of Military PWAs That Have Been Soldered withNo -CleanFlux

Lusby, Jack R. <[log in to unmask]>

Mon, 24 Jun 2002 12:31:59 -0700

175 lines

Re: Cleaning of Military PWAs That Have Been Soldered withNo -CleanFlux

Ingemar Hernefjord (EMW) <[log in to unmask]>

Tue, 25 Jun 2002 09:02:27 +0200

197 lines

Re: Cleaning of Military PWAs That Have Been Soldered withNo -CleanFlux

joyce <[log in to unmask]>

Tue, 25 Jun 2002 07:47:21 -0400

246 lines

New Thread

Cleaning of Military PWAs That Have Been Soldered withNo-CleanFlux

Re: Cleaning of Military PWAs That Have Been Soldered withNo-CleanFlux

David Douthit <[log in to unmask]>

Thu, 20 Jun 2002 19:10:13 -0700

116 lines

Re: Cleaning of Military PWAs That Have Been Soldered withNo-CleanFlux

Peter Barton <[log in to unmask]>

Fri, 21 Jun 2002 08:41:00 +0100

94 lines

Re: Cleaning of Military PWAs That Have Been Soldered withNo-CleanFlux

b_ellis <[log in to unmask]>

Fri, 21 Jun 2002 12:40:36 +0300

60 lines

Re: Cleaning of Military PWAs That Have Been Soldered withNo-CleanFlux

Gordon F. Davis Jr <[log in to unmask]>

Fri, 21 Jun 2002 06:30:14 -0500

108 lines

Re: Cleaning of Military PWAs That Have Been Soldered withNo-CleanFlux

David Douthit <[log in to unmask]>

Tue, 25 Jun 2002 05:42:38 -0700

220 lines

New Thread

Conformal coating - Dip Vs Spray

Conformal coating - Dip Vs Spray

Peter Lee <[log in to unmask]>

Fri, 7 Jun 2002 12:25:14 -0700

309 lines

Re: Conformal coating - Dip Vs Spray

Gary Camac <[log in to unmask]>

Fri, 7 Jun 2002 15:59:21 -0500

285 lines

Re: Conformal coating - Dip Vs Spray

Graham Naisbitt <[log in to unmask]>

Sat, 8 Jun 2002 17:19:40 +0100

275 lines

New Thread

Contract Manufacturing Seminar

Contract Manufacturing Seminar

Scott Lefebvre <[log in to unmask]>

Thu, 20 Jun 2002 09:12:54 -0700

34 lines

New Thread

Cosmetic Requirements

Cosmetic Requirements

[log in to unmask]

Fri, 21 Jun 2002 06:45:27 -0700

33 lines

New Thread

cracks in solder joints

cracks in solder joints

Bev Christian <[log in to unmask]>

Thu, 20 Jun 2002 15:32:47 -0400

28 lines

Re: cracks in solder joints

David Douthit <[log in to unmask]>

Thu, 20 Jun 2002 14:52:56 -0700

58 lines

Re: cracks in solder joints

Werner Engelmaier <[log in to unmask]>

Fri, 21 Jun 2002 07:24:06 EDT

42 lines

Re: cracks in solder joints

Bev Christian <[log in to unmask]>

Fri, 21 Jun 2002 09:07:04 -0400

87 lines

Re: cracks in solder joints

Werner Engelmaier <[log in to unmask]>

Sat, 22 Jun 2002 20:29:51 EDT

39 lines

Re: cracks in solder joints

Ingemar Hernefjord (EMW) <[log in to unmask]>

Mon, 24 Jun 2002 09:11:29 +0200

54 lines

New Thread

Definition of Suported/ unsupported hole

Definition of Suported/ unsupported hole

Peter Lee <[log in to unmask]>

Tue, 25 Jun 2002 12:22:04 -0700

33 lines

Re: Definition of Suported/ unsupported hole

Beerman, Dennis <[log in to unmask]>

Tue, 25 Jun 2002 14:03:17 -0600

60 lines

Re: Definition of Suported/ unsupported hole

Kathy Kuhlow <[log in to unmask]>

Tue, 25 Jun 2002 15:10:47 -0500

49 lines

Re: Definition of Suported/ unsupported hole

Gary Ferrari <[log in to unmask]>

Tue, 25 Jun 2002 16:17:29 EDT

52 lines

Re: Definition of Suported/ unsupported hole

Brooks,Bill <[log in to unmask]>

Tue, 25 Jun 2002 13:34:02 -0700

85 lines

Re: Definition of Suported/ unsupported hole

Neda Thrash <[log in to unmask]>

Tue, 25 Jun 2002 15:36:50 -0500

54 lines

Re: Definition of Suported/ unsupported hole

Guy Ramsey <[log in to unmask]>

Tue, 25 Jun 2002 16:46:26 -0400

44 lines

Re: Definition of Suported/ unsupported hole

D.Terstegge <[log in to unmask]>

Tue, 25 Jun 2002 23:02:32 +0200

159 lines

Re: Definition of Suported/ unsupported hole

Ong Seet Leng <[log in to unmask]>

Wed, 26 Jun 2002 09:04:58 +0800

53 lines

Re: Definition of Suported/ unsupported hole

Dieselberg, Ron <[log in to unmask]>

Wed, 26 Jun 2002 09:15:02 -0400

194 lines

New Thread

Definition of Supported/ unsupported hole

Re: Definition of Supported/ unsupported hole

Mcmaster, Michael <[log in to unmask]>

Tue, 25 Jun 2002 17:14:59 -0700

214 lines

Re: Definition of Supported/ unsupported hole

[log in to unmask]

Wed, 26 Jun 2002 10:18:11 +0800

125 lines

Re: Definition of Supported/ unsupported hole

Atkinson, Neil <[log in to unmask]>

Wed, 26 Jun 2002 07:32:22 +0100

598 lines

Re: Definition of Supported/ unsupported hole

Jack C. Olson <[log in to unmask]>

Wed, 26 Jun 2002 07:17:13 -0500

34 lines

Re: Definition of Supported/ unsupported hole

Gary Ferrari <[log in to unmask]>

Wed, 26 Jun 2002 08:36:27 EDT

52 lines

Re: Definition of Supported/ unsupported hole

Dieselberg, Ron <[log in to unmask]>

Wed, 26 Jun 2002 09:52:04 -0400

516 lines

Re: Definition of Supported/ unsupported hole

Kathy Kuhlow <[log in to unmask]>

Wed, 26 Jun 2002 09:15:05 -0500

53 lines

Re: Definition of Supported/ unsupported hole

Kathy Kuhlow <[log in to unmask]>

Wed, 26 Jun 2002 09:17:36 -0500

51 lines

Re: Definition of Supported/ unsupported hole

Leo Lambert <[log in to unmask]>

Wed, 26 Jun 2002 14:12:12 -0400

67 lines

Re: Definition of Supported/ unsupported hole

Genny Gibbard <[log in to unmask]>

Thu, 27 Jun 2002 08:58:16 -0600

44 lines

Re: Definition of Supported/ unsupported hole

Roger Stoops <[log in to unmask]>

Thu, 27 Jun 2002 13:09:43 -0400

67 lines

New Thread

DEK Enviromental Control Unit (ECU)

DEK Enviromental Control Unit (ECU)

Steve Gregory <[log in to unmask]>

Wed, 5 Jun 2002 14:03:46 EDT

80 lines

Re: DEK Enviromental Control Unit (ECU)

Vanderhoof, Brad <[log in to unmask]>

Wed, 5 Jun 2002 13:18:07 -0700

67 lines

New Thread

DEK Environmental Control Unit (ECU)

Re: DEK Environmental Control Unit (ECU)

Howard Watson <[log in to unmask]>

Wed, 5 Jun 2002 14:14:15 -0600

135 lines

Re: DEK Environmental Control Unit (ECU)

Bloomquist, Ken <[log in to unmask]>

Wed, 5 Jun 2002 13:28:32 -0700

65 lines

Re: DEK Environmental Control Unit (ECU)

Steve Gregory <[log in to unmask]>

Wed, 5 Jun 2002 17:29:14 EDT

84 lines

New Thread

Direct copper bonding

Direct copper bonding

Dennis J. Fall <[log in to unmask]>

Thu, 6 Jun 2002 13:54:27 -0500

31 lines

Re: Direct copper bonding

Mike Fenner <[log in to unmask]>

Fri, 7 Jun 2002 10:17:05 +0100

80 lines

Re: Direct copper bonding

Creswick, Steven <[log in to unmask]>

Fri, 7 Jun 2002 05:59:42 -0400

75 lines

New Thread

DPMO benchmarking

Re: DPMO benchmarking

Peter Swanson <[log in to unmask]>

Tue, 4 Jun 2002 20:44:10 +0100

130 lines

New Thread

Drilling FR6 material

Drilling FR6 material

chemelek <[log in to unmask]>

Wed, 5 Jun 2002 09:19:21 +0200

68 lines

New Thread

Econonic Boom

Re: Econonic Boom

Kathy Kuhlow <[log in to unmask]>

Mon, 3 Jun 2002 09:01:25 -0500

49 lines

New Thread

Electrolude DCA COnformal Coating Rework

Electrolude DCA COnformal Coating Rework

Michael Bell <[log in to unmask]>

Wed, 12 Jun 2002 08:21:59 +1200

30 lines

Re: Electrolude DCA COnformal Coating Rework

Phil Kinner <[log in to unmask]>

Wed, 12 Jun 2002 11:06:50 +0100

222 lines

New Thread

Electronics Assembly disposal

Electronics Assembly disposal

Jason <[log in to unmask]>

Thu, 6 Jun 2002 17:06:24 -0500

26 lines

Re: Electronics Assembly disposal

Randy Bock Sr. <[log in to unmask]>

Fri, 14 Jun 2002 07:38:23 -0400

60 lines

Re: Electronics Assembly disposal

Steve Gregory <[log in to unmask]>

Fri, 14 Jun 2002 10:33:34 EDT

106 lines

Re: Electronics Assembly disposal

[log in to unmask]

Fri, 14 Jun 2002 11:39:49 -0500

149 lines

Re: Electronics Assembly disposal

Steve Thomas <[log in to unmask]>

Fri, 14 Jun 2002 09:38:04 -0700

158 lines

Re: Electronics Assembly disposal

Randy Bock Sr. <[log in to unmask]>

Fri, 14 Jun 2002 12:54:11 -0400

168 lines

Re: Electronics Assembly disposal

Jason W. Gregory <[log in to unmask]>

Fri, 14 Jun 2002 15:53:05 -0500

172 lines

Re: Electronics Assembly disposal

Mike Hughes <[log in to unmask]>

Mon, 17 Jun 2002 09:06:05 +1000

123 lines

Re: Electronics Assembly disposal

Jason <[log in to unmask]>

Mon, 17 Jun 2002 09:57:30 -0500

23 lines

New Thread

Electrovert Omniflo-10 users..

Electrovert Omniflo-10 users..

Steve Gregory <[log in to unmask]>

Mon, 3 Jun 2002 20:14:00 EDT

40 lines

Re: Electrovert Omniflo-10 users..

Tom <[log in to unmask]>

Tue, 4 Jun 2002 13:24:11 +0930

84 lines

New Thread

ELni/au

ELni/au

Rick Fudalewski <[log in to unmask]>

Mon, 17 Jun 2002 08:09:58 EDT

40 lines

Re: ELni/au

Bev Christian <[log in to unmask]>

Mon, 17 Jun 2002 08:21:46 -0400

100 lines

Re: ELni/au

Rick Fudalewski <[log in to unmask]>

Mon, 17 Jun 2002 10:21:53 EDT

47 lines

Re: ELni/au

Bev Christian <[log in to unmask]>

Mon, 17 Jun 2002 10:29:49 -0400

85 lines

Re: ELni/au

George Milad <[log in to unmask]>

Mon, 17 Jun 2002 11:06:37 EDT

47 lines

Re: ELni/au

Gregg Klawson <[log in to unmask]>

Mon, 17 Jun 2002 15:55:31 -0400

83 lines

New Thread

ESD and equipment isolation

Re: ESD and equipment isolation

Seth Goodman <[log in to unmask]>

Tue, 4 Jun 2002 03:04:41 -0500

144 lines

New Thread

ESD heel straps

ESD heel straps

Graham Collins <[log in to unmask]>

Wed, 5 Jun 2002 14:54:02 -0400

43 lines

Re: ESD heel straps

Steve Gregory <[log in to unmask]>

Wed, 5 Jun 2002 15:23:38 EDT

181 lines

Re: ESD heel straps

Phil Nutting <[log in to unmask]>

Wed, 5 Jun 2002 15:39:09 -0400

83 lines

Re: ESD heel straps

Randy Bock Sr. <[log in to unmask]>

Wed, 5 Jun 2002 16:18:04 -0400

77 lines

Re: ESD heel straps

Michael Bell <[log in to unmask]>

Thu, 6 Jun 2002 08:27:47 +1200

107 lines

Re: ESD heel straps

Hinners Hans M Civ WRALC/LUGE <[log in to unmask]>

Wed, 5 Jun 2002 16:27:24 -0400

91 lines

Re: ESD heel straps

Mel Parrish <[log in to unmask]>

Wed, 5 Jun 2002 15:45:59 -0500

83 lines

Re: ESD heel straps

Kathy Kuhlow <[log in to unmask]>

Wed, 5 Jun 2002 16:19:38 -0500

58 lines

Re: ESD heel straps

Alain Savard <[log in to unmask]>

Thu, 6 Jun 2002 07:43:46 -0400

128 lines

Re: ESD heel straps

Graham Collins <[log in to unmask]>

Thu, 6 Jun 2002 08:40:58 -0400

114 lines

Re: ESD heel straps

Barry Gallegos <[log in to unmask]>

Thu, 6 Jun 2002 07:22:59 -0600

112 lines

Re: ESD heel straps

Phil Nutting <[log in to unmask]>

Thu, 6 Jun 2002 10:16:39 -0400

161 lines

Re: ESD heel straps

Gene Felder <[log in to unmask]>

Tue, 11 Jun 2002 10:55:02 -0700

184 lines

New Thread

Evanohm

Evanohm

Steve Kelly <[log in to unmask]>

Wed, 26 Jun 2002 14:08:11 -0400

27 lines

Re: Evanohm

Vandendolder, Ron <[log in to unmask]>

Wed, 26 Jun 2002 16:10:13 -0400

53 lines

Re: Evanohm

Smith, Russell (US LA) <[log in to unmask]>

Wed, 26 Jun 2002 16:25:06 -0700

65 lines

New Thread

Extraneous Metal On MLCCs

Extraneous Metal On MLCCs

Ed Hare <[log in to unmask]>

Mon, 3 Jun 2002 08:21:57 -0700

47 lines

Re: Extraneous Metal On MLCCs

Crepeau, Phil <[log in to unmask]>

Mon, 3 Jun 2002 09:30:03 -0700

71 lines

Re: Extraneous Metal On MLCCs

John Maxwell <[log in to unmask]>

Mon, 3 Jun 2002 09:31:32 -0700

78 lines

Re: Extraneous Metal On MLCCs

Ed Hare <[log in to unmask]>

Mon, 3 Jun 2002 14:52:14 -0700

111 lines

Re: Extraneous Metal On MLCCs

David Fish <[log in to unmask]>

Wed, 5 Jun 2002 09:57:03 -0700

78 lines

New Thread

Failure at IMC

Re: Failure at IMC

Phillip Hinton <[log in to unmask]>

Thu, 20 Jun 2002 12:53:07 EDT

67 lines

New Thread

Flex circuit registration

Flex circuit registration

Steve Kelly <[log in to unmask]>

Fri, 7 Jun 2002 12:28:54 -0700

164 lines

Re: Flex circuit registration

Brian McCrory <[log in to unmask]>

Fri, 7 Jun 2002 12:38:36 -0700

144 lines

Re: Flex circuit registration

Randy Bock Sr. <[log in to unmask]>

Sat, 15 Jun 2002 07:51:06 -0400

184 lines

Re: Flex circuit registration

Guy Ramsey <[log in to unmask]>

Mon, 17 Jun 2002 07:43:30 -0400

209 lines

Re: Flex circuit registration

Jeffrey Ciesla <[log in to unmask]>

Mon, 17 Jun 2002 12:47:38 -0500

25 lines

New Thread

Flip Chip and Tape automated bonding feasibility and Implementation Program

Flip Chip and Tape automated bonding feasibility and Implementation Program

bonilla_d <[log in to unmask]>

Tue, 11 Jun 2002 09:55:24 -0400

32 lines

New Thread

flux on component side of PCB

flux on component side of PCB

Bob Arciolla <[log in to unmask]>

Fri, 14 Jun 2002 14:01:56 -0400

64 lines

Re: flux on component side of PCB

Joyce Koo <[log in to unmask]>

Fri, 14 Jun 2002 14:24:06 -0400

100 lines

Re: flux on component side of PCB

b_ellis <[log in to unmask]>

Sat, 15 Jun 2002 08:50:55 +0300

43 lines

Re: flux on component side of PCB

Graham Collins <[log in to unmask]>

Mon, 17 Jun 2002 07:18:04 -0400

64 lines

New Thread

fluxing the top side of printed circuit board

fluxing the top side of printed circuit board

Bob Arciolla <[log in to unmask]>

Fri, 14 Jun 2002 14:05:38 -0400

63 lines

Re: fluxing the top side of printed circuit board

Phil Kinner <[log in to unmask]>

Mon, 17 Jun 2002 09:48:21 +0100

175 lines

New Thread

Foreign Inclusions (Interpretation)

Foreign Inclusions (Interpretation)

JR Rackard <[log in to unmask]>

Mon, 17 Jun 2002 14:13:26 -0400

76 lines

Re: Foreign Inclusions (Interpretation)

[log in to unmask]

Mon, 17 Jun 2002 15:40:02 EDT

31 lines

New Thread

fractured solder joints

fractured solder joints

Patricia Volkman <[log in to unmask]>

Tue, 25 Jun 2002 21:18:04 +0000

57 lines

Re: fractured solder joints

Crepeau, Phil <[log in to unmask]>

Tue, 25 Jun 2002 16:03:08 -0700

84 lines

Re: fractured solder joints

Maguire, James F <[log in to unmask]>

Tue, 25 Jun 2002 16:46:08 -0700

102 lines

Re: fractured solder joints

[log in to unmask]

Wed, 26 Jun 2002 08:44:23 +0800

146 lines

Re: fractured solder joints

Werner Engelmaier <[log in to unmask]>

Wed, 26 Jun 2002 07:36:57 EDT

36 lines

Re: fractured solder joints

Werner Engelmaier <[log in to unmask]>

Wed, 26 Jun 2002 07:36:56 EDT

30 lines

Re: fractured solder joints

joyce <[log in to unmask]>

Wed, 26 Jun 2002 08:05:48 -0400

153 lines

Re: fractured solder joints

Ingemar Hernefjord (EMW) <[log in to unmask]>

Wed, 26 Jun 2002 14:44:06 +0200

60 lines

Re: fractured solder joints

Werner Engelmaier <[log in to unmask]>

Wed, 26 Jun 2002 17:44:32 EDT

31 lines

Re: fractured solder joints

[log in to unmask]

Thu, 27 Jun 2002 07:55:52 +0800

72 lines

New Thread

FW: Flip Chip and Tape automated bonding feasibility and Implementation Program

FW: Flip Chip and Tape automated bonding feasibility and Implementation Program

bonilla_d <[log in to unmask]>

Tue, 11 Jun 2002 09:53:23 -0400

40 lines

New Thread

FW: [DC] BGA Coating Question

FW: [DC] BGA Coating Question

Brooks,Bill <[log in to unmask]>

Tue, 4 Jun 2002 12:21:15 -0700

75 lines

New Thread

FW: [TN] Advice on Inspection Equipment Needeed

FW: [TN] Advice on Inspection Equipment Needeed

Barry Gallegos <[log in to unmask]>

Fri, 7 Jun 2002 07:30:49 -0600

106 lines

New Thread

Glue or Not to Glue?

Glue or Not to Glue?

Dave Snyder <[log in to unmask]>

Fri, 7 Jun 2002 14:48:07 -0700

30 lines

Re: Glue or Not to Glue?

David Fish <[log in to unmask]>

Tue, 11 Jun 2002 10:29:31 -0700

63 lines

New Thread

High operating temperature

High operating temperature

Eddie Rocha <[log in to unmask]>

Wed, 26 Jun 2002 09:37:03 -0700

26 lines

Re: High operating temperature

Joe Fjelstad <[log in to unmask]>

Wed, 26 Jun 2002 12:56:26 EDT

43 lines

Re: High operating temperature

joyce <[log in to unmask]>

Wed, 26 Jun 2002 13:16:00 -0400

56 lines

Re: High operating temperature

Graham Collins <[log in to unmask]>

Wed, 26 Jun 2002 14:21:08 -0400

57 lines

Re: High operating temperature

[log in to unmask]

Thu, 27 Jun 2002 09:22:43 +0800

91 lines

Re: High operating temperature

Ingemar Hernefjord (EMW) <[log in to unmask]>

Thu, 27 Jun 2002 08:42:31 +0200

48 lines

Re: High operating temperature

MA Ranganath/SMPLB/SEC/SANMAR <[log in to unmask]>

Thu, 27 Jun 2002 14:37:10 +0530

148 lines

Re: High operating temperature

Ingemar Hernefjord (EMW) <[log in to unmask]>

Thu, 27 Jun 2002 12:50:15 +0200

163 lines

Re: High operating temperature

Phillip Hinton <[log in to unmask]>

Thu, 27 Jun 2002 12:57:11 EDT

77 lines

New Thread

High Rel Circuit Board Fab

High Rel Circuit Board Fab

Gary Bremer <[log in to unmask]>

Tue, 18 Jun 2002 19:16:29 -0400

31 lines

High Rel circuit board fab

Gary Bremer <[log in to unmask]>

Tue, 18 Jun 2002 19:30:03 -0400

33 lines

Re: High Rel Circuit Board Fab

Werner Engelmaier <[log in to unmask]>

Thu, 20 Jun 2002 07:25:57 EDT

40 lines

New Thread

How to de-populate a PWB?

How to de-populate a PWB?

Michelle Huang <[log in to unmask]>

Thu, 6 Jun 2002 11:49:20 -0700

71 lines

Re: How to de-populate a PWB?

Kathy Kuhlow <[log in to unmask]>

Thu, 6 Jun 2002 14:42:44 -0500

63 lines

Re: How to de-populate a PWB?

Victor Hernandez <[log in to unmask]>

Thu, 6 Jun 2002 14:38:05 -0500

141 lines

Re: How to de-populate a PWB?

Crepeau, Phil <[log in to unmask]>

Thu, 6 Jun 2002 13:02:40 -0700

119 lines

Re: How to de-populate a PWB?

Martyn Gaudion <[log in to unmask]>

Thu, 6 Jun 2002 21:05:36 +0100

57 lines

Re: How to de-populate a PWB?

Martyn Gaudion <[log in to unmask]>

Thu, 6 Jun 2002 21:11:37 +0100

52 lines

Re: How to de-populate a PWB?

Karnwal, Pankaj <[log in to unmask]>

Fri, 7 Jun 2002 07:54:19 +0200

51 lines

Re: How to de-populate a PWB?

Peter Swanson <[log in to unmask]>

Fri, 7 Jun 2002 09:11:40 +0100

170 lines

New Thread

How to de-populate a PWB? (warning - another commercial plug)

Re: How to de-populate a PWB? (warning - another commercial plug)

Carl VanWormer <[log in to unmask]>

Thu, 6 Jun 2002 14:21:27 -0700

82 lines

Re: How to de-populate a PWB? (warning - another commercial plug)

David Fish <[log in to unmask]>

Thu, 6 Jun 2002 21:00:42 -0700

119 lines

Re: How to de-populate a PWB? (warning - another commercial plug)

Steve Gregory <[log in to unmask]>

Thu, 6 Jun 2002 22:13:37 EDT

54 lines

New Thread

How to de-populate a PWB? part 2

Re: How to de-populate a PWB? part 2

Kathy Kuhlow <[log in to unmask]>

Thu, 6 Jun 2002 14:43:53 -0500

49 lines

New Thread

Hows ya balls?

Hows ya balls?

Ingemar Hernefjord (EMW) <[log in to unmask]>

Tue, 25 Jun 2002 16:43:17 +0200

27 lines

Re: Hows ya balls?

David Douthit <[log in to unmask]>

Tue, 25 Jun 2002 09:26:32 -0700

53 lines

New Thread

Immersion Tin

Immersion Tin

Grant Emandien <[log in to unmask]>

Wed, 19 Jun 2002 12:06:33 +0200

45 lines

Re: Immersion Tin

Ingemar Hernefjord (EMW) <[log in to unmask]>

Wed, 19 Jun 2002 14:04:23 +0200

78 lines

Re: Immersion Tin

tony steinke <[log in to unmask]>

Wed, 19 Jun 2002 08:18:53 -0700

102 lines

Re: Immersion Tin

Tempea, Ioan <[log in to unmask]>

Wed, 19 Jun 2002 12:06:53 -0400

147 lines

Re: Immersion Tin

tony steinke <[log in to unmask]>

Wed, 19 Jun 2002 14:15:07 -0700

200 lines

Re: Immersion Tin

Steve Kelly <[log in to unmask]>

Wed, 19 Jun 2002 14:13:02 -0400

223 lines

Re: Immersion Tin

tony steinke <[log in to unmask]>

Wed, 19 Jun 2002 15:11:33 -0700

250 lines

Re: Immersion Tin

Rick Thompson <[log in to unmask]>

Wed, 19 Jun 2002 13:01:31 -0700

207 lines

Re: Immersion Tin

Steve Kelly <[log in to unmask]>

Thu, 20 Jun 2002 09:24:11 -0400

320 lines

Re: Immersion Tin

Tempea, Ioan <[log in to unmask]>

Thu, 20 Jun 2002 16:00:41 -0400

347 lines

Re: Immersion Tin

Dave Hillman <[log in to unmask]>

Thu, 20 Jun 2002 16:03:03 -0500

268 lines

Re: Immersion Tin

Guy Ramsey <[log in to unmask]>

Fri, 21 Jun 2002 07:25:14 -0400

103 lines

Re: Immersion Tin

tony steinke <[log in to unmask]>

Fri, 21 Jun 2002 08:41:14 -0700

144 lines

Re: Immersion Tin

Dave Hillman <[log in to unmask]>

Fri, 21 Jun 2002 09:54:20 -0500

136 lines

Re: Immersion Tin

Steve Kelly <[log in to unmask]>

Fri, 21 Jun 2002 13:06:51 -0400

183 lines

New Thread

Immersion Tin and SERA

Re: Immersion Tin and SERA

Guy Ramsey <[log in to unmask]>

Wed, 19 Jun 2002 14:56:37 -0400

57 lines

New Thread

Intermetallic Joint Failure

Intermetallic Joint Failure

Henry Rekers <[log in to unmask]>

Tue, 11 Jun 2002 14:05:28 -0700

29 lines

Re: Intermetallic Joint Failure

Dave Hillman <[log in to unmask]>

Fri, 14 Jun 2002 16:40:51 -0500

78 lines

Re: Intermetallic Joint Failure

Werner Engelmaier <[log in to unmask]>

Wed, 19 Jun 2002 08:47:40 EDT

27 lines

Re: Intermetallic Joint Failure

Victor Hernandez <[log in to unmask]>

Wed, 19 Jun 2002 08:45:32 -0500

64 lines

Re: Intermetallic Joint Failure

Ingemar Hernefjord (EMW) <[log in to unmask]>

Wed, 19 Jun 2002 15:50:29 +0200

51 lines

Re: Intermetallic Joint Failure

rgrant <[log in to unmask]>

Wed, 19 Jun 2002 08:58:07 -0600

96 lines

Re: Intermetallic Joint Failure

Mel Parrish <[log in to unmask]>

Wed, 19 Jun 2002 10:35:02 -0500

78 lines

Re: Intermetallic Joint Failure

Ingemar Hernefjord (EMW) <[log in to unmask]>

Thu, 20 Jun 2002 13:03:03 +0200

88 lines

Re: Intermetallic Joint Failure

Werner Engelmaier <[log in to unmask]>

Thu, 20 Jun 2002 18:03:36 EDT

31 lines

Re: Intermetallic Joint Failure

Werner Engelmaier <[log in to unmask]>

Thu, 20 Jun 2002 18:03:35 EDT

34 lines

New Thread

IPC spec on silkscreen alignment

Re: IPC spec on silkscreen alignment

Jack C. Olson <[log in to unmask]>

Tue, 25 Jun 2002 09:09:21 -0500

72 lines

New Thread

IPC spec on silkscreen alignment.

IPC spec on silkscreen alignment.

Scott Lefebvre <[log in to unmask]>

Mon, 24 Jun 2002 17:06:06 -0700

30 lines

New Thread

IPC standards on Flux residue that is non-conductive and non-corrosive?

IPC standards on Flux residue that is non-conductive and non-corrosive?

Kevin Tisdall <[log in to unmask]>

Thu, 20 Jun 2002 08:41:37 -0230

25 lines

Re: IPC standards on Flux residue that is non-conductive and non-corrosive?

[log in to unmask]

Thu, 20 Jun 2002 07:29:39 -0500

41 lines

New Thread

IPC Torque Specifications

IPC Torque Specifications

Ken Carlile <[log in to unmask]>

Tue, 11 Jun 2002 09:05:54 -0500

21 lines

Re: IPC Torque Specifications

Phil Nutting <[log in to unmask]>

Tue, 11 Jun 2002 11:33:11 -0400

79 lines

Re: IPC Torque Specifications

Guy Ramsey <[log in to unmask]>

Tue, 11 Jun 2002 12:40:02 -0400

55 lines

Re: IPC Torque Specifications

Sauer, Steven T. <[log in to unmask]>

Tue, 11 Jun 2002 15:59:30 -0400

54 lines

New Thread

IPC's std.. IPC 7721

IPC's std.. IPC 7721

sbayar <[log in to unmask]>

Tue, 11 Jun 2002 16:13:55 +0300

36 lines

Re: IPC's std.. IPC 7721

Dan R. Johnson <[log in to unmask]>

Tue, 11 Jun 2002 07:27:40 -0700

32 lines

New Thread

IPC-1720 AQP (Assemblers Qualification Profile)

IPC-1720 AQP (Assemblers Qualification Profile)

Steve Gregory <[log in to unmask]>

Thu, 20 Jun 2002 14:07:00 EDT

57 lines

Re: IPC-1720 AQP (Assemblers Qualification Profile)

Jack Crawford <[log in to unmask]>

Thu, 20 Jun 2002 14:23:58 -0500

68 lines

Re: IPC-1720 AQP (Assemblers Qualification Profile)

Eddie Rocha <[log in to unmask]>

Thu, 20 Jun 2002 15:14:02 -0700

51 lines

Re: IPC-1720 AQP (Assemblers Qualification Profile)

Eddie Rocha <[log in to unmask]>

Thu, 20 Jun 2002 15:18:36 -0700

95 lines

New Thread

Isolation Resistance vs. Insulation Resistance

Isolation Resistance vs. Insulation Resistance

Alfred Brock <[log in to unmask]>

Wed, 19 Jun 2002 09:38:37 -0400

59 lines

Re: Isolation Resistance vs. Insulation Resistance

[log in to unmask]

Wed, 19 Jun 2002 09:56:30 -0500

76 lines

Re: Isolation Resistance vs. Insulation Resistance

Dan R. Johnson <[log in to unmask]>

Wed, 19 Jun 2002 09:35:00 -0700

25 lines

Re: Isolation Resistance vs. Insulation Resistance

Alfred Brock <[log in to unmask]>

Wed, 19 Jun 2002 14:51:43 -0400

102 lines

Re: Isolation Resistance vs. Insulation Resistance

Ahne Oosterhof <[log in to unmask]>

Thu, 20 Jun 2002 09:37:42 -0700

220 lines

New Thread

Jim Herard/Endicott/IBM is out of the office.

Jim Herard/Endicott/IBM is out of the office.

Jim Herard <[log in to unmask]>

Sat, 29 Jun 2002 01:39:47 -0400

25 lines

New Thread

Labor estimation

Labor estimation

Tempea, Ioan <[log in to unmask]>

Tue, 11 Jun 2002 11:56:50 -0400

35 lines

Re: Labor estimation

rgrant <[log in to unmask]>

Tue, 11 Jun 2002 12:03:46 -0600

79 lines

Re: Labor estimation

Guy Ramsey <[log in to unmask]>

Wed, 12 Jun 2002 07:08:27 -0400

70 lines

New Thread

Lead Emission Calcs for EPA TRI Reporting?

Lead Emission Calcs for EPA TRI Reporting?

Rick Thompson <[log in to unmask]>

Tue, 11 Jun 2002 14:22:10 -0700

44 lines

Re: Lead Emission Calcs for EPA TRI Reporting?

David Fish <[log in to unmask]>

Wed, 12 Jun 2002 16:20:48 -0700

81 lines

New Thread

lead free assembly

lead free assembly

Dan R. Johnson <[log in to unmask]>

Tue, 11 Jun 2002 16:43:45 -0700

54 lines

Re: lead free assembly

Debbie Goodwin <[log in to unmask]>

Wed, 12 Jun 2002 06:34:13 -0700

151 lines

Re: lead free assembly

Eddie Rocha <[log in to unmask]>

Wed, 12 Jun 2002 08:51:10 -0700

25 lines

New Thread

liquid residue between lands

liquid residue between lands

Bissonnette, Jean-Francois <[log in to unmask]>

Wed, 26 Jun 2002 09:40:49 -0400

55 lines

Re: liquid residue between lands

Furrow, Robert Gordon (Bob) <[log in to unmask]>

Wed, 26 Jun 2002 10:20:15 -0400

106 lines

New Thread

Looking for Soldering Theory Proofs

Looking for Soldering Theory Proofs

Ronald G. Currell <[log in to unmask]>

Wed, 19 Jun 2002 13:10:40 -0500

44 lines

Re: Looking for Soldering Theory Proofs

Joe Fjelstad <[log in to unmask]>

Wed, 19 Jun 2002 16:14:58 EDT

49 lines

Re: Looking for Soldering Theory Proofs

Werner Engelmaier <[log in to unmask]>

Thu, 20 Jun 2002 18:03:39 EDT

44 lines

New Thread

looking for users of Lloyd Doyle Phasor Inspection System

looking for users of Lloyd Doyle Phasor Inspection System

Jack Crawford <[log in to unmask]>

Wed, 12 Jun 2002 16:53:54 -0500

27 lines

New Thread

Mark Orlowski/PEMSTAR Inc is out of the office.

Mark Orlowski/PEMSTAR Inc is out of the office.

Mark Orlowski/PEMSTAR Inc <[log in to unmask]>

Wed, 19 Jun 2002 01:01:51 -0500

24 lines

New Thread

Masking Caps

Masking Caps

Dehoyos, Ramon <[log in to unmask]>

Thu, 27 Jun 2002 06:49:27 -0700

24 lines

Re: Masking Caps

jim <[log in to unmask]>

Thu, 27 Jun 2002 11:34:48 -0500

55 lines

Re: Masking Caps

Graham Naisbitt <[log in to unmask]>

Thu, 27 Jun 2002 18:41:40 +0100

78 lines

Re: Masking Caps

Steve Gregory <[log in to unmask]>

Thu, 27 Jun 2002 14:02:47 EDT

54 lines

Re: Masking Caps

David Fish <[log in to unmask]>

Thu, 27 Jun 2002 14:18:29 -0700

119 lines

New Thread

Metal core PCB's

Re: Metal core PCB's

MA Ranganath/SMPLB/SEC/SANMAR <[log in to unmask]>

Mon, 10 Jun 2002 14:01:10 +0530

168 lines

New Thread

Metcal SP200 soldering Iron

Metcal SP200 soldering Iron

Charles Caswell <[log in to unmask]>

Tue, 18 Jun 2002 15:01:51 -0500

29 lines

Re: Metcal SP200 soldering Iron

Barr, Bob <[log in to unmask]>

Tue, 18 Jun 2002 16:55:43 -0400

66 lines

Re: Metcal SP200 soldering Iron

Sauer, Steven T. <[log in to unmask]>

Wed, 19 Jun 2002 10:15:34 -0400

54 lines

Re: Metcal SP200 soldering Iron

Linda Langley <[log in to unmask]>

Wed, 19 Jun 2002 14:48:20 -0400

83 lines

Re: Metcal SP200 soldering Iron

[log in to unmask]

Thu, 20 Jun 2002 13:56:45 EDT

33 lines

Re: Metcal SP200 soldering Iron

Barr, Bob <[log in to unmask]>

Thu, 20 Jun 2002 15:33:42 -0400

71 lines

Re: Metcal SP200 soldering Iron

[log in to unmask]

Thu, 20 Jun 2002 15:57:30 EDT

32 lines

New Thread

Moisture sensitive device

Moisture sensitive device

Marki Sasportas <[log in to unmask]>

Tue, 18 Jun 2002 09:37:43 +0200

28 lines

Moisture sensitive device

Francois Monette <[log in to unmask]>

Fri, 21 Jun 2002 09:50:09 -0400

62 lines

Re: Moisture sensitive device

Paul Signorelli <[log in to unmask]>

Fri, 21 Jun 2002 10:08:52 -0500

109 lines

Re: Moisture sensitive device

Debbie Kenney <[log in to unmask]>

Mon, 24 Jun 2002 15:29:24 -0700

101 lines

New Thread

Moisture Sensitive Devices

Moisture Sensitive Devices

Mike Hughes <[log in to unmask]>

Thu, 13 Jun 2002 10:04:24 +1000

49 lines

Re: Moisture Sensitive Devices

[log in to unmask]

Wed, 12 Jun 2002 21:36:30 EDT

73 lines

Re: Moisture Sensitive Devices

Tom <[log in to unmask]>

Thu, 13 Jun 2002 16:06:45 +0930

82 lines

Re: Moisture Sensitive Devices

Zweigart, Siegmund <[log in to unmask]>

Thu, 13 Jun 2002 11:17:37 +0200

89 lines

Re: Moisture Sensitive Devices

Adrian Hanks <[log in to unmask]>

Thu, 13 Jun 2002 10:58:03 +0100

156 lines

Re: Moisture Sensitive Devices

Lee Whiteman <[log in to unmask]>

Thu, 13 Jun 2002 08:52:40 -0400

40 lines

Re: Moisture Sensitive Devices

Andre Leclair <[log in to unmask]>

Fri, 14 Jun 2002 14:52:39 -0500

37 lines

New Thread

My Friday TechNet post

My Friday TechNet post

Jack Crawford <[log in to unmask]>

Mon, 3 Jun 2002 11:51:31 -0500

105 lines

New Thread

Need user assist with IPC website issues

Need user assist with IPC website issues

Jack Crawford <[log in to unmask]>

Fri, 21 Jun 2002 13:36:51 -0500

41 lines

Re: Need user assist with IPC website issues

Mike Hughes <[log in to unmask]>

Mon, 24 Jun 2002 09:40:45 +1000

72 lines

New Thread

Nickle-Palladium lead finish

Nickle-Palladium lead finish

Brad Mecham <[log in to unmask]>

Wed, 19 Jun 2002 08:21:50 -0500

34 lines

Re: Nickle-Palladium lead finish

Henry Rekers <[log in to unmask]>

Wed, 19 Jun 2002 08:20:03 -0700

65 lines

Re: Nickle-Palladium lead finish

Guy Ramsey <[log in to unmask]>

Wed, 19 Jun 2002 11:24:42 -0400

50 lines

New Thread

No UV block

No UV block

Dan Brandler <[log in to unmask]>

Wed, 26 Jun 2002 16:17:29 -0700

37 lines

Re: No UV block

Leo Roos <[log in to unmask]>

Thu, 27 Jun 2002 10:03:09 -0700

66 lines

New Thread

Not gold fingers on prototype conductive elastomer switc h

Re: Not gold fingers on prototype conductive elastomer switc h

Barmuta, Mike <[log in to unmask]>

Wed, 19 Jun 2002 15:27:07 -0700

90 lines

New Thread

Not gold fingers on prototype conductive elastomer switch

Not gold fingers on prototype conductive elastomer switch

Carl VanWormer <[log in to unmask]>

Wed, 19 Jun 2002 13:55:48 -0700

37 lines

New Thread

NTC

NTC

Bloomquist, Ken <[log in to unmask]>

Mon, 3 Jun 2002 06:16:18 -0700

32 lines

New Thread

NTC: Looking for a service bureau (or equivalent) that c anhandleSCI CARDS files?

Re: NTC: Looking for a service bureau (or equivalent) that c anhandleSCI CARDS files?

Victor Hernandez <[log in to unmask]>

Wed, 19 Jun 2002 06:29:18 -0500

140 lines

New Thread

NTC: Looking for a service bureau (or equivalent) that can handle SCI CARDS files?

NTC: Looking for a service bureau (or equivalent) that can handle SCI CARDS files?

Alcorn, Brent <[log in to unmask]>

Tue, 18 Jun 2002 14:29:45 -0400

34 lines

Re: NTC: Looking for a service bureau (or equivalent) that can handle SCI CARDS files?

SDC's Tech Net <[log in to unmask]>

Tue, 18 Jun 2002 13:02:21 -0700

74 lines

New Thread

NTC: Looking for a service bureau (or equivalent) that canhandleSCI CARDS files?

Re: NTC: Looking for a service bureau (or equivalent) that canhandleSCI CARDS files?

Mickey Weiner <[log in to unmask]>

Wed, 19 Jun 2002 00:02:20 -0500

107 lines

New Thread

Optocoupler's

Optocoupler's

Paul Truit <[log in to unmask]>

Fri, 14 Jun 2002 14:59:38 -0400

58 lines

Re: Optocoupler's

Hogg, Blair K. <[log in to unmask]>

Fri, 14 Jun 2002 15:56:20 -0400

101 lines

Re: Optocoupler's

Dave Pahlas <[log in to unmask]>

Fri, 14 Jun 2002 16:42:03 -0400

105 lines

Re: Optocoupler's

b_ellis <[log in to unmask]>

Sat, 15 Jun 2002 08:59:26 +0300

85 lines

Re: Optocoupler's

Kathy Kuhlow <[log in to unmask]>

Mon, 17 Jun 2002 08:07:55 -0500

58 lines

New Thread

OT Cell phone antenna enhances...NTC

Re: OT Cell phone antenna enhances...NTC

Brian Ellis <[log in to unmask]>

Sat, 1 Jun 2002 10:48:09 +0300

66 lines

Re: OT Cell phone antenna enhances...NTC

[log in to unmask]

Mon, 3 Jun 2002 08:09:58 -0600

49 lines

New Thread

OT- Anybody else getting strange emails?

OT- Anybody else getting strange emails?

Steve Gregory <[log in to unmask]>

Fri, 7 Jun 2002 10:18:04 EDT

104 lines

Re: OT- Anybody else getting strange emails?

Victor Hernandez <[log in to unmask]>

Fri, 7 Jun 2002 09:30:44 -0500

131 lines

Re: OT- Anybody else getting strange emails?

Phil Nutting <[log in to unmask]>

Fri, 7 Jun 2002 11:08:25 -0400

151 lines

Re: OT- Anybody else getting strange emails?

Bev Christian <[log in to unmask]>

Fri, 7 Jun 2002 11:09:37 -0400

147 lines

Re: OT- Anybody else getting strange emails?

Dougal Stewart <[log in to unmask]>

Fri, 7 Jun 2002 16:17:36 +0100

165 lines

Re: OT- Anybody else getting strange emails?

[log in to unmask]

Fri, 7 Jun 2002 11:23:23 EDT

38 lines

Re: OT- Anybody else getting strange emails?

Randy Bock Sr. <[log in to unmask]>

Fri, 7 Jun 2002 11:33:29 -0400

159 lines

Re: OT- Anybody else getting strange emails?

Crepeau, Phil <[log in to unmask]>

Fri, 7 Jun 2002 08:26:18 -0700

121 lines

Re: OT- Anybody else getting strange emails?

Thorup, John <[log in to unmask]>

Fri, 7 Jun 2002 08:46:00 -0700

69 lines

Re: OT- Anybody else getting strange emails?

Barry Gallegos <[log in to unmask]>

Fri, 7 Jun 2002 09:50:52 -0600

160 lines

Re: OT- Anybody else getting strange emails?

Kathy Bergman <[log in to unmask]>

Fri, 7 Jun 2002 09:01:19 -0700

133 lines

New Thread

OT- wasn't an experiment.. (The other side)

Re: OT- wasn't an experiment.. (The other side)

Jim Mathis <[log in to unmask]>

Mon, 3 Jun 2002 08:23:12 -0400

104 lines

Re: OT- wasn't an experiment.. (The other side)

Kasprzak, Bill (sys) USX <[log in to unmask]>

Mon, 3 Jun 2002 09:39:41 -0400

167 lines

New Thread

Oxidation problem in Silver plated components leads

Oxidation problem in Silver plated components leads

Karnwal, Pankaj <[log in to unmask]>

Tue, 4 Jun 2002 14:12:29 +0200

42 lines

Re: Oxidation problem in Silver plated components leads

Charles Caswell <[log in to unmask]>

Tue, 4 Jun 2002 08:35:25 -0500

84 lines

Re: Oxidation problem in Silver plated components leads

Brian Ellis <[log in to unmask]>

Tue, 4 Jun 2002 16:57:31 +0300

62 lines

Re: Oxidation problem in Silver plated components leads

[log in to unmask]

Tue, 4 Jun 2002 11:20:05 -0500

54 lines

Re: Oxidation problem in Silver plated components leads

Charles Caswell <[log in to unmask]>

Tue, 4 Jun 2002 13:07:54 -0500

97 lines

Re: Oxidation problem in Silver plated components leads

pratap singh <[log in to unmask]>

Tue, 4 Jun 2002 13:18:39 -0500

39 lines

Re: Oxidation problem in Silver plated components leads

Dave Hillman <[log in to unmask]>

Tue, 4 Jun 2002 15:56:38 -0500

102 lines

Re: Oxidation problem in Silver plated components leads

Brian Ellis <[log in to unmask]>

Wed, 5 Jun 2002 09:17:18 +0300

82 lines

Re: Oxidation problem in Silver plated components leads

Charles Caswell <[log in to unmask]>

Wed, 5 Jun 2002 07:04:43 -0500

128 lines

Re: Oxidation problem in Silver plated components leads

Gene Felder <[log in to unmask]>

Tue, 11 Jun 2002 11:10:43 -0700

141 lines

Re: Oxidation problem in Silver plated components leads

b_ellis <[log in to unmask]>

Wed, 12 Jun 2002 09:20:01 +0300

160 lines

New Thread

PCB Finish

PCB Finish

Peter Lee <[log in to unmask]>

Sun, 16 Jun 2002 23:15:32 -0700

32 lines

Re: PCB Finish

Ian Hood <[log in to unmask]>

Mon, 17 Jun 2002 09:36:06 +0100

64 lines

New Thread

PCB lay-out problem...

PCB lay-out problem...

Steve Gregory <[log in to unmask]>

Fri, 21 Jun 2002 14:53:37 EDT

83 lines

Re: PCB lay-out problem...

Thorup, John <[log in to unmask]>

Fri, 21 Jun 2002 13:07:50 -0700

71 lines

Re: PCB lay-out problem...

Steve Gregory <[log in to unmask]>

Fri, 21 Jun 2002 16:39:23 EDT

77 lines

Re: PCB lay-out problem...

Guy Ramsey <[log in to unmask]>

Fri, 21 Jun 2002 16:43:58 -0400

178 lines

Re: PCB lay-out problem...

Barbara Burcham <[log in to unmask]>

Fri, 21 Jun 2002 15:41:19 -0500

85 lines

Re: PCB lay-out problem...

Jeff Seeger <[log in to unmask]>

Fri, 21 Jun 2002 16:43:38 -0400

68 lines

Re: PCB lay-out problem...

Tom Parkinson - WinTronics, Inc. - Quality System Manager <[log in to unmask]>

Fri, 21 Jun 2002 16:49:19 -0400

70 lines

Re: PCB lay-out problem...

[log in to unmask]

Fri, 21 Jun 2002 16:00:53 -0500

34 lines

Re: PCB lay-out problem...

Ted Tontis, C.I.D. <[log in to unmask]>

Fri, 21 Jun 2002 16:06:42 -0500

75 lines

Re: PCB lay-out problem...

Roger Stoops <[log in to unmask]>

Fri, 21 Jun 2002 17:08:46 -0400

44 lines

Re: PCB lay-out problem...

Matthias Mansfeld <[log in to unmask]>

Fri, 21 Jun 2002 23:40:45 +0200

52 lines

Re: PCB lay-out problem...

Greg Scott <[log in to unmask]>

Fri, 21 Jun 2002 14:54:10 -0700

158 lines

Re: PCB lay-out problem...

David Ricketts <[log in to unmask]>

Fri, 21 Jun 2002 15:10:25 -0700

167 lines

Re: PCB lay-out problem...

Crepeau, Phil <[log in to unmask]>

Fri, 21 Jun 2002 16:04:48 -0700

117 lines

Re: PCB lay-out problem...

Steve Gregory <[log in to unmask]>

Fri, 21 Jun 2002 20:12:46 EDT

105 lines

Re: PCB lay-out problem...

Seth Goodman <[log in to unmask]>

Fri, 21 Jun 2002 20:36:36 -0500

337 lines

Re: PCB lay-out problem...

Ron Olinyk <[log in to unmask]>

Sat, 22 Jun 2002 14:07:18 -0500

84 lines

New Thread

Peel Strength

Peel Strength

Kathy Bergman <[log in to unmask]>

Tue, 11 Jun 2002 11:21:29 -0700

31 lines

New Thread

PWB measling and moisture

PWB measling and moisture

WEEKES, MICHAEL HS-SNS <[log in to unmask]>

Tue, 18 Jun 2002 09:06:26 -0400

91 lines

Re: PWB measling and moisture

Randy Bock Sr. <[log in to unmask]>

Tue, 18 Jun 2002 13:11:40 -0400

133 lines

New Thread

Re column grid arrays

Re: Re column grid arrays

Werner Engelmaier <[log in to unmask]>

Sun, 2 Jun 2002 08:12:07 EDT

25 lines

Re: Re column grid arrays

Werner Engelmaier <[log in to unmask]>

Sun, 2 Jun 2002 08:12:06 EDT

30 lines

Re: Re column grid arrays

Tegehall Per-Erik <[log in to unmask]>

Tue, 4 Jun 2002 09:26:34 +0200

143 lines

New Thread

recommended land pattern

recommended land pattern

Thorup, John <[log in to unmask]>

Thu, 6 Jun 2002 09:15:39 -0700

27 lines

Re: recommended land pattern

Brooks,Bill <[log in to unmask]>

Thu, 6 Jun 2002 13:23:18 -0700

62 lines

New Thread

Reflow on Wave.

Reflow on Wave.

Henry Rekers <[log in to unmask]>

Wed, 26 Jun 2002 07:07:35 -0700

29 lines

Re: Reflow on Wave.

Kathy Kuhlow <[log in to unmask]>

Wed, 26 Jun 2002 09:37:19 -0500

49 lines

Re: Reflow on Wave.

Barr, Bob <[log in to unmask]>

Wed, 26 Jun 2002 10:44:51 -0400

66 lines

Re: Reflow on Wave.

Guy Ramsey <[log in to unmask]>

Wed, 26 Jun 2002 11:42:06 -0400

61 lines

Re: Reflow on Wave.

Barry Gallegos <[log in to unmask]>

Wed, 26 Jun 2002 09:43:02 -0600

60 lines

Re: Reflow on Wave.

Eric Dawson <[log in to unmask]>

Wed, 26 Jun 2002 17:24:42 +0100

48 lines

Re: Reflow on Wave.

jim <[log in to unmask]>

Wed, 26 Jun 2002 13:06:21 -0500

92 lines

Re: Reflow on Wave.

Gaby Bogdan <[log in to unmask]>

Wed, 26 Jun 2002 21:55:07 +0200

61 lines

Re: Reflow on Wave.

Victor Hernandez <[log in to unmask]>

Wed, 26 Jun 2002 15:33:48 -0500

98 lines

Re: Reflow on Wave.

Gaby Bogdan <[log in to unmask]>

Thu, 27 Jun 2002 00:12:24 +0200

125 lines

New Thread

Reflowing tin.

Reflowing tin.

Rene Lopez <[log in to unmask]>

Fri, 21 Jun 2002 09:55:13 -0700

94 lines

New Thread

Registration of soldermask

Registration of soldermask

Tempea, Ioan <[log in to unmask]>

Fri, 21 Jun 2002 15:59:54 -0400

30 lines

Re: Registration of soldermask

Greg Scott <[log in to unmask]>

Fri, 21 Jun 2002 15:19:24 -0700

61 lines

Re: Registration of soldermask

Steve Thomas <[log in to unmask]>

Fri, 21 Jun 2002 15:51:22 -0700

111 lines

Re: Registration of soldermask

Dougal Stewart <[log in to unmask]>

Sat, 22 Jun 2002 12:29:30 +0100

122 lines

Re: Registration of soldermask

Mark Hargreaves <[log in to unmask]>

Mon, 24 Jun 2002 11:22:55 -0400

198 lines

Re: Registration of soldermask

Tempea, Ioan <[log in to unmask]>

Tue, 25 Jun 2002 08:32:50 -0400

252 lines

New Thread

Reverse engineering a PCB...

Reverse engineering a PCB...

Steve Gregory <[log in to unmask]>

Tue, 18 Jun 2002 14:49:11 EDT

71 lines

Re: Reverse engineering a PCB...

SDC's Tech Net <[log in to unmask]>

Tue, 18 Jun 2002 13:00:10 -0700

104 lines

Re: Reverse engineering a PCB...

b_ellis <[log in to unmask]>

Wed, 19 Jun 2002 10:51:11 +0300

52 lines

Re: Reverse engineering a PCB...

SDC's Tech Net <[log in to unmask]>

Wed, 19 Jun 2002 17:12:38 -0700

87 lines

Re: Reverse engineering a PCB...

bonilla_d <[log in to unmask]>

Fri, 21 Jun 2002 14:56:45 -0400

181 lines

New Thread

Rigid Flex

Rigid Flex

Zweigart, Siegmund <[log in to unmask]>

Thu, 13 Jun 2002 09:42:57 +0200

32 lines

New Thread

Rigid-Flex Bake Requirements??

Rigid-Flex Bake Requirements??

Rick Thompson <[log in to unmask]>

Tue, 4 Jun 2002 15:49:47 -0700

45 lines

Re: Rigid-Flex Bake Requirements??

[log in to unmask]

Tue, 4 Jun 2002 20:44:00 EDT

84 lines

Re: Rigid-Flex Bake Requirements??

Steve Kelly <[log in to unmask]>

Wed, 5 Jun 2002 08:44:53 -0700

77 lines

Re: Rigid-Flex Bake Requirements??

[log in to unmask]

Wed, 5 Jun 2002 09:45:34 EDT

63 lines

Re: Rigid-Flex Bake Requirements??

ryan <[log in to unmask]>

Wed, 5 Jun 2002 19:35:26 -0400

73 lines

New Thread

Rigid-Flex vendors...

Rigid-Flex vendors...

Steve Gregory <[log in to unmask]>

Thu, 27 Jun 2002 17:18:22 EDT

58 lines

Re: Rigid-Flex vendors...

Sean Hill <[log in to unmask]>

Thu, 27 Jun 2002 16:53:58 -0700

93 lines

Re: Rigid-Flex vendors...

[log in to unmask]

Thu, 27 Jun 2002 23:40:07 EDT

28 lines

Re: Rigid-Flex vendors...

Ingemar Hernefjord (EMW) <[log in to unmask]>

Fri, 28 Jun 2002 11:57:11 +0200

45 lines

Re: Rigid-Flex vendors...

tony steinke <[log in to unmask]>

Fri, 28 Jun 2002 08:31:37 -0700

115 lines

Re: Rigid-Flex vendors...

Dave Roesler <[log in to unmask]>

Fri, 28 Jun 2002 09:09:12 -0500

121 lines

New Thread

Rod Smith/Endicott/IBM is out of the office.

Rod Smith/Endicott/IBM is out of the office.

Rod Smith <[log in to unmask]>

Fri, 7 Jun 2002 10:55:29 -0400

24 lines

Rod Smith/Endicott/IBM is out of the office.

Rod Smith <[log in to unmask]>

Fri, 14 Jun 2002 11:38:57 -0400

24 lines

Rod Smith/Endicott/IBM is out of the office.

Rod Smith <[log in to unmask]>

Fri, 21 Jun 2002 10:35:23 -0400

24 lines

Rod Smith/Endicott/IBM is out of the office.

Rod Smith <[log in to unmask]>

Fri, 28 Jun 2002 12:15:49 -0400

24 lines

New Thread

Seeking PWA Test Information

Seeking PWA Test Information

Bogert <[log in to unmask]>

Fri, 28 Jun 2002 06:05:40 -0400

71 lines

Re: Seeking PWA Test Information

Hogg, Blair K. <[log in to unmask]>

Fri, 28 Jun 2002 08:50:57 -0400

57 lines

New Thread

Seho Solder System 8000

Seho Solder System 8000

Michael Bell <[log in to unmask]>

Thu, 20 Jun 2002 09:56:27 +1200

75 lines

Re: Seho Solder System 8000

Chris Murphy <[log in to unmask]>

Thu, 20 Jun 2002 13:54:44 +1200

42 lines

New Thread

Shelf life of Immersion Silver Fabs

Shelf life of Immersion Silver Fabs

Reid, Lorraine <[log in to unmask]>

Wed, 26 Jun 2002 16:34:43 +0100

47 lines

Re: Shelf life of Immersion Silver Fabs

Vandendolder, Ron <[log in to unmask]>

Wed, 26 Jun 2002 17:06:14 -0400

74 lines

Shelf life of Immersion Silver Fabs

Jack C. Olson <[log in to unmask]>

Thu, 27 Jun 2002 13:53:38 -0500

79 lines

Re: Shelf life of Immersion Silver Fabs

Wenger, George M. <[log in to unmask]>

Fri, 28 Jun 2002 10:37:29 -0400

151 lines

Re: Shelf life of Immersion Silver Fabs

Mickey Weiner <[log in to unmask]>

Sun, 30 Jun 2002 01:50:28 -0500

298 lines

Re: Shelf life of Immersion Silver Fabs

DUTTON Phil <[log in to unmask]>

Mon, 1 Jul 2002 09:41:29 +1000

77 lines

New Thread

Sign off Technet

Sign off Technet

Brummer Chuck <[log in to unmask]>

Fri, 28 Jun 2002 13:58:53 -0700

49 lines

New Thread

SNEC Meeting

SNEC Meeting

Gary Ferrari <[log in to unmask]>

Thu, 6 Jun 2002 14:40:44 EDT

107 lines

Re: SNEC Meeting

[log in to unmask]

Thu, 6 Jun 2002 15:45:42 EDT

42 lines

Re: SNEC Meeting

Gary Ferrari <[log in to unmask]>

Thu, 6 Jun 2002 15:51:14 EDT

45 lines

Re: SNEC Meeting

Randy Bock Sr. <[log in to unmask]>

Thu, 6 Jun 2002 16:14:41 -0400

175 lines

Re: SNEC Meeting

Randy Bock Sr. <[log in to unmask]>

Mon, 10 Jun 2002 07:52:40 -0400

195 lines

New Thread

SNEC Mtg - corrected date

SNEC Mtg - corrected date

Gary Ferrari <[log in to unmask]>

Thu, 6 Jun 2002 15:48:29 EDT

38 lines

New Thread

Solder beads on soldermask relieved traces

Solder beads on soldermask relieved traces

Kaye Knotts <[log in to unmask]>

Mon, 3 Jun 2002 10:59:14 -0400

74 lines

Re: Solder beads on soldermask relieved traces

Barmuta, Mike <[log in to unmask]>

Mon, 3 Jun 2002 15:14:09 -0700

141 lines

New Thread

Soldering Nickel

Soldering Nickel

Kathy Bergman <[log in to unmask]>

Tue, 4 Jun 2002 13:30:51 -0700

28 lines

Re: Soldering Nickel

[log in to unmask]

Tue, 4 Jun 2002 17:01:58 EDT

49 lines

Re: Soldering Nickel

Brian Ellis <[log in to unmask]>

Wed, 5 Jun 2002 08:46:59 +0300

58 lines

Re: Soldering Nickel

Mike Fenner <[log in to unmask]>

Wed, 5 Jun 2002 09:41:19 +0100

92 lines

Re: Soldering Nickel

Woody, Linda L <[log in to unmask]>

Wed, 5 Jun 2002 16:17:51 -0400

58 lines

New Thread

soldermask ring v. full coat for BGA design

Re: soldermask ring v. full coat for BGA design

David Hoover <[log in to unmask]>

Tue, 4 Jun 2002 07:16:14 -0700

141 lines

New Thread

Sorry for the weird messages

Sorry for the weird messages

Sherif Refaat <[log in to unmask]>

Fri, 7 Jun 2002 12:41:16 -0400

240 lines

New Thread

Subj: [TN] Wire bondable gold

Subj: [TN] Wire bondable gold

Joe Fjelstad <[log in to unmask]>

Sat, 22 Jun 2002 12:48:05 EDT

74 lines

New Thread

subscribe TechNet David Bailey

subscribe TechNet David Bailey

David Bailey <[log in to unmask]>

Wed, 5 Jun 2002 15:33:19 +1000

82 lines

New Thread

Suggestions for Dye penetrants used for BGA solder joint crack te sting

Suggestions for Dye penetrants used for BGA solder joint crack te sting

Maguire, James F <[log in to unmask]>

Tue, 25 Jun 2002 16:59:11 -0700

44 lines

Re: Suggestions for Dye penetrants used for BGA solder joint crack te sting

Crepeau, Phil <[log in to unmask]>

Tue, 25 Jun 2002 17:24:06 -0700

39 lines

New Thread

SURFACE FINISHES

Re: SURFACE FINISHES

Louis, Edwin @ CSE <[log in to unmask]>

Wed, 5 Jun 2002 15:12:31 -0400

98 lines

New Thread

TDR Testing

TDR Testing

[log in to unmask]

Fri, 7 Jun 2002 17:26:46 +0800

30 lines

Re: TDR Testing

Guy Ramsey <[log in to unmask]>

Fri, 7 Jun 2002 07:07:45 -0400

63 lines

Re: TDR Testing

Brian D. Butler <[log in to unmask]>

Fri, 7 Jun 2002 07:46:22 -0500

139 lines

New Thread

Testing Fuse Wire

Testing Fuse Wire

Michael Bell <[log in to unmask]>

Mon, 1 Jul 2002 11:44:33 +1200

26 lines

New Thread

Tetra treatment

Tetra treatment

Goh Guan Chye <[log in to unmask]>

Mon, 3 Jun 2002 17:52:48 +0800

56 lines

Re: Tetra treatment

Rudy Sedlak <[log in to unmask]>

Mon, 3 Jun 2002 07:23:47 EDT

56 lines

Re: Tetra treatment

Franck, George <[log in to unmask]>

Mon, 3 Jun 2002 07:55:20 -0400

154 lines

Re: Tetra treatment

Dave Hillman <[log in to unmask]>

Mon, 3 Jun 2002 09:18:41 -0500

131 lines

Re: Tetra treatment

[log in to unmask]

Mon, 3 Jun 2002 08:18:30 -0600

92 lines

Re: Tetra treatment

James TerVeen <[log in to unmask]>

Tue, 4 Jun 2002 10:35:48 -0400

64 lines

New Thread

thanks

thanks

Kathy Bergman <[log in to unmask]>

Wed, 5 Jun 2002 14:03:13 -0700

25 lines

New Thread

Throughhole insertion

Throughhole insertion

Peter Lee <[log in to unmask]>

Fri, 14 Jun 2002 00:05:06 -0700

31 lines

Re: Throughhole insertion

Guy Ramsey <[log in to unmask]>

Fri, 14 Jun 2002 07:17:37 -0400

58 lines

Re: Throughhole insertion

Sauer, Steven T. <[log in to unmask]>

Fri, 14 Jun 2002 09:05:02 -0400

55 lines

Re: Throughhole insertion

Kathy Kuhlow <[log in to unmask]>

Fri, 14 Jun 2002 08:44:55 -0500

83 lines

Re: Throughhole insertion

Phil Nutting <[log in to unmask]>

Fri, 14 Jun 2002 10:31:47 -0400

109 lines

New Thread

tin whiskers - matte tin

tin whiskers - matte tin

Ingemar Hernefjord (EMW) <[log in to unmask]>

Wed, 19 Jun 2002 11:10:42 +0200

30 lines

Re: tin whiskers - matte tin

Joyce Koo <[log in to unmask]>

Wed, 19 Jun 2002 07:55:25 -0400

77 lines

Re: tin whiskers - matte tin

Ingemar Hernefjord (EMW) <[log in to unmask]>

Thu, 20 Jun 2002 10:37:19 +0200

96 lines

Re: tin whiskers - matte tin

jbrusse <[log in to unmask]>

Thu, 20 Jun 2002 09:21:16 -0400

259 lines

New Thread

TN: Smooth bright solder Joint

TN: Smooth bright solder Joint

Poh Kong Hui <[log in to unmask]>

Wed, 5 Jun 2002 21:56:21 +0800

39 lines

Re: TN: Smooth bright solder Joint

Gary Camac <[log in to unmask]>

Wed, 5 Jun 2002 11:24:48 -0500

60 lines

Re: TN: Smooth bright solder Joint

Guy Ramsey <[log in to unmask]>

Wed, 5 Jun 2002 13:26:56 -0400

68 lines

Re: TN: Smooth bright solder Joint

Karnwal, Pankaj <[log in to unmask]>

Thu, 6 Jun 2002 07:46:46 +0200

71 lines

Re: TN: Smooth bright solder Joint

Lou Hart <[log in to unmask]>

Thu, 6 Jun 2002 09:22:16 -0400

44 lines

New Thread

US Competitivness--No Tech Content

US Competitivness--No Tech Content

Greg Jones <[log in to unmask]>

Thu, 20 Jun 2002 13:10:16 -0700

33 lines

Re: US Competitivness--No Tech Content

Ken Carlile <[log in to unmask]>

Thu, 20 Jun 2002 16:37:04 -0400

83 lines

Re: US Competitivness--No Tech Content

[log in to unmask]

Thu, 20 Jun 2002 14:47:25 -0600

55 lines

Re: US Competitivness--No Tech Content

Rudy Sedlak <[log in to unmask]>

Thu, 20 Jun 2002 17:44:12 EDT

50 lines

Re: US Competitivness--No Tech Content

David Douthit <[log in to unmask]>

Thu, 20 Jun 2002 14:58:50 -0700

77 lines

Re: US Competitivness--No Tech Content

Joe Fjelstad <[log in to unmask]>

Thu, 20 Jun 2002 17:58:05 EDT

93 lines

Re: US Competitivness--No Tech Content

Joe Fjelstad <[log in to unmask]>

Thu, 20 Jun 2002 17:59:56 EDT

47 lines

Re: US Competitivness--No Tech Content

Bernard Kessler <[log in to unmask]>

Thu, 20 Jun 2002 14:09:44 -0700

86 lines

Re: US Competitivness--No Tech Content

Mike Hughes <[log in to unmask]>

Fri, 21 Jun 2002 09:45:53 +1000

131 lines

New Thread

very small technical comment - Metcal

very small technical comment - Metcal

Phil Nutting <[log in to unmask]>

Thu, 20 Jun 2002 16:26:46 -0400

35 lines

Re: very small technical comment - Metcal

Linda Langley <[log in to unmask]>

Fri, 21 Jun 2002 09:38:59 -0400

64 lines

New Thread

Virus

Virus

Randy Bock Sr. <[log in to unmask]>

Sat, 22 Jun 2002 06:55:31 -0400

65 lines

New Thread

Voltage Breakdown of Thick Laminates

Voltage Breakdown of Thick Laminates

Ted J. Casper <[log in to unmask]>

Wed, 26 Jun 2002 08:13:19 -0500

50 lines

Re: Voltage Breakdown of Thick Laminates

Ingemar Hernefjord (EMW) <[log in to unmask]>

Wed, 26 Jun 2002 16:53:08 +0200

75 lines

New Thread

Washing Semi gloss boards.

Washing Semi gloss boards.

[log in to unmask]

Tue, 18 Jun 2002 13:42:27 EDT

39 lines

Re: Washing Semi gloss boards.

Phil Nutting <[log in to unmask]>

Tue, 18 Jun 2002 15:06:08 -0400

76 lines

Re: Washing Semi gloss boards.

Paul <[log in to unmask]>

Tue, 18 Jun 2002 16:14:10 -0400

68 lines

Re: Washing Semi gloss boards.

Wanner, Bernhard <[log in to unmask]>

Wed, 19 Jun 2002 09:47:55 +0200

150 lines

Re: Washing Semi gloss boards.

b_ellis <[log in to unmask]>

Wed, 19 Jun 2002 11:04:10 +0300

70 lines

Re: Washing Semi gloss boards.

Leo Roos <[log in to unmask]>

Wed, 19 Jun 2002 08:32:06 -0700

112 lines

Re: Washing Semi gloss boards.

b_ellis <[log in to unmask]>

Thu, 20 Jun 2002 08:22:54 +0300

142 lines

New Thread

Wavesoldering Ceramic Caps

Wavesoldering Ceramic Caps

Kasprzak, Bill (sys) USX <[log in to unmask]>

Tue, 18 Jun 2002 10:30:10 -0400

42 lines

Re: Wavesoldering Ceramic Caps

Charles Caswell <[log in to unmask]>

Tue, 18 Jun 2002 10:14:28 -0500

85 lines

Re: Wavesoldering Ceramic Caps

Ingemar Hernefjord (EMW) <[log in to unmask]>

Tue, 18 Jun 2002 17:26:41 +0200

66 lines

Re: Wavesoldering Ceramic Caps

Tuan Bui <[log in to unmask]>

Tue, 18 Jun 2002 08:46:12 -0700

88 lines

Re: Wavesoldering Ceramic Caps

John Maxwell <[log in to unmask]>

Tue, 18 Jun 2002 17:12:50 -0700

68 lines

Re: Wavesoldering Ceramic Caps

Ingemar Hernefjord (EMW) <[log in to unmask]>

Wed, 19 Jun 2002 08:58:33 +0200

91 lines

Re: Wavesoldering Ceramic Caps

Werner Engelmaier <[log in to unmask]>

Wed, 19 Jun 2002 08:47:41 EDT

32 lines

Re: Wavesoldering Ceramic Caps

Tempea, Ioan <[log in to unmask]>

Wed, 19 Jun 2002 12:13:23 -0400

111 lines

New Thread

Wessel Drills

Wessel Drills

[log in to unmask]

Wed, 5 Jun 2002 16:39:12 -0400

30 lines

Re: Wessel Drills

Brian Ellis <[log in to unmask]>

Thu, 6 Jun 2002 12:39:12 +0300

50 lines

New Thread

Wire bondable gold

Wire bondable gold

Steve Kelly <[log in to unmask]>

Sat, 22 Jun 2002 11:22:29 -0400

28 lines

Re: Wire bondable gold

Creswick, Steven <[log in to unmask]>

Mon, 24 Jun 2002 06:05:06 -0400

66 lines

Re: Wire bondable gold

Misner, Bruce <[log in to unmask]>

Mon, 24 Jun 2002 07:29:18 -0500

61 lines

Re: Wire bondable gold

Ingemar Hernefjord (EMW) <[log in to unmask]>

Mon, 24 Jun 2002 14:51:18 +0200

92 lines

Re: Wire bondable gold

Bill Christoffel <[log in to unmask]>

Mon, 24 Jun 2002 08:31:34 -0500

68 lines

Re: Wire bondable gold

joyce <[log in to unmask]>

Mon, 24 Jun 2002 13:00:27 -0400

145 lines

Re: Wire bondable gold

George Milad <[log in to unmask]>

Mon, 24 Jun 2002 22:26:47 EDT

53 lines

Re: Wire bondable gold

Ingemar Hernefjord (EMW) <[log in to unmask]>

Tue, 25 Jun 2002 09:07:19 +0200

153 lines

New Thread

Wrappage Percentage for printed boards with BGA and micr o BGA

Re: Wrappage Percentage for printed boards with BGA and micr o BGA

Mcmaster, Michael <[log in to unmask]>

Thu, 27 Jun 2002 10:03:09 -0700

132 lines

Re: Wrappage Percentage for printed boards with BGA and micr o BGA

Dwight Mattix <[log in to unmask]>

Thu, 27 Jun 2002 14:21:35 -0700

157 lines

New Thread

Wrappage Percentage for printed boards with BGA and micro BGA

Wrappage Percentage for printed boards with BGA and micro BGA

Ong Seet Leng <[log in to unmask]>

Wed, 26 Jun 2002 18:23:42 +0800

72 lines

Advanced Options


Options

Log In

Log In

Get Password

Get Password


Search Archives

Search Archives


Subscribe or Unsubscribe

Subscribe or Unsubscribe


Archives

May 2017
April 2017
March 2017
February 2017
January 2017
December 2016
November 2016
October 2016
September 2016
August 2016
July 2016
June 2016
May 2016
April 2016
March 2016
February 2016
January 2016
December 2015
November 2015
October 2015
September 2015
August 2015
July 2015
June 2015
May 2015
April 2015
March 2015
February 2015
January 2015
December 2014
November 2014
October 2014
September 2014
August 2014
July 2014
June 2014
May 2014
April 2014
March 2014
February 2014
January 2014
December 2013
November 2013
October 2013
September 2013
August 2013
July 2013
June 2013
May 2013
April 2013
March 2013
February 2013
January 2013
December 2012
November 2012
October 2012
September 2012
August 2012
July 2012
June 2012
May 2012
April 2012
March 2012
February 2012
January 2012
December 2011
November 2011
October 2011
September 2011
August 2011
July 2011
June 2011
May 2011
April 2011
March 2011
February 2011
January 2011
December 2010
November 2010
October 2010
September 2010
August 2010
July 2010
June 2010
May 2010
April 2010
March 2010
February 2010
January 2010
December 2009
November 2009
October 2009
September 2009
August 2009
July 2009
June 2009
May 2009
April 2009
March 2009
February 2009
January 2009
December 2008
November 2008
October 2008
September 2008
August 2008
July 2008
June 2008
May 2008
April 2008
March 2008
February 2008
January 2008
December 2007
November 2007
October 2007
September 2007
August 2007
July 2007
June 2007
May 2007
April 2007
March 2007
February 2007
January 2007
December 2006
November 2006
October 2006
September 2006
August 2006
July 2006
June 2006
May 2006
April 2006
March 2006
February 2006
January 2006
December 2005
November 2005
October 2005
September 2005
August 2005
July 2005
June 2005
May 2005
April 2005
March 2005
February 2005
January 2005
December 2004
November 2004
October 2004
September 2004
August 2004
July 2004
June 2004
May 2004
April 2004
March 2004
February 2004
January 2004
December 2003
November 2003
October 2003
September 2003
August 2003
July 2003
June 2003
May 2003
April 2003
March 2003
February 2003
January 2003
December 2002
November 2002
October 2002
September 2002
August 2002
July 2002
June 2002
May 2002
April 2002
March 2002
February 2002
January 2002
December 2001
November 2001
October 2001
September 2001
August 2001
July 2001
June 2001
May 2001
April 2001
March 2001
February 2001
January 2001
December 2000
November 2000
October 2000
September 2000
August 2000
July 2000
June 2000
May 2000
April 2000
March 2000
February 2000
January 2000
December 1999
November 1999
October 1999
September 1999
August 1999
July 1999
June 1999
May 1999
April 1999
March 1999
February 1999
January 1999
December 1998
November 1998
October 1998
September 1998
August 1998
July 1998
June 1998
May 1998
April 1998
March 1998
February 1998
January 1998
December 1997
November 1997
October 1997
September 1997
August 1997
July 1997
June 1997
May 1997
April 1997
March 1997
February 1997
January 1997
1996
1995

ATOM RSS1 RSS2



LISTSERV.IPC.ORG

CataList Email List Search Powered by the LISTSERV Email List Manager